Method and device for printing a substance onto a target surface of a target - Patent Application 20070122997

JP2025532837APending Publication Date: 2025-10-03NEDERLANDSE ORG VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
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Patent Information

Application Number
JP2025517749
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-09-30
Filing Date
2023-09-29
Publication Date
2025-10-03

AI Technical Summary

Technical Problem

Existing methods for transferring viscous materials face challenges in achieving uniform deposition on target surfaces due to vibrations and deformation of samples of different sizes, leading to incomplete coverage, air bubble entrapment, and misalignment, particularly when using conventional printing devices.

Method used

The implementation of a structured thermal buffer layer in the printing device that controls heat flux and transfer time, allowing for position-dependent delays in the heating process to manage sample vibrations and ensure uniform deposition, regardless of sample size or composition, using materials like SiO2 for the buffer layer.

Benefits of technology

The solution enables bubble-free, uniform coverage of diverse sample sizes and compositions on both planar and non-planar surfaces, improving print quality and reducing shear forces, especially for highly viscous materials, by controlling heat flux and transfer dynamics.

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Abstract

Provided herein is a printing device (1) for printing a substance onto a target surface (TS) of a target (T), comprising a carrier (2) having, on a first main surface (21), a carrier surface (2s) for carrying a sample (SB1, SB2, SB3) of the substance to be printed, a heater arrangement (23) for heating the carrier surface to evaporate a portion of the sample on the carrier surface side and induce a vapor pressure that transfers the remaining portion of the sample to the target surface, and a structured thermal buffer layer (25) for providing a position-dependent delay in heat transfer from the heater arrangement to the carrier surface.
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