Component mounting apparatus and data acquisition method

Abstract

To save labor for data acquisition work used for detecting the mounting failure of a lead component.SOLUTION: A component mounting device 102 includes a component feeding unit 5, a mounting head 20, a load detection part (a current detection part 36a) for detecting a load acting on the mounting head 20 during component mounting, an encoder 24a for detecting the height of the mounting head 20, a main control part 32 for controlling the operation of the mounting head 20, and a storage part 34 for storing determination date D3. The main controller 32 executes a mounting process of taking out the lead component C from the component feeding unit 5 by the placing head 20 and mounting the lead component C on the substrate P, and a storage process of storing the maximum load Nm acting on the placing head 20 during the mounting process and the datum for determination D3 including the height of the placing head 20 when the maximum load is generated in the storage section 34.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus and a data acquisition method for acquiring data used to detect mounting defects of lead components. [Background technology]

[0002] When mounting a lead component on a board with its lead terminals inserted into terminal holes (through holes) in the board, mounting defects can occur, such as the lead terminals not being properly inserted into the terminal holes. Patent Document 1 discloses a technique for preventing such mounting defects.

[0003] Patent Document 1 discloses a component mounting device that detects improper insertion of lead terminals by detecting the load acting on a mounting head when the mounting head reaches a predetermined height during the mounting operation of lead components using the mounting head and comparing the load with a threshold value. This component mounting device can detect improper insertion of lead terminals early during the mounting operation of lead components. This makes it possible to prevent mounting defects and lead terminal breakage. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-92278 Summary of the Invention [Problem to be solved by the invention]

[0005] The conventional component mounting device detects mounting defects based on the height and load of the mounting head, which vary for each component type depending on various conditions such as the length, shape, and material of the lead terminals and the size of the terminal holes on the board.

[0006] Therefore, the head height and load are measured manually in advance using a force gauge (push-pull gauge) and a measuring jig to detect insertion errors, and this data is used to control the component mounting equipment. However, there are many types of lead components, and it takes time and effort to perform this data acquisition work for each type of component.

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a technique that contributes to reducing the labor required for acquiring data used to detect mounting defects in lead components. [Means for solving the problem]

[0008] In order to solve the above problem, a component mounting apparatus according to one aspect of the present invention comprises a component supply unit, a movable head that picks up components from the component supply unit and mounts them on a board, a load detection unit that detects a load acting on the head during component mounting, a position detection unit that detects the height of the head, a control unit that controls the operation of the head, and a memory unit that can store judgment data for detecting mounting defects of lead components having lead terminals, wherein the control unit executes a data acquisition process that includes: a mounting process in which the head picks up lead components from the component supply unit and mounts the lead components on a board with the lead terminals inserted into terminal holes; and a storage process in which, during the mounting process, the maximum load detected by the load detection unit and the head height detected by the position detection unit when the maximum load occurs are acquired, and the judgment data including the maximum load and the head height are stored in the memory unit.

[0009] According to this component mounting device, the data acquisition process is performed to automate the acquisition of judgment data that can be used to detect mounting defects of lead components, i.e., to determine insertion defects of lead terminals. That is, in this component mounting device, the head performs the mounting process of picking up lead components from the component supply unit and mounting them on the board, and the maximum load acting on the head during this mounting process is detected, and judgment data including this maximum load and the head height at which this maximum load occurs is stored in the memory unit. This eliminates the need for manual data acquisition work as in the past, thereby reducing the labor required for data acquisition work.

[0010] In the component mounting apparatus, the control unit may be configured to execute the data acquisition process for the lead components that are mounted on the product boards during production of the product boards.

[0011] In this configuration, the data acquisition process is performed using lead components that are mounted on the product boards during production, which allows for efficient acquisition of data for evaluation during production of the product boards.

[0012] In this case, the control unit may be configured to determine the maximum load of the judgment data based on the maximum load detected by the load detection unit in each of multiple lead component mounting processes performed during the production of the product board, and to determine the head height of the judgment data based on the head height corresponding to each of the maximum loads.

[0013] In this configuration, the maximum load for the determination data is calculated based on the maximum load detected in each of the multiple lead component mounting processes, and the head height for the determination data is calculated based on the head height corresponding to each maximum load, thereby improving the reliability of the determination data and ultimately improving the accuracy of detecting lead component mounting defects.

[0014] In the component mounting device, the control unit can be configured to determine that the mounting has failed and execute a predetermined error processing if, during the production of a product substrate, the detected load of the load detection unit becomes equal to or greater than the maximum load of the judgment data before the head height reaches the head height of the judgment data during the mounting process of a lead component, which is a component mounted on the product substrate.

[0015] For example, if the lead terminal is not inserted into the terminal hole, if the lead terminal is bent in the terminal hole, or if a foreign object is sandwiched between the lead component and the board, the detection load will exceed the maximum load before the head reaches the head height specified in the judgment data. Therefore, with the above configuration, it is possible to appropriately detect mounting defects in lead components using the judgment data during the production of product boards.

[0016] In this case, when the maximum load of the judgment data is defined as a first load, the control unit may be configured to store the judgment data in the memory unit, which further includes a second load lower than the first load, and to determine that the mounting is defective and execute the error processing if, during the mounting process of the lead component, the detected load of the load detection unit becomes equal to or greater than the second load before the head reaches the head height of the judgment data.

[0017] In this configuration, a mounting defect is determined when the load detection unit detects a second load that is lower than the first load. Therefore, by appropriately setting the second load, it is possible to detect mounting defects in lead components while avoiding problems such as breakage of lead terminals.

[0018] In the component mounting device, the control unit may be configured to store the detected load of the load detection unit at the head height of the judgment data in the memory unit as history data of the product substrate during the mounting process of lead components, which are mounted components on the product substrate, during production of the product substrate.

[0019] Such historical data is useful for analyzing defects, etc., after the product board is sold, and therefore contributes to improving the traceability of product boards on which lead components are mounted.

[0020] In the above-mentioned component mounting device, the memory unit may store the judgment data for each type of lead component, and the control unit may be configured to execute the following processes: a process of acquiring specification information for a new lead component for which the judgment data is not stored; a process of identifying, based on the specification information, a lead component whose specifications are similar to those of the new lead component from among the lead components related to the judgment data stored in the memory unit; a process of estimating, based on the judgment data for the identified lead component, the maximum load of the new lead component and the head height at which the maximum load occurs; and a process of storing the judgment data including the estimated maximum load and head height in the memory unit as the judgment data for the new lead component.

[0021] In this configuration, the determination data for a new lead component is estimated based on the existing determination data stored in the memory unit, making it possible to obtain the determination data for a new lead component without actually mounting the lead component on a board.

[0022] On the other hand, a data acquisition method according to one aspect of the present invention is a method for acquiring judgment data for detecting defective mounting of lead components having lead terminals in a component mounting device having a component supply unit and a movable head that picks up components from the component supply unit and mounts them on a board, and includes the steps of: using the head to pick up a lead component from the component supply unit and mount the lead component on a board with the lead terminal properly inserted into a terminal hole; detecting the maximum load acting on the head when mounting the lead component on the board and detecting the height of the head when the maximum load occurs; and storing judgment data including the maximum load and the height of the head when the maximum load occurs.

[0023] According to this method, it is possible to easily obtain, using a component mounting device, determination data that can be used to detect mounting defects in lead components, that is, to determine whether or not a lead terminal is inserted properly. [Effects of the Invention]

[0024] As described above, the present invention can provide a technology that contributes to reducing the labor required for detecting mounting defects in lead components, i.e., acquiring data used to determine insertion defects of lead terminals. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a diagram showing a component mounting system including a component mounting device according to the present invention. [Figure 2] FIG. 2 is a plan view of the component mounting device. [Figure 3] FIG. 2 is an enlarged front view showing a head unit portion of the component mounting apparatus. [Figure 4] FIG. 2 is a block diagram showing a control system of the component mounting apparatus. [Figure 5] 10 is a flowchart of a data acquisition process. [Figure 6] FIG. 10 is a diagram showing the relationship between head height and load (straight part). [Figure 7] FIG. 10 is a diagram showing the relationship between head height and load (kinked parts). [Figure 8] FIG. 10 is a diagram illustrating an example of determination data. [Figure 9] 10 is a flowchart of a mounting defect detection process. [Figure 10] 10 is a flowchart of a mounting defect detection process. [Figure 11] 10 is a flowchart of a data acquisition process according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0027] [Component mounting system configuration] 1 is a block diagram showing a component mounting system including a component mounting apparatus according to the present invention. The component mounting system 100 includes a component mounting apparatus 102, an inspection apparatus 103, and a management apparatus 101 connected to the component mounting apparatus 102 and the inspection apparatus 103 so as to be capable of data communication.

[0028] The component mounting device 102 is a device that mounts (loads) components such as electronic components onto a substrate P such as a printed wiring board. The inspection device 103 is a device that inspects the component mounting state on the substrate P after the component mounting process has been performed by the component mounting device 102. The management device 101 is configured, for example, by a personal computer, and is provided so as to be able to comprehensively manage various types of information in the component mounting system 100.

[0029] [Overall configuration of component mounting apparatus 102] Fig. 2 is a plan view showing the component mounting apparatus 102, and Fig. 3 is an enlarged front view showing a portion of the component mounting apparatus 102 that includes a head unit 6 (described later). In Figs. 2 and 3, directional relationships are shown using XY Cartesian coordinates that are orthogonal to each other on a horizontal plane.

[0030] The component mounting apparatus 102 comprises a main body frame 2, a board transport mechanism 3, a component supply unit 5, and a head unit 6. The main body frame 2 is a structure in which each component is arranged. The board transport mechanism 3 comprises a pair of conveyors 4 extending in the X direction. The board P is transported in the X direction along the conveyors 4 and is positioned at a predetermined working position by a board support unit (not shown).

[0031] The component supply units 5 (corresponding to the "component supply section" of the present invention) are arranged on both sides of the board transport mechanism 3 in the Y direction. The component supply units 5 are provided with feeders that supply components.

[0032] Specifically, multiple tape feeders 5a are arranged side by side in the component supply unit 5 on one side (the upper side in Figure 2). Each tape feeder 5a has a reel around which a component storage tape is wound, storing components at predetermined intervals, and supplies the components to a predetermined component supply position by feeding the component storage tape from the reel. The tape feeder 5a is used to supply mainly chip components such as ICs, transistors, and capacitors.

[0033] The component supply unit 5 on the other side (the lower side in FIG. 2) has a tray feeder 5b in addition to the tape feeder 5a. The tray feeder 5b is used to supply lead components with lead terminals, such as ICs such as DIPs (Dual In-Line Packages) and SIPs (Single In-Line Packages), or resistors, capacitors, coils, and other components with lead terminals, which are mounted on the substrate P with the lead terminals inserted into terminal holes (through holes) of the substrate P.

[0034] The head unit 6 picks up components from the feeders 5a, 5b of the component supply unit 5, moves to the work position, and mounts (loads) the components on the substrate P. The head unit 6 is held by a movable frame 11. A pair of fixed rails 10 extending in the Y direction and a ball screw shaft 12 driven to rotate by a Y-axis servo motor 13 are arranged on the main body frame 2. The movable frame 11 is placed on the fixed rails 10, and a nut portion provided on this movable frame 11 is threadedly engaged with the ball screw shaft 12. A guide member 14 extending in the X direction and a ball screw shaft 15 driven by an X-axis servo motor 16 are arranged on the movable frame 11. The head unit 6 is movably held by this guide member 14, and a nut portion provided on this head unit 6 is threadedly engaged with the ball screw shaft 15.

[0035] That is, the Y-axis servo motor 13 is operated to move the moving frame 11 in the Y direction, and the X-axis servo motor 16 is operated to move the head unit 6 in the X direction relative to the moving frame 11. Therefore, the head unit 6 can move in the Y direction in conjunction with the movement of the moving frame 11, and can also move in the X direction along the moving frame 11. With this configuration, the head unit 6 moves between the component supply unit 5 and the board P placed at the work position.

[0036] As shown in FIG. 3, the head unit 6 is equipped with a plurality of mounting heads 20 (corresponding to the "head" of the present invention). Each mounting head 20 has a suction nozzle 22 at its tip (lower end). The suction nozzle 22 is a nozzle that can suck and hold components supplied by the feeders 5a and 5b. The suction nozzle 22 can be connected to either a negative pressure generator, a positive pressure generator, or the atmosphere via an electric switching valve. In other words, supplying negative pressure to the suction nozzle 22 enables the suction nozzle 22 to suck and hold a component, and then supplying positive pressure releases the suction and holding of the component.

[0037] Each mounting head 20 can move up and down vertically relative to the frame of the head unit 6, and can also rotate around a head axis extending in the vertical direction. Each mounting head 20 is driven to move up and down individually by an elevation drive mechanism using a Z-axis servo motor 24 as a drive source. In addition, each mounting head 20 is driven to rotate together by a rotation drive mechanism using an R-axis servo motor 25 (shown in FIG. 4) as a drive source.

[0038] Each mounting head 20 can be raised and lowered between a suction-enabled position where the suction nozzle 22 can suction-hold a component and a retracted position above the suction-enabled position. That is, when picking a component from feeders 5a and 5b, each mounting head 20 descends from the retracted position to the suction-enabled position to suction-hold the component, and then ascends from the suction-enabled position to the retracted position. Furthermore, each mounting head 20 can be raised and lowered between a mounting position where the component suction-held by the suction nozzle 22 can be mounted at a target mounting position on the substrate P, and the retracted position. That is, when mounting a component on the substrate P, each mounting head 20 descends from the retracted position to the mounting position to release the component on the substrate P, and then ascends from the mounting position to the retracted position.

[0039] [Control configuration of component mounting apparatus 102] Fig. 3 is a block diagram showing a control system of the component mounting apparatus 102. The component mounting apparatus 102 includes a control unit 30 shown in Fig. 3. The control unit 30 includes a main control unit 32, a storage unit 34 connected to the main control unit 32 via a bus 33, a drive control unit 36, an input / output unit 38, and a communication unit 40.

[0040] The main control unit 32 comprehensively controls the operation of the component mounting apparatus 102. The main control unit 32 is configured to include one or more ICs having a CPU, ROM, RAM, etc. as a processor, and other memories, etc. The processor may be configured to perform processing using a single CPU, multiple CPUs, or a hardware circuit such as an ASIC, or may be configured to perform processing in cooperation with a CPU and a hardware circuit.

[0041] The main control unit 32 controls the drive control unit 36 ​​according to the programs and data stored in the ROM and the memory unit 34 described later by the CPU, performs a predetermined component mounting process in which components are taken out from the component supply unit 5 and mounted on the substrate P, and also performs various calculation processes related to this process.

[0042] Furthermore, the main control unit 32 executes a mounting defect detection process that detects mounting defects in lead components having lead terminals, and a data acquisition process that acquires judgment data D3 (described later) used in this mounting defect detection process, as well as various arithmetic processes related to these processes. The mounting defect detection process is a process that detects mounting defects in lead components, specifically, a process that mainly detects insertion defects of lead terminals into terminal holes when mounting the lead components on the substrate P. The mounting defect detection process and the data acquisition process will be described in detail later.

[0043] The storage unit 34 is configured with a hard disk, memory, etc., and stores various programs and data required to control the operation of the component mounting apparatus 102. For example, data such as board data D1, component data D2, determination data D3, and history data D4 are stored in the storage unit 34.

[0044] The board data D1 is data of the board P that is referenced by the main control unit 32 in the component mounting process. The board data D1 is composed of component pickup position (coordinate) information, component mounting position (coordinate) information, terminal hole size information, and the like.

[0045] Component data D2 is data made up of parameters for identifying a component. For example, component data D2 is made up of a component name indicating the type of component, the component's external dimensions in the X and Y directions, and the component's thickness (external dimension in the Z direction). Note that the external dimensions and thickness of a lead component refer to the external dimensions and thickness of the component body (e.g., the package portion other than the lead terminals). For lead components, the component data D2 also includes the shape, thickness (diameter), length, and so on of the lead terminals. In other words, this component data D2 can be said to be component specification information.

[0046] The determination data D3 is data configured from information acquired in the data acquisition process. The determination data D3 will be described in detail later together with the data acquisition process.

[0047] The history data D4 is data configured from information acquired for each board P in each process executed by the component mounting device.

[0048] The drive control unit 36 ​​controls the Y-axis servo motor 13 and the X-axis servo motor 16 to control the movement of the head unit 6, and also controls the Z-axis servo motor 24 and the R-axis servo motor 25 to control the elevation and rotation of each head 20. The drive control unit 36 ​​performs feedback control of the movement of the head unit 6 and the mounting head 20 based on position information output from the encoders 13a, 16a, 24a, and 25a built into each servo motor 13, 16, 24, and 25. The drive control unit 36 ​​also has a current value detection unit 36a that detects the control current values ​​of each servo motor 13, 16, 24, and 25. The current value detection unit 36a is used to measure the load acting on the mounting head 20. Specifically, in the data acquisition process and mounting defect detection process described below, when a lead component is mounted on the substrate P, the load acting on the head 20 is determined based on the control current value of the Z-axis servo motor 24 detected by the current value detection unit 36a. In this example, the current value detector 36a corresponds to the "load detector" of the present invention.

[0049] The input / output unit 38 is a so-called interface. An operation unit 50 is connected to the input / output unit 38. The operation unit 50 includes a display unit 51 such as a liquid crystal display, and an input unit 52 such as a touch panel, keyboard, or mouse. An operator can operate the operation unit 50 to make various settings.

[0050] The communication unit 40 is connected to the inspection device 103 and the management device 101 via a communication line CL so as to be able to perform data communication, and controls communication between the inspection device 103 and the management device 101 .

[0051] [Data acquisition process] The data acquisition process is a process for acquiring judgment data D3 used in the lead component mounting defect detection process described below. More specifically, it is a process for acquiring data used in the mounting defect detection process, creating judgment data D3 including that data, and storing the judgment data in the storage unit 34. As described above, the data acquisition process is executed by the main control unit 32, and the judgment data D3 is acquired for each type of component. Here, a case where the data acquisition process is performed during non-production times of the component mounting device 102 will be described.

[0052] 5 is a flowchart showing the data acquisition process. The data acquisition process starts when the operator operates operation unit 50 to register (input) the part names of one or more lead parts to be acquired, and selects the data acquisition process command displayed on display unit 51. At this time, the operator prepares the lead parts to be acquired in tray feeder 5b in advance.

[0053] When processing starts, the main control unit 32 operates the substrate transport mechanism 3 to load the substrate P into the machine. When the substrate P is loaded into the work position and positioned (step S1), the main control unit 32 sets the component counter m to "1" (step S3). The substrate P can be a product substrate or a dummy substrate equivalent to a product substrate.

[0054] Next, the main control unit 32 determines whether or not component data D2 related to the new lead component from which data is to be acquired is stored in the storage unit 34 (step S5). If the determination is No, the main control unit 32 causes the display unit 51 to display a screen requesting input of component data D2 (step S19). When the operator operates the input unit 52 to input component data D2 (Yes in step S21), the process proceeds to step S7.

[0055] If the processing in step S5 or step S21 is judged to be Yes, the main control unit 32 executes component mounting processing for the lead component for which data is to be acquired, and acquires the maximum load Nm acting on the mounting head 20 during the mounting operation of the lead component and the height Zm of the mounting head 20 at which the maximum load occurs (maximum load occurrence height Zm) (step S7).

[0056] In this case, the main control unit 32 calculates the maximum load Nm acting on the mounting head 20 by converting the control current value of the Z-axis servo motor 24 detected by the current value detection unit 36a into a load value, and obtains the maximum load generation height Zm based on the output of the encoder 24a built into the Z-axis servo motor 24.

[0057] The height Zm of the mounting head 20 at which the maximum load Nm occurs differs depending on whether the lead terminal is a straight lead component or a lead component that has a kink portion midway through the lead terminal, as shown in Figures 6 and 7. The kink portion is an enlarged or bent portion formed midway through the lead terminal.

[0058] 6 is a diagram showing the relationship between the height (Z-axis position) of the mounting head 20 and the load when mounting a lead component C (sometimes referred to as a straight component C1 for convenience) having straight lead terminals Ct. Specifically, the diagram shows the relationship between the height of the mounting head 20 and the load when the lead terminals Ct are correctly inserted into the terminal holes H of the substrate P, thereby successfully mounting the straight component C1 on the substrate P. The height of the mounting head 20 is a height controlled by the main control unit 32.

[0059] In the mounting operation of the straight component C1, the load is approximately zero from the descent start position Z1, i.e., the retracted position, to a mounting height Z3 at which the straight component C1 is mounted on the substrate P, and a maximum load Nm occurs at the mounting height Z3. The mounting height Z3 is the target height of the mounting head 20 in the mounting operation, and is set to a position slightly lower than the height at which the component body of the straight component C1 contacts the upper surface of the substrate P.

[0060] Therefore, when the data acquisition target is a straight part C1, the main control unit 32 acquires the mounting load N3 at the mounting height Z3 as the maximum load Nm, and acquires the mounting height Z3 at which the maximum load Nm occurs as the maximum load occurrence height Zm. Note that, because the movement of the mounting head 20 is feedback-controlled based on the position information of the encoder 24a, the mounting height Z3 and the maximum load occurrence height Zm are substantially the same.

[0061] Figure 7 is a diagram showing the relationship between the height and load of the mounting head 20 during the mounting operation of a lead component C (sometimes referred to as a kinked component C2) whose lead terminal Ct has a kink portion. Similar to Figure 6, this figure shows the relationship between the height and load of the mounting head 20 when the kinked component C2 is normally mounted on the substrate P by correctly inserting the lead terminal Ct into the terminal hole H of the substrate P.

[0062] During the mounting operation of the kinked component C2, a maximum load Nm occurs between the descent start position Z1 and the mounting height Z3 at which the kinked component C2 is mounted on the substrate P. This occurs because a high load is placed on the mounting head 20 when the lead terminals Ct (kinked portions) are press-fit into the terminal holes H. That is, during the mounting operation of the kinked component C2, the load is approximately zero up to the height at which the maximum load Nm occurs, decreases slightly after the maximum load occurs, and then increases again at mounting height Z3 due to the substrate reaction force. The load at mounting height Z3, i.e., the mounting load N3, is slightly lower than the maximum load Nm.

[0063] Therefore, when the data acquisition target is a kinked part C2, the main control unit 32 acquires the maximum load Nm that occurs between the descent start position Z1 and the mounting height Z3, and acquires the height Zm of the mounting head 20 at which the maximum load Nm occurs as the maximum load occurrence height Zm.

[0064] When the processing of step S7 is completed, the main control unit 32 determines whether the component counter m is equal to the registered number M (step S9). The registered number M is the total number of lead components registered by the operator as data acquisition targets. That is, in the processing of step S9, the main control unit 32 determines whether the maximum load Nm and the maximum load occurrence height Zm have been acquired for all components registered as data acquisition targets. If the determination here is No, the main control unit 32 increments the component counter m by "1" and proceeds to step S5.

[0065] If the determination in step S9 is Yes, the main control unit 32 operates the substrate transport mechanism 3 to transport the substrate P (step S11). As a result, the substrate P is transported from the component mounting device 102 to the inspection device 103. The inspection device 103 inspects the mounting state of each lead component mounted on the substrate P. Here, it is inspected using, for example, a 3D camera or a laser displacement meter, whether the lead components C are properly mounted on the substrate P with the lead terminals Ct properly inserted into the terminal holes H of the substrate P.

[0066] The inspection results are transmitted from the inspection device 103 to the component mounting device 102, and the main control unit 32 acquires these inspection results (step S13). The main control unit 32 determines whether there are any defectively mounted components based on the inspection results (step S15), and if the determination is No, the main control unit 32 creates determination data D3 including the data acquired in the processing of step S7, i.e., the maximum load Nm and the maximum load occurrence height Zm, and stores the determination data D3 in the storage unit 34 (steps S16, S17). This completes the series of data acquisition processes.

[0067] On the other hand, if the determination in step S15 is Yes, that is, if a defectively mounted component has occurred, main control unit 32 displays information identifying the lead component in which the mounting defect occurred on display unit 51 (step S25), and then proceeds to step S16. In this case, main control unit 32 creates determination data D3 for lead components other than the lead component in which the mounting defect occurred, and stores this determination data D3 in storage unit 34.

[0068] By the above data acquisition process, judgment data D3 is acquired when the lead component is normally mounted on the board P as shown in FIGS.

[0069] 8 is a diagram showing an example of the determination data D3. As shown in the figure, the determination data D3 is configured by registering, for each component name indicating the type of lead component, information indicating the specifications of the lead component, the maximum load Nm, and the maximum load occurrence height Zm. The information indicating the specifications of the lead component is, for example, the lead shape, lead thickness, lead length, and component thickness (thickness of the component body). The size of the terminal hole H is also registered as information indicating the specifications of the lead component.

[0070] In addition to the above information, the determination data D3 also registers the insertion start height Z2 and the allowable load Nc at that time. For kinked parts, the applied load N3 is also registered.

[0071] 6 and 7, the insertion start height Z2 is the height of the mounting head 20 when the insertion of the lead terminals Ct into the terminal holes H begins. More specifically, the insertion start height Z2 is the height at which the tips of the lead terminals Ct are inserted slightly into the terminal holes H from the top surface of the substrate P. The allowable load Nc (corresponding to the "second load" of the present invention) is a load lower than the maximum load Nm (corresponding to the "first load" of the present invention) and is a load that prevents deformation of the lead terminals Ct when they hit the substrate P, or limits deformation to a slight extent.

[0072] During the data acquisition process described above, when creating the determination data D3 (step S16 in FIG. 5), the main control unit 32 calculates the insertion start height Z2, the allowable load Nc, and the applied load N3 and registers them in the determination data D3. For example, the main control unit 32 calculates the insertion start height Z2 based on the descent start position Z1, the lead length of the lead component, and the component thickness. Furthermore, based on the maximum load Nm acquired during the data acquisition process, the main control unit 32 calculates a certain percentage of the maximum load Nm as the allowable load Nc and the applied load N3. For example, the main control unit 32 calculates a load that is 50% or 40% of the maximum load Nm as the allowable load Nc. Furthermore, the main control unit 32 calculates a load that is 90% of the maximum load Nm as the applied load N3 of the kinked component. Note that the applied load N3 of the kinked component may be actually acquired at the loading height Z3 during the data acquisition process described above.

[0073] [Mounting defect detection process] The mounting defect detection process is a process that mainly detects mounting defects of lead components, specifically, improper insertion of lead terminals Ct into terminal holes H when mounting the lead components on a substrate P. The above-mentioned judgment data D3 is used in this mounting defect detection process.

[0074] <Straight part C1> 9 is a flowchart of the mounting defect detection process for the straight component C1. This mounting defect detection process is executed during the mounting operation of the straight component C1 by the mounting head 20, as shown in FIG.

[0075] The main control unit 32 waits for the mounting head 20 to start descending from the descending start position Z1, and when the descending operation starts (Yes in step S31), determines whether the mounting head 20 has reached the insertion start height Z2 (step S33). If the determination is Yes, the main control unit 32 determines whether the load N acting on the mounting head 20, i.e., the detected load N, is equal to or greater than the allowable load Nc (step S35).

[0076] Specifically, the main control unit 32 obtains the load acting on the mounting head 20 by converting the control current value of the Z-axis servo motor 24 detected by the current value detection unit 36a into a load value, and determines whether this load (detected load N) is equal to or greater than the allowable load Nc. If the determination is Yes, the main control unit 32 determines that a mounting defect has occurred and executes a predetermined error process. That is, the main control unit 32 displays an error screen on the display unit 51, and then stops the component mounting device 102 (steps S45 and S46). This ends the mounting defect detection process.

[0077] When a load equal to or greater than the allowable load Nc acts on the mounting head 20 at the insertion start height Z2, it is assumed that, for example, some or all of the multiple lead terminals Ct will abut against the substrate P without being inserted into the terminal holes H. Therefore, in this case, the main control unit 32 determines that a mounting defect has occurred and stops the component mounting apparatus 102.

[0078] As described above, the allowable load Nc is a load that prevents deformation or limits deformation to a slight extent when the lead terminals Ct hit the substrate P. Therefore, by detecting a mounting defect at this stage, breakage of the lead terminals Ct can be avoided.

[0079] On the other hand, if the determination in step S35 is No, the main control unit 32 determines whether the detected load N is equal to or greater than the maximum load Nm (step S37). If the determination here is No, the main control unit 32 determines whether the mounting head 20 has reached the maximum load generation height Zm, that is, whether it has reached the mounting height Z3 (step S39), and if the determination here is No, the process returns to step 37. In other words, if the detected load N becomes equal to or greater than the maximum load Nm before the mounting head 20 reaches the maximum load generation height Zm (mounting height Z3) (Yes in step S37), the main control unit 32 determines that a mounting defect has occurred, and proceeds to step S45.

[0080] For example, if the lead terminals Ct are bent inside the terminal holes H, or if a foreign object is present between the component body and the substrate P, or if some or all of the lead terminals Ct are bent without being inserted into the terminal holes H, the detected load N will be equal to or greater than the maximum load Nm before the mounting head 20 reaches the maximum load generation height Zm (mounting height Z3). Therefore, in this case, the main control unit 32 determines that a mounting defect has occurred and stops the component mounting apparatus 102.

[0081] If the answer to step S39 is Yes, that is, if it is determined that the mounting head 20 has reached the maximum load generation height Zm (mounting height Z3), the main control unit 32 acquires the actual load at the maximum load generation height Zm and stores this detected load N in the memory unit 34 as historical data D4 for the substrate P (step S41).

[0082] Next, the main control unit 32 determines whether the detected load N is equal to or greater than the maximum load Nm (step S43), and if the determination is Yes, the main control unit 32 ends the mounting defect detection process. On the other hand, if the determination is No in step S43, the main control unit 32 determines that a mounting defect has occurred, and proceeds to step S45.

[0083] For example, if the support state of the substrate P at the work position is inappropriate, the substrate P may be pressed by the mounting head 20 and bend downward, and as a result, the detectable load N at the maximum load generating height Zm, i.e., the mounting height Z3, may not reach the maximum load Nm. In such a case, the lead terminals Ct are incompletely inserted into the terminal holes H. Therefore, if the detectable load N is not equal to or greater than the maximum load Nm when the mounting head 20 reaches the maximum load generating height Zm (mounting height Z3), the main control unit 32 determines that a mounting defect has occurred, and proceeds to step S45.

[0084] <Kink part C2> 10 is a flowchart of the mounting defect detection process for the kinked component C2. This mounting defect detection process is executed during the mounting operation of the kinked component C2 by the mounting head 20 as shown in FIG.

[0085] The difference between the mounting defect detection process for the kink component C2 and the mounting defect detection process for the straight component C1 is that the processing of steps S42 and S44 shown in Fig. 10 is provided instead of the processing of step S43 in Fig. 9. Otherwise, the mounting defect detection process for the kink component C2 and the mounting defect detection process for the straight component C1 are basically the same.

[0086] In the mounting defect detection process for the kinked component C2, after storing the history data D4 in the memory unit 34 in the process of step S41, the main control unit 32 waits for the mounting head 20 to reach the mounting height Z3, and when the mounting height Z3 is reached (Yes in step S42), determines whether the detected load N is equal to or greater than the mounting load N3 (step S44). If the determination here is Yes, the main control unit 32 ends the mounting defect detection process. On the other hand, if the determination in step S44 is No, the main control unit 32 determines that a mounting defect has occurred, and proceeds to step S45.

[0087] That is, as in the case of the straight component C1, the mounting head 20 may press the substrate P and cause it to bend downward, resulting in the detection load N at the mounting height Z3 not reaching the mounting load N3. In such a case, the lead terminals Ct are incompletely inserted into the terminal holes H. Therefore, if the detection load N is not equal to or greater than the mounting load N3 when the mounting head 20 reaches the mounting height Z3, the main control unit 32 determines that a mounting defect has occurred and proceeds to step S45.

[0088] [effect] As described above, in the component mounting apparatus 102 of the embodiment, a data acquisition process is executed to acquire determination data D3 used in the lead component mounting defect detection process by the operator operating the operation unit 50. In this data acquisition process, a component mounting process is executed in which the mounting head 20 actually picks up lead components from the component supply unit 5 (tray feeder 5b) and mounts them on the board P, and data to be used in the mounting defect detection process, i.e., the maximum load Nm and the maximum load occurrence height Zm acting on the mounting head 20, is acquired, and determination data D3 including this maximum load Nm and maximum load occurrence height Zm is created and stored in the storage unit 34.

[0089] This eliminates the need for the conventional manual measurement of data used to detect mounting defects in lead components using force gauges (push-pull gauges) and measuring jigs, thereby reducing the labor required for data acquisition.

[0090] During production of product boards, a lead component mounting defect detection process is executed using the data acquired in the data acquisition process (maximum load Nm and maximum load generation height Zm). In this mounting defect detection process, as described above, if the detected load N becomes equal to or greater than the maximum load Nm before the height of the mounting head 20 reaches the maximum load generation height Zm during the lead component mounting process, a mounting defect is determined and a predetermined error process is executed. Therefore, according to the component mounting device 102 of the embodiment, it is possible to appropriately detect a lead component mounting defect using the data acquired in the data acquisition process.

[0091] Moreover, the determination data D3 includes, in addition to the maximum load Nm, an allowable load Nc that is lower than the maximum load Nm, and if the detected load N is equal to or greater than the allowable load Nc before the mounting head 20 reaches the maximum load generation height Zm, specifically, when it reaches the insertion start height Z2, it is determined to be a mounting defect and a predetermined error process is executed. Therefore, according to the component mounting apparatus 102 of the embodiment, it is possible to detect a mounting defect state in which some or all of the multiple lead terminals Ct are abutting against the substrate P without being inserted into the terminal holes H, while avoiding breakage of the lead terminals.

[0092] Furthermore, the component mounting apparatus 102 of the embodiment is configured to acquire the actual detected load N at the maximum load generation height Zm during production of the product substrate as history data D4 of the substrate P and store it in the memory unit 34 (step S41 in FIGS. 9 and 10). Such history data D4 is useful data for analyzing defects, etc., after the product substrate is sold. Therefore, the component mounting apparatus 102 of the embodiment contributes to improving the traceability of the product substrate on which lead components are mounted. Note that the history data D4 and the determination data D3 may be configured to be transmitted to the management device 101 via the communication line CL, for example, and managed in the management device 101 in association with the serial number of the substrate P.

[0093] [Modifications, etc.] The component mounting apparatus 102 described above is an example of a preferred embodiment of the component mounting apparatus according to the present invention, and the specific configuration of the component mounting apparatus 102 can be changed as appropriate without departing from the gist of the present invention. For example, the following configurations are also applicable.

[0094] (1) In the data acquisition process of the embodiment, the main control unit 32 acquires the maximum load Nm and the maximum load generation height Zm by executing a component mounting process in which lead components are actually mounted on the board P (FIG. 5). However, instead of actually mounting lead components on the board P, the main control unit 32 may estimate the maximum load Nm and the maximum load generation height Zm based on the component data D2 and existing determination data D3 stored in the memory unit 34.

[0095] 11 is a flowchart showing the data acquisition process in this case. This data acquisition process also starts when the operator operates operation unit 50 to register (input) the name of the new lead component to be acquired, and selects the command for the data acquisition process displayed on display unit 51.

[0096] The main control unit 32 first causes the display unit 51 to display a screen requesting input of component data D2 for the lead component (step S51). When the component data D2 for the lead component is input by operating the display unit 51 (Yes in step S53), the main control unit 32 searches for lead components similar in shape to the new lead component based on the component data D2 stored in the memory unit 34, i.e., on the data indicating specifications (specification information) (step S55), and determines whether there are any similar components (step S57). The determination of similarity can be made, for example, by focusing on the thickness of the lead terminals Ct and the size of the terminal holes H.

[0097] If the determination in step S57 is Yes, i.e., if a similar part exists, in other words, if a similar part has been identified, the main control unit 32 references the determination data D3 of the similar part and estimates (calculates) the maximum load Nm and maximum load occurrence height Zm of the new lead part C (step S59).The main control unit 32 then creates determination data D3 including the results and stores it in the storage unit 34 (steps S59 and S61).On the other hand, if the determination in step S57 is No, the main control unit 32 causes the display unit 51 to display an image indicating that no similar part exists (step S63), and then ends the data acquisition process.

[0098] According to this configuration, it is possible to acquire the judgment data D3 for the new lead component without actually mounting the lead component C on the board P.

[0099] (2) In the embodiment, the case where the data acquisition process is executed during non-production time of the component mounting apparatus 102 has been described. However, the data acquisition process may also be executed during production time of the component mounting apparatus 102, i.e., during production of product boards. That is, the main control unit 32 may be configured to execute the data acquisition process for lead components to be mounted on the product boards during production of the product boards in accordance with the procedures in the flowcharts of FIGS. 5 and 11. With this configuration, it is possible to acquire the determination data D3 using the product components (lead components) and the board P during production of the product boards.

[0100] In this case, in addition to using data (maximum load Nm and maximum load occurrence height Zm) acquired during the mounting operation of a single lead component as determination data D3, the average value of data (maximum load Nm and maximum load occurrence height Zm) acquired during each mounting operation of multiple lead components (multiple lead components of the same type) can also be used as determination data D3. This configuration improves the reliability of determination data D3, and ultimately improves the accuracy of detecting mounting defects of lead components.

[0101] (3) In the embodiment, the application height of the allowable load Nc registered in the determination data D3 is the insertion start height Z2. That is, the main control unit 32 determines that a mounting defect has occurred if the detected load N when the mounting head 20 reaches the insertion start height Z2 is equal to or greater than the allowable load Nc. However, the application height of the allowable load Nc is not limited to the insertion start height Z2. For example, as shown in FIG. 6, the application height of the allowable load Nc may be set to the height Zc at which the tip of the lead terminal Ct reaches a position that is approximately 50% of the terminal hole H, or to any other height. In this case, the specific value of the allowable load Nc can be set appropriately depending on the application height.

[0102] (4) In the embodiment, the load detection unit of the present invention is provided with a current value detection unit 36a that detects the control current value of the Z-axis servo motor 24. However, the load detection unit of the present invention only needs to be able to detect the load directly or indirectly, and therefore a load cell (load sensor) may also be provided as the load detection unit.

[0103] (5) In the data acquisition process of the embodiment (FIG. 5), the main control unit 32 acquires the inspection results from the inspection device 103 and, based on the results, determines whether or not there are any defectively mounted lead components among the lead components mounted on the substrate P (steps S13 and S15). However, this determination may also be made visually by an operator. In this case, the operator may input the determination result by operating the operation unit 50, and the main control unit 32 may execute subsequent processing based on the input. [Explanation of symbols]

[0104] 5 Parts supply unit (parts supply section) 6 Head Unit 20 Mounted head 20 (head) 22 Suction nozzle 24 Z-axis servo motor 24a Encoder (position detection unit) 30 Control Unit 32 Main control unit (control unit) 34 Storage section 36 Drive control unit 36a Current value detection unit (load detection unit) 102 Component mounting equipment

Claims

1. a parts supply unit; a movable head that picks up components from the component supply unit and mounts them on a board; a load detection unit that detects a load acting on the head during component mounting; a position detection unit that detects the height of the head; a control unit for controlling the operation of the head; a storage unit capable of storing determination data for detecting mounting defects of a lead component having a lead terminal, The control unit a mounting process in which the head takes out lead components from the component supply unit and mounts the lead components on a substrate with the lead terminals inserted into the terminal holes; During the mounting process, the component mounting device executes a data acquisition process that includes: acquiring the maximum load detected by the load detection unit and the head height detected by the position detection unit when the maximum load occurs; and storing the judgment data including the maximum load and the head height in the memory unit.

2. 2. The component mounting apparatus according to claim 1, The control unit executes the data acquisition process for the lead components that are mounted on the product substrate during production of the product substrate.

3. 3. The component mounting apparatus according to claim 2, The control unit determines the maximum load of the judgment data based on the maximum load detected by the load detection unit in each of multiple lead component mounting processes performed during the production of product boards, and determines the head height of the judgment data based on the head height corresponding to each of the maximum loads.

4. 4. The component mounting apparatus according to claim 1, The control unit determines that the mounting has been defective and executes a predetermined error process when, during the production of a product substrate, the detected load of the load detection unit becomes equal to or greater than the maximum load of the judgment data before the head height reaches the head height of the judgment data during the mounting process of a lead component, which is a component mounted on the product substrate.

5. 5. The component mounting apparatus according to claim 4, When the maximum load of the determination data is defined as a first load, The control unit stores the judgment data in the memory unit, which further includes a second load lower than the first load, and if, during the mounting process of the lead component, the detected load of the load detection unit becomes equal to or greater than the second load before the head reaches the head height of the judgment data, the component mounting device determines that the mounting has failed and executes the error processing.

6. 4. The component mounting apparatus according to claim 1, the control unit stores the detected load of the load detection unit at the head height of the judgment data in the memory unit as history data of the product substrate during the mounting process of lead components, which are mounted components on the product substrate, during production of the product substrate.

7. 4. The component mounting apparatus according to claim 1, the storage unit stores the determination data for each type of lead component; The control unit A process of acquiring specification information of a new lead component for which the determination data is not stored; a process of identifying lead parts having specifications similar to those of the new lead part from among the lead parts related to the determination data stored in the storage unit based on the specification information; a process of estimating the maximum load of the new lead component and the height of the head at which the maximum load occurs based on the determination data of the identified lead component; and storing the determination data, including the estimated maximum load and head height, in the storage unit as the determination data for the new lead component.

8. a parts supply unit; a movable head that picks up components from the component supply unit and mounts them on a board, a method for acquiring judgment data for detecting mounting defects of lead components having lead terminals in a component mounting apparatus including the component supply unit, a step of taking out lead components from the component supply unit by the head and mounting the lead components on a substrate with the lead terminals properly inserted into the terminal holes; a step of detecting a maximum load acting on the head when mounting a lead component on a substrate, and detecting the height of the head when the maximum load is generated; and storing judgment data including the maximum load and the height of the head when the maximum load occurs.

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