Temporary fixing composition, method for producing wafer, and composition

Abstract

To provide a temporary fixing composition capable of reducing resin residue on a wafer.SOLUTION: A temporary fixing composition comprising a polymerizable component (A) comprising a (meth)acrylate compound, a photoradical polymerization initiator (B), and an ultraviolet absorber (C), wherein the (meth)acrylate compound comprises a bifunctional (meth)acrylate compound (a1) having a polymerizable functional group at both terminals and a number-average molecular weight of 750 or more and 10,000 or less, and a monofunctional or bifunctional (meth)acrylate compound (a2) having a cured product glass-transition temperature measured by a specific method of 50 °C or more.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a temporary fixing composition, a method for producing a wafer, and a composition. [Background technology]

[0002] In the field of electronic devices, in a state where a support member is temporarily fixed to one surface of a wafer via a temporary fixing composition, the wafer is thinned, electrodes are formed on the surface of the wafer, and the like, and then a process of peeling the support member and the temporary fixing composition from the wafer is sometimes carried out.

[0003] Patent Document 1 discloses a temporary adhesive for semiconductor device production containing (A) a radically polymerizable monomer having an alicyclic skeleton, (B) a polymer compound, and (C) a radical polymerization initiator. Patent Document 1 also describes, as an object of the invention of Patent Document 1, that the adhesive has excellent coatability, and is capable of temporarily supporting a workpiece (such as a semiconductor wafer) with high adhesive strength even at high temperatures (e.g., 100°C) when the workpiece is subjected to mechanical or chemical processing, and further, that the temporary support for the treated member can be easily released (with high releasability) without damaging the treated member even after the high-temperature process. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-129431 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention provides a temporary fixing composition that can reduce resin residue on a wafer. [Means for solving the problem]

[0006] According to the present invention, there are provided a temporary fixing composition, a method for producing a wafer, and a composition as shown below.

[0007] 1. A temporary fixing composition comprising: The composition comprises a polymerizable component (A) containing a (meth)acrylate compound, a photoradical polymerization initiator (B), and an ultraviolet absorber (C), The (meth)acrylate compound is a bifunctional (meth)acrylate compound (a1) having polymerizable functional groups at both ends and having a weight average molecular weight of 750 or more and 10,000 or less; A temporary fixing composition comprising: a monofunctional or bifunctional (meth)acrylate compound (a2) having a glass transition temperature of 50°C or higher when cured, as measured by the following [method]. [method] First, a mixture of 97 parts by mass of the monofunctional or bifunctional (meth)acrylate compound (a2) and 3 parts by mass of a photoradical polymerization initiator was formed into a film, and the film was irradiated with ultraviolet light (UV-LED) having a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50 RH%. 2 A cured product with a thickness of 50 μm is obtained by irradiating for 16 seconds. Next, the cured product is measured using a dynamic viscoelasticity measuring device (measurement temperature range -100 to 250°C, heating rate 2°C / min, frequency 1 Hz, tensile mode) to obtain a graph with temperature T on the horizontal axis and loss tangent tanδ on the vertical axis. The temperature at which tanδ reaches its maximum value on the obtained graph is defined as the glass transition temperature. 2. The temporary fixing composition according to 1., wherein the monofunctional or bifunctional (meth)acrylate compound (a2) includes one or more compounds selected from the group consisting of isobornyl (meth)acrylate, (meth)acryloylmorpholine, and tricyclodecane dimethanol di(meth)acrylate. 3. The temporary fixing composition according to 1. or 2., wherein the (meth)acrylate compound includes an aromatic (meth)acrylate. 4. The aromatic (meth)acrylate is a C1-C 20 3. The temporary fixing composition according to 3., which contains alkoxylated bisphenol A di(meth)acrylate. 5. The temporary fixing composition according to 3. or 4., wherein the aromatic (meth)acrylate contains 9,9-bis(4-(2-(meth)acryloyloxyethoxyl)phenyl)fluorene. 6. The temporary fixing composition according to any one of 1. to 5., wherein the ultraviolet absorber (C) includes a benzotriazole-based ultraviolet absorber (C1) having a benzotriazole ring, a functional group containing a heteroatom, a polymerizable functional group, and an aliphatic hydrocarbon group having 4 or more and 30 or less carbon atoms. 7. The temporary fixing composition according to 6., wherein the benzotriazole-based ultraviolet absorber (C1) includes a benzotriazole-based ultraviolet absorber (C1-1) represented by the following formula (1): [ka] (In the formula (1), R 1 contains a heteroatom-containing functional group, and R 2 contains a polymerizable functional group, and R 3 and R 4 each independently contains an aliphatic hydrocarbon group having 4 to 30 carbon atoms, and n is an integer of 1 to 4. 8. The temporary fixing composition according to 6. or 7., wherein the functional group containing a heteroatom contains a hydroxy group. 9. The temporary fixing composition according to any one of 6. to 8., wherein the polymerizable functional group includes one or more selected from the group consisting of a vinyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. 10. The temporary fixing composition according to any one of 6. to 9., wherein the aliphatic hydrocarbon group contains a branched aliphatic hydrocarbon group having 4 to 30 carbon atoms. 11. The temporary fixing composition according to 10, wherein the aliphatic hydrocarbon group contains a t-octyl group. 12. The temporary fixing composition according to any one of 6. to 11., wherein the benzotriazole-based ultraviolet absorber (C1) has a weight-average molecular weight of 500 or more and 2,000 or less. 13. The temporary fixing composition according to any one of 1. to 12., wherein the peel strength of the temporary fixing cured film obtained by the following [method] is 3.00 (N / 50 mm) or less. [method] A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a silicon wafer (150 mm diameter x 625 μm thickness) having a non-photosensitive polyimide applied to 95% or more of its surface and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer having the non-photosensitive polyimide applied thereto and the glass support member. Next, under a nitrogen atmosphere, a UV-LED with a wavelength of 405 nm (illuminance 300 W / cm 2 , irradiation time 16 seconds, cumulative light intensity 4,800mJ / cm 2 The temporary fixing film is cured by irradiating the temporary fixing film from the glass support member side, and a temporary fixing cured film is obtained. The temporary fixing film is placed on a hot plate with the silicon wafer side to which the non-photosensitive polyimide is applied facing downward, and is heat-treated at 150°C for 1 hour. Next, a UV laser having a wavelength of 355 nm (output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) is irradiated onto the temporary fixing cured film from the glass support member side so as to scan the entire temporary fixing cured film. Next, the glass support member is peeled off to obtain a test piece in a state where the temporary fixing cured film is attached onto the silicon wafer to which the non-photosensitive polyimide is applied. Next, a 50 mm wide cut is made in the cured film for temporary fixing on the test piece using a cutter, and the cured film for temporary fixing is peeled off from the silicon wafer in accordance with JIS Z 0237:2009 under conditions of 23°C, a peel angle of 180°, and a peel speed of 300 mm / min, to measure the peel strength. 14. In accordance with JIS Z 8803:2011, at a temperature of 23°C, the viscosity was measured using an E-type viscometer at a shear rate of 75 sec -1 14. The temporary fixing composition according to any one of 1. to 13., wherein the viscosity of the temporary fixing composition measured by the above method is 1000 mPa·s or more and 4000 mPa·s or less. 15. The temporary fixing composition according to any one of 1. to 14., which is capable of temporarily fixing a support member and a wafer. 16. The temporary fixing composition according to claim 15, wherein the support member comprises a glass support member. 17. The temporary fixing composition according to 15. or 16., wherein the wafer comprises a semiconductor wafer. 18. A method for manufacturing a wafer, comprising: A method for producing a wafer, comprising: a peeling step of irradiating a structure (b) including, in this order, a support member, a cured film of the temporary fixing composition according to any one of 1. to 17., and a wafer, with light from the support member side to decompose at least a part of the cured film of the temporary fixing composition, thereby peeling the wafer from the support member. 19. The method for producing a wafer according to 18, wherein the light includes a UV laser having a wavelength of 300 nm or more and 385 nm or less. 20. Before the peeling step, 19. The method for producing a wafer according to 18. or 19., further comprising a thinning step of obtaining a structure (c) by thinning the wafer in the structure (b). 21. Before the thinning step, 21. The method for producing a wafer according to 20., further comprising a curing step of irradiating light to a structure (a) including the support member, a temporary fixing film made of the temporary fixing composition according to any one of 1. to 17., and the wafer in this order, to cure the temporary fixing film, thereby obtaining the structure (b). 22. A composition comprising: a polymerizable component (A) containing a polymerizable functional group; The polymerizable component (A) a bifunctional polymerizable component (a1) having a weight average molecular weight of 750 or more and 10,000 or less; A composition comprising: a monofunctional or bifunctional polymerizable component (a2) having a glass transition temperature of 50°C or higher when cured, as measured by the following [method]. [method] First, a mixture of 97 parts by mass of the polymerizable component (a2) and 3 parts by mass of a photoradical polymerization initiator was formed into a film, and the film was irradiated with ultraviolet light (UV-LED) having a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50 RH%. 2 A cured product with a thickness of 50 μm is obtained by irradiating for 16 seconds. Next, the cured product is measured using a dynamic viscoelasticity measuring device (measurement temperature range -100 to 250°C, heating rate 2°C / min, frequency 1 Hz, tensile mode) to obtain a graph with temperature T on the horizontal axis and loss tangent tanδ on the vertical axis. The temperature at which tanδ reaches its maximum value on the obtained graph is defined as the glass transition temperature. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a temporary fixing composition that can reduce resin residue on a wafer. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described below based on embodiments.

[0010] In the present embodiment, the term "(meth)acrylate" represents a concept that encompasses both acrylate and methacrylate. The same applies to similar terms such as "(meth)acrylic."

[0011] The composition of the present embodiment comprises: a polymerizable component (A) containing a polymerizable functional group; The polymerizable component (A) is a bifunctional polymerizable component (a1) having a weight average molecular weight of 750 or more and 10,000 or less; and a monofunctional or bifunctional polymerizable component (a2) having a glass transition temperature of 50°C or higher when cured, as measured by the following [method]. [method] First, a mixture of 97 parts by mass of the polymerizable component (a2) and 3 parts by mass of a photoradical polymerization initiator was formed into a film, and the film was irradiated with ultraviolet light (UV-LED) having a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50 RH%. 2 A cured product with a thickness of 50 μm is obtained by irradiating for 16 seconds. Next, the cured product is measured using a dynamic viscoelasticity measuring device (measurement temperature range -100 to 250°C, heating rate 2°C / min, frequency 1 Hz, tensile mode) to obtain a graph with temperature T on the horizontal axis and loss tangent tanδ on the vertical axis. The temperature at which tanδ reaches its maximum value on the obtained graph is defined as the glass transition temperature.

[0012] The composition of the present embodiment is preferably a composition containing a polymerization initiator (B) and an ultraviolet absorber (C). The polymerizable component (A) is preferably a polymerizable component (A) containing a (meth)acrylate compound. The polymerization initiator (B) is preferably a photoradical polymerization initiator. The composition of the present embodiment is preferably a temporary fixing composition.

[0013] 1. Temporary fixing composition The temporary fixing composition of this embodiment will be described below.

[0014] The temporary fixing composition of the present embodiment includes a polymerizable component (A) containing a (meth)acrylate compound, a photoradical polymerization initiator (B), and an ultraviolet absorber (C), and the (meth)acrylate compound includes a bifunctional (meth)acrylate compound (a1) having polymerizable functional groups at both ends and having a number average molecular weight of 750 or more and 10,000 or less, and a monofunctional or bifunctional (meth)acrylate compound (a2) having a glass transition temperature of 50°C or more of a cured product measured by the following [method]. [method] First, a mixture of 97 parts by mass of the monofunctional or bifunctional (meth)acrylate compound (a2) and 3 parts by mass of a photoradical polymerization initiator was formed into a film, and the film was irradiated with ultraviolet light (UV-LED) having a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50 RH%. 2 A cured product with a thickness of 50 μm is obtained by irradiating for 16 seconds. Next, the cured product is measured using a dynamic viscoelasticity measuring device (measurement temperature range -100 to 250°C, heating rate 2°C / min, frequency 1 Hz, tensile mode) to obtain a graph with temperature T on the horizontal axis and loss tangent tanδ on the vertical axis. The temperature at which tanδ reaches its maximum value on the obtained graph is defined as the glass transition temperature. The molecular weight can be analyzed, for example, by gel permeation chromatography (GPC). The GPC measurement conditions are as follows: Measuring device: HLC-8320GPC (Tosoh Corporation) Column: TSKgel GMHHR-H (300 mm x 7.8 mm ID, Tosoh Corporation) x 2 Column temperature: 40℃ Mobile phase: Tetrahydrofuran (stabilizer-free, GPC grade, Fujifilm Wako Pure Chemical Industries, Ltd.) Flow rate: 1mL / min Detector: RI (differential refractive index detector) Standard material: Polystyrene PStQuick Kit-H (Tosoh Corporation)

[0015] The mechanism by which the temporary fixing composition of this embodiment can reduce the amount of resin remaining on the wafer is not clear, but the following mechanism is presumed. First, the mechanism by which the resin residue occurs is presumed to be that the cured product of the temporary fixing composition has low toughness, which causes the cured product of the temporary fixing composition to break during peeling, resulting in the resin residue on the wafer. On the other hand, it is presumed that the temporary fixing composition of the present embodiment, which contains a specific (meth)acrylate compound, can improve the toughness of the cured product of the temporary fixing composition, thereby reducing the amount of residual resin.

[0016] The bifunctional (meth)acrylate compound (a1) of this embodiment preferably includes one or more compounds selected from the group consisting of urethane (meth)acrylates and polyester (meth)acrylates, and more preferably includes one or more compounds selected from the group consisting of urethane acrylates and polyester acrylates. This improves the toughness of the cured product of the temporary fixing composition, making the cured product of the temporary fixing composition less likely to break during peeling, and further reducing the amount of resin remaining on the wafer. Commercially available bifunctional (meth)acrylate compounds (a1) of this embodiment include UN-353, UN-333 (all manufactured by Negami Chemical Industrial Co., Ltd.), KRM7776, EBECRYL8413 (all manufactured by Daicel-Allnex Corporation), M-6100 (manufactured by Toagosei Co., Ltd.), PEAM-1769, PEAM-1044, and PEAM-645 (all manufactured by Designer Molecules Inc.), and the like.

[0017] The weight-average molecular weight of the bifunctional (meth)acrylate compound (a1) of this embodiment is preferably 1,000 or more and 9,000 or less, more preferably 2,000 or more and 8,000 or less, even more preferably 3,000 or more and 7,000 or less, and even more preferably 4,000 or more and 6,000 or less. This can improve the toughness of the cured product of the temporary fixing composition, making the cured product of the temporary fixing composition less likely to break during peeling, and further reducing the amount of resin remaining on the wafer.

[0018] The glass transition temperature of the cured product of the monofunctional or bifunctional (meth)acrylate compound (a2) of this embodiment, measured by the above-mentioned [Method], is preferably 60°C or higher, more preferably 65°C or higher, and even more preferably 70°C or higher. This improves the toughness of the cured product of the temporary fixing composition, making the cured product of the temporary fixing composition less likely to break during peeling, and further reducing the amount of resin remaining on the wafer. The upper limit of the glass transition temperature of the cured product of the monofunctional or bifunctional (meth)acrylate compound (a2) of this embodiment is not particularly limited, and may be, for example, 300°C or lower, 280°C or lower, 250°C or lower, 200°C or lower, 150°C or lower, or 120°C or lower.

[0019] The monofunctional or bifunctional (meth)acrylate compound (a2) of this embodiment preferably includes a monofunctional or bifunctional (meth)acrylate compound (a2) containing an alicyclic structure, more preferably includes one or more compounds selected from the group consisting of isobornyl (meth)acrylate, (meth)acryloylmorpholine, and tricyclodecane dimethanol di(meth)acrylate, even more preferably includes one or more compounds selected from the group consisting of isobornyl (meth)acrylate and (meth)acryloylmorpholine, even more preferably includes isobornyl (meth)acrylate, and even more preferably includes isobornyl acrylate. This can improve the toughness of the cured product of the temporary fixing composition, making the cured product of the temporary fixing composition less likely to break during peeling, and further reducing the amount of resin remaining on the wafer.

[0020] <Polymerizable component (A) containing a (meth)acrylate compound> The polymerizable component (A) containing a (meth)acrylate compound of this embodiment will be described below.

[0021] The (meth)acrylate compound of the present embodiment preferably contains one or more compounds selected from the group consisting of monofunctional (meth)acrylates and polyfunctional (meth)acrylates, and more preferably contains one or more compounds selected from the group consisting of monofunctional (meth)acrylates and difunctional (meth)acrylates.

[0022] The polyfunctional (meth)acrylate of the present embodiment refers to a di- or higher functional (meth)acrylate. The bifunctional (meth)acrylate will be described later. Examples of trifunctional (meth)acrylates include ethylene oxide isocyanurate modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, and tris[(meth)acryloyloxyethyl]isocyanurate. Examples of tetrafunctional or higher (meth)acrylates include ditrimethylolpropane tetra(meth)acrylate, dimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol ethoxy tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0023] The (meth)acrylate compound of the present embodiment may be a polyfunctional (meth)acrylate monomer or a polyfunctional (meth)acrylate polymer, or a mixture thereof. However, from the viewpoint of further reducing the amount of resin remaining on the wafer, it preferably contains a polyfunctional (meth)acrylate polymer, and more preferably contains a (meth)acrylic group-containing polybutyl(meth)acrylate.

[0024] The (meth)acrylate compound of the present embodiment preferably contains one or more compounds selected from the group consisting of monofunctional alkyl (meth)acrylates having an alkyl group, aromatic (meth)acrylates, alicyclic bifunctional (meth)acrylates, and acyclic bifunctional (meth)acrylates, and from the viewpoint of being able to provide a rigid structure, more preferably contains one or more compounds selected from the group consisting of aromatic (meth)acrylates and alicyclic bifunctional (meth)acrylates, and even more preferably contains an aromatic (meth)acrylate.

[0025] The alkyl group of the monofunctional alkyl (meth)acrylate having an alkyl group of this embodiment (hereinafter, may be simply referred to as the alkyl group of this embodiment) preferably includes one or more types selected from the group consisting of a linear alkyl group, a branched alkyl group, and an alicyclic alkyl group.

[0026] The alkyl group of the present embodiment preferably contains an alkyl group having 18 to 40 carbon atoms, and more preferably an alkyl group having 18 to 32 carbon atoms. This can enhance the aliphatic hydrocarbon properties of the polymerizable component (A) containing the (meth)acrylate compound of the present embodiment (preferably the aliphatic hydrocarbon properties of the entire system), thereby improving low volatility, chemical resistance, and heat resistance.

[0027] The alkyl group of this embodiment preferably includes one or more selected from the group consisting of branched alkyl groups and alicyclic alkyl groups, and more preferably includes one or more selected from the group consisting of branched alkyl groups and cycloalkyl groups such as an isostearyl group, an isotetracosanyl group (e.g., 2-decyl-1-tetradecanyl group), an isotriacontanyl group (e.g., 2-tetradecyl-1-octadecanyl group), etc. This can improve the compatibility of the polymerizable component (A) containing the (meth)acrylate compound of this embodiment with other components.

[0028] The monofunctional alkyl (meth)acrylate having an alkyl group of the present embodiment preferably includes one or more selected from the group consisting of stearyl (meth)acrylate, isostearyl (meth)acrylate, behenyl (meth)acrylate, 2-decyl-1-tetradecanyl (meth)acrylate, 2-dodecyl-1-hexadecanyl (meth)acrylate, and 2-tetradecyl-1-octadecanyl (meth)acrylate, more preferably includes one or more selected from the group consisting of stearyl (meth)acrylate and isostearyl (meth)acrylate, and even more preferably includes isostearyl (meth)acrylate.

[0029] The aromatic (meth)acrylate of the present embodiment preferably contains C1 to C6 alkyl groups from the viewpoint of providing a rigid structure. 20 Alkoxylated bisphenol A di(meth)acrylate, 9,9-bis(4-(2-(meth)acryloyloxyethoxy)phenyl)fluorene, nonylphenol ethylene oxide modified (meth)acrylate, 1,3-bis(2-(meth)acryloyloxy C1-C 20 The compound contains one or more selected from the group consisting of alkyl (meth)benzene, 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, nonylphenoxypolyethylene glycol (meth)acrylate, benzyl (meth)acrylate, and structural isomers thereof.

[0030] The aromatic (meth)acrylate of the present embodiment is preferably a C1 to C6 aromatic (meth)acrylate, from the viewpoint of further reducing the resin residue on the wafer. 20 It includes alkoxylated bisphenol A di(meth)acrylate, more preferably includes ethoxylated bisphenol A di(meth)acrylate, and even more preferably includes ethoxylated bisphenol A diacrylate (ethylene oxide-modified bisphenol A diacrylate).

[0031] From the viewpoint of further reducing the amount of resin remaining on the wafer, the aromatic (meth)acrylate of the present embodiment preferably contains 9,9-bis(4-(2-(meth)acryloyloxyethoxyl)phenyl)fluorene, and more preferably contains 9,9-bis(4-(2-acryloyloxyethoxyl)phenyl)fluorene.

[0032] The alicyclic bifunctional (meth)acrylate of the present embodiment is preferably a C1 to C6 alicyclic bifunctional (meth)acrylate from the viewpoint of providing a rigid structure. 20 Alkoxylated hydrogenated bisphenol A di(meth)acrylate, 1,3-di(meth)acryloyloxyadamantane, tricyclo C 10 ~C 20 Alkanedimethanol di(meth)acrylate, dicyclo C5-C 20 Di(meth)acrylates and structural isomers thereof, and more preferably C1 to C 20 It includes alkoxylated hydrogenated bisphenol A di(meth)acrylate, and more preferably includes ethoxylated hydrogenated bisphenol A di(meth)acrylate.

[0033] The acyclic bifunctional (meth)acrylate of the present embodiment preferably includes one or more selected from the group consisting of polyethylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, neopentyl glycol-modified trimethylolpropane di(meth)acrylate, stearic acid-modified pentaerythritol di(meth)acrylate, tripropylene glycol di(meth)acrylate, and caprolactone-modified hydroxypivalic acid neopentyl glycol di(meth)acrylate, more preferably includes polyethylene glycol di(meth)acrylate, and even more preferably includes polyethylene glycol diacrylate.

[0034] The content of the polymerizable component (A) containing a (meth)acrylate compound in the temporary fixing composition of this embodiment is preferably 50% by mass or more and less than 100% by mass, more preferably 65% ​​by mass or more and 99.5% by mass or less, even more preferably 75% by mass or more and 99.0% by mass or less, even more preferably 80% by mass or more and 98.9% by mass or less, and even more preferably 83% by mass or more and 98.8% by mass or less, relative to 100% by mass of the temporary fixing composition of this embodiment, from the viewpoint of further reducing the resin remaining on the wafer.

[0035] <Photoradical polymerization initiator (B)> The photoradical polymerization initiator (B) will be described below.

[0036] The photoradical polymerization initiator (B) of this embodiment is a compound whose molecules are cleaved and split into two or more radicals when irradiated with, for example, ultraviolet light or visible light (for example, a wavelength of 350 to 700 nm, preferably 365 to 500 nm, more preferably 385 to 450 nm).

[0037] From the viewpoint of further reducing the resin remaining on the wafer, the photoradical polymerization initiator (B) may be, for example, 2,2-dimethoxy-2-phenylacetophenone, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime), 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4 The compound may contain one or more compounds selected from the group consisting of 2,2-dimethoxy-2-phenylacetophenone, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime), and more preferably one or two compounds selected from the group consisting of 2,2-dimethoxy-2-phenylacetophenone and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0038] The content of the photoradical polymerization initiator (B) in the temporary fixing composition of this embodiment is preferably 0.1 parts by mass or more and 10.0 parts by mass or less, more preferably 0.5 parts by mass or more and 5.0 parts by mass or less, and even more preferably 1.0 parts by mass or more and 2.0 parts by mass or less, relative to 100 parts by mass of the polymerizable component (A) containing the (meth)acrylate compound of this embodiment, from the viewpoint of further reducing the resin remaining on the wafer.

[0039] <Ultraviolet absorber (C)> The ultraviolet absorbent (C) of this embodiment will be described below.

[0040] From the viewpoint of further reducing the resin residue on the wafer, the ultraviolet absorber (C) of the present embodiment preferably has one or more skeletons selected from the group consisting of a benzophenone skeleton, a triazole skeleton (preferably a benzotriazole skeleton), a hydroxyphenyltriazine skeleton, and a phenol skeleton (preferably a hindered phenol skeleton), more preferably has one or more skeletons selected from the group consisting of a benzophenone skeleton and a triazole skeleton (preferably a benzotriazole skeleton), and even more preferably has one or more skeletons selected from the group consisting of a benzophenone skeleton and a benzotriazole skeleton. The ultraviolet absorber (C) of this embodiment preferably has a polymerizable functional group. The polymerizable functional group of this embodiment is preferably present at the terminal of the ultraviolet absorber (C) of this embodiment.

[0041] From the viewpoint of further reducing the amount of resin remaining on the wafer, the ultraviolet absorber (C) of the present embodiment more preferably contains a benzotriazole-based ultraviolet absorber (C1) having a benzotriazole ring, a functional group containing a heteroatom, a polymerizable functional group, and an aliphatic hydrocarbon group having 4 to 30 carbon atoms.

[0042] The benzotriazole-based ultraviolet absorber (C1) of the present embodiment preferably contains a benzotriazole-based ultraviolet absorber (C1-1) represented by the following formula (1), which makes it easier for the cured product of the temporary fixing composition to be peeled from the wafer surface, and further reduces the amount of resin remaining on the wafer.

[0043] [ka]

[0044] In formula (1), R 1 contains a heteroatom-containing functional group, and R 2 contains a polymerizable functional group, and R 3 and R 4each independently contains an aliphatic hydrocarbon group having 4 to 30 carbon atoms, and n is an integer from 1 to 4.

[0045] In this embodiment, the heteroatom-containing functional group preferably includes one or more selected from the group consisting of a hydroxy group, an alkoxy group, a carboxy group, a carbonyl group, an ester group, an amino group, an amide group, a nitro group, an azo group, an imine group, a nitrile group, a thiol group, a sulfonic acid group, a sulfonyl group, and a thiocarbonyl group, and more preferably includes a hydroxy group. This makes it even easier to peel the cured product of the temporary fixing composition from the wafer surface, and can further reduce the amount of resin remaining on the wafer.

[0046] The polymerizable functional group in this embodiment preferably includes a polymerizable functional group containing a carbon-carbon double bond, more preferably includes one or more selected from the group consisting of a vinyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group, even more preferably includes a (meth)acryloyloxy group, and even more preferably includes an acryloyloxy group. This makes it even easier for the cured product of the temporary fixing composition to be peeled from the wafer surface, and further reduces the amount of resin remaining on the wafer. This also improves bleeding resistance and outgassing resistance.

[0047] The aliphatic hydrocarbon group in the present embodiment preferably contains an aliphatic hydrocarbon group having from 4 to 30 carbon atoms, more preferably contains an aliphatic hydrocarbon group having from 4 to 20 carbon atoms, even more preferably contains an aliphatic hydrocarbon group having from 4 to 18 carbon atoms, even more preferably contains an aliphatic hydrocarbon group having from 4 to 16 carbon atoms, even more preferably contains an aliphatic hydrocarbon group having from 4 to 14 carbon atoms, even more preferably contains an aliphatic hydrocarbon group having from 4 to 12 carbon atoms, even more preferably contains an aliphatic hydrocarbon group having from 4 to 10 carbon atoms, even more preferably contains an aliphatic hydrocarbon group having from 6 to 10 carbon atoms, and even more preferably contains an aliphatic hydrocarbon group having from 8 carbon atoms. This makes it even easier to peel the cured product of the temporary fixing composition from the wafer surface, and can further reduce the amount of resin remaining on the wafer.

[0048] The aliphatic hydrocarbon group in this embodiment preferably contains a branched aliphatic hydrocarbon group, more preferably contains a branched aliphatic hydrocarbon group having from 4 to 30 carbon atoms, even more preferably contains a branched aliphatic hydrocarbon group having from 4 to 20 carbon atoms, even more preferably contains a branched aliphatic hydrocarbon group having from 4 to 16 carbon atoms, even more preferably contains a branched aliphatic hydrocarbon group having from 4 to 12 carbon atoms, even more preferably contains a branched aliphatic hydrocarbon group having from 6 to 10 carbon atoms, even more preferably contains a branched aliphatic hydrocarbon group having 8 carbon atoms, and even more preferably contains a t-octyl group. This makes it even easier to peel the cured product of the temporary fixing composition from the wafer surface, and can further reduce the amount of resin remaining on the wafer.

[0049] In formula (1), n ​​is preferably an integer of 1 to 4, more preferably an integer of 1 to 3, even more preferably an integer of 1 or 2, and still more preferably 1. This makes it easier for the cured product of the temporary fixing composition to be peeled from the wafer surface, and can further reduce the amount of resin remaining on the wafer.

[0050] The weight-average molecular weight of the benzotriazole-based ultraviolet absorber (C1) of this embodiment is preferably 500 or more and 2,000 or less, more preferably 550 or more and 1,000 or less, and even more preferably 600 or more and 800 or less. This makes it easier for the cured product of the temporary fixing composition to be peeled from the wafer surface, and the amount of resin remaining on the wafer can be further reduced.

[0051] The content of the ultraviolet absorber (C) in the temporary fixing composition of this embodiment is preferably 0.01 to 30.0 parts by mass, more preferably 0.03 to 25.0 parts by mass, even more preferably 0.05 to 20.0 parts by mass, and still more preferably 0.07 to 18.0 parts by mass, relative to 100 parts by mass of the polymerizable component (A) containing the (meth)acrylate compound of this embodiment. This makes it even easier to peel the cured product of the temporary fixing composition from the wafer surface, and can further reduce the amount of resin remaining on the wafer.

[0052] <Other ingredients> The temporary fixing composition of the present embodiment may contain components other than those described above, and may contain known components such as, for example, a solvent, an antifoaming agent, a surfactant, a colorant, a polymerization inhibitor, a stabilizer, an adhesion modifier, a release agent, a filler, etc. The contents of these other components can be set arbitrarily as necessary.

[0053] <Physical properties of temporary fixing composition> Hereinafter, the physical properties of the temporary fixing composition of this embodiment will be described.

[0054] The peel strength of the temporary fixing cured film obtained by the following [Method] is preferably 0.01 (N / 50mm) or more and 3.00 (N / 50mm) or less, more preferably 0.01 (N / 50mm) or more and 2.50 (N / 50mm) or less, even more preferably 0.01 (N / 50mm) or more and 2.00 (N / 50mm) or less, even more preferably 0.02 (N / 50mm) or more and 1.70 (N / 50mm) or less, and even more preferably The applied pressure is preferably 0.03 (N / 50mm) or more and 1.40 (N / 50mm) or less, more preferably 0.04 (N / 50mm) or more and 1.00 (N / 50mm) or less, even more preferably 0.05 (N / 50mm) or more and 0.80 (N / 50mm) or less, even more preferably 0.06 (N / 50mm) or more and 0.50 (N / 50mm) or less, and even more preferably 0.07 (N / 50mm) or more and 0.30 (N / 50mm) or less. This makes it even easier for the cured product of the temporary fixing composition to be peeled off from the wafer surface, and further reduces the amount of resin remaining on the wafer. [method] A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of a temporary fixing composition is applied between a silicon wafer (150 mm diameter x 625 μm thickness) having a non-photosensitive polyimide applied to 95% or more of its surface and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer to which the non-photosensitive polyimide has been applied and the glass support member. Next, under a nitrogen atmosphere, a UV-LED with a wavelength of 405 nm (illuminance 300 W / cm 2 , irradiation time 16 seconds, cumulative light intensity 4,800mJ / cm2 The temporary fixing film is cured by irradiating it from the glass support member side with light, obtaining a temporary fixing cured film. This is placed on a hot plate with the silicon wafer side to which the non-photosensitive polyimide is applied facing downwards, and is heated at 150°C for 1 hour. Next, a UV laser with a wavelength of 355 nm (output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) is irradiated onto the temporary fixing cured film from the glass support member side, scanning the entire temporary fixing cured film. Next, the glass support member is peeled off to obtain a test piece in a state where the temporary fixing cured film is adhered to the silicon wafer to which the non-photosensitive polyimide is applied. Next, a 50 mm wide cut is made in the temporary fixing cured film on the test piece using a cutter, and the temporary fixing cured film is peeled off from the silicon wafer in accordance with JIS Z 0237:2009 under conditions of 23°C, a peel angle of 180°, and a peel speed of 300 mm / min, and the peel strength is measured.

[0055] In accordance with JIS Z 8803:2011, measured at a temperature of 23°C using an E-type viscometer at a shear rate of 75 sec -1 From the viewpoint of improving workability, the viscosity of the temporary fixing composition of the present embodiment measured by is preferably 1000 mPa·s or more and 4000 mPa·s or less, more preferably 2000 mPa·s or more and 3800 mPa·s or less, and even more preferably 2500 mPa·s or more and 3700 mPa·s or less.

[0056] The tensile stress at break of the temporary fixing composition of this embodiment, measured by the following [method], is preferably 10 MPa or more and 50 MPa or less, more preferably 15 MPa or more and 45 MPa or less, even more preferably 18 MPa or more and 40 MPa or less, even more preferably 20 MPa or more and 35 MPa or less, and even more preferably 25 MPa or more and 30 MPa or less. This can improve the toughness of the cured product of the temporary fixing composition, making the cured product of the temporary fixing composition less likely to break during peeling, and further reducing the amount of resin remaining on the wafer. The tensile elongation at break of the temporary fixing composition of this embodiment, measured by the following [method], is preferably 5.0% or more and 50.0% or less, more preferably 10.0% or more and 48.0% or less, even more preferably 15.0% or more and 45.0% or less, even more preferably 20.0% or more and 43.0% or less, and even more preferably 25.0% or more and 40.0% or less. This can improve the toughness of the cured product of the temporary fixing composition, making the cured product of the temporary fixing composition less likely to break when peeled off, and further reducing the amount of resin remaining on the wafer. [method] The temporary fixing composition of this embodiment is sandwiched between two PET films to form a film, and then irradiated with ultraviolet light (UV-LED) having a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50 RH%. 2 A 50 μm thick cured product is obtained by irradiating it for 16 seconds at 1000 kJ / s. The thickness is adjusted by inserting a 50 μm thick tape between the PET films. Next, the cured product is punched out using a dumbbell-shaped 1BA mold conforming to Appendix A of JIS K 7161-1:2014 to obtain a test dumbbell. Next, the obtained test dumbbell is used to measure the tensile stress at break and the tensile elongation at break under conditions of 23°C and a tensile speed of 120 mm / min in accordance with JIS K 7161-1:2014.

[0057] <Uses of temporary fixing composition> Hereinafter, uses of the temporary fixing composition of this embodiment will be described.

[0058] The temporary fixing composition of this embodiment is preferably capable of temporarily fixing a support member and a wafer.

[0059] The support member of this embodiment is not particularly limited, but preferably includes a light-transmitting material. This allows light irradiation such as UV laser irradiation to be performed from the support member side. Examples of light-transmitting materials include inorganic substrates such as crystal, glass, quartz, calcium fluoride, and magnesium fluoride, and organic substrates such as plastic.

[0060] The support member of this embodiment preferably includes one or more types selected from the group consisting of a quartz support member and a glass support member, and more preferably includes a glass support member.

[0061] The wafer of this embodiment preferably comprises a semiconductor wafer.

[0062] 2. Wafer manufacturing method The wafer manufacturing method of this embodiment will be described below.

[0063] The method for producing a wafer of this embodiment includes a peeling step of irradiating light from the support member side to a structure (b) including a support member, a cured film of the temporary fixing composition of this embodiment, and a wafer in this order, to decompose at least a part of the cured film of the temporary fixing composition of this embodiment, thereby peeling off the wafer from the support member.

[0064] The light irradiated from the support member side preferably contains a UV laser having a wavelength of 300 nm or more and 385 nm or less, more preferably 320 nm or more and 375 nm or less, and even more preferably 350 nm or more and 365 nm or less, from the viewpoint of improving the peelability of the cured film of the temporary fixing composition from the support member.

[0065] The method for producing a wafer according to this embodiment preferably further includes a thinning step of obtaining a structure (c) by thinning the wafer in the structure (b) before the peeling step.

[0066] The method for producing a wafer of this embodiment preferably further includes, before the thinning step, a curing step of irradiating light onto a structure (a) including a support member, a temporary fixing film made of the temporary fixing composition of this embodiment, and a wafer in this order, to cure the temporary fixing film, thereby obtaining a structure (b).

[0067] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0068] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0069] Unless otherwise stated, experiments were conducted at 23°C and 50% humidity.

[0070] <Preparation of temporary fixing composition> The components were mixed at 80° C. in the formulation (unit: parts by mass) shown in Table 1 below to obtain temporary fixing compositions of the respective examples. The contents of each component are as follows.

[0071] The following was used as the polymerizable component (A) containing a (meth)acrylate compound. UN-353 (bifunctional (meth)acrylate compound (a1), urethane acrylate, product name: UN-353, Negami Chemical Industrial Co., Ltd., bifunctional, weight average molecular weight: 5,000, urethane acrylate having a polyester skeleton) A-BPEF-2 (9,9-bis(4-(2-acryloyloxyethoxyl)phenyl)fluorene, product name: A-BPEF-2, manufactured by Shin-Nakamura Chemical Co., Ltd.) A-BPE-10 (ethylene oxide-modified bisphenol A diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.) M-113 (nonylphenol ethylene oxide modified acrylate, product name: Aronix M-113, manufactured by Toagosei Co., Ltd., glass transition temperature: -18°C) IBXA (monofunctional (meth)acrylate compound (a2), isobornyl acrylate, product name: IBXA, Osaka Organic Chemical Industry Ltd., glass transition temperature: 95°C)

[0072] The glass transition temperature of the cured product of the polymerizable component (A) was measured by the following method. [method] First, a mixture of 97 parts by mass of polymerizable component (A) and 3 parts by mass of a photoradical polymerization initiator (Omnirad 651, manufactured by IGM Resins BV) was sandwiched between two PET films (product name: Lumirror, manufactured by Toray Industries, Inc.) to form a film, and then irradiated with ultraviolet light (UV-LED) with a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50% RH. 2 The thickness was adjusted by inserting a 50 μm thick tape between the PET films. The cured product was then measured using a dynamic viscoelasticity measuring device (model: RSA3, manufactured by T.A. Instruments, measuring temperature range -100 to 250°C, heating rate 2°C / min, frequency 1Hz, tensile mode), and a graph was obtained with temperature T on the horizontal axis and loss tangent tanδ on the vertical axis. The temperature at which tanδ reached its maximum value on the graph was determined to be the glass transition temperature.

[0073] The following was used as the photoradical polymerization initiator (B). Omnirad 819 (bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, product name: Omnirad 819, manufactured by IGM Resins)

[0074] The following was used as the ultraviolet absorber (C). C1-1 (composition produced by the following [method]) [method] A 100 mL recovery flask was charged with 7 mmol of 2,2'-methylenebis[6-(benzotriazol-2-yl)-4-tert-octylphenol] (a compound represented by the following chemical formula (10), manufactured by Tokyo Chemical Industry Co., Ltd.), 42 mmol of KCO3, and 25 mL of dehydrated THF under a nitrogen atmosphere, followed by stirring at room temperature for 2 hours. Next, 3.5 mmol of acryloyl chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) was added, and after attaching a reflux condenser, the mixture was reacted in an oil bath at 70 °C for 4 hours. The reaction solution was then gravity filtered and evaporated. The remaining solution was then dissolved in 30 mL of chloroform and transferred to a separatory funnel. 50 mL of water was added to wash the mixture. The mixture was then extracted three times with chloroform. Sodium sulfate was added to the resulting chloroform solution, which was then left overnight and filtered through cotton. The resulting solution was then evaporated to obtain C1-1.

[0075] [ka]

[0076] C1-1 1 H-NMR analysis revealed that the compound represented by the following chemical formula (100) was contained at 99%. 1 H-NMR data: δ = 0.69-0.75, 1.30-1.41, 1.70-1.78, 4.08-4.20, 5.85-6.50, 7.30-8.50, 11.2-11.7 ppm 1 The H-NMR measurement conditions are as follows: The product obtained as described above was dissolved in deuterated chloroform (reagent grade, manufactured by Tokyo Chemical Industry Co., Ltd.) to prepare a 3% by mass solution, and then 1 H-nuclear magnetic resonance measurement ( 1 H-NMR was performed. Measuring device: JNM-ECZ400R (manufactured by JEOL) Frequency: 400MHz Deuterated solvent: deuterated chloroform

[0077] [ka]

[0078] Furthermore, analysis of C1-1 by gel permeation chromatography (GPC) revealed that the weight average molecular weight was 610 and the number average molecular weight was 607. The GPC measurement conditions are as follows: Measuring device: HLC-8320GPC (Tosoh Corporation) Column: TSKgel GMHHR-H (300 mm x 7.8 mm ID, Tosoh Corporation) x 2 Column temperature: 40℃ Mobile phase: Tetrahydrofuran (stabilizer-free, GPC grade, Fujifilm Wako Pure Chemical Industries, Ltd.) Flow rate: 1mL / min Detector: RI (differential refractive index detector) Standard material: Polystyrene PStQuick Kit-H (Tosoh Corporation)

[0079] The following ultraviolet absorbents were used as ultraviolet absorbents other than the ultraviolet absorbent (C) of this embodiment (hereinafter referred to as other ultraviolet absorbents (C)). 2,2'-methylenebis[6-(benzotriazol-2-yl)-4-tert-octylphenol] (manufactured by Tokyo Chemical Industry Co., Ltd., a compound represented by the above chemical formula (10))

[0080] <Peel strength> The peel strength of the temporary fixing composition was measured by the following [method]. The results are shown in Table 1. [method] A disk-shaped temporary fixing film (150 mm diameter × 50 μm thickness) made of the temporary fixing composition of this example was applied between a silicon wafer (150 mm diameter × 625 μm thickness, manufactured by Seiren KST) having a non-photosensitive polyimide (product name: PIX-3400, manufactured by HD Microsystems, thickness 5 μm) applied to 95% or more of its surface and a disk-shaped glass support member (150 mm diameter × 700 μm thickness), thereby bonding the silicon wafer to which the non-photosensitive polyimide was applied and the glass support member. Next, under a nitrogen atmosphere, a UV-LED with a wavelength of 405 nm (illuminance 300 W / cm 2 , irradiation time 16 seconds, cumulative light intensity 4,800mJ / cm 2 The temporary fixing film was cured by irradiating the temporary fixing film from the glass support member side, and a cured temporary fixing film was obtained. This film was placed on a hot plate with the silicon wafer side to which the non-photosensitive polyimide was applied facing downwards, and was heated at 150°C for 1 hour. Next, a UV laser with a wavelength of 355 nm (output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) was irradiated onto the temporary fixing cured film from the glass support member side, scanning the entire temporary fixing cured film. Next, the glass support member was peeled off to obtain a test piece in a state where the temporary fixing cured film was adhered to the silicon wafer to which the non-photosensitive polyimide had been applied. Next, a 50 mm wide cut was made in the cured film for temporary fixation on the test piece using a cutter, and the cured film for temporary fixation was peeled off from the silicon wafer in accordance with JIS Z 0237:2009 under conditions of 23°C, a peel angle of 180°, and a peel speed of 300 mm / min, to measure the peel strength.

[0081] <Viscosity> In accordance with JIS Z 8803:2011, the viscosity was measured at a temperature of 23°C using an E-type viscometer (model: DVNXHBCBG, manufactured by Brookfield) at a shear rate of 75 sec -1 (rotation speed: 5 rpm, plate model number: CPA-40Z) to measure the viscosity of the temporary fixing composition. The results are shown in Table 1.

[0082] <Tensile stress at break and tensile elongation at break> The tensile breaking stress and tensile breaking elongation of the temporary fixing composition were measured by the following [method]. The results are shown in Table 1. [method] The temporary fixing composition was sandwiched between two PET films (product name: Lumirror, manufactured by Toray Industries, Inc.) to form a film, which was then irradiated with ultraviolet light (UV-LED) with a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50% RH. 2 The thickness was adjusted by inserting a 50 μm thick tape between the PET films. Next, the cured product was punched out using a dumbbell-shaped 1BA mold conforming to Appendix A of JIS K 7161-1:2014 to obtain a test dumbbell. Next, the tensile stress at break and the tensile elongation at break were measured using the obtained test dumbbells in accordance with JIS K 7161-1:2014 using a universal testing machine Instron model 3365 (manufactured by Instron) at 23°C and a tensile speed of 120 mm / min.

[0083] <Resin residue on wafer> After peel strength evaluation was performed using the method described above in <Peel Strength>, the wafer surface was visually observed, and the amount of resin remaining on the wafer was evaluated according to the following criteria: The results are shown in Table 1. No: No resin residue on the wafer Yes: Resin remains on the wafer

[0084] [Table 1]

[0085] With the temporary fixing compositions of Examples, no resin remained on the wafer. This shows that with the temporary fixing composition of this embodiment, the amount of resin remaining on the wafer can be reduced.

Claims

1. A temporary fixing composition, The composition comprises a polymerizable component (A) containing a (meth)acrylate compound, a photoradical polymerization initiator (B), and an ultraviolet absorber (C), The (meth)acrylate compound is a bifunctional (meth)acrylate compound (a1) having polymerizable functional groups at both ends and having a weight average molecular weight of 750 or more and 10,000 or less; a monofunctional or bifunctional (meth)acrylate compound (a2) having a glass transition temperature of 50°C or higher when cured, as measured by the following [method]. [method] First, a mixture of 97 parts by mass of the monofunctional or bifunctional (meth)acrylate compound (a2) and 3 parts by mass of a photoradical polymerization initiator was formed into a film, and the film was irradiated with ultraviolet light (UV-LED) having a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50 RH%. ２ The resulting cured product has a thickness of 50 μm. Next, the cured product is measured using a dynamic viscoelasticity measuring device (measurement temperature range -100 to 250°C, heating rate 2°C / min, frequency 1 Hz, tensile mode) to obtain a graph with temperature T on the horizontal axis and loss tangent tanδ on the vertical axis. The temperature at which tanδ reaches its maximum value on the obtained graph is defined as the glass transition temperature.

2. 2. The temporary fixing composition according to claim 1, wherein the monofunctional or bifunctional (meth)acrylate compound (a2) includes one or more compounds selected from the group consisting of isobornyl (meth)acrylate, (meth)acryloylmorpholine, and tricyclodecane dimethanol di(meth)acrylate.

3. The temporary fixing composition according to claim 1 or 2, wherein the (meth)acrylate compound includes an aromatic (meth)acrylate.

4. The aromatic (meth)acrylate is １ ~C ２０ The temporary fixing composition according to claim 3 , comprising an alkoxylated bisphenol A di(meth)acrylate.

5. The temporary fixing composition according to claim 3, wherein the aromatic (meth)acrylate includes 9,9-bis(4-(2-(meth)acryloyloxyethoxyl)phenyl)fluorene.

6. 3. The temporary fixing composition according to claim 1, wherein the ultraviolet absorber (C) comprises a benzotriazole-based ultraviolet absorber (C1) having a benzotriazole ring, a functional group containing a heteroatom, a polymerizable functional group, and an aliphatic hydrocarbon group having 4 or more and 30 or less carbon atoms.

7. The temporary fixing composition according to claim 6, wherein the benzotriazole-based ultraviolet absorber (C1) comprises a benzotriazole-based ultraviolet absorber (C1-1) represented by the following formula (1): 【Chemistry 1】 (In the formula (1), R １ contains a heteroatom-containing functional group, and R ２ contains a polymerizable functional group, and R ３ and R ４ each independently contains an aliphatic hydrocarbon group having 4 to 30 carbon atoms, and n is an integer from 1 to 4.

8. The temporary fixing composition according to claim 6 , wherein the functional group containing a heteroatom contains a hydroxy group.

9. The temporary fixing composition according to claim 6 , wherein the polymerizable functional group includes one or more groups selected from the group consisting of a vinyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group.

10. The temporary fixing composition according to claim 6 , wherein the aliphatic hydrocarbon group contains a branched aliphatic hydrocarbon group having 4 to 30 carbon atoms.

11. The temporary fixing composition according to claim 10, wherein the aliphatic hydrocarbon group includes a t-octyl group.

12. The temporary fixing composition according to claim 6 , wherein the benzotriazole-based ultraviolet absorber (C1) has a weight average molecular weight of 500 or more and 2,000 or less.

13. The temporary fixing composition according to claim 1 or 2, wherein the peel strength of the temporary fixing cured film obtained by the following [method] is 3.00 (N / 50 mm) or less. [method] A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a silicon wafer (150 mm diameter x 625 μm thickness) having a non-photosensitive polyimide applied to 95% or more of its surface and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer to which the non-photosensitive polyimide has been applied and the glass support member. Next, under a nitrogen atmosphere, a UV-LED with a wavelength of 405 nm (illuminance 300 W / cm ２ , irradiation time 16 seconds, cumulative light amount 4,800 mJ / cm ２ The temporary fixing film is cured by irradiating the temporary fixing film from the glass support member side, and the temporary fixing film is placed on a hot plate with the silicon wafer side to which the non-photosensitive polyimide is applied facing downward, followed by heat treatment at 150°C for 1 hour. Next, a UV laser having a wavelength of 355 nm (output: 6.5 W, spot diameter: 150 μm, irradiation pitch: 200 μm, scan speed: 8 m / sec, frequency: 40 kHz) is irradiated onto the temporary fixing cured film from the glass support member side so as to scan the entire temporary fixing cured film. Next, the glass support member is peeled off to obtain a test piece in a state where the temporary fixing cured film is attached onto the silicon wafer to which the non-photosensitive polyimide is applied. Next, a 50 mm wide notch is made in the cured film for temporary fixing on the test piece using a cutter, and the cured film for temporary fixing is peeled off from the silicon wafer in accordance with JIS Z 0237:2009 under conditions of 23°C, a peel angle of 180°, and a peel speed of 300 mm / min, to measure the peel strength.

14. According to JIS Z 8803:2011, the viscosity was measured at a temperature of 23°C using an E-type viscometer at a shear rate of 75 sec. －１ The temporary fixing composition according to claim 1 or 2, wherein the viscosity of the temporary fixing composition measured by the above method is 1000 mPa·s or more and 4000 mPa·s or less.

15. The temporary fixing composition according to claim 1 or 2, which is capable of temporarily fixing a support member and a wafer.

16. The temporary fixing composition according to claim 15 , wherein the support member comprises a glass support member.

17. The temporary fixing composition according to claim 15 , wherein the wafer comprises a semiconductor wafer.

18. A method for manufacturing a wafer, comprising:

10. A method for manufacturing a wafer, comprising: a peeling step of irradiating a structure (b) including, in this order, a support member, a cured film of the temporary fixing composition according to claim 1 or 2, with light from the support member side to decompose at least a part of the cured film of the temporary fixing composition, thereby peeling the wafer from the support member.

19. The method for producing a wafer according to claim 18 , wherein the light includes a UV laser having a wavelength of 300 nm or more and 385 nm or less.

20. Before the peeling step, The method for producing a wafer according to claim 18, further comprising a thinning step of thinning the wafer in the structure (b) to obtain a structure (c).

21. Before the thinning step, 21. The method for producing a wafer according to claim 20, further comprising a curing step of irradiating light to a structure (a) including the support member, a temporary fixing film made of the temporary fixing composition according to claim 1 or 2, and the wafer in this order, to cure the temporary fixing film, thereby obtaining the structure (b).

22. 1. A composition comprising: a polymerizable component (A) containing a polymerizable functional group, The polymerizable component (A) a bifunctional polymerizable component (a1) having a weight average molecular weight of 750 or more and 10,000 or less; A composition comprising: a monofunctional or bifunctional polymerizable component (a2) having a glass transition temperature of 50°C or higher when cured, as measured by the following [method]. [method] First, a mixture of 97 parts by mass of the polymerizable component (a2) and 3 parts by mass of a photoradical polymerization initiator was formed into a film, and the film was irradiated with ultraviolet light (UV-LED) having a wavelength of 405 nm at an irradiation intensity of 300 mW / cm under conditions of a temperature of 23°C and a humidity of 50% RH. ２ The resulting cured product has a thickness of 50 μm. Next, the cured product is measured using a dynamic viscoelasticity measuring device (measurement temperature range -100 to 250°C, heating rate 2°C / min, frequency 1 Hz, tensile mode) to obtain a graph with temperature T on the horizontal axis and loss tangent tanδ on the vertical axis. The temperature at which tanδ reaches its maximum value on the obtained graph is defined as the glass transition temperature.

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