Current sensor
By using a current sensor vertically installed below an overhead conductor, and leveraging the magnetic core layer to enhance spatial magnetic field coupling, contactless current monitoring is achieved. This solves the problems of sensor insulation capacity and installation costs, and improves monitoring efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2026-03-31
AI Technical Summary
Existing overhead conductor current monitoring sensors require direct contact with the conductors, resulting in high insulation requirements and the need for power outages during installation, leading to economic losses.
Design a current sensor that uses a structure of housing, coil frame, coil and magnetic core layer, and is installed vertically directly below an overhead conductor. The magnetic core layer is used to enhance the coupling of the spatial magnetic field to achieve contactless current monitoring.
The elimination of contact with wires reduces the requirements for sensor insulation, avoids power outages during installation, and minimizes economic losses.
Smart Images
Figure CN224066881U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power monitoring technology, and in particular to a current sensor. Background Technology
[0002] Overhead transmission lines are the key carriers of power transmission, and monitoring signals such as line load current, fault current, and high-frequency current is an essential part of the operation and maintenance of power grid companies.
[0003] Currently, such as Figure 1 As shown, the monitoring of overhead conductor current signals mainly employs loop current sensors, such as magnetic ring current transformers and Rogowski coils, which reconstruct the measured current signal by coupling the magnetic field around the overhead conductor. These sensors require direct contact with the conductor, which places high demands on their insulation capabilities and increases manufacturing costs. Furthermore, to ensure the safety of installers, the power line must be shut down during installation, resulting in economic losses in power transmission. Utility Model Content
[0004] This application proposes a current sensor for monitoring the current of an overhead conductor without contact with it.
[0005] To achieve the above objectives, this application adopts the following technical solution:
[0006] In a first aspect, a current sensor is provided, comprising a housing, a coil frame, a coil, and a magnetic core layer; the current sensor is mounted directly below and perpendicular to an overhead conductor. The coil frame and the magnetic core layer have a cylindrical structure, with the magnetic core layer embedded inside the coil frame; the coil is wound around the outside of the coil frame; the coil frame is placed inside the housing.
[0007] Furthermore, the coil frame includes an outer PCB board and an inner PCB board, with the outer PCB board and the inner PCB board forming a hollow layer, and the magnetic core layer embedded inside the inner PCB board.
[0008] Furthermore, the outer PCB board and the inner PCB board are fixed together by multiple connecting plates.
[0009] Furthermore, two symmetrical wiring boards are connected to the outer side of the coil frame, and the wiring boards are provided with multiple wiring holes.
[0010] Furthermore, the multiple wiring holes include a first layer of wiring holes and a second layer of wiring holes; the first layer of wiring holes and the second layer of wiring holes are arranged side by side in an intersecting manner.
[0011] Furthermore, a first layer of wire turns is formed on the outside of the coil frame after winding based on the first layer of wiring holes, and a second layer of wire turns is formed on the outside of the coil frame after winding based on the second layer of wiring holes; on the outside of the coil frame, the first layer of wire turns and the second layer of wire turns are wound in a cross-winding manner.
[0012] Furthermore, the shell consists of cylindrical sides and two end caps.
[0013] Furthermore, the cylindrical sides are made of metal.
[0014] Furthermore, an explosion-proof plug and a signal output line are connected to the outside of the end cover.
[0015] Furthermore, the gap between the housing and the coil frame is filled with a plastic resin potting compound.
[0016] To ensure effective current monitoring, the current sensor provided in this application incorporates a magnetic core layer embedded within the coil frame. This enhances the current sensor's ability to couple with spatial magnetic fields, enabling it to monitor the current of overhead conductors without direct contact. Consequently, by eliminating the need for contact with overhead conductors, this overcomes the limitations of related technologies that require high insulation of the current sensor housing and cause economic losses in power transmission during installation. Attached Figure Description
[0017] Figure 1 A schematic diagram of the installation of a ring current sensor provided for an embodiment of this application;
[0018] Figure 2 A schematic diagram of the structure of a current sensor provided for an embodiment of this application;
[0019] Figure 3 A schematic diagram of the installation position of a current sensor provided for an embodiment of this application;
[0020] Figure 4 A schematic cross-sectional view of a coil frame provided for an embodiment of this application;
[0021] Figure 5 A three-dimensional structural schematic diagram of a coil frame provided for an embodiment of this application;
[0022] Figure 6 A schematic diagram of a coil winding structure provided for an embodiment of this application;
[0023] Figure 7 A schematic diagram of the structure of a current sensor provided for an embodiment of this application;
[0024] Figure label:
[0025] Current sensor 100, housing 110, cylindrical side 111, end cover 112, coil frame 120, outer PCB board 121, inner PCB board 122, hollow layer 123, connecting plate 124, wiring board 125, first layer wiring hole 126, second layer wiring hole 127, coil 130, first layer wire turn 131, second layer wire turn 132, magnetic core layer 140, explosion-proof plug 150, signal output line 160, plastic resin potting compound 170, overhead wire 200. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.
[0027] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0030] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0031] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0032] This application discloses a current sensor, including a housing, a coil frame, a coil, and a magnetic core layer; the current sensor is installed directly below and perpendicular to an overhead conductor. The coil frame and the magnetic core layer have a cylindrical structure, with the magnetic core layer embedded inside the coil frame; the coil is wound on the outside of the coil frame; the coil frame is placed inside the housing.
[0033] To ensure effective current monitoring, the current sensor provided in this application incorporates a magnetic core layer embedded within the coil frame. This enhances the current sensor's ability to couple with spatial magnetic fields, enabling it to monitor the current of overhead conductors without direct contact. Consequently, by eliminating the need for contact with overhead conductors, this overcomes the limitations of related technologies that require high insulation of the current sensor housing and cause economic losses in power transmission during installation.
[0034] Figure 2 A schematic diagram of a current sensor structure is shown, wherein the current sensor 100 includes a housing 110, a coil frame 120, a coil 130, and a magnetic core layer 140.
[0035] Figure 3 A schematic diagram of the installation position of a current sensor 100 is shown. The current sensor 100 is installed directly below the overhead conductor 200 and perpendicular to the overhead conductor 200.
[0036] like Figure 2As shown, the coil frame 120 and the magnetic core layer 140 have a cylindrical structure, and the magnetic core layer is embedded inside the coil frame 120 to enhance the ability of the current sensor 100 to couple a spatial magnetic field.
[0037] The coil 130 is wound on the outside of the coil frame 120, and the coil frame 120 is placed inside the housing 110.
[0038] Figure 4 A cross-sectional schematic diagram of a coil frame 120 is shown, which includes an outer PCB board 121 and an inner PCB board 122.
[0039] The outer PCB board 121 and the inner PCB board 122 form a hollow layer 123, and the magnetic core layer 140 is embedded inside the inner PCB board 122.
[0040] Understandably, since the magnetic core layer 140 has magnetic saturation characteristics, a hollow layer 123 is introduced into the coil frame 120 to enhance the critical value of magnetic saturation and improve the accuracy of current measurement by the current sensor 100.
[0041] In some embodiments, in order to improve the stability of the coil frame 120, it is fixed between the outer PCB board 121 and the inner PCB board 122 by a plurality of connecting plates.
[0042] For example, such as Figure 4 As shown, multiple connecting plates 124 are provided between the outer PCB board 121 and the inner PCB board 122 to ensure the stability of the coil frame 120.
[0043] In some embodiments, such as Figure 4 As shown, two symmetrical wiring boards 125 are connected to the outer side of the coil frame 120; as Figure 5 As shown, the wiring board 125 is provided with multiple wiring holes, including a first layer wiring hole 126 and a second layer wiring hole 127.
[0044] The first layer wiring hole 126 and the second layer wiring hole 127 are arranged side by side in an intersecting manner.
[0045] In some embodiments, in order to enable the current sensor 100 to have a wider detection bandwidth and adapt to the acquisition of multi-frequency signals such as load current, fault current, and high-frequency current, the coil 130 of the current sensor 100 is wound in a cross double-layer winding manner.
[0046] like Figure 6 As shown, after winding based on the first layer of wiring holes 126, a first layer of wire turns 131 is formed on the outside of the coil frame 120, and after winding based on the second layer of wiring holes 127, a second layer of wire turns 132 is formed on the outside of the coil frame 120.
[0047] On the outside of the coil frame 120, the first layer of wire turns 131 and the second layer of wire turns 132 are wound in a cross-winding manner.
[0048] Understandably, the above winding method can significantly reduce the distributed capacitance between the windings while ensuring the uniformity of the winding, thereby increasing the detection bandwidth of the current sensor.
[0049] Figure 7 A schematic diagram of a current sensor 100 is shown, wherein the housing 110 of the current sensor 100 is composed of a cylindrical side surface 111 and two end cover plates 112.
[0050] The cylindrical side 111 is made of metal, such as stainless steel, to better shield against the influence of external interference magnetic fields.
[0051] Optionally, both end covers 112 can be PCB covers, such as... Figure 7 As shown, an explosion-proof plug 150 and a signal output line 160 are connected to the outside of any end cover plate 112.
[0052] The signal output line 160 is connected to the coil 130 inside the current sensor 100 via the explosion-proof plug 150 for uploading the acquired signal.
[0053] like Figure 7 As shown, in the current sensor 100, the gap between the housing 110 and the coil frame 120 is filled with a plastic resin potting compound 170 to fix the coil frame 120 inside the housing 110, thereby improving the stability of the current sensor 100 in use.
[0054] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A current sensor, characterized by, The current sensor comprises a shell, a coil former, a coil and a magnetic core layer; the current sensor is installed directly below an overhead conductor and is perpendicular to the overhead conductor; The coil former and the magnetic core layer are in a cylindrical structure, and the magnetic core layer is embedded in the coil former; The coil is wound outside the coil former; The coil former is placed inside the shell.
2. The current sensor of claim 1, wherein, The coil former comprises an outer PCB and an inner PCB, the outer PCB and the inner PCB form a hollow layer, and the magnetic core layer is embedded in the inner PCB.
3. The current sensor of claim 2, wherein, The outer PCB and the inner PCB are fixed by a plurality of connecting plates.
4. The current sensor according to any one of claims 1 to 3, characterized in that Two mutually symmetrical wire boards are connected to the outside of the coil former, and a plurality of wire holes are arranged on the wire boards.
5. The current sensor of claim 4, wherein, The plurality of wire holes comprises a first layer of wire holes and a second layer of wire holes; The first layer of wire holes and the second layer of wire holes are arranged in a staggered manner.
6. The current sensor of claim 5, wherein, After winding based on the first layer of wire holes, a first layer of turns is formed outside the coil former, and after winding based on the second layer of wire holes, a second layer of turns is formed outside the coil former; Outside the coil former, the first layer of turns and the second layer of turns are wound in a staggered manner.
7. The current sensor of any one of claims 1-3, wherein, The shell is composed of a cylindrical side and two end cover plates.
8. The current sensor of claim 7, wherein, The cylindrical side is made of metal.
9. The current sensor of claim 7, wherein, An explosion-proof plug and a signal output line are connected to the outside of the end cover plate.
10. The current sensor of any one of claims 1-3, wherein, The gap between the shell and the coil former is filled with plastic resin potting glue.