A method for manufacturing low-cost, high-strength thermoelectric modules with simplified manufacturing processes

Abstract

The method includes a lower metal sheet punching step of covering an upper surface of a support having a plurality of through holes formed therein with a metal sheet for the diffusion barrier, and punching and inserting the metal sheet for the diffusion barrier to a size corresponding to each of the through holes; a thermoelectric material powder filling step of filling a p-type thermoelectric material powder and an n-type thermoelectric material powder into the space above the metal sheet; an upper metal sheet punching step of punching and inserting the metal sheet for the diffusion barrier to a size corresponding to each of the through holes; a thermoelectric material sintering step of sintering the p-type thermoelectric material powder and the n-type thermoelectric material powder; and a thermoelectric module completing step of mounting ceramic substrates on the upper and lower surfaces of each of the through holes that have passed the thermoelectric material sintering step to complete a thermoelectric module.

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a low-cost, high-strength thermoelectric module, and more particularly to a method for manufacturing a low-cost, high-strength thermoelectric module with simplified manufacturing steps. [Background technology]

[0002] The main application of thermoelectric elements is power generation using the Seebeck effect, which uses the temperature difference between the high-temperature and low-temperature areas where heat flows in. In thermoelectric power generation, it is important to maintain as large a temperature difference as possible between both ends of the thermoelectric element within the element's tolerance range in order to obtain a consistent power output and efficiency.

[0003] Generally, the temperature difference between both ends of the element is created by increasing the thickness of the thermoelectric material, but it is known that realizing a temperature difference due to thickness is difficult to achieve above a certain temperature due to the thermal and electrical resistance caused by the basic physical properties of the thermoelectric material used, and that this can result in a waste of expensive materials.

[0004] As shown in the prior art document (Korean Patent Registration No. 10-1384981, see Figure 1), this problem was solved by using a spacer inside the thermoelectric element. However, the thermoelectric material on the surface of the support can be formed by various coating methods such as MOCVD, ECVD sputtering, spray coating, etc. However, there are problems with peeling between the support and the thermoelectric material and limitations on mass production, which limits the extent of use.

[0005] Therefore, there is a need for a technology that can solve the problems of the prior art described above. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Republic of Korea Patent Registration No. 10-1384981 Summary of the Invention [Problem to be solved by the invention]

[0007] The object of the present invention is to solve the problems of the prior art by providing a method for manufacturing a low-cost, high-strength thermoelectric module that simplifies the manufacturing process of many thermoelectric modules, improves the mechanical strength of the thermoelectric module, and does not degrade the performance of the thermoelectric module. [Means for solving the problem]

[0008] To achieve this object, according to one aspect of the present invention, a method for manufacturing a low-cost, high-strength thermoelectric module with simplified manufacturing processes includes a lower metal sheet punching step of covering an upper surface of a support having a plurality of through holes formed therein for forming a tunnel diffusion barrier with a metal sheet for the diffusion barrier, and punching and inserting the metal sheet for the diffusion barrier into a size corresponding to each through hole; a thermoelectric material powder filling step of respectively filling p-type thermoelectric material powder and n-type thermoelectric material powder into spaces above the metal sheet for the diffusion barrier inserted into the through holes of the support; The method may include an upper metal sheet punching step of covering an upper surface of a support with a metal sheet for a diffusion barrier and punching and inserting the metal sheet for the diffusion barrier in a size corresponding to each through hole; a thermoelectric material sintering step of applying a predetermined pressure to upper and lower surfaces of the through holes of the support and heating the insides of the through holes at a predetermined temperature to sinter the p-type thermoelectric material powder and the n-type thermoelectric material powder; and a thermoelectric module completing step of mounting ceramic substrates on the upper and lower surfaces of each through hole that has passed the thermoelectric material sintering step to complete a thermoelectric module.

[0009] In one embodiment of the present invention, the lower metal sheet punching step may include: a support preparation step of preparing a support having a structure in which a plurality of through holes, which can be filled with a thermoelectric material, are arranged at regular intervals and each through hole is partitioned by a metal partition; a metal sheet preparation step of covering the upper surface of the support with a metal sheet for a diffusion barrier having the same area as the upper surface of the support and a predetermined thickness; a punch member preparation step of preparing a cylindrical punch member having an outer diameter and the same length as the inner diameter of the through hole of the support; and a punching insertion step of placing the punch member on the upper surface of the metal sheet at a position corresponding to the through hole, and then applying a predetermined pressure to punch out a metal sheet into a shape corresponding to the through hole and inserting it into the through hole.

[0010] In one embodiment of the present invention, the thermoelectric material powder filling step may include: a first filling guide preparing step of preparing a p-type powder filling guide having a block structure, the block structure having a bottom surface corresponding to the top surface of the support and having through holes formed at the same positions as those of the through holes of the support where the p-type thermoelectric material powder is to be filled; a second filling guide preparing step of preparing an n-type powder filling guide having a block structure, the block structure having a bottom surface corresponding to the top surface of the support and having through holes formed at the same positions as those of the through holes of the support where the n-type thermoelectric material powder is to be filled; and a thermoelectric material powder pressing step of inserting a punch into the through holes formed in the support and applying a predetermined pressure to pressurize the thermoelectric material powder filled in the through holes.

[0011] In one embodiment of the present invention, the sintering of the thermoelectric material may include a thermocouple installation step of installing thermocouples on upper and lower surfaces of the through-hole of the support body, a pressure placement step of placing punches on upper and lower surfaces of the through-hole of the support body, a heating equipment placement step of installing spark plasma sintering (SPS) equipment in the through-hole of the support body, and a pressure sintering step of operating the thermocouples, punches, and spark plasma sintering equipment for a predetermined time according to predetermined conditions.

[0012] In one embodiment of the present invention, the thermoelectric module completion step may include a circuit board preparation step of preparing a Cu-bonded ceramic substrate having a plate-like structure formed in a configuration corresponding to the upper and lower surfaces of the support, the Cu-bonded ceramic substrate having copper electrodes configured according to a preset circuit design connected thereto; a bonding material application step of applying an electrical bonding material to the upper and lower surfaces of the sintered thermoelectric material corresponding to the positions of each of the through holes that have passed through the thermoelectric material sintering step; and an electrical bonding step of mounting the Cu-bonded ceramic substrates on the upper and lower surfaces of the support and then electrically connecting them with the bonding material. [Effects of the Invention]

[0013] As described above, the method for manufacturing a low-cost, high-strength thermoelectric module of the present invention includes specific processes, such as a lower metal sheet punching step, a thermoelectric material powder filling step, an upper metal sheet punching step, a thermoelectric material sintering step, and a thermoelectric module completion step. This enables mass production of thermoelectric elements and module assemblies having a structure that can improve thermal efficiency. The production process can be shortened from 12 steps to 5 steps, which is economical, while the structure is stable due to the support. Poor module bonding, which occurs due to differences in the height, angle, and position of the thermoelectric elements, which are the most common causes of defects in thermoelectric module manufacturing, can be eliminated. This provides a method for manufacturing a low-cost, high-strength thermoelectric module that can be mass-produced using simple processes. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of a thermoelectric element according to the prior art. [Figure 2] 3 is a flowchart illustrating a method for manufacturing a thermoelectric element module assembly according to one embodiment of the present invention. [Figure 3] 3 is a flowchart specifically illustrating a lower metal sheet punching step of the thermoelectric element module assembly manufacturing method shown in FIG. 2. [Figure 4] 3 is a flowchart specifically showing a thermoelectric material powder filling step in the method for manufacturing the thermoelectric element module assembly shown in FIG. 2. [Figure 5] 3 is a flowchart specifically showing a thermoelectric material sintering step in the method for manufacturing the thermoelectric element module assembly shown in FIG. 2. [Figure 6] 3 is a flowchart specifically showing the thermoelectric module completion step of the thermoelectric element module assembly manufacturing method shown in FIG. 2. [Figure 7] 1 is a perspective view showing a metal sheet for a support, a punch member, and a diffusion barrier used in a method for manufacturing a thermoelectric element module assembly according to an embodiment of the present invention. [Figure 8] 10 is a perspective view illustrating a state in which a lower nickel sealing part is attached to the bottom of the through hole of the support after performing a lower metal sheet punching step in a method for manufacturing a thermoelectric element module assembly according to an embodiment of the present invention. [Figure 9] 10 is a perspective view illustrating a state in which a filling guide is attached to an upper surface of a support body in a step of filling thermoelectric material powder in a method of manufacturing a thermoelectric element module assembly according to an embodiment of the present invention. [Figure 10] FIG. 10 is a perspective view showing a state in which a masking member is mounted on the filling guide shown in FIG. 9 and p-type thermoelectric material powder is filled therein. [Figure 11] FIG. 10 is a perspective view showing a state in which a masking member is mounted on the filling guide shown in FIG. 9 and n-type thermoelectric material powder is filled therein. [Figure 12] FIG. 10 is a perspective view showing a state in which p-type thermoelectric material powder and n-type thermoelectric material powder have been filled using the filling guide shown in FIG. [Figure 13] FIG. 13 is a perspective view showing a state in which a thermoelectric material powder pressing step is performed in the thermoelectric material powder filling step of the method for manufacturing a thermoelectric element module assembly according to one embodiment of the present invention, in which the p-type thermoelectric material powder and the n-type thermoelectric material powder shown in FIG. 12 are compressed using a punch member. [Figure 14]FIG. 14 is a perspective view illustrating a state in which an upper metal sheet punching step is performed in the method for manufacturing a thermoelectric element module assembly according to an embodiment of the present invention, in which an upper nickel sealing part is attached to an upper surface of the thermoelectric material powder filled in the through-hole of the support body shown in FIG. [Figure 15] 10 is a perspective view illustrating a state in which Cu-bonded ceramic substrates are mounted on the upper and lower surfaces of a support body in a thermoelectric module completion step of a method for manufacturing a thermoelectric element module assembly according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Prior to this, the terms and words used in the specification and claims are interpreted only in their ordinary or dictionary meanings and as meanings and concepts that correspond to the technical ideas of the present invention.

[0016] Throughout this specification, when a member is said to be located "on" another member, this includes not only when the member is in contact with the other member, but also when there is another member between the two members. Throughout this specification, when a part is said to "comprise" a certain component, this does not mean that it excludes other components, but that it may further include other components, unless otherwise specified.

[0017] FIG. 2 shows a flow chart illustrating a method for manufacturing a thermoelectric element module assembly according to one embodiment of the present invention.

[0018] Referring to FIG. 2 , the method for manufacturing a low-cost, high-strength thermoelectric module S100 according to this embodiment includes specific processes: a lower metal sheet punching step S110, a thermoelectric material powder filling step S120, an upper metal sheet punching step S130, a thermoelectric material sintering step S140, and a thermoelectric module completion step S150. This enables mass production of thermoelectric elements and module assemblies having a structure that can improve thermal efficiency. The 12-step production process can be shortened to 5 steps, which is economical, and the support 110 provides a stable structure. This eliminates module bonding defects that occur due to differences in the height, angle, and position of the thermoelectric elements, which are the most common cause of defects in thermoelectric module manufacturing. This provides a method for manufacturing a low-cost, high-strength thermoelectric module that can be mass-produced using simple processes.

[0019] Hereinafter, each component constituting the method for manufacturing a low-cost, high-strength thermoelectric module S100 according to this embodiment will be described in detail with reference to the drawings.

[0020] Figures 3 to 6 show flowcharts illustrating in more detail each step of the thermoelectric element module assembly manufacturing method according to this embodiment, and Figures 7 to 15 show schematic process diagrams illustrating in more detail each step of the thermoelectric element module assembly manufacturing method according to this embodiment.

[0021] 2 to 15, in the method S100 for manufacturing a low-cost, high-strength thermoelectric module according to this embodiment, the lower metal sheet punching step S110 includes covering the upper surface of the support 110, in which a plurality of through holes 111 are formed, with the metal sheet 130 for the diffusion barrier, and punching and inserting the metal sheet 130 for the diffusion barrier to a size corresponding to each of the through holes 111. The metal sheet 130 for the diffusion barrier may be made of nickel or other metal or alloy materials.

[0022] Specifically, the lower metal sheet punching step S110 may include a support preparing step S111, a metal sheet preparing step S112, a punch member preparing step S113, and a punch inserting step S114, which perform specific processes. As shown in FIGS. 7 and 8 , the support preparing step S111 is a process of preparing a support 110 having a plurality of through holes 111, which can be filled with a thermoelectric material, spaced apart at regular intervals and partitioning each through hole 111 with a metal partition wall. The metal sheet preparing step S112 is a process of covering the upper surface of the support 110 with a metal sheet 130 for a diffusion barrier having the same area as the upper surface of the support 110 and a predetermined thickness. The punch member preparing step S113 is a process of preparing a cylindrical punch member 120 having an outer diameter equal to the inner diameter of the through holes 111 of the support 110. In addition, the punching insertion step S114 involves placing a punch member 120 on the top surface of the metal sheet at a position corresponding to the through hole 111, and then applying a predetermined pressure to punch the metal sheet into a shape corresponding to the through hole 111 and inserting it into the through hole 111.

[0023] In the thermoelectric material powder filling step S120 according to this embodiment, a p-type thermoelectric material powder and an n-type thermoelectric material powder are respectively filled into the upper space of the thin metal plate 130 for the diffusion barrier inserted into the through-hole 111 of the support 110.

[0024] 9 to 13, the thermoelectric material powder filling step S120 according to this embodiment may include specific steps, namely, a first filling guide preparation step S121, a second filling guide preparation step S122, and a thermoelectric material powder pressing step S123. The first filling guide preparation step S121 involves preparing a p-type powder filling guide 140 having a block structure, with a bottom surface corresponding to the top surface of the support body 110 and with identical through holes 111 formed at the same positions as the through holes 111 of the support body 110 at which the p-type thermoelectric material powder will be filled. The second filling guide preparation step S122 involves preparing an n-type powder filling guide 140 having a block structure, with a bottom surface corresponding to the top surface of the support body 110 and with identical through holes 111 formed at the same positions as the through holes 111 of the support body 110 at which the n-type thermoelectric material powder will be filled. In addition, the thermoelectric material powder pressing step S123 involves inserting a punch member 120 into the through-holes 111 formed in the support 110 and applying a preset pressure to pressurize the thermoelectric material powder filled in the through-holes 111.

[0025] In the upper metal sheet punching step S130 according to this embodiment, as shown in FIG. 14, a metal sheet 130 for the diffusion barrier is placed on the upper surface of the support 110, and the metal sheet 130 for the diffusion barrier is punched out to a size corresponding to each through hole 111 and inserted.

[0026] In the thermoelectric material sintering step S140 according to this embodiment, the upper and lower surfaces of the through-hole 111 of the support 110 are pressurized to a predetermined pressure, and the inside of the through-hole 111 is heated to a predetermined temperature to sinter the p-type thermoelectric material powder and the n-type thermoelectric material powder.

[0027] Specifically, the thermoelectric material sintering step S140 may include a thermocouple installation step S141, a pressure arrangement step S142, a heating equipment arrangement step S143, and a pressure sintering step S144, which perform specific processes. The thermocouple installation step S141 is a process of installing thermocouples on the upper and lower surfaces of the through-hole 111 of the support 110. The pressure arrangement step S142 is a process of placing punches on the upper and lower surfaces of the through-hole 111 of the support 110. The heating equipment arrangement step S143 is a process of installing spark plasma sintering (SPS) equipment in the through-hole 111 of the support 110. In addition, the pressure sintering step S144 is a process of operating the thermocouples, punches, and spark plasma sintering equipment for a predetermined time according to predetermined conditions.

[0028] In the thermoelectric module completion step S150 according to this embodiment, a ceramic substrate is mounted on the upper and lower surfaces of each through-hole 111 that has passed through the thermoelectric material sintering step, thereby completing the thermoelectric module.

[0029] 15, the thermoelectric module completion step S150 according to this embodiment may include a circuit board preparation step S151, a bonding material application step S152, and an electrical bonding step S153, which perform specific processes. The circuit board preparation step S151 involves preparing a Cu-bonded ceramic substrate, which has a plate-like structure corresponding to the upper and lower surfaces of the support 110 and is connected to copper electrodes configured according to a preset circuit design. The bonding material application step S152 involves applying an electrical bonding material to the upper and lower surfaces of the sintered thermoelectric material corresponding to the positions of each through-hole 111 obtained through the thermoelectric material sintering step S140. The electrical bonding step S153 involves mounting the Cu-bonded ceramic substrate on the upper and lower surfaces of the support 110 and then electrically connecting them with the bonding material.

[0030] As described above, the method for manufacturing a low-cost, high-strength thermoelectric module of the present invention includes specific processes, such as a lower metal sheet punching step S110, a thermoelectric material powder filling step S120, an upper metal sheet punching step S130, a thermoelectric material sintering step S140, and a thermoelectric module completion step S150. This enables mass production of thermoelectric elements and module assemblies having a structure that improves thermal efficiency. The production process can be shortened from 12 steps to 5 steps, which is economical, and the support 110 provides a stable structure. This eliminates poor module connection problems that occur due to differences in the height, angle, and position of the thermoelectric elements, which are the most common causes of defects in thermoelectric module manufacturing. This provides a method for manufacturing a low-cost, high-strength thermoelectric module that can be mass-produced using simple processes.

[0031] While the detailed description of the present invention has described only specific embodiments thereof, it is to be understood that the invention is not limited to the specific forms set forth in the detailed description, but rather includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

[0032] In other words, the present invention is not limited to the specific embodiments and explanations described above, and various modifications can be made by anyone with ordinary knowledge in the technical field to which the present invention pertains without departing from the gist of the present invention as claimed in the claims, and such modifications are within the scope of protection of the present invention.

[0033] The embodiments of the invention have been described together in the best mode for carrying out the invention. [Industrial Applicability]

[0034] The present invention relates to a method for manufacturing a low-cost, high-strength thermoelectric module using a simplified manufacturing process. The method includes specific processes, such as a lower metal sheet punching step, a thermoelectric material powder filling step, an upper metal sheet punching step, a thermoelectric material sintering step, and a thermoelectric module completion step. This allows for mass production of thermoelectric elements and module assemblies having a structure that can improve thermal efficiency. The manufacturing process can be shortened from 12 steps to 5 steps, which is economical, yet the structure is stable due to the support. This method can also eliminate module bonding defects caused by differences in the height, angle, and position of the thermoelectric elements, which are the most common causes of defects in thermoelectric module manufacturing. Therefore, the method provides a low-cost, high-strength thermoelectric module that can be mass-produced using a simplified process, and is therefore industrially applicable.

Claims

1. a lower metal sheet punching step S110 for covering an upper surface of a support 110 having a plurality of through holes 111 formed therein with a metal sheet 130 for the diffusion barrier to form a tunnel diffusion barrier, and punching and inserting the metal sheet 130 for the diffusion barrier into a size corresponding to each through hole 111; a thermoelectric material powder filling step (S120) of filling a p-type thermoelectric material powder and an n-type thermoelectric material powder into an upper space of the thin metal plate (130) for a diffusion barrier inserted into the through-hole (111) of the support (110), respectively; an upper metal sheet punching step S130 of covering an upper surface of the support 110 with a metal sheet 130 for a diffusion barrier and punching and inserting the metal sheet 130 for a diffusion barrier into the through-holes 111 in a size corresponding to each through-hole; a thermoelectric material sintering step (S140) in which the upper and lower surfaces of the through-holes 111 of the support 110 are pressurized with a predetermined pressure and the inside of the through-holes 111 is heated at a predetermined temperature to sinter the p-type thermoelectric material powder and the n-type thermoelectric material powder; and a thermoelectric module completion step (S150) of mounting ceramic substrates on the upper and lower surfaces of each of the through holes (111) that have passed the thermoelectric material sintering step to complete the thermoelectric module. A method for manufacturing a low-cost, high-strength thermoelectric module.

2. The lower metal sheet punching step S110 includes: a support preparation step S111 for preparing a support 110 having a structure in which a large number of through-holes 111 that can be filled with a thermoelectric material are arranged at regular intervals and each through-hole 111 is partitioned by a metal partition wall; a metal sheet preparation step (S112) of covering the upper surface of the support 110 with a metal sheet 130 for a diffusion barrier having the same area as the upper surface of the support 110 and a predetermined thickness; a punch member preparation step S113 of preparing a punch member 120 having a cylindrical structure and an outer diameter having the same length as the inner diameter of the through-hole 111 of the support body 110; and a punching and inserting step S114 of disposing a punch member 120 on the upper surface of the metal sheet at a position corresponding to the through hole 111, and then applying a preset pressure to punch out a shape corresponding to the through hole 111 from the metal sheet and inserting the punched metal sheet into the through hole 111.

10. A method for manufacturing a low-cost, high-strength thermoelectric module according to claim 1.

3. The thermoelectric material powder filling step S120 includes: a first filling guide preparation step (S121) of preparing a p-type powder filling guide 140 having a block structure in which a bottom surface corresponding to the top surface of the support 110 is formed and through holes 111 are formed at the same positions as the through holes 111 of the support 110 at positions where the p-type thermoelectric material powder is to be filled; a second filling guide preparation step (S122) of preparing an n-type powder filling guide 140 having a block structure in which a bottom surface corresponding to the top surface of the support 110 is formed and through holes 111 are formed at the same positions as the through holes 111 of the support 110 at positions where the n-type thermoelectric material powder is to be filled; and a thermoelectric material powder pressing step (S123) of inserting a punch member (120) into the through-hole (111) formed in the support (110) and applying a preset pressure to pressurize the thermoelectric material powder filled in the through-hole (111).

3. The method for manufacturing a low-cost, high-strength thermoelectric module according to claim 2.

4. The thermoelectric material sintering step S140 includes: a thermocouple installation step S141 of installing thermocouples on the upper and lower surfaces of the through-hole 111 of the support 110; a pressurizing and arranging step S142 in which punches are arranged on the upper and lower surfaces of the through-hole 111 of the support 110; a heating equipment arrangement step S143 of installing a spark plasma sintering (SPS) equipment in the through-hole 111 of the support 110; and a pressure sintering step (S144) of operating a thermocouple, a punch, and a spark plasma sintering device for a predetermined time according to a predetermined condition.

10. A method for manufacturing a low-cost, high-strength thermoelectric module according to claim 1.

5. The thermoelectric module completion step S150 includes: a circuit board preparation step (S151) for preparing a Cu-bonded ceramic substrate having a plate-like structure formed in a structure corresponding to the upper and lower surfaces of the support 110 and connected to copper electrodes configured according to a preset circuit design; a bonding material applying step (S152) of applying an electrical bonding material to the upper and lower surfaces of the sintered thermoelectric material corresponding to the positions of the through holes 111 that have passed through the thermoelectric material sintering step (S140); and an electrical bonding step (S153) of mounting Cu-bonded ceramic substrates on the upper and lower surfaces of the support 110 and then electrically connecting them with a bonding material.

10. A method for manufacturing a low-cost, high-strength thermoelectric module according to claim 1.

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