Transfer device and substrate processing apparatus

Abstract

To provide a mode of preventing positional deviation of a substrate by a simple mechanism and suppressing variation in bevel polishing of the substrate.SOLUTION: The transfer machine 80 includes an arm 810, a holding unit 830 provided in the arm 810 and configured to hold a substrate W, a turning unit 100 configured to turn the arm 810 about a turning axis A, and a control unit 50 configured to adjust a position of the substrate W in an in-plane direction by turning the arm 810 by the turning unit 100 based on the position of the substrate W held by the holding unit 830 in the in-plane direction measured by a measuring unit 110.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a transfer machine that transfers a substrate, and a substrate processing apparatus that polishes the peripheral portion of a substrate that is transferred and carried out by the transfer machine. [Background technology]

[0002] Conventionally, substrate processing apparatuses including bevel polishing apparatuses for polishing the bevels of substrates such as wafers have been known. When polishing the bevels of substrates using bevel polishing apparatuses, variations can occur, and attempts have been made to suppress such variations. Patent Document 1 proposes using a jig to adjust the position of a polishing head during bevel polishing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-192522 Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides an embodiment that prevents displacement of a substrate using a simpler mechanism than conventional embodiments, and suppresses variations during bevel polishing of the substrate. [Means for solving the problem]

[0005] [Concept 1] The transfer machine according to the present invention comprises: Arm and a holder provided on the arm for holding a substrate; a rotating unit that rotates the arm around a rotation axis; a control unit that adjusts the in-plane position of the substrate by rotating the arm using the rotating unit based on the in-plane position of the substrate measured by the measuring unit; may also be provided.

[0006] [Concept 2] In the transfer vehicle based on Concept 1, The pivot axis may extend in a direction perpendicular to the substrate loading direction.

[0007] [Concept 3] In the transfer vehicle based on Concept 2, The pivot shaft may be provided closer to the substrate entrance than the holder, and may extend in an in-plane direction of the substrate before being pivoted by the pivot part.

[0008] [Concept 4] A transfer vehicle according to any one of concepts 1 to 3, a support portion provided below the arm and supporting the substrate; The swivel portion may be provided at a position below the support portion and below a transport path of the substrate transport mechanism.

[0009] [Concept 5] The substrate processing apparatus according to the present invention comprises: a transfer machine having an arm, a holding part provided on the arm for holding a substrate, and a rotating part for rotating the arm about a rotating axis; a measuring unit for measuring an in-plane position of the substrate held by the holding unit; a control unit that adjusts the position of the substrate by rotating the arm using the rotating unit based on the in-plane position of the substrate measured by the measuring unit; may also be provided.

[0010] [Concept 6] In the substrate processing apparatus according to Concept 5, The measurement unit may include a first measurement unit and a second measurement unit provided at a position point-symmetrical to the first measurement unit with respect to the center of the substrate.

[0011] [Concept 7] In the substrate processing apparatus according to Concept 6, The diameter of the substrate may be calculated from the measurement results obtained by the first measuring unit and the second measuring unit, thereby calculating the deviation in size from the ideal diameter of the substrate, and the position of the substrate may be adjusted by rotating the rotating unit based on the calculation results obtained using the deviation in size.

[0012] [Concept 8] 8. The substrate processing apparatus according to any one of Concepts 5 to 7, The amount of angular deviation of the tip position of the substrate around the rotation axis relative to the tip position at the ideal position of the substrate may be calculated, and the position of the substrate may be adjusted by rotating the rotation unit based on the calculation result using the amount of angular deviation.

[0013] [Concept 9] 9. The substrate processing apparatus according to any one of Concepts 6 to 8, The first measurement unit and the second measurement unit may be disposed at positions shifted by a predetermined angle θ with respect to the substrate transfer direction.

[0014] [Concept 10] 10. The substrate processing apparatus according to any one of Concepts 6 to 9, A jig board for setting the zero points of the first measuring unit and the second measuring unit becomes available, The jig substrate may have a suction target portion that is suctioned by the substrate suction holding portion, and an adjustment portion that is movable in an in-plane direction relative to the suction target portion.

[0015] [Concept 11] 11. The substrate processing apparatus according to any one of Concepts 5 to 10, The measurement unit may include a line sensor.

[0016] [Concept 12] A substrate processing apparatus according to any one of Concepts 5 to 11, comprising: a substrate suction holding unit that suctions and holds the substrate; An elastic member may be provided on the mounting surface of the substrate suction holding portion. [Effects of the Invention]

[0017] In one aspect of the present invention, when the position of the substrate is adjusted by rotating the arm using the rotating unit around the rotation axis based on the position of the substrate measured by the measurement unit, the substrate can be transferred from the substrate transfer machine to the substrate suction holding unit after its position has been adjusted, simply by controlling the rotating unit. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a plan view of a transfer machine that can be used in an embodiment of the present invention. [Figure 2] Figure 2(a) is a side view showing how a substrate is transported to a substrate suction holding section by a transfer machine that can be used in an embodiment of the present invention, Figure 2(b) is a side view showing a state in which the substrate has been handed over to the substrate suction holding section, which is an advanced state from the state shown in Figure 2(a), and Figure 2(c) is a side view showing a state in which the transfer machine has moved away, which is an advanced state from the state shown in Figure 2(b). [Figure 3] FIG. 3 is a plan view of a transfer machine that can be used in an embodiment of the present invention, and is a view for explaining a mode for measuring a substrate misalignment (including manufacturing errors and positional misalignment). [Figure 4] FIG. 4 is a plan view for explaining in more detail the manner in which the misalignment of the substrate (including manufacturing errors and positional misalignment) is measured. [Figure 5] FIG. 5 is a side view for explaining an aspect in which the position of the substrate is adjusted by the rotation of the rotation unit. [Figure 6] FIG. 6 is a side view showing a measuring unit made up of a line sensor that can be used in an embodiment of the present invention. [Figure 7] Figure 7(a) is a side view illustrating an aspect in which a swivel is provided below the transport path of a substrate transport mechanism such as a robot hand, and Figure 7(b) is a side view showing an aspect in which the substrate transport mechanism such as a robot hand is separated from an arm or the like. [Figure 8] FIG. 8 is a perspective view showing a robot hand which is an example of a substrate transport mechanism. [Figure 9] Figure 9 is a diagram for explaining how to set the zero point of the measurement section using a jig substrate, where Figure 9(a) is a side view showing how the jig substrate is misaligned, and Figure 9(b) is a side view showing how the jig substrate is not misaligned. [Figure 10] FIG. 10 is a plan view showing a slide mechanism provided in the adjustment section of the jig substrate. [Figure 11] FIG. 11 is a side view showing an aspect in which an elastic member is provided on the mounting surface of the substrate suction holding portion. [Figure 12] FIG. 12 is a schematic diagram showing the configuration of a bevel polishing system. [Figure 13] FIG. 13 is a plan view showing a bevel polishing apparatus that can be used in an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] Embodiment "composition" FIG. 12 is a plan view showing a bevel polishing system including a bevel polishing apparatus according to an embodiment of the present invention. The bevel polishing system is an example of a substrate processing apparatus. As shown in FIG. 12, the bevel polishing system 1000 includes a FOUP 1005 serving as a load port, an EFEM 1007, multiple bevel polishing apparatuses 10 (hereinafter sometimes referred to as a first polishing section 1001 and a second polishing section 1002), a cleaning unit 1003, a dryer 1004, multiple substrate temporary placement stages 1008 and 1009, multiple transporters 1010-1013, and a control unit 50. The control unit 50 may be installed in a remote location so that the bevel polishing system 1000 can be controlled remotely.

[0020] In the configuration of the bevel polishing system 1000 shown in Fig. 12, a substrate W such as a wafer is processed in the following procedure. Specifically, the substrate W is placed on a temporary substrate rest 1008 from the FOUP 1005 via a transfer device 1013 in the EFEM 1007. The substrate W on the temporary substrate rest 1008 is then transferred by a transfer device 1010 to either the first polishing unit 1001 or the second polishing unit 1002, where it is polished. The polished substrate W is then transferred by the transfer device 1010 to a temporary substrate rest 1009. The substrate W on the temporary substrate rest 1009 is then transferred by a transfer device 1011 to a cleaning unit 1003, where it is cleaned. The cleaned substrate W is then transferred by a transfer device 1012 to a dryer 1004, where it is dried, and then transferred by a transfer device 1013 to the FOUP 1005.

[0021] Fig. 13 is a plan view showing a bevel polishing apparatus 10 according to this embodiment. As shown in Fig. 13, the bevel polishing apparatus 10 according to this embodiment is an apparatus for polishing the peripheral portion (edge ​​and bevel) of a substrate W, and includes a housing 11, a substrate suction holding portion (substrate holding portion) 20 including a substrate stage or the like for holding the substrate W within the housing 11, a polishing unit 40 including a bevel polishing unit or the like for polishing the peripheral portion of the substrate W held by the substrate suction holding portion 20, and a transfer machine 80 for placing the substrate W carried into the housing 11 on the substrate suction holding portion 20 and for removing the substrate W held by the substrate suction holding portion 20 from the substrate suction holding portion 20.

[0022] Of these, the polishing unit 40 polishes the peripheral portion of the substrate W held by the substrate suction holder 20. In the illustrated example, four polishing units 40 are provided within the housing 11, but this is not limitative and two, three, or five or more polishing units 40 may be provided. The polishing unit 40 may have a polishing tape (not shown), a polishing pad (not shown) that is a pressing unit for pressing the polishing tape against the substrate W, and a pressing force adjustment unit (not shown) formed of an air cylinder or the like that uses gas to adjust the pressing force of the polishing tape against the substrate W.

[0023] As shown in FIG. 13, the housing 11 has an opening 12 on its side. This opening 12 is opened and closed by a shutter 13 driven by a cylinder (not shown). The substrate W is carried into and out of the housing 11 by a substrate transport mechanism 1010 (see also FIG. 8) including a robot hand or the like. For example, as shown in FIG. 12, when the substrate W is carried into the first polishing section 1001, the substrate W on the temporary substrate table 1008 is placed on the robot hand, which is the substrate transport mechanism 1010. Next, as shown in FIG. 13, the opening 12 of the housing 11 is opened by the shutter 13, and the substrate W is transferred from the robot hand, which is the substrate transport mechanism 1010, to the arm 810 of the transfer machine 80. Thereafter, the substrate W is placed on the substrate suction holder 20 from the transfer machine 80, and the opening 12 of the housing 11 is closed after the substrate transport mechanism 1010 is retracted. Furthermore, for example, when the substrate W is to be removed after polishing of the bevel portion of the substrate W has been completed in the first polishing unit 1001, the substrate W is placed on the arm 810 of the transfer machine 80, and the opening 12 of the housing 11 is opened by the shutter 13. Next, the substrate W on the arm 810 of the transfer machine 80 is placed on the substrate transport mechanism 1010, and then the substrate transport mechanism 1010 removes the substrate W from the housing 11 and places it on the temporary substrate stand 1009, and the opening 12 of the housing 11 is closed by the shutter 13. Note that closing the opening 12 of the housing 11 with the shutter 13 isolates the inside of the housing 11 from the outside. This maintains the cleanliness and airtightness of the inside of the housing 11 during polishing, and prevents contamination of the substrate W from the outside of the housing 11 and contamination of the outside of the housing 11 due to scattering of polishing liquid, particles, etc. from the inside of the housing 11.

[0024] Next, a description will be given of the structure of the transfer machine 80 according to this embodiment. The transfer machine 80 is a device for transporting the substrate W to the substrate suction holding part 20 that holds the back surface of the substrate W. The substrate suction holding part 20 is, for example, a stage that suction-holds the back surface of the substrate W.

[0025] As shown in FIG. 1 , the transfer machine 80 may include a pair of arms 810, a support unit 820 having support members 821 that support the rear surface of the substrate W, and a holding unit 830 having holding members 831, such as chucks, that hold the side surfaces of the substrate W. Two support members 821 may be provided on one arm 810, and two support members 821 may be provided on the other arm 810, for a total of four support members 821. The support members 821 may be provided below the arms 810. Two holding members 831 that hold the substrate W from the sides may be provided on one arm 810, and two holding members 831 that hold the substrate W from the sides may be provided on the other arm 810, for a total of four holding members 831. The transfer machine 80 may include a drive unit 30 that moves the pair of arms 810 symmetrically toward or away from each other in the opening and closing direction. The drive by the drive unit 30 may be performed using a ball screw and an LM guide. Furthermore, as disclosed in JP 2017-112291 A, a configuration using a circular belt may be adopted. Various shapes such as a rectangular parallelepiped, a cubic shape, or a cylindrical shape may be adopted as the shape of the holding member 831. While FIG. 1 shows a mode in which the shape of the holding member 831 is rectangular when viewed from above, the shape is not limited to this, and the shape of the holding member 831 when viewed from above may also be an arc shape.

[0026] 1, the other arm 810 may have the same length as one arm 810. However, this is not limited to such an embodiment, and the length of the other arm 810 and the length of the one arm 810 may be different from each other.

[0027] At least one of the support members 821 may be movable in an in-plane direction (e.g., a first direction) of the substrate W. The movement of the support members 821 in the in-plane direction of the substrate W may be adjusted by driving the first arm 810 and / or the second arm 810 with the drive unit 30 (see FIG. 1 ), or each of the support members 821 may be movable relative to the arm 810, and the position of the support member 821 relative to the arm 810 may change, thereby moving the support member 821 in the in-plane direction of the substrate W. Note that in this embodiment, the in-plane direction of the substrate W will be described as the horizontal direction, and the normal direction of the substrate W as the vertical direction, but this is not necessarily limited to this, and the in-plane direction of the substrate W may be inclined from the horizontal direction, and the normal direction of the substrate W may be inclined from the vertical direction.

[0028] When the position adjustment of the support member 821 in the in-plane direction of the substrate W is performed by moving the arm 810, either one of the first arm 810 and the second arm 810 may be movable, and the other may be fixed. That is, the second arm 810 may be fixed, and the first arm 810 may be movable in the in-plane direction of the substrate W by the drive unit 30, or the first arm 810 may be fixed, and the second arm 810 may be movable in the in-plane direction of the substrate W by the drive unit 30. In an aspect in which the support member 821 is movable relative to the arm 810, any one or more of the four support members may be movable relative to the arm 810.

[0029] The movement of the holding member 831 in the in-plane direction of the substrate W may be adjusted by driving the first arm 810 and / or the second arm 810 with the drive unit 30, or the holding member 831 may be movable relative to the arm 810, and the position of the holding member 831 relative to the arm 810 may be changed, thereby moving the holding member 831 in the in-plane direction of the substrate W. By adjusting the position of the holding member 831 in the in-plane direction of the substrate W, the position of the support member 821 connected to the holding member 831 in the in-plane direction of the substrate W may also be adjusted simultaneously. In an aspect in which the holding member 831 is movable relative to the arm 810, any one or more of the four holding members may be movable relative to the arm 810.

[0030] The movement of the support members 821 and the holding members 831 relative to the arm 810 may be performed by a drive unit 839 such as an electric motor. The drive units 839 that move the support members 821 and the holding members 831 may be attached to the arm 810 corresponding to each support member 821 and each holding member 831, or may be provided inside the box 35 that is the base of the arm 810. The movement of the support members 821 and the holding members 831 relative to the arm 810 may be performed individually, or the movement of the support members 821 and the holding members 831 relative to the arm 810 may be performed in conjunction with each other.

[0031] At least one of the support members 821 may be movable along the normal direction to the substrate W. The movement of the support member 821 in the normal direction to the substrate W may be adjusted by driving the first arm 810 and / or the second arm 810 with the drive unit 30, or the support member 821 may be movable relative to the arm 810, and the position of the support member 821 relative to the arm 810 may change, causing the support member 821 to move in the normal direction to the substrate W. Also, a normal direction position detection unit (not shown) may be provided that can detect the position of the support member 821 and / or the holding member 831 in the normal direction to the substrate W.

[0032] A pivoting unit 100 (see FIG. 2) may be provided that can pivot the arm 810 around a pivot axis A (see FIG. 3) that extends in a direction perpendicular to the substrate loading direction (first direction, left-right direction in FIG. 1). In this embodiment, the substrate loading / unloading direction is referred to as the second direction, and the in-plane direction of the substrate W that is perpendicular to the second direction is referred to as the first direction. The normal direction of the substrate W is referred to as the third direction.

[0033] As shown in FIG. 2, the bevel polishing apparatus includes a substrate suction holding unit (substrate holding unit) 20 that, for example, suction-holds the backside of a substrate W transported by a transfer machine 80, and the polishing unit 40 (see FIG. 13) described above that polishes the bevel of the substrate W held by the substrate suction holding unit 20. The transfer machine 80 may transfer the substrate W to the substrate suction holding unit 20 as shown in FIG. 2. More specifically, as shown in FIG. 2(a), the transfer machine 80 carries in the substrate W, whose backside (the lower surface in FIG. 2) is supported by a support member 821 and whose side is held by a holding member 831 (see FIG. 1). Then, as shown in FIG. 2(b), the substrate suction holding unit 20 rises, and the substrate W carried in by the transfer machine 80 is placed on the substrate suction holding unit 20, and the backside of the substrate W is suction-held. Thereafter, the transfer machine 80 releases the support and holding of the substrate W, and the substrate W is separated from the transfer machine 80. At this time, the arm 810 is rotated by the rotating part 100 as shown in FIG. 2(c).

[0034] Before the substrate W carried in by the transfer machine 80 is placed on the substrate suction holder 20, the control unit 50 may adjust the position of the substrate W by rotating the arm 810 using the swivel unit 100 based on the in-plane (radial) position of the substrate W held by the holder 830 measured by the measurement unit 110. During this position adjustment, the measurement unit 110 measures the amount of deviation of the substrate W from a reference position (see FIGS. 3 and 4). The control unit 50 then calculates a correction angle from this amount of deviation, and the swivel unit 100 rotates the arm 810 by the amount of this correction angle (see FIG. 5). Thereafter, the substrate W is transferred from the transfer machine 80 to the substrate suction holder 20, which is an example of a substrate holder. The adoption of such a swivel unit 100 and control unit 50 is advantageous in that the position of the substrate W can be adjusted by simply controlling the swivel unit 100 to rotate the arm 810, and then the substrate W can be transferred from the transfer machine 80 to the substrate suction holder 20. Note that the swivel unit 100 is often also mounted on conventional transfer machines 80, and in this embodiment, the swivel unit 100 can be used as is to adjust the transfer position of the substrate W to the substrate suction holder 20, which is therefore extremely advantageous in that it does not require the addition of any new components to many transfer machines 80.

[0035] When the pivot axis A of the swivel unit 100 extends in a direction (first direction) that is in the plane of the substrate W before being rotated by the swivel unit 100 and is perpendicular to the substrate carry-in direction, the swivel unit 100 is rotated along the pivot axis A that extends in the plane of the substrate W, which is advantageous in that the position of the substrate W can be adjusted along the substrate carry-in direction (second direction) without providing, for example, a mechanism for sliding the substrate W. Note that the swivel unit 100 may be provided deeper than the holder 830 (left side in FIG. 2 ). However, in this case, the device configuration would need to be enlarged toward the depth due to its relationship with other components not shown in this specification. In contrast, providing the pivot axis A of the swivel unit 100 closer to the substrate W entrance than the holder 830 (right side in FIG. 2 ) is advantageous in that it does not require a larger device configuration.

[0036] The measuring unit 110 may measure the in-plane (radial) position of the substrate W held by the holding unit 830. As shown in Fig. 3, the measuring unit 110 may have a first measuring unit 111 and a second measuring unit 112 provided at a position point-symmetrical to the first measuring unit 111 with respect to the center of the substrate W (a position point-symmetrical to the center of the substrate W in the in-plane direction of the substrate W). By employing such an embodiment, the diameter of the substrate W can be calculated, and the deviation from the center of the substrate W can be easily determined.

[0037] A line sensor may be used as the measurement unit 110 (see FIG. 6). In this case, each of the first measurement unit 111 and the second measurement unit 112 may be a line sensor. By employing such a line sensor, it is possible to ignore vertical deviation of the substrate W. However, the present invention is not limited to this embodiment, and a CCD camera or the like may be used as the measurement unit 110 instead of a line sensor.

[0038] The control unit 50 may calculate the diameter of the substrate W from the measurement results by the first measuring unit 111 and the second measuring unit 112, thereby calculating the amount of deviation in size from the ideal diameter of the substrate W, and then control the swivel unit 100 to adjust the position of the substrate W (see FIG. 4). Adopting such an embodiment is advantageous in that it allows the substrate W to be positioned at an appropriate position while taking into account the deviation in size (manufacturing error) for each individual substrate W.

[0039] The measurement reference value (zero point) of the measuring unit 110 may be adjusted in advance by measuring the in-plane (radial) position of the rotating jig substrate 200 (see FIGS. 9(a) and 9(b)). This jig substrate 200 may have the diameter of an ideal substrate W. For example, if a 300 mm substrate W is being measured, the diameter of the jig substrate 200 will be 300 mm.

[0040] The jig substrate 200 may have an adsorbed portion 210 and an adjustment portion 220 that is movable in an in-plane direction relative to the adsorbed portion 210. For example, the adsorbed portion 210 and the adjustment portion 220 may be connected via a slide mechanism 221 (see FIG. 10 ). When adjusting the position, first, the adsorbed portion 210 is adsorbed to the substrate adsorption holding portion 20. Next, the adsorbed portion 210 is rotated, and the position of the adjustment portion 220 is measured by the measurement portion 110. Next, the position of the adjustment portion 220 relative to the adsorbed portion 210 is released from the fixing portion (not shown), and the in-plane position of the adjustment portion 220 is adjusted back and forth or left and right using the slide mechanism 221 (see FIG. 10 ). After that, the position of the adjustment portion 220 relative to the adsorbed portion 210 is fixed by the fixing portion. Thereafter, the substrate suction holder 20 is rotated, and the adjustment is completed when the measurement value of the measuring unit 110 does not change or the amount of change is within the allowable range. The adjustment is repeated until the measurement value of the measuring unit 110 does not change or the amount of change is within the allowable range (see FIGS. 9(a) and 9(b)). Then, the measurement value of the measuring unit 110 at the time when the adjustment is completed is set as the zero point. By setting the zero point in this manner, the deviation of the substrate W (including manufacturing error and positional deviation) can be measured more accurately.

[0041] 3 and 4, the pair of first and second measurement units 111 and 112 may be disposed at positions offset by a predetermined angle θ with respect to the loading / unloading direction (second direction) of the substrate W. Since the substrate W is often misaligned in the loading / unloading direction, taking this into consideration alone, it is preferable to position the first and second measurement units 111 and 112 relative to the loading / unloading direction of the substrate W. However, providing the first and second measurement units 111 and 112 along the loading / unloading direction of the substrate W increases the device configuration and raises concerns about interference with other components such as the substrate transport mechanism 1010, which is comprised of a robot hand or the like that transfers the substrate W to the arm 810. Therefore, it is more beneficial to dispose them at positions offset by the predetermined angle θ with respect to the loading / unloading direction of the substrate W. The predetermined angle θ is, for example, in the range of 30 to 60 degrees.

[0042] As shown in Figures 7(a) and 7(b), the swivel unit 100 may be provided below the support unit 820, below the transport path of the substrate transport mechanism 1010, such as a robot hand. By adopting such an embodiment, interference between the substrate transport mechanism 1010, such as a robot hand, and the swivel unit 100 can be prevented. After delivering the substrate W to the support unit 820, the substrate transport mechanism 1010 moves to below the support unit 820 and then moves in the unloading direction (the right side in Figure 7(b)). The substrate W, whose back surface is supported by the support unit 820 in this way, then has its side surface held by the holder 830.

[0043] (Calculation of deviation) As an example, let us assume that the design value of the substrate diameter is Φ0, the actual substrate diameter is Φ, the amount of deviation on the first measuring unit 111 side is d1, and the amount of deviation on the second measuring unit 112 side is d2.

number

[0044] (Calculation of turning angle) If the distance along the second direction from the rotation axis A to the tip of the substrate W at the ideal position is L, the tip of the substrate W, which is located at a position where the second direction component = L + a from the rotation axis A, is rotated by ψ1 to adjust the second direction component of the tip of the substrate W to = L (see Figure 5). Specifically, ψ1 can be calculated by performing the following calculation.

number

number

number

[0045] As in the example described above, it is very beneficial from the perspective of accurate positioning to adjust the position of the substrate W based on the calculation results using both the deviation in size of the substrate and the deviation in position of the substrate, but it is not necessarily necessary to do both, and the position of the substrate W may be adjusted based on the calculation results using only either the deviation in size of the substrate or the deviation in position of the substrate.

[0046] 11, an elastic member 90 (typically a silicon film) made of silicon or the like may be provided on the placement surface (upper surface) of the substrate suction holding part 20. When such an elastic member 90 is provided, the substrate W is placed on the substrate suction holding part 20 in a state in which it is only slightly tilted (in the above example, in a state in which it is tilted by the correction angle ψ1). Thereafter, the substrate W is sucked by the substrate suction holding part 20, and thereby the substrate W is sucked and held by the substrate suction holding part 20 in a state in which its position has been adjusted. For this reason, providing such an elastic member 90 is advantageous in that the substrate W can be smoothly transferred from the transfer machine 80 to the substrate suction holding part 20.

[0047] The above description of the embodiment and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and the invention described in the claims is not limited by the above description of the embodiment or the disclosure of the drawings. Furthermore, the claims as originally filed are merely examples, and the claims may be modified as appropriate based on the description in the specification, drawings, etc. [Explanation of symbols]

[0048] 20 Substrate suction holding part 50 control section 80 Transfer machine 90 Elastic member 100 Swivel section 110 Measuring section 111 First measurement section 112 Second measurement section 200 Jig Board 210 Adsorbed part 220 Adjustment section 810 Arm 820 Support part 830 Holding part W substrate

Claims

1. Arm and a holder provided on the arm for holding a substrate; a rotation unit that rotates the arm around a rotation axis that extends in a direction perpendicular to the substrate carrying-in direction; a control unit that adjusts the in-plane position of the substrate by rotating the arm using the rotating unit based on the in-plane position of the substrate measured by the measuring unit; Equipped with The transfer machine has a rotation axis that is provided closer to the substrate entrance than the holder and extends in the in-plane direction of the substrate before it is rotated by the rotation section.

2. a support portion provided below the arm and supporting the substrate; The transfer machine according to claim 1 , wherein the swivel unit is provided at a position below the support unit and below a transfer path of a substrate transfer mechanism.

3. A transfer machine according to claim 1, a measuring unit for measuring an in-plane position of the substrate held by the holding unit; a control unit that adjusts the position of the substrate by rotating the arm using the rotating unit based on the in-plane position of the substrate measured by the measuring unit; A substrate processing apparatus comprising:

4. The substrate processing apparatus according to claim 3 , wherein the measurement unit includes a first measurement unit and a second measurement unit provided at a position point-symmetrical with respect to the center of the substrate of the first measurement unit.

5. 5. The substrate processing apparatus according to claim 4, wherein the substrate diameter is calculated from the measurement results by the first measurement unit and the second measurement unit, thereby calculating the deviation of the diameter from an ideal diameter of the substrate, and the position of the substrate is adjusted by rotating the rotation unit based on the calculation result using the deviation of the diameter.

6. 6. The substrate processing apparatus according to claim 3, wherein an amount of angular deviation of the tip position of the substrate about the pivot axis relative to the tip position of the substrate at an ideal position is calculated, and the position of the substrate is adjusted by pivoting the pivot unit based on a calculation result using the amount of angular deviation.

7. The substrate processing apparatus according to claim 4 , wherein the first measurement unit and the second measurement unit are disposed at positions shifted by a predetermined angle θ with respect to a substrate loading / unloading direction.

8. A jig board for setting the zero points of the first measuring unit and the second measuring unit becomes available, 6. The substrate processing apparatus according to claim 4, wherein the jig substrate has a suction target portion that is suctioned by a substrate suction holding portion, and an adjustment portion that is movable in an in-plane direction relative to the suction target portion.

9. The substrate processing apparatus according to claim 3 , wherein the measuring unit includes a line sensor.

10. a substrate suction holding unit that suctions and holds a substrate; The substrate processing apparatus according to claim 3 , wherein an elastic member is provided on a mounting surface of the substrate suction holding part.

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