RF connector and communication device including the same

Abstract

To provide an RF connector capable of reducing the overall size of a device and a communication device including the same. [Solution] The communication device includes a mechanism box including a board seating surface and a connecting groove formed on the board seating surface, a plurality of printed circuit boards arranged on the board seating surface, a connector arranged in the connecting groove and electrically connecting the plurality of printed circuit boards, and a gasket arranged to cover at least a portion of the connector.

Description

[Technical Field]

[0001] The present invention relates to an RF connector and a communication device including the same. [Background technology]

[0002] The material described in this section merely provides background information for the present disclosure and may not constitute prior art.

[0003] RF connectors are commonly used to receive RF (Radio Frequency) signals between printed circuit boards (PCBs). RF connectors come in two types: single connectors that transmit a single frequency signal, and multi-connectors that transmit various signals in different frequency bands. In particular, multi-connectors are increasingly being used these days to process signals in various frequency bands.

[0004] However, connectors for transmitting frequency signals occupy a large volume, and in order to connect various printed circuit boards due to the structure and function of the connectors, differences in height occur between the printed circuit boards, which increases the overall size of the device.

[0005] Furthermore, there is a limit to the range of frequency bands that a connector can handle, and there is a problem in that the overall unit cost of parts increases in order to transmit signals in many connectors or in a wide range of frequency bands. Summary of the Invention [Problem to be solved by the invention]

[0006] The RF connectors and communication devices including the same according to the present disclosure are configured to transmit RF signals on the same plane or at similar heights, thereby reducing the overall size of the device.

[0007] The RF connector and communication device including the same according to the present disclosure are capable of processing signals in various frequency bands, while reducing the unit cost of parts and improving economy.

[0008] The RF connector according to the present disclosure and a communication device including the same can be configured in a compact size while having excellent heat dissipation performance.

[0009] The RF connector and the communication device including the same according to the present disclosure can significantly improve the shielding effect by including a gasket that is arranged to cover the RF connector. [Means for solving the problem]

[0010] According to one embodiment of the present disclosure, there is provided a communication device including: a mechanism box including a board seating surface and a connecting groove formed on the board seating surface; a plurality of printed circuit boards arranged on the board seating surface; a connector arranged in the connecting groove and electrically connecting the plurality of printed circuit boards; and a gasket arranged to cover at least a portion of the connector.

[0011] According to another embodiment of the present disclosure, there is provided an RF connector including: an elastic connecting member, at least a portion of which is elastically deformable and configured to electrically connect a printed circuit board; a support member that supports the elastic connecting member; and a gasket that is arranged to cover at least a portion of the elastic connecting member. [Effects of the Invention]

[0012] According to the present disclosure, RF connectors and communication devices including the same are configured to transmit RF signals on the same plane or at similar heights, which has the effect of reducing the overall size of the device.

[0013] According to the present disclosure, an RF connector and a communication device including the same are capable of processing signals in various frequency bands, while also reducing the unit cost of components and improving economy.

[0014] According to the present disclosure, an RF connector and a communication device including the same have the advantage of being able to be configured in a compact size while having excellent heat dissipation performance.

[0015] According to the present disclosure, the RF connector and the communication device including the same include a gasket arranged to cover the RF connector, thereby significantly improving the shielding effect. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is an exploded perspective view of a partial configuration of a communication device according to an embodiment of the present disclosure. [Figure 2a] 1 is a cross-sectional view of a portion of a communication device according to an embodiment of the present disclosure, illustrating a case where a printed circuit board is not installed. [Figure 2b] 1 is a cross-sectional view of a portion of a communication device according to an embodiment of the present disclosure, illustrating a case where a printed circuit board is disposed. [Figure 3] 1 is a perspective view of a portion of a communication device according to an embodiment of the present disclosure. [Figure 4] FIG. 2 is a perspective view illustrating only a connector of a communication device according to an embodiment of the present disclosure. [Figure 5] 1A and 1B are diagrams illustrating an example of a connector integrally formed through an insert injection method according to one embodiment of the present disclosure. [Figure 6a] 10 is a cross-sectional view of a portion of a communication device according to another embodiment of the present disclosure, illustrating a case in which a printed circuit board at the same height as the printed board connected to the connector is not arranged. [Figure 6b] 10 is a cross-sectional view of a portion of a communication device according to another embodiment of the present disclosure, illustrating a case in which a printed circuit board is arranged at the same height as the printed board connected to the connector. [Figure 7] FIG. 10 is a perspective view of a portion of a communication device according to another embodiment of the present disclosure. [Figure 8] FIG. 10 is a perspective view illustrating only the connector of a communication device according to another embodiment of the present disclosure. [Figure 9]1 is a perspective view of a portion of a device configured to simulate connector performance of a communication device according to the present disclosure. FIG. [Figure 10] FIG. 10 is a perspective cross-sectional view of FIG. 9. [Figure 11] 11 shows the results of simulations regarding the device configurations of FIGS. 9 and 10. [Figure 12a] 10 is a cross-sectional view of a portion of a communication device according to yet another embodiment of the present disclosure, illustrating a case where a printed circuit board is not disposed. [Figure 12b] 10 is a cross-sectional view of a portion of a communication device according to yet another embodiment of the present disclosure, illustrating a case where a printed circuit board is disposed. [Figure 13] FIG. 10 is a perspective view of a portion of a communication device according to still another embodiment of the present disclosure. [Figure 14] FIG. 10 is an exploded perspective view of a connector according to still another embodiment of the present disclosure. [Figure 15] FIG. 10 is a cross-sectional view of a gasket according to still another embodiment of the present disclosure. [Figure 16] 10 is a simulation result relating to still another embodiment of the present disclosure. [Figure 17] FIG. 10 is an exploded perspective view of a connector including a gasket without an insertion groove according to still another embodiment of the present disclosure. [Figure 18] FIG. 10 is an exploded perspective view of a connector including a gasket having an insertion groove formed therein according to still another embodiment of the present disclosure. [Figure 19] 19 shows simulation results for the connectors shown in FIGS. 17 and 18. DETAILED DESCRIPTION OF THE INVENTION

[0017] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. When assigning reference numerals to components in each drawing, please note that the same reference numerals are used for the same components even if they appear in different drawings. In describing the present disclosure, if a detailed description of related known structures or functions is deemed to obscure the gist of the present disclosure, such a detailed description will be omitted.

[0018] In describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. are used only to distinguish the components from other components, and the terms do not limit the nature, order, or sequence of the components.

[0019] When a component is described as being "coupled," "coupled," or "connected" to another component, it is understood that the component is directly connected or connected to the other component, but that there may also be other components "coupled," "coupled," or "connected" between each component.

[0020] Throughout the specification, when a part is said to "comprise" or "include" certain elements, this does not mean that it excludes other elements, but that it may further include other elements, unless specifically stated to the contrary.

[0021] The terms "unit," "module," etc. used in this specification refer to a unit that processes at least one function or operation, and is embodied in hardware, software, or a combination of hardware and software.

[0022] It should be understood that any discussion of any one embodiment may also apply to other embodiments unless stated to the contrary.

[0023] The description of the invention disclosed below in conjunction with the accompanying drawings is intended to describe exemplary embodiments of the invention and is not intended to represent the only embodiments in which the invention may be practiced.

[0024] FIG. 1 is an exploded perspective view of a partial configuration of a communication device according to an embodiment of the present disclosure.

[0025] FIG. 2a is a cross-sectional view of a portion of a communication device according to one embodiment of the present disclosure, illustrating the case where a printed circuit board is not installed.

[0026] FIG. 2b is a cross-sectional view of a portion of a communication device according to one embodiment of the present disclosure, illustrating a printed circuit board in place.

[0027] FIG. 3 is a perspective view of a portion of a communication device according to an embodiment of the present disclosure.

[0028] 1 to 3, a communication device according to one embodiment of the present invention includes all or part of a mechanical housing 20, a first printed circuit board 10, a second printed circuit board 12, and one or more connectors 300.

[0029] The mechanism box 20 includes a board seating surface 210 on which the first printed circuit board 10 and the second printed circuit board 12 are seated, and one or more coupling grooves 220 formed in the board seating surface 210. The mechanism box 20 is formed from a thermally conductive rigid member, such as an aluminum alloy or a stainless steel alloy.

[0030] In one embodiment of the present invention, the mechanical housing 20 is an external housing that forms the exterior of the communication device, is configured to support the device structure, and is configured to accommodate a printed circuit board. The external housing includes a plurality of heat dissipation fins 21 formed on at least a portion of its surface.

[0031] However, the present invention is not limited to this, and the mechanical housing 20 is not an external housing but a separate structure, for example, a separate thermally conductive rigid member that supports the printed circuit board between the external housing and the printed circuit board.

[0032] The board seating surface 210 includes a first seating surface 212 on which the first printed circuit board 10 is seated, and a second seating surface 214 on which the second printed circuit board 12 is seated. The first seating surface 212 and the second seating surface 214 are formed to have a step with respect to each other.

[0033] In one embodiment of the present invention, the first printed circuit board 10 and the second printed circuit board 12 have different thicknesses. The size of the step between the first seating surface 212 and the second seating surface 214 corresponds to the difference in thickness between the first printed circuit board 10 and the second printed circuit board 12. As a result, the top surface of the first printed circuit board 10 (the surface opposite to the surface supported by the board seating surface 210) and the top surface of the second printed circuit board 12 (the surface opposite to the surface supported by the board seating surface 210) are arranged on the same plane or a plane equivalent thereto.

[0034] Although not shown in this specification, the arrangement of the first printed circuit board 10 and the second printed circuit board 12 on the same plane is advantageous in reducing or optimizing the size and weight of the overall communication device in terms of any connector 300 that directly connects the two, or in terms of supporting the two or arranging filters or other elements that are provided on the upper surface.

[0035] One or more connecting grooves 220 are formed in the substrate seating surface 210 , for example, a plurality of grooves are formed along the boundary between the first seating surface 212 and the second seating surface 214 .

[0036] The first printed circuit board 10 includes a plurality of devices mounted thereon. In an RF connector according to an embodiment of the present disclosure, the first printed circuit board 10 is an amplifier (Amp) board, but is not necessarily limited to this.

[0037] The second printed circuit board 12 is disposed adjacent to but spaced apart from the first printed circuit board 10 on one side of the first printed circuit board 10, and includes a plurality of elements mounted thereon. In an RF connector according to an embodiment of the present disclosure, the second printed circuit board 12 is a digital board, but is not necessarily limited to this.

[0038] One or more connectors 300 are disposed in the coupling groove 220 and configured to electrically couple the first printed circuit board 10 and the second printed circuit board 12 .

[0039] FIG. 4 is a perspective view illustrating only the connector of a communication device according to an embodiment of the present disclosure.

[0040] With additional reference to FIG. 4, connector 300 includes a support member 310 and a resilient coupling member 320 .

[0041] The support member 310 contacts at least a part of the mechanism box 20 within the connecting groove 220. The support member 310 is made of an insulating material such as a high-heat resistant thermoplastic plastic, for example, polycarbonate, Lusep, or Teflon (registered trademark).

[0042] The elastic connecting member 320 is made of a conductive material that is elastic and suitable for transmitting high-frequency signals (RF signals), such as beryllium copper (BeCu) or stainless steel alloy (SUS). The elastic connecting member 320 is disposed between the support member 310 and the first printed circuit board 10 and / or the second printed circuit board 12, and is configured to electrically connect the first printed circuit board 10 and the second printed circuit board 12.

[0043] The elastic connecting member 320 includes a plate-shaped base 324, a first side wall 325 formed at one end of the plate-shaped base 324, a first contact portion 326 formed at one end of the first side wall 325, a second side wall 327 formed at the other end of the plate-shaped base 324, and a second contact portion 328 formed at one end of the second side wall 327. The elastic connecting member 320 is formed through a bending process.

[0044] As described above, the board seating surface 210 has a step corresponding to the difference in thickness between the first printed circuit board 10 and the second printed circuit board 12. In addition, the lengths (or vertical heights) of the first side wall 325 and the second side wall 327 of the elastic connecting member 320 differ to correspond to the size of the step in the board seating surface 210.

[0045] The support member 310 includes a support base 312, a protruding seat 314 protruding from one side of the support base 312 and configured to seat an elastic connecting member 320, and a fixing member 316 formed on the protruding seat 314 to fix the elastic connecting member 320.

[0046] Referring again to Figures 2a and 4, the plate-shaped base 324 of the elastic connecting member 320 is supported on the protruding seat 314, thereby forming a deformation gap 222 between the plate-shaped base 324 of the elastic connecting member 320 and the support base 312 of the support member 310.

[0047] That is, in one embodiment of the present invention, the connector 300 includes a deformation gap 222 formed between the support base 312 and the elastic connecting member 320 so that when the first printed circuit board 10 and / or the second printed circuit board 12 are seated on the board seating surface 210, the first contact portion 326 and the second contact portion 328 are pressed by the lower surfaces of the printed circuit boards 10 and 12, respectively, thereby allowing the elastic connecting member 320 to be elastically deformable (see FIG. 2b).

[0048] Furthermore, in one embodiment of the present invention, the fixing member 316 includes a fixing member 316 formed on the protruding seat 314. The elastic connecting member 320 includes a through hole into which the fixing member 316 is inserted.

[0049] FIG. 5 is a diagram illustrating an example of a connector integrally formed through an insert injection method according to one embodiment of the present disclosure.

[0050] 5, the connector 300 according to the present disclosure is manufactured using an insert injection method. That is, the elastic connecting member 320 and the support member 310 are integrally formed through insert injection. However, the present invention is not limited thereto, and the elastic connecting member 320 and the support member 310 may be manufactured separately and combined through a separate assembly process.

[0051] In the illustrated embodiment of the present invention, the connector 300 is illustrated as having a structure and size for transmitting and receiving high frequency signals. However, the present invention is not limited thereto. The connector 300 can be modified and used to have a structure sized to transmit signals other than high frequency signals, such as power or analog or digital low frequency signals.

[0052] FIG. 6a is a cross-sectional view of a portion of a communication device according to another embodiment of the present disclosure, illustrating a case where a printed circuit board connected to a connector is not disposed at the same height.

[0053] FIG. 6b is a cross-sectional view of a portion of a communication device according to another embodiment of the present disclosure, illustrating a case where a printed circuit board is arranged at the same height as the printed board connected to the connector.

[0054] FIG. 7 is a perspective view of a portion of a communication device according to another embodiment of the present disclosure.

[0055] FIG. 8 is a perspective view illustrating only the connector of a communication device according to another embodiment of the present disclosure.

[0056] A communication device according to another embodiment of the present disclosure will be described with reference to Figures 6 to 8. Although a description of portions that overlap with one embodiment of the present disclosure will be omitted, it should be made clear that the features of one embodiment of the present disclosure can be applied in the same or similar manner to other embodiments to the extent that they are not arranged in other embodiments of the present disclosure.

[0057] According to another embodiment of the present disclosure, the first and second seating surfaces 212, 214 are formed flat with the same or similar height, i.e., without any steps. The first and second printed circuit boards 10, 12 may have the same or similar thickness. This allows the top surfaces of the first and second printed circuit boards 10, 12 to be positioned on the same plane or a similar plane.

[0058] When the first printed circuit board 10 and the second printed circuit board 12 are formed to the same or similar thickness, the board seating surface 210 is formed flat without any steps. In this case, the lengths (or vertical heights) of the first side wall 325 and the second side wall 327 of the elastic connecting member 320 are the same or similar.

[0059] FIG. 9 is a perspective view of a portion of an apparatus configured to simulate connector performance of a communication device according to the present disclosure.

[0060] FIG. 10 is a perspective cross-sectional view of FIG.

[0061] FIG. 11 shows the simulation results for the device configurations of FIGS.

[0062] FIG. 10 illustrates a communication device according to one embodiment of the present disclosure, i.e., a case in which the thicknesses of the printed circuit boards 10 and 12 are different and the heights of the side walls 325 and 327 are different. However, it should be made clear that the effects of the present invention described below do not occur only when one embodiment of the present disclosure is followed, but can also occur in other embodiments of the present disclosure, i.e., when the thicknesses of the printed circuit boards 10 and 12 are the same or similar and the heights of the side walls 325 and 327 are the same or similar.

[0063] Referring to Figures 9-11, a virtual digital board and a virtual amplifier board structure were used to simulate the connector performance of a communication device according to the present invention.

[0064] The virtual digital board (second printed circuit board 12) and the virtual amplifier board (first printed circuit board 10) include a first electrode 54 and a second electrode 52 that contact and electrically connect with the first contact portion 326 and the second contact portion 328 of the elastic connecting member 320, respectively.

[0065] For the purpose of the simulation, it was illustrated that multiple via holes 56 surround the first electrode 54 and the second electrode 52, and that each of the first electrode 54 and the second electrode 52 is provided with a port 58 for signal transmission.

[0066] 11, the simulation results show that for this configuration, the return loss of connector 300 is 20 dB. Furthermore, when the spacing of connector 300 is 10 mm (1 cm) and the frequency of the high-frequency signal is 2.16 GHz, the isolation value is 50 dB. The insertion loss is also found to be a maximum of 0.1 dB.

[0067] It can be seen that the degree of isolation varies depending on the spacing of the connector structure, and the spacing of the connector structure can be determined and optimized according to the connector structure and the type of high frequency signal by referring to the simulation results.

[0068] According to the present invention, the first printed circuit board 10 and the second printed circuit board 12 are a type of heat source, and their heat management, particularly heat dissipation performance through direct heat conduction, is an important factor that determines the performance of the entire device.

[0069] Thus, in one embodiment of the present invention, the first printed circuit board 10 and the second printed circuit board 12 are positioned in direct contact with a mechanical enclosure 20, for example an external housing.

[0070] However, the area where the first printed circuit board 10 and the second printed circuit board 12 are spaced apart from each other has a relatively small effect on the heat dissipation performance of the printed circuit boards through direct conduction.

[0071] The present invention forms a connecting structure for connecting the printed circuit boards in the spaced apart area between the two boards. Because the mechanical housing 20, e.g., the outer housing, is itself made of a metallic shielding material, the connector according to one embodiment of the present invention can maintain an effective shielding state from the outside within the connecting groove 220. In other words, even without covering the connector with a separate RF shielding member, the connector of the communication device according to the present invention has sufficient shielding effect (isolation) as revealed by the above simulation results.

[0072] Furthermore, since the printed circuit board can have a structure in which the largest possible area is in direct surface contact with the mechanical housing 20, a communication device having excellent heat dissipation performance and a compact size is provided.

[0073] FIG. 12a is a cross-sectional view of a portion of a communication device according to yet another embodiment of the present disclosure, illustrating a case where a printed circuit board is not disposed.

[0074] FIG. 12b is a cross-sectional view of a portion of a communication device according to yet another embodiment of the present disclosure, illustrating a printed circuit board in place.

[0075] FIG. 13 is a perspective view of a portion of a communication device according to still another embodiment of the present disclosure.

[0076] FIG. 14 is an exploded perspective view of a connector according to still another embodiment of the present disclosure.

[0077] FIG. 15 is a cross-sectional view of a gasket according to yet another embodiment of the present disclosure.

[0078] Before describing a communication device according to another embodiment of the present disclosure, we will omit a description of parts that overlap with a communication device according to an embodiment different from the above-mentioned embodiment of the present disclosure, but we would like to make it clear that the contents of a communication device according to an embodiment different from the embodiment of the present disclosure (e.g., a support base, a protruding seat, a fixing member, a plate-shaped base, a first side wall, a first contact portion, a second side wall, a second contact portion, etc.) can be applied in the same or similar manner to a communication device according to another embodiment of the present disclosure to the extent that they are not arranged.

[0079] 12 to 15, a communication device according to another embodiment of the present disclosure includes a connector 1400 and a gasket 1430.

[0080] The connector 1400 includes a support member 1410 and a resilient coupling member 1420 .

[0081] The support member 1410 includes a support base 1412 , a protruding seat 1414 , a securing member 1416 , and a protruding insert 1418 .

[0082] The elastic connecting member 1420 includes a plate-shaped base 1424 , a first sidewall 1425 , a first contact portion 1426 , a second sidewall 1427 , and a second contact portion 1428 .

[0083] The gasket 1430 includes a body 1432 and an insertion groove 1434 .

[0084] A support member 1410 according to another embodiment of the present disclosure further includes protruding inserts 1418 for being coupled to a gasket 1430. The protruding inserts 1418 are formed on both sides of the protruding seat 1414. The protruding inserts 1418 are formed to protrude from the support base 1412. The support member 1410 and the gasket 1430 are coupled together by inserting the protruding inserts 1418 into the insertion grooves 1434 of the gasket 1430. An elastic connecting member 1420 is disposed between the support member 1410 and the gasket 1430. To ensure a firm coupling between the support member 1410 and the gasket 1430, the protruding inserts 1418 are formed in a shape corresponding to the shape of the insertion grooves 1434 of the gasket 1430, and the height of the protruding inserts 1418 is the same as or similar to the height of the insertion grooves 1434. The protruding inserts 1418 are formed to be taller than the protruding seat 1414.

[0085] In the following, gasket 1430 will be described as being a separate component from connector 1400, but it should be made clear that gasket 1430 and connector 1400 do not necessarily have to be separate components, and gasket 1430 may be understood to be a component included in connector 1400.

[0086] The gasket 1430 is arranged to cover at least a portion of the connector 1400 to improve the shielding effect of the connector 1400. The gasket 1430 is arranged to cover at least a portion of the elastic connecting member 1420 of the connector 1400. The gasket 1430 is arranged to cover at least a portion of the plate-shaped base 1424 of the elastic connecting member 1420. As shown in FIGS. 13 and 14 , the gasket 1430 is arranged to intersect with the connector 1400. This improves the shielding effect of the connector 1400 while electrically connecting multiple printed circuit boards. The gasket 1430 is arranged to intersect with the connector 1400.

[0087] The gasket 1430 is coupled to the connector 1400. The gasket 1430 is configured to allow at least a portion of the connector 1400, i.e., the protruding insert 1418 of the support member 1410, to be inserted therein. The gasket 1430 includes a body portion 1332 and an insertion groove 1434. The protruding insert 1418 of the support member 1410 is inserted into the insertion groove 1434. As described above, the insertion groove 1434 and the protruding insert 1418 are formed to have corresponding shapes, allowing the gasket 1430 and the connector 1400 to be firmly coupled together. The height of the insertion groove 1434 may be the same as or similar to the height of the protruding insert 1418.

[0088] 15, the height h of the insertion groove 1434 is equal to or greater than half the total height H of the gasket 1430. For example, if the total height H of the gasket 1430 is 1.2 mm, the height of the insertion groove 1434 is 0.7 mm. This allows the gasket 1430 and the connector 1400 to be firmly coupled together without increasing the package size, and also improves the shielding effect of the connector 1400.

[0089] The gasket 1430 is made of aluminum to improve the shielding effect of the connector 1400, but the material of the gasket 1430 is not limited to this, and various materials can be used to improve the shielding effect of the connector 1400.

[0090] FIG. 16 shows simulation results for yet another embodiment of the present disclosure including gasket 1430.

[0091] 16, the return loss of the communication device connector 1400 including the gasket 1430 was 21.7451 dB when the frequency of the high-frequency signal was 4 GHz. Furthermore, for S(1,3), the isolation value was 124.0433 dB when the frequency of the high-frequency signal was 4 GHz, demonstrating a significant improvement in shielding effect compared to when the gasket 1430 was not included (see FIG. 11). Furthermore, the insertion loss was 0.1711 dB when the frequency of the high-frequency signal was 4 GHz.

[0092] In this way, a communication device including gasket 1430 according to the present disclosure has the advantage that the shielding effect of connector 1400 is significantly improved by arranging gasket 1430 so as to cover at least a portion of connector 1400.

[0093] FIG. 17 is an exploded perspective view of a connector including a gasket without an insertion groove according to still another embodiment of the present disclosure.

[0094] 17, a gasket 1430 according to another embodiment of the present disclosure does not have the above-described insertion groove 1434, and both the upper and lower surfaces are flat. When the insertion groove 1434 is not formed in the gasket 1430, the gasket 1430 is seated on the support member 1410, for example, on the protruding seat portion 1414 (see FIG. 14) or the protruding insertion portion 1418 (see FIG. 14), to cover the connector 140. When the gasket 1430 is formed in a flat shape without the insertion groove 1434, the shielding effect of the connector 1400 is improved, and the structure is simplified, thereby reducing manufacturing costs.

[0095] FIG. 18 is an exploded perspective view of a connector including a gasket having an insertion groove formed therein according to still another embodiment of the present disclosure.

[0096] 18, a gasket 1430 according to another embodiment of the present disclosure has an insertion groove 1434 formed therein, as described above. For example, the insertion groove 1434 is formed on the lower surface of the gasket 1430. As shown in FIG. 18, one surface (e.g., the lower surface) of the gasket 1430 is formed to have a step, and the insertion groove 1434 is formed on the stepped surface. A portion of the support member 1410 (e.g., the protruding insertion portion 1418, see FIG. 14) is inserted into the insertion groove 1434, thereby coupling the connector 1400 and the gasket 1430. When the insertion groove 1434 is formed in the gasket 1430 and the connector 1400 and the gasket 1430 are coupled using this, reflection loss is improved, as described below.

[0097] FIG. 19 shows the simulation results for the connector shown in FIGS.

[0098] 19, the return loss A of the connector 1400 covered with the flat gasket 1430 without the insertion groove 1434 described in connection with FIG. 17 is 19.1064 dB when the frequency of the RF signal is 4 GHz, while the return loss B of the connector 1400 covered with the stepped gasket 1430 including the insertion groove 3 described in connection with FIG. 18 is 26.7269 dB when the frequency of the RF signal is 4 GHz. In other words, it can be seen that when the insertion groove 1434 is formed in the gasket 1430 and the connector 1400 and the gasket 1430 are coupled using this, the return loss is improved. However, even when the flat gasket 1430 shown in FIG. 17 is used, a relatively good return loss can be expected while improving the shielding effect of the connector 1400, and the simple structure reduces manufacturing costs, so a gasket 1430 with an appropriate structure can be selected and applied as needed.

[0099] The above description merely exemplifies the technical concept of the present embodiment, and various modifications and variations may be made by a person skilled in the art without departing from the essential characteristics of the present embodiment. Therefore, the present embodiment is intended to illustrate, not limit, the technical concept of the present embodiment, and the scope of the technical concept of the present embodiment is not limited by such an embodiment. The scope of protection of the present embodiment should be interpreted by the claims, and all technical concepts within the scope equivalent thereto should be interpreted as being included in the scope of the present embodiment. [Explanation of symbols]

[0100] 1400 Connector 1410 Support member 1420 Elastic connecting member 1430 Gasket [CROSS-REFERENCE TO RELATED APPLICATION]

[0101] This patent application claims priority to Patent Application No. 10-2022-0155854, filed in Korea on November 18, 2022, the entire contents of which are incorporated herein by reference.

Claims

1. a mechanism box including a board seating surface and a connecting groove formed on the board seating surface; a plurality of printed circuit boards disposed on the board seating surface; a connector disposed in the connecting groove and electrically connecting the plurality of printed circuit boards; a gasket disposed to cover at least a portion of the connector; A communication device comprising:

2. The gasket is The communication device of claim 1 , wherein at least a portion of the connector is configured to be insertable.

3. The gasket is The communication device according to claim 2 , further comprising an insertion groove into which at least a portion of the body and the connector are inserted.

4. The connector comprises: a support member disposed in the connecting groove and in contact with at least a portion of the mechanism box; and a conductive elastic connecting member disposed between the support member and the plurality of printed circuit boards; The gasket is The communication device according to claim 3 , wherein at least a portion of the support member is arranged to be inserted into the insertion groove.

5. The support member is A support base; a protruding seat portion protruding from one surface of the support base and configured to seat the elastic connecting member; and protruding inserts formed on both sides of the protruding seating portion, The gasket is The communication device according to claim 4 , wherein the protruding insertion portion is arranged to be inserted into the insertion groove.

6. The connector comprises: The communication device according to claim 5 , further comprising a deformation gap formed between the support base and the elastic connecting member.

7. The communication device of claim 1 , wherein the gasket is positioned to intersect with the connector.

8. The communication device of claim 1 , wherein the gasket is made of aluminum.

9. The communication device according to claim 3 , wherein the height of the insertion groove is equal to or greater than half the height of the body portion.

10. The communication device according to claim 5 , wherein the height of the protruding insertion portion and the height of the insertion groove are the same.

11. The elastic connecting member is a flat base; a first sidewall formed on one side of the flat base; a first contact portion formed on one side of the first sidewall; a second sidewall formed on the other side of the flat base; and a second contact portion formed on one side of the second sidewall, The communication device according to claim 4 , wherein the gasket is disposed so as to cover at least a portion of the plate-shaped base.

12. 5. The communication device of claim 4, wherein the support member is made of polycarbonate, Lusep, or Teflon.

13. The communication device according to claim 1 , wherein the mechanical housing includes a plurality of heat dissipation fins formed on at least a portion thereof.

14. The connector comprises: a support member disposed in the connecting groove and in contact with at least a portion of the mechanism box; and a conductive elastic connecting member disposed between the support member and the plurality of printed circuit boards; The communication device according to claim 1 , wherein the support member and the elastic connecting member are integrally formed.

15. The communication device according to claim 1 , wherein the upper and lower surfaces of the gasket are formed in a flat shape.

16. The communication device according to claim 1 , wherein one surface of the gasket is formed to have a step.

17. an elastic coupling member, at least a portion of which is elastically deformable and configured to electrically couple to the printed circuit board; a support member that supports the elastic connecting member; a gasket disposed to cover at least a portion of the elastic connecting member; An RF connector comprising:

18. The support member is A support base; a protruding seat portion protruding from one surface of the support base and configured to seat the elastic connecting member; and protruding inserts formed on both sides of the protruding seating portion, The gasket is The RF connector according to claim 17, wherein the protruding insert is arranged to be inserted into the insert groove.

19. The RF connector of claim 17, wherein the gasket is positioned across the elastic coupling member.

20. The elastic connecting member is a flat base; a first sidewall formed on one side of the flat base; a first contact portion formed on one side of the first sidewall; a second sidewall formed on the other side of the flat base; and a second contact portion formed on one side of the second sidewall, The RF connector according to claim 17, wherein the gasket is disposed so as to cover at least a portion of the plate-shaped base.

Images