High-precision Scanning Electron Microscope Image Contour Extraction Method, Device and Equipment

Abstract

The present application provides a method, apparatus, electronic device, and computer-readable storage medium for extracting a high-precision scanning electron microscope image contour. The method includes: when collecting a plurality of scanning electron microscope images of a plurality of detected positions, aligning the plurality of scanning electron microscope images with a design layout respectively to generate an alignment result; extracting a first scanning electron microscope image contour of each scanning electron microscope image based on the alignment result; comparing each first scanning electron microscope image contour with the design layout to generate a comparison result; adjusting each first scanning electron microscope image contour based on the comparison result to generate a plurality of second scanning electron microscope image contours; and averaging all the second scanning electron microscope image contours to generate a third scanning electron microscope image contour. The present application can effectively improve the accuracy of the scanning electron microscope image contour.

Description

Technical Field

[0001] This application relates to the field of image contour extraction, and particularly to a method, apparatus, electronic device, and computer-readable storage medium for extracting high-precision scanning electron microscope image contours.

Background Art

[0002] In the manufacturing process of semiconductor integrated circuits, it is necessary to scan a silicon wafer multiple times to generate a large number of scanning electron microscope (SEM) images, and analyze the SEM images to timely judge and evaluate each process in the manufacturing stage. Performing contour extraction on the obtained SEM images is very widely applied in semiconductor defect detection, important dimension measurement, and modeling and optimization of the optical proximity correction (OPC) model.

[0003] As shown in FIG. 1, a conventional high-precision contour extraction solution takes one SEM picture with a large field of view (FOV) and including a repeating pattern, cuts out multiple small block SEM pictures including the same pattern from the SEM picture, performs alignment between all the small block SEM pictures based on the picture information, averages all the aligned SEM pictures to obtain one high-resolution SEM picture, and extracts a high-precision contour from the high-resolution SEM picture.

[0004] However, in such a method, the range for taking the SEM picture is limited to the area including a large number of repeating patterns on the silicon wafer, and in the area with almost no repeating pattern, it is impossible to extract a high-precision contour using this method. Also, the high-precision contours obtained by the prior art cannot meet the requirements of OPC model training.

[0005] Therefore, how to improve the accuracy of the scanning electron microscope image contour is an urgent problem to be solved by those skilled in the art.

Summary of the Invention

[0006] An object of the present application is to provide a high-precision scanning electron microscope image contour extraction method, apparatus, electronic device, and computer-readable storage medium that can effectively improve the accuracy of the scanning electron microscope image contour.

[0007] According to a first aspect of the present application, when collecting a plurality of scanning electron microscope images of a plurality of detected positions, aligning the plurality of scanning electron microscope images with a design layout respectively to generate an alignment result, where all the plurality of detected positions include the same pattern, and the plurality of detected positions correspond one-to-one to the plurality of scanning electron microscope images, and extracting a first scanning electron microscope image contour of each scanning electron microscope image based on the alignment result, and comparing each first scanning electron microscope image contour with the design layout to generate a comparison result, and adjusting each first scanning electron microscope image contour based on the comparison result to generate a plurality of second scanning electron microscope image contours, where the plurality of first scanning electron microscope image contours and the plurality of second scanning electron microscope image contours correspond one-to-one, and averaging all the second scanning electron microscope image contours to generate a third scanning electron microscope image contour, and providing a high-precision scanning electron microscope image contour extraction method including the above steps.

[0008] Optionally, the step of averaging the second scanning electron microscope image contours to generate a third scanning electron microscope image contour includes determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, and determining the positions of the plurality of detection points in each second scanning electron microscope image contour, and calculating an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the same position and the detection point of all the second scanning electron microscope image contours, and Calculating the average value of all offset amounts in the X direction and / or the average value of all offset amounts in the Y direction; Determining the positions of high-precision contour points based on the average value of all offset amounts in the X direction and / or the average value of all offset amounts in the Y direction; Connecting all high-precision contour points based on the design layout to generate a third scanning electron microscope image contour.

[0009] Optionally, the plurality of detected positions are obtained by one or more of the field of view range included in the scanning electron microscope image, the chip range, and the mask plate range.

[0010] Optionally, when collecting a plurality of scanning electron microscope images of a plurality of detected positions, the step of aligning the plurality of scanning electron microscope images with the design layout respectively and generating an alignment result includes: When collecting a plurality of scanning electron microscope images of a plurality of detected positions, extracting a fourth scanning electron microscope image contour of each scanning electron microscope image; Adjusting the fourth scanning electron microscope image contour based on the scanning electron microscope image to generate a fifth scanning electron microscope image contour; Converting the fifth scanning electron microscope image contour into a fifth scanning electron microscope image contour in the same format as the design layout; Aligning the converted fifth scanning electron microscope image contour with a preset original design layout to obtain an alignment result.

[0011] Optionally, the step of extracting a first scanning electron microscope image contour of each scanning electron microscope image based on the alignment result includes: Adjusting the fifth scanning electron microscope image contour based on the alignment result to generate a first scanning electron microscope image contour; Extracting each first scanning electron microscope image contour.

[0012] Optionally, the step of comparing each first scanning electron microscope image contour with the design layout and generating a comparison result includes: determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image; determining the positions of the plurality of detection points in each first scanning electron microscope image contour; calculating an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the position of each first scanning electron microscope image contour and the detection point; calculating an average value of all the offset amounts in the X direction and / or an average value of all the offset amounts in the Y direction; generating a comparison result based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction.

[0013] Optionally, after averaging all the second scanning electron microscope image contours to generate a third scanning electron microscope image contour, the method further includes: calculating a key size including at least one of the line width and the aperture size of the third scanning electron microscope image contour based on the third scanning electron microscope image contour; performing model training for optical proximity effect correction based on the key size.

[0014] Optionally, the step of aligning the converted fifth scanning electron microscope image contour with a preset original design layout to obtain an alignment result includes: aligning the converted fifth scanning electron microscope image contour with a preset original design layout, and obtaining an alignment result based on a preset graphic similarity index used to represent the degree of alignment between the fifth scanning electron microscope image contour and the design layout.

[0015] Optionally, after aligning the converted fourth scanning electron microscope image contour with a preset original design layout to obtain an alignment result, the method further includes: It includes the step of performing automatic measurement based on the alignment result to obtain an automatic measurement result.

[0016] According to the second aspect of the present application, when collecting a plurality of scanning electron microscope images of a plurality of detected positions, align each of the plurality of scanning electron microscope images with a design layout to generate an alignment result, where all of the plurality of detected positions include the same pattern, and the plurality of detected positions correspond one-to-one with the scanning electron microscope images, an alignment module, a first extraction module that extracts a first scanning electron microscope image contour of each scanning electron microscope image based on the alignment result, a comparison module that compares each first scanning electron microscope image contour with the design layout to generate a comparison result, a first adjustment module that adjusts each first scanning electron microscope image contour based on the comparison result to generate a plurality of second scanning electron microscope image contours, where the plurality of first scanning electron microscope image contours and the plurality of second scanning electron microscope image contours correspond one-to-one, a generation module that averages all the second scanning electron microscope image contours to generate a third scanning electron microscope image contour, and provides a high-precision scanning electron microscope image contour extraction device.

[0017] Optionally, the generation module determines a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, determines the positions of the plurality of detection points in each second scanning electron microscope image contour, calculates an offset amount including the offset amount in the X direction and / or the offset amount in the Y direction between the same position and the detection point of all the second scanning electron microscope image contours, calculates the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction, determines the position of a high-precision contour point based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction, It is used to connect all high-precision contour points based on the design layout to generate a third scanning electron microscope image contour.

[0018] Optionally, a plurality of detected positions are obtained by one or more of a field of view range included in a scanning electron microscope image, a chip range, and a mask plate range.

[0019] Optionally, the alignment module When collecting a plurality of scanning electron microscope images of a plurality of detected positions, extract a fourth scanning electron microscope image contour of each scanning electron microscope image, Convert the fourth scanning electron microscope image contour into a fourth scanning electron microscope image contour in the same format as the design layout, It is used to align the converted fourth scanning electron microscope image contour with a preset original design layout to obtain an alignment result.

[0020] Optionally, the first extraction module Adjust the fourth scanning electron microscope image contour based on the scanning electron microscope image, Adjust the adjusted fourth scanning electron microscope image contour based on the alignment result to generate a first scanning electron microscope image contour, It is used to extract each first scanning electron microscope image contour.

[0021] Optionally, the comparison module Determine a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, Determine the positions of a plurality of detection points in each first scanning electron microscope image contour, Calculate an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the position of each first scanning electron microscope image contour and the detection point, Calculate an average value of all offset amounts in the X direction and / or an average value of all offset amounts in the Y direction, It is used to generate a comparison result based on the average value of all offset amounts in the X direction and / or the average value of all offset amounts in the Y direction.

[0022] Optionally, the apparatus a calculation module that calculates a key size including at least one of the line width and the aperture length of the third scanning electron microscope image contour based on the third scanning electron microscope image contour; a training module that performs model training for optical proximity effect correction based on the key size.

[0023] Optionally, the alignment module aligns the converted fifth scanning electron microscope image contour with a preset original design layout, and is used to represent the degree of alignment between the fifth scanning electron microscope image contour and the design layout, and obtains an alignment result based on a preset graphic similarity index.

[0024] Optionally, the apparatus further includes a measurement module that performs an automatic measurement based on the alignment result and obtains an automatic measurement result.

[0025] According to a third aspect of the present application, there is provided an electronic device including a processor, a memory, and a program or instruction stored in the memory and executable by the processor. When the program or instruction is executed by the processor, the steps of the high-precision scanning electron microscope image contour extraction method shown in the first aspect are realized.

[0026] According to a fourth aspect of the present application, there is provided a readable storage medium in which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps of the high-precision scanning electron microscope image contour extraction method shown in the first aspect are realized.

[0027] In this application, when collecting multiple scanning electron microscope images of multiple detected positions, after aligning each of the multiple scanning electron microscope images with the design layout to generate an alignment result, based on the alignment result, the first scanning electron microscope image contour of each scanning electron microscope image is extracted, each first scanning electron microscope image contour is compared with the design layout to generate a comparison result, based on the comparison result, each first scanning electron microscope image contour is adjusted to generate a plurality of second scanning electron microscope image contours, all the second scanning electron microscope image contours are averaged to generate a third scanning electron microscope image contour. In this application, after extracting the first scanning electron microscope image contour based on the alignment result, each first scanning electron microscope image contour is compared with the design layout, and each scanning electron microscope image is adjusted based on the first comparison result to form a plurality of second scanning electron microscope images. Here, after the plurality of second scanning electron microscope images constitute one complete second scanning electron microscope image, all the second scanning electron microscope images are averaged to generate a third scanning electron microscope image contour. In this application, the accuracy of the scanning electron microscope image contour can be effectively improved.

Brief Description of the Drawings

[0028] To more clearly explain the specific embodiments of this application or the technical solutions in the prior art, the drawings that need to be used in the following description of the specific embodiments or the prior art will be briefly described. Obviously, the drawings in the following description are some embodiments of this application, and those skilled in the art can also obtain other drawings based on these drawings without creative labor.

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Figure 8

Embodiments for Carrying out the Invention

[0029] In order to make the above and other features and advantages of the present application clearer, the present application will be further described below with reference to the drawings. It should be understood that the specific examples provided in this specification are for the purpose of explaining to those skilled in the art, and are merely illustrative and not limiting.

[0030] In the following description, many specific details will be described in order to provide a complete understanding of the present application. However, it is obvious to those skilled in the art that it is not necessary to use specific details to implement the present application. In other cases, well-known steps or services are not described in detail in order to avoid obscuring the present application.

[0031] As can be seen from the content of the background art section, the high-precision contour extraction scheme of the prior art is limited to the area where the range of SEM image shooting includes a large number of repetitive patterns in the silicon wafer, and in the area where there are almost no repetitive patterns, this method cannot be used to extract high-precision contours. In addition, the high-precision contours obtained by the prior art cannot meet the requirements of OPC model training.

[0032] To solve the above problems, the present application provides a high-precision scanning electron microscope image contour extraction method, apparatus, electronic device, and computer-readable storage medium. Hereinafter, with reference to the drawings, a high-precision scanning electron microscope image contour extraction method according to the present application will be described in detail by way of specific embodiments and their application scenarios.

[0033] As shown in FIG. 2, the present application provides a high-precision scanning electron microscope image contour extraction method, which can include the following steps.

[0034] In step S11, when a plurality of scanning electron microscope images of a plurality of detected positions are collected, the plurality of scanning electron microscope images are respectively aligned with a design layout to generate an alignment result. The plurality of detected positions all include the same pattern, and the plurality of detected positions correspond one-to-one with the plurality of scanning electron microscope images.

[0035] In an alternative embodiment, step S11 includes when a plurality of scanning electron microscope images of a plurality of detected positions are collected, extracting the fourth scanning electron microscope image contour of each scanning electron microscope image; adjusting the fourth scanning electron microscope image contour based on the scanning electron microscope image to generate a fifth scanning electron microscope image contour; converting the fifth scanning electron microscope image contour into a fifth scanning electron microscope image contour in the same format as the design layout; and aligning the converted fifth scanning electron microscope image contour with a preset original design layout to obtain an alignment result.

[0036] Specifically, in this application, as shown in FIGS. 3 and 4, first, positions including a plurality of same patterns in the silicon wafer are determined, and then, images are taken at these positions including the same patterns respectively to obtain a plurality of scanning electron microscope images (see FIG. 3). After that, the fourth scanning electron microscope image contour of each scanning electron microscope image is extracted, and all the extracted fourth scanning electron microscope image contours are preliminarily adjusted based on the scanning electron microscope images to generate a fifth scanning electron microscope image contour. Then, the fifth scanning electron microscope image contour is converted into a fifth scanning electron microscope image contour in the same format as the design layout, that is, after converting the format of the fifth scanning electron microscope image contour and the format of the design layout into the same format, the two can be aligned. Then, the converted fifth scanning electron microscope image contour is aligned with the design layout to obtain an alignment result (see FIG. 4). In this application, two adjustments are adopted, that is, the fourth scanning electron microscope image contour is first preliminarily adjusted based on the scanning electron microscope image, and then, the fourth scanning electron microscope image contour after preliminary adjustment (that is, the fifth scanning electron microscope image contour) is readjusted by using the design layout, so as to quickly realize the rough alignment between the scanning electron microscope image and the design layout, and accurately extract the fifth scanning electron microscope image contour.

[0037] Note that the format of the fifth scanning electron microscope image contour may be the GDS format / OASIS format.

[0038] In one selectable embodiment, the plurality of detected positions are obtained by one or more of the field of view range, the chip range, and the mask plate range included in the scanning electron microscope image.

[0039] In this embodiment, the method of performing contour extraction on the scanning electron microscope image based on the design layout does not have high requirements for the quality of the image. Therefore, the used scanning electron microscope images do not need to be cut out from the scanning electron microscope images with the same large field of view, and these images can be derived from the ranges of different chips and / or mask plates.

[0040] Note that the viewing range may be the size of the viewing field, the chip range may be the size of the chip, and the mask plate range may be the size of the mask plate.

[0041] Note that the viewing range may be smaller than the chip range and may also be smaller than the mask plate range.

[0042] In one selectable embodiment, even in a region that does not contain a large number of repeating patterns on the same silicon wafer, such as a Logic region, a position containing a plurality of the same patterns can be found using a pattern match algorithm, and a scanning electron microscope image can be taken at each of these positions. Therefore, this application greatly expands the applicable range of the high-precision scanning electron microscope image contour extraction method.

[0043] In one selectable embodiment, the step of aligning the fifth scanning electron microscope image contour after conversion with a preset original design layout to obtain an alignment result is aligning the fifth scanning electron microscope image contour after conversion with a preset original design layout, and obtaining an alignment result based on a preset graphic similarity index used to represent the degree of alignment between the fifth scanning electron microscope image contour and the design layout.

[0044] In one selectable embodiment, after aligning the fourth scanning electron microscope image contour after conversion with a preset original design layout to obtain an alignment result, the method further includes the step of performing automatic measurement based on the alignment result to obtain an automatic measurement result.

[0045] In step S13, the first scanning electron microscope image contour of each scanning electron microscope image is extracted based on the alignment result.

[0046] In one selectable embodiment, the step of extracting the first scanning electron microscope image contour of each scanning electron microscope image based on the alignment result includes: adjusting the fifth scanning electron microscope image contour based on the alignment result to generate the first scanning electron microscope image contour; and extracting each first scanning electron microscope image contour.

[0047] In this embodiment, after obtaining the comparison result, the fifth scanning electron microscope image contour is adjusted based on the comparison result to generate the first scanning electron microscope image contour, and then each first scanning electron microscope image contour is extracted.

[0048] In step S15, each first scanning electron microscope image contour is compared with the design layout to generate a comparison result.

[0049] In one selectable embodiment, step S15 includes: determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image; determining the positions of the plurality of detection points in each first scanning electron microscope image contour; calculating an offset amount including the offset amount in the X direction and / or the offset amount in the Y direction between the position of each first scanning electron microscope image contour and the detection point; calculating the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction; and generating a comparison result based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction.

[0050] In this embodiment, referring to FIG. 5, since the format of the first scanning electron microscope image contour is adjusted as described above, that is, adjusted to the GDS format / OASIS format, the deviation value between each first scanning electron microscope image contour and the design layout can be directly calculated. Here, after determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, the positions of the corresponding detection points in each first scanning electron microscope image are sequentially found, and then, it is necessary to calculate the offset amount between the position of the corresponding detection point of each first scanning electron microscope image contour and the detection point. Here, the offset amount includes the offset amount in the X direction and / or the offset amount in the Y direction. In this step, the offset amount of each first scanning electron microscope image can be accurately found. Then, the average value of the X direction offset amounts of all the first scanning electron microscope images and / or the average value of the Y direction offset amounts of all the first scanning electron microscope images are calculated, and a comparison result is generated based on the average value of the X direction offset amounts of all the first scanning electron microscope images and / or the average value of the Y direction offset amounts of all the first scanning electron microscope images.

[0051] Note that the above offset amount may be an edge placement error index. Here, the edge placement error index can represent the error between the edge of the simulated post-exposure photoresist pattern and the edge of the design pattern, and can evaluate the similarity between the two contours.

[0052] In step S17, each first scanning electron microscope image contour is adjusted based on the comparison result to generate a plurality of second scanning electron microscope image contours, and the plurality of first scanning electron microscope image contours and the plurality of second scanning electron microscope image contours correspond one-to-one.

[0053] Specifically, in the present application, as shown in FIG. 6, after obtaining the above comparison result, each first scanning electron microscope image contour is adjusted based on the comparison result, that is, each first scanning electron microscope image contour is adjusted based on the calculated average value in the X direction and / or the average value in the Y direction to obtain a second scanning electron microscope image contour, thereby realizing accurate alignment between the second scanning electron microscope image contour and the design layout contour.

[0054] In step S19, all the second scanning electron microscope image contours are averaged to generate a third scanning electron microscope image contour.

[0055] In one selectable embodiment, all the second scanning electron microscope image contours can be averaged using an edge placement error algorithm to generate a third scanning electron microscope image contour.

[0056] In one selectable embodiment, step S19 includes: determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image; identifying the positions of the plurality of detection points in the second scanning electron microscope image contour; calculating an offset amount including the offset amount in the X direction and / or the offset amount in the Y direction between the same position of all the second scanning electron microscope image contours and the detection points; calculating the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction; determining the positions of high-precision contour points based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction; connecting all the high-precision contour points based on the design layout to generate a third scanning electron microscope image contour.

[0057] In this embodiment, as shown in FIG. 6, the left figure is the second scanning electron microscope contour, and the right figure is the third scanning electron microscope contour. Here, the second scanning electron microscope image contour includes a plurality of first scanning electron microscope image contours. After determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, the positions of the corresponding detection points in each scanning electron microscope image contour in the second scanning electron microscope image are sequentially found, and then it is necessary to calculate the offset amount between the position of the corresponding detection point in each first scanning electron microscope image contour and the detection point. Here, the offset amount includes the offset amount in the X direction and / or the offset amount in the Y direction. In this step, the offset amount of each first scanning electron microscope image is accurately found, and the position of the high-precision contour point can be determined based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction.

[0058] For example, the second scanning electron microscope image contour includes three first scanning electron microscope image contours. The coordinate position of one detection point determined in the design layout is (1, 2), and the coordinates of the positions corresponding to the three first scanning electron microscope image contours and the detection point are (2, 7), (6, 7), and (4, 4) respectively. The average value of the offset amounts in the X direction is 3, and the average value of the offset amounts in the Y direction is 4. Therefore, the coordinate position (3, 4) becomes the final high-precision contour point. Finally, each determined high-precision contour point is connected to obtain the third scanning electron microscope image contour, that is, the high-precision contour.

[0059] In an alternative embodiment, after averaging all the second scanning electron microscope image contours to generate the third scanning electron microscope image contour, the method further includes calculating a key size including at least one of the line width and the aperture size of the third scanning electron microscope image contour based on the third scanning electron microscope image contour; and performing model training for optical proximity effect correction based on the key size.

[0060] As shown in FIG. 7, in one selectable embodiment, the present application provides a method for extracting the contour of a high-precision scanning electron microscope image, and the method includes: selecting a plurality of positions in the silicon wafer that contain the same pattern (i.e., the above-mentioned pattern); respectively taking SEM images (i.e., the above-mentioned scanning electron microscope images) at the selected positions; aligning all the SEM images with the design layout; extracting the accurate GDS contour of all the SEM images based on the design layout; further aligning the GDS contour of the SEM images with the design layout by using EPE (i.e., the above-mentioned edge placement error algorithm); averaging the aligned GDS contour by using EPE (i.e., the above-mentioned edge placement error algorithm) to obtain a high-precision contour.

[0061] In one selectable embodiment, when high-precision contours are derived from different layers, the information of the multi-layer design layout is utilized to quickly and automatically realize the alignment of high-precision contours between different layers, generate an alignment result, and analyze the alignment result to obtain the alignment situation of the actual patterns between different layers. After effectively feeding back, the alignment effect between layers in the photolithography process can be improved, and the photolithography process level can be enhanced.

[0062] As described above, in the present application, the information of the design layout is introduced to align the scanning electron microscope images, avoiding directly aligning the scanning electron microscope images with each other. It is only necessary to align all the extracted scanning electron microscope image contours with the design layout respectively, which can effectively improve the efficiency of aligning the scanning electron microscope images.

[0063] In addition, in this application, the edge placement error algorithm is used to perform a second fine alignment on the scanning electron microscope image contour, which can further improve the accuracy of the alignment of the scanning electron microscope image and the accuracy of the contour extraction.

[0064] In addition, in this application, the method of performing contour extraction on the scanning electron microscope image based on the design layout does not have high requirements for the quality of the image. Therefore, the scanning electron microscope pictures used do not need to be cut out from the scanning electron microscope pictures with the same large field of view. These pictures are derived from different shots or Dies, and the applicable range of the high-precision scanning electron microscope image contour extraction method can be greatly improved.

[0065] As shown in FIG. 8, in one selectable embodiment, this application provides a high-precision scanning electron microscope image contour extraction device, and the device includes When collecting a plurality of scanning electron microscope images of a plurality of detected positions, aligning the plurality of scanning electron microscope images with the design layout respectively to generate an alignment result. The plurality of detected positions all include the same pattern, and the plurality of detected positions are in one-to-one correspondence with the scanning electron microscope images. An alignment module 81, A first extraction module 82 for extracting the first scanning electron microscope image contour of each scanning electron microscope image based on the alignment result, A comparison module 83 for comparing each first scanning electron microscope image contour with the design layout to generate a comparison result, A first adjustment module 84 for adjusting each first scanning electron microscope image contour based on the comparison result to generate a plurality of second scanning electron microscope image contours. The plurality of first scanning electron microscope image contours and the plurality of second scanning electron microscope image contours are in one-to-one correspondence, A generation module 85 for averaging all the second scanning electron microscope image contours to generate a third scanning electron microscope image contour.

[0066] Optionally, the generation module 85 Determine a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, Determine the positions of the plurality of detection points in each second scanning electron microscope image contour, Calculate an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the detection points at the same position of all the second scanning electron microscope image contours, Calculate an average value of all the offset amounts in the X direction and / or an average value of all the offset amounts in the Y direction, Determine the position of the high-precision contour point based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction, It is used to connect all the high-precision contour points based on the design layout to generate a third scanning electron microscope image contour.

[0067] Optionally, the plurality of detected positions are obtained by one or more of the viewing range included in the scanning electron microscope image, the chip range, and the mask plate range.

[0068] Optionally, the alignment module 81 When collecting a plurality of scanning electron microscope images of a plurality of detected positions, extract a fourth scanning electron microscope image contour of each scanning electron microscope image, Convert the fourth scanning electron microscope image contour into a fourth scanning electron microscope image contour in the same format as the design layout, Align the converted fourth scanning electron microscope image contour with a preset original design layout to obtain an alignment result, and is used for this purpose.

[0069] Optionally, the first extraction module 82 Adjust the fourth scanning electron microscope image contour based on the scanning electron microscope image, Adjust the adjusted fourth scanning electron microscope image contour based on the alignment result to generate a first scanning electron microscope image contour, It is used to extract each first scanning electron microscope image contour.

[0070] Optionally, the comparison module 83 determines a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, determines the positions of the plurality of detection points in each first scanning electron microscope image contour, calculates an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the position of each first scanning electron microscope image contour and the detection point, calculates an average value of all the offset amounts in the X direction and / or an average value of all the offset amounts in the Y direction, and is used to generate a comparison result based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction.

[0071] Optionally, the apparatus further includes a calculation module that calculates a key size including at least one of the line width and the aperture size of the third scanning electron microscope image contour based on the third scanning electron microscope image contour, and a training module that performs model training for optical proximity effect correction based on the key size.

[0072] Optionally, the alignment module 81 aligns the transformed fifth scanning electron microscope image contour with a preset original design layout, and is used to obtain an alignment result based on a preset graphic similarity index for representing the degree of alignment between the fifth scanning electron microscope image contour and the design layout.

[0073] Optionally, the apparatus further includes a measurement module that performs an automatic measurement based on the alignment result and obtains an automatic measurement result.

[0074] It should be understood that all or part of each module / unit of the device of the present application can be implemented by software, hardware, firmware, or a combination thereof. Each module / unit may be embedded in the processor of the electronic device in the form of hardware or firmware respectively, or may be independent of the processor, and may be stored in the memory of the electronic device in the form of software and called by the processor to execute the services of each module / unit. Each module / unit may be implemented as an independent component or module respectively, or two or more modules / units may be implemented as a single component or module.

[0075] In one embodiment, an electronic device including a memory and a processor is provided, wherein the memory stores computer instructions executable by the processor, and when the computer instructions are executed by the processor, the processor is instructed to execute each step of the method of the present application. The electronic device may be a server, a terminal, or any other electronic device having the required computing and / or processing capabilities in a broad sense. In one embodiment, the electronic device may include a processor, a memory, a network interface, a communication interface, etc. connected via a system bus. The processor of the electronic device can provide the required computing, processing, and / or control capabilities. The memory of the electronic device may include a non-volatile storage medium and an internal memory. The service system, computer program, etc. may be stored in the non-volatile storage medium. The internal memory may be an execution environment for the service system and computer program in the non-volatile storage medium. The network interface and communication interface of the electronic device are used to connect and communicate with external devices via a network.

[0076] This application can be implemented as a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps of the method of this application are executed. In one embodiment, the computer program is distributed among a plurality of electronic devices or processors connected to a network, whereby the computer program is stored, accessed, and executed in a distributed manner by one or more electronic devices or processors. A single method step / service, or two or more method steps / services, may be executed by a single electronic device or processor, or by two or more electronic devices or processors. One or more method steps / services may be executed by one or more electronic devices or processors, and one or more other method steps / services may be executed by one or more other electronic devices or processors. One or more electronic devices or processors may execute a single method step / service, or may execute two or more method steps / services.

[0077] As can be understood by those skilled in the art, the steps of the method of this application can be instructed to be completed by related hardware, such as an electronic device or a processor, by a computer program. The computer program may be stored in a non-transitory computer-readable storage medium, and when the computer program is executed, the steps of the method of this application are executed. In some cases, any reference to memory, storage, database, or other media in this specification may include non-volatile memory and / or volatile memory. Examples of non-volatile memory include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, magnetic tape, flexible disk, magneto-optical data storage device, optical data storage device, hard disk, solid state disk, etc. Examples of volatile memory include random access memory (RAM), external cache memory, etc.

[0078] Each of the above-described technical features can be arbitrarily combined. Although not described for all possible combinations of these technical features, any combination of these technical features should be considered to be included in this specification as long as such a combination is not contradictory.

[0079] The present application has been described with reference to the embodiments, but those skilled in the art should understand that the above description and drawings are merely illustrative and not limiting, and the present application is not limited to the disclosed embodiments. Various changes and modifications are possible without departing from the gist of the present application.

Claims

1. When collecting a plurality of scanning electron microscope images of a plurality of detected positions, aligning each of the plurality of scanning electron microscope images with a design layout to generate an alignment result, where all of the plurality of detected positions include the same pattern, and the plurality of detected positions correspond one-to-one with the plurality of scanning electron microscope images; extracting a first scanning electron microscope image contour of each of the scanning electron microscope images based on the alignment result; comparing each of the first scanning electron microscope image contours with the design layout to generate a comparison result; adjusting each of the first scanning electron microscope image contours based on the comparison result to generate a plurality of second scanning electron microscope image contours, where the plurality of first scanning electron microscope image contours and the plurality of second scanning electron microscope image contours correspond one-to-one; averaging all of the second scanning electron microscope image contours to generate a third scanning electron microscope image contour. A high-precision method for extracting a scanning electron microscope image contour is characterized by including the above steps.

2. The step of averaging all of the second scanning electron microscope image contours to generate a third scanning electron microscope image contour includes: determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image; determining the positions of the plurality of detection points in each of the second scanning electron microscope image contours; calculating an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the same position of all of the second scanning electron microscope image contours and the detection points; calculating an average value of all of the offset amounts in the X direction and / or an average value of all of the offset amounts in the Y direction; determining the positions of high-precision contour points based on the average value of all of the offset amounts in the X direction and / or the average value of all of the offset amounts in the Y direction; connecting all of the high-precision contour points based on the design layout to generate the third scanning electron microscope image contour. The high-precision method for extracting a scanning electron microscope image contour according to Claim 1 is characterized by including the above steps.

3. The plurality of detected positions are obtained by one or more of the field of view range, the chip range, and the mask plate range included in the scanning electron microscope image. The high-precision scanning electron microscope image contour extraction method according to claim 1.

4. When collecting a plurality of scanning electron microscope images of a plurality of detected positions, the step of aligning each of the plurality of scanning electron microscope images with a design layout and generating an alignment result is as follows: When collecting the plurality of scanning electron microscope images of the plurality of detected positions, the step of extracting a fourth scanning electron microscope image contour of each scanning electron microscope image; Adjusting the fourth scanning electron microscope image contour based on the scanning electron microscope image to generate a fifth scanning electron microscope image contour; Converting the fifth scanning electron microscope image contour into the fifth scanning electron microscope image contour in the same format as the design layout; Aligning the converted fifth scanning electron microscope image contour with a preset original design layout to obtain the alignment result. The high-precision scanning electron microscope image contour extraction method according to claim 1.

5. Based on the alignment result, the step of extracting a first scanning electron microscope image contour of each scanning electron microscope image is as follows: Adjusting the fifth scanning electron microscope image contour based on the alignment result to generate the first scanning electron microscope image contour; Extracting each of the first scanning electron microscope image contours. The high-precision scanning electron microscope image contour extraction method according to claim 4.

6. The step of comparing each of the first scanning electron microscope image contours with the design layout and generating a comparison result is as follows: Determining a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image; Determining the positions of the plurality of detection points in each of the first scanning electron microscope image contours; Calculating an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the position of each of the first scanning electron microscope image contours and the detection point; Calculating an average value of all the offset amounts in the X direction and / or an average value of all the offset amounts in the Y direction. generating a comparison result based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction, characterized in that the method for extracting a high-precision scanning electron microscope image contour according to claim 1 includes this step.

7. After the step of averaging all the second scanning electron microscope image contours to generate a third scanning electron microscope image contour, the method further includes calculating a key size including at least one of the line width and the aperture size of the third scanning electron microscope image contour based on the third scanning electron microscope image contour, performing model training for optical proximity effect correction based on the key size, characterized in that the method for extracting a high-precision scanning electron microscope image contour according to claim 1 includes these steps.

8. The step of aligning the fifth scanning electron microscope image contour after transformation with a preset original design layout to obtain an alignment result aligns the fifth scanning electron microscope image contour after transformation with the preset original design layout, and includes the step of obtaining the alignment result based on a preset figure similarity index used to represent the degree of alignment between the fifth scanning electron microscope image contour and the design layout, characterized in that the method for extracting a high-precision scanning electron microscope image contour according to claim 4 includes this step.

9. After the step of aligning the fourth scanning electron microscope image contour after transformation with a preset original design layout to obtain an alignment result, the method further includes performing an automatic measurement based on the alignment result to obtain an automatic measurement result, characterized in that the method for extracting a high-precision scanning electron microscope image contour according to claim 4 includes this step.

10. When collecting a plurality of scanning electron microscope images of a plurality of detected positions, an alignment module that aligns each of the plurality of scanning electron microscope images with a design layout to generate an alignment result, wherein the plurality of detected positions all include the same pattern, and the plurality of detected positions are in one-to-one correspondence with the scanning electron microscope images, a first extraction module that extracts a first scanning electron microscope image contour of each of the scanning electron microscope images based on the alignment result, a comparison module that compares each of the first scanning electron microscope image contours with the design layout to generate a comparison result Based on the comparison results, adjust each of the first scanning electron microscope image contours to generate a plurality of second scanning electron microscope image contours, and a first adjustment module in which the plurality of first scanning electron microscope image contours and the plurality of second scanning electron microscope image contours correspond one-to-one, A generation module that averages all of the second scanning electron microscope image contours to generate a third scanning electron microscope image contour, a high-precision scanning electron microscope image contour extraction device.

11. The generation module is Determine a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, Determine the positions of the plurality of detection points in each of the second scanning electron microscope image contours, Calculate an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the same position of all the second scanning electron microscope image contours and the detection points, Calculate an average value of all the offset amounts in the X direction and / or an average value of all the offset amounts in the Y direction, Based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction, determine the position of a high-precision contour point, Connect all the high-precision contour points based on the design layout to generate the third scanning electron microscope image contour, and is used for the high-precision scanning electron microscope image contour extraction device according to claim 10.

12. The plurality of detected positions are obtained by one or more of a viewing range, a chip range, and a mask plate range included in the scanning electron microscope image, and the high-precision scanning electron microscope image contour extraction device according to claim 10.

13. The alignment module is When collecting the plurality of scanning electron microscope images of the plurality of detected positions, extract a fourth scanning electron microscope image contour of each of the scanning electron microscope images, Adjust the fourth scanning electron microscope image contour based on the scanning electron microscope image to generate a fifth scanning electron microscope image contour, Convert the fifth scanning electron microscope image contour into the fifth scanning electron microscope image contour in the same format as the design layout, The high-precision scanning electron microscope image contour extraction device according to claim 10, wherein the converted fifth scanning electron microscope image contour is aligned with a preset original design layout to obtain the alignment result.

14. The first extraction module adjusts the fifth scanning electron microscope image contour based on the alignment result to generate the first scanning electron microscope image contour, and is used to extract each of the first scanning electron microscope image contours. The high-precision scanning electron microscope image contour extraction device according to claim 13 is characterized in that.

15. The comparison module determines a plurality of detection points of the design layout based on the pixel size of the scanning electron microscope image, determines the positions of the plurality of detection points in each of the first scanning electron microscope image contours, calculates an offset amount including an offset amount in the X direction and / or an offset amount in the Y direction between the position of each of the first scanning electron microscope image contours and the detection point, calculates an average value of all the offset amounts in the X direction and / or an average value of all the offset amounts in the Y direction, and is used to generate a comparison result based on the average value of all the offset amounts in the X direction and / or the average value of all the offset amounts in the Y direction. The high-precision scanning electron microscope image contour extraction device according to claim 10 is characterized in that.

16. A calculation module that calculates a key size including at least one of the line width and the aperture length of the third scanning electron microscope image contour based on the third scanning electron microscope image contour; and a training module that performs model training for optical proximity effect correction based on the key size. The high-precision scanning electron microscope image contour extraction device according to claim 10 further includes the above features.

17. The alignment module aligns the converted fifth scanning electron microscope image contour with the preset original design layout, and is used to represent the degree of alignment between the fifth scanning electron microscope image contour and the design layout, and obtains the alignment result based on a preset graphic similarity index. The high-precision scanning electron microscope image contour extraction device according to claim 13 is characterized in that.

18. The high-precision scanning electron microscope image contour extraction device according to claim 13, further comprising a measurement module that performs automatic measurement based on the alignment result and obtains an automatic measurement result.

19. comprising a processor and a memory storing computer program instructions, wherein when the processor executes the computer program instructions, the high-precision scanning electron microscope image contour extraction method according to any one of claims 1 to 9 is realized. An electronic device characterized by this.

20. A computer-readable storage medium storing computer program instructions, wherein when the computer program instructions are executed by a processor, the high-precision scanning electron microscope image contour extraction method according to any one of claims 1 to 9 is realized. A computer-readable storage medium characterized by this.

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