Method of manufacturing light emitting device, and light emitting device

Abstract

To provide a method of manufacturing a light-emitting device capable of improving luminance, and the light-emitting device.SOLUTION: The method of manufacturing a light emitting device includes providing a light emitting element, disposing an uncured bonding member on an upper surface of the light emitting element, disposing a light-transmissive member on the upper surface of the light emitting element via the bonding member, pressing the bonding member with the light-transmissive member to allow the bonding member to up a lateral surface of the light-transmissive member, curing the bonding member, and removing a portion of the bonding member and a portion of the light-transmissive member by scraping the bonding member covering the lateral surface of the light-transmissive member and the lateral surface of the light-transmissive member covered with the bonding member.SELECTED DRAWING: Figure 3I

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a light-emitting device, and a light-emitting device. [Background technology]

[0002] A light-emitting device is known that includes a substrate, a light-emitting element mounted on the substrate, a transparent material layer disposed on the light-emitting element, a plate-shaped optical layer mounted on the transparent material layer, and a reflective material layer disposed around the light-emitting element and the transparent material layer. In this light-emitting device, the lower surface of the plate-shaped optical layer is larger than the upper surface of the light-emitting element, and the reflective material layer forms an inclined surface that connects the lower end of the side surface of the light-emitting element to the side surface of the plate-shaped optical layer.

[0003] A method for manufacturing such a light-emitting device includes, for example, a first step of forming an uncured transparent material layer having inclined side surfaces between the light-emitting element and the plate-shaped optical layer, and then curing the transparent material layer, and a second step of filling a non-conductive reflective material around the transparent material layer and curing it to form a reflective material layer having inclined side surfaces that follow the inclined side surfaces of the transparent material layer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-004303 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present disclosure is to provide a method for manufacturing a light emitting device capable of improving brightness, and the light emitting device. [Means for solving the problem]

[0006] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes the steps of preparing a light-emitting element, arranging an uncured bonding member on an upper surface of the light-emitting element, arranging a translucent member on the upper surface of the light-emitting element via the bonding member, pressing the bonding member with the translucent member, and causing the bonding member to creep up onto a side surface of the translucent member, curing the bonding member, and scraping off the bonding member covering the side surface of the translucent member and the side surface of the translucent member that was covered by the bonding member, thereby removing a portion of the bonding member and the translucent member.

[0007] A light emitting device according to one embodiment of the present disclosure includes a light emitting element, a bonding member that covers at least a portion of the side surface and an upper surface of the light emitting element, a translucent member that is disposed on the upper surface of the light emitting element via the bonding member, a first covering member that covers the lower surface of the light emitting element and is in contact with the bonding member, and a second covering member that exposes the upper surface of the translucent member, covers the side surfaces of the translucent member and the bonding member, and is in contact with the first covering member, and at least a portion of the side surfaces of the translucent member and the bonding member are flush with each other. [Effects of the Invention]

[0008] According to an embodiment of the present disclosure, it is possible to provide a manufacturing method for a light emitting device and a light emitting device capable of improving brightness. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view schematically illustrating a light emitting device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3A] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3B] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3C] FIG. 2 is a diagram of the wiring board as viewed from the top surface side of the wiring board. [Figure 3D]5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3E] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3F] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3G] 10 is a view of the light emitting element, the bonding member, and the light-transmitting member as viewed from the bottom side of the light emitting element. FIG. [Figure 3H] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3I] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3J] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 3K] 10 is a view of the light emitting element, the bonding member, and the light-transmitting member as viewed from the bottom side of the light emitting element. FIG. [Figure 3L] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process for the light emitting device according to the present embodiment. [Figure 4] FIG. 10 is a cross-sectional view schematically showing a light emitting device according to Modification 1 of the present embodiment. [Figure 5A] 10A to 10C are cross-sectional views schematically illustrating an example of a manufacturing process for a light emitting device according to Modification 1 of the present embodiment. [Figure 5B] 10A to 10C are cross-sectional views schematically illustrating an example of a manufacturing process for a light emitting device according to Modification 1 of the present embodiment. [Figure 5C] 10A to 10C are cross-sectional views schematically illustrating an example of a manufacturing process for a light emitting device according to Modification 1 of the present embodiment. [Figure 5D] 10A to 10C are cross-sectional views schematically illustrating an example of a manufacturing process for a light emitting device according to Modification 1 of the present embodiment. [Figure 6A] 10A to 10C are cross-sectional views schematically showing another example of the manufacturing process for the light emitting device according to the first modified example of the present embodiment. [Figure 6B] 10A to 10C are cross-sectional views schematically showing another example of the manufacturing process for the light emitting device according to the first modified example of the present embodiment. [Figure 6C]10A to 10C are cross-sectional views schematically showing another example of the manufacturing process for the light emitting device according to the first modified example of the present embodiment. [Figure 7] FIG. 10 is a cross-sectional view schematically showing a light emitting device according to Modification 2 of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a manufacturing method according to an embodiment of the present invention and a light-emitting device obtained by the manufacturing method (hereinafter, sometimes referred to as a "light-emitting device according to an embodiment") will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "upper," "lower," and other terms including these terms) will be used as necessary. However, the use of these terms is intended to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the present invention. Furthermore, parts that appear with the same reference numerals in multiple drawings indicate the same or equivalent parts or components.

[0011] Furthermore, the embodiments described below are intended to exemplify light-emitting devices and the like embodying the technical concepts of the present invention and are not intended to limit the scope of the present invention. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are intended for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, the content described in one embodiment may also be applicable to other embodiments and modified examples. Furthermore, the size and positional relationships of components shown in the drawings may be exaggerated for clarity. Furthermore, to avoid overly complex drawings, schematic diagrams may be used in which some elements are omitted, or end views may be used as cross-sectional views showing only the cut surface. Furthermore, even if some components change in size or shape due to processing or pressing, the same names may still be used to describe them.

[0012] <Light-emitting device 1 according to the embodiment> Fig. 1 is a perspective view schematically showing a light emitting device according to this embodiment. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. Fig. 2 shows a cross section of the light emitting device 1 cut along a plane perpendicular to the upper surface 20a of the light emitting element 20. The same applies to the subsequent cross-sectional views.

[0013] 1 and 2, the light emitting device 1 includes a wiring substrate 10, a light emitting element 20, a protective element 30, a bonding member 40, a light-transmitting member 50, and a covering member 60. The light emitting device 1 may not include the protective element 30 and the wiring substrate 10.

[0014] In the light emitting device 1, the light emitting element 20 is disposed on a wiring substrate 10. Furthermore, in the light emitting device 1, a protection element 30 may be disposed on the wiring substrate 10. The light emitting element 20 has an upper surface 20a, a plurality of side surfaces 20c continuous with the upper surface 20a, and a lower surface 20b opposite the upper surface 20a. The plurality of side surfaces 20c are continuous with the upper surface 20a and the lower surface 20b. In other words, the plurality of side surfaces 20c each have an outer edge continuous with the outer edge of the upper surface 20a and the outer edge of the lower surface 20b. The light emitting element 20 can emit light from the upper surface 20a, the lower surface 20b, and the side surfaces 20c.

[0015] The light emitting element 20 has an upper surface 20a that is substantially rectangular. For example, the light emitting element 20 has an external shape that is substantially rectangular parallelepiped or substantially cubic. In this case, the upper surface 20a and the lower surface 20b of the light emitting element 20 are substantially rectangular, and the light emitting element 20 has four substantially rectangular side surfaces 20c. The shape of the upper surface 20a of the light emitting element 20 may be a polygon such as a triangle or a hexagon. Furthermore, the external shape of the light emitting element 20 may be a columnar or frustum with a polygonal upper surface.

[0016] The bonding member 40 covers at least a portion of the side surface 20c and the top surface 20a of the light-emitting element 20. Specifically, the bonding member 40 covers the entire top surface 20a of the light-emitting element 20 and at least a portion of the upper end side of each side surface 20c (i.e., the outer edge side connected to the top surface 20a). The bonding member 40 has a side surface 40c that connects to the side surface 20c of the light-emitting element 20 and the bottom surface 50b of the light-transmitting member 50. The bonding member 40 preferably covers as much area of ​​each side surface 20c of the light-emitting element 20 as possible, and more preferably covers almost the entirety of each side surface 20c. In other words, the side surface 40c of the bonding member 40 preferably contacts the side surface 20c at a position close to the bottom end side of each side surface 20c of the light-emitting element 20 (i.e., the side connected to the bottom surface 20b), and more preferably contacts the bottom end of each side surface 20c. Specifically, on each side surface 20c of the light-emitting element 20, it is preferable that 75% or more and 100% or less of the area in the height direction from the upper end side is covered with the bonding member 40, and it is more preferable that 90% or more and 100% or less of the area is covered with the bonding member 40.

[0017] The light-transmitting member 50 is disposed on the upper surface 20a of the light-emitting element 20 via a bonding member 40. The light-transmitting member 50 has an upper surface 50a, a lower surface 50b opposite the upper surface 50a, and a side surface 50c between the upper surface 50a and the lower surface 50b. The upper surface 50a of the light-transmitting member 50 constitutes the upper surface of the light-emitting device 1 as the main light-emitting surface of the light-emitting device 1. The light-transmitting member 50 is disposed on the light-emitting element 20 such that the lower surface 50b of the light-transmitting member 50 faces the upper surface 20a of the light-emitting element 20 via the bonding member 40 disposed on the upper surface 20a of the light-emitting element 20. The light-transmitting member 50 is disposed such that the lower surface 50b of the light-transmitting member 50 is approximately parallel to the upper surface 20a of the light-emitting element 20. It is preferable that the shape of the lower surface 50b of the light-transmitting member be similar to the shape of the upper surface 20a of the light-emitting element. For example, when the upper surface 20a of the light-emitting element is rectangular, it is preferable that the lower surface 50b of the light-transmitting member also be rectangular.

[0018] The lower surface 50b of the light-transmitting member 50 is a flat surface. The upper surface 50a of the light-transmitting member 50 may be a flat surface parallel to the lower surface 50b, or a part or all of the upper surface 50a may have a surface that is not parallel to the lower surface 50b. The lower surface 50b of the light-transmitting member 50 preferably has the same area as the upper surface 20a of the light-emitting element 20 or a larger area than the upper surface 20a of the light-emitting element 20. Furthermore, the light-transmitting member 50 is preferably disposed such that the lower surface 50b of the light-transmitting member 50 encloses the light-emitting element 20 in a top view. Furthermore, in the light-emitting device 1, the bonding member 40 interposed between the lower surface 50b of the light-transmitting member 50 and the upper surface 20a of the light-emitting element 20 preferably covers the lower surface 50b of the light-transmitting member 50 that does not overlap with the upper surface 20a of the light-emitting element 20 in a top view. Furthermore, in the light emitting device 1, the bonding member 40 is preferably disposed so as to reach the outer edge of the lower surface 50b of the light-transmitting member 50, and more preferably the entire lower surface 50b is covered with the bonding member 40. This allows more of the light emitted from the light emitting element 20 to be incident on the lower surface 50b of the light-transmitting member 50 via the bonding member 40.

[0019] The side surface 50c of the light-transmitting member 50 is a surface perpendicular to the upper surface 50a and / or the lower surface 50b. Here, perpendicular includes a case where the side surface 50c of the light-transmitting member 50 is inclined within 90±5 degrees. At least a portion of the side surface 50c of the light-transmitting member 50 and the side surface 40c of the joining member 40 are flush with each other. The side surface 50c of the light-transmitting member 50 and the side surface 40c of the joining member 40 may be entirely flush with each other. Here, "one surface being flush with another surface" includes a case where the one surface is inclined with respect to the other surface within ±5 degrees. It also includes a case where there is a step of ±5 μm or less at the boundary between the one surface and the other surface.

[0020] In order to improve the brightness of the light-emitting device 1, it is preferable that the area of ​​the light-emitting surface of the light-emitting device 1 be as small as possible. Furthermore, in order to allow as much light emitted from the light-emitting element 20 to be incident on the light-transmitting member 50 as possible, it is preferable that the widths of the lower surface 50b of the light-transmitting member 50 in the X and Y directions be within a range of ±10% of the widths of the upper surface 20a of the light-emitting element 20 in the X and Y directions. Furthermore, it is more preferable that the widths of the lower surface 50b of the light-transmitting member 50 in the X and Y directions be approximately the same as the widths of the upper surface 20a of the light-emitting element 20 in the X and Y directions. Here, "approximately the same width" includes a range in which the widths of the light-transmitting member 50 in the X and Y directions are within a range of +6% of the widths of the light-emitting element 20 in the X and Y directions. For example, in the cross-sectional view of FIG. 2 , if the width of the upper surface 20a of the light-emitting element 20 in the X direction is 1, the width of the lower surface 50b of the light-transmitting member 50 in the X direction is greater than 1 and approximately 1.06 or less. Therefore, the width in the X direction of the bonding member 40 covering the side surface 20c of the light-emitting element 20 is greater than 0 and approximately 0.03 or less. Similarly, if the width in the Y direction of the upper surface 20a of the light-emitting element 20 is 1, the width in the Y direction of the lower surface 50b of the light-transmitting member 50 is greater than 1 and approximately 1.06 or less. Therefore, the width in the Y direction of the bonding member 40 covering the side surface 20c of the light-emitting element 20 is greater than 0 and approximately 0.03 or less.

[0021] The covering member 60 exposes the upper surface 50a of the light-transmitting member 50, and covers the side surface 40c of the bonding member 40 and the side surface 50c of the light-transmitting member 50. The covering member 60 also covers the upper surface of the wiring board 10. Furthermore, if the light emitting device 1 has a protective element 30, the covering member 60 preferably covers the upper surface and side surface of the protective element 30. The covering member 60 may also cover the lower surface 20b of the light emitting element 20. Furthermore, if a portion of the side surface 20c of the light emitting element 20 is exposed from the bonding member 40, the covering member 60 may directly cover the side surface 20c of the light emitting element 20 that is exposed from the bonding member 40.

[0022] The covering member 60 preferably has light-blocking properties, specifically, light-reflecting properties and / or light-absorbing properties. In particular, it is preferable that the covering member 60 contains a material that can suitably reflect the light emitted from the light-emitting element 20.

[0023] By covering the side surface 40c of the joining member 40 with the covering member 60, light that is emitted from the side surface 20c of the light emitting element 20 and transmitted through the joining member 40 is reflected by the covering member 60. The covering member 60 may also cover the bottom surface 20b of the light emitting element 20. In this case, light that is emitted from the bottom surface 20b of the light emitting element 20 and travels downward can be reflected by the covering member 60. As a result, the light extraction efficiency of the light emitting device 1 can be improved.

[0024] The covering member 60 may be composed of a single part or multiple parts. In the example shown in Figure 2, the covering member 60 is composed of multiple parts including a first covering member 61 and a second covering member 62.

[0025] In the covering member 60, the first covering member 61 is disposed on the wiring board 10 side. The first covering member 61 covers, for example, the upper surface of the wiring board 10. The first covering member 61 contacts the bonding member 40. The first covering member 61 may cover the lower surface 20b of the light-emitting element 20. Furthermore, in the case where the light-emitting device 1 has a protective element 30, the first covering member 61 covers, for example, at least a part of the side surface of the protective element 30. The first covering member 61 may cover the lower surface of the protective element 30.

[0026] The first covering member 61 has a side surface 61c. The first covering member 61 has an unspecified shape because it is disposed on the wiring substrate 10 along the surfaces of the light-emitting element 20 and the protection element 30. Here, the side surface 61c of the first covering member 61 refers to a surface that contacts the side surface 40c of the bonding member 40 and extends toward the wiring substrate 10. The side surface 61c of the first covering member 61 may include an area that is flush with the side surface 50c of the light-transmitting member 50 and the side surface 40c of the bonding member 40.

[0027] In the covering member 60, the second covering member 62 is disposed on, for example, the first covering member 61. The second covering member 62 exposes the upper surface 50a of the light-transmitting member 50, covers the side surface 50c of the light-transmitting member 50 and the side surface 40c of the joining member 40, and is in contact with the first covering member 61. Furthermore, in the case where the light emitting device 1 has a protection element 30, the second covering member 62 covers, for example, the upper surface of the protection element 30. The second covering member 62 may cover a portion of the side surface of the protection element 30 exposed from the first covering member 61.

[0028] The side surfaces of the second covering member 62, together with the side surfaces of the wiring board 10, form the side surfaces of the light emitting device 1. The side surfaces of the second covering member 62 and the side surfaces of the wiring board 10 can be flush with each other, for example. Furthermore, the top surface of the second covering member 62 and the top surface 50a of the light-transmitting member 50 can be flush with each other, for example.

[0029] In the light emitting device 1, when a current is supplied from an external power source to the light emitting element 20, the light emitting element 20 emits light. Of the light emitted by the light emitting element 20, light that travels upward (i.e., toward the lower surface of the light-transmitting member) is extracted to the outside of the light emitting device 1 via the bonding member 40 and the light-transmitting member 50. Of the light emitted by the light emitting element 20, light that travels downward is reflected by the covering member 60 and the wiring board 10, and is extracted to the outside of the light emitting device 1 via the light emitting element 20, the bonding member 40, and the light-transmitting member 50. Of the light emitted by the light emitting element 20, light that travels laterally is reflected at the interface between the side surface 20c of the bonding member 40 and the covering member 60, and is extracted to the outside of the light emitting device 1 via the bonding member 40 and the light-transmitting member 50.

[0030] In the light emitting device 1, the side surface 50c of the light-transmitting member 50 and the side surface 40c of the joining member 40 are flush and continuous. In the light emitting device 1, the side surface 50c of the light-transmitting member 50 is not covered by the joining member 40. This allows more of the light emitted from the light emitting element 20 to enter the light-transmitting member 50 from the lower surface 50b of the light-transmitting member 50 via the joining member 40. This allows the brightness of the upper surface 50a of the light-transmitting member 50, which is the light emitting surface of the light emitting device 1, to be improved.

[0031] Furthermore, in the light emitting device 1, the widths of the light-transmitting member 50 in the X and Y directions are approximately the same as the widths of the light emitting element 20 in the X and Y directions. That is, in the light emitting device 1, the area of ​​the upper surface 50a of the light-transmitting member 50, which serves as the main light-emitting surface, is approximately the same as the area of ​​the upper surface 20a of the light emitting element 20. Therefore, the area through which light emitted from the light emitting element 20 and incident on the light-transmitting member 50 is guided is constant. That is, the optical path length from the light emitted from the light emitting element 20 to the outside is shortened, and more light can be emitted from the upper surface 50a of the light-transmitting member 50. This increases the amount of light per unit area emitted from the upper surface 50a of the light-transmitting member 50, improving brightness.

[0032] Each element constituting the light emitting device 1 according to the embodiment will be described in detail below.

[0033] [Wiring board 10] The wiring board 10 is a component on which the light-emitting elements 20 are disposed. The wiring board 10 includes wiring for supplying power to the light-emitting elements from an external source and a substrate 11 supporting the wiring. For example, the wiring board 10 includes upper surface wiring 12 disposed on the upper surface on which the light-emitting elements 20 are disposed, and lower surface wiring 13 disposed on the lower surface opposite the upper surface. The substrate 11 has, for example, a substantially rectangular parallelepiped or cubic shape. The substrate 11 is preferably made of an insulating material that is not easily transmitted by light emitted from the light-emitting elements 20 or external light. Examples of materials for the substrate 11 include ceramics such as aluminum oxide, aluminum nitride, silicon nitride, and mullite; resins such as epoxy resin, silicone resin, modified epoxy resin, urethane resin, phenolic resin, polyimide resin, BT resin, and polyphthalamide; semiconductors such as silicon; and metals such as copper and aluminum, as well as composites thereof. Among these, ceramics, which have excellent heat dissipation properties, are preferably used as the material for the substrate 11.

[0034] The upper wiring 12 includes wiring electrically connected to the light-emitting element 20 and wiring electrically connected to the protection element 30. The lower wiring 13 includes an anode electrode and a cathode electrode having regions for ensuring electrical connection with an external power source (i.e., serving as electrodes of the light-emitting device 1). The upper wiring 12 and the lower wiring 13 can be made of, for example, metals such as iron, copper, nickel, aluminum, gold, silver, platinum, titanium, tungsten, and palladium, or alloys containing at least one of these metals. Furthermore, the wiring board 10 may include relay wiring inside and / or on the side of the base material 11 for connecting the upper wiring 12 and the lower wiring 13.

[0035] The wiring board 10 does not necessarily have to have the bottom wiring 13. In this case, an anode electrode and a cathode electrode that are electrically connected to an external power supply may be disposed on the top or side surface.

[0036] The wiring board 10 may have a recess on its upper surface, and the light emitting device 1 may have a structure in which the light emitting element 20 is disposed at the bottom of the recess in the wiring board 10. The light emitting device 1 may also have a structure without the wiring board 10. For example, the light emitting device may have a structure in which a metal member (e.g., an electrode of the light emitting element 20 described later) exposed from a covering member 60 covering the lower surface 20b of the light emitting element 20 is used as an electrode of the light emitting device 1.

[0037] The wiring board 10 may also use leads as wiring. In this case, the wiring board 10 has leads as wiring and a resin molded body that holds the leads as a base material. The leads may be made of the above-mentioned metals or alloys and processed into a predetermined shape by rolling, punching, extrusion, wet or dry etching, or a combination of these processes.

[0038] (Light-emitting element 20) The light emitting element 20 can suitably be a semiconductor light emitting element such as a light emitting diode (LED) chip or a semiconductor laser (LD) chip. The shape, size, etc. of the light emitting element 20 can be selected arbitrarily. The light emitting element 20 has, for example, positive and negative electrodes on the lower surface 20b. The light emitting element 20 is disposed on the wiring substrate 10. For example, the light emitting element 20 is flip-chip mounted to the wiring substrate 10 via a conductive bonding member 25, with the lower surface 20b facing the wiring substrate 10. The conductive bonding member 25 can be, for example, a known member such as eutectic solder, conductive paste, or a bump.

[0039] The light emitting element 20 includes, for example, a semiconductor structure and a support substrate that supports the semiconductor structure. The semiconductor structure includes an n-side semiconductor layer, a p-side semiconductor layer, and an active layer sandwiched between the n-side semiconductor layer and the p-side semiconductor layer. The active layer may have a single quantum well (SQW) structure or a multiple quantum well (MQW) structure including multiple well layers. The semiconductor structure includes multiple semiconductor layers made of nitride semiconductors. The nitride semiconductors include In x Al y Ga 1-x-y This includes semiconductors of all compositions in which the composition ratios x and y in the chemical formula N (0≦x, 0≦y, x+y≦1) are varied within their respective ranges. The emission peak wavelength of the active layer can be appropriately selected depending on the purpose. The active layer is configured to be able to emit, for example, visible light or ultraviolet light.

[0040] The light-emitting element 20 may have one semiconductor structure on one support substrate, or may have multiple semiconductor stacks on one support substrate. Furthermore, one semiconductor structure may have only one light-emitting layer, or may have multiple light-emitting layers. The structure of a semiconductor structure having multiple light-emitting layers may include multiple active layers between one n-side semiconductor layer and one p-side semiconductor layer, or may be a structure in which a structure including an n-side semiconductor layer, an active layer, and a p-side semiconductor layer in that order is repeated multiple times.

[0041] The light-emitting element 20 includes an n-electrode connected to the n-side semiconductor layer and a p-electrode connected to the p-side semiconductor layer. The p-electrode and n-electrode may be disposed on different surfaces of the semiconductor laminate, or may be disposed on the same surface. Here, the electrodes, including the p-electrode and n-electrode, are disposed on the same surface of the semiconductor structure. The side on which the electrodes are disposed constitutes the lower surface 20b of the light-emitting element 20, and the surface of the support substrate opposite to the surface on which the semiconductor structure is disposed constitutes the upper surface 20a of the light-emitting element 20. Examples of the support substrate include insulating substrates such as sapphire and spinel (MgAl2O4), and nitride-based semiconductor substrates such as gallium nitride. Note that, in order to extract light emitted from the active layer through the support substrate, it is preferable to use a light-transmitting material for the support substrate. Note that the light-emitting element 20 may not have a support substrate. In this case, the surface of the semiconductor structure opposite to the surface on which the electrodes are disposed constitutes the upper surface 20a of the light-emitting element 20.

[0042] (protective element 30) The light emitting device 1 may include other electronic components such as a protective element 30 in addition to the light emitting element 20. The protective element 30 is, for example, a Zener diode. The light emitting device 1 may not include the protective element 30.

[0043] (Joint member 40) The joining member 40 is disposed between the light emitting element 20 and the light-transmitting member 50, and is a member that joins the light emitting element 20 and the light-transmitting member 50. The joining member 40 is also light-transmitting, and is a member that guides light emitted from the light emitting element 20 to the light-transmitting member 50. By covering the side surface 20c of the light emitting element 20 with the joining member 40, it becomes easier to guide the light emitted from the side surface 20c of the light emitting element 20 to the light-transmitting member 50, and the light extraction efficiency of the light emitting device 1 can be improved.

[0044] The bonding member 40 is disposed so as to cover the upper surface 20a and each side surface 20c of the light-emitting element 20. For example, a light-transmitting resin can be used as the bonding member 40. Examples of the light-transmitting resin include thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin. Among them, silicone resin, which has high heat resistance, is preferably used. Alternatively, a silicon alcoholate such as polysilazane, which has better heat resistance, may be used as the bonding member 40. The bonding member 40 may contain a light diffusing member or a phosphor, which will be described later.

[0045] (Translucent member 50) The light-transmitting member 50 is disposed on the light-emitting element 20 and transmits light emitted from the light-emitting element 20 to the outside. The light-transmitting member 50 may transmit 60% or more of the light from the light-emitting element 20 and / or light obtained by wavelength conversion of the light from the light-emitting element 20 (e.g., light having a wavelength in the range of 320 nm to 850 nm), and preferably transmits 70% or more of the light. The light-transmitting member 50 may be formed from an inorganic material such as glass, ceramic, or sapphire, or an organic material such as a resin or hybrid resin containing one or more of silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, phenolic resin, or fluororesin. The light-transmitting member 50 may contain a phosphor capable of wavelength conversion of at least a portion of incident light. Examples of the light-transmitting member 50 containing a phosphor include a sintered body of a phosphor and the above-mentioned materials containing phosphor powder. The light-transmitting member 50 may be a light-transmitting plate that is a molded body of resin, glass, ceramic, or the like, on whose surface a phosphor layer, such as a resin layer containing a phosphor or a glass layer containing a phosphor, is disposed. The light-transmitting member 50 may also contain a filler, such as a light-diffusing material, depending on the purpose. When a filler, such as a light-diffusing material, is contained, the light-transmitting member 50 may be a resin, glass, ceramic, or other inorganic material containing the filler, or a light-diffusing layer, such as a resin layer containing a filler, such as a light-diffusing material, or a glass layer containing a filler, is disposed on the surface of the light-transmitting plate that is a molded body of resin, glass, ceramic, or the like.

[0046] The phosphor is an yttrium-aluminum-garnet phosphor (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSiO 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 oxynitride phosphors such as (La,Y)3Si6N 11 :Ce), BSESN phosphors (for example, (Ba,Sr)2Si5N8:Eu), SLA phosphors (for example, SrLiAl3N4:Eu), CASN phosphors (for example, CaAlSiN3:Eu) or SCASN phosphors (for example, (Sr,Ca)AlSiN3:Eu), nitride phosphors such as KSF phosphors (for example, K2SiF6:Mn), KSAF phosphors (for example, K2(Si 1-x Al x )F 6-x:Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) can be used.

[0047] As the light diffusion member, those known in the art can be used. For example, titanium oxide, silicon oxide, aluminum oxide, barium titanate, etc. can be used.

[0048] When a resin is used as the binder of the phosphor layer or the light diffusion layer, examples of the resin include thermosetting resins such as epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, etc.

[0049] (Coating member 60) The coating member 60 is a member that exposes the upper surface 50a of the light-transmissive member 50 and covers the side surface 40c of the joining member 40 and the side surface 50c of the light-transmissive member 50. The coating member 60 preferably has a reflectance of 60% or more with respect to the light emitted from the light-emitting element 20, and more preferably has a reflectance of 70% or more, 80% or more, or 90% or more.

[0050] The covering member 60 is preferably made of an insulating material. The covering member 60 is, for example, a member containing particles of a light-reflecting substance and a base material. Examples of base materials used for the covering member 60 include resins or hybrid resins containing one or more of silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea resin, acrylic resin, phenolic resin, bismaleimide triazine resin, and polyphthalamide resin. Among these, silicone resin is particularly preferred because of its excellent light resistance, heat resistance, electrical insulation, and flexibility. The base material may also be made of an inorganic material such as an alkali metal silicate. Examples of light-reflecting substances include titanium oxide, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, barium titanate, zinc oxide, silicon nitride, aluminum nitride, boron nitride, calcium carbonate, calcium hydroxide, calcium silicate, and combinations thereof. Among these, titanium oxide, which has a relatively high refractive index, is preferred from the perspective of light reflection.

[0051] As described above, the covering member 60 may be composed of a first covering member 61 and a second covering member 62. In this case, each of the first covering member 61 and the second covering member 62 can be formed using a material selected from the materials listed above as examples of the material for the covering member 60. By forming the covering member 60 from the first covering member 61 and the second covering member 62, it becomes possible to use a material with high mechanical strength for the second covering member 62 that forms the outer surface of the light emitting device 1, or to use a material with low elasticity and low linear expansion for the first covering member 61 that covers the lower surface 20b of the light emitting element 20, thereby alleviating the stress caused by resin expansion.

[0052] <Method of Manufacturing the Light-Emitting Device According to the Embodiment> A manufacturing method of a light emitting device according to an embodiment includes the steps of preparing a light emitting element, arranging an uncured bonding member on an upper surface of the light emitting element, arranging a light-transmitting member on the upper surface of the light emitting element via the bonding member, pressing the bonding member with the light-transmitting member, and causing the bonding member to creep up onto the side surfaces of the light-transmitting member, curing the bonding member, and scraping off the bonding member covering the side surfaces of the light-transmitting member and the side surfaces of the light-transmitting member that were covered by the bonding member, thereby removing the bonding member and part of the light-transmitting member.

[0053] Furthermore, the method for manufacturing a light emitting device according to the embodiment may include, before the removing step, a step of arranging a first covering member that covers at least a part of the bonding member.

[0054] Furthermore, the manufacturing method of the light emitting device according to the embodiment may include, after the removing step, a step of exposing an upper surface of the translucent member and arranging a second covering member that covers a side surface of the translucent member and a side surface of the joining member.

[0055] Furthermore, the manufacturing method of the light emitting device according to the embodiment may include, before the step of placing the bonding member, the step of preparing a wiring substrate and the step of placing the light emitting element on the wiring substrate.

[0056] Hereinafter, each manufacturing step of the manufacturing method of the light emitting device according to the embodiment will be described with reference to the drawings.

[0057] 3A to 3L are schematic diagrams illustrating a manufacturing process for a light emitting device according to this embodiment. Specifically, FIGS. 3A, 3B, 3D to 3F, 3H to 3J, and 3L are cross-sectional views schematically illustrating an example of a manufacturing process for a light emitting device according to this embodiment. FIG. 3C is a view of a wiring substrate viewed from the top surface side of the wiring substrate. FIGS. 3G and 3K are views of a light emitting element, a bonding member, and a light-transmitting member viewed from the bottom surface side of the light emitting element. Note that in FIG. 3C, the top surface wiring of the wiring substrate is omitted.

[0058] (Process of preparing light-emitting element) First, as shown in FIG. 3A, a light emitting element 20 is prepared, which has an upper surface 20a, a lower surface 20b, and a plurality of side surfaces 20c continuous with the upper surface 20a and the lower surface 20b. A protective element 30 is also prepared. The protective element 30 is prepared as needed. The light emitting element 20 can be prepared by undergoing some or all of multiple steps, such as a step of forming a semiconductor laminate and a step of forming electrodes. In the description of the manufacturing method, "preparing" a component does not necessarily mean manufacturing the component, but also includes acquiring the component, such as purchasing the component or receiving the component.

[0059] (Process of preparing a wiring board, process of arranging a light emitting element on the wiring board) Next, as shown in FIG. 3B , a wiring board 10 is prepared, and a light emitting element 20 is arranged on the wiring board 10. Specifically, first, a wiring board 10 is prepared, which has a base material 11, upper surface wiring 12 provided on the upper surface of the base material 11, and lower surface wiring 13 provided on the lower surface of the base material 11. Then, the light emitting element 20 is arranged on the upper surface side of the wiring board 10. Here, a protective element 30 is arranged together with the light emitting element 20. The light emitting element 20 and the protective element 30 are flip-chip mounted on the wiring board 10, for example, with the surfaces on which the respective electrodes are arranged facing the upper surface wiring 12 side.

[0060] As shown in FIG. 3C , the wiring substrate 10 can include alignment marks 300 used for aligning the light-emitting elements 20 within the regions that constitute the individual light-emitting devices 1. The alignment marks 300 can be configured, for example, with a wiring pattern similar to that of the top surface wiring 12. The alignment marks 300 can be, for example, cross-shaped, and multiple marks can be arranged diagonally across the wiring substrate 10. By using the alignment marks 300 as a reference, the light-emitting elements 20 can be accurately positioned at desired positions on the wiring substrate 10. The alignment marks may be arranged within or outside the regions that constitute the light-emitting devices 1. Alternatively, an aggregate substrate including multiple regions that will become the light-emitting devices 1 after singulation may be prepared as the wiring substrate 10.

[0061] (Step of placing uncured bonding material on the upper surface of the light emitting element) Next, as shown in FIG. 3D , uncured bonding material 40 is placed on the upper surface 20a of the light-emitting element 20. Specifically, a nozzle is placed above the light-emitting element 20, and uncured bonding material 40 is dispensed from the nozzle toward the upper surface 20a of the light-emitting element 20. After a predetermined amount of bonding material 40 has been dispensed, dispensing is stopped, and the nozzle is moved from above the light-emitting element 20. The uncured bonding material 40 assumes the shape shown in FIG. 3D due to surface tension. Note that "uncured" refers to a state before the curing reaction has progressed, i.e., a state before an operation for promoting the curing reaction is performed. Examples of operations for promoting the curing reaction include heating or light irradiation. Note that the curing reaction may have progressed slightly before the operation for promoting the curing reaction, and such a state is also included in the "uncured" state. Specifically, it is sufficient that the bonding material 40 has fluidity that allows it to creep up, as shown in FIG. 3F (described later).

[0062] (A step of placing a transparent member on the upper surface of the light-emitting element via a bonding member and hardening the bonding member) 3E, a light-transmitting member 50 is prepared and placed on the upper surface 20a of the light-emitting element 20 via the uncured bonding member 40. The light-transmitting member 50 prepared here has an upper surface 50a and a lower surface 50b with larger areas than the light-transmitting member 50 that will ultimately be mounted on the light-emitting device 1.

[0063] Next, as shown in FIG. 3F , the light-transmitting member 50 presses the joining member 40 in the direction of the arrow, causing the joining member 40 to creep up onto the side surface 50c of the light-transmitting member 50. The pressure changes the shape of the joining member 40, and the joining member 40 is disposed between the upper surface 20a of the light-emitting element 20 and the lower surface 50b of the light-transmitting member 50 with a substantially constant thickness. Furthermore, the joining member 40 moves outward from the upper surface 20a of the light-emitting element 20, covering part or all of the side surface 20c of the light-emitting element 20, and creeps up onto the side surface 50c of the light-transmitting member 50, covering part or all of the side surface 50c of the light-transmitting member 50. The joining member 40 is then cured. This bonds the light-transmitting member 50 and the light-emitting element 20 together via the joining member 40. Curing can be performed by a known method, such as heating in an oven.

[0064] The bonding member 40 is preferably disposed at a distance from the wiring board 10. By separating the bonding member 40 from the wiring board 10, the bonding member 40 can be formed in an irregular shape, which can reduce the reflection of light from the light emitting element 20 in unintended directions, thereby improving the light extraction efficiency of the light emitting device 1.

[0065] The bonding member 40 is pressed by the light-transmitting member 50, causing the bonding member 40 to flow, so that the bonding member 40 can be disposed on the lower surface 50b of the light-transmitting member 50, which does not face the upper surface 20a of the light-emitting element. The bonding member 40 covers part or all of the lower surface 50b of the light-transmitting member 50. As an example of the bonding member 40 covering part of the lower surface 50b of the light-transmitting member 50, as shown in FIG. 3G, corners 55 located at the four corners of the lower surface 50b of the light-transmitting member 50 may not be completely covered by the bonding member 40. This is because the corners 55 of the lower surface 50b of the light-transmitting member 50 are far from the outer edge of the light-emitting element 20, making it difficult for the uncured bonding member 40 to spread.

[0066] (Step of placing the first covering member) Next, as shown in FIG. 3H, a first covering member 61 is placed on the wiring substrate 10. The first covering member 61 is placed so as to cover at least a portion of the bonding member 40. Specifically, first, an uncured first covering member 61 is placed on the wiring substrate 10. The uncured first covering member 61 can be placed on the wiring substrate 10 by, for example, potting, spraying, or the like. The first covering member 61 covers, for example, the lower surface 20b of the light-emitting element 20, at least a portion of the side surface 40c of the bonding member 40, the lower surface of the protection element 30, and at least a portion of the side surface of the protection element 30. Thereafter, the uncured first covering member 61 is cured.

[0067] (Removal process) 3I, the joining member 40 covering the side surface 50c of the light-transmitting member 50 and the side surface 50c of the light-transmitting member 50 that was covered by the joining member 40 are ground to remove a portion of the joining member 40 and the light-transmitting member 50. Specifically, a rotary blade 350 of a predetermined thickness is rotated and scanned in the X and Y directions to grind the outer periphery of the four side surfaces 50c of the light-transmitting member 50 that are covered with the joining member 40, thereby processing the light-transmitting member 50 and the joining member 40 into a predetermined shape. Note that the removal may be performed using a laser, a cutter, or the like.

[0068] In the removing step, the joining member 40 and the light-transmitting member 50 are removed using the alignment mark 300 shown in Fig. 3C. For example, when scanning the rotary blade 350, the rotary blade 350 is aligned with the alignment mark 300 as a reference, thereby enabling the joining member 40 and the light-transmitting member 50 to be processed into the desired shape with high precision. Furthermore, the positional precision of the light-transmitting member 50 relative to the light-emitting element 20 can be improved.

[0069] FIG. 3J shows a state after the side surface of the light-transmitting member 50 covered with the joining member 40 has been removed. As shown in FIG. 3J, the removing step forms a side surface 50c of the light-transmitting member 50 exposed from the joining member. The areas of the upper surface 50a and the lower surface 50b of the light-transmitting member 50 after the removing step are smaller than those before the removing step. Furthermore, the removing step makes the side surface 50c of the light-transmitting member 50 and the side surface 40c of the joining member 40 at least partially flush with each other. Furthermore, in the removing step, a portion of the first covering member 61 may be removed along with the joining member 40 and the light-transmitting member 50. In this case, for example, the side surface 50c of the light-transmitting member 50, the side surface 40c of the joining member 40, and the side surface 61c of the first covering member 61 at least partially flush with each other.

[0070] When removing a portion of the bonding member 40 and the light-transmitting member 50, the rotary blade 350 may reach the surface of the wiring substrate 10. In this case, the entire side surface 61c of the first covering member 61 may be flush with the side surface 50c of the light-transmitting member 50 and the side surface 40c of the bonding member 40. Furthermore, the first covering member 61 covering the lower surface 20b of the light-emitting element 20 may be separated from the first covering member 61 covering the lower surface of the protection element 30, etc.

[0071] 3K, after the cutting step, the entire lower surface 50b of the light-transmitting member 50 exposed from the light-emitting element 20 is covered with the joining member 40. That is, even if the corners 55 located at the four corners are not completely covered with the joining member 40 as shown in FIG. 3G, the uncovered portions can be removed, and therefore the entire lower surface 50b of the light-transmitting member 50 can be covered with the joining member 40. This makes it easier to guide the light emitted by the light-emitting element 20 to the light-transmitting member 50, thereby improving the light extraction efficiency of the light-emitting device 1.

[0072] Note that by performing a step of removing a portion of the bonding member 40 and the light-transmitting member 50 after the step of arranging the first covering member 61, the light-emitting element 20 can be firmly fixed to the wiring substrate 10 by an anchor effect when removing the bonding member 40 and the light-transmitting member 50. In addition, it is possible to reduce the adhesion of foreign matter generated when removing the portion of the bonding member 40 and the light-transmitting member 50 to the upper surface of the wiring substrate 10 and the lower surface 20b of the light-emitting element 20.

[0073] (Step of placing second covering member) Next, as shown in FIG. 3L , the upper surface 50a of the light-transmitting member 50 is exposed, and a second covering member 62 is placed on the first covering member 61. The second covering member 62 exposes the upper surface 50a of the light-transmitting member 50 and covers the side surfaces 50c of the light-transmitting member 50 and the side surfaces 40c of the bonding member 40. Specifically, the uncured second covering member 62 is placed on the first covering member 61. The uncured second covering member 62 exposes the upper surface 50a of the light-transmitting member 50 and covers the side surfaces 50c of the light-transmitting member 50 and the side surfaces 40c of the bonding member 40. The uncured second covering member 62 can be placed on the first covering member 61 by, for example, potting, spraying, printing, or the like. The second covering member 62 may cover the upper surface of the protection element 30 and a portion of the side surfaces of the protection element 30. The uncured second covering member 62 is then cured to form a covering member 60 made of the cured first covering member 61 and second covering member 62. This completes the light-emitting device 1.

[0074] Before arranging the light-emitting element 20 on the wiring board 10, a light-transmitting member 50 may be arranged on the upper surface 20a of the light-emitting element 20 via a bonding member 40, the bonding member 40 may be cured, and the side surfaces 50c of the bonding member 40 and the light-transmitting member 50 may be scraped to remove parts of the bonding member 40 and the light-transmitting member 50, thereby producing a structure. Then, this structure may be arranged on the wiring board 10.

[0075] As described above, in the manufacturing method of the light-emitting device 1, the bonding member 40 is caused to creep up onto the side surface 50c of the light-transmitting member 50, the bonding member 40 is cured, and then the bonding member 40 covering the side surface 50c of the light-transmitting member 50 and the side surface 50c of the light-transmitting member 50 that was covered by the bonding member 40 are scraped off, thereby removing a portion of the bonding member 40 and the light-transmitting member 50. As a result, in the light-emitting device 1, the side surface 50c of the light-transmitting member 50 can be exposed from the bonding member 40. Furthermore, the widths of the light-transmitting member 50 in the X and Y directions can be made substantially the same as the widths of the light-emitting element 20 in the X and Y directions, which allows for improved brightness of the light-emitting device 1, as described above. Furthermore, the upper surface 20a of the light-emitting element 20 is not exposed from the light-transmitting member 50. Therefore, color unevenness during light emission caused by misalignment or the like can be reduced.

[0076] <Modification> Fig. 4 is a cross-sectional view schematically showing a light-emitting device according to Modification 1 of the present embodiment. The light-emitting device 1A shown in Fig. 4 differs from the light-emitting device 1 in that the light-transmitting member 50 has a side surface 50d that is connected by a step, in that the light-transmitting member 50 has a side surface 50c that does not have a step.

[0077] In the light emitting device 1A, the side surface 50d of the light-transmissive member 50 has a first side surface 50d1 that is continuous with the upper surface 50a of the light-transmissive member 50, and a second side surface 50d2 that is located outside the first side surface 50d1 and is continuous with the lower surface 50b of the light-transmissive member 50. The second side surface 50d2 can be provided in a frame shape that surrounds the outside of the first side surface 50d1 in a top view.

[0078] In a cross-sectional view, the side of the first side surface 50d1 connected to the second side surface 50d2 may be a concave curve, a straight line inclined relative to the upper surface 50a, or a straight line parallel to the upper surface 50a. In a cross-sectional view, the second side surface 50d2 may be a straight line perpendicular to the upper surface 50a. The second side surface 50d2 and the side surface 40c of the joining member 40 may be flush with each other, for example.

[0079] In the light emitting device 1A, the area of ​​the upper surface 50a of the light-transmitting member 50, which serves as the main light-emitting surface, is even smaller than in the light emitting device 1. Therefore, the light emitting device 1A can achieve even greater brightness than the light emitting device 1. In addition, an anchor effect occurs between the stepped side surface 50d of the light-transmitting member 50 and the second covering member 62 that contacts the side surface 50d, making it possible to improve adhesion between the light-transmitting member 50 and the second covering member 62.

[0080] Hereinafter, each manufacturing step of the manufacturing method of the light emitting device according to the first modification of the embodiment will be described with reference to the drawings. Figures 5A to 5D are schematic views illustrating the manufacturing steps of the light emitting device according to the first modification of the embodiment. Specifically, Figures 5A to 5D are cross-sectional views schematically illustrating an example of the manufacturing steps of the light emitting device according to the first modification of the embodiment.

[0081] In the manufacturing method of the light emitting device 1A, the steps similar to those in FIGS. 3A to 3H are performed, namely, a step of preparing a light emitting element, a step of preparing a wiring board, a step of arranging the light emitting element, a step of arranging a bonding member, a step of hardening the bonding member, and a step of arranging a first covering member, and then, as shown in FIGS. 5A to 5D, a step of processing the light-transmitting member 50 is performed so that the area of ​​the upper surface 50a of the light-transmitting member 50 is smaller than the area of ​​the lower surface 50b.

[0082] In the process of processing the light-transmitting member 50, first, as shown in FIGS. 5A and 5B, a rotary blade 350 of a predetermined thickness is used to remove the upper side of the side surface 50c of the light-transmitting member 50, thereby forming a first side surface 50d1 that is continuous with the upper surface 50a of the light-transmitting member 50. However, the position of the rotary blade 350 in the Z direction is controlled so that the tip of the rotary blade 350 does not reach the lower surface 50b of the light-transmitting member 50. Note that processing may also be performed using a grindstone or the like. In this process, removal of the light-transmitting member 50 may also be performed using an alignment mark 300 shown in FIG. 3C.

[0083] Next, as shown in FIGS. 5C and 5D, the lower portion of the side surface 50c of the light-transmitting member 50 is removed to form a second side surface 50d2 that is located outside the first side surface 50d1 in a top view and is continuous with the lower surface 50b of the light-transmitting member 50. When removing the lower portion of the side surface 50c of the light-transmitting member 50, the bonding member 40 covering the side surface 50c is also removed, so that the second side surface 50d2 and the side surface 40c of the bonding member 40 become flush with each other. The processing method for the light-transmitting member 50 is the same as in FIGS. 5A and 5B. Note that when removing the lower portion of the side surface 50c of the light-transmitting member 50, the rotary blade 350 may reach the surface of the wiring substrate 10. Thereafter, as shown in FIG. 3L, a step of disposing a second covering member is performed to complete the light-emitting device 1A.

[0084] In addition, the manufacturing method of light emitting device 1A may include the steps of preparing a light emitting element, preparing a wiring substrate, arranging the light emitting element, arranging a bonding member, curing the bonding member, arranging a first covering member, and removing the first covering member, all of which are shown in Figures 3A to 3J, and then the step of removing the upper side of the light-transmitting member, as shown in Figures 5A and 5B. In this case, the step of removing the upper side of the light-transmitting member produces a structure identical to that shown in Figure 5D, which is obtained by the step of removing the lower side of the light-transmitting member described above. Thereafter, the step of arranging a second covering member, as shown in Figure 3L, is performed to complete light emitting device 1A.

[0085] The light emitting device 1A may be manufactured by the following manufacturing method. Figures 6A to 6C are schematic views illustrating another example of the manufacturing process for the light emitting device according to Variation 1 of this embodiment. Specifically, Figures 6A to 6C are cross-sectional views schematically illustrating another example of the manufacturing process for the light emitting device according to Variation 1 of this embodiment.

[0086] First, as in FIGS. 3A to 3D , the steps of preparing a light-emitting element, preparing a wiring board, arranging the light-emitting element, and arranging a bonding member are performed. Then, as shown in FIG. 6A , a light-transmitting member 50 is prepared whose side surfaces have been processed to have steps. The light-transmitting member 50 is then arranged on the upper surface 20a of the light-emitting element 20 via an uncured bonding member 40. The side surface 50d of the light-transmitting member 50 prepared here has a first side surface 50d1 that is continuous with the upper surface 50a of the light-transmitting member 50, and a second side surface 50d2 that is located outward from the first side surface 50d1 and is continuous with the lower surface 50b of the light-transmitting member 50. Furthermore, the light-transmitting member 50 prepared here has a larger area of ​​the lower surface 50b and the same area of ​​the upper surface 50a as the light-transmitting member 50 that will ultimately be mounted in the light-emitting device 1A.

[0087] 3F to 3H, after performing the steps of hardening the bonding member and arranging the first covering member, as shown in FIGS. 6B and 6C, a rotary blade 350 of a predetermined thickness is used to cut the bonding member 40 covering the second side surface 50d2 of the light-transmitting member 50 and the second side surface 50d2 of the light-transmitting member 50 that was covered by the bonding member 40, thereby removing a portion of the bonding member 40 and the light-transmitting member 50. Note that the processing may be performed using a laser, a cutter, or the like. In this step, the bonding member 40 and the light-transmitting member 50 may be removed using an alignment mark 300 shown in FIG. 3C.

[0088] 6C, the area of ​​the underside 50b of the light-transmitting member 50 after the step of removing the lower side of the side of the light-transmitting member is smaller than the area of ​​the underside 50b of the prepared light-transmitting member 50 in FIGS. 6A and 6B. In addition, the second side surface 50d2 and the side surface 40c of the joining member 40 become flush with each other. Thereafter, as shown in FIG. 3L, a step of arranging a second covering member is performed, thereby completing the light emitting device 1A.

[0089] Fig. 7 is a cross-sectional view schematically showing a light emitting device according to Modification 2 of the present embodiment. The light emitting device 1B shown in Fig. 7 differs from the light emitting device 1 in which the bonding member 40 covers the side surface 20c of the light emitting element 20 in that the bonding member 40 does not cover the side surface 20c of the light emitting element 20.

[0090] In the light emitting device 1B, the joining member 40 is disposed between the upper surface 20a of the light emitting element 20 and the lower surface 50b of the light-transmitting member. The joining member 40 is not disposed on the side surface 20c of the light emitting element 20 or the side surface 50c of the light-transmitting member. In the illustrated example, the side surface 20c of the light emitting element 20 and the side surface 50c of the light-transmitting member are covered with a second covering member 62. The lower end side of the side surface 20c of the light emitting element 20 may be covered with a first covering member 61. The side surface 50c of the light-transmitting member 50 and the side surface 20c of the light emitting element 20 are flush with each other. The side surface 50c of the light-transmitting member 50, the side surface 20c of the light emitting element 20, and the side surface 40c of the joining member 40 may also be flush with each other.

[0091] In the light emitting device 1B, the widths in the X and Y directions of the lower surface 50b of the light-transmitting member 50 are approximately the same as the widths in the X and Y directions of the upper surface 20a of the light emitting element 20, which makes it easier for more of the light emitted from the light emitting element 20 to be incident on the light-transmitting member 50. Furthermore, in the light emitting device 1B, the area of ​​the upper surface 50a of the light-transmitting member 50, which serves as the main light-emitting surface, is even smaller than in the light emitting device 1. As a result, the light emitting device 1B can achieve even greater brightness than the light emitting device 1.

[0092] To manufacture light emitting device 1B, the steps of preparing a light emitting element, preparing a wiring substrate, arranging the light emitting element, arranging a bonding member, curing the bonding member, and arranging a first covering member are performed as shown in Figures 3A to 3H, and then the step of removing is performed as shown in Figure 3I. However, unlike the case of manufacturing light emitting device 1, the removing step involves removing bonding member 40 covering the side surface 50c of light-transmitting member 50, the side surface 50c of light-transmitting member 50 that was covered by bonding member 40, and the bonding member 40 covering the side surface 20c of light emitting element 20. Thereafter, the step of arranging a second covering member shown in Figure 3L is performed, thereby completing light emitting device 1B.

[0093] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0094] In addition to the above-described embodiments, the following supplementary notes are also disclosed. (Appendix 1) providing a light-emitting element; placing an uncured bonding material on an upper surface of the light emitting element; a step of placing a light-transmitting member on an upper surface of the light-emitting element via the joining member, and pressing the joining member with the light-transmitting member to cause the joining member to creep up onto a side surface of the light-transmitting member; hardening the joining member; a step of scraping the joining member covering the side surface of the light-transmitting member and the side surface of the light-transmitting member that was covered by the joining member, thereby removing a part of the joining member and the light-transmitting member. (Appendix 2) 2. The method for manufacturing a light emitting device according to claim 1, further comprising, before the removing step, a step of arranging a first covering member that covers at least a portion of the bonding member. (Appendix 3) 3. The method for manufacturing a light emitting device according to claim 2, wherein in the removing step, a part of the first covering member is removed together with the joining member and the light-transmitting member. (Appendix 4) 4. The method for manufacturing a light emitting device according to claim 2, further comprising, after the removing step, a step of exposing an upper surface of the light-transmitting member and arranging a second covering member that covers a side surface of the light-transmitting member and a side surface of the joining member. (Appendix 5) 5. A method for manufacturing a light emitting device according to any one of claims 1 to 4, wherein the removing step includes a step of processing the light-transmitting member so that the area of ​​the upper surface of the light-transmitting member is smaller than the area of ​​the lower surface. (Appendix 6) The step of processing the light-transmitting member includes: removing an upper portion of a side surface of the light-transmitting member to form a first side surface that is continuous with the upper surface of the light-transmitting member; and removing a lower side of the side of the translucent member to form a second side that is positioned outward from the first side in a top view and is continuous with the lower surface of the translucent member. (Appendix 7) Before the step of placing the joining member, preparing a wiring substrate; and arranging the light-emitting element on the wiring substrate, 7. The method for manufacturing a light emitting device according to claim 1, wherein the wiring substrate includes an alignment mark used for aligning the light emitting element. (Appendix 8) 8. The method for manufacturing a light emitting device according to claim 7, wherein the bonding member is disposed apart from the wiring substrate. (Appendix 9) 9. The method for manufacturing a light emitting device according to claim 7, wherein in the removing step, the joining member and the light-transmitting member are removed using the alignment marks. (Appendix 10) A light-emitting element; a bonding member covering at least a portion of a side surface and an upper surface of the light emitting element; a light-transmitting member disposed on an upper surface of the light-emitting element via the joining member; a first covering member that covers a lower surface of the light emitting element and is in contact with the bonding member; a second covering member that exposes an upper surface of the light-transmitting member, covers a side surface of the light-transmitting member and a side surface of the joining member, and is in contact with the first covering member, The light emitting device, wherein a side surface of the light-transmitting member and a side surface of the joining member are at least partially flush with each other. (Appendix 11) 11. The light emitting device according to claim 10, wherein the side surface of the light-transmitting member, the side surface of the joining member, and the side surface of the first covering member are at least partially flush with each other. (Appendix 12) the side surface of the light-transmitting member includes a first side surface that is continuous with an upper surface of the light-transmitting member, and a second side surface that is located outward from the first side surface and is continuous with a lower surface of the light-transmitting member; 12. The light emitting device according to claim 10, wherein the second side surface and the side surface of the joining member are flush with each other. [Explanation of symbols]

[0095] 1.1A Light Emitting Device 10. Wiring board 11 Base material 12 Top wiring 13 Bottom wiring 20 Light-emitting element 20a top surface 20b Bottom side 20c side 25 Conductive joining material 30 Protection element 40 Joint material 40c side 50 Translucent material 50a top 50b Bottom side 50c,50d side 50d1 First side 50d2 2nd side 55 Corner 60 Covering material 61 First covering member 61c Side 62 Second covering member 300 Alignment Mark 350 rotary blade

Claims

1. providing a light-emitting element; placing an uncured bonding material on an upper surface of the light emitting element; a step of placing a light-transmitting member on an upper surface of the light-emitting element via the joining member, and pressing the joining member with the light-transmitting member to cause the joining member to creep up onto a side surface of the light-transmitting member; hardening the joining member; a step of scraping the joining member covering the side surface of the light-transmitting member and the side surface of the light-transmitting member that was covered by the joining member, thereby removing a part of the joining member and the light-transmitting member.

2. The method for manufacturing a light emitting device according to claim 1 , further comprising, before the removing step, a step of arranging a first covering member that covers at least a part of the bonding member.

3. The method for manufacturing a light emitting device according to claim 2 , wherein in the removing step, a part of the first covering member is removed together with the joining member and the light-transmitting member.

4. 3. The method for manufacturing a light emitting device according to claim 2, further comprising, after the removing step, a step of exposing an upper surface of the translucent member and arranging a second covering member that covers a side surface of the translucent member and a side surface of the joining member.

5. The method for manufacturing a light emitting device according to claim 1 , wherein the removing step includes the step of processing the light transmissive member so that an area of ​​an upper surface of the light transmissive member is smaller than an area of ​​a lower surface of the light transmissive member.

6. The step of processing the light-transmitting member includes: removing an upper portion of a side surface of the light-transmitting member to form a first side surface that is continuous with the upper surface of the light-transmitting member; a step of removing a lower side of the side of the translucent member and forming a second side that is positioned outward from the first side in a top view and is continuous with the lower surface of the translucent member.

7. Before the step of placing the joining member, preparing a wiring substrate; and arranging the light-emitting element on the wiring substrate, The method for manufacturing a light emitting device according to claim 1 , wherein the wiring substrate includes an alignment mark used for aligning the light emitting element.

8. The method for manufacturing a light emitting device according to claim 7 , wherein the bonding member is disposed apart from the wiring substrate.

9. The method for manufacturing a light emitting device according to claim 7 , wherein in the removing step, the joining member and the light-transmitting member are removed using the alignment mark.

10. A light-emitting element; a bonding member covering at least a portion of a side surface and an upper surface of the light emitting element; a light-transmitting member disposed on an upper surface of the light-emitting element via the joining member; a first covering member that covers a lower surface of the light emitting element and is in contact with the bonding member; a second covering member that exposes an upper surface of the light-transmitting member, covers a side surface of the light-transmitting member and a side surface of the joining member, and is in contact with the first covering member, The light emitting device, wherein a side surface of the light-transmitting member and a side surface of the joining member are at least partially flush with each other.

11. The light emitting device according to claim 10 , wherein a side surface of the translucent member, a side surface of the joining member, and a side surface of the first covering member are at least partially flush with each other.

12. the side surface of the light-transmitting member includes a first side surface that is continuous with an upper surface of the light-transmitting member, and a second side surface that is located outward from the first side surface and is continuous with a lower surface of the light-transmitting member, The light emitting device according to claim 10 , wherein the second side surface and the side surface of the joining member are flush with each other.

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