Electronic component

Abstract

To provide a highly reliable solid electrolytic capacitor in which intrusion of oxygen or moisture from the outside is suppressed.SOLUTION: The electronic component includes a multilayer body, a plurality of outer electrodes, a first resin body, and a second resin body. The multilayer body is formed by stacking a plurality of electronic component bodies in a first direction. The plurality of external electrodes are electrically connected to each of the plurality of electronic component bodies constituting the laminated body. The first resin body seals the stacked body to form a sealed body. The second resin body is formed on the plurality of external electrodes so as to be in contact with the first resin body. The sealing body has a first end and a second end. The second resin body is formed in the vicinity of the first end and the second end of the sealing body.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component having a lead frame as an external electrode. [Background technology]

[0002] Conventionally, a solid electrolytic capacitor has been described that includes a capacitor element and a resin sealing member that seals the capacitor element, forming a sealed body by sealing the capacitor element. The sealing body is made of insulating resin. In this solid electrolytic capacitor, a cathode terminal and an anode terminal are each extended from the capacitor element to the outside of the sealed body by a lead frame, and each lead frame functions as an external electrode. The lead frame is made of, for example, a copper alloy layer, with a tin layer formed on the surface.

[0003] The capacitor elements of solid electrolytic capacitors deteriorate due to external oxygen and moisture. Therefore, it is necessary to prevent the intrusion of external oxygen and moisture. Furthermore, during reflow mounting, the tin layer formed on the surface of the lead frame melts, and the pressure of the gas vaporized inside the solid electrolytic capacitor pushes the tin layer outward. This can lead to gaps between the insulating resin seal and the lead frame. Similarly, due to the difference in thermal expansion coefficients between the insulating resin and the lead frame, gaps can also lead to gaps between the insulating resin seal and the lead frame. These gaps can serve as a path for external oxygen and moisture to penetrate.

[0004] Patent Document 1 discloses a structure for preventing the intrusion of oxygen and moisture from the outside. In the lead frame of Patent Document 1, the tin layer formed on the portion that contacts the sealing body made of insulating resin is removed. Furthermore, the copper alloy layer from which the tin layer has been removed is roughened. In this way, the copper alloy layer is roughened, thereby improving adhesion to the sealing body. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 5-21290 Summary of the Invention [Problem to be solved by the invention]

[0006] However, even when the structure described in Patent Document 1 is used, there is a risk of reduced adhesion between the lead frame and the insulating resin. More specifically, when a solid electrolytic capacitor is resin-sealed by transfer molding, it is necessary to use an insulating resin that is easy to release from the mold. In this case, if the copper alloy layer of the lead frame has a roughened surface, there is a risk that adhesion will not be ensured. As a result, gaps will form at the contact surface between the lead frame and the insulating resin, making it impossible to prevent oxygen and moisture from entering from the outside.

[0007] Furthermore, since the lead frame is made of metal, it has a high elastic modulus. Furthermore, the insulating resin forming the encapsulant preferably has a high elastic modulus because it is required to increase its strength. However, if a substrate on which a solid electrolytic capacitor including a lead frame with a high elastic modulus and an insulating resin is mounted is bent and stress is applied to the solid electrolytic capacitor, the lead frame and the insulating resin are unlikely to elastically deform, and the stress may not be fully absorbed. This stress may then cause peeling at the interface between the lead frame and the insulating resin, which are fragile in the structure of the solid electrolytic capacitor.

[0008] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a highly reliable solid electrolytic capacitor that is inhibited from invading oxygen and moisture from the outside. [Means for solving the problem]

[0009] The electronic component of the present invention comprises a laminate, a plurality of external electrodes, a first resin body, and a second resin body. The laminate is formed by stacking a plurality of electronic component base bodies in a first direction. The plurality of external electrodes are electrically connected to each of the plurality of electronic component base bodies that make up the laminate. The first resin body seals the laminate to form a sealing body. The second resin body is formed on the plurality of external electrodes so as to abut against the first resin body. The sealing body has a first end and a second end. The second resin body is formed near the first end and the second end of the sealing body.

[0010] In this configuration, the first resin body that seals the laminate abuts against the second resin body. Furthermore, the second resin body abuts against the multiple external electrodes. That is, by providing the second resin body, adhesion between the first resin body, the second resin body, and the multiple external electrodes is improved. This suppresses peeling between the first resin body and the second resin body, and between the second resin body and the multiple external electrodes, thereby suppressing the intrusion of oxygen and moisture from the outside. This allows for the realization of a highly reliable electronic component. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide a highly reliable solid electrolytic capacitor that is inhibited from invading oxygen and moisture from the outside. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a cross-sectional view of the solid electrolytic capacitor according to the first embodiment. [Figure 2] FIG. 2(A) is an external perspective view of the capacitor element according to the first embodiment, and FIG. 2(B) is a cross-sectional view of the capacitor element. [Figure 3] FIG. 3(A) is a cross-sectional view of the first external electrode and the second external electrode according to the first embodiment, and FIG. 3(B) and FIG. 3(C) are diagrams showing the more detailed structures of the first external electrode and the second external electrode. [Figure 4] FIG. 4 is a flowchart showing the procedure for forming the solid electrolytic capacitor according to the first embodiment. [Figure 5] FIG. 5 is a cross-sectional view of the solid electrolytic capacitor according to the second embodiment. [Figure 6] FIG. 6 is a cross-sectional view of the solid electrolytic capacitor according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] In the following embodiments, the electronic component of the present invention will be described as a "solid electrolytic capacitor" by way of example. However, the electronic component is not limited to a solid electrolytic capacitor and may be any component that has a lead frame and is sealed with an insulating resin or the like.

[0014] [First embodiment] A solid electrolytic capacitor according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a cross-sectional view of the solid electrolytic capacitor according to the first embodiment. Fig. 2(A) is an external perspective view of the capacitor element according to the first embodiment, and Fig. 2(B) is a cross-sectional view of the capacitor element. Fig. 3(A) is a cross-sectional view of the first external electrode and the second external electrode according to the first embodiment, and Figs. 3(B) and 3(C) are diagrams showing the structures of the first external electrode and the second external electrode in more detail.

[0015] The solid electrolytic capacitor 1 includes a capacitor assembly 10, a first terminal electrode 20, a second terminal electrode 30, and an insulating resin body 40. The capacitor assembly 10 corresponds to the "laminate" of the present invention. The first terminal electrode 20 and the second terminal electrode 30 correspond to the "external electrodes" of the present invention.

[0016] The capacitor assembly 10 includes a plurality of capacitor elements 11-14 (capacitor element 11, capacitor element 12, capacitor element 13, capacitor element 14) and a conductive member 19. In this embodiment, the number of capacitor elements constituting the capacitor assembly 10 is four, but the number of capacitor elements may be any number. The longitudinal direction of the plurality of capacitor elements 11-14 is the X-axis direction, the lateral direction of the plurality of capacitor elements 11-14 perpendicular to the X-axis direction is the Y-axis direction, and the direction in which the plurality of capacitor elements 11-14 are stacked (stacking direction) is the Z-axis direction. The capacitor elements 11-14 correspond to the "electronic component body" in the present invention. The X-axis direction corresponds to the "second direction" in the present invention, and the Z-axis direction corresponds to the "first direction" in the present invention.

[0017] The plurality of capacitor elements 11-14 have the same configuration. Each of the plurality of capacitor elements 11-14 includes an electrode foil 111, a dielectric layer 112, and a solid electrolyte layer 113 (see FIGS. 2(A) and 2(B) described below). The electrode foil 111 corresponds to the "valve metal substrate" of the present invention.

[0018] The capacitor assembly 10 is sealed with an insulating resin body 40. The sealing body 400 is formed by sealing the capacitor assembly 10 in the insulating resin body 40. The sealing body 400 has a substantially rectangular parallelepiped shape having a top surface 401, a bottom surface 402, a first end surface 403, and a second end surface 404. The insulating resin body 40 corresponds to the "first resin body" of the present invention. The sealing body 400 has a first end E1 at the first end surface 403 and a second end E2 at the second end surface 404.

[0019] The plurality of capacitor elements 11-14 are stacked. The plurality of capacitor elements 11-14 are arranged so as to expand in the thickness direction from the first end E1 side toward the second end E2 side in side view. That is, the plurality of capacitor elements 11-14 are stacked in the axial direction (stacking direction) so that the dimension of the first terminal electrode 20 on the first end E1 side is smaller than the dimension of the second terminal electrode 30 on the second end E2 side.

[0020] The plurality of capacitor elements 11-14 are connected to first terminal electrodes 20 on the first end E1 side of each electrode foil 111 (see FIGS. 2(A) and 2(B) described below).

[0021] The connection layers (conductive layers including the solid electrolyte layer 113) of the multiple capacitor elements 11-14 are electrically and physically connected to the second terminal electrode 30 on the second end E2 side using a conductive member 19 (see Figures 2(A) and 2(B) described below).

[0022] Conductive member 19 is preferably an electrode paste containing, for example, nickel, silver, or copper as a main component. The maximum thickness of conductive member 19 is preferably 2 μm or more and 20 μm or less. Note that, even without using conductive member 19, if conductivity equal to or higher than the desired conductivity can be obtained between multiple capacitor elements 11-14, between capacitor elements 12 and 13 and second terminal electrode 30, etc., conductive member 19 can be omitted.

[0023] The first terminal electrode 20 and the second terminal electrode 30 have a structure based on, for example, a copper alloy-based material or an iron alloy-based material. The first terminal electrode 20 and the second terminal electrode 30 are preferably formed from a metal material that is easy to bend and has high conductivity. The first terminal electrode 20 and the second terminal electrode 30 are formed from, for example, a material cut out from a metal plate. The first terminal electrode 20 and the second terminal electrode 30 may be made of the same material or different materials.

[0024] A portion of the first terminal electrode 20 is embedded in the sealing body 400 (insulating resin body 40), and another portion is exposed from a first end surface 403 (first end E1) of the sealing body 400. The end 20E1 of the first terminal electrode 20 is connected to the capacitor elements 11-14. The end 20E2 of the first terminal electrode 20 is exposed to the outside from the first end surface 403 of the sealing body 400, and is bent over the first end surface 403 and the bottom surface 402. The first end E1 corresponds to the portion of the first terminal electrode 20 that is exposed to the outside from the first end surface 403 of the sealing body 400.

[0025] Similarly, a portion of the second terminal electrode 30 is embedded in the sealing body 400 (insulating resin body 40), and another portion is exposed from a second end surface 404 of the sealing body 400. An end portion 30E1 of the second terminal electrode 30 is connected to the capacitor elements 11-14. An end portion 30E2 of the second terminal electrode 30 is exposed to the outside from the second end surface 404 of the sealing body 400, and is bent over the second end surface 404 and the bottom surface 402. The second end portion E2 corresponds to the portion of the second terminal electrode 30 that is exposed to the outside from the second end surface 404 of the sealing body 400.

[0026] A first resin member 210 is formed at a midpoint in the direction in which the first terminal electrode 20 extends. Similarly, a second resin member 310 is formed at a midpoint in the direction in which the second terminal electrode 30 extends. Details will be described later.

[0027] The insulating resin body 40 described above is mainly made of resin and may contain a filler. Examples of preferred resins include epoxy resin, phenol resin, polyimide resin, silicone resin, polyamide resin, and liquid crystal polymer. The resin may be in either solid or liquid form. It is preferred that corners are rounded by barrel polishing after resin sealing. Examples of preferred fillers include silica particles, alumina particles, and metal particles. The maximum diameter of the filler is preferably 30 μm or more and 40 μm or less. A material containing silica particles in a solid epoxy resin and phenol resin is more preferred.

[0028] 2(A) and 2(B), the structure of capacitor element 11 will be described. Capacitor elements 12-14 have the same structure as capacitor element 11. As described above, capacitor element 11 includes electrode foil 111, dielectric layer 112, and solid electrolyte layer 113.

[0029] Electrode foil 111 is made of, for example, a metal such as aluminum, tantalum, niobium, titanium, zirconium, magnesium, or silicon, or an alloy containing these metals. Electrode foil 111 is preferably made of aluminum or an aluminum alloy. Electrode foil 111 may be made of any valve metal that exhibits so-called valve action.

[0030] A dielectric layer 112 is formed on the electrode foil 111. The dielectric layer 112 covers a first surface F1 and a second surface F2 of the electrode foil 111. More specifically, the dielectric layer 112 is formed on the electrode foil 111. The electrode foil 111 has surfaces (a first surface F1 and a second surface F2) that face each other in the Z-axis direction. The electrode foil 111 further includes a third surface F3 and a fourth surface F4 that are connected to the first surface F1 and the second surface F2 and are perpendicular to the Z-axis direction. The dielectric layer 112 covers the first surface F1, the second surface F2, and the fourth surface F4 of the electrode foil 111.

[0031] Dielectric layer 112 is preferably made of an oxide film of electrode foil 111. For example, when aluminum foil is used for electrode foil 111, dielectric layer 112 is formed by oxidizing it in an aqueous solution containing boric acid, phosphoric acid, adipic acid, or their sodium salts, ammonium salts, or the like. The thickness of dielectric layer 112 is preferably 10 nm or more and 100 nm or less.

[0032] Solid electrolyte layer 113 covers the outer surface of dielectric layer 112 (the surface opposite to the surface in contact with electrode foil 111). Solid electrolyte layer 113 also fills the numerous pores covered with dielectric layer 112.

[0033] More specifically, the solid electrolyte layer 113 includes, for example, an inner layer and an outer layer.

[0034] The inner layer is a layer on the dielectric layer 112 side of the solid electrolyte layer 113, and may be, for example, a PEDOT:PSS layer realized by a conductive polymer having a skeleton of pyrroles, thiophenes, anilines, or the like, or a conductive polymer having a skeleton of thiophenes such as PEDOT [poly(3,4-ethylenedioxythiophene)], and composited with polystyrene sulfonate (PSS) as a dopant. The inner layer is formed by a method of forming a polymer film of poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer 112 using an electrolyte solution that serves as the base for forming the solid electrolyte layer 113, for example, a treatment liquid containing a monomer such as 3,4-ethylenedioxythiophene, or a method of applying a dispersion of a polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric portion and drying it, or the like.

[0035] The outer layer is a layer formed on the outside of the inner layer. For example, the outer layer is a layer formed so as to cover the entire dielectric layer 112 after the inner layer is formed to fill the fine recesses in the porous portion. The thickness of the outer layer is preferably 2 μm or more and 20 μm or less. The outer layer is preferably a carbon layer, a graphene layer, or a silver layer formed by applying a conductive paste such as carbon paste, graphene paste, or silver paste. The outer layer may be a composite layer in which a silver layer is provided on a carbon layer or a graphene layer, or a mixed layer in which carbon paste or graphene paste is mixed with silver paste.

[0036] With this configuration, capacitor element 11 becomes a flat-film solid electrolytic capacitor. In this capacitor element 11, electrode foil 111 corresponds to the anode, and solid electrolyte layer 113 corresponds to the cathode. The region of electrode foil 111 where solid electrolyte layer 113 is not formed corresponds to the "anode terminal region" of the present invention, and the region of electrode foil 111 where solid electrolyte layer 113 is formed corresponds to the "cathode-forming region" of the present invention.

[0037] Next, the detailed structures of the first terminal electrode 20 and the second terminal electrode 30 will be described using Figures 3(A), 3(B), and 3(C). Figure 3(A) is a diagram showing the bent shape of the first terminal electrode 20 and the second terminal electrode 30, which is the same as the shape in Figure 1. Figures 3(B) and 3(C) are diagrams showing a more detailed structure of the first terminal electrode 20. In Figures 3(A), 3(B), and 3(C), some dimensions are exaggerated to make the structure easier to understand.

[0038] As shown in Fig. 3(A), a first resin member 210 is formed on the first terminal electrode 20. The first resin member 210 is located near a first end E1 of the sealing body 400. Similarly, a second resin member 310 is formed on the second terminal electrode 30. The second resin member 310 is located near a second end E2 of the sealing body 400. The first resin member 210 and the second resin member 310 correspond to the "second resin body" of the present invention.

[0039] Here, the vicinity of the first end E1 of the sealing body 400 is defined as follows. The end of the first resin member 210 is located closer to the inside of the solid electrolytic capacitor 1 than the end of the sealing body 400 . The end of the first resin member 210 is flush with the end of the sealing body 400 . The end of the first resin member 210 protrudes from the end of the sealing body 400 to the outside of the solid electrolytic capacitor 1 . The end of the first resin member 210 is preferably located, for example, 0.15 mm from the first end E1 of the sealing body 400.

[0040] That is, the vicinity of the first end E1 of the sealing body 400 may be any position that can effectively prevent the first resin member 210 and the sealing body 400 from peeling off and prevent oxygen and moisture from entering from the outside.

[0041] Similarly, the vicinity of the second end E2 of the encapsulant 400 is defined as follows. The end of the second resin member 310 is located closer to the solid electrolytic capacitor 1 than the end of the sealing body 400 . The end of the sealing body 400 and the end of the second resin member 310 are flush with each other. The end of the second resin member 310 protrudes from the end of the sealing body 400 to the outside of the solid electrolytic capacitor 1 . The end of the second resin member 310 is preferably located, for example, 0.15 mm from the second end E2 of the sealing body 400.

[0042] That is, similar to the first resin member 210, the vicinity of the second end E2 of the sealing body 400 may be any position that has the effect of suppressing peeling between the second resin member 310 and the sealing body 400 and suppressing the intrusion of oxygen and moisture from the outside.

[0043] Next, the structure of the first terminal electrode 20 will be described in more detail with reference to Figures 3(B) and 3(C). Note that although the description will be given using the first terminal electrode 20 in Figures 3(B) and 3(C), the second terminal electrode 30 also has a similar structure. Figures 3(B) and 3(C) are diagrams showing the state before the first terminal electrode 20 is bent (the state before it is brought into the state of Figure 3(A)).

[0044] The first terminal electrode 20 has a first portion, a second portion, and a third portion in the extension direction (X-axis direction). As shown in Fig. 3(B), the first terminal electrode 20 has the first and third portions in which a tin layer 202 is formed on the surface of a base 201 made of a copper alloy-based material or the like, and a second portion in which the tin layer 202 is not formed on the surface. Fig. 3(B) shows a state in which the tin layer 202 is not formed on the second portion.

[0045] The first terminal electrode 20 is formed as follows. First, as shown in FIG. 3(B), the tin layer 202 is peeled off along the outer periphery of the second portion of the first terminal electrode 20 to form the first resin member 210. The first resin member 210 is formed on the second portion from which the tin layer 202 has been peeled off. At this time, the length of the second portion in the X-axis direction is formed to be 0.1 mm or more and 0.9 mm or less. The thickness of the first resin member 210 in the Z-axis direction is formed to be 0.01 mm or more and 0.2 mm or less. The state in which the tin layer 202 has been formed on the second portion in this manner is shown in FIG. 3(C).

[0046] 3(A), 3(B), and 3(C), the first end E1 of the sealing body 400 is located in the second portion. More preferably, the first end E1 of the sealing body 400 is located near the boundary between the second portion and the third portion.

[0047] The sealing body 400 has a first elastic modulus. The first resin member 210 and the second resin member 310 have a second elastic modulus. The first terminal electrode 20 and the second terminal electrode 30 have a third elastic modulus.

[0048] The second elastic modulus of the first resin member 210 is smaller than the first elastic modulus of the insulating resin body 40. Similarly, the second elastic modulus of the second resin member 310 is smaller than the first elastic modulus of the insulating resin body 40. In order to reduce the second elastic modulus of the first resin member 210 and the second resin member 310, for example, it is advisable to reduce the concentration of filler relative to the insulating resin body 40.

[0049] Similarly, the second elastic modulus of the first resin member 210 is smaller than the third elastic modulus of the first terminal electrode 20. Furthermore, the second elastic modulus of the second resin member 310 is smaller than the third elastic modulus of the second terminal electrode 30.

[0050] Therefore, stress applied to the solid electrolytic capacitor 1 is absorbed by the first resin member 210 and the second resin member 310, which have the second elastic modulus, which is smaller than the elastic modulus. That is, the stress is less likely to be applied to the interface between the first resin member 210 and the insulating resin body 40 and the interface between the first terminal electrode 20 and the first resin member 210. Similarly, the stress is less likely to be applied to the interface between the second resin member 310 and the insulating resin body 40 and the interface between the second terminal electrode 30 and the second resin member 310. Therefore, peeling between the first resin member 210 and the first terminal electrode 20, and between the second resin member 310 and the second terminal electrode 30 is suppressed.

[0051] Furthermore, the first bond strength between the first resin member 210 and the insulating resin body 40 is higher than the second bond strength between the first terminal electrode 20 and the insulating resin body 40. The first bond strength between the second resin member 310 and the insulating resin body 40 is higher than the second bond strength between the second terminal electrode 30 and the insulating resin body 40. In this way, the high first bond strength further suppresses peeling between the first resin member 210 and the first terminal electrode 20, and between the second resin member 310 and the second terminal electrode 30.

[0052] That is, because peeling is suppressed between the first resin member 210 and the first terminal electrode 20, and between the first resin member 210 and the insulating resin body 40, the solid electrolytic capacitor 1 can be prevented from invading oxygen and moisture from the outside. Similarly, because peeling is suppressed between the second resin member 310 and the second terminal electrode 30, and between the second resin member 310 and the insulating resin body 40, the solid electrolytic capacitor 1 can be prevented from invading oxygen and moisture from the outside.

[0053] As described above, the first end E1 and the second end E2 of the sealing body 400 are preferably located near the boundary between the second portion and the third portion. In this way, by forming the second portion near the first end E1 of the sealing body 400 and by forming the first resin member 210 in the second portion, the solid electrolytic capacitor 1 can efficiently prevent air and moisture from entering from the outside. Similarly, by forming the second portion near the second end E2 of the sealing body 400 and by forming the second resin member 310 in the second portion, the solid electrolytic capacitor 1 can efficiently prevent air and moisture from entering from the outside.

[0054] Furthermore, by positioning first end E1 and second end E2 of sealing body 400 near the boundary between the second portion and the third portion, the distance in the second direction between the formation position of first resin member 210 and the formation position of second resin member 310 can be increased. That is, the length of the cathode regions in the second direction of multiple capacitor elements 11-14 can be increased. This allows the capacitance of multiple capacitor elements 11-14 to be increased without increasing the size of sealing body 400.

[0055] (Method for forming a solid electrolytic capacitor) 4 is a flowchart showing the procedure for forming the solid electrolytic capacitor according to the first embodiment. A method for forming the solid electrolytic capacitor 1 having the above-described configuration will be described using the flowchart of FIG.

[0056] Capacitor element 11 is formed (S11). Specifically, as shown in Figures 2(A) and 2(B), dielectric layer 112 and solid electrolyte layer 113 are formed on a plurality of electrode foils 111.

[0057] Next, conductive members 19 are formed on solid electrolyte layers 113 of capacitor elements 11. Furthermore, capacitor elements 11 are stacked to form capacitor assembly 10 (S12). At this time, portions of first terminal electrode 20 and second terminal electrode 30 are disposed inside capacitor assembly 10.

[0058] As shown in FIG. 1, the capacitor assembly 10 is sealed with an insulating resin body 40 to form a sealed body 400 (S13).

[0059] Next, the first terminal electrode 20 is formed (bent) along the sealing body 400 (S14). More specifically, the end 20E2 of the first terminal electrode 20 is exposed to the outside from the first end face 403 of the sealing body 400, and is bent across the first end face 403 and the bottom face 402.

[0060] Next, the second terminal electrode 30 is formed (bent) along the sealing body 400 (S15). More specifically, the end 30E2 of the second terminal electrode 30 is exposed to the outside from the second end face 404 of the sealing body 400, and is bent across the second end face 404 and the bottom face 402.

[0061] Through this procedure, the solid electrolytic capacitor 1 is formed.

[0062] Here, the sealing body 400 is formed in a state where the first resin member 210 and the second resin member 310 are formed on the first terminal electrode 20 in the vicinity of the first end E1 and the second terminal electrode 30 in the vicinity of the second end E2.

[0063] This suppresses peeling between the first resin member 210 and the first terminal electrode 20, and between the first resin member 210 and the insulating resin body 40. Similarly, it suppresses peeling between the second resin member 310 and the second terminal electrode 30, and between the second resin member 310 and the insulating resin body 40. In other words, the solid electrolytic capacitor 1 can be prevented from being exposed to oxygen and moisture from the outside, improving its reliability.

[0064] As described above, the first resin member 210 is formed along the outer periphery of the second portion of the first terminal electrode 20, and the second resin member 310 is formed along the outer periphery of the second portion of the second terminal electrode 30. However, even if the first resin member 210 and the second resin member 310 are formed on part of the outer periphery of the second portion (for example, in a strip shape or formed to have projections and recesses), a certain level of effect can be obtained.

[0065] [Second embodiment] A solid electrolytic capacitor according to a second embodiment of the present invention will be described with reference to the drawings. Figure 5 is a cross-sectional view of the solid electrolytic capacitor according to the second embodiment.

[0066] 5, the solid electrolytic capacitor 1A according to the second embodiment differs in that it includes a first resin member 211 and a second resin member 311. The other configuration of the solid electrolytic capacitor 1A according to the second embodiment is the same as that of the solid electrolytic capacitor 1 according to the first embodiment, and a description of the same parts will be omitted.

[0067] 5, a first resin member 211 is formed on the second portion of the first terminal electrode 20. The first resin member 211 is integrally formed with the insulating resin body 40. The first resin member 211 is a region in the insulating resin body 40 where the concentration of filler is different.

[0068] Similarly, a second resin member 311 is formed on a second portion of the second terminal electrode 30. The second resin member 311 is integrally formed with the insulating resin body 40. The second resin member 311 is a region in the insulating resin body 40 where the concentration of filler is different.

[0069] Even with this configuration, it is possible to suppress peeling between the first resin member 210 and the first terminal electrode 20, and between the first resin member 210 and the insulating resin body 40. Similarly, it is possible to suppress peeling between the second resin member 310 and the second terminal electrode 30, and between the second resin member 310 and the insulating resin body 40. In other words, the solid electrolytic capacitor 1A can suppress the intrusion of oxygen and moisture from the outside, thereby improving reliability.

[0070] Furthermore, the insulating resin body 40 can be integrally formed with the first terminal electrode 20 and the second terminal electrode 30. That is, the first resin member 211 and the second resin member 311 can be easily formed.

[0071] [Third embodiment] A solid electrolytic capacitor according to a third embodiment of the present invention will be described with reference to the drawings, in which Fig. 6 is a cross-sectional view of the solid electrolytic capacitor according to the third embodiment.

[0072] 6, the solid electrolytic capacitor 1B according to the third embodiment differs in that it includes a first adhesive layer 215 and a second adhesive layer 315. The other configuration of the solid electrolytic capacitor 1B according to the third embodiment is the same as that of the solid electrolytic capacitor 1 according to the first embodiment, and a description of the same parts will be omitted.

[0073] 6, a first adhesive layer 215 is formed on the surface of a first resin member 210 in the solid electrolytic capacitor 1B. The first adhesive layer 215 is preferably formed of a material having a stronger adhesive strength to the insulating resin body 40 than the adhesive strength of the first resin member 210 to the insulating resin body 40.

[0074] Similarly, a second adhesive layer 315 is formed on the surface of the second resin member 310. The second adhesive layer 315 is preferably formed of a material having a stronger adhesive strength than the adhesive strength of the second resin member 310 to the insulating resin body 40. Note that the first adhesive layer 215 and the second adhesive layer 315 preferably contain an epoxy resin as a main component.

[0075] Even with this configuration, it is possible to suppress peeling between the first resin member 210 and the first terminal electrode 20, and between the first resin member 210 and the insulating resin body 40. Similarly, it is possible to suppress peeling between the second resin member 310 and the second terminal electrode 30, and between the second resin member 310 and the insulating resin body 40. In other words, it is possible to suppress the intrusion of oxygen and moisture from the outside into the solid electrolytic capacitor 1B.

[0076] Note that an adhesive layer with stronger adhesive strength may also be provided between the first resin member 210 and the first terminal electrode 20, and between the second resin member 310 and the second terminal electrode 30.

[0077] Furthermore, the configurations shown in the above-described embodiments can be combined as appropriate, and effects according to each combination can be achieved.

[0078] The present specification discloses the following:

[0079] <1> a stacked body formed by stacking a plurality of electronic component bodies in a first direction; a plurality of external electrodes electrically connected to each of the plurality of electronic component elements constituting the laminate; a first resin body that forms a sealing body by sealing the laminate; a second resin body formed on the plurality of external electrodes so as to contact the first resin body; Equipped with the encapsulant has a first end and a second end; The second resin body is formed near the first end and the second end of the sealing body.

[0080] <2> a second bonding strength between the second resin body and the first resin body and the plurality of external electrodes is higher than a first bonding strength between the first resin body and the plurality of external electrodes; <1> The electronic component according to claim 1.

[0081] <3> the first resin body has a first elastic modulus; the second resin body has a second elastic modulus; the plurality of external electrodes have a third elastic modulus; the second elastic modulus is smaller than the first elastic modulus and the third elastic modulus; <1> or <2> The electronic component according to claim 1.

[0082] <4> In a second direction perpendicular to the first direction, The length of the second resin body is 0.1 mm or more and 0.9 mm or less. <1> ~ <3> 0.150.15 <5> The second resin body is The contact hole is formed at a position 0.15 mm from the first end and at a position 0.15 mm from the second end. <1> ~ <4> 1. An electronic component according to any one of the preceding claims.

[0083] <6> In the first direction, The thickness of the second resin body is 0.01 mm or more and 0.2 mm or less. <1> ~ <5> 1. An electronic component according to any one of the preceding claims.

[0084] <7> The plurality of electronic component bodies A capacitor element comprising: a valve metal substrate having a dielectric layer on at least one main surface thereof and divided into an anode terminal region and a cathode formation region; and a solid electrolyte layer provided on the dielectric layer in the cathode formation region. <1> ~ <6> 1. An electronic component according to any one of the preceding claims. [Explanation of symbols]

[0085] E1...first end E2…Second end F1…Front page F2…Second side F3…Side 3 F4…Fourth side 1, 1A, 1B...Solid electrolytic capacitor 10...Capacitor assembly 11, 12, 13, 14...Capacitor elements 19...Conductive member 20...1st terminal electrode 20E1,20E2,30E1,30E2...End 30…Second terminal electrode 40...Insulating resin body 111...Electrode foil 112...Dielectric layer 113...Solid electrolyte layer 201...Base 202…Tin layer 210, 211...First resin member 215...First adhesive layer 310, 311...Second resin member 315...Second adhesive layer 400...Sealing body 401...Top 402...Bottom 403...First end surface 404…Second end face

Claims

1. a stack formed by stacking a plurality of electronic component elements in a first direction; a plurality of external electrodes electrically connected to each of the plurality of electronic component elements constituting the laminate; a first resin body that forms a sealed body by sealing the laminate; a second resin body formed on the plurality of external electrodes so as to contact the first resin body; Equipped with the encapsulant has a first end and a second end; The second resin body is formed near the first end and the second end of the sealing body.

2. a second bonding strength between the second resin body and the first resin body and the plurality of external electrodes is higher than a first bonding strength between the first resin body and the plurality of external electrodes; The electronic component according to claim 1 .

3. the first resin body has a first elastic modulus; the second resin body has a second elastic modulus; the plurality of external electrodes have a third elastic modulus; 3. The electronic component according to claim 1, wherein the second elastic modulus is smaller than the first elastic modulus and the third elastic modulus.

4. In a second direction perpendicular to the first direction, 3. The electronic component according to claim 1, wherein the second resin body has a length of 0.1 mm or more and 0.9 mm or less.

5. The second resin body is 3. The electronic component according to claim 1, wherein the first end is located 0.15 mm from the first end and the second end is located 0.15 mm from the second end.

6. In the first direction, 3. The electronic component according to claim 1, wherein the second resin body has a thickness of 0.01 mm or more and 0.2 mm or less.

7. The plurality of electronic component bodies A capacitor element comprising: a valve metal substrate having a dielectric layer on at least one main surface thereof and divided into an anode terminal region and a cathode formation region; and a solid electrolyte layer provided on the dielectric layer in the cathode formation region. The electronic component according to claim 1 or 2.

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