Display panel and display device

Abstract

The present disclosure provides a display panel and a display device. The display panel includes a display area and a non-display area located on one side of the display area. The non-display area includes a bending area, a bonding area, and a wiring area located between the bending area and the bonding area. The display panel includes a base substrate and a touch structure located on the base substrate, the touch structure including touch lead lines. The touch lead lines are drawn out from the display area and extend to the bonding area. The touch lead lines include a first lead line located in the bending area and a second lead line located in the wiring area. The first lead line and the second lead line are electrically connected and are located in different metal layers, and the second lead line employs a touch structure of a single layer of metal wiring.

Description

Technical Field

[0001] (Cross-reference to Related Art) This application claims the priority of a Chinese patent application with an application number of 202210723269.7 and an application title of "Display Panel and Display Device", which was filed with the China National Intellectual Property Administration on June 23, 2022, and the entire content thereof is incorporated herein by reference. This disclosure relates to the field of touch display technology, and particularly to display panels and display devices.

Background Art

[0002] As electronic products develop, OLED (Organic Light Emitting Diode) display devices are widely applied because they can achieve full screen, narrow bezel, high resolution, wearable curling, folding, etc. Among them, the technology of fabricating a touch structure (Flexible Multi-Layer On Cell, FMLOC) on the encapsulation layer of an OLED (Organic Light Emitting Diode) display panel enables the manufacture of lighter and thinner display devices, and this technology is applicable to foldable and curlable OLED display devices.

Summary of the Invention

[0003] Embodiments of the present disclosure provide a display panel and a display device, and the specific technical solutions are as follows.

[0004] The display panel provided by an embodiment of the present disclosure includes a display area and a non-display area located on one side of the display area. The non-display area includes a bending area, a bonding area, and a wiring area located between the bending area and the bonding area. The display panel includes a base substrate and a touch structure located on the base substrate, the touch structure including touch lead lines. The touch lead lines are drawn out from the display area and extend to the bonding area. The touch lead lines have a first lead line located in the bending area and a second lead line located in the wiring area. The first lead line and the second lead line are electrically connected and are located in different metal layers. Also, the second lead line includes a touch structure employing a single layer of metal wiring.

[0005] In one possible implementation, in the above display panel provided by an embodiment of the present disclosure, a first metal layer, a first planarization layer, a second metal layer, a second planarization layer, a third metal layer, and a third planarization layer, which are sequentially stacked and provided between the base substrate and the touch structure, are further included. The first metal layer is close to the base substrate. The touch structure further includes a first insulating layer, a first touch electrode layer, a second insulating layer, and a second touch electrode layer, which are sequentially stacked and provided at least in the display area on the side opposite to the base substrate of the third planarization layer. The first insulating layer and the second insulating layer are organic layers. The first lead line is located in the second metal layer.

[0006] In one possible implementation, in the above display panel provided by an embodiment of the present disclosure, the touch lead lines further include a third lead line drawn out from the display area and extending to the side opposite to the bonding area of the bending area. The third lead line includes a first sub-lead line located in the first touch electrode layer and a second sub-lead line located in the second touch electrode layer. The first sub-lead line and the second sub-lead line are electrically connected through vias penetrating the second insulating layer.

[0007] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the non-display area further includes a transition area located between the display area and the bending area. In the transition area, a portion close to the bending area is a first adaptable area, and a portion of the wiring area close to the bending area is a second adaptable area. The first sub-lead line is electrically connected to a first contact portion of the third metal layer through a via penetrating the third planarization layer in the first adaptable area. The first contact portion is electrically connected to the first lead line through a via penetrating the second planarization layer in the first adaptable area.

[0008] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, a via electrically connecting the first sub-lead line and the second sub-lead line does not overlap with the first adaptable area.

[0009] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the second lead line is located in the third metal layer, and the second lead line is electrically connected to the first lead line through a via penetrating the second planarization layer in the second adaptable area.

[0010] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, a positive projection of the first touch electrode layer onto the wiring area covers at most a positive projection onto a portion of the wiring area close to the bonding area, and a positive projection of the second touch electrode layer onto the wiring area covers at most a positive projection onto a portion of the wiring area close to the bonding area.

[0011] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, a positive projection of the first touch electrode layer onto the base substrate does not overlap with a positive projection of the bending area onto the base substrate, and a positive projection of the second touch electrode layer onto the base substrate does not overlap with a positive projection of the bending area onto the base substrate.

[0012] In one possible implementation, in the above display panel provided by the embodiments of the present disclosure, the second lead line is located in the first touch electrode layer, and the second lead line is electrically connected to a second contact portion located in the third metal layer through a via penetrating the first insulating layer and the third planarization layer in the second adapter via region, and the second contact portion is electrically connected to the first lead line through a via penetrating the second planarization layer in the second adapter via region.

[0013] In one possible implementation, in the above display panel provided by the embodiments of the present disclosure, the orthographic projection of the first touch electrode layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate, the orthographic projection of the second touch electrode layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate, and the orthographic projection of the second touch electrode layer onto the wiring region covers at most the orthographic projection of a portion of the wiring region close to the bonding region.

[0014] In one possible implementation, in the above display panel provided by the embodiments of the present disclosure, the second lead line is located in the second touch electrode layer, and the second lead line is electrically connected to a second contact portion located in the third metal layer through a via penetrating the second insulating layer, the first insulating layer, and the third planarization layer in the second adapter via region, and the second contact portion is electrically connected to the first lead line through a via penetrating the second planarization layer in the second adapter via region.

[0015] In one possible implementation, in the above display panel provided by the embodiments of the present disclosure, the orthographic projection of the second touch electrode layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate, the orthographic projection of the first touch electrode layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate, and the orthographic projection of the first touch electrode layer onto the wiring region covers at most the orthographic projection of a portion of the wiring region close to the bonding region.

[0016] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the orthographic projection of the second insulating layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate, and the orthographic projection of the second insulating layer onto the base substrate overlaps with the orthographic projections of the display region, the wiring region, and the bonding region onto the base substrate.

[0017] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the orthographic projection of the first insulating layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate, and the orthographic projection of the first insulating layer onto the base substrate overlaps with the orthographic projections of the display region, the wiring region, and the bonding region onto the base substrate.

[0018] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the display panel further includes a low-voltage power line and a high-voltage power line. The low-voltage power line and the high-voltage power line both employ a layer of metal wiring located in the second metal layer in the bending region, and the metal wiring of the low-voltage power line and / or the high-voltage power line in the bending region is located on both sides of the first lead wire and is provided at an interval from the first lead wire. The low-voltage power line and the second lead wire overlap with each other in the wiring region.

[0019] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, it further includes a low-voltage power line and a high-voltage power line. The low-voltage power line includes a first conductive structure and a second conductive structure in the wiring region. The first conductive structure is located in the first metal layer, and the second conductive structure is located in the second metal layer. The first conductive structure is electrically connected to the second conductive structure through a via penetrating the first planarization layer. The high-voltage power line includes a third conductive structure and a fourth conductive structure in the wiring region. The third conductive structure is located in the first metal layer and is provided at an interval from the first conductive structure. The fourth conductive structure is located in the second metal layer and is provided at an interval from the second conductive structure. The third conductive structure is electrically connected to the fourth conductive structure through a via penetrating the first planarization layer.

[0020] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the low-voltage power line further includes a fifth conductive structure in the wiring region. The fifth conductive structure is located in the third metal layer. The fifth conductive structure is electrically connected to the second conductive structure through a via penetrating the second planarization layer. The high-voltage power line further includes a sixth conductive structure in the wiring region. The sixth conductive structure is located in the third metal layer. The sixth conductive structure is provided at an interval from the fifth conductive structure. The sixth conductive structure is electrically connected to the fourth conductive structure through a via penetrating the second planarization layer. The second lead wire is insulated from the fifth conductive structure and the sixth conductive structure.

[0021] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the fifth conductive structure includes two sub-conductive structures provided at an interval. The second lead wire is located between the two sub-conductive structures.

[0022] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the display panel further includes a protective layer located on the side opposite to the base substrate of the touch structure, and the orthographic projection of the protective layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate.

[0023] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the display panel further includes a display structure located between the third planarization layer and the touch structure, and a sealing structure located between the display structure and the touch structure. The display structure includes an anode layer, a pixel definition layer, a light-emitting functional layer, and a cathode layer that are sequentially stacked between the third planarization layer and the sealing structure. The display panel further includes a spacer layer provided between the pixel definition layer and the cathode layer. The sealing structure includes a first inorganic sealing layer, a first organic sealing layer, a second inorganic sealing layer, a second organic sealing layer, and a third inorganic sealing layer that are stacked.

[0024] In one possible implementation, in the display panel provided by the embodiments of the present disclosure, the first planarization layer, the second planarization layer, the third planarization layer, and the spacer layer all cover the bending region.

[0025] Accordingly, the embodiments of the present disclosure provide a display device including the display panel provided by the embodiments of the present disclosure.

Brief Description of the Drawings

[0026]

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DETAILED DESCRIPTION OF THE INVENTION

[0027] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings of the embodiments of the present disclosure. Of course, the described embodiments are only some of the embodiments of the present disclosure, not all of them. Also, as long as there is no contradiction, the embodiments in the present disclosure and the features in the embodiments may be combined with each other. Based on the described embodiments of the present disclosure, other embodiments obtained by those skilled in the art without creative labor all fall within the protection scope of the present disclosure.

[0028] Unless otherwise defined, technical terms or scientific terms used in the present disclosure have the ordinary meanings that can be understood by those skilled in the art. Similar terms such as "including" or "having" used in the present disclosure mean that the element or thing before the term encompasses the element or thing described after the term and its equivalents, and does not exclude other elements or things. Similar terms such as "connected" or "coupled" are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect. "Inside", "outside", "above", "below", etc. are only used to indicate relative positional relationships, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0029] Note that in the drawings, the sizes and shapes of the respective figures do not represent the actual scale and are merely for the purpose of schematically explaining the content of the present disclosure. Also, the same or similar reference numerals from the beginning to the end represent the same or similar elements or elements having the same or similar functions.

[0030] As shown in FIGS. 1 and 2, FIG. 1 is a schematic plan view after a touch electrode is provided on an OLED display panel. The display panel includes a display area AA and a non-display area located on one side of the display area AA. The non-display area includes a bending area CC, a bonding area BB, and a wiring area EE located between the bending area CC and the bonding area BB. The display area AA usually includes a plurality of light-emitting sub-pixels. As shown in FIG. 2, FIG. 2 is a schematic cross-sectional view of one light-emitting sub-pixel in FIG. 1. The display panel includes a display substrate 1, a sealing structure 2 for sealing the display substrate 1, a touch structure 3 located on the sealing structure 2, and a protective layer 4 located on the touch structure 3. Among them, the touch structure 3 is directly fabricated on the sealing structure 2. Such a technology is called the FMLOC technology. By using the FMLOC technology, a lighter and thinner touch panel can be manufactured, and this technology is also applicable to foldable and curlable OLED display devices.

[0031] As shown in FIG. 2, the display substrate 1 includes a base substrate 11, and a driving circuit 12 and a display structure 13 which are sequentially stacked and provided between the base substrate 11 and the sealing structure 2. Alternatively, the base substrate 11 may include a polyimide layer 111 and a buffer layer 112 which are sequentially stacked and provided. The driving circuit 12 may include an active layer 121, a first gate insulating layer 122, a first gate metal layer 123, a second gate insulating layer 124, a second gate metal layer 125, an interlayer dielectric layer 126, a first metal layer 127 (abbreviated as the first Source Drain metal layer, SD1), a passivation layer 128, a first planarization layer 129, a second metal layer 130 (abbreviated as the second Source Drain metal layer, SD2), a second planarization layer 131, a third metal layer 132 (abbreviated as the third Source Drain metal layer, SD3), and a third planarization layer 133 which are sequentially stacked and provided on the base substrate 11. The display structure 13 may include an anode layer 134, a pixel defining layer 135, a light emitting functional layer 136, and a cathode layer 137 which are sequentially stacked and provided between the driving circuit 12 and the sealing structure 2. Among them, the anode layer 134 may be electrically connected to the first metal layer 127 by the second metal layer 130.

[0032] Specifically, usually, sources, drains, data lines, etc. are provided on the first metal layer 127, and usually, an intermediate electrode for contacting the anode layer 134 and the drain is provided on the second metal layer 130. The third metal layer 132 is based on the FIAA technology used in the project of narrow border products. In such a technology, one layer of the third metal layer 132 and the third planarization layer 133 are added, and this third metal layer 132 is mainly used for the data signal wiring in the fanout region to realize the design of the narrow border of the lower border.

[0033] With the rapid development of OLEDs, the need for four-sided foldable mobile phones is increasing, and the process challenges are also growing. To meet the stress requirements of large-angle folding, the inorganic film layer in the FMLOC process is replaced by an organic film layer. As shown in FIG. 2, the touch structure 3 includes a first insulating layer 31, a first touch electrode layer 32, a second insulating layer 33, and a second touch electrode layer 34 that are stacked. The first insulating layer 31 and the second insulating layer 33 are both organic layers. Alternatively, the first touch electrode layer 32 may include a plurality of bridge electrodes 321. The second touch electrode layer 34 may include a plurality of touch electrodes 341, and some of the touch electrodes 341 are directly electrically connected through a connection portion 342 located in the second touch electrode layer 34. The other touch electrodes 341 are electrically connected by the bridge electrodes 321 located in the first touch electrode layer 32, and the Tx touch electrode and the Rx touch electrode are obtained.

[0034] As shown in FIG. 1, the touch structure 3 further includes a touch lead wire 35 electrically connected to the touch electrode 341. The touch lead wire 35 extends from the display area AA to the bonding area BB. As shown in FIGS. 3A to 3C, FIG. 3A is a schematic layout diagram of a partial bending area CC, a wiring area EE, and a bonding area BB in FIG. 1. FIG. 3B is a schematic cross-sectional view within the dashed block E1 in FIG. 3A. FIG. 3C is a schematic cross-sectional view along the FF' direction in FIG. 3A. For the portion of the touch lead wire 35 located in the display area AA and the portion located between the display area AA and the bending area CC, usually, two-layer metal wiring (the two-layer wiring located in the first touch electrode layer 32 and the second touch electrode layer 34, and these two-layer wirings are electrically connected through vias so as to reduce resistance) is adopted. The portion of the touch lead wire 35 located in the bending area CC usually jumps to the second metal layer 130. The portion of the touch lead wire 35 located in the bonding area BB also jumps to the first touch electrode layer 32 and the second touch electrode layer 34, and the second insulating layer 33 in the bonding area BB is dug out. That is, the touch lead wire 35 adopts two-layer wiring in the bonding area BB and is directly in contact and electrically connected so as to further reduce the resistance.

[0035] When the second insulating layer 33 in the bonding area BB is dug out, the etching resistance of the organic first insulating layer 31 becomes poor and it is easy to absorb moisture. For this reason, the first touch electrode layer 32 makes the surface of the organic first insulating layer 31 uneven in the etching process, and when the second touch electrode layer 34 is grown, it polymerizes with the organic first insulating layer 31, resulting in incomplete etching of the second touch electrode layer 34 and causing a problem of metal residue. This causes a problem that adjacent touch lead wires 35 are short-circuited in the bonding area BB.

[0036] To solve the above problems, the present disclosure provides a display panel. As shown in FIGS. 1, 2, 4A-6C, FIG. 4A is a schematic layout diagram of a partial bending region CC and a bonding region BB in FIG. 1. FIG. 4B is a schematic cross-sectional view within a dashed-line block E1 in FIG. 4A. FIG. 4C is a schematic cross-sectional view along the FF' direction in FIG. 4A. FIG. 5A is a schematic layout diagram of a partial bending region CC and a bonding region BB in FIG. 1. FIG. 5B is a schematic cross-sectional view within a dashed-line block E1 in FIG. 5A. FIG. 5C is a schematic cross-sectional view along the FF' direction in FIG. 5A. FIG. 6A is a schematic layout diagram of a partial bending region CC and a bonding region BB in FIG. 1. FIG. 6B is a schematic cross-sectional view within a dashed-line block E1 in FIG. 6A. FIG. 6C is a schematic cross-sectional view along the FF' direction in FIG. 6A. This display panel includes a display area AA and a non-display area located on one side of the display area AA. The non-display area includes a bending region CC, a bonding region BB, and a wiring region EE between the bending region CC and the bonding region BB. Specifically, the display panel includes a base substrate 11 and a touch structure 3 located on the base substrate 11, which includes touch lead lines 35. The touch lead lines 35 are drawn out from the display area AA and extend to the bonding region BB. The touch lead lines 35 include a first lead line 351 located in the bending region CC and a second lead line 352 located in the wiring region EE. The first lead line 351 and the second lead line 352 are electrically connected and are located in different metal layers, and the second lead line 352 includes a touch structure 3 that employs a single layer of metal wiring.

[0037] By adopting a single layer of metal wiring as the second lead line located in the wiring region, the display panel provided by the embodiment of the present disclosure can avoid the problem that adjacent touch lead lines short-circuit in the wiring region due to metal residues generated in the manner shown in FIGS. 3A-3C by providing a corresponding insulating layer above or below the film layer where the second lead line is located.

[0038] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1, 2, 4A to 6C, the display panel further includes a first metal layer 127, a first planarization layer 129, a second metal layer 130, a second planarization layer 131, a third metal layer 132, and a third planarization layer 133 that are sequentially laminated and located between the base substrate 11 and the touch structure 3. The first metal layer 127 is close to the base substrate 11, or the first metal layer 127 may be an SD1 layer. The second metal layer 130 may be an SD2 layer. The third metal layer 132 may be an SD3 layer. Among them, usually, a source, a drain, a data line, etc. are provided in the SD1 layer. Usually, an anode layer and an intermediate electrode in contact with the drain are provided in the SD2 layer. The SD3 layer is based on the FIAA technology used in the project of narrow bezel products. In such a technology, one layer of SD3 layer and the third planarization layer 133 are added. The SD3 layer is mainly used for data signal wiring in the fan-out region (bonding region, bending region, and transition region). That is, the data line of the SD1 layer is used to jump to the SD3 layer through a via. In this way, by reducing the area occupied by the SD1 layer signal line in the fan-out region, a narrow bezel design of the lower bezel can be realized.

[0039] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1, 2, 4A to 6C, the touch structure 3 further includes a first insulating layer 31, a first touch electrode layer 32, a second insulating layer 33, and a second touch electrode layer 34 that are sequentially laminated and located at least in the display area AA on the side opposite to the base substrate 11 of the third planarization layer 133.

[0040] The first insulating layer 31 and the second insulating layer 33 are organic layers. The first lead wire 351 is located in the second metal layer 130, and the second lead wire 352 is located in any one of the film layers of the third metal layer 132, the first touch electrode layer 32, and the second touch electrode layer 34. In this way, by providing the first lead wire 351 in the bending region CC in the second metal layer 130, the bending characteristics of the display panel are improved. By providing the second lead wire 352 in any one of the film layers of the third metal layer 132, the first touch electrode layer 32, and the second touch electrode layer 34, in the embodiments shown in FIGS. 3A to 3C, metal residue occurs, and the problem that adjacent touch lead wires are short-circuited in the wiring region EE can be avoided.

[0041] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1 and 2, the touch lead wire 35 further includes a third lead wire 353 (that is, a lead wire located above the bending region CC) that is drawn out from the display region AA and extends to the side opposite to the bonding region BB in the bending region CC. The third lead wire 353 includes a first sub-lead wire (not shown) located in the first touch electrode layer 32 and a second sub-lead wire (not shown) located in the second touch electrode layer 34. The first sub-lead wire and the second sub-lead wire are electrically connected through vias penetrating the second insulating layer 33. That is, the third lead wire 353 located in the display region AA of the touch lead wire 35 and the third lead wire 353 located between the display region AA and the bending region CC employ two-layer metal wirings of the first touch electrode layer 32 and the second touch electrode layer 34 to reduce resistance.

[0042] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1, 4A, 4C, 5A, 5C, 6A, and 6C, the non-display region further includes a transition region DD located between the display region AA and the bending region CC. A portion of the transition region DD close to the bending region CC is the first adapter via region D1, and a portion of the wiring region EE close to the bending region CC is the second adapter via region E1.

[0043] The first sub-lead line is electrically connected to a first contact portion 61 located in the third metal layer 132 through a via penetrating the third planarization layer 133 in the first adaptable via region D1. The first contact portion 61 is electrically connected to the first lead line 351 through a via penetrating the second planarization layer 131 in the first adaptable via region D1. That is, the touch lead line 35 (the third lead line 353) drawn from the display region AA and extending to the first adaptable via region D1 may employ a two-layer wiring of the first touch electrode layer 32 and the second touch electrode layer 34. When entering the first adaptable via region D1 of the transition region DD, the touch lead line 35 jumps from the first touch electrode layer 32 to the second metal layer 130 by the third metal layer 132. That is, the bending region CC employs the second metal layer 130 to fabricate the touch lead line 35 (that is, the first lead line 351 located in the bending region CC). Further, the first lead line 351 may jump to any one of the film layers of the third metal layer 132, the first touch electrode layer 32, and the second touch electrode layer 34 in the second adaptable via region E1.

[0044] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, the via electrically connecting the first sub-lead line and the second sub-lead line does not overlap with the first adaptable via region. For example, the via electrically connecting the first sub-lead line and the second sub-lead line is located in a non-display region on the upper surface of the transition region DD, and the first sub-lead line and the second sub-lead line may be electrically connected through a plurality of vias so as to increase the contact area between the first sub-lead line and the second sub-lead line and achieve the purpose of further reducing the resistance.

[0045] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1, 2, 4A to 4C, the second lead wire 352 may be located in the third metal layer 132. In this way, the second lead wire 352 can be electrically connected to the first lead wire 351 through a via penetrating the second planarization layer 131 in the second adapter area E1. In this way, when manufacturing the subsequent touch structure 3, the orthographic projection of the first touch electrode layer 32 onto the base substrate 11 is made not to overlap with the orthographic projection of the bending area CC onto the base substrate 11, and the orthographic projection of the second touch electrode layer 34 onto the base substrate 11 is made not to overlap with the orthographic projection of the bending area CC onto the base substrate 11. The orthographic projection of the first touch electrode layer 32 onto the wiring area EE is made to cover at most a portion close to the bonding area BB of the wiring area EE, and the orthographic projection of the second touch electrode layer 34 onto the wiring area EE is made to cover at most a portion close to the bonding area BB of the wiring area EE.

[0046] That is, by completely removing the first touch electrode layer 32 and the second touch electrode layer 34 located in the bending area CC, removing a part of the first touch electrode layer 32 and a part of the second touch electrode layer 34 located in the wiring area EE, and making the touch lead wire 35 jump to the third metal layer 132 (SD3 layer) in the wiring area EE, in the embodiments of FIGS. 3A to 3C, the problem that the organic first insulating layer 31 and the organic second insulating layer 33 are likely to absorb moisture and have poor etching resistance, resulting in metal oxidation and causing metal Remain, can be solved.

[0047] In a specific implementation, in order to improve the bending characteristics of the bending region, in the display panel provided by the embodiments of the present disclosure, as shown in FIGS. 3A to 3C, the orthographic projection of the first insulating layer 31 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the first insulating layer 31 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11.

[0048] Specifically, since the first planarization layer 129, the second planarization layer 131, and the third planarization layer 133 are retained in the bending region CC, in order to position the first lead wire 351 at the neutral layer 2, in the embodiments of the present disclosure, by removing the first insulating layer 31 and the second insulating layer 33 located in the bending region CC, the problem that the first lead wire 351 is disconnected during bending can be prevented.

[0049] In a specific implementation, in the display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1, 2, 5A to 5C, the second lead wire 352 may further be located in the first touch electrode layer 32. In this way, the second lead wire 352 is electrically connected to the second contact portion 62 of the third metal layer 132 through a via penetrating the first insulating layer 31 and the third planarization layer 133 in the second adapter region E1. The second contact portion 62 can be electrically connected to the first lead wire 351 through a via penetrating the second planarization layer 131 in the second adapter region E1.

[0050] Here, the orthographic projection of the first insulating layer 31 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the first insulating layer 31 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11. In this way, when manufacturing the subsequent touch structure 3, the orthographic projection of the first touch electrode layer 32 onto the base substrate 11 is made not to overlap with the orthographic projection of the bending region CC onto the base substrate 11, and the orthographic projection of the second touch electrode layer 34 onto the base substrate 11 is made not to overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the second touch electrode layer 34 onto the wiring region EE can be made to cover at most the portion of the wiring region EE close to the bonding region BB.

[0051] That is, by removing the second touch electrode layer 34 located in the bending region CC and a part of the second touch electrode layer 34 located in the wiring region EE, in the first insulating layer 31, the first touch electrode layer 32 is adopted to manufacture the second lead wire 352, the second insulating layer 33 above the second lead wire 352 is retained, and when a part of the second touch electrode layer 34 located above the second insulating layer 33 in the wiring region EE is removed, the retained second insulating layer 33 can prevent the problem that the adjacent second lead wire 352 is short-circuited due to the existence of etching Remain in the second touch electrode layer 34.

[0052] Specifically, as shown in FIGS. 5A to 5C, since the first planarization layer 129, the second planarization layer 131, and the third planarization layer 133 are retained in the bending region CC, in the embodiment of the present disclosure, in order to position the first lead wire 351 in the neutral layer 2, the first insulating layer 31 and the second insulating layer 33 located in the bending region CC are removed, and the problem that the first lead wire 351 is disconnected during bending can be prevented.

[0053] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1, 2, 6A to 6C, the second lead wire 352 may be located in the second touch electrode layer 34. The second lead wire 352 is electrically connected to a second contact portion 62 located in the third metal layer 132 through a via penetrating the second insulating layer 33, the first insulating layer 31, and the third planarization layer 133 in the second adapter via region E1. The second contact portion 62 can be electrically connected to the first lead wire 351 through a via penetrating the second planarization layer 131 in the second adapter via region E1. Here, the orthographic projection of the first insulating layer 31 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the first insulating layer 31 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11.

[0054] In this way, when manufacturing the subsequent touch structure 3, the orthographic projection of the first touch electrode layer 32 above the first insulating layer 31 onto the base substrate 11 is made not to overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the first touch electrode layer 32 onto the wiring region EE is made to cover at most the portion of the wiring region EE close to the bonding region BB. The orthographic projection of the second touch electrode layer 34 onto the base substrate 11 can be made not to overlap with the orthographic projection of the bending region CC onto the base substrate 11. That is, by removing a part of the first touch electrode layer 32 located in the bending region CC and a part of the first touch electrode layer 32 located in the wiring region EE, and retaining the second insulating layer 33 above the first touch electrode layer 32, it can be ensured that the second lead wire 352 can be manufactured above the flat second insulating layer 33, and the problem of shorting of adjacent second lead wires 352 due to the presence of etching Remain in the second touch electrode layer 34 can be prevented.

[0055] Specifically, as shown in FIGS. 6A to 6C, since the first planarization layer 129, the second planarization layer 131, and the third planarization layer 133 are retained in the bending region CC, in the embodiments of the present disclosure, in order to position the first lead wire 351 on the neutral layer 2, the first insulating layer 31 and the second insulating layer 33 located in the bending region CC are removed, and the problem that the first lead wire 351 is disconnected during bending can be prevented.

[0056] In a specific implementation, in order to improve the bending characteristics of the bending region, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 2, 4A to 6C, in the embodiments of the present disclosure, an example in which the first insulating layer 31 is an organic layer is given. Of course, the first insulating layer 32 may be an inorganic layer. By adopting the inorganic layer as the first insulating layer 32, the stacking of the organic layer film layers in the bonding region BB can be reduced, and the inorganic layer is difficult to absorb moisture and is etching resistant, and the purpose of further reducing the metal Remain can be achieved.

[0057] In a specific implementation, in order to improve the bending characteristics of the bending region, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 2, 4A, 5A, and 6A, a low-voltage power supply line VSS and a high-voltage power supply line (not shown) are further included. In order to improve the bending characteristics, both the low-voltage power supply line VSS and the high-voltage power supply line adopt a layer of metal wiring located in the second metal layer 130 in the bending region CC, and the low-voltage power supply line VSS and / or the high-voltage power supply line are such that the metal wiring in the bending region CC is located on both sides of the first lead wire 351 and is provided at an interval from the first lead wire 351, and the low-voltage power supply line VSS and the second lead wire 352 overlap each other in the wiring region EE. In the embodiments of the present disclosure, an example in which the metal wiring of the low-voltage power supply line VSS in the bending region CC is located on both sides of the first lead wire 351 and is provided at an interval from the first lead wire 351 is given.

[0058] In a specific implementation, as shown in FIGS. 5A and 6A, since the second lead wire 352 is fabricated in the touch electrode layer, for the high-voltage power line and the low-voltage power line VSS, a three-layer wiring design of the first metal layer 127, the second metal layer 130, and the third metal layer 13 can be adopted in the wiring region EE to provide a conductive structure for reducing resistance.

[0059] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 2 and 4A, the low-voltage power line VSS includes a first conductive structure 51 and a second conductive structure 52 in the wiring region EE. The first conductive structure 51 may be located in the first metal layer 127, and the second conductive structure 52 may be located in the second metal layer 130. The first conductive structure 51 is electrically connected to the second conductive structure 52 through a via penetrating the first planarization layer 129. Note that providing the first conductive structure 51 and the second conductive structure 52 electrically connected in the wiring region EE is for reducing the resistance of the low-voltage power line VSS. The patterns of the first conductive structure 51 and the second conductive structure 52 are the same, and the first conductive structure 51 is covered by the pattern of the second conductive structure 52.

[0060] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, the high-voltage power line corresponding to the structure shown in FIG. 4A may include a third conductive structure and a fourth conductive structure in the wiring region. The third conductive structure may be located in the first metal layer, and the third conductive structure is provided at a distance from the first conductive structure. The fourth conductive structure may be located in the second metal layer, and the fourth conductive structure is provided at a distance from the second conductive structure. The third conductive structure is electrically connected to the fourth conductive structure through a via penetrating the first planarization layer. Note that providing the third conductive structure and the fourth conductive structure electrically connected in the wiring region is for reducing the resistance of the high-voltage power line. The patterns of the third conductive structure and the fourth conductive structure are the same, and the third conductive structure is covered by the pattern of the fourth conductive structure.

[0061] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIG. 4D, the low-voltage power line VSS further includes a fifth conductive structure 53 in the wiring region EE. The fifth conductive structure 53 is located in the third metal layer 132, and the fifth conductive structure 53 is electrically connected to the second conductive structure 52 through a via penetrating the second planarization layer 131.

[0062] The high-voltage power line VDD further includes a sixth conductive structure 54 in the wiring region EE. The sixth conductive structure 54 is located in the third metal layer 132, and the sixth conductive structure 54 is provided at an interval from the fifth conductive structure 53. The sixth conductive structure 54 is electrically connected to the fourth conductive structure through a via penetrating the second planarization layer 131. Incidentally, providing the first conductive structure 51, the second conductive structure 52, and the fifth conductive structure 53 that are electrically connected in the wiring region EE is for further reducing the resistance of the low-voltage power line VSS. The patterns of the first conductive structure 51 and the second conductive structure 52 are the same, and the fifth conductive structure 53 covers some of the first conductive structure 51 and the second conductive structure 52. FIG. 4D only shows the fifth conductive structure 53 and the sixth conductive structure 54 located in the third metal layer 132.

[0063] The second lead wire 352 is insulated from the fifth conductive structure 53 and the sixth conductive structure 54, and in this way, the fifth conductive structure 53, the sixth conductive structure 54, and the second lead wire 352 do not affect each other.

[0064] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIG. 4D, the fifth conductive structure 53 includes two sub-conductive structures (531 and 532) provided at intervals. The second lead wire 352 is located between the two sub-conductive structures (531 and 532), that is, the orthographic projections of the second lead wire 352 and the two sub-conductive structures (531 and 532) on the base substrate 11 do not overlap with each other. Specifically, both of the two sub-conductive structures are electrically connected to the second conductive structure 52. By providing the second lead wire 352 located in the wiring area EE of the touch lead wire 35 on the third metal layer 132, the high-voltage power supply line VDD further includes a sixth conductive structure 54 located on the third metal layer 132 in the wiring area EE. The low-voltage power supply line VSS further includes the fifth conductive structure 53 located on the third metal layer 132 in the wiring area EE, thereby further reducing the resistance of the high-voltage power supply line VDD and the low-voltage power supply line VSS, and the high-voltage power supply line VDD, the low-voltage power supply line VSS, and the second lead wire 352 do not affect each other.

[0065] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 2, 7A to 7C, FIG. 7A is a schematic cross-sectional view within the broken-line block E1 in FIG. 3A. FIG. 7B is a schematic cross-sectional view along the FF' direction in FIG. 3A. FIG. 7C is a schematic plan view in which the touch lead wire 35 employs two-layer wiring of the first touch electrode layer 32 and the second touch electrode layer 34 in the wiring area EE. The second insulating layer 33 between the first touch electrode layer 32 and the second touch electrode layer 34 is retained in the wiring area EE, and the portion located in the wiring area EE of the touch lead wire 35 is electrically connected through a via V penetrating the second insulating layer 33. In this way, the second insulating layer 33 retained in the wiring area EE can prevent the problem that adjacent touch lead wires 35 are short-circuited in the bonding area BB due to the problem of metal residue (Remain) generated when the second touch electrode layer 34 is grown on the flattening layer base and the second touch electrode layer 34 and the organic first insulating layer 31 polymerize and react to etch the second touch electrode layer 34.

[0066] Specifically, as shown in FIGS. 1 and 7B, the orthographic projection of the first insulating layer 31 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the first insulating layer 31 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. The orthographic projection of the second insulating layer 33 onto the base substrate 11 overlaps with the orthographic projections of the display region AA, the wiring region EE, and the bonding region BB onto the base substrate 11.

[0067] Note that "overlap with each other" described in the embodiments of the present disclosure may include "completely overlap" and "partially overlap".

[0068] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 2, 4B, 4C, 5B, 5C, 6B, 6C, 7A, and 7B, the display panel may further include a protective layer 4 located on the side opposite to the base substrate 11 of the touch structure 3. The orthographic projection of the protective layer 4 onto the base substrate 11 does not overlap with the orthographic projection of the bending region CC onto the base substrate 11. Alternatively, the protective layer 4 may be an organic layer, and the protective layer 4 can play a role in protecting the touch electrodes located in the display region AA and protecting the bonding region BB.

[0069] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 4A, 4C, 5A, 5C, 6A, 6C, 7A, 7C, and 8, FIG. 8 is a schematic boundary view of the upper and lower sides of the bending region CC of the first insulating layer 31 and the second insulating layer 33 corresponding to FIGS. 4A, 4C, 5A, 5C, 6A, 6C, 7A, and 7C. As can be seen from the above figures, the orthographic projections of the first insulating layer 31 and the second insulating layer 33 onto the base substrate 11 do not overlap with the orthographic projection of the bending region CC onto the base substrate 11, and the bending characteristics of the bending region CC can be improved.

[0070] Note that FIG. 8 only schematically shows the boundaries on both the upper and lower sides of the bending region CC of the first insulating layer 31 and the second insulating layer 33, and an adaptor may be provided in the transition region DD and the wiring region EE of the first insulating layer 31 and the second insulating layer 33.

[0071] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIG. 2, a display structure 13 located between the third planarization layer 133 and the touch structure 3, and a sealing structure 2 located between the display structure 13 and the touch structure 3 are further included.

[0072] The display structure 13 includes an anode layer 134, a pixel defining layer 135, a light emitting functional layer 136, and a cathode layer 137 that are sequentially stacked between the third planarization layer 133 and the sealing structure 3. The display panel further includes a spacer layer (not shown) provided between the pixel defining layer 135 and the cathode layer 137, and the material of the spacer is an organic material.

[0073] To achieve the stress needs of large-angle bending, the sealing structure 2 may include a first inorganic sealing layer 21, a first organic sealing layer 22, a second inorganic sealing layer 23, a second organic sealing layer 24, and a third inorganic sealing layer 25 that are stacked. In this way, compared with the sealing structure adopting an inorganic layer-organic layer-inorganic layer in the prior art, in the embodiments of the present disclosure, by adding one layer of the second organic sealing layer 24 and one layer of the third inorganic sealing layer 25, the problem that cracks occur in the second inorganic sealing layer 23 during bending can be prevented, and the sealing characteristics of the display panel can be improved.

[0074] In a specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 4B, 4C, 5B, 5C, 6B, 6C, 7A, and 7B, in order to further ensure that the first lead wire 351 is located in the neutral layer 2, the first planarization layer 129, the second planarization layer 131, the third planarization layer 133, and the spacer layer 7 all cover the bending region CC. That is, the first planarization layer 129, the second planarization layer 131, the third planarization layer 133, and the spacer layer 7 are retained in the bending region CC.

[0075] In specific implementation, in the above display panel provided by the embodiments of the present disclosure, as shown in FIGS. 1, 3A, 4A, 5A and 6A, the bonding region BB includes a pad region (Pad region) close to the edge of the display panel. The pad region includes a plurality of pads 8 (Pad), and the pads 8 are used to bond with a driving IC to transmit signals on the driving IC to the display region AA for display.

[0076] As shown in FIGS. 9, 10 and 11, FIG. 9 is an enlarged schematic diagram of some of the pads 8 in FIG. 4A and the touch lead lines 35 electrically connected thereto. FIG. 10 is an enlarged schematic diagram of some of the pads 8 in FIG. 5A and the touch lead lines 35 electrically connected thereto. FIG. 11 is an enlarged schematic diagram of some of the pads 8 in FIG. 6A and the touch lead lines 35 electrically connected thereto. The pads 8 (Pad) may be designed in parallel by adopting multiple metal layers among the first metal layer 127, the second metal layer 130, the third metal layer 132, the first touch electrode layer 32 and the second touch electrode layer 34 so as to reduce resistance and improve signal transmission characteristics.

[0077] In specific implementation, the above display panel provided by the embodiments of the present disclosure may include other functional film layers well known to those skilled in the art, but examples are not given one by one here.

[0078] Based on the same inventive concept, the embodiments of the present disclosure further provide a display device including the above display panel provided by the embodiments of the present disclosure. Since the principle of solving problems of the display device is similar to that of the above display panel, for the implementation of the display device, reference may be made to the implementation of the above display panel, and repeated description is omitted here.

[0079] In specific implementation, the above display device provided by the embodiments of the present disclosure may be a full-screen display device, or may be a flexible display device or the like, and is not limited here.

[0080] In specific implementation, the display device provided by the embodiments of the present disclosure may be a full-screen mobile phone as shown in FIG. 12. Of course, the display device provided by the embodiments of the present disclosure may be any product or component having a display function, such as a tablet, a television, a display, a notebook computer, a digital photo frame, a navigator, etc. Those skilled in the art can understand that other essential components should be provided for the display device, and the description here is omitted and should not limit the present disclosure.

[0081] Regarding the display panel and the display device provided by the embodiments of the present disclosure, for the above display panel provided by the embodiments of the present disclosure, a single layer of metal wiring is adopted for the second lead line located in the bonding region, and a corresponding insulating layer is provided above or below the film layer where the second lead line is located, so as to avoid the problem that adjacent touch lead lines are shorted in the bonding region due to metal residue generated in the modes shown in FIGS. 3A to 3C.

[0082] Although the preferred embodiments of the present disclosure have been described, those skilled in the art can make other changes and variations to these embodiments if they know the basic creative concepts. Therefore, the appended claims are construed to include all changes and variations that fall within the preferred embodiments and the scope of the present disclosure.

[0083] Of course, those skilled in the art can make various changes and deformations to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. In this way, if these changes and deformations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and its equivalent technical scope, the present disclosure shall include these changes and deformations.

Claims

1. A display panel including a display area and a non-display area located on one side of the display area, the non-display area including a bending area, a bonding area, and a wiring area located between the bending area and the bonding area, comprising: a base substrate; a touch structure located on the base substrate, including touch lead lines, the touch lead lines being drawn out from the display area and extending to the bonding area; the touch lead lines having a first lead line located in the bending area and a second lead line located in the wiring area, the first lead line and the second lead line being electrically connected and located in different metal layers, and the second lead line adopting a touch structure with a single layer of metal wiring; A display panel including the above.

2. Further including a first metal layer, a first planarization layer, a second metal layer, a second planarization layer, a third metal layer, and a third planarization layer sequentially laminated between the base substrate and the touch structure, the first metal layer being close to the base substrate; the touch structure further including a first insulating layer, a first touch electrode layer, a second insulating layer, and a second touch electrode layer sequentially laminated at least in the display area on the side opposite to the base substrate of the third planarization layer; The display panel according to Claim 1, wherein the first insulating layer and the second insulating layer are organic layers, and the first lead line is located in the second metal layer.

3. The touch lead lines further include a third lead line drawn out from the display area and extending to the side opposite to the bonding area of the bending area, the third lead line including a first sub-lead line located in the first touch electrode layer and a second sub-lead line located in the second touch electrode layer, and the first sub-lead line and the second sub-lead line being electrically connected through vias penetrating the second insulating layer; The display panel according to Claim 2.

4. The non-display area further includes a transition area located between the display area and the bending area, a portion of the transition area close to the bending area being a first adapter via area, and a portion of the wiring area close to the bending area being a second adapter via area; The first sub-lead line is electrically connected to a first contact portion of the third metal layer through a via penetrating the third planarization layer in the first adapter via region. The display panel according to claim 3, wherein the first contact portion is electrically connected to the first lead line through a via penetrating the second planarization layer in the first adapter via region. **Claim 5** The display panel according to claim 4, wherein a via electrically connecting the first sub-lead line and the second sub-lead line does not overlap with the first adapter via region. **Claim 6** The second lead line is located in the third metal layer, and the second lead line is electrically connected to the first lead line through a via penetrating the second planarization layer in the second adapter via region. The display panel according to claim 4 or 5. **Claim 7** The orthographic projection of the first touch electrode layer onto the wiring region covers at most the orthographic projection onto a portion of the wiring region close to the bonding region, and the orthographic projection of the second touch electrode layer onto the wiring region covers at most the orthographic projection onto a portion of the wiring region close to the bonding region. The display panel according to claim 6. **Claim 8** The orthographic projection of the first touch electrode layer onto the base substrate does not overlap with the orthographic projection of the base substrate onto the bending region, and the orthographic projection of the second touch electrode layer onto the base substrate does not overlap with the orthographic projection of the base substrate onto the bending region. The display panel according to claim 7. **Claim 9** The second lead line is located in the first touch electrode layer, and the second lead line is electrically connected to a second contact portion located in the third metal layer through a via penetrating the first insulating layer and the third planarization layer in the second adapter via region. The second contact portion is electrically connected to the first lead line through a via penetrating the second planarization layer in the second adapter via region. The display panel according to claim 4 or 5. **Claim 10** The orthographic projection of the first touch electrode layer onto the base substrate does not overlap with the orthographic projection of the base substrate onto the bending region, and the orthographic projection of the second touch electrode layer onto the base substrate does not overlap with the orthographic projection of the base substrate onto the bending region. The orthographic projection of the second touch electrode layer onto the wiring region covers at most the orthographic projection onto a portion of the wiring region close to the bonding region. The display panel according to claim 9. **Claim 11** The second lead wire is located in the second touch electrode layer. The second lead wire is electrically connected to a second contact portion located in the third metal layer through a via penetrating the second insulating layer, the first insulating layer, and the third planarization layer in the second adapter via region. The second contact portion is electrically connected to the first lead wire through a via penetrating the second planarization layer in the second adapter via region. The display panel according to claim 4 or 5.

12. The orthographic projection of the second touch electrode layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate. The orthographic projection of the first touch electrode layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate. The orthographic projection of the first touch electrode layer onto the wiring region covers at most the orthographic projection of a portion of the wiring region close to the bonding region. The display panel according to claim 11.

13. The orthographic projection of the second insulating layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate. The orthographic projection of the second insulating layer onto the base substrate overlaps with the orthographic projections of the display region, the wiring region, and the bonding region onto the base substrate. The display panel according to any one of claims 6 to 12.

14. The orthographic projection of the first insulating layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate. The orthographic projection of the first insulating layer onto the base substrate overlaps with the orthographic projections of the display region, the wiring region, and the bonding region onto the base substrate. The display panel according to any one of claims 6 to 12.

15. Further including a low-voltage power line and a high-voltage power line. Both the low-voltage power line and the high-voltage power line employ a single layer of metal wiring located in the second metal layer in the bending region. And the metal wiring of the low-voltage power line and / or the high-voltage power line in the bending region is located on both sides of the first lead wire and is provided at an interval from the first lead wire. The low-voltage power line and the second lead wire overlap with each other in the wiring region. The display panel according to any one of claims 2 to 14.

16. It further includes a low-voltage power supply line and a high-voltage power supply line. The low-voltage power supply line includes a first conductive structure and a second conductive structure in the wiring region. The first conductive structure is located in the first metal layer, and the second conductive structure is located in the second metal layer. The first conductive structure is electrically connected to the second conductive structure through a via penetrating the first planarization layer. The high-voltage power supply line includes a third conductive structure and a fourth conductive structure in the wiring region. The third conductive structure is located in the first metal layer, and the third conductive structure is provided at a distance from the first conductive structure. The fourth conductive structure is located in the second metal layer, and the fourth conductive structure is provided at a distance from the second conductive structure. The third conductive structure is electrically connected to the fourth conductive structure through a via penetrating the first planarization layer. The display panel according to any one of claims 6 to 8.

17. The low-voltage power supply line further includes a fifth conductive structure in the wiring region. The fifth conductive structure is located in the third metal layer, and the fifth conductive structure is electrically connected to the second conductive structure through a via penetrating the second planarization layer. The high-voltage power supply line further includes a sixth conductive structure in the wiring region. The sixth conductive structure is located in the third metal layer, and the sixth conductive structure is provided at a distance from the fifth conductive structure. The sixth conductive structure is electrically connected to the fourth conductive structure through a via penetrating the second planarization layer. The second lead wire is insulated from the fifth conductive structure and the sixth conductive structure. The display panel according to claim 16.

18. The fifth conductive structure includes two sub-conductive structures provided at a distance from each other. The second lead wire is located between the two sub-conductive structures. The display panel according to claim 17.

19. The display panel further includes a protective layer located on the side opposite to the base substrate of the touch structure. The orthographic projection of the protective layer onto the base substrate does not overlap with the orthographic projection of the bending region onto the base substrate. The display panel according to any one of claims 1 to 18.

20. It further includes a display structure located between the third planarization layer and the touch structure, and a sealing structure located between the display structure and the touch structure. The display structure includes an anode layer, a pixel defining layer, a light emitting functional layer, and a cathode layer, which are sequentially laminated and provided between the third planarization layer and the encapsulation structure. The display panel further includes a spacer layer provided between the pixel defining layer and the cathode layer. The encapsulation structure includes a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, a second organic encapsulation layer, and a third inorganic encapsulation layer, which are laminated and provided, and the display panel according to any one of claims 2 to 19.

21. The display panel according to claim 20, wherein the first planarization layer, the second planarization layer, the third planarization layer, and the spacer layer all cover the bending region.

22. A display device including the display panel according to any one of claims 1 to 21.

Images