Current sensor module

Abstract

SOLUTION: The sealing portion seals a part of the first current conductor, the first magneto-electric conversion element, a part of the second current conductor, the second magneto-electric conversion element, the signal processing IC, and a part of the signal conductor. A portion of the first current conductor is exposed from a first surface of the sealing portion, a portion of the second current conductor is exposed from a second surface of the sealing portion facing the first surface in a first direction, and a portion of the signal conductor is exposed from a third surface of the sealing portion. The sealing portion has, on the first surface or the third surface, a first groove intersecting a first path on a surface of the sealing portion where a distance between the exposed portion of the first current conductor and the exposed portion of the signal conductor is shortest, and has, on the second surface or the third surface, a second groove intersecting a second path on the surface of the sealing portion where a distance between the exposed portion of the second current conductor and the exposed portion of the signal conductor is shortest.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to a current sensor module. [Background technology]

[0002] Patent Document 1 discloses a current sensor capable of measuring currents to be measured for two channels. [Prior art document] [Patent Documents]

[0003] [Patent Document 1] International Publication No. 2015 / 033541 Summary of the Invention [Problem to be solved by the invention]

[0004] It is desirable to miniaturize a current sensor that can measure two channels of current to be measured. [Means for solving the problem]

[0005] A current sensor according to an aspect of the present invention may include a first current conductor through which a first current to be measured flows. The current sensor may include a first magnetoelectric transducer that detects a magnetic field generated by the first current to be measured. The current sensor may include a second current conductor through which a second current to be measured flows. The current sensor may include a second magnetoelectric transducer that detects a magnetic field generated by the second current to be measured. The current sensor may include a signal processing IC that processes signals output from the first magnetoelectric transducer and the second magnetoelectric transducer. The current sensor may include a signal conductor that is electrically connected to the signal processing IC and transmits a signal output from the signal processing IC. The current sensor may include a sealing portion that seals a portion of the first current conductor, the first magnetoelectric transducer, a portion of the second current conductor, the second magnetoelectric transducer, the signal processing IC, and a portion of the signal conductor. A portion of the first current conductor may be exposed from a first surface of the sealing portion. A portion of the second current conductor may be exposed from a second surface of the sealing portion that faces the first surface in the first direction. A portion of the signal conductor may be exposed from a third surface of the sealing portion that is adjacent to the first and second surfaces of the sealing portion along the first direction. The sealing portion may have a first groove formed along the first surface or the third surface. The sealing portion may have a second groove in the second surface or the third surface that intersects with a second path on the surface of the sealing portion where the distance between the exposed portion of the second current conductor and the exposed portion of the signal conductor is shortest.

[0006] The current sensor may further include a second groove formed along the second surface or the third surface.

[0007] In any of the current sensors, the sealing portion may include a fourth surface facing the third surface in a second direction intersecting the first direction, and a fifth surface and a sixth surface facing the third direction intersecting the first direction and the second direction. The first groove and the second groove may include a portion of the first surface or the third surface that extends along the third direction, and a portion of the fifth surface and the sixth surface that extends at least along the first direction.

[0008] In any of the current sensors, the sealing portion may further have a fifth surface and a sixth surface that face each other in the first direction and a third direction that intersects with a second direction that intersects with the first direction, and a groove that extends across the third surface, the fifth surface, and the sixth surface to surround the exposed portion of the signal conductor from the third surface.

[0009] In any of the current sensors, the sealing portion may include a fourth surface facing the third surface in a second direction intersecting the first direction. Another portion of the signal conductor may also be exposed from the fourth surface. The sealing portion may have a third groove on the first surface or the fourth surface that intersects with a third path on the surface of the sealing portion where the distance between the exposed portion of the first current conductor and the exposed portion of the signal conductor from the fourth surface is shortest. The sealing portion may have a fourth groove formed along the second surface or the fourth surface.

[0010] In any of the current sensors, the sealing portion may have a fifth surface and a sixth surface opposing each other in a third direction intersecting the first and second directions. The sealing portion may further have a groove that extends across the fourth, fifth, and sixth surfaces to surround the exposed portion of the signal conductor from the fourth surface. The first and second grooves may be provided on the third surface and may be part of the groove that extends across the exposed portion of the signal conductor from the third surface. The third and fourth grooves may be provided on the fourth surface and may be part of the groove that extends across the exposed portion of the signal conductor from the fourth surface to surround the exposed portion of the signal conductor.

[0011] In any of the current sensors, the sealing portion may include a fourth surface facing the third surface in a second direction intersecting the first direction. Another portion of the signal conductor may be exposed from the fourth surface. The sealing portion may have a second groove formed along the second surface or the third surface, a third groove formed along the first surface or the fourth surface, and a fourth groove formed along the second surface or the fourth surface. The sealing portion may have a fifth surface and a sixth surface facing each other in a third direction intersecting the first and second directions. The sealing portion may have a groove that communicates across the first surface, the fifth surface, and the sixth surface to surround the exposed portion of the first current conductor from the first surface. The sealing portion may have a groove that communicates across the second surface, the fifth surface, and the sixth surface to surround the exposed portion of the second current conductor from the second surface. The first groove may be provided in the first surface or the third surface. The third groove may be provided on the first surface or the fourth surface and may be a part of the groove that communicates to surround the exposed portion of the first current conductor from the first surface. The second groove may be provided on the second surface or the third surface. The fourth groove may be provided on the second surface or the fourth surface and may be a part of the groove that communicates to surround the exposed portion of the second current conductor from the second surface.

[0012] In any of the current sensors, the first groove and the second groove may include a portion along the third direction on the third surface, and a portion along the first direction and the second direction on the fifth surface and the sixth surface.

[0013] In any of the current sensors, the sealing portion may include a fourth surface facing the third surface in a second direction intersecting the first direction, and a fifth surface and a sixth surface facing the third surface in a third direction intersecting the first direction and the second direction. The signal conductor may not be exposed from the fourth surface. The sealing portion may have a fifth groove on the fourth surface that intersects with a fifth path on the surface of the sealing portion where the distance between the exposed portion of the first current conductor and the exposed portion of the second current conductor is shortest.

[0014] Any of the current sensors may have grooves that communicate across the first surface, the second surface, the fifth surface, and the sixth surface. The first groove and the second groove may be part of the groove. The fifth groove may be part of the groove.

[0015] In any one of the current sensors, the fifth groove may communicate across the fourth surface, the fifth surface, and the sixth surface.

[0016] In any of the current sensors, the first groove may include a portion along the third direction on the first surface and a portion along the first direction on the fifth and sixth surfaces. The second groove may include a portion along the third direction on the second surface and a portion along the first direction on the fifth and sixth surfaces. The portion of the first groove along the first direction on the fifth and sixth surfaces and the portion of the second groove along the first direction on the fifth and sixth surfaces may merge.

[0017] In any of the current sensors, the first groove may include a portion along the third direction on the first surface and a portion along the first direction on the fifth and sixth surfaces. The second groove may include a portion along the third direction on the second surface and a portion along the first direction on the fifth and sixth surfaces. The fifth groove may include a portion along the third direction on the fourth surface and a portion along the second direction on the fifth and sixth surfaces. The portion of the first groove along the first direction on the fifth and sixth surfaces may merge with the portion of the second groove along the first direction on the fifth and sixth surfaces. The portion of the fifth groove along the second direction on the fifth and sixth surfaces may merge with the first groove and the second groove. An exposed portion of the first current conductor from the sealing portion may be surrounded by the fifth groove and the first groove. The portion of the second current conductor exposed from the sealing portion may be surrounded by the fifth groove and the second groove.

[0018] Any of the current sensors may further include a heat sink provided on the portion of the fifth surface or the sixth surface of the sealing portion that is along the second direction.

[0019] In any one of the current sensors, the first magnetoelectric transducer and the second magnetoelectric transducer may be disposed on a circuit surface of the signal processing IC.

[0020] In any of the current sensors, the first current conductor may include, in a plan view, a first conductor portion and a second conductor portion extending in the first direction and spaced apart in a second direction intersecting the first direction, and a third conductor portion extending in the second direction and connecting the first conductor portion and the second conductor portion. The second current conductor may include, in a plan view, a fourth conductor portion and a fifth conductor portion extending in the first direction and spaced apart in the second direction, and a sixth conductor portion extending in the second direction and connecting the fourth conductor portion and the fifth conductor portion. Portions of the first conductor portion and the second conductor portion may be exposed from the first surface of the sealing portion. Portions of the fourth conductor portion and the fifth conductor portion may be exposed from the second surface of the sealing portion.

[0021] In any of the current sensors, the third conductor portion and the sixth conductor portion may be spaced apart and opposed to each other in a planar view, and the space between the third conductor portion and the sixth conductor portion may be filled with a resin material that constitutes the sealing portion.

[0022] Any of the current sensors may further include a third magnetoelectric transducer arranged on the circuit surface of the signal processing IC facing the first magnetoelectric transducer across a portion of the first conductor portion in a plan view, and a fourth magnetoelectric transducer arranged on the circuit surface of the signal processing IC facing the second magnetoelectric transducer across a portion of the fifth conductor portion in a plan view. In a plan view, at least a portion of the third magnetoelectric transducer may be located in an area surrounded by the first current conductor. In a plan view, at least a portion of the fourth magnetoelectric transducer may be located in an area surrounded by the second current conductor. In a plan view, a distance between the first magnetoelectric transducer and the sixth conductor portion may be equal to a distance between the third magnetoelectric transducer and the sixth conductor portion. In a plan view, a distance between the second magnetoelectric transducer and the third conductor portion may be equal to a distance between the fourth magnetoelectric transducer and the third conductor portion.

[0023] Any of the current sensors may further include a third magnetoelectric transducer arranged on the circuit surface of the signal processing IC facing the first magnetoelectric transducer across the second conductor portion in a plan view, and a fourth magnetoelectric transducer arranged on the circuit surface of the signal processing IC facing the second magnetoelectric transducer across the fourth conductor portion in a plan view. In a plan view, the first magnetoelectric transducer may be located in an area surrounded by the first current conductor. In a plan view, the second magnetoelectric transducer may be located in an area surrounded by the second current conductor. In a plan view, the distance between the first magnetoelectric transducer and the sixth conductor portion may be equal to the distance between the third magnetoelectric transducer and the sixth conductor portion. In a plan view, the distance between the second magnetoelectric transducer and the third conductor portion may be equal to the distance between the fourth magnetoelectric transducer and the third conductor portion. The first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer may have a sensitivity axis in a third direction that intersects with the first direction and the second direction.

[0024] In any of the current sensors, in a plan view, the first magnetoelectric transducer may be located on an extension line of the fourth conductor portion. In a plan view, the third magnetoelectric transducer may be located on an extension line of the fifth conductor portion. In a plan view, the second magnetoelectric transducer may be located on an extension line of the second conductor portion. In a plan view, the fourth magnetoelectric transducer may be located on an extension line of the first conductor portion.

[0025] In any of the current sensors, the first magnetoelectric transducer may be located on a perpendicular bisector of a line segment connecting the second magnetoelectric transducer and the fourth magnetoelectric transducer in a plan view, and the second magnetoelectric transducer may be located on a perpendicular bisector of a line segment connecting the first magnetoelectric transducer and the third magnetoelectric transducer in a plan view.

[0026] In any of the current sensors, the first magnetoelectric conversion element, the second magnetoelectric conversion element, the third magnetoelectric conversion element, and the fourth magnetoelectric conversion element may be Hall elements that utilize the Hall effect and have a sensitivity axis in a direction that intersects with the magnetic sensing surface.

[0027] In any of the current sensors, the first current conductor and the second current conductor may have the same shape. The first current conductor and the second current conductor may be arranged in a positional relationship rotated 180 degrees in a plan view. The current sensor may further include a third magnetoelectric transducer arranged to face the first magnetoelectric transducer in the second direction, and a fourth magnetoelectric transducer arranged to face the second magnetoelectric transducer in the second direction. The entire magnetic sensitive surface of the first magnetoelectric transducer may overlap the first conductor portion in a plan view. The entire magnetic sensitive surface of the third magnetoelectric transducer may overlap the second conductor portion in a plan view. The entire magnetic sensitive surface of the second magnetoelectric transducer may overlap the fourth conductor portion in a plan view. The entire magnetic sensitive surface of the fourth magnetoelectric transducer may overlap the fifth conductor portion in a plan view. The first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer may have sensitivity axes in the second direction.

[0028] In any one of the current sensors, the first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer may be built into a chip that constitutes the signal processing IC.

[0029] A current sensor module according to one aspect of the present invention may include the current sensor and a substrate on which the current sensor is mounted. The substrate may have a first slit and a second slit extending in a second direction intersecting the first direction. In plan view, an exposed portion of the signal conductor from the sealing portion may be present between the first slit and the second slit, and the first slit may be present between the exposed portion of the first current conductor from the sealing portion and the exposed portion of the signal conductor from the sealing portion, and the second slit may be present between the exposed portion of the second current conductor from the sealing portion and the exposed portion of the signal conductor from the sealing portion. The first slit and the second slit may extend outward from the third surface and the fourth surface of the sealing portion in plan view.

[0030] In the current sensor module, the current sensor may further include a second groove formed along the second surface or the third surface, and the first slit and the second slit may be disposed at least at positions facing portions of the first groove and the second groove of the sealing portion that face the substrate and extend in the second direction.

[0031] A current sensor module according to one aspect of the present invention may include the current sensor and a substrate on which the current sensor is mounted. The substrate may have a first slit extending in the first direction and a second slit extending in a second direction intersecting the first direction. The first slit may be present between the exposed portions of the first and second current conductors from the sealing portion and the exposed portions of the signal conductor from the sealing portion, and may extend outward from the first and second surfaces of the sealing portion in a plan view. The second slit may be present between the exposed portions of the first and second current conductors from the sealing portion and may extend outward from the fourth surface of the sealing portion in a plan view.

[0032] The first slit may be disposed at least at a position facing a portion of the first groove and the second groove of the sealing portion that faces the substrate and that is aligned in the first direction. The second slit may be disposed at least at a position facing a portion of the fifth groove of the sealing portion that faces the substrate and that is aligned in the second direction. The first slit and the second slit may be in communication with each other.

[0033] The above summary of the invention does not list all of the features of the present invention, and subcombinations of these features may also be inventions. [Brief explanation of the drawings]

[0034] [Figure 1A] 2 is a schematic plan view of the current sensor and the substrate according to the first embodiment as viewed from the ceiling surface side (positive direction of the z-axis). FIG. [Figure 1B] 1B is a side view of the current sensor and the substrate shown in FIG. 1A as viewed from the negative direction of the x-axis. [Figure 1C] 1B is a side view of the current sensor and the substrate shown in FIG. 1A as viewed from the negative y-axis direction. [Figure 2] 3A and 3B are diagrams for explaining the positional relationship between a magnetoelectric transducer and a current conductor in the first embodiment. [Figure 3] 10A and 10B are diagrams for explaining the positional relationship between a magnetoelectric transducer and a current conductor according to a modified example of the first embodiment. [Figure 4A] 10 is a schematic plan view of a current sensor and a substrate according to a second embodiment, as viewed from the ceiling surface side (positive direction of the z-axis). FIG. [Figure 4B] 4B is a side view of the current sensor and the substrate shown in FIG. 4A as viewed from the negative x-axis direction. [Figure 4C] 4B is a side view of the current sensor and the substrate shown in FIG. 4A as viewed from the positive y-axis direction. [Figure 5A] 10 is a schematic plan view of the current sensor according to the third embodiment as viewed from the ceiling surface side (positive direction of the z-axis). FIG. [Figure 5B]5B is a side view of the current sensor and the substrate shown in FIG. 5A as viewed from the negative x-axis direction. [Figure 5C] 5B is a side view of the current sensor and the substrate shown in FIG. 5A as viewed from the negative y-axis direction. [Figure 6] FIG. 11 is a side view of the current sensor and the substrate of the third embodiment in the case of an insert mounting type, as viewed from the negative direction of the x-axis. [Figure 7A] FIG. 10 is a schematic plan view of a current sensor and a substrate according to a fourth embodiment, as viewed from the ceiling surface side (positive direction of the z-axis). [Figure 7B] 7B is a side view of the current sensor and the substrate shown in FIG. 7A as viewed from the negative direction of the x-axis. [Figure 7C] 7B is a side view of the current sensor and the substrate shown in FIG. 7A as viewed from the negative y-axis direction. [Figure 8A] FIG. 11 is a schematic plan view of the current sensor and the substrate according to the fifth embodiment, as viewed from the ceiling surface side (positive direction of the z-axis). [Figure 8B] 8B is a side view of the current sensor and the substrate shown in FIG. 8A as viewed from the negative direction of the x-axis. [Figure 8C] 8B is a side view of the current sensor and the substrate shown in FIG. 8A as viewed from the negative y-axis direction. [Figure 9A] 10A and 10B are diagrams for explaining another example of the positional relationship between the magnetoelectric transducer and the current conductor. [Figure 9B] 10A and 10B are diagrams for explaining another example of the positional relationship between the magnetoelectric transducer and the current conductor. [Figure 10] 1 is a schematic plan view of a current sensor mounted on a substrate having a slit, as viewed from the ceiling surface side (positive direction of the z-axis). FIG. [Figure 11] 1 is a schematic plan view of a current sensor mounted on a substrate having a slit, as viewed from the ceiling surface side (positive direction of the z-axis). FIG. [Figure 12A] FIG. 13 is a schematic plan view of the current sensor according to the sixth embodiment as viewed from the ceiling surface side (positive direction of the z-axis). [Figure 12B] 12B is a side view of the current sensor shown in FIG. 12A as viewed from the negative x-axis direction. [Figure 12C] 12B is a side view of the current sensor shown in FIG. 12A as viewed from the negative y-axis direction. [Figure 13A] FIG. 13 is a schematic plan view of the current sensor according to the seventh embodiment as viewed from the ceiling surface side (positive direction of the z-axis). [Figure 13B] 13B is a side view of the current sensor shown in FIG. 13A as viewed from the negative x-axis direction. [Figure 13C] 13B is a side view of the current sensor shown in FIG. 13A as viewed from the negative y-axis direction. DETAILED DESCRIPTION OF THE INVENTION

[0035] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0036] FIG. 1A is a schematic plan view of the current sensor 10 and the substrate 200 according to the first embodiment, as viewed from the ceiling surface side (positive z-axis direction). FIG. 1B is a side view of the current sensor 10 and the substrate 200 shown in FIG. 1A, as viewed from the negative x-axis direction. FIG. 1C is a side view of the current sensor 10 and the substrate 200 shown in FIG. 1A, as viewed from the negative y-axis direction. In FIG. 1A, the coordinate system is defined as follows: the x-axis direction is parallel to the paper and extends from bottom to top; the y-axis direction is parallel to the paper and extends from left to right; and the z-axis direction is perpendicular to the paper and extends from back to front. Any one of the x-axis, y-axis, and z-axis is orthogonal to the other axes. The x-axis is an example of a first direction, the y-axis is an example of a second direction, and the z-axis is an example of a third direction.

[0037] The current sensor 10 includes a signal processing IC 100, magnetoelectric conversion elements 20A-1, 20A-2, 20B-1, and 20B-2, primary current conductors 140A and 140B, a secondary signal conductor 150, a support plate 170A, a support plate 170B, and a sealing portion 130. The current sensor 10 includes two current conductors 140A and 140B for measuring currents to be measured for two channels. The magnetoelectric conversion elements 20A-1, 20A-2, 20B-1, and 20B-2 may be collectively referred to as magnetoelectric conversion elements 20. The magnetoelectric conversion element 20A-1 is an example of a first magnetoelectric conversion element. The magnetoelectric conversion element 20A-2 is an example of a third magnetoelectric conversion element. The magnetoelectric conversion element 20B-1 is an example of a second magnetoelectric conversion element. The magnetoelectric transducer 20B-2 is an example of a fourth magnetoelectric transducer. The current conductor 140A is an example of a first current conductor. The current conductor 140B is an example of a second current conductor.

[0038] The sealing unit 130 seals the magnetoelectric conversion element 20, a portion of the current conductor 140A, a portion of the current conductor 140B, the signal processing IC 100, the support plate 170A, the support plate 170B, and the signal conductor 150 with a resin material. The resin material may be, for example, an epoxy-based thermosetting resin with silica added, or a thermoplastic resin such as a liquid crystal polymer. The sealing unit 130 may be formed by compression molding or transfer molding using a mold.

[0039] The current conductor 140A and the current conductor 140B are conductors through which different currents to be measured flow, and are electrically connected to any two phases (e.g., U-phase and V-phase) of three-phase electric wires in a three-phase AC circuit such as a three-phase motor through which the currents to be measured flow.

[0040] The current conductors 140A and 140B may have the same shape in a plan view. The current conductors 140A and 140B may be configured from a single lead frame. The current conductor 140A includes conductor portions 141A and 142A that extend in the x-axis direction and are separated from each other in the y-axis direction in a plan view, and a conductor portion 143A that extends in the y-axis direction and connects the conductor portions 141A and 142A. The conductor portions 141A and 142A may form a U-shape in a plan view. One end of the conductor portion 141A and one end of the conductor portion 142A are exposed from the surface 130a of the sealing portion 130. The conductor portion 143A connects the other end of the conductor portion 141A to the other end of the conductor portion 142A.

[0041] The conductor portion 141A and the conductor portion 142A may have a step portion 144A that is spaced apart from the signal conductor 150 in the z-axis direction so that the current conductor 140A and the signal conductor 150 do not come into contact with each other in the z-axis direction (thickness direction). The conductor portion 141A is an example of a first conductor portion, the conductor portion 142A is an example of a second conductor portion, and the conductor portion 143A is an example of a third conductor portion.

[0042] The current conductor 140B includes, in a plan view, conductor portions 141B and 142B that extend in the x-axis direction and are separated from each other in the y-axis direction, and conductor portion 143B that extends in the y-axis direction and connects conductor portion 141B and conductor portion 142B. Conductor portions 141B, 142B, and conductor portion 143B may form a U-shape in a plan view. One end of conductor portion 141B and one end of conductor portion 142B are exposed from surface 130b, which faces surface 130a of the sealing portion 130. Conductor portion 143B connects the other end of conductor portion 141B to the other end of conductor portion 142B.

[0043] The conductor portion 141B and the conductor portion 142B may have a step portion 144B that is spaced apart from the signal conductor 150 in the z-axis direction so that the current conductor 140B and the signal conductor 150 do not come into contact with each other in the z-axis direction (thickness direction). The conductor portion 141B is an example of a fourth conductor portion, the conductor portion 142B is an example of a fifth conductor portion, and the conductor portion 143B is an example of a sixth conductor portion.

[0044] The signal conductor 150 may be formed of a lead frame different from the lead frames forming the current conductors 140A and 140B. The signal conductor 150 includes a support portion 151 and terminal portions 152A and 152B. The terminal portions 152A and 152B are electrically connected to the signal processing IC 100 via wires 108. A signal output from the signal processing IC 100 is output to the outside via the signal conductor 150. A portion of the terminal portion 152A is exposed from a surface 130c of the sealing portion 130, which is different from the surfaces 130a and 130b that face each other in the x-axis direction. The surface 130c is adjacent to the surfaces 130a and 130b along the x-axis direction. A portion of the terminal portion 152B is exposed from a surface 130d that faces the surface 130c in the y-axis direction.

[0045] The support portion 151 is sealed within the sealing portion 130 and supports the signal processing IC 100, the support plate 170A, and the support plate 170B. The terminal portion 152A and the terminal portion 152B have a plurality of terminals, and some of the plurality of terminals are physically integrated with the support portion 151. At least a portion of each of the plurality of terminals is exposed from the surface 130c of the sealing portion 130. The support portion 151 may have a step portion 154 at a connection portion with the terminal portion 152A and the terminal portion 152B so as to be separated from the current conductors 140A and 140B in the z-axis direction so that the current conductors 140A and 140B do not contact the signal conductor 150 in the z-axis direction (thickness direction).

[0046] The current conductor 140A, the current conductor 140B, and the signal conductor 150 may be made of a conductive material containing copper as a main component. The support portion 151 may be made of a metal plate separate from the terminal portions 152A and 152B, a plate made of a semiconductor, or may be combined with an insulating member such as a die attach film.

[0047] The magnetoelectric transducers 20A-1 and 20A-2 are disposed on a support plate 170A made of an insulating material such as polyimide tape. The magnetoelectric transducers 20B-1 and 20B-2 are disposed on a support plate 170B made of an insulating material such as polyimide tape. The support plates 170A and 170B are supported by a support portion 151.

[0048] 1A , a portion of current conductor 140A, a portion of current conductor 140B, and a portion of signal conductor 150 are at the same height in the z-axis direction, and magnetoelectric transducer 20 is supported by support plates 170A and 170B. On the other hand, current conductors 140A and 140B and signal conductor 150 may be at different heights in the z-axis direction. In this case, support plates 170A and 170B may not be provided, and magnetoelectric transducer 20 may be supported by support portion 151.

[0049] The magnetoelectric transducer 20 is electrically connected to the signal processing IC 100 via a wire 22. The wire 22 electrically connects the magnetoelectric transducer 20 to the signal processing IC 100 by straddling a portion of the current conductor 140A or the current conductor 140B. The wire 22 and the wire 108 may be formed from a conductive material containing Au, Ag, Cu, or Al as a main component.

[0050] The magnetoelectric conversion element 20 may include a substrate made of a compound semiconductor or silicon and a magnetoelectric conversion unit provided on the substrate. The magnetoelectric conversion element 20 has a sensitivity axis in the z-axis direction. Since the magnetoelectric conversion element 20 detects a magnetic field in the z-axis direction, in the first embodiment, a Hall element that detects a vertical magnetic field in the thickness direction of the current conductor 140A or the current conductor 140B is suitable as the magnetoelectric conversion element 20.

[0051] The signal processing IC 100 is a large-scale integrated circuit (LSI). The signal processing IC 100 is a monolithic IC. More specifically, the signal processing IC 100 is a signal processing circuit made of a Si monolithic semiconductor formed on a Si substrate. The signal processing circuit processes an output signal according to the magnitude of the magnetic field output from the magnetoelectric conversion element 20.

[0052] The signal processing circuit cancels noise components due to a common external magnetic field contained in the output signals of magnetoelectric conversion elements 20A-1 and 20A-2 based on the difference between the output signals of magnetoelectric conversion elements 20A-1 and 20A-2, amplifies the output signals of magnetoelectric conversion elements 20A-1 and 20A-2 with reduced noise components, calculates a current value Ia of the current to be measured flowing through current conductor 140A based on the amplified output signal, and outputs an output signal indicating the current value Ia. The signal processing circuit may perform offset adjustment after canceling the noise components due to the disturbance magnetic field. The signal processing circuit may also perform temperature characteristic correction when calculating the current value Ia based on the amplified output signal. That is, the signal processing circuit may cancel noise components due to the external magnetic field commonly applied to magnetoelectric conversion element 20A-1 and magnetoelectric conversion element 20A-2, extract only the output component based on the current flowing through current conductor 140A, and output the output signal after performing offset adjustment, amplification of the output signal, and correction based on temperature characteristics.

[0053] Furthermore, the signal processing circuit cancels noise components due to a common external magnetic field contained in the output signals of magnetoelectric conversion elements 20B-1 and 20B-2 based on the difference between the output signals of magnetoelectric conversion elements 20B-1 and 20B-2, amplifies the output signals of magnetoelectric conversion elements 20B-1 and 20B-2 with reduced noise components, calculates a current value Ib of the current to be measured flowing through current conductor 140B based on the amplified output signal, and outputs an output signal indicating the current value Ib. Similarly, the signal processing circuit may cancel noise components due to an external magnetic field commonly applied to magnetoelectric conversion elements 20B-1 and 20B-2, extract only the output component based on the current flowing through current conductor 140B, and output the output signal after performing offset adjustment, amplification of the output signal, and correction based on temperature characteristics.

[0054] 2 is a diagram illustrating the positional relationship between the magnetoelectric conversion element 20 and the current conductor 140A and current conductor 140B in the first embodiment. In Fig. 2, arrow IA indicates the direction of the current to be measured flowing through the current conductor 140A, and arrow IB indicates the direction of the current to be measured flowing through the current conductor 140B. Marks indicated by symbols Ma and Mb indicate the direction of magnetic flux in the area where the marks are located.

[0055] The magnetoelectric conversion elements 20A-1 and 20A-2 are arranged in a region surrounded by the current conductor 140A in a plan view. The current conductor 20A-1 is arranged in a region surrounded by the conductor portion 141A, the conductor portion 143A, and the conductor portion 142A. The magnetoelectric conversion element 20A-2 is arranged opposite the magnetoelectric conversion element 20A-1 across the conductor portion 142A in a plan view. The magnetoelectric conversion element 20A-2 is arranged in a region surrounded by the conductor portion 142A, the conductor portion 143A, and an extension portion 145A of the conductor portion 143A extending in the y-axis direction. The magnetoelectric conversion elements 20A-1 and 20A-2 are arranged side by side along the y-axis direction.

[0056] The magnetoelectric conversion elements 20B-1 and 20B-2 are arranged in a region surrounded by the current conductor 140B in a plan view. The current conductor 20B-1 is arranged in a region surrounded by the conductor portion 141B, the conductor portion 143B, and the conductor portion 142B. The magnetoelectric conversion element 20B-2 is arranged opposite the magnetoelectric conversion element 20B-1 across the conductor portion 142B in a plan view. The magnetoelectric conversion element 20B-2 is arranged in a region surrounded by the conductor portion 142B, the conductor portion 143B, and the extension portion 145B of the conductor portion 143B extending in the y-axis direction. The magnetoelectric conversion elements 20B-1 and 20B-2 are arranged side by side along the y-axis direction.

[0057] Current conductor 140A and current conductor 140B have the same shape and are positioned at positions rotated 180 degrees in a plan view. The shapes of current conductor 140A and current conductor 140B are not limited to the shape shown in Fig. 2. For example, the shape formed by conductor portion 141A, conductor portion 142A, and conductor portion 143A may be symmetrical about a perpendicular bisector L3 of a line segment L4 connecting magnetoelectric conversion element 20B-1 and magnetoelectric conversion element 20B-2 in a plan view. The shape formed by conductor portion 141B, conductor portion 142B, and conductor portion 143B may be symmetrical about a perpendicular bisector L1 of a line segment L2 connecting magnetoelectric conversion element 20A-1 and magnetoelectric conversion element 20A-2 in a plan view.

[0058] In a plan view, the magnetoelectric conversion element 20A-1 is located on an extension of the conductor portion 142B. In a plan view, the magnetoelectric conversion element 20A-2 is located on an extension of the conductor portion 141B. In a plan view, the magnetoelectric conversion element 20B-1 is located on an extension of the conductor portion 142A. In a plan view, the magnetoelectric conversion element 20B-2 is located on an extension of the conductor portion 141A. Furthermore, in a plan view, the magnetoelectric conversion element 20A-1 is located on the perpendicular bisector L3 of the line segment L4 connecting the magnetoelectric conversion elements 20B-1 and 20B-2. In a plan view, the magnetoelectric conversion element 20B-1 is located on the perpendicular bisector L1 of the line segment L2 connecting the magnetoelectric conversion elements 20A-1 and 20A-2.

[0059] Furthermore, conductor portion 143B is a current path extending in a direction along line segment L2 connecting magnetoelectric conversion element 20A-1 and magnetoelectric conversion element 20A-2. In a plan view, distance k1 between magnetoelectric conversion element 20A-1 and conductor portion 143B is equal to distance k2 between magnetoelectric conversion element 20A-2 and conductor portion 143B. Therefore, the magnetic field generated at the position of magnetoelectric conversion element 20A-1 due to the measured current flowing through current conductor 140B is equal to the magnetic field generated at the position of magnetoelectric conversion element 20A-2. As described above, the signal processing circuit calculates the difference between the output signal of magnetoelectric conversion element 20A-1 and the output signal of magnetoelectric conversion element 20A-2. Therefore, by calculating the difference between the output signal of magnetoelectric conversion element 20A-1 and the output signal of magnetoelectric conversion element 20A-2, the signal processing circuit can cancel the influence of the magnetic field generated by the measured current flowing through current conductor 140B. This prevents the magnetic field generated by the current to be measured flowing through current conductor 140B from affecting the measurement results of the current to be measured flowing through current conductor 140A, which are based on the output signals of magnetoelectric conversion element 20A-1 and magnetoelectric conversion element 20A-2.

[0060] Similarly, conductor portion 143A is a current path extending in a direction along line segment L4 connecting magnetoelectric conversion element 20B-1 and magnetoelectric conversion element 20B-2. In a plan view, distance k3 between magnetoelectric conversion element 20B-1 and conductor portion 143A is equal to distance k4 between magnetoelectric conversion element 20B-2 and conductor portion 143A. Therefore, the magnetic field generated at the position of magnetoelectric conversion element 20B-1 due to the measurement current flowing through current conductor 140A is equal to the magnetic field generated at the position of magnetoelectric conversion element 20B-2. Therefore, by the signal processing circuit calculating the difference between the output signal of magnetoelectric conversion element 20B-1 and the output signal of magnetoelectric conversion element 20B-2, the influence of the magnetic field generated by the measurement current flowing through current conductor 140A can be canceled. This prevents the magnetic field generated by the current to be measured flowing through current conductor 140A from affecting the measurement results of the current to be measured flowing through current conductor 140B, which are based on the output signals of magnetoelectric conversion element 20B-1 and magnetoelectric conversion element 20B-2.

[0061] In the current sensor 10 configured as described above, it is necessary to ensure insulation between the primary-side current conductors 140A and 140B and the secondary-side signal conductor 150. To maintain high insulation performance, it is necessary to cover the entire structure with an insulating material such as molded resin and ensure both clearance and creepage distances. However, if the primary-side current conductors 140A and 140B and the secondary-side signal conductor 150 are exposed from two adjacent side surfaces of the sealing portion 130 rather than from two opposing side surfaces, increasing the distance between the primary-side current conductors 140A and 140B and the secondary-side signal conductor 150 to ensure the creepage distance would increase the size of the sealing portion 130, hindering the miniaturization of the current sensor 10.

[0062] Therefore, in the current sensor 10 according to the first embodiment, a groove is provided on the side surface of the sealing portion 130 to ensure the creepage distance.

[0063] 1A and 1C , the sealing portion 130 has at least one first groove 161 on the surface 130c that intersects with a first path on the surface of the sealing portion 130 along which the distance between the exposed portion of the conductor portion 142A, which is the exposed portion of the current conductor 140A, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest. The first groove 161 is formed along the surface 130c. Furthermore, the sealing portion 130 has at least one second groove 162 on the surface 130c that intersects with a second path on the surface of the sealing portion 130 along which the distance between the conductor portion 141B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest. The second groove 162 is formed along the surface 130c.

[0064] The first groove 161 extends along the z-axis direction on the surface 130c, then extends along the y-axis direction to the surface 130e (the ceiling surface) and the surface 130f (the bottom surface), and then extends along the x-axis direction. Similarly, the second groove 162 extends along the z-axis direction on the surface 130c, then extends along the y-axis direction to the surfaces 130e and 130f, and then extends along the x-axis direction. The first groove 161 and the second groove 162 merge at portions of the surfaces 130e and 130f extending along the x-axis direction to form a single groove, and the terminal portion 152A is surrounded by the first groove 161 and the second groove 162.

[0065] The sealing portion 130 has at least one third groove 163 on the surface 130d, which intersects with a third path on the surface of the sealing portion 130, along which the distance between the exposed portion of the conductor portion 142A, which is the exposed portion of the current conductor 140A, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. The third groove 163 is formed on the surface 130d. Furthermore, the sealing portion 130 has at least one fourth groove 164 on the surface 130d, which intersects with a fourth path on the surface of the sealing portion 130, along which the distance between the conductor portion 141B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. The fourth groove 164 is formed along the surface 130d.

[0066] The third groove 163 extends along the z-axis direction on the surface 130d, then extends in the y-axis direction as it reaches the surfaces 130e and 130f, and then extends in the x-axis direction. Similarly, the fourth groove 164 extends along the z-axis direction on the surface 130f, then extends in the y-axis direction as it reaches the surfaces 130e and 130f, and then extends in the x-axis direction. The third groove 163 and the fourth groove 164 join at portions of the surfaces 130e and 130f that extend along the x-axis direction to form a single groove, and the terminal portion 152B is surrounded by the third groove 163 and the fourth groove 164.

[0067] The sealing portion 130 may have a groove 166 extending in the z-axis direction in the exposed portion of the terminal portion 152A in the central portion of the surface 130c. Furthermore, the sealing portion 130 may have a groove 165 extending in the z-axis direction in the exposed portion of the terminal portion 152B in the central portion of the surface 130d.

[0068] FIG. 3 is a diagram illustrating the positional relationship between the magnetoelectric conversion element 20 and the current conductor 140A and the current conductor 140B according to a modification of the first embodiment. In the example illustrated in FIG. 2, the magnetoelectric conversion element 20 and the current conductor 140A and the current conductor 140B are arranged in positions that do not overlap in a planar view. However, as illustrated in FIG. 3, the magnetoelectric conversion element 20 and the current conductor 140A or the current conductor 140B may be arranged in positions that partially overlap in a planar view. The magnetoelectric conversion element 20A-2 may be arranged to face each other across a part of the conductor portion 141A in a planar view. The magnetoelectric conversion element 20B-2 may be arranged to face each other across a part of the conductor portion 141B in a planar view. Half of the magnetically sensitive surface of the magnetoelectric conversion element 20 may overlap with the current conductor 140A or the current conductor 140B in a planar view.

[0069] 3, when the magnetoelectric transducer 20 is disposed at a position where it partially overlaps with the current conductor 140A or 140B in a planar view, the sensitivity axis of the magnetoelectric transducer may detect a magnetic field not only in the z-axis direction but also in any one of the axes in the xy plane or above that is parallel to the magnetic sensing surface. Therefore, in the current sensor according to the modification of the first embodiment shown in FIG. 3, the magnetoelectric transducer 20 may be a Hall element utilizing the Hall effect or a magnetoresistive element utilizing the magnetoresistive effect. The magnetoresistive element may be, for example, a semiconductor magnetoresistive element (SMR), an extraordinary magnetoresistive element (AMR), a giant magnetoresistive element (GMR), or a tunneling magnetoresistive element (TMR).

[0070] As described above, according to the current sensor 10 of the first embodiment, by providing a groove on the side surface of the sealing portion 130, the current sensor 10 has two current conductors 140A and 140B and is capable of measuring two channels of current to be measured, and can achieve miniaturization while ensuring the creepage distance between the current conductors 140A and 140B and the signal conductor 150.

[0071] 4A is a schematic plan view of the current sensor 10 and the substrate 200 according to the second embodiment, as viewed from the ceiling surface side (positive z-axis direction). FIG. 4B is a side view of the current sensor 10 and the substrate 200 shown in FIG. 4A, as viewed from the negative x-axis direction. FIG. 4C is a side view of the current sensor 10 and the substrate 200 shown in FIG. 4A, as viewed from the negative y-axis direction. In FIG. 4A, the coordinate system is defined as the x-axis direction, which is parallel to the paper and extends from bottom to top; the y-axis direction, which is parallel to the paper and extends from left to right; and the z-axis direction, which is perpendicular to the paper and extends from back to front. Any one of the x-axis, y-axis, and z-axis is orthogonal to the other axes.

[0072] The current sensor 10 according to the second embodiment differs from the current sensor 10 according to the first embodiment in that the magnetoelectric conversion element 20 is mounted on a surface 100a, which is the circuit surface of the signal processing IC 100. The circuit surface corresponds to the ceiling surface of the semiconductor package that constitutes the signal processing IC 100.

[0073] By mounting the magnetoelectric conversion element 20 on the surface 100a of the signal processing IC 100, the magnetoelectric conversion element 20 and the signal processing IC 100 can be electrically connected by the wire 22 without crossing the current conductors 140A and 140B. Therefore, deformation of the wire 22 is unlikely to occur, optimization of the shape of the wire 22 is relatively easy, and deterioration of the electrical characteristics such as the responsiveness of the current sensor 10 can be suppressed.

[0074] In this way, by mounting the magnetoelectric transducer 20 on the surface 100a of the signal processing IC 100, the wire 22 can be arranged without crossing the current conductors 140A and 140B. Therefore, in a plan view, the conductor portions 143A and 143B are arranged facing each other at a distance, while the distance between the current conductors 140A and 140B can be shortened. In a plan view, the distance between the opposing portions of the current conductors 140A and 140B, i.e., the distance between the conductor portions 143A and 143B, can be 2 mm or less and 0.1 mm or more. This allows the width of the sealing portion 130 in the x-axis direction to be reduced, thereby enabling the miniaturization of the current sensor 10 capable of measuring two channels of current to be measured. The space between the conductor portions 143A and 143B is filled with the resin material constituting the sealing portion 130. Therefore, insulation between the conductor portions 143A and 143B can be ensured.

[0075] Reducing the distance between the conductor portion 143A and the conductor portion 143B makes it possible to reduce the size of the sealing portion 130. On the other hand, reducing the distance between the conductor portion 143A and the conductor portion 143B makes it difficult to increase the distance between the primary-side current conductors 140A and 140B and the secondary-side signal conductor 150 and ensure a sufficient creepage distance.

[0076] Therefore, in the current sensor 10 according to the second embodiment, similarly to the current sensor 10 according to the first embodiment, grooves are provided on the surface of the sealing portion 130 to ensure a sufficient length of the creepage distance.

[0077] 4A and 4C, the sealing portion 130 has at least one first groove 161 on the surface 130c that intersects with a first path on the surface of the sealing portion 130 along which the distance between the exposed portion of the conductor portion 142A, which is the exposed portion of the current conductor 140A, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest. Furthermore, the sealing portion 130 has at least one second groove 162 on the surface 130c that intersects with a second path on the surface of the sealing portion 130 along which the distance between the conductor portion 141B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest.

[0078] First groove 161 extends along the z-axis direction on surface 130c, then extends in the y-axis direction to reach surface 130e (the ceiling surface) and surface 130f (the bottom surface), and then extends along the x-axis direction. Similarly, second groove 162 extends along the z-axis direction on surface 130c, then extends in the y-axis direction to reach surfaces 130e and 130f, and then extends along the x-axis direction. First groove 161 and second groove 162 merge at portions of surfaces 130e and 130f extending along the x-axis direction to form a single groove, and terminal portion 152A is surrounded by first groove 161 and second groove 162.

[0079] The sealing portion 130 has at least one third groove 163 on the surface 130d that intersects with a third path on the surface along which the distance between the exposed portion of the conductor portion 141A, which is the exposed portion of the current conductor 140A, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. Furthermore, the sealing portion 130 has at least one fourth groove 164 on the surface 130d that intersects with a fourth path on the surface of the sealing portion 130 along which the distance between the conductor portion 141B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. The third groove 163 extends along the z-axis direction on the surface 130d, further extends in the y-axis direction after reaching the surfaces 100e and 130f, and then extends along the x-axis direction. Similarly, the fourth groove 164 extends along the z-axis direction on the surface 130d, and then extends along the y-axis direction upon reaching the surfaces 100e and 130f, and then extends along the x-axis direction.

[0080] The third groove 163 and the fourth groove 164 join together at the portion extending along the x-axis direction of the surfaces 130e and 130f to form a single groove, and the terminal portion 152B is surrounded by the third groove 163 and the fourth groove 164.

[0081] As described above, according to the current sensor 10 of the second embodiment, a groove is provided on the side of the sealing portion 130, and in the current sensor 10 having two current conductors 140A and 140B and capable of measuring two channels of current to be measured, by mounting the magnetoelectric conversion element 20 on the circuit surface of the signal processing IC 100, the distance between the current conductors 140A and 140B is shortened, making it even more compact than the current sensor 10 of the first embodiment, while ensuring the creepage distance between the current conductors 140A and 140B and the signal conductor 150.

[0082] FIG. 5A is a schematic plan view of the current sensor 10 and the substrate 200 according to the third embodiment, as viewed from the ceiling surface side (positive z-axis direction). FIG. 5B is a side view of the current sensor 10 and the substrate 200 shown in FIG. 5A, as viewed from the negative x-axis direction. FIG. 5C is a side view of the current sensor 10 and the substrate 200 shown in FIG. 5A, as viewed from the negative y-axis direction. In FIG. 5A, the coordinate system is defined as the x-axis direction, which is parallel to the paper and runs from bottom to top; the y-axis direction, which is parallel to the paper and runs from left to right; and the z-axis direction, which is perpendicular to the paper and runs from back to front. Any one of the x-axis, y-axis, and z-axis is orthogonal to the other axes.

[0083] The current sensor 10 according to the third embodiment differs from the current sensor 10 according to the second embodiment in that the signal conductor 150 is exposed only from the surface 130c of the sealing portion 130, and not from the surface 130d. The current sensor 10 according to the third embodiment differs from the current sensor 10 according to the second embodiment in that the signal conductor 150 does not have a terminal portion 152B exposed from the surface 130d.

[0084] The shape of the groove formed in the sealing portion 130 also differs from that of the current sensor 10 according to the first and second embodiments.

[0085] The sealing portion 130 has at least one first groove 161 on the surface 130a that intersects with a first path on the surface along which the distance between the exposed portion of the conductor portion 142A, which is the exposed portion of the current conductor 140A, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest. Furthermore, the sealing portion 130 has at least one second groove 162 on the surface 130b that intersects with a second path on the surface of the sealing portion 130 along which the distance between the conductor portion 141B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest.

[0086] First groove 161 extends along the z-axis direction on surface 130a, then reaches surface 130e (the ceiling surface) and surface 130f (the bottom surface), and then extends along the x-axis direction. Similarly, second groove 162 extends along the z-axis direction on surface 130a, then reaches surfaces 130e and 130f, and then extends along the x-axis direction. First groove 161 and second groove 162 meet at portions of surfaces 130e and 130f extending along the x-axis direction to form a single groove.

[0087] Furthermore, the sealing portion 130 has at least one fifth groove 167 on the surface 130d. The fifth groove 167 intersects with the third path on the surface of the sealing portion 130, where the distance between the conductor portion 141A, which is the exposed portion of the current conductor 140A, and the conductor portion 142B, which is the exposed portion of the current conductor 140B, is shortest. The fifth groove 167 extends along the z-axis direction on the surface 130d and further extends in the y-axis direction, reaching the surfaces 130e and 130f. After extending in the y-axis direction on the surfaces 130e and 130f, the fifth groove 167 merges with the first groove 161 and the second groove 162, which extend in the x-axis direction on the surfaces 130e and 130f. As a result, the first groove 161 and the fifth groove 167 surround the conductor portion 141A and the conductor portion 142A, which are the exposed portions of the current conductor 140A. Moreover, the second groove 162 and the fifth groove 167 surround the conductor portion 141B and the conductor portion 142B, which are exposed portions of the current conductor 140B.

[0088] 5A to 5C is a surface-mount type in which current conductors 140A and 140B are disposed on the mounting surface of a substrate 200. If a slit or the like is provided in the substrate 200 to increase the creepage distance on the substrate 200 side, it may be preferable to position the sealing portion 130 of the current sensor 10 away from the substrate 200 so as not to interfere with the creepage distance. That is, it may be preferable to position the sealing portion 130 away from the substrate 200 to prevent dielectric breakdown through the surface of the current sensor 10. Therefore, the portions of the conductor portions 141A and 142A exposed from the surface 130a of the sealing portion 130 and the portions of the conductor portions 141B and 142B exposed from the surface 100b of the sealing portion 130 each have an extension portion 1410 that extends in the z-axis direction beyond the surface 130f of the sealing portion 130 facing the surface 100b opposite the circuit surface of the signal processing IC 100. By fixing the extension portion 1410 to the mounting surface 200a of the substrate 200, the sealing portion 130 is positioned above the mounting surface 200a. This makes it possible to provide a space between the sealing portion 130 and the substrate 200. It is preferable that the distance between the mounting surface 200a of the substrate 200 and the surface 130f of the sealing portion 130 that faces the mounting surface 200a is 1 mm or more.

[0089] The current sensor 10 shown in FIGS. 5A to 5C is an example of a surface-mount type. The current sensors 10 shown in FIGS. 1A to 1C and 4A to 4C are also examples of a surface-mount type. However, the current sensor 10 may be an insert-mount type in which the current conductors 140A and 140B are inserted into the substrate 200. The insert-mount type allows the current conductors 140A and 140B to be electrically connected directly and with low resistance to the copper foil inner layer of the substrate 200 at the shortest distance, thereby reducing heat generation in the substrate 200. Furthermore, when the extension portion 1410 is inserted into the substrate 200, the width of the tip of the extension portion 1410 should be narrower than the width of the remaining portion of the extension portion 1410 to ensure a space between the mounting surface 200a of the substrate 200 and the surface 130f of the sealing portion 130. The narrow tip of the extension portion 1410 is inserted into the substrate 200, and the remaining portion of the extension portion 1410 contacts the mounting surface 100a of the substrate 200. This ensures a space between the mounting surface 200a of the substrate 200 and the surface 130f of the sealing portion 130. For example, as shown in FIG. 6, the tip of the extension portion 1410 may include multiple teeth 1410a arranged in a comb shape. This allows the teeth 1410a to be inserted into multiple circular holes formed in the substrate 200 to establish direct electrical connection with the inner layers of the substrate 200, making it easier to drill holes in the substrate 200 and reducing heat generation in the substrate 200. For example, a drill or the like can be used to drill the holes in the substrate 200. The width of each of the plurality of tooth portions 1410a may be 0.5 to 2 times the thickness D (shown in FIG. 5C) of each of the conductor portions 141A, 142A, 141B, and 142B. The cross section of the plurality of tooth portions 1410a may be square.

[0090] Fig. 7A is a schematic plan view of the current sensor 10 and the substrate 200 according to the fourth embodiment, as viewed from the ceiling surface side (positive direction of the z-axis). Fig. 7B is a side view of the current sensor 10 and the substrate 200 shown in Fig. 7A, as viewed from the negative direction of the x-axis. Fig. 7C is a side view of the current sensor 10 and the substrate 200 shown in Fig. 7A, as viewed from the negative direction of the y-axis.

[0091] The current sensor 10 according to the fourth embodiment differs from the current sensor 10 according to the third embodiment in that a heat sink 180 is mounted in one of the plurality of fifth grooves 167 in the sealing portion 130, the fifth groove 167 being located in the center of the surface 130e. The heat sink 180 may be made of a metal with high thermal conductivity, such as an aluminum alloy. By providing the heat sink 180, heat generated by current flowing through the current conductors 140A and 140B built into the sealing portion 130 can be efficiently radiated to the outside. Furthermore, by providing the heat sink 180 in the fifth groove 167, an increase in the thickness of the current sensor 10 can be suppressed.

[0092] 8A is a schematic plan view of the current sensor 10 and the substrate 200 according to the fifth embodiment, as viewed from the ceiling surface side (positive z-axis direction). FIG. 8B is a side view of the current sensor 10 and the substrate 200 shown in FIG. 8A, as viewed from the negative x-axis direction. FIG. 8C is a side view of the current sensor 10 and the substrate 200 shown in FIG. 8A, as viewed from the negative y-axis direction. In FIG. 8A, the coordinate system is defined as follows: the x-axis direction is parallel to the paper and extends from bottom to top; the y-axis direction is parallel to the paper and extends from left to right; and the z-axis direction is perpendicular to the paper and extends from back to front. Any one of the x-axis, y-axis, and z-axis is orthogonal to the other axes.

[0093] The current sensor 10 according to the fifth embodiment differs from the current sensors 10 according to the first to fourth embodiments in that the magnetoelectric conversion element 20 is a magnetoresistive element. It also differs in that the magnetoelectric conversion element 20 overlaps the current conductor 140A or the current conductor 140B in plan view. The magnetoelectric conversion element 20 detects a magnetic field in one of the axial directions on the xy plane. That is, the magnetoelectric conversion element 20 has a sensitivity axis along the magnetic sensing surface. For example, the sensitivity axis may be the y-axis direction. The magnetoelectric conversion element 20 may be a magnetoresistive element utilizing the magnetoresistive effect. The magnetoresistive element may be, for example, a semiconductor magnetoresistive element (SMR), an extraordinary magnetoresistive element (AMR), a giant magnetoresistive element (GMR), or a tunneling magnetoresistive element (TMR).

[0094] 8A shows a current sensor in which the magnetoelectric conversion element 20 is built into the signal processing IC 100, but similar to Fig. 7A etc., the magnetoelectric conversion element 20 may not be built into the signal processing IC 100 but may be installed on the circuit surface. That is, the current sensor 10 may have a monolithic structure in which the magnetic sensor 20 is built into the signal processing IC 100, or may not have a monolithic structure in which the magnetic sensor 20 and the signal processing IC 100 are configured separately.

[0095] FIG. 9A is a diagram for explaining the positional relationship between the magnetoelectric conversion element 20 and the current conductors 140A and 140B.

[0096] The current conductor 140A and the second current conductor 140B have the same shape. The current conductor 140A and the second current conductor may be arranged in a positional relationship rotated 180 degrees in a plan view. The current conductor 140B may be arranged at a position obtained by symmetrically moving the current conductor 140A with respect to a line L10 along the y direction as an axis of symmetry in a plan view. The magnetoelectric conversion elements 20A-1 and 20A-2 are arranged at positions to detect a magnetic field in the y-axis direction on the xy plane generated by a current to be measured flowing through the current conductor 140A. The magnetoelectric conversion elements 20A-1 and 20A-2 may be arranged at positions overlapping with the current conductor 140A in a plan view. The magnetoelectric conversion elements 20B-1 and 20B-2 are arranged at positions to detect a magnetic field in the y-axis direction on the xy plane generated by a current to be measured Ib flowing through the current conductor 140B. The magnetoelectric transducer 20B-1 and the magnetoelectric transducer 20B-2 may be disposed at positions overlapping the current conductor 140A in plan view.

[0097] The magnetoelectric conversion element 20A-1 and the magnetoelectric conversion element 20A-2 are arranged opposite each other in the y-axis direction. The magnetoelectric conversion element 20B-1 and the magnetoelectric conversion element 20B-2 are arranged opposite each other in the y-axis direction. The entire magnetically sensitive surface of the magnetoelectric conversion element 20A-1 may overlap with the conductor portion 141A in a planar view, and the entire magnetically sensitive surface of the magnetoelectric conversion element 20A-2 may overlap with the conductor portion 142A in a planar view. The entire magnetically sensitive surface of the magnetoelectric conversion element 20B-1 may overlap with the conductor portion 141B in a planar view, and the entire magnetically sensitive surface of the magnetoelectric conversion element 20B-2 may overlap with the conductor portion 142B in a planar view.

[0098] The shape formed by conductor portion 141A, conductor portion 142A, and conductor portion 143A is symmetrical about the perpendicular bisector L3 of line segment L4 connecting magnetoelectric conversion element 20B-1 and magnetoelectric conversion element 20B-2 in a planar view in terms of the positional relationship between magnetoelectric conversion element 20B-1 and magnetoelectric conversion element 20B-2. The shape formed by conductor portion 141B, conductor portion 142B, and conductor portion 143C is symmetrical about the perpendicular bisector L1 of line segment L2 connecting magnetoelectric conversion element 20A-1 and magnetoelectric conversion element 20A-2 in a planar view in terms of the positional relationship between magnetoelectric conversion element 20A-1 and magnetoelectric conversion element 20A-2.

[0099] Conductor portion 141A includes, in a plan view, a portion 1411A overlapping with magnetoelectric conversion element 20A-1 and a portion 1412A that is wider in the y-axis direction than portion 1411A overlapping with magnetoelectric conversion element 20A-2. Conductor portion 142A includes, in a plan view, a portion 1421A overlapping with magnetoelectric conversion element 20A-2 and a portion 1422A that is wider in the y-axis direction than portion 1421A overlapping with magnetoelectric conversion element 20A-2. Conductor portion 141B includes, in a plan view, a portion 1411B overlapping with magnetoelectric conversion element 20B-1 and a portion 1412B that is wider in the y-axis direction than portion 1411B overlapping with magnetoelectric conversion element 20B-1. In a plan view, the conductor portion 142B includes a portion 1421B that overlaps with the magnetoelectric conversion element 20B-2 and a portion 1422B that is wider in the y-axis direction than the portion 1421B that overlaps with the magnetoelectric conversion element 20B-2. Because the widths of the portions of the current conductors 140A and 140B that overlap with the magnetoelectric conversion element 20 are narrow, the magnetoelectric conversion element 20 can measure the currents flowing through the current conductors 140A and 140B with high sensitivity.

[0100] The magnetoelectric conversion element 20A-1 may be disposed at the center of the width in the y-axis direction of a portion 1411A of the conductor portion 141A that overlaps with the magnetoelectric conversion element 20A-1 in a plan view. The magnetoelectric conversion element 20A-2 may be disposed at the center of the width in the y-axis direction of a portion 1421A of the conductor portion 142A that overlaps with the magnetoelectric conversion element 20A-2 in a plan view. The magnetoelectric conversion element 20B-1 may be disposed at the center of the width in the y-axis direction of a portion 1411B of the conductor portion 141B that overlaps with the magnetoelectric conversion element 20B-1 in a plan view. The magnetoelectric conversion element 20B-2 may be disposed at the center of the width in the y-axis direction of a portion 1421B of the conductor portion 142B that overlaps with the magnetoelectric conversion element 20B-2 in a plan view. This enables the magnetoelectric conversion element 20 to measure the currents flowing through the current conductors 140A and 140B with higher sensitivity.

[0101] However, as shown in FIG. 9B, the magnetoelectric conversion element 20 does not have to be positioned at the center of the portion of the current conductor 140A or the current conductor 140B that overlaps with the magnetoelectric conversion element 20 in a planar view.

[0102] Fig. 10 is an example of a plan view of the current sensor 10 according to the second embodiment mounted on a substrate 200. As shown in Fig. 10, the substrate 200 has slits 210 and 212 that extend along the y-axis direction and penetrate the substrate 200.

[0103] In plan view, terminal portion 152A and terminal portion 152B are present between slit 210 and slit 212. In plan view, slit 210 is present between conductor portion 141A and conductor portion 142A and terminal portion 152A and terminal portion 152B. In plan view, slit 212 is present between conductor portion 141B and conductor portion 142B and terminal portion 152A and terminal portion 152B.

[0104] The slit 210 may be provided at a position facing the portions of the first groove 161 and the third groove 163 along the y-axis direction on the surface 130f, which is the bottom surface of the sealing unit 130. The slit 212 may be provided at a position facing the portions of the second groove 162 and the fourth groove 164 along the y-axis direction on the surface 130f of the sealing unit 130. The slits 210 and 212 are longer than the width of the sealing unit 130 in the y-axis direction in a planar view. The slits 210 and 212 extend in the positive and negative y-axis directions beyond the side surfaces (surfaces 130c or 130d) of the sealing unit 130 in a planar view. The slits 210 and 212 may extend in the positive and negative y-axis directions beyond the side surfaces of the sealing unit 130 by at least 5 mm or more in a planar view. The width of the slits 210 and 212 may be 1 mm or more.

[0105] Fig. 11 is an example of a plan view of the current sensor 10 according to the third embodiment mounted on a substrate 200. As shown in Fig. 11, the substrate 200 has a slit 210 that extends along the x-axis direction and penetrates the substrate 200, and a slit 212 that extends along the y-axis direction and penetrates the substrate 200.

[0106] In plan view, slit 210 exists between terminal portion 152A and conductor portion 142A and conductor portion 141B. In plan view, slit 212 exists between conductor portion 141A and conductor portion 142A and conductor portion 141B and conductor portion 142B. Slit 210 and slit 212 may join together to form a T-shape in plan view.

[0107] In a plan view, the slit 210 is longer than the width of the sealing portion 130 in the x-axis direction. In a plan view, the slit 210 extends in the positive x-axis direction and the negative x-axis direction further than the side surfaces (surfaces 130a and 130b) of the sealing portion 130. In a plan view, the slit 212 extends in the negative y-axis direction further than the side surfaces (surface 130b) of the sealing portion 130. In a plan view, the slit 210 may extend in the positive x-axis direction and the negative x-axis direction further than the side surfaces of the sealing portion 130 by at least 5 mm. In a plan view, the slit 212 may extend in the negative y-axis direction further than the side surfaces of the sealing portion 130 by 5 mm or more. The width of the slits 210 and 212 may be 1 mm or more.

[0108] By providing the slits 210 and 212 as shown in FIGS. 10 and 11 in the substrate 200, it is possible to more reliably ensure insulation between the current conductors 140A and 140B and the terminal portions 152A and 152B.

[0109] FIG. 12A is a schematic plan view of a current sensor 10 according to a sixth embodiment, as viewed from the ceiling surface side (positive z-axis direction). FIG. 12B is a side view of the current sensor 10 shown in FIG. 12A, as viewed from the negative x-axis direction. FIG. 12C is a side view of the current sensor 10 shown in FIG. 12A, as viewed from the negative y-axis direction. In FIG. 12A, the coordinate system is defined as follows: the x-axis direction is parallel to the paper and extends from bottom to top; the y-axis direction is parallel to the paper and extends from left to right; and the z-axis direction is perpendicular to the paper and extends from back to front. Any one of the x-axis, y-axis, and z-axis is orthogonal to the other axes.

[0110] Similar to the current sensor 10 according to the first embodiment, the magnetoelectric transducers 20A-1 and 20A-2 are disposed on a support plate 170A made of an insulating material such as polyimide tape. The magnetoelectric transducers 20B-1 and 20B-2 are disposed on a support plate 170B made of an insulating material such as polyimide tape. The support plate 170A and the support plate 170B are supported by a support portion 151 of the signal conductor 150. The conductor portion 141A and the conductor portion 142A have a step portion 144A spaced apart from the signal conductor 150 in the z-axis direction (thickness direction) so that the current conductor 140A and the signal conductor 150 do not come into contact with each other in the z-axis direction (thickness direction). The conductor portion 141B and the conductor portion 142B have a step portion 144B spaced apart from the signal conductor 150 in the z-axis direction so that the current conductor 140B and the signal conductor 150 do not come into contact with each other in the z-axis direction (thickness direction).

[0111] On the other hand, the current sensor 10 according to the sixth embodiment differs from the current sensor 10 according to the first embodiment in the surface of the sealing unit 130 on which the first groove 161, the second groove 162, the third groove 163, and part of the fourth groove 164 are formed. The sealing unit 130 has at least one first groove 161 on the surface 130a, which intersects with a first path on the surface of the sealing unit 130 along which the distance between the exposed portion of the conductor portion 141A, which is the exposed portion of the current conductor 140A, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. Furthermore, the sealing unit 130 has at least one second groove 162 on the surface 130a, which intersects with a second path on the surface of the sealing unit 130 along which the distance between the conductor portion 142A, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest.

[0112] First groove 161 extends along the z-axis direction on surface 130c, then extends along the x-axis direction to reach surface 130e (the ceiling surface) and surface 130f (the bottom surface), and then extends along the y-axis direction. Similarly, second groove 162 extends along the z-axis direction on surface 130c, then extends along the x-axis direction to reach surfaces 130e and 130f, and then extends along the y-axis direction. First groove 161 and second groove 162 merge at portions of surfaces 130e and 130f extending along the y-axis direction to form a single groove, and conductor portion 141A and conductor portion 142A exposed from surface 130a are surrounded by first groove 161 and second groove 162.

[0113] The sealing portion 130 has at least one third groove 163 on the surface 130b that intersects with a third path on the surface along which the distance between the exposed portion of the conductor portion 142B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. Furthermore, the sealing portion 130 has at least one fourth groove 164 on the surface 130b that intersects with a fourth path on the surface of the sealing portion 130 along which the distance between the conductor portion 141B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest.

[0114] The third groove 163 extends along the z-axis direction on the surface 130b, further extends in the x-axis direction as it reaches the surfaces 130e and 130f, and then extends along the y-axis direction. Similarly, the fourth groove 164 extends along the z-axis direction on the surface 130b, further extends in the x-axis direction as it reaches the surfaces 130e and 130f, and then extends along the y-axis direction. The third groove 163 and the fourth groove 164 meet at portions of the surfaces 130e and 130f extending along the y-axis direction to form a single groove, and the current conductor 141B and the conductor portion 142B are surrounded by the third groove 163 and the fourth groove 164.

[0115] The sealing portion 130 has a groove 166 extending in the z-axis direction in the exposed portion of the terminal portion 152A in the central portion of the surface 130c. Furthermore, the sealing portion 130 has a groove 165 extending in the z-axis direction in the exposed portion of the terminal portion 152B in the central portion of the surface 130d. The grooves 165 and 166 extend along the z-axis direction and further extend along the y-axis direction to reach the surfaces 130e and 130f, where they merge with each other. The groove 165 merges with a portion of the third groove 163 formed in the surfaces 130e and 130f and extending in the x-axis direction. The groove 166 merges with a portion of the second groove 162 formed in the surfaces 130e and 130f and extending in the x-axis direction.

[0116] According to the current sensor 10 of the sixth embodiment, similarly to the current sensor 10 of the first embodiment, a groove is provided on the side of the sealing portion 130, so that the current sensor 10 has two current conductors 140A and 140B and is capable of measuring two channels of current to be measured, and it is possible to achieve miniaturization while ensuring a creepage distance between the current conductors 140A and 140B and the signal conductor 150.

[0117] FIG. 13A is a schematic plan view of the current sensor 10 according to the seventh embodiment, as viewed from the ceiling surface side (positive z-axis direction). FIG. 13B is a side view of the current sensor 10 shown in FIG. 13A, as viewed from the negative x-axis direction. FIG. 13C is a side view of the current sensor 10 shown in FIG. 13A, as viewed from the negative y-axis direction. In FIG. 13A, the coordinate system is defined as follows: the x-axis direction is parallel to the paper and extends from bottom to top; the y-axis direction is parallel to the paper and extends from left to right; and the z-axis direction is perpendicular to the paper and extends from back to front. Any one of the x-axis, y-axis, and z-axis is orthogonal to the other axes.

[0118] In the current sensor 10 according to the seventh embodiment, similar to the current sensor 10 according to the second embodiment, the magnetoelectric conversion element 20 is mounted on the surface 100a, which is the circuit surface of the signal processing IC. Similar to the current sensor 10 according to the second embodiment, the magnetoelectric conversion elements 20A-1 and 20A-2 are arranged in an area surrounded by the current conductor 140A in a planar view. Similar to the current sensor 10 according to the second embodiment, the magnetoelectric conversion elements 20B-1 and 20B-2 are arranged in an area surrounded by the current conductor 140B in a planar view.

[0119] On the other hand, the current sensor 10 according to the seventh embodiment differs from the current sensor 10 according to the second embodiment in the surface of the sealing unit 130 on which the first groove 161, the second groove 162, the third groove 163, and part of the fourth groove 164 are formed. The sealing unit 130 has at least one first groove 161 on the surface 130a, which intersects with a first path on the surface of the sealing unit 130 along which the distance between the exposed portion of the conductor portion 141A, which is the exposed portion of the current conductor 140A, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. Furthermore, the sealing unit 130 has at least one second groove 162 on the surface 130a, which intersects with a second path on the surface of the sealing unit 130 along which the distance between the conductor portion 142A, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest.

[0120] First groove 161 extends along the z-axis direction on surface 130c, then extends along the x-axis direction to reach surface 130e (the ceiling surface) and surface 130f (the bottom surface), and then extends along the y-axis direction. Similarly, second groove 162 extends along the z-axis direction on surface 130c, then extends along the x-axis direction to reach surfaces 130e and 130f, and then extends along the y-axis direction. First groove 161 and second groove 162 merge at portions of surfaces 130e and 130f extending along the y-axis direction to form a single groove, and conductor portion 141A and conductor portion 142A exposed from surface 130a are surrounded by first groove 161 and second groove 162.

[0121] The sealing portion 130 has at least one third groove 163 on the surface 130b that intersects with a third path on the surface along which the distance between the exposed portion of the conductor portion 142B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152B, which is the exposed portion of the signal conductor 150 from the surface 130d, is shortest. Furthermore, the sealing portion 130 has at least one fourth groove 164 on the surface 130b that intersects with a fourth path on the surface of the sealing portion 130 along which the distance between the conductor portion 141B, which is the exposed portion of the current conductor 140B, and the exposed portion of the terminal portion 152A, which is the exposed portion of the signal conductor 150 from the surface 130c, is shortest.

[0122] The third groove 163 extends along the z-axis direction on the surface 130b, further extends in the x-axis direction as it reaches the surfaces 130e and 130f, and then extends along the y-axis direction. Similarly, the fourth groove 164 extends along the z-axis direction on the surface 130b, further extends in the x-axis direction as it reaches the surfaces 130e and 130f, and then extends along the y-axis direction. The third groove 163 and the fourth groove 164 meet at portions of the surfaces 130e and 130f extending along the y-axis direction to form a single groove, and the current conductor 141B and the conductor portion 142B are surrounded by the third groove 163 and the fourth groove 164.

[0123] As described above, according to the current sensor 10 of the seventh embodiment, a groove is provided on the side of the sealing portion 130, and in the current sensor 10 having two current conductors 140A and 140B and capable of measuring two channels of current to be measured, by mounting the magnetoelectric conversion element 20 on the circuit surface of the signal processing IC 100, the distance between the current conductors 140A and 140B can be shortened, as in the current sensor 10 of the second embodiment, thereby achieving an even smaller size than the current sensor 10 of the first embodiment, while ensuring the creepage distance between the current conductors 140A and 140B and the signal conductor 150.

[0124] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention.

[0125] It should be noted that the execution order of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and that the processes can be performed in any order unless the output of a previous process is used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, this does not mean that the processes must be performed in this order.

[0126] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention.

[0127] It should be noted that the execution order of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and that the processes can be performed in any order unless the output of a previous process is used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, this does not mean that the processes must be performed in this order. [Explanation of symbols]

[0128] 10 Current Sensor 20, 20A-1, 20A-2, 20B-1, 20B-2 Magnetoelectric conversion element 22, 108 wire 100 Signal Processing IC 130 Sealing part 140A, 140B current conductor 141A, 142A, 143A Conductor parts 141B, 142B, 143B Conductor parts 144A, 144B, 154 Step 145A, 145B extension part 150 Signal Conductor 151 Support part 152A, 152B terminal section 161, 162, 163, 164, 165, 166, 167 groove 170A, 170B support plate 180 Heatsink 200 boards 210, 212 slits 212 Slit 1410 Extension part 1410a Teeth

Claims

1. a first current conductor through which a first current to be measured flows; a first magnetoelectric transducer for detecting a magnetic field generated by the first current to be measured; a second current conductor through which a second current to be measured flows; a second magnetoelectric transducer for detecting a magnetic field generated by the second current to be measured; a signal processing IC that processes signals output from the first magnetoelectric transducer and the second magnetoelectric transducer; a signal conductor electrically connected to the signal processing IC and transmitting a signal output from the signal processing IC; a sealing portion that seals a portion of the first current conductor, the first magnetoelectric transducer, a portion of the second current conductor, the second magnetoelectric transducer, the signal processing IC, and a portion of the signal conductor; Equipped with a portion of the first current conductor is exposed from a first surface of the sealing portion; a portion of the second current conductor is exposed from a second surface of the sealing portion that faces the first surface in a first direction; a portion of the signal conductor is exposed from a third surface of the sealing portion adjacent to the first surface and the second surface along the first direction; The sealing portion is a first groove formed along the first surface or the third surface; A current sensor having:

2. The current sensor according to claim 1 , further comprising a second groove formed along the second surface or the third surface.

3. the sealing portion includes a fourth surface facing the third surface in a second direction intersecting the first direction, and a fifth surface and a sixth surface facing the third direction intersecting the first direction and the second direction, 3. The current sensor according to claim 2, wherein the first groove and the second groove include a portion along the third direction on the first surface or the third surface, and a portion along at least the first direction on the fifth surface and the sixth surface.

4. The sealing portion is a fifth surface and a sixth surface that face each other in the first direction and a third direction that intersects with a second direction that intersects with the first direction; 2. The current sensor according to claim 1, further comprising a groove that extends across the third surface, the fifth surface, and the sixth surface so as to surround the exposed portion of the signal conductor from the third surface.

5. The sealing portion is a fourth surface facing the third surface in a second direction intersecting the first direction, Another part of the signal conductor is exposed from the fourth surface, The sealing portion is a third groove formed along the first surface or the fourth surface; The current sensor according to claim 2 , further comprising a fourth groove formed along the second surface or the fourth surface.

6. the sealing portion has a fifth surface and a sixth surface that face each other in a third direction that intersects with the first direction and the second direction; a groove that communicates with the fourth surface, the fifth surface, and the sixth surface so as to surround the exposed portion of the signal conductor from the fourth surface; the first groove and the second groove are provided on the third surface and are part of the groove that communicates with the exposed portion of the signal conductor from the third surface so as to surround the exposed portion, The current sensor according to claim 5 , wherein the third groove and the fourth groove are part of a groove that is provided on the fourth surface and communicates with the exposed portion of the signal conductor from the fourth surface so as to surround the exposed portion.

7. the sealing portion includes a fourth surface facing the third surface in a second direction intersecting the first direction, another part of the signal conductor is exposed from the fourth surface, the sealing portion has a second groove formed along the second surface or the third surface, a third groove formed along the first surface or the fourth surface, and a fourth groove formed along the second surface or the fourth surface, the sealing portion has a fifth surface and a sixth surface that face each other in a third direction that intersects with the first direction and the second direction, a groove that communicates across the first surface, the fifth surface, and the sixth surface so as to surround an exposed portion of the first current conductor from the first surface, and a groove that communicates across the second surface, the fifth surface, and the sixth surface so as to surround an exposed portion of the second current conductor from the second surface, the first groove is provided in the first surface or the third surface, the third groove is provided in the first surface or the fourth surface and is a part of the groove communicating with and surrounding the exposed portion of the first current conductor from the first surface, the second groove is provided in the second surface or the third surface, The current sensor according to claim 1 , wherein the fourth groove is provided in the second surface or the fourth surface and is a part of the groove that communicates with and surrounds the exposed portion of the second current conductor from the second surface.

8. The first groove and the second groove are The current sensor according to claim 6 , comprising: a portion of the third surface extending along the third direction; and portions of the fifth surface and the sixth surface extending along the first direction and the second direction.

9. the sealing portion includes a fourth surface facing the third surface in a second direction intersecting the first direction, and a fifth surface and a sixth surface facing the third direction intersecting the first direction and the second direction, the signal conductor is not exposed from the fourth surface; 3. The current sensor of claim 2, wherein the sealing portion has a fifth groove on the fourth surface that intersects with a fifth path on the surface of the sealing portion where a distance between the exposed portion of the first current conductor and the exposed portion of the second current conductor is shortest.

10. a groove communicating across the first surface, the second surface, the fifth surface, and the sixth surface; The current sensor of claim 9 , wherein the first groove and the second groove are part of the groove.

11. The current sensor of claim 10 , wherein the fifth groove is a part of the groove.

12. The current sensor according to claim 9 , wherein the fifth groove communicates across the fourth surface, the fifth surface, and the sixth surface.

13. the first groove includes a portion along the third direction in the first surface and portions along the first direction in the fifth surface and the sixth surface, the second groove includes a portion along the third direction in the second surface and portions along the first direction in the fifth surface and the sixth surface, 10. The current sensor according to claim 9, wherein the portion of the first groove along the first direction on the fifth surface and the sixth surface and the portion of the second groove along the first direction on the fifth surface and the sixth surface merge with each other.

14. the first groove includes a portion along the third direction in the first surface and portions along the first direction in the fifth surface and the sixth surface, the second groove includes a portion along the third direction in the second surface and portions along the first direction in the fifth surface and the sixth surface, the fifth groove includes a portion along the third direction in the fourth surface and portions along the second direction in the fifth surface and the sixth surface, the portions of the first groove along the first direction on the fifth surface and the sixth surface merge with the portions of the second groove along the first direction on the fifth surface and the sixth surface, the portions of the fifth groove along the second direction in the fifth surface and the sixth surface merge with the first groove and the second groove, an exposed portion of the first current conductor from the sealing portion is surrounded by the fifth groove and the first groove; The current sensor according to claim 12 , wherein the exposed portion of the second current conductor from the sealing portion is surrounded by the fifth groove and the second groove.

15. The current sensor according to claim 14 , further comprising a heat sink provided on the portion of the fifth surface or the sixth surface of the sealing portion along the second direction.

16. The current sensor according to claim 1 , wherein the first magnetoelectric transducer and the second magnetoelectric transducer are disposed on a circuit surface of the signal processing IC.

17. the first current conductor includes, in a plan view, a first conductor portion and a second conductor portion that extend in the first direction and are spaced apart in a second direction intersecting the first direction, and a third conductor portion that extends in the second direction and connects the first conductor portion and the second conductor portion; the second current conductor includes, in a plan view, a fourth conductor portion and a fifth conductor portion that extend in the first direction and are spaced apart in the second direction, and a sixth conductor portion that extends in the second direction and connects the fourth conductor portion and the fifth conductor portion; a portion of the first conductor portion and a portion of the second conductor portion are exposed from the first surface of the sealing portion; The current sensor according to claim 16 , wherein a portion of the fourth conductor portion and a portion of the fifth conductor portion are exposed from the second surface of the sealing portion.

18. 18. The current sensor according to claim 17, wherein, in a plan view, the third conductor portion and the sixth conductor portion face each other at a distance from each other, and the space between the third conductor portion and the sixth conductor portion is filled with a resin material that constitutes the sealing portion.

19. a third magnetoelectric transducer arranged on the circuit surface of the signal processing IC to face the first magnetoelectric transducer across a part of the first conductor portion in a plan view; a fourth magnetoelectric transducer arranged on the circuit surface of the signal processing IC, facing the second magnetoelectric transducer across a part of the fifth conductor portion in a plan view; Furthermore, In a plan view, at least a portion of the third magnetoelectric transducer is located in a region surrounded by the first current conductor, In a plan view, at least a portion of the fourth magnetoelectric transducer is located in a region surrounded by the second current conductor, In a plan view, a distance between the first magnetoelectric transducer and the sixth conductor portion is equal to a distance between the third magnetoelectric transducer and the sixth conductor portion; 18. The current sensor according to claim 17, wherein, in a plan view, a distance between the second magnetoelectric transducer and the third conductor portion is equal to a distance between the fourth magnetoelectric transducer and the third conductor portion.

20. 20. The current sensor according to claim 19, wherein the first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer are built into a chip that constitutes the signal processing IC.

21. a third magnetoelectric transducer arranged on the circuit surface of the signal processing IC, facing the first magnetoelectric transducer across the second conductor portion in a plan view; a fourth magnetoelectric transducer arranged on the circuit surface of the signal processing IC, facing the second magnetoelectric transducer across the fourth conductor portion in plan view; Furthermore, the first magnetoelectric transducer is located in a region surrounded by the first current conductor in a plan view; the second magnetoelectric transducer is located in a region surrounded by the second current conductor in a plan view; In a plan view, a distance between the first magnetoelectric transducer and the sixth conductor portion is equal to a distance between the third magnetoelectric transducer and the sixth conductor portion; In a plan view, a distance between the second magnetoelectric transducer and the third conductor portion is equal to a distance between the fourth magnetoelectric transducer and the third conductor portion; 18. The current sensor according to claim 17, wherein the first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer have sensitivity axes in a third direction that intersects the first direction and the second direction.

22. 22. The current sensor according to claim 21, wherein the first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer are built into a chip that constitutes the signal processing IC.

23. In a plan view, the first magnetoelectric transducer is located on an extension line of the fourth conductor portion, In a plan view, the third magnetoelectric transducer is located on an extension line of the fifth conductor portion, In a plan view, the second magnetoelectric transducer is located on an extension line of the second conductor portion, The current sensor according to claim 21 , wherein the fourth magnetoelectric transducer is located on an extension line of the first conductor portion in plan view.

24. In a plan view, the first magnetoelectric transducer is located on a perpendicular bisector of a line segment connecting the second magnetoelectric transducer and the fourth magnetoelectric transducer, 24. The current sensor according to claim 23, wherein, in a plan view, the second magnetoelectric transducer is located on a perpendicular bisector of a line segment connecting the first magnetoelectric transducer and the third magnetoelectric transducer.

25. 22. The current sensor according to claim 21, wherein the first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer are Hall elements utilizing the Hall effect and having a sensitivity axis in a direction intersecting a magnetic sensing surface.

26. the first current conductor and the second current conductor have the same shape; the first current conductor and the second current conductor are arranged in a positional relationship rotated by 180 degrees in a plan view, The current sensor a third magnetoelectric transducer arranged to face the first magnetoelectric transducer in the second direction; a fourth magnetoelectric transducer arranged to face the second magnetoelectric transducer in the second direction, the entire magnetic sensing surface of the first magnetoelectric conversion element overlaps with the first conductor portion in a plan view; the entire magnetic sensing surface of the third magnetoelectric conversion element overlaps with the second conductor portion in a plan view; the entire magnetic sensing surface of the second magnetoelectric conversion element overlaps with the fourth conductor portion in a plan view, the entire magnetic sensing surface of the fourth magnetoelectric conversion element overlaps with the fifth conductor portion in a plan view, The current sensor according to claim 17 , wherein the first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer have sensitivity axes in the second direction.

27. 27. The current sensor according to claim 26, wherein the first magnetoelectric transducer, the second magnetoelectric transducer, the third magnetoelectric transducer, and the fourth magnetoelectric transducer are built into a chip that constitutes the signal processing IC.

28. A current sensor according to any one of claims 5 to 8; a substrate on which the current sensor is mounted, the substrate has a first slit and a second slit extending in a second direction intersecting the first direction; In a plan view, an exposed portion of the signal conductor from the sealing portion is present between the first slit and the second slit, the first slit is present between the exposed portion of the first current conductor from the sealing portion and the exposed portion of the signal conductor from the sealing portion, and the second slit is present between the exposed portion of the second current conductor from the sealing portion and the exposed portion of the signal conductor from the sealing portion, The current sensor module, wherein the first slit and the second slit extend outward from the third surface and the fourth surface of the sealing portion in a plan view.

29. the current sensor further has a second groove formed along the second surface or the third surface; 29. The current sensor module of claim 28, wherein the first slit and the second slit are arranged at least at positions facing the portions of the first groove and the second groove of the sealing portion that face the substrate along the second direction.

30. A current sensor according to any one of claims 9 to 15; a substrate on which the current sensor is mounted, the substrate has a first slit extending in the first direction and a second slit extending in a second direction intersecting the first direction; the first slit is present between an exposed portion of the first current conductor from the sealing portion, an exposed portion of the second current conductor from the sealing portion, and an exposed portion of the signal conductor from the sealing portion, and extends outward from the first surface and the second surface of the sealing portion in a plan view; A current sensor module, wherein the second slit is located between the exposed portion of the first current conductor from the sealing portion and the exposed portion of the second current conductor from the sealing portion, and extends further outward than the fourth surface of the sealing portion in a planar view.

31. the first slit is disposed at least at a position facing a portion of the first groove and the second groove of the sealing portion that faces the substrate and that extends along the first direction, the second slit is disposed at least at a position facing a portion of the fifth groove of the sealing portion that faces the substrate and that is aligned along the second direction, The current sensor module according to claim 30 , wherein the first slit and the second slit are in communication with each other.

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