Substrate processing apparatus, detection method, method of manufacturing semiconductor device, and recording medium

Abstract

To provide a technique for easily detecting a component state.SOLUTION: A processing chamber configured to process a substrate, a transfer unit configured to transfer the substrate, a component related to at least one of the processing chamber and the transfer unit, a storage unit configured to store a plurality of operation events, a detection unit configured to detect an operation sound of the component, and a control unit configured to acquire data of the operation sound detected by the detection unit, wherein a plurality of areas in which at least one of the processing chamber, the transfer unit, and the component is installed is set, and the detection unit is provided in at least one of the plurality of areas; The control unit is configured to be able to select at least one area from among the plurality of areas in which the operating sound is to be detected, in correspondence with each of the plurality of operation events, and acquire detection data from the detection unit in the selected at least one area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus, a detection method, a method for manufacturing a semiconductor device, and a program. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there have been proposed substrate processing apparatuses that process substrates in a manufacturing process of semiconductor devices. In the substrate processing apparatuses, the states of components are detected and maintenance such as component replacement is sometimes performed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-129118 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for easily detecting the state of a component. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, a processing chamber for processing a substrate; a transport unit that transports the substrate; a plurality of components related to at least one of the processing chamber and the transfer unit; a storage unit for storing a plurality of motion events; a detection unit capable of detecting operation sounds of the components; a control unit configured to be able to acquire information about the operation sound detected by the detection unit; and the detection unit is provided in at least one of the plurality of areas, A technology is provided in which the control unit is configured to select at least one area from the plurality of areas in which the operation sound is detected in response to each of the plurality of operation events, and to acquire detection data from the detection unit in the selected at least one area. [Effects of the Invention]

[0006] According to the present disclosure, the component state can be easily detected. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a schematic cross-sectional view of a substrate processing apparatus suitable for use in one embodiment of the present disclosure; FIG. [Figure 2] 1 is a vertical cross-sectional view showing a processing furnace and its vicinity of a substrate processing apparatus suitably used in one embodiment of the present disclosure. [Figure 3] 1 is a schematic diagram showing a portion of a substrate processing apparatus suitably used in one aspect of the present disclosure, in which a detection unit is installed. [Figure 4] FIG. 1 is a block diagram of a control system preferably used in one embodiment of the present disclosure. [Figure 5] 10 is a flowchart of a sound data storage process according to an embodiment of the present disclosure. [Figure 6A] 1A and 1B are flowcharts of processes during each operation event of a sound data storage process according to an embodiment of the present disclosure. (A) is a flowchart of a sound data storage process during a wafer charge event according to an embodiment of the present disclosure. (B) is a flowchart of a sound data storage process during a boat load event according to an embodiment of the present disclosure. (C) is a flowchart of a sound data storage process during a temperature increase and vacuum event according to an embodiment of the present disclosure. (D) is a flowchart of a sound data storage process during a film processing event according to an embodiment of the present disclosure. [Figure 6B]1 is a flowchart of each process during each operation event of the sound data storage process according to one embodiment of the present disclosure. (E) is a flowchart of the sound data storage process during a temperature drop and atmospheric release event according to one embodiment of the present disclosure. (F) is a flowchart of the sound data storage process during a temperature drop and boat unload event according to one embodiment of the present disclosure. (G) is a flowchart of the sound data storage process during a temperature drop and wafer discharge event according to one embodiment of the present disclosure. [Figure 7] 10 is a table listing main sound sources, detection target parts, and reference sound data for each event according to one embodiment of the present disclosure. [Figure 8] 10 is a flowchart of an abnormal noise confirmation process according to an embodiment of the present disclosure. [Figure 9] FIG. 10 is a schematic cross-sectional view of the overall configuration of a substrate processing apparatus according to a modified example of the present disclosure. [Figure 10] FIG. 10 is a schematic configuration diagram of a substrate processing apparatus according to a modified example of the present disclosure, showing the entire apparatus in vertical cross section. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, one embodiment of the present disclosure will be described with reference to the drawings. Note that all drawings used in the following description are schematic, and the dimensional relationships, ratios, etc. of elements shown in the drawings do not necessarily correspond to the actual ones. Furthermore, the dimensional relationships, ratios, etc. of elements between multiple drawings do not necessarily correspond to the actual ones.

[0009] (1) Configuration of the substrate processing equipment The substrate processing apparatus 10 is configured as a vertical substrate processing apparatus that performs substrate processing steps such as heat treatment as one step in the manufacture of semiconductor devices. As shown in Figures 1 and 2, the substrate processing apparatus 10 includes a processing module 20, a processing transport section 30, a transport section 40, and a container loading / unloading section 50. When viewed from the front side of the substrate processing apparatus 10, these are arranged in the order of the loading / unloading section 50, the transport section 40, and the transport section 30. The processing module 20 is arranged above the transport section 30.

[0010] The processing module 20 is partitioned within the main housing 12, and includes a reaction tube 22 and a heater 24. The reaction tube 22 has a generally cylindrical shape with a closed upper end, and the heater 24 is disposed around the reaction tube 22. A flow path 24A is provided around the heater 24, forming a gas flow of an inert gas that prevents the heater 24 from overheating. The flow path 24A is connected to a gas supply pipe 114A that can supply the inert gas and an exhaust pipe 114B that can exhaust the inert gas. The reaction tube 22 is formed of, for example, quartz or silicon carbide (SiC). A processing chamber 22A for processing a wafer W as a substrate is formed within the reaction tube 22. The space within the processing module 20, which serves as a first processing area, is partitioned by the main housing 12 and is configured as an independent closed space independent of the housings 14 and 16, which will be described later. Similarly, the housings 14 and 16 are each partitioned from the main housing 12, and the internal spaces of the respective housings are configured as different closed spaces.

[0011] 3, a second detection unit 92 is installed inside the main housing 12. The second detection unit 92 detects operating sounds generated inside the main housing 12. Data detected by the second detection unit 92 is referred to as "second detection data 92D."

[0012] Below the processing module 20, a transfer chamber 32 and a transfer chamber 36 are provided in the processing transfer unit 30. The transfer chamber 32 is provided with a boat 34 that supports multiple wafers W and a boat elevator 35 that can raise and lower the boat 34. The boat elevator 35 is also referred to as a boat lifting unit. The wafers W are transferred to the boat 34 in the transfer chamber 32. The transfer chamber 36 is located adjacent to the front side of the transfer chamber 32. The transfer chamber 36 is provided with a transfer machine 38 that transfers the wafers W. The transfer chambers 32 and 36 are each configured as independent spaces partitioned by a housing 14 and a housing 16. An opening (not shown) is provided between the housing 16 and a housing 18 (described later) through which the wafers W can be moved. A pod opener 43 is provided on the housing 16 side of the opening. The pod opener 43 has a capping / removal mechanism 41, and the cap of the pod P is opened and closed by the capping / removal mechanism 41. The transfer chamber 32 and the transfer chamber 36 form a third area. In this embodiment, the third area may be called a third transfer area. At least one of the boat elevator 35 and the transfer machine 38, or both, are collectively called a second transfer section.

[0013] 3, a third detection unit 93 is installed in the transfer chamber 32. The third detection unit 93 detects operation sounds generated in the transfer chamber 32. Data detected by the third detection unit 93 is referred to as "third detection data 93D."

[0014] The transfer unit 40 is disposed in front of the processing modules 20 and the transfer chamber 36. The transfer unit 40 is provided with a shelf 44 for storing pods P, which are containers for accommodating wafers W, a mounting table 45 for placing the pods P, and a carrier loader 46, which serves as a first transfer unit. The shelf 44 has shelf plates 44A, and the containers are held by the shelf plates 44A. The carrier loader 46 has an elevator 46A, which serves as a lifting unit for raising and lowering the pods P, and a pod transfer mechanism 46B that moves the pods P between the transfer unit 40 and a container loader / unloader 50, which will be described later. A transfer chamber 42, which has an independent space partitioned by a housing 18, is formed within the transfer unit 40.

[0015] As shown in FIG. 3, first detection units 91A and 91B are installed in the transfer chamber 42. The first detection unit 91A is installed at the top of the transfer chamber 42, and the first detection unit 91B is installed below the first detection unit 91A. The first detection units 91A and 91B detect operating sounds generated in the transfer chamber 42. The data (information) detected by the first detection units 91A and 91B are referred to as "first detection data 91AD" and "first detection data 91BD," respectively. The first detection unit 91A is also referred to as a first sub-detection unit, and the second detection unit 91B is also referred to as a second sub-detection unit. The first sub-detection unit and the second sub-detection unit are collectively referred to as the first detection units.

[0016] The interior of the container loading / unloading section 50 is configured as an independent space partitioned by the housing 15, and an opening (not shown) is provided to allow access to the interior of the housing 15 from the outside. A load port 52 is installed in the container loading / unloading section 50. The pod P is loaded onto the load port 52 through the opening by a transfer device (not shown) outside the substrate processing apparatus 10, and is also unloaded from the load port 52. An opening (not shown) that is opened and closed by a front shutter 51 is provided between the housing 15 and the housing 18, and the pod P moves between the housing 15 and the housing 18 through the opening. The area including the transfer section 40 is configured as a second area. The second area may be referred to as a second transfer area. The second area and the third area are partitioned by the housing, and each housing has a closed space.

[0017] 2, gas used for substrate processing is supplied into processing chamber 42 by gas supply mechanism 62 serving as a supply control system. Gas supply mechanism 62 is housed in supply box 60 serving as a second processing area. An independent closed space partitioned by housing 13A is formed within supply box 60. Note that gas supply mechanism 62 may include gas supply pipe 114A.

[0018] The gas supply mechanism 62 includes gas supply pipes 64a and 64b and inert gas supply pipes 64c and 64d. The gas supply pipes 64a and 64b are respectively provided with, in order from the upstream side, mass flow controllers (hereinafter referred to as MFCs) 66a and 66b, which are flow rate controllers (flow rate control units), and valves 68a and 68b, which are on-off valves. The gas supply pipe 64a is connected to a nozzle 28a penetrating a sidewall of a manifold 26 (described later), and the gas supply pipe 64b is connected to a nozzle 28b penetrating a sidewall of the manifold 26. The nozzles 28a and 28b are installed upright in the vertical direction within the reaction tube 22. The nozzles 28a and 28b are formed with a plurality of supply holes that open toward the wafers W held in the boat 34. For example, a source gas is supplied to the wafers W through the supply holes of the nozzle 28a, and a reactive gas is supplied to the wafers W through the supply holes of the nozzle 28b.

[0019] The inert gas supply pipes 64c and 64d are provided with MFCs 66c and 66d and valves 68c and 68d, in that order from the upstream direction. The inert gas supply pipe 64c is connected to the nozzle 28a, and the inert gas supply pipe 64d is connected to the nozzle 28b. An inert gas is supplied to the wafer W from the inert gas supply pipes 64c and 64d. Either or both of the source gas and the reactive gas are collectively referred to as a process gas. The process gas may include an inert gas.

[0020] 3, a fourth detection unit 94 is installed inside the supply box 60. The fourth detection unit 94 detects operation sounds generated inside the supply box 60. Data detected by the fourth detection unit 94 is referred to as "fourth detection data 94D."

[0021] As shown in Fig. 2, a cylindrical manifold 26 is connected to the lower end opening of the reaction tube 22 via a sealing member such as an O-ring, and supports the lower end of the reaction tube 22. The lower end opening of the manifold 26 is opened and closed by a disk-shaped seal cap 25A. A sealing member such as an O-ring is installed on the upper surface of the seal cap 25A, thereby airtightly sealing the inside of the reaction tube 22 from the outside air. A heat insulating part 25B is placed on the seal cap 25A.

[0022] An exhaust pipe 72 is attached to the manifold 26. A vacuum pump 78 serving as a vacuum exhaust device is connected to the exhaust pipe 72 via a pressure sensor 74 serving as a pressure detection unit that detects the pressure inside the processing chamber 22A and an APC (Auto Pressure Controller) valve 76 serving as a pressure adjustment unit. With this configuration, the pressure inside the processing chamber 22A can be adjusted to a processing pressure appropriate for the processing. An exhaust control system is mainly composed of the exhaust pipe 72 and the APC valve 76, and the exhaust control system is housed in an exhaust box 70 serving as a third processing area. Within the exhaust box 70, an independent closed space partitioned by a housing 13C is formed.

[0023] The processing module 20, the supply box 60, and the exhaust box 70 form a first area.

[0024] 3, a fifth detection unit 95 is installed inside the exhaust box 70. The fifth detection unit 95 detects operating sounds generated inside the exhaust box 70. Data detected by the fifth detection unit 95 is referred to as "fifth detection data 95D."

[0025] The processing chamber 22A can accommodate a boat 34 supporting multiple wafers W, e.g., 25 to 150 wafers W. The boat 34 is configured to support the wafers W in multiple stages, horizontally and with their centers aligned vertically, i.e., spaced apart. The boat 34 is made of a heat-resistant material such as quartz or SiC. The boat 34 is supported above the heat insulating portion 25B by a rotation shaft 25C that penetrates the seal cap 25A and the heat insulating portion 25B. The rotation shaft 25C is connected to a rotation mechanism 27 installed below the seal cap 25A and is rotatable while hermetically sealing the interior of the reaction tube 22. The seal cap 25A is driven vertically by a boat elevator 35. As a result, the boat 34 and the seal cap 25A are raised and lowered together, and the boat 34 is loaded into and unloaded from the reaction tube 22.

[0026] The main housing 12, housing 13A, housing 13B, housing 13C, housing 14, housing 15, housing 16, and housing 18, which house the various components, are supported on floor B. An underground space R is defined below floor B, and a pump 112 and a blower box 114 are provided therein. A fan capable of controlling the atmosphere around the heater 24 is provided within the blower box 114. An exhaust pipe 114B is connected to the blower box 114. The pump 112 is connected to the exhaust pipe 72. The pump 112 exhausts gas from the processing chamber 22A. A sixth detector 96 is provided near the pump 112 in the underground space, and a seventh detector 97 is provided within the blower box 114. The sixth detector 96 detects operating sounds generated within the basement. The seventh detector 97 detects operating sounds generated within the blower box 114. The data detected by the sixth detector 96 is referred to as "sixth detected data 96D," and the data detected by the seventh detector 97 is referred to as "seventh detected data 97D."

[0027] 4, controller 121, which is a control unit, is configured as a computer including a CPU (Central Processing Unit) 121a, RAM (Random Access Memory) 121b, storage device 121c, and I / O port 121d. RAM 121b, storage device 121c, and I / O port 121d are configured to be able to exchange data with CPU 121a via internal bus 121e. An input / output device 122 configured as, for example, a touch panel, and a display unit 123 are connected to controller 121.

[0028] The storage device 121c as a storage unit is configured with, for example, a flash memory, an HDD (Hard Disk Drive), etc. Control programs for controlling the operation of the substrate processing apparatus, process recipes describing procedures and conditions for substrate processing (described later), etc., are readably stored in the storage device 121c. The process recipe is a combination of procedures for substrate processing (described later) that are executed by the controller 121 to obtain a predetermined result, and functions as a program. Hereinafter, the process recipes, control programs, etc. are collectively referred to simply as programs (program products). The process recipes are also simply referred to as recipes. In this specification, the term "program" may refer to a recipe alone, a control program alone, or both. The RAM 121b is configured as a memory area (work area) for temporarily storing programs, data, etc. read by the CPU 121a.

[0029] The I / O port 121d is connected to the above-mentioned MFCs 66a to 66d, valves 68a to 68d, APC valve 76, vacuum pump 78, rotation mechanism 27, boat elevator 35, first detectors 91A and 91B, second detector 92, third detector 93, fourth detector 94, fifth detector 95, sixth detector 96, and seventh detector 97. The detected data from the first detectors 91A and 91B, second detector 92, third detector 93, fourth detector 94, fifth detector 95, sixth detector 96, and seventh detector 97 is connected via a filter that allows only wavelengths of a predetermined width to pass. This eliminates the need for the controller 121 to perform discrimination processing such as noise removal.

[0030] The CPU 121a is configured to read and execute a control program from the storage device 121c, and also to read a recipe from the storage device 121c in response to input of an operation command from the input / output device 122. The CPU 121a is configured to control the flow rate adjustment operation of various gases by the MFCs 66a to 66d, the opening and closing operation of the valves 68a to 68d, the opening and closing operation of the APC valve 76, the start and stop of the vacuum pump 78, the rotation and rotation speed adjustment operation of the boat 34 by the rotation mechanism 27, the raising and lowering operation of the boat 34 by the boat elevator 35, and the like, in accordance with the contents of the read recipe.

[0031] The controller 121 can be configured by installing the above-mentioned program stored in an external storage device 124 (for example, a magnetic disk such as a hard disk, an optical disk such as a CD, or a semiconductor memory such as a USB memory) into a computer. The storage device 121c and the external storage device 124 are configured as computer-readable recording media. Hereinafter, these will be collectively referred to simply as recording media. When the term recording media is used in this specification, it may include only the storage device 121c alone, only the external storage device 124 alone, or both. Note that the program may be provided to the computer using a communication means such as the Internet or a dedicated line, without using the external storage device 124.

[0032] The controller 100 is housed in a controller box 90. An independent space partitioned by a housing 13B is formed inside the controller box 90. Instead of being installed inside the supply box 60, the fourth detection unit 94 may be installed inside the controller box 90 to detect operation sounds generated inside the controller box 90.

[0033] Next, the reference sound data stored in advance in the storage device 121c or the external storage device 123 will be described.

[0034] The reference sound data D is data of a normal sound pattern corresponding to the detection data detected by the first detection unit 91A, 91B, the second detection unit 92, the third detection unit 93, the fourth detection unit 94, the fifth detection unit 95, the sixth detection unit 96, and the seventh detection unit 97 during each operation event described below when each part of the substrate processing apparatus 10 is operating normally.

[0035] When there are multiple detection targets for each operation event, the reference sound data D is stored as a pattern that integrates multiple detection data. For example, the reference sound data D for a wafer charge event is a pattern that integrates detection data detected by the first detection units 91A, 91B and the third detection unit 93 when each unit is operating normally. The integrated pattern is also called a normal sound feature pattern. Furthermore, within each operation event, the reference sound data D is stored as data accompanied by a time series of processing. The reference sound data D is compared with the detection data detected during actual operation, and an abnormality is determined if the difference exceeds a predetermined threshold value TH, for example.

[0036] When multiple detectors exist in the same area, the reference sound data D is stored as a pattern that integrates the data detected by each detector. For example, in the second area, the data detected by the first detectors 91A and 91B is stored as a pattern that integrates the data. Here, using multiple detectors in one area means detecting the operating status of components located in different locations within the same area, or detecting the operating status of multiple components that are located close to each other and generate different operating sounds. For example, in area 2, the first detector 91A detects the operating sounds of the area above the elevator 46A and the shelves 44, while the first detector 91B detects the area below the elevator 46A and the front shutter 51.

[0037] Furthermore, the reference sound data D may be stored for each type of operation. Furthermore, operational events may be set for each type of operation of the apparatus. Examples of the operation types include operation for each type of substrate processing, operation with or without a substrate in the processing chamber, operation for each type of substrate, operation for each state of the substrate, operation for initial setup of the apparatus, operation during maintenance of the apparatus, etc.

[0038] Next, specific examples of operation types will be described. Substrate processing can be performed in a variety of ways, such as cycle processing, in which gases are alternately supplied to a processing chamber, or chemical vapor deposition (CVD) processing, in which gases are simultaneously supplied to a processing chamber. Cycle processing and CVD processing may involve different component operating conditions, such as different valve opening and closing timings and frequencies. Therefore, it is desirable to have reference sound data for each type of substrate processing.

[0039] The state with / without a substrate in the processing chamber will now be described. The state with a substrate refers to, for example, a state in which a substrate W is present in the processing chamber and is processed through cycle processing, CVD processing, or the like. The state without a substrate refers to, for example, a state in which a cleaning process is performed to clean the processing chamber inner walls, or a seasoning process or conditioning process is performed to process the processing chamber inner walls, etc., before substrate processing, when no substrate W is present in the processing chamber. Since the operation of valves and pumps may differ when a substrate is present and when no substrate is present, it is desirable to have reference sound data for each operation with and without a substrate. Furthermore, in this case, reference sound data may be provided for each process, such as cleaning processing, seasoning processing, and conditioning processing.

[0040] The types of substrates will now be explained. There are types of substrates that differ in size and shape, such as 300mm substrates and 200mm substrates, and there are also types that differ in the material of the substrate itself, such as silicon substrates and SiC (silicon carbide) substrates. It is conceivable that the operating conditions of components will differ for each type of substrate, for example, the elevator ascent and descent speed and the rotation speed of the transfer machine will differ. For this reason, it is desirable to have reference sound data for each type of substrate.

[0041] The state of the substrate will now be described. The state of the substrate can be, for example, a state before the substrate is processed or a state after the substrate is processed. The state before the substrate is processed can be, for example, a state before the substrate is subjected to a heat treatment, and the state after the substrate is processed can be, for example, a state after the substrate has been subjected to a heat treatment. In addition, there are cases where many types of films are formed on the substrate and cases where only a few types of films are formed on the substrate, and in these cases, the stress of the entire film formed on the substrate differs. It is conceivable that the operating conditions of components will differ for each state of the board, for example, the elevator ascent / descent speed, the transfer machine rotation speed, etc. Therefore, it is desirable to have reference sound data for each state of the board.

[0042] The initial setup of the device will now be described. For example, teaching of a transport robot may be performed during the initial setup of the device. In this case, it is conceivable to perform the work by setting the operating speed of the transport robot slower than that during substrate processing. Therefore, it is desirable to have reference sound data during the initial setup of the device. Even better, a reference sound may be provided for each event during the initial setup, for example.

[0043] The following describes the case where the equipment is maintained. During the maintenance of the equipment, for example, maintenance of a transport robot or an elevator may be performed. In this case, it is conceivable to perform the work by slowing down the operating speed of the elevator or transport robot compared to when substrates are processed. Therefore, it is desirable to have reference sound data during the maintenance of the equipment. Even better, for example, a reference sound may be provided for each event during maintenance.

[0044] Data learned by machine learning can be used as the reference sound data D. Data learned by machine learning is data that takes into account, for example, the usage time, usage frequency, deterioration, etc. of parts. In other words, the reference sound data D can be generated by machine learning that targets information on the usage frequency of parts and the deterioration of part conditions.

[0045] Next, a substrate processing method using the substrate processing apparatus 10 will be described. Since this substrate processing method is also a method for manufacturing a semiconductor device, it is also referred to as a semiconductor device manufacturing method. The CPU 121a of the controller 121 loads a program stored in the storage device 121c into the RAM 121b, and executes control of the following operation events based on a recipe, for example: wafer charging, boat loading, temperature increase, vacuuming, film formation, temperature decrease, atmospheric return, boat unloading, and wafer discharge. Each component of the substrate processing apparatus 10 operates based on control signals from the CPU 121a. At the same time, the CPU 121a executes a sound data storage process for each operation event. That is, a process for switching the sound detection target for each operation event is executed. This process can also be said to be a process for selecting at least one area from multiple areas for operation sound detection corresponding to each of multiple operation events.

[0046] (Wafer charge) A pod P containing wafers W is loaded onto a load port 52 of a container loading / unloading unit 50 through an opening formed in the housing 15. When the front shutter 51 is opened, the carrier loader 46 moves the pod P into the transfer unit 40 and carries it to a predetermined shelf 44. The carrier loader 46 also moves the pod P stored on the shelf 44 or the pod P loaded from the load port 52 directly to the mounting table 45.

[0047] A door (not shown) of the pod P on the mounting table 45 is removed by the cap attaching / detaching mechanism 41, and the wafers W inside are taken out by the transfer machine 38 and transferred to the boat 34. During wafer charging, the transfer machine 38 and the carrier loader 46 are the main components that generate noise.

[0048] During the wafer charging process of transferring the wafer W from the load port 52 to the boat 34, as shown in FIG. 5, in the sound data storage process, if it is determined in step S10 that the wafer charging process has started, the wafer charging sound process is executed in step S12. As shown in FIG. 6A(A), in the wafer charging sound process, the first detector 91A, the first detector 91B, and the third detector 93 are selected as detection targets in step S12A. This instructs only the first detector 91A, the first detector 91B, and the third detector 93 to detect operation sounds. In step S12B, the controller 121 acquires (receives) the first detection data 91AD, the first detection data 91BD, and the third detection data 93D, and in step S12C, the first detection data 91AD, the first detection data 91BD, and the third detection data 93D are stored in the storage device 121c together with the detection times. In step S12D, it is determined whether the boat loading process has started, and if the determination is negative, the process returns to step S12B and the above process is repeated. As a result, the first detection data 91AD, the first detection data 91BD, and the third detection data 93D are stored in the storage device 121c together with the detection times until the wafer charging process is completed.

[0049] (boat load) When a predetermined number of wafers W are loaded into the boat 34, the lower end of the reaction tube 22, which has been closed by a furnace port shutter (not shown), is opened. The boat 34 holding the group of wafers W is raised by the boat elevator 35 and loaded into the processing chamber 22A inside the reaction tube 22. Once the boat 34 is loaded, the processing chamber 22A is airtightly closed by the seal cap 25A. During boat loading, the boat elevator 35 and the seal cap 25A (furnace port seal cap) are the main components that generate noise.

[0050] In the sound data storage process, if it is determined in step S12D that the boat loading process has started, the boat loading sound process is started in step S14. In the boat loading sound process, as shown in FIG. 6A(B), in step S14A, the second detection unit 92 and the third detection unit 93 are selected as detection targets. This instructs only the second detection unit 92 and the third detection unit 93 to detect operation sounds. In step S14B, the controller 121 acquires the second detection data 92D and the third detection data 93D, and in step S14C, stores the second detection data 92D and the third detection data 93D together with the detection time in the storage device 121c. In step S14D, it is determined whether the heating and vacuuming processes have started. If the determination is negative, the process returns to step S14B and repeats the above process. As a result, the second detection data 92D and the third detection data 93D together with the detection time are stored in the storage device 121c until the boat loading process is completed.

[0051] (heating, vacuuming) After the boat loading process, the atmosphere in the reaction tube 22 is heated to a predetermined temperature by the heater 24, and the reaction tube 22 is evacuated to a predetermined pressure by the operation of the vacuum pump 78 and the pump 112. During the heating and evacuation, the vacuum pump 78 and the pump 112 are the main noise sources.

[0052] In the sound data storage process, if it is determined in step S14D that the boat loading process has started, the heating and vacuuming sound processes are started in step S16. In the heating and vacuuming sound processes, as shown in FIG. 6A(C), the second detection unit 92, the fourth detection unit 94, the fifth detection unit 95, and the sixth detection unit 96 are selected as detection targets in step S16A. This instructs only the second detection unit 92, the fourth detection unit 94, the fifth detection unit 95, and the sixth detection unit 96 to detect operation sounds. In step S16B, the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, and the sixth detection data 96D are acquired, and in step S16C, the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, and the sixth detection data 96D are stored in the storage device 121c together with the detection times. In step S16D, it is determined whether the film formation process has started, and if the determination is negative, the process returns to step S16B and the above process is repeated. As a result, the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, and the sixth detection data 96D are stored in the storage device 121c together with the detection times until the temperature increase and evacuation processes are completed.

[0053] (membrane treatment) After predetermined conditions for the temperature and pressure inside the reaction tube 22 are met, the boat 34 is rotated by the rotation mechanism 27, and the process gas flows through the gas supply pipes 64a and 64b according to a predetermined procedure and is introduced into the process chamber 22A from the nozzles 28a and 28b. The introduced process gas passes through the process chamber 22A and is exhausted from the exhaust pipe 72. The process gas comes into contact with the surface of the wafer W as it passes through the process chamber 22A. At this time, a film process such as film formation or film modification is performed on the surface of the wafer W. During the film process, each part of the gas supply mechanism 62 (e.g., the supply pipes and valves) is a major source of noise.

[0054] In the sound data storage process, if it is determined in step S16D that membrane processing has started, a process of collecting sounds during membrane processing is started in step S18. In the collection process, as shown in FIG. 6A(D), in step S18A, the second detection unit 92, the fourth detection unit 94, the fifth detection unit 95, and the sixth detection unit 96 are selected as detection targets. This instructs only the second detection unit 92, the fourth detection unit 94, the fifth detection unit 95, and the sixth detection unit 96 to detect operation sounds. In step S18B, the controller 121 acquires the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, and the sixth detection data 96D, and in step S18C, the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, and the sixth detection data 96D are stored in the storage device 121c together with the detection times. In step S18D, it is determined whether the temperature-lowering and atmospheric exposure process has started, and if the determination is negative, the process returns to step S18B and the above process is repeated. As a result, the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, and the sixth detection data 96D are stored in the storage device 121c together with the detection times until the membrane process is completed.

[0055] (cooling down, open to the atmosphere) After the preset processing time has elapsed, inert gas is supplied from inert gas supply pipes 64c and 64d to processing chamber 42, the atmosphere in processing chamber 57 is replaced with inert gas, and the pressure in processing chamber 22A is returned to normal pressure. Note that the processing time in this specification refers to the time the processing continues. This also applies to the following explanations. During the temperature drop and atmospheric release, the fan and pump 112 in blower box 114 are the main noise sources.

[0056] In the sound data storage process, when it is determined in step S18D that the temperature drop and atmosphere release process has started, the temperature drop and atmosphere release sound process is started in step S20. In the temperature drop and atmosphere release sound process, as shown in Fig. 6B(E), the second detection unit 92, the fourth detection unit 94, the fifth detection unit 95, the sixth detection unit 96, and the seventh detection unit 97 are selected as detection targets in step S20A. This instructs only the second detection unit 92, the fourth detection unit 94, the fifth detection unit 95, the sixth detection unit 96, and the seventh detection unit 97 to detect operation sounds. In step S20B, the controller 121 acquires the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, the sixth detection data 96D, and the seventh detection data 97D. In step S20C, the controller 121 stores the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, the sixth detection data 96D, and the seventh detection data 97D together with the detection times in the storage device 121c. In step S20D, it is determined whether the boat unloading process has started. If the determination is negative, the controller 121c returns to step S20B and repeats the above process. As a result, the second detection data 92D, the fourth detection data 94D, the fifth detection data 95D, the sixth detection data 96D, and the seventh detection data 97D together with the detection times are stored in the storage device 121c until the temperature drop and atmospheric exposure processes are completed.

[0057] (Boat unloading) Thereafter, the boat 34 is lowered by the boat elevator 35, the lower end of the manifold 26 is opened, and the processed wafers W held in the boat 34 are transferred from the lower end of the manifold 26 to the transfer chamber 32 outside the reaction tube 22. During boat unloading, the boat elevator 35 and the seal cap 25A are the main components that generate noise.

[0058] In the sound data storage process, if it is determined in step S20D that the boat unloading process has started, the boat unloading sound process is started in step S22. In the boat unloading sound process, as shown in FIG. 6B(F), the second detection unit 92 and the third detection unit 93 are selected as detection targets in step S22A. This instructs only the second detection unit 92 and the third detection unit 93 to detect operation sounds. In step S22B, the controller 121 acquires the second detection data 92D and the third detection data 93D, and in step S22C, stores the second detection data 92D and the third detection data 93D together with the detection time in the storage device 121c. In step S22D, it is determined whether the wafer discharge process has started. If the determination is negative, the process returns to step S22B and repeats the above process. As a result, the second detection data 92D and the third detection data 93D together with the detection time are stored in the storage device 121c until the boat unloading process is completed.

[0059] (wafer discharge) The processed wafers W unloaded from the boat are removed from the boat 34 by the transfer machine 38 and returned to an empty pod P previously transferred onto the mounting table 45, and a door is attached to the wafer loading / unloading opening of the pod P. During wafer discharging, the transfer machine 38 and the carrier loader 46 are the main noise generating components.

[0060] The pod P, whose wafer loading / unloading opening has been closed, is transported by the carrier loader 46 and delivered to a designated shelf 44A in the transport chamber 42.

[0061] The pod P is temporarily stored, and the carrier loader 46 is returned from the shelf 44A to the load port 52 at a predetermined timing. Note that the pod P containing the processed wafers W may be returned directly to the load port 52 without temporary storage. The pod P returned to the load port 52 is transported to a predetermined process.

[0062] In the sound data storage process, if it is determined in step S24 that the wafer discharge process has started, the wafer discharge sound process is executed in step S24. In the wafer discharge sound process, as shown in FIG. 6B(G), in step S24A, the first detector 91A, the first detector 91B, and the third detector 93 are selected as detection targets. This instructs only the first detector 91A, the first detector 91B, and the third detector 93 to detect operation sounds. In step S24B, the controller 121 acquires the first detection data 91AD, the first detection data 91BD, and the third detection data 93D, and in step S24C, stores the first detection data 91AD, the first detection data 91BD, and the third detection data 93D together with the detection times in the storage device 121c. In step S24D, it is determined whether the wafer discharge process has ended. If the determination is negative, the process returns to step S24B and the above process is repeated. As a result, the first detection data 91AD, the first detection data 91BD, and the third detection data 93D are stored in the storage device 121c together with the detection times until the wafer charging process is completed. If the determination in step S24D is affirmative, this process ends.

[0063] 7 shows a chronological list of the components that are the main sound sources, the detection targets, and the corresponding reference sound data D for each of the above events. For example, in wafer charging, the transfer machine 38 and carrier loader 46 are the main sound source components, and the first detection units 91A and 91B and third detection unit 93 are the detection targets. The bottom row of the table shows the reference sound data that integrates the data detected from the detection targets under normal conditions for each event.

[0064] The data stored in the storage device 121c in the sound data storage process is subjected to an abnormal sound confirmation process to determine whether or not there is an abnormality.

[0065] 8, the abnormal noise confirmation process integrates detection data detected in the same event in step S30A. For example, in the wafer charge process event, the detected first detection data 91AD, first detection data 91BD, and third detection data 93D are integrated to create integrated detection pattern data T.

[0066] Next, in step S30B, the reference sound data D of the corresponding identical event is read, and in step S30C, the integrated detection pattern data T is compared with the reference sound data D. In step S30D, it is determined whether the difference in the comparison exceeds a threshold value TH that defines the normal range, and if the determination is affirmative, an abnormality notification is output in step S30E. The output of the abnormality notification can be executed by displaying it on a display unit, etc.

[0067] Next, a description will be given of the actions and effects obtained by the substrate processing apparatus 10 according to this embodiment. According to this embodiment, one or more of the following effects can be obtained.

[0068] (1) According to the substrate processing apparatus 10 of this embodiment, at least one area from among a plurality of areas for detecting operation sounds is selected in response to each of a plurality of operation events. Therefore, compared to the case where operation sounds are detected in all areas, the processing load in the controller 121 is reduced, and the load on the CPU 121a is lightened, while the status of the components can be detected.

[0069] (2) A detection unit is provided in at least one of the main housing 12 (part of the first area), the supply box 60 (part of the first area), the exhaust box 70 (part of the first area), the conveying unit 40 (part of the second area, also referred to as the second conveying area), and the conveying chamber 32 (part of the third area), so that the condition of the component in the area where the detection unit is located can be detected.

[0070] (3) A second transfer area includes a shelf that can hold a container and an elevator that can raise and lower the container to the position of the shelf, and a third area includes a third transfer area that includes a transfer machine that can transfer substrates to and from the second transfer area and a boat elevator that can raise and lower a boat that is loaded and unloaded into a processing chamber, and the first area includes a first processing area that includes a processing chamber, a second processing area that includes a supply control unit that controls gas supply to the processing chamber, and a third processing area that includes an exhaust control unit that controls gas exhaust from the processing chamber. Therefore, it is possible to detect the status of components in at least each area.

[0071] (4) The second and third transfer areas are provided in separate closed spaces separated by a housing, thereby reducing the influence of the third transfer area and facilitating the detection of sounds from the second transfer area.

[0072] (5) The first processing area, the second processing area, and the third processing area are each provided in a different closed space partitioned by a housing. Therefore, when attempting to detect sound from one of the first processing area, the second processing area, and the third processing area, the influence from the other areas can be reduced, making it easier to detect operation sound in the detection target area.

[0073] (6) The first area, second area, and third area are each provided in a different closed space partitioned by a housing, and a fourth area having at least a pump is provided below the floor supporting the housing, and a detection unit is provided in each of the first area, second area, third area, and fourth area. Therefore, when attempting to detect operation sound in one of the first area, second area, third area, and fourth area, the influence from the other areas can be reduced, making it easier to detect operation sound in the detection target area.

[0074] (7) Since multiple detectors are provided inside the housing, sound can be detected even if the housing or the component for which the operating sound is to be detected is large.

[0075] (8) The control unit is configured to not receive detection data from a detection unit corresponding to an area that is not a detection target, or not store the data in the memory unit after receiving it. Therefore, compared to detecting and storing operation sounds from a detection unit in an area that is not a detection target, the amount of data stored can be reduced, and the capacity burden on the memory unit can be reduced. Therefore, even devices with small storage capacities can continue to operate.

[0076] (9) The control unit is configured to detect only the operation sounds generated in the area where the operation sound detection is performed among multiple areas. This suppresses the detection of unnecessary sounds that become noise in areas that are not the detection target, thereby improving the accuracy of detecting the condition of the component. Furthermore, the network load can be reduced compared to when the operation sounds are detected by the detection unit in the area that is not the detection target and the detected data is sent to the control unit. Therefore, even devices with small network capacity can continue to operate.

[0077] (10) The control unit is configured to not detect sounds generated in areas where operation sound detection is not performed. Therefore, preparations for detecting operation sound, such as operating a detection unit, can be omitted in areas that are not subject to detection. This reduces the burden on the control unit.

[0078] (11) Operation events are set for each operation type of the substrate processing apparatus. Therefore, it is possible to detect operation sounds for each operation type. In other words, it is possible to detect the state of components for each operation type.

[0079] (12) The system stores detection data related to detected operating sounds and reference data that can be compared with the detection data, and the reference data is recorded for each operation type. Therefore, the system can compare the detection data related to detected operating sounds with the reference data for each operation type. This allows the system to accurately grasp the condition of parts for each operation type.

[0080] (13) A storage unit is provided for storing detection data related to detected operating sounds and reference data that can be compared with the detection data. This allows preparation for comparing the detection data related to detected operating sounds with the reference data for each operation type. This allows accurate understanding of the component status for each operation type.

[0081] (14) The reference data is data learned through machine learning. Therefore, even if the condition of a part changes over time, it is possible to extract reference data that reflects the change, so accurate reference data can always be maintained.

[0082] (15) The pattern representing the detection data is a pattern that integrates the detection information of multiple areas for each action event. Therefore, if there are multiple detection targets for each action event, the multiple detection data are integrated, so the number of reference sound data to be saved can be reduced, and the load on the memory unit can be reduced. Compared to storing each pattern, the capacity burden on the memory unit can be reduced.

[0083] (16) The detection data can be arranged in chronological order, and the patterns of the detection data in chronological order can be compared with the patterns of the reference data. If there are any differences, the time when the abnormal noise occurred can be identified, and the part that was operating at that time can be identified. Therefore, the time when the part's condition changed can be easily identified.

[0084] (17) The pattern of the detected data is a pattern for each operation event and for each part, so that the state of each part used can be grasped for each operation event.

[0085] In this embodiment, sound is not detected by the non-selected detectors, but it is also possible not to receive detection data from the detectors or not to store the data in the storage unit after receiving it. In other words, it is also possible to receive only data from the selected detectors or to store only data from the selected detectors in the storage unit.

[0086] Furthermore, although the above describes an example in which two detection units are used in the second area and one detection unit is used in the other area, this is not limited to this, and the number of detection units may be set appropriately depending on the type and number of detection targets and operation.

[0087] (Variation) In the above embodiment, a vertical substrate processing apparatus has been described as an example, but the present invention can also be applied to a single-sheet type substrate processing apparatus 200 as shown in FIGS.

[0088] The substrate processing apparatus 200 is mainly composed of a load port 210, an atmospheric transfer chamber 220 as a transfer section, a load lock chamber 230, a vacuum transfer chamber 240, and a reactor 250 in which a processing chamber is formed.

[0089] The load port 210 is provided on the front side (front face) of the substrate processing apparatus 200, and the pod P is loaded onto the load port 210 and unloaded from the load port 210.

[0090] An atmospheric transfer chamber 220 is provided adjacent to the load port 210. An atmospheric transfer robot 222 that transfers wafers W is installed in the atmospheric transfer chamber 220. A sound detection unit 220A that detects operation sounds within the atmospheric transfer chamber 220 is provided in the atmospheric transfer chamber 220.

[0091] A load lock chamber 230 is provided on the opposite side of the atmospheric transfer chamber 220 from the load port 210. The load lock chamber 230 is provided with at least two placement surfaces 235 on which wafers W are placed.

[0092] On the opposite side of the load lock chamber 230 from the atmospheric transfer chamber 220, there is provided a vacuum transfer chamber 240, into which the wafer W is transferred under negative pressure. The vacuum transfer chamber 240 is formed inside a housing 241 and has a pentagonal shape in a plan view. Reactors 250 (250a to 250d) that process the load lock chamber 230 and the wafer W are connected to each side of the pentagon. Hereinafter, the four reactors 250a, 250b, 250c, and 250d will be collectively referred to as the reactors 250. A transfer robot 244 that transfers (transfers) the wafer W under negative pressure is installed approximately in the center of the vacuum transfer chamber 240. A sound detection unit 244A that detects operating sounds from the transfer robot 244 is provided near the transfer robot 244.

[0093] A processing chamber 251 is formed inside each of the reactors 250. A support table 252 for supporting a wafer W is provided inside each processing chamber 251, and an elevator 253 for raising and lowering the support table 252 is provided. A sound detection unit 253A for detecting operating sounds from the elevator 253 is provided near the elevator 253. Between each processing chamber 251 and the vacuum transfer chamber 240, the wafer W is transferred by a transfer robot 244 via gate valves 241 (241a to 241d).

[0094] 10, gas used for substrate processing is supplied into a processing chamber 251 by a gas supply mechanism 260 serving as a supply control system. The gas supply mechanism 260 includes a gas pipe 261 connected to the processing chamber 251 of the reactor 250. A gas source 262, an MFC 263, and a valve 264 are connected to the gas pipe 261 in this order from the upstream side. A sound detection unit 260A that detects operating sounds from the gas supply mechanism 260 is provided near the gas supply mechanism 260.

[0095] An exhaust pipe 265 is connected to the processing chamber 251. A valve 268, an APC valve 267, and a vacuum pump 266 are connected to the exhaust pipe 265. With this configuration, gas can be exhausted from the processing chamber 251, and the pressure inside the processing chamber 251 can be adjusted to a processing pressure appropriate for the processing. An exhaust control system 269 is mainly composed of the exhaust pipe 265, the valve 268, the APC valve 267, and the vacuum pump 266. A sound detection unit 269A that detects operating sounds from the exhaust control system 269 is provided near the exhaust control system 269.

[0096] Gas is supplied into the vacuum transfer chamber 240 by a gas supply mechanism 280 serving as a supply control system. The gas supply mechanism 270 includes a gas pipe 271 connected to the vacuum transfer chamber 240. A gas source 272, an MFC 273, and a valve 274 are connected to the gas pipe 271 in this order from the upstream side. A sound detection unit 270A that detects operating sounds from the gas supply mechanism 270 is provided near the gas supply mechanism 270.

[0097] An exhaust pipe 275 is connected to the load lock chamber 230. A valve 278, an APC valve 277, and a vacuum pump 276 are connected to the exhaust pipe 275. With this configuration, gas can be exhausted from the vacuum transfer chamber 240, and the pressure inside the vacuum transfer chamber 240 can be adjusted to a processing pressure appropriate for the processing. An exhaust control system 279 is mainly composed of the exhaust pipe 275, the valve 278, the APC valve 277, and the vacuum pump 276. A sound detection unit 279A that detects operating sounds from the exhaust control system 279 is provided near the exhaust control system 279.

[0098] Gas is supplied into the load lock chamber 230 by a gas supply mechanism 280 serving as a supply control system. The gas supply mechanism 280 includes a gas pipe 281 connected to the load lock chamber 230. A gas source 282, an MFC 283, and a valve 284 are connected to the gas pipe 281 in this order from the upstream side. A sound detection unit 280A that detects operating sounds from the gas supply mechanism 280 is provided near the gas supply mechanism 280.

[0099] An exhaust pipe 285 is connected to the load lock chamber 230. A valve 288, an APC valve 287, and a vacuum pump 286 are connected to the exhaust pipe 285. With this configuration, gas can be exhausted from the load lock chamber 230, and the pressure inside the load lock chamber 230 can be adjusted to a processing pressure appropriate for the process. An exhaust control system 289 is mainly composed of the exhaust pipe 285, the valve 288, the APC valve 287, and the vacuum pump 286. A sound detection unit 289A that detects operating sounds from the exhaust control system 289 is provided near the exhaust control system 289.

[0100] In the substrate processing apparatus 200, reference sound data D2 corresponding to each operation event is stored in the storage device 121c of the controller 121, similar to that in the substrate processing apparatus 10. In addition, a sound detection unit to be selected in association with each operation event executed in the substrate processing apparatus 200 is stored in the storage device 121c.

[0101] In the substrate processing apparatus 200 according to the modified example, the detection data from the sound detection unit selected for each operation event is stored together with a time series, similar to the substrate processing apparatus 10. The substrate processing apparatus 200 can also obtain one or more effects similar to those of the substrate processing apparatus 10.

[0102] For example, in the above-described embodiment, a process such as forming a silicon-containing film such as a SiN film or a SiO film can be performed in the process chamber 22A, but the present disclosure is not limited to such an embodiment. For example, the present disclosure can also be suitably applied to the formation of a film containing a metal element such as titanium (Ti), zirconium (Zr), hafnium (Hf), tantalum (Ta), niobium (Nb), aluminum (Al), molybdenum (Mo), or tungsten (W), i.e., a metal-based film, on the wafer W.

[0103] That is, this embodiment can be suitably applied when forming a film containing a predetermined element such as a semiconductor element or a metal element, but can also be suitably applied when performing processes such as oxidation, diffusion, annealing, and etching on a film formed on a wafer W.

[0104] Furthermore, the present disclosure is not limited to semiconductor manufacturing apparatuses that process semiconductor wafers such as the substrate processing apparatus 10 according to this embodiment, but can also be applied to LCD (Liquid Crystal Display) manufacturing apparatuses that process glass substrates, and the like. [Explanation of symbols]

[0105] W wafer (substrate) 10, 200 Substrate processing equipment 22A Processing Room 30 Conveying section 121 Controller (control unit)

Claims

1. a processing chamber for processing a substrate; a transport unit that transports the substrate; a component related to at least one of the processing chamber and the transfer unit; a storage unit for storing a plurality of motion events; a detection unit capable of detecting operation sounds of the components; a control unit configured to be able to acquire data of the operation sound detected by the detection unit; and a plurality of areas are set in which at least one of the processing chamber, the transfer unit, or the component is installed; the detection unit is provided in at least one of the plurality of areas, The control unit is configured to select at least one area from the plurality of areas in which the operation sound is to be detected, in response to each of the plurality of operation events, and to acquire detection data from the detection unit in the selected at least one area. Substrate processing equipment.

2. The area is a first area including at least the processing chamber; a second area including a first transport section capable of transporting at least a substrate, among the transport sections; a third area including a second transport unit that can move the substrate between the first area and the second area, The substrate processing apparatus according to claim 1 .

3. The second area is a second transport area including a shelf capable of holding a container and a lifting unit capable of raising and lowering the container to the position of the shelf, The third area is a third transfer area including a transfer machine capable of transferring substrates to and from the second transfer area and a boat lifting unit capable of lifting and lowering a boat that is carried in and out of the processing chamber; The first area is a first processing area including the processing chamber; a second processing area including a supply control unit that controls gas supply to the processing chamber; a third processing area including an exhaust control unit that controls gas exhaust from the processing chamber; have The substrate processing apparatus according to claim 2 .

4. The second transfer area and the third transfer area are provided in different closed spaces partitioned by a housing. The substrate processing apparatus according to claim 3 .

5. The substrate processing apparatus according to claim 3 , wherein the first processing area, the second processing area, and the third processing area are provided in different closed spaces partitioned by a housing.

6. the first area, the second area, and the third area are provided in different closed spaces partitioned by a housing, Further, a fourth area having at least a pump is provided below the floor supporting the housing, The substrate processing apparatus according to claim 2 , wherein the detection unit is provided in each of the first area, the second area, the third area, and the fourth area.

7. The substrate processing apparatus according to claim 4 , wherein a plurality of the detectors are provided in the housing.

8. the control unit is configured to not receive detection data from the detection unit corresponding to the area that is not the target of the detection, or to not store the detection data in the storage unit after receiving the detection data. The substrate processing apparatus according to claim 1 .

9. The substrate processing apparatus according to claim 1 , wherein the control unit is configured to be able to set the control unit to detect only sounds generated in an area where the operation sound detection is performed, among the plurality of areas.

10. The substrate processing apparatus according to claim 1 , wherein the control unit is configured to be able to set not to detect sounds generated in an area among the plurality of areas where the operation sound detection is not performed.

11. The substrate processing apparatus according to claim 1 , wherein the operational event is set for each operation type of the substrate processing apparatus.

12. The substrate processing apparatus according to claim 11 , further comprising: storing detection data relating to the detected operation sound and reference data that can be compared with the detection data, the reference data being recorded for each operation type.

13. The substrate processing apparatus according to claim 1 , further comprising: a storage unit that stores detection data relating to the detected operation sound and reference data that can be compared with the detection data.

14. The substrate processing apparatus according to claim 13 , wherein the reference data is data learned by machine learning.

15. the pattern representing the detection data is a pattern obtained by integrating detection information of a plurality of the areas for each of the motion events; The substrate processing apparatus according to claim 1 .

16. a storage unit that stores detection data relating to the detected operation sound and reference data that can be compared with the detection data; The detection data can be arranged in time series; comparing a pattern of the detected data with a pattern of the reference data in a time series; The substrate processing apparatus according to claim 15, wherein if there is a difference, the difference is identified as the time when the abnormal noise occurred, and the part that was operating at that time is identified.

17. The substrate processing apparatus according to claim 1 , wherein the pattern of the detection data is a pattern for each of the components for each of the operational events.

18. a processing chamber for processing a substrate; a transport unit that transports the substrate; a component related to at least one of the processing chamber and the transfer unit; a storage unit for storing a plurality of motion events; a detection unit capable of detecting operation sounds of the components; a control unit configured to be able to acquire data of the operation sound detected by the detection unit; and a substrate processing apparatus in which a plurality of areas are set in which at least one of the processing chamber, the transport unit, or the component is installed, and the detection unit is provided in at least one of the plurality of areas; selecting at least one area from the plurality of areas in which the operation sound is to be detected, corresponding to each of the plurality of operation events, and acquiring detection data from the detection unit in the at least one selected area; A detection method comprising:

19. the obtaining step; processing a substrate in the processing chamber; A method for manufacturing a semiconductor device using the method according to claim 18, comprising:

20. a processing chamber for processing a substrate; a transport unit that transports the substrate; a plurality of components related to at least one of the processing chamber and the transfer unit; a storage unit for storing a plurality of motion events; a detection unit capable of detecting operation sounds of the components; a control unit configured to be able to acquire data of the operation sound detected by the detection unit; and a substrate processing apparatus in which a plurality of areas are set in which at least one of the processing chamber, the transport unit, or the component is installed, and the detection unit is provided in at least one of the plurality of areas; A program that causes a computer to execute on a substrate processing apparatus the following: selecting at least one area from the plurality of areas in which the operation sound is to be detected, in response to each of the operation events; and acquiring detection data from the detection unit in the at least one selected area.

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