Sensor integrated circuit (IC) with opposing ambient light and proximity sensors, and related electronic devices and manufacturing methods

Abstract

A sensor integrated circuit (IC) employing oppositely facing ambient light and proximity sensors, and related electronic devices and manufacturing methods. As an example, the sensor IC may be integrated into an electronic device (e.g., a wearable device) to detect a user's proximity and ambient light and control the electronic device's functions. The proximity sensor and ambient light sensor are located on different sides of the sensor IC such that the proximity sensor and ambient light sensor are positioned within the sensor IC facing outward in different (e.g., opposite) directions within the package to align toward the user and the ambient light experienced by the user. In this way, the ambient light sensor can be oriented in the direction of ambient light perceived by a user of the electronic device, and the proximity sensor detects the user from different sides of the electronic device.

Description

[Technical Field]

[0001] Priority application

[0001] This application claims priority to U.S. patent application Ser. No. 17 / 930,121, filed Sep. 7, 2022, entitled "SENSOR INTEGRATED CIRCUIT (IC) WITH OPPOSITE FACING AMBIENT LIGHT SENSOR AND PROXIMITY SENSOR, AND RELATED ELECTRONIC DEVICES AND FABRICATION METHODS," the entire contents of which are incorporated herein by reference. [Background technology]

[0002] I. Areas of Disclosure

[0002] The field of the disclosure relates to electronic devices, such as reality computing devices, that incorporate an ambient sensor for detecting ambient light to control the brightness of a display and a proximity sensor for detecting a user to control the operating mode of the electronic device.

[0003] II. Background technology Computing devices can be used for extended reality applications, including virtual reality (VR), augmented reality (AR), and extended reality (XR) applications. For example, a reality computing device can display captured real-world objects on a screen along with computer-generated information, such as images or text information. VR is a simulated experience that can be similar to the real world or completely different. AR is a technology that alters the perception of reality by digitally overlaying information on a live camera feed. XR, on the other hand, blends the physical and virtual worlds and extends them into and beyond the background. A mobile computing device can be used as a computing device for a reality device while also providing users with access to various information via a wireless communication system. One example of a reality mobile computing device is an electronic device in the form of head-mounted XR glasses, such as the XR glasses 100 shown in FIG. 1. The XR glasses 100 are electronic computing devices that include a computing device 102 that controls an integrated display 104 integrated into lenses 106, allowing a user to view either VR images and / or the real world with objects added by the computing device 102.

[0004]

[0004] A reality computing device may include an integrated circuit (IC) that includes ambient light sensor(s) and proximity sensor(s) to address specific functions. The ambient light sensor is used in the reality computing device to detect ambient light conditions of the reality computing device. The reality computing device may include an electronic device that can control display brightness based on ambient light conditions detected by the ambient light sensor. The ambient light sensor(s) are typically integrated into the reality computing device so that the ambient light sensor(s) face outward from the user, thereby detecting light from generally the same direction as received by the user. A proximity sensor is integrated into the reality computing device to detect whether the user is wearing the reality computing device (e.g., whether the reality computing device is glasses or a head mask). The reality computing device may control its operating mode based on the proximity sensor detecting the user as an object. For example, if the proximity sensor detects a user, the reality computing device may transition to an active power mode in which the reality computing device may operate at a higher power consumption to operate at a higher performance level. If the proximity sensor no longer detects a user for a defined period of time, the reality computing device may transition to an idle or sleep power mode to conserve power, as higher performance is not important in this mode. The proximity sensor is typically integrated into the reality computing device such that the proximity sensor faces (e.g., points toward) the user, depending on how the reality computing device is oriented when worn by the user, so that the proximity sensor may detect use of the reality computing device by the user. Summary of the Invention

[0005] Aspects disclosed herein include a sensor integrated circuit (IC) employing opposing ambient light and proximity sensors. Related electronic devices and manufacturing methods are also disclosed. The sensor IC may be included in a reality computing electronic device, such as a user mobile and / or wearable reality computing device, by way of example. The ambient light sensor receives ambient light within the ambient light sensor's peripheral field of view in the sensor IC's environment. By way of example, an electronic device including the sensor IC may adjust the brightness of a display(s) of the electronic device based on the amount of ambient light detected by the ambient light sensor. The proximity sensor is configured to emit light at a field of view within the emission field from the sensor IC and detect returned emitted light within its proximity field of view that has been reflected or scattered from another object, such as a user. By way of another example, an electronic device including the sensor IC may adjust its operating mode based on detecting the amount of returned emitted light as an indication of a detected user of the electronic device. Due to the inherent configuration of electronic devices, it may be important for the proximity sensor and ambient light sensor to face outward in different and / or opposite directions from each other, so that a user of the electronic device is detected from one side of the electronic device opposite the side from which the user would perceive ambient light. Accordingly, in an exemplary aspect, a sensor IC is provided that includes a proximity sensor and an ambient light sensor disposed adjacent to each other on different (e.g., opposite) sides of the sensor IC. The proximity sensor and ambient light sensor may be disposed within the sensor IC so as to face outward in opposite directions from each other within a single package. As an example, this arrangement may also make a wearable electronic device incorporating the sensor IC more ergonomically feasible for integration into a wearable device because, because the wearable electronic device is designed to be worn, the orientations of the proximity sensor and ambient light sensor on different (e.g., opposite) sides within the sensor IC may be automatically aligned toward the user and the ambient light they experience.Furthermore, by having the proximity sensor and ambient light sensor facing in different directions as integrated components within a single sensor IC, the extra cost and / or area that would result from having to provide such sensors in multiple packages to allow them to be placed within an electronic device facing outward in different directions may be avoided.

[0006] In yet another exemplary aspect, the proximity sensor and the ambient light sensor may be positioned adjacent to each other on different (e.g., opposite) sides of the sensor IC, thereby preventing the ambient field of view of the ambient light sensor from overlapping with the emission field of the proximity sensor. This is so that light emitted by the proximity sensor is not received by the ambient light sensor, or is received at a reduced intensity, because it would be erroneously indicated as ambient light. This may improve the accuracy of ambient light detection by the ambient light sensor, which may in turn enable an electronic device incorporating the sensor IC to adjust the brightness of a display(s) based on accurate detection of ambient light.

[0007] In one exemplary aspect, the ambient light sensor of the sensor IC includes an ambient visible light receiver (e.g., a PD) configured to receive visible light within a peripheral field of view in a first direction toward a first side of the sensor IC to detect ambient light within the peripheral field of view. The proximity sensor of the sensor IC includes a proximity light emitter (e.g., a light-emitting diode (LED)) configured to emit light (e.g., infrared (IR) light) within an emission field in a second direction opposite the first direction and outward from the second side of the sensor IC package. For example, the first and second sides of the sensor IC can be opposite sides. The proximity sensor also includes a proximity light receiver (e.g., a photodetector (PD)) configured to receive light (e.g., infrared (IR) light) emitted from the proximity light returned within its proximity field of view in the first direction toward the second side of the IC to enable detection of an object proximate to the IC.

[0008]

[0008] Furthermore, because the ambient visible light receiver may also be sensitive to receiving ambient IR light, the sensor IC may also include an optional ambient IR light receiver disposed on a second side of the sensor IC and configured to receive the ambient IR light. An electronic device incorporating the sensor IC may use the IR light level detected by the optional ambient IR light receiver to correct (e.g., reduce or eliminate) the IR light received by the ambient visible light receiver. As another example, an optical filter may be provided that is disposed within the peripheral field of view of the ambient visible light receiver to filter out or reduce the amount of IR light received by the ambient visible light receiver.

[0009] In another exemplary aspect, a sensor IC includes a circuit board and one or more semiconductor dies (“die”) mounted on the circuit board. The proximity sensor and the ambient light sensor may share the circuit board as a common circuit board to limit pins, area, and cost of the sensor IC package. In one example, the ambient light sensor is disposed adjacent to a first die in the sensor IC package, and the proximity sensor is disposed adjacent to a second die in the sensor IC package. The second die, as the top die, may be vertically stacked on top of the first die, as the bottom die, as a three-dimensional (3D) stacked die module, with a first bottom side of the first die disposed on or coupled to a first top surface of the circuit board. The first bottom side of the first die is opposite a second top side of the second die. In another example, the first die and the second die may be disposed side-by-side adjacent to each other, with each of their first bottom sides disposed on or coupled to a first top surface of the circuit board. The first bottom sides of the first die and the second die are adjacent to the top surface of the sensor IC package, and the second top sides of the first die and the second die are opposite the first bottom sides. The ambient light sensor is disposed on or adjacent to the first bottom side of the first die so that its ambient field of view is in a first direction outward from the first side of the sensor IC package. The proximity sensor is disposed on or adjacent to the second top side of the second die on the second side of the sensor IC so that its proximity emission field is in a second direction opposite the first direction and outward from the second side of the sensor IC package. In this way, light emitted by the proximity sensor is within the proximity emission field in the second direction outward from the second side of the sensor IC and is outside the ambient field of view of the ambient sensor.

[0010]

[0010] In another example, a light pipe is provided within the circuit board to provide the ambient sensor with a peripheral field of view that is not obstructed by the circuit board. In one example, the light pipe includes an opening extending between a first surface and a second surface of the circuit board, the opening being adjacent to the ambient sensor. The opening forms the peripheral field of view of the ambient light sensor. In this manner, the ambient light sensor can receive ambient light in a first direction directed toward the first side of the sensor IC and the second surface of the circuit board through the opening in the circuit board that forms the peripheral field of view. The diameter of the opening can be sized to control the desired angle of the peripheral field of view as a filtering (i.e., blocking) method. In another example, an optical filter can be disposed within the opening or on the second surface of the circuit board over the opening to filter light of wavelengths included in the light emitted by the proximity sensor.

[0011] In this regard, in one exemplary aspect, an integrated circuit is provided. The IC includes a first die including a first side and a second side opposite the first side. The IC also includes an ambient light sensor adjacent to the first side of the first die, the ambient light sensor facing outward from the first side of the first die in a first direction. The IC also includes a proximity sensor adjacent to the second side of the first die, the proximity sensor facing outward from the second side of the first die in a second direction opposite the first direction.

[0012] In another exemplary aspect, a method of manufacturing an IC is provided. The method includes providing a first die including a first side and a second side opposite the first side. The method also includes coupling an ambient light sensor adjacent to the first side of the first die, facing outward from the first side of the first die in a first direction. The method also includes coupling a proximity sensor adjacent to the second side of the first die, facing outward from the second side of the first die in a second direction opposite the first direction.

[0013] In another exemplary aspect, an electronic device is provided. The electronic device includes a computing device and a display coupled to the computing device. The electronic device also includes an IC coupled to the computing device. The IC includes a first die including a first side and a second side opposite the first side. The IC also includes an ambient light sensor adjacent to the first side of the first die, the ambient light sensor facing outward from the first side of the first die in a first direction. The IC also includes a proximity sensor adjacent to the second side of the first die, the proximity sensor facing outward from the second side of the first die in a second direction opposite the first direction. The ambient light sensor is configured to receive visible light within a peripheral field of view in the second direction toward the first side of the first die and generate an ambient light signal including ambient light information indicative of the amount of visible light received. The proximity sensor is configured to emit a first light in a first direction outward from the second side of the first die into an emission field, receive at least a portion of the first light returned in a second direction toward the second side of the first die into a proximity field of view, and generate a proximity signal including proximity information indicative of a proximity of an object to the IC. The computing device is configured to receive the ambient light signal and control a brightness of a display based on the ambient light information in the ambient light signal, and receive the proximity signal and control an operating mode of the computing device based on the proximity information in the proximity signal. [Brief explanation of the drawings]

[0014] [Figure 1]

[0014] FIG. 1 is a perspective view of an exemplary electronic device in the form of wearable reality computer glasses that includes an integrated computing system for controlling an integrated display. [Figure 2A]

[0015] FIG. 1 is a side view of an exemplary sensor integrated circuit (IC) including opposing proximity sensors and an ambient light sensor. [Figure 2B] FIG. 1 is a side view of an exemplary sensor integrated circuit (IC) including opposing proximity sensors and an ambient light sensor. [Figure 3]

[0016] FIG. 1 is a side view of a sensor IC including an ambient light sensor and a proximity sensor facing in the same direction from the sensor IC. [Figure 4]

[0017] FIG. 2C is a block diagram of the sensor IC of FIGS. 2A and 2B including a proximity sensor configured to detect the proximity of an object and an ambient light sensor configured to detect ambient light. [Figure 5]

[0018] FIG. 10 is a side view of another example sensor IC including a first die and a second die stacked on top of each other adjacent to a circuit board and coupled to the circuit board, the sensor IC including an ambient light sensor facing outward from a first side of the sensor IC and a proximity sensor facing outward from a second side of the sensor IC opposite the first side of the sensor IC. [Figure 6]

[0019] FIG. 10 is a side view of another sensor IC including first and second dies arranged side-by-side adjacent to each other on a circuit board, the sensor IC including an ambient light sensor facing outward from a first side of the sensor IC and a proximity sensor facing outward from a second side of the sensor IC opposite the first side. [Figure 7]

[0020] 7 is a side view of another exemplary sensor IC similar to the sensor IC of FIG. 6 with a first die and a second die disposed between outer circuit substrates. [Figure 8]

[0021] FIG. 5 is a side view of another exemplary sensor IC similar to the sensor IC of FIG. 4, but including a second lower circuit board disposed adjacent to the ambient light sensor and including a light pipe that allows the ambient field of view of the ambient light sensor to extend beyond the second circuit board. [Figure 9A]

[0022] FIG. 1 is a front perspective view of an electronic device in the form of extended reality (XR) glasses including a sensor IC mounted on a nose bridge of the XR glasses, the sensor IC including opposing proximity sensors and ambient light sensors, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 9B]FIG. 1 is a rear perspective view of an electronic device in the form of extended reality (XR) glasses including a sensor IC mounted on a nose bridge of the XR glasses, the sensor IC including opposing proximity sensors and ambient light sensors, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 10A]

[0023] FIG. 9C is a front perspective view of the XR glasses of FIGS. 9A and 9B, but with a sensor IC mounted on the left and / or right arms of the XR glasses. [Figure 10B] FIG. 9C is a side view of the XR glasses of FIGS. 9A and 9B, but with a sensor IC mounted on the left and / or right arms of the XR glasses. [Figure 11A]

[0024] FIG. 10 is a front perspective view of an electronic device in the form of a head-mounted virtual reality (VR) display device including a sensor IC including opposing proximity sensors and ambient light sensors, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 11B] FIG. 10 is a rear perspective view of an electronic device in the form of a head-mounted virtual reality (VR) display device including a sensor IC including opposing proximity sensors and ambient light sensors, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 12]

[0025] 9 is a flowchart illustrating an exemplary manufacturing process for manufacturing a sensor IC including an opposing proximity sensor and an ambient light sensor, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 13A]

[0026] 9 is a flowchart illustrating another exemplary manufacturing process for manufacturing a sensor IC including an opposing proximity sensor and an ambient light sensor, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 13B] 9 is a flowchart illustrating another exemplary manufacturing process for manufacturing a sensor IC including an opposing proximity sensor and an ambient light sensor, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 13C] 9 is a flowchart illustrating another exemplary manufacturing process for manufacturing a sensor IC including an opposing proximity sensor and an ambient light sensor, including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8. [Figure 14A]

[0027] 13A-13C illustrate exemplary manufacturing stages during the manufacture of a sensor IC according to the exemplary manufacturing process of FIGS. 13A-13C. [Figure 14B] 13A-13C illustrate exemplary manufacturing stages during the manufacture of a sensor IC according to the exemplary manufacturing process of FIGS. 13A-13C. [Figure 14C] 13A-13C illustrate exemplary manufacturing stages during the manufacture of a sensor IC according to the exemplary manufacturing process of FIGS. 13A-13C. [Figure 14D] 13A-13C illustrate exemplary manufacturing stages during the manufacture of a sensor IC according to the exemplary manufacturing process of FIGS. 13A-13C. [Figure 14E] 13A-13C illustrate exemplary manufacturing stages during the manufacture of a sensor IC according to the exemplary manufacturing process of FIGS. 13A-13C. [Figure 15]

[0028] FIG. 12 is a block diagram of an exemplary electronic device in the form of a processor-based system that may include a sensor IC including opposing proximity sensors and an ambient light sensor, manufactured according to a manufacturing process including but not limited to the sensor ICs of FIGS. 2A and 2B and 4-8, and including but not limited to the exemplary manufacturing process of FIGS. 12-13C. DETAILED DESCRIPTION OF THE INVENTION

[0015]

[0029] Some exemplary aspects of the present disclosure will now be described with reference to the drawings. The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects.

[0016]

[0030] Aspects disclosed herein include a sensor integrated circuit (IC) that uses opposing ambient light and proximity sensors. Related electronic devices and manufacturing methods are also disclosed. The sensor IC, by way of example, can be included in a reality computing electronic device, such as a user mobile and / or wearable reality computing device. The ambient light sensor receives ambient light within the ambient light sensor's peripheral field of view in the sensor IC's environment. As an example, an electronic device including the sensor IC may adjust the brightness of the electronic device's display(s) based on the amount of ambient light detected by the ambient light sensor. The proximity sensor is configured to emit light at a field of view within the emission field from the sensor IC and detect emitted light returned within its proximity field of view that has been reflected or scattered from another object, such as a user. As another example, an electronic device including the sensor IC can adjust its operating mode based on detecting the amount of returned emitted light as an indication of a detected user of the electronic device. Due to the inherent configuration of electronic devices, it may be important for the proximity sensor and the ambient light sensor to face outward in different and / or opposite directions from each other, so that a user of the electronic device is detected from one side of the electronic device opposite the side from which the user would perceive ambient light. Accordingly, in an exemplary aspect, a sensor IC is provided that includes a proximity sensor and an ambient light sensor disposed adjacent to each other on different (e.g., opposite) sides of the sensor IC. The proximity sensor and the ambient light sensor may be disposed within the sensor IC so as to face outward in opposite directions from each other within a single package. As an example, this arrangement may also make a wearable electronic device incorporating the sensor IC more ergonomically feasible for integration into a wearable device because, because the wearable electronic device is designed to be worn, the orientations of the proximity sensor and the ambient light sensor on different (e.g., opposite) sides within the sensor IC may be automatically aligned toward the user and the ambient light that the user experiences.Furthermore, by arranging the proximity sensor and ambient light sensor facing in different directions as integrated components within a single sensor IC, the extra cost and / or area that would result from having to provide such sensors in multiple packages to allow them to be positioned within an electronic device facing outward in different directions may be avoided.

[0017]

[0031] In yet another exemplary aspect, the proximity sensor and the ambient light sensor may be positioned adjacent to each other on different (e.g., opposite) sides of the sensor IC, thereby preventing the ambient field of view of the ambient light sensor from overlapping with the emission field of the proximity sensor. This is so that light emitted by the proximity sensor is not received by the ambient light sensor, or is received at a reduced intensity, because it would be erroneously indicated as ambient light. This may improve the accuracy of ambient light detection by the ambient light sensor, which may in turn enable an electronic device incorporating the sensor IC to adjust the brightness of its display(s) based on accurate detection of ambient light.

[0018]

[0032] 2A and 2B are side views of an exemplary sensor IC 200 including a proximity sensor 202 and an ambient light sensor 204. As described in more detail below, the proximity sensor 202 is positioned within the sensor IC 200 so as to face away from the ambient light sensor 204. In this example, the proximity sensor 202 is positioned within the sensor IC 200 so as to face away from the ambient light sensor 204 in the vertical direction (Z-axis direction), but is not so limited. The sensor IC 200 may be included within a computing electronic device, such as a mobile and / or wearable reality computing device, to detect the proximity of a user of the electronic device and to detect ambient light around the electronic device, by way of example.

[0019]

[0033] 2A , the ambient light sensor 204 in the sensor IC 200 of FIG. 2 includes a visible light receiver 206 configured to detect visible light in ambient visible light 208 in the environment of the sensor IC 200 from a first direction D1 (vertical Z-axis direction) in a peripheral field of view 210 having a first central axis A1 in the environment of the sensor IC 200. The first central axis A1 extends in a vertical direction (Z-axis direction) that is perpendicular to the horizontal directions (X-axis direction and Y-axis direction). As an example, an electronic device including the sensor IC 200 may adjust the brightness of a display(s) of the electronic device based on the amount of ambient visible light 208 detected by the visible light receiver 206.

[0020]

[0034] Even if the visible light receiver 206 of the ambient light sensor 204 is configured to receive and detect visible light, the visible light receiver 206 may also detect some IR light. It may be desirable to correct for this detected IR light in the detected ambient visible light 208 so that the IR light received by the ambient light sensor 204 is not used or its influence is reduced to indicate the amount of visible light observed by a user of the electronic device. In this regard, the ambient light sensor 204 in the sensor IC 200 of FIG. 2 in this example also includes an optional second receiver 212, which in this example is an IR light receiver. The second receiver 212 is configured to receive and detect ambient IR light 208R in the ambient visible light 208. Thus, in one example, the electronic device including the sensor IC 200 can interface with the second receiver 212 to receive an indication of the amount of IR light detected in the ambient visible light 208 and correct the amount of ambient visible light 208 detected by the visible light receiver 206 (e.g., subtract the amount of IR light from the amount of ambient visible light 208), thereby providing a more accurate representation of the amount of visible light detected in the ambient visible light 208.

[0021]

[0035] 2A , the proximity sensor 202 in the sensor IC 200 in this example includes a light emitter 214 configured to emit a first light 216 in a second direction D2 (vertical Z-axis direction) within an emission field 218 having a second central axis A2. The second central axis A2 extends in a vertical direction (Z-axis direction) perpendicular to the horizontal directions (X-axis direction and Y-axis direction). For example, the light emitter 214 may be a light-emitting device (LED). The light emitter 214 may be an infrared (IR) emitter (e.g., an IR LED) configured to emit IR light as the first light 216. The proximity sensor 202 also includes a proximity light receiver 220 configured to detect at least a portion of the first light 216 reflected and / or scattered from the object as light 216R within a proximity field of view 222 returned to the proximity light receiver 220. For example, the proximity light receiver 220 may be a photodetector, more specifically, an IR photodetector configured to detect IR light. As an example, an electronic device including the sensor IC 200 can use information about the amount of returned light 216R as an indication of the detected user of the electronic device and then adjust its operational mode accordingly. For example, it may be desirable to use the proximity sensor 202 to place the electronic device into an active or ready mode when an object is detected as an indication that a user is using the electronic device.

[0022]

[0036] To enable the proximity sensor 202 and the ambient light sensor 204 to be provided as part of the same sensor IC 200 and further to be used in an electronic device to detect the proximity of a user and ambient light from opposite sides of the sensor IC 200, the proximity sensor 202 and the ambient light sensor 204 are disposed adjacent to different (e.g., opposite) sides S1, S2 of the sensor IC 200. This is shown in a side view of the sensor IC 200 in FIG. 2B . As shown in FIG. 2B , the sensor IC 200 is provided in the form of an IC package 224. The IC package 224 includes a first die 226, the ambient light sensor 204, and the proximity sensor 202, encapsulated within an overmold material 228 to form the IC package 224. The first die 226 includes circuitry configured to interface with the ambient light sensor 204 and the proximity sensor 202 to detect ambient light and objects in proximity to the sensor IC 200, such as for the reasons previously described above. The first die 226 is coupled to pins 230 of the IC package 224 via wire bonds 232. The first die 226 has a first surface 234(1) on a first side 236(1) and a second surface 234(2) on a second side 236(2) opposite the first side 236(1) in the vertical direction (Z-axis direction). The first side 236(1) of the first die 226 is on a first side S1 of the sensor IC 200 and the IC package 224. The second side 236(2) of the first die 226 is on a second side S2 of the sensor IC 200 and the IC package 224.

[0023]

[0037] 2B , the first die 226 is also coupled to the first and second optical receivers 206 and 212 of the ambient light sensor 204 via wire bonds 238. The first and second optical receivers 206 and 212 of the ambient light sensor 204 are adjacent to a first surface 234(1) of the first die 226 on a first side 236(1) of the first die 226 on the first side S1 of the IC package 224. The first and second optical receivers 206 and 212 of the ambient light sensor 204 are oriented vertically (in the Z-axis direction) in a third direction D3 such that their detector components 240 and 242 face outward from the first side S1 of the IC package 224. The detector components 240 and 242 are components that receive light and sense electromagnetic radiation of the received light, such as through the photoelectric effect or the photochemical effect. Thus, the first light receiver 206 and the second light receiver 212 of the ambient light sensor 204 are configured to receive ambient visible light 208 (shown in FIG. 2A) emitted in a first direction D1 toward the first side 236(1) of the first die 226 on the first side S1 of the IC package 224 (also toward the second direction D2).

[0024]

[0038] 2B , the light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are located on a second side 236(2) of the first die 226, adjacent to a second surface 234(2) of the first die 226, on the second side S2 of the IC package 224. The light emitter 214 is directly coupled to the second surface 234(2) of the first die 226 and is electrically connected to the first die 226. The proximity light receiver 220 is electrically coupled to the first die 226 via wire bond(s) 239. The light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are oriented in a second direction D2, perpendicular to the third direction D3 in which the ambient light sensor 204 faces (the Z-axis direction), so that their respective light emitter and detector components 244 and 246 face outward from the second side S2 of the IC package 224. The light emitter component 244 is the component of the light emitter 214 that emits light. The detector component 246 of the proximity light receiver 220 is the component that receives light and senses the received optical electromagnetic radiation, such as through the photoelectric effect or the photochemical effect. Thus, the light emitter 214 of the proximity sensor 202 is configured to emit a first light 216 (see FIG. 2A ) in the second direction D2 outward from the second side 236(2) of the first die 226 on the second side S2 of the IC package 224. The proximity light receiver 220 of the proximity sensor 202 is configured to receive and detect light (including light 216 emitted from the light emitter 214 shown in FIG. 2A) emitted in a fourth direction D4 toward the second side 236(2) of the first die 226 on the second side S2 of the IC package 224 (also toward the first direction D1).

[0025]

[0039] In this manner, the placement of sensor IC 200 allows sensor IC 200 to be integrated into an electronic device in a more ergonomically feasible manner because, because wearable electronic devices are designed to be worn, the orientation of the proximity sensor and ambient light sensor on different (e.g., opposite) sides within the sensor IC can be automatically aligned toward the user and the ambient light the user experiences. Furthermore, by placing the proximity sensor 202 and ambient light sensor 204 facing in different directions as integrated components within a single sensor IC 200, the extra cost and / or area of ​​having to provide such proximity sensor 202 and ambient light sensor 204 in multiple packages to allow such sensors to be placed within an electronic device facing outward in different directions can be avoided.

[0026]

[0040] 2A , the ambient field of view 210 of the ambient light sensor 204 and the emission field 218 of the proximity sensor 202 may not overlap, such that light 216 emitted by the proximity sensor 202 is not received by the ambient light sensor 204 or is received at a reduced intensity because it would be erroneously indicated as ambient light. This may improve the accuracy of ambient light detection by the ambient light sensor 204, which may in turn enable an electronic device incorporating the sensor IC 200 to adjust the brightness of its display(s) based on accurate detection of the ambient visible light 208. This arrangement may also make a wearable electronic device incorporating the sensor IC 200 more ergonomically feasible for integration into a wearable device because, because the wearable electronic device is designed to be worn, the orientation of the proximity sensor 202 and the ambient light sensor 204 on different (e.g., opposite) sides S1, S2 of the IC package 224 within the sensor IC 200 may be automatically aligned toward the user and the ambient visible light 208 that the user receives.

[0027]

[0041] 2A and 2B differs from a sensor IC that incorporates a proximity sensor and an ambient light sensor on the same side of the sensor IC, such as the sensor IC 300 shown in FIG. 3, where both sensors emit and receive light on the same side of the sensor IC. As shown in FIG. 3, the sensor IC 300 includes a proximity sensor 302 and an ambient light sensor 304 that are both adjacently disposed on the same second side 306(2) of the die 308. The second side 306(2) of the die 308 is on the second side S4 of the sensor IC 300. The first side 306(1) of the die 308 is on the first side S3 of the sensor IC 300. In this configuration of the sensor IC 300 in FIG. 3, the proximity sensor 302 and the ambient light sensor 304 within the sensor IC 300 are oriented outward from the same side S4 of the sensor IC 300, which may prevent the sensor IC 300 from being properly incorporated into a wearable electronic device. Thus, either the proximity sensor 302 or the ambient light sensor 304 that are part of the same sensor IC 300 and its package will not only not be aligned toward the user to detect the user's proximity to the electronic device that includes the sensor IC 300, but will also not be aligned toward the direction of ambient light as perceived by the user of the electronic device. Also, in the sensor IC 300 of FIG. 3, the ambient light sensor 304 may receive light emitted by the proximity sensor 302, which can result in inaccurate ambient light detection.

[0028]

[0042] FIG. 4 is a block diagram of the sensor IC 200 of FIGS. 2A and 2B and illustrates an example architecture of components within the sensor IC 200, including the proximity sensor 202 and the ambient light sensor 204. As shown in FIG. 4, the proximity sensor 202 includes an emitter 214 that includes an emitter component 244, in this example, in the form of an IR LED 402. The IR LED 402 is oriented to emit light outward from the sensor IC 200, as shown in FIG. 2A and described above. The proximity sensor 202 includes an IR LED driver circuit 403 configured to drive current to the IR LED 402, causing the IR LED 402 to emit IR light (also referred to herein as “IR light 216”) as the first light 216. The proximity sensor 202 also includes a proximity light receiver 220 that includes a detector component 246 in the form of an IR light detector 404 if an object is within the path of the IR light 216 and reflects or scatters at least a portion of the IR light 216 back to the emitter 214 as returned light 216R. The IR photodetector 404 is configured to receive and detect IR light, including the returned light 216R. The proximity light receiver 220 also includes a light removal amplifier 406 that is configured to amplify the signal received from the IR photodetector 404 that is generated as a result of the IR light being absorbed by the IR photodetector 404.

[0029]

[0043] 4 , the sensor IC 200 also includes an ambient light sensor 204 that includes a visible light receiver 206. In this example, the detector component 240 includes an optical filter 407 configured to receive and filter the ambient visible light 208 and direct the filtered ambient visible light 208 to the detector component 240 in the form of a visible light detector 408. The visible light detector 408 is coupled to an amplifier 410 (e.g., an operational amplifier) ​​to amplify a signal generated by the visible light detector 408 in response to receiving the ambient visible light 208. In this example, to share front-end circuitry between the proximity sensor 202 and the ambient light sensor 204, the sensor IC 200 includes a shared analog switch 411. An analog switch 411 can be switched to couple either the proximity sensor 202 or the ambient light sensor 204 to an analog-to-digital (ADC) controller 412 circuit, which converts the proximity signal 414(1) and the ambient light signal 414(2) generated by the proximity light receiver 220 and the visible light receiver 206, respectively, into a digital signal 415 representative of the detected light 216R, 208. The sensor IC 200 includes a selection logic circuit 416 controlled via a data register 424 to switch the analog switch 411.

[0030]

[0044] The sensor IC 200 also includes a corresponding proximity sensor control logic circuit 418 configured to activate and deactivate an LED pulse generator 420 in the light emitter 214 in the proximity sensor 202, to cause the IR LED driver circuit 403 to cause the IR LED 402 to emit IR light 216. The proximity sensor control logic circuit 418 is also configured to receive a digital signal 415 indicative of the amount of returned light 216R detected by the proximity light receiver 220. The sensor IC 200 also includes an ambient light control logic circuit 422 configured to receive a digital signal 415 indicative of the amount of ambient visible light 208 detected by the visible light receiver 206 of the ambient light sensor 204. The ambient light control logic circuit 422 and the proximity sensor control logic circuit 418 are interfaced to a data register 424 that can be written to by a controller, such as a microcontroller or microprocessor, via an interface circuit 426. The data registers 424 are mapped to specific registers assigned to the proximity sensor 202 and the ambient light sensor 204, thereby allowing an external device to control the operation of the proximity sensor 202 and the ambient light sensor 204 by writing data to these specific registers. The ambient light control logic 422 and the proximity sensor control logic 418 also write data received via digital signals 415 regarding the detected returned light 216R and the detected ambient visible light 208 from the proximity sensor 202 and the ambient light sensor 204 to determine whether an object is detected in proximity and the ambient light conditions of the sensor IC 400.

[0031]

[0045] 4 , an electronic device 428 as part of a computing device 430 may interface with the sensor IC 200 via the interface circuitry 426 of the sensor IC 200. The electronic device 428 may include a controller 432 (e.g., a microcontroller, a microprocessor) that interfaces with the interface circuitry 426 of the sensor IC 200 to control certain features of the electronic device 428 using proximity and ambient light data from the sensor IC 200. For example, the computing device 430 may include a display 434 under the control of the controller 432. The controller 432 is configured to retrieve or receive ambient light information 436 from the sensor IC 200 via the interface circuitry 426, the ambient light information 436 indicating the amount of ambient visible light 208 detected by the ambient light sensor 204. The controller 432 is also configured to retrieve or receive proximity information 438 from the sensor IC 200 via the interface circuitry 426, the ambient light information 436 indicating the proximity of an object detected by the proximity sensor 202. The controller 432 may be configured to control the brightness of the display 434 based on the ambient light information 436. For example, the controller 432 may reduce the brightness of the display 434 in response to an increase in the amount of detected ambient visible light 208. The controller 432 may also be configured to control the operating mode of the electronic device 428 based on the proximity information 438. For example, the controller 432 may cause the electronic device 428 to enter an idle mode or a sleep mode with limited functionality based on the proximity information 438 to reduce power consumption when an object (e.g., a user) is not detected. The controller 432 may cause the electronic device 428 to enter an active mode or an awake mode with increased functionality that consumes more power based on the proximity information 438 when an object (e.g., a user) is detected.

[0032]

[0046] To reduce or prevent the ambient light sensor from receiving light emitted from the proximity sensor, a sensor IC having a proximity sensor oriented to face away from the ambient light sensor may be provided in other packaging configurations besides IC package 224 of sensor IC 200 of FIG. 200. In this regard, FIG. 5 is a side view of another exemplary sensor IC 500 including an IC package 502 including, in this example, a first bottom die 504(1) and a second top die 504(2) stacked adjacent to and vertically (in the Z-axis direction) on top of each other. The first die 504(1) is coupled to a circuit board 506 as part of the IC package 502. Note that the circuit board 506 may be, by way of example, a printed circuit board (PCB) or a package substrate. Pins 508 physically and electrically couple the first die 504(1) and the second die, 504(2), to the circuit board 506. 2A and 2B, an ambient light sensor 204 is disposed adjacent to and coupled to a first side 510(1) of a first die 504(1). The first die 504(1) also has a second side 510(2) adjacent to a first side 511(1) of a second die 504(2).

[0033]

[0047] The ambient light sensor 204 in the sensor IC 500 of FIG. 5 has only a visible light receiver 206. The previous description of the ambient light sensor 204 and its light emission in the sensor IC 200 of FIGS. 2A and 2B can be applied to the ambient light sensor 204 in the sensor IC 500 of FIG. 5. The ambient light sensor 204 is oriented vertically (in the Z-axis direction) outward from the first side S5 of the IC package 502 in a fifth direction D5. The proximity sensor 202 is disposed adjacent to and coupled to the second side 511(2) of the second die 504(2) and oriented vertically (in the Z-axis direction) outward from the second side S6 of the IC package 502 in a sixth direction D6 opposite the fifth direction D5. The proximity sensor 202 in the sensor IC 500 of FIG. 5 can be similar to the proximity sensor 202 in the sensor IC 200 of FIGS. 2A and 2B. Thus, in this orientation, the proximity sensor 202 is oriented to face away from the ambient light sensor 204, as provided in the sensor IC 200 of Figures 2A and 2B, to reduce or avoid the ambient light sensor receiving light emitted from the proximity sensor 202.

[0034]

[0048] 5 , circuit board 506 has a first surface 512(1) and a second surface 512(2) vertically (in the Z-axis direction) opposite first surface 512(1). First die 504(1) is coupled adjacent to second surface 512(2) of circuit board 506. To prevent circuit board 506 from obstructing the peripheral field of view 210 of ambient light sensor 204, circuit board 506 also includes a light pipe 518. Light pipe 518, in this example, is an opening 520 in circuit board 506 that extends from first surface 512(1) to second surface 512(2). First die 504(1) is coupled to ambient light sensor 204 and is positioned on circuit board 506 such that ambient light sensor 204 is positioned adjacent to opening 520. In this manner, detector component 240 of ambient light sensor 204 is provided with a field of view 210 for receiving ambient light through opening 520 in circuit board 506. Opening 520 in circuit board 506 has a first diameter DIA1 that controls an angle Φ1 of ambient field of view 210 for receiving ambient light emitted in a sixth direction D6 toward second surface 512(1) of circuit board 506 and first side 510(1) of first die 504(1).

[0035]

[0049] FIG. 6 is a side view of another sensor IC 600 that is similar to the sensor IC 500 of FIG. 5, except that the sensor IC 600 of FIG. 6 has a first die 504(1) and a second die 504(2) arranged side-by-side adjacent to each other on a circuit board 506. Common elements between the sensor IC 500 of FIG. 5 and the sensor IC 600 of FIG. 6 are indicated with common element numbers and will not be described again. The first die 504(1) is arranged on the second surface 512(1) of the circuit board 506, adjacent to the second surface 512(1). The second die 504(2) is also arranged on the second surface 512(1) of the circuit board 506. The second die 504(2) is adjacent to the first die 504(1) in the horizontal direction (X-axis and Y-axis directions). The ambient light sensor 204 is disposed adjacent to and coupled to a first side 510(1) of the first die 504(1). The ambient light sensor 204 faces outward from a first side S5 of the IC package 602 in a vertical (Z-axis) direction in a fifth direction D5. The proximity sensor 202 is disposed adjacent to and coupled to a second side 511(2) of the second die 504(2) and faces outward from a second side S6 of the IC package 502 in a vertical (Z-axis) direction opposite the fifth direction D5 in a sixth direction D6. Thus, in this orientation of the sensor IC 600, the proximity sensor 202 is oriented to face away from the ambient light sensor 204 to reduce or avoid the ambient light sensor 204 receiving light emitted from the proximity sensor 202, as provided in the sensor IC 200 of Figures 2A and 2B.

[0036]

[0050] Similar to the sensor IC 500 of FIG. 5 , in the sensor IC 600 of FIG. 6 , the circuit board 506 also includes a light pipe 518 to prevent the circuit board 506 from obscuring the peripheral field of view 210 of the ambient light sensor 204. The light pipe 518 resides in an opening 520 in the circuit board 506, which in this example extends from the first surface 512(1) to the second surface 512(2). The first die 504(1) and the ambient light sensor 204 coupled to the first die 504(1) are positioned on the circuit board 506 such that the ambient light sensor 204 is positioned adjacent to the opening 520. In this manner, the detector component 240 of the ambient light sensor 204 is provided with a peripheral field of view 210 for receiving ambient light through the opening 520 in the circuit board 506.

[0037]

[0051] FIG. 7 is a side view of another exemplary sensor IC 700 provided as an IC package 702 and similar to the sensor IC 500 of FIG. 5. However, in the sensor IC 700 of FIG. 7, a second circuit board 704 is provided within the IC package 702, and the first die 504(1) and the second die 504(2) are disposed between the first circuit board 506 and the second circuit board 704. Common elements between the sensor IC 500 of FIG. 5 and the sensor IC 700 of FIG. 7 are indicated with common element numbers and will not be described again. Because the second circuit board 704 is disposed adjacent to the second side 511(2) of the second die 504(1), the second circuit board 704 will block the emission field 218 of the light emitter 214 and the proximity field of view 222 of the proximity light receiver 220 of the proximity sensor 202. However, similar to the light pipe 518 provided in the first circuit board 506 for the ambient light sensor 204, the second circuit board 704 also includes a second light pipe 706 in the form of a second opening 710 and a third light pipe 708 in the form of a third opening 712, respectively. The light pipes 706, 708 are provided such that the emission field 218 of the light emitter 214 and the proximity field of view 222 of the proximity light receiver 220 of the proximity sensor 202, respectively, are not obstructed by the second circuit board 704.

[0038]

[0052] 7 , the second opening 710 in the second circuit board 704, in this example, extends from the first surface 714(1) of the second circuit board 704 to the second surface 714(2) of the second circuit board 704. The third opening 712 in the second circuit board 704 also extends from the first surface 714(1) of the second circuit board 704 to the second surface 714(2) of the second circuit board 704. The second die 504(2) and the proximity sensor 202 coupled to the second die 504(2) are positioned on the second circuit board 704 such that the light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are disposed adjacent the second opening 710 and the third opening 712, respectively. Thus, the light emitter 214 of the proximity sensor 202 is provided with an emission field 218 for emitting light through the second opening 710 in the second circuit board 704. The proximity light receiver 220 of the proximity sensor 202 is provided with a proximity field 222 for receiving light through the third opening 712 in the second circuit board 704.

[0039]

[0053] FIG. 8 is a side view of another exemplary sensor IC 800 provided as an IC package 802 and similar to the sensor IC 500 of FIG. 5 . However, in the sensor IC 800 of FIG. 8 , a second circuit board 804 is provided within the IC package 802 and is disposed below the first surface 512(1) of the circuit board 506. The second circuit board 804 is coupled to the circuit board 506 via an external connector 806, which may be, by way of example, a solder bump or a ball grid array (BGA) interconnect. Common elements between the sensor IC 500 of FIG. 5 and the sensor IC 800 of FIG. 8 are indicated with common element numbers and will not be described again. Because the second circuit board 804 is disposed adjacent to the first surface 512(1) of the circuit board 506, the second circuit board 804 will obstruct the peripheral field of view 210 of the visible light receiver 206 of the ambient light sensor 204. However, similar to the light pipe 518 provided in the first circuit board 506 for the ambient light sensor 204, the second circuit board 804 also includes a second light pipe 808 in the form of a second opening 810. The second light pipe 808 is provided such that the peripheral field of view 210 of the visible light receiver 206 of the ambient light sensor 204 is also not obstructed by the second circuit board 804.

[0040]

[0054] 8 , the second opening 810 in the second circuit board 804 extends, in this example, from the first surface 814(1) of the second circuit board 804 to the second surface 814(2) of the second circuit board 804. The second circuit board 804 is aligned with the first circuit board 506 such that the opening 520 in the first circuit board 506 and the second opening 810 in the second circuit board 804 at least partially overlap in the vertical direction (Z-axis direction). In this manner, the visible light receiver 206 of the ambient light sensor 204 is provided with an ambient field of view 210 for receiving light through the second opening 810 in the second circuit board 804 and the opening 520 in the first circuit board 506.

[0041]

[0055] The sensor ICs 200, 500, 600, 700, and 800 of FIGS. 2A and 2B and 4-8 may be incorporated into or integrated into electronic devices, including, but not limited to, user-wearable or mobile electronic devices, to detect ambient light and proximity. In this regard, FIGS. 9A and 9B are front and rear perspective views, respectively, of a device 900 in the form of extended reality (XR) glasses 902 designed to be worn by a user and including a sensor IC 904 mounted on a nose bridge 906 of the XR glasses 902. The sensor IC 904 may, by way of example, be any of the sensor ICs 200, 500, 600, 700, and 800 of FIGS. 2A and 2B and 4-8. The sensor IC 904 includes an opposing proximity sensor 908 and ambient light sensor 910 to reduce or prevent the ambient light sensor 910 from receiving light emitted from the proximity sensor 908. As shown in the front view of the XR glasses 902 in Figure 9A, the ambient light sensor 910 is adjacent to, exposed to, and facing outward from a front side 912 of the XR glasses 902, so that the ambient light sensor 910 receives ambient light in the same direction as perceived by a user wearing the XR glasses 902. As shown in the rear view of the XR glasses 902 in Figure 9B, the proximity sensor 908 is adjacent to, exposed to, and facing outward from a back side 914 of the XR glasses 902, so that the proximity sensor 908 can detect when a user places the XR glasses 902 near them, when they are about to put on the XR glasses 902, or when they are wearing the XR glasses 902. The orientation of the proximity sensor 908 and ambient light sensor 910, located on opposite sides of the sensor IC 904, is particularly advantageous in this configuration of the XR glasses 902 because the desired orientation is such that the proximity sensor 908 is exposed and faces outward from the back side 914 of the XR glasses 902, and the ambient light sensor 910 is exposed and faces outward from the front side 912 of the XR glasses 902.Thus, having the proximity sensor 908 and ambient light sensor 910 already located on opposite sides of the sensor IC 904 means that the sensor IC 904 can be integrated into the XR glasses 902 without having to route or re-route interfaces to the proximity sensor 908 or ambient light sensor 910 if they were not so located on opposite sides of the sensor IC 904.

[0042]

[0056] The XR glasses 902 may have an integrated display 916 that can be controlled by an electronic device 918. The electronic device 918 is also interfaced to the sensor IC 904 such that the electronic device 918 retrieves or receives ambient light information from the sensor IC 904 indicating the amount of ambient light detected by the ambient light sensor 910. The electronic device 918 may be configured to control the brightness of the display 916 based on the ambient light information. For example, the electronic device 918 may reduce the brightness of the display 916 in response to an increase in the amount of ambient light detected. The electronic device 918 is also configured to retrieve or receive proximity information from the sensor IC 904 indicating the proximity of an object detected by the proximity sensor 908. The electronic device 918 may also be configured to control an operating mode of the electronic device 918 based on the proximity information. For example, the electronic device 918 may cause the electronic device 918 to enter an idle mode or a sleep mode with limited functionality based on the proximity information to reduce power consumption when no object (e.g., a user) is detected. Based on the proximity information, the electronic device 918 can cause the electronic device 918 to enter an active mode or an awake mode with increased functionality that consumes more power when an object (e.g., a user) is detected.

[0043]

[0057] 10A and 10B are front perspective and side views, respectively, of the XR glasses 902 of FIGS. 9A and 9B , but with the sensor IC 904 mounted on a left arm 920 opposite a right arm 922 of the XR glasses 902. The left arm 920 and the right arm 924 protrude from the front of the XR glasses 902 to make it easier for a user to place the XR glasses 902 on the user's head. As shown in FIGS. 10A and 10B , in this example, the ambient light sensor 910 is adjacent to, exposed, and faces outward from an outward-facing side 924 of the left arm 922 of the XR glasses 902 such that the ambient light sensor 910 receives ambient light in an outward direction from the XR glasses 902. In this example, the proximity sensor 908 is adjacent to, exposed, and facing outward from the back side 914 of the left arm 922, allowing the proximity sensor 908 to detect when a user places the XR glasses 902 near the user, when the user is about to put on the XR glasses 902, or when the user is wearing the XR glasses 902. The orientation of the proximity sensor 908 and ambient light sensor 910 on opposite sides of the sensor IC 904 is particularly advantageous in this configuration of the XR glasses 902 because the desired orientation is for the proximity sensor 908 to be exposed and facing outward from the back side 914 of the XR glasses 902, and the ambient light sensor 910 to be exposed and facing outward from the front side 912 of the XR glasses 902.

[0044]

[0058] 11A and 11B are front and rear perspective views, respectively, of another wearable device 1100 in the form of a head-mounted virtual reality (VR) display device 1102 designed to be worn by a user, and including a sensor IC 1104 mounted on a head visor 1106 of the head-mounted VR display device 1102. The sensor IC 1104 may be, by way of example, any of the sensor ICs 200, 500, 600, 700, and 800 of FIGS. 2A and 2B and 4-8. The sensor IC 1104 includes an opposing proximity sensor 1108 and an ambient light sensor 1110 to reduce or prevent the ambient light sensor 1110 from receiving light emitted from the proximity sensor. 11A , the ambient light sensor 1110 is adjacent to, exposed to, and facing outward from a front side 1112 of the head-mounted VR display device 1102, so that the ambient light sensor 1110 receives ambient light in the same direction as perceived by a user wearing the head-mounted VR display device 1102. As shown in the rear view of the head-mounted VR display device 1102 in FIG. 11B , the proximity sensor 1108 is adjacent to, exposed to, and facing outward from a rear side 1114 of the head-mounted VR display device 1102, so that the proximity sensor 1108 can detect when the user has placed the head-mounted VR display device 1102 near them, is about to wear the head-mounted VR display device 1102, or is wearing the head-mounted VR display device 1102. The orientation of the proximity sensor 1108 and ambient light sensor 1110, located on opposite sides of the sensor IC 1104, is particularly advantageous in this configuration of the head-mounted VR display device 1102 because the desired orientation is such that the proximity sensor 1108 is exposed from the back side 1114 of the head-mounted VR display device 1102 and faces outward, and the ambient light sensor 1110 is exposed from the front side 1112 of the head-mounted VR display device 1102 and faces outward.Thus, having the proximity sensor 1108 and ambient light sensor 1110 already located on opposite sides of the sensor IC 1104 means that the sensor IC 1104 can be integrated into the head-mounted VR display device 1102 without having to route or re-route interfaces to the proximity sensor 1108 or ambient light sensor 1110 if they were not so located on opposite sides of the sensor IC 1104.

[0045]

[0059] The head-mounted VR display device 1102 may have an integrated display 1116, shown in FIG. 11B , that may be controlled by an electronic device 1118. The electronic device 1118 is also interfaced to the sensor IC 1104 such that the electronic device 1118 retrieves or receives ambient light information from the sensor IC 1104 indicating the amount of ambient light detected by the ambient light sensor 1110. The electronic device 1118 may be configured to control the brightness of the display 1116 based on the ambient light information. For example, the electronic device 1118 may reduce the brightness of the display 1116 in response to an increase in the amount of ambient light detected. The electronic device 1118 is also configured to retrieve or receive proximity information from the sensor IC 1104 indicating the proximity of an object detected by the proximity sensor 1108. The electronic device 1118 may also be configured to control an operational mode of the electronic device 1118 based on the proximity information. For example, the electronic device 1118 can use the proximity information to cause the electronic device 918 to enter an idle mode or a sleep mode with limited functionality to reduce power consumption when no object (e.g., a user) is detected, and the electronic device 1118 can use the proximity information to cause the electronic device 1118 to enter an active mode or an awake mode with increased functionality that consumes more power when an object (e.g., a user) is detected.

[0046]

[0060] A manufacturing process may be employed to fabricate sensor ICs including opposing proximity sensors and ambient light sensors, including but not limited to the sensor ICs 200, 400, 500, 600, 700, and 800 of FIGS. 2A and 2B and 4-8. In this regard, FIG. 12 is a flowchart illustrating an exemplary manufacturing process 1200 for fabricating sensor ICs including opposing proximity sensors and ambient light sensors, including but not limited to the sensor ICs 200, 400, 500, 600, 700, and 800 of FIGS. 2A and 2B and 4-8. While the manufacturing process 1200 of FIG. 12 is described with respect to the sensor IC 200 of FIG. 2, it should be noted that the manufacturing process 1200 of FIG. 12 is not limited to fabricating sensor ICs such as the sensor IC 200 of FIG. 2. The manufacturing process 1200 of FIG. 12 may be used to fabricate the sensor ICs 400, 600, 700, and 800 of FIGS. 4 and 6-8.

[0047]

[0061] In this regard, as shown in Figure 12, a first step in this example manufacturing process 1200 is to provide a first die 226 including a first side 236(1) and a second side 236(2) opposite the first side (block 1202 of Figure 12). A next step in this example manufacturing process 1200 is to couple an ambient light sensor 204 adjacent to and facing outward from the first side 236(1) of the first die 226 in a first direction D1 (block 1204 of Figure 12). The next step in the manufacturing process 1200 in this example is to bond the proximity sensor 202 adjacent to the second side 236(2) of the first die 226, facing outward from the second side 236(2) of the first die 226 in a second direction D2 opposite the first direction D1 (block 1206 of FIG. 12).

[0048]

[0062] Other manufacturing processes may be employed to fabricate sensor ICs including opposing proximity sensors and ambient light sensors, including but not limited to sensor ICs 200, 400, 500, 600, 700, and 800 of Figures 2A and 2B and 4-8. In this regard, Figures 13A-13C are a flowchart illustrating another exemplary manufacturing process 1300 for fabricating sensor ICs including opposing proximity sensors and ambient light sensors, including but not limited to sensor ICs 200, 400, 500, 600, 700, and 800 of Figures 2A and 2B and 4-8. Figures 14A-14E are exemplary manufacturing stages 1400A-1400E during the fabrication of a sensor IC according to manufacturing process 1300 of Figures 13A-13C. It should be noted that the manufacturing process 1400 in Figures 13A-13C, as shown in manufacturing stages 1400A-1400E in Figures 14A-14E, is described with reference to the sensor IC 400 of Figure 4, but is not so limited. The manufacturing process 1200 of Figure 12 may be used to manufacture the sensor ICs 200, 600, 700, 800 of Figures 2 and 6-8.

[0049]

[0063] In this regard, as shown in manufacturing stage 1400A of FIG. 14A , a second die 504(2) including a proximity sensor 202 is prepared (block 1302 of FIG. 13A ). The light emitter 214 and the proximity light receiver 220 of the proximity sensor 202 are disposed on a second side 511(2) of the second die 504(2). A light-resistant resin 1402 is also disposed within the second die 504(2) adjacent to the second side 511(2) of the second die 504(2) to provide a light barrier between the light emitter 214 and the proximity light receiver 220. Then, as shown in manufacturing stage 1400B of FIG. 14B , a first die 504(1) including an ambient light sensor 204 is prepared (block 1304 of FIG. 13A ). The visible light receiver 206 of the ambient light sensor 204 is disposed on a first side 510(1) of the first die 504(1). Then, as shown in manufacturing stage 1400C in FIG. 14C, the second die 504(2) is vertically (Z-axis direction) bonded to the first die 504(1) such that the second die 504(2) is stacked on top of the first die 504(1) (block 1306 in FIG. 13B). Then, as shown in manufacturing stage 1400D in FIG. 14D, pins 508 are formed and bonded to the first die 504(1) and the second die 504(2) (block 1308 in FIG. 13B) to provide interconnections to the first die 504(1) and the second die 504(2). An overmold material 1404 is disposed around the first die 504(1) and second die 504(2) and the pins 508 to form the IC package 224 of the sensor IC 200 (block 1308 of FIG. 13B ). Then, as shown in manufacturing stage 1400E of FIG. 14E , an opening 520 is formed in the circuit board 506, and the IC package 224 of the sensor IC 200 is mounted to the circuit board 506 (block 1310 of FIG. 13C ). The IC package 224 is coupled to the second surface 512(2) of the circuit board 506 such that the ambient light sensor 204 is positioned adjacent to the opening 520, whereby the opening 520 forms a light pipe 518 for the ambient light sensor 204 and provides the ambient field of view 210 for the ambient light sensor 204 (block 1310 of FIG. 13C ).

[0050]

[0064] It should be noted that the terms "inwardly" and "outwardly" are relative terms and are not necessarily limited to external or internal components. Also, it should be noted that components described herein as "mounted," "coupled," and "disposed on" are not limited to such components being directly or indirectly attached or coupled.

[0051]

[0065] Sensor ICs including opposing proximity sensors and ambient light sensors, including but not limited to sensor ICs 200, 400, 500, 600, 700, and 800 of Figures 2A and 2B, 4-8, and 14A-14E, manufactured according to a manufacturing process, including but not limited to example manufacturing processes 1200 and 1300 of Figures 12-13C, and manufactured according to any aspect disclosed herein, may be provided in or integrated with any processor-based device. Examples include, but are not limited to, glasses including XR glasses, head-mounted display devices, electronic watches, set-top boxes, entertainment units, navigation devices, communication devices, fixed position data units, mobile position data units, global positioning system (GPS) devices, mobile phones, mobile phones, smartphones, session initiation protocol (SIP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, laptop computers, wearable computing devices (e.g., smart watches, health or fitness trackers, eyewear, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, and vehicle components.

[0052]

[0066] In this regard, FIG. 15 illustrates an example of a processor-based system 1500 including a sensor IC 1502 including an opposing proximity sensor and an ambient light sensor, including but not limited to the sensor ICs 200, 400, 500, 600, 700, and 800 of FIGS. 2A and 2B, 4-8, and 14A-14E, manufactured according to a manufacturing process including but not limited to the example manufacturing processes 1200 and 1300 of FIGS. 12-13C, and manufactured according to any aspect disclosed herein. For example, the processor-based system 1500 can be integrated into a mobile device, including a wearable device such as XR glasses or other device(s). In this example, the processor-based system 1500 can be formed as an IC 1504 and as part of an IC package, such as a system-on-a-chip (SoC) 1506. The processor-based system 1500 includes a central processing unit (CPU) 1508, which may also be referred to as a CPU core or processor core, and includes one or more processors 1510. The CPU 1508 may have a cache memory 1512 coupled to the CPU 1508 for rapid access to temporarily stored data. The CPU 1508 is coupled to a system bus 1514, which may interconnect master and slave devices included within the processor-based system 1500. As is well known, the CPU 1508 communicates with these other devices by exchanging address, control, and data information via the system bus 1514. For example, the CPU 1508 may communicate bus transaction requests to a memory controller 1516, an example of a slave device. Although not shown in FIG. 15, multiple system buses 1514 may be provided, with each system bus 1514 constituting a different fabric.

[0053]

[0067] Other master and slave devices may be connected to the system bus 1514. As shown in FIG. 15, these devices may include, by way of example, a memory system 1520 including a memory controller 1516 and memory array(s) 1518, one or more input devices 1522, one or more output devices 1524, one or more network interface devices 1526, and one or more display controllers 1528. The input device(s) 1522 may include any type of input device, including, but not limited to, input keys, switches, audio processors, etc. The output device(s) 1524 may include any type of output device, including, but not limited to, audio indicators, video indicators, other visual indicators, etc. The network interface device(s) 1526 may be any device configured to enable the exchange of data with a network 1530. The network 1530 can be any type of network, including, but not limited to, a wired or wireless network, a private or public network, a local area network (LAN), a wireless local area network (WLAN), a wide area network (WAN), a BLUETOOTH™ network, and the Internet. The network interface device(s) 1526 can be configured to support any type of communication protocol desired.

[0054]

[0068] The CPU 1508 may also be configured to access display controller(s) 1528 via the system bus 1514 to control information sent to one or more displays 1532. The display controller(s) 1528 send information to be displayed to the display(s) 1532 via one or more video processors 1534, which process the information to be displayed into a format suitable for the display(s) 1532. The display(s) 1532 may include any type of display, including, but not limited to, a cathode ray tube (CRT), a liquid crystal display (LCD), a plasma display, a light emitting diode (LED) display, etc.

[0055]

[0069] The CPU 1508 and / or display controller 1528 in the processor-based system 1500 may use information received from the sensor IC 1502 to control the brightness of the display 1532 based on ambient light conditions detected by an ambient light sensor in the sensor IC 1502. The CPU 1508 and / or display controller 1528 may also control its operational mode based on the proximity sensor in the sensor IC 1502 detecting the user as an object.

[0056]

[0070] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithms described in connection with aspects disclosed herein may be implemented as electronic hardware, as instructions stored in a memory or another computer-readable medium and executed by a processor or other processing device, or as a combination of both. The memory disclosed herein may be of any type and size and may be configured to store any type of information desired. To clearly illustrate this interchangeability, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. How such functionality is implemented depends on the particular application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0057]

[0071] The various illustrative logic blocks, modules, and circuits described in connection with aspects disclosed herein may be implemented or performed using a processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof, designed to perform the functions described herein. A processor may be a microprocessor, but alternatively, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0058]

[0072] Aspects disclosed herein may be embodied in hardware or in instructions stored in the hardware and that may reside in, for example, a Random Access Memory (RAM), a flash memory, a Read Only Memory (ROM), an Electrically Erasable Programmable ROM (EPROM), an Electrically Erasable Programmable ROM (EEPROM), a register, a hard disk, a removable disk, a CD-ROM, or any other form of computer-readable medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. Alternatively, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a remote station. Alternatively, the processor and the storage medium may reside as discrete components in a remote station, a base station, or a server.

[0059]

[0073] It should also be noted that the operational steps described in any of the exemplary aspects herein are described to provide examples and explanations. The described operations may be performed in many different sequences other than the sequence shown. Furthermore, an operation described in a single operational step may actually be performed in several different steps. Furthermore, one or more operational steps described in the exemplary aspects may be combined. It should be understood that numerous different modifications may be made to the operational steps depicted in the flowchart diagrams, as would be readily apparent to one of ordinary skill in the art. Those skilled in the art will also appreciate that information and signals may be represented using any of a wide variety of technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0060]

[0074] The above description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other variations. Thus, the disclosure is not intended to be limited to the embodiments and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0061]

[0075] Example implementations are described in the following numbered clauses. 1. An integrated circuit (IC), comprising: a first die including a first side and a second side opposite the first side; an ambient light sensor adjacent to a first side of the first die, the ambient light sensor facing outward in a first direction from the first side of the first die; a proximity sensor adjacent to a second side of the first die, the proximity sensor facing outward from the second side of the first die in a second direction opposite the first direction; An integrated circuit (IC) comprising: 2. an ambient light sensor configured to receive visible light within an ambient field of view in a second direction toward the first side of the first die; The proximity sensor emitting a first light outward from the second side of the first die in a first direction into an emission field; and receiving at least a portion of the first light returned in a second direction toward a second side of the first die within the near field of view; It is configured as follows: IC as described in clause 1. 3. an ambient light sensor coupled to a first side of the first die; a proximity sensor coupled to a second side of the first die; IC as described in clause 1 or 2. 4. The IC of clause 3, further comprising a circuit substrate including a first surface and a second surface opposite the first surface, a first side of the first die adjacent to a first surface of the circuit board; the circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the circuit board; an ambient light sensor adjacent to the first opening; IC as described in clause 3. 5. the first opening has a first diameter that defines a peripheral field of view in a second direction toward the first side of the first die; an ambient light sensor configured to receive visible light within the ambient field of view through the first opening; IC as described in clause 4. 6. The IC of clause 1 or 2, further comprising a second die including a third side and a fourth side opposite the third side, an ambient light sensor coupled to a first side of the first die; a proximity sensor coupled to a second side of the second die; IC as described in clause 1 or 2. 7. The IC of clause 6, further comprising a circuit substrate including a first surface and a second surface opposite the first surface, a first side of the first die adjacent to a first surface of the circuit board; the circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the circuit board; an ambient light sensor adjacent to the first opening; IC as described in Article 6. 8. the first opening has a first diameter that defines a peripheral field of view in a second direction toward the first side of the first die; an ambient light sensor configured to receive visible light within the ambient field of view through the first opening; IC as described in Article 7. 9. The IC of any of clauses 6-8, wherein a third side of the second die is vertically adjacent to the second side of the first die. 10. The IC of clause 9, further comprising a first circuit substrate including a first surface and a second surface opposite the first surface; a first side of the first die adjacent to a first surface of the first circuit board; the first circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the first circuit board; an ambient light sensor adjacent to the first opening; IC as described in Article 9. 11. the first opening has a first diameter that defines a peripheral field of view in a second direction toward the first side of the first die; an ambient light sensor configured to receive visible light within the ambient field of view through the first opening; IC as described in Article 10. 12. The IC of any of clauses 6-8, further comprising a first circuit substrate including a first surface and a second surface opposite the first surface, a first side of the first die adjacent to a first surface of the first circuit board; a third side of the second die adjacent to the first surface of the first circuit board and adjacent to the first die; the first circuit board further includes a first light pipe including a first opening extending from the first surface to the second surface of the first circuit board; an ambient light sensor adjacent to the first opening; An IC as set forth in any of clauses 6 to 8. 13. the first opening has a first diameter that defines a peripheral field of view in a second direction toward the first side of the first die; an ambient light sensor configured to receive visible light within the ambient field of view through the first opening; IC as described in Article 12. 14. a second circuit board including a third surface and a fourth surface opposite the third surface; 12. The IC of clause 10 or 11, further comprising: a fourth surface of the second circuit board adjacent to the first surface of the first circuit board; the second circuit board further includes a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; 12. The IC of clause 10 or 11, wherein the first opening is at least partially vertically aligned with the second opening. 15. the first opening has a first diameter and the second opening has a second diameter to form a peripheral field of view in a second direction toward the first side of the first die; 15. The IC of clause 14, wherein the ambient light sensor is configured to receive visible light within the ambient field of view through the first opening and the second opening. 16. The IC of clause 10 or 11, further comprising a second circuit substrate including a third surface and a fourth surface opposite the third surface; a third surface of the second circuit board adjacent to the second side of the second die; a second circuit board; a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; a third light pipe including a third opening extending from the third surface to the fourth surface of the second circuit board; Further comprising: The proximity sensor a light emitter adjacent to the second opening in the second circuit board; a light receiver adjacent to the third opening in the second circuit board; ICs as described in clauses 10 or 11, including: 17. the second opening has a second diameter defining an emission field; a second opening having a third diameter defining a second field of view in the first direction toward a second side of the first die; an ambient light sensor configured to receive visible light within the ambient field of view through the first opening; a light emitter configured to emit light through the second opening and outward from the second side of the first die in a second direction into an emission field; the light receiver is configured to receive the second light within the second field of view through the third opening; IC as stated in Article 16. 18. the ambient light sensor includes a visible light receiver configured to detect visible light within an ambient field of view in a first direction toward a first side of the first die; The proximity sensor an infrared light emitter configured to emit first light comprising first infrared (IR) light into an emission field in a second direction outward from the second side of the first die; an IR light receiver configured to detect at least a portion of the first IR light, including at least a portion of the first IR light returned within a near field of view in a first direction toward a second side of the first die; An IC according to any one of clauses 2 to 17, including: 19. The IC of clause 18, wherein the ambient light sensor further includes a second IR light receiver configured to detect ambient IR light. 20. Eyeglasses, XR glasses, head mounted display devices, electronic watches, set top boxes, entertainment units, navigation devices, communication devices, fixed position data units, mobile position data units, global positioning system (GPS) devices, mobile phones, mobile phones, smartphones, session initiation protocol (SIP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices, desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, and vehicle components, 20. The IC of any of clauses 1-19 integrated into a device selected from the group consisting of: 21. A method for manufacturing an integrated circuit (IC), comprising: providing a first die including a first side and a second side opposite the first side; coupling an ambient light sensor adjacent to the first side of the first die and facing outward in a first direction from the first side of the first die; coupling a proximity sensor adjacent to the second side of the first die facing outward from the second side of the first die in a second direction opposite the first direction; A method comprising: twenty two. providing a circuit board including a first surface and a second surface opposite the first surface; forming a light pipe in a circuit board including an opening extending from a first surface to a second surface of the circuit board; coupling a first die adjacent to a first surface of the circuit substrate such that the ambient light sensor is adjacent the opening; 22. The method of clause 21, further comprising: twenty three. 23. The method of claim 21 or 22, further comprising providing a second die comprising a third side and a fourth side opposite the third side; coupling the ambient light sensor includes coupling the ambient light sensor to a first side of the first die facing outward in a first direction from the first side of the first die; 23. The method of clause 21 or 22, wherein coupling the proximity sensor includes coupling the proximity sensor to a second side of the second die facing outward from the second side of the second die in a second direction opposite the first direction. 24. The method of clause 23, further comprising bonding a third side of the second die vertically adjacent to the second side of the first die. twenty five. providing a first circuit board including a first surface and a second surface opposite the first surface; Coupling a first side of a first die adjacent to a first surface of a first circuit substrate; coupling a third side of the second die adjacent to the first surface of the first circuit substrate and adjacent to the first die; 24. The method of clause 23, further comprising: 26. providing a first circuit board including a first surface and a second surface opposite the first surface; providing a second circuit board including a third surface and a fourth surface opposite the third surface; 22. The IC of clause 21, further comprising: coupling the ambient light sensor further includes coupling the ambient light sensor adjacent to the second surface of the first circuit board; coupling the proximity sensor further includes coupling the proximity sensor adjacent to the second surface of the first circuit board; The IC referred to in Article 21: forming a first light pipe in a first circuit board, the first light pipe including a first opening extending from a first surface to a second surface of the first circuit board; forming a second light pipe in the second circuit board, the second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; positioning the fourth surface of the second circuit board adjacent to the first surface of the first circuit board such that the first opening and the second opening are at least partially vertically aligned; coupling a first die adjacent to a first surface of a first circuit substrate such that the ambient light sensor is adjacent to the first opening; The IC described in clause 21 further comprises: 27. providing a first circuit board including a first surface and a second surface opposite the first surface; providing a second circuit board including a third surface and a fourth surface opposite the third surface; forming a first light pipe in a first circuit board, the first light pipe including a first opening extending from a first surface to a second surface of the first circuit board; forming a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; forming a third light pipe including a third opening extending from the third surface to the fourth surface of the second circuit board; placing a third surface of the second circuit board adjacent to the second surface of the first circuit board; coupling a first die adjacent to a first surface of a first circuit substrate such that the ambient light sensor is adjacent to the first opening; coupling a second die adjacent to the fourth surface of the second circuit substrate such that a light emitter of the proximity sensor is adjacent to the second opening and a light receiver of the proximity sensor is adjacent to the third opening; 24. The method of clause 23, further comprising: 28. a computing device; a display coupled to the computing device; an integrated circuit (IC) coupled to the computing device; An electronic device comprising: a first die including a first side and a second side opposite the first side; an ambient light sensor adjacent to a first side of the first die, the ambient light sensor facing outward in a first direction from the first side of the first die; a proximity sensor adjacent to a second side of the first die, the proximity sensor facing outward from the second side of the first die in a second direction opposite the first direction; Equipped with The ambient light sensor receiving visible light within a peripheral field of view in a second direction toward a first side of the first die; and generating an ambient light signal including ambient light information indicative of the amount of visible light received; It is structured as follows: The proximity sensor emitting a first light outward from the second side of the first die in a first direction into an emission field; receiving at least a portion of the first light returned in a second direction toward a second side of the first die within the near field of view; and generating a proximity signal including proximity information indicative of the proximity of an object to the IC; It is structured as follows: The computing device receiving an ambient light signal; controlling the brightness of the display based on the ambient light information in the ambient light signal; Receives proximity signals, controlling an operational mode of the computing device based on proximity information in the proximity signal; It is configured as follows: Electronic devices. 29.IC, an interface circuit coupled to the computing device; a switch configured to receive the ambient light signal and the proximity signal, and an output coupled to the interface circuit; a selection logic circuit coupled to the switch, the selection logic circuit configured to pass one of the ambient light signal and the proximity signal to the output; 29. The electronic device of clause 28, further comprising: 30. An electronic device according to clause 28 or 29, including wearable glasses. 31. The wearable eyeglasses further include a nose bridge including a third side and a fourth side opposite the third side, the fourth side being configured to be adjacent to a user wearing the wearable eyeglasses; the IC is coupled to the nose bridge such that a first side of the first die is adjacent to a third side of the nose bridge and a second side of the first die is adjacent to a fourth side of the nose bridge; An electronic device as described in clause 30. 32. The wearable eyeglasses further include an arm including a third side and a fourth side opposite the third side, the fourth side being configured to be adjacent to a user wearing the wearable eyeglasses; the IC is coupled to the arm such that a first side of the first die is adjacent to a third side of the arm and a second side of the first die is adjacent to a fourth side of the arm; An electronic device as described in clause 30. 33. An electronic device as described in clause 28, including a head-mounted display device. 34. A head-mounted display device includes a head visor including a third side and a fourth side opposite the first side, the fourth side being configured to be adjacent to a user wearing the head-mounted display; the IC is coupled to the head visor such that a first side of the first die is adjacent to a third side of the head visor and a second side of the first die is adjacent to a fourth side of the head visor; An electronic device as described in clause 33.

Claims

1. 1. An integrated circuit (IC), comprising: a first die including a first side and a second side opposite the first side; an ambient light sensor adjacent to the first side of the first die, the ambient light sensor facing outward in a first direction from the first side of the first die; a proximity sensor adjacent the second side of the first die, the proximity sensor facing outward from the second side of the first die in a second direction opposite the first direction; An integrated circuit (IC) comprising:

2. the ambient light sensor is configured to receive visible light within an ambient field of view in the second direction toward the first side of the first die; The proximity sensor emitting a first light outward from the second side of the first die in the first direction into an emission field; and receiving at least a portion of the first light returned in the second direction toward the second side of the first die within a near field of view; It is configured as follows:

10. The IC of claim 1.

3. the ambient light sensor is coupled to the first side of the first die; the proximity sensor is coupled to the second side of the first die; 10. The IC of claim 1.

4. 4. The IC of claim 3 further comprising a circuit substrate including a first surface and a second surface opposite the first surface, the first side of the first die is adjacent to the first surface of the circuit board; the circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the circuit board; the ambient light sensor is adjacent to the first opening; The IC of claim 3.

5. the first opening has a first diameter that defines a peripheral field of view in the second direction toward the first side of the first die; the ambient light sensor is configured to receive visible light within the ambient field of view through the first opening; 5. The IC of claim 4.

6. 10. The IC of claim 1 further comprising a second die including a third side and a fourth side opposite the third side, the ambient light sensor is coupled to the first side of the first die; the proximity sensor is coupled to the second side of the second die; 10. The IC of claim 1.

7. 7. The IC of claim 6, further comprising a circuit substrate including a first surface and a second surface opposite the first surface, the first side of the first die is adjacent to the first surface of the circuit board; the circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the circuit board; the ambient light sensor is adjacent to the first opening; 7. The IC of claim 6.

8. the first opening has a first diameter that defines a peripheral field of view in the second direction toward the first side of the first die; the ambient light sensor is configured to receive visible light within the ambient field of view through the first opening; 8. The IC of claim 7.

9. The IC of claim 6 , wherein the third side of the second die is vertically adjacent to the second side of the first die.

10. 10. The IC of claim 9, further comprising a first circuit substrate including a first surface and a second surface opposite the first surface, the first side of the first die is adjacent to the first surface of the first circuit board; the first circuit board further includes a light pipe including a first opening extending from the first surface to the second surface of the first circuit board; the ambient light sensor is adjacent to the first opening; 10. The IC of claim 9.

11. the first opening has a first diameter that defines a peripheral field of view in the second direction toward the first side of the first die; the ambient light sensor is configured to receive visible light within the ambient field of view through the first opening; The IC of claim 10.

12. 7. The IC of claim 6, further comprising a first circuit substrate including a first surface and a second surface opposite the first surface, the first side of the first die is adjacent to the first surface of the first circuit board; the third side of the second die is adjacent to the first surface of the first circuit board and adjacent to the first die; the first circuit board further includes a first light pipe including a first opening extending from the first surface to the second surface of the first circuit board; the ambient light sensor is adjacent to the first opening; 7. The IC of claim 6.

13. the first opening has a first diameter that defines a peripheral field of view in the second direction toward the first side of the first die; the ambient light sensor is configured to receive visible light within the ambient field of view through the first opening; 13. The IC of claim 12.

14. 11. The IC of claim 10, further comprising a second circuit substrate including a third surface and a fourth surface opposite the third surface, the fourth surface of the second circuit board is adjacent to the first surface of the first circuit board; the second circuit board further includes a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; the first opening is at least partially aligned in the vertical direction with the second opening; The IC of claim 10.

15. the first opening has a first diameter and the second opening has a second diameter to define a peripheral field of view in the second direction toward the first side of the first die; the ambient light sensor is configured to receive visible light within the ambient field of view through the first opening and the second opening; 15. The IC of claim 14.

16. 11. The IC of claim 10, further comprising a second circuit substrate including a third surface and a fourth surface opposite the third surface, the third surface of the second circuit board is adjacent to the second side of the second die; The second circuit board a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; a third light pipe including a third opening extending from the third surface to the fourth surface of the second circuit board; Further comprising: The proximity sensor a light emitter adjacent to the second opening in the second circuit board; a light receiver adjacent to the third opening in the second circuit board; Including, The IC of claim 10.

17. the second opening has a second diameter defining an emission field; the second opening has a third diameter defining a second field of view in the first direction toward the second side of the first die; the ambient light sensor is configured to receive visible light within a peripheral field of view through the first opening; the light emitter is configured to emit light into the emission field in the second direction outward from the second side of the first die through the second opening; the light receiver is configured to receive second light within the second field of view through the third opening; 17. The IC of claim 16.

18. the ambient light sensor includes a visible light receiver configured to detect the visible light within the ambient field of view in the first direction toward the first side of the first die; The proximity sensor an infrared light emitter configured to emit the first light comprising first infrared (IR) light into the emission field in the second direction outward from the second side of the first die; an IR light receiver configured to detect at least a portion of the first IR light, including at least a portion of the first IR light, returned into the near field of view in the first direction toward the second side of the first die; 3. The IC of claim 2 , comprising:

19. 20. The IC of claim 18, wherein the ambient light sensor further comprises a second IR light receiver configured to detect ambient IR light.

20. eyeglasses, XR eyeglasses, head mounted display devices, electronic watches, set top boxes, entertainment units, navigation devices, communication devices, fixed position data units, mobile position data units, global positioning system (GPS) devices, mobile phones, mobile phones, smartphones, session initiation protocol (SIP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices, desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, and vehicle components, 10. The IC of claim 1 integrated within a device selected from the group consisting of:

21. 1. A method for manufacturing an integrated circuit (IC), comprising: providing a first die including a first side and a second side opposite the first side; coupling an ambient light sensor adjacent to the first side of the first die, facing outward in a first direction from the first side of the first die; coupling a proximity sensor adjacent to the second side of the first die facing outward from the second side of the first die in a second direction opposite the first direction; A method comprising:

22. providing a circuit board including a first surface and a second surface opposite the first surface; forming a light pipe in the circuit board including an opening extending from the first surface to the second surface of the circuit board; coupling the first die adjacent to the first surface of the circuit substrate such that the ambient light sensor is adjacent the opening; 22. The method of claim 21 further comprising:

23. 22. The method of claim 21, further comprising providing a second die including a third side and a fourth side opposite the third side, coupling the ambient light sensor includes coupling the ambient light sensor to the first side of the first die facing outward from the first side of the first die in the first direction; coupling the proximity sensor includes coupling the proximity sensor to the second side of the second die facing outward from the second side of the second die in the second direction opposite the first direction.

22. The method of claim 21.

24. 24. The method of claim 23, further comprising: bonding the third side of the second die vertically adjacent to the second side of the first die.

25. providing a first circuit board including a first surface and a second surface opposite the first surface; coupling the first side of the first die adjacent to the first surface of the first circuit substrate; coupling the third side of the second die adjacent to the first surface of the first circuit substrate and adjacent to the first die; 24. The method of claim 23, further comprising:

26. providing a first circuit board including a first surface and a second surface opposite the first surface; providing a second circuit board including a third surface and a fourth surface opposite the third surface; 22. The IC of claim 21 further comprising: coupling the ambient light sensor further includes coupling the ambient light sensor adjacent to the second surface of the first circuit board; coupling the proximity sensor further includes coupling the proximity sensor adjacent to the second surface of the first circuit board; 22. The IC of claim 21, forming a first light pipe in the first circuit board, the first light pipe including a first opening extending from the first surface to the second surface of the first circuit board; forming a second light pipe in the second circuit board, the second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; positioning the fourth surface of the second circuit board adjacent to the first surface of the first circuit board such that the first opening and the second opening are at least partially vertically aligned; coupling the first die adjacent to the first surface of the first circuit substrate such that the ambient light sensor is adjacent the first opening; 22. The IC of claim 21 further comprising:

27. providing a first circuit board including a first surface and a second surface opposite the first surface; providing a second circuit board including a third surface and a fourth surface opposite the third surface; forming a first light pipe in the first circuit board, the first light pipe including a first opening extending from the first surface to the second surface of the first circuit board; forming a second light pipe including a second opening extending from the third surface to the fourth surface of the second circuit board; forming a third light pipe including a third opening extending from the third surface to the fourth surface of the second circuit board; placing the third surface of the second circuit board adjacent to the second surface of the first circuit board; coupling the first die adjacent to the first surface of the first circuit substrate such that the ambient light sensor is adjacent the first opening; coupling the second die adjacent to the fourth surface of the second circuit substrate such that a light emitter of the proximity sensor is adjacent to the second opening and a light receiver of the proximity sensor is adjacent to the third opening; 24. The method of claim 23, further comprising:

28. a computing device; a display coupled to the computing device; an integrated circuit (IC) coupled to the computing device; An electronic device comprising: a first die including a first side and a second side opposite the first side; an ambient light sensor adjacent to the first side of the first die, the ambient light sensor facing outward in a first direction from the first side of the first die; a proximity sensor adjacent the second side of the first die, the proximity sensor facing outward from the second side of the first die in a second direction opposite the first direction; Equipped with the ambient light sensor receiving visible light within a peripheral field of view in the second direction toward the first side of the first die; and generating an ambient light signal including ambient light information indicative of the amount of visible light received; It is structured as follows: The proximity sensor emitting a first light outward from the second side of the first die in the first direction into an emission field; receiving at least a portion of the first light returned in the second direction toward the second side of the first die within a near field of view; and generating a proximity signal including proximity information indicative of the proximity of an object to the IC; It is structured as follows: the computing device: receiving the ambient light signal; controlling the brightness of the display based on the ambient light information in the ambient light signal; receiving the proximity signal; controlling an operational mode of the computing device based on the proximity information in the proximity signal. It is configured as follows: Electronic devices.

29. The IC is an interface circuit coupled to the computing device; a switch configured to receive the ambient light signal and the proximity signal, and an output coupled to the interface circuit; a selection logic circuit coupled to the switch, the selection logic circuit configured to pass one of the ambient light signal and the proximity signal to the output; 30. The electronic device of claim 28, further comprising:

30. 30. The electronic device of claim 28, comprising wearable eyeglasses.

31. the wearable eyeglasses further include a nose bridge including a third side and a fourth side opposite the third side, the fourth side being configured to be adjacent to a user wearing the wearable eyeglasses; the IC is coupled to the nose bridge such that the first side of the first die is adjacent to the third side of the nose bridge and the second side of the first die is adjacent to the fourth side of the nose bridge; 31. The electronic device of claim 30.

32. the wearable glasses further include an arm including a third side and a fourth side opposite the third side, the fourth side being configured to be adjacent to a user wearing the wearable glasses; the IC is coupled to the arm such that the first side of the first die is adjacent to the third side of the arm and the second side of the first die is adjacent to the fourth side of the arm; 31. The electronic device of claim 30.

33. 30. The electronic device of claim 28, comprising a head-mounted display device.

34. the head-mounted display device includes a head visor including a third side and a fourth side opposite the first side, the fourth side being configured to be adjacent to a user wearing the head-mounted display; the IC is coupled to the head visor such that the first side of the first die is adjacent to the third side of the head visor and the second side of the first die is adjacent to the fourth side of the head visor; 34. The electronic device of claim 33.

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