Liquid ejecting head, head module, and liquid ejecting apparatus

Abstract

To provide a liquid ejecting head, a head module, and a liquid ejecting apparatus capable of suppressing an increase in size and facilitating assembly.SOLUTION: The liquid ejecting head includes a liquid ejecting head including a head chip and a holder including a first flow path, and a support body that supports the liquid ejecting head and includes a second flow path, the holder includes a first positioning portion, the support body includes a second positioning portion, and the first positioning portion includes a first communication flow path communicating with the first flow path, and the second positioning portion includes a second communication flow path communicating with the second flow path. One of the first positioning portion and the second positioning portion has an inner wall surface constituting a positioning hole, the other is a rod-shaped protrusion portion, one of the first communication flow path and the second communication flow path is a positioning hole, the protrusion portion is inserted into the positioning hole, and a part of the protrusion portion comes into contact with the inner wall surface, so that the liquid ejecting head is positioned with respect to the support body, and the first communication flow path and the second communication flow path communicate with each other.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head, a head module, and a liquid ejection apparatus. [Background technology]

[0002] 2. Description of the Related Art Liquid ejection apparatuses equipped with liquid ejection heads that eject liquid onto a medium such as printing paper have been proposed.

[0003] Patent Document 1 discloses a head module having a liquid jet head and a support that supports the liquid jet head. The support is provided with an opening into which a part of the liquid jet head is inserted, and a positioning pin that is arranged near the periphery of the opening. The positioning pin is a rod-shaped protrusion that protrudes from the support, and is inserted by press fitting into a positioning portion that is formed by a through-hole that is provided in the liquid jet head. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2023-146038 Summary of the Invention [Problem to be solved by the invention]

[0005] Patent Document 1 discloses a technology for positioning a liquid jet head and a support using a positioning pin. As described above, conventional positioning members have been provided solely for the purpose of positioning, and are provided separately from the flow path connections. This poses a problem in that the head module becomes larger due to the provision of a positioning section that serves only as a positioning function. Furthermore, positioning and flow path connections must be performed separately, which makes assembling the head module more cumbersome. [Means for solving the problem]

[0006] A head module according to an aspect of the present disclosure includes a liquid jet head including a head chip having a nozzle that jets liquid in a first direction, and a holder that is disposed in a second direction opposite to the first direction with respect to the head chip and has a first flow path that supplies liquid to the nozzle; and a support body that supports the liquid jet head and has a second flow path that supplies liquid to the first flow path, wherein the holder includes a holder main body and a first positioning part connected to the holder main body, and the support body includes a support main body part having an opening through which a part of the liquid jet head is inserted, and a second positioning part connected to the support main body. the first positioning portion has a first communicating flow path that communicates with the first flow path, the second positioning portion has a second communicating flow path that communicates with the second flow path, one of the first positioning portion and the second positioning portion has an inner wall surface that forms a positioning hole, and the other is a rod-shaped protrusion portion, one of the first communicating flow path and the second communicating flow path is the positioning hole, and the protrusion portion is inserted into the positioning hole and a portion of the protrusion portion comes into contact with the inner wall surface, thereby positioning the liquid ejection head with respect to the support body, and the first communicating flow path and the second communicating flow path are connected.

[0007] a holder arranged in a second direction opposite to the first direction relative to the head chip, supporting the head chip and having a fourth flow path that supplies liquid to the third flow path; the head chip having a chip body and a third positioning part connected to the chip body; the holder having a holder body supporting the head chip and a fourth positioning part connected to the holder body; the third positioning part having a third communicating flow path that communicates with the third flow path; the fourth positioning part having a fourth communicating flow path that communicates with the fourth flow path; one of the third positioning part and the fourth positioning part having an inner wall surface that constitutes a positioning hole, and the other being a rod-shaped protrusion; the protrusion being inserted into the positioning hole and a portion of the protrusion contacting the inner wall surface, thereby positioning the head chip relative to the holder and connecting the third communicating flow path to the fourth communicating flow path.

[0008] A liquid ejecting apparatus according to one aspect of the present disclosure includes a head module and a conveying unit that conveys a medium. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating the configuration of a liquid ejecting apparatus according to a first embodiment. [Figure 2] FIG. 2 is a schematic perspective view of the head module shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view of the head module shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the head chip shown in FIG. [Figure 5] FIG. 4 is a plan view of the head module shown in FIG. [Figure 6] 4 is a diagram showing the planar arrangement of the base end portions of the first positioning portion and the second positioning portion in FIG. 3. FIG. [Figure 7] 4 is a diagram showing the planar arrangement of the tip portions of the first positioning portion and the second positioning portion in FIG. 3. FIG. [Figure 8] 4 is a diagram showing the planar arrangement of the base end portions of the first flow path connecting portion and the second flow path connecting portion in FIG. 3. FIG. [Figure 9] 4 is a diagram showing a planar arrangement of the tip end portions of the first flow path connecting portion and the second flow path connecting portion in FIG. 3. FIG. [Figure 10] FIG. 10 is a cross-sectional view of a head module according to a second embodiment. [Figure 11] FIG. 11 is a plan view of the head module shown in FIG. [Figure 12] FIG. 10 is a cross-sectional view of a liquid jet head according to a third embodiment. [Figure 13] 13 is a diagram showing the planar arrangement of the base end portions of the third positioning portion and the fourth positioning portion in FIG. 12. FIG. [Figure 14] 4 is a diagram showing the planar arrangement of the third positioning portion and the tip end portion of the fourth positioning portion in FIG. 3. FIG. [Figure 15] 4 is a diagram showing the planar arrangement of the fourth flow path connecting portion and the base end portion of the third flow path connecting portion in FIG. 3. FIG. [Figure 16] 4 is a diagram showing a planar arrangement of the fourth flow path connecting portion and the tip end portion of the third flow path connecting portion in FIG. 3. FIG. [Figure 17] FIG. 10 is a cross-sectional view of a head module according to a first modified example. [Figure 18] 18 is a diagram showing the planar arrangement of the base end portions of the first positioning portion and the second positioning portion in FIG. 17. FIG. [Figure 19] 18 is a diagram showing the planar arrangement of the tip portions of the first positioning portion and the second positioning portion in FIG. 17. FIG. [Figure 20] 18 is a diagram showing the planar arrangement of the base end portions of the first flow path connecting portion and the second flow path connecting portion in FIG. 17. FIG. [Figure 21] 18 is a diagram showing the planar arrangement of the tip end portions of the first flow path connecting portion and the second flow path connecting portion in FIG. 17. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The dimensions and scale of each part in the drawings may differ from the actual dimensions, and some parts are shown schematically to facilitate understanding. The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to the effect that the present invention is limited to these embodiments. Furthermore, the term "element β on element γ" is not limited to a configuration in which element γ and element β are in direct contact with each other, but also includes a configuration in which element γ and element β are not in direct contact with each other. The term "element γ and element β are equal" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like.

[0011] 1. First embodiment 1-1. Overall configuration of the liquid ejection device 100 FIG. 1 is a schematic diagram illustrating the configuration of a liquid ejection device 100 according to a first embodiment. For ease of explanation, the following description will appropriately use mutually perpendicular X, Y, and Z axes. A direction along the X axis will be referred to as the X1 direction, and a direction opposite to the X1 direction will be referred to as the X2 direction. Similarly, a direction along the Y axis will be referred to as the Y1 direction, and a direction opposite to the Y1 direction will be referred to as the Y2 direction. A direction along the Z axis will be referred to as the Z1 direction, and a direction opposite to the Z1 direction will be referred to as the Z2 direction. The Z1 direction corresponds to the "first direction." The Z2 direction corresponds to the "second direction opposite to the first direction." The Z1 direction relative to a certain point is referred to as "downward," and the Z2 direction from a certain point is referred to as "upward." Viewing in the Z1 or Z2 direction is referred to as a "planar view."

[0012] As shown in FIG. 1, the liquid ejecting device 100 includes a liquid storage section 9, a control unit 91, a conveying section 92, a head module 10, and a moving mechanism 40.

[0013] The liquid storage unit 9 is a container that stores a liquid such as ink. Specific embodiments of the liquid storage unit 9 include, for example, a cartridge that is detachable from the liquid ejection device 100, a bag-shaped liquid pack made of a flexible film, and a liquid tank that can be refilled with liquid. The type of liquid stored in the liquid storage unit 9 is not particularly limited and can be any type.

[0014] The control unit 91 controls the operation of each element of the liquid ejection device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operation of each element of the liquid ejection device 100.

[0015] The transport unit 92 transports the medium 90 in a direction DM under the control of the control unit 91. In this embodiment, the direction DM is the X1 direction. In the example shown in FIG. 1, the transport unit 92 includes a long transport roller along the Y axis and a motor that rotates the transport roller. Note that the transport unit 92 is not limited to a configuration using a transport roller, and may be configured, for example, to use a drum or endless belt that transports the medium 90 while adsorbing it to its outer peripheral surface using electrostatic force or the like.

[0016] The head module 10 has a plurality of liquid jet heads 5 and a support body 1. Each liquid jet head 5 jets liquid toward a medium M. The plurality of liquid jet heads 5 are, for example, arranged in a staggered manner when viewed in the Z1 direction. Note that the arrangement of the plurality of liquid jet heads 5 is not limited to this and can be any arrangement. The support body 1 is a member that supports the plurality of liquid jet heads 5. In this embodiment, the support body 1 is a carriage that is involved in transporting the plurality of liquid jet heads 5.

[0017] When the head module 10 is configured to be able to circulate the liquid, the head module 10 may be connected to the liquid storage unit 9 via a circulation mechanism for circulating the liquid inside the head module 10.

[0018] The movement mechanism 40 has a conveyor belt to which the support 1 of the head module 10 is fixed, and moves the head module 10 back and forth in the Y1 and Y2 directions under the control of a control unit 91. Under the control of the control unit 91, the head module 10 ejects liquid supplied from a liquid storage section 9 from each of a plurality of nozzles N onto the medium 90 in the Z1 direction. The ejection of liquid from the head module 10 is performed in parallel with the movement of the head module 10 by the movement mechanism 40, so that an image is formed in liquid on the surface of the medium 90.

[0019] As described above, the liquid ejecting device 100 includes the head module 10 and the transport unit 92 that transports the medium M. As will be described later, the head module 10 is small and easy to assemble. Therefore, by including such a head module 10, it is possible to provide a liquid ejecting device 100 that is small and easy to assemble.

[0020] 1-2. Head module 10 Fig. 2 is a schematic perspective view of the head module 10 shown in Fig. 1. As shown in Fig. 2, a support 1 included in the head module 10 supports a plurality of liquid jet heads 5. In the illustrated example, the support 1 is a plate-shaped member whose thickness direction is along the Z axis, but it may have another shape.

[0021] The support body 1 has a support main body portion 15, a plurality of second positioning portions 11, and a plurality of second flow path connecting portions 12. The support main body portion 15 is a plate-shaped member whose thickness direction is along the Z axis. The support main body portion 15 has a plurality of openings 101. Each opening 101 is a hole that penetrates the support body 1 in the thickness direction. The planar shape of each opening 101 is, for example, a rectangle. An opening 101 is provided for each liquid jet head 5. A portion of the liquid jet head 5 is inserted into the opening 101. Note that in FIG. 2, in order to show the openings 101, some of the liquid jet heads 5 arranged in a portion of the support body 1 are not shown. Note that the plurality of second positioning portions 11 and the plurality of second flow path connecting portions 12 will be described in detail later.

[0022] Furthermore, two mounting holes 105 are provided in the support body 15 for each opening 101. The two mounting holes 105 are used to mount the liquid jet head 5 to the support 1. Each mounting hole 105, for example, penetrates the support 1 along the thickness direction. For example, a female screw is formed on the wall surface that forms each mounting hole 105. The two mounting holes 105 are provided at two corners located on diagonal lines of the opening 101 that is rectangular in plan view. Note that the number and arrangement of the mounting holes 105 are not limited to the example shown in FIG. 2 and are arbitrary. Furthermore, each mounting hole 105 does not have to penetrate the support 1 along the thickness direction.

[0023] Furthermore, a plurality of flow path openings 103 are provided in the support main body 15. In the illustrated example, each flow path opening 103 is formed in a side wall of the support main body 15. Specifically, each flow path opening 103 is formed in the side wall of the support main body 15 in the Y1 direction and the Y2 direction.

[0024] Fig. 3 is a cross-sectional view of the head module 10 shown in Fig. 2. As shown in Fig. 3, each liquid jet head 5 has a head chip 50 and a holder 55.

[0025] Holder 55 is a member that is disposed in the Z2 direction of head chip 50 and supports head chip 50. In the illustrated example, one holder 55 supports one head chip 50, but multiple head chips 50 may be supported.

[0026] 1-2a. Head chip 50 FIG. 4 is a cross-sectional view of the head chip 50 shown in FIG. 3. The head chip 50 shown in FIG. 4 has a plurality of nozzles N that eject liquid. Although not shown in detail, the plurality of nozzles N of the head chip 50 are arranged along the Y axis. The plurality of nozzles N are divided into two nozzle rows that are arranged side by side at intervals along the X axis. Each nozzle row is a collection of a plurality of nozzles N that are arranged linearly along the Y axis. The surface of the head chip 50 on which the openings of the plurality of nozzles N are formed is referred to as the nozzle surface SN. The nozzle surface SN is the surface of the head chip 50 that faces the Z1 direction. Note that the following description will mainly focus on the configuration corresponding to the nozzles N that belong to one of the nozzle rows.

[0027] The head chip 50 includes, for example, a communication plate 302 , a pressure chamber substrate 303 , a vibration plate 304 , a nozzle plate 301 , a vibration absorber 306 , a plurality of drive elements E, and a sealing substrate 305 .

[0028] The communicating plate 302, pressure chamber substrate 303, diaphragm 304, nozzle plate 301, and vibration absorber 306 are each a long plate-like member extending along the Y axis. The pressure chamber substrate 303 is placed on the surface of the communicating plate 302 facing the Z2 direction. The nozzle plate 301 and vibration absorber 306 are placed on the surface of the communicating plate 302 facing the Z1 direction. The components are fixed together, for example, with an adhesive.

[0029] The nozzle plate 301 is a plate-like member in which a plurality of nozzles N are formed. The nozzle plate 301 is the member of the head chip 50 that is located furthest in the Z1 direction. The surface of the nozzle plate 301 facing the Z1 direction is the nozzle surface SN. Each of the plurality of nozzles N is a circular through-hole that ejects liquid. For example, the nozzle plate 301 is manufactured by processing a silicon (Si) single crystal substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0030] The communicating plate 302 has a flow path 50R. The flow path 50R has multiple throttle portions R1, multiple communicating flow paths R2, a common space Ra, and a common flow path Rb. The throttle portion R1 and the multiple communicating flow paths R2 are provided for each driving element E. The throttle portion R1 and the communicating flow paths R2 each extend in the Z1 direction and are through holes formed for each nozzle N. The communicating flow path R2 overlaps the nozzle N in a planar view. The common space Ra and the common flow path Rb are common to the multiple driving elements E belonging to each nozzle row. The common space Ra is an opening formed in an elongated shape along the Y axis. The common space Ra extends along the Y axis. The common flow path Rb is in communication with the common space Ra and overlaps with the common space Ra in a planar view. The common flow path Rb extends along the Y axis. The common flow path Rb is in communication with the multiple throttle portions R1.

[0031] A plurality of pressure chambers C are formed in the pressure chamber substrate 303. The pressure chambers C are located between the communication plate 302 and the vibration plate 304, and are spaces formed by the wall surfaces of the pressure chamber substrate 303. A pressure chamber C is formed for each nozzle N. The pressure chamber C is an elongated space extending in the X1 direction. The plurality of pressure chambers C are arranged along the Y axis. The plurality of pressure chambers C can be considered to be part of the flow path 50R.

[0032] The communication plate 302 and the pressure chamber substrate 303 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate.

[0033] An elastically deformable vibration plate 304 is disposed above the pressure chamber C. The vibration plate 304 is laminated on the pressure chamber substrate 303 and contacts the surface of the pressure chamber substrate 303 opposite the communication plate 302. The vibration plate 304 is a long rectangular plate member that extends along the Y axis in a plan view. The pressure chamber C communicates with the communication flow path R2 and the throttle portion R1. Also, for ease of explanation, the pressure chamber substrate 303 and the vibration plate 304 are shown in FIG. 4 as separate substrates, but in reality they are laminated on a single silicon substrate.

[0034] A driving element E is formed for each pressure chamber C on the surface of the vibration plate 304 opposite to the pressure chamber C. The driving element E is an elongated piezoelectric element extending along the X-axis in a plan view. The driving element E includes, for example, a pair of electrodes and a piezoelectric body sandwiched between the pair of electrodes.

[0035] The sealing substrate 305 is a structure that protects the multiple drive elements E. The sealing substrate 305 is fixed to the surface of the diaphragm 304 with, for example, an adhesive. The multiple drive elements E are housed inside a recess formed on the surface of the sealing substrate 305 that faces the diaphragm 304. The sealing substrate 305 is also provided with wiring holes 50H for inserting a wiring board (not shown). The wiring board is, for example, a flexible board such as an FPC (Flexible Printed Circuit) or a COF (Chip On Film) or a rigid board. A drive signal and a reference voltage for driving the drive elements E are supplied to each drive element E from the wiring board.

[0036] The vibration absorber 306 is a thin metal plate that forms the wall surface of the common flow path Rb. The vibration absorber 306 has a thickness similar to that of the nozzle plate 301. The planar shape of the vibration absorber 306 is, for example, a frame shape that surrounds the nozzle plate 301. A mold 307 made of resin is provided between the vibration absorber 306 and the nozzle plate 301. The vibration absorber 306 is a flexible film that forms the wall surface of the common space Ra, and absorbs pressure fluctuations of the liquid in the common space Ra.

[0037] In this head chip 50, when the drive element E contracts due to energization, the vibration plate 304 is bent and deflected in the direction that reduces the volume of the pressure chamber C, and the force inside the pressure chamber C increases, causing a droplet of liquid to be ejected from the nozzle N. At this time, pressure also propagates from the pressure chamber C toward the throttle portion R1, and liquid also flows into the common flow path Rb through the throttle portion R1. After the liquid is ejected, the drive element E returns to its original position. At this time, the liquid in the common flow path Rb from the nozzle N also vibrates. Then, at the same time that the meniscus of the nozzle N returns to its original state, liquid is supplied from the throttle portion R1. Through this series of operations, the liquid is ejected from the nozzle N.

[0038] 4, the components of the head chip 50 do not necessarily have all of the elements, and may further include additional elements. Furthermore, the head chip 50 only needs to include at least one of the elements of the nozzle plate 301, the pressure chamber substrate 303, the communication plate 302 or the driving element E, and the sealing substrate 305. The head chip 50 preferably includes at least the nozzle plate 301, more preferably the pressure chamber substrate 303, and particularly preferably the communication plate 302. Furthermore, the head chip 50 may be a laminate of silicon substrates manufactured using MEMS, or a laminate of thin plates such as ceramic sheets or metals, or a laminate in which thin plate-like members of the aforementioned materials are stacked.

[0039] 1-2b. Holder 55 As shown in FIG. 3, holder 55 is a member that is positioned in the Z2 direction of head chip 50 and supports head chip 50. Holder 55 is also a flow path member that has first flow path 55R for supplying liquid to head chip 50. The material of holder 55 is, for example, resin or metal such as stainless steel. Note that there are no particular limitations on the method of connecting holder 55 and head chip 50. For example, holder 55 and head chip 50 are connected by an adhesive or the like.

[0040] The holder 55 has a holder main body 550, a first positioning portion 551, and a first flow path connecting portion 552. The first positioning portion 551 and the first flow path connecting portion 552 are each surrounded by a two-dot chain line. Note that the holder main body 550, the first positioning portion 551, and the first flow path connecting portion 552 are integrally formed, but the holder main body 550, the first positioning portion 551, and the first flow path connecting portion 552 may also be formed as separate bodies and bonded together.

[0041] Holder main body 550 is the main part of holder 55. Holder main body 550 overlaps with head chip 50 when viewed in the Z1 direction. Wiring hole 55H and two first flow paths 55R are provided in holder main body 550. Wiring hole 55H overlaps with wiring hole 50H of head chip 50 when viewed in the Z1 direction, and the aforementioned wiring board (not shown) is inserted through it.

[0042] The first flow paths 55R are provided for each nozzle row of the head chip 50. The first flow paths 55R communicate with the flow paths 50R provided in the head chip 50. In the example shown, the first flow paths 55R have a portion extending along the Z axis from the connection portion with the flow path 50R, and a portion extending along the X axis from that portion. However, the shape of each first flow path 55R is not limited to this and can be any shape.

[0043] In the illustrated example, the first positioning portion 551 is provided in the Y1 direction of the holder main body 550. The first positioning portion 551 is used for positioning the liquid jet head 5 to the support 1. Furthermore, the first positioning portion 551 is used for connecting the flow paths between the liquid jet head 5 and the support 1. The first positioning portion 551 has an inner wall surface 5510 that constitutes a first communication flow path 551R. The first communication flow path 551R is a hole formed in the holder 55 and is a positioning hole used for the above-mentioned positioning. Furthermore, the first communication flow path 551R is a flow path that communicates with one of the two first flow paths 55R. Therefore, the first positioning portion 551 also serves as a flow path connecting portion. Furthermore, for example, the inner wall surface 5510 is cylindrical, and the inner diameter of the inner wall surface 5510 is constant.

[0044] The first flow path connection portion 552 is provided in the Y2 direction of the holder main body 550. The first flow path connection portion 552 is used for flow path connection between the liquid jet head 5 and the support 1. The first flow path connection portion 552 has an inner wall surface 5520 that constitutes a first connection flow path 552R. The first flow path connection portion 552 is a hole formed in the holder 55 and communicates with the other of the two first flow paths 55R. The inner wall surface 5510 is cylindrical with a stepped surface, and the width of the inner wall surface 5520 is not constant. The inner wall surface 5510 has an upper portion 5521 and a lower portion 5522. The lower portion 5522 is located closer to the support 1 than the upper portion 5521. The width of the lower portion 5522 along the Y axis is greater than the width of the upper portion 5521 along the Y axis.

[0045] 1-2c.Support 1 As described above, the support body 1 has the support main body part 15, the second positioning part 11, and the second flow path connecting part 12. The support main body part 15, the second positioning part 11, and the second flow path connecting part 12 may be integral with each other, or may be separate parts joined together with an adhesive or the like.

[0046] 3, a head chip 50, which is a part of the liquid jet head 5, is disposed in an opening 101 of a support body 15 of the support 1. The surface of the support 1 in the Z1 direction and the nozzle surface SN of the head chip 50 are substantially flush with each other. In addition, a holder 55 is disposed in the Z2 direction of the support body 15.

[0047] The support main body 15 has two second flow paths 103R. One second flow path 103R is provided for each first flow path 55R. The second flow paths 103R correspond to the first flow paths 55R and supply liquid to the first flow paths 55R. The two second flow paths 103R are provided on both sides of the head chip 50 along the Y axis when viewed in the Z1 direction, and do not overlap with the head chip 50 when viewed in the Z1 direction. The second flow paths 103R are provided corresponding to the flow path opening 103 shown in FIG. 2, and liquid flows into the second flow paths 103R from the flow path opening 103.

[0048] The second positioning portion 11 is provided corresponding to the first positioning portion 551, and overlaps with the first positioning portion 551 when viewed in the Z1 direction. The second positioning portion 11, together with the first positioning portion 551, is used to position the liquid jet head 5 on the support body 1. Furthermore, the second positioning portion 11, together with the first positioning portion 551, is used to connect the liquid jet head 5 and the support body 1 to a flow path.

[0049] The second positioning portion 11 is a rod-shaped protrusion that protrudes in the Z2 direction from the support main body portion 15. The second positioning portion 11 is inserted into the first communication flow path 551R of the first positioning portion 551 by press-fitting. The second positioning portion 11 also has a second communication flow path 101R that communicates with the second flow path 103R. The second communication flow path 101R is, for example, cylindrical and has a constant diameter. However, the diameter does not have to be constant.

[0050] The second positioning part 11 has a tip part 111 and a base part 112. The base part 112 is on the support main body part 15 side of the center of the second positioning part 11 in the direction along the Z axis, and the tip part 111 is on the opposite side of the support main body part 15.

[0051] The tip portion 111 is farther from the support body portion 15 than the base portion 112 and includes the tip of the second positioning portion 11. The tip portion 111 is tapered from the base portion 112 toward the tip. The base portion 112 includes the base end of the second positioning portion 11, i.e., the connection portion with the support body portion 15. The base portion 112 is cylindrical. The outer diameter of the base portion 112 is larger than the outer diameter of the tip portion 111. Note that the outer diameter of the base end of the second positioning portion 11 is larger than the outer diameter of the tip.

[0052] The second positioning portion 11 is inserted into the first communication flow path 551R of the first positioning portion 551. The base end portion 112 contacts the inner wall surface 5510, and the tip end portion 111 is spaced from the inner wall surface 5510. A seal member 61 is disposed between the tip end portion 111 and the inner wall surface 5510.

[0053] The second flow path connecting portion 12 is provided corresponding to the first flow path connecting portion 552, and overlaps with the first flow path connecting portion 552 when viewed in the Z1 direction. The second flow path connecting portion 12, together with the first flow path connecting portion 552, is used for connecting the flow paths between the liquid jet head 5 and the support 1.

[0054] The second flow path connecting portion 12 is a rod-shaped protrusion that protrudes in the Z2 direction from the support body portion 15. The second flow path connecting portion 12 is inserted into the first connection flow path 552R of the first flow path connecting portion 552 by press-fitting. The second flow path connecting portion 12 also has a second connection flow path 102R that communicates with the second flow path 103R. The second connection flow path 102R is, for example, cylindrical, and has a constant diameter. However, the diameter does not have to be constant.

[0055] The second flow path connecting part 12 has a tip end part 121 and a base end part 122. The base end part 122 is the part of the second flow path connecting part 12 closer to the support main body part 15 than the center in the direction along the Z axis, and the tip end part 121 is the part opposite to the support main body part 15.

[0056] The tip end 121 is farther from the support body 15 than the base end 122 and includes the tip of the second flow path connecting portion 12. The tip end 121 is tapered from the base end 122 toward the tip. The base end 122 includes the base end of the second flow path connecting portion 12, i.e., the connection portion with the support body 15. The base end 122 is cylindrical. The outer diameter of the base end 122 is larger than the outer diameter of the tip end 121. The outer diameter of the base end of the second flow path connecting portion 12 is larger than the outer diameter of the tip.

[0057] The second flow path connecting portion 12 is inserted into the first connecting flow path 552R of the first flow path connecting portion 552. The base end portion 122 contacts the inner wall surface 5520, and the tip end portion 121 is spaced from the inner wall surface 5520. A seal member 62 is disposed between the tip end portion 121 and the inner wall surface 5520.

[0058] 1-2d. Planar layout Fig. 5 is a plan view of the head module 10 shown in Fig. 3. Fig. 3 corresponds to a cross section taken along line A1-A1 in Fig. 5.

[0059] As shown in Figure 5, the first positioning portion 551 and the second positioning portion 11, and the first flow path connection portion 552 and the second flow path connection portion 12 are arranged to sandwich the head chip 50 when viewed in the Z1 direction, and are located near the diagonal corners of the head chip 50.

[0060] The holder 55 is also provided with two mounting holes 559. The two mounting holes 559 correspond to the two mounting holes 105 of the support 1 described above and overlap when viewed in the Z1 direction. The mounting holes 559, together with the mounting holes 105, are used to mount the liquid jet head 5 to the support 1. Each mounting hole 559, for example, penetrates the holder 55 along the thickness direction. For example, a female screw is formed on the wall surface that constitutes each mounting hole 559. Screws or the like (not shown) are inserted into the mounting holes 559 and 105, and the holder 55 is screwed to the support 1.

[0061] The two mounting holes 559 are provided at two diagonally opposite corners of the opening 101, which is rectangular in plan view, as are the two mounting holes 105. The number and arrangement of the mounting holes 105 and 509 are not limited to the example shown in Figure 2 and can be determined as desired.

[0062] Fig. 6 is a diagram showing the planar arrangement of the first positioning portion 551 and the base end portion 112 of the second positioning portion 11 in Fig. 3. Fig. 7 is a diagram showing the planar arrangement of the first positioning portion 551 and the tip end portion 111 of the second positioning portion 11 in Fig. 3. As described above, the second positioning portion 11 is inserted into the first positioning portion 551 by press-fitting.

[0063] 6, the outer diameter of base end portion 112 of second positioning portion 11 is approximately equal to the inner diameter of inner wall surface 5510 that constitutes first communication flow path 551R. The outer shape of base end portion 112 corresponds to the shape of inner wall surface 5510 and is cylindrical. Therefore, base end portion 112 is in contact with inner wall surface 5510 over its entire circumference. Note that base end portion 112 may be in contact with only a portion of inner wall surface 5510.

[0064] 7, the outer diameter of the tip portion 111 of the second positioning portion 11 is smaller than the inner diameter of the inner wall surface 5510 that constitutes the first communication flow path 551R. The outer shape of the tip portion 111 corresponds to the shape of the inner wall surface 5510 and is cylindrical. The tip portion 111 is spaced apart from the inner wall surface 5510 over its entire circumference. Note that a portion of the tip portion 111 may be in contact with the inner wall surface 5510.

[0065] A seal member 61 is disposed between the tip portion 111 and the inner wall surface 5510. The seal member 61 fills the gap between the tip portion 111 and the inner wall surface 5510. Therefore, the first communication flow path 551R and the second communication flow path 101R are connected without leakage.

[0066] Fig. 8 is a diagram showing the planar arrangement of the first flow path connecting portion 552 and the base end portion 122 of the second flow path connecting portion 12 in Fig. 3. Fig. 9 is a diagram showing the planar arrangement of the first flow path connecting portion 552 and the tip end portion 121 of the second flow path connecting portion 12 in Fig. 3. As described above, the second flow path connecting portion 12 is inserted into the first flow path connecting portion 552 by press fitting.

[0067] 8, the outer shape of base end 122 is cylindrical. Meanwhile, the planar shape of lower portion 5522 of inner wall surface 5520 is, for example, an ellipse with the Y axis as the longitudinal direction. The width of base end 122 in the Y axis is greater than the width of lower portion 5522 of inner wall surface 5520 in the Y axis. Base end 122 is spaced apart from lower portion 5522 of inner wall surface 5520 in the Y axis. Meanwhile, the width of base end 122 in the X axis is approximately equal to the width of lower portion 5522 of inner wall surface 5520 in the X axis. Base end 122 is in contact with lower portion 5522 of inner wall surface 5520 in the X axis.

[0068] 9, the outer diameter of tip portion 121 of second flow path connecting portion 12 is smaller than the inner diameter of upper portion 5521 of inner wall surface 5520. The outer shape of tip portion 121 corresponds to the shape of upper portion 5521 of inner wall surface 5520 and is cylindrical. Tip portion 121 is spaced apart from upper portion 5521 of inner wall surface 5520 around its entire circumference.

[0069] A seal member 62 is disposed between the tip portion 121 and the inner wall surface 5520. The seal member 62 fills the gap between the tip portion 121 and the inner wall surface 5520. Therefore, the first connection flow path 552R and the second connection flow path 102R are connected without leakage.

[0070] 1-2e. Positioning and fluid connection As described above, the support 1 has the second positioning portion 11, and the holder 55 has the first positioning portion 551. The second positioning portion 11 has the second communication flow path 101R, and the first positioning portion 551 has the first communication flow path 551R. The second positioning portion 11 is a protrusion. The first communication flow path 551R is a positioning hole, and the first positioning portion 551 has an inner wall surface 5510 that constitutes the first communication flow path 551R. The second positioning portion 11, which is a protrusion, is inserted into the first communication flow path 551R of the first positioning portion 551, and a part of the outer circumferential surface 110 of the second positioning portion 11, which is a protrusion, comes into contact with the inner wall surface 5510 of the first positioning portion 551, thereby positioning the liquid jet head 5 with respect to the support 1, and communicating between the second communication flow path 101R and the first communication flow path 551R.

[0071] In this way, the second positioning portion 11 and the first positioning portion 551 not only position the liquid jet head 5 relative to the support body 1, but also serve to connect the flow paths between the support body 1 and the liquid jet head 5. Therefore, there is no need to provide separate members for positioning and for connecting the flow paths. This makes it possible to prevent the head module 10 from becoming larger. Furthermore, once the liquid jet head 5 is positioned relative to the support body 1, the flow paths between the support body 1 and the liquid jet head 5 are necessarily connected. This makes it easy to assemble the head module 10.

[0072] As described above, the second positioning portion 11, which is a protrusion, has a tip portion 111 and a base portion 112. The base portion 112 contacts the inner wall surface 5510, and the tip portion 111 and the inner wall surface 5510 are spaced apart from each other. The gap between the tip portion 111 and the inner wall surface 5510 is sealed by the seal member 61. Therefore, at the tip portion 111, the first communication flow path 551R and the second communication flow path 101R are connected without leakage. In addition, at the base portion 112, the base portion 112 contacts the inner wall surface 5510, thereby positioning the holder 55 relative to the support body 1. In particular, since the base portion 112 contacts the entire circumference of the inner wall surface 5510, the positioning can be performed with high precision.

[0073] As described above, the second positioning portion 11, which is a protrusion, is inserted by press-fitting into the first communication flow path 551R of the first positioning portion 551. This allows the holder 55 to be positioned relative to the support body 1 easily and with high precision.

[0074] Furthermore, with respect to the first flow path connecting portion 552 and the second flow path connecting portion 12, the base end portion 122 is spaced apart from the lower portion 5522 of the inner wall surface 5520 in the Y axis direction, but is in contact with the lower portion 5522 of the inner wall surface 5520 in the X axis direction. Therefore, although movement of the holder 55 relative to the support body 1 in the direction along the X axis is restricted, movement of the holder 55 relative to the support body 1 in the direction along the Y axis is not restricted.

[0075] By providing the first flow path connecting portion 552 and the second flow path connecting portion 12, the holder 55 can be suitably positioned relative to the support 1 while allowing for manufacturing or assembly errors of the head chip 50, the holder 55, and the support 1. In particular, by restricting movement of the holder 55 in the X axis relative to the support 1, movement of the liquid jet head 5 in the rotational direction relative to the support 1 is restricted, with the first positioning portion 551 used as a reference. The movement in the rotational direction is related to movement of the nozzle row in the X axis relative to the first positioning portion 551. This movement in the X axis is significantly related to the ink jetting accuracy. For this reason, it is preferable that movement in a direction intersecting the nozzle row, particularly in a direction perpendicular to the nozzle row, is restricted by the first flow path connecting portion 552 and the second flow path connecting portion 12, as viewed in the Z1 direction.

[0076] Furthermore, it is preferable that the first flow path connecting portion 552 and the first positioning portion 551 are provided at opposing corners of the square head chip 50 when viewed in the Z1 direction. In other words, it is preferable that the first flow path connecting portion 552 and the first positioning portion 551 are arranged on a diagonal line. This arrangement can improve the positioning accuracy of the holder 55 relative to the support 1 compared to other arrangements.

[0077] Note that first flow path connecting portion 552 and first positioning portion 551 may be provided at a location other than a corner of head chip 50 when viewed in the Z1 direction. However, from the viewpoint of increasing positioning accuracy, first flow path connecting portion 552 and first positioning portion 551 are preferably provided so as to sandwich head chip 50 when viewed in the Z1 direction. Also, the number of first flow path connecting portion 552 and first positioning portion 551 is one each, but may be two or more. The same applies to the number of second flow path connecting portions 12 and second positioning portions 11.

[0078] Furthermore, the tip 121 of the second flow path connecting part 12 corresponds to the shape of the upper part 5521 of the inner wall surface 5520 of the first flow path connecting part 552, and is circular in plan view. Therefore, the distance between the tip 121 and the inner wall surface 5520 is equal around the entire circumference. This makes it easy to assemble the seal member 62, and the sealing performance of the seal member 62 can be improved.

[0079] Similarly, the distance between the tip 121 of the second positioning portion 11 and the inner wall surface 5510 is equal around the entire circumference. Therefore, assembly of the seal member 61 is easy, and the sealing performance of the seal member 61 can be improved.

[0080] 2. Second embodiment A second embodiment of the present disclosure will be described below. In the following exemplary embodiments, elements whose actions or functions are similar to those of the first embodiment will be designated by the same reference numerals as those used in the description of the first embodiment, and detailed descriptions of each element will be omitted where appropriate.

[0081] Fig. 10 is a cross-sectional view of a head module 10A according to the second embodiment. As shown in Fig. 10, this embodiment differs from the first embodiment in that the holder 55 and the support 1 are fixed together by a fixing member 70. The fixing member 70 is, for example, a screw.

[0082] Two screw holes 59 are provided on the surface of the holder 55 facing the Z1 direction. Furthermore, two screw holes 19 are provided in the support body 1, penetrating the support body 1. The two screw holes 19 correspond to the two screw holes 59. When viewed in the Z1 direction, each screw hole 19 overlaps with the corresponding screw hole 59. A fixing member 70 is inserted through the screw holes 19 and 59 in this order. The holder 55 is screwed to the support body 1 by the fixing member 70.

[0083] Fig. 11 is a plan view of head module 10A shown in Fig. 10. As shown in Fig. 11, the distance between fixing member 70 and head chip 50 on the Y axis, as viewed in the Z1 direction, is shorter than the distance between first positioning portion 551 and head chip 50 on the Y axis, or the distance between first flow path connecting portion 552 and head chip 50 on the Y axis. From another perspective, fixing member 70 is arranged in the region between first positioning portion 551 and head chip 50 on the Y axis, or the region between first flow path connecting portion 552 and head chip 50 on the Y axis, as viewed in the Z1 direction.

[0084] 10, the fixing member 70 does not overlap the second flow path 103R when viewed in the Z1 direction. Furthermore, the fixing member 70 does not overlap the first positioning portion 551, the second positioning portion 11, the first flow path connecting portion 552, or the second flow path connecting portion 12 when viewed in the Z1 direction. Therefore, the fixing member 70 does not overlap the first communication flow path 551R, the second communication flow path 11R, the first connection flow path 552R, or the second connection flow path 12R when viewed in the Z1 direction. Arranging the fixing member 70 in this manner prevents the fixing member 70 from interfering with the flow path connection from the support 1 to the holder 55.

[0085] Furthermore, since the fixing member 70 is a screw, the holder 55 can be easily fixed to and released from the support body 1 by rotating the screw. Furthermore, since the fixing member 70 is a screw, the holder 55 can be detachably fixed to the support body 1 without using an adhesive.

[0086] The fixing member 70 may be something other than a screw, and may include, for example, an L-shaped or T-shaped pin with the tip in the Z2 direction bent at a right angle and an elastic member such as a leaf spring or a coil spring, and may be configured to fix the holder 55 and the support body 1 together using the elastic force of the elastic member.

[0087] 3. Third embodiment A third embodiment of the present disclosure will be described below. In the following exemplary embodiments, elements that have the same actions or functions as those in the first embodiment will be designated by the same reference numerals as those in the first embodiment, and detailed descriptions of each element will be omitted where appropriate.

[0088] Fig. 12 is a cross-sectional view of a liquid jet head 5B according to the third embodiment. As shown in Fig. 12, this embodiment differs from the first embodiment in that the holder 55B has a fourth positioning portion 56 and a fourth flow path connecting portion 58, and the head chip 50B has a third positioning portion 51 and a third flow path connecting portion 52. Note that the above-mentioned "first positioning portion" and "second positioning portion" may or may not be omitted.

[0089] Fourth positioning portion 56 is used to position head chip 50B relative to holder 55B. Furthermore, fourth positioning portion 56 is used to connect the flow paths between head chip 50B and holder 55B. Fourth positioning portion 56 has inner wall surface 506 that constitutes fourth communicating flow path 506R. Fourth communicating flow path 506R is a hole formed in holder 55B and is used for the above-mentioned positioning. Furthermore, fourth communicating flow path 506R communicates with first flow path 55R. Therefore, fourth positioning portion 56 also serves as a flow path connecting portion. Furthermore, for example, inner wall surface 506 is cylindrical, and the inner diameter of inner wall surface 506 is constant.

[0090] Fourth flow path connecting portion 58 is used for connecting the flow paths between head chip 50B and holder 55B. Fourth flow path connecting portion 58 has inner wall surface 508 that constitutes fourth connection flow path 508R. Fourth flow path connecting portion 58 is a hole formed in holder 55B and communicates with first flow path 55R. In addition, inner wall surface 508 is cylindrical with a stepped surface, and the width of inner wall surface 508 is not constant. Inner wall surface 508 has upper portion 5081 and lower portion 5082. Lower portion 5082 is located closer to head chip 50B than upper portion 5081.

[0091] Head chip 50B has head chip main body 53, third positioning portion 51, and third flow path connecting portion 52. Head chip main body 53 has the same configuration as head chip 50 of the first embodiment shown in Fig. 4. Third positioning portion 51 and third flow path connecting portion 52 are each a "protrusion" that protrudes from head chip main body 53 in the Z2 direction.

[0092] Third positioning portion 51 is provided corresponding to fourth positioning portion 56 and overlaps with fourth positioning portion 56 when viewed in the Z1 direction. Third positioning portion 51, together with fourth positioning portion 56, is used to position head chip 50B relative to holder 55B. Furthermore, third positioning portion 51, together with fourth positioning portion 56, is used to connect the flow paths between head chip 50B and holder 55B. Third positioning portion 51 is inserted into fourth communication flow path 506R of fourth positioning portion 56 by press-fitting.

[0093] The third positioning portion 51 is a rod-shaped protrusion that protrudes in the Z2 direction from the head chip 50B. The third positioning portion 51 has a third communication flow path 505R that communicates with the flow path 50R. The flow path 50R corresponds to the "third flow path." The third communication flow path 505R is, for example, cylindrical and has a constant diameter. However, the diameter does not have to be constant.

[0094] Third positioning portion 51 is divided into tip portion 511 and base portion 512. Base portion 512 is the portion closer to head chip 50B than the center of third positioning portion 51 in the direction along the Z axis, and tip portion 511 is the portion opposite head chip 50B.

[0095] The tip portion 511 is farther from the head chip 50B than the base portion 512 and includes the tip of the third positioning portion 51. The tip portion 511 is tapered from the base portion 512 toward the tip. The base portion 512 includes the base end of the third positioning portion 51, i.e., the connection portion with the head chip main body 53. The base portion 512 is cylindrical. The outer diameter of the base portion 512 is larger than the outer diameter of the tip portion 511. The outer diameter of the base end of the third positioning portion 51 is larger than the outer diameter of the tip.

[0096] The third positioning part 51 is inserted into the fourth communication flow path 506R of the fourth positioning part 56. The base end part 512 contacts the inner wall surface 506, and the tip part 511 is spaced from the inner wall surface 506.

[0097] The third flow path connecting portion 52 is provided corresponding to the fourth flow path connecting portion 58, and overlaps with the fourth flow path connecting portion 58 when viewed in the Z1 direction. The third flow path connecting portion 52, together with the fourth flow path connecting portion 58, is used for connecting the flow paths between the head chip 50B and the holder 55B. The third flow path connecting portion 52 is inserted into the fourth connecting flow path 508R of the fourth flow path connecting portion 58 by press-fitting.

[0098] The third flow path connecting portion 52 is a rod-shaped protrusion that protrudes in the Z2 direction from the head chip main body 53. The third flow path connecting portion 52 has a third connection flow path 507R that communicates with the flow path 50R as the "third flow path." The third connection flow path 507R is, for example, cylindrical, and has a constant diameter. However, the diameter does not have to be constant.

[0099] Third flow path connecting portion 52 is divided into tip portion 521 and base portion 522. Base portion 522 is the portion closer to head chip main body 53 than the center of third flow path connecting portion 52 in the direction along the Z axis, and tip portion 521 is the portion opposite head chip main body 53.

[0100] Tip portion 521 is farther from head chip main body 53 than base portion 522 and includes the tip of third flow path connecting portion 52. Tip portion 521 is tapered from base portion 522 toward the tip. Base portion 522 includes the base end of third flow path connecting portion 52, i.e., the connection portion with head chip main body 53. Base portion 522 is cylindrical. The outer diameter of base portion 522 is larger than the outer diameter of tip portion 521. The outer diameter of the base end of third flow path connecting portion 52 is larger than the outer diameter of the tip.

[0101] The third flow path connecting portion 52 is inserted into the fourth connecting flow path 508R of the fourth flow path connecting portion 58. The base end portion 522 contacts a lower portion 5082 of the inner wall surface 508, and the tip portion 121 is spaced apart from an upper portion 5081 of the inner wall surface 508.

[0102] Fig. 13 is a diagram showing the planar arrangement of the fourth positioning portion 56 and the base end portion 512 of the third positioning portion 51 in Fig. 12. Fig. 14 is a diagram showing the planar arrangement of the fourth positioning portion 56 and the tip end portion 511 of the third positioning portion 51 in Fig. 3. As described above, the third positioning portion 51 is inserted into the fourth positioning portion 56 by press-fitting.

[0103] 13, the outer diameter of the base end portion 512 of the third positioning portion 51 is approximately equal to the inner diameter of the inner wall surface 506 that constitutes the fourth communication flow path 506R. The outer shape of the base end portion 512 corresponds to the shape of the inner wall surface 506 and is cylindrical. Therefore, the base end portion 512 is in contact with the inner wall surface 506 over its entire circumference. Note that the base end portion 512 may be in contact with only a portion of the inner wall surface 506.

[0104] 14, the outer diameter of the tip portion 511 of the third positioning portion 51 is smaller than the inner diameter of the inner wall surface 506 that constitutes the fourth communication flow path 506R. The outer shape of the tip portion 511 corresponds to the shape of the inner wall surface 506 and is cylindrical. The tip portion 511 is spaced apart from the inner wall surface 506 around its entire circumference. Note that a portion of the tip portion 511 may be in contact with the inner wall surface 506.

[0105] A seal member 63 is disposed between the tip portion 511 and the inner wall surface 506. The seal member 63 fills the gap between the tip portion 511 and the inner wall surface 506. Therefore, the third communicating flow path 505R and the fourth communicating flow path 506R are connected without leakage.

[0106] Fig. 15 is a diagram showing the planar arrangement of the fourth flow path connecting portion 58 and the base end portion 522 of the third flow path connecting portion 52 in Fig. 3. Fig. 16 is a diagram showing the planar arrangement of the fourth flow path connecting portion 58 and the tip end portion 521 of the third flow path connecting portion 52 in Fig. 3. As described above, the third flow path connecting portion 52 is inserted into the fourth flow path connecting portion 58 by press fitting.

[0107] 15, the outer shape of base end 522 is cylindrical. Meanwhile, the planar shape of lower portion 5082 of inner wall surface 508 is, for example, an ellipse with the Y axis as the longitudinal direction. The width of base end 122 in the Y axis is smaller than the width of lower portion 5082 of inner wall surface 508 in the Y axis, and base end 122 is spaced apart from lower portion 5082 of inner wall surface 508 along the Y axis. Meanwhile, the width of lower portion 5082 of inner wall surface 508 along the X axis is approximately equal to the width of lower portion 5082 of inner wall surface 508, and base end 122 is in contact with lower portion 5082 of inner wall surface 5080 along the X axis.

[0108] 16, the outer diameter of tip portion 521 of third flow path connecting portion 52 is smaller than the inner diameter of upper portion 5081 of inner wall surface 508. The outer shape of tip portion 521 corresponds to the shape of upper portion 5081 of inner wall surface 508 and is cylindrical. Tip portion 511 is spaced apart from upper portion 5081 of inner wall surface 508 around its entire circumference.

[0109] A seal member 64 is disposed between the tip portion 521 and the upper portion 5081 of the inner wall surface 508. The seal member 64 fills the gap between the tip portion 521 and the upper portion 5081 of the inner wall surface 508. Therefore, the third connection flow path 507R and the fourth connection flow path 508R are connected without leakage.

[0110] As described above, head chip 50B has third positioning portion 51, and holder 55B has fourth positioning portion 56. Third positioning portion 51 has fourth communicating flow path 506R, and fourth positioning portion 56 has fourth communicating flow path 506R. Third positioning portion 51 is a protrusion. Fourth communicating flow path 506R is a positioning hole, and fourth positioning portion 56 has inner wall surface 506 that constitutes fourth communicating flow path 506R. Then, third positioning portion 51, which is a protrusion, is inserted into fourth communicating flow path 506R of fourth positioning portion 56, and part of outer circumferential surface 505 of third positioning portion 51, which is a protrusion, comes into contact with inner wall surface 506 of fourth positioning portion 56, thereby positioning head chip 50B in holder 55B and connecting third communicating flow path 505R and fourth communicating flow path 506R.

[0111] In this way, the third positioning portion 51 and the fourth positioning portion 56 not only position the head chip 50B relative to the holder 55B, but also serve to connect the flow paths between the holder 55B and the head chip 50B. This eliminates the need to provide separate members for positioning and for connecting the flow paths. This makes it possible to prevent the liquid jet head 5 from becoming larger. Furthermore, once the head chip 50B is positioned relative to the holder 55B, the flow paths between the head chip 50B and the holder 55B are inevitably connected. This makes it easy to assemble the liquid jet head 5B.

[0112] As described above, the third positioning portion 51, which is a protrusion, has a tip portion 511 and a base portion 512. The base portion 512 contacts the inner wall surface 506, and the tip portion 511 and the inner wall surface 506 are spaced apart. The gap between the tip portion 511 and the inner wall surface 506 is sealed by a sealing member 63. Therefore, the third communication flow path 505R and the fourth communication flow path 506R are connected without leakage at the tip portion 511. In addition, the contact of the base portion 512 with the inner wall surface 506 positions the head chip 50B relative to the holder 55B. In particular, the contact of the base portion 512 with the entire circumference of the inner wall surface 506 allows the positioning to be performed with high precision.

[0113] As described above, third positioning portion 51, which is a protrusion, is inserted by press-fitting into fourth communication flow path 506R of fourth positioning portion 56. This allows head chip 50B to be positioned with respect to holder 55B simply and with high precision.

[0114] Furthermore, with respect to fourth flow path connecting portion 58 and third flow path connecting portion 52, base end portion 522 is spaced apart from lower portion 5082 of inner wall surface 508 in the Y axis, but is in contact with upper portion 5081 of inner wall surface 508 in the X axis. Therefore, although movement of head chip 50B relative to holder 55B in the direction along the X axis is restricted, movement of head chip 50B relative to holder 55B in the direction along the Y axis is not restricted.

[0115] The provision of the fourth flow path connecting portion 58 and the third flow path connecting portion 52 allows for suitable positioning of the head chip 50B relative to the holder 55B while allowing for manufacturing or assembly errors of the head chip 50B and the holder 55B. In particular, restricting movement of the head chip 50B relative to the holder 55B in the X-axis direction restricts movement of the head chip 50B relative to the holder 55B in the rotational direction, using the fourth positioning portion 56 as a reference. The movement of the head chip 50B in the rotational direction has a significant impact on the ink ejection accuracy. For this reason, it is preferable that movement in a direction intersecting the nozzle row in the Z1 direction, particularly in a direction perpendicular to the nozzle row, is restricted by the fourth flow path connecting portion 58 and the third flow path connecting portion 52.

[0116] Although not shown in detail, from the viewpoint of improving positioning accuracy, the fourth flow path connecting portion 58 and the fourth positioning portion 56 are preferably arranged to sandwich the nozzle surface SN when viewed in the Z1 direction.

[0117] Furthermore, the tip 521 of the third flow path connecting portion 52 corresponds to the shape of the upper portion 5081 of the inner wall surface 508 of the fourth flow path connecting portion 58 and is circular in plan view. Therefore, the distance between the tip 521 and the inner wall surface 508 is equal around the entire circumference. This makes it easy to assemble the seal member 64 and improves the sealing performance of the seal member 64.

[0118] Similarly, the distance between the tip 511 of the third positioning portion 51 and the inner wall surface 506 is equal around the entire circumference. This makes it easy to assemble the seal member 63, and the sealability of the seal member 63 can be improved.

[0119] 4. Variations The first embodiment exemplified above can be modified in various ways. Specific modified aspects that can be applied to the first embodiment are exemplified below. Two or more aspects arbitrarily selected from the following examples can be appropriately combined as long as they are not mutually contradictory. For example, the "head module" may be a form that combines the third embodiment with the first or second embodiment.

[0120] In the first and second embodiments described above, the holder 55 includes the first positioning portion 551 having the first communication flow path 551R as a positioning hole, and the support body 1 includes the second positioning portion 11 which is a protrusion. However, the "first positioning portion" of the holder 55 may include the "protrusion," and the "second positioning portion" of the support body 1 may include the "positioning hole."

[0121] Similarly, in the first and second embodiments described above, the holder 55 includes the first flow path connecting portion 552 having the first connection flow path 552R, and the support 1 includes the second flow path connecting portion 12 which is a protrusion. However, the "first flow path connecting portion" of the holder 55 may include a "protrusion."

[0122] In the third embodiment described above, holder 55B is provided with fourth positioning portion 56 having fourth communication flow path 506R as a positioning hole, and head chip 50B is provided with third positioning portion 51 which is a protrusion. However, the "fourth positioning portion" of holder 55B may have a "protrusion," and the "third positioning portion" of head chip 50B may have a "positioning hole."

[0123] Similarly, in the third embodiment described above, holder 55B includes fourth flow path connecting portion 58 having fourth connection flow path 508R, and head chip 50B includes third flow path connecting portion 52 which is a protrusion. However, the "fourth flow path connecting portion" of holder 55B may include a "protrusion."

[0124] In the above-described embodiment, the "sealing member" is provided at the "tip end" and positioning is performed at the "base end". However, positioning may be performed at the "tip end" and the "sealing member" may be provided at the "base end".

[0125] 4-1. First modified example Fig. 17 is a cross-sectional view of a head module 10C of a first modified example. Fig. 18 is a diagram showing a planar arrangement of a first positioning portion 551C and a base end portion 112C of a second positioning portion 11C in Fig. 17. Fig. 19 is a diagram showing a planar arrangement of a first positioning portion 551C and a tip end portion 111C of a second positioning portion 11C in Fig. 17. Fig. 20 is a diagram showing a planar arrangement of a first flow path connecting portion 552C and a base end portion 122C of a second flow path connecting portion 12C in Fig. 17. Fig. 21 is a diagram showing a planar arrangement of a first flow path connecting portion 552C and a tip end portion 121C of a second flow path connecting portion 12C in Fig. 17.

[0126] In the first positioning portion 551C of the holder 55C of the head module 10C shown in FIG. 17, the inner diameter of the inner wall surface 5510C that constitutes the first communication flow path 551R is not constant. The inner wall surface 5510C has an upper portion 5511 and a lower portion 5512. The outer diameter of the second positioning portion 11C of the support body 1C is constant. The second positioning portion 11C has a tip portion 111C and a base end portion 112C. The tip portion 111C and the base end portion 112C are each cylindrical. The distance between the tip portion 111C and the inner wall surface 5510C is smaller than the distance between the base end portion 112C and the inner wall surface 5510C.

[0127] 17 and 18, base end portion 112C and lower portion 5512 are spaced apart from each other around the entire circumference. Sealing member 61 is disposed between base end portion 112C and lower portion 5512. Furthermore, as shown in FIGS. 17 and 19, tip end portion 111C is in contact with upper portion 5511 around the entire circumference.

[0128] As shown in FIG. 17, in a first flow path connecting portion 552C of a holder 55C, an inner wall surface 5520C constituting a first connection flow path 552R has an upper portion 5521 and a lower portion 5522. The inner diameter of the upper portion 5521 is larger than the inner diameter of the lower portion 5522. The outer diameter of a second flow path connecting portion 12C of a support body 1C is constant. The second flow path connecting portion 12C has a distal end portion 121C and a proximal end portion 122C. The second flow path connecting portion 12C and the inner wall surface 5520C are spaced apart from each other. The distance between the distal end portion 121C and the inner wall surface 5520C is larger than the distance between the proximal end portion 122C and the inner wall surface 5520C.

[0129] 17 and 20, base end portion 122C and inner wall surface 5520C are spaced apart from each other around the entire circumference. Sealing member 62 is disposed between base end portion 112C and lower portion 5512. Furthermore, as shown in FIGS. 17 and 21, tip end portion 121C and inner wall surface 5520C are spaced apart from each other around the entire circumference.

[0130] In the first modified example as well, the presence of the first positioning portion 551C and the second positioning portion 11C makes it possible to position the holder 55C relative to the support body 1C, which inevitably makes it possible to connect the first communication flow path 551R and the second communication flow path 101R. This makes it possible to facilitate the assembly of the head module 10C and prevent it from becoming too large.

[0131] 4-2.Other variations "Liquid ejection devices" can be used in various devices such as facsimile machines and copiers, as well as devices dedicated to printing. The uses of liquid ejection devices are not limited to printing. For example, a liquid ejection device that ejects a solution of coloring material is used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. A liquid ejection device that ejects a solution of conductive material is used as a manufacturing device for forming wiring and electrodes on relay boards. A liquid ejection device that ejects a solution of organic matter related to living organisms is used as a manufacturing device for manufacturing biochips, for example.

[0132] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the above-described embodiments. Furthermore, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above-described embodiments, and any configuration can be added. [Explanation of symbols]

[0133] 1C...support, 5...liquid jet head, 9...liquid storage section, 10...head module, 11...second positioning section, 11R...second communication flow path, 12...second flow path connecting section, 15...support main body section, 19...screw hole, 40...movement mechanism, 50...head chip, 50H...wiring hole, 50R...flow path (third flow path), 51...third positioning section, 52...third flow path connecting section, 53...head chip main body, 55...holder, 55B...holder, 55C...holder, 55H...wiring hole, 55R...first flow path, 56...fourth positioning portion, 58...fourth flow path connecting portion, 59...screw hole, 61...sealing member, 62...sealing member, 63...sealing member, 64...sealing member, 70...fixing member, 90...medium, 91...control unit, 92...conveying portion, 100...liquid ejection device, 101...opening, 101R...second communicating flow path, 102R...second connecting flow path, 103...flow path opening, 103R...second flow path, 105...mounting hole, 110...outer peripheral surface, 111...tip portion, 112...base End, 121...tip portion, 122...base end, 301...nozzle plate, 302...communicating plate, 303...pressure chamber substrate, 304...diaphragm, 305...sealing substrate, 306...vibration absorber, 307...mold, 505...outer surface, 505R...third communicating flow path, 506...inner wall surface, 506R...fourth communicating flow path, 507...outer surface, 507R...third connecting flow path, 508...inner wall surface, 508R...fourth connecting flow path, 511...tip portion, 512...base end, 521...tip portion, 522...base end, 5 50...holder body, 551...first positioning portion, 551R...first communicating flow path, 552...first flow path connection portion, 552R...first connecting flow path, 559...mounting hole, 5081...upper portion, 5082...lower portion, 5510...inner wall surface, 5511...upper portion, 5512...lower portion, 5520...inner wall surface, 5521...upper portion, 5522...lower portion, C...pressure chamber, E...driving element, M...medium, N...nozzle, R1...throttle portion, R2...communicating flow path, Ra...common space, Rb...common flow path, SN...nozzle surface.

Claims

1. a liquid ejection head including a head chip having a nozzle that ejects liquid in a first direction, and a holder that is disposed in a second direction opposite to the first direction with respect to the head chip and has a first flow path that supplies liquid to the nozzle; a support body that supports the liquid jet head and has a second flow path that supplies liquid to the first flow path, the holder includes a holder body and a first positioning portion connected to the holder body; the support body includes a support main body portion having an opening through which a part of the liquid jet head is inserted, and a second positioning portion connected to the support main body portion, the first positioning portion has a first communication flow path that communicates with the first flow path, the second positioning portion has a second communication flow path that communicates with the second flow path, one of the first positioning portion and the second positioning portion has an inner wall surface that forms a positioning hole, and the other is a rod-shaped protrusion, one of the first communication flow path and the second communication flow path is the positioning hole, the protrusion is inserted into the positioning hole, and a portion of the protrusion comes into contact with the inner wall surface, thereby positioning the liquid ejection head with respect to the support body, and communicating the first communication flow path with the second communication flow path. A head module characterized by:

2. The protrusion has a distal end and a proximal end, the base end is in contact with the inner wall surface, The tip portion and the inner wall surface are spaced apart from each other, The gap between the tip portion and the inner wall surface is sealed by a sealing member. The head module according to claim 1 .

3. the head chip is fixed to the holder by a fixing member, the fixing member does not overlap with the second flow path, the first communication flow path, and the second communication flow path when viewed in the first direction. The head module according to claim 1 .

4. The protrusion is inserted into the positioning hole by press-fitting. The head module according to claim 1 .

5. a head chip having a nozzle that ejects liquid in a first direction and a third flow path that communicates with the nozzle; a holder disposed in a second direction opposite to the first direction with respect to the head chip, supporting the head chip, and having a fourth flow path that supplies liquid to the third flow path; the head chip includes a chip body and a third positioning part connected to the chip body; the holder includes a holder body that supports the head chip, and a fourth positioning part that is connected to the holder body, the third positioning portion has a third communication flow path that communicates with the third flow path, the fourth positioning portion has a fourth communication flow path that communicates with the fourth flow path, one of the third positioning portion and the fourth positioning portion has an inner wall surface that forms a positioning hole, and the other is a rod-shaped protrusion, the protrusion is inserted into the positioning hole, and a portion of the protrusion comes into contact with the inner wall surface, thereby positioning the head chip relative to the holder and connecting the third communication flow path and the fourth communication flow path. A liquid jet head characterized by:

6. A liquid jet head according to claim 5, a support body that supports the plurality of liquid jet heads;

7. The head module according to claim 1 or 6; A liquid ejecting apparatus including: a conveying unit that conveys a medium.

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