Laser processing apparatus

Abstract

To facilitate adjustment of laser beam irradiation.SOLUTION: The laser beam machining device 1 can engrave first and second recesses on a front 500a by simultaneously irradiating the front 500a extending in first and second directions with two laser beams L1, L2, and includes a laser beam source 10, a branching optical system 30, an irradiating optical system, and a rotating mechanism 90 for rotating the branching optical system 30. The branching optical system 30 branches the laser light L incident from the laser light source 10 into two. The radiation optical system radiates the two laser beams L1 and L2 to the front face 500a in oblique directions at angles different from each other with respect to the first direction. When the branching optical system 30 is rotated by the rotation mechanism 90, the radiation interval in the second direction between the two laser beams 500a and L2 radiated to the front side 500a is changed while the radiation interval between the two laser beams L1 and L2 radiated to the front side L1 is maintained constant.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laser processing device. [Background technology]

[0002] Conventionally, laser processing devices capable of engraving recesses into the surface of a workpiece using a laser beam have been known. For example, Japanese Patent Laid-Open Publication No. 2023-46975 (Patent Document 1) discloses a laser processing device that uses a laser oscillator to engrave first and second recesses in oblique directions at different angles relative to the surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-46975 Summary of the Invention [Problem to be solved by the invention]

[0004] From the viewpoint of shortening the operation time using a laser processing device, it is important to quickly adjust the irradiation position and irradiation angle of the laser beam relative to the surface of the workpiece. In this regard, when engraving a first recess and a second recess in a diagonal direction at different angles relative to the surface as disclosed in the above-mentioned Patent Document 1, it is not easy to quickly adjust the irradiation of the laser beam as described above so that the engraving angles of these two recesses satisfy a predetermined relationship.

[0005] Therefore, the present invention has been made in consideration of the above points, and aims to facilitate adjustment of laser light irradiation in a laser processing device capable of engraving a first recess and a second recess into a surface. [Means for solving the problem]

[0006] A laser processing apparatus according to the present invention is capable of engraving a first recess and a second recess in a surface extending in a first direction and a second direction perpendicular to the first direction by simultaneously irradiating the surface with two laser beams, and includes a laser light source, a branching optical system, an irradiation optical system, and a rotation mechanism. The branching optical system branches the laser beam incident from the laser light source into two. The irradiation optical system irradiates the surface with the two laser beams branched by the branching optical system in oblique directions at different angles relative to the first direction. The rotation mechanism rotates the branching optical system. In the laser processing apparatus according to the present invention, the rotation mechanism rotates the branching optical system, thereby maintaining a constant irradiation interval between the two laser beams irradiated onto the surface by the irradiation optical system, while changing the irradiation interval in the second direction between the two laser beams irradiated onto the surface by the irradiation optical system.

[0007] With this configuration, it is possible to facilitate adjustment of laser light irradiation in a laser processing device capable of engraving the first recess and the second recess on the surface.

[0008] In the laser processing apparatus according to the present invention, the irradiation optical system may include a single galvanometer mirror for changing the traveling directions of the two laser beams, which simplifies the configuration of the irradiation optical system.

[0009] The laser processing apparatus according to the present invention may further include a scanning mechanism that scans the two laser beams in the second direction over the surface by moving one of the irradiation positions of the two laser beams and the surface relative to the other.

[0010] With this configuration, the first recess and the second recess can be provided on the surface so as to extend along the second direction.

[0011] The laser processing device according to the present invention may further include a blowing mechanism that blows gas toward the surface of the portion irradiated with the two laser beams.

[0012] This configuration prevents debris generated on the surface by the irradiation of the two laser beams from adhering to the first recess and the second recess. This makes it possible to form the first recess and the second recess on the surface with high processing accuracy. Furthermore, it is also possible to effectively prevent the surface from being overheated by the irradiation of the two laser beams.

[0013] In the laser processing apparatus according to the present invention, the blowing mechanism may blow the gas from the upstream side to the downstream side in the scanning direction of the two laser beams.

[0014] With this configuration, it becomes possible to provide the first recess and the second recess on the surface with higher processing accuracy.

[0015] The laser processing apparatus according to the present invention may further include an actuator that changes the direction in which the gas is blown by the blowing mechanism, and a control unit. In this case, the control unit may operate the actuator so that the direction in which the gas is blown by the blowing mechanism is changed in accordance with the rotation angle of the branching optical system when the branching optical system is rotated by the rotation mechanism.

[0016] With this configuration, the gas can be blown from the upstream side to the downstream side in the scanning direction of the two laser beams, regardless of the rotation angle of the branching optical system.

[0017] In the laser processing apparatus according to the present invention, the branching optical system may be configured by a diffraction grating, which allows the branching optical system to be configured simply. [Effects of the Invention]

[0018] According to the present invention, in a laser processing device capable of engraving a first recess and a second recess into a surface, it is possible to facilitate adjustment of laser light irradiation. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a schematic diagram of a laser processing apparatus according to an embodiment, viewed from the front side; [Figure 2] 2 is a schematic side view of a part of the laser processing apparatus shown in FIG. 1. FIG. [Figure 3] 2 is a schematic cross-sectional view showing how a first recess and a second recess are formed on a surface of a first member by the laser processing apparatus shown in FIG. 1. FIG. [Figure 4] 2 is a perspective view of a first member having a first recess and a second recess formed on the surface thereof by the laser processing apparatus shown in FIG. 1. FIG. [Figure 5] 5 is a schematic cross-sectional view showing the configuration of a connection body formed by connecting a second member to the first member shown in FIG. 4. FIG. [Figure 6] 2 is a schematic diagram showing irradiation positions of a pair of laser beams when the diffraction grating shown in FIG. 1 is placed at a predetermined rotational position. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, the same or common parts are designated by the same reference numerals in the drawings, and the description thereof will not be repeated.

[0021] (Embodiment) FIG. 1 is a schematic diagram of a laser processing device according to an embodiment. FIG. 2 is a schematic diagram of a part of the laser processing device shown in FIG. 1 as seen from the side. FIG. 3 is a schematic cross-sectional view showing how a first recess and a second recess are formed on a surface of a first member by the laser processing device shown in FIG. 1. FIG. 4 is a perspective view of a first member on whose surface the first recess and the second recess are formed by the laser processing device shown in FIG. 1. FIG. 5 is a schematic cross-sectional view showing the configuration of a connection body formed by connecting a second member to the first member shown in FIG. 4. Hereinafter, a laser processing device 1 according to this embodiment will be described with reference to FIGS. 1 to 5.

[0022] In the present embodiment described below, an example is shown in which two recesses are carved into a surface 500a of a first member 500 made of a metal material using a laser processing device 1. The surface 500a of the first member 500 extends in a first direction and a second direction perpendicular to the first direction.

[0023] As shown in FIG. 1, the right and left directions when viewing the laser processing apparatus 1 from the front are referred to as the X1 direction and the X2 direction, respectively. The direction coinciding with the X1 direction and the X2 direction is also referred to as the X-axis direction. Similarly, the rearward and forward directions when viewing the laser processing apparatus 1 from the front are referred to as the Y1 direction and the Y2 direction, respectively. The direction coinciding with the Y1 direction and the Y2 direction is also referred to as the Y-axis direction. Similarly, the upward and downward directions when viewing the laser processing apparatus 1 from the front are referred to as the Z1 direction and the Z2 direction, respectively. The direction coinciding with the Z1 direction and the Z2 direction is also referred to as the Z-axis direction.

[0024] The first direction corresponds to the X-axis direction, the second direction corresponds to the Y-axis direction, and the third direction, which is perpendicular to both the first and second directions, corresponds to the Z-axis direction.

[0025] 1 and 2, the laser processing apparatus 1 includes a laser oscillator 10, an optical fiber 20, a diffraction grating 30, a collimating lens 40, a galvanometer mirror 50, a condensing lens 60, a scanning mechanism 70, a spraying mechanism 80, a rotation mechanism, and a control unit 100. The laser oscillator 10, the optical fiber 20, the diffraction grating 30, the collimating lens 40, the galvanometer mirror 50, and the condensing lens 60 are arranged in this order from the upstream side to the downstream side of the optical path of the laser light.

[0026] The laser processing apparatus 1 is configured to be able to engrave a first recess 1000 and a second recess 2000 (see FIGS. 3 and 4) into a surface 500a of a first member 500 placed on a stage 71 of a scanning mechanism 70 by irradiating the surface 500a with a first laser beam L1 and a second laser beam L2. In this embodiment, the first recess 1000 and the second recess 2000 are provided on the surface 500a so as to extend along the Y-axis direction. In other words, the first recess 1000 and the second recess 2000 are both provided linearly on the surface 500a. The stage 71 will be described in detail later.

[0027] A laser oscillator 10 serving as a laser light source emits laser light L. The laser light L emitted from the laser oscillator 10 is incident on a diffraction grating 30 via an optical fiber 20.

[0028] The diffraction grating 30 splits the incident laser light L into two beams: a first laser beam L1 and a second laser beam L2. By providing the diffraction grating 30 on the optical path of the laser light L in this manner, it becomes possible to simultaneously irradiate the surface 500a with the first laser beam L1 and the second laser beam L2 split from the laser beam L. This makes it possible to shorten the working time of the processing operation when the first recess 1000 and the second recess 2000 are carved obliquely at different angles relative to the surface 500a of the first member 500.

[0029] That is, when engraving two recesses on surface 500a as described above by irradiating only a single laser beam, it is necessary to optimize the irradiation optical system, etc. to determine the irradiation position of the single laser beam for engraving the first recess, and then re-optimize the irradiation optical system, etc. to re-position the irradiation position of the single laser beam for engraving the second recess, which may result in a longer operation time using the laser processing apparatus.

[0030] In this regard, by configuring the laser processing apparatus 1 according to this embodiment so that the first laser light L1 and the second laser light L2 can be simultaneously irradiated onto the surface 500a, there is no need to repeatedly position the irradiation position of the laser light as described above, and as a result, it is possible to carve two recesses into the surface 500a in a shorter time.

[0031] The diffraction grating 30 is provided with a rotation mechanism for rotating it, which will be described in detail later.

[0032] The first laser light L1 and the second laser light L2 split by the diffraction grating 30 are both incident on a collimator lens 40. The collimator lens 40 has been aberration-corrected so that the laser light incident thereon becomes parallel. The first laser light L1 and the second laser light L2 that have passed through the collimator lens 40 are incident on a single galvanometer mirror 50 in a parallel state.

[0033] The galvanometer mirror 50 is a reflecting mirror that reflects the laser light incident thereon. The size of the galvanometer mirror 50 and the coating applied thereto can be changed appropriately depending on the diameter and wavelength of the laser light, etc.

[0034] The first laser light L1 and the second laser light L2 are both reflected by the single galvanometer mirror 50, and thereby their traveling directions are changed toward predetermined directions. The first laser light L1 and the second laser light L2 reflected by the galvanometer mirror 50 are incident on the condenser lens 60.

[0035] The condenser lens 60 condenses the laser light incident thereon, and is formed, for example, by a plano-convex lens, etc. The first laser light L1 and the second laser light L2 pass through the condenser lens 60 and are condensed onto the surface 500a of the first member 500.

[0036] As shown in FIG. 3, the first laser beam L1 and the second laser beam L2 focused on the surface 500a of the first member 500 are irradiated onto the surface 500a in oblique directions at mutually different angles with respect to the X-axis direction.

[0037] In the present embodiment, the above-described collimator lens 40, galvanometer mirror 50, and condenser lens 60 correspond to the irradiation optical system. However, the configuration of the irradiation optical system is not particularly limited to this. That is, as long as the irradiation optical system is configured to be able to irradiate the first laser beam L1 and the second laser beam L2 onto the surface 500a in oblique directions at different angles relative to the X-axis direction, the irradiation optical system may not include any of the collimator lens 40, the galvanometer mirror 50, and the condenser lens 60, or may include other optical systems in addition to these.

[0038] 1 and 2, the scanning mechanism 70 includes a stage 71 and an actuator 72 connected to the stage 71. The stage 71 extends along the XY plane. The actuator 72 enables the stage 71 to move in both the X-axis and Y-axis directions.

[0039] The scanning mechanism 70 moves the first member 500 in the Y1 direction with the first member 500 placed on the stage 71. By moving the surface 500a of the first member 500 relative to the irradiation positions of both the first laser light L1 and the second laser light L2 in this manner, it becomes possible to relatively scan the surface 500a with the first laser light L1 and the second laser light L2 in the Y2 direction.

[0040] The configuration of the scanning mechanism 70 is not limited to the above-described configuration, and may be, for example, a robot arm configured to be able to move the first member 500 in both the X-axis and Y-axis directions.

[0041] 2, the irradiation positions of the first laser beam L1 and the second laser beam L2 irradiated onto the surface 500a of the first member 500 are preferably spaced apart from each other in the scanning direction of the irradiation of the first laser beam L1 and the second laser beam L2. This effectively prevents unintended melting of the surface 500a due to local heating of the surface 500a caused by simultaneous irradiation of the first laser beam L1 and the second laser beam L2.

[0042] In this embodiment, the scanning direction coincides with the Y2 direction, and therefore the irradiation position of the first laser beam L1 is located downstream in the Y2 direction from the irradiation position of the second laser beam L2.

[0043] The spraying mechanism 80 mainly includes a cylinder 81 and a nozzle 82 connected to the cylinder 81. The spraying mechanism 80 sprays a gas 83 toward the surface 500a of the first member 500, which is a portion that is irradiated with the first laser beam L1 and the second laser beam L2.

[0044] Cylinder 81 is a supply source of gas 83. Cylinder 81 is filled with, for example, compressed air. Note that gas 83 is not particularly limited to air, and may be, for example, an inert gas such as argon. Note that the supply source of gas 83 is not particularly limited to cylinder 81.

[0045] The nozzle 82 functions as an injector that injects the gas 83. The nozzle 82 is connected to the cylinder 81 via a flow rate adjusting valve 84 that serves as an adjusting mechanism that adjusts the flow rate of the gas 83.

[0046] The flow rate adjustment valve 84 is configured so that its opening degree can be changed. The flow rate adjustment valve 84 adjusts the flow rate of the gas 83 sent from the cylinder 81 based on a signal from the control unit 100. The flow rate adjustment valve 84 is configured, for example, by a valve, a solenoid valve, or the like, whose opening degree can be adjusted.

[0047] A motor 85, which is an actuator, is connected to the nozzle 82. The motor 85 is configured, for example, by a servo motor or a stepping motor. The position and angle of the nozzle 82 are changed by driving the motor 85. Therefore, by controlling the driving of the motor 85, it is possible to change the position of the portion of the surface 500a of the first member 500 onto which the gas 83 is blown to a predetermined position, or to change the blowing direction of the gas 83 to a predetermined direction.

[0048] The blowing mechanism 80 is preferably configured to blow the gas 83 from the upstream side to the downstream side in the scanning direction of the first laser beam L1 and the second laser beam L2.

[0049] More specifically, it is preferable that the motor 85 is driven so that the gas 83 is blown from the upstream side to the downstream side in the scanning direction of the irradiation of the first laser light L1 and the second laser light L2 (i.e., from the right side to the left side in Figure 2) toward the irradiation position of the first laser light L1 and the second laser light L2 on the surface 500a of the first member 500.

[0050] This makes it possible to provide the first recess 1000 and the second recess 2000 in the surface 500a of the first member 500 with high processing accuracy, particularly when the first member 500 is made of a metal material.

[0051] That is, when a recess is formed in a workpiece made of a metal material by laser processing, spatter, which is metal melted by the heat of the laser light, may adhere to the recess. If dissimilar materials are joined by pouring molten resin into the recess while spatter is adhering to the recess, the joining strength between the dissimilar materials may be reduced due to the recess being filled with spatter.

[0052] In this regard, by configuring the blowing mechanism 80 as described above, sputters generated by the irradiation of the first laser beam L1 and the second laser beam L2 are blown away by the gas 83 from the inside to the outside of the first recessed portion 1000 and the second recessed portion 2000. This prevents sputters from adhering to the first recessed portion 1000 and the second recessed portion 2000, and as a result, it becomes possible to provide the first recessed portion 1000 and the second recessed portion 2000 on the surface 500a with high processing accuracy.

[0053] In addition, by using the blowing mechanism 80 to blow gas 83 onto the irradiation position of the first laser light L1 and the second laser light L2, it is possible to effectively prevent the surface 500a from being overheated by the irradiation of these two laser lights.

[0054] The control unit 100 has, as its main components, a CPU (Central Processing Unit) 101, a memory 102, an input / output device (not shown) for inputting and outputting various signals, etc. The control unit 100 controls the oscillation of laser light L by the laser oscillator 10, the drive of the actuator 72 of the scanning mechanism 70, the drive of the spray mechanism 80, and the drive of the rotation mechanism. The rotation mechanism will be described in detail later.

[0055] The CPU 101 executes programs. The memory 102 includes a ROM (Read Only Memory) and a RAM (Random Access Memory). The ROM stores data in a non-volatile manner. The RAM stores data generated by the CPU 101 executing programs in a volatile manner.

[0056] The components of the control unit 100 are interconnected by a data bus. Processing in the CPU 101 is realized by the various pieces of hardware and software executed by the CPU 101. Such software is pre-stored in ROM / RAM. Power is supplied to the control unit 100 from an internal power supply (not shown) or an external power supply (not shown). Connection to the external power supply is made, for example, using an AC adapter (not shown).

[0057] By configuring the laser processing apparatus 1 as described above, it is possible to engrave the first recess 1000 and the second recess 2000 in a diagonal direction at different angles relative to the surface 500a of the first member 500, as shown in Fig. 4. Furthermore, by using the scanning mechanism 70, it is possible to provide the first recess 1000 and the second recess 2000 in the surface 500a so as to extend along a predetermined direction.

[0058] The first member 500 having the first recess 1000 and the second recess 2000 formed on the surface 500a in this manner is connected to a second member 600 made of a resin material that is a different material from the metal material that makes up the first member 500, as shown in Figure 5, to form a connector 700 of different materials.

[0059] In the connecting body 700, the first member 500 and the second member 600 are firmly engaged with each other by engaging a portion of the second member 600 with both the first recess 1000 and the second recess 2000. This is because, by forming an engaging portion with the first recess 1000 and the second recess 2000 that are carved obliquely at different angles relative to the surface 500a as described above, it is possible to eliminate a weak direction that would reduce the connection strength between the first member 500 and the second member 600.

[0060] Here, when the first recess 1000 and the second recess 2000 are carved obliquely at different angles relative to the surface 500a of the first member 500 as described above, it is not easy to adjust the irradiation positions and irradiation angles of the two laser beams relative to the surface 500a while ensuring that the carving angles of each of these two recesses satisfy a predetermined relationship.

[0061] In this regard, in the laser processing apparatus 1 according to the present embodiment, a rotation mechanism is provided on the diffraction grating 30 as the branching optical system, thereby facilitating adjustment of the laser light irradiation. This will be described in detail below with reference to FIG. 6 and the above-mentioned FIG. 1.

[0062] Figures 6(A), 6(B), and 6(C) are schematic diagrams, respectively, of the irradiation positions of a pair of laser beams when the diffraction grating shown in Figure 1 is arranged at a first rotation position, a second rotation position, and a third rotation position in its rotation direction, as viewed from the direction of arrow VI shown in Figure 1. The irradiation positions of the pair of laser beams shown in Figure 6(A) correspond to the irradiation positions of the pair of laser beams when the first recessed portion 1000 and the second recessed portion 2000 are provided on the surface 500a of the first member 500 so as to extend along the Y-axis direction, as described above.

[0063] 6(A) to 6(C) are merely examples and can be changed as appropriate. The rotational position of the diffraction grating 30 is not limited to the first rotational position, the second rotational position, and the third rotational position, and the diffraction grating 30 can be placed at any desired rotational position.

[0064] 1, a rotation mechanism is provided for diffraction grating 30 as a branching optical system. The rotation mechanism is for rotating diffraction grating 30. In this embodiment, a motor 90 is used as the rotation mechanism.

[0065] The motor 90 rotates the diffraction grating 30 in a plane perpendicular to the incident direction of the laser light L. The motor 90 is configured by, for example, a servo motor or a stepping motor. It is preferable that the motor 90 is connected to an encoder 91 that detects the rotational position of the motor 90.

[0066] By rotating the diffraction grating 30 using the rotation mechanism configured in this manner, as shown in Figures 6(A) to 6(C), the irradiation distance (see dimension d in the figure) between the first laser light L1 and the second laser light L2 irradiated onto the surface 500a of the first member 500 by the irradiation optical system configured with a galvanometer mirror 50 etc. is maintained constant, while the irradiation distance (see dimensions D1, D2, D3 in the figure) in the Y-axis direction between the first laser light L1 and the second laser light L2 irradiated onto the surface 500a by the irradiation optical system is changed.

[0067] In this way, by rotating the diffraction grating 30 using the motor 90, it is possible to rotate and move the irradiation positions of the first laser light L1 and the second laser light L2 on the surface 500a of the first member 500 around a virtual central axis as the center of rotation, while maintaining a predetermined relative relationship between the irradiation directions of the first laser light L1 and the second laser light L2 relative to the surface 500a of the first member 500.

[0068] Therefore, by configuring the laser processing device 1 as described above, it is possible to facilitate adjustment of laser light irradiation in a laser processing device capable of engraving the first recess and the second recess on the surface.

[0069] Furthermore, by providing a rotation mechanism as in the laser processing apparatus 1 of this embodiment, adjustment of the laser light irradiation is facilitated, particularly when changing the scanning direction of the irradiation of the first laser light L1 and the second laser light L2.

[0070] That is, in the laser processing apparatus 1, by rotating the diffraction grating 30 by the motor 90, it is possible to maintain the relative relationship between the irradiation directions of the first laser beam L1 and the second laser beam L2 with respect to the surface 500a as viewed along the scanning direction before and after changing the scanning direction, thereby making it possible to easily adjust the laser beam irradiation when changing the scanning direction.

[0071] In addition, in the laser processing apparatus 1 according to this embodiment, when the diffraction grating 30 is rotated by the motor 90, the control unit 100 operates the motor 85 so that the direction in which the gas 83 is blown by the nozzle 82 of the blowing mechanism 80 is changed according to the rotation angle of the diffraction grating 30.

[0072] With this configuration, regardless of the rotation angle of the diffraction grating 30, the gas 83 can be blown from the upstream side to the downstream side in the scanning direction of the first laser light L1 and the second laser light L2.

[0073] In the above-described embodiment, a case where a diffraction grating is used as the branching optical system has been described as an example, but the branching optical system may be, for example, an optical branching fiber or the like.

[0074] Furthermore, in the above-described embodiment, an example has been given in which the first recess 1000 and the second recess 2000 are provided in a line on the surface 500a of the first member 500, but the first recess 1000 and the second recess 2000 may also be provided in a spot pattern on the surface 500a.

[0075] Furthermore, in the above-described embodiment, an example has been given in which the scanning mechanism 70 moves the first member 500 to move the surface 500a of the first member 500 relative to the irradiation positions of both the first laser light L1 and the second laser light L2, but instead of moving the first member 500, the scanning mechanism 70 may move the diffraction grating 30 and the irradiation optical system to move the surface 500a of the first member 500 relative to the irradiation positions of both the first laser light L1 and the second laser light L2.

[0076] (Addendum) The characteristic configuration of the laser processing device disclosed in the above-described embodiment can be summarized as follows.

[0077] [Appendix 1] A laser processing apparatus capable of engraving a first recess and a second recess into a surface extending in a first direction and a second direction perpendicular to the first direction by simultaneously irradiating the surface with two laser beams, the laser processing apparatus comprising: a laser light source; a branching optical system that branches the laser light incident from the laser light source into two beams; an irradiation optical system that irradiates the surface with the two laser beams branched by the branching optical system in oblique directions at angles different from each other with respect to the first direction; a rotation mechanism that rotates the branching optical system, The laser processing apparatus wherein the branching optical system is rotated by the rotation mechanism, thereby maintaining a constant irradiation interval between the two laser beams irradiated onto the surface by the irradiation optical system, while changing the irradiation interval in the second direction between the two laser beams irradiated onto the surface by the irradiation optical system.

[0078] [Appendix 2] The laser processing apparatus described in Appendix 1 further includes a scanning mechanism that scans the two laser beams in the second direction over the surface by moving one of the irradiation positions of the two laser beams and the surface relative to the other.

[0079] [Appendix 3] 3. The laser processing apparatus according to claim 2, further comprising a blowing mechanism for blowing gas toward the surface of the portion irradiated with the two laser beams.

[0080] [Appendix 4] 4. The laser processing device according to claim 3, wherein the blowing mechanism blows the gas from the upstream side to the downstream side in the scanning direction of the two laser beams.

[0081] [Appendix 5] an actuator for changing the direction in which the gas is blown by the blowing mechanism; a control unit; The laser processing apparatus described in Appendix 3 or 4, wherein the control unit operates the actuator so that, when the branching optical system is rotated by the rotation mechanism, the direction in which the gas is blown by the blowing mechanism is changed according to the rotation angle of the branching optical system.

[0082] [Appendix 6] 6. The laser processing apparatus according to any one of claims 1 to 5, wherein the irradiation optical system includes a single galvanometer mirror for changing the directions of travel of the two laser beams.

[0083] [Appendix 7] 7. The laser processing device according to claim 1, wherein the branching optical system is configured by a diffraction grating.

[0084] (Other forms, etc.) The shape, configuration, size, number, material, etc. of each part shown in the embodiment described above can be changed in various ways without departing from the spirit of the present invention.

[0085] Furthermore, the characteristic configurations shown in the above-described embodiments of the present invention can naturally be combined with each other without departing from the spirit of the present invention.

[0086] As such, the above-described embodiments disclosed herein are illustrative in all respects and are not restrictive. The technical scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0087] 1 laser processing device, 10 laser oscillator, 30 diffraction grating, 50 galvanometer mirror, 70 scanning mechanism, 80 spray mechanism, 83 gas, 85 motor, 90 motor, 100 control unit, 500a surface, 1000 first recess, 2000 second recess, L laser light, L1 first laser light, L2 second laser light.

Claims

1. A laser processing apparatus capable of engraving a first recess and a second recess in a surface extending in a first direction and a second direction perpendicular to the first direction by simultaneously irradiating the surface with two laser beams, the laser processing apparatus comprising: a laser light source; a branching optical system that branches the laser light incident from the laser light source into two beams; an irradiation optical system that irradiates the surface with the two laser beams branched by the branching optical system in oblique directions at angles different from each other with respect to the first direction; a rotation mechanism that rotates the branching optical system, The laser processing device wherein the branching optical system is rotated by the rotation mechanism, thereby maintaining a constant irradiation interval between the two laser beams irradiated onto the surface by the irradiation optical system, while changing the irradiation interval in the second direction between the two laser beams irradiated onto the surface by the irradiation optical system.

2. 2. The laser processing apparatus according to claim 1, further comprising a scanning mechanism that scans the surface with the two laser beams in the second direction by moving one of the irradiation positions of the two laser beams and the surface relative to the other.

3. The laser processing device according to claim 2 , further comprising a blowing mechanism for blowing gas toward the surface of the portion irradiated with the two laser beams.

4. The laser processing device according to claim 3 , wherein the blowing mechanism blows the gas from an upstream side to a downstream side in a scanning direction of the two laser beams.

5. an actuator for changing the direction in which the gas is blown by the blowing mechanism; a control unit; The laser processing apparatus of claim 4, wherein the control unit operates the actuator so that, when the branching optical system is rotated by the rotation mechanism, the direction in which the gas is blown by the blowing mechanism is changed according to the rotation angle of the branching optical system.

6. 2. The laser processing apparatus according to claim 1, wherein the irradiation optical system includes a single galvanometer mirror for changing the traveling directions of the two laser beams.

7. 7. The laser processing device according to claim 1, wherein the branching optical system is configured by a diffraction grating.

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