Camera module and optical device including same

Abstract

A camera module according to an embodiment includes a first substrate having a first terminal portion, an image sensor arranged on the first substrate, a base arranged on the first substrate, a lens driving device arranged on the base and including a second substrate having a second terminal portion, and a connecting pin passing through the base, one end of the connecting pin contacting the first terminal portion and the other end of the connecting pin contacting the second terminal portion.

Description

[Technical Field]

[0001] The embodiments relate to a camera module and an optical device including the same. [Background technology]

[0002] Camera modules are used to capture images and videos of objects and are installed in a variety of devices, including mobile phones, notebooks, drones, and vehicles.

[0003] Generally, the above-mentioned devices are equipped with a miniature camera module, which can perform an autofocus (AF) function that automatically adjusts the distance between the image sensor and the lens to align the focal length of the lens.

[0004] Recently, camera modules have adopted image stabilization (IS) technology to correct or prevent image shake caused by camera movement due to an unstable fixing device or user movement.

[0005] Such image stabilization (IS) technologies include optical image stabilizer (OIS) technology and image stabilization technology using image sensors. OIS technology compensates for movement by changing the path of light, while image stabilization technology using image sensors compensates for movement using mechanical and electronic methods, with OIS technology being increasingly adopted recently.

[0006] Therefore, the camera module includes an actuator for performing autofocus and image stabilization functions. The actuator, also referred to as a lens driver, provides a driving force for moving or tilting the lens driver along the first, second, and third axes.

[0007] The lens driver includes a driving coil for providing a driving force around each axis, and a position sensor for sensing the position of the lens module.

[0008] As a result, the number of soldering points between the actuator and the driver or module connector in the conventional camera module has increased, causing problems in the soldering process. Here, the soldering points may refer to connection contacts at which the actuator and the module connector or driver are electrically connected. For example, the soldering points may include connection contacts between a plurality of drive coils and the module connector or driver. For example, the soldering points may include connection contacts between a plurality of position sensors and the module connector or driver.

[0009] In the past, each driving coil and each position sensor were connected to the module connector or driver. This resulted in an increase in the number of soldering points between the actuator and the module connector or driver, complicating the manufacturing process. Furthermore, in the past, the increase in soldering points increased the volume of the circuit board, resulting in design constraints due to spatial issues.

[0010] Furthermore, the prior art technology has problems with electrical reliability due to defects in the soldering process, and cracks occur at the soldering points, which are problematic in terms of impact reliability and environmental reliability. [Prior art documents] [Patent documents]

[0011] [Patent Document 1] KR10-2017-0053274A Summary of the Invention [Problem to be solved by the invention]

[0012] The embodiments provide a camera module with a new structure and an optical device including the same.

[0013] Furthermore, the embodiments provide a camera module that can improve the reliability of the connection between the lens driving device and the first substrate, and an optical device including the camera module.

[0014] Furthermore, the embodiments provide a camera module that can omit a soldering process and an optical device including the same.

[0015] Furthermore, the embodiments provide a camera module with improved electrical reliability and an optical device including the same.

[0016] The technical problems to be solved in the embodiments are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person skilled in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0017] A camera module according to an embodiment includes a first substrate having a first terminal portion, an image sensor arranged on the first substrate, a base arranged on the first substrate, a lens driving device arranged on the base and including a second substrate having a second terminal portion, and a connecting pin passing through the base, one end of the connecting pin contacting the first terminal portion and the other end of the connecting pin contacting the second terminal portion.

[0018] The connecting pin also includes a main body that penetrates the base, a first connecting portion that protrudes downward from the main body and has one end that contacts the first terminal portion, and a second connecting portion that protrudes upward from the main body and has the other end that contacts the second terminal portion.

[0019] At least one of the first connecting portion and the second connecting portion has elasticity.

[0020] The base also includes an insertion hole into which the body of the connecting pin is inserted, the insertion hole penetrating the base at a position spaced apart from an outer end of the base.

[0021] The base also includes a first region including the insertion hole and a second region adjacent to the first region, and the first region and the second region do not have a step.

[0022] The base also includes the first region including the insertion hole and the second region adjacent to the first region, and the first region and the second region have a step.

[0023] The first region of the base is provided with a recess corresponding to the step, and the recess includes a first recess provided on one side of the base and in which a first adhesive member that connects the first connecting portion and the first terminal portion is disposed, and a second recess provided on another side opposite to the one side of the base and in which a second adhesive member that connects the second connecting portion and the second terminal portion is disposed.

[0024] The lens driving device further includes a driving coil disposed on the second substrate, and the second terminal portion includes a plurality of second terminals, at least one of which is electrically connected to the driving coil.

[0025] The lens driving device further includes a mover that moves relative to the second substrate and includes a sensor unit, and at least another of the plurality of second terminals includes a terminal electrically connected to the sensor unit.

[0026] In addition, the first terminal portion and the second terminal portion overlap in the optical axis direction, the insertion hole is aligned with the first terminal portion and the second terminal portion in the optical axis direction, and a peripheral region of the upper surface of the first substrate adjacent to the first terminal portion overlaps with the base in the optical axis direction.

[0027] The lens driving device further includes a holder on which the second substrate is placed, the second substrate being placed on the holder and including a first substrate region on which the driving coil is placed and a second substrate region bent from the first substrate region, and the second terminal portion being placed in the second substrate region of the second substrate.

[0028] Further, the second substrate region of the second substrate includes a first sub-region bent from one end of the first substrate region of the second substrate and positioned on the side of the holder, and a second sub-region bent from the first sub-region and positioned on the bottom of the holder, and the second terminal portion is positioned on the bottom surface of the second sub-region facing the top surface of the base.

[0029] The second terminal portion also includes a first portion that is disposed on the underside of the second sub-region and contacts the first connecting portion of the connecting pin, and a second portion that extends from the first portion and is disposed on the side of the first sub-region.

[0030] The lens driving device further includes a holder on which the second substrate is placed, the second substrate being placed on the holder and including a substrate area on which the driving coil is placed, the second terminal portion being placed on the underside of the substrate area, and the holder vertically overlapping the second terminal portion and including a through hole through which the second connecting portion of the connecting pin passes.

[0031] The second terminal portion also includes a first portion that is disposed on the underside of the substrate area and contacts the first connecting portion of the connecting pin, and a second portion that extends from the first portion and is disposed on a side surface of the substrate area.

[0032] The first terminal portion includes a 1-1 terminal portion disposed on one side of the image sensor on the upper surface of the first substrate, and a 1-2 terminal portion disposed on the other side of the upper surface of the first substrate opposite to the one side of the image sensor, the second terminal portion includes a 2-1 terminal portion corresponding to the 1-1 terminal portion and a 2-2 terminal portion corresponding to the 1-2 terminal portion, and the connecting pins include a first connecting pin contacting the 1-1 terminal portion and the 2-1 terminal portion, respectively, and a second connecting pin contacting the 1-2 terminal portion and the 2-2 terminal portion, respectively.

[0033] In addition, at least one of the first connecting portion and the second connecting portion includes a flat surface, and at least one of the first terminal portion and the second terminal portion includes a flat surface corresponding to the first connecting portion or the second connecting portion.

[0034] In addition, at least one of the first connecting portion and the second connecting portion includes an inwardly concave surface, and at least one of the first terminal portion and the second terminal portion includes an outwardly convex surface that corresponds to the concave surface of the first connecting portion or the second connecting portion.

[0035] Furthermore, at least one of the first connecting portion and the second connecting portion includes a surface that is convex toward the outside, and at least one of the first terminal portion and the second terminal portion includes a surface that is concave toward the inside, corresponding to the convex surface of the first connecting portion or the second connecting portion.

[0036] On the other hand, the camera module of the embodiment includes a first substrate including a first terminal portion, an image sensor arranged on the first substrate, a base arranged on the first substrate, a lens driving device arranged on the base and including a second substrate including a second terminal portion, and a connecting pin that contacts the first terminal portion and the second terminal portion, wherein the base includes a hole into which the connecting pin is inserted, and at least one end of the connecting pin has elasticity.

[0037] On the other hand, the camera module of the embodiment includes a substrate, an image sensor arranged on the substrate, a lens driving device arranged on the substrate, and a base arranged between the substrate and the lens driving device, the base including an upper surface having a first groove, a lower surface having a second groove, and a through hole penetrating the first groove and the second groove, and the side wall of the base in the area where the through hole is arranged is exposed to the outside.

[0038] On the other hand, the camera module of the embodiment includes a first substrate including a plurality of first terminals, an image sensor arranged on the first substrate, a base arranged on the first substrate, a lens driving device including a second substrate arranged on the base and including a plurality of second terminals, and a connecting portion in contact with the plurality of first terminals and the plurality of second terminals, wherein the base includes an opening corresponding to the image sensor and a first region through which the connecting portion passes, and the first region of the base is located between the opening and one side of the base. [Effects of the Invention]

[0039] The camera module of the embodiment can improve the reliability of the electrical connection between the driving substrate unit and the lens driving device.

[0040] Specifically, the drive substrate unit includes a first substrate including a first terminal portion. The lens drive device includes a second substrate including a second terminal portion. At this time, a base of a filter unit is disposed between the first substrate and the second substrate. The base includes an insertion hole. The camera module of the embodiment includes a connecting pin inserted into the insertion hole. At this time, the connecting pin includes a first connecting portion connected to the first terminal portion of the first substrate and a second connecting portion connected to the second terminal portion of the second substrate when inserted into the insertion hole of the base. The connecting portion electrically connects the first substrate and the second substrate when supported by the base.

[0041] As a result, the embodiment can omit the soldering process for electrically connecting the first terminal portion and the second terminal portion, thereby solving the problems of electrical reliability and physical reliability that may occur during the soldering process, and also solving the problem of cracks occurring at the points where the soldering process is performed due to various factors.

[0042] Furthermore, the embodiment can ensure the flatness of the base on which the infrared filter is disposed. As a result, the embodiment can ensure the flatness of the infrared filter. Specifically, the base of the comparative example includes an opening that is open to a region where the second terminal portion of the second substrate is formed. As camera module technology advances, the size of image sensors increases, and the size of the infrared filter also increases. The base of the comparative example must ensure a region where the opening is formed, which reduces the strength of the base. Furthermore, the comparative example increases the size of the base as the opening is formed, which increases the overall size of the camera module. In contrast, the embodiment does not require the opening to be formed in the base. As a result, the embodiment can improve the strength of the base. Therefore, the camera module of the embodiment can improve the flatness of the base and further improve the flatness of the infrared filter.

[0043] Furthermore, the camera module of the comparative example performs a soldering process on the outside to electrically connect the first and second substrates. Therefore, in the camera module of the comparative example, the solder part that electrically connects the first and second substrates is exposed to the outside of the camera module. Therefore, in the comparative example, the solder part is exposed to the outside, which causes problems with electrical reliability and physical reliability.

[0044] In contrast, the camera module of the embodiment electrically connects the first substrate and the second substrate using a connecting pin. Therefore, in the camera module of the embodiment, a contact point between the first terminal portion of the first substrate and the second terminal portion of the second substrate can be located inside the camera module. Therefore, the embodiment can protect the contact point from various factors. As a result, the embodiment can further improve the electrical connectivity between the first substrate and the second substrate. Furthermore, the embodiment can improve the operational reliability of the camera module. [Brief explanation of the drawings]

[0045] [Figure 1] FIG. 1 is a perspective view of a camera module according to an embodiment. [Figure 2] 2 is a cross-sectional view of the camera module of FIG. 1 taken along the line AA'. [Figure 3] 2 is a cross-sectional view of the camera module of FIG. 1 taken along the line BB'. [Figure 4] FIG. 2 is an exploded perspective view of the camera module of FIG. 1. [Figure 5] FIG. 5 is a side view of the lens driving device of FIG. [Figure 6] FIG. 5 is an exploded perspective view of the lens driving device of FIG. [Figure 7a] FIG. 2 is a perspective view of a second substrate according to the first embodiment, as viewed from above. [Figure 7b] FIG. 2 is a perspective view of a second substrate according to the first embodiment, as viewed from below. [Figure 8a] FIG. 10 is a perspective view of a second substrate according to a second embodiment, as viewed from below. [Figure 8b] FIG. 11 is a perspective view of a second substrate according to a third embodiment, as viewed from below. [Figure 9] FIG. 2 is an exploded perspective view of the filter unit of the first embodiment. [Figure 10a] FIG. 2 is a perspective view of a connecting pin according to the first embodiment. [Figure 10b] FIG. 10 is a perspective view of a connecting pin according to a second embodiment. [Figure 10c] FIG. 10 is a perspective view of a connecting pin according to a third embodiment. [Figure 11] FIG. 2 is a plan view showing a state in which a connecting pin is coupled to a base of the first embodiment. [Figure 12] 1A is a side view of the state in which the connecting pin is coupled to the base of the first embodiment, and FIG. 1B is a cross-sectional view of the state in which the connecting pin is coupled to the base of the first embodiment. [Figure 13a] FIG. 10 is a perspective view of a base according to a second embodiment. [Figure 13b] FIG. 10 is a perspective view of a base according to a third embodiment. [Figure 14a] 3 is a cross-sectional view of a connecting pin, a first terminal portion, and a second terminal portion according to the first embodiment. FIG. [Figure 14b] FIG. 10 is a cross-sectional view of a connecting pin, a first terminal portion, and a second terminal portion according to a second embodiment. [Figure 14c] FIG. 10 is a cross-sectional view of a connecting pin, a first terminal portion, and a second terminal portion according to a third embodiment. [Figure 15] FIG. 10 is a plan view of a base of a comparative example to be compared with the example. [Figure 16] 1A is a side view of a camera module according to a comparative example, and FIG. 1B is a side view of a camera module according to an embodiment of the present invention. [Figure 17] 1 illustrates a mobile terminal to which a camera module according to an embodiment is applied. [Figure 18] 1 is a perspective view of a vehicle to which a camera module according to an embodiment is applied; DETAILED DESCRIPTION OF THE INVENTION

[0046] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0047] However, the technical concept of the present invention is not limited to the several embodiments described, but may be realized in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

[0048] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the examples of the present invention are to be interpreted as meanings that can be commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and commonly used terms such as predefined terms may be interpreted in light of the contextual meaning of the relevant art.

[0049] Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the present invention. In this specification, the singular form can also include the plural form unless otherwise specified, and when it is stated as "A and (and) at least one (or more) of B and C," it can include one or more of all combinations of A, B, and C.

[0050] Furthermore, when describing components of embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "b" may be used. These terms are used merely to distinguish the component from other components, and do not limit the essence, order, or procedure of the components. Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, it may include not only a case where the component is directly coupled or connected to the other component, but also a case where the component is "coupled," "coupled," or "connected" to the other component by another component or between the component and the other component.

[0051] Furthermore, when it is stated that something is formed or disposed "above (upper) or below (lower)" a component, the above (upper) or below (lower) refers not only to the case where two components are in direct contact with each other, but also to the case where one or more other components are formed or disposed between the two components. Furthermore, when it is expressed as "above (upper) or below (lower)," it can mean not only the upper direction but also the lower direction based on one component.

[0052] The optical axis direction used below can be defined as the optical axis direction of a lens coupled to a camera module, and the vertical direction can be defined as the direction perpendicular to the optical axis.

[0053] The "optical axis direction" used below is defined as the optical axis direction of a lens module included in a camera module. However, the "optical axis direction" can also be used interchangeably with "upper and lower side directions," "z-axis direction," etc.

[0054] The autofocus function used below is defined as a function that allows the image sensor to capture a clear image of the subject. For example, the "autofocus function" is defined as a function that automatically focuses on the subject by moving the lens module along the optical axis according to the distance to the subject and adjusting the distance to the image sensor. Meanwhile, "autofocus" can be used interchangeably with "AF (Auto Focus)."

[0055] In addition, the term "image stabilization function" used below is defined as a function that moves or tilts the lens module in a direction perpendicular to the optical axis to offset vibrations (movements) that occur in the image sensor due to external forces. On the other hand, "image stabilization" can be used interchangeably with "OIS (Optical Image Stabilization)."

[0056] Prior to describing the embodiments of the present invention, the configuration of the optical device according to the embodiments will be described.

[0057] The optical device may be any one of a handheld phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistant), a PMP (Portable Multimedia Player), and a navigation system, but the types of optical devices are not limited thereto, and any device for taking images or photographs can be called an optical device.

[0058] The optical device may include a main body (not shown), a camera module, and a display unit (not shown), although one or more of the main body, camera module, and display unit may be omitted or modified in the optical device.

[0059] The body may form the exterior of the optical device. As an example, the body may include a rectangular parallelepiped shape. As another example, the body may be formed with at least a portion being rounded. The body may house a camera module. A display unit may be disposed on one side of the body. As an example, the display unit and the camera module may be disposed on one side of the body, and a camera module may be further disposed on the other side of the body (the side opposite to the one side).

[0060] The camera module may be disposed on the body of the optical device. The camera module may be disposed on one side of the body. The camera module may be at least partially housed inside the body. A plurality of camera modules may be provided. The plurality of camera modules may be disposed on one side of the body and on the other side of the body, respectively. The camera module is capable of capturing an image of a subject.

[0061] The display unit may be disposed on the main body. The display unit may be disposed on one side of the main body. That is, the display unit may be disposed on the same side as the camera module. Alternatively, the display unit may be disposed on another side of the main body. The display unit may be disposed on a side of the main body opposite to the side on which the camera module is disposed. The display unit may output an image captured by the camera module.

[0062] 1 is a perspective view of a camera module according to an embodiment, FIG. 2 is a cross-sectional view of the camera module of FIG. 1 taken along the line A-A', FIG. 3 is a cross-sectional view of the camera module of FIG. 1 taken along the line B-B', FIG. 4 is an exploded perspective view of the camera module of FIG. 1, FIG. 5 is a side view of the lens driving device of FIG. 4, FIG. 6 is an exploded perspective view of the lens driving device of FIG. 4, FIG. 7a is a perspective view of a second substrate according to a first embodiment seen from above, and FIG. 8b is a perspective view of the second substrate according to the first embodiment as viewed from below, FIG. 8a is a perspective view of the second substrate according to the second embodiment as viewed from below, FIG. 8b is a perspective view of the second substrate according to the third embodiment as viewed from below, FIG. 9 is an exploded perspective view of the filter section according to the first embodiment, FIG. 10a is a perspective view of the connecting pin according to the first embodiment, FIG. 10b is a perspective view of the connecting pin according to the second embodiment, and FIG. 10c is a perspective view of the connecting pin according to the third embodiment. 14a is a cross-sectional view of the connecting pin, first terminal portion, and second terminal portion of the first embodiment, FIG. 14b is a cross-sectional view of the connecting pin, first terminal portion, and second terminal portion of the second embodiment, FIG. 14c is a cross-sectional view of the connecting pin, first terminal portion, and second terminal portion of the third embodiment, FIG. 15 is a plan view of the base of a comparative example to be compared with the examples, FIG. 16(a) is a side view of the camera module of the comparative example, and FIG. 16(b) is a side view of the camera module of the examples.

[0063] The overall configuration of the camera module according to the embodiment will be described below with reference to FIGS.

[0064] Prior to describing the embodiments, one of the first drive coil 222, the drive magnet 232, and the second drive coil 242 may be referred to as the "first drive unit," the other as the "second drive unit," and the remaining one as the "third drive unit." Meanwhile, the first drive coil 222 may be referred to as the "AF drive coil," the second drive coil 242 as the "OIS drive coil," and the drive magnet 232 as the "shared magnet." Meanwhile, the first drive coil 222, the drive magnet 232, and the second drive coil 242 may be arranged with their positions interchanged with one another.

[0065] Furthermore, the camera module of the embodiment may include a plurality of magnets, one of which may include the driving magnet 232.

[0066] The camera module may also include a sensing magnet 271 and a compensation magnet 272 .

[0067] In this case, one of the driving magnet 232, the sensing magnet 271, and the compensation magnet 272 may be referred to as a "first magnet," another may be referred to as a "second magnet," and the remaining one may be referred to as a "third magnet."

[0068] 1 to 4, the camera module of the embodiment may include a lens module 100, a lens driving device 200, a driving substrate unit 300, a filter unit 400, and a connecting pin 500.

[0069] The driving substrate unit 300 may include a first substrate 310, an image sensor 320, a first terminal unit 330, a first element 340, and a second element 350. The first element 340 may be a driver element, and the second element 350 may be a motion sensor. The driving substrate unit 300 may also be referred to as a first substrate unit.

[0070] Meanwhile, the camera module of the embodiment includes the lens module 100, the lens driving device 200, the driving substrate unit 300, the filter unit 400, and the connecting pin 500, but any one or more of these may be omitted or modified.

[0071] Furthermore, the lens module 100 may include a lens 120 and a lens barrel 110. The lens module 100 may include at least one lens 120 and a lens barrel 110 that houses the lens 120. However, one configuration of the lens module 100 is not limited to the lens barrel 110. For example, one configuration of the lens module 100 may be any holder structure that can support one or more lenses 120.

[0072] The lens module 100 can be coupled inside the lens driver 200 .

[0073] The lens module 100 may be coupled to the bobbin 221 of the lens driving device 200. The lens module 100 may be moved together with the bobbin 221 of the lens driving device 200. For example, the lens module 100 may be moved integrally with the bobbin 221 of the lens driving device 200.

[0074] For example, the lens module 100 may be coupled to the bobbin 221 by an adhesive member (not shown). For another example, the lens module 100 may be screwed to the bobbin 221. Meanwhile, light passing through the lens module 100 may be irradiated onto the image sensor 320 of the driving board unit 300.

[0075] The filter unit 400 may be disposed on the image sensor 320. The filter unit 400 may block light in the infrared region from entering the image sensor 320. The filter unit 400 may include a base 410 and an infrared filter 420. The filter unit 400 may also include an adhesive member 430. That is, the adhesive member 430 may be disposed on the base 410. The infrared filter 420 may be attached or coupled to the base 410 via the adhesive member 430.

[0076] The infrared filter 420 may be disposed between the lens module 100 and the image sensor 320. A base 410 for the filter unit 400 may be disposed between the lens module 100 and the image sensor 320. The infrared filter 420 may be mounted on the base 410. For example, the infrared filter 420 may be mounted in a through-hole 411 of the base 410. The infrared filter 420 may be formed of a film material or a glass material. The infrared filter 420 may be formed by coating an infrared blocking coating material on a flat optical filter, such as a cover glass for protecting an imaging surface. For example, the infrared filter 420 may be an infrared absorption filter that absorbs infrared rays. For another example, the infrared filter 420 may be an infrared reflection filter that reflects infrared rays. The filter unit 400 may be disposed on the driving substrate unit 300. Preferably, the filter unit 400 may be disposed on the first substrate 310 of the driving substrate unit 300.

[0077] Meanwhile, the lens driving device 200 may be disposed on the driving substrate unit 300 and the filter unit 400. Preferably, the lens driving device 200 may be disposed on the filter unit 400. As an example, the filter unit 400 may include an adhesive member 430 disposed on an upper surface of the base 410. The holder 243 of the lens driving device 200 may be fixed to the filter unit 400 via the adhesive member 430. However, the embodiment is not limited thereto.

[0078] Preferably, the driving substrate unit 300 may be disposed below the filter unit 400. The lens driving device 200 may be disposed above the filter unit 400.

[0079] The filter unit 400 may be coupled to the driving substrate unit 300 , and the lens driving device 200 may be coupled to the filter unit 400 .

[0080] The driving substrate unit 300 may include a first substrate 310. An image sensor 320 may be disposed on the first substrate 310. The first substrate 310 may be electrically connected to the image sensor 320.

[0081] In this case, the filter unit 400 and the lens driving device 200 may house the image sensor 320 therein. With this configuration, light passing through the lens module 100 coupled to the lens driving device 200 may be irradiated onto the image sensor 320 mounted on the first substrate 310 of the driving substrate unit 300. The first substrate 310 may supply power (for example, current) to the lens driving device 200.

[0082] Meanwhile, a first element 340, which is a control element for controlling the lens driving device 200, may be disposed on the first substrate 310. Also, a second element 350, which is a sensing element for determining control conditions of the lens driving device 200, may be disposed on the first substrate 310.

[0083] The image sensor 320 may be disposed on the first substrate 310 of the driving substrate unit 300. The image sensor 320 may be electrically connected to the first substrate 310. For example, the image sensor 320 may be bonded to the first substrate 310 using surface mounting technology (SMT). For another example, the image sensor 320 may be bonded to the first substrate 310 using flip-chip technology. The image sensor 320 may be disposed so that its optical axis coincides with that of the lens module 100. That is, the optical axis of the image sensor 320 may be aligned with the optical axis of the lens module 100. Thus, the image sensor 320 can capture light that has passed through the lens module 100. The image sensor 320 can convert light irradiated onto an effective image area into an electrical signal. The image sensor 320 may be any one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID. However, the type of image sensor 320 is not limited thereto, and the image sensor 320 may include any configuration capable of converting incident light into an electrical signal.

[0084] The first element 340 may be disposed on the first substrate 310. As an example, the first element 340 may be disposed outside the lens driving device 200 on the first substrate 310. However, the embodiment is not limited thereto, and the first element 340 may be disposed inside the lens driving device 200 on the first substrate 310.

[0085] The first substrate 310 may include a first terminal unit 330. The first terminal unit 330 may be disposed on one surface of the first substrate 310. Preferably, the first terminal unit 330 may be disposed on the upper surface of the first substrate 310.

[0086] The first terminal unit 330 may be disposed around the image sensor 320 on the first substrate 310. The first terminal unit 330 may include a plurality of first terminals. For example, the first terminal unit 330 may include a plurality of first terminals electrically connected to the second substrate 241 of the lens driving device 200.

[0087] The first terminal portion 330 may be divided into a plurality of first terminal groups.

[0088] The first terminal unit 330 may include a first terminal unit 331 including a plurality of first terminals. The first terminal unit 331 may be disposed adjacent to one side of the image sensor 320 on the first substrate 310.

[0089] The first terminal unit 330 may include a first-second terminal unit 332 including a plurality of first-second terminals. The first-second terminal unit 332 may be disposed adjacent to the other side of the image sensor 320 opposite to the one side on the first substrate 310.

[0090] The first terminal unit 331 and the first terminal unit 332 may include the same number of terminals. For example, the number of the first terminals may be the same as the number of the first terminals. However, the embodiment is not limited thereto. For example, the number of the first terminals may be different from the number of the first terminals. However, in the embodiment, the number of the first terminals is set to be the same as the number of the first terminals. This improves the weight balance of the camera module, thereby improving operability.

[0091] For example, the plurality of 1-1 terminals may include eight terminals, and the plurality of 1-2 terminals may also include eight terminals.

[0092] The plurality of 1-1 terminals may include power supply-related terminals, a clock terminal, and an OIS driving terminal. The plurality of 1-2 terminals may include a Hall sensor terminal and a ground terminal. For example, the first substrate 310 may be connected to a second driving coil 242 disposed on the second substrate 241. In this case, the second driving coil 242 may include a 2-1 driving coil (not shown) for driving in the x-axis direction and a 2-2 driving coil (not shown) for driving in the y-axis direction. The lens driving device 200 may also include a first sensor unit (not shown) and a second sensor unit (not shown) for sensing the position of the housing 231 or the bobbin 221.

[0093] The plurality of 1-1 terminals of the 1-1 terminal unit 331 may include a 1-1a terminal connected to one end of the 2-1 driving coil, a 1-1b terminal connected to the other end of the 2-1 driving coil, a 1-1c terminal connected to one end of the 2-2 driving coil, a 1-1d terminal connected to the other end of the 2-2 driving coil, a 1-1e terminal corresponding to an SDA terminal for transmitting a data signal, a 1-1f terminal corresponding to an SCL terminal for transmitting a clock signal, a 1-1g terminal for transmitting a VDD power supply, and a 1-1h terminal for transmitting a VSS power supply.

[0094] The 1-2 terminals of the 1-2 terminal section 332 may include a 1-2a terminal connected to the first input terminal of the first sensor unit, a 1-2b terminal connected to the first output terminal (e.g., positive terminal) of the first sensor unit, a 1-2c terminal connected to the second output terminal (e.g., negative terminal) of the first sensor unit, a 1-2d terminal connected to the first input terminal of the second sensor unit, a 1-2e terminal connected to the first output terminal (e.g., positive terminal) of the second sensor unit, a 1-2f terminal connected to the second output terminal (e.g., negative terminal) of the second sensor unit, a 1-2g terminal commonly connected to the second input terminals of the first and second sensor units, and a 1-2h terminal for frame ground.

[0095] The first terminal unit 330 may be formed of a metal material having high electrical conductivity to transmit an electrical signal. For example, the first terminal unit 330 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). For example, the first terminal unit 330 may be formed of copper (Cu), which has high electrical conductivity and is relatively inexpensive. The first terminal unit 330 may be formed using a typical circuit board manufacturing process, such as an additive process, a subtractive process, a modified semi-additive process (MSAP), or a semi-additive process (SAP).

[0096] The first element 340 can also be called a “drive element,” a “control element,” or a “control unit” that drives or controls the lens driving device 200 .

[0097] The first element 340 can individually control the direction, strength, amplitude, etc. of the current supplied to the first drive coil 222 and the second drive coil 242 of the lens driving device 200. However, the strength of the current supplied to the first drive coil 222 can be controlled by a Hall driver element (not shown).

[0098] The first element 340 can control the lens driving device 200 to perform one or more of an autofocus function and an image stabilization function of the camera module. That is, the first element 340 can control the lens driving device 200 to move the lens module 100 in the optical axis direction, move it in a direction perpendicular to the optical axis direction, or tilt it. Furthermore, the first element 340 can perform one or more of feedback control of the autofocus function and feedback control of the image stabilization function.

[0099] For example, the first element 340 may receive the position of the bobbin 221 or the housing 231 sensed by a first sensor unit (not shown) and control the current applied to the first driving coil 222. Through this, the first element 340 may perform autofocus feedback control. Also, the first element 340 may receive the position of the bobbin 221 or the housing 231 sensed by a second sensor unit (not shown) and control the current applied to the second driving coil 242. Through this, the first element 340 may perform image stabilization feedback control.

[0100] At this time, feedback control by the first element 340 occurs in real time, thereby enabling more precise autofocus and image stabilization functions.

[0101] The second element 350 may be disposed on the first substrate 310 at a distance from the first element 340. The second element 350 may be a motion sensor. For example, the second element 350 may sense rotational angular velocity information due to the movement of the camera module. The second element 350 may be implemented as a two-axis or three-axis gyro sensor or an angular velocity sensor.

[0102] The driving substrate unit 300 may also include a connector 360. The connector 360 may be disposed on the first substrate 310. For example, the connector 360 may be electrically connected to the first substrate 310. The connector 360 may include a port electrically connected to an external device (e.g., an optical device). The connector 360 may transmit an image signal acquired from the image sensor 320 to the optical device. The connector 360 may also transmit a signal transmitted from the optical device to the first element 340 disposed on the first substrate 310.

[0103] The connecting pin 500 may be coupled to the filter unit 400. For example, the connecting pin 500 may penetrate the base 410 of the filter unit 400. The connecting pin 500 may include a first connecting portion 502 connected to the first substrate 310 of the driving substrate unit 300. The connecting pin 500 may also include a second connecting portion 503 connected to the second substrate 241 of the lens driving device 200.

[0104] For example, the driving substrate unit 300 and the lens driving device 200 may be electrically connected to each other. For example, the first substrate 310 of the driving substrate unit 300 and the second substrate 241 of the lens driving device 200 may be electrically connected to each other.

[0105] In this case, the camera module of the embodiment may electrically connect the first substrate 310 and the second substrate 241 using a connecting pin 500. The connecting pin 500 is disposed to penetrate the base 410 of the filter unit 400. The connecting pin 500 may penetrate the base 410 and be electrically connected to the first substrate 310 via a first connecting portion 502, and to the second substrate 241 via a second connecting portion 503.

[0106] Specifically, the first substrate 310 may include a first terminal portion 330. The lens driving device 200 may also include a second substrate 241 having a second terminal portion 241P (see FIGS. 14a to 14c).

[0107] At this time, in the camera module of the comparative example, the first terminal portion 330 and the second terminal portion 241P are connected to each other by soldering.

[0108] In contrast, in the embodiment, the first substrate 310 and the second substrate 241 may be electrically connected to each other via a connecting pin 500 penetrating the base 410. For example, the first connecting portion 502 of the connecting pin 500 may contact the first terminal portion 330 of the first substrate 310, and the second connecting portion 503 of the connecting pin 500 may contact the second terminal portion 241P of the second substrate 241. Therefore, the point of contact between the second terminal portion 241P and the second connecting portion 503 of the connecting pin 500 may be arranged horizontally rather than vertically on the second substrate 241. For example, as shown in FIG. 5 , when viewed from the side of the camera module, a portion of the entire area of ​​the second terminal portion 241P that substantially contacts the second connecting portion 503 may be located at the bottom of the second substrate 241. In contrast, the contact portion in the comparative example is located at the side of the second substrate. This can be achieved by the camera module of the embodiment in which the first substrate 310 and the second substrate 241 are interconnected by the connecting pin 500, thereby eliminating the soldering process of the comparative example.

[0109] The lens driving device 200, the driving substrate unit 300, the filter unit 400, and the connecting pin 500 of the embodiment will be described in more detail below.

[0110] Referring to FIG. 6, the lens driving device 200 may include a cover member 210, a first movable element 220, a second movable element 230, a stator 240, a first support member 250, a second support member 260, and a sensor unit (not shown).

[0111] However, any one or more of the cover member 210, the first movable element 220, the second movable element 230, the stator 240, the first support member 250, the second support member 260, and the sensor unit may be omitted or modified in the lens driving device 200. In particular, the sensor unit is a component for autofocus feedback control and image stabilization feedback control, and any one or more of these may be omitted.

[0112] The cover member 210 may form the exterior of the lens driving device 200. The cover member 210 may have a hexahedral shape with an open bottom. However, the shape of the cover member 210 is not limited thereto. The cover member 210 may be made of a non-magnetic material. If the cover member 210 is made of a magnetic material, the magnetic force of the cover member 210 may affect one or more of the driving magnet 232, the sensing magnet 271, and the compensation magnet 272. The cover member 210 may be made of a metal material.

[0113] The cover member 210 may be made of a metal plate. In this case, the cover member 210 can block EMI (electro-magnetic interference). Therefore, the cover member 210 can be called an "EMI shielding can." The cover member 210 can block radio waves generated outside the lens driving device 200 from entering the inside of the cover member 210. In addition, the cover member 210 can block radio waves generated inside the cover member 210 from emitting to the outside of the cover member 210.

[0114] The cover member 210 may include an upper plate 211 and a side plate 212. The cover member 210 may include the upper plate 211 and the side plate 212 extending downward from the outer periphery of the upper plate 211. The cover member 210 may be coupled to a holder 243. A portion of the side plate 212 of the cover member 210 may be coupled to the holder 243.

[0115] The inner surface of the side plate 212 of the cover member 210 can be in direct contact with the outer surface of the holder 243. The inner surface of the side plate 212 of the cover member 210 can be bonded to the holder 243 by an adhesive (not shown).

[0116] The first armature 220, the second armature 230, the stator 240, the first support member 250, and the second support member 260 may be disposed in the internal space formed by the cover member 210 and the holder 243. Through this structure, the cover member 210 can protect the internal components from external impacts and prevent the penetration of external contaminants.

[0117] The cover member 210 may include an opening 213. The opening 213 may be provided on an upper plate 211 of the cover member 210. The opening 213 may expose the lens module 100 from an upper side thereof. The opening 213 may be formed in a shape corresponding to the lens module 100. The size of the opening 213 may be larger than the diameter of the lens module 100 so that the lens module 100 can be assembled through the opening 213. Light incident through the opening 213 may pass through the lens module 100. At this time, the light passing through the lens module 100 may be converted into an electrical signal by an image sensor and acquired as an image.

[0118] The first movable element 220 may be coupled to the lens module 100. The first movable element 220 may accommodate the lens module 100 therein. The outer periphery surface of the lens module 100 may be coupled to the inner periphery surface of the first movable element 220. The first movable element 220 may move through interaction with the second movable element 230 and / or the stator 240. In this case, the first movable element 220 may move integrally with the lens module 100. Meanwhile, the first movable element 220 may move for an autofocus function. In this case, the first movable element 220 may be referred to as an "AF movable element." However, this does not mean that the first movable element 220 is limited to a component that moves only for the autofocus function. The first movable element 220 may also move for an image stabilization function.

[0119] The first mover 220 may include a bobbin 221 and a first drive coil 222. However, in the first mover 220, any one or more of the bobbin 221 and the first drive coil 222 may be omitted or modified.

[0120] The bobbin 221 may be disposed inside the housing 231. The bobbin 221 may be disposed in a through-hole (not shown) of the housing 231.

[0121] The bobbin 221 can move in the optical axis direction based on the housing 231. The bobbin 221 can be arranged in a through-hole (not shown) of the housing 231 so as to move along the optical axis. The bobbin 221 can be coupled to the lens module 100. The inner peripheral surface of the bobbin 221 can be coupled to the outer peripheral surface of the lens module 100. The first driving coil 222 can be coupled to the bobbin 221. The first driving coil 222 can be coupled to the outer peripheral surface of the bobbin 221. A lower portion of the bobbin 221 can be coupled to the lower support member 252. An upper portion of the bobbin 221 can be coupled to the upper support member 251.

[0122] The bobbin 221 may include a through-hole (not shown). The lens module 100 may be disposed in the through-hole of the bobbin 221. For example, the lens module 100 may be screwed into the through-hole of the bobbin 221. Alternatively, the lens module 100 may be attached to the through-hole of the bobbin 221 with an adhesive.

[0123] A first driving coil 222 may be coupled to the bobbin 221. To this end, the bobbin 221 may include a groove (not shown) formed by partially recessing an outer circumferential surface of the bobbin 221. The first driving coil 222 may be accommodated in the groove.

[0124] An upper support member 251 may be coupled to the upper surface of the bobbin 221. To this end, a coupling protrusion (not shown) to which the upper support member 251 is coupled may be formed on the upper side of the bobbin 221.

[0125] Additionally, a lower support member 252 may be coupled to the lower surface of the bobbin 221 .

[0126] The first drive coil 222 may be disposed on the bobbin 221. The first drive coil 222 may be disposed on the outer circumferential surface of the bobbin 221. The first drive coil 222 may be directly wound around the bobbin 221. The first drive coil 222 may face the drive magnet 232. In this case, when a current is supplied to the first drive coil 222 to form a magnetic field around the first drive coil 222, the first drive coil 222 may move relative to the drive magnet 232 due to electromagnetic interaction between the first drive coil 222 and the drive magnet 232. The first drive coil 222 may electromagnetically interact with the drive magnet 232. The first drive coil 222 may move the bobbin 221 in the optical axis direction relative to the housing 231 through electromagnetic interaction with the drive magnet 232. For example, the first drive coil 222 may be a single coil formed integrally. For another example, the first drive coil 222 may include multiple coils spaced apart from each other.

[0127] The first drive coil 222 may include a pair of lead wires for supplying power. In this case, the pair of lead wires of the first drive coil 222 may be electrically connected to the upper support member 251. That is, the first drive coil 222 may be supplied with power via the upper support member 251. As another example, the pair of lead wires of the first drive coil 222 may be electrically connected to the lower support member 252.

[0128] The second movable element 230 may accommodate at least a portion of the first movable element 220 therein. The second movable element 230 may move the first movable element 220 or may move together with the first movable element 220. The second movable element 230 may move through interaction with the stator 240. The second movable element 230 may move for the image stabilization function. In this case, the second movable element 230 may be referred to as an "OIS movable element." The second movable element 230 may move integrally with the first movable element 220 when moving for the image stabilization function.

[0129] The second mover 230 may include a housing 231 and a drive magnet 232. However, in the second mover 230, any one or more of the housing 231 and the drive magnet 232 may be omitted or modified.

[0130] The housing 231 may be disposed outside the bobbin 221. The housing 231 may accommodate at least a portion of the bobbin 221 therein. For example, the housing 231 may have a hexahedral shape. The housing 231 may have four side surfaces and four corner portions disposed between the four side surfaces. The driving magnet 232 may be disposed in the housing 231. For example, the driving magnet 232 may be disposed at each of the four corner portions of the housing 231. For another example, the driving magnet 232 may be disposed at each of the four corner portions of the housing 231. At least a portion of the outer circumferential surface of the housing 231 may be formed in a shape corresponding to the inner circumferential surface of the cover member 210. In particular, the outer circumferential surface of the housing 231 may be formed in a shape corresponding to the inner circumferential surface of the side plate 212 of the cover member 210. The housing 231 may be formed of an insulating material. The housing 231 may be formed of a material different from that of the cover member 210.

[0131] An upper support member 251 may be coupled to an upper portion of the housing 231. A lower support member 252 may be coupled to a lower portion of the housing 231.

[0132] In addition, the housing 231 may have a first sensor unit and / or a second sensor unit disposed therein.

[0133] For example, the first sensor unit 270 may include a sensing magnet 271, a compensation magnet 272, and a first Hall sensor (not shown).

[0134] The drive magnet 232 may be disposed on the housing 231. The drive magnet 232 may be disposed outside the first drive coil 222. The drive magnet 232 may face the first drive coil 222. The drive magnet 232 may electromagnetically interact with the first drive coil 222. The drive magnet 232 may be disposed above the second drive coil 242. The drive magnet 232 may face the second drive coil 242. The drive magnet 232 may electromagnetically interact with the second drive coil 242. The drive magnet 232 may be used in common for the autofocus function and the anti-shake function. However, the drive magnet 232 may include multiple magnets that are used separately for the autofocus function and the anti-shake function. For example, the drive magnet 232 may be disposed on a side of the housing 231. In this case, the drive magnet 232 may be a flat magnet. The drive magnet 232 may have a flat plate shape. As another example, the drive magnet 232 may be disposed at a corner of the housing 231. In this case, the drive magnet 232 may be a corner magnet. The drive magnet 232 may have a hexahedral shape with an inner side wider than an outer side. The drive magnet 232 may include a plurality of magnets spaced apart from one another. The drive magnet 232 may include four magnets spaced apart from one another. In this case, the four magnets may be disposed in the housing 231 such that two adjacent magnets are at 90° angles to one another. That is, the drive magnets 232 may be disposed at equal intervals on the four sides of the housing 231.

[0135] The stator 240 may be disposed below the housing 231. The stator 240 may be disposed below the second armature 230.

[0136] The stator 240 can face the second movable element 230. The stator 240 can movably support the second movable element 230. The stator 240 can move the second movable element 230. At this time, the first movable element 220 can also move together with the second movable element 230.

[0137] The stator 240 may include a second substrate 241, a second drive coil 242, and a holder 243. However, in the stator 240, any one or more of the second substrate 241, the second drive coil 242, and the holder 243 may be omitted or modified. The stator 240 may also be referred to as a second substrate portion.

[0138] The second substrate 241 can supply power to the second drive coil 242. The second substrate 241 can be coupled to the second drive coil 242. The second substrate 241 can be coupled to the base 410 of the filter unit 400, which is disposed below the holder 243. The second substrate 241 can be disposed on the lower surface of the second drive coil 242. The second substrate 241 can be disposed on the upper surface of the holder 243. The second substrate 241 can be disposed between the second drive coil 242 and the holder 243.

[0139] The second substrate 241 may include a flexible printed circuit board (FPCB).

[0140] The second substrate 241 may have different structures or shapes depending on the embodiment.

[0141] First, the second substrate 241 of the first embodiment will be described as follows.

[0142] Referring to FIGS. 7a and 7b, the second substrate 241 may include at least a bent portion.

[0143] For example, the second substrate 241 may include a first region 241-1. The first region 241-1 may be a flat region. The first region 241-1 may be a rigid region. The first region 241-1 of the second substrate 241 may be disposed on the holder 243.

[0144] The first region 241-1 may include an opening 241-11. The opening 241-11 may be aligned with the optical axis of the lens module 100 and the image sensor 320. For example, the opening 241-11 may be formed in the center of the first region 241-1 of the second substrate 241. The opening 241-11 may be formed to penetrate the first region 241-1 of the second substrate 241. The opening 241-11 may allow light that has passed through the lens module 100 to pass through. The opening 241-11 may be formed in a circular shape, but is not limited to this.

[0145] The first region 241-1 of the second substrate 241 may include at least one through hole 241-12. The through hole 241-12 may penetrate the first region 241-1. The through hole 241-12 may include a plurality of through holes. The through holes 241-12 may be formed in corner regions of the upper surface of the first region 241-1 of the second substrate 241. The through holes 241-12 may be through holes through which the second support member 260 passes.

[0146] The second substrate 241 may include a second region bent from the first region 241-1.

[0147] For example, the second substrate 241 may include a second region that is bent at at least one end of the first region 241-1, and the second region may include a plurality of bent regions that are bent at different ends of the first region 241-1.

[0148] The second region of the second substrate 241 may include a first bending region 241-2 bent downward at one end of the first region 241-1, and a second bending region 241-3 bent downward at the other end opposite to the one end of the first region 241-1.

[0149] A second terminal portion may be formed in the second region of the second substrate 241. The second terminal portion may be electrically connected to the first terminal portion 330 of the first substrate 310. For example, the second terminal portion of the second substrate 241 may be electrically connected to the first terminal portion 330 of the first substrate 310 via a connecting pin 500.

[0150] In this case, the second region of the second substrate 241 may be divided into a plurality of sub-regions. For example, the second region of the second substrate 241 may include a first sub-region 241-21 (see FIG. 3) bent from the first region 241-1 and penetrating the holder 243. However, embodiments are not limited thereto. For example, the first sub-region 241-21 of the second region of the second substrate 241 may be disposed on a side of the holder 243 without penetrating the holder 243.

[0151] The second region of the second substrate 241 may include a second sub-region 241-22 (see FIG. 3) bent from the first sub-region 241-21 and disposed under the holder 243. That is, the first sub-region 241-21 may pass through the holder 243 or may be disposed on the side of the holder 243.

[0152] For example, the first bending region 241-2 and the second bending region 241-3 of the second substrate 241 may each include the first sub-region 241-21 and the second sub-region 241-22.

[0153] The second sub-regions 241-22 of the first bending region 241-2 and the second bending region 241-3 may face the first region 241-1. For example, the upper surface of the second sub-regions 241-22 of the first bending region 241-2 and the second bending region 241-3 may face the lower surface of the first region 241-1.

[0154] The second terminal portion of the first embodiment may be disposed on the lower surface of the second sub-region 241-22 of the second region. For example, the second terminal portion may be disposed opposite to the upper surface of the base 410 of the filter unit 400.

[0155] The second terminal portion may include a 2-1 terminal portion 241-2P disposed on a lower surface of the second sub-region of the first bending region 241-2. The 2-1 terminal portion 241-2P may correspond to the 1-1 terminal portion 331 of the first terminal portion 330. Thus, the number of the 2-1 terminal portions 241-2P may correspond to, but is not limited to, the number of the 1-1 terminal portions 331. The 2-1 terminal portion 241-2P may include a plurality of 2-1 terminals connected to a plurality of 1-1 terminals of the 1-1 terminal portion 331 of the first substrate 310.

[0156] The second terminal portion may include a 2-2 terminal portion 241-3P disposed on a lower surface of the second sub-region of the second bending region 241-3. The 2-2 terminal portion 241-3P may correspond to the 1-2 terminal portion 332 of the first terminal portion 330. Thus, the number of the 2-2 terminal portions 241-3P may correspond to, but is not limited to, the number of the 1-2 terminal portions 332. The 2-2 terminal portion 241-3P may include a plurality of 2-2 terminals connected to a plurality of 1-2 terminals of the 1-2 terminal portion 332 of the first substrate 310.

[0157] The second terminal portion of the second substrate 241 may be electrically connected to the first terminal portion 330 of the first substrate 310 by a connecting pin 500, which will be described later.

[0158] Meanwhile, referring to FIG. 8a, a second substrate 241 in another embodiment may have a different structure in the second terminal portion from that in the first embodiment of FIGS. 7a and 7b.

[0159] That is, the second terminal portion may include a plurality of portions.

[0160] For example, the 2-1 terminal portion 241-2P may include multiple portions. Also, the 2-2 terminal portion 241-3P may include multiple portions. The following description will be based on the 2-2 terminal portion 241-3P. The 2-1 terminal portion 241-2P may have the same structure as the 2-2 terminal portion 241-3P described below.

[0161] The second-2 terminal portion 241-3P may include a first portion 241-31P and a second portion 241-32P.

[0162] The first portion 241-31P of the second-2 terminal portion 241-3P may be disposed in the second bending region 241-3 of the second substrate 241. For example, the first portion 241-31P of the second-2 terminal portion 241-3P may be disposed under the second sub-region 241-22 of the second bending region 241-3 of the second substrate 241. The first portion 241-31P of the second-2 terminal portion 241-3P may be a portion that contacts the second connecting portion 503 of the connecting pin 500. For example, the first portion 241-31P of the second-2 terminal portion 241-3P may be a contact terminal that contacts the second connecting portion 503.

[0163] In addition, the second portion 241-32P of the second-2 terminal portion 241-3P may be disposed in the first sub-region 241-21 of the second bending region 241-3 of the second substrate 241. For example, the second portion 241-32P of the second-2 terminal portion 241-3P may be disposed on a side of the first sub-region 241-21. The second portion 241-32P of the second-2 terminal portion 241-3P may be connected to the first portion 241-31P of the second-2 terminal portion 241-3P. That is, the first portion 241-31P and the second portion 241-32P may be a single terminal pattern, which may be divided according to their arrangement positions. The second portion 241-32P of the second-2 terminal portion 241-3P may be exposed to the outside of the camera module. In this case, when the second bending region 241-3 penetrates the holder 243, a side of the holder 243 may include a recess (not shown) that horizontally overlaps the second portion 241-32P of the second-2 terminal portion 241-3P and exposes the second portion 241-3 to the outside of the camera module. The second portion 241-32P of the second-2 terminal portion 241-3P may be used as a test terminal. For example, in order to couple the second substrate 241 of the lens driving device 200 with the filter unit 400 coupled to the first substrate 310 on which the image sensor 320 is mounted, an active alignment (AA) process should be performed to accurately align the focus of the lens of the lens driving device 200 with the image sensor 320. The second portion 241-32P of the 2-2 terminal portion 241-3P may be connected to a gripper during the active alignment process and may be used as a terminal for adjusting the position of the lens driving device 200. After the active alignment process is completed, the second portion 241-32P of the 2-2 terminal portion 241-3P may not be used. After the active alignment process is completed, the second portion 241-32P of the 2-2 terminal portion 241-3P may be covered with another insulating member (not shown). However, the embodiment is not limited thereto.For example, the second portion 241-32P of the 2-2 terminal unit 241-3P may be exposed to the outside of the camera module even after the active alignment process is completed, and the exposed second portion 241-32P may be used as a terminal for testing the contact reliability between the first terminal unit 330 of the first substrate 310 and the second terminal unit of the second substrate 241, which are connected via the connecting pin 500, in the environment in which the camera module is used.

[0164] Meanwhile, referring to FIG. 8b, the second substrate 241 in another embodiment may have a different structure from the first and second embodiments of FIGS. 7a, 7b, and 8a in that it does not include a curved region.

[0165] Specifically, the second substrate 241 may include only the first region 241-1 in the structure of the first embodiment. For example, the second substrate 241 may not include a bending region that is bent downward at an end of the first region 241-1. The second terminal may be disposed on a lower surface of the first region 241-1 of the second substrate 241. In this case, a holder 243 may be disposed under the second substrate 241. Accordingly, the holder 243 may include an opening (not shown) that vertically overlaps with the second terminal disposed on the lower surface of the first region 241-1 of the second substrate 241. At least a portion of the second connecting portion 503 of the connecting pin 500 may be disposed in the opening of the holder 243. Thus, the second connecting portion 503 may contact or be electrically connected to the second terminal disposed on the lower surface of the first region 241-1 of the second substrate 241 through the opening of the holder 243. Meanwhile, the second terminal portion provided on the second substrate 241 of the third embodiment may also include a first portion and a second portion, corresponding to the second embodiment. In this case, the first portion of the second terminal portion may be provided on the lower surface of the first region 241-1, and the second portion of the second terminal portion may be provided on the side surface of the first region 241-1.

[0166] 6 again, the second drive coil 242 may be disposed on the holder 243. The second drive coil 242 may be disposed on the second substrate 241. The second drive coil 242 may be disposed on the upper surface of the second substrate 241. The second drive coil 242 may be disposed below the drive magnet 232. The second drive coil 242 may be disposed between the drive magnet 232 and the holder 243. A second support member 260 may be coupled to the second drive coil 242. The second drive coil 242 may movably support the second mover 230. In this case, although not shown in the drawing, the second drive coil 242 may include a substrate portion and a coil portion disposed on the substrate portion.

[0167] The second drive coil 242 may be supplied with power via the first substrate 310, the connecting pin 500, and the second substrate 241. The second drive coil 242 may face the drive magnet 232. In this case, when a current is supplied to the second drive coil 242 to form a magnetic field around the second drive coil 242, the drive magnet 232 may move relative to the second drive coil 242 due to electromagnetic interaction between the second drive coil 242 and the drive magnet 232. The second drive coil 242 may interact electromagnetically with the drive magnet 232. The second drive coil 242 may move the housing 231 and the bobbin 221 relative to the holder 243 in a direction perpendicular to the optical axis through electromagnetic interaction with the drive magnet 232.

[0168] The first support member 250 may be coupled to the bobbin 221 and the housing 231. The first support member 250 may elastically support the bobbin 221. At least a portion of the first support member 250 may be elastic. In this case, the first support member 250 may be referred to as a "first elastic member." The first support member 250 may movably support the bobbin 221. The first support member 250 may support the bobbin 221 so that it can move in the optical axis direction relative to the housing 231. That is, the first support member 250 may support the bobbin 221 so that it performs AF driving. In this case, the first support member 250 may be referred to as an "AF support member." The first support member 250 may include an upper support member 251 and a lower support member 252. However, in the first support member 250, any one or more of the upper support member 251 and the lower support member 252 may be omitted or modified.

[0169] The upper support member 251 may be disposed above the bobbin 221 and coupled to the bobbin 221 and the housing 231. The upper support member 251 may be coupled to the bobbin 221 and the housing 231. The upper support member 251 may be coupled to the upper part of the bobbin 221 and the upper part of the housing 231. The upper support member 251 may elastically support the bobbin 221. The upper support member 251 may be at least partially elastic. In this case, the upper support member 251 may be referred to as an "upper elastic member." The upper support member 251 may movably support the bobbin 221. The upper support member 251 may support the bobbin 221 so that it can move in the optical axis direction relative to the housing 231. The upper support member 251 may be formed of a leaf spring.

[0170] The lower support member 252 may be disposed below the bobbin 221 and coupled to the bobbin 221 and the housing 231. The lower support member 252 may be coupled to the bobbin 221 and the housing 231. The lower support member 252 may be coupled to the lower part of the bobbin 221 and the lower part of the housing 231. The lower support member 252 may elastically support the bobbin 221. The lower support member 252 may be at least partially elastic. In this case, the lower support member 252 may be referred to as a "lower elastic member." The lower support member 252 may movably support the bobbin 221. The lower support member 252 may support the bobbin 221 so that it can move in the optical axis direction relative to the housing 231. The lower support member 252 may be formed of a leaf spring.

[0171] The second support member 260 can movably support the housing 231. The second support member 260 can elastically support the housing 231. At least a portion of the second support member 260 can be elastic. In this case, the second support member 260 can be referred to as a "second elastic member." As an example, the second support member 260 can support the housing 231 movably in a direction perpendicular to the optical axis relative to the stator 240. In this case, the bobbin 221 can move integrally with the housing 231. As another example, the second support member 260 can support the housing 231 tiltably relative to the stator 240. In other words, the second support member 260 can support the housing 231 and the bobbin 221 so as to drive the OIS. In this case, the second support member 260 can be referred to as an "OIS support member." As an example, the second support member 260 can be formed of a wire.

[0172] The first sensor unit 270 may be provided for autofocus feedback. The first sensor unit 270 may sense the movement of the bobbin 221 in the optical axis direction. The first sensor unit 270 may sense the amount of movement of the bobbin 221 in the optical axis direction and provide the amount of movement to the first element 340 in real time. The first sensor unit 270 may include a first Hall sensor (not shown), a sensing magnet 271, and a compensation magnet 272.

[0173] The camera module may further include a second sensor unit (not shown). The second sensor unit may include a second Hall sensor. The second sensor unit may be provided for image stabilization feedback. In this case, the second sensor unit may be referred to as an "OIS feedback sensor." The second sensor unit may sense movement of the housing 231. The second sensor unit may sense movement or tilt of the housing 231 and / or the bobbin 221 in a direction perpendicular to the optical axis. The second sensor unit may sense the drive magnet 232. The second sensor unit may sense the drive magnet 232 disposed in the housing 231. The second sensor unit may sense the position of the housing 231. The second sensor unit may sense the amount of movement of the housing 231 in a direction perpendicular to the optical axis.

[0174] The lens driving device 200 may further include a third substrate 280. The third substrate 280 may be electrically connected to the second substrate 241. For example, the third substrate 280 may be electrically connected to the first driving coil 222. The third substrate 280 may supply power to the first driving coil 222. In this case, the third substrate 280 may be electrically connected to at least one of the first supporting member 250 and the second supporting member 260. Thus, power provided to the third substrate 280 from the second substrate 241 may be supplied to the first driving coil 222 via at least one of the first supporting member 250 and the second supporting member 260.

[0175] As described above, the lens driving device 200 may include the second substrate 241. In addition, the second terminal portion of the second substrate 241 may be disposed opposite to the upper surface of the base 410 of the filter unit 400, which will be described later.

[0176] Meanwhile, the overall configuration of the filter section 400 will be described with reference to FIGS.

[0177] 9 to 12, the filter unit 400 may include a base 410, an infrared filter 420, and an adhesive member 430.

[0178] The base 410 may be disposed below the lens driving device 200. For example, at least a portion of an upper surface of the base 410 may be disposed directly opposite to at least a portion of the second substrate 241. Preferably, at least a portion of the upper surface of the base 410 may be disposed directly opposite to a lower surface of the second sub-region 241-22 of the second region of the second substrate 241.

[0179] The base 410 may include a through hole 411. The base 410 may have a seat 412 formed around the through hole 411.

[0180] In addition, an adhesive member 430 may be disposed on the upper surface of the base 410. The adhesive member 430 may be used to attach the lens driving device 200 to the base 410. Preferably, the adhesive member 430 may be used to attach the holder 243 of the lens driving device 200 to the base 410.

[0181] Also, an adhesive may be applied to the mounting portion 412 of the base 410. Through this, the infrared filter 420 may be disposed on the mounting portion 412 of the base 410. The mounting portion 412 may have the shape of a recess, a cavity, or a hole recessed from the upper surface of the base 410, but is not limited thereto. For example, the mounting portion 412 may be a protrusion protruding from the upper surface of the base 410. For example, the mounting portion 412 of the base 410 may refer to a stepped portion provided on the upper surface of the base 410 corresponding to an area where the infrared filter 420 is disposed.

[0182] The seat 412 of the base 410 may function to prevent the lower end of the lens module 100 from contacting or colliding with the infrared filter 420 .

[0183] At this time, the mounting portion 412 may be formed along the side of the infrared filter 420. For example, the mounting portion 412 may be formed to surround the side of the infrared filter 420.

[0184] The shape of the mounting portion 412 as viewed from above may be, but is not limited to, the same as the shape of the infrared filter 420. In other embodiments, the shape of the mounting portion 412 may be similar to or different from the shape of the infrared filter 420.

[0185] The through-hole 411 of the base 410 allows light passing through the infrared filter 420 to be incident on the image sensor 320. The through-hole 411 may pass through the center of the base 410. The area of ​​the through-hole 411 may be smaller than the area of ​​the infrared filter 420.

[0186] The base 410 is disposed on the first substrate 310 of the driving substrate unit 300. The base 410 may accommodate an infrared filter 420 therein. The base 410 may also support the lens driving device 200 located thereon.

[0187] In addition, the base 410 may support a connecting pin 500 that electrically connects the first substrate 310 and the second substrate 241. That is, the base 410 may fix the connecting pin 500.

[0188] To this end, the base 410 may include an insertion hole 415. The insertion hole 415 may be a through-hole that penetrates the base 410. The insertion hole 415 may be aligned with the optical axis of the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241 in the base 410.

[0189] The insertion hole 415 may include a first insertion hole 415-1 corresponding to the 1-1 terminal portion 331 of the first terminal portion 330 and the 2-1 terminal portion 241-2P of the second terminal portion.

[0190] The insertion hole 415 may include a second insertion hole 415-2 corresponding to the 1-2 terminal portion 332 of the first terminal portion 330 and the 2-2 terminal portion 241-3P of the second terminal portion.

[0191] The first insertion hole 415-1 and the second insertion hole 415-2 may be spaced apart from the outer end of the base 410. For example, the first insertion hole 415-1 and the second insertion hole 415-2 may penetrate the base 410 at a position spaced apart from the outer end of the base 410.

[0192] Meanwhile, the number of the first insertion holes 415-1 may correspond to the number of the 1-1 terminal portions 331 and the 2-1 terminal portions 241-2P. Also, the number of the second insertion holes 415-2 may correspond to the number of the 1-2 terminal portions 332 and the 2-2 terminal portions 241-3P.

[0193] A connecting pin 500 may be inserted into the insertion hole 415 of the base 410. The connecting pin 500 may be coupled to the base 410. The connecting pin 500 may be fixed in a state where it is inserted into the insertion hole 415 of the base 410.

[0194] The connecting pin 500 may include a plurality of first connecting pins 510 inserted into the first insertion holes 415-1, and a plurality of second connecting pins 520 inserted into the second insertion holes 415-2.

[0195] The connecting pin 500 is disposed on the base 410 and can electrically connect the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241 .

[0196] The first connecting pin 510 may electrically connect the 1-1 terminal portion 331 and the 2-1 terminal portion 241-2P. For example, one end of the first connecting pin 510 may directly contact the 1-1 terminal portion 331, and the other end may directly contact the 2-1 terminal portion 241-2P. The number of the first connecting pins 510 may correspond to the number of terminals of the 1-1 terminal portion 331 and the 2-1 terminal portion 241-2P.

[0197] The second connecting pin 520 may electrically connect the first-2 terminal portion 332 and the second-2 terminal portion 241-3P. For example, one end of the second connecting pin 520 may be in direct contact with the first-2 terminal portion 332, and the other end may be in direct contact with the second-2 terminal portion 241-3P. The number of the second connecting pins 520 may correspond to the number of terminals of the first-2 terminal portion 332 and the second-2 terminal portion 241-3P.

[0198] To this end, the connecting pin 500 including the first connecting pin 510 and the second connecting pin 520 may include a main body 501. The main body 501 of the connecting pin 500 may penetrate the base 410. For example, the main body 501 of the connecting pin 500 may be inserted into and fixed in an insertion hole 415 of the base 410.

[0199] Furthermore, the connecting pin 500 may include a connecting portion disposed within the main body 501. For example, the connecting pin 500 may include a connecting portion protruding from the main body 501.

[0200] For example, the connecting pin 500 may include a first connecting portion 502 protruding downward from the main body 501. The first connecting portion 502 may be disposed to protrude downward from the base 410 when the main body 501 is inserted into the insertion hole 415 of the base 410. The first connecting portion 502 may be electrically connected to the first terminal portion 330 of the first substrate 310.

[0201] For example, the connecting pin 500 may include a second connecting portion 503 protruding upward from the main body 501. The second connecting portion 503 may protrude upward from the base 410 when the main body 501 is inserted into the insertion hole 415 of the base 410. The second connecting portion 503 may be electrically connected to a second terminal portion of the second board 241.

[0202] In this case, the connecting pin 500 may have different structures depending on the embodiment. That is, the connecting pin 500 may include a first connecting portion 502 and a second connecting portion 503. In this case, in one embodiment, the first connecting portion 502 and the second connecting portion 503 may have elasticity. In another embodiment, the first connecting portion 502 may not have elasticity, and the second connecting portion 503 may have elasticity. In yet another embodiment, both the first connecting portion 502 and the second connecting portion 503 may not have elasticity. This will be described in detail as follows.

[0203] 10a, the connecting pin 500 of the first embodiment may include an elastic means (not shown). The elastic means may be disposed within the body 501 of the connecting pin 500. As a result, the first connecting portion 502 and the second connecting portion 503 may be pressed into the body 501 by the elastic means. As a result, the first connecting portion 502 and the second connecting portion 503 may be firmly coupled to the first terminal portion 330 and the second terminal portion.

[0204] 10a(a), the first connecting portion 502 and the second connecting portion 503 may protrude from the body 501 of the connecting pin 500 by a first height when not in contact with the first terminal portion 330 and the second terminal portion. As shown in FIG. 10a(b), the first connecting portion 502 and the second connecting portion 503 may be pressed by the elastic means when in contact with the first terminal portion 330 and the second terminal portion, and may have a second height that is lower than the first height. Thus, in this embodiment, the first connecting portion 502 and the second connecting portion 503 may be firmly coupled to the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241, respectively, due to the pressure from the elastic means.

[0205] 10b, the connecting pin 500 of the second embodiment may have an elastic means in only one of the connecting portions. Preferably, the first connecting portion 502 of the connecting pin 500 may not have an elastic means. The second connecting portion 503 of the connecting pin 500 may have an elastic means.

[0206] 10b (a) and (b), the height of the first connecting portion 502 of the connecting pin 500 may be constant both when in contact with and out of contact with the first terminal portion 330 of the first substrate 310. For example, in the second embodiment, the body 501 and the first connecting portion 502 of the connecting pin 500 may be integrally formed. The second connecting portion 503 of the connecting pin 500 may protrude to a first height when not in contact with the second terminal portion of the second substrate 241, and may protrude to a second height lower than the first height when in contact with the second terminal portion. That is, when the first connecting portion 502 and the first terminal portion 330 of the first substrate 310 are coupled together, adjustment of the coupling position therebetween may not be necessary. Therefore, the first connecting portion 502 may not be provided with an elastic member. However, when the second connecting portion 503 and the second terminal portion of the second substrate 241 are coupled together, adjustment of the coupling position therebetween may be necessary through an active alignment process. Therefore, the second connecting unit 503 may be provided with an elastic means, thereby improving the efficiency of the active alignment process. In this case, if the first connecting unit 502 is not provided with an elastic means, the planar shape of the first connecting unit 502 may correspond to the planar shape of the first terminal unit 330 in order to improve the coupling reliability between the first connecting unit 502 and the first terminal unit 330 of the first substrate 310. Furthermore, the first terminal unit 330 may have a bend in the vertical and / or horizontal directions, which will be described in more detail below.

[0207] 10c, the connecting pin 500 of the third embodiment does not necessarily have to be provided with the elastic means at all of the connecting portions. Preferably, the first connecting portion 502 and the second connecting portion 503 of the connecting pin 500 do not necessarily have to be provided with the elastic means.

[0208] 10c (a) and (b), the height of the first connecting portion 502 of the connecting pin 500 may be the same whether it is in contact with or not in contact with the first terminal portion 330 of the first substrate 310. For example, in the third embodiment, the main body 501 and the first connecting portion 502 of the connecting pin 500 may be integrally formed. And, the height of the second connecting portion 503 may be the same whether it is in contact with or not in contact with the second terminal portion of the second substrate 241. For example, in the third embodiment, the main body 501 and the second connecting portion 503 of the connecting pin 500 may be integrally formed.

[0209] That is, there may be no need to adjust the coupling position between the first connecting portion 502 and the first terminal portion 330 of the first substrate 310 when they are coupled together. Furthermore, in the case of a normal autofocusing camera module that does not require an active alignment process, the second connecting portion 503 coupled to the second terminal portion of the second substrate 241 may not also be provided with an elastic means.

[0210] As described above, the first substrate 310 and the second substrate 241 of this embodiment are electrically connected using the connecting pin 500, rather than a separate soldering process.

[0211] For this purpose, the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241 may be aligned with the optical axis. For example, the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241 may be aligned with the optical axis with the connecting pin 500 sandwiched therebetween.

[0212] Meanwhile, a process of electrically connecting the first substrate 310 and the second substrate 241 using the connecting pin 500 will be briefly described as follows.

[0213] First, the image sensor 320 may be attached to the first substrate 310. Then, the base 410 having the connecting pin 500 may be disposed on the first terminal portion 330 of the first substrate 310. At this time, an adhesive such as epoxy may be applied to the first terminal portion 330 of the first substrate 310 while the first connecting portion 502 of the connecting pin 500 is in contact with the first terminal portion 330 of the first substrate 310. Through this, the first substrate 310 and the base 410 may be bonded to each other.

[0214] Then, the second substrate 241 may be placed on the base 410. Then, an adhesive such as epoxy may be applied to the second terminal portion of the second substrate 241 with the second connecting portion 503 of the connecting pin 500 connected to the second terminal portion of the second substrate 241. At this time, an active alignment process may be performed according to the embodiment before applying the adhesive. Then, the second substrate 241 of the lens driving device 200 may be bonded to the base 410 using the applied adhesive.

[0215] As a result, the embodiment can omit the soldering process for electrically connecting the first terminal portion and the second terminal portion. As a result, the embodiment can solve the problems of electrical reliability and physical reliability that occur during the soldering process. Furthermore, the embodiment can solve the problem of cracks occurring at the points where the soldering process is performed due to various factors.

[0216] Meanwhile, the base 410 of the filter unit 400 may have different shapes or structures depending on the embodiment.

[0217] 9 and 11, the base 410 of the first embodiment may include an area where the insertion hole 415 is formed and its surrounding area. The area of ​​the base 410 where the insertion hole 415 is formed and its surrounding area may be located on the same plane. For example, the area of ​​the base 410 where the insertion hole 415 is formed and its surrounding area may not have a step. This may further improve the strength of the base 410. Therefore, the embodiment may minimize distortion of the base 410 in a usage environment of a camera module. Furthermore, the embodiment may minimize deformation of the base 410 due to physical impact and / or thermal stress acting on the base 410 in a usage environment of a camera module.

[0218] 13a, the base 410 may include a recess 413. For example, the base 410 may have the recess 413 in a peripheral region where the insertion hole 415 is formed. The recess 413 may also be a recess that is recessed from the upper surface of the base 410 toward the lower surface of the base 410. The recess 413 may be formed to surround the region where the insertion hole 415 is disposed.

[0219] Specifically, the insertion hole 415 may include a first insertion hole 415-1 and a second insertion hole 415-2. The recess 413 may include a first part 413-1 provided around the first insertion hole 415-1. The recess 413 may also include a second part 413-2 that is not connected to the first part 413-1 and is provided around the second insertion hole 415-2.

[0220] 13A shows that the recess 413 is provided only on the upper surface of the base 410, but this is not limiting. Preferably, the recess 413 may include a first recess provided on the lower surface of the base 410 and a second recess provided on the upper surface of the base 410. This can improve the efficiency of epoxy application through the first recess when bonding with the first substrate 310. Furthermore, the efficiency of epoxy application can be improved by using the second recess when bonding with the second substrate 241.

[0221] In this case, the recess 413 formed in the base 410 of the second embodiment may be connected to the outer surface of the base 410. For example, the recess 413 may be exposed to a side of the base 410. Accordingly, in the second embodiment, an epoxy side sealing process may be performed in which an adhesive material such as epoxy is applied to the recess 413 exposed through the side of the base 410 while the base 410 is disposed on the first substrate 310. For example, while the first connecting portion 502 of the connecting pin 500 penetrating the base 410 is disposed on the first substrate 310, side sealing may be performed on the side of the base 410, and epoxy may be filled into the first recess. Furthermore, while the second substrate 241 is disposed on the second connecting portion 503 of the connecting pin 500 penetrating the base 410, epoxy may be filled into the second recess. In this manner, in this embodiment, the recess 413 may be filled with an adhesive material such as epoxy. In this case, the recess 413 can function as a dam to prevent the epoxy from overflowing into areas other than the area where the insertion hole 415 is located (e.g., the area where the through hole 411 is provided) while allowing the epoxy to be applied during the side sealing process.

[0222] 13b, unlike the base of the second embodiment, the recess 413 provided in the base 410 may not be connected to the outer surface of the base 410. For example, the recess 413 may be spaced apart from the outer surface of the base 410. The recess 413 may also function as a dam to prevent the epoxy from overflowing in all directions.

[0223] 13b, the recess 413 may be partially connected to the outer surface of the base 410, rather than being entirely connected to the outer surface of the base 410. In this case, overflow of the epoxy filled in the recess can be minimized, and gas generated when the epoxy hardens can be easily discharged to the outside.

[0224] Meanwhile, the base 410 may be formed of multiple layers. The recess 413 may be formed by processing one of the multiple layers. However, the embodiment is not limited thereto. The base 410 may be formed of a single layer, or the single-layer base 410 may be processed to form the recess 413 that does not penetrate the base.

[0225] Meanwhile, the connecting pin 500, the first terminal portion 330 of the first substrate 310, and the second terminal portion 241P of the second substrate 241 may have various structures.

[0226] For example, referring to FIG. 14a, the first connecting portion 502 of the connecting pin 500 and the first terminal portion 330 of the first substrate 310 of the first embodiment include a contact portion that contacts with each other, and the contact portion may be flat.

[0227] The surface (e.g., the lower surface) of the first connecting portion 502 of the connecting pin 500 that contacts the first terminal portion 330 may be flat. The surface (e.g., the upper surface) of the first terminal portion 330 that contacts the first connecting portion 502 may also be flat corresponding to the first connecting portion 502.

[0228] Meanwhile, the second connecting portion 503 of the connecting pin 500 and the second terminal portion 241P of the second board 241 may include a contact portion that contacts with each other.

[0229] The surface (e.g., upper surface) of the second connecting portion 503 of the connecting pin 500 that contacts the second terminal portion 241P may be flat. The surface (e.g., lower surface) of the second terminal portion 241P that contacts the second connecting portion 503 may also be flat corresponding to the second connecting portion 503.

[0230] Meanwhile, referring to FIG. 14b, in the second embodiment, the first connecting portion 502 of the connecting pin 500 and the first terminal portion 330 of the first substrate 310 may include a contact portion that contacts with each other, and the contact portion may be concave or convex.

[0231] The surface (e.g., the lower surface) of the first connecting portion 502 of the connecting pin 500, which contacts the first terminal portion 330, may include a convex portion that is convex toward the first terminal portion 330. The surface (e.g., the upper surface) of the first terminal portion 330, which contacts the first connecting portion 502, may include a concave portion that is concave toward the inside of the first terminal portion 330, corresponding to the convex portion of the first connecting portion 502. When the first substrate 310 and the base 410 are coupled together, the convex portion of the first connecting portion 502 may be inserted into the concave portion of the first terminal portion 330. This prevents misalignment between the first terminal portion 330 and the first connecting portion 502 during the coupling process of the first connecting portion 502 and the first terminal portion 330. This improves the coupling reliability between the first terminal portion 330 and the first connecting portion 502.

[0232] Meanwhile, the second connecting portion 503 of the connecting pin 500 and the second terminal portion 241P of the second board 241 may include a contact portion that contacts with each other.

[0233] The surface (e.g., upper surface) of the second connecting portion 503 of the connecting pin 500, which contacts the second terminal portion 241P, may include a convex portion that is convex toward the second terminal portion 241P. The surface (e.g., lower surface) of the second terminal portion 241P, which contacts the second connecting portion 503, may include a concave portion that is concave toward the inside of the second terminal portion 241P, corresponding to the convex portion of the second connecting portion 503. When the second substrate 241 and the base 410 are coupled together, the convex portion of the second connecting portion 503 may be inserted into the concave portion of the second terminal portion 241P.

[0234] In this case, the width of the convex portion of the second connection portion 503 may be different from the width of the concave portion of the second terminal portion 241P. Preferably, the width of the convex portion of the second connection portion 503 may be smaller than the width of the concave portion of the second terminal portion 241P. Thus, in this embodiment, the position of the second connection portion 503 may be moved while the convex portion of the second connection portion 503 is inserted into the concave portion of the second terminal portion 241P. Thus, in this embodiment, an active alignment process may be easily performed.

[0235] Meanwhile, referring to FIG. 14c, in the third embodiment, the first connecting portion 502 of the connecting pin 500 and the first terminal portion 330 of the first substrate 310 may include a contact portion that contacts with each other, and the contact portion may be concave or convex.

[0236] The surface (e.g., the lower surface) of the first connecting portion 502 of the connecting pin 500, which contacts the first terminal portion 330, may include a recessed portion recessed inward (e.g., toward the main body 501). The surface (e.g., the upper surface) of the first terminal portion 330, which contacts the first connecting portion 502, may include a protruding portion protruding toward the first connecting portion 502, corresponding to the recessed portion of the first connecting portion 502. When the first substrate 310 and the base 410 are coupled together, the recessed portion of the first connecting portion 502 may be inserted into the protruding portion of the first terminal portion 330. This prevents misalignment between the first terminal portion 330 and the first connecting portion 502 during the coupling process between the first terminal portion 330 and the first connecting portion 502. This improves the coupling reliability between the first terminal portion 330 and the first connecting portion 502.

[0237] Meanwhile, the second connecting portion 503 of the connecting pin 500 and the second terminal portion 241P of the second board 241 may include a contact portion that contacts with each other.

[0238] The surface (e.g., upper surface) of the second connecting portion 503 of the connecting pin 500, which comes into contact with the second terminal portion 241P, may include a recessed portion recessed inward (e.g., toward the main body 501). The surface (e.g., lower surface) of the second terminal portion 241P, which comes into contact with the second connecting portion 503, may include a protruding portion protruding toward the second connecting portion 503, corresponding to the recessed portion of the second connecting portion 503. When the second substrate 241 and the base 410 are coupled together, the recessed portion of the second connecting portion 503 may be inserted into the protruding portion of the second terminal portion 241P.

[0239] In this case, the width of the recessed portion of the second connection portion 503 may be different from the width of the protruding portion of the second terminal portion 241P. Preferably, the width of the recessed portion of the second connection portion 503 may be greater than the width of the protruding portion of the second terminal portion 241P. Thus, in this embodiment, the position of the second connection portion 503 may be moved while the protruding portion of the second terminal portion 241P is inserted into the recessed portion of the second connection portion 503. Thus, in this embodiment, an active alignment process may be easily performed.

[0240] Meanwhile, the connecting pin 500, the first terminal portion 330, and the second terminal portion 241P of the embodiment may be realized by combining the structures shown in FIGS. 14a to 14c.

[0241] For example, the first connecting portion 502 and the first terminal portion 330 may have the structure shown in FIG. 14a, and the second connecting portion 503 and the second terminal portion 241P may have the structure shown in FIG. 14b or FIG. 14c.

[0242] For example, the first connecting portion 502 and the first terminal portion 330 may have the structure shown in FIG. 14b, and the second connecting portion 503 and the second terminal portion 241P may have the structure shown in FIG. 14a or FIG. 14c.

[0243] For example, the first connecting portion 502 and the first terminal portion 330 may have the structure shown in FIG. 14c, and the second connecting portion 503 and the second terminal portion 241P may have the structure shown in FIG. 14a or 14b.

[0244] Meanwhile, the embodiment can ensure the flatness of the base 410 compared to the comparative example, and thus the flatness of the infrared filter 420 seated on the base 410 can be ensured.

[0245] That is, with the recent technological development of camera modules, the size of the image sensor 320 has increased, and accordingly, the size of the infrared filter 420 has also increased.

[0246] As shown in FIG. 15 , the base 410a of the comparative camera module includes a first opening 410b through which an infrared filter is disposed and second openings 410c and 410d through which the second substrate of the lens driver passes. The base 410a of the comparative example had to have the second openings 410c and 410d formed in the area corresponding to the second substrate for soldering between the first and second substrates. This reduces the strength of the base 410a of the comparative example by the area corresponding to the second openings 410c and 410d. This reduces the flatness of the base 410a, which in turn reduces the flatness of the infrared filter. Furthermore, the camera module of the comparative example required space to be secured for the soldering process between the first and second substrates.

[0247] In contrast, the base 410 of the embodiment can eliminate the second openings 410c and 410d of the comparative example, thereby improving the strength of the base 410. As a result, the camera module of the embodiment can improve the flatness of the base 410 and further improve the flatness of the infrared filter 420.

[0248] In addition, in the base of the comparative example, the second openings 410c and 410d positioned the outer edge of the first terminal portion of the first substrate further outward than the outer edge of the base. In other words, in the camera module of the comparative example, the first terminal portion of the first substrate did not overlap with the base in the optical direction. However, the first terminal portion of the first substrate of the camera module of the comparative example overlapped with the second openings 410c and 410d of the base in the optical axis.

[0249] In contrast, in the embodiment, the outer end of the base 410 may be disposed further outward than the outer end of the first terminal unit 330. Thus, the insertion hole 415 of the base 410 is disposed at a position spaced apart from the outer end of the base 410, and the first terminal unit 330 and the insertion hole 415 overlap with the optical axis. Thus, the outer end of the base 410 may be disposed further outward than the outer end of the first terminal unit 330. In other words, at least a portion of the first terminal unit 330 may overlap with the base 410 on the optical axis. In other words, the peripheral region of the first terminal unit 330 of the first substrate 310 overlaps with the base 410 on the optical axis.

[0250] 16(a), in the camera module of the comparative example, the soldering process between the first substrate 310a and the second substrate 241a is performed outside the cover member 210a. As a result, the solder parts SB that electrically connect the first substrate 310a and the second substrate 241a are disposed outside the cover member 210a of the camera module. Therefore, in the camera module of the comparative example, the solder parts SB are exposed to the outside in the usage environment, which may cause problems with electrical reliability and physical reliability.

[0251] In contrast, as shown in FIG. 16(b), the camera module of the embodiment electrically connects the first substrate 310 and the second substrate 241 using a connecting pin 500.

[0252] As a result, in the embodiment, the contact point where the first terminal unit 330 of the first substrate 310 and the second terminal unit 241 are connected to each other may be located inside the camera module. Therefore, the embodiment may protect the contact point from various factors. As a result, the embodiment may improve electrical connectivity between the first substrate 310 and the second substrate 241. Furthermore, the embodiment may improve operational reliability of the camera module.

[0253] FIG. 17 shows a mobile terminal to which the camera module according to the embodiment is applied.

[0254] 17, the mobile terminal 1500 of the embodiment may include a camera module 1000, a flash module 1530, and an autofocus device 1510 provided on the rear surface. The mobile terminal 1500 of the embodiment may further include a second camera module 1100.

[0255] The camera module 1000 may include an image capture function and an autofocus function. For example, the camera module 1000 may include an image-based autofocus function. The camera module 1000 may be the camera module shown in FIG. 1.

[0256] The camera module 1000 processes still or moving image frames acquired by an image sensor in a photographing mode or a video call mode. The processed image frames may be displayed on a predetermined display unit or stored in a memory. A camera (not shown) may also be disposed on the front of the mobile terminal body.

[0257] For example, the camera module 1000 may include a first camera module and a second camera module, and the first camera module may be capable of implementing OIS along with an AF or zoom function.

[0258] The flash module 1530 may include a light emitting element therein, and may be activated by a camera operation of the mobile terminal or by a user control.

[0259] The autofocus device 1510 may include one of a surface emitting laser device package as a light emitting unit.

[0260] The autofocus device 1510 may include an autofocus function using a laser. The autofocus device 1510 may be used primarily under conditions where the autofocus function using the image of the camera module 1000 is degraded, such as close proximity of 10 m or less or in dark environments. The autofocus device 1510 may include a light-emitting unit including a vertical cavity surface-emitting laser (VCSEL) semiconductor element and a light-receiving unit such as a photodiode that converts optical energy into electrical energy.

[0261] FIG. 18 is a perspective view of a vehicle to which a camera module according to an embodiment is applied.

[0262] For example, FIG. 18 is an external view of a vehicle equipped with a vehicle driving assistance device to which a camera module according to an embodiment is applied.

[0263] 18, the vehicle 700 of the embodiment may include wheels 13FL and 13FR that are rotated by a power source, and a predetermined sensor. The sensor may be, but is not limited to, a camera sensor 2000.

[0264] The camera 2000 may be a camera sensor to which the camera module 1000 according to the embodiment is applied.

[0265] The vehicle 700 of the embodiment can acquire image information through a camera sensor 2000 that captures forward or peripheral images, and can use the image information to determine whether lanes are unidentified and generate virtual lanes when lanes are unidentified.

[0266] For example, the camera sensor 2000 can capture a front image of the vehicle 700, and a processor (not shown) can analyze objects included in the front image to obtain image information.

[0267] For example, if the image captured by the camera sensor 2000 includes objects such as lanes, adjacent vehicles, obstacles, and objects that are indicative of roads on indirect roads, such as medians, curbs, and roadside trees, the processor can detect such objects and include them in the image information.

[0268] At this time, the processor may further complement the image information by acquiring distance information to the object detected through the camera sensor 2000. The image information may be information about the object captured in the image.

[0269] The camera sensor 2000 may include an image sensor and an image processing module. The camera sensor 2000 may process still or moving images acquired by an image sensor (e.g., a CMOS or CCD). The image processing module may process the still or moving images acquired through the image sensor to extract necessary information and transmit the extracted information to a processor.

[0270] In this case, the camera sensor 2000 may include, but is not limited to, a stereo camera to improve the accuracy of measuring the object and further secure information such as the distance between the vehicle 700 and the object.

[0271] The example vehicle 700 is capable of providing advanced driver assistance systems (ADAS).

[0272] For example, cutting-edge driver assistance systems (ADAS) include Autonomous Emergency Braking (AEB), an automatic emergency braking system that automatically slows down or stops the vehicle without the driver having to brake when there is a risk of a collision; Lane Keep Assist System (LKAS), a driving and steering assistance system that adjusts the direction of travel when the vehicle deviates from its lane to stay in its lane; Advanced Smart Cruise Control (ASCC), which detects and maintains a predetermined distance from the vehicle in front while driving at a predetermined speed; Active Blind Spot Detection (ABSD), a rear collision avoidance assistance system that detects the risk of a collision in a blind spot and helps the driver change lanes safely; and Around View Monitor (AVM), an around-view monitoring system that visually displays the situation around the vehicle.

[0273] In such advanced driver assistance systems (ADAS), camera modules function as core components along with radars, and the proportion of applications for camera modules is gradually expanding.

[0274] For example, an automatic emergency braking system (AEB) uses a front camera sensor and radar sensor to detect vehicles or pedestrians ahead and automatically applies emergency braking when the driver does not control the vehicle. A driving steer assist system (LKAS) uses a camera sensor to detect when the driver is leaving the road without giving any input, such as a turn signal, and automatically steers the steering wheel to keep the vehicle on the road. An around-view monitoring system (AVM) also uses camera sensors located on all four sides of the vehicle to provide a visual display of the situation around the vehicle.

[0275] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person skilled in the art to which the embodiment belongs. Therefore, content related to such combinations and modifications should be interpreted as being included in the scope of the embodiments.

[0276] The above description focuses on the embodiments, but these are merely illustrative and do not limit the embodiments. Those skilled in the art will recognize that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically illustrated in the embodiments can be modified and implemented. Such modifications and differences related to applications should be construed as being included within the scope of the embodiments defined in the accompanying claims.

Claims

1. a first substrate including a first terminal portion; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device including a second substrate disposed on the base and having a second terminal portion; a connecting pin passing through the base, One end of the connecting pin contacts the first terminal portion, and the other end of the connecting pin contacts the second terminal portion.

2. The connecting pin is a body that penetrates the base; a first connecting portion protruding downward from the main body and having the one end in contact with the first terminal portion; The camera module according to claim 1 , further comprising: a second connecting portion that protrudes upward from the main body and has the other end that contacts the second terminal portion.

3. The camera module of claim 2 , wherein at least one of the first connecting portion and the second connecting portion has elasticity.

4. the base includes an insertion hole into which the body of the connecting pin is inserted, The camera module according to claim 2 , wherein the insertion hole penetrates the base at a position spaced apart from an outer edge of the base.

5. The base is a first region including the insertion hole; a second region adjacent to the first region, The camera module according to claim 4 , wherein the first area and the second area have no step.

6. The base is a first region including the insertion hole; a second region adjacent to the first region, The camera module according to claim 4 , wherein the first area and the second area have a step.

7. The first region of the base is provided with a recess corresponding to the step, The recess is a first recess provided on one surface of the base, in which a first adhesive member is disposed to connect the first connecting portion and the first terminal portion; 7. The camera module of claim 6, further comprising: a second recess provided on another surface of the base opposite to the one surface, in which a second adhesive member for connecting the second connection portion and the second terminal portion is disposed.

8. the lens driving device includes a driving coil disposed on the second substrate; the second terminal portion includes a plurality of second terminals, The camera module of claim 3 , wherein at least one of the second terminals is electrically connected to the driving coil.

9. The lens driving device a mover that moves relative to the second substrate and includes a sensor unit; The camera module of claim 8 , wherein at least one of the second terminals includes a terminal electrically connected to the sensor unit.

10. the first terminal portion and the second terminal portion overlap in the optical axis direction, the insertion hole is aligned with the first terminal portion and the second terminal portion in the optical axis direction; The camera module according to claim 8 , wherein a peripheral region of the upper surface of the first substrate adjacent to the first terminal portion overlaps with the base in the optical axis direction.

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