Mapping apparatus and load port apparatus

Abstract

To provide a mapping device capable of accurately detecting a storage state of a detection object regardless of the presence or absence of deflection of the detection object, and to provide a load port having the mapping device.SOLUTION: The mapping device 20 detects an accommodation state of the plate-shaped object to be detected 100 accommodated in the container 10. The mapping device 20 includes a first sensor having a first optical axis 33 extending along the opening 14 of the vessel 10, and a second sensor having a second optical axis 43a extending toward the side of the vessel 10 so as to obliquely intersect the first optical axis 33.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a mapping device and a load port device having a mapping device. [Background technology]

[0002] Generally, a load port is equipped with a mapping device to detect the storage state of substrates (whether or not they are overlapping, whether or not they are tilted, etc.) (see Patent Document 1). The mapping device in Patent Document 1 has a transmission type sensor. The optical axis of the sensor extends horizontally along the opening of the container. When the sensor descends inside the container, the light emitted by the sensor is sequentially irradiated onto the multiple substrates stored in the container (specifically, the edges of the substrates located on the opening side of the container). Based on the signal output from the sensor during this time, the storage state of the substrates stored in the container can be detected.

[0003] Meanwhile, shelves for placing substrates are provided on both side walls of the container in several tiers. Normally, one substrate is placed on each tier, but two or more substrates may accidentally be placed overlapping on one tier. If the substrates are not bent, the detection value when the sensor detects two overlapping substrates will be different from the detection value when the sensor detects a single substrate. This is because the detection distance (the movement distance of the sensor in the vertical direction) when the sensor detects two overlapping substrates is different from the detection distance when the sensor detects a single substrate. Therefore, whether or not the substrates are overlapping can be detected based on the detection value of the sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-35384 Summary of the Invention [Problem to be solved by the invention]

[0005] However, if the substrates (especially the central portion of the substrates) are warped, it may be difficult to detect whether the substrates are overlapping. If the amount of warping of one substrate corresponds to the sum of the thicknesses of the two substrates, the detection distance when the sensor detects one warped substrate will be equal to the detection distance when the sensor detects two overlapping substrates (but not warped). Therefore, the detection value of the sensor when one substrate is warped will be equal to the detection value of the sensor when two substrates (but not warped) are overlapping. In this case, it is not possible to distinguish between the warping of one substrate and the overlapping of two substrates based on the detection value of the sensor. Thus, with conventional mapping devices, it has been difficult to accurately detect the storage state of substrates when the substrates are warped.

[0006] The present invention has been made in consideration of the above-described circumstances, and its purpose is to provide a mapping device and a load port having a mapping device that can accurately detect the storage state of an object to be detected, regardless of whether the object to be detected is bent or not. [Means for solving the problem]

[0007] In order to achieve the above object, a mapping device according to the present invention comprises: A mapping device for detecting a state of a plate-shaped detection object contained in a container, a first sensor having a first optical axis extending along the opening of the container; and a second sensor having a second optical axis extending toward the side of the container so as to obliquely intersect with the first optical axis.

[0008] The mapping device according to the present invention includes a first sensor having a first optical axis extending along the opening of the container. Therefore, when the first sensor moves vertically, the first optical axis intersects with an end (hereinafter, "front end") of the object to be detected located on the opening side of the container at a predetermined timing. Based on the detection value of the signal output from the first sensor at this time, it is possible to detect, although not distinguish, whether the objects to be detected are overlapping or bending.

[0009] The mapping device according to the present invention also includes a second sensor having a second optical axis extending toward the side of the container so as to intersect the first optical axis at an angle. Therefore, when the second sensor moves vertically, the second optical axis intersects at least the side of the object to be detected. Generally, the side of the object to be detected is located on shelves on both sides of the container and is therefore less likely to bend. Therefore, when one object to be detected is bent, the detection value (detection distance L) of the second sensor corresponds to the thickness (T) of the object to be detected. Furthermore, when n (n≧2) objects to be detected are overlapping, the detection value (detection distance L') of the second sensor corresponds to the sum of the thicknesses of the n objects to be detected (n×T). Therefore, L≠L', and it is possible to determine whether the objects to be detected are overlapping and whether they are bent based on the detection value of the second sensor.

[0010] The second optical axis may be inclined so as to approach the side wall of the container as it moves toward the back of the container. In this case, the second optical axis is inclined toward the side portion of the detection object and intersects with the side portion of the detection object. As described above, since the side portion of the detection object is less likely to bend, the detection value of the second sensor corresponds to the thickness of one detection object or the sum of the thicknesses of n detection objects. Therefore, it is possible to determine whether the detection objects are overlapping and whether the detection objects are bending based on the detection value of the second sensor.

[0011] The shape of the detection object may be rectangular in a plan view, have a first side parallel to the opening and a second side perpendicular to the first side, and the second optical axis may intersect the first side and the second side at a corner of the detection object. In this case, the second optical axis intersects a portion of a lateral portion of the detection object where bending is less likely to occur. Therefore, based on the detection value of the second sensor, it is possible to detect with higher accuracy whether the detection objects (e.g., rectangular substrates) are overlapping and whether the detection objects are bending.

[0012] The object to be detected may have a circular shape in a plan view, and the second optical axis may intersect with a first point and a second point on the outer periphery of the object to be detected, with at least one of the first point and the second point being located on a side of the container. In this case, the second optical axis intersects with a portion of the side of the object to be detected where bending is less likely to occur. Therefore, based on the detection value of the second sensor, it is possible to detect with higher accuracy whether the object to be detected (e.g., a circular substrate) is overlapping and whether the object to be detected is bending.

[0013] The first sensor may have a first light-emitting unit and a first light-receiving unit that receives light emitted by the first light-emitting unit, and the second sensor may have a second light-emitting unit and a second light-receiving unit that receives light emitted by the second light-emitting unit, and the height positions of the first light-emitting unit and the first light-receiving unit may be equal to the height positions of the second light-emitting unit and the second light-receiving unit. If the height positions of the first light-emitting unit and the first light-receiving unit differ from the height positions of the second light-emitting unit and the second light-receiving unit, the vertical movement distance of the first sensor or the second sensor is reduced by a distance corresponding to the difference. In contrast, if the height positions of the first light-emitting unit and the first light-receiving unit are equal to the height positions of the second light-emitting unit and the second light-receiving unit, both the first sensor and the second sensor can move from the top to the bottom of the container. Therefore, the first sensor and the second sensor can detect the storage state of the detection target over a wide range.

[0014] The second sensor may have a second light-emitting unit and a second light-receiving unit that receives light emitted by the second light-emitting unit, wherein one of the second light-emitting unit and the second light-receiving unit is located closer to the front of the container than the first sensor, and the other of the second light-emitting unit and the second light-receiving unit is located closer to the back of the container than the first sensor. In this case, when the first sensor and the second sensor move vertically, the second optical axis intersects with a lateral portion of the detection object at the same time that the first optical axis intersects with the front edge of the detection object. Therefore, the detection values ​​of the first sensor and the second sensor are acquired at substantially the same time, improving the detection speed of the mapping device.

[0015] The second sensor may be a pair of second sensors, and the second optical axis of one of the second sensors and the second optical axis of the other second sensor may become increasingly distant from each other as they move toward the back of the container. In this case, one second optical axis extends toward one side (e.g., the left side) of the container in the horizontal direction when viewed from the opening side of the container. One second optical axis intersects with a lateral portion of the object to be detected on one side (e.g., the left side) in the horizontal direction. The other second optical axis extends toward the other side (e.g., the right side) of the container in the horizontal direction when viewed from the opening side of the container. The other second optical axis intersects with a lateral portion of the object to be detected on the other side (e.g., the right side) in the horizontal direction. This allows the second sensor to detect the storage state of the object to be detected based on detection values ​​from both side portions of the object to be detected. Therefore, the second sensor can accurately detect the storage state of the object to be detected.

[0016] At least one of the first optical axis and the second optical axis may be inclined with respect to a horizontal plane. In this case, the detection distance of at least one of the first sensor and the second sensor increases according to the inclination angle of at least one of the first optical axis and the second optical axis. Therefore, it is possible to accurately detect whether or not the detection objects overlap and whether or not the detection objects are bent.

[0017] The mapping device may further include a mapping arm parallel to the opening and a jig attached to the mapping arm and having the first and second sensors mounted thereon. When the mapping arm advances toward the opening of the container, the first and second sensors enter the interior of the container. When the mapping arm moves vertically in this state, the first optical axis intersects with the front edge of the detection object, and the second optical axis intersects with the side of the detection object. This allows the detection values ​​of the first sensor and the second sensor to be obtained.

[0018] In order to achieve the above object, the load port apparatus according to the present invention comprises: any of the mapping devices described above; an installation section for installing the container; and a door for opening and closing the lid of the container.

[0019] For example, if the mapping device detects overlapping or bending of the detection objects, it can prevent interference between the arm and the detection object by stopping the operation of the arm (the arm of the semiconductor manufacturing device attached to the load port device).The arm then starts handling the detection object only after confirming that there is space between one adjacent shelf and the other for the arm to safely enter, thereby preventing damage to the arm or the detection object. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a schematic diagram of a load port apparatus having a mapping device according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a schematic diagram of the load port device shown in FIG. 1 when a container is attached thereto. [Figure 3] FIG. 3 is a schematic diagram of the mapping device shown in FIG. 2 when inserted into the interior of a container. [Figure 4] FIG. 4 is a schematic diagram of the mapping device shown in FIG. 3 when it is lowered. [Figure 5] FIG. 5 is a cross-sectional view of the container shown in FIG. 2 as viewed from the opening side. [Figure 6] FIG. 6 is a cross-sectional view of the container shown in FIG. 2 as seen from above. [Figure 7] FIG. 7 is a perspective view of the mapping device shown in FIG. [Figure 8] FIG. 8 is a perspective view of the first sensor, the second sensor, and the jig shown in FIG. [Figure 9] FIG. 9 is a conceptual diagram for explaining the mechanism by which the first sensor and the second sensor shown in FIG. 7 detect the detection target. [Figure 10A] FIG. 10A is a conceptual diagram for explaining the movement direction of the first sensor shown in FIG. [Figure 10B]FIG. 10B is a conceptual diagram for explaining the movement direction of the second sensor shown in FIG. [Figure 11] FIG. 11 is a conceptual diagram showing bending and overlapping of the detection object contained in the container. [Figure 12A] FIG. 12A is a conceptual diagram for explaining a detection mechanism when the first sensor and the second sensor detect overlapping of detection targets. [Figure 12B] FIG. 12B is a conceptual diagram for explaining a detection mechanism when the first sensor and the second sensor detect bending of the detection object. [Figure 13] FIG. 13 is a perspective view of a mapping device according to the second embodiment of the present invention. [Figure 14] FIG. 14 is a perspective view of the first sensor and the second sensor shown in FIG. [Figure 15] FIG. 15 is a perspective view of a modified example of the first sensor shown in FIG. 10A. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the contents shown in the drawings are merely shown schematically and exemplarily to facilitate understanding of the present invention, and the appearance and dimensional ratios may differ from the actual product. Furthermore, the present invention is not limited to the following embodiments.

[0022] First embodiment As shown in FIG. 1, a mapping device 20 according to the first embodiment of the present invention is provided in a load port device 1. The mapping device 20 is a device that detects the storage state (presence or absence of overlap, presence or absence of bending, presence or absence of tilted arrangement, presence or absence of positional deviation, presence or absence of protrusion toward the opening side of the container 10, etc.) of multiple plate-shaped detection objects stored in a container 10 (FIG. 2). In this embodiment, the detection objects of the mapping device 20 are multiple substrates 100. The substrates 100 are square semiconductor wafers (silicon wafers) that have a rectangular shape in a planar view. However, the substrates 100 may also be semiconductor wafers that have a circular shape in a planar view. Alternatively, the substrates 100 may be glass substrates or the like that have a rectangular or circular shape in a planar view.

[0023] The load port device 1 is used by being assembled to a semiconductor manufacturing device (not shown) that performs processes (heat treatment, doping process to add specific impurities, photolithography process, exposure process, etching process, etc.) on a substrate 100 (FIG. 2). The load port device 1 is a unit that serves as an interface between the container 10 and the semiconductor manufacturing device.

[0024] 2 and 3, the X axis is an axis along the horizontal direction parallel to the opening 14 of the container 10 (FIG. 3). The Y axis is an axis along the horizontal direction perpendicular to the opening 14 of the container 10. The Z axis is an axis along the vertical direction. Hereinafter, the direction along the Z axis will be referred to as the up-down direction, and the direction along the Y axis will be referred to as the front-to-back direction. The positive side of the Z axis will be referred to as the upside, and the negative side of the Z axis will be referred to as the downside. The negative side of the Y axis will be referred to as the front, and the positive side of the Y axis will be referred to as the rear.

[0025] In this embodiment, "parallel" is not limited to strictly parallel, and also includes a state where the deviation from strictly parallel is within a few degrees (for example, 3°) or less. Furthermore, "perpendicular" is not limited to strictly perpendicular, and also includes a state where the deviation from strictly perpendicular is within a few degrees (for example, 3°) or less.

[0026] The container 10 is, for example, a FOUP (Front-Opening Unified Pod: a front-opening cassette-integrated transport and storage container). The container 10 is used to store and transport a plurality of substrates 100 in a sealed state. The container 10 is placed in the installation section 3 of the load port device 1. The container 10 is transferred to the installation section 3 by, for example, an automatic transport device.

[0027] As shown in FIG. 2, the container 10 has a main body 11 and a lid 15. A plurality of substrates 100 are housed inside the main body 11. The plurality of substrates 100 are arranged in multiple stages in the vertical direction (see FIG. 5). An opening 14 (FIG. 3) is formed in the front (rear) of the main body 11. The plurality of substrates 100 are inserted into and removed from the main body 11 through the opening 14 by a robot arm of a semiconductor manufacturing device (not shown).

[0028] 2 and 3, lid 15 is removably attached to opening 14. By attaching lid 15 to opening 14, the inside of main body 11 is sealed, and the inside of container 10 can be maintained in a highly clean state.

[0029] As shown in FIG. 5, a plurality of shelves 12a and a plurality of shelves 12b are provided inside the main body 11. The plurality of shelves 12a and the plurality of shelves 12b are arranged at regular intervals along the Z axis. The plurality of shelves 12a and the plurality of shelves 12b extend along the Y axis and face each other along the X axis. The plurality of shelves 12a are attached to a side wall 16a located on one side of the main body 11 in the X axis direction and protrude inward in the X axis direction from the side wall 16a. The plurality of shelves 12b are attached to a side wall 16b located on the other side of the main body 11 in the X axis direction and protrude inward in the X axis direction from the side wall 16b. The plurality of shelves 12a may be provided spaced apart from the side wall 16a. Similarly, the plurality of shelves 12b may be provided spaced apart from the side wall 16b.

[0030] The substrate 100 has a side portion 110a located on one side in the X-axis direction and a side portion 110b located on the other side in the X-axis direction. The side portion 110a is disposed on the shelf 12a, and the side portion 110b is disposed on the shelf 12b. The side portions 110a and 110b are supported by the shelves 12a and 12b, respectively, while the center portion of the substrate 100 in the X-axis direction is not supported.

[0031] 1 and 2, the load port apparatus 1 has at least a mapping device 20. In this embodiment, the load port apparatus 1 further has a frame 2, an installation unit 3, a door 4, a door arm 5, a first drive unit 50, a second drive unit 60, a third drive unit 70, and a sensor position detection unit 80. However, the configuration of the load port apparatus 1 is not limited to the configuration shown in FIGS. 1 and 2, and any of the above-mentioned components may be omitted.

[0032] The frame 2 is disposed so as to face the front of the container 10 (the side on which the lid 15 is disposed). A frame opening 6 is formed in the frame 2. The frame opening 6 is provided at a position corresponding to the opening 14, and the size of the frame opening 6 corresponds to the size of the opening 14. As shown in FIG. 3, when the opening 14 is fitted into the frame opening 6, the container 10 is connected to the frame 2. A robot arm of a semiconductor manufacturing device (not shown) puts and takes out the substrate 100 from the container 10 through the frame opening 6. The shapes of the frame opening 6 and the opening 14 are not particularly limited, but may be, for example, rectangular.

[0033] The installation unit 3 is a platform for installing the container 10, and is configured to be movable in the front-to-rear direction. When the installation unit 3 moves forward, the container 10 installed on the installation unit 3 moves forward. When the installation unit 3 moves backward, the container 10 installed on the installation unit 3 moves backward.

[0034] The door 4 moves relatively to the frame opening 6 in the front-to-rear direction to open and close the frame opening 6. The door 4 also opens and closes the opening 14 of the container 10 while holding the lid 15. When the door 4 moves back from the opening 14 while engaged with the lid 15, the lid 15 is removed from the container 10. When the door 4 moves forward toward the opening 14 while engaged with the lid 15, the lid 15 is attached to the container 10. As shown in Figures 3 and 4, the door 4 moves up and down relative to the frame opening 6 while holding the lid 15.

[0035] The door arm 5 is fixed to the door 4 and supports the door 4. The door arm 5 is directly or indirectly connected to a first drive unit 50. The door arm 5 is configured to be movable up and down by being driven by the first drive unit 50. The first drive unit 50 is, for example, an air-driven rodless cylinder, and has a movable body 51 and a cylinder tube 52. Compressed air is supplied to and exhausted from the cylinder tube 52. The movable body 51 moves up and down along the cylinder tube 52 by controlling the air pressure of the compressed air inside the cylinder tube 52.

[0036] When the movable body 51 descends along the cylinder tube 52, the door arm 5 descends accordingly. Conversely, when the movable body 51 ascends along the cylinder tube 52, the door arm 5 ascends accordingly.

[0037] The second drive unit 60 drives the door arm 5 to be movable in the front-rear direction and to be rotatable. The door arm 5 rotates around the second drive unit 60. As shown in FIGS. 2 and 3 , the second drive unit 60 rotates the door arm 5 rearward so as to move away from the frame opening 6. Although not shown in detail, the second drive unit 60 also rotates the door arm 5 forward so as to move closer to the frame opening 6. The second drive unit 60 is directly or indirectly connected to the movable body 51. Therefore, the door arm 5, together with the second drive unit 60, rises and falls in accordance with the rising and falling movement of the movable body 51.

[0038] The third drive unit 70 drives the support arm 21 of the mapping device 20 to be movable in the front-rear direction and also to be rotatable. The support arm 21 rotates around the third drive unit 70. As shown in FIGS. 2 and 3, the third drive unit 70 rotates the support arm 21 forward (toward the opening 14). Although not shown in detail, the third drive unit 70 also rotates the support arm 21 backward (away from the opening 14). The third drive unit 70 is directly or indirectly connected to the movable body 51. Therefore, the support arm 21, together with the third drive unit 70, rises and falls in accordance with the rising and falling of the movable body 51.

[0039] The sensor position detection unit 80 is a position detection sensor (for example, a transmission sensor) and detects the vertical positions of the sensors (first sensor 30, second sensor 40a, and second sensor 40b described below) of the mapping device 20. The signal output by the sensor position detection unit 80 is provided to a calculation unit 90 of the mapping device 20. Based on the signal output from the sensor position detection unit 80, the calculation unit 90 identifies the relative position of the mapping sensor with respect to the substrate 100 in the vertical direction.

[0040] As shown in Fig. 1, the mapping device 20 is provided near the door 4 of the load port device 1. The mapping device 20 detects the accommodation state of the substrates 100 accommodated in the container 10 (Fig. 2). The mapping device 20 has a support arm 21, a mapping arm 22, jigs 23a and 23b (Fig. 7), a first sensor 30 (Fig. 7), second sensors 40a and 40b (Fig. 7), and a calculation unit 90 (Fig. 2).

[0041] As shown in FIG. 1 , the support arm 21 is made up of a rod-shaped member. The support arm 21 is arranged along the outer edges of the door 4 and the door arm 5 so as to surround the door 4 and the door arm 5. The mapping arm 22 is made up of a rod-shaped member and attached to the support arm 21. The mapping arm 22 is fastened to the support arm 21 by a fastening member such as a bolt. However, the mapping arm 22 may be integral with the support arm 21.

[0042] As shown in FIG. 6, the mapping arm 22 is disposed parallel to the horizontal plane and parallel to the opening 14 (to the X-axis). However, the mapping arm 22 may be tilted at an angle of less than 5 degrees relative to the horizontal plane. The mapping arm 22 may also be tilted at an angle of less than 5 degrees horizontally relative to the X-axis. As shown in FIG. 7, the cross-sectional shape of the mapping arm 22 is not particularly limited, but may be, for example, rectangular. The mapping arm 22 moves in the front-rear and up-down directions in accordance with the movement of the support arm 21 (FIG. 1) in the front-rear and up-down directions.

[0043] The jigs 23a and 23b are configured by plate-like members bent into an L shape. The jigs 23a and 23b are attached to the mapping arm 22 and are spaced apart along the axial direction of the mapping arm 22. The jig 23a is located at one end of the mapping arm 22 in the axial direction, and the jig 23b is located at the other end of the mapping arm 22 in the axial direction. The jig 23a has a shape that is mirror-symmetrical to the jig 23b.

[0044] The jig 23a has a first portion 24a and a second portion 25a, and the jig 23b has a first portion 24b and a second portion 25b. The first portions 24a and 24b extend parallel to the mapping arm 22. The first portions 24a and 24b are attached to the mapping arm 22 by fasteners such as bolts. The second portions 25a and 25b are continuous with the first portions 24a and 24b, respectively, and are perpendicular to the first portions 24a and 24b. The angle between the first portion 24a and the second portion 25a is 90 degrees, but may be less than 90 degrees or greater than 90 degrees. Similarly, the angle between the first portion 24b and the second portion 25b is 90 degrees, but may be less than 90 degrees or greater than 90 degrees.

[0045] 6, the second portions 25a and 25b extend forward so as to protrude toward the opening 14. As the mapping arm 22 moves forward, at least a portion (tip) of the second portion 25a enters the interior of the container 10 through the opening 14. More specifically, at least a portion of the second portion 25a enters between the side portion 110a of the substrate 100 and the side wall 16a of the container 10.

[0046] Furthermore, as the mapping arm 22 descends, at least a part (tip) of the second portion 25b enters the interior of the container 10 through the opening 14. More specifically, the second portion 25b enters between the side portion 110b of the substrate 100 and the side wall 16b of the container 10.

[0047] When second portion 25a is positioned to the side of side portion 110a and second portion 25b is positioned to the side of side portion 110b, the end portion of substrate 100 on the opening 14 side (hereinafter referred to as front end 112 of substrate 100) is sandwiched on both sides by second portion 25a and second portion 25b.

[0048] The first portions 24a and 24b are disposed parallel to the opening 14, and the second portions 25a and 25b are disposed perpendicular to the opening 14. The second portions 25a and 25b extend along the Y axis, but may be inclined toward the side of the container 10 by less than 10 degrees relative to the Y axis.

[0049] As shown in Fig. 8, the first sensor 30 is an optical sensor (transmission sensor) that detects the front edge 112 of the substrate 100 (Fig. 6). The first sensor 30 has a first light-emitting unit 31 and a first light-receiving unit 32 that receives light emitted by the first light-emitting unit 31. The first light-emitting unit 31 is, for example, a visible light LED, an infrared LED, an ultraviolet LED, or a laser diode. The first light-receiving unit 32 is, for example, a phototransistor, a photodiode, or an infrared detection element.

[0050] The first light-emitting unit 31 faces the first light-receiving unit 32 along the X-axis. The first sensor 30 has a first optical axis 33 extending along the opening 14 of the container 10 (FIG. 6). The first optical axis 33 is the optical axis of light emitted by the first light-emitting unit 31. In FIG. 9 and other drawings, for ease of understanding, the first optical axis 33 is shown as an imaginary line connecting the first light-emitting unit 31 and the first light-receiving unit 32, intersecting the substrate 100 (passing through the substrate 100). In reality, the light emitted by the first light-emitting unit 31 does not pass through the substrate 100 but is blocked by the substrate 100. As shown in FIG. 8, the first light-emitting unit 31 is provided on the jig 23a, and the first light-receiving unit 32 is provided on the jig 23b. However, the first light-emitting unit 31 may be provided on the jig 23b, and the first light-receiving unit 32 may be provided on the jig 23a.

[0051] The first light-emitting unit 31 is provided at the end (tip) of the second portion 25a in the Y-axis direction. The first light-receiving unit 32 is provided at the end (tip) of the second portion 25b in the Y-axis direction. The first light-emitting unit 31 and the first light-receiving unit 32 are arranged in the second portions 25a and 25b, respectively, so that the first optical axis 33 is parallel to the mapping arm 22 (FIG. 6) or the opening 14.

[0052] The second sensor 40a is an optical sensor (transmission sensor) and includes a second light emitter 41a and a second light receiver 42a that receives the light emitted by the second light emitter 41a. The second light emitter 41a is, for example, a visible light LED, an infrared LED, an ultraviolet LED, or a laser diode. The second light receiver 42a is, for example, a phototransistor, a photodiode, or an infrared detection element. The second optical axis 43a is the optical axis of the light emitted by the second light emitter 41a. For ease of understanding, in FIG. 9 and other drawings, the second optical axis 43a is depicted as an imaginary line connecting the second light emitter 41a and the second light receiver 42a, intersecting the substrate 100 (transmitting through the substrate 100). In reality, the light emitted by the second light emitter 41a does not transmit through the substrate 100 but is blocked by the substrate 100.

[0053] As shown in FIG. 8, the second light-emitting unit 41a is provided at the end (tip) of the first portion 24a in the X-axis direction. The second light-receiving unit 42a is provided at the end (tip) of the second portion 25a in the Y-axis direction. However, the second light-emitting unit 41a may be provided at the tip of the second portion 25a, and the second light-receiving unit 42a may be provided at the tip of the first portion 24a. As shown in FIG. 9, the second light-receiving unit 42a is located further back (negative Y-axis direction) of the container 10 than the first sensor 30 (first light-emitting unit 31). The second light-emitting unit 41a is located closer to the front (positive Y-axis direction) of the container 10 than the first sensor 30 (first light-emitting unit 31).

[0054] As shown in FIG. 8, the second sensor 40b is a transmission sensor and includes a second light emitter 41b and a second light receiver 42b that receives the light emitted by the second light emitter 41b. The second light emitter 41b is, for example, a visible light LED, an infrared LED, an ultraviolet LED, or a laser diode. The second light receiver 42b is, for example, a phototransistor, a photodiode, or an infrared detection element. The second optical axis 43b is the optical axis of the light emitted by the second light emitter 41b. For ease of understanding, in FIG. 9 and other drawings, the second optical axis 43b is depicted as an imaginary line connecting the second light emitter 41b and the second light receiver 42b, intersecting the substrate 100 (transmitting through the substrate 100). In reality, the light emitted by the second light emitter 41b does not transmit through the substrate 100 but is blocked by the substrate 100.

[0055] As shown in FIG. 8, the second light-emitting unit 41b is provided at the end (tip) of the first portion 24b in the X-axis direction. The second light-receiving unit 42b is provided at the end (tip) of the second portion 25b in the Y-axis direction. However, the second light-emitting unit 41b may be provided at the tip of the second portion 25b, and the second light-receiving unit 42b may be provided at the tip of the first portion 24b. As shown in FIG. 9, the second light-receiving unit 42b is located further back (negative Y-axis direction) of the container 10 than the first sensor 30 (first light-receiving unit 32). The second light-emitting unit 41b is located closer to the front (positive Y-axis direction) of the container 10 than the first sensor 30 (first light-receiving unit 32).

[0056] 6, the second optical axis 43a extends toward the side of the container 10 so as to obliquely intersect with the first optical axis 33. When viewed from the front side (opening 14 side) of the container 10, the second optical axis 43a is inclined so as to approach the side wall 16a as it approaches the back of the container 10. The second optical axis 43a is inclined toward the side portion 110a of the substrate 100 and virtually intersects with the side portion 110a. The inclination angle θa of the second optical axis 43a with respect to the first optical axis 33 is not particularly limited, but is in the range of 30°≦θa≦60°.

[0057] Similarly, the second optical axis 43b extends toward the side of the container 10 so as to obliquely intersect with the first optical axis 33. When viewed from the front side of the container 10, the second optical axis 43b is inclined so as to approach the side wall 16b as it extends toward the back of the container 10. Therefore, the second optical axis 43b is inclined toward the side portion 110b of the substrate 100 and virtually intersects with the side portion 110b. The inclination angle θb of the second optical axis 43b with respect to the first optical axis 33 is not particularly limited, but is in the range of 30°≦θb≦60°. The angle θb is equal to the angle θa, but may be different.

[0058] When detecting the substrate 100, the second optical axis 43a intersects with a first side S1 of the substrate 100, which is parallel to the opening 14, and also intersects with a second side S2 perpendicular to the first side S1, at the corner 111a of the substrate 100. More specifically, the second optical axis 43a obliquely intersects with the end of the first side S1 on the negative X-axis direction side, and also obliquely intersects with the end of the second side S2 on the positive Y-axis direction side.

[0059] Here, the end of the first side S1 on the negative X-axis side refers to a portion located within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the first side S1 along the X-axis from the intersection of the first side S1 and the second side S2. The end of the second side S2 on the positive Y-axis side refers to a portion located within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the second side S2 along the Y-axis from the intersection of the first side S1 and the second side S2. The corner 111a of the substrate 100 refers to a portion within a predetermined length from the intersection of the first side S1 and the second side S2. Here, the predetermined length refers to the length of the end of the first side S1 on the negative X-axis side or the length of the end of the second side S2 on the positive Y-axis side.

[0060] When detecting the substrate 100, the second optical axis 43b intersects with a first side S1 of the substrate 100, which is parallel to the opening 14, and also intersects with a third side S3 perpendicular to the first side S1, at the corner 111b of the substrate 100. More specifically, the second optical axis 43b obliquely intersects with the end of the first side S1 on the positive X-axis direction side, and also obliquely intersects with the end of the third side S3 on the positive Y-axis direction side.

[0061] Here, the end of the first side S1 on the positive X-axis side refers to a portion located within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the first side S1 along the X-axis from the intersection of the first side S1 and the third side S3. The end of the third side S3 on the positive Y-axis side refers to a portion located within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the third side S3 along the Y-axis from the intersection of the first side S1 and the third side S3. The corner 111b of the substrate 100 refers to a portion within a predetermined length from the intersection of the first side S1 and the third side S3. Here, the predetermined length refers to the length of the end of the first side S1 on the positive X-axis side or the length of the end of the third side S3 on the positive Y-axis side.

[0062] The second optical axis 43a and the second optical axis 43b move away from each other as they move toward the back of the container 10 (in a direction moving forward away from the opening 14). An imaginary extension line of the second optical axis 43a obliquely intersects the side wall 16a of the container 10 and also obliquely intersects the opening 14 (opening surface). Furthermore, an imaginary extension line of the second optical axis 43b obliquely intersects the side wall 16b of the container 10 and also obliquely intersects the opening 14 (opening surface).

[0063] As shown in FIG. 7, the height positions of the first light-emitting unit 31 and the first light-receiving unit 32 from a reference position (for example, the bottom of the container 10 shown in FIG. 5) are equal to the height positions of the second light-emitting unit 41a and the second light-receiving unit 42a from the reference position. However, there may be a difference between these height positions within ±7% (preferably ±5%, more preferably ±3%). Furthermore, the height positions of the first light-emitting unit 31 and the first light-receiving unit 32 from a reference position (for example, the bottom of the container 10 shown in FIG. 5) are equal to the height positions of the second light-emitting unit 41b and the second light-receiving unit 42b from the reference position. However, there may be a difference between these height positions within ±7% (preferably ±5%, more preferably ±3%).

[0064] Furthermore, the first light-emitting unit 31 and the first light-receiving unit 32 are located on the same plane as the second light-emitting unit 41a and the second light-receiving unit 42a. Therefore, the first optical axis 33 and the second optical axis 43a are located on the same plane. Furthermore, the first light-emitting unit 31 and the first light-receiving unit 32 are located on the same plane as the second light-emitting unit 41b and the second light-receiving unit 42b. Therefore, the first optical axis 33 and the second optical axis 43b are located on the same plane.

[0065] The calculation unit 90 shown in Figure 2 determines the storage state of the substrate 100 stored in the container 10 based on the signal output from the sensor position detection unit 80, the signal output from the first sensor 30 shown in Figure 7, and the signals output from the second sensors 40a and 40b shown in Figure 7.

[0066] Next, the mechanism by which the mapping device 20 detects the accommodation state of the substrate 100 will be described. As shown in FIG. 3, when the door arm 5 rotates rearward while the door 4 is engaged with the lid 15, the lid 15 is removed from the container 10. This opens the opening 14 of the container 10. In this state, when the support arm 21 of the mapping device 20 rotates forward, the mapping arm 22 moves forward. Then, as shown in FIG. 6, the second portion 25a and the second portion 25b enter the interior of the container 10 through the opening 14.

[0067] When the second portion 25a and the second portion 25b enter the inside of the container 10, the mapping arm 22 descends together with the door arm 5, as shown in Fig. 4. Then, the mapping device 20 (first sensor 30, second sensor 40a, second sensor 40b) shown in Fig. 7 detects the accommodation state of the plurality of substrates 100 accommodated in the container 10.

[0068] 10A is a view of one of the plurality of substrates 100 housed in the container 10, viewed from the front end 112 side. As the mapping arm 22 descends, the first optical axis 33 of the first sensor 30 descends from a position (1) above one of the substrates 100 housed in the container 10 to a position (3) below it. At position (1), the front end 112 is not located between the first light-emitting unit 31 and the first light-receiving unit 32. Therefore, the light emitted by the first light-emitting unit 31 reaches the first light-receiving unit 32 without being blocked by the front end 112. As a result, the first light-receiving unit 32 receives light greater than a predetermined threshold.

[0069] Furthermore, even in position (3), the front end 112 is not located between the first light-emitting unit 31 and the first light-receiving unit 32. Therefore, the light emitted by the first light-emitting unit 31 reaches the first light-receiving unit 32 without being blocked by the front end 112. As a result, the first light-receiving unit 32 receives light that is greater than a predetermined threshold.

[0070] On the other hand, in position (2), the front end 112 is located between the first light-emitting unit 31 and the first light-receiving unit 32. Therefore, the light emitted by the first light-emitting unit 31 is blocked by the front end 112. As a result, the first light-receiving unit 32 receives light that is less than a predetermined threshold. In this manner, the amount of light received by the first light-receiving unit 32 changes depending on whether or not the substrate 100 is present between the first light-emitting unit 31 and the first light-receiving unit 32. Therefore, the detection value of the signal output by the first sensor 30 is a value corresponding to the amount of light received by the first light-receiving unit 32, and changes depending on whether or not the substrate 100 (front end 112) is present between the first light-emitting unit 31 and the first light-receiving unit 32. As will be described later, the amount of light received by the first light-receiving unit 32 changes depending on the state of the substrates 100 in the container 10 (whether or not they are overlapping, whether or not they are bent, whether or not they are obliquely disposed, etc.).

[0071] 10B is a view of one of the plurality of substrates 100 contained in the container 10, viewed from the corner 111a side. Below, of the second sensors 40a and 40b, the detection mechanism of the substrate 100 by the second sensor 40a will be described. The detection mechanism of the substrate 100 by the second sensor 40b is similar to the detection mechanism of the substrate 100 by the second sensor 40a, and therefore a detailed description thereof will be omitted.

[0072] As the mapping arm 22 descends, the second optical axis 43a of the second sensor 40a descends from position (1) above one of the substrates 100 housed in the container 10 to position (3) below it. At position (1), the corner 111a is not located between the second light-emitting unit 41a and the second light-receiving unit 42a. Therefore, the light emitted by the second light-emitting unit 41a reaches the second light-receiving unit 42a without being blocked by the corner 111a. As a result, the second light-receiving unit 42a receives light greater than a predetermined threshold.

[0073] Furthermore, even in position (3), the corner 111a is not located between the second light-emitting unit 41a and the second light-receiving unit 42a. Therefore, the light emitted by the second light-emitting unit 41a reaches the second light-receiving unit 42a without being blocked by the corner 111a. As a result, the second light-receiving unit 42a receives light greater than a predetermined threshold.

[0074] On the other hand, at position (2), a corner 111a is located between the second light-emitting unit 41a and the second light-receiving unit 42a. Therefore, the light emitted by the second light-emitting unit 41a is blocked by the corner 111a. As a result, the second light-receiving unit 42a receives light that is less than a predetermined threshold. Thus, the amount of light received by the second light-receiving unit 42a varies depending on whether or not the substrate 100 is present between the second light-emitting unit 41a and the second light-receiving unit 42a. Therefore, the detected value of the signal output by the second sensor 40a corresponds to the amount of light received by the second light-receiving unit 42a, and varies depending on whether or not the substrate 100 (corner 111a) is present between the second light-emitting unit 41a and the second light-receiving unit 42a. As will be described later, the amount of light received by the second light-receiving unit 42a varies depending on the state of the substrates 100 in the container 10 (whether or not they overlap, whether or not they are bent, whether or not they are obliquely disposed, etc.).

[0075] 11, two substrates 100 may be accidentally placed overlapping on one shelf 12a and 12b. As shown in FIG. 12A, when the first sensor 30 detects the two substrates 100, the light emitted by the first light-emitting unit 31 is blocked by the front edges 112 of the two substrates 100. In other words, the first optical axis 33 intersects with the front edges 112. During this time, the first sensor 30 descends a distance equivalent to twice the thickness T of the substrates 100. Therefore, when the first sensor 30 detects two overlapping substrates 100, the detection value of the signal output by the first sensor 30 corresponds to twice the thickness T of the substrates 100 (the sum of the thicknesses of the two substrates 100: 2T).

[0076] 10A, when the first sensor 30 detects one substrate 100, the light emitted by the first light-emitting unit 31 is blocked by the front edge 112 of the substrate 100. During this time, the first sensor 30 descends a distance equivalent to the thickness T of the substrate 100. Therefore, when the first sensor 30 detects one substrate 100, the detection value of the signal output by the first sensor 30 becomes a value corresponding to the thickness T of the substrate 100.

[0077] In this way, when the substrates 100 are not bent, the detection distance (movement distance) when the first sensor 30 detects two overlapping substrates 100 is twice the detection distance when the first sensor 30 detects a single substrate 100. Therefore, the detection value of the first sensor 30 when the first sensor 30 detects two overlapping substrates 100 differs from the detection value of the first sensor 30 when the first sensor 30 detects a single substrate 100. Therefore, the storage state of the substrates 100 (here, whether the substrates 100 are overlapping or not) can be identified based on the detection value of the first sensor 30.

[0078] 11, when the substrates 100 (especially the central portions of the substrates 100) are warped, it is difficult to determine whether the substrates 100 are overlapping or warping using only the first sensor 30. If the amount of warping of one substrate 100 corresponds to the sum (2T) of the thicknesses of the two substrates 100, the detection value of the first sensor 30 when detecting one warped substrate 100 will be a value corresponding to the sum (2T) of the thicknesses of the two substrates 100. On the other hand, as described above, the detection value of the first sensor 30 when detecting two overlapping substrates 100 will be a value corresponding to the sum (2T) of the thicknesses of the two substrates 100.

[0079] Therefore, theoretically, the detection value of the first sensor 30 when it detects one bent substrate 100 is equal to the detection value of the first sensor 30 when it detects two overlapping substrates 100. In this case, it is not possible to distinguish between the bending of one substrate 100 and the overlapping of two unbent substrates 100 based on the detection value of the first sensor 30.

[0080] 7, the mapping device 20 is equipped with at least one (in this embodiment, both) of second sensors 40a and 40b in addition to the first sensor 30. As shown in FIG. 9, the second optical axis 43a of the second sensor 40a extends toward the side of the container 10 so as to obliquely intersect with the first optical axis 33.

[0081] Therefore, as shown in FIG. 12B , when the second sensor 40a detects the substrate 100, the second optical axis 43a intersects with the side portion 110a of the substrate 100 at the corner 111a of the substrate 100. At this time, the light emitted by the second light-emitting unit 41a is blocked by the side portion 110a of the bent substrate 100. Generally, the side portion 110a is disposed on the shelf 12a ( FIG. 5 ) and is therefore unlikely to bend. Therefore, while the second optical axis 43a intersects with the side portion 110a of the bent substrate 100, the second sensor 40a descends a distance equivalent to the thickness T of the substrate 100. Therefore, when the second sensor 40a detects the bent substrate 100, the detection value of the signal output by the second sensor 40a corresponds to the thickness T of the substrate 100.

[0082] 12A, when the second sensor 40a detects the two overlapping substrates 100, the second optical axis 43a intersects with the side portions 110a of the two substrates 100 at the corner 111a of the two substrates 100. At this time, the light emitted by the second light-emitting unit 41a is blocked by the side portions 110a of the two overlapping substrates 100. As described above, the side portions 110a are generally not easily deflected because they are disposed on the shelf 12a (FIG. 5). Therefore, while the second optical axis 43a intersects with the side portions 110a of the two substrates 100, the second sensor 40a descends a distance equivalent to the sum of the thicknesses of the two substrates 100 (2T). Therefore, when the second sensor 40a detects the two overlapping substrates 100, the detection value of the signal output by the second sensor 40a corresponds to the sum of the thicknesses of the two substrates 100 (2T).

[0083] As a result, the detection value (a value corresponding to the thickness T of the substrate 100) when the second sensor 40a detects one bent substrate 100 is different from the detection value (a value corresponding to the sum 2T of the thicknesses of the two substrates 100) when the second sensor 40a detects two overlapping substrates 100. Therefore, based on the detection value of the second sensor 40a, it is possible to determine whether the substrates 100 are overlapping and whether the substrates 100 are bent.

[0084] As described above, the mapping device 20 of this embodiment can accurately detect the accommodation state of the substrates 100 (whether or not there is overlap, whether or not there is bending, etc.) regardless of whether or not there is bending of the substrates 100. Furthermore, the mapping device 20 of this embodiment can also accurately detect whether or not the substrates 100 are tilted, whether or not there is a positional deviation, whether or not there is a protrusion toward the opening side of the container 10, etc.

[0085] 7, the height positions of the first light-emitting unit 31 and the first light-receiving unit 32 from a reference position (e.g., the bottom of the container 10 shown in FIG. 5) are equal to the height positions of the second light-emitting unit 41a and the second light-receiving unit 42a from the reference position. If the height positions of the first light-emitting unit 31 and the first light-receiving unit 32 differ from the height positions of the second light-emitting unit 41a and the second light-receiving unit 42a, the vertical movement distance of the first sensor 30 or the second sensor 40a is reduced by a distance corresponding to the difference. In contrast, if the height positions of the first light-emitting unit 31 and the first light-receiving unit 32 are equal to the height positions of the second light-emitting unit 41a and the second light-receiving unit 42a, both the first sensor 30 and the second sensor 40a can move from the top to the bottom of the container 10 (FIG. 5). Therefore, the first sensor 30 and the second sensor 40a can detect the state of the substrates 100 contained in the container 10 over a wide range in the vertical direction.

[0086] 9, the second light-emitting unit 41a is located closer to the front of the container 10 than the first sensor 30, and the second light-receiving unit 42a is located closer to the back of the container 10 than the first sensor 30. Therefore, when the first sensor 30 and the second sensor 40a move in the up-down direction, the second optical axis 43a intersects with the side portion 110a of the substrate 100 at the same time that the first optical axis 33 intersects with the front edge 112 of the substrate 100. As a result, the detection values ​​of the first sensor 30 and the second sensor 40a are acquired at substantially the same time, improving the detection speed of the mapping device 20.

[0087] As shown in FIG. 6 , the second optical axis 43a and the second optical axis 43b become increasingly separated from each other as they move toward the back of the container 10. Therefore, the second optical axis 43a extends toward the sidewall 16a of the container 10 when viewed from the opening 14 side. The second optical axis 43a virtually intersects with the side portion 110a of the substrate 100. The second optical axis 43b extends toward the sidewall 16b of the container 10 when viewed from the opening 14 side. The second optical axis 43b virtually intersects with the side portion 110b of the substrate 100. This allows the second sensors 40a and 40b to detect the storage state of the substrate 100 based on the detection values ​​of the side portions 110a and 110b on both sides of the substrate 100. Therefore, the second sensors 40a and 40b can accurately detect the storage state of the substrate 100.

[0088] 6 and 7, the mapping device 20 includes a mapping arm 22 parallel to the opening 14 and jigs 23a and 23b attached to the mapping arm 22 and equipped with a first sensor 30, a second sensor 40a, and a second sensor 40b. When the mapping arm 22 advances toward the opening 14 of the container 10, the first sensor 30, the second sensor 40a (second light receiving unit 42a), and the second sensor 40b (second light receiving unit 42b) enter the interior of the container 10. When the mapping arm 22 descends in this state, the first optical axis 33 intersects with the front end 112 of the substrate 100, and the second optical axes 43a and 43b intersect with the side portions 110a and 110b of the substrate 100, respectively. This allows the detection value of the first sensor 30 and the detection values ​​of the second sensors 40a and 40b to be acquired.

[0089] Furthermore, in this embodiment, the operation of the arm for handling the substrates 100 can be stopped in response to the overlapping of multiple substrates 100 or the bending of the substrates 100. This makes it possible to prevent interference between the arm and the substrates 100. Furthermore, as shown in FIG. 11, it is possible to confirm that there is a space for the arm to safely enter between one shelf 12a, 12b and the other shelf 12a, 12b adjacent in the vertical direction. This makes it possible to prevent damage to the arm or the substrates 100.

[0090] Second embodiment 13 has the same configuration as the mapping device 20 of the first embodiment, except for the following points. The same reference numerals are used to designate parts that overlap with the mapping device 20 of the first embodiment, and detailed descriptions thereof will be omitted.

[0091] The mapping device 20A differs from the mapping device 20 of the first embodiment in that it includes jigs 23aA and 23bA. The jig 23aA includes a third portion 26a in addition to the first portion 24a and the second portion 25a. The jig 23bA includes a third portion 26b in addition to the first portion 24b and the second portion 25b. The third portions 26a and 26b protrude from the first portion 24 along the Y axis in a direction away from the mapping arm 22. The protruding directions of the third portions 26a and 26b are the same as the protruding directions of the second portions 25a and 25b, respectively.

[0092] 14, the second light-emitting unit 41a is provided in the third portion 26a. However, the second light-receiving unit 42a may also be provided in the third portion 26a. Furthermore, the second light-emitting unit 41b is provided in the third portion 26b. However, the second light-receiving unit 42b may also be provided in the third portion 26b.

[0093] In this embodiment, the same effects as in the first embodiment can be obtained. Additionally, in this embodiment, the third portion 26a is provided on the jig 23aA, and the third portion 26b is provided on the jig 23bA. Therefore, when the jigs 23aA and 23bA are placed inside the container 10 (FIG. 5), the positions of the second light-emitting units 41a and 41b in the front-rear direction can be adjusted. This allows the detection accuracy of the second sensors 40a and 40b to be adjusted.

[0094] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0095] At least one of the first optical axis 33 and the second optical axis 43a (43b) shown in FIG. 7 may be inclined with respect to the horizontal plane. For example, as shown in FIG. 15, the first optical axis 33 may be inclined with respect to the horizontal plane. Although detailed illustration is omitted, the second optical axis 43a may also be inclined with respect to the horizontal plane. Furthermore, the second optical axis 43b may also be inclined with respect to the horizontal plane. In this case, the detection distance (movement distance) of at least one of the first sensor 30 and the second sensor 40a (40b) increases depending on the inclination angle of at least one of the first optical axis 33 and the second optical axis 43a (43b). Therefore, for example, it is possible to accurately detect whether the substrates 100 overlap and whether the substrates 100 are warped.

[0096] As shown in Fig. 11, the shape of the substrate 100 is rectangular in plan view, but it may also be circular. In this case, the second optical axis 43a intersects with any two points on the outer periphery of the substrate 100. At least one of these two points is preferably located on the side (side wall 16a side) of the container 10 shown in Fig. 6. In other words, the second optical axis 43a preferably intersects with at least one point on the outer periphery of the substrate 100 on the side (side wall 16a side) of the container 10.

[0097] Furthermore, the second optical axis 43b intersects with any two points on the outer periphery of the substrate 100. At least one of these two points is preferably located on the side (side wall 16b side) of the container 10. That is, the second optical axis 43b preferably intersects with at least one point on the outer periphery of the substrate 100 on the side (side wall 16b side) of the container 10.

[0098] As shown in FIG. 7, mapping device 20 includes both second sensors 40a and 40b, but may include only one of second sensors 40a and 40b.

[0099] The first sensor 30, the second sensor 40a, and the second sensor 40b are optical sensors, but may be ultrasonic sensors, magnetic sensors, or the like. [Explanation of symbols]

[0100] 1...Load port equipment 2...Frame 3…Installation part 4...Door 5...Door arm 6...Frame opening 10…Container 11...Main unit 12a, 12b...Shelves 14...Opening 15…Lid 16a,16b...Side wall 20, 20A...Mapping device 21...Support arm 22...Mapping arm 23a, 23b, 23aA, 23bA...jig 24a,24b…first part 25a,25b…Second part 26a,26b…3rd part 30...First sensor 31...First light-emitting part 32...1st light receiving section 33…1st optical axis 40a, 40b...Second sensor 41a, 41b...second light-emitting section 42a, 42b…Second light receiving section 43a, 43b…Second optical axis 50...First drive unit 51...Movable body 52...Cylinder tube 60...Second drive unit 70...Third drive unit 80...Sensor position detection unit 90...Arithmetic section 100...Substrate 110a,110b...Side part 111a, 111b...corner 112...Front end

Claims

1. A mapping device for detecting a state of a plate-shaped detection object contained in a container, a first sensor having a first optical axis extending along the opening of the container; a second sensor having a second optical axis extending toward the side of the container so as to intersect the first optical axis at an angle;

2. The mapping device according to claim 1 , wherein the second optical axis is inclined so as to approach a side wall of the container as it goes deeper into the container.

3. The shape of the detection object is rectangular in a plan view, the detection object has a first side parallel to the opening and a second side perpendicular to the first side, The mapping device according to claim 1 or 2, wherein the second optical axis intersects with the first side and the second side at a corner of the detection object.

4. The shape of the detection object is circular in a plan view, the second optical axis intersects with a first point and a second point on the outer periphery of the detection object; The mapping device according to claim 1 or 2, wherein at least one of the first point and the second point is located on a side of the container.

5. the first sensor includes a first light-emitting unit and a first light-receiving unit that receives light emitted by the first light-emitting unit; the second sensor includes a second light-emitting unit and a second light-receiving unit that receives light emitted by the second light-emitting unit; 3. The mapping device according to claim 1, wherein the height positions of the first light-emitting unit and the first light-receiving unit are equal to the height positions of the second light-emitting unit and the second light-receiving unit.

6. the second sensor includes a second light-emitting unit and a second light-receiving unit that receives light emitted by the second light-emitting unit; one of the second light-emitting unit and the second light-receiving unit is located closer to a front surface of the container than the first sensor; The mapping device according to claim 1 or 2, wherein the other of the second light-emitting unit and the second light-receiving unit is located deeper inside the container than the first sensor.

7. the second sensor is composed of a pair of second sensors, 3. The mapping device according to claim 1, wherein the second optical axis of one of the second sensors and the second optical axis of the other of the second sensors become increasingly separated from each other as they move toward the depth of the container.

8. 3. The mapping device according to claim 1, wherein at least one of the first optical axis and the second optical axis is inclined with respect to a horizontal plane.

9. a mapping arm parallel to the aperture; The mapping apparatus according to claim 1 or 2, further comprising a jig attached to the mapping arm and provided with the first sensor and the second sensor.

10. A mapping device according to any one of claims 1 to 9; an installation section for installing the container; and a door for opening and closing the lid of the container.

Images