Machining apparatus

Abstract

To provide a processing device of a simple structure capable of inspecting a state of each shelf of a cassette having a plurality of shelves.SOLUTION: The processing apparatus includes a cassette table on which a cassette having a plurality of shelves arranged vertically is placed, a carry-in / carry-out mechanism that carries out a workpiece from any of the plurality of shelves of the cassette and carries in the workpiece to any of the plurality of shelves of the cassette, a holding table that holds the workpiece, a processing unit that processes the workpiece held by the holding table, a partition wall that has an opening through which at least a part of the carry-in / carry-out mechanism passes and partitions a first region in which the cassette table is disposed and a second region in which the holding table is disposed, a shutter of a vertically opening and closing type that can close the opening, and a sensor unit that is fixed to a part of the shutter so as to face the first region side and moves vertically according to opening and closing of the shutter.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus that carries out and processes workpieces from a cassette having a plurality of shelves. [Background technology]

[0002] Plate-shaped workpieces, such as wafers, are transported to a processing device in a state where they are housed in a cassette with multiple shelves arranged vertically, and are processed after being removed from the cassette. Each of the multiple shelves of the cassette is designed to be able to house a single workpiece horizontally, and the processing device moves a robot hand or the like to match the position of the cassette shelf placed on the cassette table, and removes the workpiece from the cassette.

[0003] However, workpieces may be stored in a cassette at an angle, spanning multiple shelves, or with some of the workpieces protruding outside the cassette. If the workpieces are not stored on each shelf in an appropriate manner, the processing device will be unable to remove the workpieces from the cassette and will stop. Therefore, in recent years, a technology has been proposed that uses a sensor unit having multiple light-emitting elements and multiple light-receiving elements to check the status of each shelf of a cassette (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2023-76058 Summary of the Invention [Problem to be solved by the invention]

[0005] According to the above-mentioned technology, the processing device can be operated in accordance with the state of each shelf of the cassette, so that the processing device does not have to stop even when the workpieces are not stored on each shelf in an appropriate manner. On the other hand, the above-mentioned technology requires light-emitting units and light-receiving units corresponding to the number of shelves, which causes the problem that the structure of the processing device becomes complicated and the price becomes high.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a processing device with a simple structure that can inspect the condition of each shelf of a cassette having a plurality of shelves. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a processing device comprising: a cassette table on which a cassette having a plurality of shelves arranged vertically is placed; a loading / unloading mechanism for loading a workpiece from one of the plurality of shelves of the cassette and loading the workpiece into one of the plurality of shelves of the cassette; a holding table for holding the workpiece; a processing unit for processing the workpiece held by the holding table; a partition wall having an opening for allowing at least a portion of the loading / unloading mechanism to pass through and separating a first area in which the cassette table is disposed from a second area in which the holding table is disposed; a vertically opening / closing shutter capable of closing the opening; a sensor unit fixed to a portion of the shutter so as to face the first area and which moves up and down as the shutter opens and closes; and a controller, wherein the controller inspects the condition of the plurality of shelves of the cassette using the sensor unit which moves as the shutter opens and closes. [Effects of the Invention]

[0008] A processing apparatus according to one aspect of the present invention includes a partition wall separating a first area in which a cassette table is placed from a second area in which a holding table is placed, a vertically opening and closing shutter that can close the opening of the partition wall, and a sensor unit fixed to a part of the shutter so as to face the first area.

[0009] Therefore, when a workpiece is removed from or loaded onto a cassette shelf placed on the cassette table, the shutter is opened and closed and the sensor unit simultaneously moves up and down, allowing the condition of the cassette shelf to be inspected.

[0010] This eliminates the need to prepare complex sensor units according to the number of shelves, simplifying the structure of the processing device. Also, because the sensor unit is moved up and down using the opening and closing of the shutter, there is no need to prepare a separate movement mechanism for moving the sensor unit. Thus, according to one aspect of the present invention, it is possible to provide a processing device with a simple structure that can inspect the state of cassette shelves. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view schematically showing a processing device. [Figure 2] FIG. 2 is a front view of the cassette. [Figure 3] FIG. 3 is an enlarged cross-sectional view of a part of the processing device. [Figure 4] FIG. 4 is a front view of the cassette without a workpiece properly seated therein. [Figure 5] FIG. 5 is a cross-sectional view showing how the state of the cassette shelf is inspected. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a processing device 2 according to this embodiment. In Fig. 1, some components are expressed as functional blocks. In addition, the X-axis (front-rear axis), Y-axis (left-right axis), and Z-axis (vertical axis) used in the following description are perpendicular to one another.

[0013] 1, the processing device 2 includes a base 4 that supports various elements that make up the processing device 2. A recessed storage section 4a, whose upper end opens to the upper surface of the base 4, is provided on the front end side of the upper surface of the base 4, and a robot arm (carry-in / out mechanism) 6 used for transporting a plate-shaped workpiece 11 is housed within the storage section 4a. The robot arm 6 can not only transport the workpiece 11, but also turn the workpiece 11 upside down.

[0014] The workpiece 11 is, for example, a disk-shaped wafer containing a semiconductor such as silicon as its main material. That is, the workpiece 11 has a circular front surface 11a and a circular back surface 11b opposite the front surface 11a. The front surface 11a side of the workpiece 11 is divided into a plurality of small regions by a plurality of intersecting streets (planned division lines), and a device such as an integrated circuit (IC) is formed in each small region.

[0015] The processing device 2 of this embodiment is used, for example, when grinding and / or polishing the back surface 11b of the workpiece 11. When grinding and / or polishing the back surface 11b of the workpiece 11, a protective member, typified by a protective tape made of a material such as resin, can be attached to the front surface 11a of the workpiece 11. By attaching the protective member to the front surface 11a of the workpiece 11, the impact applied to the front surface 11a during grinding and / or polishing of the back surface 11b is alleviated, and devices and the like of the workpiece 11 are protected.

[0016] Furthermore, in this embodiment, a disk-shaped wafer containing a semiconductor such as silicon as its main material is exemplified as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited to this embodiment. For example, a substrate containing mainly other semiconductors, ceramics, resin, metal, etc. may be used as the workpiece 11. Similarly, the type, number, shape, structure, size, arrangement, etc. of the devices are not limited to the above embodiment. The workpiece 11 does not necessarily have to have any devices formed thereon.

[0017] Two cassette tables 10 are provided in front of the storage section 4a, each capable of carrying a cassette 8 that can store a plurality of workpieces 11. Fig. 2 is a front view schematically showing the structure of the cassette 8 that can be placed on each cassette table 10. As shown in Fig. 2, the cassette 8 has a generally flat, plate-shaped bottom plate 8a.

[0018] The bottom plate 8a is configured, for example, in a shape having two parallel sides in a plan view, and the left and right ends corresponding to these two sides are connected to the lower ends of flat side plate 8b and side plate 8c having the same shape as side plate 8b, respectively. The inner surface of side plate 8b (the surface facing side plate 8c) and the opposing inner surface of side plate 8c (the surface facing side plate 8b) are, for example, generally parallel to each other.

[0019] A flat top plate 8d having a shape similar to that of the bottom plate 8a in a plan view is connected to the upper ends of the side plates 8b and 8c. That is, the top plate 8d is also configured to have two parallel sides in a plan view, and the upper ends of the side plates 8b and 8c are connected to the left and right ends corresponding to these two sides, respectively. The top surface of the bottom plate 8a (the surface facing the top plate 8d) and the opposing bottom surface of the top plate 8d (the surface facing the bottom plate 8a) are, for example, generally parallel to each other.

[0020] The rear end of the bottom plate 8a, the rear end of the side plate 8b, the rear end of the side plate 8c, and the rear end of the top plate 8d are connected to the lower end, two side ends of the back plate 8e, and the upper end of the back plate 8e, respectively. As a result, the cassette 8 is configured like a hollow box with an open front side. Note that the back plate 8e in this embodiment is a curved plate that is curved so as to be convex toward the rear, as shown in FIG.

[0021] Ten rectangular shelf plates 8f, each long in the front-to-back direction and short in the left-to-right direction, are fixed to the inside surface of side plate 8b at approximately equal intervals above and below. Similarly, ten rectangular shelf plates 8g, each long in the front-to-back direction and short in the left-to-right direction, are fixed to the inside surface of side plate 8c at approximately equal intervals above and below. For example, shelf plates 8f and 8g, which are approximately the same distance from bottom plate 8a, form shelf 8h for storing and supporting workpieces 11.

[0022] That is, the cassette 8 has ten sets of shelves 8h, each capable of supporting one workpiece 11. However, there is no limit to the number of shelves 8h that the cassette 8 has. That is, the cassette 8 only needs to have at least a plurality of shelves 8h arranged vertically. The cassette 8 configured in this manner is placed on the cassette table 10 with its front side facing the rear of the processing device 2, as shown in FIG. 1.

[0023] 1, a position adjustment mechanism 12 is disposed diagonally rearward of the storage section 4a, and adjusts the position of the workpiece 11 carried out from the cassette 8. The position adjustment mechanism 12 includes a disk-shaped adjustment table 14 and a plurality of movable pins 16 disposed around the adjustment table 14.

[0024] By simultaneously moving the multiple movable pins 16 along the radial direction of the adjustment table 14, the center of the workpiece 11, for example, carried out by the robot arm 6 from an arbitrary shelf 8h of the cassette 8 and placed on the adjustment table 14, is aligned to a predetermined position in a plane parallel to the X-axis and Y-axis. The workpiece 11 is placed on the adjustment table 14 so that the surface to be processed (for example, the back surface 11b) faces upward.

[0025] A first transfer arm 18 is provided on the side of the position adjustment mechanism 12 to hold and transfer the workpiece 11 to the rear before processing. A rotary drive source (not shown) such as a motor and an actuator (not shown) such as an air cylinder are connected to the base end of the first transfer arm 18. The tip of the first transfer arm 18 moves (pivots) around a rotation axis that passes through the base end of the first transfer arm 18 and is generally parallel to the Z axis by the power of the rotary drive source, and moves (lifts and lowers) up and down along the Z axis by the power of the actuator.

[0026] A first holding pad 20 that can suck and hold the upper surface (surface to be processed) of the workpiece 11 before processing is provided at the tip of the first transport arm 18. For example, the workpiece 11, whose position has been adjusted by the position adjustment mechanism 12, is held by the first holding pad 20, and the first holding pad 20 is moved by the first transport arm 18, whereby the workpiece 11 is transported backward.

[0027] A turntable 22 is provided behind the first transfer arm 18 and the first holding pad 20. The turntable 22 is connected to a rotary drive source (not shown) such as a motor, and rotates around a rotation axis that is generally parallel to the Z axis by the power of this rotary drive source. Four disk-shaped chuck tables (holding tables) 24 are arranged on the upper surface of the turntable 22 at approximately equal intervals (equidistant angular intervals) along the circumferential direction of the turntable 22. However, the number of chuck tables 24 is not limited to this.

[0028] Each chuck table 24 includes a disk-shaped frame 26 made of a material such as ceramics. A recess (not shown) is provided in the upper part of the frame 26, the upper end of which is circularly open on the upper surface of the frame 26. A holding plate 28 made of a porous material such as ceramics and having a disk shape is fixed in this recess. An upper surface 28a of the holding plate 28 functions as a holding surface for holding the workpiece 11, etc.

[0029] The lower surface side of the holding plate 28 is connected to a suction source (not shown) such as an ejector via a flow path (not shown) provided inside the frame 26 or a valve (not shown) arranged outside the frame 26. Therefore, when the valve is opened and negative pressure from the suction source is applied while the workpiece 11 (or protective member) is in contact with the upper surface 28a of the holding plate 28, the workpiece 11 (or protective member) is sucked by the chuck table 24. In other words, the workpiece 11 is held by the upper surface 28a of the chuck table 24.

[0030] The frame 26 of each chuck table 24 is supported on the turntable 22 via a rotational drive source (not shown) such as a motor, and each chuck table 24 rotates by the power of this rotational drive source around a rotational axis that is roughly parallel to the Z axis or a rotational axis that is slightly inclined with respect to the Z axis. In other words, each chuck table 24 is configured to be rotatable around a rotational axis that intersects with its upper surface 28a.

[0031] 1, each chuck table 24 moves along the circumferential direction of the turntable 22. Specifically, the turntable 22 moves the chuck table 24, for example, in the order of a load / unload area close to the first transport arm 18 and the first holding pad 20, a rough grinding area behind the load / unload area, a finish grinding area to the side of the rough grinding area, a polishing area in front of the finish grinding area and to the side of the load / unload area, and then the load / unload area.

[0032] The workpiece 11 is transported by the first transport arm 18 and the first holding pad 20 from the adjustment table 14 of the position adjustment mechanism 12 to the chuck table 24 arranged in the load / unload area. In the rough grinding area, the finish grinding area, and the polishing area, the space around the turntable 22 is covered by a processing chamber cover 30. Therefore, debris generated during processing of the workpiece 11 remains in the processing chamber inside the processing chamber cover 30 and is unlikely to scatter outside the processing chamber cover 30.

[0033] A columnar support structure 32 is provided behind each of the rough grinding area and the finish grinding area (i.e., behind the turntable 22). A Z-axis movement mechanism 34 including a ball screw connected to a rotational drive source such as a motor is provided on the front side of each support structure 32. This Z-axis movement mechanism 34 moves (raises and lowers) a support 36 arranged in front of each support structure 32 up and down along the Z axis.

[0034] Each support 36 supports a grinding mechanism (processing unit) 38 for grinding the workpiece 11 held by the chuck table 24 in the rough grinding area or the finish grinding area. Each grinding mechanism 38 includes a spindle housing 40 supported by the support 36. Each spindle housing 40 accommodates a columnar spindle (not shown) whose rotation axis is parallel to the Z axis or slightly inclined with respect to the Z axis, in a manner that allows it to rotate about its axis.

[0035] A rotary drive source (not shown), such as a motor, is connected to the upper end (base end) of each spindle, and the spindle rotates around its axis due to the power of this rotary drive source. The lower end (tip) of each spindle is exposed from the lower end surface of the spindle housing 40, and a disk-shaped mount 42 is connected to the lower end of this spindle.

[0036] A grinding wheel (not shown), which is a tool for rough grinding, is attached by bolts or the like to the underside of the mount 42 of the grinding mechanism 38 on the rough grinding area side. That is, a grinding wheel for rough grinding is attached to the spindle on the rough grinding area side. On the other hand, a grinding wheel, which is a tool for finish grinding, is attached by bolts or the like to the underside of the mount 42 of the grinding mechanism 38 on the finish grinding area side. That is, a grinding wheel for finish grinding is attached to the spindle on the finish grinding area side.

[0037] Each grinding wheel includes an annular wheel base made of metal such as stainless steel or aluminum. A plurality of grinding stones, each made of abrasive grains such as diamond dispersed in a binder such as vitrified or resinoid, are fixed to the underside of the wheel base so as to be arranged in an annular pattern around the periphery of the wheel base.

[0038] The conditions for the grinding wheel, such as the size of the abrasive grains and the type of binder, are appropriately set depending on the type of workpiece 11 and the quality required for the workpiece 11 after processing. For example, a rough grinding wheel equipped with a grinding wheel composed of abrasive grains with a relatively large grain size and a binder is attached to the mount 42 of the grinding mechanism 38 on the rough grinding region side. Also, for example, a finish grinding wheel equipped with a grinding wheel composed of abrasive grains with a relatively small grain size and a binder is attached to the mount 42 of the grinding mechanism 38 on the finish grinding region side.

[0039] A nozzle (not shown) capable of supplying a grinding liquid (grinding fluid) to the contact area between the workpiece 11 and the grinding wheel is disposed near each grinding mechanism 38. Instead of or together with this nozzle, a liquid supply port used to supply the liquid may be provided on the grinding wheel or the like.

[0040] 1, a support structure 54 separate from the support structure 32 is provided on the side of the polishing area. A Z-axis movement mechanism 56 including a rotation drive source (not shown) such as a motor is provided on the side of the support structure 54 facing the turntable 22. This Z-axis movement mechanism 56 moves (raises and lowers) a support tool 58 arranged on the turntable 22 side of the support structure 54 up and down along the Z axis.

[0041] A polishing mechanism (processing unit) 60 for polishing the workpiece 11 held by the chuck table 24 in the polishing area is supported on the support 58. The polishing mechanism 60 includes a spindle housing 62 supported on the support 58. The spindle housing 62 accommodates a columnar spindle (not shown) whose rotation axis is parallel to the Z axis or slightly tilted relative to the Z axis, in a manner that allows it to rotate around its axis.

[0042] A rotary drive source (not shown), such as a motor, is connected to the upper end (base end) of the spindle, and the power of this rotary drive source causes the spindle to rotate around its axis. The lower end (tip) of the spindle is exposed from the lower end surface of the spindle housing 62, and a disk-shaped mount 64 is connected to the lower end of the spindle.

[0043] A polishing pad (not shown), which is a polishing tool, is attached to the underside of the mount 64 with bolts or the like. In other words, the polishing pad is attached to the spindle of the polishing mechanism 60. The polishing pad is made of, for example, nonwoven fabric or polymer foam and does not contain abrasive grains. However, the polishing pad may contain abrasive grains.

[0044] The polishing pad also has a through-hole (not shown) at its center that penetrates the polishing pad in the thickness direction. A polishing liquid (polishing solution) is supplied to this through-hole via, for example, a spindle. The polishing liquid is typically a slurry in which abrasive grains are dispersed. However, the polishing liquid does not necessarily have to contain abrasive grains.

[0045] The workpiece 11 held by the chuck table 24 in the rough grinding region has its upper surface ground by the grinding mechanism 38 in the rough grinding region described above. The workpiece 11 held by the chuck table 24 in the finish grinding region has its upper surface ground by the grinding mechanism 38 in the finish grinding region described above. The workpiece 11 held by the chuck table 24 in the polishing region has its upper surface polished by the polishing mechanism 60 described above.

[0046] In this way, the chuck table 24 holding the workpiece 11 moves in the order of the carry-in / carry-out area, rough grinding area, finish grinding area, and polishing area, thereby successively performing rough grinding of the workpiece 11, finish grinding after the rough grinding, and polishing after the finish grinding. After polishing of the workpiece 11 is completed, the chuck table 24 in the polishing area is again positioned in the carry-in / carry-out area. Note that the processing apparatus 2 of this embodiment may be used to perform only one or two of rough grinding, finish grinding, and polishing of the workpiece 11.

[0047] A second transfer arm 76 is provided in front of the loading / unloading area and to the side of the first transfer arm 18 and first holding pad 20 to hold and transport the processed workpiece 11 forward. A rotary drive source (not shown) such as a motor and an actuator (not shown) such as an air cylinder are connected to the base end of the second transfer arm 76. The rotary drive source causes the tip of the second transfer arm 76 to move (pivot) around a rotation axis that passes through the base end of the second transfer arm 76 and is generally parallel to the Z axis, and the actuator causes the tip to move (lift) up and down along the Z axis.

[0048] A second holding pad 78 is provided at the tip of the second transport arm 76, which is capable of suctioning and holding the upper surface of the processed workpiece 11. For example, the processed workpiece 11 on the chuck table 24 that has been moved to the loading / unloading area is held by the second holding pad 78, and the second holding pad 78 is moved by the second transport arm 76, thereby transporting the workpiece 11 forward. The second holding pad 78 is larger than the first holding pad 20, and is capable of holding almost the entire workpiece 11, the rigidity of which has been reduced by processing.

[0049] A cleaning mechanism 80 is provided on the side of the second transport arm 76 and the second holding pad 78 to clean the processed workpiece 11 that has been carried out from the chuck table 24 in the carry-in / carry-out area. The cleaning mechanism 80 includes, for example, a cleaning nozzle (not shown) that can spray cleaning fluid. Below this cleaning nozzle, a spinner table (cleaning table) 82 is arranged to hold the workpiece 11 during cleaning processing by the cleaning nozzle.

[0050] Like the chuck table 24, the spinner table 82 is configured to suck and hold the workpiece 11. A rotary drive source such as a motor is connected to the bottom of the spinner table 82, and the spinner table 82 rotates around a rotation axis that is roughly parallel to the Z axis by the power of the rotary drive source. The workpiece 11 is transferred from the chuck table 24 to the spinner table 82 by the second transfer arm 76 and the second holding pad 78.

[0051] While the spinner table 82 is rotating, a cleaning fluid is sprayed from a cleaning nozzle toward the workpiece 11 held on the spinner table 82, thereby cleaning the workpiece 11. The cleaning fluid sprayed from the cleaning nozzle is typically a mixed fluid (two-fluid) of water and air. Of course, water not mixed with air may also be used as the cleaning fluid. After cleaning, the workpiece 11 is transported by the robot arm 6 and loaded onto any shelf 8h of the cassette 8.

[0052] An exterior cover (partition wall) 84 is attached to the base 4 to cover the space above the base 4. The exterior cover 84 separates an external first area A where the cassette table 10 is provided from an internal second area B where the robot arm 6, chuck table 24, etc. are provided.

[0053] The exterior cover 84 has two openings 84a that open at positions corresponding to the two cassette tables 10. Each opening 84a is, for example, sized to fit the front side of a cassette 8 to be placed on each cassette table 10, and allows at least a portion of the robot arm 6 to pass through. By approaching the cassette 8 through this opening 84a, the robot arm 6 can take out the workpiece 11 from any of the multiple shelves 8h of the cassette 8 and can load the workpiece 11 onto any of the multiple shelves 8h of the cassette 8.

[0054] 3 is an enlarged cross-sectional view of the opening 84a and its surroundings in the processing device 2. As shown in Fig. 3, a slit-shaped opening 4b of a predetermined depth that opens along the Y axis is provided directly below the opening 84a in the base 4. A vertically opening / closing shutter 86 configured to be large enough to close the opening 84a in the exterior cover 84 is disposed in this opening 4b.

[0055] An opening / closing mechanism (not shown) is connected to the shutter 86, and the shutter 86 moves up and down (raise and lower) along the opening 4b by the power of this opening / closing mechanism. The opening / closing mechanism is typically an actuator such as an air cylinder. When the opening / closing mechanism moves the shutter 86 to the upper end position, the opening 84a is closed by the shutter 86. When the opening / closing mechanism moves the shutter 86 to the lower end position, the opening 84a is fully opened.

[0056] An optical sensor unit 88 is fixed to the upper part of the surface of the shutter 86 facing the first area A (outside). This sensor unit 88 includes an emitter that emits light generated by a light source to an object, and a light receiver that receives light reflected by the object. The sensor unit 88 is fixed to the shutter 86 in a state facing the first area A so that the light emitted from the emitter travels toward the cassette 8 in the first area A.

[0057] The light source of the sensor unit 88 is, for example, an LED (Light Emitting Diode) or an incandescent light bulb, and functions as the above-mentioned radiator. However, the radiator does not need to be the light source itself, and may be, for example, a part (the end of the optical waveguide) that radiates light guided from the light source via an optical waveguide such as an optical fiber to the outside.

[0058] A photoelectric conversion element such as a photodiode is connected to the light receiving unit via an optical waveguide such as an optical fiber. This photoelectric conversion element is sensitive to the wavelength of light emitted from the emitting unit and converts the light received by the light receiving unit into an electrical signal. However, the light receiving unit may be the photoelectric conversion element itself. Alternatively, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a CCD (Charge Coupled Device) image sensor, or the like may be used as the photoelectric conversion element.

[0059] The sensor unit 88 of this embodiment has at least one set of emitting units and light receiving units, but does not have the same number of sets of emitting units and light receiving units as the number of shelves 8h of the cassette 8. In other words, the sensor unit 88 of this embodiment has fewer sets of emitting units and light receiving units than the number of shelves 8h of the cassette 8. This simplifies the structure of the processing device 2 compared to a case where a complex sensor unit having as many sets of emitting units and light receiving units as the number of shelves 8h of the cassette 8 is prepared.

[0060] A controller (control unit) 90 is connected to each element of the processing device 2, including the opening / closing mechanism of the shutter 86 and the sensor unit 88. This controller 90 is configured by a computer including, for example, a processing device 92 and a storage device 94, and controls the operation of each element of the processing device 2 so that the workpiece 11 is processed appropriately.

[0061] The processing device 92 is typically a CPU (Central Processing Unit) and performs various processes required to control the above-described elements of the processing device 2. The storage device 94 includes, for example, a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive or flash memory. The functions of the controller 90 are realized, for example, by the processing device 92 operating in accordance with a program stored in the storage device 94.

[0062] An input / output device 96 serving as a user interface is connected to this controller 90. The input / output device 96 is, for example, a touch screen, and inputs commands from an operator into the controller 90. Furthermore, the input / output device 96 outputs (displays, in the case of a touch screen) information related to the processing device 2 based on commands from the controller 90 in a format that can be recognized by the operator.

[0063] In this embodiment, an input / output device 96 having both an input function and an output function is shown, but an input device having an input function and an output device having an output function may each be connected to the controller 90. Examples of input devices that can be used include a keyboard and a mouse. Examples of output devices that can be used include a display device such as a liquid crystal display, a speaker that can communicate information by voice, and an indicator light that can communicate information by the color of light or the state of light emission (on, blinking, off, etc.).

[0064] Fig. 4 is a front view of the cassette 8 when the workpieces 11 are not properly stored, and Fig. 5 is a cross-sectional view showing how the state of the shelves 8h of the cassette 8 is inspected. When the workpieces 11 are not properly stored in the cassette 8, even if the processing device 2 attempts to remove the workpieces 11 from all the shelves 8h using the robot arm 6, the processing device 2 is unable to remove the workpieces 11 from some of the shelves 8h.

[0065] In this case, the processing device 2 will generate an error and stop, resulting in a decrease in the operating rate of the processing device 2. Note that examples of situations in which the workpieces 11 are not properly stored in the cassette 8 include a situation in which they are stored diagonally across multiple shelves 8h (FIG. 4), a situation in which they are stored with part of them protruding outside the cassette 8 (not shown), and a situation in which the workpieces 11 are not stored on the specified shelf 8h in the first place (FIG. 4).

[0066] Therefore, the processing device 2 of this embodiment inspects the state of the shelves 8h of the cassette 8 at the same time that the shutter 86 is opened. Then, based on the result of this inspection, the processing device 2 transports the workpieces 11 out of the shelves 8h excluding the shelves 8h on which the workpieces 11 are not properly accommodated (i.e., the shelves 8h on which the workpieces 11 are properly accommodated).

[0067] Specifically, the controller 90 starts emitting light from the emitting portion of the sensor unit 88, as shown in Fig. 5, around the time when the controller 90 starts the operation of lowering the shutter 86. The emission of light from the emitting portion of the sensor unit 88 continues, for example, until the shutter 86 moves to the bottom end position and the opening 84a is fully opened. That is, in this embodiment, the state of the shelf 8h is inspected while the shutter 86 is lowering.

[0068] However, the controller 90 may stop the descent of the shutter 86 (sensor unit 88) in accordance with the position (height) of each shelf 8 h. Also, the controller 90 may cause the emitting portion of the sensor unit 88 to emit light in accordance with the position (height) of each shelf 8 h.

[0069] For example, when the position (height) of the sensor unit 88 matches the position (height) of the shelf 8h on which the workpiece 11 is properly stored, as shown in FIG. 5, the light emitted from the emitting portion is properly reflected by the workpiece 11, and light of an appropriate intensity is incident on the light receiving portion of the sensor unit 88.

[0070] On the other hand, at the position (height) of the shelf 8h where the workpiece 11 is not properly stored, the light emitted from the emitting part is not properly reflected by the workpiece 11, and the intensity of the light incident on the light receiving part of the sensor unit 88 falls outside the appropriate range.

[0071] Therefore, the controller 90 can determine whether the workpiece 11 is properly stored on the target shelf 8h based on the position (height) of the sensor unit 88 when light enters the light receiving unit and the intensity of the light.

[0072] For example, when the workpieces 11 are stored diagonally across multiple shelves 8h, or when no workpieces 11 are stored on the target shelf 8h, the intensity of light incident on the light receiving unit will normally deviate below the appropriate range. Also, when the workpieces 11 are stored with part of them protruding outside the cassette 8, the intensity of light incident on the light receiving unit will deviate above or below the appropriate range depending on the state of the light emitted from the sensor unit 88.

[0073] As described above, in this embodiment, the states of all shelves 8h of the cassette 8 are inspected by lowering the shutter 86 from a state in which the opening 84a is completely closed by the shutter 86 until the opening 84a is completely open. The inspection results, that is, information on whether or not the workpieces 11 are properly accommodated on each shelf 8h, are stored in the memory device 94 of the controller 90.

[0074] When the opening 84a is fully opened, the controller 90 causes the robot arm 6 to carry out the workpiece 11 from the desired shelf 8h where the workpiece 11 is appropriately stored, and place it on the adjustment table 14 of the position adjustment mechanism 12. Thereafter, the controller 90 proceeds with the processing of the workpiece 11.

[0075] The inspection of the state of the shelf 8h of the cassette 8 described above may be performed when the shutter 86 is closed instead of when the shutter 86 is opened. Similarly, the inspection of the state of the shelf 8h of the cassette 8 may be performed when the workpieces 11 are loaded onto the shelf 8h of the cassette 8 instead of when the workpieces 11 are unloaded from the shelf 8h of the cassette 8.

[0076] As described above, the processing apparatus 2 of this embodiment includes an outer cover (partition wall) 84 that separates the first area A where the cassette table 10 is arranged from the second area B where the chuck table (holding table) 24 is arranged, an upper and lower opening / closing type shutter 86 that can close the opening 84a of the outer cover 84, and a sensor unit 88 fixed to a part of the shutter 86 so as to face the first area A side.

[0077] Therefore, when the workpiece 11 is removed from the shelf 8h of the cassette 8 placed on the cassette table 10 or when the workpiece 11 is loaded onto the shelf 8h of the cassette 8, the shutter 86 is opened and closed, and at the same time the sensor unit 88 moves up and down to inspect the condition of the shelf 8h of the cassette 8.

[0078] This eliminates the need to prepare complex sensor units according to the number of shelves 8h, thereby simplifying the structure of the processing device 2. Furthermore, because the sensor unit 88 is moved up and down by using the opening and closing of the shutter 86, there is no need to prepare a separate moving mechanism for moving the sensor unit 88. Thus, according to this embodiment, it is possible to provide a processing device 2 with a simple structure that can inspect the state of the shelves 8h of the cassette 8.

[0079] The present invention is not limited to the above-described embodiment and can be practiced with various modifications. For example, in the above-described embodiment, the processing device 2 is shown to include two grinding mechanisms (processing units) 38 and one polishing mechanism (processing unit) 60, but the processing device of the present invention is not limited to this.

[0080] For example, the processing apparatus of the present invention may be a processing apparatus called a grinding apparatus that includes a grinding mechanism 38 but not a polishing mechanism 60, or a processing apparatus called a polishing apparatus that includes a polishing mechanism 60 but not a grinding mechanism 38. Furthermore, the processing apparatus of the present invention may be a processing apparatus called a cutting apparatus that includes a cutting mechanism having a spindle to which an annular cutting blade (cutting tool) is attached.

[0081] In addition, the structures, methods, etc. according to the above-described embodiments and modifications may be modified and implemented without departing from the scope of the present invention. [Explanation of symbols]

[0082] 2: Processing equipment 4: Base 4a: Storage section 4b: Opening 6: Robot arm (carry-in / out mechanism) 8: Cassette 8a: Bottom plate 8b: Side plate 8c: Side plate 8d: Top plate 8e: Back plate 8th floor: Shelf 8g: Shelf 8h: shelf 10: Cassette table 12:Position adjustment mechanism 14: Adjustment table 16: Movable pin 18: First transport arm 20: First holding pad 22: Turntable 24: Chuck table (holding table) 26: Frame 28: Holding plate 28a:Top surface 30: Processing chamber cover 32:Support structure 34:Z-axis movement mechanism 36: Support 38: Grinding mechanism (processing unit) 40: Spindle housing 42: Mount 54 :Support structure 56:Z-axis movement mechanism 58 :Support 60: Polishing mechanism (processing unit) 62: Spindle housing 64: Mount 76: Second transfer arm 78: Second holding pad 80: Cleaning mechanism 82: Spinner table (cleaning table) 84: Exterior cover (partition wall) 84a: Opening 86: Shutter 88: Sensor unit 90: Controller (control unit) 92: Processing equipment 94 :Storage device 96: Input / output device 11: Workpiece 11a: Surface 11b: Back side A: 1st area B:Second area

Claims

[Claim 1] a cassette table having a plurality of shelves arranged vertically on which cassettes can be placed; a carry-in / out mechanism that carries out a workpiece from any one of the plurality of shelves of the cassette and carries the workpiece into any one of the plurality of shelves of the cassette; a holding table for holding the workpiece; a processing unit that processes the workpiece held by the holding table; a partition wall having an opening through which at least a part of the carry-in / out mechanism passes, the partition wall separating a first area in which the cassette table is disposed from a second area in which the holding table is disposed; a vertically opening and closing shutter that can close the opening; a sensor unit fixed to a part of the shutter so as to face the first area and move up and down as the shutter is opened and closed; a controller; The controller inspects the states of the shelves of the cassette by the sensor unit that moves in accordance with the opening and closing of the shutter.

Images