Passive electromagnetic waveguides and waveguide components, and methods of fabrication and manufacture

Abstract

The electromagnetic waveguide component includes multiple planar layers, one or more of which are shaped to receive incident electromagnetic waves, each layer including two or more alignment features and corresponding pins, the two or more alignment features of each layer providing precise stack registration between the multiple layers, and the planar layers configured to provide a desired radio frequency (RF) response when assembled into a stack.

Description

[Background technology]

[0001] Passive electromagnetic components, such as waveguides, are used to transmit and manipulate electromagnetic fields without a separate energy source. Their construction may require the integration of metal, ceramic (including lossy ceramic), plastic, and specialized magnetic components into an assembly. Passive electromagnetic components include, but are not limited to, straight waveguide sections; waveguide bends; waveguide transitions from one size to another; waveguide transitions from one mode to another; couplers, splitters, or joiners; multiplexers; filters; equalizers; waveguide-to-coaxial adapters, terminations, or loads; some phase shifters, isolators, and circulators; unbiased diodes; and some antennas. Summary of the Invention [Problem to be solved by the invention]

[0002] The size and / or dimensions of features in passive electromagnetic components depend on one or more frequencies of the electromagnetic waves the component is designed to handle. Fabrication of passive electromagnetic components requires precise geometric shapes to a small fraction of a wavelength. At high frequencies, achieving the necessary precision can be difficult using traditional machining and often involves time-consuming and costly processes. At high frequencies, semiconductor lithography techniques can produce passive electromagnetic components at low cost, but require significant upfront investment in tooling and process development. Additive manufacturing offers a flexible approach, but often does not produce passive electromagnetic components of the same quality as those machined from solid billets of material. For example, the bulk conductivity of the material used in passive electromagnetic components affects their performance. Traditional additive manufacturing techniques can only achieve relatively low conductivity, resulting in significant losses of electromagnetic energy. Furthermore, porosity, inclusions, and contamination can affect thermal conductivity and mechanical strength when using traditional additive manufacturing techniques. [Means for solving the problem]

[0003] Disclosed herein are exemplary designs, techniques, and processes for fabricating passive electromagnetic components. In some embodiments, the designs, techniques, and processes achieve precise dimensions and small feature sizes with high electrical conductivity and high manufacturing flexibility. In some embodiments, the techniques and processes disclosed herein are particularly useful for fabricating millimeter-wave components, where the wavelength is between 1 centimeter and 1 millimeter (approximately 30 GHz and 300 GHz). As used herein, the term "waveguide" is intended to refer to any passive electromagnetic component.

[0004] Various embodiments of the present invention use layer-by-layer fabrication designs, techniques, and processes. In some embodiments, multiple planar layers are fabricated and assembled to form precise, highly conductive waveguide structures in a process that is less costly and more rapid than current fabrication processes. The multiple layers may include conductive and / or non-conductive materials, such as dielectric or ferrite elements. The multiple layers may include alignment features that ensure accurate, cost-effective assembly of the layers into a monolithic waveguide component. In some embodiments, the alignment features allow the assembled monolithic waveguide component to be disassembled and reassembled without loss of performance, thereby enabling replacement of a layer, multiple layers, and / or specific elements within a layer. While the layers are shown as planar, they need not be planar.

[0005] The layers can be bonded together to form a high-strength assembly with minimal voids or discontinuities between the layers. The layers can be bonded together using any of the following techniques: brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, a combination of one or more of these, and / or the like. In some embodiments, bonding can be performed in a non-reactive environment, such as hydrogen, nitrogen, and / or the like.

[0006] Prior to bonding, each layer may be cleaned, plasma etched, or otherwise treated to remove contaminants and any surface oxide layers, and may be maintained under a vacuum or inert gas environment to aid in the formation of a leak-tight bond. Each layer may be coated (e.g., sputtered, electroplated, metallized, and / or painted) with a material to aid in the formation of a void-free and gap-free bond between the layers (which may be made of different materials). The coating may include one or more of nickel, gold, silver, molybdenum-manganese, copper, copper-gold, copper-silver, titanium-nickel, gold-copper-titanium, copper-silver-titanium, copper-silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver-copper-indium-titanium, copper-germanium, palladium-nickel-copper-silver, gold-palladium-manganese, silver-palladium, gold-copper-nickel, gold-copper-indium, silver-copper-indium, gold-nickel, gold-nickel-chromium, and / or the like.

[0007] The joints formed between adjacent layers can be hermetic, especially for situations where the interior is evacuated to a vacuum or pressurized with gas, which is often done to reduce the possibility of radio frequency (RF) attenuation during use. At millimeter-wave frequencies, waveguides are particularly sensitive to small air gaps, which can cause absorption losses and reflections of RF signals or can result in undesirable changes to RF characteristics such as resonant or filter frequencies. Reducing air gaps and discontinuities can result in relatively high power handling and high gradient capabilities. Layer-by-layer fabrication designs, techniques, and processes are particularly well suited for devices between 30 GHz and 300 GHz, but can also be used for devices below 30 GHz and above 300 GHz.

[0008] Most of the layered fabrication designs, techniques, and processes disclosed herein can be used in any of the embodiments disclosed herein, and each embodiment disclosed herein is presented to teach additional designs, techniques, and processes that can be used in any of the other embodiments.

[0009] According to some embodiments, the present invention provides an electromagnetic waveguide component comprised of a plurality of planar layers, the plurality of planar layers comprising: one or more layers shaped to accommodate at least a portion of a waveguide channel configured to transmit or manipulate electromagnetic waves and to provide a desired radio frequency (RF) response; and one or more alignment features formed in each of the plurality of layers, the one or more alignment features of each of the plurality of layers configured to provide precise stacking registration between the plurality of planar layers, the one or more alignment features configured to cooperate with corresponding pins; and the plurality of planar layers configured to form the waveguide channel when assembled into a stack.

[0010] One or more of the planar layers may be composed of conductive and non-conductive materials. One or more of the planar layers may be composed of a ferrite material. Joining the planar layers together forms an electromagnetically hermetic seal, such that any loss and mismatch of the electromagnetic waves corresponds to that of a solid piece of material. The planar layers may be made of copper, aluminum, titanium, tungsten, iron, nickel, cupronickel, stainless steel, carbon steel, alloy steel, tool steel, iron oxide-based ferromagnetic material, copper alloy, dispersion-hardened copper, aluminum alloy, or any combination thereof. The layers may be made of multiple materials, including one or more of lossy dielectrics, lossless dielectrics, insulators, ferromagnetic materials, diamagnetic materials, and electrets. The electromagnetic waveguide component may be a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port. The electromagnetic waveguide component may be a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port and provides a coupler to one or more of the waveguide paths, which provides a portion of a signal to one or more of the one or more waveguide channels at a connecting port. The electromagnetic waveguide component may be a coupler, phase shifter, circulator, load, or filter. The electromagnetic waveguide component may provide waveguide routing and connection to one or more further electromagnetic waveguide components. The one or more alignment features may include different types of alignment features. A planar layer may be divided into at least two sections, and each of the sections may include at least one alignment feature. Each of the planar layers may include at least two alignment features. A waveguide channel may be routed upward or downward to different planar layers. A waveguide channel may pass above or below another waveguide channel. At least one of the planar layers may be formed on at least one removable support. [Brief explanation of the drawings]

[0011] [Figure 1A] 1A-1C illustrate exemplary passive waveguide components fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 1B] 1A-1C illustrate exemplary passive waveguide components fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 1C] 1A-1C illustrate exemplary passive waveguide components fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figures 2A-2C] 2A-2C illustrate an exemplary multi-port waveguide coupler fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figures 3A-3D] 3A-3D illustrate an exemplary T-shaped waveguide coupler fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figures 4A-4C] 4A-4C illustrate exemplary waveguide filters fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 5A] 5A-5F illustrate exemplary waveguide phase shifters fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 5B] 5A-5F illustrate exemplary waveguide phase shifters fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 5C] 5A-5F illustrate exemplary waveguide phase shifters fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 5D] 5A-5F illustrate exemplary waveguide phase shifters fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 5E]5A-5F illustrate exemplary waveguide phase shifters fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 5F] 5A-5F illustrate exemplary waveguide phase shifters fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6A] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6B] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6C] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6D] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6E] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6F] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6G] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6H] 6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 6I]6A-6I illustrate exemplary waveguide distribution networks fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 7A-7C] 7A-7C illustrate exemplary waveguide distribution networks with integrated couplers fabricated using layer-by-layer fabrication according to some embodiments of the present invention. [Figures 8A-8D] 8A-8D illustrate waveguide components configured to be coupled to other waveguide components fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9A] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9B] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9C] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9D] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9E] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9F] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9G] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9H]9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. [Figure 9I] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention.

[0012] Disclosed herein are exemplary designs, techniques, and processes for fabricating passive electromagnetic components. In some embodiments, the designs, techniques, and processes achieve precise dimensions and small feature sizes with high electrical conductivity and high manufacturing flexibility. In some embodiments, the techniques and processes disclosed herein are particularly useful for fabricating millimeter-wave components, where wavelengths are between 1 centimeter and 1 millimeter (approximately 30 GHz and 300 GHz). As used herein, the term "waveguide" is intended to refer to any passive electromagnetic component.

[0013] Various embodiments of the present invention use layer-by-layer fabrication designs, techniques, and processes. In some embodiments, multiple planar layers are fabricated and assembled to form precise, highly conductive waveguide structures in a process that is less costly and more rapid than current fabrication processes. The multiple layers may include conductive and / or non-conductive materials, such as ferrite elements. The multiple layers may include alignment features that ensure accurate, cost-effective assembly of the layers into a monolithic waveguide component. In some embodiments, the alignment features allow the assembled monolithic waveguide component to be disassembled and reassembled without loss of performance, thereby enabling replacement of a layer, multiple layers, and / or specific elements within a layer. While the layers are shown as planar, they need not be planar.

[0014] The layers can be bonded together to form a high-strength assembly with minimal voids or discontinuities between the layers. The layers can be bonded together using any of the following techniques: brazing, diffusion bonding, assisted diffusion bonding, solid-state bonding, cold welding, ultrasonic welding, a combination of one or more of these, and / or the like. In some embodiments, bonding can be performed in a non-reactive environment, such as hydrogen, nitrogen, and / or the like.

[0015] Prior to bonding, each layer may be cleaned, plasma etched, or otherwise treated to remove contaminants and any surface oxide layers, and may be maintained under a vacuum or inert gas environment to aid in the formation of a leak-tight bond. Each layer may be coated (e.g., sputtered, electroplated, metallized, and / or painted) with a material to aid in the formation of a void-free and gap-free bond between the layers (which may be made of different materials). The coating may include one or more of nickel, gold, silver, molybdenum-manganese, copper, copper-gold, copper-silver, titanium-nickel, gold-copper-titanium, copper-silver-titanium, copper-silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver-copper-indium-titanium, copper-germanium, palladium-nickel-copper-silver, gold-palladium-manganese, silver-palladium, gold-copper-nickel, gold-copper-indium, silver-copper-indium, gold-nickel, gold-nickel-chromium, and / or the like.

[0016] The joints formed between adjacent layers can be hermetic, especially for situations where the interior is evacuated to a vacuum or pressurized with gas, which is often done to reduce the possibility of radio frequency (RF) attenuation during use. At millimeter-wave frequencies, waveguides are particularly sensitive to small air gaps, which can cause absorption losses and reflections of RF signals or can result in undesirable changes to RF characteristics such as resonant or filter frequencies. Reducing air gaps and discontinuities can result in relatively high power handling and high gradient capabilities. Layer-by-layer fabrication designs, techniques, and processes are particularly well suited for devices between 30 GHz and 300 GHz, but can also be used for devices below 30 GHz and above 300 GHz.

[0017] Most of the layered fabrication designs, techniques, and processes disclosed herein can be used in any of the embodiments disclosed herein, and each embodiment disclosed herein is presented to teach additional designs, techniques, and processes that can be used in any of the other embodiments.

[0018] 1A-1C illustrate an exemplary passive waveguide component 100 fabricated using layer-by-layer fabrication designs, techniques, and processes in accordance with some embodiments of the present invention. FIG. 1A illustrates an isometric view of the waveguide component 100. As can be seen, the waveguide component 100 includes seven layers: a channel layer 102 sandwiched between six non-channel layers 101. The non-channel layers 101 and the channel layers 102 may be formed of any suitable waveguide material and may be designed to handle electromagnetic waves in the frequency range of approximately 30 GHz to 300 GHz, or other frequency ranges. The non-channel layers 101 and the channel layers 102 may be composed of conductive or non-conductive materials.

[0019] The non-channel layer 101 (Layer A) and the channel layer 102 (Layer B) are fabricated and then laminated to form the passive waveguide component 100. Fabrication of the non-channel layer 101 and the channel layer 102 may include milling, drilling, or otherwise forming alignment features 120. As shown in FIGS. 1A-1C, in some embodiments, the alignment features 120 may be circular and may be located at the corners of each layer 101, 102. While the alignment features 120 are illustrated as circular, other shapes are possible. Although the alignment features 120 are illustrated as being located at the corners, other locations are possible. While the layers are illustrated as including multiple alignment features, layer 101 or 102 may include only one alignment feature 120. In some embodiments, layer 101 or 102 may include two or more alignment features 120. In some embodiments, the multiple alignment features 120 may include alignment features of different shapes or types. For layers with disconnected sections (such as layer 102 shown in FIG. 1C), one or more alignment features 120 may be positioned on each section. As shown in FIG. 1C, channel layer 102 may be divided into two sections 102A, 102B, with each section 102A, 102B including two alignment features 120.

[0020] In some embodiments, the alignment features 120 can be aligned across the stacked layers 101, 102. In some embodiments, each layer 101, 102 can have a second-shaped alignment feature 130 in addition to the first-shaped alignment feature 120. For example, the alignment feature 120 can include a circular feature, and the additional alignment feature 130 can include a rectangular feature (including a square) configured to further ensure accurate layer alignment. Unlike a single circular alignment feature 120, a single rectangular alignment feature 130 controls the layer's rotation in addition to its position. Other shapes (e.g., triangular, pentagonal, star-shaped) can also control the layer's rotation. Multiple rectangular alignment features 130 further ensure proper positioning and prevent rotation. In some embodiments, the alignment feature 120 or 130 can include a hole configured to receive a similarly shaped alignment pin (not shown). Alignment feature 120 or 130 may include a borehole that passes through some or all of a layer. Alignment feature 120 may include alignment feature 130.

[0021] Layer 102 can be fabricated as two separate sections or by removing section 150 from a "solid" layer, leaving sections 102A and 102B after removal. In some embodiments, the "solid" layer may have non-channel portions removed, such as for alignment features 120. The removed section 150 forms the waveguide channel upon assembly of the layers of waveguide component 100. Layer 102 (Layer B) may have a thickness equal to the desired height of the interior waveguide channel. In some embodiments, layer 102 may include multiple identical layers with reduced thicknesses such that the combined thickness of the layers forms the waveguide height. Sections 102A and 102B may be spaced apart by a distance equal to the desired width of the interior waveguide channel.

[0022] During assembly, the waveguide component 100 can be formed by fastening, e.g., bonding, layers 101 and 102 together. Bonding the layers together helps establish intimate contact between them to create a final assembly comparable or identical to components fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques, involving the application of some combination of pressure and elevated temperature for a suitable period of time. As noted above, prior to assembly, the layers 101, 102 may be subjected to cleaning or etching processes to remove contaminants and to applying one or more coatings to aid in the formation of void-free, void-free joints between the layers. The layers may then be bonded together. In embodiments in which the layers are only mechanically fastened, the waveguide component can be disassembled and reassembled as needed.

[0023] 2A-2C illustrate an exemplary multi-hole waveguide coupler 200 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention. As shown in FIG. 2A, waveguide coupler 200 includes two non-channel layers 201 and one channel layer 202. Layers 201, 202 may include conductive and / or non-conductive materials. Layers 201, 202 can be fabricated and assembled using techniques similar to those described with respect to FIGS. 1A-1C.

[0024] As shown in FIG. 2B, non-channel layer 201 may comprise an entirely solid layer. As mentioned above, in some embodiments, a "solid" layer may have non-channel portions removed, such as for alignment features 120. As shown in FIG. 2C, channel layer 202 has two waveguide channels. Channel layer 202 may have a thickness equal to the desired height of the waveguide channels therein. As mentioned above, layer 202 may comprise multiple identical layers whose thicknesses are reduced so that the combined thickness of the layers forms the height of the waveguides. In some embodiments, the channels may be formed by removing material from a solid layer.

[0025] As shown in FIGS. 2A-2C, alignment features 120 (shown as circular, but other shapes and / or combinations of shapes are possible) can be formed in each layer 201, 202. As described above, alignment features 120 can include holes configured to receive alignment pins (not shown). Although not shown, additional alignment features 130, such as the rectangular alignment features shown in FIGS. 1A-1C, can be formed in layers 201, 202 and / or in sections of a layer, such as layer 102. For example, sections 202A-202C of layer 202 can include circular features, and sections 202D, 202E can include square features. The dimensions of each layer 201, 202 (including the channels) can be selected to achieve desired performance characteristics. The alignment features 120 may be positioned to properly align layers and sections of layers when stacked to form the monolithic multihole waveguide coupler 200, for example, when stacking layer A with a section of layer B with another layer A.

[0026] Waveguide coupler 200 can be formed by fastening (e.g., bonding) non-channel layer 201 and channel layer 202 together. Bonding the layers together helps establish intimate contact between them, creating a final assembly comparable or identical to components fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques, involving the application of some combination of pressure and elevated temperature for an appropriate period of time. As described above, prior to assembly, the layers may be subjected to cleaning or etching processes to remove contaminants and to processes that apply one or more coatings to aid in the formation of void-free and void-free joints between the layers. The layers may then be bonded together. Because the layers are assembled as disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0027] 3A-3D illustrate an exemplary T-shaped waveguide coupler 300 fabricated using a layer-by-layer fabrication design, technique, and process according to some embodiments of the present invention. As shown in FIG. 3A, the T-shaped waveguide coupler 300 includes three layers 301, 302, and 303. Layers 301, 302, and 303 are fabricated and then stacked to form the T-shaped waveguide coupler 300. Layers 301-303 may comprise conductive and / or non-conductive materials. FIG. 3B illustrates the top layer 301, which has port 2 and a channel portion 350 extending through its thickness. FIG. 3C illustrates the channel layer 302, which has a T-shaped channel portion 350 leading to ports 1, 3, and 4. FIG. 3D illustrates the bottom layer 303, which has no channels or ports.

[0028] In some embodiments, channel layer 302 has a thickness equal to the desired height of the waveguide channel therein. As mentioned above, channel layer 302 may include multiple identical layers with reduced thicknesses such that the combined thickness of the layers forms the waveguide height. Channel portions 350 that penetrate the thickness of layer 301 connect to T-shaped channel portions 350 in layer 302. As mentioned above, these channel portions 350 can be formed by removing material from the layers.

[0029] Alignment features 120, which may be circular or other shapes, may be formed on each layer 301, 302, and 303. Alternatively, or in addition, alignment features 130, which may be rectangular or other shapes, may be formed on each layer or layer section. The dimensions of layers 301-303 may be selected to achieve the desired coupling between the waveguides. The thickness of layer 302 may be designed to be the height of the waveguide, and one of the dimensions of removed region 350 on layer 302 may correspond to the width of the waveguide. In some embodiments, multiple sections of a single layer may be formed separately rather than by removing material. In some embodiments, channel portion 350 does not need to be formed into multiple separate sections. In other words, layer 302 may be thicker than the height of the intended waveguide channel. Thus, material removal may leave a floor that holds thicker sections 302A, 302B, and 302C together.

[0030] Waveguide coupler 300 is formed by fastening or bonding layers 301-303 together. Bonding the layers together helps establish intimate contact between them, creating a final assembly comparable or identical to components fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques, involving the application of some combination of pressure and elevated temperature for an appropriate period of time. As noted above, prior to assembly, the layers may be subjected to cleaning or etching processes to remove contaminants and to applying one or more coatings to aid in the formation of void-free, void-free joints between the layers. The layers may then be bonded together. Because the layers are assembled as disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0031] 4A-4C illustrate an exemplary waveguide filter 400 formed using a layer-by-layer fabrication design, technique, and process according to some embodiments of the present invention. As shown in FIG. 4A, waveguide filter 400 includes two non-channel layers 401 and one channel layer 402. Non-channel layer 401 and channel layer 402 may comprise conductive and / or non-conductive materials. FIG. 4B illustrates non-channel layer 401. FIG. 4C illustrates channel layer 402.

[0032] The channel layer 402 may have a thickness equal to the desired height of the waveguide therein. As mentioned above, the channel layer 402 may include multiple identical layers whose thicknesses are reduced so that the combined thickness of the layers forms the height of the waveguide. The channel layer 402 may be fabricated by removing material from a solid layer to form the waveguide path 450 and repeating features 460 configured to provide a filter-like response over the desired operating frequency. The process of selecting the dimensions of these features to achieve the desired RF performance can be found in standard references and textbooks.

[0033] Alignment features 120, which may include alignment holes of, for example, circular, rectangular, or other shapes, or a combination of shapes, are formed in each of the non-channel layer 401 and the channel layer 402 to ensure that all layers and sections are aligned when stacked and bonded.

[0034] Waveguide filter 400 can be formed by fastening and / or bonding non-channel layer 401 and channel layer 402 together. Bonding the layers together helps establish intimate contact between them, creating a final assembly comparable or identical to components fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques, involving the application of some combination of pressure and elevated temperature for an appropriate period of time. As described above, prior to assembly, the layers may be subjected to cleaning or etching processes to remove contaminants and to processes that apply one or more coatings to aid in the formation of void-free and void-free joints between the layers. The layers may then be bonded together. Because the layers are assembled as disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0035] 5A-5F illustrate an exemplary waveguide phase shifter 500 formed using a layer-by-layer fabrication design, technique, and process according to some embodiments of the present invention. As shown in FIG. 5A, the waveguide phase shifter 500 includes top and bottom layers 501, an open channel layer 502, and a ferrite channel layer 504. FIG. 5B illustrates the top or bottom layer 501. FIG. 5C illustrates the open channel layer 502. FIG. 5D illustrates the ferrite channel layer 504. FIG. 5E illustrates a bonded waveguide ferrite assembly 510 including magnetic field generating elements 560 positioned on the outer surfaces of the top and bottom layers 501 of the waveguide phase shifter 500. FIG. 5F illustrates details of the bonded waveguide ferrite assembly 510 including magnetic field generating elements 560 positioned on the outer surfaces of the top and bottom layers of the waveguide phase shifter 500.

[0036] The top and bottom layers 501 and the open channel layer 502 may comprise conductive and / or non-conductive materials. As shown in FIGS. 5B, 5C, and 5D, the top and bottom layers 501, the open channel layer 502, and the ferrite channel layer 504 each include removable supports, each having one or more unique alignment features 120. The removable supports are part of the layers 501, 502, and 504, respectively, and are detachably coupled to the body via one or more bridges. The top and bottom layers 501 include removable supports 501A and 501B. The open channel layer 502 includes removable supports 502A and 502B. The ferrite channel layer 504 includes removable supports 503A and 503B. The bridges are preferably small to allow the associated removable supports to be removed during assembly.

[0037] As shown in Figure 5D, the ferrite channel layer 504 includes three sections: a ferrite section 503 and two side sections of conductive material 504C, 504D. To assemble the waveguide phase shifter 500, the top and bottom layers 501, the open channel layer 502, and the ferrite channel layer 504 (including their respective removable supports 501A, 501B; 502A, 502B; 503A, 503B, channels 550, and alignment features 120) are fabricated. The top and bottom layers 501, the open channel layer 502, and the ferrite channel layer 504 are then laminated together as shown in Figure 5A.

[0038] As shown in FIG. 5A , the open channel layer 502 may have a thickness equal to the desired height of the internal waveguide channel. As described above, the channel layer 502 may include multiple identical layers with reduced thicknesses such that the combined thickness of the layers defines the waveguide height. The open channel layer 502 and the ferrite channel layer 504 may have the channel removed. Alignment features 120 may be located on each of the top and bottom layers 501, the open channel layer 502, and the ferrite channel layer 504 (including the ferrite section 503). The dimensions of each layer 501, 502, and 504 can be selected to achieve desired performance characteristics. Alignment features 120, including those on the removable supports, ensure alignment of all layers and features during assembly.

[0039] The layers 501, 502, 504 (including the ferrite section 503) are secured, e.g., bonded, together. Bonding the layers together helps establish intimate contact between them to create a final assembly comparable or identical to a part fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques that involve applying some combination of pressure and elevated temperature for a suitable period of time. As described above, prior to assembly, the layers may be subjected to cleaning or etching processes to remove contaminants and to processes that apply one or more coatings to aid in the formation of void-free and void-free joints between the layers. The layers may then be bonded together. Because the layers are assembled as disclosed herein, the waveguide component can be disassembled and reassembled as needed.

[0040] After lamination, assembly and bonding, each of the removable supports may be removed.

[0041] As shown in Figures 5E and 5F, magnetic field generating elements 560 can be added on the outer surfaces of the top and bottom layers 501 to form the waveguide phase shifter 500. As shown in Figure 5F, the magnetic field generating elements 560 may include an insulated wire 570 wound on a non-magnetic "spool." When a current is passed through the wire 570, a magnetic field is generated in the vertical direction, biasing the ferrite in the ferrite section 503 and changing the electrical phase length from one waveguide port to the other. Alternatively, the magnetic field may be provided by a permanent magnet.

[0042] Combining the waveguide phase shifter 500 with a coupler such as those shown in Figures 3A-3D can form a four-port waveguide circulator. By adding an absorbing load to two of the ports, the device becomes a waveguide isolator. A similar approach can also be used to implement a three-port Y-shaped waveguide circulator and isolator.

[0043] 6A-6I illustrate an exemplary waveguide distribution assembly 600 employing layer-by-layer fabrication designs, techniques, and processes in accordance with some embodiments of the present invention. As shown in FIG. 6A, the waveguide distribution assembly 600 includes two waveguide channels 660, 650, which can be seen to intersect with each other therein. Although not shown in FIG. 6A, the waveguide distribution assembly 600 is fabricated using multiple layers.

[0044] Figure 6B shows a cross-sectional side view of waveguide distribution assembly 600. As shown in Figure 6B, waveguide channels 660 traverse waveguide distribution assembly 600 "horizontally," without ascending (routing upward through a layer) or descending (routing downward through a layer), and preferably through only a single layer. Waveguide channels 650 traverse waveguide distribution assembly 600 ascending and descending through higher layers, passing above waveguide channels 660.

[0045] 6C shows a cross-sectional top view of waveguide distribution assembly 600. As shown in FIG. 6C, waveguide channel 660 traverses waveguide distribution assembly 600 in an "S-shaped" curve from the rear section to the front section, and waveguide channel 650 traverses waveguide distribution assembly 600 in an "S-shaped" curve from the front section to the rear section. As shown, waveguide channel 660 is below waveguide channel 650 because waveguide channel 650 is routed through a higher layer above waveguide channel 660 and then routed downward through a lower layer, where waveguide channel 650 does not necessarily return to the same layer where it began. As shown, the waveguide channel ports may be located on opposite sides of waveguide distribution assembly 600.

[0046] FIG. 6D shows a non-channel layer A. FIG. 6E shows layer B having channel 660 and a portion of channel 650. FIG. 6F shows layer C having a first elevated portion of channel 650 when channel 650 is routed upward onto layer B. FIG. 6G shows layer D having a second elevated portion of channel 650 when channel 650 is routed onto layer C. FIG. 6H shows layer E having a third elevated portion of channel 650 when channel 650 is routed onto layer D. FIG. 61 shows layer F having a fourth elevated portion of channel 650 when channel 650 is routed onto layer E. An assembly of layers A-E is shown in FIG. 6B. Notably, the thickness of each layer need not be the same to create a smoother transition (smaller step) as the channel rises across the layers. The individual layers of the waveguide distribution assembly 600 can be formed, stacked, and secured (e.g., bonded).

[0047] This example shows that the present technique allows any number of waveguide channels to be routed within the assembly in a manner similar to the way signals are routed on a single conductor or stripline on a printed circuit board. Increasing the number of layers may increase routing complexity, but changes in manufacturing complexity are minimized. Step features that occur at the transition between layers affect RF characteristics. Standard techniques known to those skilled in the art of RF design can account for these effects to produce the desired RF characteristics for the waveguide distribution assembly 600.

[0048] Alignment features 120 ensure that all layers and features are aligned during assembly. The layers are secured, e.g., bonded, together. Bonding the layers together helps establish intimate contact between them to create a final assembly comparable or identical to parts fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques that involve applying some combination of pressure and elevated temperature for an appropriate period of time. As described above, prior to assembly, the layers may be subjected to cleaning or etching processes to remove contaminants and to applying one or more coatings to aid in the formation of void-free, void-free joints between the layers. The layers may then be bonded together. Because the layers are assembled as disclosed herein, the waveguide component can be disassembled and reassembled as needed.

[0049] 7A-7C illustrate an exemplary waveguide distribution assembly 700 (with integrated couplers) fabricated using layer-by-layer fabrication designs, techniques, and processes, according to some embodiments of the present invention. As shown in FIG. 7A, the waveguide distribution assembly 700 includes a set of multiple input ports, shown on the front surface in FIG. 7C, a set of multiple forward coupling ports 751 on the top surface, and a set of multiple reverse coupling ports 752 on the top surface.

[0050] 7B shows a cross-sectional side view of waveguide distribution assembly 700 through one of the input ports, one of the forward connection ports 751, and one of the reverse connection ports 752. As shown, waveguide distribution assembly 700 includes layers 701-704. Layer 704 includes a non-channel base layer. A waveguide channel is positioned between layer 704 and layer 703. Layer 703 includes an iris 760 to allow a traveling wave to pass through layer 703 toward layers 701 and 702 and exit the waveguide channel upward, with layers 701 and 702 forming forward and reverse channels to forward and reverse connection ports 751 and 752, respectively.

[0051] 7C shows a cross-sectional top view of waveguide distribution assembly 700 through input port, forward coupling port 751, and reverse coupling port 752. As shown, waveguide distribution assembly 700 includes five waveguide channels 753-757. Waveguide channels 753-757 are formed from layers 701-704 and can be made of conductive and / or non-conductive materials, for example, by removing sections.

[0052] Each waveguide channel 753-757 passes through a coupler section 750 formed from a series of irises 760 in layer 703 immediately above the waveguide. The coupler section 750 is formed above the irises 760 by appropriately removing material from the more conductive layers 702, 701. Features selected using conventional RF design techniques can be included in layers 701, 702, 703 during fabrication to provide appropriate RF characteristics such as return loss, entrance loss, and directivity. A forward power coupling port 751 and a rear power coupling port 752 are formed in the top layer 701. The individual layers 701-704 of assembly 700 can be formed, stacked, and secured together using bonding techniques employed with any of the waveguide components disclosed herein.

[0053] Exemplary waveguide components can be quickly and accurately formed using stacked layers with aligned registration features (circular, square, rectangular, and / or other shapes) and corresponding registration pins as disclosed herein. The stacked layers can be conductive, non-conductive, or a combination of conductive and non-conductive. Waveguide paths can be formed in one or more layers by precision machining (e.g., material removal), which can be performed under the control of an appropriately programmed processor. These paths can be sized to achieve component performance at various electromagnetic frequencies. These layers can be assembled, aligned, and fastened. Because the layers are assembled as disclosed herein, the waveguide component can be disassembled and reassembled as needed.

[0054] Some features that are shown across multiple figures, such as alignment pin 120, perform the same or similar function in these examples.

[0055] The layers can be secured, e.g., bonded, together. Bonding the layers together helps establish intimate contact between them to create a final assembly comparable or identical to a part fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques, involving the application of some combination of pressure and elevated temperature for an appropriate period of time. As described above, prior to assembly, the layers may be subjected to cleaning or etching processes to remove contaminants and to processes that apply one or more coatings to aid in the formation of void-free and void-free joints between the layers. The layers may then be bonded together. Because the layers are assembled as disclosed herein, the waveguide component can be disassembled and reassembled as needed.

[0056] 8A-8D illustrate a waveguide component 800 configured to be coupled to other waveguide components, fabricated using layer-by-layer fabrication designs, techniques, and processes, according to some embodiments of the present invention.

[0057] FIG. 8A shows a perspective view of a waveguide component 800 with a waveguide port 802 on the front surface of the waveguide component 800. As shown, the waveguide port 802 may include a waveguide opening on a surface perpendicular to the direction of waveguide propagation and may include a protrusion 808 that frames the opening. Additional features may be included to simplify use of the waveguide component. Component alignment features (e.g., holes 804 and pins 806) may be included in the layers. The holes 804 may receive the pins 806. The pins 806 may be pressed into near-fit holes 804 or secured by other means (e.g., brazing, soldering, epoxy, etc.). The pins 806 may be used to align the waveguide component 800 with its corresponding waveguide component. The holes 804 may also be included to receive the pins 806 on the corresponding waveguide component. Holes 804 can be included to allow the waveguide component to be bolted on. Holes 804 can act as pilot features to provide a precise location for drilling and tapping or for applying a threaded insert. Standard waveguide flanges are designed by various organizations. These features can be used to fabricate waveguide components that fit onto the standard flanges.

[0058] Figure 8B shows a top view of waveguide component 800, which includes pin 806 extending from the front surface. Figure 8C shows a top view of waveguide component 800 and identifies section A-A. Figure 8D shows a cross-sectional side view of waveguide component 800, showing the sequence of layers that form hole 804, waveguide port 802, and frame 808.

[0059] For waveguide components that require a gas-tight seal, the waveguide port face can include features to accept an elastomeric "O-ring," thereby providing a gas-tight seal between this and its corresponding waveguide component.

[0060] 9A-9I illustrate a waveguide height converter 900 fabricated using layer-by-layer fabrication designs, techniques, and processes according to some embodiments of the present invention.

[0061] As shown in Figures 9A and 9B, waveguide height transition 900 includes a low-height waveguide port 902 and a full-height (standard) waveguide port 904. As shown in Figure 9C, layers G, H, I, J, K, and L, when assembled, form waveguide height transition 906 to transition from full-height waveguide port 904 to low-height waveguide port 902. As an example, the standard waveguide is a WR-10 waveguide that is 0.1 inches wide and 0.05 inches high. The width of the low-height waveguide is the same as the WR-10 (0.1 inches), but the height is reduced to 0.01 inches. This transition is achieved by a number of steps formed in the successive layers.

[0062] Figure 9D shows layer G as a non-channel layer having alignment features 120. Figure 9E shows layer H as a non-channel layer from which a first segment 908 has been removed to form a first segment of waveguide channel 906. Figure 9F shows layer I as a non-channel layer from which a second segment 910 (longer than first segment 908) has been removed to form a second segment of waveguide channel 906. Figure 9G shows layer J as a non-channel layer from which a third segment 912 (longer than first segment 910) has been removed to form a third segment of waveguide channel 906. Figure 9H shows layer K as a non-channel layer from which a third segment 914 (longer than first segment 912) has been removed to form a fourth segment of waveguide channel 906. Figure 91 shows layer L as a non-channel layer from which a segment 916 (across layer L) has been removed to form the bottom segment of waveguide channel 906. Each layer H, I, J, K, L also includes alignment features 120 that aid in assembling the layers together to form the waveguide height converter 900.

[0063] The individual layers G-L of waveguide height converter 900 can be formed, stacked, and secured together using bonding techniques employed with any of the waveguide components disclosed herein.

[0064] As disclosed herein, exemplary waveguide components can be rapidly and accurately formed using stacked layers with aligned registration features (circular, square, rectangular, and / or other shapes) and corresponding alignment pins. The stacked layers can be conductive, non-conductive, or a combination of conductive and non-conductive. Waveguide paths can be formed in one or more layers by precision machining (e.g., material removal), which can be performed under the control of a suitably programmed processor. These paths can be sized to achieve component performance at various electromagnetic frequencies. These layers can be assembled, aligned, and, for example, bonded. Bonding the layers together helps establish intimate contact between them to create a final assembly comparable or identical to a component fabricated from one or more solid blocks of metal using conventional processes. This bonding can be performed by a variety of known techniques, involving the application of some combination of pressure and elevated temperature for an appropriate period of time. As described above, prior to assembly, the layers may be subjected to cleaning or etching processes to remove contaminants and to applying one or more coatings to aid in the formation of void-free and void-free joints between the layers. The layers may then be bonded together. Because the layers are assembled as disclosed herein, the waveguide components can be disassembled and reassembled as needed.

[0065] Some features that are shown across multiple figures, such as alignment feature 120, serve the same or similar function in these examples.

[0066] In some embodiments, some designs may eliminate the need for alignment features 120 for some layers or portions of layers. For example, a section may be placed in a "pocket" in a layer. For example, a metallic layer may have a notch in it (either through the entire layer to form a "hole" or through only a portion of the layer to form a "cavity"), and a dielectric material of the same shape as the notch may be placed in the notch. The dielectric material will be aligned by the notch. The shape may be keyed or designed to be self-aligning.

[0067] The foregoing description of preferred embodiments of the present invention is by way of example only, and other variations and modifications of the above-described embodiments and methods are possible in light of the above teachings. The embodiments described herein are not intended to be exhaustive or limiting. The present invention is limited only by the following claims.

Claims

1. 1. An electromagnetic waveguide component comprising: A plurality of planar layers: one or more layers configured to transmit or manipulate electromagnetic waves and shaped to accommodate at least a portion of a waveguiding channel configured to provide a desired radio frequency (RF) response; one or more alignment features formed on each of the plurality of layers, the one or more alignment features of each of the plurality of layers configured to provide precise stacking registration between the plurality of planar layers, the one or more alignment features configured to cooperate with corresponding pins; a plurality of planar layers, the plurality of planar layers being configured to form the waveguide channel when assembled into a stack.

2. The electromagnetic waveguide component of claim 1 , wherein one or more of the plurality of planar layers is comprised of a conductive material and a non-conductive material.

3. The electromagnetic waveguide component of claim 2 , wherein one or more of the plurality of planar layers is composed of a ferrite material.

4. 10. The electromagnetic waveguide component of claim 1, wherein the joining of the planar layers forms an electromagnetically hermetic seal such that any loss and mismatch of the electromagnetic waves is comparable to that from a solid piece of material.

5. 10. The electromagnetic waveguide component of claim 1, wherein the plurality of planar layers are made of copper, aluminum, titanium, tungsten, iron, nickel, cupronickel, stainless steel, carbon steel, alloy steel, tool steel, iron oxide-based ferromagnetic material, copper alloy, dispersion hardened copper, aluminum alloy, or any combination thereof.

6. 10. The electromagnetic waveguide component of claim 1, wherein the plurality of layers are made of a plurality of materials including one or more of a lossy dielectric, a lossless dielectric, an insulator, a ferromagnetic material, a diamagnetic material, and an electret.

7. 10. The electromagnetic waveguide component of claim 1, wherein the electromagnetic waveguide component is a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port.

8. 10. The electromagnetic waveguide component of claim 1, wherein the electromagnetic waveguide component is a waveguide distribution assembly that routes one or more waveguide channels from an input port to an output port and provides couplers to one or more of the waveguide paths, the waveguide paths providing a portion of a signal to one or more of the one or more waveguide channels at an associated port.

9. 2. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a coupler.

10. 2. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a phase shifter.

11. 2. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a circulator.

12. 2. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a load.

13. 2. The electromagnetic waveguide component according to claim 1, wherein the electromagnetic waveguide component is a filter.

14. 10. The electromagnetic waveguide component of claim 1, wherein the electromagnetic waveguide component provides waveguide routing and coupling to one or more further electromagnetic waveguide components.

15. The electromagnetic waveguide component of claim 1 , wherein the one or more alignment features include a plurality of different types of alignment features.

16. 2. The electromagnetic waveguide component of claim 1, wherein at least one of said plurality of planar layers is divided into at least two sections, each said section including at least one said alignment feature.

17. The electromagnetic waveguide component of claim 1 , wherein each of said plurality of planar layers includes at least two of said alignment features.

18. 10. The electromagnetic waveguide component of claim 1, wherein the waveguide channels are routed upward or downward into different planar layers.

19. 20. The electromagnetic waveguide component of claim 18, wherein the waveguide channel passes above or below another waveguide channel.

20. The electromagnetic waveguide component of claim 1 , wherein at least one of the plurality of planar layers is formed on at least one removable support.

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