Door opening detection sensor

Abstract

To provide a door opening detection sensor capable of enhancing detection accuracy of an opening history of a door.SOLUTION: The door opening detection sensor detects opening of a door that can be opened and closed with respect to an object to be moved. A door opening detection sensor includes a base material stuck across an object to be moved and a door, an antenna for radio communication provided on the base material, and an IC chip electrically connected to the antenna. The base material has a first sticking part and a second sticking part stuck to the door and the object to be moved by the adhesive layer, respectively. The door opening detection sensor detects the opening of the door based on the influence on the radio communication caused by the breakage of the base material accompanying the separation of the first attachment part and the second attachment part by the opening operation of the door.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a door opening detection sensor. [Background technology]

[0002] A system has been proposed that uses an RFID tag to detect the open / closed state of a door (see, for example, Patent Document 1). This system includes an RFID tag installed on the side edge surface of the door and a reader that can communicate with the RFID tag. This system can determine whether the door is open or closed based on whether the reader can communicate with the RFID tag. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-218766 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in this system, the accuracy of detecting the door opening history can be low.

[0005] An object of one aspect of the present invention is to provide a door-opening detection sensor that can improve the accuracy of detecting the door opening history. [Means for solving the problem]

[0006] One aspect of the present invention provides a door-opening detection sensor that detects the opening of a door that can be opened and closed relative to an object to be operated, comprising: a substrate that is attached across the object to be operated and the door; an antenna for wireless communication provided on the substrate; and an IC chip electrically connected to the antenna, wherein the substrate has a first adhesive portion and a second adhesive portion that are attached to the door and the object to be operated, respectively, by an adhesive layer, and the door-opening detection sensor detects the opening of the door based on the effect on the wireless communication caused by the substrate breaking as the first adhesive portion and the second adhesive portion separate when the door is opened.

[0007] It is preferable that the door open detection sensor further includes a detection wiring electrically connected to the IC chip, and detects the opening of the door based on the effect on the wireless communication caused by the detection wiring being disconnected due to the breakage of the base material.

[0008] The door-opening detection sensor preferably detects the opening of the door based on the effect on the wireless communication caused by the breakage of the antenna due to the breakage of the base material.

[0009] It is preferable that the base material of the door open detection sensor has a notch formed therein to promote breaking.

[0010] The door opening detection sensor may be configured such that the adhesive layer formed on one of the first adhesive portion and the second adhesive portion and the adhesive layer formed on the other of the first adhesive portion and the second adhesive portion are formed on different sides of the base material.

[0011] One of the first adhesive portion and the second adhesive portion may be attached to an end surface of the object to be moved, and the other of the first adhesive portion and the second adhesive portion may be attached to a main surface of the door. [Effects of the Invention]

[0012] According to one aspect of the present invention, it is possible to provide a door-opening detection sensor that can improve the accuracy of detecting the door opening history. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 2 is a plan view of the door open detection sensor according to the first embodiment. [Figure 2] 1 is a cross-sectional view of a door-opening detection sensor according to a first embodiment. FIG. [Figure 3] 1 is a schematic diagram showing an installation state of a door-opening detection sensor according to a first embodiment. FIG. [Figure 4] FIG. 2 is a cross-sectional view showing an installation state of the door-opening detection sensor according to the first embodiment. [Figure 5] 5A to 5C are schematic diagrams showing the operation of the door open detection sensor according to the first embodiment. [Figure 6] 5A and 5B are cross-sectional views showing the operation of the door open detection sensor according to the first embodiment. [Figure 7] FIG. 10 is a plan view of a door open detection sensor according to a second embodiment. [Figure 8] FIG. 10 is a cross-sectional view of a door-opening detection sensor according to a second embodiment. [Figure 9] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a second embodiment. [Figure 10] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a second embodiment. [Figure 11] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the second embodiment. [Figure 12] FIG. 10 is a plan view of a door open detection sensor according to a third embodiment. [Figure 13] FIG. 10 is a cross-sectional view of a door-opening detection sensor according to a third embodiment. [Figure 14] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a third embodiment. [Figure 15] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the third embodiment. [Figure 16] FIG. 10 is a plan view of a door open detection sensor according to a fourth embodiment. [Figure 17] FIG. 10 is a cross-sectional view of a door-opening detection sensor according to a fourth embodiment. [Figure 18] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a fourth embodiment. [Figure 19] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the fourth embodiment. [Figure 20] FIG. 10 is a plan view of a door open detection sensor according to a fifth embodiment. [Figure 21] FIG. 10 is a cross-sectional view of a door-opening detection sensor according to a fifth embodiment. [Figure 22] FIG. 10 is a plan view of a door-opening detection sensor according to a sixth embodiment. [Figure 23] FIG. 10 is a cross-sectional view of a door-opening detection sensor according to a sixth embodiment. [Figure 24] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a sixth embodiment. [Figure 25] 13A and 13B are schematic diagrams showing the operation of the door open detection sensor according to the sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, the door open detection sensor of the embodiment will be specifically described with reference to the drawings.

[0015] [Door Opening Detection Sensor] (First Embodiment) FIG. 1 is a plan view of the door-opening detection sensor 100 according to the first embodiment. FIG. 2 is a cross-sectional view of the door-opening detection sensor 100. FIG. 2 shows a cross-section II of FIG. 1. FIG. 3 is a schematic diagram showing the installation state of the door-opening detection sensor 100. FIG. 4 is a cross-sectional view showing the installation state of the door-opening detection sensor 100. FIG. 4 shows a cross-section II-II of FIG. 3. FIG. 5 is a schematic diagram showing the operation of the door-opening detection sensor 100. FIG. 5 is a cross-sectional view showing the operation of the door-opening detection sensor 100.

[0016] 1, the door-opening detection sensor 100 includes a substrate 1, an antenna 2, an IC chip 3, a detection wiring 4, a first adhesive layer 5, and a second adhesive layer 6. The door-opening detection sensor 100 is an RFID (Radio Frequency Identification) tag.

[0017] As shown in FIGS. 3 and 4, the door 101 (first door) is formed in a plate shape. The door 101 is openable and closable relative to the moved object 102. The door 101 is rotatable, for example, about a rotation axis provided at the second side end (the side end opposite to the first side end 101a). When the door 101 is closed relative to the moved object 102, the end surface 101b of the first side end 101a of the door 101 faces the end surface 102b of the first side end 102a of the moved object 102. The first main surface 101c (main surface) is one surface (the surface on the +Z side) of the door 101. The constituent material of the door 101 may be a non-metallic material (wood, resin, etc.) or a metal.

[0018] The moved object 102 is formed, for example, in a plate shape. The moved object 102 may be a door (second door) that can be opened and closed relative to the door 101. When the moved object 102 is a door, the moved object 102 is rotatable, for example, around a rotation axis provided at a second side edge (the side edge opposite to the first side edge 102a). The moved object 102 may be a door frame that surrounds the door 101. The moved object 102 may be a wall that constitutes a building. The first main surface 102c is one surface (the surface on the +Z side) of the moved object 102. When the door 101 is closed relative to the moved object 102, the first main surface 102c of the moved object 102 is flush with, for example, the first main surface 101c of the door 101. The constituent material of the moved object 102 may be a non-metallic material (wood, resin, etc.) or a metal.

[0019] The "main surface" refers to the widest surface of the plate-like body, specifically the front surface and back surface of the plate-like body. The end surface refers to the surface formed on the edge of the plate-like body, and is usually a surface perpendicular to the main surface.

[0020] The door 101 is opened by rotating it relative to the operated body 102. The door 101 is opened by rotating either the door 101 or the operated body 102, or both. To open the door 101, for example, only the door 101 may be rotated, or only the operated body 102 may be rotated, or both the door 101 and the operated body 102 may be rotated.

[0021] In FIG. 3, the door 101 is in a closed state relative to the operated object 102. In FIG. 3, the direction in which the operated object 102 and the door 101 in a closed state are aligned (left-right direction in FIG. 3) is the X direction. One side of the X direction (right side in FIG. 3) is the +X side. The direction opposite to the +X side is the -X side. The direction in which the first side ends 101a, 102a of the door 101 and the operated object 102 extend (up-down direction in FIG. 3) is the Y direction. The Y direction is orthogonal to the X direction. One side of the Y direction (upper side in FIG. 3) is the +Y side. The direction opposite to the +Y side is the -Y side.

[0022] The Z direction is perpendicular to the X and Y directions. The Z direction is the thickness direction of the operated body 102 and the door 101 in the closed state. One direction in the Z direction is the +Z side. The direction opposite to the +Z side is the -Z side. Viewing from the Z direction is called planar view. The up and down directions are tentatively defined according to Figure 3. The upper side (+Y side) in Figure 3 is the upper side. The lower side (-Y side) in Figure 3 is the lower side. The up and down directions defined here do not limit the orientation of the door open detection sensor when in use.

[0023] 1, the substrate 1 includes a first substrate portion 11 and a second substrate portion 12. The substrate 1 has a rectangular shape in a plan view. The first substrate portion 11 is a part of the substrate 1. The first substrate portion 11 is, for example, a portion on the +X side from the center of the substrate 1. Two notches 16A and 16B are formed in the first substrate portion 11. The notches 16A and 16B are formed linearly from the +X side edge of the first substrate portion 11 toward the -X side. The two notches 16A and 16B are formed with a gap in the Y direction. The notch 16A is located above (on the +Y side of) the notch 16B. Note that the number of notches formed in the substrate 1 is not limited to two. The number of notches may be one or multiple (any number greater than or equal to two).

[0024] The first base member 11 is divided by cuts 16A and 16B into a first divided portion 11A, a second divided portion 11B, and a third divided portion 11C. The first divided portion 11A is located closest to the +Y side of the divided portions 11A to 11C. The third divided portion 11C is located closest to the -Y side of the divided portions 11A to 11C. The second divided portion 11B is located between the first divided portion 11A and the third divided portion 11C. The first divided portion 11A, the second divided portion 11B, and the third divided portion 11C can be collectively referred to as divided portions 11A to 11C. The divided portions 11A to 11C are each rectangular in plan view. The second main surface 11b is the surface on the -Z side of the first base member 11 (see FIG. 2).

[0025] The second substrate portion 12 is a part of the substrate 1. The second substrate portion 12 is, for example, a portion on the -X side from the center of the substrate 1. The second main surface 12b is the surface on the -Z side of the second substrate portion 12 (see FIG. 2).

[0026] 3 and 4, the first adhesive layer 5 is formed in an area of ​​the second main surface 11b that includes the end (first end 11c) on the +X side of the second divided portion 11B. The second divided portion 11B is attached to the first main surface 101c of the door 101 by the first adhesive layer 5 (adhesive layer). The first affixing portion 13 is an area of ​​the second divided portion 11B that is attached to the door 101 by the first adhesive layer 5. The first affixing portion 13 may cover the entire area of ​​the second divided portion 11B.

[0027] A partial region including the first end 11c of the second divided portion 11B is located so as to overlap the door 101 in a plan view. A partial region including the end (second end 11d) on the -X side of the second divided portion 11B is located so as to overlap the moved object 102 (see FIG. 3). Therefore, the second divided portion 11B is attached across the moved object 102 and the door 101. That is, the second divided portion 11B is provided from one side of the moved object 102 to the other side of the door 101.

[0028] The second adhesive layer 6 is formed on the entire area of ​​the second main surface 12b of the second base member 12. The second base member 12 is attached to the first main surface 102c of the object to be moved 102 by the second adhesive layer 6 (adhesive layer). The second attachment portion 14 is the area of ​​the second base member 12 that is attached to the object to be moved 102 by the second adhesive layer 6. The second attachment portion 14 is, for example, the entire area of ​​the second base member 12.

[0029] 3, the first divided portion 11A and the third divided portion 11C may be attached to the end surface 102b of the moved object 102 by a second adhesive layer (adhesive layer). In this case, the portions of the first divided portion 11A and the third divided portion 11C attached to the end surface 102b of the moved object 102 are part of the second adhesive portion 14. When the first divided portion 11A and the third divided portion 11C are attached to the end surface 102b of the moved object 102, the upper and lower portions of the second base portion 12 can be stably attached to the moved object 102. This makes it easier to separate the middle portion 12B of the second base portion 12 (the portion in the same height range as the second divided portion 11B) from the other portions.

[0030] The substrate 1 (i.e., the first substrate portion 11 and the second substrate portion 12) is, for example, a resin substrate, a paper substrate, etc. Materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET), polyolefin resins, polyethylene fluoride resins, polyamide resins, vinyl polymers, acrylic resins, polystyrene, polycarbonate, etc. It is desirable that the first substrate portion 11 and the second substrate portion 12 have flexibility.

[0031] As shown in Fig. 1, the antenna 2 is capable of wireless communication (contactless communication) with the outside. The antenna 2 is an antenna for wireless communication. The antenna 2 has two radiating portions 21 and 22. The antenna 2 is formed on the second main surface 12b of the second base portion 12 (see Fig. 2).

[0032] The two radiating portions 21 and 22 extend in directions away from each other along the X direction. The radiating portions 21 and 22 gradually become wider in the extending direction (direction away from each other).

[0033] The antenna 2 can be formed from, for example, a conductive ink such as a polymer-type conductive ink or a silver ink composition. The antenna 2 may also be formed from, for example, a metal foil, a metal thin film formed by plating or the like, a metal thin film formed by metal vapor deposition or the like, a metal plate, or the like.

[0034] The IC chip 3 is not particularly limited as long as it is capable of writing and reading information contactlessly via the antenna 2. Examples of the IC chip 3 include a contactless IC tag, a contactless IC label, and a contactless IC card. The IC chip 3 is mounted on the second main surface 12b of the second substrate portion 12. The IC chip 3 is electrically connected to the antenna 2.

[0035] The detection wiring 4 has a first wiring 31, a second wiring 32, and a connection wiring 33. The detection wiring 4 is formed on the second main surface 12b of the second base material portion 12. One end of the first wiring 31 and one end of the second wiring 32 are electrically connected to the IC chip 3. The first wiring 31 and the second wiring 32 extend from the IC chip 3 to the -Y side. The first wiring 31 and the second wiring 32 are parallel to each other. The first wiring 31 and the second wiring 32 are formed with a gap between them. The first wiring 31 and the second wiring 32 are referred to as "wirings 31, 32."

[0036] When viewed from the X direction, the +Y side ends of the wirings 31 and 32 are located above (on the +Y side of) the notch 16A. When viewed from the X direction, the -Y side ends of the wirings 31 and 32 are located below (on the -Y side of) the notch 16B. The connection wiring 33 electrically connects the -Y side end of the first wiring 31 and the -Y side end of the second wiring 32.

[0037] The detection wiring 4 can be formed from, for example, a conductive ink such as a polymer-type conductive ink or a silver ink composition. The detection wiring 4 may also be formed from, for example, a metal foil, a metal thin film formed by plating, or a metal thin film formed by metal vapor deposition. The detection wiring 4 is provided on the second attachment portion 14. Unbroken detection wiring 4 is in a state of sufficient conductivity (high conduction state).

[0038] The adhesive layers 5 and 6 are formed of, for example, a known adhesive. The door-opening detection sensor 100 has the adhesive layers 5 and 6, and can be attached to the surfaces of the operated body 102 and the door 101. The first adhesive layer 5 and the second adhesive layer 6 are collectively referred to as "adhesive layers 5 and 6." The first adhesive layer 5 and the second adhesive layer 6 may be formed continuously.

[0039] If the door 101 is made of metal, a non-metallic spacer (not shown) may be provided between the adhesive layer 5 and the door 101 to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the door 101. Similarly, if the object to be moved 102 is made of metal, a non-metallic spacer (not shown) may be provided between the adhesive layer 6 and the object to be moved 102 to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the object to be moved 102. The spacer may be formed of, for example, a non-conductive resin. Similarly, in the following embodiments, a spacer may be provided between the adhesive layer 5 and the door 101. A spacer may be provided between the adhesive layer 6 and the object to be moved 102.

[0040] [Door open detection sensor operation] The operation of the door open detection sensor 100 will be described with reference to FIGS. As shown in Figures 3 and 4, the door-opening detection sensor 100 is installed across the operated object 102 and the door 101. More specifically, the second divided portion 11B is attached to the first main surface 101c of the door 101 with a first adhesive layer 5. The second base material portion 12 is attached to the first main surface 102c of the operated object 102 with a second adhesive layer 6. The base material 1 is attached across the operated object 102 and the door 101. In other words, the base material 1 is provided from one side of the operated object 102 and the door 101 to the other side.

[0041] 5 and 6, the door 101 is opened by rotating the door 101 in the +Z direction relative to the object to be moved 102. The rotation of the door 101 (opening operation of the door 101) separates the first adhesive portion 13 and the second adhesive portion 14. "The first adhesive portion 13 and the second adhesive portion 14 separate" means that at least one of the first adhesive portion 13 and the second adhesive portion 14 moves in a direction away from the other from a state in which the first adhesive portion 13 and the second adhesive portion 14 are attached to the door 101 and the object to be moved 102, respectively.

[0042] As second divided portion 11B moves toward the +Z side together with door 101, a force toward the +Z side acts on middle portion 12B of second base portion 12 (a portion in the same height range as second divided portion 11B) (see FIG. 3). This causes breakage of second base portion 12 to progress from the tips (-X side ends) of notches 16A and 16B toward the -X side. Middle portion 12B of second base portion 12 separates from the other portions and peels off from moved body 102. Because breakage of second base portion 12 progresses from notches 16A and 16B, it can be said that notches 16A and 16B have the effect of promoting breakage of second base portion 12.

[0043] Because the middle portion 12B of the second base material portion 12 is separated from the other portions, the wirings 31, 32 are disconnected due to the loss of a portion, and enter a low conductivity state (e.g., a non-conductive state). The "low conductivity state" is a state in which the conductivity is lower (i.e., a state in which the electrical resistance is higher) than in the normal state (see FIGS. 3 and 4).

[0044] Because the second substrate portion 12 is flexible, the middle portion 12B that has peeled off from the moved object 102 is likely to bend. Therefore, even when the door 101 is closed, the middle portion 12B is unlikely to return to the same configuration as in the installed state (see FIGS. 3 and 4) (a configuration in which the entire area of ​​the middle portion 12B is attached to the moved object 102). Therefore, reconnection of the wirings 31 and 32 is unlikely to occur (i.e., it is unlikely to return to a high conductivity state). In this way, the second substrate portion 12 has a structure (reconnection restriction structure) that makes it unlikely for reconnection of the wirings 31 and 32 after they have entered a low conductivity state. Therefore, it can be said that the wirings 31 and 32 irreversibly enter a low conductivity state.

[0045] When the wires 31 and 32 are in a low conductivity state, the electrical resistance of the detection wire 4 increases, which affects wireless communication by the antenna 2. This allows the door open detection sensor 100 to detect the opening history of the door 101. The door open detection sensor 100 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2. For example, the antenna 2 can transmit flag information based on the comparison result between the electrical resistance of the detection wire 4 and a threshold value (e.g., the difference between the electrical resistance of the detection wire 4 and the threshold value).

[0046] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 100 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated when the door 101 is opened. The separation of the first adhesive portion 13 and the second adhesive portion 14 causes the second base material portion 12 to break, causing the wirings 31 and 32 to enter a low conductivity state, which affects wireless communication by the antenna 2. For example, the flag information transmitted by the antenna 2 changes based on a decrease in the electrical resistance of the detection wiring 4. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0047] The second substrate portion 12 is flexible. Since the middle portion 12B that has peeled off from the operated body 102 is likely to bend, the second substrate portion 12 can be said to have a structure (reconnection restricting structure) that makes it difficult for the wirings 31, 32 to reconnect after they have become in a low conduction state. Therefore, even after the door 101 has been closed, it is possible to detect the opening history of the door 101.

[0048] In the door-open detection sensor 100, the wiring 31, 32 is disconnected when the second base material portion 12 is broken, so it is difficult for the wiring 31, 32 to reconnect even when the door 101 is closed (i.e., it is difficult for the wiring 31, 32 to return to a high conductivity state). Therefore, the opening history of the door 101 can be detected with high accuracy.

[0049] In the door-opening detection sensor 100, the notches 16A and 16B are formed in the first base material portion 11, which makes it easier to break the second base material portion 12 when the door 101 is opened.

[0050] The door-opening detection sensor 100 can attach the second divided portion 11B (first adhesive portion 13) to the first main surface 101c of the door 101, and can attach a part of the second base material portion 12 (second adhesive portion 14) to the end surface 102b of the operated body 102 (see FIG. 3). The end surface 102b is a plane that intersects with the first main surface 101c of the door 101 in the closed state (for example, a plane perpendicular to the first main surface 101c), so that a large shear force can be applied to the base material 1 when the door 101 is opened. This makes it easier to break the base material 1.

[0051] In the open door detection sensor 100, both the antenna 2 and the detection wiring 4 are provided on the second substrate 12. In this way, in an open door detection sensor in which the antenna and the detection wiring are provided on one substrate (one of the first substrate or the second substrate), the structure of the other substrate (in this embodiment, the first substrate 11) can be simplified. In an open door detection sensor with this structure, the overall size can be made smaller than when at least one of the antenna and the detection wiring is provided across both the first substrate and the second substrate.

[0052] [Door Opening Detection Sensor] (Second Embodiment) FIG. 7 is a plan view of a door-opening detection sensor 200 according to a second embodiment. FIG. 8 is a cross-sectional view of the door-opening detection sensor 200. FIG. 8 shows a cross section taken along line III-III in FIG. 7. FIGS. 9 and 10 are schematic diagrams showing the installation state of the door-opening detection sensor 200. FIG. 10 is a diagram showing the door 101 and the operated object 102 spaced apart to make the shape of the door-opening detection sensor 200 easier to see. FIG. 11 is a schematic diagram showing the operation of the door-opening detection sensor 200. Configurations common to other embodiments are designated by the same reference numerals and will not be described again.

[0053] As shown in FIG. 7, the door opening detection sensor 200 includes a base material 201, an antenna 2, an IC chip 3, a first adhesive layer 205, a second adhesive layer 206, and a cover member . The open door detection sensor 200 differs from the open door detection sensor 100 (see Figure 1) in that a base material 201 is used instead of the base material 1, that a cover member 7 is provided, and that the detection wiring 4 is not formed.

[0054] The base material 201 includes a first base material portion 211 and a second base material portion 212. The base material 201 has a rectangular shape in a plan view. The first substrate portion 211 is a part of the substrate 201. The first substrate portion 211 is, for example, a portion on the +X side from the center of the substrate 201. A notch 216 is formed in the first substrate portion 211. The notch 216 is formed in a straight line from the edge on the +X side of the first substrate portion 211 toward the -X side. Note that the number of notches formed in the substrate 201 is not limited to one, and may be multiple (any number equal to or greater than two).

[0055] The first base member 211 is divided by a notch 216 into a first divided portion 211A and a second divided portion 211B. The first divided portion 211A and the second divided portion 211B can be collectively referred to as divided portions 211A, 211B. The first divided portion 211A is the one of the divided portions 211A, 211B that is closest to the +Y side. The second divided portion 211B is the one of the divided portions 211A, 211B that is closest to the -Y side. The divided portions 211A, 211B are each rectangular in a plan view. The first main surface 211a is the surface of the first base member 211 on the +Z side. The second main surface 211b is the surface of the first base member 211 on the -Z side (see FIG. 8).

[0056] The second base material portion 212 is a part of the base material 201. The second base material portion 212 is, for example, a portion on the −X side from the center of the base material 201. The first main surface 212a is the surface on the +Z side of the second base material portion 212 (see FIG. 8).

[0057] As shown in FIG. 8, the first adhesive layer 205 is formed on the entire area of ​​the second main surface 211b of the first divided portion 211A. 9, the first divided portion 211A is attached to the first main surface 101c of the door 101 by a first adhesive layer 205 (adhesive layer). The first attachment portion 213 is a region of the first divided portion 211A that is attached to the door 101 by the first adhesive layer 205. The first attachment portion 213 is, for example, the entire region of the first divided portion 211A.

[0058] As shown in FIG. 7, the second adhesive layer 206 is formed on the entire area of ​​the second main surface 211b (see FIG. 8) of the second divided portion 211B. As shown in FIG. 10, the second divided portion 211B is attached to the end surface 102b of the moved body 102 by the second adhesive layer 206 (adhesive layer). The second adhesive portion 214 is a region of the second divided portion 211B that is attached to the moved object 102 by the second adhesive layer 206. The second adhesive portion 214 is, for example, the entire region of the second divided portion 211B.

[0059] The substrate 201 (that is, the first substrate portion 211 and the second substrate portion 212) is, for example, a resin substrate, a paper substrate, etc. It is desirable that the first substrate portion 211 and the second substrate portion 212 have flexibility.

[0060] 7, the antenna 2 is formed on the first main surface 212a of the second base material portion 212. The two radiating portions 21 and 22 extend in directions away from each other along the Y direction.

[0061] When viewed from the X direction, the +Y side end of radiation portion 21 is located above (on the +Y side of) cutout 216. When viewed from the X direction, the -Y side end of radiation portion 22 is located below (on the -Y side of) cutout 216.

[0062] The cover member 7 covers the first main surfaces 211a, 212a of the base material 201. The cover member 7 covers the antenna 2 and the IC chip 3. The cover member 7 is made of, for example, paper, resin, or the like. The cover member 7 has the same shape as the base material 201. It is desirable that the cover member 7 be flexible.

[0063] A notch 217 is formed in the cover member 7 at a position overlapping the notch 216 in a plan view. The notch 217 is formed in a straight line from the edge on the +X side of the cover member 7 toward the -X side. Note that the number of notches formed in the cover member 7 is not limited to one, and may be multiple (any number equal to or greater than two).

[0064] [Door open detection sensor operation] 9 and 10, the door-opening detection sensor 200 is installed across the moved object 102 and the door 101. More specifically, the first divided portion 211A is attached to the first main surface 101c of the door 101 with a first adhesive layer 205. The second divided portion 211B is attached to the end surface 102b of the moved object 102 with a second adhesive layer 206. The base material 201 is attached across the moved object 102 and the door 101.

[0065] The door-opening detection sensor 200 can be installed so that the portion including the second substrate portion 212 protrudes from the first main surfaces 101c, 102c. The portion including the second substrate portion 212 stands upright relative to the first main surfaces 101c, 102c. For example, the portion including the second substrate portion 212 stands upright perpendicular to the first main surfaces 101c, 102c.

[0066] 11, the door 101 is opened by moving at least one of the door 101 and the operated body 102 in a direction away from each other along the X direction. For example, the door 101 is opened by moving the door 101 in the +X direction. Since the first base material portion 211 moves in the +X direction together with the door 101, the first divided portion 211A (first adhesive portion 213) and the second divided portion 211B (second adhesive portion 214) are separated from each other.

[0067] As the first divided portion 211A moves toward the +X side, a force acts on the upper portion 212A (portion in the same height range as the first divided portion 211A) of the second base portion 212 toward the +X side. This causes the breakage of the second base portion 212 to progress from the tip of the notch 216. The upper portion 212A separates from the lower portion 212B (portion in the same height range as the second divided portion 211B). Because the breakage of the second base portion 212 progresses from the notch 216, it can be said that the notch 216 has the effect of promoting the breakage of the second base portion 212. When the second base portion 212 breaks, the cover member 7 also breaks at the same position.

[0068] The breakage of the second base material portion 212 breaks the antenna 2. Breakage of the antenna 2 affects the performance of wireless communication. This allows the door open detection sensor 200 to detect the history of opening of the door 101.

[0069] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 200 of this embodiment, the first adhesive portion 213 and the second adhesive portion 214 are separated by the opening operation of the door 101. The separation of the first adhesive portion 213 and the second adhesive portion 214 causes the second base material portion 212 to break, which breaks the antenna 2, affecting wireless communication by the antenna 2. For example, the breakage of the antenna 2 causes a change in the information transmitted by the antenna 2. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0070] In the door opening detection sensor 200, the antenna 2 breaks when the second base material portion 212 breaks, so wireless communication performance is unlikely to recover even when the door 101 is closed. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0071] In the door-opening detection sensor 200, the notch 216 is formed in the first base material portion 211, which makes it easier to break the second base material portion 212 when the door 101 is opened.

[0072] The door-opening detection sensor 200 can attach the first divided portion 211A (first adhesive portion 213) to the first main surface 101c of the door 101, and the second divided portion 211B (second adhesive portion 214) to the end surface 102b of the operated body 102. Therefore, a large shear force can be applied to the base material 201 during the opening operation of the door 101. This makes it easier to break the base material 201.

[0073] [Door Opening Detection Sensor] (Third Embodiment) Fig. 12 is a plan view of a door-opening detection sensor 300 according to a third embodiment. Fig. 13 is a cross-sectional view of the door-opening detection sensor 300. Fig. 13 shows a cross section taken along line IV-IV in Fig. 12. Fig. 14 is a schematic diagram showing the installation state of the door-opening detection sensor 300. Fig. 15 is a schematic diagram showing the operation of the door-opening detection sensor 300. Configurations common to other embodiments are designated by the same reference numerals and will not be described again.

[0074] As shown in FIG. 12, the door opening detection sensor 300 includes a first substrate 301, an antenna 2, an IC chip 3, a first adhesive layer 305, a second adhesive layer 306, a second substrate 307, and an adhesive layer 318. The open door detection sensor 300 differs from the open door detection sensor 200 (see FIG. 7) in that a first base material 301 is used instead of the base material 201, and a second base material 307 is used instead of the cover member 7.

[0075] 13, the first base material 301 (base material) differs from the base material 201 in that it is formed only by the second base material portion 212 (see FIGS. 7 and 8). In other words, the first base material 301 has a configuration in which the first base material portion 211 is omitted from the base material 201. An adhesive layer 318 is formed on the −Z side surface of the first base material 301. The door open detection sensor 300 according to this embodiment includes the adhesive layer 318, but the adhesive layer 318 may be omitted.

[0076] 12, the second base material 307 (base material) includes a first base material portion 311 and a second base material portion 312. The second base material 307 has a rectangular shape in a plan view. The first substrate portion 311 is a part of the second substrate 307. The first substrate portion 311 is, for example, a portion on the +X side from the center of the second substrate 307. A notch 316 is formed in the first substrate portion 311. The notch 316 is formed linearly from the edge on the +X side of the first substrate portion 311 toward the -X side. Note that the number of notches formed in the second substrate 307 is not limited to one, and may be multiple (any number equal to or greater than two).

[0077] First base material portion 311 is divided into first divided portion 311A ​​and second divided portion 311B by cut 316. First divided portion 311A ​​and second divided portion 311B can be collectively referred to as divided portions 311A, 311B. Second main surface 311b is the surface on the -Z side of first base material portion 311 (see FIG. 13). The second substrate portion 312 is a part of the second substrate 307. The second substrate portion 312 is, for example, a portion of the second substrate 307 on the −X side from the center thereof.

[0078] As shown in FIG. 13, the first adhesive layer 305 is formed on the entire area of ​​the second main surface 311b of the first divided portion 311A. 14, the first divided portion 311A ​​is attached to the first main surface 101c of the door 101 by a first adhesive layer 305 (adhesive layer). The first attachment portion 313 is a region of the first divided portion 311A ​​that is attached to the door 101 by the first adhesive layer 305. The first attachment portion 313 is, for example, the entire region of the first divided portion 311A.

[0079] As shown in FIG. 13, the second adhesive layer 306 is formed on the entire area of ​​the second main surface 311b of the second divided portion 311B. 14, the second divided portion 311B is attached to the first main surface 102c of the moved object 102 by the second adhesive layer 306 (adhesive layer). The second adhesive portion 314 is a region of the second divided portion 311B that is attached to the moved object 102 by the second adhesive layer 306. The second adhesive portion 314 is, for example, the entire region of the second divided portion 311B.

[0080] The second substrate 307 (that is, the first substrate portion 311 and the second substrate portion 312) is, for example, a resin substrate, a paper substrate, or the like. The second substrate 307 covers the antenna 2 and the IC chip 3 .

[0081] 12, the antenna 2 is formed on the first main surface (the surface on the +Z side) of the first base material 301. The two radiating portions 21 and 22 extend in directions away from each other along the Y direction.

[0082] When viewed from the X direction, the +Y side end of radiation portion 21 is located above (on the +Y side of) cutout 316. When viewed from the X direction, the -Y side end of radiation portion 22 is located below (on the -Y side of) cutout 316.

[0083] [Door open detection sensor operation] 14, the door-opening detection sensor 300 is installed across the moved object 102 and the door 101. More specifically, the first divided portion 311A ​​is attached to the first main surface 101c of the door 101 with adhesive layers 305 and 318. The second divided portion 311B is attached to the first main surface 102c of the moved object 102 with adhesive layers 306 and 318. The second base material 307 is attached across the moved object 102 and the door 101.

[0084] The door-opening detection sensor 300 can be installed so that the portion including the second substrate portion 312 protrudes from the first main surfaces 101c, 102c. For example, the portion including the second substrate portions 312, 212 stands upright relative to the first main surfaces 101c, 102c. This portion has high rigidity due to the inclusion of the second substrate portion 312 and the second substrate portion 212, and is therefore easy to maintain in an upright position.

[0085] 15, when the door 101 is opened by moving at least one of the door 101 and the operated body 102 away from each other in the X direction, the first divided portion 311A ​​(first adhesive portion 313) and the second divided portion 311B (second adhesive portion 314) are separated from each other. This causes the second base material portion 312, 212 to break from the tip of the notch 316.

[0086] The breakage of the second base material portions 312, 212 breaks the antenna 2. Breakage of the antenna 2 affects the performance of wireless communication. This allows the door open detection sensor 300 to detect the history of the door 101 being opened.

[0087] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 300 of this embodiment, the first adhesive portion 313 and the second adhesive portion 314 are separated by the opening operation of the door 101. The separation of the first adhesive portion 313 and the second adhesive portion 314 causes the second base material portions 312, 212 to break, which breaks the antenna 2, affecting wireless communication by the antenna 2. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0088] In the door opening detection sensor 300, the antenna 2 breaks when the second base material portions 312, 212 break, so wireless communication performance is unlikely to recover even when the door 101 is closed. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0089] In the door-opening detection sensor 300, the notch 316 is formed in the first base material portion 311, so that the second base material portions 312, 212 can be easily broken when the door 101 is opened.

[0090] [Door Opening Detection Sensor] (Fourth Embodiment) Fig. 16 is a plan view of a door-opening detection sensor 400 according to a fourth embodiment. Fig. 17 is a cross-sectional view of the door-opening detection sensor 400. Fig. 17 shows a VV cross section of Fig. 16. Fig. 18 is a schematic diagram showing the installation state of the door-opening detection sensor 400. Fig. 19 is a schematic diagram showing the operation of the door-opening detection sensor 400. Configurations common to other embodiments are assigned the same reference numerals and descriptions thereof will be omitted.

[0091] As shown in FIG. 16, the door opening detection sensor 400 includes a first base material 301, an antenna 2, an IC chip 3, a first adhesive layer 305, a second adhesive layer 306, and a second base material 407. The door-opening detection sensor 400 differs from the door-opening detection sensor 300 (see FIG. 12) in that a second base material 407 is used instead of the second base material 307, and in that the adhesive layer 318 is not provided.

[0092] As shown in FIG. 16, the second base material 407 (base material) includes a first base material portion 411 and a second base material portion 312. A notch 420 is formed in the edge on the +X side of first base material portion 411. Notch 420 has a V-shape that gradually narrows from the edge on the +X side toward the -X side. A cut 416 is formed at the tip (deepest part) of notch 420.

[0093] First base material portion 411 is divided into first divided portion 411A and second divided portion 411B by notch 420 and cutout 416. First divided portion 411A and second divided portion 411B can be collectively referred to as divided portions 411A, 411B. Second main surface 411b is the surface on the -Z side of first base material portion 411 (see FIG. 17).

[0094] As shown in FIG. 17, the first adhesive layer 405 is formed on the entire area of ​​the second main surface 411b of the first divided portion 411A. 18, the first divided portion 411A is attached to the first main surface 101c of the door 101 by a first adhesive layer 405 (adhesive layer). The first attaching portion 413 is a region of the first divided portion 411A that is attached to the door 101 by the first adhesive layer 405.

[0095] As shown in FIG. 17, the second adhesive layer 406 is formed on the entire area of ​​the second main surface 411b of the second divided portion 411B. 18, the second divided portion 411B is attached to the first main surface 102c of the moved object 102 by the second adhesive layer 406 (adhesive layer). The second adhesive portion 414 is a region of the second divided portion 411B that is attached to the moved object 102 by the second adhesive layer 406.

[0096] [Door open detection sensor operation] 18, the door-opening detection sensor 400 is installed across the moved object 102 and the door 101. More specifically, the first divided portion 411A is attached to the first main surface 101c of the door 101 by a first adhesive layer 405. The second divided portion 411B is attached to the first main surface 102c of the moved object 102 by a second adhesive layer 406. The second base material 407 is attached across the moved object 102 and the door 101.

[0097] 19, when the door 101 is opened by moving at least one of the door 101 and the operated body 102 away from each other along the X direction, the first divided portion 411A (first adhesive portion 413) and the second divided portion 411B (second adhesive portion 414) are separated from each other. This causes the breakage of the second base material portions 312, 212 to progress from the tip of the notch 416.

[0098] The breakage of the second base material portions 312, 212 breaks the antenna 2. Breakage of the antenna 2 affects the performance of wireless communication. This allows the door open detection sensor 400 to detect the history of the door 101 being opened.

[0099] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 400 of this embodiment, the opening operation of the door 101 causes the first adhesive portion 413 and the second adhesive portion 414 to separate. The separation of the first adhesive portion 413 and the second adhesive portion 414 causes the second base material portions 312, 212 to break, which breaks the antenna 2, affecting wireless communication by the antenna 2. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0100] In the door opening detection sensor 400, the antenna 2 breaks when the second base material portions 312, 212 break, so wireless communication performance is unlikely to recover even when the door 101 is closed. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0101] In the door-opening detection sensor 400, the notch 420 and the cutout 416 are formed in the first base material portion 411, so that the second base material portions 312, 212 can be easily broken when the door 101 is opened.

[0102] 18, in this embodiment, the door-opening detection sensor 400 is attached to the first main surface 101c of the door 101 and the first main surface 102c of the moved object 102, but the installation form of the door-opening detection sensor 400 is not particularly limited. For example, the door-opening detection sensor 400 may be attached to the first main surface of one of the door 101 and the moved object 102 and to an end surface of the other, similar to the door-opening detection sensor 200 shown in FIG. 10. Specifically, the door-opening detection sensor 400 may have the first divided portion 411A attached to the first main surface 101c of the door 101 and the second divided portion 411B attached to the end surface 102b of the moved object 102, for example.

[0103] [Door Opening Detection Sensor] (Fifth Embodiment) Fig. 20 is a plan view of a door-opening detection sensor 500 according to a fifth embodiment. Fig. 21 is a cross-sectional view of the door-opening detection sensor 500. Fig. 21 shows a cross section taken along line VI-VI in Fig. 20. Configurations common to other embodiments are given the same reference numerals and descriptions thereof will be omitted.

[0104] As shown in FIGS. 20 and 21, the door opening detection sensor 500 includes a base material 201, an antenna 2, an IC chip 3, a first adhesive layer 205, a second adhesive layer 206, and a cover member 7 (see FIG. 7). An adhesive layer 218 is formed on the second base material portion 212.

[0105] As shown in FIG. 20, the first base material portion 211 is divided by a cut 216 into a first divided portion 211A and a second divided portion 211B. A weakened line 521 may be formed at the base end of the second divided portion 211B. The weakened line 521 is, for example, a structure in which cutting lines are formed intermittently (so-called perforations). The weakened line 521 may also be a half-cut portion, a thin-walled portion, or the like. The weakened line 521 is formed along the boundary line between the second divided portion 211B and the second base material portion 212. The second divided portion 211B can be easily bent at the weakened line 521.

[0106] [Door open detection sensor operation] The door-opening detection sensor 500 can be installed across the moved object 102 and the door 101. For example, similar to the door-opening detection sensor 200 shown in FIG. 10 , the second divided portion 211B is attached to the first main surface 101c of the door 101 by the second adhesive layer 206. The first divided portion 211A is attached to the end surface 102b of the moved object 102 by the first adhesive layer 205. The base material 201 is attached across the moved object 102 and the door 101.

[0107] When the door 101 (see FIG. 10) is opened, the first divided portion 211A (first adhesive portion 213) and the second divided portion 211B (second adhesive portion 214) are separated from each other. This causes the second base material portion 212 to break from the tips of the notches 216 and 217.

[0108] The breakage of the second base material portion 212 breaks the antenna 2. Breakage of the antenna 2 affects the performance of wireless communication. This allows the door open detection sensor 500 to detect the history of the door 101 being opened.

[0109] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 500 of this embodiment, the opening operation of the door 101 causes the first adhesive portion 213 and the second adhesive portion 214 to separate. The separation of the first adhesive portion 213 and the second adhesive portion 214 causes the second base material portion 212 to break, which breaks the antenna 2, affecting wireless communication by the antenna 2. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0110] In the door opening detection sensor 500, the antenna 2 breaks when the second base material portion 212 breaks, so wireless communication performance is unlikely to recover even when the door 101 is closed. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0111] In the door-opening detection sensor 500, the notch 216 is formed in the first base material portion 211, which makes it easier to break the second base material portion 212 when the door 101 is opened.

[0112] [Door Opening Detection Sensor] (Sixth Embodiment) Fig. 22 is a plan view of a door-opening detection sensor 600 according to a sixth embodiment. Fig. 23 is a cross-sectional view of the door-opening detection sensor 600. Fig. 24 shows a cross section taken along line VII-VII in Fig. 23. Fig. 24 is a schematic diagram showing the installation state of the door-opening detection sensor 600. Fig. 25 is a schematic diagram showing the operation of the door-opening detection sensor 600. Configurations common to other embodiments are designated by the same reference numerals and descriptions thereof will be omitted.

[0113] As shown in FIGS. 22 and 23, the door open detection sensor 600 includes a base material 601, an antenna 2, an IC chip 3, a detection wiring 4, a first adhesive layer 605, a second adhesive layer 6, and a cover member 607.

[0114] The substrate 601 includes a first substrate portion 611 and a second substrate portion 12. The substrate 601 is rectangular in plan view. A notch 616 is formed in the first substrate portion 11. The notch 616 is formed linearly from the edge of the first substrate portion 611 on the +X side toward the -X side.

[0115] The first base material portion 611 is divided by a cut 616 into a first divided portion 611A and a second divided portion 611B. The first main surface 611a is the surface on the +Z side of the first base portion 611 (see FIG. 23). The first main surface 12a is the surface on the +Z side of the second base part 12. The second main surface 12b is the surface on the -Z side of the second base part 12 (see FIG. 23).

[0116] The first adhesive layer 605 is formed on the first main surface 607a (the surface on the +Z side) of the cover member 607 in a portion overlapping with the second divided portion 611B. That is, the first adhesive layer 605 is formed on the first main surface 611a (the surface on the +Z side) of the second divided portion 611B with the cover member 607 interposed therebetween.

[0117] The second divided portion 611B and the portion of the cover member 607 overlapping with the second divided portion 611B are attached to the end surface 101b of the door 101 by a first adhesive layer 605 (adhesive layer). The first attachment portion 613 is a region of the second divided portion 611B that is attached to the door 101 by the first adhesive layer 605.

[0118] The second adhesive layer 6 is formed on the −Z side surface of the base material 601. It can be said that the second adhesive layer 6 is formed on the surface of the base material 601 opposite to the first adhesive layer 605.

[0119] When viewed from the X direction, the +Y side ends of the wirings 31 and 32 are located above (on the +Y side of) the notch 616. When viewed from the X direction, the -Y side ends of the wirings 31 and 32 are located below (on the -Y side of) the notch 616.

[0120] The cover member 607 is overlaid on the first main surface 611 a of the first base material portion 611 and the first main surface 12 a of the second base material portion 12 .

[0121] [Door open detection sensor operation] The operation of the door open detection sensor 600 will be described with reference to FIGS. As shown in Fig. 24, the door-opening detection sensor 600 is installed across the moved object 102 and the door 101. More specifically, the second divided portion 611B is attached to the end surface 101b of the door 101 with a first adhesive layer 605. The second base material portion 12 is attached to the first main surface 102c of the moved object 102 with a second adhesive layer 6. The base material 601 is attached across the moved object 102 and the door 101.

[0122] The base material 601 has one surface (first main surface 611a) of the second divided portion 611B (first adhesive portion 613) attached to the end surface 101b of the door 101 via the cover member 607. The base material 601 has the other surface of the second base material portion 12 (second adhesive portion 14) attached to the first main surface 102c of the operated body 102.

[0123] 25, the door 101 is opened by rotating the door 101. The opening operation of the door 101 separates the first adhesive portion 613 and the second adhesive portion 14. This causes the breakage of the second base material portion 12 and the cover member 607 to progress from the tip of the notch 616. The wirings 31 and 32 are broken and enter a low conductivity state (for example, a non-conductive state).

[0124] When the wires 31 and 32 are in a low conduction state, the electrical resistance of the detection wire 4 increases, which affects wireless communication by the antenna 2. This allows the door open detection sensor 600 to detect the history of when the door 101 has been opened.

[0125] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 600 of this embodiment, the opening operation of the door 101 causes the first adhesive portion 613 and the second adhesive portion 14 to separate from each other. The separation of the first adhesive portion 613 from the second adhesive portion 14 causes the second base material portion 12 to break, causing the wirings 31 and 32 to enter a low conductivity state, which affects wireless communication by the antenna 2. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0126] The second substrate portion 12 is flexible. Since the middle portion 12B that has peeled off from the operated body 102 is likely to bend, the second substrate portion 12 can be said to have a structure (reconnection restricting structure) that makes it difficult for the wirings 31, 32 to reconnect after they have become in a low conduction state. Therefore, even after the door 101 has been closed, it is possible to detect the opening history of the door 101.

[0127] In the door-open detection sensor 600, the wiring 31, 32 is disconnected when the second base material portion 12 is broken, so it is difficult for the wiring 31, 32 to be reconnected (i.e., difficult for the wiring 31, 32 to return to a high conductivity state) even when the door 101 is closed. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0128] In the door-opening detection sensor 600, the notch 616 is formed in the first base material portion 611, which makes it easier to break the second base material portion 12 when the door 101 is opened.

[0129] In the door-opening detection sensor 600, a first adhesive layer 605 is formed on one surface of a second divided portion 611B (first adhesive portion 613) of a base material 601 with a cover member 607 interposed therebetween. A second adhesive layer 6 is formed on the other surface of a second base material portion 12 (second adhesive portion 14). The first adhesive layer 605 formed on the first adhesive portion 613 and the second adhesive layer 6 formed on the second adhesive portion 14 are formed on different surfaces of the base material 601. Therefore, the second divided portion 611B (first adhesive portion 613) can be attached to the end surface 101b of the door 101, and the second base material portion 12 (second adhesive portion 14) can be attached to the first main surface 102c of the operated body 102. In this way, since the two adhesive portions 613 and 14 can be attached to the main surface and the end surface, respectively, a large shear force can be applied to the base material 601 and the cover member 607 when the door 101 is opened. This makes it easier to break the base material 601 and the cover member 607. This allows the opening history of the door 101 to be detected with high accuracy.

[0130] The door-opening detection sensor 600 can attach the second divided portion 611B (first adhesive portion 613) to the end surface 101b of the door 101, and the second base material portion 12 (second adhesive portion 14) to the first main surface 102c of the operated body 102. Therefore, when the door 101 is opened, a large shear force can be applied to the base material 601 and the cover member 607. This makes it easier to break the base material 601 and the cover member 607.

[0131] The above describes an embodiment of the present invention, but each configuration and their combination in the embodiment is an example, and additions, omissions, substitutions, and other modifications of the configuration are possible within the scope that does not deviate from the spirit of the present invention. 24, the first adhesive portion 613 is attached to the end surface 101b of the door 101, and the second adhesive portion 14 is attached to the first main surface 102c of the operated body 102, but the installation form of the door opening detection sensor of the embodiment is not limited to this. For example, the first adhesive portion 613 may be attached to the first main surface 101c, and the second adhesive portion 14 may be attached to the end surface 102b. In this way, the door opening detection sensor of the embodiment may have one of the first adhesive portion and the second adhesive portion attached to the end surface of the operated body, and the other of the first adhesive portion and the second adhesive portion attached to a main surface (e.g., the first main surface) of the door.

[0132] The antenna 2 in the door-opening detection sensor 100 shown in FIG. 1 has radiating portions 21 and 22, but the shape of the antenna is not particularly limited. [Explanation of symbols]

[0133] 1,201,601...Base material, 2...Antenna, 3...IC chip, 4...Detection wiring, 5,205,305,405,605...First adhesive layer (adhesive layer), 6,206,306,406...Second adhesive layer (adhesive layer), 13,213,313,413,613...First adhesive portion, 14,214,314,414,...Second adhesive Landing portion, 16A, 16B, 216, 316, 416, 616...notches, 100, 200, 300, 400, 500, 600...door opening detection sensor, 101...door, 101b...end surface, 101c...first main surface (main surface), 102...operated body, 102b...end surface, 102c...first main surface, 307, 407...second base material (base material)

Claims

1. A door open detection sensor that detects the opening of a door that can be opened and closed relative to an operated object, a base material attached across the operated body and the door; an antenna for wireless communication provided on the substrate; an IC chip electrically connected to the antenna, the base material has a first adhesive portion and a second adhesive portion that are attached to the door and the object to be moved by adhesive layers, respectively; detecting the opening of the door based on an effect on the wireless communication caused by a break in the base material due to separation of the first adhesive portion and the second adhesive portion caused by the door opening operation; Door open detection sensor.

2. further comprising a detection wiring electrically connected to the IC chip; detecting the opening of the door based on an effect on the wireless communication caused by a break in the detection wiring due to the break in the base material; The door opening detection sensor according to claim 1.

3. detecting the opening of the door based on an effect on the wireless communication caused by the breakage of the antenna due to the breakage of the base material; The door opening detection sensor according to claim 1.

4. The substrate has a notch formed therein to promote breaking. The door opening detection sensor according to claim 1.

5. the adhesive layer formed on one of the first adhesive portion and the second adhesive portion and the adhesive layer formed on the other of the first adhesive portion and the second adhesive portion are formed on different surfaces of the base material. The door opening detection sensor according to claim 1.

6. One of the first adhesive portion and the second adhesive portion is attached to an end surface of the object to be moved, and the other of the first adhesive portion and the second adhesive portion is attached to a main surface of the door. The door opening detection sensor according to claim 1.

Images