Vibration device, angular velocity sensor, electronic apparatus, and vehicle

Abstract

To provide a vibration device in which fluctuation of vibration characteristics is reduced, an angular velocity sensor in which deterioration of detection accuracy is reduced, and an electronic apparatus and a moving body including the vibration device.SOLUTION: A vibrating element having a plurality of terminals; a base body having a plurality of electrical connection terminals; and a wiring portion electrically connecting the plurality of electrical connection terminals and the plurality of terminals, and a relay substrate that supports the resonator element with respect to the base, in which the relay substrate includes a base fixing portion that is fixed to the base, a resonator element mounting portion on which the resonator element is mounted, and at least one beam portion that couples the base fixing portion and the resonator element mounting portion to each other, and the at least one beam portion includes a first portion that extends in a first direction and a second portion that extends toward a second direction intersecting the first direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a vibration device, an angular velocity sensor, an electronic device, and a moving object. [Background technology]

[0002] BACKGROUND ART Physical quantity detection devices that detect physical quantities such as angular velocity and acceleration using vibration elements such as piezoelectric vibrators and MEMS (Micro Electro Mechanical Systems) vibrators have been known.

[0003] As an example of such a physical detection device, Patent Document 1 discloses an angular velocity sensor including an angular velocity detection element made of silicon or quartz, a ceramic package, and a fixing frame that holds the angular velocity detection element relative to the package. The fixing frame also includes a torsion spring and a balancer. In the angular velocity sensor disclosed in Patent Document 1, the torsion spring and balancer reduce external leakage of vibrations from the angular velocity detection element. Furthermore, in the angular velocity sensor disclosed in Patent Document 1, the fixing frame is made of a metal material such as a stainless steel alloy or an iron-nickel-cobalt alloy, thereby suppressing translational movement of the angular velocity detection element in the thickness direction. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-089049 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the angular velocity sensor described in Patent Document 1, due to the configuration of the fixed frame supporting the angular velocity detection element, thermal stress generated in the package and stress generated when the package is subjected to an impact or the like are transmitted to the angular velocity detection element, resulting in fluctuations in the vibration characteristics and fluctuations in the zero-point voltage of the output signal.

[0006] An object of the present invention is to provide a vibration device with reduced fluctuations in vibration characteristics, an angular velocity sensor equipped with such a vibration device and with reduced degradation in detection accuracy, and an electronic device and a mobile object equipped with such a vibration device. [Means for solving the problem]

[0007] The above object has been made to solve at least part of the above-mentioned problems, and can be achieved as follows.

[0008] The vibration device of this application example includes a vibration element having a plurality of terminals, a base having a plurality of electrical connection terminals, and an interposer substrate having a wiring portion electrically connecting the plurality of electrical connection terminals to the plurality of terminals and supporting the vibration element on the base, wherein the interposer substrate has a base fixing portion fixed to the base, a vibration element mounting portion on which the vibration element is mounted, and at least one beam portion connecting the base fixing portion and the vibration element mounting portion, and the at least one beam portion has a first portion extending in a first direction and a second portion extending toward a second direction intersecting the first direction.

[0009] According to such a vibration device, by providing an intermediate substrate having a first portion and a second portion that intersect with each other, deformation of the base due to external forces (for example, thermal stress or impact) can be absorbed or suppressed by the beam portion. Therefore, when the base or the like is deformed, deformation of the vibration element mounting portion can be reduced, and therefore the state in which the vibration element is held by the vibration element mounting portion does not fluctuate significantly or the fluctuation can be reduced. Therefore, fluctuations in the vibration characteristics of the vibration element mounted on the vibration element mounting portion can be reduced.

[0010] In the resonator device of this application example, it is preferable that the relay substrate includes an insulating material. This reduces the occurrence of thermal stress between the base and the vibration element, and also facilitates insulation between the multiple wires included in the wiring portion.

[0011] In the vibration device of this application example, it is preferable that the base body is an electronic component including a circuit that drives the vibration element.

[0012] Even with this configuration, the force received by the electronic component due to deformation of the base body caused by external force can be absorbed or suppressed by the relay substrate, thereby reducing fluctuations in the vibration characteristics of the vibration element placed on the mounting portion.

[0013] In the vibration device of this application example, it is preferable that the base body comprises an electronic component including a circuit that drives the vibration element, and a stress relief portion that is provided between the electronic component and the relay substrate and has a wiring layer that electrically connects the electronic component and the wiring portion.

[0014] This allows the stress relaxation portion to absorb the external force received by the electronic component, and further reduces the transmission of the external force to the vibration element.

[0015] In the vibration device of this application example, it is preferable that the relay substrate, in plan view, configures a first frame body that surrounds the vibration element mounting portion with the base fixing portion and the beam portion.

[0016] This lengthens the transmission path of stress caused by deformation of the package base due to external force, so that even if the base is deformed by external force, the deformation (distortion) can be more effectively absorbed or suppressed by the first frame body. Therefore, deformation of the vibration element can be more effectively reduced, and fluctuations in the vibration characteristics of the vibration element mounted on the vibration element mounting portion can be further reduced.

[0017] In the vibration device of this application example, it is preferable that the relay substrate has a second frame body located between the first frame body and the vibration element mounting portion in a plan view.

[0018] This lengthens the transmission path of stress caused by deformation of the package base due to external force, so that even if the base is deformed by external force, the deformation can be more effectively absorbed or suppressed by the first frame and the second frame, thereby more effectively reducing fluctuations in the vibration characteristics of the vibration element mounted on the vibration element mounting portion.

[0019] In the resonation device of this application example, it is preferable that the relay substrate has a plurality of the first portions and a plurality of the second portions, and the first portions and the second portions are alternately connected to each other.

[0020] This lengthens the transmission path of stress caused by deformation of the package base due to external force, thereby more effectively reducing fluctuations in the vibration characteristics of the vibration element mounted on the vibration element mounting portion.

[0021] In the resonator device of this application example, it is preferable that the wiring portion has a shield wiring electrically connected to a constant potential.

[0022] This reduces the capacitance between the vibration element and, for example, the wiring layer and electronic components (IC chips) formed on the substrate, improving the S / N ratio and enabling the realization of a vibration device that can detect angular velocity with higher accuracy.

[0023] The angular velocity sensor of this application example includes the vibration device of this application example. Such an angular velocity sensor is equipped with a vibration device with reduced fluctuations in vibration characteristics, and therefore can exhibit excellent reliability.

[0024] The electronic device of this application example includes the vibration device of this application example. Such electronic devices include a vibration device with reduced fluctuations in vibration characteristics, and therefore can exhibit excellent reliability.

[0025] The moving object of this application example includes the vibration device of this application example. Such a moving body is provided with a vibration device with reduced fluctuations in vibration characteristics, and therefore can exhibit excellent reliability. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a perspective view showing a vibration device according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the vibration device shown in FIG. [Figure 3] 2 is a plan view showing an IC chip of the resonation device shown in FIG. 1. [Figure 4] FIG. 2 is a plan view showing a vibration element. [Figure 5] FIG. [Figure 6] FIG. 6 is a plan view (transparent view) of the relay board shown in FIG. 5. [Figure 7] 6 is a plan view of a main body of the relay board shown in FIG. 5. [Figure 8] 10 is a graph showing stresses on a mounting portion for each shape of an interconnect board. [Figure 9] FIG. 4 is a cross-sectional view showing a vibration device according to a second embodiment. [Figure 10] FIG. 10 is a cross-sectional view showing a vibration device according to a third embodiment. [Figure 11] FIG. 2 is a cross-sectional view showing a stress relaxation layer. [Figure 12] 10 is a plan view of a relay substrate included in a resonation device according to a fourth embodiment. FIG. [Figure 13] FIG. 13 is a plan view (transparent view) of the relay board shown in FIG. [Figure 14] 14 is a plan view of a main body of the relay board shown in FIG. 13. FIG. [Figure 15] 10 is a plan view of a relay substrate included in a resonation device according to a fifth embodiment. FIG. [Figure 16] FIG. 16 is a plan view (transparent view) of the relay board shown in FIG. [Figure 17] 16 is a plan view of a main body of the relay board shown in FIG. 15. FIG. [Figure 18] 18 is a plan view showing a modified example of the main body of the relay board shown in FIG. 17. FIG. [Figure 19] 18 is a plan view showing a modified example of the main body of the relay board shown in FIG. 17. FIG. [Figure 20] 10 is a perspective view of a main body portion of a relay substrate included in a resonation device according to a first reference example. FIG. [Figure 21] 10 is a plan view of a main body portion of an intermediate substrate included in a resonation device according to a second reference example. FIG. [Figure 22] 22 is a plan view showing a modified example of the main body of the relay board shown in FIG. 21. FIG. [Figure 23] FIG. 13 is a plan view of a vibration element included in a vibration device according to a sixth embodiment. [Figure 24] FIG. 13 is a cross-sectional view of a vibration device according to a seventh embodiment. [Figure 25] FIG. 25 is a plan view of the vibration element shown in FIG. 24. [Figure 26] 25 is a plan view (transparent view) of the vibration element shown in FIG. 24. [Figure 27] 25 is a diagram illustrating another example of the vibration element shown in FIG. 24. [Figure 28] FIG. 13 is a plan view of a vibration element included in a vibration device according to an eighth embodiment. [Figure 29] FIG. 13 is a plan view of a vibration device according to a ninth embodiment. [Figure 30] 30 is another example of the relay board shown in FIG. 29. [Figure 31] FIG. 20 is a cross-sectional view showing a vibration device according to a tenth embodiment. [Figure 32] FIG. 1 is a cross-sectional view showing a module including a vibration device. [Figure 33] 1 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic device of this application example is applied. [Figure 34]1 is a perspective view showing the configuration of a mobile phone (including PHS) to which the electronic device of this application example is applied. [Figure 35] FIG. 10 is a perspective view showing the configuration of a digital still camera to which the electronic device of this application example is applied. [Figure 36] FIG. 10 is a perspective view showing an automobile to which the moving body of this application example is applied. DETAILED DESCRIPTION OF THE INVENTION

[0027] The vibration device, angular velocity sensor, electronic device, and mobile object of the present invention will be described in detail below with reference to the embodiments shown in the accompanying drawings. Note that the drawings may be enlarged or reduced in size to make the parts being described clearly.

[0028] 1. Vibration Device First, the vibration device of this application example will be described.

[0029] First Embodiment FIG. 1 is a perspective view showing a resonation device according to a first embodiment. FIG. 2 is a cross-sectional view of the resonation device shown in FIG. 1. FIG. 3 is a plan view showing an IC chip of the resonation device shown in FIG. 1. The upper side in FIG. 2 is referred to as "top" and the lower side in FIG. 2 is referred to as "bottom." For ease of explanation, FIGS. 1 to 3 illustrate three mutually orthogonal axes: an X-axis, a Y-axis, and a Z-axis. The tip end of each arrow indicating each axis is designated as "+" and the base end as "-." The direction parallel to the X-axis is referred to as the "X-axis direction," the direction parallel to the Y-axis is referred to as the "Y-axis direction," and the direction parallel to the Z-axis is referred to as the "Z-axis direction." The +Z-axis side is also referred to as "top," and the -Z-axis side is also referred to as "bottom." In this embodiment, the X-axis, Y-axis, and Z-axis correspond to the electrical, mechanical, and optical axes, respectively, which are the crystal axes of quartz. The lid 22 is not shown in FIG. 1.

[0030] 1 and 2 is an angular velocity sensor that detects angular velocity around the Z axis. The vibration device 1 includes a package 2, a vibration element 3 housed in the package 2, an IC chip 4 (electronic component) disposed in the package 2, and an intermediate substrate 5 that supports the vibration element 3 relative to the package 2.

[0031] <package> The package 2 has a box-shaped base member 21 having a recess for accommodating the vibration element 3, and a plate-shaped lid 22 joined to the base member 21 via a joining member 23 so as to close the opening of the recess 211 of the base member 21. The space inside the package 2 may be in a reduced pressure (vacuum) state, or may be filled with an inert gas such as nitrogen, helium, or argon.

[0032] The recess 211 of the base member 21 has a lower surface 241 located on the bottom side, an upper surface 243 located on the opening side, and a middle surface 242 located between these surfaces. The material of the base member 21 is not particularly limited, and various ceramics such as aluminum oxide and various glass materials can be used, for example. The material of the lid 22 is also not particularly limited, but is preferably a material with a linear expansion coefficient similar to that of the material of the base member 21. For example, if the material of the base member 21 is ceramic, the material of the lid 22 is preferably an alloy such as Kovar. The joining member 23 is formed using a seam ring, low-melting-point glass, adhesive, etc.

[0033] As shown in FIG. 3, the upper surface 243 is provided with a plurality of terminals 261, 262, 263, 264, 265, and 266 (electrical connection terminals) electrically connected to the relay substrate 5. Furthermore, the middle surface 242 is provided with a plurality of terminals 25 electrically connected to the IC chip 4. Furthermore, as shown in FIG. 2, a plurality of external connection terminals 27 are formed on the rear surface of the base member 21. The plurality of terminals 261, 262, 263, 264, 265, and 266, the plurality of terminals 25, and the plurality of external connection terminals 27 are connected to form circuit wiring via internal wiring and through-holes (not shown) formed in the base member 21. These connection terminals are not particularly limited as long as they are conductive, and may be formed with a metal coating formed by laminating coatings of Ni (nickel), Au (gold), Ag (silver), Cu (copper), or the like on a metallized layer (underlayer) such as Cr (chromium), W (tungsten), or the like.

[0034] In this embodiment, the outer shape of the base member 21 in plan view and the shape of the recess 211 in plan view are both rectangular, but these are not limited to the shapes shown in the drawings and can be any shape. Furthermore, each of the lids 22 has a rectangular flat plate shape in plan view, but the shape of the lid 22 is not limited to the shape shown in the drawing and may be any shape.

[0035] <IC chip (electronic component)> As shown in Fig. 2, the IC chip 4 is fixed to the lower surface 241 of the base member 21 with an adhesive 11. As shown in Fig. 3, the IC chip 4 has a plurality of terminals 41, each of which is electrically connected to the aforementioned terminals 25 by a conductive wire B1. The IC chip 4 has a drive circuit for driving the vibration element 3 to vibrate, and a detection circuit for detecting the detection vibration generated in the vibration element 3 when an angular velocity ω is applied.

[0036] <Vibration element> FIG. 4 is a plan view showing the vibration element. 4 is a sensor element that detects an angular velocity ω around the Z axis. The vibration element 3 has a vibrating body 30 and an electrode portion 37 formed on the surface of the vibrating body 30.

[0037] (vibrator) The vibrating body 30 is a plate-like structure that extends in the XY plane defined by the Y-axis (mechanical axis) and X-axis (electrical axis), which are the crystal axes of the quartz substrate, and has a thickness in the Z-axis (optical axis) direction. That is, the vibrating body 30 is made of a Z-cut quartz plate. The Z-axis does not necessarily need to coincide with the thickness direction of the vibrating body 30; it may be slightly tilted relative to the thickness direction to minimize temperature-related changes in frequency at room temperature. Specifically, a Z-cut quartz plate includes a quartz plate with a cut angle such that the main surface is a plane obtained by rotating a plane perpendicular to the Z-axis around at least one of the X-axis and Y-axis by a range of 0 to 10 degrees. The material of the vibrating body 30 is not limited to quartz; for example, piezoelectric materials other than quartz, such as lithium tantalate and lithium niobate, can also be used. The vibrating body 30 may also be made of a material that does not have piezoelectric properties, such as silicon. In this case, a piezoelectric element may be appropriately provided on the vibrating body 30.

[0038] The vibrating body 30 has a base 311, a pair of detection vibrating arms 312 and 313 extending from the base 311 on both sides in the Y-axis direction, a pair of connecting arms 314 and 315 extending from the base 311 on both sides in the X-axis direction, a pair of drive vibrating arms 316 and 317 extending from the tip of the connecting arm 314 on both sides in the Y-axis direction, and a pair of drive vibrating arms 318 and 319 extending from the tip of the connecting arm 315 on both sides in the Y-axis direction. The vibrating body 30 also has a pair of support portions 321 and 322 that support the base 31, a pair of beam portions 323 and 324 that connect the support portion 321 and the base 311, and a pair of beam portions 325 and 326 that connect the support portion 322 and the base 311.

[0039] In addition, in the illustration, the width (length in the X-axis direction) of the tip ends of the detection vibration arms 312, 313 and the drive vibration arms 316, 317, 318, and 319 is wider than the base 311, but is not limited to this. For example, the width of the tip ends of the detection vibration arms 312, 313 and the drive vibration arms 316, 317, 318, and 319 may be constant. Furthermore, the detection vibration arms 312, 313 and the drive vibration arms 316, 317, 318, and 319 may each have a pair of bottomed grooves formed on their upper and lower surfaces that are open and extend in the Y-axis direction.

[0040] (electrode part) The electrode section 37 has an electrode pattern (not shown) provided on the surface of the vibrating body 30 and a plurality of terminals 381, 382, ​​383, 384, 385, and 386.

[0041] Although not shown, the electrode pattern has drive signal electrodes and drive ground electrodes provided on the drive vibration arms 316 , 317 , 318 , and 319 , and detection signal electrodes and detection ground electrodes provided on the detection vibration arms 312 and 313 .

[0042] A terminal 381 (drive signal terminal) electrically connected to the drive signal electrode (not shown), a terminal 383 (detection signal terminal) electrically connected to the detection signal electrode (not shown), and a terminal 385 (detection ground terminal) having a reference potential with respect to the detection signal electrode (not shown) are provided on the lower surface of the support portion 321. Furthermore, a terminal 382 (drive ground terminal) electrically connected to the drive ground electrode (not shown), a terminal 384 (detection signal terminal) electrically connected to the detection signal electrode (not shown), and a terminal 386 (detection ground terminal) having a reference potential with respect to the detection signal electrode (not shown) are provided on the lower surface of the support portion 322.

[0043] The material of such electrode portion 37 is not particularly limited as long as it is conductive, but it can be made of a metal coating in which a metallized layer (base layer) such as Cr (chromium) or W (tungsten) is laminated with coatings such as Ni (nickel), Au (gold), Ag (silver), or Cu (copper).

[0044] In such a vibration element 3, when an electric field is generated between the drive signal electrode and the drive ground electrode by inputting a drive signal to terminal 381 (drive signal terminal) in a state where no angular velocity ω is applied to the vibration element 3, each of the drive vibration arms 316, 317, 318, and 319 performs bending vibration (drive vibration) in the direction shown by arrow C in Fig. 4. At this time, since the drive vibration arms 316, 317 and the drive vibration arms 318, 319 perform vertically symmetrical vibration in Fig. 4, the base 311 and the detection vibration arms 312, 313 hardly vibrate.

[0045] When an angular velocity ω about the central axis a (center of gravity) along the Z axis is applied to the vibration element 3 while this drive vibration is occurring, a detection vibration (vibration in the detection mode) is excited. Specifically, a Coriolis force acts on the drive vibration arms 316, 317, 318, and 319 and the connecting arms 314 and 315 in the direction indicated by arrow D in FIG. 4, exciting a new vibration. Accordingly, a detection vibration is excited in the detection vibration arms 312 and 313 in the direction indicated by arrow E in FIG. 4 so as to cancel out the vibration of the connecting arms 314 and 315. Then, charges generated in the detection vibration arms 312 and 313 by this detection vibration are extracted as detection signals from the detection signal electrodes, and the angular velocity ω is determined based on this detection signal.

[0046] <Relay board> Fig. 5 is a plan view of the relay board, Fig. 6 is a plan view (transparent view) of the relay board shown in Fig. 5, Fig. 7 is a plan view of the main body of the relay board shown in Fig. 5.

[0047] As shown in FIGS. 5 and 6, the relay substrate 5 has a flat plate-shaped main body portion 50 and a wiring portion 57 formed on the surface of the main body portion 50.

[0048] (Main body) As shown in Figure 7, the main body 50 is located in the center of the relay substrate 5 and has a mounting portion 51 (vibration element mounting portion) that is rectangular in plan view, fixed portions 52a, 52b (base fixing portions) that are approximately rectangular in plan view and are located on opposite sides of the mounting portion 51 in plan view, and two elongated beam portions 53a, 53b that connect the fixed portions 52a, 52b to each other and connect the fixed portions 52a, 52b to the mounting portion 51.

[0049] The fixed portion 52a is spaced apart from the mounting portion 51 and is located on the left side of the mounting portion 51 in FIG. 7, and the fixed portion 52b is spaced apart from the mounting portion 51 and is located on the right side of the mounting portion 51 in FIG.

[0050] The beams 53a and 53b are located on opposite sides of the mounting portion 51. The beam 53a is located on the upper side of the mounting portion 51 in FIG. 7, and the beam 53b is located on the lower side of the mounting portion 51 in FIG.

[0051] Each of the beam portions 53a and 53b has a first portion 531 extending along the Y-axis direction (first direction) and a second portion 532 extending from the middle of the first portion 531 toward the X-axis direction (second direction) perpendicular to the first portion 531. One end of the first portion 531 is connected to the fixed portion 52a, and the other end of the first portion 531 is connected to the fixed portion 52b. One end of the second portion 532 is connected to the center of the first portion 531, and the other end of the second portion 532 is connected to the mounting portion 51. Note that the relationship between the width (length along the Y-axis direction) and length (length along the Z-axis direction) of the second portion 532 is not limited to that shown in the figure.

[0052] In this embodiment, the line segment a1 connecting the center line of the second portion 532 of the beam portion 53a and the center line of the second portion 532 of the beam portion 53b coincides with the center line of the mounting portion 51 along the short side direction.

[0053] In plan view, the main body 50 has a first frame 530 having an annular shape that surrounds the mounting portion 51 with the fixing portions 52a, 52b, the first portion 531 of the beam portion 53a, and the first portion 531 of the beam portion 53b.

[0054] Furthermore, the main body 50 of the relay substrate 5 is preferably made of an insulating material (insulating material). That is, the relay substrate 5 includes an insulating material. This reduces the generation of thermal stress between the relay substrate 5 and the base member 21 and between the relay substrate 5 and the vibration element 3. Specifically, the constituent material of the main body 50 is not particularly limited, but it is preferable to use an insulating material such as quartz, silicon, or ceramics. In particular, it is preferable to use the same material as the constituent material of the vibrating body 30 as the constituent material of the main body 50. This reduces the thermal expansion difference between the vibration element 3 and the relay substrate 5, thereby reducing the thermal stress associated with the thermal expansion difference between them. In this embodiment, the vibrating body 30 is made of quartz, as described above. Therefore, it is preferable to use quartz as the constituent material of the main body 50.

[0055] (Wiring section) As shown in Figure 5 or 6, the wiring section 57 has a plurality of terminals 581, 582, 583, 584, 585, and 586 provided on the upper surface of the mounting section 51, terminals 561, 562, 563, 564, 565, and 566 provided on the lower surface of the fixed section 52a or the fixed section 52b, and a plurality of wirings 571, 572, 573, 574, and 575.

[0056] 5 are used for electrical connection to the vibration element 3 described above, and are provided at positions corresponding to the terminals 381, 382, ​​383, 384, 385, 386 of the vibration element 3 (see FIGS. 4 and 5). Terminals 581, 583, 585 are located on the −Y-axis side of the mounting portion 51, and terminals 582, 584, 586 are located on the +Y-axis side of the mounting portion 51.

[0057] 6 are used to electrically connect to the plurality of terminals 261, 262, 263, 264, 265, and 266 of the base member 21, respectively, and are provided at positions corresponding to the terminals 261, 262, 263, 264, 265, and 266 of the base member 21 (see FIGS. 3 and 5). Terminals 561, 562, and 564 are provided on the lower surface of the fixed portion 52b, and terminals 563, 565, and 566 are provided on the lower surface of the fixed portion 52a.

[0058] Wiring 571 is provided on the upper surface of mounting portion 51 and on the upper surface of beam portion 53a, and electrically connects terminal 581 to terminal 561. Wiring 572 is provided on the upper surface of mounting portion 51, on the upper surface of beam portion 53a, and on the upper surface of fixed portion 52b, and electrically connects terminal 582 to terminal 562. Wiring 573 is provided on the upper surface of mounting portion 51, on the upper surface of beam portion 53b, and on the upper surface of fixed portion 52a, and electrically connects terminal 583 to terminal 563. Wiring 574 is provided on the upper surface of mounting portion 51, on the upper surface of beam portion 53b, and on the upper surface of fixed portion 52b, and electrically connects terminal 585 to terminal 565. Wiring 575 is provided on the upper and lower surfaces of mounting portion 51, the upper and lower surfaces of beam portions 53a and 53b, and the upper surface of fixing portion 52a, and electrically connects terminals 585 and 586 to terminals 565 and 566.

[0059] Furthermore, the wiring 575 is provided over the entire lower surface of the mounting portion 51, and the portion of the wiring 575 provided on the lower surface of the mounting portion 51 functions as a shield wiring that electrically shields against signal interference caused by parasitic capacitance. This shield wiring is electrically connected to a constant potential, which in this embodiment is ground. Here, the constant potential means the ground potential or a potential fixed at a constant potential.

[0060] The material of such wiring portion 57 is not particularly limited as long as it is conductive, but it can be made of a metal coating in which a metallized layer (base layer) such as Cr (chromium) or W (tungsten) is laminated with coatings such as Ni (nickel), Au (gold), Ag (silver), or Cu (copper).

[0061] In the relay board 5 described above, the terminals 561, 562, 563, 564, 565, and 566 are adhesively fixed to the corresponding terminals 261, 262, 263, 264, 265, and 266 of the base member 21, for example, via a conductive adhesive (see FIGS. 2, 3, and 6). As a result, the relay board 5 is fixed to the base member 21 (see FIG. 2). As shown in FIG. 2, the mounting portion 51 is not in contact with the base member 21 and is located above the recess 211. As shown in FIG. 2, the terminals 581, 582, 583, 584, 585, and 586 of the relay board 5 are adhesively fixed to the corresponding terminals 381, 382, ​​383, 384, 385, and 386 of the vibration element 3, for example, via a conductive adhesive (see FIGS. 2, 4, and 5). As a result, the vibration element 3 is mounted on the mounting portion 51, as shown in FIG. 2. In this way, the relay substrate 5 connects the base member 21 and the vibration element 3, and electrically connects the terminals 261, 262, 263, 264, 265, 266 provided on the base member 21 to the terminals 381, 382, ​​383, 384, 385, 386 of the vibration element 3.

[0062] As described above, the beams 53a and 53b of the relay substrate 5 support the mounting portion 51 relative to the fixed portions 52a and 52b. The beams 53a and 53b support the mounting portion 51 relative to the fixed portions 52a and 52b so that the mounting portion 51 does not oscillate when an angular velocity ω is applied to the vibration element 3 on the mounting portion 51. Therefore, for example, the resonant frequencies of the second portions 532 of the beams 53a and 53b are preferably higher than the resonant frequency of the vibrating body 30 by 10 KHz or more. This makes it possible to prevent or reduce the oscillation of the mounting portion 51 when an angular velocity ω is applied to the vibration element 3.

[0063] As described above, the wiring section 57 includes a shielded wiring electrically connected to a constant potential. Specifically, as described above, the wiring section 57 includes a wiring 575 that is provided across the entire lower surface of the mounting section 51 and is electrically connected to ground. This reduces the capacitance between the electrode section 37 of the vibrating element 3 and a wiring layer (not shown) having terminals 261, 262, 263, 264, 265, and 266 formed on the base member 21 or the IC chip 4. This improves the S / N ratio of the vibrating device 1, enabling it to detect the angular velocity ω with higher accuracy. Furthermore, when the IC chip 4 has a digital output, the frequency band is on the order of MHz, so it is particularly effective for the wiring section 57 to include a shielded wiring.

[0064] Furthermore, as described above, the terminals 581, 582, 583, 584, 585, and 586 provided on the mounting portion 51 are provided at positions corresponding to the terminals 381, 382, ​​383, 384, 385, and 386 of the vibration element 3. In this way, by setting and changing the pattern of the wiring portion 57 of the relay substrate 5 to match the vibration element 3, a wide variety of vibration elements 3 can be connected (mounted) to the same package 2. Therefore, when the holding position or pattern of the vibration element 3 is changed due to a design change or the like in the mounting portion 51, it is not necessary to change the package 2 in accordance with the change, and therefore it is possible to prevent a decrease in productivity due to the change.

[0065] The paths of the wires 571, 572, 573, 574, and 575, the arrangement of the terminals 581, 582, 583, 584, 585, and 586, and the arrangement of the terminals 561, 562, 563, 564, 565, and 566 are not limited to the illustrated form. The configuration of the vibration device 1 has been described above.

[0066] As described above, the vibration device 1 includes a vibration element 3 having a plurality of terminals 381, 382, ​​383, 384, 385, 386, a base member 21 (substrate) having a plurality of terminals 261, 262, 263, 264, 265, 266 (electrical connection terminals), and an interconnect substrate 5 having a wiring portion 57 that electrically connects the plurality of terminals 261, 262, 263, 264, 265, 266 to the plurality of (corresponding) terminals 381, 382, ​​383, 384, 385, 386, and supporting the vibration element 3 relative to the base member 21. The relay substrate 5 also has fixing portions 52a and 52b (base fixing portions) fixed to the base member 21, a mounting portion 51 (vibration element mounting portion) on which the vibrating body 30 is mounted, and at least one (two in this embodiment) beam portions 53a and 53b connecting the fixing portions 52a and 52b to the mounting portion 51. Each of the two beam portions 53a and 53b has a first portion 531 extending in the Y-axis direction (first direction) and a second portion 532 extending in the X-axis direction (second direction) intersecting (orthogonal in this embodiment) the Y-axis direction.

[0067] The resonator device 1 includes the relay substrate 5 including the beams 53a and 53b having the first and second portions 531 and 532 that intersect with each other. This lengthens the transmission path to the mounting portion 51 of stress generated by deformation of the base member 21 due to an external force (e.g., an impact). Therefore, the beams 53a and 53b can absorb or suppress the stress. Therefore, deformation of the mounting portion 51 due to the stress can be reduced, and the holding state of the resonator element 3 does not fluctuate significantly. Therefore, fluctuations in the vibration characteristics of the resonator element 3 due to external forces can be reduced, and a resonator device 1 that is highly stable and robust to external environments can be provided. Therefore, in the resonator device 1, which is an angular velocity sensor, the difference between the drive frequency (the resonant frequency of the drive vibrating arms 316, 317, 318, and 319) and the detection frequency (the resonant frequency of the detection vibrating arms 312 and 313) does not fluctuate, and therefore the detuning frequency, which is the difference between the drive frequency and the detection frequency, is unlikely to fluctuate. Therefore, according to the vibration device 1, it is possible to reduce fluctuations in the zero point voltage and realize a low-noise angular velocity sensor.

[0068] As described above, the relay substrate 5 is connected to the base member 21 using a conductive adhesive (or bumps). For example, if temperature is applied during this connection, thermal stress occurs due to the difference in linear expansion coefficient between the relay substrate 5 and the base member 21. However, the beam portions 53a and 53b of the relay substrate 5 can absorb or suppress deformation of the mounting portion 51 due to this thermal stress. For example, the relay substrate 5 prevents deformation of the mounting portion 51, even on the order of several nanometers. Therefore, deformation of the mounting portion 51 can be reduced even when temperature is applied in addition to external forces such as impacts, and the holding state of the vibrating element 3 does not fluctuate significantly. Therefore, the vibrating device 1 can realize an angular velocity sensor with excellent temperature characteristics.

[0069] As described above, the relay board 5 has two beam portions 53a and 53b, and in plan view, the relay board 5 forms a first frame 530 that surrounds the mounting portion 51 (vibration element mounting portion) with the fixing portions 52a and 52b, the first portion 531 of the beam portion 53a, and the first portion 531 of the beam portion 53b. This lengthens the transmission path of stress caused by deformation of the base member 21 due to an external force, so that even if the base member 21 is deformed by an external force or the like, the deformation (distortion) can be more effectively absorbed or suppressed by the first frame 530. Therefore, deformation of the mounting portion 51 can be more effectively reduced, and fluctuations in the vibration characteristics of the vibration element 3 mounted on the mounting portion 51 can be further reduced.

[0070] Furthermore, as described above, the relay board 5 has an opening between the first frame 530 and the mounting portion 51, and the first frame 530 and the mounting portion 51 are connected by the second portion 532 of the beam portion 53a and the second portion 532 of the beam portion 53b. As described above, in this embodiment, the line segment a1 connecting the center lines of the second portions 532 of the beam portions 53b coincides with the center line of the mounting portion 51 along the short-side direction. This makes it possible to particularly suppress deformation of the mounting portion 51 in the longitudinal direction. Also, the area of ​​the mounting portion 51 on which the vibration element 3 is mounted can be increased.

[0071] In this embodiment, the line segment a1 coincides with the center line of the mounting portion 51 along the short-side direction, but may also coincide with, for example, the center line of the mounting portion 51 along the long-side direction. In this case, deformation of the mounting portion 51 in the short-side direction can be particularly suppressed.

[0072] (Stress relief effect of relay board) FIG. 8 is a graph showing stresses on the mounting portion for each shape of the relay board.

[0073] 8 indicates a flat relay board (hereinafter referred to as "relay board X") that is rectangular in plan view and has a uniform thickness with no holes, grooves, or the like formed therein, and "5" indicates the relay board 5 in this embodiment. Also, "5C" indicates the relay board 5C in the fourth embodiment described below, "5D" indicates the relay board 5D in the fifth embodiment described below, "5E" indicates the relay board 5E in the first reference example described below, and "5F" indicates the relay board 5F in the second reference example described below.

[0074] 8 shows the stress generated in the mounting area of ​​the vibration element 3 when an angular velocity ω about the central axis a (detection axis) is applied. The stress shown in FIG. 8 is a value normalized by setting the stress of the relay substrate X (rectangle) to 1.

[0075] As shown in FIG. 8, the stress generated in the mounting area (mounting portion 51) of the vibration element 3 in the relay substrate 5 is smaller than that in the relay substrate X, specifically, the stress is smaller by 90% or more.

[0076] In this way, according to the resonator device 1 including the relay substrate 5, even if the base member 21 is deformed by an external force or the like, the deformation (distortion) can be absorbed or suppressed by the beam portions 53a and 53b, so that the mounting portion 51 does not deform or the deformation is reduced. Therefore, it is possible to prevent the characteristics of the resonator element 3 mounted on the mounting portion 51 from changing.

[0077] The above has been described with reference to an example in which the vibration device 1 of the present invention is used as an angular velocity sensor. That is, the angular velocity sensor includes the vibration device 1. Such an angular velocity sensor includes the vibration device 1 with reduced fluctuations in vibration characteristics, and therefore can exhibit excellent reliability.

[0078] Second Embodiment Next, a second embodiment will be described.

[0079] FIG. 9 is a cross-sectional view showing a vibration device according to the second embodiment. This embodiment is similar to the above-described embodiment, except that a relay substrate is provided on the IC chip. In the following description, the second embodiment will be described, focusing on the differences from the above-described embodiment, and a description of the same points will be omitted.

[0080] In a resonator device 1A shown in FIG. 9, a relay substrate 5 is placed on an IC chip 4 (electronic component) via, for example, a conductive adhesive material.

[0081] The IC chip 4 is provided with a plurality of terminals 42 that are electrically connected to a plurality of terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5. The plurality of terminals 42 are provided at positions corresponding to the plurality of terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5.

[0082] Thus, in the resonator device 1A, the "base" to which the relay substrate 5 is connected is the IC chip 4 (electronic component) including a circuit that drives the resonator element 3. Even with this configuration, even if the base member 21 or the IC chip 4 is deformed by an external force or the like, the beam portions 53a and 53b can absorb or suppress the deformation (distortion), so the mounting portion 51 does not deform or the deformation is reduced. Therefore, it is possible to reduce fluctuations in the vibration characteristics of the resonator element 3 mounted on the mounting portion 51. Furthermore, it is possible to electrically connect the IC chip 4 and the relay substrate 5 without, for example, wire bonding. Furthermore, the relay substrate 5 and the resonator element 3 are provided directly above the IC chip 4. Therefore, it is possible to reduce the height of the resonator device 1A.

[0083] Furthermore, as described in the first embodiment, the wiring 575 provided on the back surface of the main body 50 among the wiring portion 57 of the relay substrate 5 functions as a shield wiring (see FIG. 6). Therefore, when the vibration element 3 is disposed on the IC chip 4 via the relay substrate 5 as in this embodiment, the shield wiring (wiring 575) can reduce the electrostatic capacitance between the IC chip 4. Therefore, signal interference with the vibration element 3 via the parasitic capacitance from the IC chip 4 can be particularly effectively prevented. The second embodiment as described above can also reduce fluctuations in vibration characteristics.

[0084] Third Embodiment Next, a third embodiment will be described.

[0085] Fig. 10 is a cross-sectional view showing a resonation device according to a third embodiment Fig. 11 is a cross-sectional view showing a stress relaxation layer.

[0086] This embodiment is similar to the above-described embodiments, except that a relay substrate is provided on the stress relaxation layer. In the following description, the third embodiment will be described, focusing on the differences from the above-described embodiments, and a description of the same points will be omitted.

[0087] 10 includes a stress relaxation layer 8 provided on an IC chip 4 (electronic component). An intermediate substrate 5 is placed on the stress relaxation layer 8 via, for example, a conductive adhesive material.

[0088] 11, the stress relaxation layer 8 is located between the IC chip 4 and the relay substrate 5 and is provided on the upper surface of the IC chip 4. By providing this stress relaxation layer 8, the impact received by the package 2 is alleviated, and the impact is less likely to be transmitted to the relay substrate 5. In addition, the stress generated due to the difference in thermal expansion between the IC chip 4 and the relay substrate 5 is alleviated, making it less likely that the relay substrate 5 will bend, and the fluctuation in the vibration characteristics of the vibrating element 3 can be further reduced. As a result, the angular velocity ω can be detected with high accuracy.

[0089] 11, the IC chip 4 has a passivation film 43 at its bottom layer. Although not shown, this passivation film 43 is provided on a wiring layer formed on the active surface of the IC chip 4 to protect the wiring layer. A stress relaxation layer 8 is provided on the top surface of the IC chip 4 (specifically, on the passivation film 43).

[0090] The stress relief layer 8 includes a laminated first insulating layer 81, a first wiring layer 82 disposed on the first insulating layer 81, a second insulating layer 83 disposed on the first insulating layer 81 and the first wiring layer 82, and a second wiring layer 84 disposed on the second insulating layer 83. The first and second insulating layers 81 and 83 each have elasticity, thereby absorbing the impact described above. The materials for the first and second insulating layers 81 and 83 are not particularly limited, but examples of suitable materials include polyimide, silicone-modified polyimide resin, epoxy resin, silicone-modified epoxy resin, acrylic resin, phenolic resin, silicone resin, modified polyimide resin, benzocyclobutene, and polybenzoxazole. This allows the first and second insulating layers 81 and 83 to have sufficient elasticity, thereby more reliably achieving the above-described effects.

[0091] The second wiring layer 84 has a plurality of terminals 841 arranged corresponding to the terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5. The corresponding terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5 are adhesively fixed to the terminals 841, for example, via a conductive adhesive. The first wiring layer 82 electrically connects the plurality of terminals 841 of the second wiring layer 84 to the plurality of terminals 42 of the IC chip 4. This electrically connects the relay substrate 5 and the IC chip 4 via the stress relaxation layer 8. In this way, the first and second wiring layers 82 and 84 provided in the stress relaxation layer 8 function as wiring (relocation wiring) for electrically connecting the relay substrate 5 and the IC chip 4. This allows, for example, the terminals 42 of the IC chip 4 to be freely arranged without considering the positions of the terminals 561, 562, 563, 564, 565, and 566 of the relay substrate 5. This increases the degree of freedom in designing the resonation device 1B.

[0092] Furthermore, the second wiring layer 84 has shielding wiring 842 in addition to the terminals 841. The shielding wiring 842 is arranged to extend over the second insulating layer 83 as far as it does not obstruct the arrangement of the terminals 841. The shielding wiring 842 is electrically connected to, for example, ground. Such shielding wiring 842 functions as a shielding layer that reduces the electrostatic capacitance between the electrode portion 37 of the vibration element 3 and the IC chip 4. Therefore, by arranging the shielding wiring 842, the S / N ratio is improved, resulting in a vibration device 1B that can detect the angular velocity ω with higher accuracy. Furthermore, even if noise has a temperature characteristic, this noise can be reduced, resulting in a vibration device 1B with excellent temperature characteristics.

[0093] As described above, in this embodiment, the "base" to which the relay substrate 5 is connected is the IC chip 4 and the stress relaxation layer 8. That is, the "base" includes the IC chip 4 (electronic component) including a circuit that drives the vibration element 3, and the stress relaxation layer 8 (stress relaxation portion) that is provided between the IC chip 4 and the relay substrate 5 and has wiring layers (in this embodiment, the first wiring layer 82 and the second wiring layer 84) that electrically connect the IC chip 4 and the wiring portion 57 of the relay substrate 5. This allows the stress relaxation layer 8 to absorb the external force received by the IC chip 4, and the transmission of the external force to the vibration element 3 can be further reduced. The third embodiment as described above can also reduce fluctuations in vibration characteristics.

[0094] <Fourth embodiment> Next, a fourth embodiment will be described.

[0095] Fig. 12 is a plan view of a relay substrate included in a resonation device according to a fourth embodiment. Fig. 13 is a plan view (transparent view) of the relay substrate shown in Fig. 12. Fig. 14 is a plan view of a main body of the relay substrate shown in Fig. 13.

[0096] This embodiment is similar to the above-described embodiments except for the configuration of the relay board. In the following description, the fourth embodiment will be described focusing on the differences from the above-described embodiments, and a description of the same points will be omitted.

[0097] <Relay board> As shown in FIGS. 12 and 13, the relay substrate 5C has a main body portion 50C and a wiring portion 57C.

[0098] (Main body) As shown in FIG. 14, the main body 50C has, in a plan view, a first frame body 530 having an annular shape and a second frame body 54 having an annular shape that is located inside the first frame body 530 and surrounds the mounting portion 51.

[0099] The second frame 54 (beam portion) is located between the first frame 530 and the mounting portion 51 in a plan view, and is spaced apart from the first frame 530 and the mounting portion 51.

[0100] The second frame 54 has a rectangular frame-shaped frame portion 541 and a portion 542 (fifth portion) connecting the frame portion 541 and the mounting portion 51. The frame portion 541 has two portions 5411 (third portions) extending along the Y-axis direction and two portions 5412 (fourth portions) connected to both ends of the portion 5411 and extending along the X-axis direction. The portions 5411 are connected to the second portions 532 of the beam portions 53a and 53b, and the portions 5412 are connected to the portions 542 (fifth portions).

[0101] The two portions 542 (fifth portions) are located on opposite sides of the mounting portion 51, and a line segment a2 connecting the center lines of the two portions 542 coincides with the center line along the longitudinal direction of the mounting portion 51. The line segment a1 and the line segment a2 intersect, and in this embodiment, are perpendicular to each other.

[0102] (Wiring section) As shown in FIG. 12 or 13, wiring 571C is provided on the upper surface of mounting portion 51 and the upper surface of beam portion 53a. Wiring 572C is provided on the upper surface of mounting portion 51, the upper surface of beam portion 53a, and the upper surface of fixed portion 52b. Wiring 573C is provided on the upper surface of mounting portion 51, the upper surface of beam portion 53b, and the upper surface of fixed portion 52a. Wiring 574C is provided on the upper surface of mounting portion 51, the upper surface of beam portion 53b, and the upper surface of fixed portion 52b. Wiring 575C is provided on the upper surface of mounting portion 51, the upper and lower surfaces of beam portions 53a and 53b, and the upper surface of fixed portion 52a. Wiring 575C is provided across the entire lower surface of mounting portion 51.

[0103] Furthermore, the second frame 54 of the relay substrate 5C supports the mounting portion 51 together with the beams 53a, 53b relative to the fixed portions 52a, 52b so that the mounting portion 51 does not oscillate when an angular velocity ω is applied to the vibration element 3. For example, the resonant frequency of the second frame 54 is preferably 10 KHz or more higher than the resonant frequency of the vibrating body 30. This makes it possible to prevent or reduce the oscillating motion of the mounting portion 51 when an angular velocity ω is applied to the vibration element 3.

[0104] As described above, the relay board 5C in this embodiment has the second frame 54 located between the first frame 530 and the mounting portion 51 (vibration element mounting portion) in a plan view. This lengthens the transmission path of stress caused by deformation of the package 2 due to external force. Therefore, the stress caused by the deformation can be absorbed or suppressed by the first frame 530 and the second frame 54. As a result, deformation of the mounting portion 51 can be more effectively reduced, and therefore fluctuations in the vibration characteristics of the vibration element 3 mounted on the mounting portion 51 can be more effectively reduced.

[0105] As described above, the relay board 5C has an opening between the first frame 530 and the second frame 54, and the first frame 530 and the second frame 54 are connected by the second portion 532 of the beam 53a and the second portion 532 of the beam 53b. Furthermore, an opening is provided between the second frame 54 and the mounting portion 51, and the second frame 54 and the mounting portion 51 are connected by two portions 542 (fifth portions) of the second frame 54. As described above, in this embodiment, the line segment a1 coincides with the center line of the mounting portion 51 along the short side, and the line segment a2 coincides with the center line of the mounting portion 51 along the longitudinal direction, and the line segment a1 and the line segment a2 intersect (orthogonal in this embodiment). This makes it difficult for deformation in the long side and short side of the relay board 5 to be transmitted to the mounting portion 51. Therefore, a more accurate and stable angular velocity sensor can be realized.

[0106] In the illustration, the line segment a1 coincides with the center line of the mounting portion 51 along the short side direction, and the line segment a2 coincides with the center line of the mounting portion 51 along the long side direction, but the opposite may also be true. That is, the line segment a1 may coincide with the center line of the mounting portion 51 along the long side direction, and the line segment a2 may coincide with the center line of the mounting portion 51 along the short side direction. Also, for example, an additional frame may be provided between the second frame 54 and the mounting portion 51 in a planar view. That is, the relay board 5C may have three or more frame members surrounding the mounting portion 51 in a planar view. This further lengthens the transmission path of stress caused by deformation of the package 2 due to an external force.

[0107] 8, the relay substrate 5C can reduce the stress generated in the mounting area (mounting portion 51) of the vibration element 3, specifically by 90% or more, compared to the relay substrate X. Furthermore, the relay substrate 5C can reduce the stress generated in the mounting portion 51 compared to the relay substrate 5 in the first embodiment. The fourth embodiment as described above can also reduce fluctuations in vibration characteristics.

[0108] Fifth Embodiment Next, a fifth embodiment will be described.

[0109] Fig. 15 is a plan view of a relay substrate included in a resonation device according to a fifth embodiment. Fig. 16 is a plan view (transparent view) of the relay substrate shown in Fig. 15. Fig. 17 is a plan view of a main body of the relay substrate shown in Fig. 15.

[0110] This embodiment is similar to the above-described embodiments except for the configuration of the relay board. In the following description, the fifth embodiment will be described focusing on the differences from the above-described embodiments, and a description of the same points will be omitted.

[0111] <Relay board> As shown in FIGS. 15 and 16, the relay substrate 5D has a main body portion 50D and a wiring portion 57D.

[0112] (Main body) As shown in FIG. 17, the main body 50D has a plurality of meandering beams 55a, 55b, 55c, and 55d in a plan view.

[0113] The beams 55a and 55b each connect the fixed portion 52a and the mounting portion 51. The beams 55c and 55d each connect the fixed portion 52b and the mounting portion 51.

[0114] Each of the beam portions 55a, 55b, 55b, 55c, and 55d has three first portions 551 extending along the Y-axis direction and two second portions 552 extending along the X-axis direction and longer than the first portions 551.

[0115] Beam portions 55a and 55b are each formed by alternatingly connecting first portions 551 and second portions 552, with some portions being close to each other and some portions being far apart in the X-axis direction. One ends of beam portions 55a and 55b are connected to both ends of fixed portion 52a on the +Y-axis direction side, and the other ends are connected to both ends of mounting portion 51 on the -Y-axis direction side.

[0116] Similarly, in each of the beam portions 55c and 55d, first portions 551 and second portions 552 are alternately connected, and there are portions where they are close to each other in the X-axis direction and portions where they are spaced apart. Beam portion 55c and beam portion 55d have one end connected to both ends of fixed portion 52b on the −Y-axis direction side, and the other end connected to both ends of mounting portion 51 on the +Y-axis direction side.

[0117] (Wiring section) As shown in FIG. 15 or 16, wiring 571D is provided on the upper surface of mounting portion 51, the upper surface of beam portion 55c, and the upper surface of fixed portion 52b. Wiring 572D is provided on the upper surface of mounting portion 51, the upper surface of beam portion 55d, and the upper surface of fixed portion 52b. Wiring 573D is provided on the upper surface of mounting portion 51, and the upper surfaces of beam portion 55a and fixed portion 52a. Wiring 574D is provided on the upper surface of mounting portion 51, the upper surfaces of beam portions 55a and 55b, and the upper surface of fixed portion 52a. Wiring 575D is provided on the upper surface of mounting portion 51, the upper and lower surfaces of beam portions 55a and 55b, and the upper surface of fixed portion 52a. Wiring 575D is provided across the entire lower surface of mounting portion 51.

[0118] In this embodiment, the terminals 581, 583, and 585 are located on the −X-axis side of the mounting portion 51, and the terminals 582, 584, and 586 are located on the +X-axis side of the mounting portion 51.

[0119] Furthermore, it is preferable that the resonant frequencies of the beam portions 55a, 55b, 55c, and 55d are each 10 KHz or more higher than the resonant frequency of the vibrating body 30. This makes it possible to prevent or reduce the accompanying oscillation of the mounting portion 51 when an angular velocity ω is applied to the vibrating element 3.

[0120] As described above, the relay substrate 5D has a plurality of (three in this embodiment) first portions 551 and a plurality of (two in this embodiment) second portions 552, and the first portions 551 and the second portions 552 are alternately connected. This lengthens the transmission path of stress caused by deformation of the package 2 due to external force. Therefore, deformation of the mounting portion 51 can be more effectively reduced, thereby reducing fluctuations in the vibration characteristics of the vibration element 3 mounted on the mounting portion 51. Furthermore, in the relay substrate 5D, the plurality of beam portions 55a, 55b, 55c, and 55d are connected to the corners of the mounting portion 51, respectively, thereby particularly reducing twisting of the mounting portion 51.

[0121] Furthermore, because relay board 5D has multiple beam portions 55a, 55b, 55c, and 55d, it is possible to separate the paths for driving system wiring 571D and 572D from those for detection system wiring 573D, 574D, and 575D. This reduces signal interference from driving system wiring 571D and 572D to detection system wiring 573D, 574D, and 575D, allowing for more accurate transmission of detection signals to IC chip 4. This also provides a high degree of freedom in the design of wiring 571D, 572D, 573D, 574D, and 575D. This is particularly effective when mounting an angular velocity sensor element with a relatively large number of terminals, such as vibration element 3, on mounting portion 51.

[0122] The above-described wirings 571D, 572D, 573D, 574D, and 575D may be drawn out together from a desired one of the beam portions 55a, 55b, 55c, and 55d.

[0123] Furthermore, as shown in FIG. 8, the relay substrate 5D can reduce the stress generated in the mounting region (mounting portion 51) of the vibration element 3 compared to the relay substrate X, specifically by 90% or more.

[0124] (Variation 1) FIG. 18 is a plan view showing a modification of the main body of the relay board shown in FIG.

[0125] 18, beams 55a and 55b of main body 50Da have one end connected to the center of fixed portion 52a on the +Y-axis direction side, and the other end connected to the center of mounting portion 51 on the -Y-axis direction side. Similarly, beams 55c and 55d have one end connected to the center of fixed portion 52b on the -Y-axis direction side, and the other end connected to the center of mounting portion 51 on the +Y-axis direction side. Main body 50Da having such a configuration can also lengthen the transmission path to mounting portion 51 of stress generated by deformation of package 2 due to external force, and therefore can reduce fluctuations in the vibration characteristics of resonator element 3.

[0126] (Variation 2) FIG. 19 is a plan view showing a modification of the main body of the relay board shown in FIG.

[0127] As shown in FIG. 19 , the main body 50Db has two beams 56a and 56b. The beam 56a connects the fixed portion 52a and the mounting portion 51, and the beam 56b connects the fixed portion 52b and the mounting portion 51. The beam 56a is formed by integrating the beams 55a and 55b of the main body 50Da. Specifically, the beams 56a and 56b each have four first portions 5610 extending along the Y-axis direction and two second portions 5620 extending along the X-axis direction and longer than the first portions 5610. The main body 50Db having such a configuration can also lengthen the transmission path to the mounting portion 51 of stress generated by deformation of the package 2 due to an external force, thereby reducing fluctuations in the vibration characteristics of the vibrating element 3. The fifth embodiment as described above can also reduce fluctuations in vibration characteristics.

[0128] <1st reference example> Next, a first reference example will be described. FIG. 20 is a perspective view of a main body portion of a relay substrate included in a resonation device according to a first reference example.

[0129] This reference example is similar to the above-described embodiment except for the configuration of the relay board. In the following description, the first reference example will be described, focusing on the differences from the above-described embodiment, and a description of similar points will be omitted.

[0130] 20 has a beam 570a that connects the fixing portion 52a and the mounting portion 51, and a beam 570b that connects the fixing portion 52b and the mounting portion 51. In other words, in this embodiment, the main body 50E does not have an opening (through hole), has a flat plate shape that is rectangular in plan view, and has two thin-walled portions (beams 570a, 570b) that are thinner than other portions formed along the X-axis direction on the +Y-axis side and the −Y-axis side.

[0131] In this way, by having the beam portions 570a, 570b, which are thin portions, the relay substrate 5E can have low rigidity portions between the fixing portions 52a, 52b and the mounting portion 51, thereby making it difficult for the influence of external force to be transmitted to the mounting portion 51. Therefore, with the relay substrate 5E, it is possible to reduce the stress generated in the mounting region of the vibration element 3 (mounting portion 51) compared to the relay substrate X, which has a uniform thickness, as shown in FIG.

[0132] The beam portions 570a and 570b can be formed by, for example, photoetching, patterning the beam portions 570a and 570b, shortening the etching time, and removing the beam portions 570a and 570b from the etching solution before they penetrate the main body portion 50E.

[0133] It is also effective to provide such beam portions 570a, 570b to the relay boards 5, 5C, 5D, etc. of the above-described embodiments.

[0134] <Second reference example> Next, a second reference example will be described. FIG. 21 is a plan view of a main body portion of an intermediate substrate included in a resonation device according to a second reference example.

[0135] This reference example is similar to the above-described embodiment except for the configuration of the relay board. In the following description, the first reference example will be described, focusing on the differences from the above-described embodiment, and a description of similar points will be omitted.

[0136] 21 has three beams 571a partially provided between the fixed portion 52a and the mounting portion 51, and three beams 571b partially provided between the fixed portion 52b and the mounting portion 51. These beams 571a, 571b are thin-walled portions, similar to the beams 570a, 570b in the first reference example described above. That is, in the main body 50F shown in FIG. 21, the three beams 571a, which are thin-walled portions, are lined up along the X-axis direction on the -Y-axis side, and the three beams 571b, which are thin-walled portions, are lined up along the X-axis direction on the +Y-axis side.

[0137] In other words, main body 50F has two portions 581a between fixed portion 52a and mounting portion 51, each having the same thickness as fixed portion 52a and mounting portion 51. Similarly, main body 50F has two portions 581b between fixed portion 52b and mounting portion 51, each having the same thickness as fixed portion 52b and mounting portion 51.

[0138] As shown in FIG. 8, such an intermediate substrate 5F can also reduce stress generated in the mounting region (mounting portion 51) of the vibration element 3, compared to the intermediate substrate X having a uniform thickness.

[0139] In addition, in main body 50F, beam 571a may not be a thin portion but may be a through portion. That is, fixed portion 52a and mounting portion 51 may be connected at portion 581a. Similarly, beam 571b may not be a thin portion but may be a through portion. That is, fixed portion 52b and mounting portion 51 may be connected at portion 581b. In that case, portions 581a and 581b function as beams.

[0140] (Variation) FIG. 22 is a plan view showing a modification of the main body of the relay board shown in FIG.

[0141] The main body 50Fa shown in Figure 22 has two thin-walled beam portions 572a lined up along the X-axis direction on its -Y-axis side, and two thin-walled beam portions 572b lined up along the X-axis direction on its +Y-axis side.

[0142] In other words, main body portion 50Fa has one portion 582a between fixing portion 52a and mounting portion 51, the portion having the same thickness as fixing portion 52a and mounting portion 51. Similarly, main body portion 50Fa has one portion 582b between fixing portion 52b and mounting portion 51, the portion having the same thickness as fixing portion 52b and mounting portion 51.

[0143] The relay substrate 5Fa including such a main body portion 50Fa can also reduce stress generated in the mounting region (mounting portion 51) of the vibration element 3 compared to the relay substrate X having a uniform thickness. As described above, thin portions may be provided in parts.

[0144] Sixth Embodiment Next, a sixth embodiment will be described. FIG. 23 is a plan view of a vibration element included in a vibration device according to the sixth embodiment.

[0145] This embodiment is similar to the above-described embodiments except for the configuration of the relay board. In the following description, the sixth embodiment will be described focusing on the differences from the above-described embodiments, and a description of the same points will be omitted.

[0146] <Vibration element> 23 is a sensor element that detects an angular velocity ω around the Y axis. The vibration element 6 has a vibrating body 60 and an electrode portion 67 formed on the surface of the vibrating body 60.

[0147] (vibrator) The vibrating body 60 of the vibrating element 6 shown in Figure 23, like the vibrating body 30 in the first embodiment, has an extension in the XY plane defined by the Y axis (mechanical axis) and X axis (electrical axis), which are the crystal axes of the quartz substrate, and is plate-shaped with a thickness in the Z axis (optical axis) direction.

[0148] The vibrating body 60 has a base 61, a pair of drive vibrating arms 621, 622, a pair of detection vibrating arms 631, 632, a pair of adjustment vibrating arms 641, 642, a support part 65, and four connecting parts 661, 662, 663, 664, which are integrally formed.

[0149] The drive vibration arms 621 and 622 are arranged side by side along the X-axis direction and each extend from the base 61 in the -Y-axis direction. The detection vibration arms 631 and 632 are arranged side by side along the X-axis direction and each extend from the base 61 in the +Y-axis direction. The adjustment vibration arms 641 and 642 are arranged side by side along the X-axis direction, sandwiching the pair of detection vibration arms 631 and 632 described above, and each extend from the base 61 in the +Y-axis direction. The support portion 65 has an elongated portion 651 that is arranged on the -Y-axis side of the base 61 and extends along the X-axis direction, and two portions 652 and 653 that extend from both ends of the portion 651 along the +Y-axis direction. The connecting portions 661, 662, 663, and 664 each connect the base 61 and the support portion 65 and have multiple bent or curved portions along the way.

[0150] In the illustration, the widths (lengths in the X-axis direction) of the tip ends of the drive vibration arms 621, 622, detection vibration arms 631, 632, and adjustment vibration arms 641, 642 are wide, but this is not limited to this. For example, the widths of the drive vibration arms 621, 622, detection vibration arms 631, 632, and adjustment vibration arms 641, 642 may be constant. Furthermore, the drive vibration arms 621, 622, detection vibration arms 631, 632, and adjustment vibration arms 641, 642 may have a pair of bottomed grooves formed on their upper and lower surfaces that are open and extend in the Y-axis direction.

[0151] (electrode part) The electrode section 67 has an electrode pattern (not shown) provided on the surface of the vibrating body 60, and a plurality of terminals 681, 682, 683, 684, 685, and 686.

[0152] Although not shown, the electrode pattern includes drive signal electrodes and drive ground electrodes provided on the drive vibration arms 621 and 622, detection signal electrodes and detection ground electrodes provided on the detection vibration arms 631 and 632, and adjustment electrodes for adjusting the output of the detection signal electrodes provided on the adjustment vibration arms 641 and 642.

[0153] Terminal 681 (drive ground terminal) is provided on the lower surface of portion 651 of support portion 65. Terminal 682 (drive ground terminal) is provided on the lower surface of portion 651 of support portion 65. Terminal 683 (detection signal terminal) is provided on the lower surface of portion 652 of support portion 65, and terminal 684 (detection signal terminal) is provided on the lower surface of portion 653 of support portion 65. Terminal 685 (detection ground terminal) is provided on the lower surface of portion 652 of support portion 65, and terminal 686 (detection ground terminal) is provided on the lower surface of portion 653 of support portion 65.

[0154] The constituent material of the electrode portion 67 as described above is not particularly limited as long as it is conductive, and specifically, for example, the materials described for the electrode portion 37 of the vibration element 3 in the first embodiment can be used.

[0155] In such a vibration element 6, when an electric field is generated between the drive signal electrode and the drive ground electrode by inputting a drive signal to the drive signal electrode in a state where no angular velocity ω is applied to the vibration element 6, the drive vibration arms 621 and 622 perform bending vibration (drive vibration) in opposite directions to each other in the X-axis direction, as shown by arrow F in Figure 23.

[0156] When an angular velocity ω about the central axis a3 along the Y-axis direction is applied to the vibration element 6 while this drive vibration is occurring, the Coriolis force acts on the drive vibration arms 621, 622, causing the drive vibration arms 621, 622 to flexurally vibrate in opposite directions along the Z-axis. Accordingly, the detection vibration arms 631, 632 flexurally vibrate (detection vibration) in opposite directions along the Z-axis, as shown by arrow G in Figure 1. Due to this detection vibration, charges generated in the detection vibration arms 631, 632 are extracted as detection signals from the detection signal electrodes, and the angular velocity ω is determined based on this detection signal.

[0157] Here, the adjustment vibration arms 641 and 642 flexurally vibrate in opposite directions to each other in the X-axis direction in response to the drive vibration of the drive vibration arms 621 and 622, regardless of the presence or absence of detection vibration. Then, charges generated between the detection signal electrode and the detection ground electrode and the adjustment electrode in response to the flexural vibration of the adjustment vibration arms 641 and 642 are superimposed on the detection signal. This makes it possible to adjust the detection signal so that, for example, the detection signal becomes zero when no angular velocity ω is applied.

[0158] Even when such a vibration element 6 is used, since the vibration element 6 includes the relay substrate (e.g., relay substrate 5) of this application example, deformation of the package 2 is less likely to be transmitted to the vibration element 3, and therefore fluctuations in vibration characteristics can be reduced. Furthermore, when the vibration element 6 is used, although not shown, for example, the arrangement of the terminals of the relay substrate 5 can be provided at positions corresponding to the terminals 681, 682, 683, 684, 685, and 686 of the vibration element 6. In this way, for example, the vibration element 6 can be connected (mounted) to the package 2 simply by setting and changing the pattern of the wiring portion of the relay substrate 5 to match the vibration element 6. Therefore, a decrease in productivity due to changes in the pattern can be prevented. The sixth embodiment as described above can also reduce fluctuations in vibration characteristics.

[0159] Seventh Embodiment Next, a seventh embodiment will be described.

[0160] Fig. 24 is a cross-sectional view of a vibration device according to a seventh embodiment. Fig. 25 is a plan view of the vibration element shown in Fig. 24. Fig. 26 is a plan view (transparent view) of the vibration element shown in Fig. 24.

[0161] In this embodiment, the vibration device of this application example is used as an oscillator. In the following description, the seventh embodiment will be described focusing on the differences from the above-described embodiments, and a description of similar points will be omitted.

[0162] A resonator device 1G shown in FIG. 24 is an oscillator, and includes a package 2, an intermediate substrate 5, a resonator element 700, and an IC chip 4G (electronic component).

[0163] <IC chip (electronic component)> The IC chip 4G shown in FIG. 24 has an oscillation circuit for controlling the driving of the vibration element 700, and when the vibration element 700 is driven by the IC chip 4G, a signal of a predetermined frequency can be extracted.

[0164] <Vibration element> The vibrating element 700 shown in FIGS. 25 and 26 has a vibrating body 710 (piezoelectric substrate) that has a rectangular (rectangular) plate shape when viewed from above, and an electrode section 720 formed on the surface of the vibrating body 710.

[0165] (vibrator) The vibrating body 710 is a quartz crystal substrate that primarily vibrates in thickness-shear mode. In this embodiment, the vibrating body 710 is an AT-cut quartz crystal substrate. AT-cut refers to cutting out a quartz crystal substrate so that it has a main surface (main surface including the X-axis and Z'-axis) obtained by rotating a plane (Y-plane) including the X-axis and Z-axis, which are the crystal axes of the quartz crystal, about the X-axis by approximately 35 degrees 15 minutes counterclockwise from the Z-axis. Furthermore, the longitudinal direction of the vibrating body 710 coincides with the X-axis, which is the crystal axis of the quartz crystal.

[0166] The electrode section 720 has a pair of electrode pattern sections 721 and 722. The electrode pattern section 721 has an electrode 7211 (excitation electrode) formed on the upper surface of the vibrating body 710, a terminal 7212 formed on the lower surface of the vibrating body 710, and wiring 7213 that electrically connects the electrode 7211 and the terminal 7212. The electrode pattern section 722 has an electrode 7221 (excitation electrode) formed on the lower surface of the vibrating body 710, a terminal 7222 formed on the upper surface of the vibrating body 710, and wiring 7223 that electrically connects the electrode 7221 and the terminal 7222. The electrodes 7211 and 7221 have substantially the same shape and overlap each other across the vibrating body 710 when viewed in the thickness direction of the vibrating body 710.

[0167] In such a vibrating element 700, when an alternating voltage is applied between the electrodes 7211 and 7221, the vibrating body 710 vibrates in the Y-axis direction at a predetermined frequency.

[0168] Even in such a resonator device 1G, by including the relay substrate (for example, the relay substrate 5) of this application example, the deformation of the package 2 is not easily transmitted to the resonator element 700, and the holding state of the resonator element 700 does not change, so that fluctuations in the vibration characteristics can be reduced. Therefore, since the oscillation frequency does not fluctuate, a highly accurate oscillation frequency with a good C / N ratio can be provided.

[0169] Furthermore, when using the vibration element 700, although not shown, for example, the arrangement of terminals provided on the relay substrate 5 may be provided at positions corresponding to the terminals 7212 and 7222 of the vibration element 700. In this way, for example, the vibration element 700 can be connected (mounted) to the package 2 simply by setting and changing the pattern of the wiring portion 57 of the relay substrate 5 to match the vibration element 700.

[0170] (Another example of a vibration element) FIG. 27 is a diagram showing another example of the vibration element shown in FIG.

[0171] 27, the vibration element 70 has a vibration body 730 and an electrode portion 740 arranged on the vibration body 730. Such a vibration element 70 is suitable when the vibration device 1G, which is an oscillator, is an oven-controlled crystal oscillator (OCXO) equipped with a temperature control element (not shown) that controls the temperature of the vibration element 70.

[0172] The vibrating body 730 is an SC-cut quartz crystal substrate that has been etched, machined, or otherwise processed into a substantially circular shape in plan view. By using the vibrating body 730, which is an SC-cut quartz crystal substrate that has been processed into a circular shape, it is possible to obtain a vibrating element 70 that is particularly small in frequency jumps and resistance increases due to spurious vibrations and has particularly stable temperature characteristics. Note that the planar shape of the vibrating body 730 is not limited to a circle, and may be a nonlinear shape such as an ellipse or oval, or a linear shape such as a triangle or rectangle.

[0173] The electrode section 740 has a pair of electrode pattern sections 741 and 742. The electrode pattern section 741 has an electrode 7411 (excitation electrode) formed on the upper surface of the vibrating body 730, a terminal 7412 formed on the upper surface of the vibrating body 730, and wiring 7413 that electrically connects the electrode 7411 and the terminal 7412. The electrode pattern section 742 has an electrode 7421 (excitation electrode) formed on the lower surface of the vibrating body 730, a terminal 7422 formed on the lower surface of the vibrating body 730, and wiring 7423 that electrically connects the electrode 7421 and the terminal 7422. The electrodes 7411 and 7421 have substantially the same shape and overlap each other across the vibrating body 730 when viewed in the thickness direction of the vibrating body 730.

[0174] Even in the resonator device 1G including such a resonator element 70, by including the relay substrate (for example, the relay substrate 5) of this application example, the deformation of the package 2 is not easily transmitted to the resonator element 70, and the holding state of the resonator element 70 does not change, so that it is possible to reduce fluctuations in vibration characteristics. Therefore, since the oscillation frequency does not fluctuate, it is possible to provide a highly accurate oscillation frequency with a good C / N ratio.

[0175] Furthermore, when using the vibration element 70, although not shown, for example, the arrangement of terminals provided on the relay substrate 5 may be provided at positions corresponding to the terminals 7412 and 7422 of the vibration element 70. In this way, for example, the vibration element 3 can be connected (mounted) to the package 2 simply by setting and changing the pattern of the wiring portion of the relay substrate 5 to match the vibration element 70.

[0176] The resonator device 1G can also be applied to, for example, a temperature compensated crystal oscillator (TCXO). The resonator element included in the resonator device 1G is not limited to the resonator element 700 using an AT-cut quartz substrate or the resonator element 70 using an SC-cut quartz substrate, but may be, for example, a resonator element using a BT-cut quartz diaphragm. The seventh embodiment as described above can also reduce fluctuations in vibration characteristics.

[0177] Eighth Embodiment Next, an eighth embodiment will be described. FIG. 28 is a plan view of a vibration element included in a vibration device according to the eighth embodiment.

[0178] This embodiment is the same as the above-described embodiments except for the configuration of the relay board. In the following description, the eighth embodiment will be described focusing on the differences from the above-described embodiments, and a description of the same points will be omitted.

[0179] The vibration element 7 (vibration piece) shown in FIG. 28 has a vibrating body 750 and an electrode section 760 formed on the surface of the vibrating body 750.

[0180] (vibrator) The vibrating body 750 is made of a Z-cut quartz crystal plate and has a base 751 and a pair of vibrating arms 752 and 753 extending from the base 751.

[0181] The base 751 includes a first base 7511 from which the vibrating arms 752 and 753 extend, a second base 7513 provided on the opposite side of the first base 7511 from the vibrating arms 752 and 753, and a connecting portion 7512 connecting the first base 7511 and the second base 7513. The connecting portion 7512 is located between the first base 7511 and the second base 7513 and has a smaller width (length in the X-axis direction) than the first base 7511. This makes it possible to reduce vibration leakage while reducing the length of the base 751 along the Y-axis direction. The vibrating arms 752 and 753 are aligned in the X-axis direction and extend from the base 751 in the -Y-axis direction so as to be parallel to each other.

[0182] In the drawing, the width (length in the X-axis direction) of the tip end of the vibrating arms 752, 753 is wider than the base end, but this is not limited to this. In addition, the vibrating arms 752, 753 have a pair of bottomed grooves formed on their upper and lower surfaces that are open and extend in the Y-axis direction, but these grooves do not necessarily have to be formed.

[0183] (electrode part) The electrode section 760 has an electrode pattern (not shown) provided on the surface of the vibrating body 750 and a plurality of terminals 761 and 762.

[0184] Although not shown, the electrode pattern has first and second drive electrodes provided on the vibrating arms 752 and 753. In addition, terminals 761 and 762 are provided on the lower surface of the second base portion 7513.

[0185] In such a vibration element 7, when an alternating voltage is applied between the first drive electrode and the second drive electrode, the vibrating arms 752, 753 vibrate at a predetermined frequency in an in-plane direction (XY plane direction) so as to repeatedly approach and move away from each other. The eighth embodiment as described above can also reduce fluctuations in vibration characteristics.

[0186] Ninth Embodiment Next, a ninth embodiment will be described. FIG. 29 is a plan view of a vibration device according to the ninth embodiment.

[0187] This embodiment is similar to the above-described embodiments except that it has a plurality of vibration elements. In the following description, the ninth embodiment will be described mainly focusing on the differences from the above-described embodiments, and a description of the same points will be omitted.

[0188] A vibration device 1H shown in FIG. 29 is a three-axis angular velocity sensor, and can independently detect an angular velocity ωx around the X axis, an angular velocity ωy around the Y axis, and an angular velocity ωz around the Z axis.

[0189] The resonator device 1H includes three resonator elements 3a, 6a, and 6b, and an interconnection substrate 5H on which the resonator elements 3a, 6a, and 6b are mounted together. In this embodiment, the interconnection substrate 5H is mounted on an IC chip 4.

[0190] Vibration element 3a has the same configuration as vibration element 3 in the first embodiment described above, and detects angular velocity ωz. Meanwhile, vibration elements 6a and 6b each have the same configuration as vibration element 6 in the sixth embodiment described above. However, vibration elements 6a and 6b are arranged differently so as to detect angular velocities around the X-axis and Y-axis, respectively, with vibration element 6a detecting angular velocity ωy and vibration element 6b detecting angular velocity ωx.

[0191] These three vibration elements 3a, 6a, and 6b are mounted together on a mounting portion 51 of one relay substrate 5H (the vibration element of this application example). Therefore, although not shown, the relay substrate 5H has a plurality of terminals corresponding to the plurality of terminals of the three vibration elements 3a, 6a, and 6b.

[0192] As in the resonator device 1H, by arranging the three resonator elements 3a, 6a, and 6b together on one relay substrate 5H, it is possible to reduce the size of the resonator device 1H.

[0193] (Variation) FIG. 30 shows another example of the relay board shown in FIG.

[0194] 30, in the resonator device 1Ha, relay substrates 5Ha, 5Hb, and 5Hc are provided for each of the resonator elements 3a, 6a, and 6b. That is, the resonator element 3a is mounted on the relay substrate 5Ha, the resonator element 6a is mounted on the relay substrate 5Hb, and the resonator element 6b is mounted on the relay substrate 5Hc. In this case, in each of the relay substrates 5Ha, 5Hb, and 5Hc, the wiring (not shown) extending from the mounting portion 51 to the IC chip 4 is divided for each of the resonator elements 3a, 6a, and 6b. This increases the design freedom of the wiring portion (not shown) of each of the relay substrates 5Ha, 5Hb, and 5Hc compared to the resonator device 1H shown in FIG. 29, in which wiring (not shown) for multiple resonator elements 3a, 6a, and 6b is extended from a single relay substrate 5H. The ninth embodiment as described above can also reduce fluctuations in vibration characteristics.

[0195] Tenth Embodiment Next, a tenth embodiment will be described. FIG. 31 is a cross-sectional view showing a vibration device according to a tenth embodiment.

[0196] This embodiment is similar to the above-described embodiment except that it includes two relay boards. In the following description, the tenth embodiment will be described focusing on the differences from the above-described embodiments, and a description of similar points will be omitted.

[0197] As shown in FIG. 31, the resonation device 1I has a substrate 17 (intermediate substrate) provided above the resonator element 3. The substrate 17 is located between the lid 22 and the resonator element 3 and is spaced apart from the lid 22 and the resonator element 3. The substrate 17 has a rectangular shape in a plan view and overlaps the resonator element 3 so as to encompass the resonator element 3. In this embodiment, the substrate 17 is connected to fixing portions 52a and 52b of the intermediate substrate 5 via connecting members 170 formed of, for example, an adhesive or the like.

[0198] The constituent material of the substrate 17 is not particularly limited, but it is preferable to use an insulating material such as quartz, silicon, or ceramics. In particular, it is preferable to use the same material as the constituent material of the vibrating body 30 and the main body 50 of the relay substrate 5 as the constituent material of the substrate 17. This makes it possible to reduce the thermal expansion difference between the substrate 17, the vibrating element 3, and the relay substrate 5, and to reduce the thermal stress associated with the thermal expansion difference among them. In this embodiment, as described above, the vibrating body 30 and the main body 50 are made of quartz. Therefore, it is preferable to use quartz as the constituent material of the substrate 17.

[0199] Providing such a substrate 17 can reduce the risk that, for example, an external force applied to the package 2 will cause the lid 22 to deform, changing the parasitic capacitance between the vibration element 3 and the lid 22 and thereby affecting the characteristics of the vibration element 3. Note that, with such a substrate 17, the parasitic capacitance (distribution of electric force lines) around the vibration element 3 does not change.

[0200] Furthermore, it is preferable that the substrate 17 has the same configuration as the relay substrate 5. That is, it is preferable that the substrate 17 has a portion 171 corresponding to the mounting portion 51, two portions 172a and 172b corresponding to the fixing portions 52a and 52b, and portions 173a and 173b corresponding to the beam portions 53a and 53b. This reduces the displacement between the mounting portion 51 of the relay substrate 5 and the portion 171 of the substrate 17, thereby further reducing changes in the vibration characteristics of the vibration element 3. Therefore, the vibration device 1I can realize an angular velocity sensor that is more robust against external forces.

[0201] In this embodiment, the substrate 17 does not include an electrode portion, unlike the relay substrate 5, but the electrode portion may be formed on the surface of the substrate 17. In this way, the vibrating element 3 may be excited by an electric field generated between the electrode portion 37 of the relay substrate 5 and the electrode portion (not shown) of the substrate 17.

[0202] Furthermore, the substrate 17 may be a flat member that does not have holes, grooves, etc. In the drawing, the substrate 17 is connected to the fixing portions 52a and 52b of the relay substrate 5, but the substrate 17 may be connected to the mounting portion 51 of the relay substrate 5. In this case, even if the substrate 17 is a flat member that does not have holes, grooves, etc., the displacement between the mounting portion 51 of the relay substrate 5 and the substrate 17 can be reduced, and therefore, the change in the vibration characteristics of the vibration element 3 can be more effectively reduced. The tenth embodiment as described above can also reduce fluctuations in vibration characteristics.

[0203] 2.Module equipped with a vibration device Next, a module including the vibration device of this application example will be described.

[0204] FIG. 32 is a cross-sectional view showing a module including a vibration device. 32, the module 10 includes a resonator device (e.g., the resonator device 1) of this application example and a mounting substrate 15 on which the resonator device 1 is mounted. The resonator device 1 is mounted on the mounting substrate 15 by connecting an external connection terminal 27 provided on the lower surface (rear surface) of the resonator device 1 to a terminal 157 provided on the mounting substrate 15 via, for example, a conductive adhesive. The mounting substrate 15 is not particularly limited, and may be, for example, a printed wiring board on which a circuit is formed.

[0205] In this embodiment, the mounting substrate 15 has the same configuration as the relay substrate 5. That is, the mounting substrate 15 has a portion 151 corresponding to the mounting portion 51, two portions 152a and 152b corresponding to the fixing portions 52a and 52b, and portions 153a and 153b corresponding to the beam portions 53a and 53b. The vibration device 1 is mounted on the portion 151 of the mounting substrate 15. This reduces the displacement of the portion 151 of the mounting substrate 15 due to an external force (including thermal stress), thereby more effectively reducing the effect of the external force on the vibration device 1, thereby realizing a module 10 equipped with a robust angular velocity sensor.

[0206] 3.Electronic equipment Next, an electronic device including the vibration device of this application example will be described.

[0207] FIG. 33 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic device of this application example is applied.

[0208] In this figure, a personal computer 1100 is configured with a main body 1104 having a keyboard 1102 and a display unit 1106 having a display unit 1008, and the display unit 1106 is rotatably supported on the main body 1104 via a hinge structure. Such a personal computer 1100 has a built-in vibration device of this application example (for example, vibration device 1).

[0209] FIG. 34 is a perspective view showing the configuration of a mobile phone (including PHS) to which the electronic device of this application example is applied.

[0210] In this figure, a mobile phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a mobile phone 1200 has a built-in vibration device (for example, vibration device 1) of this application example.

[0211] FIG. 35 is a perspective view showing the configuration of a digital still camera to which the electronic device of this application example is applied.

[0212] A display unit 2000 is provided on the back of a case (body) 1302 of the digital still camera 1300, and is configured to display an image based on an image signal captured by a CCD. The display unit 2000 functions as a finder that displays an image of a subject as an electronic image. A light receiving unit 1304 including an optical lens (image capturing optical system) and a CCD is provided on the front side (back side in the figure) of the case 1302. When the photographer checks the image of the subject displayed on the display unit 2000 and presses the shutter button 1306, the image signal captured by the CCD at that time is transferred to and stored in a memory 1308. The digital still camera 1300 has a built-in vibration device (e.g., vibration device 1) of this application example.

[0213] Such electronic devices include the vibration device of this application example (for example, the vibration device 1), and therefore can achieve the effects of the vibration device of this application example described above, and can exhibit excellent characteristics.

[0214] In addition to the personal computer of FIG. 33, the mobile phone of FIG. 34, and the digital still camera of FIG. 35, the electronic device of this application example can be applied to, for example, smartphones, tablet terminals, watches (including smart watches), inkjet discharge devices (e.g., inkjet printers), laptop personal computers, televisions, wearable terminals such as HMDs (head-mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic organizers (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, security television monitors, electronic binoculars, POS terminals, medical equipment (e.g., electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasound diagnostic devices, electronic endoscopes), fish finders, various measuring devices, equipment for mobile terminal base stations, instruments (e.g., instruments for vehicles, aircraft, and ships), flight simulators, network servers, etc.

[0215] 4. Mobile Next, a moving object equipped with the vibration device of this application example will be described.

[0216] FIG. 36 is a perspective view showing an automobile to which the moving body of this application example is applied. In this figure, an automobile 1500 has a body 1501 and four wheels 1503, and is configured so that the wheels 1503 are rotated by a power source (engine) (not shown) provided on the body 1501.

[0217] Such an automobile 1500 is equipped with a vibration device (for example, vibration device 1) of this application example. The vibration device (for example, vibration device 1) of this application example can detect the attitude and movement direction of a vehicle body 1501. A detection signal from the vibration device (for example, vibration device 1) of this application example is supplied to a vehicle body attitude control device 1502, which can detect the attitude of the vehicle body 1501 based on the signal, and can control the hardness or softness of the suspension or the brakes of individual wheels 1503 according to the detection result.

[0218] In addition, the moving body equipped with the vibration device of this application example (e.g., vibration device 1) is not limited to automobiles, but can also be applied to other vehicles such as motorcycles, trains, airplanes, ships, spacecraft, bipedal robots, radio-controlled helicopters, etc.

[0219] An automobile 1500, which is an example of such a moving body, has a vibration device of this application example (for example, the vibration device 1), and therefore can achieve the effects of the vibration device of this application example described above, and can exhibit excellent characteristics.

[0220] The vibration device, angular velocity sensor, electronic device, and moving body of the present invention have been described above based on the embodiments shown in the accompanying drawings, but the present invention is not limited to these, and the configuration of each part can be replaced with any configuration having a similar function. Furthermore, any other components may be added to the present invention. Furthermore, each embodiment may be combined as appropriate. [Explanation of symbols]

[0221] 1...vibration device, 1A...vibration device, 1B...vibration device, 1G...vibration device, 1H...vibration device, 1Ha...vibration device, 1I...vibration device, 2...package, 3...vibration element, 3a...vibration element, 4...IC chip, 4G...IC chip, 5...relay board, 5C...relay board, 5D...relay board, 5E...relay board, 5F...relay board, 5Fa...relay board, 5H...relay board, 5Ha...relay board, 5Hb...relay board, 5Hc...relay board, 6...vibration element, 6a...vibration element, 6b...vibration element, 7...vibration element, 8...stress relaxation layer, 10...module, 11...adhesive, 15 ...mounting board, 17...substrate, 21...base member, 22...lid, 23...bonding member, 25...terminal, 27...external connection terminal, 30...vibrating body, 37...electrode portion, 41...terminal, 42...terminal, 43...passivation film, 50...main body portion, 50C...main body portion, 50D...main body portion, 50Da...main body portion, 50Db...main body portion, 50E...main body portion, 50F...main body portion, 50Fa...main body portion, 51...mounting portion, 52a...fixing portion, 52b...fixing portion, 53a...beam portion, 53b...beam portion, 54...second frame body, 55a...beam portion, 55b...beam portion, 55c...beam portion, 55d...beam portion, 56a...beam portion, 56b...beam portion, 57...wiring portion, 57C...wiring portion, 57D...wiring portion, 60...vibrating body, 61...base portion, 65...support portion, 67...electrode portion, 70...vibrating element, 81...first insulating layer, 82...first wiring layer, 83...second insulating layer, 84...second wiring layer, 151...portion, 152a...portion, 152b...portion, 153a...portion, 153b...portion, 157...terminal, 170...connecting member, 171...portion, 172a...portion, 172b...portion, 173a...portion, 173b...portion, 211...recess, 241...lower surface, 242...middle surface, 243...upper surface, 261...terminal, 262...terminal, 263...terminal, 264...terminal, 265...terminal, 266...terminal, 311...base, 312...detection vibration arm, 313...detection vibration arm, 314...connecting arm, 315...connecting arm, 316...drive vibration arm, 317...drive vibration arm, 318...drive vibration arm, 319...drive vibration arm, 321...support part, 322...support part, 323...beam part, 324...beam part, 325...beam part, 326...beam part, 381...terminal, 382...terminal, 383...terminal, 384...terminal, 385...terminal, 386...terminal, 530...first frame body, 531...first part, 532...second part, 541...frame body part, 542...part, 551...first part, 552...second part, 561...terminal, 562...terminal,563...terminal, 564...terminal, 565...terminal, 566...terminal, 570a...beam portion, 570b...beam portion, 571...wiring, 571C...wiring, 571D...wiring, 571a...beam portion, 571b...beam portion, 572...wiring, 572C...wiring, 572D...wiring, 572a...beam portion, 572b...beam portion, 573...wiring, 573C...wiring, 573D...wiring, 574...wiring, 574C...wiring, 574D...wiring, 575...wiring, 575C...wiring, 575D...wiring, 581...terminal, 581a...portion, 582a...portion, 581b...portion, 582b...portion, 582...terminal, 583...terminal, 584...end terminal, 585...terminal, 586...terminal, 621...drive vibration arm, 622...drive vibration arm, 631...detection vibration arm, 632...detection vibration arm, 641...adjustment vibration arm, 642...adjustment vibration arm, 651...portion, 652...portion, 653...portion, 661...connection portion, 662...connection portion, 663...connection portion, 664...connection portion, 681...terminal, 682...terminal, 683...terminal, 684...terminal, 685...terminal, 686...terminal, 700...vibration element, 710...vibration body, 720...electrode portion, 721...electrode pattern portion, 722...electrode pattern portion, 730...vibration body, 740...electrode portion, 741...electrode pattern portion, 74 2...electrode pattern portion, 750...vibrating body, 751...base portion, 752...vibrating arm, 753...vibrating arm, 760...electrode portion, 761...terminal, 762...terminal, 841...terminal, 842...shielded wiring, 1008...display portion, 1100...personal computer, 1102...keyboard, 1104...main body portion, 1106...display unit, 1200...mobile phone, 1202...operation buttons, 1204...earpiece, 1206...mouthpiece, 1208...display portion, 1300...digital still camera, 1302...case, 1304...light receiving unit, 1306...shutter button, 1308...memory , 1310...display unit, 1500...automobile, 1501...vehicle body, 1502...vehicle body attitude control device, 1503...wheel, 2000...display unit, 5411...part, 5412...part, 5610...first part, 5620...second part, 7211...electrode, 7212...terminal, 7213...wiring, 7221...electrode, 7222...terminal, 7223...wiring, 7411...electrode, 7412...terminal, 7413...wiring, 7421...electrode, 7422...terminal, 7423...wiring, 7511...first base, 7512...connecting part, 7513...second base, B1...conductive wire, C...arrow, D...arrow, E...arrow, F...arrow,a…central axis, a1…line division, a2…line division, a3…central axis, ω…angular velocity,

Claims

1. a vibration element having a plurality of terminals; a base having a plurality of electrical connection terminals; a relay substrate that has a wiring portion that electrically connects a plurality of the electrical connection terminals to a plurality of the terminals and supports the vibration element relative to the base, the relay substrate has a base fixing portion fixed to the base, a vibration element mounting portion on which the vibration element is mounted, and at least one beam portion connecting the base fixing portion and the vibration element mounting portion, A vibration device characterized in that the at least one beam portion has a first portion extending in a first direction and a second portion extending in a second direction intersecting the first direction.

2. The vibration device according to claim 1 , wherein the intermediate substrate includes an insulating material.

3. The vibration device according to claim 1 , wherein the substrate is an electronic component including a circuit for driving the vibration element.

4. the substrate includes an electronic component including a circuit for driving the vibration element; The vibration device according to claim 1 or 2, further comprising a stress relaxation portion provided between the electronic component and the relay substrate and having a wiring layer that electrically connects the electronic component and the wiring portion.

5. The resonator device according to claim 1 , wherein the relay substrate, in plan view, comprises the base fixing portion and the beam portion forming a first frame surrounding the resonator element mounting portion.

6. The resonator device according to claim 5 , wherein the relay substrate has a second frame positioned between the first frame and the resonator element mounting portion in a plan view.

7. the relay substrate has a plurality of the first portions and a plurality of the second portions, The vibration device according to claim 1 , wherein the first portions and the second portions are alternately connected to each other.

8. The resonator device according to claim 1 , wherein the wiring portion includes a shield wiring electrically connected to a constant potential.

9. An angular velocity sensor comprising the vibration device according to any one of claims 1 to 8.

10. An electronic device comprising the vibration device according to claim 1 .

11. A moving object comprising the vibration device according to any one of claims 1 to 8.

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