Transferring pattern onto substrate
By controlling the temperature and tension of the mesh, and combining it with paper guiding, alignment, and speed adjustment devices, the problem of pattern size changes during transfer was solved, achieving accurate alignment and consistency of the pattern on the substrate.
Patent Information
- Application Number
- CN202480047184.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-21
- Filing Date
- 2024-07-18
- Publication Date
- 2026-02-13
AI Technical Summary
During the process of transferring a pattern from a flexible mesh to a substrate, the size of the pattern changes, causing the deviation between the actual and expected values to exceed the acceptable range, affecting the alignment and functionality/appearance of the pattern.
An apparatus is employed, comprising an imprinting line, a mesh heater, a tensioner, and a control unit, which ensures that the pattern conforms to the required length and width after transfer by controlling the temperature and tension of the mesh. The apparatus also includes a paper guide, an alignment device, and a speed adjustment device for precise alignment and synchronization of the substrate and the pattern on the mesh.
It effectively reduces dimensional changes in patterns during the transfer process, ensuring pattern consistency and accurate alignment on the substrate. It is suitable for different types of substrates, including rigid and flexible, planar and non-planar substrates.
Smart Images

Figure CN121532290A_ABST
Abstract
Description
[0001] Cross Reference to Related Applications
[0002] This application claims priority under the Paris Convention to UK Patent Application No. GB 2311276.6, filed on 21 July 2023, the entire contents of which are incorporated herein by reference as if fully set forth herein. TECHNICAL FIELD
[0003] The present invention relates to the transfer of a pattern from a web onto a substrate, for example in the manufacture of solar cells and circuit boards, where the pattern can also be electrically conductive. BACKGROUND
[0004] In the manufacture of certain products, it is necessary to apply a pattern of a substance to the surface of a substrate, the applied pattern being intended to perform a functional, decorative or both.
[0005] For example, in the manufacture of articles such as solar cells, circuit boards, touch screens and radio frequency identification (RFID) antennas, it can be desirable to apply a substance to a substrate according to a desired pattern, the substance comprising a composition of particles of an electrically conductive material, often also comprising an adhesive for holding the particles in a desired shape (e.g. a line pattern, a line cross-section etc.) and / or an adhesive which can enhance adhesion to or facilitate any functional interaction with the target substrate.
[0006] For example, in a solar cell, the substrate can be a semiconductor wafer; in a printed circuit board, the substrate can be an electrically insulating substrate.
[0007] While such substrates are often rigid and planar, flexible and / or non-planar (e.g. curved) substrates can also be used.
[0008] In some cases, it can be desirable to apply a physical pattern directly to a three-dimensional article, for example a part of a device body or a decoration, where the surface can be flat or curved, for example for RFID devices or where the pattern is decorative.
[0009] The present applicant has previously proposed in EP 3826438 a method of applying an electrically conductive pattern to a substrate, the method comprising providing a flexible film or web having a layer made of a deformable plastic polymer (e.g. a thermoplastic polymer) which can be embossed or cast.
[0010] The first surface of the film (or the front face of the web) has a certain pattern
[0011] The pattern of grooves formed therein corresponds to at least part of a desired electrically conductive pattern to be applied to a substrate.
[0012] The composition, comprising conductive material particles and a binder, is loaded into grooves on the first surface of a membrane, or otherwise deposited thereon. The filling process is carried out in a filling cycle such that, upon completion, the composition substantially fills the grooves, is flush with the first surface of the membrane, and the portion of the first surface between the grooves is substantially free of composition. Next, the membrane is brought into contact with a substrate, with the first surface of the membrane facing the desired surface of the substrate, and pressure is applied to the membrane to adhere the compound loaded into the grooves on the first surface of the membrane to the substrate. The membrane can then be detached from the substrate, thereby transferring the composition from the grooves on the first surface of the membrane to the substrate. Energy can then be applied to sinter the conductive particles, giving the pattern of composition transferred from the grooves to the substrate conductivity.
[0013] The applicant has disclosed a similar method in EP 3491900, the full text of which is incorporated herein by reference.
[0014] In EP 3491902 (the full text of which is also incorporated herein by reference), the applicant further proposed an apparatus for transferring a pattern of a transferable composition (e.g., a composition containing conductive material particles and a thermally activated adhesive) from the surface of such a flexible mesh to the surface of a substrate.
[0015] The apparatus includes a corresponding drive mechanism for simultaneously advancing the mesh and substrate through a clamp where the surfaces of the mesh and substrate are pressed together. A heating station is provided to heat the mesh and / or substrate to a temperature before and / or during rolling, activating the adhesive in the composition upon surface contact. A cooling station is provided to cool the rolled paper web and selectively cool the paper web before it passes through a separation device that peels the paper web from the substrate, allowing the composition pattern to adhere to the substrate surface.
[0016] For example, when the conductive pattern is applied to a substrate using the above method and apparatus, it is found that the size of the pattern applied to the substrate may change.
[0017] Not only will the dimensions of transferred patterns differ across different fabrics, but even patterns transferred from the same fabric will gradually change in size during the transfer from the fabric to the substrate. These changes can be reflected in the length of the pattern, as well as in its width in the X direction (or Y direction), measured along the direction of movement of the mesh. This variation can be due to conditions during the production of the patterned fabric or during the transfer of the pattern from the fabric to the substrate. This variation can cause deviations between the actual and expected nominal values to exceed acceptable limits. In such cases, missized transferred patterns may fail to align correctly with the substrate and / or with patterns transferred to the other side of the same substrate.
[0018] In addition, some deviations from the ideal size may adversely affect the appearance and / or function of the transfer pattern. Summary of the Invention
[0019] The present invention aims to alleviate the problem of pattern size differences when applied to different substrates, which is particularly important when the pattern is carried by a flexible mesh. SUMMARY
[0021] The present invention provides an apparatus for transferring a pattern carried by a deformable plastic mesh onto a substrate. The apparatus includes an embossing line defined between at least one embossing roller and a backing support. The substrate and the mesh pass simultaneously through the embossing line, and pressure is applied by means of the embossing line to transfer the pattern from the mesh to the substrate. The apparatus is characterized by a mesh heater and a mesh tensioner arranged upstream of the embossing line, and a control unit for controlling the mesh heater and the mesh tensioner based on data indicating the length and width of the pattern on the mesh before transfer or the length and width of the pattern on the substrate after transfer, to ensure that the pattern conforms to the desired length and width after transfer to the substrate.
[0022] Once transferred to the substrate, the size of the pattern does not need to be exactly the same as the required size.
[0023] The size of the pattern may be within the allowable deviation range (whether in absolute terms, such as within 100 micrometers (µm), or in relative terms, such as within 1% of the ideal length and / or width).
[0024] In some cases, the relative position of the patterns on the substrate is not critical, as long as the patterns meet the required dimensions to characterize them; in other cases, it may be necessary to apply the patterns to specific areas of the substrate.
[0025] The area on the substrate surface that requires pattern transfer can be called the "transfer area", while the area on the substrate that does not require pattern transfer can be called the "non-transfer area".
[0026] Generally, non-transfer regions form a boundary around at least a portion of the pattern's perimeter, but they can also (or in addition) be regions within other permitted transfer regions. When it is necessary to align patterns on the network with at least one edge of the substrate, the size of the substrate can also be taken into account, or the size of the substrate can be determined by the device, so that each pattern is aligned with each substrate to be transferred.
[0027] The problem of relative alignment between each pattern and its substrate can be solved in at least one of the following ways:
[0028] a) A paper guiding device capable of actively moving the paper web upstream of the pressure roller in the Y direction, causing it to move toward the pressure roller in the X direction, or designed to keep the paper web within a predetermined lateral path;
[0029] b) An alignment device capable of positioning the side of the substrate (i.e., its Y-position) and / or rotating the substrate to match the inclination of the pattern on the paper web before placing the substrate into the pressure roller; and
[0030] c) A speed regulating device capable of accelerating or decelerating the substrate to ensure that the time it enters the pressure roll (i.e., its X position) coincides with the time it enters the pressure roll carrying the paper web with the pattern to be transferred.
[0031] For example, the device can be configured (e.g., by properly operating a suitable mesh guide, substrate alignment device, and / or substrate speed regulator) to substantially coincide (or be at the desired spacing) the centroids of the pattern and the substrate, which are then connected by an imprinting line.
[0032] In some cases, when patterns need to be applied to both sides of a substrate and the two patterns need to be aligned with each other, the required length and width of the first pattern carried on the first sheet may depend on the length and width of the second pattern carried on the second sheet.
[0033] In this case, at least one of the heating and tension forces of the first and second webs can be set to ensure proper alignment between them.
[0034] In one embodiment, when a specific transfer area is used to apply a pattern, the patterns on different mesh structures (substrate sides) need to be aligned not only with each other, but also with the substrate.
[0035] In this case, at least one of the meshes and the substrate can be aligned with each other (e.g., as previously described, a single mesh is used to apply a pattern to one side of the substrate). When two meshes are used to transfer the same or different patterns on both sides of the substrate, the transfer areas on both sides of the substrate may need to be different (e.g., different shapes and / or different positions relative to the edge of the substrate).
[0036] In some embodiments of the invention, the pattern or reference mark on the paper web can be measured before the pattern reaches the printing line (where the pattern is transferred to the substrate), and the temperature and tension of the paper web before entering the printing line can be adjusted based on the measurement results during the transfer of the pattern from the paper web to the substrate.
[0037] In other embodiments, the pattern transferred onto the substrate can be measured, and the temperature and tension of the mesh before it enters the imprinting line can be adjusted based on the measurement results during the transfer of the pattern from the mesh to other substrates.
[0038] The length of the pattern can be changed by altering the tension of the mesh upstream of the jaws, but this stretching of the mesh can also reduce the width of the mesh, thereby reducing the width of the pattern.
[0039] Heating the paper web softens it, which increases its deformation as it passes through the pressure rollers, causing the width and length of the pattern to increase with increasing temperature.
[0040] This invention ensures that the pattern is stretched as needed during the transfer process by correctly setting the tension and temperature of the mesh based on measurement results before and / or after the mesh enters the roller press orifice, so that it more accurately and consistently conforms to the required length and width after being transferred to the substrate.
[0041] The length and width of the pattern can be measured during the production of the mesh, and coded markings (such as barcodes) can be applied to the mesh during the production process, containing data indicating the size of the pattern.
[0042] In this embodiment of the invention, the control unit of the device sets the temperature and tension of the mesh based on data read from the mesh.
[0043] Encoded markers can provide information related to different changes displayed along a mesh over a certain distance, the temperature and tension of which are adjusted to accommodate the distance.
[0044] In addition, there may be detectable data tags on the internet.
[0045] Data markings on the fabric can measure the length and width of the pattern in the area near the markings, or can provide actual online measurements of these dimensions, or can indicate the optimal fabric temperature and tension set by the control unit when transferring the pattern to the substrate. This method is sufficient if maintaining constant temperature and pressure during pattern transfer results in a consistently sized transferred pattern on the substrate. However, as mentioned earlier, in practice, it has been found that dimensional variations can gradually develop during the transfer of a pattern from a single mesh. To compensate for such errors, in another embodiment of the invention, the device includes sensors for measuring the width and length of the pattern on the fabric during transfer at an upstream position on the roller.
[0046] Understandably, this method cannot be used to correct for random variations in the size of transferred patterns between adjacent patterns on the same paper web, because the rate of change in paper web temperature is relatively slow compared to the paper feed speed (e.g., up to 1 m / s).
[0047] However, this method can at least reduce the gradual size changes observed in experiments.
[0048] In one embodiment, the sensor may include an optical sensor for determining the positions of specific markers on both sides of the mesh. These markers may be reference markers different from (e.g., conductive) patterns, or they may be elements of the pattern, thereby providing a measurement indicating the width of the pattern on the mesh.
[0049] For example, it can be expected that when the markers (or elements at the corresponding positions in subsequent patterns) are repeated along the net, their spacing should be a predetermined spacing.
[0050] The pressure roller may be associated with a shaft encoder, which is capable of measuring the movement of the paper web as it passes through the pressure roller.
[0051] In this embodiment, the length of the paper web through the roll gap (detected by an optical sensor as a series of specific marks on the paper web) can indicate the length of the pattern on the paper web.
[0052] In one embodiment, the mesh heater may be a heating roller located upstream of the printing line, but a portion of the mesh may also be heated by a blower or radiation.
[0053] In addition, at least one surface (which, when joined, defines the indentation for transfer, i.e., the indentation roller or backing support) may contain a heater.
[0054] In one embodiment, the device is adapted to transfer a pattern to both sides of the same substrate.
[0055] In this configuration, the device may include two independent jaws, each designed to transfer a specific pattern from a corresponding screen to a specific side. The pressure rollers may consist of one pressure roller and a support, or two pressure rollers arranged side-by-side. Alternatively, two patterns can be transferred from their respective screens to opposite sides of the substrate at the same embossing line, in which case the embossing line consists of two typically symmetrical embossing line rollers.
[0056] In one embodiment, the device may include a guide system upstream of the pressure roll that is capable of laterally changing the position of the paper web relative to the side end of the pressure roll (i.e., the Y position of the paper web edge relative to the pressure roll). The guide system includes any suitable guide device that is responsive to a paper web edge sensor or any other sensor capable of detecting the paper web position, allowing the side edge of the paper web to be correctly positioned relative to the pressure roll (and therefore also correctly positioned relative to a substrate independently aligned with the same pressure roll).
[0057] The mesh guiding system may include one or more mesh guiding devices selected from unwinding mesh guiding devices, steering mesh guiding devices, displacement mesh guiding devices, and biasing pivot guiding devices. The system also includes sensors, controllers, and / or actuators for detecting and correcting (e.g., reducing or eliminating) deviations of the mesh from the desired position. For example, the actuators of the mesh guiding system may be configured to move and / or tilt rollers as the mesh moves over them.
[0058] In one embodiment, the apparatus may include a substrate alignment device upstream of the pressure roller, the substrate alignment device being configured to at least modify the Y coordinate of the substrate relative to the pressure roller (and thus also modify the Y coordinate of the mesh and / or pattern on the substrate that is independently aligned with the same pressure roller).
[0059] In one embodiment, the alignment device can laterally move the substrate by a distance (to the right or left) equal to the distance measured from the leading edge to the trailing edge of the substrate, while the X-coordinates of the corner points are unaffected by the alignment. In other embodiments, the alignment device can further modify the X-coordinates of at least three corners of the substrate. In other words, the alignment device can rotate the substrate relative to its initial orientation when entering the substrate drive mechanism. These lateral displacements or rotations of the substrate can be achieved by a substrate alignment device comprising lateral stops located on opposite sides of the substrate, which are movable relative to each other in the Y direction and reversibly biased relative to each other to clamp the opposite side edges of the substrate at any desired position relative to the pressure roller, thereby advancing the substrate toward the pressure roller in a desired alignment manner controllably set by the stops.
[0060] In one embodiment, the device may include a speed regulating device located upstream of the pressure roller, which is adapted to accelerate or decelerate the substrate before it enters the pressure roller to ensure that the time when the substrate enters the pressure roller (i.e., its X position) is consistent with the time when the substrate enters the pressure roller.
[0061] A mesh with a pattern to be transferred.
[0062] According to the principles of the present invention, the pattern transferred onto the substrate using the device and / or method can be functional or decorative, and the transferable composition supported by the substrate and the flexible mesh can be selected and adjusted according to the intended end use of the transferred pattern.
[0063] It is worth noting that, since the pattern is carried by a flexible mesh, the substrate to be transferred does not have to be completely rigid and planar. Flexible and / or non-planar (e.g., curved) substrates can also be used and benefit from this technology.
[0064] On the other hand, the present invention provides a method for ensuring that a pattern carried by a mesh of deformable plastic material conforms to a desired length and width after being transferred to a substrate at a transfer embossing line, the method comprising: a) collecting data indicating the length and width of the pattern on the mesh before transfer or on the substrate after transfer; and b) controlling the temperature and tension of the mesh upstream of the embossing line or at the embossing line based on the collected data.
[0065] These and other advantages and features of the invention will be better understood from the following detailed description, taken in conjunction with the accompanying drawings and non-limiting examples.
[0066] Brief Description of the Drawings
[0067] The invention will now be further described by way of example with reference to the accompanying drawings, wherein the same reference numerals or characters denote corresponding or identical parts.
[0068] The accompanying drawings enable those skilled in the art to clearly understand how to implement some embodiments of this disclosure.
[0069] These illustrations are for illustrative purposes only and do not attempt to show the structural details of the embodiments in more detail than are necessary for a basic understanding of this disclosure.
[0070] For clarity and convenience, some objects depicted in the image may not be shown to scale.
[0071] As shown in the figure:
[0072] Figure 1 is similar to Figure 1 in EP 3491902 and is reproduced here for completeness to show an exemplary device for transferring a pattern from a mesh onto a substrate.
[0073] Figure 2 is a detailed schematic diagram of the roll paper feeding device in Figure 1, with modifications made to implement the present invention;
[0074] Figure 3 is a perspective view of part of the mesh feeding device in Figure 2;
[0075] Figure 4 is a perspective view of a portion of the network, schematically depicting the patterns within and / or on it;
[0076] Figure 5 is a perspective view of a portion of the network, schematically depicting a single pattern and how it is measured;
[0077] Figures 6A to 6C are schematic side views of the pressure roller, through which fabric and substrate can be transferred;
[0078] Figure 7 is a flowchart of the steps that may be included in the method according to the present invention.
[0079] DETAILED DESCRIPTION
[0080] Apparatus Overview
[0081] The exemplary apparatus shown in Figure 1 is designed to apply patterns to opposite sides of a substrate 10. These patterns are derived from a substrate supply device (e.g., stack 12) and are made of a transferable composition, which may contain conductive material particles and an adhesive that can subsequently be activated by heat and / or pressure.
[0082] In this case, the component can be sintered by applying energy, thereby making the pattern conductive.
[0083] Therefore, in one example, substrate 10 may be a semiconductor wafer or an insulating substrate, onto which the device applies front and back patterns (e.g., electrodes, circuits, antennas, etc.) of the desired final product.
[0084] However, some materials may be able to conduct electricity without the application of energy, and in some cases, conductivity may not be necessary. For example, patterns may have other functions or may simply be decorative.
[0085] If the pattern is to be processed to achieve the desired functional and / or aesthetic effects, such as heating it to make it conductive, or melting or curing it to enhance adhesion to the substrate, this processing is usually performed after the pattern has been transferred to a suitable substrate, and can be done offline with the roll-to-roll equipment shown in the figure.
[0086] The two patterns that can be applied to each side of the substrate are usually not the same, but may need to be properly aligned with each other and with the substrate.
[0087] In the substrate driving mechanism 90, the substrates 10 are distributed one by one from the stack 12 to the inspection station 60. In the inspection station, the upper surface of the substrate can be optically analyzed by setting a suitable inspection device to detect defects.
[0088] In the next selection station 62, defective substrates can be rejected using a suitable screening device.
[0089] Defect-free components of substrate 10 are pushed onto alignment device 50, and in one embodiment, they may also be heated by heater 52.
[0090] If necessary, the substrate 10 is heated at the alignment station and correctly positioned and oriented before being fed into the embossing line 40, which in this figure consists of two pressure rollers 22a and 22b.
[0091] The reference number assigned to a work station (subsystem) within a device can also be used to identify the relevant device that performs the function assigned to that work station.
[0092] For example, reference number 60 can be used interchangeably to refer to a workstation that can inspect a substrate, and to inspection equipment used to detect any defects related to the substrate.
[0093] While it is recommended to equip the equipment with inspection station 60 and selection station 62 to inspect and reject defective substrates, these stations are not essential for the operation of the equipment, but are preferred from a quality control perspective.
[0094] Downstream of the pressure roller, typically after the flexible mesh has been peeled off, a station with a similar function can be selectively set up to detect defect patterns and eliminate substrates with such defects.
[0095] In Figure 1, downstream detection of a substrate and / or a pattern transferred onto the substrate is schematically illustrated by sensors 80a and 80b. These sensors may be the same as or different from the sensors located upstream of the pressure roller, such as sensor 70. For the sake of illustration, sensor 70 is an optical sensor, such as cameras 122 and 601, all of which will be described in detail below.
[0096] When the apparatus includes stations 60 and 62 located upstream of the imprinting line, it may be considered to further include an acceleration station 64, so that the defect-free substrate pulled out after the defective substrate is discharged can arrive at the imprinting line synchronously with the mesh pattern.
[0097] Therefore, this accelerated station 64 can prevent the mesh from being "empty" fed at the clamping point when there is no matrix.
[0098] However, such an accelerated station is not essential, as this empty feed can be tolerated or mitigated by other methods, such as adding perfect substrates pre-selected from a buffer of defect-free substrates (e.g., wafers), or by any similar solution.
[0099] More generally, regardless of whether there is an inspection station 60 or a selection station 62 for detecting and eliminating defective substrate 10, station 64 can be used to change the speed at which the substrate is fed into the imprinting line 40.
[0100] Therefore, station 64 can also be called the speed regulating station, which includes a device of the same name that can accelerate or decelerate the substrate as needed to ensure that it enters the printing line in sync with the pattern on the screen to be aligned. In this figure, the composition pattern to be transferred onto the substrate is carried by two flexible meshes 14a and 14b. The substance to be transferred, also known as the transferable composition, may be located in a groove (e.g., in a trench) below the surface of the mesh and / or on the surface of the mesh. The side of the mesh with the material pattern may be referred to as the front side of the mesh, and the other side of the mesh may be referred to as the back side of the mesh.
[0101] As can be clearly seen from Figure 1, the drive mechanisms of the two meshes 14a and 14b can be mirror images of each other.
[0102] To avoid repetition, this specification will use reference numerals without suffixes to refer to the components of the two drum drive mechanisms, but in the accompanying drawings, the suffixes "a" and "b" will be used to distinguish the upper drive mechanism and the lower drive mechanism.
[0103] Each sheet of web 14 is moved from left to right by an electric feed roller 16 via an idler roller 18 and a vibrator 20 (as indicated by arrow 21), thereby pulling out or releasing the slack portion of the web.
[0104] The unwinder 16 can also be used as a wire guide device, with the feed rollers movable along their longitudinal axis to adjust the lateral position of the wire. From the current device view, lateral guidance of the paper web can be achieved by moving the feed rollers to the front or back of the drawing plane. Furthermore, the sides of the paper web can be guided by appropriately arranged guide rollers along the paper web path.
[0105] For example, roller 18 near the printing line can be used as a guide as needed to bend the paper web so that it is better aligned with the desired position when it reaches the next station (e.g., printing line 40).
[0106] If other alignment constraints need to be met, any other displacement guiding device can be used to achieve lateral guidance of the mesh. All of the above mesh guiding devices are referred to as mesh guiding systems. Each such guiding system includes (if required) its own detection system and controller, as well as any actuators capable of implementing the required corrective actions (if these components are separate, they are not shown in the figure).
[0107] Then, the mesh 14 passes between two pressure rollers 22, which define the imprint line 40, into which the substrate is fed.
[0108] In the pressure rollers, the composite pattern on the mesh 14 is pressed against the surface of the substrate 10, thereby adhering the composite pattern to the substrate. As shown, the paper web then passes through the cooling station 23 and the separation device 30 between the two rollers 26. After the paper roll is separated from the substrate 10 by the device 30, the paper roll is rewound onto the take-up roller 32. Considering the cost of the plastic material constituting the flexible mesh and the methods that can be used to manufacture it (e.g., roll-to-roll embossing), the material can be discarded after a single use once after separation from the substrate. Irreversible deformation may occur in some cases if the flexible mesh is separated, but this deformation will not affect the pattern transferred from the separated mesh.
[0109] To ensure proper alignment of the composition pattern with the substrate, an optical sensor 70 is placed upstream of the idler roller 18 to sense the pattern or associated markings on the mesh 14.
[0110] Any type of optical sensor suitable for the pattern and / or mark to be detected can be used in this device. The optical sensor can be an image sensor, fiber optic sensor, contrast sensor, or any other similar sensor suitable for detecting light signals.
[0111] Figure 4 schematically shows a perspective view of a mesh that can be used in the apparatus and method according to this teaching.
[0112] In Figure 4, arrow 400 indicates a sensor suitable for measuring the width W and length L of any pattern 410 of a transferable composition inside or on the surface of the flexible mesh 100. Marks 420 and 430, detectable by the sensor 400, are provided on the mesh surface, as shown. These marks are located on both sides of the mesh surface, but this is not limiting, as the marks can also be located upstream and / or downstream of each pattern, or even inside the pattern in some cases. The figure also shows how a specific element 440 in the pattern performs a similar detection and measurement function in another or additional way. Downstream of the roll, after the mesh is stripped, the marks (if present) associated with detection and measurement by the downstream sensor are typically specific elements in the transfer pattern, unless the reference marks are made of a transferable material. In this figure, only one sensor 400 is shown, which is suitable when the sensor's detection range is wide enough to sense all marks associated with the expected measurement (e.g., if located on opposite sides of the mesh as shown by marks 420 and 430), and the sensor is arranged relative to the mesh so that it can ideally detect both sides.
[0113] If the sensor's detection range is limited, multiple sensors may be needed to detect all relevant markings. As shown in the figure, thin horizontal lines in the pattern can represent "finger"-like traces transferred onto the solar cell substrate, while wide horizontal lines can represent busbars. The transfer composition used to form the finger structure is typically located in grooves beneath the mesh surface, these grooves having a cross-sectional profile suitable for the solar cell finger structure (e.g., the groove cross-section is triangular, preferably with a high aspect ratio). In contrast, due to the shape of the generatrix, the transferable components can be found on the surface of the mesh structure.
[0114] Although for simplicity this article describes the process of transferring a pattern from a mesh to a substrate, the process involves controlling a mesh heater and a mesh tensioner (located upstream of the transfer roller) and relies solely on data indicating the characteristic dimensions of the pattern (e.g., their length and / or width), which can be measured on the mesh before transfer or on the substrate after transfer (or both), the length and width of the pattern need not be the only dimensions that meet the desired values.
[0115] Figure 5 shows a single pattern that will be used to explain how to derive measurement results from the relevant data acquired through any suitable sensor, camera, or scanner.
[0116] Although the pattern outline schematically depicted in Figure 4 is a top view from a square, in this figure, the outline of the pattern (represented by dashed lines) is more like a trapezoid to eliminate ambiguity in some of the following interpretations.
[0117] For simplicity, a reference can be made to a mesh pattern, and similar considerations apply to patterns transferred onto a suitable substrate. Therefore, while on a mesh, the sides can be used to locate measurement points (e.g., patterns, outlines, and / or their associated markings) on the mesh plane (e.g., to set axes that determine (x,y) coordinates), the sides of a substrate can also be used to locate points measured on the substrate surface.
[0118] Using one edge of the mesh as a reference line (for example, the lower horizontal edge of the mesh in this figure), and taking a point on that reference line as the origin of the axis (i.e., coordinates (0,0)), the position of any point on the mesh can be determined by evaluating the (x,y) coordinates of each point in the XY plane where the pattern is located.
[0119] The width W and / or length L of a pattern, and the deviation from the desired value, or the variation between successive measurements of similar dimensions, can be determined by repeatedly measuring the distance between two points indicating the pattern's width or length at similar locations in each pattern. The pattern shown in Figure 5 is marked with four points AD, which appear at the four corners of the pattern outline; however, this should not be interpreted as restrictive, and these points can also be selected from reference marks on the mesh or elements within the pattern. Although not shown in the figure, subsequent patterns may have four feature points A'-D' at corresponding locations, followed by A”-D”, then A”'-D”’, and so on. The width of the pattern can be evaluated by measuring the distance between points AC or BD and comparing the calculated value with relevant reference data and / or similar calculations.
[0120] Measurements are taken between points A'-C' or B'-D', A”-C” or B”-D””, A”'-C”’ or B”'-D”’, etc., to monitor for gradual changes in width, allowing for corrective action and / or evaluation of its effectiveness. Similarly, the length of the pattern can be evaluated by measuring the distance between points AB or CD and comparing the calculated value with relevant reference data and / or similar calculations between points A'-B' or C'-D', A”-B” or C”-D”, etc.
[0121] Alternatively, the width and / or length of the pattern can be calculated as the average of two or more measurements.
[0122] Since the current drawing only depicts four points to describe the pattern, the average of two distances will be considered. The width W of the pattern can be calculated by averaging the distance between points AC (W1) and the distance between points BD (W2). The length L of the pattern can be calculated by averaging the distance between points AB (L1) and the distance between points CD (L2).
[0123] After the locations of these four exemplary points are determined through appropriate data collection, more information can be calculated.
[0124] For example, the location of the centroid (center of mass) of the pattern can be determined by averaging the positions of the points AD at the midpoint of each (x,y) coordinate. This point E is represented by an asterisk in this figure.
[0125] Similarly, once the coordinates of the points representing the mesh pattern are determined, the relative position of the pattern with respect to the mesh edge can be further evaluated.
[0126] In some cases, it may not be enough for the pattern to simply meet the required length or width; the pattern must also be located within a specific area of the webpage (in other words, beyond a specific margin). For example, regarding the width of the pattern, the distance between points AC or BD, or the average of W1 and W2, may not be sufficient to meet the reference value setting for W, but the distance between point AD and its nearest projection on the edge of the paper web may also need to be greater than the value set for the edge where the pattern cannot be located on the paper web (or on the substrate after transfer). Similarly, the distance between points AB or CD, or the average of LI and L2, may not be sufficient to meet the reference value setting for L, but the distance between point AD and its nearest projection on the edge of the substrate may also need to be greater than the value set for the margin where the pattern cannot be located on the substrate.
[0127] The relative displacement between the centroid E of the pattern derived from the measurement point AD and the ideal position of the centroid of the reference pattern may also indicate a deviation in the pattern shape. Alternatively, the tilt of the pattern orientation can be assessed by measuring the angle between the edge of the mesh and the straight line between two points selected for this purpose. To illustrate the pattern shown in Figure 5, it can be expected that line AB is parallel to the side of the mesh, and the angle formed between this virtual line and the edge (e.g., the upper line in the figure) represents the tilt angle α. To some extent, the tilt in the pattern can be corrected by causing a similar tilt in the substrate with the assistance of an alignment device 50, which may include a side pusher capable of setting a small angle (e.g., modifying the Y coordinate of at least one angle) for the substrate as it enters the pressure roller.
[0128] In practice, pattern tilt (usually due to manufacturing errors) can only be corrected if the angle between the pattern and the intended direction does not exceed the ability of the substrate alignment device to slightly rotate the substrate. This increases the degree of alignment between the substrate edge and the intended direction of the pattern. In other words, assuming all other parameters are as expected, if the edge of the mesh should originally be parallel to the side edge of the substrate, then the fact that the virtual line AB is not parallel to the side edge of the mesh can be ignored because the substrate has now been rotated to ensure that its side edge is parallel to line AB.
[0129] So far, the size issue has been related to patterns on deformable networks, and similar approaches apply to substrates.
[0130] However, for rigid substrates, the values of width and length can also be predetermined by the manufacturer or before they are loaded into the equipment. That is, they can also be independently evaluated online by the equipment using sensors appropriately arranged along the substrate drive mechanism. The leading and trailing edges can be used to determine the length of the substrate, while the side edges can be used to determine its width. Points characterizing the substrate can be its four corners, or, in the absence of intersecting straight edges, virtual points set at the intersections of the straight portions of the substrate edges (these four points are, for example, referred to as Alef, Bet, Guimel, and Dalet). The position of the substrate centroid (He) can be calculated according to the interpretation of the pattern. For the pattern to be properly aligned with its substrate, it may be necessary for their centroids (E and He) to coincide, or for one to be positioned relative to the other according to a reference vector.
[0131] After the transfer, eight points can now be considered: AD points representing the pattern and Alef-Dalet points representing the substrate, allowing for direct evaluation of the actual edges between the transferred pattern outline and its substrate. While the illustration schematically depicts an apparatus capable of simultaneously transferring two patterns onto opposing surfaces of a substrate, those skilled in the art will readily understand how to fabricate a similar apparatus to transfer a compositional pattern onto a single face of a substrate. In this case, for example, an embossing line 40 can be formed between the pressure roller 22 and the backing support 42 of the substrate 10. Furthermore, the transfer of two patterns onto opposing surfaces of the substrate need not be simultaneous; in this case, the apparatus may include two separate indentations, each corresponding to each face of the substrate.
[0132] Figure 6 illustrates these alternatives schematically. Figure A depicts a single embossing line 40A formed by a pressure roller 22 and a backing support 42; Figure B depicts a single embossing line 40B formed by two pressure rollers 22a and 22b, which are of similar size; Figure C depicts two consecutive embossing lines 40' and 40'", each identical to the preceding embossing line 40A. In other cases (not shown), each separate first and second embossing line used to transfer material to different sides of the substrate can also be independently selected from embossing lines 40A and 40B. In Figures 6A through 6C, the surfaces constituting the example pressure rollers are in contact with each other; for clarity, the substrate and mesh are omitted.
[0133] For skilled technicians, it is easy to understand that the surfaces that form the clamping surfaces can also be separated when needed, for example, for the purpose of servicing, repairing or cleaning the equipment.
[0134] The device may include other workstations not shown in the diagram, some of which may be selected to be offline for performing activities that can be carried out at different times and / or locations, and / or handled by different entities.
[0135] For example, the apparatus may include a curing station for curing the transferred pattern; a furnace for sintering the particles of the transfer composition and / or fusing the transferred pattern onto its respective substrate; a coating station for coating the transferred pattern; and any similar post-transfer processing station that brings the transferred pattern and its respective substrate closer to the intended ready-to-use final product. Each of these stations, whether offline or online, may be referred to as a finishing station. The apparatus may include other online workstations to facilitate any activities described above and further detailed below. Some of these stations and associated equipment may be operated on the substrate and / or paper web before they enter the roll press, and are generally referred to as pre-transfer stations (these stations are also omitted from the figures for clarity). For example, the apparatus may include a pre-coating station that selectively or continuously applies an adhesive layer to the pattern upstream of the roll press, while simultaneously applying an intermediate adhesive layer to the web, selected areas of the substrate, or both.
[0136] Between the pattern and the base, it facilitates the transfer of the former to the latter at the indentation.
[0137] The exemplary apparatus for implementing the present invention has been generally described above; now, the various components and parts of the apparatus will be described.
[0138] Substrate Drive Mechanism
[0139] The device shown in the figure is intended for use in manufacturing solar cells or printed circuit boards, where the substrate is typically rigid and shaped like a square semiconductor wafer or a rectangular insulating plate.
[0140] Before describing the driving mechanism in detail, it should be made clear that its design actually depends on the nature of the substrate, which in turn may depend on the type of pattern to be transferred to the substrate (e.g., functional or decorative pattern).
[0141] In other embodiments, if the substrate itself is flexible, the driving mechanism of the substrate can be similar to the driving mechanism of a mesh structure.
[0142] If the substrate is a 3D object and a pattern (e.g., conductive) is applied only to one side, the substrate drive mechanism 90 can be a conveyor belt passing under a single pressure roller 22. Such adjustments and modifications can be easily implemented by a skilled person and need not be elaborated here.
[0143] In the embodiment shown in FIG1, the substrate driving mechanism 90 includes a box structure in which stacked individual substrates 10 are stored.
[0144] Substrates 10 can be distributed one at a time from stack 12 to inspection station 60 (e.g., for optical defect inspection) via a conveyor belt (not shown), where they can be observed from above by camera 601. Images captured by the camera can be analyzed by a computer programmed to detect defects and flaws, such as cracks. Selection station 62 following inspection station 60 may include, for example, a deflector operated by a solenoid valve controlled by the image analysis computer of the previous station, which moves defective substrates from the conveyor belt into a waste container. Only defect-free substrates proceed to the next station, where they can be heated as needed and properly aligned relative to pressure rollers and the pattern to be transferred thereon. Proper positioning of the substrate relative to the embossed surface can be achieved using suitable mating parts. Correct registration of the pattern on the mesh can be achieved by accelerating or decelerating the substrate feed toward the embossed line based on the distance between the pattern and the embossed line and the speed of the mesh.
[0145] In one embodiment, the substrate driving mechanism 90 is configured and adapted to feed the substrate to the imprinting line 40 at a linear velocity of at least 0.1 m / s, at least 0.5 m / s, or at least 0.7 m / s. Typically, the linear velocity of the substrate at the lamination point will not exceed 2.0 m / s, and is generally in the range of 0.2 m / s to 1.5 m / s, 0.4 m / s to 1.0 m / s, and 0.5 m / s to 0.8 m / s.
[0146] Heating and Calibration Station
[0147] As the name suggests, this workstation has two different functions.
[0148] First, its function is to heat the substrate 10 to a certain temperature when needed, so as to activate the adhesive carried by the substrate 14 when the substrate 10 comes into contact with the substrate 14 at the embossing line.
[0149] The appropriate temperature depends on the properties of the composition and the adhesive, which is discussed in more detail in EP 3491900.
[0150] Depending on the desired temperature, the heating station (represented by dashed box 52) can take different forms, such as conduction (the substrate comes into contact with a hot plate heated by circulating fluid, resistance heating elements, or PTC resistors), convection (blowing heated gas onto the substrate), or radiation (infrared or microwave, depending on the properties of the substrate).
[0151] When using conductive heating, it may be necessary to add some components to keep the substrate in close contact with the heating plate (e.g., the rollers make contact with the heating plate) to accelerate the heating of the substrate to the required temperature.
[0152] While heating can be performed upstream of the roll inlet to heat at least one of the mesh and substrate surfaces separately, bringing them into contact with each other, heating can also be performed at the roll inlet, or simultaneously at the roll inlet.
[0153] For example, in such an embodiment, the pressure roller 22 can also be used as a heating roller.
[0154] The No. 14 mesh is made of a flexible material, and grooves can be formed on it through various possible processes such as embossing or casting.
[0155] The geometry of these grooves is complementary to the geometry of the desired pattern (e.g., a conductor) and can be filled with a mixture containing conductive material particles (e.g., silver) and thermally activated and / or pressure-activated binders. As previously mentioned, for certain types of relatively flat conductive patterns, such as the back electrode of a solar cell and the ground plane of a PCB ground layer, the composition can also be placed on the surface of the mesh structure. For now, it is sufficient to know that the pattern carried by the mesh structure matches at least a portion of the desired pattern (e.g., a conductor pattern) to be applied to the substrate, but interested readers can find more details about the material types in EP3491900. The mesh can be manufactured, the grooves can be manufactured, and the chemical structure of the composition components can be specified. It should be noted that the components themselves are not necessarily conductive, but can become conductive after sintering if a conductive pattern is required.
[0156] Furthermore, while this specification primarily relates to the transfer of patterns intended for electrical conductivity, the invention should not be construed as being limited to such patterns. The invention may be advantageous for transferring any type of pattern (e.g., patterns with functions other than electrical conductivity or decorative purposes), and it is important to maintain the dimensions of the transferred pattern within strict dimensional ranges or permissible deviations.
[0157] For now, it can be briefly noted that the mesh is sufficiently inelastic to maintain the contours of the grooves (and patterns) and the shape of the composition to be transferred therefrom.
[0158] On the other hand, the mesh possesses sufficient elasticity (e.g., stretchability) to align the pattern carried thereon with the substrate through undulation and tension. Therefore, the plastic material for deformable meshes (or a layer thereof, typically formed due to contact with the substrate) includes any polymer capable of changing shape due to the operating conditions of the equipment used to manufacture the mesh (e.g., embossing) or to transfer the mesh. Furthermore, deformable plastic meshes undergo irreversible deformation upon separation from the substrate, making them suitable for single-use and disposable applications. Materials suitable for such meshes (or the outermost deformable layer) can be thermoplastic polymers such as cyclic olefin copolymers (COC), polypropylene (PP), polyethylene (PE), thermoplastic polyurethane (TPU), and their copolymers, etc.
[0159] The dynamometer can also act as a buffer until the network reaches a constant speed.
[0160] Because the various electric cylinders in contact with the reel have different diameters, some inertia may exist between them until they can all provide the same linear speed. The mesh preferably possesses sufficient flexibility to conform to the substrate surface, thereby achieving a sufficiently close contact for transferring the composition lines. This capability is related to the presence of a thermoplastic polymer in at least one layer constituting the first surface / front of the mesh. It is believed that, through the aforementioned heating method, the thermoplastic layer on the first surface of the mesh can be softened to a degree sufficient to substantially match the morphology of the substrate surface. For example, assuming the substrate has a random or patterned textured surface, such as pyramidal protrusions similar to those on a silicon substrate for solar cells, the plasticity of the film, especially during heating, enables the thermoplastic surface to substantially fill the substrate surface. The spacing between adjacent, relatively raised textures is relatively shallow.
[0161] It should be emphasized that thermosetting polymers used to prepare dimensionally flexible molds (such as gravure printing molds) cannot achieve this topographic consistency under normal operating conditions.
[0162] Other desirable properties are also readily understood, enabling the mesh to be compatible with the processes implemented by the apparatus (e.g., stress resistance, heat resistance, thermal conductivity or heat dissipation, etc.) and with the compositions used (e.g., chemical resistance, chemical inertness, etc.), while responding to changes in temperature and tension, thereby allowing the length and width of the pattern to be adjusted according to the methods taught in this invention.
[0163] Pressure Rollers
[0164] The function of the pressure roller 22 is to press the mesh 14 against the substrate 10.
[0165] A force is applied to the pressure roller 22 to apply a compressive force at the imprint line 40. The magnitude of the force depends on the nature of the mesh, the components carried in and / or on the mesh, the substrate, and the geometry of the pattern (e.g., the depth of the groove and / or the cross-sectional profile, the complexity of the pattern, etc.).
[0166] The speed at which the mesh is fed into the imprinting line (i.e., the time the mesh is pressed) and the required transfer mass can also affect the magnitude of the applied force.
[0167] The pressure roller can be made of any suitable material, such as rubber or steel, but is coated with a thin layer of flexible material to ensure good contact with the entire surface area of the mesh. Therefore, although the indentation can ideally be considered as a contact line formed between the mesh and the substrate surface, in reality, due to the compressible material at the contact point between the sides of the indentation and the back of the mesh, the indentation forms a contact area extending along the width of the mesh.
[0168] As previously mentioned, in some embodiments, the pressure roller 22 can also be used as a heating cylinder when the heating is not performed entirely on the substrate or on the paper web upstream of the printing line.
[0169] The pressure rollers can also be driven by a motor to pull the paper web out from the feed roller 16. As shown in the figure, when the two pressure rollers are pressed together, only one of the pressure rollers needs to be driven if necessary.
[0170] It is important to ensure that when the patterns on the mesh 14 (whether they are below and / or above the surface of the mesh) reach the embossing line 40, they arrive in sync with the arrival of the substrate.
[0171] The spacing of the patterns on the webpage is appropriate to leave blank areas. As the new substrate is oriented for proper feeding into the pressure rollers, the paper roll may pass through the printing line 40; this orientation can be selectively performed while the substrate is heated. Because the wire is continuously driven, while the presentation of the substrate to the printing line 40 is intermittent, a problem arises where the time it takes for the pattern to reach the printing line may not match the duration of the substrate's presence within the printing line.
[0172] To avoid this problem, the paper web can be pulled out from the feed roller 16 by rotating the feed roller 16 or rotating the take-up roller 32.
[0173] A sensor 70 is provided to detect the arrival of the pattern at a specific location when the mesh is detached from the feed roller 16. If the expected time for the pattern to reach the printing line 40 does not coincide with the next time the substrate 10 reaches the printing line 40, the movement of the vibrator 20 can alter the paper web path length from the feed roller 16 to the printing line 40, thereby increasing or decreasing the perceived time required for the pattern to reach the printing line 40. Therefore, by controlling the vibrator 20 based on the time the pattern is sensed by the sensor 70 and the time the substrate 10 is fed into the printing line 40, proper alignment between the pattern and the substrate can be ensured. If the patterns on the opposing surfaces of the substrate are all correctly aligned with the substrate, then they will also be correctly aligned with each other.
[0174] While any suitable alignment device 50 can be used in this invention, the applicant has devised various methods for timely feeding of the substrate into the pressure roller while ensuring its correct alignment with the corresponding pattern.
[0175] In addition to the apparatus disclosed in EP 3491902, interested readers may find alternative methods and apparatuses for implementing these apparatuses in EP 4049308 and EP4320059, all of which can be used as alignment apparatus 50. In some cases, if a tilting of the pattern orientation is observed before or after pattern transfer, it may be advantageous to use an alignment apparatus capable of tilting the substrate to match the mesh pattern orientation.
[0176] Cooling Station
[0177] In the illustrated embodiment, the mesh 14 is cooled by conduction after passing through the printing line 40. An endless cooling belt 24 passes through the first and second rollers 26 and is held at tension by an idler roller 28. Thus, the cooling belt 24 remains in thermal contact with the back of the mesh throughout its entire run from the pressure roller 22 to the second roller 26.
[0178] Cooling belt 24 is exposed to ambient air for its remaining length and may not require additional cooling. If cooling of belt 24 is required, a blower can be used. An air blowing device is provided to it, and this air is preferably (but not necessarily) cooled. As an alternative, cooling belt 24 can be omitted, and air can be blown directly onto the back of the roller, thereby cooling the mesh downstream of the roller.
[0179] If necessary, the air can be cooled to a temperature not exceeding 20°C via a refrigeration circuit or other means. Furthermore, the cooling strip can be replaced with any suitable heat sink to reduce the temperature to the desired range.
[0180] As the mesh 14 passes through the cooling station 23, it remains attached to the substrate 10. However, as the mesh cools, the adhesion between the composition and the mesh decreases and / or conversely, the adhesion between the composition and the substrate increases. This change in relative adhesion to the respective source and target surfaces helps to separate the mesh from the substrate when needed.
[0181] Therefore, the temperature that a cooling station needs to reach or maintain may depend on the network, the substrate, and the future effects they may collectively experience. When the cooling station acts as a heat sink, it can be advantageously controlled so that the temperature of the paper roll and substrate exiting the cooling station is adapted to the function to be performed in the downstream station.
[0182] Since active cooling of the mesh 14 and / or its underlying substrate 10 is intended to promote proper separation of the mesh from the substrate so that the pattern of the transferable composition can adhere adequately thereon, cooling may be redundant if separation of the mesh is not required, or at least not immediately.
[0183] Separation Device
[0184] The separating device 30 shown in the exemplary embodiment of the apparatus illustrated includes a metal plate that is bent or formed to form an acute angle, such as the angle on a blade. The web, on its path back to the take-up roll 32, bends to a sharp edge defined on the outside of the separating device. This operation peels the web 14 from the substrate 10, causing the composition to adhere to the substrate 10. Those skilled in the art will readily understand that other separating devices (e.g., devices that rotate the paper web toward the take-up roll) can satisfactorily achieve similar paper web peeling when separation is required; rods or rotating cylinders are merely examples of such alternative devices.
[0185] In one embodiment, the mesh 14 may need to be held attached to the substrate 10 as a temporary protection for the pattern until it is separated later (optionally at a different facility and / or by a different entity), or as a permanent protective layer for the pattern.
[0186] In this configuration, the mesh 14 does not need to be wound by the take-up roller 32; it only needs to be stretched. It can then be removed from the supply roll 16 using any suitable device for this purpose. Furthermore, when the separation of the mesh from the substrate is delayed or omitted, it may not be necessary to cool the mesh 14 downstream of the printing line 40, nor to cool it to a temperature chosen to facilitate separation. Additionally, in this configuration, particularly when the substrate is fed into the pressure roller as a separate unit, the device may include a cutting device for cutting off any unbonded edges of the mesh remaining on the substrate between any desired number of adjacent substrates. The cutting device (not shown) can separate each substrate from the next, or separate two or more substrates from subsequent sets of substrates.
[0187] An embodiment of the present invention is shown in Figures 2 and 3.
[0188] For clarity, many components already discussed in Figure 1, such as the substrate supply device (e.g., 12), the substrate drive mechanism (e.g., 90, conveyor belt not shown), and the alignment station (e.g., 50), as well as optional substrate inspection stations (e.g., 60), selection stations (e.g., 62), speed adjustment stations (e.g., 64), and heating stations (e.g., 52) located upstream of the imprinting line, are omitted, along with any other pre-transfer stations that may be necessary for a particular device (or method). Similarly, post-transfer stations, if present, may be located downstream of the imprinting line (40) or even downstream of the separation station (e.g., 30).
[0189] Figures 2 and 3 only schematically show the modifications made to the device shown in Figure 1 to implement the present invention.
[0190] In Figures 2 and 3, the mesh 100 is drawn out in the direction indicated by arrow 130 by an electrically operated feed roller (not shown, but equivalent to roller 16 in Figure 1, which, as previously mentioned, can also serve as a mesh guide unwinder), first passing through a vibrator 102 located between two guide rollers 104 and 106. Next, the mesh 100 passes through another guide roller 108 and through a tension groove formed by an electrically operated tension roller 110 and a rubber roller 112, which presses the mesh with constant pressure to ensure no slippage occurs between the tension roller 110 and the mesh 100. Before reaching the imprinting roller 116, the mesh is simultaneously and / or subsequently heated by a mesh heater (e.g., by bypassing the heating roller 114), at which point the pattern is transferred from the mesh 100 onto the substrate. As shown in the figure, when a pressing joint is formed between the two pressure rollers (for example, embossing line 40), pressure roller 116 (equivalent to...) Figure 1 The pressure roller 22 or at least one pressure roller (e.g., the upper pressure roller) can be driven by a motor to drive the mesh 100.
[0191] The actuator 102 in Figure 1 is equivalent to the actuator 20 in Figure 1. Its function is to buffer the system during the initial acceleration and / or final deceleration when the linear velocities of different rollers have not yet matched each other.
[0192] This actuator is also associated with a camera (number 118). This ensures proper alignment of the pattern with the substrate by accelerating or decelerating the substrate feed rate. The position of the substrate relative to the indentation can be determined upstream of the indentation by sensors (e.g., optical sensors), which can monitor the edges of the substrate, reference marks on the substrate, or both. Such sensors may be part of the substrate alignment device (as shown at station 50 in Figure 1).
[0193] A control system 120 is provided to compensate for pattern size errors transferred onto the substrate.
[0194] As shown by the dashed lines in Figure 2, the control system receives data signals from camera 122 and the shaft encoder associated with pressure roller 116 via electrical connections, and sends control signals to set the speed and / or torque of the electric tension roller 110 and the temperature of the heating roller 114. Alternatively, the temperature of any other heating device along the mesh upstream of the pressure roller or within the pressure roller can also be set. For example, a section of mesh 100 between guide roller 106 and embossing roller 116, or a section of mesh 100 between tension roller 112 and heating roller 114, can be heated by convection or radiation (e.g., using an infrared heater).
[0195] As shown in Figure 2 and Figure 3, two cameras 122 can be placed to observe the reference points on both sides of the mesh 100 as it passes through the printing roller 116.
[0196] Alternatively, the camera can be placed after the pattern has been transferred to the substrate to view the reference points on the pattern. By detecting the position of the reference points, the control system 120 can determine the deviation of the reference point width spacing from the desired size. Furthermore, by measuring the movement of the mesh 100 between successive reference point sensings using a shaft encoder associated with the embossing roller 116, the control system 120 can determine the deviation of the pattern length from the desired size.
[0197] The control system 120 can control the change in the width of the transfer pattern by changing the temperature provided by the heating device (e.g., heating roller 114) upstream of the pressure roller, thereby changing the temperature of the mesh 100 and the degree of spreading of the mesh 100 (and the pattern thereon) when it is pressed onto the substrate by the printing roller 116.
[0198] The length of the transferred pattern can be changed by altering the tension of the mesh 100 immediately upstream of the imprinting roller 116 via the control system 120. Tension control can be achieved by changing the relative speed and / or torque between the motor driving the imprinting roller 116 (or one of a pair of imprinting lines) and the tension roller 110.
[0199] The term "immediately following" means that although it does not necessarily occur instantaneously or at a precise prior location, the control system completes the change before the mesh enters. The timing and / or location of the fine-tuning must be close enough to the event so that the control effect persists sufficiently to achieve the desired level of modification during the fine-tuning.
[0200] The degree of tension that needs to be applied to the mesh depends, among other factors, on the specific mesh, the size of the pattern to be transferred and its deviation from the nominal and permissible values, and the temperature of the mesh (e.g., between 20°C and 80°C).
[0201] Tolerable deviations in pattern size and / or position may depend on the pattern to be transferred and / or the parameters considered.
[0202] For example, the absolute value of the deviation from the ideal size (e.g., the length and / or width of the pattern, the transfer area and / or the non-transfer area) or the ideal position (e.g., a point characterizing the pattern, the substrate or their respective centroids) can reach 100 µm, 50 µm, 25 µm, 10 µm, 5 µm, or 1 µm.
[0203] Alternatively, such deviation can be within 1% of the ideal size and / or position relative to the value sought by the reference data, or within 0.5%, 0.25%, 0.1%, or 0.05% of the relevant nominal value (e.g., the distance between two points or the coordinates of a point).
[0204] Regardless of the tolerance range of the ideal value, this device can correct deviations of up to twice the upper limit of acceptable variation on any dimension. In some embodiments, the device can correct deviations of up to 5, 10, or 20 times.
[0205] For example, if the width of the pattern differs from the ideal width value by no more than 10 picometers and the length differs from the ideal length value by no more than 50 picometers to maintain a satisfactory effect on the intended substrate, the device is adapted to modify the width and / or length of the pattern on the mesh to differ from their respective ideal values by no more than 200 picometers and / or 1000 picometers. Taking into account the tilt angle of the pattern, in some cases, the device can correct for orientation deviations of the pattern relative to the sheet, with an α angle of up to 2°. In one embodiment, the device can be used to properly align the pattern with its respective substrate, such that the angle between the pattern and the substrate is 1.5° or less, 1° or less, or 0.5° or less. Ideally, there should be almost no deviation (« < 0.03°) between the pattern orientation observed on the mesh (or the transferred substrate) and the intended “reference” orientation of these patterns on their respective supports.
[0206] For the sake of symmetry, the device shown in the figure has two controllers 120, but in reality, if the device is designed to be based on data received from different cameras, a single controller can be used to control the two networks.
[0207] Transfer the patterns of two different spider webs to opposite sides of the same substrate (e.g., at the same occlusion or at two different occlusions).
[0208] In one embodiment, the data read by camera 122 may be coded data written onto the mesh during manufacturing, indicating the length and width of the pattern measured during manufacturing, or indicating the optimal settings of heat and tension applied to the mesh to obtain the desired pattern-consistent dimensions after transfer to a substrate.
[0209] This type of data only needs to be input into one side of the network, and each network only needs one camera.
[0210] Although heat is the primary parameter determining pattern widening during transfer, and tension is the primary parameter determining pattern elongation (e.g., for conductivity), these two adjustments are not independent of each other, as heating may elongate the pattern, while tension may narrow it.
[0211] Therefore, when setting the heating level and mesh tension, the controller must take into account both the measured length and width.
[0212] The controller may contain a lookup table that indicates optimal heating and tension based on the measured width and length of the pattern on the mesh, or a recursive algorithm may be used to derive the optimal settings.
[0213] It should be understood that feedback loops that alter fabric heating and tension during processing cannot react quickly enough to correct dimensional changes from one pattern to the next.
[0214] However, by taking readings at the beginning of the mesh, the controller can determine the heating and tension settings for the remaining portion of the mesh; by taking readings during the pattern transfer process, the settings can be modified to compensate for the slow, long-term drift in the measured length and width of the pattern.
[0215] Method Overview
[0216] The apparatus suitable for implementing this method has been described above; now, it will be described with reference to Figure 7.
[0217] It must be emphasized that although these steps have been assigned numerical values, they do not need to be performed in sequential order.
[0218] Typically, in the first step, marked SO1 in the diagram, at least one mesh with a pattern and a substrate to be transferred is pushed toward the pressure roller, with the substrate being fed in one at a time.
[0219] Ideally, the paper roll and the substrate should be aligned beforehand.
[0220] When entering the rolling zone, the position of the side of the mesh relative to the rolling zone is determined by the mesh guiding system, and the position of the substrate is determined by the substrate alignment device.
[0221] As described in the equipment manual, this step may include inspection, selection / rejection, and / or heating of the substrate. Furthermore, if a misalignment between the pattern and its substrate is detected in a later stage, the substrate feed method can be modified as part of a gradual correction of this mismatch.
[0222] For example, the substrate can be accelerated or decelerated as needed until the speeds of the mesh and the substrate match again; and / or the substrate can be tilted during alignment to match the tilt of the pattern orientation on the mesh.
[0223] In step S02, the dimensions (length and / or width) of the pattern are determined on the fabric before it enters the rollers. This step includes data acquisition, which can be performed using any suitable sensor capable of detecting pattern elements or other markings on the fabric surface besides the patterned area, and then analyzing the acquired data to take appropriate action.
[0224] Sensors and tags must be compatible with each other; typically, optical sensors are used for optically detectable tags.
[0225] This step can also be used to read data encoded in the mesh during manufacturing, such encoded data setting recommended tension and / or temperature for each specific mesh, or a combination of both methods: setting recommended values initially during manufacturing, and values derived from actual measurements taken during the mesh's feeding into the imprinting line. This step can be partially or entirely omitted and replaced by step S05, which will be described in detail later, where similar data acquisition and analysis (referred to as measurement) can be performed once the pattern is transferred to the substrate.
[0226] Assuming that the pattern-related measurements are performed on the web in step S02, the measured length and / or width are compared with the ideal value (reference data), see step S06. If there is a deviation from the ideal value, the tension and / or temperature of the web before it enters the printing line can be adjusted accordingly (see step S03).
[0227] Such adjustments can be made even if the deviation between the measured value and the expected value is within tolerance (e.g., to avoid or limit future deviations from that range). As described in the illustration of Figure 5 above, although for simplicity the steps involve only the measurement of length and / or width (or comparison with the corresponding reference value), in some cases it may be necessary to evaluate other characteristics of the pattern, such as its centroid position (point E in Figure 5) and the relative position of the pattern. This includes the edges of the mesh (especially when it is necessary to avoid edges in order to transfer to the appropriate area of the substrate), and the tilt of the pattern relative to the reference direction of the reference pattern (if any). Furthermore, while step S02 refers to measuring the dimensions characterizing the pattern on the first sheet of paper (e.g., length, width, centroid position, pattern tilt, position relative to the edge or side of the paper, etc.), the subsequent step S03 (setting the tension and / or temperature of the paper based on the measured results) may also consider measurements relative to the substrate to which the pattern will be transferred, and (if relevant) similar measurements relative to a second pattern carried on a second sheet of paper, which has been transferred to the other side of the substrate.
[0228] For two mesh structures, since the substrate can only be aligned with the two mesh structures once, it can be advantageously positioned in the middle between the two patterns (if each pattern is relatively deviated from the expected position), so that the absolute deviation of each pattern relative to the substrate can be halved.
[0229] The settings for sheet tension and / or temperature (as related to S03) can initially be made based on experience or input from the sheet manufacturer; however, this primary feedforward control is often insufficient to account for continuous changes in pattern size and gradual increases in transfer accuracy.
[0230] The initial settings are corrected using a feedback mechanism based on measurements of the pattern on the mesh (S02) or after it has been transferred from the mesh to the corresponding substrate at the imprinting line (S04). For example, the actual length and / or width of the pattern is measured when the pattern is transferred to the substrate (S05) (data acquisition and analysis). If necessary, pattern measurements can be performed before (S02) and after (S05) the transfer. As described in S02, the dimensions characterizing the pattern on the first side of the substrate (e.g., length, width, centroid position, pattern tilt, position relative to the substrate edge or side, etc.) can be compared not only with corresponding reference values but also with similar values measured relative to the substrate to which the pattern will be transferred and / or the second side of the substrate.
[0231] If the control of mesh tension and / or temperature is based on measurements taken on substrate S05 after transfer, the measured length and / or width, etc., are compared with the reference data in step S06. If there is a deviation from the reference data, the tension and / or temperature of the mesh before entering the imprinting line can be adjusted accordingly (see step S03).
[0232] If the dimensional measurements of the pattern on the characterizing mesh pattern (performed at S02) and / or the substrate (performed at S05) are compared with measurements indicating the substrate position, and the results show that while the pattern conforms to the expected values (e.g., spacing), the actual measurements deviate from the expected values (e.g., due to step S03), the substrate may need to move forward or backward relative to the pattern, and a correction operation may then be performed in a subsequent step S01. This may also include slowing down or accelerating the substrate upstream of the indentation to ensure proper alignment of the pattern with the substrate.
[0233] As previously stated, if the deviation from the expected output is related to the relative Y position and / or orientation of the pattern with respect to the sheet or substrate (if no corrective action is taken), then step S01 (or the step after the problem is discovered) may alternatively (or additionally) include lateral displacement and / or tilting of the substrate to bring it into the embossing line at the desired Y position or tilt angle, which substantially matches the corresponding position or tilt angle of the pattern orientation on the sheet.
[0234] In summary, in this method, the preventive or corrective measures that can be taken before entering the roll gap, in addition to the basic steps of A] feeding the paper web and substrate into the roll gap (S01) and B] controlling the tension and / or temperature of the paper web (S03), may also include one or more of the following: a) adjusting the lateral position of the paper web (e.g., by operating the paper web guiding system); b) adjusting the lateral position of the substrate (e.g., by operating the substrate alignment system to uniformly change the Y-axis position of the substrate along its length); c) adjusting the position of the leading edge of the substrate (e.g., by changing its speed); and d) adjusting the orientation of the substrate (e.g., by operating the substrate alignment system to differentially change the Y-axis position of the substrate along its length).
[0235] Each of the above potential (e.g., response) measures may not completely eliminate harmful deviations from the desired parameter, but is sufficient to reduce such deviations to within a tolerable range from the sought value.
[0236] In some cases, it may be necessary to combine two or more corrective measures to bring the deviation within an acceptable range. In such cases, not all combined measures need to be effective individually, as long as their combined effect can satisfactorily reduce the deviation.
[0237] Exemplary Applicability
[0238] The transfer process achieved by the above-described apparatus and related methods is applicable to rigid or flexible, planar or curved substrates, and the specific properties of the substrate can be selected as needed, depending on the product to be manufactured.
[0239] The substrate used for transferring functional patterns, such as substrates used to manufacture electronic components, can be any substrate suitable for manufacturing items such as printed circuit boards (PCBs), integrated circuits (ICs), radio frequency identification (RFID) tags, liquid crystal displays (LCDs), waveguides, thin film devices, and photovoltaic (solar) cells, to name just a few.
[0240] Such substrates are known to those skilled in the art and need not be described in detail here. There are fewer restrictions on the substrates used for transferring decorative patterns, as long as they conform to the apparatus and methods described in this teaching.
[0241] Taking substrates suitable for manufacturing solar cells as an example, they may include single-junction and multi-junction, rigid wafers and flexible thin films, and are typically made of semiconductor materials, including organic and inorganic semiconductors, such as silicon (crystalline or amorphous), gallium arsenide (e.g. in single-junction GaAs cells), cadmium telluride (CdTe), copper indium selenide (CuInSe), perovskite materials (with an ABX3 crystal structure, such as perovskite oxide (CaTiO3)), and copper indium gallium selenide (CIGS), to name a few. Some materials are also additionally doped or passivated in specific photovoltaic cells.
[0242] For thin films, the thickness of such substrates can be as low as a few nanometers (nm) to tens of micrometers, overlapping with thin wafers (e.g., approximately 25 µm thick), more commonly wafers no more than 1 millimeter, and preferably thinner than 500 µm or 250 µm. It is evident that while some of these substrates are rigid, they are relatively fragile and brittle, posing a challenge to any device and method that ensures proper pattern transfer without damaging the substrate.
[0243] In addition to the disclosed features described in the preceding claims, the following provisions also list features deemed to be inventive in order to provide a fair basis for the final filing of one or more divisional patent applications.
[0244] Clauses
[0245] 1. A method for ensuring that a pattern carried by a mesh of deformable plastic material conforms to a desired length and / or width after the pattern is transferred to a substrate at a transfer embossing line, the transfer embossing line comprising a rotatable embossing roller, and at the transfer embossing line the mesh and the substrate are pressed against each other, the method comprising: a) collecting data indicating (i) at least one length and / or width of the pattern on the mesh before the pattern is transferred to the substrate and / or (ii) on the substrate after the pattern is transferred to the substrate, and
[0246] b) Based on the collected data, control at least one of the temperature and tension of the mesh upstream of the embossing line or at the embossing line.
[0247] 2. The method of Clause 1, wherein the transfer embossing line is defined between a rotatable embossing line roller and a fixed backing support.
[0248] 3. The method of Clause 1, wherein the transfer imprint line is defined between an imprint line roller and a second imprint line roller that can be rotated in the opposite direction.
[0249] 4. The method as described in any one of Clauses 1 to 3, wherein the temperature and / or tension of the mesh are controlled by a control unit, the control unit being configured to operate at least one of the mesh heater and the mesh tensioner in response to collected data regarding the length and width of the pattern.
[0250] 5. The method as described in any of Clauses 1 to 4, wherein data indicating the length and / or width of the pattern is collected by at least one sensor positioned upstream or downstream of the embossing line along the mesh.
[0251] 6. The method as described in Clause 5, wherein one of the at least one sensors is an optical sensor.
[0252] 7. The method as described in Clause 5 or Clause 6, wherein the data indicating the length and / or width of the pattern is derived from the elements of the pattern or the detection of each sensor.
[0253] 8. The method as described in any of Clauses 5 to 7, wherein the data indicating the length and / or width of the pattern is derived from the detection of the or each sensor on a reference mark different from the pattern.
[0254] 9. The method as described in any one of Clauses 5 to 8, further comprising providing a shaft encoder associated with the embossing line roller, the encoder being capable of measuring the movement of the mesh and substrate through the embossing line, and detecting, by means of an optical sensor, the length of the mesh through the embossing line between detections of consecutive specific marks, indicating the length of the pattern on the mesh or the substrate.
[0255] 10. The method of any of Clauses 1 to 9, wherein the length and / or width of the pattern is measured during the manufacture of the mesh and the data is placed on the mesh to indicate the optimal temperature and tension of the mesh during the transfer of the pattern to the substrate, and wherein, during the transfer of the pattern to the substrate, at least one of the temperature and tension of the mesh upstream of the embossing line or at the embossing line is controlled based on data read from the mesh.
[0256] 11. The method as described in any of Clauses 1 to 10, wherein tension in the mesh is controlled by changing the speed or torque of a motor driving two spaced rollers for advancing the mesh.
[0257] 12. The method of any one of Clauses 1 to 11, wherein the substrate is fed into the imprinting line by a substrate supply device and a drive mechanism for conveying the substrate into the imprinting line, wherein the substrate is aligned before entering the imprinting line, the method optionally including one or more of the following before entering: a) inspecting the substrate for defects; b) selecting a substantially defect-free substrate; c) changing the speed of the substrate (e.g., by accelerating if a defective substrate is discarded at a previous selection step); and d) heating the substrate.
[0258] 13. The method of Clause 12, wherein the alignment of the substrate includes setting the substrate to at least a Y position relative to the imprint line and / or rotating the substrate, the alignment optionally being performed by a lateral stop.
[0259] 14. The method as described in Clause 12 or Clause 13, wherein the substrate is accelerated or decelerated before entering the embossing line to align with the pattern upon entering the embossing line.
[0260] 15. The method described in any of Clauses 1 to 14 further includes laterally guiding the mesh before it enters the imprinting line.
[0261] 16. The method as described in any of Clauses 1 to 15, further comprising cooling the mesh and / or substrates attached to each other downstream of the embossing line after the pattern has been transferred to the substrate; the method may optionally include cutting the mesh between one or more substrates.
[0262] 17. The method of any one of Clauses 1 to 16 further comprises peeling the mesh off the substrate after transferring the pattern to the search substrate.
[0263] 18. The method of any one of Clauses 1 to 17, wherein the pattern comprises at least one transferable composition carried in a groove in a first surface of the mesh and / or on the first surface of the mesh; the mesh is made of one or more layers of plastic material and has at least a first surface made of a deformable thermoplastic polymer.
[0264] 19. The method as described in Clause 18, wherein the or each transferable composition comprises particles of one or more materials, and an adhesive that can be activated by heating and / or by pressure before or during passage through the embossing line.
[0265] 20. The method of Clause 19, wherein at least one transferable composition comprises particles made of a conductive material.
[0266] 21. The method of Clause 20, further comprising making the pattern or portions thereof containing particles made of a conductive material conductive, the step of which includes sintering and / or melting the pattern transferred to the substrate.
[0267] 22. An article comprising a pattern applied to a substrate, wherein the pattern conforms to a desired length and / or width and the deviation from the desired length and / or width does not exceed 100 micrometers and / or 1%, said article being manufactured using the apparatus and / or methods set forth in the various clauses and claims and substantially as described in this teaching.
[0268] 23. The article as described in Clause 22, wherein the pattern also conforms to a desired position on the substrate and the deviation from the desired corresponding coordinates of the point indicating the pattern does not exceed 100 micrometers and / or 1%.
[0269] 24. An article as described in Clause 22 or Clause 23, wherein the pattern also conforms to a desired orientation relative to the substrate and the deviation from said orientation does not exceed 3 degrees.
[0270] It should be understood that certain features of this disclosure (which, for clarity, are described in separate embodiments) may also be provided in combination in a single embodiment. Conversely, various features of this disclosure (described for brevity in the context of a single embodiment) may also be provided individually, or in any suitable sub-combination, or as required in any other described embodiment of this disclosure.
[0271] Unless certain elements are missing, some features described in the various embodiments should not be considered as fundamental features of these embodiments. Although this disclosure has been described in conjunction with various specific embodiments, this is merely for illustrative purposes and these specifically disclosed embodiments should not be considered limiting.
[0272] Based on the disclosure herein, those skilled in the art will conceive of many other alternatives, modifications, and variations. Therefore, this invention is intended to cover all such alternatives, modifications, and variations, and is limited only by the scope of the terms and claims of this disclosure and any changes in their meaning and equivalents.
[0273] In the specification and claims of this disclosure, each verb "comprising," "including," and "having," and their variations, is used to indicate that the object of the verb is not necessarily a complete enumeration of the features, members, steps, components, elements, or parts of the subject of the verb. Nevertheless, the methods of this doctrine are also contemplated to essentially include or consist of the process steps, and the apparatus of this doctrine is also essentially included or consist of the apparatus.
[0274] The singular forms “a” and “this” as used herein include plural references meaning “at least one” or “one or more”, unless the context clearly specifies otherwise. At least one of A and B may refer to either A or B, and in some embodiments, may refer to both A and B.
[0275] In this document, positional or motion terms such as “up,” “down,” “right,” “left,” “bottom,” “below,” “lower,” “lower,” “top,” “above,” “raise,” “high,” “vertical,” “horizontal,” “backward,” “forward,” “upstream,” and “downstream,” as well as their grammatical variations, are used only for illustrative purposes to describe the relative position, placement, or displacement of certain components, indicating the first and second components in the current example, or both.
[0276] Such terms do not necessarily imply, for example, that a “bottom” component is located below a “top” component, because such orientation, components, or both can be flipped, rotated, moved in space, placed diagonally or in a position, placed horizontally or vertically, or similarly modified.
[0277] Unless otherwise specified, the use of "and / or" between the last two members of the selection list indicates that one or more options in the list can be selected.
[0278] In this article, the word "exemplary" means "as an example, instance, or illustration".
[0279] Any embodiment described as "exemplary" is not necessarily superior to other embodiments, nor does it exclude features of other embodiments.
[0280] As used herein, unless otherwise stated, adjectives such as “substantially,” “approximately,” and “about” used to modify the conditions or relationships of features or characteristics of embodiments of the present technology should be understood as being defined as being within acceptable tolerances in the intended application of the embodiment, or within the range of variation expected in the measurements performed and / or the measuring instruments used. When “approximately” or “about” appears before a numerical value, it indicates an error range of ±15%, ±10%, or even ±5%, and in some cases, indicates an exact value.
[0281] Furthermore, unless otherwise stated, the terms (e.g., numbers) used in this disclosure, even without such adjectives, should be interpreted as having tolerances that may deviate from the precise meaning of the relevant terms, but are sufficient to enable the invention or related parts thereof to operate and function in the manner described, and to be understood by those skilled in the art.
[0282] Unless otherwise stated, when the outer boundary of the range of a feature of an embodiment of the present invention is indicated in this disclosure, it should be understood that, in that embodiment, the possible values of the feature may include the indicated outer boundary and values between the indicated outer boundary.
[0283] All publications, patents and patent applications mentioned herein, especially the applicant’s applications, which are necessary for understanding or completing this disclosure, are incorporated herein by reference in their entirety and are listed here in full.
Claims
1. An apparatus for transferring a pattern (410) carried on a deformable plastic mesh (14, 100) onto a substrate (10), said apparatus comprising an embossing line (40) defined between at least one embossing roller (22) and a backing support (42), wherein the substrate and the mesh pass simultaneously through the embossing line (40), and pressure is applied by means of the embossing line (40) to achieve the transfer of the pattern (410) from the mesh to the substrate, characterized in that, A mesh heater (114) and a mesh tensioner (110) are arranged upstream of the imprinting line (40), and a control unit (120) is arranged to control the mesh heater and the mesh tensioner according to data indicating the length and width of the pattern on the mesh before transfer or the length and width of the pattern on the substrate after transfer, so as to ensure that the pattern conforms to the required length and width after transfer to the substrate.
2. The apparatus of claim 1, comprising at least one sensor (70) for obtaining measurements at a location upstream of the embossing line (40) indicating the width and length of the pattern (410) immediately preceding the transfer on the mesh (14, 100).
3. The apparatus of claim 1 or 2, comprising at least one sensor (80) for acquiring measurements indicating the width and length of the pattern (410) on the substrate (10) after transfer at the embossing line (40).
4. The apparatus as claimed in claim 2 or 3, wherein, Each of the sensors (70, 80) includes an optical sensor (122) for determining the position of specific marks on both sides of the mesh (100) to provide a measurement indicating the width of the pattern on the mesh or the substrate (10), the marks being either reference marks (420, 430) different from the pattern, or elements (440) of the pattern (410).
5. The apparatus of claim 4, wherein, The embossing roller (22) is associated with a shaft encoder capable of measuring the movement of the mesh (100) and the substrate (10) through the embossing line (40), the length of the mesh through the embossing line between the detection of at least one optical sensor (122) of a series of specific marks (420, 430) on the mesh, and indicating the length of the pattern on the mesh or the substrate.
6. The apparatus according to any one of claims 1 to 5, wherein, The length and width of the pattern (410) are measured during the manufacture of the mesh (100), and encoded data markers (420, 430) are applied to the mesh during the manufacture, the encoded data markers (420, 430) containing data indicating the size of the pattern, and wherein the control unit (120) of the device is used to set the mesh temperature and tension based on data read from the mesh.
7. The apparatus of claim 6, wherein the encoded data markers (420, 430) indicate the optimal mesh temperature and mesh tension to be set by the control unit (120) before transferring the pattern (410) to the substrate (10).
8. The apparatus according to any one of claims 1 to 7, wherein, The mesh heater is a heating roller (114) located upstream of the embossing line (40).
9. The apparatus according to any one of claims 1 to 8, wherein, At least one of the at least one embossing roller (22) includes a heater.
10. The apparatus according to any one of claims 1 to 9, wherein, The tension in the mesh is variable by controlling the speed or torque of the motor that drives two spaced-apart embossing rollers (22) used to advance the mesh (14, 100).
11. The apparatus according to any one of claims 1 to 10, wherein, The backing support (42) is the second embossing roller (22).
12. The apparatus of any one of claims 1 to 11, further comprising at least one of the following located upstream of the imprint line: a) Mesh guidance system (17); b) Substrate supply device (12); c) A drive mechanism (90) for conveying the substrate (10) to the imprinting line (40). d) Substrate inspection station (60); e) Substrate selection station (62); f) Substrate speed adjustment station (64); g) Substrate heating station (52); and h) Substrate alignment device (50) which enables the substrate to be laterally and / or rotatably displaced relative to the embossing line.
13. The apparatus of any one of claims 1 to 12, further comprising at least one of the following downstream of the imprinting line: i) Cooling station (23) for cooling the mesh (14,100) and / or the substrates (10) attached to each other. ii) A separation device (30) for peeling the mesh off the substrate; iii) A cutting device for cutting the mesh between one or more substrates; and iv) Finishing station.
14. The apparatus according to any one of claims 1 to 13, wherein, The pattern (410) includes at least one transferable composition, which is carried in a groove in the first surface of the mesh and / or on the first surface of the mesh.
15. The apparatus of claim 14, wherein, The mesh (14, 100) is made of one or more layers of plastic material and has at least a first surface made of a formable thermoplastic polymer.
16. The apparatus according to any one of claims 1 to 15, wherein, The pattern (410) is made of one or more transferable compositions comprising particles of one or more materials and an adhesive that can be activated by heating and / or by pressure.
17. The apparatus of claim 16, wherein, The pattern (410) is conductive, or capable of being conductive, and at least a portion of the particles are made of conductive material.
18. A method for ensuring that a pattern carried by a mesh of deformable plastic material conforms to a desired length and / or width after the pattern is transferred to a substrate at a transfer embossing line, the transfer embossing line comprising a rotatable embossing roller, and at the transfer embossing line the mesh and the substrate are pressed against each other, the method comprising: a) Collect data indicating at least one of (i) the length and / or width of the pattern on the mesh before the pattern is transferred to the substrate and / or (ii) the length and / or width of the pattern on the substrate after the pattern is transferred to the substrate, and b) Based on the collected data, control at least one of the temperature and tension of the mesh upstream of the embossing line or at the embossing line.
19. The method of claim 18, wherein, Data indicating the length and / or width of the pattern is collected by at least one sensor positioned upstream and / or downstream of the embossing line along the mesh.
20. The method of claim 19, wherein, The data indicating the length and / or width of the pattern is derived from the detection of two or more markers by the sensor or by each of the two or more markers, which are selected from the elements of the pattern and reference markers different from the pattern.
21. The method of any one of claims 18 to 20, further comprising providing a shaft encoder associated with the embossing line roller, the shaft encoder being capable of measuring the movement of the mesh and the substrate through the transfer embossing line, and the length of the mesh through the embossing line between consecutive detections of specific marks indicating the length of the pattern on the mesh or the substrate.
22. The method according to any one of claims 18 to 21, wherein, The length and / or width of the pattern are measured during the manufacture of the mesh, and the data is placed on the mesh to indicate the optimal temperature and tension of the mesh during the transfer of the pattern to the substrate, and wherein, during the transfer of the pattern to the substrate, at least one of the temperature and tension of the mesh upstream of the transfer imprint line or at the transfer imprint line is controlled based on the data read from the mesh.
23. The method of any one of claims 18 to 22, wherein: a) Temperature changes in the mesh are controlled by heating the mesh upstream of and / or at the transfer imprint line; and / or b) control the tension change in the mesh by changing the speed or torque of the motor that drives two spaced rollers for advancing the mesh toward the embossing line.
24. The method according to any one of claims 18 to 23, wherein, The substrate is fed into the imprinting line by a substrate supply device and a drive mechanism, the drive mechanism being used to transport the substrate to the transfer imprinting line, wherein the substrate is aligned before entering the imprinting line, the method optionally including one or more of the following before entering: a) inspecting the substrate for defects; b) selecting a substrate that is substantially free of defects; c) changing the speed of the substrate; and d) heating the substrate.
25. The method of claim 24, wherein the alignment of the substrate includes setting the substrate to at least a Y position relative to the transfer embossing line and / or rotating the substrate, the alignment optionally being performed by a lateral stop.
26. The method of any one of claims 18 to 25, further comprising laterally guiding the mesh before it enters the transfer imprint line.
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