Method of manufacturing oscillator

Abstract

To provide a method of manufacturing an oscillator excellent in frequency stability.SOLUTION: The method for manufacturing the oscillator 1, which is a method for manufacturing the oscillator 1 including the container 30, which accommodates the vibrator 43, and the base substrate 10, includes forming the first protrusion 21 on the container 30, forming the second protrusion 22 on the base substrate 10, and bonding the first protrusion 21 and the second protrusion 22 to each other via the bonding material 51 to mount the container 30 on the base substrate 10.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an oscillator. [Background technology]

[0002] For example, Patent Document 1 discloses an oscillator with excellent frequency stability, in which a second container that houses a vibrator is mounted on a base substrate that constitutes a first container that houses the second container via three or more protrusions, thereby improving the thermal insulation between the vibrator and the outside. The protrusions are formed by applying insulating adhesive to the base substrate with a dispenser and heating it to harden it. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2022-36479 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the oscillator described in Patent Document 1 has multiple layers of protrusions stacked on a base substrate and a second container mounted on top of them, which increases the gap between the second container and the base substrate and improves thermal insulation.However, to form multiple layers of protrusions, it is necessary to stack multiple layers of adhesive, which poses a problem in that there are strict restrictions on the application position and amount of adhesive for the upper layer. [Means for solving the problem]

[0005] The method for manufacturing an oscillator includes a container containing a vibrator and a base substrate, and includes forming a first protrusion on the container, forming a second protrusion on the base substrate, and mounting the container on the base substrate by joining the first protrusion and the second protrusion via a bonding material. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a plan view showing a schematic structure of an oscillator manufactured by a manufacturing method for an oscillator according to a first embodiment. [Figure 2] Cross-sectional view taken along line AA in FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line BB in FIG. [Figure 4] FIG. 3 is a flowchart showing a method for manufacturing the oscillator according to the first embodiment. [Figure 5] 5A to 5C are diagrams illustrating a method for manufacturing an oscillator. [Figure 6] 5A to 5C are diagrams illustrating a method for manufacturing an oscillator. [Figure 7] 5A to 5C are diagrams illustrating a method for manufacturing an oscillator. [Figure 8] 5A to 5C are diagrams illustrating a method for manufacturing an oscillator. [Figure 9] 5A to 5C are diagrams illustrating a method for manufacturing an oscillator. [Figure 10] FIG. 10 is a plan view showing a schematic structure of an oscillator manufactured by a manufacturing method of an oscillator according to a second embodiment. [Figure 11] FIG. 11 is a cross-sectional view taken along line CC in FIG. [Figure 12] FIG. 10 is a plan view showing a schematic structure of an oscillator manufactured by a manufacturing method of an oscillator according to a third embodiment. [Figure 13] 13 is a cross-sectional view taken along line DD in FIG. 12. [Figure 14] FIG. 10 is a plan view showing a schematic structure of an oscillator manufactured by a manufacturing method of an oscillator according to a fourth embodiment. [Figure 15] FIG. 15 is a cross-sectional view taken along line EE in FIG. [Figure 16] FIG. 10 is a plan view showing a schematic structure of an oscillator according to a first modified example. [Figure 17] 17 is a cross-sectional view taken along line FF in FIG. 16. [Figure 18] FIG. 10 is a plan view showing a schematic structure of an oscillator according to a second modified example. [Figure 19] A cross-sectional view taken along line GG in Figure 18. DETAILED DESCRIPTION OF THE INVENTION

[0007] 1. First embodiment First, an oscillator 1 manufactured by the manufacturing method of an oscillator according to the first embodiment will be described with reference to FIGS. 1, 2, and 3, taking a temperature compensated oscillator with a double seal structure as an example. 1 shows a state in which the lid 27 is removed for the convenience of explaining the internal configuration of the oscillator 1. Furthermore, in FIGS. 1, 2, and 3, the wiring electrically connecting the internal terminal 19 and the external terminal 20 provided in the container 5, and the terminals and wiring provided inside the container 30 are not shown.

[0008] For ease of explanation, the plan views and cross-sectional views below show three mutually perpendicular axes: the X-axis, the Y-axis, and the Z-axis. The direction along the X-axis is referred to as the "X direction," the direction along the Y-axis as the "Y direction," and the direction along the Z-axis as the "Z direction." The tip of the arrow in each axial direction is referred to as the "plus side," and the base end as the "minus side."

[0009] As shown in Figures 1, 2, and 3, the oscillator 1 of this embodiment has a temperature-compensated oscillator 40 in which an integrated circuit 41 and a vibrator 43 are housed in a container 30, and a housing container 5 that houses the temperature-compensated oscillator 40.

[0010] The temperature compensated oscillator 40 includes an integrated circuit 41, a resonator 43, and a container 30 that houses the resonator 43 and the integrated circuit 41.

[0011] The container 30 is composed of a base 31 made of ceramic or the like and a lid 32 made of metal, ceramic, glass or the like, and the base 31 and lid 32 are joined via a joining member 36 such as a seal ring or low-melting-point glass.

[0012] A plurality of first protrusions 21 formed of an insulating adhesive are provided on the lid 32 of the container 30. The first protrusions 21 can be formed by applying the insulating adhesive to the lid 32 of the container 30 using a dispenser or the like, and then heating and curing the adhesive. By keeping the amount of adhesive discharged from the dispenser constant, the diameter and height of the first protrusions 21 can be made uniform.

[0013] 2 and 3, the base 31 is formed by stacking a flat first substrate 33, a ring-shaped second substrate 34 with a central portion removed, and a third substrate 35 with a ring-shaped opening larger than that of the second substrate 34. A plurality of terminals 37 are provided on the surface of the first substrate 33 opposite to the second substrate 34. The ring-shaped second substrate 34 and the third substrate 35 form an accommodation space S2 inside the base 31 that accommodates the vibrator 43 and the integrated circuit 41. The accommodation space S2 is an airtight space filled with an inert gas such as nitrogen, helium, or argon. The atmosphere in the accommodation space S2 is not particularly limited and may be, for example, under reduced pressure or pressure.

[0014] 2, an integrated circuit 41 is fixed to the surface of the first substrate 33 facing the accommodation space S2 via a conductive bonding member 42 such as a metal bump or solder. Also, as shown in FIG. 3, a vibrator 43 is fixed to the surface of the second substrate 34 in a portion that does not overlap with the third substrate 35 via a conductive bonding member 47 such as a conductive adhesive.

[0015] The integrated circuit 41 is electrically connected to the terminal 37 via wiring, a through electrode, or the like (not shown) provided on the surface of the first substrate 33 on the housing space S2 side. The vibrator 43 is also electrically connected to the integrated circuit 41 via a terminal, a through electrode, or the like (not shown) provided on the surface of the second substrate 34 in a portion that does not overlap with the third substrate 35.

[0016] The integrated circuit 41 is accommodated in the accommodation space S2 of the container 30 and includes an oscillation circuit 61 for oscillating the oscillator 43, a temperature compensation circuit 62 for temperature-compensating for deviations of the oscillation frequency of the oscillator 43 from a desired frequency within a predetermined temperature range, and a temperature sensor 63 for detecting the temperature within the accommodation space S2.

[0017] The vibrator 43 includes a flat substrate 44, an excitation electrode 45 provided on two surfaces of the substrate 44, and a pad electrode 46. The vibrator 43 has a cantilever structure with one end in the X direction fixed to the container 30 by a bonding member 47. The excitation electrode 45 and the pad electrode 46 are electrically connected by lead electrodes (not shown) provided on the two surfaces. Therefore, the excitation electrode 45 is electrically connected to the integrated circuit 41 via the pad electrode 46 and the conductive bonding member 47. The vibrator 43 oscillates at a frequency corresponding to the mass of the substrate 44 including the excitation electrode 45. Note that the vibrator 43 may be, for example, a quartz crystal vibrator, a SAW (Surface Acoustic Wave) resonator, or other piezoelectric vibrators or MEMS (Micro Electro Mechanical Systems) vibrators. The substrate 44 may be made of a piezoelectric material such as a piezoelectric single crystal, such as quartz crystal, lithium tantalate, or lithium niobate, or a piezoelectric ceramic, such as lead zirconate titanate, or a silicon semiconductor material.

[0018] The container 5 is composed of a base substrate 10 made of ceramic or the like and a lid 27 made of metal, ceramic, glass or the like, and the base substrate 10 and the lid 27 are joined via a joining member 28 such as a seal ring or low-melting-point glass.

[0019] As shown in FIGS. 2 and 3 , the base substrate 10 is formed by stacking a flat first substrate 11, a ring-shaped second substrate 12 with a central portion removed, and a third substrate 13 with a ring-shaped opening larger than that of the second substrate 12. Furthermore, as shown in FIG. 1 , a plurality of internal terminals 19 are provided on a surface of the second substrate 12 that does not overlap with the third substrate 13. Furthermore, a plurality of external terminals 20 are provided on a second surface 15, which is the surface of the first substrate 11 opposite the second substrate 12. The internal terminals 19 and the external terminals 20 are electrically connected via through-hole electrodes (not shown). The ring-shaped second substrate 12 and the third substrate 13 form an accommodation space S1 inside the base substrate 10 that accommodates the temperature-compensated oscillator 40. The accommodation space S1 is an airtight space filled with an inert gas such as nitrogen, helium, or argon. The atmosphere in the accommodation space S1 is not particularly limited and may be, for example, under reduced pressure or pressure.

[0020] The first substrate 11 extends in the X and Y directions and has a thickness in the Z direction. A first surface 14 of the first substrate 11 facing the container 30 is provided with a plurality of second protrusions 22 formed of an insulating adhesive at positions that overlap with first protrusions 21 provided on the lid 32 of the container 30 in a plan view from the Z direction.

[0021] The second protrusions 22 can be formed by applying an insulating adhesive to the first surface 14 of the first substrate 11 using a dispenser or the like, and then heating and curing the adhesive. By keeping the amount of adhesive discharged from the dispenser constant, the diameter and height of the second protrusions 22 can be made uniform.

[0022] The container 30 is mounted on the base substrate 10 by bonding a first protrusion 21 formed on the container 30 to a second protrusion 22 formed on the base substrate 10 via a bonding material 51.

[0023] In addition, in the container 30 mounted on the base substrate 10, the terminal 37 provided on the first substrate 33 and the internal terminal 19 provided on the base substrate 10 are electrically connected via the bonding wire 52. Therefore, the terminal 37 provided on the first substrate 33 and the external terminal 20 provided on the base substrate 10 are electrically connected via the bonding wire 52, the internal terminal 19, and a through electrode (not shown), etc., so that a desired frequency temperature compensated by the temperature compensated oscillator 40 can be output from the external terminal 20.

[0024] Next, a method for manufacturing the oscillator 1 according to the first embodiment will be described with reference to FIG.

[0025] 4, the manufacturing method of the oscillator 1 includes a first protrusion forming step S1, a second protrusion forming step S2, a container mounting step S3, and a sealing step S4. The order of the first protrusion forming step S1 and the second protrusion forming step S2 may be reversed.

[0026] First, in the first protrusion forming step S1, as shown in Fig. 5, an insulating adhesive 71 is applied onto the lid 32 of the container 30 using a dispenser 70 or the like. Then, by heating and curing the adhesive, a hemispherical first protrusion 21 is formed on the lid 32 of the container 30 accommodating the vibrator 43, as shown in Fig. 8. The insulating adhesive 71 is made of a material such as epoxy resin, polyimide resin, or silicone resin.

[0027] Next, in the second protrusion forming step S2, an insulating adhesive 71 is applied onto the first surface 14 of the base substrate 10 using a dispenser 70 or the like, as shown in Fig. 6. Thereafter, the insulating adhesive 71 is heated and cured, thereby forming a hemispherical second protrusion 22 on the base substrate 10, as shown in Fig. 7.

[0028] Next, in the container mounting step S3, as shown in FIG. 7, a dispenser 70 or the like is used to apply a bonding material 51 onto the second protrusions 22 formed on the base substrate 10. Thereafter, as shown in FIG. 8, the container 30 is turned upside down, and then the container 30 is placed so that the first protrusions 21 formed on the container 30 overlap the bonding material 51 on the second protrusions 22, and heated with the first protrusions 21 pressed against the bonding material 51. The heating hardens the bonding material 51, bonding the first protrusions 21 and the second protrusions 22 together. Thus, as shown in FIG. 9, the container 30 is mounted on the base substrate 10. Note that the bonding material 51 may be made of an epoxy resin, a polyimide resin, a silicone resin, or the like.

[0029] Next, in the sealing process S4, the terminal 37 provided on the container 30 mounted on the base substrate 10 is electrically connected to the internal terminal 19 provided on the base substrate 10 via a bonding wire 52, and then the base substrate 10 and the lid 27 are joined via a joining member 28 such as a seal ring or low-melting point glass, thereby completing the oscillator 1 accommodating the temperature-compensated oscillator 40.

[0030] In the manufacturing method of the oscillator 1 of this embodiment, the first protrusion 21 is formed on the container 30 housing the resonator 43, the second protrusion 22 is formed on the base substrate 10, and then the first protrusion 21 and the second protrusion 22 are bonded via the bonding material 51, thereby mounting the container 30 housing the resonator 43 on the base substrate 10. In other words, in order to increase the gap between the container 30 and the base substrate 10, the first protrusion 21 and the second protrusion 22 are formed individually and then bonded together. This allows for greater freedom in the position and amount of insulating adhesive 71 to be applied compared to when multiple protrusions are stacked on the base substrate 10. This makes it possible to easily manufacture an oscillator 1 with improved thermal insulation and excellent frequency stability.

[0031] 2. Second embodiment Next, an oscillator 1a manufactured by the manufacturing method of an oscillator according to the second embodiment will be described with reference to Figures 10 and 11. For convenience of explanation, Figure 10 illustrates a state in which the lid 27 is removed.

[0032] The oscillator 1a of this embodiment is similar to the oscillator 1 of the first embodiment except that the area of ​​the first protrusion 21a provided on the container 30 is different from that of the oscillator 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.

[0033] As shown in Figures 10 and 11, the oscillator 1a mounts the container 30 on the base substrate 10 by joining a first protrusion 21a formed on the container 30 containing the vibrator 43 to a second protrusion 22 formed on the base substrate 10 via a bonding material 51.

[0034] The protrusion of first protrusion portion 21a has a larger area in a plan view than any of the multiple protrusions of second protrusion portion 22. Furthermore, the protrusion of first protrusion portion 21a is joined to each of the multiple protrusions of second protrusion portion 22. In other words, the area of ​​one first protrusion portion 21a is larger than the area including the multiple second protrusion portions 22, and one first protrusion portion 21a and multiple second protrusion portions 22 are joined to each other.

[0035] In the manufacturing method of the oscillator 1a of this embodiment, in a first protrusion forming step S1, an insulating adhesive 71 is applied to substantially the entire surface of the lid 32 of the container 30 using a dispenser 70 or the like to form one first protrusion 21a. Therefore, the area of ​​the protrusion of the first protrusion 21a is larger than the area including the multiple protrusions of the second protrusion 22, which makes it easier to align the first protrusion 21a with the second protrusion 22 when mounting the container 30 on the base substrate 10, and therefore makes it easier to mount the container 30 on the base substrate 10 in a container mounting step S3.

[0036] 3. Third embodiment Next, an oscillator 1b manufactured by the manufacturing method of an oscillator according to the third embodiment will be described with reference to Figures 12 and 13. For convenience of explanation, Figure 12 illustrates a state in which the lid 27 is removed.

[0037] The oscillator 1b of this embodiment is similar to the oscillator 1 of the first embodiment except that the area of ​​the first protrusion 21b provided on the container 30 is different from that of the oscillator 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.

[0038] As shown in Figures 12 and 13, oscillator 1b mounts container 30 on base substrate 10 by joining first protrusion 21b formed on container 30 containing vibrator 43 to second protrusion 22 formed on base substrate 10 via bonding material 51.

[0039] The protrusion of first protrusion portion 21b has a larger area in a plan view than any of the multiple protrusions of second protrusion portion 22. Furthermore, the protrusion of first protrusion portion 21b is joined to any of the multiple protrusions of second protrusion portion 22. In other words, the area of ​​first protrusion portion 21b is larger than the area of ​​the opposing second protrusion portion 22, and first protrusion portion 21b and the opposing second protrusion portion 22 are joined to each other.

[0040] In the manufacturing method of the oscillator 1b of this embodiment, in the first protrusion forming step S1, when insulating adhesive 71 is applied onto the lid 32 of the container 30 using a dispenser 70 or the like, the amount of insulating adhesive 71 applied is greater than the amount of insulating adhesive 71 applied in the second protrusion forming step S2, to form the first protrusion 21b. Therefore, the protrusion area of ​​the first protrusion 21b is larger than the protrusion area of ​​the opposing second protrusion 22, which makes it easier to align the first protrusion 21b and the second protrusion 22 when mounting the container 30 on the base substrate 10, and therefore makes it easier to mount the container 30 on the base substrate 10 in the container mounting step S3.

[0041] 4. Fourth embodiment Next, an oscillator 1c manufactured by the manufacturing method of an oscillator according to the fourth embodiment will be described with reference to Figures 14 and 15. For convenience of explanation, Figure 14 illustrates a state in which the lid 27 is removed.

[0042] The oscillator 1c of this embodiment is similar to the oscillator 1 of the first embodiment except that the structure of the base substrate 10c is different from that of the oscillator 1 of the first embodiment and a heater 80 and a heater control integrated circuit 84 are disposed therein. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.

[0043] 14 and 15, in the oscillator 1c, a heater 80 is fixed via a bonding member 81 such as a conductive adhesive having high thermal conductivity to the surface of the container 30 of the temperature compensated oscillator 40 on which the terminals 37 are arranged. A terminal 82 provided on the heater 80 and an internal terminal 24 provided on the second substrate 12 of the base substrate 10c are electrically connected via a bonding wire 53.

[0044] The first substrate 11c of the container 5c has a recess 26 formed on the second surface 15, recessed toward the first surface 14. A heater control integrated circuit 84 that controls the heater 80 is fixed to an inner bottom surface 29 of the recess 26 via a conductive bonding member 85 such as a metal bump or solder. The heater control integrated circuit 84 is also electrically connected to an internal terminal 24 provided on the base substrate 10c via wiring (not shown) or a through electrode (not shown) provided on the inner bottom surface 29 of the recess 26. Therefore, by controlling the heater 80 to a constant temperature using the heater control integrated circuit 84, the temperature compensated oscillator 40 can be maintained at a constant temperature, and the frequency stability of the output oscillation frequency can be further improved.

[0045] The manufacturing method of the oscillator 1c of this embodiment includes, in the sealing step S4, mounting the heater 80 and the heater control integrated circuit 84, and bonding the terminal 82 provided on the heater 80 to the internal terminal 24 provided on the second substrate 12 of the base substrate 10c. This makes it possible to manufacture an oscillator 1c having highly stable frequency characteristics.

[0046] 5. First Modification Next, an oscillator 1d according to a first modified example will be described with reference to Figures 16 and 17. For convenience of explanation, Figure 16 shows a state in which the lid 27 is removed.

[0047] The oscillator 1d of this embodiment is similar to the oscillator 1 of the first embodiment except that the structure of a temperature compensated oscillator 40d is different from that of the oscillator 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.

[0048] As shown in FIGS. 16 and 17, the oscillator 1d includes an integrated circuit 87, a temperature compensated oscillator 40d in which a resonator 43 is housed in a container 30d, and a housing container 5 that houses the temperature compensated oscillator 40d.

[0049] The temperature compensated oscillator 40d has a container 30d in which an integrated circuit 87 is formed and in which the resonator 43 is housed.

[0050] The container 30d is composed of a base 31d and a lid 32d, both of which are made of a semiconductor substrate primarily made of silicon, and the base 31d and the lid 32d are directly bonded to each other.

[0051] An integrated circuit 87 is formed on the surface of the base 31d opposite the lid 32d, and a passivation film 88 that protects the integrated circuit 87 is provided on the surface of the integrated circuit 87. An oscillation circuit 61, a temperature compensation circuit 62, and a temperature sensor 63 are formed on the integrated circuit 87. In addition, a vibrator 43 is fixed to the surface of the base 31d facing the lid 32d via a bonding member 47 such as a gold bump.

[0052] The lid 32d is provided with a recess 89 recessed on the side opposite the base 31d, and by bonding to the base 31d, an accommodation space S2 is formed to accommodate the vibrator 43. A first protrusion 21 is provided on the surface of the lid 32d opposite the base 31d, and by bonding the first protrusion 21 to a second protrusion 22 provided on the base substrate 10 via a bonding material 51, the container 30d is mounted on the base substrate 10.

[0053] In the oscillator 1d of this modification, a first protrusion 21 is formed on a container 30d that houses a vibrator 43, and a second protrusion 22 is formed on the base substrate 10. Then, the first protrusion 21 and the second protrusion 22 are joined via a bonding material 51, so that the container 30d that houses the vibrator 43 is mounted on the base substrate 10. This allows a larger gap between the container 30d and the base substrate 10, improving thermal insulation and providing an oscillator 1d with excellent frequency stability.

[0054] 6. Second Modification Next, an oscillator 1e according to a second modified example will be described with reference to Figures 18 and 19. For convenience of explanation, Figure 18 shows a state in which the lid 27 is removed.

[0055] The oscillator 1e of this embodiment is similar to the oscillator 1 of the first embodiment except that the structure of a temperature compensated oscillator 40e is different from that of the oscillator 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.

[0056] As shown in FIGS. 18 and 19, the oscillator 1e has a temperature compensated oscillator 40e in which a resonator 43e and an integrated circuit 41 are housed in a container 30e, and a housing container 5 that houses the temperature compensated oscillator 40e.

[0057] The temperature compensated oscillator 40e includes an integrated circuit 41, a resonator 43e, and a container 30e that houses the resonator 43e and the integrated circuit 41.

[0058] The container 30e is composed of a base 31e and a lid 32e, both of which are made of quartz crystal substrates, and the base 31e and the lid 32e are joined together via a joining member 90.

[0059] The base 31e has a first substrate 33e with a recess 91 recessed on the side opposite the lid 32e, and a second substrate 34e with a frame portion surrounding the vibrator 43e and connected to the end of the vibrator 43e on the negative side in the X direction. The first substrate 33e and the second substrate 34e are bonded via a bonding member 90. An integrated circuit 41 is fixed to an inner bottom surface 92 of the recess 91 of the first substrate 33e via a bonding member 42. The vibrator 43e of this embodiment has an inverted mesa structure in which the thickness of the vibrator 43e is thinner than the thickness of the frame portion of the second substrate 34e.

[0060] In this embodiment, the first substrate 33e and second substrate 34e constituting the base 31e and the lid 32e are AT-cut quartz substrates. This reduces the influence of distortion due to differences in linear expansion coefficients caused by bonding, resulting in a vibrator 43e with excellent temperature characteristics. The first substrate 33e and the lid 32e are not limited to quartz substrates, and may be made of glass materials such as soda-lime glass or quartz glass.

[0061] A first protrusion 21 is provided on the surface of the lid 32e opposite the base 31e, and the container 30e is mounted on the base substrate 10 by joining the first protrusion 21 to a second protrusion 22 provided on the base substrate 10 via a bonding material 51.

[0062] In the oscillator 1e of this modification, a first protrusion 21 is formed on a container 30e that houses a vibrator 43e, and a second protrusion 22 is formed on the base substrate 10. Then, the first protrusion 21 and the second protrusion 22 are joined via a bonding material 51, so that the container 30e that houses the vibrator 43e is mounted on the base substrate 10. This allows the gap between the container 30e and the base substrate 10 to be made larger, improving thermal insulation and providing an oscillator 1e with excellent frequency stability. [Explanation of symbols]

[0063] DESCRIPTION OF SYMBOLS 1, 1a, 1b, 1c, 1d, 1e... oscillator, 5... container, 10... base substrate, 11... first substrate, 12... second substrate, 13... third substrate, 14... first surface, 15... second surface, 19... internal terminal, 20... external terminal, 21... first protrusion, 22... second protrusion, 24... internal terminal, 26... recess, 27... lid, 28... joining member, 29... inner bottom surface, 30... container, 31... base, 32... lid, 33... first substrate, 34... second substrate, 35... third substrate, 36... joining member, 37... terminal, 40... temperature compensated oscillator, 41... integrated circuit , 42...bonding member, 43...vibrator, 44...substrate, 45...excitation electrode, 46...pad electrode, 47...bonding member, 51...bonding material, 52, 53...bonding wire, 61...oscillating circuit, 62...temperature compensation circuit, 63...temperature sensor, 70...dispenser, 71...insulating adhesive, 80...heater, 81...bonding member, 82...terminal, 84...heater control integrated circuit, 85...bonding member, 87...integrated circuit, 88...passivation film, 89...recess, 90...bonding member, 91...recess, 92 inner bottom surface, S1, S2...accommodation space.

Claims

1. A method for manufacturing an oscillator including a container containing a resonator and a base substrate, comprising: forming a first protrusion on the container; forming a second protrusion on the base substrate; and mounting the container on the base substrate by bonding the first protrusion and the second protrusion together via a bonding material. A method for manufacturing an oscillator.

2. an insulating adhesive is applied to the container and cured to form the first protrusion; an insulating adhesive is applied to the base substrate and cured to form the second protrusion; A method for manufacturing the oscillator according to claim 1.

3. the container includes a base and a lid; The first protrusion is formed on the lid. A method for manufacturing the oscillator according to claim 1.

4. the container includes a terminal formed on the base; The terminals and the base substrate are electrically connected via bonding wires. A method for manufacturing the oscillator according to claim 3.

5. the second protrusion portion includes a plurality of protrusions, the first protrusion portion includes a protrusion having an area larger in a plan view than any of the plurality of protrusions of the second protrusion portion, A method for manufacturing the oscillator according to claim 1.

6. The protrusions of the first protrusion portion are joined to the plurality of protrusions of the second protrusion portion, respectively. A method for manufacturing the oscillator according to claim 5.

7. The protrusion of the first protrusion portion is joined to any one of the plurality of protrusions of the second protrusion portion. A method for manufacturing the oscillator according to claim 5.

8. the oscillator comprises an integrated circuit including an oscillator circuit housed in the container; A method for manufacturing the oscillator according to claim 1.

9. the integrated circuit further includes a temperature compensation circuit and a temperature sensor; A method for manufacturing the oscillator according to claim 8.

10. The oscillator further includes a heater fixed to the container. A method for manufacturing the oscillator according to claim 9.

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