Configuration Alignment Method and System

Abstract

The electronic device placement system includes a spindle assembly having a positioning system configured to move between a picking position and a placement position. The spindle assembly includes a spindle having a transparent spindle body and a vertical nozzle, an upward camera configured to image the bottom of an electronic device picked up by the nozzle of the spindle before the placement stroke of the electronic device, and a downward camera movable above the spindle between the picking and placement of the electronic device by the spindle. The downward camera is configured to image the outer edge of the electronic device through the transparent spindle body during the placement stroke of the spindle and to acquire an image of the surface of the substrate before and / or during the placement stroke.

Description

Related Matters

[0001] This application has a filing date of July 1, 2022, and claims priority to U.S. Provisional Patent Application No. 63 / 357,942, entitled "PLACEMENT ALIGNMENT METHOD AND SYSTEM", and U.S. Provisional Patent Application No. 63 / 414,275, entitled "PLACEMENT ALIGNMENT METHOD AND SYSTEM", having a filing date of October 7, 2022, the disclosures of which are incorporated herein by reference.

Technical Field

[0002] The present invention generally relates to the placement of electronic devices, components, and / or dies on substrates such as wafers, printed circuit boards, fan out panels, dies, or the like. More specifically, the present invention relates to placement methods and systems for improving the accuracy or precision of alignment between the features of the devices to be placed and the target.

Background Art

[0003] Known pick and place systems or assembly machines typically fall into four categories.

[0004] The first type of known assembly machine uses machine calibration to learn the positions of components that determine the placement accuracy of the machine, such as the position of the camera for positioning the device on the spindle of the placement head, the position of the camera for positioning the destination of the substrate / components on the substrate, and finally the position of the spindle on the placement head relative to these cameras. Using this information, devices can be placed with an accuracy of approximately 10 microns. Generally, this is a fast method for placing devices, achieving a speed of thousands of components per hour.

[0005] The drawback of known machines of the first category is that the calibration values are not completely stable. Not only the influence of heat, but also friction can, especially over time, have an adverse effect on the placement accuracy. In these machines, placement is an open-loop process and calibration needs to be monitored to obtain stable results.

[0006] A second type of known assembly machine uses two cameras to look down the rear of the spindle tip along the side of the spindle. In such a machine, the spindle tip holds the device. Through the hole in the tip, special marks on the substrate can be imaged by two cameras that assist in the alignment of the parts carried to the bottom of the spindle. Since the device held at the bottom of the spindle is imaged by an upward-facing camera, the relationship between the device and the hole in the spindle tip is known to the machine controller, and thus, the device can be accurately aligned with little calibration while the spindle descends with the device receiving guidance from the camera that aligns the mark on the substrate with the hole in the spindle tip. This second type of known assembly machine has a placement accuracy at the single micron level but at a speed that is about one-tenth of the speed that requires calibration (such as that of the first type of machine).

[0007] A second known type of assembly machine monitors the rear of the spindle while placing parts. The machine aligns the hole in the spindle tip with a mark on the substrate. The main drawback of this method is that valuable surface area of the substrate needs to be sacrificed for these marks. This can result in sacrificing 10% to 50% of the substrate depending on the size of the substrate and the size of the marks. Furthermore, the additional steps of the alignment process between the part and the hole in the spindle tip and between the placement target and the alignment mark can have an adverse effect on the placement accuracy.

[0008] A third type of known assembly machine includes a kind of die placement facility for wire bonding the upper part of the die to a component substrate, which uses an on-axis camera together with a glass nozzle. In this type of assembly machine, a single camera that is stationary and placed above the substrate is used to image the upper side of the component and align it with the substrate. This configuration eliminates the need for a second upward-facing camera that can inspect the bottom of the die to establish the position of the die relative to the spindle. This configuration also simplifies the calibration of the system.

[0009] This third type of known assembly machine does not align the features at the bottom of the component with the substrate. Therefore, the third type cannot be applied to the process required to align the micro-connections at the bottom with the corresponding connections on the substrate.

[0010] Finally, there is a fourth type of known assembly machine that can be used for the placement of high-power LED components. The positional accuracy of the bottom of the component is not critical, but the position of the light-emitting part at the top of the component needs to be accurately aligned. For these components, a process called Top Alignment Placement is used. First, the component is inspected by a vision system camera from above before the component is picked up by the spindle. This enables the vision system to calculate the position of the upper light-emitting area relative to the outer shape of the component. After the component is picked up, the spindle transports the component to an upward-facing device camera that images the bottom of the component. This enables the vision system to calculate the position of the outer shape of the component relative to the spindle. Then, the component can be placed on the substrate such that the positional accuracy of the light-emitting area is optimized.

[0011] This fourth type of known assembly machine also does not align the features at the bottom of the component with the substrate (like the third type described above). Therefore, the fourth type of known assembly machine enables alignment of the upper part of the component but does not align the features at the bottom. SUMMARY OF THE INVENTION

Problems to be Solved by the Invention

[0012] Therefore, a method and system for improving the accuracy or precision of alignment of the features of a device to be placed with respect to a target, without requiring special features on a substrate and achieving sub-micron (i.e., better than 1 micron) precision, are highly evaluated in the art.

Means for Solving the Problems

[0013] According to one aspect, an electronic device placement system is a spindle assembly having a positioning system configured to move between a picking position and a placement position, the spindle assembly including a spindle having a transparent spindle body, the spindle including a nozzle vertically attached to the transparent spindle body, a spindle assembly, an upward camera configured to image the bottom of an electronic device picked up by the nozzle of the spindle before the placement stroke of the electronic device, and a downward camera movable on the spindle between picking and placing the electronic device by the spindle, the downward camera being configured to image an outer edge portion of the electronic device through the transparent spindle body during the placement stroke of the spindle, the downward camera being configured to obtain an image of a surface of a substrate before and / or during the placement stroke.

[0014] According to another aspect, a method for placing an electronic device includes moving a spindle assembly having a positioning system to a picking position, the spindle assembly including a spindle having a transparent spindle body, the spindle including a nozzle vertically attached to the transparent spindle body; picking up an electronic component using the spindle; imaging, using an upward-facing camera, a bottom portion of the electronic component picked up using the spindle before placement of the electronic component; moving the spindle with the electronic component to a placement position; imaging, using a downward-facing camera, a surface of a substrate before and / or during the placement stroke; and imaging, using a downward-facing camera movable above the spindle, through the transparent spindle body, an outer edge portion of the electronic device during the placement stroke of the spindle. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The foregoing and further advantages of the present invention can be better understood by reference to the following description in conjunction with the accompanying drawings, in which like reference numerals indicate like elements and features in the various drawings. For clarity, not all elements are shown in all drawings. The drawings are not necessarily to scale, and instead emphasis is placed on explaining the principles of the present invention.

[0016]

Figure 1

Figure 2

Figure 3A

Figure 3B

Figure 3C

Figure 4A

Figure 4B

Figure 4C

Figure 4D

Figure 5A

Figure 5B

Figure 6A

Figure 6B

Figure 7

Figure 8

DETAILED DESCRIPTION OF THE INVENTION

[0017] References to "one embodiment" or "an embodiment" in this specification mean that the particular features, structures, or characteristics described in connection with the embodiment are included in at least one embodiment of the present teachings. References to particular embodiments within this specification are not necessarily references to all the same embodiments.

[0018] The present teachings will be described in more detail with reference to its exemplary embodiments, as shown in the accompanying drawings. The present teachings are described with various embodiments and examples, but the present teachings are not intended to be limited to such embodiments. On the contrary, the present teachings include various alternatives, modifications, and equivalents, as will be understood by those skilled in the art. Those skilled in the art who are in contact with the teachings herein will recognize additional implementations, changes, and embodiments, as well as other fields of use, within the scope of the present disclosure described herein.

[0019] The present disclosure enables alignment of device features to targets on a substrate better than prior art equipment and placement of electronic devices such as components, dies, or the like on a substrate or printed circuit board. For example, the present electronic device placement system and method described herein can place electronic devices with an accuracy of 1 micron or greater.

[0020] FIG. 1 shows a top view of an electronic device placement system 10 according to one embodiment, and FIG. 2 shows a side view of the electronic device placement system 10 of FIG. 1. As shown in FIGS. 1 and 2, the electronic device placement system 10 includes a positioning system including a pair of parallel linear bearings 12a, 12b disposed on respective Y axes 13a, 13b and extending in the Y direction. The positioning system further includes three beams extending between the pair of linear bearings 12a, 12b, namely a first beam 14a, a second beam 14b, and a third beam 14c.

[0021] The first beam 14a is movably connected to the linear bearings 12a, 12b and is arranged along a first X-axis 15a that is perpendicular to the Y-axes 13a, 13b. Similarly, the second beam 14b is movably connected to the linear bearings 12a, 12b and is arranged along a second X-axis 15b that is also perpendicular to the Y-axes 13a, 13b. Similarly, the third beam 14c is movably connected to the linear bearings 12a, 12b and is arranged along a third X-axis 15c that is also perpendicular to the Y-axes 13a, 13b. Therefore, the first, second, and third beams 14a, 14b, 14c are parallel beams and are arranged at intervals along the Y-axes 13a, 13b between a pair of parallel linear bearings 12a, 12b. In particular, the third beam 14c is located between the first beam 14a and the second beam 14b. In other words, the first beam 14a is located on the first side of the electronic device placement system 10, the second beam 14b is located on the second side of the electronic device placement system 10, and the third beam 14c is located between them. The first, second, and third beams 14a, 14b, 14c are each configured to move independently of the linear bearings 12a, 12b in the Y-direction along the Y-axes 13a, 13b.

[0022] As shown in the figure, the positioning system includes a first carriage 16a that is movably connected to the first beam 14a. The first carriage 16a is configured to move relative to the first beam along the first X-axis 15a. Similarly, the positioning system further includes a second carriage 16b that is movably connected to the second beam 14b. The second carriage 16a is configured to move relative to the second beam 14b along the second X-axis 15b. Similarly, the positioning system includes a third carriage 16c that is movably connected to the third beam 14c. The third carriage 16c is configured to move relative to the third beam 14c along the third X-axis 15c.

[0023] The parallel linear bearings 12a, 12b and / or the described beams 14a, 14b, 14c and / or the carriages 16a, 16b, 16c may include any type of positioning or bearing system configured to enable movement of the spindle assembly and / or the downward camera system in both the X and Y directions along the X and Y axes. The connections between these bearings, beams, and carriages can take any form, such as wheel / roller, sliding movement, or any other type of controllable precision bearing system.

[0024] The first spindle 18a of the first spindle assembly 25a is movably connected to the first carriage 16a. In particular, the first spindle 18a is attached to or connected to a first piezo stage 20a that is attached to or connected to the first spindle assembly Z drive 22a. In particular, the first spindle assembly Z drive 22a is movably connected to the first carriage 16a and is configured to move relative to the first carriage 16a along the first Z axis 24a. The first spindle assembly Z drive 22a is configured to move the first spindle 18a along the first Z axis 24a. The first piezo stage 20a is movably connected between the first spindle assembly Z drive 22a and the first spindle 20a. The first piezo stage 20a is configured to move the first spindle 18a relative to the first spindle assembly Z drive 22a to finely adjust the positioning of the first spindle 18a.

[0025] Similar to the first spindle 18a, the second spindle 18b of the second spindle assembly 25b is movably connected to the second carriage 16b. In particular, the second spindle 18b is attached to or connected to a second piezo stage 20b that is attached to or connected to a second spindle assembly Z drive 22b. In particular, the second spindle assembly Z drive 22b is movably connected to the second carriage 16b and is configured to move relative to the second carriage 16b along the second Z-axis 24b. The second spindle assembly Z drive 22b is configured to move the second spindle 18b along the second Z-axis 24b. The second piezo stage 20b is movably connected between the second spindle assembly Z drive 22b and the second spindle 20b. The second piezo stage 20b is configured to move the second spindle 18b relative to the second spindle assembly Z drive 22b to finely adjust the positioning of the second spindle 18b.

[0026] The first and second spindles 18a, 18b can be spindle assemblies each including a first transparent spindle body 19a and a second transparent spindle body 19b. The first and second transparent spindle bodies 19a, 19b can each include a pair of glass plates 26a, 26b, one on top of and one below the structure of the spindles 18a, 18b. Instead of glass plates, other transparent materials can be used, particularly when light of different wavelengths such as infrared or X-rays can be used for irradiation. Further, the main structure of the spindles 18a, 18b may be made of a transparent material. The first and second spindles 18a, 18b can each include vertically aligned nozzles 28a, 28b. The spindle nozzles 28a, 28b may also be made of a transparent material in some embodiments. Furthermore, the first and second spindles 18a, 18b can each be configured to provide air distribution to the spindle nozzles 28a, 28b to generate vacuum suction and / or air discharge from the spindle nozzles 28a, 28b. The spindles 18a, 18b can further each include θ drives 30a, 30b to rotate the glass plates to enable pickup and placement at different angles.

[0027] As shown, nozzles 28a, 28b each pick up respective electronic devices 32a, 32b such as components, dies, or the like. The combination of the linear bearings 12a, 12b, beams 14a, 14b, and the positioning systems of the Z drives 22a, 22b, and θ drives 30a, 30b enables the electronic device placement system 10 to pick up the electronic devices 32a, 32b and move the electronic devices 32a, 32b between all large distances by the positioning systems on the X, Y, Z, and θ (rotation) axes. When the first and second spindles 18a, 18b with the picked-up electronic devices 32a, 32b are attached to or on the nozzles 28a, 28b, the electronic devices 32a, 32b can be transported from a picking position such as a feeder area and / or a feeder bank (not shown) to a device imaging position and / or a placement position above the substrate 34 or other target as described hereinafter in this specification.

[0028] In the illustrated embodiment, the electronic device placement system 10 further includes an upward-facing first upward camera 36 configured to image the bottom of the electronic device. In particular, the first upward camera 36 can be configured to image an electronic device picked up by the first spindle 18a, such as the first electronic device 32a. The imaging by the first upward camera 36 occurs before the placement stroke of the first spindle 18a for placing the first electronic device 32a.

[0029] Similar to the first upward camera 36, the electronic device placement system 10 further includes a second upward camera 38 configured to face upward and image the bottom of the electronic device. In particular, the second upward camera 38 can be configured to image an electronic device picked up by the second spindle 18b, such as the second electronic device 32b. The imaging by the second upward camera 38 occurs before the placement stroke of the second spindle 18b for placing the second electronic device 32b.

[0030] The electronic device placement system 10 further includes a positioning system, a mechanical base 40 located under linear bearings 12a, 12b, beams 14a, 14b, 14c and the like. The positioning system can be operably attached or connected to the mechanical base 40 of the electronic device placement system 10. The mechanical base 40 includes a substrate holder system 42 for holding the substrate 34. On the substrate 34, first and second electronic devices 32a, 32b can be arranged between the placement strokes of respective first and second spindles 18a, 18b. An upward-facing first upward camera 36 is located on the first side of the substrate holder system 42, and an upward-facing second upward camera 38 is located on the second side of the substrate holder. In other words, the first side of the substrate holder 42 is close to the first end of the linear bearings 12a, 12b, and the second side of the substrate holder 42 is close to the second (opposite) end of the linear bearings 12a, 12b.

[0031] The electronic device placement system 10 further includes a downward camera 50 connected to a third carriage 16c. It should be understood that the embodiments shown in FIGS. 1 and 2 include a single downward camera 50, but embodiments with multiple downward cameras are also conceivable. For example, a downward camera can be provided for each respective spindle assembly. As shown in FIGS. 1-2, the downward camera 50 can be moved above the first spindle 18a during the placement of the first electronic device, such as the first electronic device 32a, by the first spindle 18a. The downward camera 50 can be positioned approximately above the target (e.g., within 100 microns) in the X, Y, Z, and rotation axes, and the large axes X, Y, Z, and θ of the positioning systems of the beams 14a, 14b, 14c, carriages 16a, 16b, 16c, and Z drives 22a, 22b, 52 are completely stopped.

[0032] Once in the appropriate position, the downward camera 50 is configured to image the outer edges of the picked-up electronic device through the first transparent spindle body (as described above) during the placement stroke of the first spindle 18a. Similarly, the downward camera 50 is movable above the second spindle 18b during the placement of the second electronic device by the second spindle 18b, such as the second device 32b. To do this, the first beam 14a can be moved away from the substrate 34 along the linear bearings 12a, 12b towards the upward camera 36 and / or the feeder bank or the picking position. Next, the second beam 14b can be moved onto or above the substrate 34. Here, the downward camera 50 can thereby be configured to image the outer edges of the picked-up electronic device through the second transparent spindle body (as described above) during the placement stroke of the second spindle 18b. The downward camera 50 can also be moved or configured to move in the vertical Z direction via the camera Z drive 52 so that when the downward camera 50 is suspended above the substrate 34, it can focus not only on the substrate but also on the device.

[0033] Accordingly, the first and second beams 14a, 14b (i.e., the placement beams) of the system 10 carry the spindles 18a, 18b respectively, and can move the respective spindles 18a, 18b independently of the third beam 14c (i.e., the camera beam) in the X, Y, and Z axes as long as the first and second beams 14a, 14b remain on each side of the third beam 14c. In other words, the first, second, and third beams 14a, 14b, 14c may not be able to pass through each other in the Y direction along the linear bearings 12a, 12b.

[0034] To provide space for the downward-facing camera 50, the spindle assembly can extend the respective placement head beams (i.e., the first and second beams 14a, 14b) in the direction of the camera beam (i.e., the third beam 14c) so that the spindles 18a, 18b can be placed below the downward-facing camera 50 when the beams approach each other. For example, the first spindle 18a can be positioned directly below the downward-facing camera 50 when the first beam 14a approaches the third beam 14c, and the second spindle 18b can be positioned directly below the downward-facing camera 50 when the second beam 14b approaches the third beam 14c.

[0035] The extensions of each spindle 18a, 18b carry the nozzles 28a, 28b vertically attached between the centers of the two horizontal glass plates 18a, 18b. The downward-facing camera 50 on the third beam 14c is placed above the glass plates, enabling it to image the outer edges of the picked devices during the actual placement stroke and actively align these edges with the targets on the substrate 34.

[0036] The first and second piezo stages 20a, 20b can be configured to finely adjust the positioning of the first and second spindles 18a, 18b in six axial directions including the X-axis direction, Y-axis direction, Z-axis direction, θ-rotation axis direction, α-rotation axis direction, and β-rotation axis direction. The X-axis direction can be parallel to the X-axes 15a, 15b, 15c, the Y-axis direction can be parallel to the Y-axes 13a, 13b, and the Z-axis direction can be parallel to the Z-axes 24a, 24b. The α-rotation direction can be a rotation around an axis parallel to the X-axes 15a, 15b, 15c, the β-rotation direction can be a rotation around an axis parallel to the Y-axes 13a, 13b, and the θ-rotation direction can be a rotation around an axis parallel to the Z-axes 24a, 24b.

[0037] For final adjustment, a six-degree-of-freedom piezo-actuator-driven stage mounted between the Z-drive of the PH-beam carriage and the spindle assembly can perform precise position adjustment based on spindle camera information of the difference between the target position and the actual position of the device while moving slowly in small steps relative to the substrate. The piezo stage can perform adjustments of less than 1 micron of the device at the nozzle tip relative to the spindle camera and the substrate not only in the X, Y, and Z directions but also at the θ, α, and β angles. The angular adjustment is necessary because θ is more accurate than a conventional θ servo drive. The adjustments for α and β can improve the landing of the device on the same plane on the substrate and prevent crushing of the corner interconnect features on the device or the substrate.

[0038] As described above, in the exemplary embodiments of the present specification, the electronic device placement system and method utilize one or more Cartesian positioning system beams in an electronic device placement assembly machine or system. The beams disclosed herein are configured to move in the Y direction along the same linear bearing, enabling the carriage to move in the X direction along each beam. The camera beam carries a spindle camera that looks down vertically. This camera can image the substrate and, using a vision system, determine the position of the interconnect features on the substrate that are the targets where the device is to be placed.

[0039] Figure 3A shows a first downward camera image 60 during or prior to picking, according to one embodiment. As shown, the image includes an electronic device 61 positioned on a device feeder 62. It should be understood that the electronic device 61 may be the same as or similar to the electronic devices 32a, 32b described above herein. This figure shows a glass spindle 64, such as one of the spindles 18a, 18b described above herein. Through the glass spindle 64, the device feeder 62 is visible and can be imaged, similar to the electronic device 61. A nozzle 66 is depicted at the center of the glass spindle 64. The nozzle 66 is positioned above the electronic device 61 for picking, but in the position shown, the nozzle 66 needs to be moved upward so that it is centrally disposed above the electronic device 61 in the image seen by a downward camera, such as the downward camera 50 described above herein.

[0040] Figure 3B shows a second downward camera image 70 while the glass spindle 64 is carrying the electronic device 61, according to one embodiment. In particular, the second spindle camera image 70 can be taken after picking up the electronic device 61 from the device feeder 62 shown in FIG. 3A and / or while the glass spindle 64 is carrying the electronic device 61 to a placement location or substrate. In this image, the spindle camera can acquire the outer shape of the electronic device 61, including the corners of the electronic device 61. In some embodiments, this downward camera image 70 can be taken by a downward camera in parallel or simultaneously with an upward image taken by an upward camera at the bottom of the electronic device (as shown in FIG. 4A).

[0041] Figure 3C shows a third downward camera image 75 during the active placement, i.e., during the placement stroke of the spindle 64, according to one embodiment. The third downward camera image 75 shows the glass spindle 64 above the placement position on the substrate 68 being placed. The substrate includes features 69 that can be imaged by the downward camera to facilitate determining the exact placement position. In particular, images such as the third downward camera image 75 can be used to align the outer shape and corners of the electronic device 61 with the features on the substrate 68.

[0042] Figure 4A shows a schematic view of a camera image 80 of the bottom of the device 61 including a bump pattern 84 having a plurality of bumps 85, according to one embodiment. As described above, this camera image 80 can be taken in parallel or simultaneously with the downward camera image 70 of Figure 3B. The camera image 80 can be taken by an upward camera that can be positioned close to the placement position, as shown in Figure 2. Thus, the spindle can move the picked-up electronic device above the upward camera to acquire the camera image 80. The camera image 80 can be used by the placement system to process the bump pattern, find the center, find the orientation angle, and perform other desired image processing based on the bottom of the electronic device 61.

[0043] Figure 4B shows step 90 of reprocessing the same image to determine the center 91 of the outer shape and to determine the orientation angle α of the outer shape and corners, according to one embodiment. The outer shape can be located in a plane defined by the X-axis and Y-axis. Figure 4C shows step 95 of calculating the bump centers relative to the outer shape and corners of the device 61 and further calculating the angle α between the bump patterns relative to the outer shape and corners, according to one embodiment.

[0044] FIG. 4D shows the display of a downward camera image 99 on top of a substrate 68 according to one embodiment. The downward camera image 99 can be captured by a downward camera. During the placement process, the downward camera can process the bump pattern and the orientation angle as shown in FIGS. 4B and 4C. The downward camera image 99 can then be processed to find substrate features 69 before bringing the electronic device 61 to the placement position. The features on the substrate may be traces, vias, or fiducial marks, but may also be the actual substrate interconnect features that can be aligned with the interconnect features on the bottom of the device 61.

[0045] Using the image, the center 91 of the bump pattern 84 can be calculated with respect to a selected feature 69 on the substrate 68. Further, the angle α of the bump pattern 84 can also be calculated with respect to the feature 69 on the substrate 68. Using this information and these images, the electronic component can be accurately placed at a high level of accuracy.

[0046] During operation, a series of events of the electronic device placement system 10 can be as follows. First, the first spindle assembly (i.e., the first carriage 16a, the first Z drive 22a, the first piezo stage 20a, the first spindle 18a, the glass plate 26a, and the first nozzle 28a) can be moved to the device feeder position for picking up the electronic device in the X, Y, Z directions, and in the θ (rotation direction) by the first beam 14a. The placement head positioning system is expected to be accurate enough for this pickup process without imaging, but the downward camera 50 can also be used for this movement to ensure that the nozzle 28a picks up the first electronic device 32a such that there is an edge of the first electronic device 28a that remains visible to the downward camera 50 beyond the entire circumference of the tip of the nozzle 28a. Next, the placement head positioning system moves the spindle assembly to the upward-looking upward camera 36, which is configured to image the interconnect features at the bottom of the electronic device 32a so that the exact positions of these features in X, Y, and θ can be found. In parallel or simultaneously, imaging can also be performed by the downward camera 50 above the first electronic device 28a through the transparent spindle. Thereafter, the placement head positioning system processes the same image for the exact position of the edge of the device and calculates the relationship between the position of the edge and the position of the interconnect features in X, Y, and θ.

[0047] Although not shown, it should be understood that the electronic device placement system 10 may include a control and / or imaging system. The control and / or imaging system may include one or more computer processors and / or memory systems and / or data storage systems, computer system buses, and the like. The electronic device placement system 10 may include wireless components or may be entirely wired and internal to the electronic device placement system 10. In some embodiments, the various cameras 36, 38, 50 may each include their own local processing system, and they may all be interconnected via the electronic device placement system 10. In any embodiment, the computer processor and this control and / or imaging system may be configured to perform imaging and control the various movements of the placement head positioning system for both picking and placement, as described herein.

[0048] During the imaging process of the upward camera 36 (e.g., performed by the control system), the downward camera 50 may be positioned over the target area of the substrate 34. The downward camera 50 may then image this target area, calculate the position of the interconnect features of the substrate 34, and further calculate features within the same image that are also visible when the nozzle 28a with the electronic device 32a covers the interconnect features of the substrate. The vision system of the downward camera 50 may then calculate the position of the interconnect features in X, Y, and θ during the placement movement. Next, the placement head positioning system moves the first spindle 18a to a position relatively close to the final accurate placement position on the substrate 34, for example, about 100 microns in X and Y, about 2 millimeters in Z, and about 0.1 degrees in θ. By imaging the edge of the electronic device 28a, the vision system of the downward camera 50 may calculate the position of the interconnect features on the bottom side of the electronic device 32a by using the information collected previously by the upward camera 36 regarding the relationship between the edge and the interconnect features.

[0049] If larger corrections (i.e., greater than 100 microns for X and Y, about 2 mm for Z, and about 0.1 degrees for θ) are required, the placement head positioning system can move via the movement of the first beam 14a, the first carriage 16a, the Z drive 22a, and the θ drive 30a. Alternatively, if the distance between the position of the interconnect feature and the target is relatively close (i.e., greater than 100 microns for X and Y, about 2 mm for Z, and about 0.1 degrees for θ), then the piezo stage 20a can be used, and the electronic device 32a can thereby center on the target on the substrate 34 with the required accuracy.

[0050] Next, the nozzle 28a is lowered by the Z drive 22a without contacting, while focusing on the features of the substrate and at the same time until the edge of the device is in focus of the downward camera 50. At this time, the final correction may be required by the piezo stage 20a to achieve nanometer position adjustment in X, Y, and θ. Finally, the placement is performed by the Z drive of the Z drive 22a and / or the piezo stage 20a. Further, at this time, the sensor of the piezo stage 20a can be used as a sensor for registering the contact force. The α and β rotation axes from the piezo stage 20a can further be used in combination with a set of laser sensors to adjust the angle of the substrate surface so that all bumps contact the target simultaneously.

[0051] When this placement process is completed, the first spindle assembly can be returned to the electronic component feeder bank via the placement head positioning system to pick up the next component. While this is occurring, the same process described hereinabove can be performed using the second spindle assembly (i.e., the second carriage 16b, the second Z drive 22b, the second piezo stage 20b, the second spindle 18b, the glass plate 26b, and the second nozzle 28b) together with the downward camera 50 and the upward camera 38.

[0052] FIG. 5A shows a method 100 of placing an electronic device, such as one or both of the electronic devices 32a, 32b, according to an embodiment. The method 100 includes a first step 102 of moving a first beam and a first carriage. This step may include moving the first beam relative to at least one linear bearing along the Y-axis. The first beam is disposed along a first X-axis that is perpendicular to the Y-axis, and the first beam may be movably coupled to at least one linear bearing. This step may further include moving the first carriage relative to the first beam along the first X-axis. The first carriage may be movably coupled to the first beam.

[0053] The method 100 may include a next step 104 of picking up a first electronic device at a first picking position by a first spindle movably coupled to the first carriage. The first spindle may include a transparent first spindle body, as previously described herein.

[0054] The method 100 then includes moving a first spindle with the picked-up first electronic device to a first imaging position by moving one or more of the first beam along the Y-axis and the first carriage along the X-axis, and imaging the bottom of the first electronic device at the first imaging position by a first upward camera. Step 106 may be included. Simultaneously with step 106 of imaging the bottom of the first electronic device by the upward camera, the method 100 may include a simultaneous step 107 of imaging the top of the first electronic device using a downward camera. This simultaneous imaging may provide a high-precision relationship between the upper edge imaged in step 107 of the first electronic device and the bump pattern imaged between step 106 of the bottom of the first electronic device.

[0055] The method may include a step 108 of imaging a first placement position using a downward camera. It should be understood that step 108 may occur before moving the first spindle with the picked-up first electronic device to the first placement position.

[0056] Method 100 may then include step 110 of moving a first spindle carrying a picked first electronic device to a first placement position by moving a first beam along the Y-axis. Method 100 may then include step 112 of placing the first spindle directly below the downward-facing camera at the first placement position (i.e., when the first beam is close to the third beam). This step 112 may include moving at least one of the third beam and the first beam so that the third beam is close to the first beam.

[0057] Method 100 may then include step 114 of starting the placement stroke of the first spindle to begin placing the picked first electronic device on the substrate at the first placement position. Step 116 then includes imaging an outer edge portion of the first electronic device by the downward-facing camera during the placement stroke of the first spindle through the transparent first spindle body.

[0058] Method 100 may then include step 118 of moving the first spindle relative to the first spindle assembly Z-drive using a first piezo stage to finely adjust the positioning of the first spindle. Method 100 may then at that time include step 120 of placing the first electronic device on the substrate at the first placement position.

[0059] Method 100 further includes additional steps shown in FIG. 5B. The steps shown in FIG. 5B are shown after the steps shown in FIG. 5A, but some of the steps may occur before all of the steps in FIG. 5A are completed and may be executed simultaneously with the steps shown in FIG. 5A.

[0060] FIG. 5BA shows the continuation of method 100 for placing an electronic device such as one or both of the electronic devices 32a, 32b according to an embodiment. Method 100 includes the next step 122 of moving the second beam and the second carriage. This step may include moving the second beam relative to at least one linear bearing along the Y-axis. The second beam is disposed along a first X-axis perpendicular to the Y-axis, and the second beam may be movably coupled to at least one linear bearing. This step may further include moving the second carriage relative to the second beam along the first X-axis. The second carriage may be movably coupled to the second beam.

[0061] Method 100 may include the next step 124 of picking up the second electronic device at the second picking position by a second spindle movably coupled to the second carriage. The second spindle may include a transparent first spindle body as previously described herein.

[0062] Method 100 then moves the second spindle with the picked-up second electronic device to the second imaging position by moving one or more of the second beam along the Y-axis and the second carriage along the X-axis, and may include step 126 of imaging the bottom of the second electronic device at the second imaging position by the second upward camera. Simultaneously with step 126 of imaging the bottom of the second electronic device by the upward camera, method 100 may include simultaneous step 127 of imaging the top of the second electronic device using a downward camera. This simultaneous imaging may provide a high-precision relationship between the upper edge imaged in step 127 of the second electronic device and the bump pattern imaged during step 126 of the bottom of the second electronic device.

[0063] While step 126 is being performed, the method may include step 128 of imaging the second placement position using a downward camera. It should be understood that step 128 may occur before moving the second spindle with the picked-up second electronic device to the second placement position.

[0064] Method 100 may then include step 130 of moving a second spindle with a picked-up second electronic device to a second placement position by moving a second beam along the Y axis. Method 100 may then include step 132 of placing the second spindle directly below the downward-facing camera at the second placement position (i.e., when the second beam is close to the third beam). This step 132 may include moving at least one of the third beam and the second beam so that the third beam is close to the second beam.

[0065] Method 100 may then include step 134 of starting the placement stroke of the second spindle to begin placing the picked-up second electronic device on the substrate at the second placement position. Step 136 then includes imaging the outer edge of the second electronic device by the downward-facing camera during the placement stroke of the second spindle through the transparent second spindle body.

[0066] Method 100 may then include step 138 of moving the second spindle relative to the second spindle assembly Z drive using a second piezo stage to finely adjust the positioning of the second spindle. Method 100 may then include step 140 of placing the second electronic device on the substrate at the second placement position at that time. In this way, method 100 can continue to alternately pick up and place by each of the first and second spindles.

[0067] FIG. 6A shows a side schematic view of an electronic device placement system 200 including a downward-facing camera 250 and a spindle 218 of a spindle assembly 219 having a nozzle 228 that picks up an electronic device 228 moved out of the visual path of the downward-facing camera 250 according to one embodiment. FIG. 6B shows a side schematic view of an electronic device placement system 200 including a downward-facing camera 250 and having a nozzle 228 that picks up an electronic device 228 above a substrate 234 according to one embodiment.

[0068] Although not shown, the electronic device placement system 200 may include a positioning system having a pair of linear bearings such as linear bearings 12a and 12b, and at least one beam such as one of beams 14a, 14b, 14c. A carriage 216 is shown on this beam, and both a downward-facing camera 250 and a spindle 218 are movably coupled to the carriage. Thus, in this embodiment, the beam may be movably coupled to at least one bearing arranged along the X-axis perpendicular to the Y-axis. The beam may be configured to move relative to at least one linear bearing along the Y-axis to achieve movement in the X and Y directions. The carriage 216 is movably coupled to the beam and may be configured to move relative to the beam along the X-axis.

[0069] The electronic device placement system 200 includes a spindle assembly Z-drive 222 movably coupled to the carriage 216. The spindle assembly Z-drive is configured to move relative to the carriage along the Z-axis that is perpendicular and perpendicular to each of the X-axis and the Y-axis. Similarly, the spindle 218 is coupled to the spindle assembly Z-drive 222. The spindle may be the same as or similar to the spindles 18a and 18b described above in this specification. As shown, the spindle 218 includes a nozzle 228 vertically attached to a transparent spindle body. The transparent spindle body includes two glass plates 226. As shown, the spindle 218 includes a θ-drive 230 that rotates the spindle 218 and the nozzle 228.

[0070] Although not shown, the electronic device placement system 200 may include an upward-facing camera configured to image the bottom of the electronic device 232, such as one of the upward-facing cameras 36, 38 described above herein. The electronic device placement system 200 may include only a single upward-facing camera in this single spindle embodiment. The device camera may be configured to image the electronic device 232 picked up by the nozzle 228 of the spindle 218 prior to the placement stroke of the electronic device 232.

[0071] As shown in FIG. 6B, the electronic device placement system 200 includes a downward-facing camera 250 that is movable above the spindle 218 during placement of the electronic device 232 by the spindle 218. The downward-facing camera 250 is configured to image the outer edge of the electronic device 232 during the placement stroke of the spindle 218 through the transparent spindle body. The downward-facing camera 250 may include a lens and / or illumination system 254 to facilitate proper imaging. The downward-facing camera 250 may include a camera Z drive 252 movably coupled to the carriage 216 and configured to move relative to the carriage along the Z-axis. Thus, in the illustrated embodiment, the downward-facing camera 250 and the spindle 218 may be movably coupled to the same carriage 216. However, the downward-facing camera 250 may be movable independently of the carriage 216 along the Z-axis from the spindle 218. Thus, each of the spindle 218 and the downward-facing camera 250 includes a dedicated individual Z drive 222, 252 for independent movement.

[0072] As shown in FIG. 6A, the spindle 218 can be configured to move out of the visual path of the downward camera 250 along the movement path M when the spindle camera is directed to the placement position. In the illustrated embodiment, the spindle 218 can be configured to be rotatably attached to the carriage 216 in a hinged manner. However, in other embodiments, the spindle 218 can be movable along a spindle linear bearing (not shown) with respect to the carriage 216 to move out from under the downward camera 250 and enable direct imaging of the substrate 234 by the downward camera 250. The spindle 218 can be movable with respect to the downward camera 250 by at least one degree of freedom. Alternatively, the spindle 218 can be movable with respect to the downward camera 250 by at least two degrees of freedom (i.e., vertical independent movement and horizontal independent movement). Further, although not shown, it should be understood that the electronic device placement system 200 includes mechanical frames and substrate holder systems such as the mechanical frame 40 and the substrate holder system 42 described above in this specification.

[0073] The electronic device placement system 200 further includes a piezo stage 220 movably coupled between the spindle assembly Z drive 222 and the spindle 218. The piezo stage 220 can be configured to move the spindle 218 with respect to the spindle assembly Z drive 222 to finely adjust the positioning of the spindle 218. The piezo stage is configured to finely adjust the positioning of the spindle in six axial directions including the X-axis direction, Y-axis direction, Z-axis direction, θ rotation axis direction, α rotation axis direction, and β rotation axis direction, similar to the piezo stages 20a and 20b described above in this specification.

[0074] Next, referring to FIG. 7, a side schematic view of the electronic device placement system 200 of FIGS. 6A and 6B, including a downward camera 250 and a spindle 218, according to one embodiment, is shown positioned above an upward camera 236. The upward camera 236 may be a fixed camera or may include its own positioning system. In any embodiment, the upward camera 236 and the downward camera 250 can be positioned or moved so as to be vertically aligned such that the downward camera can acquire an outer shape of an electronic component picked through a transparent spindle, while the upward camera can acquire a bottom of the electronic component.

[0075] As shown, the upward camera 236 includes its own lens and / or illumination system 254. As shown in FIG. 7, the upward camera 254 can be configured to image the bottom of the electronic device 232 simultaneously with imaging the upper part of the electronic device 232 by the downward camera 250. To achieve this imaging, the upward illumination system 237 and the downward illumination system 254 can be configured to synchronously illuminate during simultaneous imaging of the upward and downward cameras of the electronic device. For example, this illumination can be illumination of 10 microseconds or less for imaging by both cameras to eliminate the influence of system vibration.

[0076] In some embodiments, an opening 260 having a sharp inner edge can be positioned above the upward camera 236 such that the electronic device 232 can be positioned at the height of the opening 260 during simultaneous imaging of the upward camera 236 and the downward camera 250 of the electronic device 232. This opening or blade may completely surround the electronic device 232 or may be narrowed to an extremely thin blade-shaped point at the inner circumference surrounding the component. This opening 260 can be useful for calibration or alignment of imaging.

[0077] In the embodiment shown in FIGS. 6A-6B, a series of events can be as follows. First, the placement head system (i.e., the carriage 216 and its accessories) is moved by the positioning system in the X and Y directions to a device feeder position (not shown) to pick up the electronic device 232. The downward camera 250 can be used for this movement to ensure that the nozzle 228 picks up the electronic device 232 such that an edge of the electronic device 232 that remains visible to the downward camera 250 extends beyond the entire circumference of the tip of the spindle 218. Next, the positioning system moves the spindle 218 to an upward-looking device camera configured to image the contact bumps of the electronic device so that exact targets for X, Y, and θ are found. Thereafter, the imaging and / or control system processes the same image for the edge of the electronic device 232 and calculates the relationship between the edge and the X, Y, and θ targets. Next, the positioning system moves the spindle 218 to a placement site on the substrate 234 within about 10 microns for X and Y, within about 2 millimeters for Z, and within about 0.01 degrees for θ. By viewing the edge of the electronic device 232, the downward camera 250 can calculate the center of the bump using the information provided by the upward camera. After moving the downward camera 250 downward by about 2 mm, the downward camera 250 can image the substrate 234. In one embodiment, if greater correction is needed, the positioning system can move the carriage 216 further. However, if the target is within microns, the piezo stage 220 can be used and the electronic device 232 is accurately centered on the target on the substrate 34. The spindle 218 is then lowered by the spindle assembly Z drive 222 without contact until the substrate features are in focus and at the same time the device edge is in focus of the downward camera 250. At this time, a final correction by the piezo stage 220 may be required to achieve nanometer alignment in X, Y, and θ. Thereafter, placement is performed by the spindle assembly Z drive 222 and / or the piezo stage 220.At this time, the piezo stage actuator can be used as a sensor for registering the contact force. The α-axis and β-axis from the piezo stage are used in combination with a set of laser sensors to adjust the angle of the substrate surface so that all bumps contact the target simultaneously.

[0078] FIG. 7 shows another method 300 of placing an electronic device, such as the electronic device 332a of FIGS. 6A and 6B, according to one embodiment. Method 300 includes a first step 302 of moving a carriage movably coupled to at least one beam to a picking position. Step 302 may include moving at least one beam along the Y-axis relative to at least one linear bearing when at least one beam is disposed along the X-axis perpendicular to the Y-axis and at least one beam is movably coupled to at least one linear bearing. Step 302 may further include moving the carriage relative to at least one along the X-axis, the carriage being movably coupled to at least one beam.

[0079] Method 300 may include the next step 304 of picking up the electronic device at the picking position by a nozzle of a spindle (e.g., a spindle coupled to a spindle assembly Z-drive as shown in FIGS. 6A and 6B). The spindle can include a transparent spindle body, and the nozzle can also be transparent and / or attached perpendicular to the transparent spindle body.

[0080] Method 300 may then include step 306 of moving the spindle with the picked electronic device to the imaging position and imaging the bottom of the electronic device at the imaging position with an upward-facing device camera. Simultaneously with step 306 of imaging the bottom of the electronic device with the upward-facing camera, method 300 may include simultaneous step 307 of imaging the top of the electronic device using a downward-facing camera. This simultaneous imaging may provide a high-precision relationship between the upper edge imaged in step 307 of the electronic device and the bump pattern imaged between step 306 of the bottom of the electronic device.

[0081] Method 300 may then include step 308 of moving the spindle with the picked electronic device to the placement position by moving one or more of at least one beam along the Y-axis, a carriage along the X-axis, and a spindle assembly Z-drive along the Z-axis, and rotating the spindle and nozzle using a θ drive. Step 308 may further include moving a downward-facing camera facing downward above the placement position.

[0082] Method 300 then includes step 310 of moving the spindle out of the visual path of the downward-facing camera when the downward-facing camera is directed at the placement position. This can be achieved, for example, by rotating the spindle hingedly with respect to the carriage and / or moving the spindle along a spindle linear bearing with respect to the carriage. The method may then include step 311 of imaging the placement position and normal ambient features on the substrate. The method may then include step 312 of returning the spindle to the visual path of the downward-facing camera.

[0083] Method 300 may then include step 313 of starting the placement stroke of the spindle to begin placing the picked electronic device on the substrate at the placement position. This step 313 may include moving the spindle assembly Z-drive relative to the carriage along the Z-axis, which is perpendicular and orthogonal to the X-axis and Y-axis when the spindle assembly Z-drive is movably coupled to the carriage.

[0084] Method 300 includes step 314 of imaging the outer edge of the electronic device by a downward camera during the placement stroke of the spindle through a transparent spindle body. This may include moving the camera Z drive relative to the carriage along the Z axis to move the downward camera along the Z axis, and / or independently moving the downward camera relative to the carriage along the Z axis relative to the spindle.

[0085] Method 300 may then include step 316 of moving the spindle relative to the spindle assembly Z drive using a piezo stage to finely adjust the positioning of the spindle. For example, step 316 may include finely adjusting the positioning of the spindle using a piezo stage in six axial directions including the X-axis direction, Y-axis direction, Z-axis direction, θ rotation axis direction, α rotation axis direction, and β rotation axis direction. The last step 318 of method 300 may include placing the electronic device on the substrate.

[0086] The method described herein may be provided for placing an electronic device picked up by a nozzle of the described spindle assembly with an accuracy better than 1 micron. Further, the method can include acquiring a single image including the outer shape of the device and the surface of the substrate during the placement stroke using a downward camera, whereby no fiducial or special marks are required on the substrate. Various other advantages can be achieved through the application of the concepts provided herein.

[0087] One of the advantages of the foregoing embodiments is the improved placement accuracy required for next-generation chip design. This is mainly achieved by the fact that steps of the placement process that contribute to placement errors are eliminated. This embodiment uniquely provides closed-loop placement by processing a single image that includes the outer shape of the device and the surface of the substrate during actual placement. Another significant advantage over prior art equipment is that it does not require special fiducial marks on the device or substrate. Rather, the system can be implemented using only known device features and substrate features. This can significantly reduce costs and miniaturize the product.

[0088] Another advantage of the embodiments shown in FIGS. 1 and 2 is the use of two drive systems to achieve improved accuracy. What is unique about this placement process is that the spindle camera is on a positioning system independent of the placement head positioning system. This enables parallel processing and increases the output of the system, especially when using two placement head positioning systems on both sides of the spindle camera positioning system. This makes it possible to perform device picking and device camera imaging in parallel with the placement process, increasing the system output (up to 2 times).

[0089] Also unique about this mechanism is the use of the camera Z drive described herein to move the downward-facing camera in the Z direction. This enables true closed-loop active alignment until the component lands.

[0090] Also, the ability to image the outer shape of the device during the placement cycle may be valuable with only a conventional X, Y, Z, θ positioning system, without a piezo stage. In other words, embodiments that do not have a piezo stage for fine adjustment are also conceivable. However, it has been found that the piezo stage significantly improves placement when there is no precise data on the position of the target on the printed circuit board (PCB) or substrate. In this case, all corrections can be made directly by a more accurate positioning system.

[0091] In various alternative embodiments, it may also be useful to make the glass plate spindle easily replaceable on the placement head drive in order to accommodate various other device sizes. Further, a glass plate spindle without a nozzle can be deployed as a tool for calibrating the upward camera with the downward camera by placing a glass device on the upward camera and simultaneously imaging this glass device using both cameras.

[0092] As previously described, instead of a glass plate, other transparent materials can be used, particularly when light of different wavelengths such as infrared light or X-rays is used for illumination. Further, instead of a separate nozzle attached between two glass plates protruding through the bottom plate, a glass plate with a protruding glass protrusion can be used to show more of the upper surface to the downward camera.

[0093] In the case of the single beam version shown in FIGS. 5A and 5B, the entire spindle assembly can be attached to a hinge, or a horizontal linear bearing, such that after picking or placing the device, the spindle assembly can move out of the path of the downward camera. This allows the downward camera to directly view the substrate without a spindle positioned between them for the highest accuracy in directly imaging the bumps and / or features of the substrate and calculating the actual relationship between the bumps and features of the electronic device and the substrate after the spindle assembly has returned in line with the spindle camera and before the placement process begins.

[0094] In another series of events, as a first step in the placement sequence, the θ drive of the spindle rotates the spindle and thereby the electronic device so that the downward camera can image a corner of the bump pattern on the substrate and calculate the relationship between this bump pattern and visible features on the substrate visible to the downward camera during the placement process.

[0095] The elements of the embodiments are introduced by either the article "a" or "an". The article is intended to mean that there is one or more elements. The terms "including" and "having", as well as their derivatives, are intended to be inclusive such that additional elements other than the recited elements may exist. The conjunction "or" when used with a list of at least two terms is intended to mean any term or combination of terms. The terms "first" and "second" are used to distinguish elements and are not used to indicate a particular order.

[0096] Although the invention has been described in detail in connection with only a limited number of embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions, or equivalent arrangements that heretofore have not been described but that are commensurate with the spirit and scope of the invention. Additionally, while various embodiments of the invention have been described, it is to be understood that aspects of the invention may include only a portion of the described embodiments. Accordingly, the invention is not limited by the foregoing description but is only limited by the appended claims.

Claims

1. An electronic device placement system, comprising: a spindle assembly having a positioning system configured to move between a picking position and a placement position, the spindle assembly including a spindle having a transparent spindle body, the spindle including a nozzle vertically attached to the transparent spindle body; an upward camera configured to image the bottom of an electronic device picked up by the nozzle of the spindle before the placement stroke of the electronic device; a downward camera movable onto the spindle between picking and placing the electronic device by the spindle, the downward camera configured to image an outer edge of the electronic device through the transparent spindle body during the placement stroke of the spindle, the downward camera configured to acquire an image of a surface of a substrate before and / or during the placement stroke; An electronic device placement system.

2. The upward camera is configured to image the bottom of the electronic device simultaneously with imaging of the upper portion of the electronic device by the downward camera. The electronic device placement system according to Claim 1.

3. The upward camera includes an upward lighting system, the downward camera includes a downward lighting system, and the upward lighting system and the downward lighting system are configured to synchronously illuminate during simultaneous imaging of the upward camera and the downward camera of the electronic device. The electronic device placement system according to Claim 2.

4. The system further includes an opening located above the upward camera such that the electronic device can be positioned at a height of the opening during simultaneous imaging of the upward camera and the downward camera of the electronic device. The electronic device placement system according to Claim 3.

5. The spindle is configured to move out of the visual path of the downward camera when the downward camera is directed towards the placement position. The electronic device placement system according to Claim 1.

6. The spindle assembly and the downward camera are attached to a carriage of the positioning system, and the spindle is configured to be movable relative to the downward camera by at least one degree of freedom. The electronic device placement system according to claim 1.

7. A camera Z drive operably attached to the downward-facing camera, the camera Z drive being movably coupled to a carriage and configured to move relative to the carriage in a vertical direction, further comprising a camera Z drive, The spindle assembly includes a spindle assembly Z drive configured to move the spindle assembly relative to the carriage along a vertical direction, the upward-facing camera being movable independently of the carriage with respect to the Z axis with respect to the spindle assembly. The electronic device placement system according to claim 6.

8. Further comprising a spindle assembly Z drive and a piezo stage movably coupled between the spindle assembly Z drive and the spindle, the piezo stage being configured to move the spindle relative to the spindle assembly Z drive for fine positioning adjustment of the position of the spindle, the piezo stage being configured to fine position the spindle in six-axis directions including the X-axis direction, Y-axis direction, Z-axis direction, θ rotation axis direction, α rotation axis direction, and β rotation axis direction. The electronic device placement system according to claim 1.

9. The transparent spindle body includes two glass plates, and the spindle includes a θ drive for rotating the nozzle. The electronic device placement system according to claim 1.

10. The electronic device placement system is configured to place the electronic device picked up by the nozzle of the spindle with an accuracy better than 1 micron, the downward-facing camera being configured to acquire a single image including the outer shape of the device and normal features on the surface of the substrate during the placement stroke, thereby eliminating the need for fiducial or special marks on the substrate. The electronic device placement system according to claim 1.

11. A method for placing an electronic device, Moving a spindle assembly provided with a positioning system to a picking position, the spindle assembly including a spindle having a transparent spindle body, the spindle including a nozzle vertically attached to the transparent spindle body. The step of picking up an electronic component using the spindle; Before the placement of the electronic component, the step of imaging the bottom of the electronic component picked up using the spindle with an upward camera; The step of moving the spindle with the electronic component to the placement position; Before and / or during the placement stroke, the step of imaging the surface of the substrate with a downward camera; Using the downward camera movable above the spindle, through the transparent spindle body, during the placement stroke of the spindle, imaging the outer edge of the electronic device; A method for placing an electronic device.

12. The method further includes the step of imaging the bottom of the electronic device using the upward camera simultaneously with the imaging of the upper part of the device by the downward camera. The method according to claim 11.

13. The upward camera includes an upward lighting system, the downward camera includes a downward lighting system, and the method further includes During the simultaneous imaging of the upward camera and the downward camera, the step of synchronously illuminating using the upward lighting system and the downward lighting system. The method according to claim 12.

14. The step of providing an opening located above the upward camera; During the simultaneous imaging of the upward camera and the downward camera of the electronic device, the step of positioning the electronic device at the height of the opening. The method according to claim 13.

15. The method further includes the step of moving the spindle out of the visual path of the downward camera when the downward camera is directed at the placement position. The method according to claim 11.

16. The spindle assembly and the downward camera are attached to the carriage of the positioning system, and the spindle The step of rotationally hinging the spindle around the carriage; At least one of the steps of moving the spindle along a spindle linear bearing relative to the carriage. The method according to claim 11.

17. The positioning system further includes a camera Z drive operably attached to the downward-facing camera, the spindle assembly includes a spindle assembly Z drive movably coupled to the carriage, and the method further comprises moving the camera in a vertical direction using the camera Z drive; moving the spindle in a vertical direction using the spindle assembly Z drive, the movement of the spindle assembly Z drive being independent of the movement of the camera Z drive; The method according to claim 16.

18. The spindle assembly further includes a spindle assembly Z drive and a piezo stage movably coupled between the spindle assembly Z drive and the spindle, and the method further comprises moving the spindle relative to the spindle assembly Z drive using the piezo stage to finely adjust the positioning of the spindle, the piezo stage being movably coupled between the spindle assembly Z drive and the spindle; finely adjusting the positioning of the spindle in six axial directions including the X-axis direction, Y-axis direction, Z-axis direction, θ-rotation axis direction, α-rotation axis direction, and β-rotation axis direction using the piezo stage. The method according to claim 11.

19. The transparent spindle body includes two glass plates, the spindle includes a θ drive for rotating the spindle and the nozzle, and the method further comprises rotating the spindle and the nozzle using the θ drive. The method according to claim 10.

20. placing the electronic device picked up by the nozzle of the spindle with an accuracy better than 1 micron; acquiring, using the downward-facing camera, a single image including the outer shape of the device and the normal features of the surface of the substrate during the placement stroke, thereby eliminating the need for fiducial or special marks on the substrate. The method according to claim 11.

Images