Machining apparatus

Abstract

To provide a machining device capable of preventing accumulation of machining chips in a case and contributing to water saving.SOLUTION: The processing apparatus 1 includes a holding table 30 for holding a package substrate W, a spindle 41, a processing unit 40 having a cutting blade 42 fixed to the tip of the spindle 41 for processing the package substrate W held by the holding table 30, a processing water supply unit 6 for supplying processing water to the package substrate W and the cutting blade 42, a water case 6 for receiving the processing water supplied from the processing water supply unit 6, a waste liquid supply unit 7 for supplying at least a part of the waste liquid received by the water case 6 to the water case 6.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] Cutting machines are known as machines that divide multiple devices formed on the surface of a workpiece, such as a silicon wafer, into individual device chips. The devices formed on the surface of the workpiece include, for example, devices such as integrated circuits (ICs) and large scale integrations (LSIs), as well as packaged devices such as chip size packages (CSPs) and quad flat non-leaded packages (QFNs), and are used in various electrical equipment. For example, Patent Document 1 describes a dicer that has a cutting blade and divides multiple semiconductor chips, such as ICs, formed on a semiconductor wafer into individual chips.

[0003] Furthermore, as described in Patent Documents 2 and 3, the cutting device is provided with a cutting water supply nozzle that supplies cutting water, a water case that receives the cutting water and cutting chips, and a discharge section that discharges the cutting water and cutting chips from the water case to the outside, and cuts the workpiece while supplying cutting water.

[0004] Cutting chips may accumulate on the bottom or inner wall of the water case. Because the accumulated cutting chips may scatter and adhere to the workpiece, the accumulated cutting chips in the water case are periodically manually removed to clean the water case. In addition, Patent Documents 2 and 3 disclose a method in which a nozzle for spraying liquid is provided in the water case to flush the accumulated cutting chips into a discharge section. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 9-139362 [Patent Document 2] Japanese Patent Application Laid-Open No. 2002-103177 [Patent Document 3] Japanese Patent Application Laid-Open No. 2006-218551 Summary of the Invention [Problem to be solved by the invention]

[0006] In Patent Documents 2 and 3, washing water for washing the water case is required in addition to the cutting water, which increases the amount of liquid used during operation of the cutting device.

[0007] The present invention provides a processing device that can prevent processing waste from accumulating inside the case and can save water. [Means for solving the problem]

[0008] The processing device of the present invention comprises: a holding table for holding the workpiece; a machining unit having a spindle and a machining tool fixed to the tip of the spindle and for machining the workpiece held on the holding table; a processing water supply unit that supplies processing water to the workpiece and the processing tool; a case for receiving the processing water supplied from the processing water supply unit; a storage tank that stores the processing water received by the case as waste liquid; The apparatus further includes a waste liquid supply unit having a flow path that communicates with the storage tank and the case, and that is capable of supplying at least a portion of the waste liquid stored in the storage tank to the case. [Effects of the Invention]

[0009] According to the present invention, the waste liquid received by the case and stored in the storage tank is utilized to clean the inside of the case, thereby preventing the accumulation of processing debris inside the case and saving water. [Brief explanation of the drawings]

[0010] [Figure 1]1 is a schematic perspective view of a processing device 1 according to an embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged perspective view of the holding table 30 and the processing unit 40. [Figure 3] 1 is a perspective view showing the schematic configuration of a water case 60, a storage tank 68, and a waste liquid supply unit 70. FIG. [Figure 4] 1 is a schematic cross-sectional view of a downstream case 62 of a water case 60 and a storage tank 68. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of the processing apparatus of the present invention will be described below with reference to the accompanying drawings. In the following description, the arrow directions shown in the drawings will be referred to as the X-axis, Y-axis, and Z-axis directions, respectively.

[0012] [Overall overview of the processing equipment] 1 is a schematic perspective view of a processing apparatus 1. The processing apparatus 1 includes a base 2 that supports components described below, and performs a predetermined processing process on a workpiece. In this embodiment, the processing apparatus 1 performs cutting processing on, for example, a package substrate W (an example of a workpiece) on which a plurality of devices D are formed, and separates the package substrate W into individual device chips.

[0013] The package substrate W is, for example, a CSP substrate or a QFN substrate, and is a rectangular plate-like object. The package substrate W is divided into multiple regions by division lines arranged in a grid pattern on its surface, and a device D is formed in each region.

[0014] The processing apparatus 1 includes a mounting table 5 on which a storage container 100 (sometimes referred to as a cassette) for storing a package substrate W is placed, a first transport unit 10 that transports the package substrate W from the mounting table 5 to a predetermined position A, a second transport unit 20 that transports the package substrate W from the predetermined position A, a holding table 30 on which the package substrate W transported from the predetermined position A by the second transport unit 20 is placed and which holds the package substrate W, a processing unit 40 that processes the package substrate W held by the holding table 30, a processing water supply unit 46 that can supply processing water to the package substrate W, a third transport unit 80 that transports the package substrate W processed by the processing unit 40, a cleaning unit 86 that cleans the processed package substrate W, and a drying unit 87 that dries the cleaned package substrate W. These units and the mounting table 5 that are components of the processing apparatus 1 are supported by a base 2.

[0015] One storage container 100 is placed on the mounting table 5. The storage container 100 has multiple shelves arranged at predetermined intervals in the vertical direction, and multiple package substrates W can be stored horizontally on the shelves. The mounting table 5 is arranged to be movable in the Z-axis direction (i.e., the vertical direction), and can adjust the height position of the package substrate W taken out of the storage container 100 to the height position of the mounting surface for the package substrate W in the first transport unit 10.

[0016] The first transport unit 10 is provided adjacent to the mounting table 5 and includes a conveyor 11 on which a package substrate W taken out of the container 100 in the +Y direction is placed and which transports the package substrate W to a predetermined position A. The conveyor 11 is, for example, a belt conveyor including an endless belt and a motor for driving the belt. Here, the predetermined position A is a downstream area on the conveyor 11, and is an area where the second transport unit 20 can hold the package substrate W.

[0017] The second transport unit 20 transports the package substrate W placed at a predetermined position A to the holding table 30. The second transport unit 20 has a suction pad 21 that suction-holds the upper surface of the package substrate W, a lifting mechanism 22 that supports the suction pad 21 and raises and lowers it up and down, an operating arm 23 that supports the lifting mechanism 22, and a moving mechanism (not shown) that moves the operating arm 23 along the Y-axis direction. The lifting mechanism 22 may be formed, for example, by an air cylinder or by a motor and a ball screw.

[0018] Two holding tables 30 are provided side by side along the Y-axis direction. Each holding table 30 has a circular holding surface, and suction holes (not shown) are exposed on this holding surface. A suction path is formed inside the holding table 30, which communicates with the suction holes and is connected to a suction source such as a vacuum pump. The holding table 30 having this configuration suction-holds the package substrate W transported by the second transport unit 20.

[0019] Further, around each holding table 30, a tray 65 is provided for receiving processing water supplied during processing and processing waste.

[0020] 2 is an enlarged perspective view of the holding table 30 and the processing unit 40. Note that the tray 65 is not shown.

[0021] The holding table 30 is provided so as to be movable along the X-axis direction (processing feed direction) by an X-axis direction moving means 35 provided below the holding table 30. The holding table 30 is also provided so as to be rotatable within a predetermined angle (for example, 90°) around a central axis extending in the Z-axis direction by a rotation drive mechanism (not shown).

[0022] The processing unit 40 cuts the package substrate W held on the holding table 30 along the planned division line. The processing unit 40 has a spindle 41 arranged along the Y-axis direction (indexing feed direction) and a disk-shaped cutting blade 42 attached to the tip of the spindle 41. The spindle 41 and the cutting blade 42 are provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis direction moving means 36 and a Z-axis direction moving means 37. The spindle 41 and the cutting blade 42 are rotated at a predetermined speed by, for example, a servo motor.

[0023] The processing water supply units 46 are provided on both sides of the cutting blade 42 in the X-axis direction and have spray nozzles 47 that can supply processing water. The processing water supplied from the spray nozzles 47 is supplied to the cutting area between the cutting blade 42 and the package substrate W. The processing water cools the cutting area and can wash away processing waste generated during cutting.

[0024] 1, the third transport unit 80 transports the individual devices D separated by the processing unit 40 to the cleaning unit 86. Similar to the second transport unit 20, the third transport unit 80 has a suction pad 81 that suction-holds the devices D, a lifting mechanism 82 that supports the suction pad 81 and raises and lowers it, an operating arm 83 that supports the lifting mechanism 82, and a moving mechanism (not shown) that moves the operating arm 83 along the Y-axis direction.

[0025] The cleaning unit 86 physically or chemically cleans the processed package substrate W. The cleaning unit 86 includes, for example, a mechanism for supplying a cleaning liquid and a cleaning tool such as a sponge that comes into contact with the device D to clean it.

[0026] The drying unit 87 dries the device D cleaned by the cleaning unit 86. The drying unit 87 includes, for example, a heater.

[0027] [Waste liquid supply unit] 3 and 4, the processing apparatus 1 further includes a water case 60 that receives the processing water supplied from the processing water supply unit 46, a storage tank 68 that stores the processing water received by the water case 60 as waste liquid, and a waste liquid supply unit 70 that can supply at least a portion of the waste liquid stored in the storage tank 68 to the water case 60. The dashed arrows in Fig. 4 indicate the flow of the waste liquid supplied from the waste liquid supply unit 70 to the water case 60. In the following description, upstream and downstream are based on the flow direction of the processing water supplied from the processing water supply unit 46.

[0028] The water case 60 has an upstream case 61 that is provided on the upstream side and covers the two holding tables 30 from below, and a downstream case 62 that is provided on the downstream side and guides the waste liquid to the storage tank 68. The upstream case 61 has a tray shape that is open at the top and covers the holding tables 30 and the X-axis direction moving means 35 (see FIG. 2) from below. Both the upstream case 61 and the downstream case 62 have inclined surfaces that slope downward toward the downstream side and guide the waste liquid toward the storage tank 68.

[0029] The water case 60 further includes a bellows cover 63 and a plate-shaped cover 64 that cover the X-axis direction moving means 35 from above, and a tray 65 attached to the periphery of the holding table 30. The holding table 30, the bellows cover 63, the plate-shaped cover 64, and the tray 65 are provided inside the upstream case 61. The bellows cover 63 is provided on the +X side of the holding table 30, and its length changes as the holding table 30 moves in the X-axis direction. The plate-shaped cover 64 is provided on the -X side of the holding table 30, and has a slope that slopes downward toward the downstream case 62. The tray 65 is connected to the plate-shaped cover 64. The outer edge of the tray 65 is surrounded by an outer peripheral wall, and the outer peripheral wall has an opening at the connection portion with the plate-shaped cover 64. Therefore, processing water and relatively large processing chips flow from the tray 65 to the plate-shaped cover 64 and are guided to the downstream case 62. Furthermore, the processing water and relatively small processing debris scattered from the tray 65 are guided from the upstream case 61 to the downstream case 62 .

[0030] The downstream case 62 extends in the Y-axis direction and guides waste liquid and processing debris flowing from the upstream case 61 and the plate-like cover 64 to a storage tank 68.

[0031] The storage tank 68 is a container configured to be able to receive the waste liquid and processing debris, and is, for example, a container with an open top, provided at the lower end of the downstream case 62. The storage tank 68 is provided with a filter 69 that catches the processing debris. Therefore, the processing debris mixed in the waste liquid is collected in the filter 69, and the waste liquid is stored in the storage tank 68.

[0032] The waste liquid supply unit 70 has a flow path 71 communicating with the storage tank 68 and the water case 60, and a pump 72 provided in the flow path 71. The waste liquid supply unit 70 supplies at least a portion of the waste liquid stored in the storage tank 68 to the water case 60 via the flow path 71. The flow path 71 and pump 72 of the waste liquid supply unit 70 are provided, for example, in the internal space of the base 2, but may also be provided outside the base 2. By providing the waste liquid supply unit 70, the waste liquid can be used to clean the inside of the water case 60, preventing the accumulation of processing debris in the water case 60. Furthermore, compared to cleaning the water case 60 by separately supplying cleaning water to the water case 60 without using the waste liquid, water can be saved, thereby reducing the operating costs of the processing apparatus 1. Note that a portion of the waste liquid stored in the storage tank 68 may be discharged to the outside of the processing apparatus 1 through a discharge section (not shown).

[0033] The waste liquid supply unit 70 has multiple supply units that supply waste liquid to multiple locations within the water case 60. Specifically, the flow path 71 communicates with the storage tank 68, the upstream case 61, and the downstream case 62, and the waste liquid supply unit 70 has an upstream supply unit 73 provided in the upstream case 61 that supplies at least a portion of the waste liquid to the upstream case 61, and a downstream supply unit 74 provided in the downstream case 62 that supplies at least a portion of the waste liquid to the downstream case 62. With this configuration, waste liquid is supplied to multiple locations from the upstream side to the downstream side of the water case 60, thereby improving the cleaning performance of the water case 60 and conserving water.

[0034] The upstream supply unit 73 is configured, for example, with a spray nozzle that sprays waste liquid to supply it to the upstream case 61, and intermittently sprays the waste liquid. This allows for good cleaning of the water case 60. In this embodiment, the upstream supply unit 73 is provided to supply waste liquid to a tray 65 provided in the upstream case 61, but it may also be provided in the bellows cover 63 or the plate-shaped cover 64, or may be provided elsewhere in the upstream case 61.

[0035] The downstream supply unit 74 is formed, for example, in a cylindrical shape extending in the X-axis direction, and supplies waste liquid by a water curtain to the downstream case 62. The downstream supply unit 74 is configured to be swingable around the central axis of the cylindrical shape by a motor or the like (not shown).

[0036] Although one embodiment of the present invention has been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such an embodiment. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above embodiment may be combined in any manner as long as they do not deviate from the spirit of the invention.

[0037] For example, the storage tank 68 may be provided integrally with the downstream case 62 .

[0038] This specification describes at least the following: In parentheses, components corresponding to those in the above-described embodiments are shown as examples, but the present invention is not limited to these.

[0039] (1) A holding table (holding table 30) for holding a workpiece (package substrate W), a processing unit (processing unit 40) having a spindle (spindle 41) and a processing tool (cutting blade 42) fixed to the tip of the spindle and used to process the workpiece held on the holding table; a processing water supply unit (processing water supply unit 46) that supplies processing water to the workpiece and the processing tool; a case (water case 60) for receiving the processing water supplied from the processing water supply unit; a storage tank (storage tank 68) that stores the processing water received by the case as waste liquid; a waste liquid supply unit (waste liquid supply unit 70) having a flow path (flow path 71) communicating with the storage tank and the case, and capable of supplying at least a portion of the waste liquid stored in the storage tank to the case; Processing equipment (processing equipment 1).

[0040] According to (1), the waste liquid that is received by the case and stored in the storage tank is utilized to clean the inside of the case, so that it is possible to prevent the accumulation of processing waste inside the case and also to conserve water.

[0041] (2) The processing device according to (1), The case includes a first case (upstream case 61) that covers the periphery of the holding table from below, and a second case (downstream case 62) that is provided downstream of the first case in the direction in which the waste liquid flows and that guides the waste liquid to the storage tank, the flow path of the waste liquid supply unit communicates with the storage tank, the first case, and the second case; the waste liquid supply unit supplies at least a portion of the waste liquid stored in the storage tank to the first case and the second case; Processing equipment.

[0042] According to (2), by providing cleaning mechanisms at multiple locations in the case, the cleaning capacity inside the case can be improved. In this processing device, the inside of the case is cleaned using waste liquid, so it is possible to achieve both improved cleaning capacity and water conservation.

[0043] (3) The processing device according to (1) or (2), the waste liquid supply unit further includes an injection nozzle (upstream supply section 73) that is provided in the case and that supplies the waste liquid to the case by injecting the waste liquid; The injection nozzle intermittently injects the waste liquid. Processing equipment.

[0044] According to (3), the cleaning ability inside the case can be improved. [Explanation of symbols]

[0045] 1 Processing equipment 30 Holding table 40 Processing Unit 41 Spindle 42 Cutting blade (processing tool) 46 Processing water supply unit 60 Water Case (Case) 61 Upstream case (first case) 62 Downstream case (second case) 68 Storage Tank 70 Waste liquid supply unit 71 Flow path 73 Upstream supply section (injection nozzle) W Package substrate (workpiece)

Claims

1. a holding table for holding the workpiece; a machining unit having a spindle and a machining tool fixed to the tip of the spindle and for machining the workpiece held on the holding table; a processing water supply unit that supplies processing water to the workpiece and the processing tool; a case for receiving the processing water supplied from the processing water supply unit; a storage tank that stores the processing water received by the case as waste liquid; a waste liquid supply unit having a flow path communicating with the storage tank and the case, and capable of supplying at least a portion of the waste liquid stored in the storage tank to the case; Processing equipment.

2. The processing device according to claim 1, the case includes a first case that covers the periphery of the holding table from below, and a second case that is provided downstream of the first case in the direction in which the waste liquid flows and that guides the waste liquid to the storage tank; the flow path of the waste liquid supply unit communicates with the storage tank, the first case, and the second case; the waste liquid supply unit supplies at least a portion of the waste liquid stored in the storage tank to the first case and the second case; Processing equipment.

3. The processing device according to claim 1 or 2, the waste liquid supply unit further includes a spray nozzle provided in the case and configured to spray the waste liquid into the case; The injection nozzle intermittently injects the waste liquid. Processing equipment.

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