Metal layer for dimming light-emitting diode chips

Abstract

A solid-state lighting device is disclosed that includes a light-emitting diode (LED) and a semitransparent metal layer deposited on the LED chip, capable of dimming the light output of the LED chip. The thickness of the semitransparent metal layer can be adjusted based on the desired dimming level. In embodiments, the metal layer is deposited on top of a passivation layer on the LED structure, such that the metal layer is not electrically coupled to the LED. The metal layer can additionally cover the mesa sidewalls of the LED structure. In other embodiments, the metal layer can be titanium, platinum, or other suitable metal. In embodiments, the metal layer can be deposited on the passivation layer, and the length of time the metal layer is deposited can be based on the amount of dimming desired.

Description

[Technical Field]

[0001] This disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs), and more particularly to metal layers that dim the light emitted from the LED chip. [Background technology]

[0002]

[0002] Solid-state lighting devices such as light-emitting diodes (LEDs) are increasingly being used in both consumer and commercial applications. Advances in LED technology have resulted in highly efficient, mechanically robust, and long-life light sources. Modern LEDs are therefore enabling a variety of new display applications and are increasingly being used in general lighting applications, often replacing incandescent and fluorescent light sources.

[0003]

[0003] LEDs are solid-state devices that convert electrical energy into light and typically contain one or more active layers (or active regions) of semiconductor material disposed between oppositely doped n-type and p-type layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer(s), where they recombine to produce light emission, such as visible or ultraviolet light. The active region may be fabricated from, for example, silicon carbide, gallium nitride, gallium phosphide, aluminum nitride, and / or gallium arsenide-based materials, and / or organic semiconductor materials. Photons generated by the active region are emitted in all directions.

[0004] As modern LED technology advances, there is a continuing need for improved LED and solid state lighting devices with desirable lighting characteristics that can overcome the challenges associated with conventional devices. Summary of the Invention [Means for solving the problem]

[0005]

[0005] The present disclosure relates to solid state lighting devices including light emitting diodes (LEDs), and more particularly to a semi-transparent metallic layer that can be deposited on an LED chip and dim the light output of the LED chip. The thickness of the semi-transparent metallic layer can be adjusted based on the desired level of dimming. In embodiments, the metal layer can be deposited on top of a passivation layer on the LED structure, such that the metal layer is not electrically coupled to the LED. The metal layer can additionally cover the mesa sidewalls of the LED structure. In other embodiments, the metal layer can be titanium, platinum, or other suitable metal. In embodiments, the metal layer can be sputter deposited on the passivation layer, and the length of time the metal layer is sputter deposited can be based on the amount of dimming desired.

[0006]

[0006] In one embodiment, the LED chip comprises an active LED structure having an n-type layer, a p-type layer, and an active layer between the n-type and p-type layers, forming a mesa with mesa sidewalls that define a periphery of the active LED structure; a metal layer that is partially transparent to the wavelength of light generated by the active LED structure; and a passivation layer that is between the metal layer and the active LED structure, thereby electrically isolating the metal layer from the active LED structure.

[0007] In another aspect, the LED chip can include a carrier submount. The LED chip can also include an active LED structure bonded to the carrier submount, the active LED structure including an n-type layer, a p-type layer, and an active layer disposed between the n-type and p-type layers, the active LED structure forming a mesa with mesa sidewalls defining a periphery of the active LED structure. The LED chip can also include a metal layer partially transparent to the wavelength of light generated by the active LED structure. The LED chip can also include a dielectric layer between the metal layer and the active LED structure, electrically isolating the metal layer from the active LED structure.

[0008] In another aspect, a method for manufacturing an LED chip is disclosed. The method includes forming an active LED structure on a carrier submount, the active LED structure including an n-type layer, a p-type layer, and an active layer between the n-type and p-type layers, the active LED structure forming a mesa with mesa sidewalls defining a periphery of the active LED structure. The method can also include depositing a passivation layer on the active LED structure. The method can also include depositing a metal layer on the passivation layer that is partially transparent to a wavelength of light generated by the active LED structure, the metal layer being electrically isolated from the active LED structure and the metal layer dimming light emitted by the active LED structure.

[0009] In other aspects, any of the foregoing aspects may be combined individually or together, and / or various individual aspects and features described herein to further advantage. Any of the various features and elements disclosed herein may be combined with one or more other disclosed features and elements, unless indicated to the contrary herein.

[0010] Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in conjunction with the accompanying drawings.

[0011] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate several aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure. [Brief explanation of the drawings]

[0011] [Figure 1]

[0012] 1 is a generalized cross-sectional view of a light-emitting diode (LED) chip embodying a vertical chip structure in accordance with one or more embodiments of the present disclosure. [Figure 2]

[0013] 2 is a cross-sectional view of an LED chip similar to that of FIG. 1 and further including a metal layer that dims the light emitted by the LED chip in accordance with one or more embodiments of the present disclosure. [Figure 3]

[0014] 3 is a cross-sectional view of an LED chip that is a different embodiment of the LED chip shown in FIG. 2 in accordance with one or more embodiments of the present disclosure. [Figure 4]

[0015] FIG. 4A is a top view of an LED chip without a metal layer according to one or more embodiments of the present disclosure.

[0016] FIG. 4B is a top view of an LED chip having a metal layer according to one or more embodiments of the present disclosure. [Figure 5]

[0017] 1 is a flowchart illustrating a method for manufacturing an LED chip having a metal layer according to one or more embodiments of the present disclosure. [Figure 6]

[0018] 1 is a graph showing experimental results illustrating light transmittance as a function of metal layer thickness in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012]

[0019] The embodiments set forth below represent the information necessary to enable one skilled in the art to practice the embodiments and illustrate the best modes for practicing the embodiments. Upon reading the following description in conjunction with the accompanying drawings, one skilled in the art will understand the concepts of the present disclosure and will recognize applications of these concepts not specifically addressed herein. It is to be understood that these concepts and applications are within the scope of this disclosure and the appended claims.

[0013]

[0020] As used herein, terms such as first, second, etc. may be used to describe various elements, but it will be understood that these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element could be termed a second element, and similarly, a second element could be termed the first element, without departing from the scope of the present disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0014]

[0021] When an element, such as a layer, region, or substrate, is referred to as being "on" or extending "over" another element, it will be understood that the element can be directly on or extending directly above the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly on" or extending "directly above" another element, there are no intervening elements. Similarly, when an element, such as a layer, region, or substrate, is referred to as being "on" or extending "over" another element, it will be understood that the element can be directly on or extending directly above the other element, or there may be intervening elements. In contrast, when an element is referred to as being "directly on" or extending "directly above" another element, there are no intervening elements. Also, when an element is referred to as being "connected" or "coupled" to another element, it will be understood that the element can be directly connected or coupled to the other element, or there may be intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0015]

[0022] Relative terms such as "bottom" or "top" or "upper" or "below" or "horizontal" or "vertical" may be used herein to describe the relationship of one element, layer, or region to another element, layer, or region, as illustrated in the figures. It will be understood that these terms, and those discussed above, are intended to encompass different orientations of the device in addition to the orientation shown in the figures.

[0016]

[0023] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly dictates otherwise. Furthermore, it will be understood that the terms "comprises," "comprising," "including," and / or "comprising," as used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0017]

[0024] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Furthermore, terms used herein should be interpreted as having a meaning consistent with the meaning in the context of the present specification and related art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0018]

[0025] Embodiments are described herein with reference to schematic diagrams of embodiments of the present disclosure. Accordingly, actual dimensions of layers and elements may vary, and variations from the illustrated shapes are expected, for example, as a result of manufacturing techniques and / or tolerances. For example, regions illustrated or described as square or rectangular may have rounded or curved features, and regions depicted as straight lines may have slight irregularities. Accordingly, regions illustrated in the figures are schematic, and the shapes of those regions are not intended to illustrate the exact shape of a region of a device or to limit the scope of the disclosure. Additionally, the size of structures or regions may be exaggerated relative to other structures or regions for illustrative purposes and, therefore, are provided to illustrate the general structure of the inventive subject matter and may or may not be drawn to scale. Elements common between figures may be identified herein with common element numbers and may not be described again later.

[0019]

[0026] The present disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs), and more particularly to a semitransparent metal layer deposited on an LED chip that can dim the light output of the LED chip. The thickness of the semitransparent metal layer can be adjusted based on the desired dimming level. In embodiments, the metal layer can be deposited on top of a passivation layer on the LED structure, whereby the metal layer is not electrically coupled to the LED. The metal layer can additionally cover the mesa sidewalls of the LED structure. In other embodiments, the metal layer can be titanium, platinum, or other suitable metal. In embodiments, the metal layer can be sputter-deposited on the passivation layer, and the length of time the metal layer is sputter-deposited can be based on the amount of dimming desired.

[0020]

[0027] An LED chip typically comprises an active LED structure or region that can have many different semiconductor layers arranged in different ways. The fabrication and operation of LEDs and their active structures are generally known in the art and will be briefly discussed herein. The layers of the active LED structure can be fabricated using known processes, with a suitable process being fabrication using metalorganic chemical vapor deposition. The layers of the active LED structure can comprise many different layers, and typically comprise an active layer sandwiched between oppositely doped n-type and p-type epitaxial layers, all formed in sequence on a growth substrate. It is understood that additional layers and elements can also be included in the active LED structure, including, but not limited to, buffer layers, nucleation layers, superlattice structures, undoped layers, cladding layers, contact layers, current-spreading layers, light extraction layers, and other elements. The active layer may comprise a single quantum well, multiple quantum wells, a double heterostructure, or a superlattice structure.

[0021]

[0028] The active LED structure can be fabricated from different material systems, some of which are III-nitride-based. III-nitrides refer to semiconductor compounds formed between nitrogen (N) and elements from group III of the periodic table, usually aluminum (Al), gallium (Ga), and indium (In). Gallium nitride (GaN) is a common binary compound. III-nitrides also refer to ternary and quaternary compounds such as aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), and aluminum indium gallium nitride (AlInGaN). For III-nitrides, silicon (Si) is a common n-type dopant, and magnesium (Mg) is a common p-type dopant. Thus, the active, n-type, and p-type layers in III-nitride-based material systems can include one or more layers of GaN, AlGaN, InGaN, and AlInGaN, undoped or doped with Si or Mg. Other material systems include silicon carbide (SiC), organic semiconductor materials, and other III-V systems such as gallium phosphide (GaP), gallium arsenide (GaAs), and related compounds.

[0022]

[0029] The active LED structure can be grown on a growth substrate, which can include many materials, such as sapphire, SiC, aluminum nitride (AlN), and GaN. A suitable substrate is the 4H polytype of SiC, although other SiC polytypes, including the 3C, 6H, and 15R polytypes, can also be used. SiC has certain advantages, such as a closer crystal lattice match with III-nitrides than other substrates, resulting in high-quality III-nitride films. SiC also has very high thermal conductivity, so the total output power of III-nitride devices on SiC is not limited by the heat dissipation of the substrate. Sapphire is another common substrate for III-nitrides and offers certain advantages, such as low cost, an established manufacturing process, and excellent optical properties with excellent light transmission.

[0023]

[0030] Different embodiments of the active LED structure can emit light of different wavelengths, depending on the composition of the active layer, n-type layer, and p-type layer. In certain embodiments, the active LED structure can emit blue light with a peak wavelength range of approximately 430 nanometers (nm) to 480 nm. In other embodiments, the active LED structure can emit green light with a peak wavelength range of 500 nm to 570 nm. In other embodiments, the active LED structure can emit red light with a peak wavelength range of 600 nm to 650 nm. In certain embodiments, the active LED structure can emit light with a peak wavelength in any region of the visible spectrum, for example, primarily in the range of 400 nm to 700 nm.

[0024]

[0031] In certain embodiments, the active LED structure may be configured to emit light outside the visible spectrum, including one or more portions of the ultraviolet (UV), infrared (IR), or near-IR spectrum. The UV spectrum is typically divided into three wavelength range categories, designated by the letters A, B, and C. Thus, UV-A light is typically defined as a peak wavelength range of 315 nm to 400 nm, UV-B is typically defined as a peak wavelength range of 280 nm to 315 nm, and UV-C is typically defined as a peak wavelength range of 100 nm to 280 nm. UV LEDs are particularly important for use in applications related to disinfection of microorganisms, such as in air, water, and surfaces. In other applications, UV LEDs may be provided with one or more luminescent materials to provide LED packages with aggregated emission having broad spectrum and improved color quality for visible light applications. The near-IR and / or IR wavelengths of the LED structures of the present disclosure may have wavelengths greater than 700 nm, such as in the range of 750 nm to 1100 nm or greater.

[0025]

[0032] The LED chip can be coated with one or more lumiphoric or other conversion materials, such as phosphors, whereby at least a portion of the light from the LED chip is absorbed by the one or more phosphors and converted to one or more different wavelength spectra according to the characteristic emissions from the one or more phosphors. In some embodiments, the combination of the LED chip and one or more phosphors emits a generally white light combination. The one or more phosphors can be selected from yellow (e.g., YAG:Ce), green (e.g., LuAg:Ce), and red (e.g., Ca i-x-y Sr x EU y The luminescent material may include one or more of the following: a phosphor, a scintillator, a luminescent ink, a quantum dot material, a day glow tape, and the like. The luminescent material may be provided by any suitable means, such as, for example, a coating directly on one or more surfaces of the LED, a dispersion in an encapsulant material configured to cover one or more LEDs, and / or a coating on one or more optical or support elements (e.g., by powder coating, inkjet printing, etc.). In certain embodiments, the luminescent material may be downconverted or upconverted, and a combination of both downconverting and upconverting materials may be provided. In certain embodiments, multiple different (e.g., different composition) luminescent materials arranged to produce different peak wavelengths may be arranged to receive the emitted light from one or more LED chips. In some embodiments, the one or more phosphors may be a yellow phosphor (e.g., YAG:Ce), a green phosphor (e.g., LuAg:Ce), and a red phosphor (e.g., Ca i-x-y Sr x EU yAlSiN3), and combinations thereof. One or more luminescent materials may be provided on one or more portions of the LED chip and / or submount in various configurations. In certain embodiments, one or more surfaces of the LED chip may be conformally coated with one or more luminescent materials, while other surfaces of such LED chip and / or associated submount may be free of luminescent materials. In certain embodiments, the top surface of the LED chip may include luminescent materials, while one or more side surfaces of the LED chip may be free of luminescent materials. In certain embodiments, all or substantially all exterior surfaces of the LED chip (e.g., not the contact-defining or mounting surfaces) are coated or covered with one or more luminescent materials. In certain embodiments, one or more luminescent materials may be disposed on or on one or more surfaces of the LED chip in a substantially uniform manner. In other embodiments, one or more luminescent materials may be disposed on or on one or more surfaces of the LED chip in a non-uniform manner with respect to one or more of material composition, concentration, and thickness. In certain embodiments, the fill factor of one or more luminescent materials may vary on or between one or more exterior surfaces of the LED chip. In certain embodiments, one or more luminescent materials may be patterned to include one or more stripes, dots, curves, or polygonal shapes on a portion of one or more surfaces of the LED chip, hi certain embodiments, multiple luminescent materials may be disposed in different discrete regions or layers of or on the LED chip.

[0026]

[0033] Light emitted from the active layer or region of an LED chip can typically travel in a variety of directions. For directional applications, an internal mirror or external reflective surface can be applied to redirect as much light as possible into the desired emission direction. The internal mirror can include single or multiple layers. Some multilayer mirrors include a metallic reflective layer and a dielectric reflective layer, with the dielectric reflective layer disposed between the metallic reflective layer and multiple semiconductor layers. A passivation layer is disposed between the metallic reflective layer and first and second electrical contacts, with the first electrical contact disposed in conductive electrical communication with the first semiconductor layer and the second electrical contact disposed in conductive electrical communication with the second semiconductor layer. For single-layer or multilayer mirrors that include surfaces with reflectivity less than 100%, some light may be absorbed by the mirror. In addition, light redirected through the active LED structure may be absorbed by other layers or elements within the LED chip.

[0027]

[0034] As used herein, a layer or region of a light-emitting device may be considered “transparent” if at least 80% of the emitted light that strikes the layer or region passes through the layer or region and emerges. Additionally, as used herein, a layer or region of an LED may be considered “reflective” or embody a “mirror” or “reflector” if at least 80% of the emitted light that strikes the layer or region is reflected. In some embodiments, the emitted light comprises visible light, such as blue and / or green LEDs, with or without luminescent materials. In other embodiments, the emitted light may comprise non-visible light. For example, in the case of GaN-based blue and / or green LEDs, silver (Ag) may be considered a reflective material (e.g., at least 80% reflective). In the case of UV LEDs, appropriate materials may be selected to provide desired, in some embodiments, high reflectivity and / or desired, in some embodiments, low absorption. In certain embodiments, a “light-transmitting” material may be configured to transmit at least 50% of the emitted light of a desired wavelength.

[0028]

[0035] The present disclosure may be useful for LED chips having various shapes, such as a vertical shape. Vertically shaped LED chips typically include an anode connection and a cathode connection on opposite sides or faces of the LED chip. In certain embodiments, vertically shaped LED chips may also include a growth substrate disposed between the anode and cathode connections. In certain embodiments, the LED chip structure may include a carrier submount, in which the growth substrate is removed. In still other embodiments, any of the described principles may also be applicable to flip-chip structures, in which the anode and cathode connections are made from the same side of the LED chip for flip-chip mounting to another surface.

[0029]

[0036] Embodiments of the present invention relate to solid-state lighting devices including light-emitting diodes (LEDs), particularly to a semitransparent metal layer deposited on an LED chip that can dim the light output of the LED chip. The metal layer can be semitransparent to the wavelength of light emitted from the LED chip. Standard sapphire alternatives are often too bright, making it difficult to meet binning requirements. Because existing chip platforms can include titanium or other metal layers instead of etching passivation and texturing, the present disclosure provides a solution for providing chips with various brightness levels using the same chip platform. By varying the thickness of the metal layer, different dimming levels can be provided, allowing a single LED chip platform to meet various brightness requirements. A titanium or platinum metal layer can be used because it adheres well to the passivation layer and can withstand gold etchants while still functioning as a light-blocking layer.

[0030]

[0037] FIG. 1 is a generalized cross-sectional view of an LED chip 10 embodying a vertical chip structure in accordance with the principles of the present disclosure. The LED chip 10 includes an active LED structure 12 formed on a carrier submount 14. The active LED structure 12 generally refers to the portion of the LED chip 10 including semiconductor layers, such as epitaxial semiconductor layers, that form a structure that produces light when electrically activated. The active LED structure 12 is formed on and supported by a carrier submount 14, which can be made of a variety of materials, with silicon or doped silicon being a suitable material. In certain embodiments, the carrier submount 14 comprises a conductive material, and the carrier submount 14 provides part of the conductive connection to the active LED structure 12. The active LED structure 12 may generally include a p-type layer 16, an n-type layer 18, and an active layer 20 disposed between the p-type layer 16 and the n-type layer 18. The active LED structure 12 may include many additional layers, such as, but not limited to, buffer layers, nucleation layers, superlattice structures, undoped layers, cladding layers, contact layers, current spreading layers, and light extraction layers. Additionally, the active layer 20 may comprise a single quantum well, multiple quantum wells, a double heterostructure, or a superlattice structure. In FIG. 1 , the p-type layer 16 is positioned between the active layer 20 and the carrier submount 14, such that the p-type layer 16 is closer to the carrier submount 14 than the n-type layer 18. The active LED structure 12 may be formed by first epitaxially growing or depositing the n-type layer 18, the active layer 20, and the p-type layer 16, in that order, on a growth substrate. The active LED structure 12 may then be flipped over and bonded to the carrier submount 14 via one or more bonding metals 22, and the growth substrate removed. In this manner, the top surface 18′ of the n-type layer 18 forms the primary light extraction surface of the LED chip 10. In certain embodiments, the top surface 18' may include a textured or patterned surface to improve light extraction. In other embodiments, the doping order may be reversed, whereby the n-type layer 18 is disposed between the active layer 20 and the carrier submount 14. In embodiments, an outer layer 50 is applied over the top surface 18' of the n-type layer 18 to cover and protect the top surface 18'.In an embodiment, the outer layer 50 may be a neutral dielectric material such as SiN, SiO2, or Al2O3, or other suitable passivation material.

[0031]

[0038] The LED chip 10 may include a first reflective layer 24 disposed on the p-type layer 16. In certain embodiments, a current spreading layer 26 may be disposed between the p-type layer 16 and the first reflective layer 24. The current spreading layer 26 may include a thin layer of a transparent conductive oxide, such as indium tin oxide (ITO), or a thin layer of a metal, such as platinum (Pt), although other materials may also be used. The first reflective layer 24 may comprise many different materials, preferably a material that exhibits a refractive index step with the material of the active LED structure 12 to promote total internal reflection (TIR) of light generated from the active LED structure 12. Light that undergoes TIR is redirected without absorption or loss, thereby contributing to useful or desired LED chip light emission. In certain embodiments, the first reflective layer 24 comprises a material with a refractive index lower than that of the material of the active LED structure 12. The first reflective layer 24 can comprise many different materials, some with refractive indices less than 2.3, others less than 2.15, less than 2.0, less than 1.5, etc. In certain embodiments, the first reflective layer 24 comprises a dielectric material such as silicon dioxide (SiO2) and / or silicon nitride (SiN). SiN, SiN x , Si3N4, Si, Germanium (Ge), SiO2, SiO x , titanium dioxide (TiO2), tantalum pentoxide (Ta2O5), ITO, magnesium oxide (MgO xIt will be appreciated that many dielectric materials can be used, such as silicon dioxide (SiO2), zinc oxide (ZnO), and combinations thereof. In certain embodiments, the first reflective layer 24 can include multiple alternating layers of different dielectric materials, for example, symmetrically repeated or asymmetrically arranged alternating layers of SiO2 and SiN. Some III-nitride materials, such as GaN, can have a refractive index of approximately 2.4, SiO2 can have a refractive index of approximately 1.48, and SiN can have a refractive index of approximately 1.9. In embodiments comprising an active LED structure 12 comprising GaN and a first reflective layer 24 comprising SiO2, a sufficient refractive index difference can be formed between the two to enable efficient TIR of light. The first reflective layer 24 can have a thickness that varies depending on the type of material used, and in some embodiments, has a thickness of at least 0.2 microns (μm). In some embodiments, the first reflective layer 24 can have a thickness ranging from 0.2 μm to 0.7 μm, and in some embodiments, the thickness can be approximately 0.5 μm.

[0032]

[0039] The LED chip 10 may further include a second reflective layer 28 positioned on the first reflective layer 24 such that the first reflective layer 24 is disposed between the active LED structure 12 and the second reflective layer 28. The second reflective layer 28 may include a metal layer configured to reflect light from the active LED structure 12 that may pass through the first reflective layer 24. The second reflective layer 28 may comprise a number of different materials, such as Ag, gold (Au), Al, nickel (Ni), titanium (Ti), or combinations thereof. The second reflective layer 28 may have different thicknesses depending on the type of material used, and in some embodiments, has a thickness of at least 0.1 μm, or in a range of 0.1 μm to 0.7 μm, or in a range of 0.1 μm to 0.5 μm, or in a range of 0.1 μm to 0.3 μm. As illustrated, the second reflective layer 28 may include or form one or more reflective layer interconnects 30 that provide a conductive path through the first reflective layer 24. In this manner, the one or more reflective layer interconnects 30 may extend across the entire thickness of the first reflective layer 24. In certain embodiments, the second reflective layer 28 is a metal reflective layer, and the reflective layer interconnects 30 comprise reflective layer metal vias. Thus, the first reflective layer 24, the second reflective layer 28, and the reflective layer interconnects 30 form a reflective structure of the LED chip 10 that is located on the p-type layer 16. Thus, the reflective structure may comprise a dielectric reflective layer and a metal reflective layer, as disclosed herein. In certain embodiments, the reflective layer interconnects 30 comprise the same material as the second reflective layer 28 and are formed simultaneously with the second reflective layer 28. In other embodiments, the reflective layer interconnects 30 may comprise a different material from the second reflective layer 28. Certain embodiments may also include an adhesion layer 32 disposed at one or more interfaces between the first reflective layer 24 and the second reflective layer 28 and / or at the interface between the first reflective layer 24 and the current spreading layer 26 to promote adhesion therebetween. The adhesive layer 32 is made of titanium oxide (TiO, TiO2), titanium oxynitride (TiON, Ti x O y N), tantalum oxide (TaO, Ta2O5), tantalum oxynitride (TaON), aluminum oxide (AlO, Al x O y), or combinations thereof, the preferred materials are TiON, AlO, or Al x O y In a particular embodiment, the adhesive layer is Al x O y In a specific embodiment, the adhesive layer comprises Al, where x=2 and y=3. x O y , i.e., Al2O3. The adhesion layer 32 can be deposited by electron beam deposition, which can provide a smooth, dense, continuous layer without significant changes in surface morphology. The adhesion layer 32 can be deposited by sputtering, chemical vapor deposition, or plasma-enhanced chemical vapor deposition.

[0033]

[0040] The LED chip 10 may include a barrier layer 34 on the second reflective layer 28 to prevent the material of the second reflective layer 28, such as Ag, from migrating to other layers. Preventing this migration allows the LED chip 10 to maintain efficient operation throughout its lifetime. The barrier layer 34 may comprise a conductive material, as well as suitable materials including, but not limited to, Ti, Pt, Ni, Au, tungsten (W), and combinations or alloys thereof. In certain embodiments, the barrier layer 34 is positioned to extend laterally beyond a portion of the active LED structure 12 or the peripheral boundary of the active LED structure 12 to provide electrical connection with the p-contact 36. In this regard, the electrical path between the p-contact 36 and the p-type layer 16 may include the barrier layer 34, the second reflective layer 28, and the reflective layer interconnect 30. In other embodiments, the polarity may be reversed, with the p-contact 36 replaced by an n-contact electrically coupled to the n-type layer 18, and electrical connection to the p-type layer 16 made through the carrier submount 14. A passivation layer 38 is included on the barrier layer 34 and on any portions of the second reflective layer 28 that may not be covered by the barrier layer 34. The passivation layer 38 protects the LED chip 10 and provides electrical insulation for the LED chip 10 and can comprise many different materials, such as dielectric materials including, but not limited to, silicon nitride. In certain embodiments, the passivation layer 38 is a single layer, while in other embodiments, the passivation layer 38 comprises multiple layers. In certain embodiments, the passivation layer 38 may also include an additional light-reflective layer, along with one or more metal-containing intermediate layers disposed or embedded therein that can act as crack stop layers for cracks that may propagate through the passivation layer 38.

[0034]

[0041] In FIG. 1 , the active LED structure 12 defines a first opening 40 or recess extending through the p-type layer 16, the active layer 20, and a portion of the n-type layer 18. The first opening 40 may be formed by a subtractive material process, such as etching, applied to the active LED structure 12 prior to bonding with the carrier submount 14. Herein, the first opening 40 may also be referred to as an active LED structure opening. As illustrated, the first reflective layer 24 and a portion of the adhesive layer 32 are disposed to cover the sidewall surfaces of the p-type layer 16, the active layer 20, and the n-type layer 18 within the first opening 40. A passivation layer 38 extends along the first reflective layer 24 in the first opening 40 and is disposed on the surface of the n-type layer 18. The LED chip 10 further includes an n-contact metal layer 42 disposed across the LED chip 10 on the passivation layer 38. In the first opening 40, the n-contact metal layer 42 extends into the first opening 40 to form an n-contact interconnect 44, which may also be referred to as an n-contact via. In this manner, the first opening 40 may be defined where the n-contact metal layer 42, the n-contact interconnect 44, the passivation layer 38, and a portion of the first reflective layer 24 extend into the active LED structure 12. Thus, the n-contact metal layer 42 and the n-contact interconnect 44 may be integrally formed and provide electrical connection to the n-type layer 18 through the first opening 40. In other embodiments, the n-contact metal layer 42 and the n-contact interconnect 44 may be formed separately and may comprise the same or different materials. In particular embodiments, the n-contact metal layer 42 and the n-contact interconnect 44 comprise a single layer or multiple layers including a conductive metal such as one or more of Al, Ti, and alloys thereof.

[0035]

[0042] As illustrated, a p-contact 36 may be formed on the barrier layer 34, and one or more upper passivation layers 46-1, 46-2 may be provided on one or more top or side surfaces of the n-type layer 18 for additional electrical insulation. In FIG. 1 , the upper passivation layer 46-2 is disposed over the mesa sidewall 12′ of the active LED structure 12. The upper passivation layers 46-1, 46-2 may comprise successive layers of a dielectric material, such as silicon nitride. During fabrication of the mesa of the active LED structure 12, an etching process is applied from the n-type layer 18 to the active LED structure 12. The etching process effectively forms a mesa sidewall 12′ having a sloped surface along the periphery of the active LED structure 12.

[0036]

[0043] FIG. 2 is a cross-sectional view of an LED chip 11 similar to the LED chip 10 of FIG. 1, further including a metal layer 48 that dims the light emitted by the LED chip 11 in accordance with one or more embodiments of the present disclosure.

[0037]

[0044] In FIG. 1 , the LED chip 10 has its upper passivation layers 46-1 and 46-2 etched away, exposing the n-type layer 18. The n-type layer is then textured to improve light extraction from the top surface 18′. However, in the embodiment of FIG. 2 , the LED chip 11 does not have its passivation layers 46-1 and 46-2 etched away. Instead, an additional metal layer 48 is deposited on the passivation layer 46-2. Without texturing, the light emitted by the LED chip 11 is reduced to a first stage. The metal layer 48, which can be semitransparent or partially opaque, can then further reduce the light emitted by the LED chip 11, and more specifically, the light emitted by the active LED structure 12. The metal layer 48 can be positioned to absorb and / or internally reflect a portion of the light from the active LED structure 12, thereby reducing the amount of light generated by the active LED structure 12 that escapes the LED chip 11. The metal layer 48 can also cover the mesa sidewalls 12′. In some embodiments, metal layer 48 can have varying thicknesses, such as a first thickness over the top of active LED structure 12 and a second thickness over mesa sidewalls 12′. The thickness of metal layer 48 over active LED structure 12 and mesa sidewalls 12′ can be selected based on a desired light emission pattern or to adjust the overall dimming level of metal layer 48. In other embodiments, metal layer 48 can have a uniform thickness.

[0038]

[0045] In an embodiment, the metal layer 48 is at least one of titanium or platinum, which are metals that adhere well to the passivation layer 46-2 and have the ability to withstand gold etchants. The thickness of the metal layer 48 can be adjusted based on the desired light emission from the LED chip 11. A thicker metal layer 48 reduces or dimmers the light emitted from the LED chip 11 more than a thinner metal layer 48.

[0039]

[0046] In embodiments, metal layer 48 can be deposited on passivation layer 46-2 by sputter deposition or other forms of physical vapor deposition, such as cathodic arc deposition, electron beam physical vapor deposition, evaporative deposition, close-space sublimation, pulsed laser deposition, or pulsed electron deposition. If the deposition rate is known, the length of time of the deposition process can determine the thickness of metal layer 48.

[0040]

[0047] In an embodiment, the metal layer 48 is electrically isolated from or not electrically coupled to the active LED structure 12 by the passivation layers 46-1, 46-2, which are a dielectric material (eg, silicon nitride, etc.).

[0041]

[0048] In embodiments, the metal layer 48 can be patterned via a photomask to prevent the metal layer 48 from being present in the street and pad regions of the LED chip 11. By preventing the metal layer 48 from being present in the street and pad regions of the LED chip 11, the metal layer 48 can be electrically isolated from the active LED structure 12 and from other components of the LED chip 11. The metal layer 48 can also be patterned and have a thickness that is variable across the top of the LED chip 11 to have adjustable brightness, an adjustable light emission pattern, and / or an adjustable emitter shape. In embodiments, the metal layer 48 is deposited on a photoresist layer, and after a photomask is applied, the patterned metal layer 48 is formed.

[0042]

[0049] In an embodiment, the metal layer 48 may have an outer layer 50 applied thereover to cover and protect the metal layer 48. In an embodiment, the outer layer 50 may be a neutral dielectric material such as SiN, SiO, or AlO, or other suitable passivation material.

[0043]

[0050] As illustrated, outer layer 50 may cover and extend laterally beyond metal layer 48 along sidewall 12′ to electrically isolate p-contact 36 from metal layer 48. Thus, metal layer 48 may be effectively embedded or surrounded by the dielectric material of passivation layers 46-1, 46-2 and outer layer 50, such that metal layer 48 is electrically isolated from active LED structure 12. By covering metal layer 48 with outer layer 50, metal layer 48 may be electrically and environmentally isolated from additional layers that may be added to LED chip 11 and / or the environment surrounding LED chip 11.

[0044]

[0051] Turning now to FIG. 3 , another embodiment of the LED chip 11 is illustrated in which the thickness of the metal layer 48 on the mesa sidewalls 12′ can be different from the thickness of the metal layer 48 on the top surface of the active LED structure 12. For example, as illustrated in FIG. 3 , the metal layer 48 on the top surface of the LED chip 11 is thicker than the metal layer 48 on the mesa sidewalls 12′. Additionally, in the embodiment illustrated in FIG. 3 , the metal layer 48 can have openings 49 where a photomask has been applied to create a pattern. A top layer 50 can fill the openings 49 where the metal layer 48 is not present.

[0045]

[0052] 4A and 4B, top views of an LED chip (e.g., LED chip 11) are illustrated without ( FIG. 4A ) and with ( FIG. 4B ) a metal layer 48, in accordance with one or more embodiments of the present disclosure. In an embodiment, as illustrated in FIG. 4B , metal layer 48 can be patterned to include openings 52 to prevent metal layer 48 from covering pads or street areas on top of LED chip 11.

[0046]

[0053] Turning now to FIG. 5, a flowchart illustrating a method 500 for manufacturing an LED chip 11 having a metal layer 48 is illustrated in accordance with one or more embodiments of the present disclosure.

[0047]

[0054] The method 500 may begin at step 502, where the method includes forming an active LED structure 12 on a carrier submount 14, the active LED structure 12 comprising an n-type layer 18, a p-type layer 16, and an active layer 20 between the n-type layer 18 and the p-type layer 16, the active LED structure 12 forming a mesa with mesa sidewalls 12′ defining a periphery of the active LED structure 12.

[0048]

[0055] In step 504, the method may include depositing a passivation layer 46 over the active LED structure 12. In an embodiment, the passivation layer 46 may be a dielectric material such as silicon nitride.

[0049]

[0056] In step 506, the method may include depositing a metal layer 48 on the passivation layer 46-2 that is partially transparent to the wavelength of light generated by the active LED structure 12, where the metal layer 48 is electrically isolated from the active LED structure 12 and where the metal layer 48 dims the light emitted by the active LED structure 12. In embodiments, the metal layer 48 may be deposited by sputter deposition, where the length of time the metal layer 48 is deposited controls the thickness of the metal layer 48 and, consequently, the amount of dimming provided by the metal layer 48. In other embodiments, other deposition techniques, such as chemical vapor deposition or plasma-enhanced chemical vapor deposition, are also possible. The metal layer 48 may also be deposited in a predetermined pattern or on a photoresist layer, where a photomask is applied to form the patterned metal layer 48.

[0050]

[0057] Turning to FIG. 6, a graph showing experimental results illustrating light transmittance as a function of metal layer thickness is illustrated in accordance with one or more embodiments of the present disclosure.

[0051]

[0058] Graph 600 shows experimental results 602 illustrating the transmission percentage as a function of the thickness of the metal layer 48. In this example, the metal layer 48 is titanium and emits light at 451 nm. The thickness is in Angstroms. The table on which graph 600 is based is provided below in Table 1.

[0052] [Table 1]

[0053]

[0059] It is contemplated that any of the foregoing aspects and / or various individual aspects and features described herein may be combined to further advantage. Any of the various embodiments disclosed herein may be combined with one or more of the other disclosed embodiments, unless indicated to the contrary herein.

[0054]

[0060] Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure, and all such improvements and modifications are considered to be within the scope of the concepts disclosed herein and the appended claims.

Claims

1. A light emitting diode (LED) chip, comprising: an active LED structure comprising an n-type layer, a p-type layer, and an active layer between the n-type layer and the p-type layer, forming a mesa with mesa sidewalls defining a perimeter of the active LED structure; a metal layer that is partially transparent to the wavelength of light produced by the active LED structure; a passivation layer between the metal layer and the active LED structure, whereby the metal layer is electrically isolated from the active LED structure; An LED chip comprising:

2. 10. The LED chip as claimed in claim 1, wherein the mesa sidewalls are covered by the passivation layer and the metal layer.

3. 10. The LED chip of claim 1, wherein the metal layer is configured to dim the light emitted by the active LED structure.

4. The LED chip according to claim 3 , wherein the amount of light attenuated by the metal layer corresponds to the thickness of the metal layer.

5. 10. The LED chip of claim 1, wherein the metal layer is at least one of titanium or platinum.

6. 10. The LED chip of claim 1, wherein the metal layer is sputter deposited onto the passivation layer.

7. 10. The LED chip of claim 1, wherein a first thickness of the metal layer on a top of the active LED structure is different from a second thickness of the metal layer on the mesa sidewalls of the active LED structure.

8. The LED chip as claimed in claim 1 , wherein the metal layer is patterned in a predetermined pattern.

9. A light emitting diode (LED) chip, comprising: a carrier submount; an active LED structure bonded to the carrier submount, the active LED structure including an n-type layer, a p-type layer, and an active layer disposed between the n-type layer and the p-type layer, forming a mesa with mesa sidewalls defining a perimeter of the active LED structure; a metal layer that is partially transparent to the wavelength of light produced by the active LED structure; a dielectric layer between the metal layer and the active LED structure, whereby the metal layer is electrically isolated from the active LED structure; and An LED chip comprising:

10. 10. The LED chip of claim 9, wherein the mesa sidewalls are covered by the dielectric layer and the metal layer.

11. 10. The LED chip of claim 9, wherein the metal layer is configured to dim the light emitted by the active LED structure.

12. 12. The LED chip of claim 11, wherein the amount of light attenuated by the metal layer corresponds to the thickness of the metal layer.

13. 10. The LED chip of claim 9, wherein the metal layer is at least one of titanium or platinum.

14. 10. The LED chip of claim 9, wherein the metal layer is sputter deposited onto the dielectric layer.

15. 10. The LED chip of claim 9, wherein a first thickness of the metal layer on a top of the active LED structure is different from a second thickness of the metal layer on the mesa sidewalls of the active LED structure.

16. 10. The LED chip as claimed in claim 9, wherein the metal layer is patterned in a predetermined pattern.

17. 10. The LED chip of claim 9, wherein the dielectric layer is silicon nitride.

18. 1. A method for manufacturing a light emitting diode (LED) chip, comprising: forming an active LED structure on a carrier submount, the active LED structure comprising an n-type layer, a p-type layer, and an active layer between the n-type layer and the p-type layer, the active LED structure forming a mesa with mesa sidewalls defining a perimeter of the active LED structure; depositing a passivation layer over the active LED structure; depositing a metal layer on the passivation layer that is partially transparent to a wavelength of light generated by the active LED structure, the metal layer being electrically isolated from the active LED structure, the metal layer being configured to dim the light emitted by the active LED structure; A method comprising:

19. 20. The method of claim 18, further comprising depositing the metal layer to a predetermined thickness based on a predetermined dimming level.

20. 20. The method of claim 18, further comprising depositing the metal layer in a predetermined pattern corresponding to a radiation pattern.

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