Electronic component

Abstract

To provide an electronic component capable of adjusting isolation while securing magnetic coupling.SOLUTION: The electronic part 1 includes an insulator 3 and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, and a fourth terminal electrode 7 disposed on a mounting surface of the insulator 3, and in the first conductive layer 10 and the second conductive layer 11, a first line S1 electrically connecting the third terminal electrode 6 and the fourth terminal electrode 7 and a second line S2 electrically connecting the first terminal electrode 4 and the second terminal electrode 5 are configured. The second line S2 includes the resistor R and the capacitor C provided on the end side connected to the second electrode 5 in the second line S2, the resistor R and the capacitor C are electrically connected in parallel, and the first line S1 and the second line S2 are magnetically coupled to each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] Patent Document 1 discloses an electronic component including: a directional coupler having an input port, an output port, and a coupled port, a main line having one end connected to the input port and the other end connected to the output port, a sub-line electromagnetically coupled to the main line and having one end connected to the coupled port, a first capacitor connected in parallel to the sub-line, a second capacitor connecting the other end of the sub-line to ground, an impedance element (resistive element) connecting the other end of the sub-line to ground and having an impedance less than a standardized impedance at a predetermined frequency, a matching circuit connected between one end of the sub-line and the coupled port and matching the impedance of the coupled port to the standardized impedance at the predetermined frequency, and a multilayer substrate formed by stacking multiple insulator layers and incorporating the directional coupler. In the electronic component described in Patent Document 1, the impedance element is arranged on the multilayer substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 079614 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of one aspect of the present invention is to provide an electronic component that can adjust isolation while ensuring magnetic coupling. [Means for solving the problem]

[0005] (1) An electronic component according to one aspect of the present invention includes an element body formed by stacking a plurality of insulating layers and a plurality of conductor layers, and an input electrode, an output electrode, a detection electrode, and a ground electrode arranged on a mounting surface of the element body, the plurality of conductor layers including a first conductor layer and a second conductor layer, the first conductor layer and the second conductor layer including a first line electrically connecting the input electrode and the output electrode and a second line electrically connecting the detection electrode and the ground electrode, the second line including a resistor and a capacitor provided on an end of the second line connected to the ground electrode, the resistor and the capacitor being electrically connected in parallel, and the first line and the second line being magnetically coupled.

[0006] In an electronic component according to one aspect of the present invention, a first line and a second line are magnetically coupled. This ensures magnetic coupling in the electronic component. In the electronic component, a resistor (termination resistor) and a capacitor are provided on the end of the second line connected to the ground electrode. The resistor and capacitor are electrically connected in parallel in the second line. In this way, by electrically connecting the resistor and capacitor in parallel in the second line, an attenuation pole can be formed in the relationship (graph) between frequency and isolation in the electronic component. This allows the isolation to be adjusted in the electronic component. Therefore, the electronic component can balance (adjust) magnetic coupling and isolation.

[0007] (2) In the electronic component of (1), the first line and the second line may have a portion extending side by side when viewed in the stacking direction of the element body, and may be magnetically coupled at that portion. This configuration ensures magnetic coupling between the first line and the second line.

[0008] (3) In the electronic component of (2) above, the first line and the second line do not have to overlap when viewed in the stacking direction. This configuration allows for a reduction in the dimensions of the element body in the stacking direction.

[0009] (4) In the electronic component of (1) or (2), the first line and the second line may have an overlapping portion when viewed from the stacking direction of the element body, and may be magnetically coupled at that portion. This configuration ensures magnetic coupling between the first line and the second line.

[0010] (5) In the electronic component of (4) above, one of the first line and the second line may be wider than the other of the first line and the second line when viewed in the stacking direction. With this configuration, even if there is a misalignment in the stacking of the first conductor layer and the second conductor layer, the first line and the second line overlap in the stacking direction. Therefore, in the electronic component, even if there is a misalignment in the stacking of the first conductor layer and the second conductor layer, magnetic coupling between the first line and the second line can be ensured.

[0011] (6) In the electronic component of (5) above, in a portion where the first line and the second line overlap as viewed from the stacking direction, one of the first line and the second line may be covered by the other of the first line and the second line. In this configuration, one of the first line and the second line does not protrude (extend) beyond the other of the first line and the second line. This makes it possible to more reliably ensure magnetic coupling between the first line and the second line.

[0012] (7) In any one of the electronic components (1) to (6) above, the resistor and the capacitor may be disposed closer to the ground electrode than the detection electrode. The resistor is a termination resistor, and is therefore preferably disposed around the ground electrode. Therefore, by disposing the resistor and the capacitor electrically connected in parallel near the ground electrode, the resistor and the capacitor can be disposed efficiently in the element body.

[0013] (8) In the electronic component of any one of (1) to (7) above, the resistor may be disposed inward of the capacitor in the element body as viewed in the stacking direction. This configuration can prevent the resistor from peeling off. [Effects of the Invention]

[0014] According to one aspect of the present invention, it is possible to adjust isolation while ensuring magnetic coupling. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a perspective view of an electronic component according to a first embodiment. [Figure 2] 2(a), 2(b), and 2(c) are diagrams showing the first conductor layer, the second conductor layer, and the third conductor layer included in the electronic component shown in FIG. [Figure 3] 3(a), 3(b), 3(c), 3(d), 3(e), 3(f), and 3(g) are diagrams showing conductor patterns provided on the electronic component shown in FIG. [Figure 4] FIG. 4 is a diagram showing a cross-sectional configuration of a part of the electronic component shown in FIG. [Figure 5] FIG. 5 is a diagram showing a cross-sectional configuration of a part of an electronic component including a resistor pattern. [Figure 6] FIG. 6 is a diagram showing a cross-sectional configuration of a part of an electronic component including a conductor pattern. [Figure 7] FIG. 7 is a diagram showing a cross-sectional configuration of a part of an electronic component including a conductor pattern. [Figure 8] FIG. 8 is a diagram showing a conductor pattern included in the electronic component shown in FIG. [Figure 9] FIG. 9 is an equivalent circuit diagram of the electronic component shown in FIG. [Figure 10] 10(a) and 10(b) are diagrams showing a first conductor layer and a second conductor layer included in the electronic component according to the second embodiment. [Figure 11] 11(a), 11(b), 11(c), 11(d), 11(e), 11(f), and 11(g) are diagrams showing conductor patterns provided on an electronic component. [Figure 12] FIG. 12 is a diagram showing a cross-sectional configuration of a part of an electronic component including a conductor pattern. [Figure 13] FIG. 13 is a diagram showing a conductor pattern provided on an electronic component. [Figure 14] FIG. 14 is an equivalent circuit diagram of the electronic component. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and redundant description will be omitted.

[0017] [First embodiment] Fig. 1 is a perspective view of an electronic component according to a first embodiment. The electronic component 1 shown in Fig. 1 is a directional coupler. As shown in Fig. 1, the electronic component 1 includes a substrate 2, an insulator (element body) 3, a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, and a fourth terminal electrode 7.

[0018] The substrate 2 has, for example, a rectangular parallelepiped shape. The rectangular parallelepiped shape may include a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The substrate 2 has, as its outer surfaces, a pair of opposing end faces 2a, 2b, a pair of opposing main faces 2c, 2d, and a pair of opposing side faces 2e, 2f.

[0019] The facing direction in which the pair of end faces 2a, 2b face each other is the first direction D1. The facing direction in which the pair of main faces 2c, 2d face each other is the second direction D2. The facing direction in which the pair of side faces 2e, 2f face each other is the third direction D3. In this embodiment, the first direction D1 is the longitudinal direction of the substrate 2. The second direction D2 is the height direction of the substrate 2 and is perpendicular to the first direction D1. The third direction D3 is the width direction of the substrate 2 and is perpendicular to the first direction D1 and the second direction D2. Viewing from the second direction D2 corresponds to a planar view.

[0020] The pair of end faces 2a, 2b extend in the second direction D2 to connect the pair of main faces 2c, 2d. The pair of end faces 2a, 2b also extend in the third direction D3. The pair of side faces 2e, 2f extend in the second direction D2 to connect the pair of main faces 2c, 2d. The pair of side faces 2e, 2f also extend in the first direction D1. The dimension of the substrate 2 in the first direction D1 may be, for example, 0.65 mm. The dimension of the substrate 2 in the third direction D3 may be, for example, 0.5 mm.

[0021] The substrate 2 can be made of a material that is chemically and thermally stable, generates little stress, and can maintain a smooth surface. The material is not particularly limited, but examples that can be used include silicon single crystal, alumina, sapphire, aluminum nitride, MgO single crystal, SrTiO3 single crystal, surface-oxidized silicon, glass, quartz, and ferrite.

[0022] The insulator 3 has a rectangular parallelepiped shape. The insulator 3 has, as its outer surfaces, a pair of end faces 3a, 3b facing each other, a pair of main faces 3c, 3d facing each other, and a pair of side faces 3e, 3f facing each other. The pair of end faces 3a, 3b face each other in a first direction D1. The pair of main faces 3c, 3d face each other in a second direction D2. The pair of side faces 3e, 3f face each other in a third direction D3.

[0023] The pair of end faces 3a, 3b extend in the second direction D2 to connect the pair of principal faces 3c, 3d. The pair of end faces 3a, 3b also extend in the third direction D3. The pair of side faces 3e, 3f extend in the second direction D2 to connect the pair of principal faces 3c, 3d. The pair of side faces 3e, 3f also extend in the first direction D1. In this embodiment, the dimension of the insulator 3 in the first direction D1 is smaller than the dimension of the substrate 2 in the first direction D1. The dimension of the insulator 3 in the third direction D3 is smaller than the dimension of the substrate 2 in the third direction D3. Note that the dimension of the insulator 3 in the first direction D1 may be equal to the dimension of the substrate 2 in the first direction D1, or the dimension of the insulator 3 in the third direction D3 may be equal to the dimension of the substrate 2 in the third direction D3.

[0024] In this embodiment, "equivalent" does not only mean equal, but also may mean values ​​that include slight differences or manufacturing errors within a preset range. For example, if multiple values ​​are within a range of ±5% of the average value of the multiple values, the multiple values ​​are defined as equivalent.

[0025] The insulator 3 is formed by stacking multiple insulator layers. The insulator layers may be made of an organic insulating material such as polyimide. The insulator layers are stacked in the second direction D2. That is, the second direction D2 is the stacking direction. In an actual insulator 3, the multiple insulator layers are integrated to the extent that the boundaries between the layers are not visible.

[0026] The substrate 2 and the insulator 3 are integrally formed. The substrate 2 and the insulator 3 are arranged such that the main surface 2c and the main surface 2d face each other. A planarization layer 8 is arranged between the substrate 2 and the insulator 3. The planarization layer 8 is arranged between the main surface 2c of the substrate 2 and the main surface 3d of the insulator 3. The planarization layer 8 may be made of silicon nitride, alumina, silicon oxide, or the like.

[0027] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 are arranged on the main surface (mounting surface) 3c of the insulator 3. The first terminal electrode 4 may be a coupling electrode (detection electrode). The second terminal electrode 5 may be a ground electrode. The third terminal electrode 6 may be a signal input electrode. The fourth terminal electrode 7 may be a signal output electrode.

[0028] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 have a substantially rectangular shape in a plan view. The rectangular shape may include a shape in which the corners and ridges are chamfered, and a shape in which the corners and ridges are rounded. In this embodiment, the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 have a rectangular shape with one rounded corner in a plan view. The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 are each disposed at a corner of the insulator 3.

[0029] The first terminal electrode 4 is disposed near the end face 3a and the side face 3e. The second terminal electrode 5 is disposed near the end face 3b and the side face 3e. The third terminal electrode 6 is disposed near the end face 3a and the side face 3f. The fourth terminal electrode 7 is disposed near the end face 3b and the side face 3f.

[0030] The first terminal electrode 4 and the second terminal electrode 5 are arranged at an interval in the first direction D1. The third terminal electrode 6 and the fourth terminal electrode 7 are arranged at an interval in the first direction D1. The first terminal electrode 4 and the third terminal electrode 6 are arranged at an interval in the third direction D3. The second terminal electrode 5 and the fourth terminal electrode 7 are arranged at an interval in the third direction D3. The interval (distance) between the electrodes may be set appropriately depending on the specifications required for the electronic component 1, etc.

[0031] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6 and the fourth terminal electrode 7 can be formed of an appropriate conductor (for example, gold, nickel, copper, silver, etc.).

[0032] Figures 2(a), 2(b), and 2(c) are diagrams showing the first conductor layer, the second conductor layer, and the third conductor layer included in the electronic component 1 shown in Figure 1. Figures 3(a), 3(b), 3(c), 3(d), 3(e), 3(f), and 3(g) are diagrams showing conductor patterns included in the electronic component 1 shown in Figure 1.

[0033] As shown in FIGS. 2(a) and 2(b), the electronic component 1 includes a first conductor layer 10, a second conductor layer 11, and a third conductor layer 12. The first conductor layer 10, the second conductor layer 11, and the third conductor layer 12 are arranged on different layers in the second direction D2. In the electronic component 1, the layers are arranged in the following order from the substrate 2 side (the main surface 3d side of the insulator 3): the first conductor layer 10, the second conductor layer 11, and the third conductor layer 12. More specifically, as shown in FIG. 4, a planarization layer 8 is arranged between the main surface 2c of the substrate 2 and the main surface 3d of the insulator 3. The first conductor layer 10 is arranged on the planarization layer 8. The planarization layer 8 can be formed of, for example, alumina, silicon oxide, or the like.

[0034] As shown in Figures 3(a), 3(b), 3(c), 3(d), 3(e), 3(f), and 3(g), the first conductor layer 10 is configured to include a conductor layer 13, a conductor layer 14, a conductor layer 15, and a conductor layer 16. The second conductor layer 11 is configured to include a conductor layer 17 and a conductor layer 18.

[0035] As shown in FIG. 3(a), the conductor layer 13 has a resistor pattern 20. The resistor pattern 20 has, for example, a rectangular shape. FIG. 5 is a diagram showing a cross-sectional configuration of a portion of the electronic component 1 including the resistor pattern 20. As shown in FIG. 5, the resistor pattern 20 is disposed across the conductor patterns 28 and 29 of the conductor layer 15. The resistor pattern 20 electrically connects the conductor patterns 28 and 29. The resistor pattern 20 can be formed of an appropriate conductor (for example, nickel, chromium, aluminum, etc.).

[0036] 3(b), the conductor layer 14 has a conductor pattern 21, a conductor pattern 22, and a conductor pattern 23. The conductor pattern 21, the conductor pattern 22, and the conductor pattern 23 can be formed of an appropriate conductor (such as copper).

[0037] The conductive pattern 21 includes a first pattern portion 21A, a second pattern portion 21B, and a third pattern portion 21C. The first pattern portion 21A, the second pattern portion 21B, and the third pattern portion 21C may be integrally formed. The first pattern portion 21A is disposed at a position closer to the end face 3a and the side face 3e. The second pattern portion 21B extends linearly along the third direction D3. One end of the second pattern portion 21B is connected to the first pattern portion 21A. The other end of the second pattern portion 21B is connected to the third pattern portion 21C. The third pattern portion 21C extends linearly along the first direction D1. One end of the third pattern portion 21C is connected to the second pattern portion 21B.

[0038] The conductive pattern 22 includes a first pattern portion 22A and a second pattern portion 22B. The first pattern portion 22A and the second pattern portion 22B may be integrally formed. The first pattern portion 22A is disposed near the end face 3b and the side face 3e. The second pattern portion 22B is disposed near the end face 3b.

[0039] Conductive pattern 23 includes first pattern portion 23A, second pattern portion 23B, and third pattern portion 23C. First pattern portion 23A, second pattern portion 23B, and third pattern portion 23C may be integrally formed. First pattern portion 23A is disposed near end face 3a and side face 3f. Second pattern portion 23B is disposed near end face 3b and side face 3f.

[0040] The third pattern portion 23C extends linearly along the first direction D1. One end of the third pattern portion 23C is connected to the first pattern portion 23A. The other end of the third pattern portion 23C is connected to the second pattern portion 23B. The third pattern portion 23C is parallel to the third pattern portion 21C of the conductive pattern 21. The third pattern portion 23C is disposed at a distance from the third pattern portion 21C of the conductive pattern 21 in the third direction D3. The distance may be, for example, 10 μm.

[0041] 3(c), the conductor layer 15 has a conductor pattern 24, a conductor pattern 25, a conductor pattern 26, a conductor pattern 27, a conductor pattern 28, a conductor pattern 29, a conductor pattern 30, and a conductor pattern 31. The conductor patterns 24, 25, 26, conductor pattern 27, conductor pattern 28, conductor pattern 29, conductor pattern 30, and conductor pattern 31 can be formed of an appropriate conductor (such as copper, for example).

[0042] The conductor pattern 24 is disposed at a position closer to the end face 3a and closer to the side face 3e. The conductor pattern 24 electrically connects the conductor pattern 21 of the conductor layer 14 to the conductor pattern 33 (see FIG. 3(e)) of the conductor layer 17 (see FIG. 3(e)). The conductor pattern 25 is disposed at a position closer to the end face 3b and closer to the side face 3e. The conductor pattern 25 electrically connects the conductor pattern 22 of the conductor layer 14 to the conductor pattern 34 (see FIG. 3(e)) of the conductor layer 17.

[0043] Conductor pattern 26 is disposed at a position closer to end face 3a and side face 3f. Conductor pattern 26 electrically connects conductor pattern 23 of conductor layer 14 and conductor pattern 35 of conductor layer 17 (see FIG. 3(e)). Conductor pattern 27 is disposed at a position closer to end face 3b and side face 3f. Conductor pattern 27 electrically connects conductor pattern 23 of conductor layer 14 and conductor pattern 35 of conductor layer 17 (see FIG. 3(e)).

[0044] The conductor pattern 28 electrically connects the resistance pattern 20 on the conductor layer 13 to the conductor pattern 34 on the conductor layer 17 (see FIG. 3(e)). The conductor pattern 29 electrically connects the resistance pattern 20 on the conductor layer 13 to the conductor pattern 33 on the conductor layer 17 (see FIG. 3(e)). The conductor pattern 29 is disposed at a position facing the conductor pattern 28 in the third direction D3 in a plan view.

[0045] The conductor pattern 30 electrically connects the conductor pattern 22 on the conductor layer 14 to the conductor pattern 32 on the conductor layer 16 (see FIG. 3(d)). The conductor pattern 31 electrically connects the conductor pattern 21 on the conductor layer 14 to the conductor pattern 33 on the conductor layer 17 (see FIG. 3(e)).

[0046] As shown in FIG. 3(d), the conductor layer 16 has a conductor pattern 32. The conductor pattern 32 can be formed of an appropriate conductor (such as copper). FIG. 6 is a diagram showing a cross-sectional configuration of a portion of the electronic component 1 including the conductor pattern 32. As shown in FIG. 6, the conductor pattern 32 is stacked with the conductor pattern 22 formed on the conductor layer 14 via a dielectric film 19, and is a conductor (intermediate conductor) that constitutes the upper electrode of the capacitor C, which will be described later. The dielectric film 19 is made of, for example, silicon nitride.

[0047] 3(e), the conductor layer 17 has a conductor pattern 33, a conductor pattern 34, and a conductor pattern 35. The conductor pattern 33, the conductor pattern 34, and the conductor pattern 35 can be formed of an appropriate conductor (such as copper).

[0048] The conductive pattern 33 includes a first pattern portion 33A, a second pattern portion 33B, a third pattern portion 33C, a fourth pattern portion 33D, and a fifth pattern portion 33E. The first pattern portion 33A, the second pattern portion 33B, the third pattern portion 33C, the fourth pattern portion 33D, and the fifth pattern portion 33E may be integrally formed.

[0049] The first pattern portion 33A is disposed closer to the end face 3a and closer to the side face 3e. The second pattern portion 33B extends linearly along the third direction D3. One end of the second pattern portion 33B is connected to the first pattern portion 33A. The other end of the second pattern portion 33B is connected to the third pattern portion 33C. The third pattern portion 33C extends linearly along the first direction D1. One end of the third pattern portion 33C is connected to the second pattern portion 33B. The other end of the third pattern portion 33C is connected to the fourth pattern portion 33D. The fourth pattern portion 33D extends linearly along the third direction D3. One end of the fourth pattern portion 33D is connected to the third pattern portion 33C. The fifth pattern portion 33E is connected to the fourth pattern portion 33D.

[0050] The conductive pattern 34 includes a first pattern portion 34A and a second pattern portion 34B. The first pattern portion 34A and the second pattern portion 34B may be integrally formed. The first pattern portion 34A is disposed near the end face 3b and the side face 3e. The second pattern portion 34B is disposed opposite the fifth pattern portion 33E of the conductive pattern 33 in the third direction D3 in a plan view.

[0051] The conductor pattern 35 has the same shape as the conductor pattern 23 of the conductor layer 14. The conductor pattern 35 includes a first pattern portion 35A, a second pattern portion 35B, and a third pattern portion 35C. The first pattern portion 35A, the second pattern portion 35B, and the third pattern portion 35C may be integrally formed. The first pattern portion 35A is disposed near the end face 3a and the side face 3f. The second pattern portion 35B is disposed near the end face 3b and the side face 3f.

[0052] The third pattern portion 35C extends linearly along the first direction D1. One end of the third pattern portion 35C is connected to the first pattern portion 35A. The other end of the third pattern portion 35C is connected to the second pattern portion 35B. The third pattern portion 35C is parallel to the third pattern portion 33C of the conductive pattern 33. The third pattern portion 35C is disposed at a distance from the third pattern portion 33C of the conductive pattern 33 in the third direction D3. The distance may be, for example, 10 μm.

[0053] FIG. 7 is a diagram illustrating a cross-sectional configuration of a portion of an electronic component 1 including a conductor pattern. As illustrated in FIG. 7, the third pattern portion 21C of the conductor pattern 21 and the third pattern portion 33C of the conductor pattern 33 are disposed opposite each other in the second direction D2. That is, the third pattern portion 21C of the conductor pattern 21 and the third pattern portion 33C of the conductor pattern 33 are disposed overlapping each other in a plan view. The distance L1 between the third pattern portion 21C of the conductor pattern 21 and the third pattern portion 33C of the conductor pattern 33 in the second direction D2 may be, for example, 5 μm. The thickness T1 of the third pattern portion 21C of the conductor pattern 21 and the thickness T2 of the third pattern portion 33C of the conductor pattern 33 may be, for example, 5 μm. The distance L1 may be the same as the thicknesses T1 and T2 (L1 = T1, T2).

[0054] The third pattern portion 23C of the conductor pattern 23 and the third pattern portion 35C of the conductor pattern 35 are disposed opposite each other in the second direction D2. That is, the third pattern portion 23C of the conductor pattern 23 and the third pattern portion 35C of the conductor pattern 35 are disposed overlapping each other in a plan view. The distance L2 in the second direction D2 between the third pattern portion 23C of the conductor pattern 23 and the third pattern portion 35C of the conductor pattern 35 may be, for example, 5 μm. The thickness T3 of the third pattern portion 23C of the conductor pattern 23 and the thickness T4 of the third pattern portion 35C of the conductor pattern 35 may be, for example, 5 μm. The distance L2 may be the same as the thicknesses T3 and T4 (L2 = T3, T4).

[0055] 3(f), the conductor layer 18 has a conductor pattern 36, a conductor pattern 37, a conductor pattern 38, and a conductor pattern 39. The conductor patterns 36, 37, 38, and 39 can be formed of an appropriate conductor (such as copper).

[0056] The conductor pattern 36 is disposed at a position closer to the end face 3a and closer to the side face 3e. The conductor pattern 36 electrically connects the conductor pattern 33 of the conductor layer 17 and the first terminal electrode 4 of the third conductor layer 12 (see FIG. 3(g)). The conductor pattern 37 is disposed at a position closer to the end face 3b and closer to the side face 3e. The conductor pattern 37 electrically connects the conductor pattern 34 of the conductor layer 17 and the second terminal electrode 5 of the third conductor layer 12 (see FIG. 3(g)).

[0057] The conductor pattern 38 is disposed at a position closer to the end face 3a and closer to the side face 3f. The conductor pattern 38 electrically connects the conductor pattern 35 of the conductor layer 17 and the third terminal electrode 6 of the third conductor layer 12 (see FIG. 3(g)). The conductor pattern 39 is disposed at a position closer to the end face 3b and closer to the side face 3f. The conductor pattern 39 electrically connects the conductor pattern 35 of the conductor layer 17 and the fourth terminal electrode 7 of the third conductor layer 12 (see FIG. 3(g)).

[0058] 3(g), the third conductor layer 12 has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, and a fourth terminal electrode 7. The third conductor layer 12 is a terminal layer.

[0059] Fig. 8 is a diagram showing the conductor patterns included in the electronic component 1 shown in Fig. 1. As shown in Fig. 8, the resistor pattern 20 and the capacitor pattern (the second pattern portion 22B of the conductor pattern 22 and the conductor pattern 32) are disposed closer to the second terminal electrode 5 (ground electrode). In plan view, the resistor pattern 20 is disposed closer to the center of the insulator 3 than the capacitor pattern. In other words, in plan view, the resistor pattern 20 is disposed farther from the end face 3b of the insulator 3 than the capacitor pattern.

[0060] Fig. 9 is an equivalent circuit diagram of the electronic component 1 shown in Fig. 1. As shown in Fig. 9, the electronic component 1 includes an input port P1, an output port P2, a coupling port P3, a ground port P4, a first line S1, and a second line S2.

[0061] The input port P1 is formed by the third terminal electrode 6. The output port P2 is formed by the fourth terminal electrode 7. The coupling port P3 is formed by the first terminal electrode 4. The ground port P4 is formed by the second terminal electrode 5.

[0062] The first line S1 connects the input port P1 and the output port P2. The first line S1 is composed of a third pattern portion 23C of the conductor pattern 23 and a third pattern portion 35C of the conductor pattern 35. The second line S2 electrically connects the coupling port P3 and the ground port P4. The second line S2 is composed of a third pattern portion 21C of the conductor pattern 21 and a third pattern portion 33C of the conductor pattern 33. The second line S2 includes a resistor R and a capacitor C.

[0063] The first line S1 and the second line S2 are electromagnetically coupled. Specifically, the third pattern portion 21C of the conductor pattern 21 and the third pattern portion 23C of the conductor pattern 23 are electromagnetically coupled. The third pattern portion 33C of the conductor pattern 33 and the third pattern portion 35C of the conductor pattern 35 are electromagnetically coupled.

[0064] The resistor R is formed by the resistor pattern 20. The resistor R is a termination resistor. The resistor R is connected between the second line S2 and the ground port P4. The resistor R is, for example, smaller than 50 Ω. The capacitor C is formed by the conductor pattern 32 and the fourth pattern portion 33D of the conductor pattern 33. The capacitor C is connected between the second line S2 and the ground port P4. The resistor R and the capacitor C are electrically connected in parallel.

[0065] As described above, in the electronic component 1 according to this embodiment, the first line S1 and the second line S2 are magnetically coupled. This ensures magnetic coupling in the electronic component 1. In the electronic component 1, the second line S2 is provided with a resistor R (termination resistor) and a capacitor C at the end of the second line S2 connected to the second terminal electrode 5 (ground electrode). The resistor R and the capacitor C are electrically connected in parallel in the second line S2. In this way, in the electronic component 1, by electrically connecting the resistor R and the capacitor C in parallel in the second line S2, an attenuation pole can be formed in the relationship (graph) between frequency and isolation. This allows the isolation to be adjusted in the electronic component 1. Therefore, the electronic component 1 can balance (adjust) magnetic coupling and isolation.

[0066] In the electronic component 1 according to this embodiment, the first line S1 and the second line S2 have portions (third pattern portion 21C and third pattern portion 23C, and third pattern portion 33C and third pattern portion 35C) that extend side by side when viewed in the stacking direction (second direction D2) of the insulator 3, and are magnetically coupled at these portions. This configuration ensures magnetic coupling between the first line S1 and the second line S2.

[0067] In the electronic component 1 according to this embodiment, the resistor R and the capacitor C are disposed closer to the second terminal electrode 5 (ground electrode) than to the first terminal electrode 4 (detection electrode). The resistor R is a termination resistor, and is therefore preferably disposed around the second terminal electrode 5. Therefore, by disposing the resistor R and the capacitor C, which are electrically connected in parallel, near the second terminal electrode 5, the resistor R and the capacitor C can be disposed efficiently in the insulator 3.

[0068] In the electronic component 1 according to this embodiment, the resistor R is disposed in the insulator 3 at a position more inward than the capacitor C when viewed in the second direction D2 (plan view). In this configuration, the resistor R is disposed at a position away from the end faces 3a, 3b and the side faces 3e, 3f of the insulator 3. Therefore, in the electronic component 1, peeling of the resistor R can be suppressed.

[0069] [Second embodiment] Next, a second embodiment will be described. Figures 10(a) and 10(b) are diagrams showing a first conductor layer and a second conductor layer included in an electronic component according to the second embodiment. As shown in Figures 10(a) and 10(b), an electronic component 1A according to the second embodiment includes a first conductor layer 40, a second conductor layer 41, and a third conductor layer 42 (see Figure 11(g)). In the electronic component 1A, the dimension of the substrate 2 in the first direction D1 may be, for example, 0.47 mm. The dimension of the substrate 2 in the third direction D3 may be, for example, 0.32 mm.

[0070] The first conductor layer 40, the second conductor layer 41, and the third conductor layer 42 are arranged on different layers in the second direction D2. In the electronic component 1A, the first conductor layer 40, the second conductor layer 41, and the third conductor layer 42 are arranged in this order from the substrate 2 side (the main surface 3d side of the insulator 3).

[0071] 11(a), 11(b), 11(c), 11(d), 11(e), 11(f), and 11(g) are diagrams showing conductor patterns included in electronic component 1A. As shown in FIGS. 11(a), 11(b), 11(c), 11(d), 11(e), 11(f), and 11(g), first conductor layer 40 includes conductor layer 43, conductor layer 44, conductor layer 45, and conductor layer 46. Second conductor layer 41 includes conductor layer 47 and conductor layer 48.

[0072] As shown in FIG. 11(a), the conductor layer 43 has a resistor pattern 50. The resistor pattern 50 has, for example, a rectangular shape. The resistor pattern 50 is disposed across the conductor pattern 58 and the conductor pattern 59 of the conductor layer 45. The resistor pattern 50 electrically connects the conductor pattern 58 and the conductor pattern 59. The resistor pattern 50 can be formed of an appropriate conductor (for example, nickel, chromium, aluminum, etc.).

[0073] 11(b), the conductor layer 44 has a conductor pattern 51, a conductor pattern 52, and a conductor pattern 53. The conductor pattern 51, the conductor pattern 52, and the conductor pattern 53 can be formed of an appropriate conductor (such as copper).

[0074] The conductor pattern 51 is disposed near the end face 3a and the side face 3e. The conductor pattern 52 includes a first pattern portion 52A and a second pattern portion 52B. The first pattern portion 52A and the second pattern portion 52B may be integrally formed. The first pattern portion 52A is disposed near the end face 3b and the side face 3e. The second pattern portion 52B is disposed near the end face 3b.

[0075] The conductive pattern 53 includes a first pattern portion 53A, a second pattern portion 53B, and a third pattern portion 53C. The first pattern portion 53A, the second pattern portion 53B, and the third pattern portion 53C may be integrally formed. The first pattern portion 53A is disposed near the end face 3a and the side face 3f. The second pattern portion 53B is disposed near the end face 3b and the side face 3f. The third pattern portion 53C has a plurality of bent portions. One end of the third pattern portion 53C is connected to the first pattern portion 53A. The other end of the third pattern portion 53C is connected to the second pattern portion 53B.

[0076] 11(c), the conductor layer 45 has a conductor pattern 54, a conductor pattern 55, a conductor pattern 56, a conductor pattern 57, a conductor pattern 58, a conductor pattern 59, and a conductor pattern 60. The conductor patterns 54, 55, 56, 57, 58, conductor pattern 59, and conductor pattern 60 can be formed of an appropriate conductor (such as copper, for example).

[0077] The conductor pattern 54 is disposed at a position closer to the end face 3a and closer to the side face 3e. The conductor pattern 54 electrically connects the conductor pattern 51 of the conductor layer 44 to the conductor pattern 62 (see FIG. 11(e)) of the conductor layer 47 (see FIG. 11(e)). The conductor pattern 55 is disposed at a position closer to the end face 3b and closer to the side face 3e. The conductor pattern 55 electrically connects the conductor pattern 52 of the conductor layer 44 to the conductor pattern 63 (see FIG. 11(e)) of the conductor layer 47.

[0078] Conductor pattern 56 is disposed at a position closer to end face 3a and closer to side face 3f. Conductor pattern 56 electrically connects conductor pattern 53 of conductor layer 44 and conductor pattern 64 of conductor layer 47 (see FIG. 11(e)). Conductor pattern 57 is disposed at a position closer to end face 3b and closer to side face 3f. Conductor pattern 57 electrically connects conductor pattern 53 of conductor layer 44 and conductor pattern 65 of conductor layer 47 (see FIG. 11(e)).

[0079] The conductor pattern 58 electrically connects the resistance pattern 50 of the conductor layer 43 to the conductor pattern 63 of the conductor layer 47 (see FIG. 11(e)). The conductor pattern 59 electrically connects the resistance pattern 50 of the conductor layer 43 to the conductor pattern 62 of the conductor layer 47 (see FIG. 11(e)). The conductor pattern 59 is disposed at a position facing the conductor pattern 58 in the third direction D3 in a plan view. The conductor pattern 60 electrically connects the conductor pattern 52 of the conductor layer 44 to the conductor pattern 61 of the conductor layer 46 (see FIG. 11(d)).

[0080] 11(d), the conductor layer 46 has a conductor pattern 61. The conductor pattern 61 can be formed of an appropriate conductor (such as copper). The conductor pattern 61 is stacked with the conductor pattern 52 formed on the conductor layer 44 via the dielectric film 19 (see FIG. 6), and is a conductor (intermediate conductor) that constitutes the upper electrode of the capacitor C.

[0081] 11(e), the conductor layer 47 has a conductor pattern 62, a conductor pattern 63, a conductor pattern 64, and a conductor pattern 65. The conductor patterns 62, 63, 64, and 65 can be formed of an appropriate conductor (such as copper).

[0082] The conductive pattern 62 includes a first pattern portion 62A, a second pattern portion 62B, a third pattern portion 62C, a fourth pattern portion 62D, and a fifth pattern portion 62E. The first pattern portion 62A, the second pattern portion 62B, the third pattern portion 62C, and the fourth pattern portion 62D may be integrally formed. The first pattern portion 62A is disposed near the end face 3a and the side face 3e. The second pattern portion 62B extends linearly along the third direction D3. One end of the second pattern portion 62B is connected to the first pattern portion 62A. The other end of the second pattern portion 62B is connected to the third pattern portion 62C.

[0083] The third pattern portion 62C has a plurality of bent portions. The third pattern portion 63C has the same shape as the third pattern portion 52C of the conductive pattern 52. One end of the third pattern portion 62C is connected to the second pattern portion 62B. The other end of the third pattern portion 62C is connected to the fourth pattern portion 62D. The fourth pattern portion 62D is disposed at a position closer to the end face 3b.

[0084] Conductor pattern 63 is disposed closer to end face 3b and side face 3e, conductor pattern 64 is disposed closer to end face 3a and side face 3f, and conductor pattern 65 is disposed closer to end face 3b and side face 3f.

[0085] 12 is a diagram showing a cross-sectional configuration of a portion of electronic component 1A including a conductor pattern. As shown in Fig. 12, third pattern portion 53C of conductor pattern 53 and third pattern portion 62C of conductor pattern 62 are disposed in positions facing each other in second direction D2. That is, third pattern portion 53C of conductor pattern 53 and third pattern portion 62C of conductor pattern 62 are disposed in positions overlapping each other in a plan view.

[0086] The distance L11 in the second direction D2 between the third pattern portion 53C of the conductive pattern 53 and the third pattern portion 62C of the conductive pattern 62 may be, for example, 5 μm. The thickness T11 of the third pattern portion 53C of the conductive pattern 53 and the thickness T12 of the third pattern portion 62C of the conductive pattern 62 may be, for example, 5 μm. The distance L11 may be the same as the thicknesses T11 and T12 (L11=T11, T12).

[0087] The width W1 of the third pattern portion 53C of the conductor pattern 53 is wider than the width W2 of the third pattern portion 62C of the conductor pattern 62 (W1>W2). In plan view, the entire third pattern portion 62C of the conductor pattern 62 overlaps the third pattern portion 53C of the conductor pattern 53. That is, in plan view, the third pattern portion 62C of the conductor pattern 62 is covered by the third pattern portion 53C of the conductor pattern 53. In other words, in plan view, the third pattern portion 53C of the conductor pattern 53 does not protrude outward from the third pattern portion 62C of the conductor pattern 62.

[0088] 11(f), the conductor layer 48 has a conductor pattern 66, a conductor pattern 67, a conductor pattern 68, and a conductor pattern 69. The conductor patterns 66, 67, 68, and 69 can be formed of an appropriate conductor (such as copper).

[0089] The conductor pattern 66 is disposed at a position closer to the end face 3a and closer to the side face 3e. The conductor pattern 66 electrically connects the conductor pattern 62 of the conductor layer 47 and the first terminal electrode 4 of the third conductor layer 42 (see FIG. 11(g)). The conductor pattern 67 is disposed at a position closer to the end face 3b and closer to the side face 3e. The conductor pattern 67 electrically connects the conductor pattern 67 of the conductor layer 47 and the second terminal electrode 5 of the third conductor layer 12 (see FIG. 11(g)).

[0090] The conductor pattern 68 is disposed at a position closer to the end face 3a and closer to the side face 3f. The conductor pattern 68 electrically connects the conductor pattern 64 of the conductor layer 47 and the third terminal electrode 6 of the third conductor layer 12 (see FIG. 11(g)). The conductor pattern 69 is disposed at a position closer to the end face 3b and closer to the side face 3f. The conductor pattern 69 electrically connects the conductor pattern 65 of the conductor layer 47 and the fourth terminal electrode 7 of the third conductor layer 12 (see FIG. 11(g)).

[0091] 11(g), the third conductor layer 42 has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, and a fourth terminal electrode 7. The third conductor layer 12 is a terminal layer.

[0092] Fig. 13 is a diagram showing the conductor patterns included in the electronic component 1A. As shown in Fig. 13, the resistor pattern 50 and the capacitor pattern (the second pattern portion 52B of the conductor pattern 52 and the conductor pattern 61) are disposed near the second terminal electrode 5 (ground electrode).

[0093] Fig. 14 is an equivalent circuit diagram of the electronic component 1A. As shown in Fig. 14, the electronic component 1A includes an input port P11, an output port P12, a coupling port P13, a ground port P41, a first line S11, and a second line S12.

[0094] The input port P11 is formed by the third terminal electrode 6. The output port P12 is formed by the fourth terminal electrode 7. The coupling port P13 is formed by the first terminal electrode 4. The ground port P14 is formed by the second terminal electrode 5.

[0095] The first line S11 connects the input port P11 and the output port P12. The first line S11 is formed by the third pattern portion 53C of the conductor pattern 53. The second line S12 electrically connects the coupling port P13 and the ground port P14. The second line S12 is formed by the third pattern portion 62C of the conductor pattern 62. The second line S12 includes a resistor R1 and a capacitor C1.

[0096] The first line S11 and the second line S12 are electromagnetically coupled. Specifically, the third pattern portion 53C of the conductive pattern 53 and the third pattern portion 62C of the conductive pattern 62 are electromagnetically coupled.

[0097] The resistor R1 is formed by the resistor pattern 50. The resistor R1 is a termination resistor. The resistor R1 is connected between the second line S12 and the ground port P14. The resistor R1 is, for example, smaller than 50 Ω. The capacitor C1 is formed by the conductor pattern 61 and the fourth pattern portion 62D of the conductor pattern 62. The capacitor C1 is connected between the second line S12 and the ground port P14. The resistor R1 and the capacitor C1 are electrically connected in parallel.

[0098] As described above, in the electronic component 1A according to this embodiment, the first line S11 and the second line S12 are magnetically coupled. This ensures magnetic coupling in the electronic component 1A. In the electronic component 1A, the second line S12 is provided with a resistor R1 (termination resistor) and a capacitor C1 at the end of the second line S12 connected to the second terminal electrode 5 (ground electrode). The resistor R1 and the capacitor C1 are electrically connected in parallel in the second line S12. In this way, in the electronic component 1A, by electrically connecting the resistor R1 and the capacitor C1 in parallel in the second line S12, an attenuation pole can be formed in the relationship (graph) between frequency and isolation. This allows the isolation to be adjusted in the electronic component 1A. Therefore, the electronic component 1A can balance (adjust) magnetic coupling and isolation.

[0099] In the electronic component 1A according to this embodiment, the first line S11 and the second line S12 have overlapping portions (third pattern portion 53C of conductor pattern 53 and third pattern portion 62C of conductor pattern 62) when viewed in the stacking direction (second direction D2) of the insulator 3, and are magnetically coupled at these overlapping portions. This configuration ensures magnetic coupling between the first line S11 and the second line S12.

[0100] In the electronic component 1A according to this embodiment, when viewed from the second direction D2, the first line S11 is wider than the second line S12 at the portion where the first line S11 and the second line S12 overlap. With this configuration, even if there is a misalignment in the stacking of the first conductor layer 40 and the second conductor layer 41, the first line S11 and the second line S12 overlap in the stacking direction. Therefore, in the electronic component 1A, magnetic coupling between the first line S11 and the second line S12 can be ensured even if there is a misalignment in the stacking of the first conductor layer 40 and the second conductor layer 41.

[0101] In the electronic component 1A according to this embodiment, when viewed from the second direction D2, the second line S12 is covered by the first line S11 in the portion where the first line S11 and the second line S12 overlap. In this configuration, one side of the second line S12 does not protrude (stick out) from the first line S11. This makes it possible to more reliably ensure magnetic coupling between the first line S11 and the second line S12.

[0102] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0103] In the above embodiment, an example has been described in which, in the electronic component 1, the first conductor layer 10 has the third pattern portion 21C of the conductor pattern 21 and the third pattern portion 23C of the conductor pattern 23, and the second conductor layer 11 has the third pattern portion 33C of the conductor pattern 33 and the third pattern portion 35C of the conductor pattern 35. However, for example, only the first conductor layer 10 may have the third pattern portion 21C of the conductor pattern 21 and the third pattern portion 23C of the conductor pattern 23. In other words, the second conductor layer 11 does not have to have the third pattern portion 33C of the conductor pattern 33 and the third pattern portion 35C of the conductor pattern 35.

[0104] In the above embodiment, an example has been described in which the width W1 of the third pattern portion 53C of the conductor pattern 53 is wider than the width W2 of the third pattern portion 62C of the conductor pattern 62 (W1>W2). However, the width W1 of the third pattern portion 53C of the conductor pattern 53 may be the same as the width W2 of the third pattern portion 62C of the conductor pattern 62. Furthermore, the width W2 of the third pattern portion 62C of the conductor pattern 62 may be wider than the width W1 of the third pattern portion 53C of the conductor pattern 53. [Explanation of symbols]

[0105] 1, 1A...electronic component, 3...insulator (element body), 3c...main surface (mounting surface), 4...first terminal electrode (detection electrode), 5...second terminal electrode (ground electrode), 6...third terminal electrode (input electrode), 7...fourth terminal electrode (output electrode), 10, 40...first conductor layer, 11, 41...second conductor layer, C, C1...capacitor, R, R1...resistor (termination resistor), S1, S11...first line, S2, S12...second line, W1, W2...width.

Claims

1. an element body formed by laminating a plurality of insulating layers and a plurality of conductor layers; an input electrode, an output electrode, a detection electrode, and a ground electrode that are arranged on a mounting surface of the element body, the plurality of conductor layers include a first conductor layer and a second conductor layer; a first line electrically connecting the input electrode and the output electrode, and a second line electrically connecting the detection electrode and the ground electrode, are formed in the first conductor layer and the second conductor layer; the second line includes a resistor and a capacitor provided on an end of the second line connected to the ground electrode, the resistor and the capacitor are electrically connected in parallel, The electronic component, wherein the first line and the second line are magnetically coupled.

2. 2. The electronic component according to claim 1, wherein the first line and the second line have a portion extending side by side when viewed in the stacking direction of the element body, and are magnetically coupled at that portion.

3. The electronic component according to claim 2 , wherein the first line and the second line do not overlap when viewed from the stacking direction.

4. 3. The electronic component according to claim 1, wherein the first line and the second line have an overlapping portion when viewed from the stacking direction of the element body, and are magnetically coupled at the overlapping portion.

5. 5. The electronic component according to claim 4, wherein, when viewed in the stacking direction, one of the first line and the second line has a width greater than the other of the first line and the second line.

6. 6. The electronic component according to claim 5, wherein, in a portion where the first line and the second line overlap each other as viewed from the stacking direction, one of the first line and the second line is covered by the other of the first line and the second line.

7. 3. The electronic component according to claim 1, wherein the resistor and the capacitor are disposed closer to the ground electrode than the detection electrode.

8. 3. The electronic component according to claim 1, wherein the resistor is disposed on the element body more inward than the capacitor when viewed in a stacking direction of the element body.

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