System for processing a wafer-shaped article

Abstract

A system for processing wafer-shaped articles, the system comprising three or more processing stations and a robotic arm including a first set of end effectors including three or more end effectors, the robotic arm configured to pick up each wafer-shaped article using each of the three or more end effectors from a storage unit configured to store a plurality of wafer-shaped articles and load one of each of the wafer-shaped articles into each of the three or more processing stations.

Description

Technical Field

[0001] The present invention relates to a system for processing wafer-shaped articles, such as semiconductor wafers.

Background Art

[0002] Wafers, such as semiconductor wafers, can undergo various surface treatment processes, such as etching, cleaning, polishing, and material deposition. During such surface treatment processes, the wafer is typically held using a chuck.

[0003] At least some of these surface treatment processes involve applying a liquid to the surface of the wafer. For example, the surface of the wafer may be etched by applying a processing liquid, such as hydrofluoric acid, to selected locations on the surface of the wafer. Alternatively, the surface of the wafer may be cleaned by applying a cleaning liquid or rinse liquid, such as isopropyl alcohol or deionized water, to the surface of the wafer.

[0004] When applying a liquid to the surface of the wafer, a rotating chuck (spin chuck) may be used, for example, to rotate the wafer and assist in distributing the liquid across the surface of the wafer.

[0005] Furthermore, the wafer may then be heated, for example, by using a heating element, such as LEDs within the chuck, to heat the lower surface of the wafer and evaporate the liquid on the surface of the wafer, thereby drying the surface of the wafer.

[0006] Of course, other types of processing devices or apparatuses for processing wafers are also well known in the art.

[0007] Generally, wafers are transported to a chuck or other suitable support of a processing device or apparatus using the end effector of a robotic arm. In particular, the end effector contacts the lower surface of the wafer to support the wafer from below and is used to transport the wafer.

[0008] Typically, an end effector is used to lower the wafer onto a chuck or other suitable support. Thereafter, the end effector can be withdrawn and the wafer can be processed. Thereafter, the same or a different end effector can be used to pick up the wafer from the chuck or other suitable support.

[0009] Wafers are typically transported to a processing apparatus in a container that holds multiple wafers, such as a FOUP (Front Opening Unified Pod). Thereafter, an end effector of a robotic arm is used to remove individual wafers from the container. After processing, the wafers can be loaded into the same or a different container for subsequent transport. SUMMARY OF THE INVENTION

[0010] The present invention most generally provides a system for processing wafer-shaped articles, wherein a robotic arm is configured to simultaneously transfer three or more wafer-shaped articles from a storage unit to a set of three or more processing stations. In this way, three or more wafer-shaped articles can be transferred from a storage unit to a processing station using a single robotic arm, thereby enabling three or more wafer-shaped articles to be processed simultaneously. This can increase the throughput of the system, i.e., increase the speed at which articles are processed. Further, since three or more processing stations can be operated simultaneously, sharing of resources between the processing stations can be enabled, thereby simplifying the construction of the system and improving the overall efficiency of the system.

[0011] According to a first aspect of the present invention, a system for processing a wafer-shaped article is provided, the system comprising three or more processing stations and a robotic arm including a first set of end effectors including three or more end effectors, the robotic arm being configured to pick up each wafer-shaped article from a storage unit configured to store a plurality of wafer-shaped articles using each of the three or more end effectors and load one of each wafer-shaped article into each of the three or more processing stations.

[0012] Thus, the robotic arm can pick up three or more wafer-shaped articles (i.e., one by each end effector) from the storage unit and then load three or more wafer-shaped articles (i.e., one by each processing station) into the processing stations. In other words, each of the three or more wafer-shaped articles is simultaneously transferred between the storage unit and the processing stations.

[0013] The first aspect of the present invention may have any one of the following optional features, or any combination thereof if applicable.

[0014] The system of the present invention may also be referred to as an apparatus rather than a system.

[0015] As used herein, the wafer-shaped article may refer to a wafer such as a semiconductor wafer. The wafer-shaped article may include a semiconductor substrate.

[0016] The processing station may be a wafer processing station.

[0017] The processing station may be, for example, a processing module, or a processing apparatus, or a processing device, or may include the same.

[0018] Each of three or more processing stations is configured to process an individual wafer-shaped article. Thus, when one of each wafer-shaped article is loaded by a robotic arm into one of the processing stations, the processing station can process the wafer-shaped article.

[0019] Three or more processing stations can be configured to perform the same process, i.e., such that the wafer-shaped articles loaded into each processing station undergo the same process.

[0020] Each of three or more processing stations can include any suitable components for performing a desired process on the wafer-shaped article. For example, each of three or more processing stations can include respective devices for processing the wafer-shaped article.

[0021] As an example, each processing station can be configured to perform an etching and / or cleaning process on the wafer-shaped article. Each processing station can be configured to dispense a liquid, such as an etching liquid or a cleaning liquid, onto the surface of the wafer-shaped article. As another example, each processing station can be configured to perform a bevel etching process on the wafer-shaped article. Of course, other types of processing are possible and are well known in the art.

[0022] Processing the wafer-shaped article can include adding or removing material from the wafer-shaped article, for example, etching material from the wafer-shaped article or depositing material on the wafer-shaped article.

[0023] Processing the wafer-shaped article can include cleaning the wafer-shaped article using a cleaning or rinsing liquid, such as a solvent or water.

[0024] Each of the processing stations can include (respective) fluid dispensers for dispensing fluid onto the surface of the wafer-shaped article.

[0025] The fluid dispenser can be a liquid dispenser for dispensing a liquid onto the surface of a wafer-shaped article.

[0026] Each of the processing stations may include two or more fluid dispensers (a plurality of fluid dispensers). For example, each of the processing stations may include two, or three or more fluid dispensers.

[0027] For example, each of the processing stations may include a first fluid dispenser for dispensing a first fluid such as an acid, or an etching fluid or a cleaning fluid. Further, each of the processing stations may include a second fluid dispenser for dispensing a rinse fluid or a rinse liquid such as deionized water. The second fluid dispenser may be for dispensing a drying gas such as nitrogen to dry the wafer-shaped article.

[0028] Each of the processing stations may include a (respective) chuck, for example, a rotating chuck. The rotating chuck may alternatively be referred to as a spin chuck or a rotary chuck. The chuck may be configured to accommodate a respective wafer-shaped article. The rotating chuck may include a drive mechanism, for example, a motor, for driving the rotation of the rotating chuck.

[0029] Loading a respective wafer-shaped article onto each of three or more processing stations may include loading a respective wafer-shaped article onto the chuck of each of the three or more processing stations.

[0030] More generally, each of the processing stations may include a (respective) support configured to support a wafer-shaped article during a processing operation performed on the wafer-shaped article.

[0031] Loading a respective wafer-shaped article onto each of three or more processing stations may include loading a respective wafer-shaped article onto the support of each of the three or more processing stations.

[0032] The support or the rotating chuck can be configured to support the wafer-shaped article spaced apart from the surface of the support or the rotating chuck. For example, the support or the rotating chuck can be configured to support the wafer-shaped article spaced apart from the surface of the support or the rotating chuck on a gas cushion according to Bernoulli's principle. Such a support or rotating chuck can be referred to as a Bernoulli chuck or a Bernoulli support. Alternatively, the support or the rotating chuck can be configured to support the wafer-shaped article spaced apart from the surface of the support or the rotating chuck on a plurality of pins extending from the surface of the support or the rotating chuck. Of course, other mechanisms for supporting the wafer-shaped article above the surface of the support or the rotating chuck are also possible.

[0033] More generally, the support or the rotating chuck can include a support or a support arrangement or a support mechanism for supporting the wafer-shaped article spaced apart from the upper surface of the support or the rotating chuck.

[0034] Each wafer-shaped article is picked up from a single storage unit.

[0035] Three or more end effectors are provided on a single robotic arm or within a single robotic arm.

[0036] The storage unit is configured to store a plurality of wafer-shaped articles.

[0037] The storage unit can be removable and / or detachable from the system.

[0038] The storage unit can be a container or a cassette configured to store a plurality of wafer-shaped articles.

[0039] The storage unit can be a container or a cassette used to transport a plurality of wafer-shaped articles to and / or from the system.

[0040] A storage unit can be a container or cassette used to transport multiple wafer-shaped articles between different processing apparatuses in a wafer manufacturing environment.

[0041] For example, the storage unit can be a FOUP.

[0042] The storage unit can form part of a system for processing wafer-shaped articles.

[0043] Thus, the system can include the storage unit.

[0044] Alternatively, the storage unit can be separate from and / or distinct from the system.

[0045] The storage unit can have any suitable structure for storing wafer-shaped articles. As an example, the storage unit can include a rack or multiple shelves for storing multiple wafer-shaped articles.

[0046] The storage unit can be configured to stack multiple wafer-shaped articles, for example, stack them substantially vertically for storage.

[0047] The storage unit can be configured to store multiple wafer-shaped articles by stacking them one on top of the other.

[0048] The storage unit can be configured to store multiple wafer-shaped articles in a vertical column.

[0049] The storage unit can include a first portion configured to store unprocessed wafer-shaped articles (i.e., articles not yet processed by a processing station) and a second portion configured to store processed wafer-shaped articles (i.e., articles processed by a processing station).

[0050] There can be exactly three or only three processing stations.

[0051] There can be four or more processing stations.

[0052] The robotic arm comprises a first set of three or more end effectors, each end effector being configured to pick up an individual wafer-shaped article.

[0053] Each end effector can be adapted to pick up and support (e.g., hold) its respective wafer-shaped article and can include any suitable element(s) and / or mechanism(s) for performing this function.

[0054] For example, each end effector can comprise one or more support elements for holding or supporting the wafer-shaped article from below.

[0055] The end effector can also be referred to as a manipulator, a wafer supporter, a wafer transporter, or a wafer carrier.

[0056] In some cases, each end effector can comprise a holding mechanism for holding (e.g., gripping, holding) the wafer-shaped article to avoid the wafer-shaped article from falling. As an example, each end effector can comprise a vacuum holder, in which a vacuum is used to hold the wafer-shaped article on the end effector. Alternatively, each end effector can comprise a plurality of pins for gripping the edge of the wafer-shaped article to hold the wafer-shaped article on the end effector. Other types of holding mechanisms may be used, or such holding mechanisms may not be used.

[0057] Each of the first set of three or more end effectors can be associated with one of each of the three or more processing stations. Thus, each end effector can be used to load the wafer-shaped article into its associated processing station. However, in other embodiments, the end effectors may be used interchangeably to load the wafer-shaped article into different processing stations among the processing stations.

[0058] Three or more end effectors of the first set may be disposed at the working end or distal end of the robotic arm. Each of the three or more end effectors is movable relative to the working end or distal end of the robotic arm, whereby it may be facilitated to pick up a wafer-shaped article from a storage unit and load the wafer-shaped article onto a processing station using the three or more end effectors.

[0059] Three or more end effectors of the first set may be provided, or attached, or disposed on a common forearm of the robotic arm.

[0060] The robotic arm may comprise any suitable type of robotic arm for transferring a wafer-shaped article between a storage unit and a processing station. The robotic arm may comprise two or more articulating portions (e.g., members). The robotic arm may comprise one or more motors for controlling the operation of the robotic arm and the end effectors.

[0061] Instead of the term "robotic arm", the term "robot arm" may be used.

[0062] The robotic arm may be movable between a first position where each of the three or more end effectors of the first set is arranged to pick up a respective wafer-shaped article from a storage unit and a second position where each of the three or more end effectors of the first set is arranged to load a respective wafer-shaped article onto a relevant one of the processing stations.

[0063] To pick up a wafer-shaped article, the end effector may be disposed below the wafer-shaped article and then lifted to contact the lower surface of the wafer-shaped article to support the wafer-shaped article.

[0064] The robotic arm can be configured to perform any suitable action(s) to pick up each wafer-shaped article from the storage unit using the end effector. For example, the robotic arm can be configured to insert each of three or more end effectors into the storage unit to pick up each wafer-shaped article from the storage unit using each end effector. The specific action of the robotic arm for picking up the wafer-shaped article from the storage unit can be adapted to the specific arrangement of the storage unit.

[0065] Similarly, the robotic arm can be configured to perform any suitable action(s) to load each wafer-shaped article into the processing station using the end effector. For example, the robotic arm can be configured to lower the end effector onto the processing station and place each wafer-shaped article onto the processing station. The specific action of the robotic arm for loading the wafer-shaped article into the processing station can be adapted to the specific arrangement of the processing station.

[0066] The robotic arm has a fixed end, and the working end and the end effector can be movable relative to the fixed end. The fixed end can be the proximal end of the robotic arm.

[0067] During operation, the robotic arm can first pick up each wafer-shaped article from the storage unit (e.g., the first part of the storage unit) using each of three or more end effectors. Next, the robotic arm can move the end effector from the storage unit to the processing station to load one of the wafer-shaped articles into each processing station. When the wafer-shaped article is loaded into each processing station, the system can be configured to process the wafer-shaped article by operating the processing station.

[0068] In this way, a single robotic arm is configured to load a wafer-shaped article onto three or more processing stations. As a result, instead of using a separate robotic arm for each processing station, the robotic arm can be shared among three or more processing stations, which can simplify the construction of the system. In particular, by sharing the robotic arm among three or more processing stations, the number of moving parts within the system can be significantly reduced. This, in turn, facilitates the maintenance of the system and reduces the number of potential failure points within the system, thereby improving the reliability and durability of the system. Furthermore, the robotic arm of the present invention enables the simultaneous transfer of three or more wafers between a storage unit and a processing station. This can contribute to an improvement in the throughput of the system and enable the parallel processing of wafer-shaped articles at three or more processing stations.

[0069] Following the processing of the wafer-shaped article, the robotic arm can be further configured to remove (e.g., pick up) the wafer-shaped article from the processing station and transfer them back to a storage unit (e.g., a second portion of the storage unit). More specifically, each of the end effectors can pick up a respective wafer-shaped article from one of the processing stations and load the respective wafer-shaped article into a storage unit, such as the same storage unit or a different storage unit from which the wafer-shaped article was removed. A first set of end effectors can be used to pick up the wafer-shaped article from the processing station. Alternatively, as will be described in more detail below, a second set of end effectors can be used.

[0070] The robotic arm can be configured to simultaneously load each of three or more processing stations with a respective wafer-shaped article. In other words, each of the three or more processing stations can have a respective wafer-shaped article simultaneously loaded thereon. Thereby, the time required to load the three or more processing stations can be reduced. Further, thereby, since processing can be started simultaneously at each processing station (i.e., after the wafer-shaped article is loaded), it becomes easier to operate the three or more processing stations simultaneously (e.g., in parallel).

[0071] By arranging a first set of three or more end effectors such that each end effector can reach its associated processing station when the robotic arm is in a second position, it can be achieved that each of the three or more processing stations is simultaneously loaded with a respective wafer-shaped article. Thus, with the same operation (or set of operations) of the robotic arm, the three or more processing stations can each accommodate a respective wafer-shaped article simultaneously.

[0072] The robotic arm can be configured to simultaneously pick up each of three or more wafer-shaped articles from a storage unit using each of the three or more end effectors. In other words, the three or more wafer-shaped articles can be picked up simultaneously (one by each end effector) by the robotic arm. Thereby, the time required to pick up the wafer-shaped articles and transfer them to the three or more processing stations can be reduced, and thus the throughput of the system can be improved.

[0073] By arranging three or more end effectors of the first set such that each end effector can reach its respective wafer-shaped article within the storage unit, it can be achieved that each wafer-shaped article is picked up simultaneously. Thus, the arrangement of three or more end effectors is particularly adapted to the storage unit such that it may be possible for each of the end effectors to pick up its respective wafer-shaped article simultaneously. Thus, by the same movement (or set of movements) of the robotic arm, it may be possible to pick up three or more wafer-shaped articles from the storage unit simultaneously.

[0074] Three or more processing stations may be configured to operate simultaneously. For example, three or more processing stations may be configured to process wafers simultaneously, for example to start and end processing simultaneously. In other words, three or more processing stations may be configured to operate in parallel. In this way, three or more wafer-shaped articles may be processed simultaneously (one at each processing station). This can improve the throughput of the system. Furthermore, this enables various parts of the system to be shared among three or more wafer processing systems, and thus can reduce the redundancy of components within the system and simplify the construction and maintenance of the system. For example, by operating three or more processing stations simultaneously, a common fluid supply line, and / or a common drain line, and / or a common suction line may be shared among the three or more processing stations.

[0075] Thus, three or more processing stations may share one or more of a common fluid supply line, a common drain line, and / or a common suction line.

[0076] More generally, three or more processing stations may share one or more components that are necessary for or used in processing wafer-shaped articles. In other words, a single one of the components may be provided for all of the three or more processing stations.

[0077] When three or more processing stations are configured to operate simultaneously, the system may include a fluid source (liquid source) and a supply valve configured to control the supply of fluid from the fluid source to each of the three or more processing stations. Thus, a single supply valve can be used to control the supply of fluid from the fluid source to three or more processing stations. When the supply valve is open, fluid can be supplied from the fluid source to each of the three or more processing stations. The supply valve can include any suitable type of valve, such as a needle valve or a ball valve. The fluid source can include any fluid used during the processing of a wafer-shaped article. For example, the fluid source can include a cleaning fluid or a cleaning liquid (e.g., isopropyl alcohol (IPA), acetone) or a rinse fluid or a rinse liquid (e.g., deionized water). In other embodiments, the fluid source can include an etching fluid such as hydrofluoric acid, or other processing chemicals. In some cases, the system may include multiple fluid sources, each of which is connected to a respective supply valve to control the supply of fluid from the fluid source to three or more processing stations.

[0078] The supply valve can be configured to control the flow rate of fluid from the fluid source to three or more processing stations.

[0079] In addition to a shared supply valve configured to control the supply of fluid from the fluid source to each of the three or more processing stations, each of the processing stations can have or can be provided with a respective supply valve. Each respective supply valve can be provided within the processing station or within each respective flow path from the shared supply valve to the processing station.

[0080] Each respective supply valve can be an on / off valve, such as a shut-on / off valve, used to switch the flow of fluid to each respective processing station on or off.

[0081] Accordingly, each supply valve controls whether to supply fluid to the processing station, and the shared supply valve can control the flow rate of the fluid flowing to the processing station when each supply valve is open.

[0082] When three or more processing stations are configured to operate simultaneously, the system may include a drain pipe and a drain valve configured to control the drainage of fluid from the three or more processing stations to the drain pipe. Accordingly, a single drain valve can be used to control the discharge of fluid from all of the three or more processing stations. The drain valve may include any suitable type of valve such as a needle valve, or a ball valve, or a suction valve.

[0083] For example, a liquid can be dispensed onto the surface of a wafer-shaped article and spun off the wafer-shaped article. The liquid spun off the wafer-shaped article can be collected and discharged through the drain pipe.

[0084] Thereafter, the collected liquid can be reused and dispensed onto the surface of the wafer-shaped article again. When the liquid is reused, the liquid may be filtered, for example, by a filter in the drain pipe and / or the drain line, before being reused.

[0085] When three or more processing stations are configured to operate simultaneously, the system may include a suction source for generating a suction force (or vacuum) and a suction valve for controlling the application of the suction force to the three or more processing stations.

[0086] In particular, the suction source can be used to suck the liquid distributed by the processing station and collected by the processing station. For example, the suction source can be used to suck the liquid into the drain pipe and / or drain line. Therefore, a single suction valve can be used to control the application of suction force to all of three or more processing stations. The suction valve can include any suitable type of valve, such as a needle valve or a ball valve.

[0087] In addition, or alternatively, each of the processing stations can have its own suction valve. Each suction valve may be provided within the processing station or in each flow path leading from a shared suction source or a shared suction valve to the processing station.

[0088] Each suction valve can be an on / off valve, such as a shut-on / off valve, used to switch the suction force to each processing station on or off.

[0089] In view of the above, a single valve or a set of valves (e.g., a supply valve, and / or a drain valve, and / or a suction valve) may be required to control the simultaneous operation of three or more processing stations. This facilitates the parallel processing of multiple wafer-shaped articles and can simplify the construction and maintenance of the system.

[0090] In some embodiments, as described above, in addition to a common valve, such as a common supply valve, drain valve, or suction valve, each of the processing stations can further have its own valve, such as its own supply valve, and / or drain valve, and / or suction valve, to enable further control. For example, by providing each processing station with its own supply valve, the interruption of the liquid supplied from the processing device, for example via a liquid nozzle, can be more appropriately controlled. For example, this can reduce the risk of droplets being dispensed after the supply of the liquid is interrupted and / or prevent the droplets from being dispensed.

[0091] If three or more processing stations are configured to operate simultaneously, the system may include an exhaust system for controlling the application of exhaust to the three or more processing stations.

[0092] Each of the three or more end effectors may be pivotally attached about a first common axis. For example, each of the three or more end effectors may be pivotally attached within, on, or to a robotic arm such that the three or more end effectors are pivotable or rotatable about the first common axis.

[0093] Being pivotable about the first common axis may mean being rotatable about the first common axis.

[0094] The first common axis may pass through the proximal end of each of the end effectors.

[0095] The first common axis may be perpendicular to the main plane of the end effector and / or, when a wafer-shaped article is supported by the end effector, may be perpendicular to the wafer-shaped article.

[0096] The three or more end effectors may be configured to align to pick up their respective wafer-shaped articles from a storage unit.

[0097] The three or more end effectors may be configured to align along the first common axis to pick up their respective wafer-shaped articles from a storage unit. This may be referred to as the first configuration of the end effector.

[0098] Saying that the end effectors are aligned can mean that the end effectors overlap when viewed along a common first axis, for example, they completely overlap or overlap to the maximum extent. This can facilitate picking up wafers from vertically stacked wafers in the storage unit.

[0099] Three or more end effectors can be configured to spread out in a fan shape to load respective wafer-shaped articles into each of three or more processing stations.

[0100] Three or more end effectors can be configured to spread out in a fan shape about a first common axis or along a first common axis to load respective wafer-shaped articles into each of three or more processing stations. This can be referred to as a second configuration of the end effectors.

[0101] Saying that three or more end effectors spread out in a fan shape can mean that each of the three or more end effectors is at a different turning angle about or around a first common axis.

[0102] Three or more end effectors can be configured to have different turning angles about a first common axis to load respective wafer-shaped articles into each of three or more processing stations.

[0103] Three or more end effectors can be configured to rotate in parallel, or in synchronization, or simultaneously between a first configuration and a second configuration of the three or more end effectors.

[0104] Three or more end effectors can be arranged to overlap vertically along a first common axis. This can facilitate picking up wafers from vertically stacked wafers in the storage unit.

[0105] The robotic arm can include one or more motors for controlling the turning or rotation of the end effector about a first common axis.

[0106] The robotic arm may include a first forearm, and three or more end effectors may be rotatably attached to the first forearm, and the three or more end effectors may be rotatable or turnable relative to the first forearm about a first common axis. With such an arrangement, for example, by moving the first forearm, a first set of three or more end effectors can be moved together between the storage unit and the processing station. Further, by making the end effector rotatable or turnable relative to the first forearm, it may be easier to turn the end effector to pick up and load a wafer-shaped article. The three or more end effectors of the first set may be arranged along the first common axis such that each of the three or more end effectors is rotatable or turnable about the first common axis. The robotic arm may include one or more motors for controlling the turning of the end effector about the first common axis.

[0107] The three or more end effectors may be rotatable or turnable relative to the forearm between a first arrangement (e.g., a transport arrangement) in which the three or more end effectors are aligned with each other along the first common axis and a second arrangement (e.g., a loading arrangement) in which the three or more end effectors are at different turning angles relative to / around the first common axis.

[0108] When the three or more end effectors pick up their respective wafer-shaped articles from the storage unit, the three or more end effectors are placed in the first arrangement.

[0109] Even when the robotic arm is transporting the wafer-shaped article between the storage unit and the processing station, the three or more end effectors can be placed in the first arrangement.

[0110] In the first arrangement, the end effectors are aligned with each other along a first common axis, i.e., when viewed along the first common axis, three or more end effectors are aligned. In other words, when the first set of end effectors is in the first arrangement, they are all at the same angular position (centered on or around the first common axis) with respect to the first common axis.

[0111] As described above, this arrangement facilitates picking up each wafer from the wafers stacked vertically in the storage unit.

[0112] In addition or alternatively, the first set of three or more end effectors can be more compact when in the first arrangement, which can facilitate the movement of the robotic arm between the storage unit and the processing station.

[0113] In the second arrangement, the end effectors are at different angular positions. For example, they can be in a fan-shaped arrangement where the end effectors are angularly spaced from each other around the first common axis.

[0114] This can facilitate simultaneously loading wafer-shaped articles onto three or more processing stations. In particular, the processing stations can be spaced apart (e.g., positioned adjacent to each other). Thus, in the second arrangement, each end effector can be pivoted with respect to the first common axis so that its position corresponds to the associated processing station.

[0115] For example, the arrangement of the end effectors in the second arrangement can correspond to the spatial arrangement of the processing stations.

[0116] As an example, when the end effectors are in the second arrangement, the end effectors can be arranged such that each end effector is positioned above its associated processing station. Then, the end effectors can be lowered towards the processing stations to simultaneously load each wafer-shaped article onto the processing stations.

[0117] The robotic arm can be configured to move a first forearm towards three or more processing stations with three or more end effectors in a first arrangement, and to move the three or more end effectors from the first arrangement to a second arrangement such that each of the three or more end effectors is positioned above a respective one of the three or more processing stations, so as to load each of the three or more processing stations with a respective wafer-shaped article.

[0118] Thus, as described above, the end effector can be placed in the first arrangement when picking up a wafer-shaped article from a storage unit and moving the first forearm towards three or more processing stations. Next, when the first forearm is at a loading position (e.g., adjacent to the three or more processing stations), the end effector can be placed in the second arrangement to enable loading of the wafer-shaped article into the processing station. Next, the three or more end effectors can be simultaneously lowered (e.g., by lowering the first forearm) to load each of the three or more processing stations with a respective wafer-shaped article.

[0119] The robotic arm can be configured to pick up each wafer-shaped article using the end effector in the first arrangement. This facilitates picking up the wafer-shaped article and can reduce the number of operations required of the robotic arm. This can be achieved by adapting the storage unit to the first arrangement of the end effector such that three or more wafer-shaped articles can be picked up simultaneously when the end effector is in the first arrangement.

[0120] Performing a process opposite to the above, a wafer-shaped article can be picked up from the processing station and conveyed to a storage unit (either the same storage unit where the wafer-shaped article was located or a different storage unit). For example, the end effector can be placed in a second configuration to pick up the wafer-shaped article from the processing station. Next, when the wafer-shaped article is picked up from the processing station, the end effector is placed in the first configuration, and the first forearm is advanced toward the storage unit to load the wafer-shaped article into the storage unit.

[0121] The robotic arm may include a plurality of forearms.

[0122] Each of three or more processing stations may include a rotating chuck having a set of holding pins for holding respective wafer-shaped articles, and each rotating chuck may be configured to rotate when three or more end effectors are moved to the second configuration to prevent contact (to align the set of holding pins with its associated end effector) between the set of holding pins and the associated end effector.

[0123] This serves to ensure that the holding pins do not interfere (e.g., contact) with the end effector when loading the wafer-shaped article into the processing station. In particular, the rotating chuck may rotate in synchronization with the swiveling or rotation of the end effector as the end effector moves to the second configuration. This can facilitate the procedure of loading each wafer-shaped article into the processing station.

[0124] The holding pins may be movable, e.g., rotatable, so as to contact the radially outer edge of the wafer-shaped article when the wafer-shaped article is loaded onto the rotating chuck to prevent or limit lateral movement of the wafer-shaped article relative to the rotating chuck.

[0125] The holding pins may be rotatable gripping pin assemblies.

[0126] The holding pins may also contact the lower surface of the wafer-shaped article to support the wafer-shaped article from below, thereby supporting the wafer-shaped article separated from the upper surface of the rotary chuck.

[0127] As an example, each end effector may be configured to support or hold the wafer-shaped article from below. For example, each end effector may include a pair of prongs (e.g., forks) for supporting or holding the wafer-shaped article from below. To load the wafer-shaped article onto a predetermined rotary chuck, the associated end effector may be lowered toward the rotary chuck. Next, while the holding pins on the rotary chuck serve to hold the wafer-shaped article on the rotary chuck, the end effector may be withdrawn from below the wafer-shaped article. During this procedure, the rotary chuck may be rotated in synchronization with the operation of the end effector so that the holding pins do not come into contact with the end effector, preventing the operation of the end effector from being obstructed by the holding pins.

[0128] The rotation of the rotary chuck may be synchronized with the operation of the end effector both when loading the wafer-shaped article onto the rotary chuck and when picking up the wafer-shaped article from the rotary chuck.

[0129] More generally, each of the three or more processing stations may include a rotary chuck having a set of holding pins for holding the respective wafer-shaped article, and each rotary chuck may rotate when the three or more end effectors are moved to load the respective wafer-shaped article onto the three or more processing stations, and may be configured to prevent contact between the set of holding pins and the associated end effector.

[0130] Each rotary chuck may be configured to rotate in synchronization with the operation of the associated end effector.

[0131] Three or more processing stations can be arranged at different vertices of a triangle. In other words, three or more processing stations can be in a triangular arrangement. This can facilitate loading each wafer-shaped article onto the processing stations. In particular, this facilitates each end effector reaching its associated processing station simultaneously, and thus can facilitate simultaneous loading as compared to a situation where, for example, the processing stations are arranged in a straight line. For example, this can enable each end effector to reach its associated processing station when three or more end effectors spread out fanwise in the second arrangement described above.

[0132] The system may further include a holding unit configured to hold a storage unit.

[0133] The system includes a plurality of holding units.

[0134] The system may include a support configured to support the holding unit.

[0135] The system may include a plurality of supports.

[0136] The robotic arm may be configured or operable to invert a first set of end effectors.

[0137] Inverting the first set of end effectors means turning the first set of end effectors upside down or rotating the first set of end effectors 180 degrees about the longitudinal axis.

[0138] In particular, the robotic arm may be configured or operable to invert the first set of end effectors such that after inversion, the first set of end effectors is above the wafer-shaped article and supports the wafer-shaped article from above while the first set of end effectors is transporting the wafer-shaped article.

[0139] For example, each end effector may include a gripping mechanism for gripping a wafer-shaped article, such that the wafer-shaped article is held by the end effector when the end effector is inverted / turned upside down. For example, each of the end effectors may be configured to grip the radially outer edge of the wafer-shaped article on the end effector, or may include a plurality of gripping elements such as actuatable pins.

[0140] The robotic arm may be configured to invert a first set of end effectors to load a wafer-shaped article onto a processing station.

[0141] Accordingly, the first set of end effectors may be used to support the wafer-shaped article from above and lower the wafer-shaped article from above onto their respective processing stations.

[0142] For example, each of the first set of end effectors may be provided or connected to a first forearm of the robotic arm, and the first forearm may be connected to or include a swivel joint or a rotary joint that can rotate the first forearm to invert the first set of end effectors.

[0143] The first forearm may be rotatable about the longitudinal axis of the first forearm to invert the first set of end effectors.

[0144] Inverting the first set of end effectors may include rotating a common axis about which the first set of end effectors is rotatable by 180 degrees therearound.

[0145] In this arrangement, the rotating chucks of the processing stations may not need to rotate simultaneously with, or in synchronization with, the pivoting of the respective end effectors. In particular, since each end effector and the robotic arm are disposed above the respective wafers loaded onto the rotating chucks, there may be no or a reduced risk of interference or contact between the robotic arm and the holding pins of the rotating chucks.

[0146] The robotic arm may further comprise a second set of end effectors including three or more end effectors, and the robotic arm may be configured to pick up each wafer-shaped article from each of the three or more processing stations using each end effector of the second set and load each wafer-shaped article into a storage unit (either the same storage unit from which the wafer-shaped article was removed or a different storage unit). In this way, different sets of end effectors may be used to handle pre-processed wafer-shaped articles and already processed wafer-shaped articles. Thereby, cross-contamination between wafer-shaped articles can be avoided. For example, when using a processing station to clean a wafer-shaped article, this can avoid cross-contamination between a soiled (i.e., pre-processed) wafer-shaped article and a non-soiled wafer-shaped article.

[0147] Alternatively, in other embodiments, the first set of end effectors may also be used to pick up wafer-shaped articles from the processing stations, and the second set of end effectors may be omitted.

[0148] The second set of end effectors may be arranged and operate in a manner similar to the first set of end effectors described above.

[0149] The second set of end effectors may have any of the features of the first set of end effectors described above, unless incompatible.

[0150] Each end effector of the second set can be associated with each one of the processing stations.

[0151] Each of the end effectors of the second set may be pivotally mounted about a second common axis and may be pivotable or rotatable between a first arrangement or configuration and a second arrangement or configuration as described above in relation to the first set of end effectors.

[0152] The robotic arm may include a second forearm, and three or more end effectors of the second set may be pivotally mounted to the second forearm, and the three or more end effectors are pivotable with respect to the second forearm about a second common axis. Similar to what was described above with respect to the first set of end effectors, making the second set of end effectors pivotable with respect to the second forearm can facilitate picking up each wafer-shaped article from the processing station and transferring them to the storage unit. The inventors have found that by providing the first set of end effectors and the second set of end effectors on separate forearms of the robotic arm, it can be easier to use the two sets of end effectors for their respective tasks.

[0153] Both the first forearm and the second forearm can be connected to the main arm portion of the robotic arm. In some cases, both the first forearm and the second forearm can be pivotally connected to the main portion of the robotic arm. This allows each forearm to pivot independently of the other, thus increasing the range of relative movement between the two sets of end effectors.

[0154] Of course, in alternative embodiments, the first set and the second set of end effectors can be pivotally mounted on the same arm or forearm.

[0155] The robotic arm may be configured or operable to invert a second set of end effectors. This may be achieved in the same manner as described above with respect to the first set of end effectors.

[0156] In this case, when picking up each wafer-shaped article from each processing station, the second set of end effectors may be disposed above each wafer-shaped article.

[0157] When the second set of end effectors picks up a wafer-shaped article from a processing station, then the second set of end effectors may be disposed below the wafer-shaped article and the second set of end effectors may be inverted to support the wafer-shaped article from below. In this configuration, the second set of end effectors may then be used to load the wafer-shaped article into a storage unit.

[0158] This may be achieved by the second set of end effectors being provided or connected to a second forearm of the robotic arm, and the second forearm may be connected to or comprise a swivel joint or a rotary joint that can rotate the second forearm to invert the second set of end effectors.

[0159] The second forearm may be rotatable about the longitudinal axis of the second forearm to invert the second set of end effectors.

[0160] Similar to the first set of end effectors, three or more end effectors of the second set may be pivotable relative to the second forearm between a first arrangement (e.g., a conveyance arrangement) in which the three or more end effectors are aligned with each other along a second common axis and a second arrangement (e.g., a loading arrangement) in which the three or more end effectors are at different swivel angles relative to the second common axis.

[0161] The robotic arm can be configured to pick up each wafer-shaped article from three or more processing stations by placing a second set of three or more end effectors in a second arrangement such that each of the second set of three or more end effectors is above a respective one of the three or more processing stations. The robotic arm can then be configured to place the second set of end effectors in a first arrangement to transfer each wafer-shaped article to a storage unit.

[0162] If each of the three or more processing stations includes a rotary chuck having a set of holding pins for holding a respective wafer-shaped article, each rotary chuck can be configured to rotate to align the set of holding pins with its associated second set of end effectors (and / or to prevent contact between the set of holding pins and its associated end effector) when the second set of three or more end effectors is moved to the second arrangement.

[0163] The robotic arm can be configured to simultaneously pick up each wafer-shaped article from each of the three or more processing stations using each of the second set of three or more end effectors.

[0164] The robotic arm can be configured to simultaneously load each wafer-shaped article into the storage unit.

[0165] The system may further include a shutter that is movable between a closed state that isolates the robotic arm from the three or more processing stations and an open state that enables access to the robotic arm from the three or more processing stations. In this way, the shutter can be closed during operation of the processing stations to avoid contamination during processing of the wafer-shaped articles. Advantageously, since a single robotic arm is used to transfer the wafer-shaped articles between the storage unit and the processing stations, only a single shutter can be used. This serves to simplify the system and reduce the number of moving parts.

[0166] Three or more processing stations may comprise a processing module or be disposed within a processing module, and the shutter is disposed to cover the access opening of the processing module when the shutter is closed. Accordingly, the shutter can be opened so that the robotic arm can access three or more processing stations. The storage unit may be disposed outside the process module, i.e., when the shutter is closed, the shutter is positioned between the storage unit and the processing station.

[0167] The system may comprise a first set of three or more processing stations and a second set of three or more processing stations, and the first and second sets of three or more processing stations are arranged adjacent to each other.

[0168] The robotic arm may be configured to selectively load each wafer-shaped article into three or more processing stations of the first set or three or more processing stations of the second set.

[0169] In other words, there are two sets of three or more processing stations adjacent to each other (e.g., side by side), and the robotic arm can load the wafer-shaped article into either set of processing stations. Accordingly, the user or the system can select one of the sets of three or more processing stations, and the robotic arm can load each wafer-shaped article into the processing stations of the selected set.

[0170] Alternatively, there may be two or more robotic arms, a first robotic arm configured to load a wafer-shaped article into a first set of processing stations, and a second robotic arm configured to load a wafer-shaped article into a second set of processing stations.

[0171] When there are a plurality of robot arms, each of the robot arms can be configured to pick up a wafer-shaped article from one or more respective storage units at each position.

[0172] For example, the system can include a plurality of support portions for supporting the storage units, such as four support portions. The first robot arm can be configured to pick up a wafer-shaped article at a first subset of the support portions (e.g., two of the support portions), and the second robot arm can be configured to pick up a wafer-shaped article at a different second subset of the support portions (e.g., two of the support portions).

[0173] In some embodiments, the first robot arm can be configured or operable to transfer or pass a wafer-shaped article to the second robot arm. Additionally or alternatively, the second robot arm can be configured or operable to transfer or pass a wafer-shaped article to the first robot arm. Such transfer can be direct or via an intermediate transfer mechanism.

[0174] That the first set and the second set of processing stations are adjacent to each other can mean that the first set of processing stations and the second set of processing stations are positioned side by side in substantially the same plane (e.g., the same horizontal plane).

[0175] The robot arm can be associated with each set of three or more processing stations, as described above with respect to loading three or more processing stations. In particular, the robot arm can be configured to simultaneously load each respective wafer-shaped article into the selected set of processing stations of the processing stations.

[0176] The first set and the second set of processing stations may have a matching layout of the processing stations. This can facilitate loading a wafer-shaped article onto the processing stations of both sets using the same robotic arm. As an example, the first set and the second set of processing stations may be mirror images of each other.

[0177] As described above, three or more processing stations of the first set may be configured to operate simultaneously. Similarly, as described above, three or more processing stations of the second set may be configured to operate simultaneously.

[0178] The system may include a first shutter through which the robotic arm can access the first set of processing stations and a second shutter through which the robotic arm can access the second set of processing stations.

[0179] The system may be configured to control the robotic arm to alternately load a wafer-shaped article onto the processing stations of the first set and load a wafer-shaped article onto the processing stations of the second set. In this way, when the processing stations of the first set are operating, the robotic arm can load onto the second set of processing stations (and vice versa). This can serve to improve the throughput of the system.

[0180] The system may include two or more levels arranged one above the other, each level including a respective set of three or more processing stations, and a robotic arm configured to selectively load respective wafer-shaped articles onto a set of three or more processing stations of one of the two or more levels. In other words, the multiple sets of processing stations are stacked vertically, and the robotic arm can load the wafer-shaped articles onto any of the sets of processing stations. Thus, a user or the system can select one of the sets of three or more processing stations, and the robotic arm can load the respective wafer-shaped articles onto the processing stations of the selected set.

[0181] The robotic arm may be pivotally mounted or attachable, for example, to a turret configured to move vertically to move the robotic arm between two or more levels.

[0182] The robotic arm can be associated with the set(s) of processing stations of each level, as described above with respect to loading three or more processing stations. In particular, the robotic arm can be configured to simultaneously load respective wafer-shaped articles onto the processing stations of the selected set of processing stations.

[0183] The sets of processing stations arranged at different levels may have a matching layout of the processing stations. This can facilitate loading wafer-shaped articles onto the processing stations of both sets using the same robotic arm. As an example, each level may include the same spatial arrangement of processing stations.

[0184] In some cases, each level may include, as described above, a first set of three or more processing stations adjacent to each other and a second set of three or more processing stations.

[0185] The system may further include an actuator for controlling the height of the robotic arm of the system. Thereby, since picking up and loading may involve raising and / or lowering of the end effector, it may be facilitated to pick up wafer-shaped articles and load them onto the processing station. If the system includes two or more levels of processing stations, this may also enable the robotic arm to reach different levels.

[0186] The actuator may comprise an appropriate type of actuator for controlling the height of the robotic arm. As an example, the actuator may comprise a belt drive actuator, an elevator system, and / or a pulley system. As described above, the actuator may comprise a turret configured to move in the vertical direction.

[0187] In this specification, a set of three or more processing stations and a set of three or more end effectors are described. Generally, the number of end effectors in a set corresponds to the number of processing stations in the set, and thus each end effector can be associated with a respective processing station.

[0188] For example, the system may include N processing stations, and the first set of end effectors may include N end effectors, where N is a number greater than or equal to 3. The system may include only N, or exactly N, processing stations, and the first set of end effectors may include only N, or exactly N, end effectors.

[0189] If present, the second set of end effectors may also include only N, or exactly N, end effectors.

[0190] N may be equal to 3.

[0191] According to a second aspect of the present invention, there is provided a method of processing a wafer-shaped article, the method comprising using a robotic arm having a first set of end effectors including three or more end effectors to pick up each respective wafer-shaped article from a storage unit with each of the three or more end effectors, and loading one of each respective wafer-shaped article into each of three or more processing stations using the robotic arm.

[0192] The method of the second aspect of the present invention can be used with the system of the first aspect of the present invention. Accordingly, any features described above in connection with the first aspect of the present invention may be shared with the second aspect of the present invention.

[0193] Each respective wafer-shaped article can be loaded into each of the three or more processing stations simultaneously.

[0194] Each respective wafer-shaped article is picked up simultaneously with each of the three or more end effectors.

[0195] The method may further comprise, following loading each respective wafer-shaped article into each of the three or more processing stations, operating the three or more processing stations to process each respective wafer-shaped article.

[0196] The method may comprise operating the three or more processing stations simultaneously to process each respective wafer-shaped article.

[0197] The robotic arm may further comprise a second set of end effectors including three or more end effectors, and the method may further comprise, following processing each respective wafer-shaped article, picking up one of each respective wafer-shaped article from one of the three or more processing stations using each end effector of the second set, and loading each respective wafer-shaped article into a storage unit (which may be the same storage unit from which the wafer was removed or a different storage unit).

[0198] As used herein, the term "fluid" may mean a liquid, and any reference herein to a fluid may be replaced by the term "liquid" unless inconsistent.

[0199] According to a third aspect of the present invention, a robotic arm is provided with a first set of end effectors including three or more end effectors. The robotic arm is configured to pick up each wafer-shaped article using each of the three or more end effectors from a storage unit configured to store a plurality of wafer-shaped articles, and load one of the respective wafer-shaped articles onto each of the three or more processing stations.

[0200] The robotic arm according to the third aspect of the present invention may have any of the features of the robotic arm according to the first or second aspect of the present invention.

[0201] For example, the first set of end effectors according to the third aspect of the present invention may have any of the features of the first set of end effectors according to the first or second aspect of the present invention.

[0202] The robotic arm may be configured to invert the first set of effectors. This can be achieved in the same manner as the first or second aspect of the present invention described above.

[0203] According to a fourth aspect of the present invention, a robotic arm is provided with a first set of end effectors including three or more end effectors, and each of the three or more end effectors is pivotally attached about a first common axis.

[0204] The robotic arm according to the fourth aspect of the present invention may have any of the features of the robotic arms according to the first to third aspects of the present invention.

[0205] For example, the first set of end effectors according to the fourth aspect of the present invention may have any of the features of the first set of end effectors according to the first to third aspects of the present invention.

[0206] Three or more end effectors may be rotatable in a first configuration in which the three or more end effectors are aligned along a first common axis and / or overlap along the first common axis.

[0207] Three or more end effectors may be rotatable in a second configuration in which the three or more end effectors spread out in a fan shape.

Brief Description of the Drawings

[0208] Hereinafter, embodiments of the present invention will be described by way of example only with reference to the accompanying drawings.

[0209]

Figure 1

Figure 2a

Figure 2b

Figure 3a

Figure 3b

Figure 4a

Figure 4b

Figure 5

Figure 6

Figure 7a

Figure 7b

Figure 8

Figure 9

Figure 10

Figure 11

[0210] FIG. 1 shows a schematic diagram of a system 100 according to an embodiment of the present invention. The schematic diagram of FIG. 1 represents a top view of the system 100. Therefore, the plane of the page of FIG. 1 may substantially correspond to a horizontal plane. The system 100 is configured to process wafer-shaped articles such as semiconductor wafers. For convenience, in the detailed description, reference is made to a "wafer", but it should be understood that the term "wafer" can refer to any wafer-shaped article.

[0211] System 100 includes a storage unit 102 configured to store a plurality of wafers 104. In one example, the storage unit 102 may store the plurality of wafers 104 in one or more stacks, which may facilitate removal of wafers from the storage unit 102 and storage of wafers in the storage unit 102. For example, the storage unit may include a plurality of shelves arranged vertically overlapping to accommodate each wafer 104 respectively.

[0212] The storage unit 102 may be a container or cassette such as a FOUP, for example.

[0213] The storage unit 102 may be transported to the system 100 from another device and / or from another location within a processing environment or a manufacturing environment.

[0214] System 100 may include a holding unit for accommodating and holding the storage unit 102. System 100 may include a plurality of such holding units. Thus, system 100 may be capable of accommodating a plurality of storage units 102 simultaneously.

[0215] System 100 further includes a process module 106 in which two sets of wafer processing stations are installed. More specifically, a first set of three processing stations 108a, 108b, 108c is located on the first side of the process module 106, and a second set of three processing stations 110a, 110b, 110c is located on the second side of the process module 106. Each wafer processing station in the first set and the second set is configured to process an individual wafer. Examples of processes that the wafer processing stations may be configured to perform include, for example, etching and / or cleaning processes, as well as bevel etching processes. All of the wafer processing stations 108a, 108b, 108c are configured to perform the same process, and similarly, all of the wafer processing stations 110a, 110b, 110c in the second set are configured to perform the same process. The processes performed by the first set and the second set may be the same process or different processes. The first set of wafer processing stations 108a, 108b, 108c may be referred to as the first triplet, and the second set of wafer processing stations 110a, 110b, 110c may be referred to as the second triplet.

[0216] Each wafer processing station in the first set and the second set includes a rotation chuck 109 (or spin chuck), which is configured to accommodate and rotate the wafer. The rotation chuck 109 may be any suitable type of rotation chuck, and its size may be adapted to the wafer being processed. Each rotation chuck 109 may include a mechanism for holding the wafer in a predetermined position on the rotation chuck 109, such as a set of holding pins and / or a set of suction ports for applying a suction force to hold the wafer.

[0217] In addition, each wafer processing station is provided with a fluid dispenser 112, which is configured to dispense fluid onto a wafer accommodated on the rotary chuck 109. The fluid dispenser 112 is on a rotatable arm and is thus disposed above the rotary chuck 109 and can be rotated between a dispensing position for dispensing fluid onto the wafer accommodated on the rotary chuck 109 and an idle position rotated away from the rotary chuck 109 (in FIG. 1, all fluid dispensers 112 are shown in the idle position). The fluid dispenser 112 of each wafer processing station can be connected to a fluid source (not shown), which can include a cleaning fluid, a rinse fluid, an etching fluid, or other types of processing fluids or chemicals. In some cases, a plurality of fluid dispensers may be provided at each wafer processing station, and each fluid dispenser is arranged to dispense different fluids onto the wafer accommodated on the rotary chuck 109 (for example, each fluid dispenser can be connected to a different fluid source).

[0218] The fluid dispenser 112 can be a liquid dispenser for dispensing liquid onto a wafer accommodated on the rotary chuck.

[0219] Each wafer processing station can include two or more fluid dispensers 112. For example, each of the processing stations can include a first fluid dispenser for dispensing a first fluid, such as an acid or an etching fluid or a cleaning fluid. Further, each of the processing stations can include a second fluid dispenser for dispensing a rinse fluid, such as deionized water. The second fluid dispenser can be for dispensing a gas, such as nitrogen, to dry the wafer.

[0220] System 100 further includes a robotic arm 114. The robotic arm 114 is configured to transfer the wafer 104 between a single storage unit 102 and a wafer processing station within the process module 106. The robotic arm 114 includes a first set of three end effectors 116a, 116b, 116c, each of which is configured to hold a respective wafer. In the example shown, the end effectors 116a, 116b, 116c each have a pair of jaws (or forks or a pair or prongs) arranged to hold an individual wafer. The jaws may be fixed relative to each other or movable as required. The jaws of each end effector may include a holding mechanism (e.g., a gripper or clamp) for holding the wafer on the jaws while transporting the wafer between the storage unit 102 and the wafer processing station. Additionally or alternatively, the jaws of each end effector may include one or more suction ports for applying a suction force to the wafer disposed on the jaws to hold the wafer on the jaws while transporting the wafer between the storage unit 102 and the wafer processing station. Alternatively or additionally, the jaws of each end effector may be configured to support the wafer by contacting the wafer from below.

[0221] The robot arm 114 is configured to pick up each of the wafers from a single storage unit 102 using the end effectors 116a, 116b, 116c. Thereafter, the robot arm may load the picked-up wafer into a first set or a second set of wafer processing stations. In FIG. 1, the robot arm 114 is shown in a position above the first set of wafer processing stations 108a, 108b, 108c such that the end effectors 116a, 116b, 116c are positioned to load wafers into the first set of wafer processing stations 108a, 108b, 108c. Each end effector 116a, 116b, 116c may be associated with a respective one of the first set and the second set of wafer processing stations. In the example shown, the end effectors 116a, 116b, 116c are respectively associated with the first set of wafer processing stations 108a, 108b, 108c. Similarly, the end effectors 116a, 116b, 116c are respectively associated with the second set of wafer processing stations 110a, 110b, 110c. Accordingly, the associated end effector may be used by the robot arm 114 to load wafers into a predetermined one of the first set or the second set of wafer processing stations.

[0222] Of course, in other embodiments, instead of providing a single robot arm for both sets, separate robot arms 114 may be provided for each of the first set and the second set of wafer processing stations.

[0223] The robotic arm 114 may include a plurality of joint members (or arms) so as to be movable between the storage unit 102 and the wafer processing station. The specific structure of the robotic arm 114 may be adapted to the spatial arrangement of the storage unit 102, the process module 106, and the wafer processing station. In the example shown, the robotic arm 114 includes a turret 118 (or base portion), to which an upper arm 120 (or intermediate arm) is pivotally connected. A first forearm 122 is pivotally connected to the upper arm 120. The end effectors 116a, 116b, 116c are all pivotally connected to the working end (or distal end) of the first forearm 122, and the end effectors 116a, 116b, 116c are pivotable with respect to the first forearm about a first common axis. For example, each of the end effectors 116a, 116b, 116c may be pivotally connected to a pivot axis 124 located at the working end (or distal end) of the first forearm 122. The first common axis may be substantially vertical, i.e., the pivot axis 124 may extend in a substantially vertical direction. The robotic arm 114 may include any suitable arrangement of motors and / or actuators for controlling the operation of its different parts.

[0224] The end effectors 116a, 116b, 116c are arranged vertically, i.e., vertically overlapping along the pivot axis 124. A vertical space is provided between the end effectors 116a, 116b, 116c so that the end effectors 116a, 116b, 116c can each pick up their respective wafers.

[0225] The robotic arm 114 is shown alone in FIGS. 2a and 2b. The end effectors 116a, 116b, 116c are pivotable relative to the first forearm 122 between a transfer configuration and a loading configuration. The dashed lines in FIGS. 2a and 2b illustrate the positions where the end effectors 116a, 116b, 116c hold the wafer 104. The loading configurations of the end effectors 116a, 116b, 116c are shown in FIGS. 1 and 2a. As can be seen, in the loading configuration, the end effectors 116a, 116b, 116c have different pivot angles relative to a first common axis, such that they fan out about the pivot axis 124. The robotic arm 114 can position the end effectors 116a, 116b, 116c in the loading configuration such that each end effector is positioned above its associated wafer processing station of a set of wafer processing stations. For example, in the arrangement shown in FIG. 1, each end effector is positioned above its associated wafer processing station of the first set.

[0226] As shown in FIG. 1, the first set of wafer processing stations 108a, 108b, 108c are arranged in a triangular configuration, i.e., each wafer processing station of the first set is located at a vertex of the triangle. This enables each end effector to be positioned above its associated wafer processing station of the first set by rotating the end effectors 108a, 108b, 108c about the pivot axis 124. For example, the wafer processing stations 108a, 108b, 108c are arranged on an arc, facilitating access to them by the rotational movement of the end effectors 116a, 116b, 116c. The second set of wafer processing stations 110a, 110b, 110c may have an arrangement that coincides with the arrangement of the first set, and similarly enables each end effector to be positioned above its associated wafer processing station of the second set. The arrangement of the second set of wafer processing stations 110a, 110b, 110c may correspond to a mirror image of the arrangement of the wafer processing stations 108a, 108b, 108c, as shown in FIG. 1.

[0227] The conveying arrangements of end effectors 116a, 116b, and 116c are illustrated in FIG. 2b. In the conveying arrangement, all of the end effectors 116a, 116b, and 116c are aligned with each other along a first common axis, that is, all of the end effectors 116a, 116b, and 116c have the same turning angle with respect to the turning axis 124. Therefore, in the top view of FIG. 2b, only the topmost end effector 116a is visible. FIGS. 3a and 3b are schematic cross-sectional views of a part of the robot arm 114 with the end effectors 116a, 116b, and 116c in the conveying arrangement. As shown in FIGS. 3a and 3b, each of the end effectors 116a, 116b, and 116c is connected to the turning axis 124, and the end effectors 116a, 116b, and 116c are arranged to overlap vertically along the turning axis 124. In FIG. 3a, the end effectors 116a, 116b, and 116c are not carrying any wafers, but in FIG. 3b, each of the end effectors 116a, 116b, and 116c is shown to carry its respective wafer 104. As can be seen, the end effectors 116a, 116b, and 116c are arranged at intervals along the vertical axis, enabling each end effector to carry its respective wafer when the end effectors 116a, 116b, and 116c are in the conveying arrangement.

[0228] The robotic arm 114 can be configured to position the end effectors 116a, 116b, 116c in a transport arrangement when transferring the wafer between the storage unit 102 and the wafer processing station. Advantageously, the transport arrangement of the end effectors 116a, 116b, 116c is more compact (e.g., compared to the loading arrangement), thus facilitating the movement of the robotic arm 114 between the storage unit 102 and the wafer processing station. Further, the robotic arm 114 can be configured to pick up the wafer 104 from the storage unit 102 using the end effectors 116a, 116b, 116c in the transport arrangement. In particular, as described above, when the storage unit 102 stores a plurality of wafers 104 stacked vertically, the robotic arm 114 can lift a stack of three wafers from the storage unit 102 using the end effectors 116a, 116b, 116c of the transport device. In this way, the robotic arm 114 can pick up three wafers 104 simultaneously from a single storage unit 102. For example, the vertical spacing of the wafer transport shelves within the storage unit 102 may be arranged to match the vertical spacing between the end effectors 116a, 116b, 116c along the pivot axis 124, whereby the end effectors 116a, 116b, 116c can be inserted into the storage unit 102 in the transport arrangement to lift the three wafers 104.

[0229] The turret 118 of the robot arm 114 may include an actuator for controlling the height of the robot arm 114 of the system 100 (and thus the end effectors 116a, 116b, 116c), or may be mounted on the actuator. For example, this may enable the end effectors 116a, 116b, 116c to be raised and lowered to pick up the wafer 104 from the storage unit 102 and load the wafer 104 onto the wafer processing station, for example. In particular, picking up the wafer 104 from the storage unit 102 may include raising the end effectors 116a, 116b, 116c to lift the wafer 104 from the storage unit 102. Loading the wafer 104 onto the wafer processing station may include lowering the end effectors 116a, 116b, 116c to place the wafer on the wafer processing station.

[0230] The process module 106 may include a first shutter 126 and a second shutter 128. The first shutter 126 and the second shutter 128 may be closed to isolate the robot arm 114 from inside the process module 106. The first shutter 126 may be opened so that the robot arm 114 can access the first set of wafer processing stations 108a, 108b, 108c. Similarly, the second shutter 128 may be opened so that the robot arm can access the second set of wafer processing stations 110a, 110b, 110c. The dashed lines indicated by reference numerals 126 and 128 in FIG. 1 show their positions when the first shutter 126 and the second shutter 128 are closed.

[0231] The process module 106 may further include a partition wall 130 located between adjacent wafer processing stations within the process module 106. The partition wall 130 serves to prevent cross-contamination between different wafer processing stations. For example, the partition wall 130 can function as a splash barrier and prevent fluid from splashing or being transmitted in other ways between adjacent wafer processing stations. FIG. 1 also shows a set of exhaust ports 138 located between a first set and a second set of wafer processing stations within the process module 106. The exhaust ports 138 can serve to extract fumes from the interior of the process module 106.

[0232] Furthermore, a wall may also be provided in the process module 106 between a first set of wafer processing stations 108a, 108b, 108c and a second set of wafer processing stations 110a, 110b, 110c. For example, the wall may be along the center of the process module 106. The wall can isolate the first set of wafer processing stations 108a, 108b, 108c from the second set of wafer processing stations 110a, 110b, 110c. This can enable, for example, the maintenance of one set of wafer processing stations while making other sets of wafer processing stations also available.

[0233] The process module 106 may further include one or more service doors for accessing the interior of the process module 106, for example, to perform maintenance on the wafer processing stations. In the example shown, the process module 106 includes a first service door 132a arranged to provide access to the wafer processing station 108a, a second service door 132b arranged to provide access to the wafer processing station 110a, a third service door 134 arranged to provide access to the wafer processing stations 108b and 108c, and a fourth service door 136 arranged to provide access to the wafer processing stations 110b and 110c.

[0234] System 100 may include a controller (not shown) configured to control the operation of various parts of system 100. In particular, the controller may control the operation of a robotic arm 114 for controlling the transfer of a wafer 104 between a storage unit 102 and a wafer processing station. The controller may also control the operation of the wafer processing station to control the processes performed by the wafer processing station. The controller may comprise any suitable computer system or set of computer systems capable of controlling the operation of system 100. Additionally or alternatively, system 100 may be controllable by a user. For example, system 100 may include a user interface for controlling the operation of robotic arm 114 and / or the operation of the wafer processing station.

[0235] In use, robotic arm 114 may first pick up three wafers 104 one by one from a single storage unit 102 using each end effector 116a, 116b, 116c. As described above, this may be accomplished by placing the end effectors 116a, 116b, 116c in a transport configuration and lifting three wafers 104 from a stack of wafers stored in storage unit 102. Depending on which set of the wafer processing stations the wafers are to be loaded into, robotic arm 114 may then move the end effectors 116a, 116b, 116c towards the first set or the second set of the wafer processing stations. For purposes of illustration, the loading of wafers into the first set of the wafer processing stations will be described, but the steps described are equally applicable to the second set of the wafer processing stations.

[0236] After picking up the wafers with end effectors 116a, 116b, 116c, the robot arm 114 can then move the end effectors 116a, 116b, 116c in the transfer arrangement towards the first set of wafer processing stations 108a, 108b, 108c. This can be achieved by opening the first shutter 126 and advancing the first forearm 122 (and thus the end effectors 116a, 116b, 116c) into the process module towards the first set of wafer processing stations 108a, 108b, 108c. Next, the end effectors 116a, 116b, 116c are rotated and placed in the loading arrangement so that each end effector can be positioned above its associated wafer processing station in the first set as shown in FIG. 1. In this position, the robot arm 114 can lower the end effectors 116a, 116b, 116c to place the wafers on the rotating chucks 109 of the wafer processing stations 108a, 108b, 108c. Thereafter, the robot arm 114 can withdraw the end effectors 116a, 116b, 116c from the wafer processing stations, leaving the wafers 104 in predetermined positions on the wafer processing stations. For example, the holding elements on the rotating chuck 109, such as holding pins, can function to hold the wafers 104 on the rotating chuck 109 when the end effectors 116a, 116b, 116c are withdrawn. Thus, the robot arm 114 can simultaneously load each respective wafer 104 onto each of the first set of wafer processing stations 108a, 108b, 108c. Similarly, the robot arm 114 can simultaneously load each respective wafer 104 onto each of the second set of wafer processing stations 110a, 110b, 110c.

[0237] After loading the wafer 104 into the first set of wafer processing stations 108a, 108b, 108c, the end effectors 116a, 116b, 116c can be returned to the transfer configuration, and the robot arm 114 can be withdrawn from the process module 106. Thereafter, the first shutter 126 can be closed, and the wafer processing stations 108a, 108b, 108c can be simultaneously activated to process the wafer 104 simultaneously. For example, the fluid dispenser 112 can distribute fluid onto the surface of the wafer and rotate the wafer using the rotating chuck 109.

[0238] While the first set of wafer processing stations 108a, 108b, 108c are operating to process the wafer 104, the robot arm can simultaneously load the wafer 104 from the storage unit 102 into the second set of wafer processing stations 110a, 110b, 110c. To load the wafer 104 into the second set of wafer processing stations 110a, 110b, 110c, a series of steps similar to those described above can be performed.

[0239] After the wafers 104 are processed by the first set of wafer processing stations 108a, 108b, 108c, the robot arm 114 can remove the wafers 104 and return them to the storage unit 102 (either the same storage unit from which the wafers 104 were removed or a different storage unit). Specifically, the first shutter 126 can be opened so that the robot arm 114 can advance the end effectors 116a, 116b, 116c in the transfer configuration into the process module 106 towards the first set of wafer processing stations. Thereafter, the end effectors 116a, 116b, 116c can be pivoted to the loading configuration (such as shown in FIG. 1), whereby each end effector can pick up the wafer 104 from its associated wafer processing station in the first set. Next, the robot arm 114 can place the end effectors 116a, 116b, 116c in the transfer configuration and transport the wafers to the storage unit 102. With the end effectors 116a, 116b, 116c maintained in the transfer configuration, the robot arm 114 can load the wafers into the storage unit, for example, by lowering the wafers 104 onto a shelf in the storage unit 102. The storage unit 102 can include a first portion for storing the pre-processed wafers 104 and a second portion for storing the processed wafers 104. In such a case, the wafers 104 picked up from the first set of wafer processing stations can be loaded into the second portion of the storage unit 102. Similarly, after the wafers 104 are processed by the second set of wafer processing stations, the robot arm 114 can pick up the wafers 104 from the second set of wafer processing stations and load them into the storage unit 102.

[0240] In the above example, the same set of end effectors 116a, 116b, 116c is used to transfer the wafer 104 from the storage unit 102 to the wafer processing station and from the wafer processing station to the storage unit 102. However, in other examples, the robot arm 114 may include a second set of end effectors so that different sets of end effectors can be used for different wafer transfer directions. In connection with FIG. 6, an example of a robot arm with two sets of end effectors will be described below.

[0241] FIGS. 4a and 4b show in more detail an example of the operations performed while loading the wafer 104 onto one of the rotating chucks 109 of the wafer processing station of the system 100. FIGS. 4a and 4b are top views showing only a part of the system 100. In particular, only the end effector 116a and the rotating chuck 109 of the associated first set of wafer processing stations 108a are shown.

[0242] As shown in FIGS. 4a and 4b, the rotating chuck 109 of the wafer processing station 108a includes a set of holding pins 402 disposed around its edge. The holding pins 402 extend perpendicularly from the surface of the rotating chuck 109 and are arranged to hold the wafer 104 on the rotating chuck 109 when the wafer 104 is placed on the rotating chuck 109. The rotating chuck 109 of each wafer processing station of the system 100 may include an equivalent set of holding pins.

[0243] The holding pins may be movable, for example rotatable, so as to contact the radially outer edge of the wafer 104 on the rotating chuck 109, thereby preventing or suppressing lateral movement of the wafer 104 relative to the surface of the rotating chuck 109.

[0244] The dashed lines in FIGS. 4a and 4b indicate the position of the wafer 104 held by the end effector 116a. To place the end effector 116a above the rotating chuck 109 of the wafer processing station 108a, the robot arm 114 advances the first forearm 122 along the direction indicated by arrow 404 in FIG. 4a towards the first set of wafer processing stations. At the same time, to align the end effector 116a above the rotating chuck 109, the end effector 116a is pivoted about axis 124 as shown by arrow 406 in FIG. 4a. The pivoting of the end effector 116a can be part of moving the end effectors 116a, 116b, 116c from a transport configuration to a loading configuration. As a result, the end effector 116a (and the wafer 104 it carries) is placed above the rotating chuck 109. Thereafter, to load the wafer 104 onto the rotating chuck 109, the robot arm 114 may lower the end effector 116a towards the rotating chuck 109.

[0245] When lowering the end effector 116a towards the rotary chuck 109, the rotary chuck 109 can be rotated as indicated by arrow 408 in FIG. 4a to avoid the holding pins 402 interfering with the operation of the end effector 116a. In this way, the holding pins 402 can be moved so as not to obstruct the end effector 116a. In particular, by rotating the rotary chuck 109, when the end effector 116a is disposed above the rotary chuck 109, it is possible to ensure that none of the holding pins 402 are positioned directly below the end effector 116a. The direction of rotation of the rotary chuck 109 during loading of the wafer 104 can coincide with (i.e., can be in the same direction as) the direction in which the end effector 116a pivots. In the example shown in FIG. 4a, the rotary chuck 109 rotates in a counterclockwise direction and the end effector 116a pivots. Alternatively, the direction of rotation of the rotary chuck 109 during loading of the wafer 104 may be opposite to the direction in which the end effector 116a pivots. The rotary chuck 109 can be configured to rotate in synchronization with the pivoting of the end effector 116a. Alternatively, the rotary chuck 109 can be rotated before or after the pivoting of the end effector 116a.

[0246] As shown in FIG. 4b, when the end effector 116a is disposed above the rotary chuck 109, the robot arm 114 can lower the end effector 116 towards the rotary chuck 109. When lowering the end effector 116a towards the rotary chuck 109, the holding pins 402 can engage the outer edge of the wafer 104. Thereafter, while holding the wafer 104 on the rotary chuck 109 by the holding pins 402, the end effector 116a can be withdrawn from beneath the wafer 104. Optionally, the wafer 104 can be held spaced from the surface of the rotary chuck 109, for example by a gas cushion or by holding pins that contact the lower surface of the wafer to support the wafer 104 or by additional pins located on the surface of the rotary chuck 109.

[0247] Of course, the end effector may be lowered simultaneously with the pivoting of the end effector, rather than as a separate step.

[0248] Pulling the end effector 116a out from under the wafer 104 may include rotating the end effector 116a, for example, in a direction opposite to the turning direction indicated by the arrow 406 in FIG. 4b, as indicated by the arrow 410 in FIG. 4b. At the same time, the robot arm 114 may retract the first forearm 122, for example, along the direction indicated by the arrow 412 in FIG. 4b, away from the first set of wafer processing stations. While pulling the end effector 116a out of the rotary chuck 109, in order to avoid the holding pin 402 interfering with the end effector 116a, the rotary chuck 109 can rotate in synchronization with the turning of the rotary chuck 109 to avoid a collision between the holding pin 402 and the end effector 116a. In particular, the rotary chuck 109 can be rotated as indicated by the arrow 414 in FIG. 4b while pulling out the end effector 116a. The rotation direction of the rotary chuck is the same as the turning direction of the end effector 116a. In the example shown in FIG. 4b, the rotary chuck 109 rotates in the clockwise direction and the end effector 116a turns. Alternatively, the rotation direction of the rotary chuck while pulling out the end effector 116a may be opposite to the turning direction of the end effector 116a while pulling out the end effector 116a.

[0249] Each of the holding pins 402 may be rotatable between a first position configured to apply a clamping force to the radially outer edge of the wafer 104 and a second position that does not apply a clamping force to the wafer 104. This can be achieved, for example, by providing the holding pin 402 with a non-circular cross-section. When the wafer 104 is lowered onto the rotary chuck 109, the holding pin 402 is in the second position, which may enable the wafer 104 to be lowered onto the rotary chuck 109. Next, the holding pin 402 can be rotated to the first position to apply a clamping force to the wafer 104 and securely hold the wafer 104 on the rotary chuck 109. Thereby, for example, it may be possible to hold the wafer 104 above the upper surface of the rotary chuck 109 by the holding pin 402 such that there is a gap between the wafer 104 and the upper surface of the rotary chuck 109.

[0250] Using a procedure similar to that described above in connection with FIGS. 4a and 4b, the wafer 104 can then be picked up from the rotary chuck 109. In particular, the robot arm 114 can insert the end effector 116 under the wafer 104 to lift the wafer 104 away from the rotary chuck. This can include a series of pivoting and rotating operations similar to those described above.

[0251] To load wafers into all of the first set or the second set of wafer processing stations, operations similar to those described above for the end effector 116a and the rotary chuck of the wafer processing station 108a can be performed by other end effectors and the rotary chucks of their associated wafer processing stations.

[0252] As described above, in an alternative arrangement, the robot arm may be configured to invert the end effector, for example, by rotating the first forearm about the longitudinal axis of the first forearm, such that when the end effector is used to lower the wafer onto the wafer processing station, the end effector supports the wafer from above.

[0253] FIG. 5 shows a side view of a schematic cross section of a particular embodiment of the system 100. In this embodiment, the system 100 includes three levels 502, 504, 506, and two sets of three wafer processing stations are arranged on each level. The sets of wafer processing stations on each level are arranged as shown in FIG. 1. In FIG. 5, only two wafer processing stations are visible on each level, but as shown in FIG. 1, each level includes six wafer processing stations. Thus, the system 100 of FIG. 5 includes a total of 18 wafer processing stations.

[0254] As shown in FIG. 5, system 100 includes an actuator 508 for controlling the height of the robot arm 114 of system 100. Specifically, the turret 118 of the robot arm 118 is connected to the actuator 508. As an example, the actuator 508 may comprise a belt drive configured to adjust the height of the robot arm 114. Other types of actuators 508, such as a pulley system or an elevator system, may also be used. The actuator 508 may be used to raise and lower the robot arm 114 to enable the transfer of the wafer 104 between the storage unit 102 and the wafer processing stations at each level 502, 504, 506. The actuator 508 may also be used to control the height of the end effectors 116a, 116b, 116c during the pick-up and load procedures described above.

[0255] As described above, each of the end effectors 116a, 116b, 116c is arranged vertically one above the other. Thus, the vertical position and / or height of each wafer supported by each of the end effectors 116a, 116b, 116c is different.

[0256] To facilitate the simultaneous loading of wafers onto the rotary chuck 109, the height of each of the rotary chucks 109 may be adjustable, and the height of the rotary chucks 109 may be adjusted to different heights corresponding to the different heights of the respective wafers supported by the respective end effectors 116a, 116b, 116c. For example, each of the rotary chucks 109 may be attached to or assembled with respective actuators configured to raise and / or lower the rotary chuck 109.

[0257] Alternatively, each of the rotary chucks 109 may be arranged or attached at different fixed heights corresponding to the different heights of the respective wafers supported by the respective end effectors 116a, 116b, 116c.

[0258] FIG. 6 shows a schematic perspective view of a robotic arm 600 that may form part of a system according to an embodiment of the present invention. For example, the robotic arm 600 may correspond to the robotic arm 114 of the system 100 described above.

[0259] The robotic arm 600 has a structure similar to that of the robotic arm 114 described above. In particular, the robotic arm 600 includes a turret 602 connected to an actuator 604 for controlling the height of the robotic arm 600. The upper arm 606 is pivotally connected to the turret 602. The robotic arm 600 further includes a lower forearm 608 and an upper forearm 610, both of which are pivotally connected to the upper arm 606. Specifically, both the lower forearm 608 and the upper forearm 610 are connected to the upper arm 606 via a first pivot axis (not shown). The lower forearm 608 and the upper forearm 610 can pivot independently about the first pivot axis.

[0260] The first set 612 of three end effectors is pivotally connected to the working end of the lower forearm 608, and the second set 614 of three end effectors is pivotally connected to the working end of the upper forearm 610. The first set 612 of end effectors is attached to the pivot axis of the working end of the lower forearm 608 in a manner similar to how the end effectors 116a, 116b, 116c described above are attached to the working end of the first forearm 122. Similarly, the second set 614 of end effectors is attached to the pivot axis of the working end of the upper forearm 610 in a manner similar to how the end effectors 116a, 116b, 116c described above are attached to the working end of the first forearm 122. Thus, the first set of end effectors 612 is pivotable relative to the lower forearm 608 between a transport configuration and a loading configuration, and the second set of end effectors 614 is similarly pivotable relative to the upper forearm 610 between a transport configuration and a loading configuration. In FIG. 6, the first set 612 of end effectors is shown in a loading configuration and the second set 614 of end effectors is shown in a transport configuration, i.e., all of the first set of end effectors 612 are at different pivot angles relative to the lower forearm 608 and all of the second set of end effectors 614 are at the same pivot angle relative to the upper forearm 610. Thus, in FIG. 6, the three end effectors of the second set 614 are indistinguishable from one another.

[0261] The first set 612 of end effectors and the second set 614 of end effectors can each operate in a manner similar to the set of end effectors 116a, 116b, 116c described above.

[0262] For example, when incorporated into system 100, robot arm 600 may be configured to transfer a pre-processed wafer from storage unit 102 to a wafer processing station using a first set 612 of end effectors, while using a second set 614 of end effectors to transfer a processed wafer back from the wafer processing station to storage unit 102. In this way, different sets of end effectors are used to handle pre-processed wafers and processed wafers, thereby avoiding contamination of the processed wafers via the end effectors. The operation of robot arm 600 for picking up and loading wafers using the first set 612 of end effectors and the second set 614 of end effectors may be similar to the operations described above in connection with robot arm 114.

[0263] In an alternative embodiment (not shown), both the first set 612 of end effectors and the second set 614 of end effectors may be pivotally attached to the same forearm of robot arm 600. For example, instead of including a lower forearm 608 and an upper forearm 610, robot arm 600 may include a single forearm pivotally connected to upper arm 606. The single forearm may include a pivot axis at its working end, to which both the first set 612 and the second set 614 of end effectors are pivotally connected. The first set 612 and the second set 614 of end effectors may be connected to opposite ends of the pivot axis, i.e., such that the working end of the single forearm is positioned between the first set 612 and the second set 614 of end effectors.

[0264] Of course, in alternative embodiments, the upper arm and the single forearm may be replaced with a single arm.

[0265] Figures 7a and 7b show an alternative configuration of robot arm 600 of FIG. 6, with both the first set 612 and the second set 614 of end effectors in a transport configuration and the lower forearm 608 and the upper forearm 610 overlapping.

[0266] FIG. 8 is a schematic view showing a perspective view of a robot arm 620 that may be part of a system according to an embodiment of the present invention. Features corresponding to those shown in FIGS. 6, 7a, and 7b are shown using the same reference numerals, and their detailed description will not be repeated.

[0267] The main difference between the robot arm 620 of FIG. 8 and the robot arm 600 of FIG. 6 is that in the robot arm 620 of FIG. 8, each of the lower forearm 608 and the upper forearm 610 is rotatable about its longitudinal axis so as to invert the first set 612 or the second set 614 of end effectors.

[0268] In particular, each of the lower forearm 608 and the upper forearm 610 is provided with or has a respective rotatable or pivoting joint 622 that can rotate the forearm about its longitudinal axis.

[0269] As described above, each of the end effectors may include a holding mechanism for holding the wafer on the end effector when the respective forearm is inverted, for example, a plurality of gripping elements or gripping pins for gripping the wafer.

[0270] FIG. 9 is a schematic view showing a fluid supply system 700 that may be used as part of a wafer processing system according to an embodiment of the present invention. For example, the fluid supply system 700 may be used as part of the above-described system 100. The fluid supply system 700 is configured to supply fluid to a set of three wafer processing stations.

[0271] The fluid supply system 700 includes a fluid source 702, the outlet of which is connected to a supply valve 704. The supply valve 704 may alternatively be or be called a flow controller or a flow rate controller that controls the flow or flow rate of the fluid (liquid).

[0272] The fluid supply source 702 may include a fluid reservoir or tank that stores the fluid used by the wafer processing station while processing the wafer. For example, the fluid supply source 702 may include a cleaning fluid (e.g., IPA, acetone), a rinse fluid (e.g., deionized water), or any etching fluid that can be used to process the wafer. The fluid is typically a liquid.

[0273] The fluid supply source 702 may include a pump that delivers fluid from the fluid supply source 702 to a set of three wafer processing stations.

[0274] The supply valve 704 is connected in parallel to three fluid dispensers 706a, 706b, 706c. For example, the fluid dispensers 706a, 706b, 706c may correspond to the fluid dispensers 112 located at each of the first set or the second set of wafer processing stations of the system 100. Thus, each of the fluid dispensers 706a, 706b, 706c may include a nozzle (or fluid outlet) disposed on an arm such that the nozzle can be disposed above the rotating chuck of the wafer processing station.

[0275] The supply valve 704 may include any suitable type of valve, such as a needle valve or a ball valve, and is configured to control the supply of fluid from the fluid source 702 to the three fluid dispensers 706a, 706b, 706c. Thus, when the supply valve 704 is closed, no fluid is supplied to the fluid dispensers 706a, 706b, 706c, and when the supply valve 704 is open, fluid is supplied from the fluid source 702 to each of the fluid dispensers 706a, 706b, 706c. Thus, a single supply valve (i.e., the supply valve 704) can be controlled to control the simultaneous supply of fluid from the fluid source 702 to the fluid dispensers located at three wafer processing stations. This facilitates the simultaneous (i.e., in parallel) processing of three wafers and reduces the amount of tubing (or piping) and the number of valves required to control the fluid supply to the wafer processing stations.

[0276] The supply valve 704 may be configured to control the flow rate of fluid from the fluid source 702.

[0277] In an alternative embodiment shown in FIG. 10, each of the fluid dispensers or processing stations may further include a separate supply valve. In particular, as shown in FIG. 10, each of the processing stations includes respective supply valves 705a, 705b, 705c. Each of the respective supply valves 705a, 705b, 705c may be an on / off valve, such as a shut-on / off valve, used to switch the flow of fluid to the respective processing stations and fluid dispensers 706a, 706b, 706c on or off.

[0278] Accordingly, each of the supply valves 705a, 705b, 705c controls whether to supply fluid to the processing stations, and the shared supply valve 704 may control the flow rate of the fluid.

[0279] Each supply valve may be provided within the processing station or within each respective flow path from the shared supply valve to the processing station.

[0280] As an example, the fluid supply system 700 may be used to supply fluid to the first set of wafer processing stations 108a, 108b, 108c of the system 100. Next, when the wafer 104 is loaded onto the rotating chuck 109 of the wafer processing stations 108a, 108b, 108c, the valve 704 can be operated to control the distribution of fluid onto the wafer during wafer processing.

[0281] The fluid supply system shown in FIG. 9 may be used, for example, to dispense a liquid such as a rinse or cleaning liquid onto the back surface of a wafer being processed.

[0282] The fluid supply system 700 can be adapted to supply fluid to multiple sets of wafer processing stations. This can be achieved by using respective supply valves to control the supply of fluid to each set of wafer processing stations. In other words, multiple fluid supply valves can be connected in parallel to the fluid source 702. Subsequently, each supply valve can be connected in parallel to the fluid dispenser of each set of wafer processing stations. Alternatively, instead of sharing a single fluid source 702 among multiple sets of wafer processing stations, respective fluid sources can be used for each set of wafer processing stations.

[0283] In some cases, the wafer processing system of the present invention can include multiple fluid supply systems, for example, where multiple (e.g., two or more) fluids are used by the wafer processing stations. Each fluid supply system can be configured as the system 700 where the fluid source 702 of each fluid supply system contains a different fluid. Next, each processing station can have one corresponding fluid dispenser for each of the multiple fluid supply systems. Then, the supply valves of each fluid supply system can be actuated to control the supply of different fluids to the set of wafer processing stations.

[0284] An architecture similar to the fluid supply system 700 can be used in a suction (or vacuum) system that is part of the wafer processing system according to the present invention.

[0285] In an alternative arrangement, the shared supply valve 704 is omitted, and instead, each of the fluid dispensers 706a, 706b, 706c can be provided with both a respective supply valve 705a, 705b, 705c and a respective liquid flow controller or liquid flow rate controller 704a, 704b, 704c. Each of the respective supply valves 705a, 705b, 705c can be an on / off valve that allows or blocks the flow of fluid to the fluid dispensers 706a, 706b, 706c. Each of the respective liquid flow controllers or liquid flow rate controllers 704a, 704b, 704c can control the flow rate of the fluid supplied to the fluid dispensers 706a, 706b, 706c when the respective supply valves 705a, 705b, 705c are open so that the liquid can flow.

[0286] This arrangement can be used, for example, for a fluid dispenser that distributes fluid onto the upper surface of a wafer being processed. The fluid can be, for example, a processing liquid, or a rinse liquid, or a cleaning liquid.

[0287] A similar arrangement can also be used for a suction (or vacuum) system that is part of a wafer processing system according to the present invention.

[0288] As described above with respect to system 100, each of the rotating chucks 109 of the wafer processing station can include a suction port that applies a suction force to suck the collected liquid. Instead of the fluid source 702, the suction system can include a suction source (e.g., a fan or a vacuum pump), while instead of the fluid dispensers 706a, 706b, 706c, the suction system can include the suction ports of the wafer processing station. Next, the valve 704 can be used to control the application of the suction force from the suction source 702 to the suction ports 706a, 706b, 706c. The suction ports can be located, for example, within a drain line and / or within a collection container.

[0289] In the above description, embodiments including a set of three wafer processing stations and a set of three end effectors have been described. In other embodiments, it will be understood that sets with different numbers (e.g., four or more) of wafer processing stations and end effectors may be included. Generally, the number of end effectors in a set of end effectors may correspond to the number of wafer processing stations in a set of wafer processing stations. In this way, each end effector in a set of end effectors may be associated with a respective wafer processing station in a set of wafer processing stations.

[0290] The features disclosed in the above description, or in the following claims, or in the accompanying drawings, may be expressed, as appropriate, in their specific forms, or in terms of means for performing the disclosed functions, or in terms of methods or processes for obtaining the disclosed results, and such features may be used, separately or in any combination, in their various forms, to implement the present invention.

[0291] Although the present invention has been described in conjunction with the above exemplary embodiments, many equivalent modifications and variations will be apparent to those skilled in the art upon reference to the present disclosure. Accordingly, the above-described exemplary embodiments of the present invention are considered to be illustrative and not limiting. Various changes may be made to the described embodiments without departing from the spirit and scope of the present invention.

[0292] To avoid any ambiguity, any theoretical explanations provided in this specification are provided for the purpose of enhancing the reader's understanding. The inventors do not wish to be bound by any of these theoretical explanations.

[0293] The section headings used in this specification are for organizational purposes only and should not be construed as limiting the subject matter being described.

[0294] Throughout this specification, including the claims which follow, unless the context requires otherwise, the words "comprise", "include" and variations such as "comprises", "comprising", "including" are to be understood to mean including the stated integer or step or group of integers or steps but not to exclude any other integer or step or group of integers or steps.

[0295] It should be noted that, as used in this specification and the appended claims, the singular forms "a", "an", and "the" include the plural referents unless the context clearly dictates otherwise. In this specification, a range may be expressed as from "about" a particular value and / or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and / or to the other particular value. Similarly, when values are expressed as approximations by use of the antecedent "about", it will be understood that the particular value forms another embodiment. The term "about" with respect to a numerical value is optional and means, for example, ±10%.

Claims

1. A system for processing wafer-shaped articles, wherein the system is Three or more processing stations, A robotic arm comprising a first set of end effectors, which includes three or more end effectors, A system in which the robot arm is configured to pick up each wafer-shaped article from a storage unit configured to store multiple wafer-shaped articles using each of the three or more end effectors, and load one of the wafer-shaped articles into each of the three or more processing stations.

2. The system according to claim 1, wherein the robot arm is configured to simultaneously load each of the three or more processing stations into the respective wafer-shaped articles.

3. The system according to claim 1, wherein the robot arm is configured to simultaneously pick up each of the three or more end effectors from the storage unit.

4. The system according to Claim 1, wherein the three or more processing stations are configured to operate simultaneously.

5. The system according to claim 1, wherein each of the three or more end effectors is mounted so as to be rotatable about a first common axis.

6. The system according to claim 5, wherein the three or more end effectors are configured to align each of the wafer-shaped articles for pickup from the storage unit.

7. The system according to claim 5, wherein the three or more end effectors are configured to spread out in a fan shape for loading the respective wafer-shaped articles into each of the three or more processing stations.

8. The system according to claim 5, wherein the three or more end effectors are configured to rotate at different angles about the first common axis in order to load the respective wafer-shaped articles into each of the three or more processing stations.

9. The system according to claim 5, wherein the three or more end effectors are arranged to overlap vertically along the first common axis.

10. The system according to claim 1, wherein the robot arm comprises a first forearm, and the three or more end effectors are rotatably mounted on the first forearm, and the three or more end effectors are rotatable relative to the first forearm about a first common axis.

11. A system according to claim 10, wherein the three or more end effectors are rotatable with respect to the first forearm between a first arrangement in which the three or more end effectors are aligned with each other along a first common axis and a second arrangement in which the three or more end effectors have different rotation angles about the first common axis.

12. The system according to claim 11, wherein the robot arm is The three or more end effectors are arranged in the first configuration, and the first forearm is moved toward the three or more processing stations, and Moving the three or more end effectors from the first arrangement to the second arrangement such that each of the three or more end effectors is positioned above one of the three or more processing stations. A system configured to load each of the three or more processing stations with the respective wafer-shaped articles.

13. The system according to claim 12, wherein each of the three or more processing stations is equipped with a rotary chuck having a set of retaining pins for holding each of the wafer-shaped articles, A system in which each rotating chuck is configured to rotate when the three or more end effectors are moved to the second arrangement, thereby preventing contact between the set of retaining pins and the associated end effectors.

14. The system according to claim 13, wherein each rotary chuck is configured to rotate in synchronization with the movement of the associated end effector.

15. The system according to claim 1, wherein the three or more processing stations are arranged at different vertices of a triangle.

16. The system according to claim 1, further comprising a holding unit configured to hold the storage unit.

17. A system according to claim 16, wherein the system comprises a plurality of the holding units.

18. The system according to claim 1, wherein the robot arm is configured to invert the first set of end effectors.

19. The system according to claim 1, wherein the robot arm further comprises a second set of end effectors including three or more end effectors, A system in which the robotic arm is configured to pick up each wafer-shaped article from each of the three or more processing stations using each of the second set of end effectors, and load each wafer-shaped article into a storage unit.

20. The system according to claim 19, wherein the robot arm is configured to simultaneously pick up each of the wafer-shaped articles from each of the three or more processing stations using each of the three or more end effectors of the second set of end effectors.

21. The system according to claim 19, wherein the robot arm is configured to load each of the wafer-shaped articles into the storage unit simultaneously.

22. The system according to claim 19, wherein the robot arm comprises a second forearm, and the three or more end effectors of the second set are swivelably mounted on the second forearm, and the three or more end effectors are swivel with respect to the second forearm about a second common axis.

23. The system according to claim 19, wherein the robotic arm is configured to invert the second set of end effectors.

24. The system according to claim 1, further comprising a shutter, the shutter being movable between a closed state that isolates the robot arm from the three or more processing stations and an open state that allows the robot arm to access the three or more processing stations.

25. The system according to claim 1, comprising a first set of three or more processing stations and a second set of three or more processing stations, wherein the first set and the second set of three or more processing stations are arranged adjacent to each other. The system is configured such that the robot arm selectively loads each of the wafer-shaped articles into the three or more processing stations of the first set or the three or more processing stations of the second set.

26. The system according to claim 1, comprising two or more levels arranged to overlap vertically, Each level has its own set of three or more processing stations. A system in which the robotic arm is configured to selectively load each of the three or more processing stations at one of the two or more levels.

27. A method for processing wafer-shaped articles, wherein the method is Using a robotic arm equipped with a first set of end effectors including three or more end effectors, pick up each wafer-shaped article from a storage unit at each of the three or more end effectors, and Using the robot arm, load one of the wafer-shaped articles into each of the three or more processing stations. Methods that include...

28. A method according to claim 27, wherein each of the wafer-shaped articles is loaded simultaneously into each of the three or more processing stations.

29. A method according to claim 27, wherein each of the wafer-shaped articles is picked up simultaneously by each of the three or more end effectors.

30. The method according to claim 27, A method further comprising loading the respective wafer-shaped articles into each of the three or more processing stations, and then operating the three or more processing stations to process the respective wafer-shaped articles.

31. The method according to claim 30, wherein the robot arm further comprises a second set of end effectors including three or more end effectors, and the method Following the processing of each of the wafer-shaped articles, each end effector of the second set is used to pick up one of the wafer-shaped articles from one of the three or more processing stations, and Loading each of the aforementioned wafer-shaped articles into a storage unit, Methods that further include the above.

32. A robotic arm comprising a first set of end effectors including three or more end effectors, The robotic arm is configured to pick up each wafer-shaped article from a storage unit configured to store a plurality of wafer-shaped articles using each of the three or more end effectors, and to load one of the wafer-shaped articles into each of the three or more processing stations.

33. A robotic arm according to claim 32, wherein the robotic arm is configured to invert the first set of effectors.

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