headphone

Abstract

Synchronizing earphone stem positions in circumaural and supraaural headphone designs. [Solution] The headphones have a pivot mechanism that connects a headband (402) to a pivot point (406) on top of earphones (404) and accommodates movement (408) about a roll axis and a yaw axis, thereby allowing the earphones to be adjusted in both roll and yaw relative to the headband, respectively, and the pivot mechanism includes a torsion spring arranged to oppose rotation of the pivot mechanism about the roll axis.

Description

[Technical Field]

[0001] The described embodiments relate generally to various headphone features, and more specifically, the various features help improve the overall user experience by incorporating arrays of sensors and new mechanical functions into the headphones. [Background technology]

[0002] Although headphones have been in use for over 100 years, the design of the mechanical frames used to hold the earphones against a user's ears has remained relatively unchanged. As a result, some overhead headphones are difficult to carry easily when not in use without using a bulky case or being worn prominently around the neck. Traditional interconnections between the earphones and the band often use a yoke that surrounds each earphone, making each earphone bulky overall. Furthermore, headphone users must manually verify that the earphones are correctly aligned with their ears whenever they wish to use the headphones. Therefore, it is desirable to address the above-mentioned shortcomings. Summary of the Invention

[0003] This disclosure describes several improvements to circumaural and supraaural headphone frame designs.

[0004] An earphone is disclosed, the earphone comprising: an earphone housing; a speaker disposed within a central portion of the earphone housing; and a pivot mechanism disposed at a first end of the earphone housing, the pivot mechanism including a stem and a spring configured to resist rotation of the earphone housing relative to the stem, the spring including a first end coupled to the stem and a second end coupled to the earphone housing.

[0005] A headphone is disclosed, the headphone including a first earphone, a second earphone, a headband assembly including a headband spring, and a first pivot assembly connecting the first earphone to a first side of the headband assembly, the first pivot assembly including a first stem and a first pivot spring configured to resist rotation of the first earphone relative to the first stem, the first pivot spring having a first end coupled to the first earphone and a second end coupled to the first stem. a first pivot assembly including a first pivot spring including a second stem; and a second pivot assembly coupling the second earbud to a second side of the headband assembly, the second pivot assembly including a second stem and a second pivot spring configured to resist rotation of the second earbud relative to the second stem, the second pivot spring including a first end coupled to the second earbud and a second end coupled to the second stem.

[0006] Disclosed are headphones including a headband assembly including a first earphone, a second earphone, and a headband spring; and first and second swivel assemblies connecting opposite sides of the headband assembly to the first and second earphones, respectively, each of the swivel assemblies being substantially enclosed within the first and second earphones, respectively, and a stem of each of the swivel assemblies coupling its respective swivel assembly to the headband assembly.

[0007] A headphone is disclosed, the headphone including a first earphone, a second earphone, and a headband configured to couple the first earphone and the second earphone together and synchronize movement of the first earphone with movement of the second earphone such that a distance between the first earphone and a center of the headband remains substantially equal to a distance between the second earphone and a center of the headband.

[0008] Disclosed is a headphone including: a headband having a first end and a second end opposite the first end; a first earphone coupled to the headband a first distance from the first end; a second earphone coupled to the headband a second distance from the second end; and a cable routed through the headband mechanically coupling the first earphone to the second earphone, the cable configured to maintain the first distance substantially the same as the second distance by changing the first distance in response to a change in the second distance.

[0009] Disclosed is a headphone including a first earphone, a second earphone, and a headband assembly coupling the first earphone and the second earphone together and including an earphone synchronization system, the earphone synchronization system configured to change a first distance between the first earphone and the headband assembly simultaneously with a change in a second distance between the second earphone and the headband assembly.

[0010] A headphone is disclosed, the headphone including a first earphone, a second earphone, a headband coupling the first earphone to the second earphone, an earphone position sensor configured to measure angular orientations of the first earphone and the second earphone relative to the headband, and a processor configured to change an operational state of the headphone according to the angular orientations of the first earphone and the second earphone.

[0011] A headphone is also disclosed, the headphone including: a headband; a first earphone pivotally coupled to a first side of the headband and having a first axis of rotation; a second earphone pivotally coupled to a second side of the headband and having a second axis of rotation; an earphone position sensor configured to measure an orientation of the first earphone relative to the first axis of rotation and an orientation of the second earphone relative to the second axis of rotation; and a processor configured to place the headphones in a first operating state when the first earphone deflects in a first direction from a neutral state of the first earphone and the second earphone deflects in a second direction opposite the first direction from the neutral state of the second earphone, and to place the headphones in a second operating state when the first earphone deflects in the second direction from the neutral state of the first earphone and the second earphone deflects in the first direction from the neutral state of the second earphone.

[0012] Disclosed is a headphone comprising: a headband; a first earphone including a first earphone housing; a first pivot mechanism disposed within the first earphone housing, the first pivot mechanism including a first stem base portion protruding through an opening defined by the first earphone housing, the first stem base portion being coupled to a first portion of the headband; and a first orientation sensor configured to measure an angular orientation of the first earphone relative to the headband; a second earphone including a second earphone housing; and a second pivot mechanism disposed within the second earphone housing, the second pivot mechanism being coupled to a first portion of the headband. a second pivot mechanism including a second stem base portion that protrudes through an opening defined by the body, the second stem base portion coupled to a second portion of the headband; and a second orientation sensor configured to measure an angular orientation of the second earbud relative to the headband; and a processor configured to transmit a first audio channel to the first earbud when sensor readings received from the first orientation sensor and the second orientation sensor correspond to the first earbud over a first ear of the user, and to transmit a second audio channel to the first earbud when the sensor readings correspond to the first earbud over a second ear of the user.

[0013] Disclosed are headphones including a first earphone having a first earpad, a second earphone having a second earpad, and a headband connecting the first earphone to the second earphone, the headphones configured to move between an arched state in which a flexible portion of the headband is curved along its length and a flattened state in which the flexible portion of the headband is flattened along its length, the first earphone and the second earphone configured to fold toward the headband such that the first earpad and the second earpad contact the flexible headband in the flattened state.

[0014] A headphone is disclosed, the headphone including a first earphone, a second earphone, and a headband assembly coupled to both the first earphone and the second earphone, the headband assembly including a linkage pivotally coupled together, and an over-center locking mechanism coupling the first earphone to a first end of the headband assembly and having a first stable position in which the linkage is flattened and a second stable position in which the linkage forms an arch.

[0015] Disclosed are headphones including a first earphone, a second earphone, and a flexible headband assembly coupled to both the first earphone and the second earphone, the flexible headband assemblies pivotally coupled together and including a hole linkage defining an interior volume within the flexible headband assembly, and a bistable element disposed within the interior volume and configured to resist transition of the flexible headband assembly between a first state in which a central portion of the hole linkage is straightened and a second state in which the hole linkage forms a bow.

[0016] Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the described embodiments. [Brief explanation of the drawings]

[0017] The disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings, in which reference numerals designate like structural elements and in which:

[0018] [Figure 1A] 1 shows a front view of an exemplary set of over-ear or on-ear headphones.

[0019] [Figure 1B] 10A-10C show headphone stems extending different distances from the headband assembly.

[0020] [Figure 2A]1 shows a perspective view of a first side of headphones with synchronized headphone stems.

[0021] [Figure 2B] 2B shows a cross-sectional view of the headphones described in FIG. 2A according to section line AA. [Figure 2C] 2B shows a cross-sectional view of the headphones described in FIG. 2A according to section line BB.

[0022] [Figure 2D] 2D shows a perspective view of the opposite side of the headphones described in FIG. 2D.

[0023] [Figure 2E] 2D according to the section line CC.

[0024] [Figure 2F] 1 shows a cross-sectional perspective view of a second side of a headphone having a synchronized headphone stem and a single spring band. [Figure 2G] 1 shows a cross-sectional perspective view of a second side of a headphone having a synchronized headphone stem and a single spring band.

[0025] [Figure 2H] 2F shows a cross-sectional view of the headphones described in FIG. 2F according to section line DD. [Figure 2I] 2C shows a cross-sectional view of the headphones described in FIG. 2G according to section line EE.

[0026] [Figure 3A] 1 illustrates an exemplary headphone having a headband assembly configured to synchronize adjustments to the position of earbuds.

[0027] [Figure 3B] 1 shows a cross-sectional view of the headband assembly when the headphones are expanded to their maximum size.

[0028] [Figure 3C] 10 shows a cross-sectional view of the headband assembly when the headphones are collapsed to a smaller size.

[0029] [Figure 3D] 1A-1C show a top perspective cross-sectional view and a cross-sectional view of a headband assembly configured to synchronize the position of earbuds. [Figure 3E] 1A-1C show a top perspective cross-sectional view and a cross-sectional view of a headband assembly configured to synchronize the position of earbuds. [Figure 3F] 1A-1C show a top perspective cross-sectional view and a cross-sectional view of a headband assembly configured to synchronize the position of earbuds.

[0030] [Figure 3G] FIG. 1 illustrates a top view of an earbud synchronization assembly. [Figure 3H] FIG. 1 illustrates a top view of an earbud synchronization assembly.

[0031] [Figure 3I] 3G-3H show flat schematic diagrams of another earphone synchronization system similar to the one described in FIGS. [Figure 3J] 3G-3H show flat schematic diagrams of another earphone synchronization system similar to the one described in FIGS.

[0032] [Figure 3K] A cross-sectional view of a headphone 360 ​​suitable for incorporating any one of the earphone synchronization systems described in Figures 3G-3J is shown. [Figure 3L] A cross-sectional view of a headphone 360 ​​suitable for incorporating any one of the earphone synchronization systems described in Figures 3G-3J is shown.

[0033] [Figure 3M] 3G-3H show perspective views of a data synchronization cable with the earphone synchronization system described in FIGS. 3G-3H in a retracted position and an extended position. [Figure 3N]3G-3H show cross-sectional perspective views of a data synchronization cable along with the earphone synchronization system described in FIGS. 3G-3H in a retracted position and an extended position.

[0034] [Figure 3O] 10 illustrates a portion of the canopy structure and how the earphone synchronization system can be routed through the reinforcement member of the canopy structure that it contains.

[0035] [Figure 4A] A front view of headphones 400 with off-center pivoting earphones is shown. [Figure 4B] A front view of headphones 400 with off-center pivoting earphones is shown.

[0036] [Figure 5A] 1 illustrates an exemplary pivot mechanism including a torsion spring.

[0037] [Figure 5B] 5B shows the pivot mechanism described in FIG. 5A positioned behind the cushion of an earphone.

[0038] [Figure 6A] 10 shows a perspective view of another pivot mechanism including a leaf spring.

[0039] [Figure 6B] 6B illustrates the range of motion of the earbuds using the pivot mechanism described in FIG. 6A. [Figure 6C] 6B illustrates the range of motion of the earbuds using the pivot mechanism described in FIG. 6A. [Figure 6D] 6B illustrates the range of motion of the earbuds using the pivot mechanism described in FIG. 6A.

[0040] [Figure 6E] 6B shows an enlarged view of the pivot mechanism depicted in FIG. 6A.

[0041] [Figure 6F] FIG. 10 shows a perspective view of another pivot mechanism.

[0042] [Figure 6G] 10 shows yet another pivot mechanism.

[0043] [Figure 6H] 6H shows the pivot mechanism described in FIG. 6G with one side removed to illustrate rotation of the stem base in different positions. [Figure 6I] 6H shows the pivot mechanism described in FIG. 6G with one side removed to illustrate rotation of the stem base in different positions.

[0044] [Figure 6J] FIG. 6F illustrates a cutaway perspective view of the swivel assembly of FIG. 6G positioned within the earbud housing.

[0045] [Figure 6K] 10A-10C show partial cross-sectional side views of a pivot assembly positioned within an earbud housing with a helical spring in relaxed and compressed states. [Figure 6L] 10A-10C show partial cross-sectional side views of a pivot assembly positioned within an earbud housing with a helical spring in relaxed and compressed states.

[0046] [Figure 7A] 10 illustrates multiple positions of a spring band suitable for use in a headband assembly.

[0047] [Figure 7B] 7B shows a graph illustrating how spring force varies based on spring constant as a function of deflection of the spring band described in FIG. 7A.

[0048] [Figure 8A] A solution is presented to prevent discomfort caused by headphones that fit too tightly around the user's neck. [Figure 8B] A solution is presented to prevent discomfort caused by headphones that fit too tightly around the user's neck.

[0049] [Figure 8C] 10 shows how separate and distinct knuckles can be placed along the lower sides of the spring band to prevent it from returning to a neutral position. [Figure 8D] 10 shows how separate and distinct knuckles can be placed along the lower sides of the spring band to prevent it from returning to a neutral position.

[0050] [Figure 8E] 7 shows how the springs connecting the headband assembly to the earbuds can cooperate with spring band 700 to set the actual amount of force applied to the user by the headphones. [Figure 8F] 7 shows how the springs connecting the headband assembly to the earbuds can cooperate with spring band 700 to set the actual amount of force applied to the user by the headphones.

[0051] [Figure 9A] An alternative approach is presented in which a low spring constant band is used to limit the range of motion of a pair of headphones. [Figure 9B] An alternative approach is presented in which a low spring constant band is used to limit the range of motion of a pair of headphones.

[0052] [Figure 10A] 1 illustrates a top view of an exemplary head of a user wearing headphones.

[0053] [Figure 10B] 10B shows a front view of the headphones described in FIG. 10A.

[0054] [Figure 10C] 10B shows a top view of the headphones described in FIG. 10A. [Figure 10D] Shows how the headphone earphones can rotate around their respective yaw axes.

[0055] [Figure 10E] 10 shows a flowchart illustrating a control method that can be performed when roll and / or yaw of the earphones relative to the headband is detected. [Figure 10F] 10 shows a flowchart illustrating a control method that can be performed when roll and / or yaw of the earphones relative to the headband is detected.

[0056] [Figure 10G] 10 shows a system-level block diagram of a computing device 1070 that can be used to implement various components described herein.

[0057] [Figure 11A] 1 shows foldable headphones. [Figure 11B] 1 shows foldable headphones. [Figure 11C] 1 shows foldable headphones.

[0058] [Figure 11D] 10 illustrates how the earphones of the foldable headphones can be folded towards the outward facing surface of the deformable band region. [Figure 11E] 10 illustrates how the earphones of the foldable headphones can be folded towards the outward facing surface of the deformable band region. [Figure 11F] 10 illustrates how the earphones of the foldable headphones can be folded towards the outward facing surface of the deformable band region.

[0059] [Figure 12A] 10 shows an embodiment of a headphone that can transition from a bowed state to a flattened state by pulling on both sides of a spring band. [Figure 12B]10 shows an embodiment of a headphone that can transition from a bowed state to a flattened state by pulling on opposite sides of a spring band.

[0060] [Figure 12C] FIG. 10 shows a side view of the foldable stem region in a flattened state. [Figure 12D] 10 shows a side view of the foldable stem region in an arched state.

[0061] [Figure 12E] 12D shows a side view of one end of the headphones described in FIG. 12D.

[0062] [Figure 13A] FIG. 1 shows a partial cross section of a headphone using an off-axis cable to transition between a bowed state and a flattened state. [Figure 13B] FIG. 1 shows a partial cross section of a headphone using an off-axis cable to transition between a bowed state and a flattened state.

[0063] [Figure 14A] 1 shows a partial cross-sectional view of a headphone having a foldable stem region constrained, at least in part, by an extension pin that delays flattening of the headphone through a first portion of travel of an earphone of the headphone. [Figure 14B] 1 shows a partial cross-sectional view of a headphone having a foldable stem region constrained, at least in part, by an extension pin that delays flattening of the headphone through a first portion of travel of an earphone of the headphone. [Figure 14C] 1 shows a partial cross-sectional view of a headphone having a foldable stem region constrained, at least in part, by an extension pin that delays flattening of the headphone through a first portion of travel of an earphone of the headphone.

[0064] [Figure 15A] Various views of the headband assembly 1500 are shown from different angles and in different states. [Figure 15B] Various views of the headband assembly 1500 are shown from different angles and in different states. [Figure 15C] Various views of the headband assembly 1500 are shown from different angles and in different states. [Figure 15D] Various views of the headband assembly 1500 are shown from different angles and in different states. [Figure 15E] Various views of the headband assembly 1500 are shown from different angles and in different states. [Figure 15F] Various views of the headband assembly 1500 are shown from different angles and in different states.

[0065] [Figure 16A] 1 shows the headband assembly in a folded and bowed state. [Figure 16B] 1 shows the headband assembly in a folded and bowed state.

[0066] [Figure 17A] 1 shows a diagram of another foldable headphone embodiment. [Figure 17B] 1 shows a diagram of another foldable headphone embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0067] Although headphones have been in production for many years, numerous design problems remain. For example, the functionality of headbands associated with headphones is generally limited to mechanical connections that function only to maintain the headphone earphones on the user's ears and provide an electrical connection between the earphones. Headbands tend to add substantial bulk to headphones, thereby making storage of the headphones problematic. Stems connecting the headband to the earphones, which are designed to accommodate adjustments to the orientation of the earphones relative to the user's ears, also add bulk to headphones. Stems connecting the headband to the earphones, which accommodate extension of the headband, generally allow the center portion of the headband to shift to one side of the user's head. This shifted configuration can look somewhat odd and, depending on the headphone design, may make the headphones less comfortable to wear.

[0068] While some improvements, such as wireless delivery of media content to headphones, have alleviated the problem of tangled cords, this type of technology brings its own set of problems. For example, because wireless headphones require battery power to operate, a user who leaves their wireless headphones turned on may unintentionally drain the battery in the wireless headphones, rendering them unusable until a new battery can be installed or the device recharged. Another design problem with many headphones is that the user must keep track of which earbud corresponds to which ear to prevent a situation where the left audio channel is presented to the right ear and the right audio channel is presented to the left ear.

[0069] A solution to the unsynchronized positioning of the earbuds is to incorporate an earbud synchronization component in the form of a mechanical mechanism located within the headband that synchronizes the distance between the earbuds and each end of the headband. This type of synchronization can be performed in several ways. In some embodiments, the earbud synchronization component can be a cable extending between both stems that can be configured to synchronize the movement of the earbuds. The cable can be arranged in a loop, with different sides of the loop attached to each stem of the earbuds, so that movement of one earbud away from the headband moves the other earbud the same distance away from the opposite end of the headband. Similarly, pushing one earbud toward one side of the headband translates the other earbud the same distance toward the opposite side of the headband. In some embodiments, the earbud synchronization component can be a rotating gear embedded within the headband that can be configured to engage teeth on each stem to maintain the earbuds synchronized.

[0070] One solution to the traditional bulky connection between the headphone stem and the earphone is to use a spring-driven pivot mechanism to control the movement of the earphone relative to the band. The spring-driven pivot mechanism may be located near the top of the earphone, allowing it to be incorporated within the earphone instead of being external to the earphone. In this way, the earphone can be equipped with pivot functionality without increasing the overall bulk of the headphones. Different types of springs may be utilized to control the movement of the earphone relative to the headband. Specific examples, including torsion springs and leaf springs, are described in detail below. A spring associated with each earphone can cooperate with a spring in the headband to set the amount of force exerted on a user wearing the headphones. In some embodiments, the spring in the headband can be a low spring constant spring configured to minimize variation in force across a wide range of users with different head sizes. In some embodiments, the travel of the low constant spring in the headband can be limited to prevent the headband from tightening around the user's neck when worn around the neck.

[0071] One solution to the problem of large headband form factors is to design the headband to flatten against the earbuds. A flattened headband allows the bow-shaped shape of the headband to be compacted into a flat shape, allowing the headphones to achieve a size and shape appropriate for more convenient storage and transport. The earbuds may be attached to the headband by a foldable stem region that allows the earbuds to fold toward the center of the headband. The force applied to fold each earbud toward the headband is transmitted to a mechanism that pulls the corresponding end of the headband to flatten the headband. In some embodiments, the stem includes an over-center locking mechanism that prevents the headphones from unintentionally returning to the bow-shaped state, without the need for an additional release button to re-transition the headphones to the bow-shaped state.

[0072] A solution to the power management problem associated with wireless headphones includes incorporating orientation sensors into the earphones, which may be configured to monitor the orientation of the earphones relative to the band. The orientation of the earphones relative to the band may be used to determine whether the headphones are being worn over the user's ears. This information may then be used to place the headphones in standby mode or shut down the headphones entirely when the headphones are not determined to be positioned over the user's ears. In some embodiments, the orientation sensors in the earphones may also be utilized to determine which of the user's ears the earphones are currently covering. Circuitry within the headphones may be configured to switch the audio channels routed to each earphone to match the determination of which of the user's ears the earphones are over.

[0073] These and other embodiments are discussed below with reference to Figures 1-17B, although those skilled in the art will readily recognize that the detailed description provided herein with respect to those figures is for illustrative purposes only and should not be considered limiting.

[0074] Symmetrical Telescoping Earphones FIG. 1A shows a front view of an exemplary set of over-the-ear or on-ear headphones 100. The headphones 100 include a band 102 that interacts with stems 104 and 106 to enable size adjustability for the headphones 100. In particular, the stems 104 and 106 are configured to shift independently relative to the band 102 to accommodate a variety of head sizes. In this manner, the position of the earbuds 108 and 110 can be adjusted to position the earbuds 108 and 110 directly over the user's ears. Unfortunately, as can be seen from FIG. 1B, this type of configuration can result in the stems 104 and 106 becoming mismatched relative to the band 102. The configuration shown in FIG. 1B can be less comfortable for the user and may also lack aesthetic appeal. To correct these problems, the user is forced to manually adjust the stems 104 and 106 relative to the band 102 to achieve a desired appearance and comfortable fit. 1A-1B show how stems 104 and 106 extend downward toward the center of earbud 108, allowing earbud 108 to rotate to conform to the curvature of a user's head. As mentioned above, the portions of stems 104 and 106 that extend downward around earbud 108 increase the diameter of earbud 108.

[0075] FIG. 2A shows a perspective view of headphones 200 having a headband 202 configured to solve the problems described in FIGS. 1A-1B. The headband 202 is depicted without decorative coverings that reveal its internal features. In particular, the headband 202 may include a wire loop 204 configured to synchronize the movement of stems 206 and 208. A wire guide 210 may be configured to maintain the curvature of the wire loop 204 to match the curvature of leaf springs 212 and 214. The leaf springs 212 and 214 may be configured to define the shape of the headband 202 and exert a force on the user's head. Each of the wire guides 210 may include an opening through which the wire loop 204 and both sides of the leaf springs 212 and 214 can pass. In some embodiments, the opening for the wire loop 204 may be defined by a low-friction bearing to prevent significant friction from impeding the movement of the wire loop 204 through the opening. In this manner, wire guide 210 defines a path along which wire loop 204 extends between stem housings 216 and 218. Wire loop 204 is coupled to both stem 206 and stem 208 and functions to maintain distance 120 between earbud 122 and stem housing 116 substantially the same as distance 124 between earbud 126 and stem housing 118. A first side 204-1 of wire loop 204 is coupled to stem 206, and a second side 204-2 of wire loop 204 is coupled to stem 208. Because opposite sides of the wire loop are attached to stems 206 and 208, movement of one of the stems results in movement of the other stem in the same direction.

[0076] FIG. 2B shows a cross-sectional view of a portion of stem housing 116 along section line AA. In particular, FIG. 2B shows how protrusion 228 of stem 206 engages a portion of wire loop 204. Because protrusion 228 of stem 206 is coupled to wire loop 204, when a user of headphones 100 pulls earbud 222 further from stem housing 216, wire loop 204 is also pulled, causing wire loop 204 to rotate through headband 202. The rotation of wire loop 204 through headband 202 adjusts the position of earbud 226, which is likewise coupled to wire loop 204 by the protrusion of stem 208. In addition to forming a mechanical coupling with wire loop 204, protrusion 228 may also be electrically coupled to wire loop 204. In some embodiments, protrusion 228 may include a conductive path 230 that electrically couples wire loop 204 to electrical components within earbud 222. In some embodiments, wire loop 204 may be formed from a conductive material such that wire loop 204 can transfer signals between components within earbuds 222 and 226.

[0077] 2C shows another cross-sectional view of stem housing 116 along section line BB. In particular, FIG. 2C shows how wire loop 204 engages pulley 232 within stem housing 216. Pulley 232 minimizes any friction caused by movement of earbud 222 toward or further from stem housing 216. Alternatively, wire loop 204 may be routed through a static bearing within stem housing 216.

[0078] 2D shows another perspective view of headphones 200. In this view, it can be seen that first side 204-1 and second side 204-2 of wire loop 204 shift laterally as they cross from one side of headband 202 to the other. This may be achieved by the openings defined by wire guide 210 being gradually offset, so that by the time sides 204-1 and 204-2 reach stem housing 218, second side 204-2 is centered and aligned with stem 208, as depicted in FIG. 2E.

[0079] 2E shows how second side 204-2 is engaged by protrusion 234. Because stems 206 and 208 are attached to first and second sides, respectively, of wire loop 204, pushing earbud 226 toward stem housing 218 pushes earbud 222 toward stem housing 216. Another advantage of the configuration described in FIGS. 2A-2E is that wire loop 204 always remains taut, regardless of the direction of movement of stems 206 and 208. This maintains the amount of force required to extend or retract earbuds 222 and 226 consistently, regardless of direction.

[0080] 2F-2G show perspective views of headphones 250. Headphones 250 are similar to headphones 200, except that a single leaf spring 252 is used to connect stem housing 254 to stem housing 256. In this embodiment, wire loop 258 may be positioned on either side of leaf spring 252. Instead of being positioned directly under one side of wire loop 258, stems 260 and 262 may be positioned directly between the two sides of wire loop 258 and connected to one side of wire loop 258 by arms of stems 260 and 262.

[0081] Figures 2H and 2I show cross-sectional views of the interior portions of stem housings 254 and 256. Figure 2H shows a cross-sectional view of stem housing 254 along section line DD. Figure 2H shows how stem 260 can include a laterally extending arm 268 that engages wire loop 258. In this manner, laterally extending arm 268 couples stem 260 to wire loop 258, thereby maintaining earbud 266 in a consistent position as earbud 264 moves. Figure 2I shows a cross-sectional view of stem housing 256 along section line EE. Figure 2I shows how wire loop 258 can be routed within stem housing 256 by pulleys 270 and 272. By routing wire loop 258 over stem 262, any interference between wire loop 258 and stem 206 can be avoided.

[0082] 3A-3C show another headphone embodiment configured to solve the problems described in FIGS. 1A-1B. FIG. 3A shows headphone 300 including headband assembly 302. Headband assembly 302 is connected to earbuds 304 and 306 by stems 308 and 310. The size and shape of headband assembly 302 may vary depending on how much adjustability is desired for headphone 300.

[0083] 3B shows a cross-sectional view of headband assembly 302 when headphones 300 are expanded to their maximum size. In particular, FIG. 3B shows how headband assembly 302 includes gear 312 configured to engage teeth defined by the ends of each of stems 308 and 310. In some embodiments, stems 308 and 310 may be prevented from being completely pulled from headband assembly 302 by spring pins 314 and 316 by engaging openings defined by stems 308 and 310.

[0084] 3C shows a cross-sectional view of headband assembly 302 as headphones 300 shrink to a smaller size. In particular, FIG. 3C shows how gear 312 maintains synchronized positions of stems 308 and 310 with movement of either stem 308 or stem 310 being transferred to the other stem by gear 312. In some embodiments, the stiffness of the housing defining the outside of headband assembly 302 may be selected to match the stiffness of stems 308 and 310 to provide a headband with a more consistent feel to a user of headphones 300.

[0085] 3D shows an alternative embodiment of stems 308 and 310. Covers concealing the ends of stems 308 and 310 have been removed to more clearly show the function of the mechanism that synchronizes the position of the stems. Stem 308 defines an opening 318 extending through a portion of stem 308. One side of opening 318 has teeth configured to engage with gear 320. Similarly, stem 310 defines an opening 322 extending through a portion of stem 310. One side of opening 322 has teeth configured to engage with gear 320. Because both sides of openings 318 and 322 engage gear 320, movement of either one of stems 308 and 310 causes movement of the other stem. In this manner, earbuds positioned at the ends of each of stems 308 and 310 are synchronized.

[0086] FIG. 3E shows a top view of stems 308 and 310. FIG. 3E also shows the outline of cover 324, which hides the geared openings defined by stems 308 and 310 and controls the movement of the ends of stems 308 and 310. FIG. 3F shows a side cross-sectional view of stems 308 and 310 covered by cover 324. Gear 320 can include bearing 326 that defines an axis of rotation for gear 320. In some embodiments, the top of bearing 326 can protrude from cover 324, allowing a user to adjust earbud position by manually rotating bearing 326. It should also be appreciated that a user can adjust earbud position by simply pushing or pulling one of stems 308 and 310.

[0087] 3G shows a flattened schematic diagram of another earphone synchronization system that utilizes loops 328 within headband 330 to maintain a distance between each of the synchronized earphones 304 and 306 and headband 330 (the rectangular shape is merely used to indicate the position of headband 330 and should not be construed as being for illustrative purposes only). Stem wires 332 and 334 couple each earphone 304 and 306 to loop 328. Stem wires 332 and 334 may be formed from metal and may be soldered to opposite sides of loop 328. Because stem wires 332 and 334 are coupled to opposite sides of loop 328, movement of earphone 306 in direction 336 causes stem wire 332 to move in direction 338. Thus, moving earphone 306 closer to headband 330 also moves stem wire 332, which in turn moves earphone 304 closer to headband 330. In addition to showing the new positions of earbuds 304 and 306 after being moved closer to headband 330, FIG. 3H shows how moving earbud 304 in direction 340 automatically moves earbud 306 in direction 342 and further away from headband 330. Although not described, it should be appreciated that headband 330 can include various reinforcing members to maintain loop 328 and stem wires 332 and 334 in the described shapes.

[0088] FIGS. 3I-3J show flattened schematic views of another earbud synchronization system similar to the one described in FIGS. 3G-3H. FIG. 3I shows how the ends of stems 344 and 346 can be directly coupled to one another without an intervening loop. By extending stems 344 and 346 in a pattern and having a shape similar to loop 328, a similar result can be achieved without the need for an additional loop structure. Movement of stems 344 and 346 is aided by reinforcing members 348, 350, and 352, which help prevent buckling of stems 344 and 346 and adjust the position of earbuds 304 and 306. Reinforcing members 348-352 can define channels through which stems 344 and 346 pass smoothly. These channels can be useful in some locations where stems 344 and 346 are curved. While not defining a curved channel, reinforcing member 352 still serves the important purpose of limiting the direction of movement of the ends of stems 344 and 346 in directions 354 and 356. Movement in direction 356 results in the earbuds moving toward headband 330, as described in FIG. 3J. Movement in direction 354 results in earbuds 304 and 306 moving farther away from headband 330.

[0089] 3K-3L show cross-sectional views of headphones 360 suitable for incorporating any one of the earbud synchronization systems described in FIGS. 3G-3J. FIG. 3K shows headphones 360 with retracted earbuds and stem wires 332 and 334 extending from headband 330 to engage and synchronize the position of stem assembly 362 with the position of stem assembly 364. Stem 334 is described as being coupled to support structure 366 within stem assembly 364, which allows stem 334 to extend and retract to maintain stem assembly 362 synchronized with stem assembly 364. As described, stem assembly 362 is disposed within a channel defined by headband 330, which allows stem assembly 362 to move relative to headband 330. 3K also shows how data sync cable 368 can extend through headband 330 and wrap around portions of both stem wire 334 and stem wire 332. By wrapping around stem wires 332 and 334, data sync cable 356 can act as a stiffening member to prevent buckling of stem wires 332 and 334. Data sync cable 356 is generally configured to exchange signals between earphones 304 and 306 to maintain precisely synchronized audio during playback operation of headphones 360.

[0090] 3L shows how the coil configuration of data sync cable 368 conforms to the extension of stem assemblies 362 and 364. Data sync cable 368 can have an exterior surface with a coating that allows stem wires 332 and 334 to slide through central openings defined by the coils. FIG. 3L also shows how earbuds 304 and 306 maintain the same distance from the center portion of headband 330.

[0091] 3M-3N show perspective views of the earbud synchronization system described in FIGS. 3G-3H in a retracted position and an extended position along with data synchronization cable 368. FIG. 3M shows how stem wire 332 includes attachment feature 370 that at least partially surrounds a portion of loop 328. In this manner, stem wire 332, stem wire 334, and support structure 366 move along loop 328. FIG. 3M also shows dashed lines illustrating how covering headband 330 can at least partially follow loop 328, stem wire 332, and stem wire 334.

[0092] 3O illustrates portions of canopy structure 372 and how the earbud synchronization system can be routed through reinforcing members 374 of canopy structure 372. Reinforcing members 374 help guide loops 328 and stem wires 332 along a desired path. In some embodiments, canopy structure 372 can include a spring mechanism that helps keep the earbuds secured in the user's ears. Off-center pivoting earphones

[0093] 4A-4B show front views of headphones 400 with off-center pivoting earphones. FIG. 4A shows a front view of the headphones 400 including a headband assembly 402. In some embodiments, the headband assembly 402 can include an adjustable band and stem to customize the size of the headphones 400. Each end of the headband assembly 402 is shown coupled to the top of the earphones 404. This differs from conventional designs that center the pivot point on the earphones 404, allowing the earphones 404 to naturally pivot in a direction that allows the earphones 404 to move to an angle that positions the earphones 404 parallel to the plane of the user's head. Unfortunately, this type of design generally requires bulky arms extending to either side of the earphones 404, thereby significantly increasing the size and weight of the earphones 404. By locating the pivot point 406 near the top of the earphones 404, the associated pivot mechanism components may be packaged within the earphones 404.

[0094] FIG. 4B shows an example range of motion 408 for each of the earbuds 404. The range of motion 408 may be configured to fit the majority of users based on research conducted on average head size measurements. This more compact configuration can still perform the same functions as the more conventional configuration described above, including applying force through the center of the earbud and establishing an acoustic seal. In some embodiments, the range of motion 408 may be approximately 18 degrees. In some embodiments, the range of motion 408 may not have a defined stop, but instead becomes increasingly stiff to deform the further it is from the neutral position. The pivot mechanism components may include spring elements configured to apply a moderate holding force to the user's ear when the headphones 400 are in use. The spring elements may also urge the earbuds back to the neutral position when the headphones 400 are no longer being worn.

[0095] 5A shows an exemplary pivot mechanism 500 for use on top of earbuds. Pivot mechanism 500 may be configured to accommodate movement about two axes, thereby allowing both roll and yaw adjustment of earbuds 404 relative to headband assembly 402. Pivot mechanism 500 includes a stem 502 that can be coupled to the headband assembly. One end of stem 502 is positioned in bearing 504, which allows stem 502 to rotate about yaw axis 506. Bearing 504 also couples stem 502 to torsion springs 508, which resist rotation of stem 502 relative to earbuds 404 about roll axis 510. Each of torsion springs 508 may also be coupled to a mounting block 512. Mounting block 512 may be secured to an interior surface of earbuds 404 by fasteners 514. The bearing 504 may be rotatably coupled to the mounting block 512 by a bushing 516, which allows the bearing 504 to rotate relative to the mounting block 512. In some embodiments, the roll and yaw axes may be substantially orthogonal to one another. In this context, substantially orthogonal means that the angle between the two axes does not have to be exactly 90 degrees, but rather remains between 85 and 95 degrees.

[0096] 5A also depicts magnetic field sensor 518. Magnetic field sensor 518 can take the form of a magnetometer or Hall-effect sensor capable of detecting movement of a magnet within pivot mechanism 500. In particular, magnetic field sensor 518 can be configured to detect movement of stem 502 relative to mounting block 512. In this manner, magnetic field sensor 518 can be configured to detect when headphones associated with pivot mechanism 500 are being worn. For example, when magnetic field sensor 518 takes the form of a Hall-effect sensor, rotation of a magnet coupled with bearing 504 can cause the polarity of the magnetic field emitted by that magnet to saturate magnetic field sensor 518. Saturation of the Hall-effect sensor by the magnetic field causes the Hall-effect sensor to transmit a signal via flexible circuit 520 to other electronic devices within headphones 400.

[0097] FIG. 5B shows pivot mechanism 500 positioned behind cushion 522 of earbud 404. In this way, pivot mechanism 500 may be integrated within earbud 404 without affecting the space typically left open to accommodate a user's ear. Close-up view 524 shows a cross-section of pivot mechanism 500. In particular, close-up view 524 shows magnet 526 positioned within fastener 528. As stem 502 rotates about roll axis 510, magnet 526 rotates with it. Magnetic field sensor 518 may be configured to sense the rotation of the field emitted by magnet 526 as it rotates. In some embodiments, the signal generated by magnetic field sensor 518 may be used to start and / or stop headphones 400. This may be particularly useful when the neutral state of earbud 404 corresponds to the bottom end of each earbud 404 oriented toward the user at an angle that rotates earbud 404 away from the user's head when worn by most users. By designing the headphones 400 in this manner, the rotation of the magnet 526 away from its neutral position may be used as a trigger that the headphones 400 are in use. Correspondingly, the movement of the magnet 526 back to its neutral position may be used as an indicator that the headphones 400 are not in use. The power state of the headphones 400 can correspond to these indications to conserve power while the headphones 400 are not in use.

[0098] Close-up view 524 in FIG. 5B shows how stem 502 can twist within bearing 504. Stem 502 is coupled to screw cap 530, which allows stem 502 to twist within bearing 504 about yaw axis 506. In some embodiments, screw cap 530 can define a mechanical stop through which the range of motion through which stem 502 can twist. Magnet 532 is disposed within stem 502 and configured to rotate along stem 502. Magnetic field sensor 534 can be configured to measure the rotation of a magnetic field emitted by magnet 532. In some embodiments, a processor receiving sensor readings from magnetic field sensor 534 can be configured to alter an operating parameter of headphones 400 in response to a sensor reading indicating a threshold amount of change in the angular orientation of magnet 532 relative to the yaw axis has occurred.

[0099] FIG. 6A shows a perspective view of another pivot mechanism 600 configured to fit within the top of earbud 404 of a headphone. The overall shape of pivot mechanism 600 is configured to conform to the space available within the top of the earbud. Pivot mechanism 600 utilizes a leaf spring instead of a torsion spring to oppose movement of earbud 404 in the direction indicated by arrow 601. Pivot mechanism 600 includes a stem 602 having one end disposed within bearing 604. Bearing 604 allows rotation of stem 602 about yaw axis 605. Bearing 604 also couples stem 602 to a first end of leaf spring 606 through spring lever 608. The second end of each of leaf springs 606 is coupled to a corresponding one of spring anchors 610. Spring anchors 610 are described as being transparent, such that the position where each second end of leaf spring 606 engages with the central portion of spring anchor 610 can be seen. This positioning allows leaf springs 606 to flex in two different directions. Spring anchors 610 couple the second end of each leaf spring 606 to earbud housing 612. In this manner, leaf springs 606 create a flexible coupling between stem 602 and earbud housing 612. Pivot mechanism 600 can include cabling 614 configured to route electrical signals between two earbuds 404 by way of headband assembly 402 (not depicted).

[0100] 6B-6D illustrate the range of motion of earbud 404. FIG. 6B shows earbud 404 in a neutral state, with leaf spring 606 in an undeflected state. FIG. 6C shows leaf spring 606 deflected in a first direction, and FIG. 6D shows leaf spring 606 deflected in a second direction opposite the first direction. FIGS. 6C-6D also illustrate how the area between cushion 522 and earbud housing 612 can accommodate the deflection of leaf spring 606.

[0101] FIG. 6E shows a close-up view of swivel mechanism 600. FIG. 6E describes a mechanical stop that limits the amount of rotation possible about yaw axis 605. Stem 602 includes a protrusion 616 configured to move within a channel defined by upper yaw bushing 618. As described, the channel defined by upper yaw bushing 618 has a length that allows for rotation greater than 180 degrees. In some embodiments, the channel can include a detent configured to define a neutral position for earbud 404. FIG. 6E also describes a portion of stem 602 that can accommodate yaw magnet 620. The magnetic field emitted by magnet 620 can be detected by magnetic field sensor 622. Magnetic field sensor 622 can be configured to determine the angle of rotation of stem 602 relative to the rest of swivel mechanism 600. In some embodiments, magnetic field sensor 622 can be a Hall Effect sensor.

[0102] FIG. 6E also describes a roll magnet 624 and a magnetic field sensor 626 that can be configured to measure the amount of deflection of the leaf spring 606. In some embodiments, the pivoting mechanism 600 can also include a strain gauge 628 configured to measure the strain created in the leaf spring 606. The strain measured in the leaf spring 606 can be used to determine in which direction and to what extent the leaf spring is deflected. In this manner, a processor receiving sensor readings recorded by the strain gauge 628 can determine whether the leaf spring 606 is deflected and the direction in which the leaf spring 606 is deflected. In some embodiments, the readings received from the strain gauges can be configured to change the operational state of headphones associated with the pivoting mechanism 600. For example, the operational state can be changed from a play state, in which media is being presented by a speaker associated with the pivoting mechanism 600, to a standby state or inactive state in response to readings from the strain gauges. In some embodiments, when the leaf spring 606 is in an undeflected state, this can indicate that the headphones associated with the pivoting mechanism 600 are not being worn by a user. In other embodiments, the strain gauge may be positioned on the headband spring. Pausing playback based on this input can be very useful, as it allows the user to maintain their position within the media file until they replace the headphones on their head, at which point the headphones can be configured to resume playback. Seal 630 can close the opening between stem 602 and the exterior surface of the earbud to prevent the entry of foreign particles that may interfere with the operation of pivot mechanism 600.

[0103] FIG. 6F shows a perspective view of another pivot mechanism 650 that differs from pivot mechanism 600 in several ways. Leaf spring 652 has a different orientation than leaf spring 606 of pivot mechanism 600. In particular, the orientation of leaf spring 652 differs by approximately 90 degrees from the orientation of leaf spring 606. This results in the thickness dimension of leaf spring 652 resisting rotation of the earbud associated with pivot mechanism 650. FIG. 6F also shows a flexible circuit 654 and a board-to-board connector 656. The flexible circuit can electrically couple strain gauges positioned on leaf spring 652 to a circuit board or other conductive paths on pivot mechanism 650. Electrical signals may be routed through tip 658 of pivot mechanism 650, thereby allowing electrical signals to be routed between earbuds.

[0104] FIG. 6G shows another pivot assembly 660 attached to earbud housing 612 by fasteners 662 and brackets 663. Pivot assembly 660 can include multiple helical springs 664 arranged side by side. In this manner, the helical coils 664 can act in parallel to increase the amount of resistance provided by pivot assembly 660. Helical springs 664 are held in place and stabilized by pins 666 and 668. Actuator 670 transfers any force received from rotation of stem base 672 to helical spring 664. In this manner, helical spring 664 can establish a desired amount of resistance to rotation of stem base 674.

[0105] 6H-6I show pivot assembly 660 with one side removed to illustrate the rotation of stem base 674 among different positions. In particular, Figures 6H-6I show how rotation of stem base 672 results in rotation of actuator 670 and compression of helical spring 664.

[0106] FIG. 6J shows a cutaway perspective view of pivot assembly 660 positioned within earbud housing 612. In some embodiments, stem base 672 can include bearings 674 to reduce friction between stem base 672 and actuator 670, as described. FIG. 6J shows how bracket 663 can define a bearing that secures pin 666 in place. Also shown are pins 666 and 668, which define flattened recesses that keep helical spring 664 securely in place. In some embodiments, the flattened recesses can include protrusions that extend into the central opening of helical spring 664.

[0107] 6K-6L show partial cross-sectional side views of pivot assembly 660 positioned within earbud housing with helical spring 664 in relaxed and compressed states. In particular, the motion that actuator 670 undergoes when shifting from a first position in FIG. 6K to a second position of maximum deflection is clearly depicted. FIGS. 6K and 6L also depict mechanical stop 676, which helps limit the amount of rotation that the earbud housing can achieve relative to the stem base. Low spring constant band

[0108] FIG. 7A illustrates multiple positions of a spring band 700 suitable for use in a headband assembly. The spring band 700 can have a low spring constant, which causes the force generated by the band in response to deformation of the spring band 700 to change slowly with shear. Unfortunately, a low spring constant results in the spring needing to experience a greater amount of shear before exerting a certain amount of force. The spring band 700 is depicted in different positions 702, 704, 706, and 708. Position 702 can correspond to the spring band 700 being in a neutral state where no force is exerted by the spring band 700. In position 704, the spring band 700 can begin to exert a force that pushes the spring band 700 back toward its neutral state. Position 706 can correspond to a position where a user with a small head would bend the spring band 700 when using headphones associated with the spring band 700. Position 708 can correspond to a position on spring band 700 where a user with a large head would bend spring band 700. The offset between positions 702 and 706 is large enough so that spring band 700 exerts a sufficient amount of force to prevent headphones associated with spring band 700 from slipping off the user's head. Furthermore, due to a low spring constant, the force exerted by spring band 700 at position 708 can be small enough so that use of headphones associated with spring band 700 is not high enough to cause user discomfort. Generally, the smaller the spring constant of spring band 700, the smaller the variation in force exerted by spring band 700. In this manner, use of a low spring constant spring band 700 can enable headphones associated with spring band 700 to provide a more consistent user experience for users with different head sizes.

[0109] FIG. 7B shows a graph illustrating how spring force varies based on spring constant as a function of misalignment of spring band 700. Line 710 can represent spring band 700 with its neutral position equivalent to position 702. As will be described, this allows spring band 700 to have a relatively low spring constant that still experiences the desired force midway through the range of motion for a particular pair of headphones. Line 712 can represent spring band 700 with its neutral position equivalent to position 704. As will be described, a higher spring constant is needed to achieve the desired amount of force exerted midway through the desired range of motion. Finally, line 714 can represent spring band 700 with its neutral position equivalent to position 706. Configuring spring band 700 to have a profile consistent with line 714 results in no force being exerted by spring band 700 at the minimum position for the desired range of motion, and more than doubles the amount of force exerted compared to spring band 700 having a profile consistent with line 710 at the maximum position. Configuring spring band 700 to move through a greater amount of slippage prior to the desired range of motion has a distinct advantage when wearing headphones associated with spring band 700, and when worn around a user's neck, it may be undesirable for the headphones to return to position 702. This can result in the headphones sitting uncomfortably around the user's neck.

[0110] 8A-8B illustrate a solution to prevent discomfort caused by headphones 800 utilizing low spring constant spring bands from wrapping too tightly around a user's neck. Headphones 800 include a headband assembly 802 that couples to earbuds 804. Headband assembly 802 includes a compression band 806 coupled to an inward-facing surface of spring band 700. FIG. 8A shows spring band 700 at position 708, which corresponds to the maximum deflection position of headphones 800. The force exerted by spring band 700 can act as a restraint against stretching headphones 800 beyond this maximum deflection position. In some embodiments, the outward-facing surface of spring band 700 can include a second compression band configured to counter deflection of spring band 700 beyond position 708. As will be described, the knuckles 808 of the compression band 806 serve little purpose when the spring band is in position 708 because the outer sides of the knuckles 808 do not contact adjacent knuckles 808 .

[0111] 8B shows spring band 700 in position 706. At position 706, knuckles 808 contact adjacent knuckles 808 to prevent further slippage of spring band 700 toward positions 704 or 702. In this manner, compression band 806 can prevent spring band 700 from exerting pressure on the neck of a user of headphones 800 while maintaining the benefits of a low spring constant spring band 700. FIGS. 8C-8D show how separate and distinct knuckles 808 can be positioned along the lower sides of spring band 700 to prevent spring band 700 from returning past position 706.

[0112] 8E-8F illustrate how the use of springs to control the movement of headband assembly 802 relative to earbuds 804 can vary the amount of force applied to a user by headphones 800 when compared to the force applied by spring band 700 alone. FIG. 8E shows force 810 exerted by spring band 700 and force 812 exerted by the spring controlling the movement of earbuds 804 relative to headband assembly 802. FIG. 8F shows exemplary curves illustrating how forces 810 and 812 supplied by at least two different springs can vary based on spring misalignment. Force 810 does not begin to act until just before the desired range of motion due to the compression band preventing spring band 700 from returning to a neutral state. For this reason, the amount of force imparted by force 810 starts at a higher level, resulting in less variation in force 810. FIG. 8F illustrates force 814, the result of forces 810 and 812 acting sequentially. Placing the springs in series reduces the rate at which the resulting force changes as headphones 800 change shape to fit the user's head size. In this way, the dual spring configuration helps provide a more consistent user experience for a range of users, including a wide variety of head shapes.

[0113] 9A-9B illustrate another approach to limiting the range of motion of a pair of headphones 900 using a low spring constant band 902. FIG. 9A shows the cable 904 in a slack state with the earbuds 904 pulled apart. The range of motion of the low spring constant band 902 may be limited by the cable 904, which performs a function similar to that of the compression band 806, but engaged as a result of tension instead of compression. The cable 904 is configured to extend between the earbuds 906 and is coupled to each of the earbuds 906 by anchor features 908. The cable 904 may be held over the low spring constant band 902 by a wire guide 910. The wire guide 910 may be similar to the wire guide 210 described in FIGS. 2A-2G, with the difference that the wire guide 910 is configured to lift the cable 904 over the low spring constant band 902. The bearing of the wire guide 910 can prevent the cable 904 from getting clogged or undesirably tangled. It should be noted that the cable 904 and low spring constant band 902 may be covered by a decorative cover. It should also be noted that in some embodiments, the cable 904 may be combined with the embodiments shown in Figures 2A-2G to create headphones with the ability to synchronize the position of the earbuds and control the range of movement of the headphones.

[0114] 9B shows how the cable 904 tightens as the earbuds 906 move closer together, eventually stopping further movement of the earbuds 906 closer together. In this way, a minimum distance 912 between the earbuds 906 may be maintained that allows the headphones 900 to be worn comfortably around the necks of a large number of users without putting too much pressure on the user's neck. Left / Right Ear Detection

[0115] FIG. 10A shows a top view of an exemplary head of a user 1000 wearing headphones 1002. Earbuds 1004 on both sides of the user 1000 are depicted. The headband connecting the earbuds 1004 is omitted to show the features of the user's 1000 head in more detail. As depicted, the earbuds 1004 are configured to rotate about a yaw axis, so they may be positioned flat against the user's 1000 head or slightly oriented toward the face of the user 1000. In a study conducted on a large group of users, it was discovered that, on average, the earbuds 1004 were offset above the x-axis when positioned above the user's ears, as depicted. Furthermore, for more than 99% of users, the angle of the earbuds 1004 relative to the x-axis was greater than the x-axis. This means that only a statistically irrelevant portion of headphone 1002 users have head shapes that orient the earbuds 1004 toward the x-axis. FIG. 10B shows a front view of the headphones 1002. In particular, FIG. 10B shows the yaw rotation axis 1006 associated with the earbuds 1004 and how both earbuds 1004 are oriented on the same side of the headband 1008 that couples to the earbuds 1004.

[0116] 10C-10D show a top view of the headphones 1002 and illustrate how the earphones 1004 can rotate about a yaw rotation axis 1006. FIGS. 10C-10D also show the earphones 1004 coupled together by a headband 1008. The headband 1008 can include a yaw position sensor 1010 that can be configured to determine the angle of each of the earphones 1004 relative to the headband 1008. The angle of the earphones relative to the headband 1008 can be measured relative to a neutral position. The neutral position can be a position in which the earphones 1004 are oriented directly toward a central region of the headband 1008. In some embodiments, the earphones 1004 can have a spring that returns the earphones 1004 to the neutral position when not acted upon by an external force. The angle of the earphones relative to the neutral position can change in a clockwise or counterclockwise direction. For example, in FIG. 10C , earphone 1004-1 is biased about rotation axis 1006-1 in a counterclockwise direction, and earphone 1004-2 is biased about rotation axis 1006-2 in a clockwise direction. In some embodiments, sensor 1010 can be a time-of-flight sensor configured to measure the angular change of earphone 1004. The depicted pattern associated with and displayed as sensor 1010 can represent a visual pattern that allows for accurate measurement of the amount of rotation of each earphone. In other embodiments, sensor 1010 can take the form of a magnetic field sensor or a Hall Effect sensor, as described in conjunction with FIGS. 5B and 6E . In some embodiments, sensor 1010 can be used to determine which ear of a user each earphone is covering. Because earphones 1004 are known to be oriented behind the x-axis for almost all users, when sensor 1010 detects both earphones 1004 oriented toward one side of the x-axis, headphones 1002 can determine which earphone is over which ear. For example, FIG. 10C illustrates a configuration in which earphone 1004-1 can be determined to be on the user's left ear and earphone 1004-2 can be determined to be on the user's right ear.In some embodiments, circuitry within headphones 1002 may be configured to adjust the audio channel so the correct channel is delivered to the correct ear.

[0117] Similarly, FIG. 10D shows a configuration in which earphone 1004-1 is on the user's right ear and earphone 1004-2 is on the user's left ear. In some embodiments, when the earphones are not oriented toward the same side of the x-axis, headphones 1002 may require further input before changing audio channels. For example, when earphones 1004-1 and 1004-2 are both detected as biased in a clockwise direction, a processor associated with headphones 1002 may determine that headphones 1002 are not currently in use. In some embodiments, headphones 1002 may include an override switch for cases in which a user desires to flip audio channels independently of the L / R audio channel routing logic associated with yaw position sensor 1010. In other embodiments, a separate sensor or sensors may be activated to confirm the position of headphones 1002 relative to the user.

[0118] 10E-10F show flowcharts describing control methods that can be executed when roll and / or yaw of the earphones relative to the headband is detected. FIG. 10E shows a flowchart describing a response to detecting rotation of the earphones relative to the headband of the headphones about a yaw axis. The yaw axis can extend through a point located near the interface between each earphone and the headband. When the headphones are being used by a user, the yaw axis can be substantially parallel to a vector defining the intersection of the user's anatomical sagittal and coronal planes. At 1052, rotation of the earphones about the yaw axis can be detected by a rotation sensor associated with the pivot mechanism. In some embodiments, the pivot mechanism can be similar to pivot mechanism 500 or pivot mechanism 600, which describe yaw axes 506 and 605. At 1054, a determination can be made as to whether a threshold associated with rotation about the yaw axis has been exceeded. In some embodiments, the yaw threshold can be met whenever the earphones pass through a position where the ear-facing faces of the two earphones can directly face each other. In the case where at least one of the earphones passes the threshold and both earphones are determined to be oriented in the same direction at 1056, the audio channels routed to the two earphones may be swapped. In some embodiments, the user may be notified of the change in audio channels. In some embodiments, the amount of roll detected by the swivel mechanism may be factored into the determination of how to allocate audio channels.

[0119] FIG. 10F shows a flowchart describing a response to detection of rotation of an earphone relative to a headband of headphones about a roll axis. The roll axis can pass through a point near the interface between each earphone and the headband. When the headphones are being used by a user, the roll axis can be substantially parallel to a vector defining the intersection of the user's anatomical sagittal and coronal planes. At 1062, rotation of the earphone about the yaw axis can be detected by a rotation sensor associated with the pivoting mechanism. In some embodiments, the pivoting mechanism can be similar to pivoting mechanism 500 or pivoting mechanism 600, which describe roll axis 510 and roll direction 601, respectively. At 1064, a determination can be made as to whether a threshold associated with rotation about the roll axis has been exceeded. In some embodiments, the threshold can be met whenever a spring(s) controlling rotation of the earphone relative to the headband is required to exert a force. In some embodiments, a position sensor, such as a Hall Effect sensor, can be configured to measure the angle of the earphone relative to the roll axis. At 1066, the operational state of the headphones changes when the roll angle of the earbuds relative to the headband indicates that the headphones are transitioning from being in use to being out of use, or vice versa.

[0120] FIG. 10G shows a system-level block diagram of a computing device 1070 that can be used to implement various components described herein, according to some embodiments. In particular, the detailed diagram illustrates various components that can be included in the headphones 1002 illustrated in FIGS. 10A-10D. As shown in FIG. 10G, the computing device 1070 can include a processor 1072, which represents a microprocessor or controller that controls the overall operation of the computing device 1070. The computing device 1070 can include a first earphone 1074 and a second earphone 1076 coupled by a headband assembly, the earphones including speakers that present media content to a user. The processor 1072 can be configured to transmit a first audio channel and a second audio channel to the first earphone 1074 and the second earphone 1076. In some embodiments, the first orientation sensor(s) 1078 can be configured to transmit orientation data of the first earphone 1074 to the processor 1072. Similarly, the second orientation sensor(s) 1080 may be configured to transmit orientation data of the second earphone 1076 to the processor 1072. The processor 1072 may be configured to swap the first audio channel with the second audio channel according to information received from the first orientation sensor 1078 and the second orientation sensor 1080. The data bus 1082 may facilitate data transfer between at least the battery / power source 1084, the wireless communication circuitry 1084, the wired communication circuitry 1082, the computer-readable memory 1080, and the processor 1072. In some embodiments, the processor 1072 may be configured to direct the battery / power source 1084 according to information received by the first orientation sensor 1078 and the second orientation sensor 1080. The wireless communication circuitry 1086 and the wired communication circuitry 1088 may be configured to provide media content to the processor 1072. In some embodiments, the processor 1072 , the wireless communication circuitry 1086 , and the wired communication circuitry 1088 may be configured to transmit information to and receive information from the computer readable memory 1090 .The computer readable memory 1090 may include a single disk or multiple disks (e.g., hard drives) and may include a storage management module that manages one or more partitions within the computer readable memory 1090 . foldable headphones

[0121] 11A-11B illustrate headphones 1100 having a deformable form factor. FIG. 11A illustrates the headphones 1100 including a deformable headband assembly 1102 that can be configured to mechanically and electrically couple earbuds 1104. In some embodiments, the earbuds 1104 can be earcups, and in other embodiments, the earbuds 1104 can be on-ear earbuds. The deformable headband assembly 1102 can be coupled to the earbuds 1104 by foldable stem regions 1106 of the headband assembly 1102. The foldable stem regions 1106 are disposed on opposite ends of the deformable band regions 1108. Each of the foldable stem regions 1106 can include an over-center locking mechanism that allows each of the earbuds 1104 to remain in a flattened state after rotating relative to the deformable band regions 1108. The flattened state refers to the curvature of the deformable band regions 1108 changing to be flatter than in a bowed state. In some embodiments, the deformable band region 1108 will be very flat, but in other embodiments, the curvature may be more variable (as shown in the figures below). The over-center locking mechanism allows the earbud 1104 to remain in the flattened state until the user rotates the over-center locking mechanism again away from the deformable band region 1108. In this way, the user does not have to find a button to change the state, but simply performs the intuitive action of rotating the earbud back into its bowed position.

[0122] FIG. 11B shows one state of the earbuds 1104 rotating against the deformable band region 1108. As described, rotation of only one of the earbuds 1104 relative to the deformable band region 1108 flattens half of the deformable band region 1108. FIG. 11C shows a second state of the earbuds rotating relative to the deformable band region 1108. In this manner, the headphones 1100 can easily transition from the bow-shaped state (i.e., FIG. 11A) to the flattened state (i.e., FIG. 11C). In the flattened state, the size of the headphones 1100 can be reduced to a size equivalent to two earbuds placed end-to-end. In some embodiments, the deformable band region can press into the cushion of the earbud 1104, thereby substantially preventing the headband assembly 1102 from adding to the height of the headphones 1100 in the flattened state.

[0123] 11D-11F show how the earbuds 1104 of the headphones 1150 can be folded toward the outward-facing surface of the deformable band region 1108. FIG. 11D shows the headphones 11D in a bow-shaped state. In FIG. 11E, one state of the earbuds 1104 is folded toward the outward-facing surface of the deformable band region 1108. With the earbuds 1104 in place as described, the force exerted in moving the earbuds 1104 to this position can be on one side of the deformable headband assembly 1102 in a flattened state, while the other side remains in a bow-shaped state. FIG. 11F also shows a second earbud 1104 folded against the outward-facing surface of the deformable band region 1108.

[0124] 12A-12B show an embodiment of headphones in which the headphones can transition from a bowed state to a flattened state by pulling on both ends of a spring band. FIG. 12A shows headphones 1200, which may be headphones 1100 shown in FIG. 11, in a flattened state. In the flattened state, the earbuds 1104 are aligned in the same plane, so that each of the ear pads 1202 faces substantially in the same direction. In some embodiments, the headband assembly 1102 contacts both sides of each of the ear pads 1202 in the flattened state. The deformable band region 1108 of the headband assembly 1102 includes a spring band 1204 and a segment 1206. The spring band 1204 may be prevented from returning the headphones 1200 to the bowed state by locking components of the foldable stem region 1106 that exert a pulling force on each end of the spring band 1204. The segments 1206 may be connected to adjacent segments 1206 by pins 1208. The pins 1208 allow the segments to rotate relative to one another so that the segments 1206 can maintain their shape together but also change shape to conform to a bowed state. Each of the segments 1206 may also have a hole to accommodate a spring band 1204 that passes through each of the segments 1206. The center or pivot segment 1206 may include a fastener 1210 that engages the center of the spring band 1204. The fastener 1210 separates the two sides of the spring band 1204, allowing the earbud 1104 to continuously rotate to the flattened state, as described in FIG. 11B.

[0125] 12A shows each of the foldable stem regions 1106 including three rigid linkages connected together by a pin that pivotally couples the upper linkage 1212, the middle linkage 1214, and the lower linkage 1216 together. Movement of the linkages relative to one another may also be restricted at least in part by a spring pin 1218, which may have a first end coupled to a pin 1220 connecting the middle linkage 1214 to the lower linkage 1216 and a second end engaged within a channel 1222 defined by the upper linkage 1212. The second end of the spring pin 1218 may also be coupled to the spring band 1204, such that the second end of the spring pin 1218 slides within the channel 1222, varying the force exerted on the spring band 1204. The headphones 1200 may be in a flattened state when the first end of the spring pin 1218 reaches an over-center lock position. The over-center locking position keeps earbud 1104 in a flat position until the first end of spring pin 1218 moves far enough to release it from the over-center locking position, at which point earbud 1104 returns to its bowed position.

[0126] FIG. 12B shows the headphones 1200 positioned in the bowed state. In this state, the spring bands 1204 are in a relaxed state with a minimal amount of force stored within the spring bands 1204. In this manner, the neutral state of the spring bands 1204 may be used to define the shape of the headband assembly 1102 in the bowed state when not being actively worn by a user. FIG. 12B also shows how the resting state of the second end of the spring pin 1218 within the channel 1222 and the corresponding reduction in force on the end of the spring bands 1204 enable the spring bands 1204 to assist the headphones 1200 in assuming the bowed state. It should be noted that while substantially all of the spring bands 1204 are depicted in FIGS. 12A-12B , the spring bands 1204 are entirely hidden by the segments 1206 and the upper linkage 1212.

[0127] 12C-12D show side views of the foldable stem region 1106 in the bowed and flattened states, respectively. FIG. 12C shows how a force 1224 exerted by a spring pin 1218 operates to maintain the linkages 1212, 1214, and 1216 in the bowed state. In particular, the spring pin 1218 maintains the linkages in the bowed state by preventing the upper linkage 1212 from rotating about pin 1226 and away from the lower linkage 1216. FIG. 12D shows how a force 1228 exerted by the spring pin 1218 operates to maintain the linkages 1212, 1214, and 1216 in the flattened state. This bistable behavior is made possible by the spring pin 1218 being shifted to the opposite side of the axis of rotation defined by pin 1226 in the flattened state. In this way, linkages 1212-1216 can operate as an over-center locking mechanism. In the flattened state, spring pin 1218 resists transitioning the headphones from the flattened state to the bowed state, but a user exerting a sufficiently large rotational force on earbud 1104 can overcome the force exerted by spring pin 1218 to transition the headphones between the flat and bowed states.

[0128] 12E shows a side view of one end of headphones 1200 in a flattened state. This view shows ear pads 1202 with contours configured to follow the curvature of a user's head. The contours of ear pads 1202 can also help prevent headband assembly 1102, and in particular segments 1206 comprising headband assembly 1102, from protruding significantly farther vertically than ear pads 1202. In some embodiments, the collapse of central portions of ear pads 1202 may be caused at least in part by pressure exerted on them by segments 1206.

[0129] 13A-13B show partial cross-sectional views of headphones 1300 that use an off-axis cable to transition between a bowed state and a flattened state. FIG. 13A shows a partial cross-sectional view of headphones 1300 in the bowed state. Headphones 1300 differ from headphones 1200 in that when earbud 1104 rotates toward headband assembly 1102, cable 1302 tightens to flatten deformable band region 1108 of headband assembly 1102. Cable 1302 may be formed from a highly stretchable cable material such as Nitinol™, a nickel-titanium alloy. Close-up view 1303 shows how deformable band region 1108 can include many segments 1304 that are fastened to spring band 1204 by fasteners 1306. In some embodiments, fasteners 1306 may also be secured to spring band 1204 by O-rings to prevent any rattle of fasteners 1306 while headphones 1300 are in use. One of the centers of the segments 1304 may include a sleeve 1308 that prevents the cable 1302 from sliding relative to one of the centers of the segments 1304. The other segment 1304 may include a metal pulley 1310 that prevents the cable 1302 from experiencing a significant amount of friction as the cable 1302 is pulled to flatten the headphones 1300. Figure 13A also shows how each end of the cable 1302 is secured to a rotating clamp 1312. As the foldable stem region 1106 rotates, the rotating clamp 1312 prevents the ends of the cable 1302 from twisting.

[0130] FIG. 13B shows a partial cross-sectional view of headphones 1300 in a flattened state. Rotating clamp 1312 is shown in a different rotational position to accommodate changes in the orientation of cable 1302. The new position of rotating clamp 1312 also creates an over-center locking position that prevents headphones 1300 from unintentionally returning to the bowed state described above relative to headphones 1200. FIG. 13B shows how the curved shape of each of segments 1304 allows segments 1304 to rotate relative to one another to transition between the bowed state and the flattened state. In some embodiments, cable 1302 may also be operable to limit the range of motion of spring band 1204, similar in some respects to the embodiment shown in FIGS. 9A-9B.

[0131] FIG. 14A shows headphone 1400 that is similar to headphone 1300. Notably, headphone 1400 also uses cable 1302 to flatten deformable band region 1108. Furthermore, a central portion of cable 1302 is held by center segment 1304. In contrast, lower linkage 1216 of foldable stem region 1106 is shifted upward relative to lower linkage 1216 depicted in FIG. 12A . When earbud 1104 rotates about axis 1402 toward deformable band region 1108, spring pin 1404 is configured to extend during a first portion of the rotation, as shown in FIG. 14B . In some embodiments, extension of spring pin 1404 can allow the earbud to rotate approximately 30 degrees from an initial position. Once the spring pins 1404 reach their maximum length, further rotation of the earbuds 1104 about the axis 1402 causes the cable 1302 to tension, causing the deformable band region 1108 to change from an arched shape to a flat shape, as shown in FIG. 14C. The delayed tensioning motion changes the angle from which the cable 1302 was initially tensioned. The changed initial angle can reduce the likelihood of the cable 1302 becoming wrapped as the headphones 1400 transition from the arched state to the flattened state.

[0132] 15A-15F show various views of headband assembly 1500 from different angles and in different states. Headband assembly 1500 has a bistable configuration that adapts to transitions between a flattened state and a bowed state. FIGS. 15A-15C depict headband assembly 1500 in the bowed state. Bistable wires 1502 and 1504 are depicted within a flexible headband housing 1506. The headband housing may be configured to change shape to adapt to at least the flattened and bowed states. Bistable wires 1502 and 1504 extend from one end of headband housing 1506 to the other and are configured to apply a clamping force to a user's head through earbuds attached to each end of headband assembly 1500 to maintain an associated pair of headphones securely in place during use. 15C particularly shows how the headband housing 1506 can be formed from multiple hole links 1508, which may be hinged together to cooperatively form a cavity in which the bi-stable wire 1502 can transition between configurations corresponding to the bowed state and the flattened state. Because only the links 1508 are hinged on one side, only the links can move to the bowed state in one direction. This helps avoid the unfortunate situation where the headband assembly 1500 bends in the wrong direction, thereby misorienting the earbuds.

[0133] 15D-15F show the headband assembly in a flattened state. The bi-stable wires 1502 and 1504 now help maintain the headband assembly 1500 in a flattened state because the ends of the bi-stable wires 1502 and 1504 have passed an over-center point where the ends of the wires 1502 and 1504 are higher than the center portions of the bi-stable wires 1502 and 1504. In some embodiments, the bi-stable wires 1502 may also be used to carry signals and / or provide power from one earbud to another through the headband assembly 1500.

[0134] 16A-16B show headband assembly 1600 in a folded and bowed state. FIG. 16A shows headband assembly 1600 in a bowed state. Similar to the embodiment shown in FIGS. 15C and 15F, the headband assembly includes a plurality of aperture links 1602 that cooperate to form a flexible headband housing that defines an interior volume. A passive linkage hinge 1604 may be positioned within a central portion of the interior volume and link bi-stable elements 1606 and 1608. FIG. 16A shows bi-stable elements 1606 and 1608 in a bowed configuration that resists forces acting to compress the sides of headband assembly 1600. When the sides of the headband assembly 1600 are pushed together in the directions indicated by arrows 1610 and 1612 with sufficient force to overcome the resistance created by the bi-stable elements 1606 and 1608, the headband assembly 1600 can transition from the bowed state depicted in FIG. 16A to the flattened state depicted in FIG. 16B. The passive linkage hinge 1604 accommodates the headphone assembly 1600 folding around a central region 1614 of the headband assembly 1600. FIG. 16B shows how the passive linkage hinge 1604 flexes to accommodate the flattened state of the headband assembly 1600. The bi-stable elements 1606 and 1608 are shown configured in a folded configuration to bias the sides of the headband assembly 1600 toward each other, thereby resisting unintentional changes in state. As depicted in FIG. 16B, the folded configuration has the advantage of occupying little space by allowing the open area defined by headband assembly 1600 to collapse as it fits over the user's head, thereby allowing headband assembly 1600 to occupy less space when not actually in use.

[0135] 17A-17B show various views of foldable headphones 1700. In particular, FIG. 17A shows a top view of headphones 1700 in a flattened state. A headband 1702 extending between earbuds 1704 and 1706 includes wires 1708 and springs 1710. In the depicted flattened state, wires 1708 and springs 1710 are straight and in a relaxed or neutral state. FIG. 17B shows a side view of headphones 1700 in a bowed state. Headphones 1700 can transition from the flattened state depicted in FIG. 17A to the bowed state depicted in FIG. 17B by rotating earbuds 1704 and 1706 away from headband 1702. Each of earbuds 1704 and 1706 includes an over-center mechanism 1712 that applies tension to the end of wire 1708 to maintain the taut wire 1708 in order to maintain the bowed state of headband 1702. Wire 1708 helps maintain the shape of headband 1702 by exerting force at multiple locations along spring 1710 through wire guides 1714, which are distributed at regular intervals along headband 1702.

[0136] While each of the above improvements has been discussed in isolation, it should be appreciated that any of the above improvements may be combined. For example, a synchronized telescoping earphone may be combined with a low spring constant band embodiment. Similarly, an off-center pivoting earphone design may be combined with a deformable form factor headphone design. In some embodiments, each type of improvement may be combined together to create a headphone with all the described advantages.

[0137] A headphone is disclosed, the headphone including a first earphone, a second earphone, and a headband configured to couple the first earphone and the second earphone together and synchronize movement of the first earphone with movement of the second earphone such that a distance between the first earphone and a center of the headband remains substantially equal to a distance between the second earphone and a center of the headband.

[0138] In some embodiments, the headband includes a loop of cable routed therethrough.

[0139] In some embodiments, the first stem of the first earbud is coupled to the loop of cable and the second stem of the second earbud is coupled to the loop of cable.

[0140] In some embodiments, the loop of cable is configured to route an electrical signal from the first earbud to the second earbud.

[0141] In some embodiments, the headband includes two parallel leaf springs that define the shape of the headband.

[0142] In some embodiments, the headband includes a gear located in a central portion of the headband that engages gear teeth on stems associated with the first earbud and the second earbud.

[0143] In some embodiments, the headband includes a loop of wire disposed within the headband, a first stem wire coupling a first earbud to a first side of the loop of wire, and a second stem wire coupling a second earbud to a second side of the loop of wire.

[0144] In some embodiments, the headphones also include a data synchronization cable that extends from the first earbud to the second earbud through a channel defined by the headband, the data synchronization cable carrying signals between electrical components of the first earbud and the second earbud.

[0145] In some embodiments, a first portion of the data synchronization cable is wrapped around a first stem wire and a second portion of the data synchronization cable is wrapped around a second stem wire.

[0146] Disclosed is a headphone including: a headband having a first end and a second end opposite the first end; a first earphone coupled to the headband a first distance from the first end; a second earphone coupled to the headband a second distance from the second end; and a cable routed through the headband mechanically coupling the first earphone to the second earphone, the cable configured to maintain the first distance substantially the same as the second distance by changing the first distance in response to a change in the second distance.

[0147] In some embodiments, the cable is disposed in a loop, with a first earbud coupled to a first side of the loop and a second earbud coupled to a second side of the loop.

[0148] In some embodiments, the headphones also include stem housings coupled to opposite ends of the headband, each of the stem housings enclosing a pulley around which the cable is wrapped.

[0149] In some embodiments, the headphones also include wire guides distributed across the headband to route the cables through the headband.

[0150] Disclosed is a headphone including a first earphone, a second earphone, and a headband assembly coupling the first earphone and the second earphone together and including an earphone synchronization system, the earphone synchronization system configured to change a first distance between the first earphone and the headband assembly simultaneously with a change in a second distance between the second earphone and the headband assembly.

[0151] In some embodiments, the headphones also include a first member and a second member coupled to opposite ends of the headband assembly, each of the first member and the second member configured to fit into a channel defined by a respective end of the headband assembly.

[0152] In some embodiments, the headphones are as recited in claim 34, wherein the earphone synchronization system includes a first stem wire coupled to the first earphone and a second stem wire coupled to the second earphone.

[0153] In some embodiments, the first stem wire is coupled to the second stem wire within a channel disposed within a central region of the headband assembly.

[0154] In some embodiments, the headphones include a reinforcing member disposed within the headband assembly and defining a channel within which the first stem wire and the second stem wire are coupled together.

[0155] In some embodiments, the earphone synchronization system includes a first stem wire having a first end coupled to the first earphone and a second end coupled to a second end of a second stem wire, the first end of the second stem wire being coupled to the second earphone.

[0156] In some embodiments, the second end of the first stem wire is oriented in the same direction as the second end of the second stem wire.

[0157] A headphone is disclosed, the headphone including a first earphone, a second earphone, a headband coupling the first earphone to the second earphone, an earphone position sensor configured to measure angular orientations of the first earphone and the second earphone relative to the headband, and a processor configured to change an operational state of the headphone according to the angular orientations of the first earphone and the second earphone.

[0158] In some embodiments, changing the operational state of the headphones includes switching audio channels routed to the first earphone and the second earphone.

[0159] In some embodiments, the earbud position sensor is configured to measure the position of the first earbud and the second earbud relative to a respective yaw axis of the earbuds.

[0160] In some embodiments, the earbud position sensor includes a time-of-flight sensor.

[0161] In some embodiments, the headphones also include a pivot mechanism coupling the first earbud to the headband, and the earbud position sensor includes a Hall Effect sensor positioned within the pivot mechanism and configured to measure the angular orientation of the first earbud.

[0162] In some embodiments, the operating state is a playback state.

[0163] In some embodiments, the headphones also include a secondary sensor disposed in the first earbud and configured to confirm a sensor reading provided by the earbud position sensor.

[0164] In some embodiments, the secondary sensor is a strain gauge.

[0165] Disclosed is a headphone including: a headband; a first earphone pivotably coupled to a first side of the headband and having a first axis of rotation; a second earphone pivotably coupled to a second side of the headband and having a second axis of rotation; an earphone position sensor configured to measure an orientation of the first earphone relative to the first axis of rotation and an orientation of the second earphone relative to the second axis of rotation; and a processor configured to place the headphones in a first operating state when the first earphone deflects in a first direction from a neutral state of the first earphone and the second earphone deflects in a second direction opposite the first direction from the neutral state of the second earphone, and to place the headphones in a second operating state when the first earphone deflects in the second direction from the neutral state of the first earphone and the second earphone deflects in the first direction from the neutral state of the second earphone.

[0166] In some embodiments, in a first operating state, the left audio channel is routed to the first earphone, and in a second operating state, the left audio channel is routed to the second earphone.

[0167] In some embodiments, the earbud position sensor is a time-of-flight sensor.

[0168] In some embodiments, the headphones include a swivel mechanism configured to accommodate rotation of the first earbud about a first axis of rotation and about a third axis of rotation substantially orthogonal to the first axis of rotation.

[0169] In some embodiments, one of the earbud position sensors is positioned on a bearing that accommodates rotation of the first earbud about the first axis of rotation.

[0170] In some embodiments, the earbud position sensor includes a magnetic field sensor and a permanent magnet.

[0171] In some embodiments, the magnetic field sensor is a Hall effect sensor.

[0172] In some embodiments, the pivot mechanism includes a leaf spring that accommodates rotation of the earbud about a third axis of rotation.

[0173] In some embodiments, the earbud position sensor includes a strain gauge positioned on the leaf spring that measures rotation of the first earbud about the third axis of rotation.

[0174] Disclosed is a headphone comprising: a headband; a first earphone including a first earphone housing; a first pivot mechanism disposed within the first earphone housing, the first pivot mechanism including a first stem base portion protruding through an opening defined by the first earphone housing, the first stem base portion being coupled to a first portion of the headband; and a first orientation sensor configured to measure an angular orientation of the first earphone relative to the headband; a second earphone including a second earphone housing; and a second pivot mechanism disposed within the second earphone housing, the second pivot mechanism being coupled to a first portion of the headband. a second pivot mechanism including a second stem base portion that protrudes through an opening defined by the body, the second stem base portion coupled to a second portion of the headband; and a second orientation sensor configured to measure an angular orientation of the second earbud relative to the headband; and a processor configured to transmit a first audio channel to the first earbud when sensor readings received from the first orientation sensor and the second orientation sensor correspond to the first earbud over a first ear of the user, and to transmit a second audio channel to the first earbud when the sensor readings correspond to the first earbud over a second ear of the user.

[0175] In some embodiments, the first pivot mechanism accommodates rotation of the first earbud about two substantially orthogonal axes of rotation.

[0176] In some embodiments, the first orientation sensor and the second orientation sensor are magnetic field sensors.

[0177] Disclosed are headphones including a first earphone having a first earpad, a second earphone having a second earpad, and a headband connecting the first earphone to the second earphone, the headphones configured to move between an arched state in which a flexible portion of the headband is curved along its length and a flattened state in which the flexible portion of the headband is flattened along its length, the first earphone and the second earphone configured to fold toward the headband such that the first earpad and the second earpad contact the flexible headband in the flattened state.

[0178] In some embodiments, the headband includes a foldable stem region at each end of the headband, the foldable stem region coupling the headband to the first earbud and the second earbud and allowing the earbuds to fold towards the headband.

[0179] In some embodiments, the foldable stem region includes an over-center locking mechanism that prevents the headphones from unintentionally transitioning from a flattened state to a bowed state.

[0180] In some embodiments, the headband is formed from a multiple hole linkage.

[0181] In some embodiments, the headphones also include a data synchronization cable electrically coupling the first earbud and the second earbud and extending through the hole linkage.

[0182] A headphone is disclosed, the headphone including a first earphone, a second earphone, and a headband assembly coupled to both the first earphone and the second earphone, the headband assembly including a linkage pivotally coupled together, and an over-center locking mechanism coupling the first earphone to a first end of the headband assembly and having a first stable position in which the linkage is flattened and a second stable position in which the linkage forms an arch.

[0183] In some embodiments, the headband assembly further includes one or more wires extending through the linkage.

[0184] In some embodiments, one or more of the linkages includes a pulley that carries one or more wires.

[0185] In some embodiments, one of the linkages defines a channel for an over-center locking mechanism.

[0186] In some embodiments, the headphones transition from the second stable position to the first stable position when the first earbud and the second earbud are folded toward the headband assembly.

[0187] In some embodiments, the first earbud includes an earpad having an outwardly facing surface defining a channel sized to receive a portion of the headband assembly in the first stable position.

[0188] Disclosed are headphones including a first earphone, a second earphone, and a flexible headband assembly coupled to both the first earphone and the second earphone, the flexible headband assemblies pivotally coupled together and including a hole linkage defining an interior volume within the flexible headband assembly, and a bistable element disposed within the interior volume and configured to resist transition of the flexible headband assembly between a first state in which a central portion of the hole linkage is straightened and a second state in which the hole linkage forms a bow.

[0189] In some embodiments, the bi-stable element has a first shape when the flexible headband assembly is in a first state and a second shape different from the first shape when the flexible headband assembly is in a second state.

[0190] In some embodiments, the bistable element includes a wire extending through a hole linkage.

[0191] In some embodiments, the headphones also include an over-center mechanism through which the wire extends.

[0192] In some embodiments, the wire is taut when the flexible headband assembly is in the first state and is in a neutral state when the flexible headband assembly is in the second state.

[0193] In some embodiments, each of the hole linkages has a rectangular shape.

[0194] In some embodiments, the hole linkages are joined together by pins.

[0195] In some embodiments, one or more of the aperture linkages includes a pulley configured to guide one or more of the bi-stable elements through the flexible headband assembly.

[0196] In some embodiments, the flexible headband assembly further includes a spring band extending through the flexible headband assembly.

Claims

1. The earphone housing and a speaker disposed within a central portion of the earphone housing; a pivot mechanism disposed at a first end of the earphone housing, the pivot mechanism comprising: The stem and a spring configured to oppose rotation of the earphone housing relative to the stem, the spring including a first end coupled to the stem and a second end coupled to the earphone housing.

2. a first sensor configured to measure the rotation of the stem about a first axis; a processor configured to change an operational state of the speaker in response to the rotation of the stem exceeding a predetermined threshold; The earphone of claim 1 further comprising:

3. The earphone of claim 2 , further comprising a second sensor configured to measure rotation of the stem about a second axis.

4. The earphone of claim 3 , wherein the first axis is a roll axis and the second axis is a yaw axis.

5. The earphone of claim 1 , wherein the stem rotates about an axis of rotation that is closer to the first end of the earphone housing than the speaker.

6. The earphone of claim 1 , wherein the stem is configured to attach the earphone housing to a headband of headphones.

7. A first earphone; A second earphone; a headband assembly including a headband spring; a first pivot assembly connecting the first earbud to a first side of the headband assembly, the first pivot assembly comprising: A first stem; a first pivotal spring configured to resist rotation of the first earbud relative to the first stem, the first pivotal spring including a first end coupled to the first earbud and a second end coupled to the first stem; a first pivot assembly including: a second pivot assembly connecting the second earbud to a second side of the headband assembly, the second pivot assembly comprising: a second stem; and a second pivotal spring configured to resist rotation of the second earbud relative to the second stem, the second pivotal spring including a first end coupled to the second earbud and a second end coupled to the second stem; and a second pivot assembly including: Equipped with headphones.

8. 8. The headphones of claim 7, wherein the headband spring and the first and second pivotal springs are configured to cooperatively exert a desired amount of force through the first and second earphones.

9. The headphones of claim 7 , wherein the first stem extends to the first earbud through an opening defined by the first earbud.

10. The headphones of claim 7 , wherein the first pivot assembly further includes a third pivot spring substantially parallel to the first pivot spring.

11. The headphone of claim 10 , wherein the first pivot spring and the third pivot spring of the first pivot assembly oppose rotation of the first earbud.

12. A first earphone; A second earphone; a headband assembly including a headband spring; a first swivel assembly and a second swivel assembly connecting opposite sides of the headband assembly to the first earphone and the second earphone, respectively, each of the swivel assemblies being substantially enclosed within the first earphone and the second earphone, respectively, and a stem of each of the swivel assemblies coupling the stem of each swivel assembly to the headband assembly; Equipped with headphones.

13. The headphones of claim 12 , wherein the first pivot assembly and the second pivot assembly each include a leaf spring.

14. 14. The headphone of claim 13, wherein the first pivot assembly includes a strain gauge configured to measure movement of the stem of the first earbud relative to an outer housing of the first earbud.

15. 13. The headphones of claim 12, further comprising a processor, wherein the first pivot assembly further includes a permanent magnet and a magnetic field sensor positioned to measure movement of the permanent magnet, and the processor is configured to determine an amount of rotation of the stem relative to a housing of the first pivot assembly based on the movement of the permanent magnet.

16. 13. The headphones of claim 12, further comprising a mechanism disposed within the headband assembly that prevents the headband spring from returning to a neutral state and maintains a minimum distance between the first earbud and the second earbud.

17. 13. The headphone of claim 12, wherein the first pivot assembly includes a mechanical stop that limits the amount of rotation of the stem of the first pivot assembly relative to a housing of the first earbud.

18. 13. The headphones of claim 12, wherein the stem of the first pivot assembly pivots about an axis of rotation that is closer to the first end of the earphone housing than a speaker disposed within the earphone housing of the first earphone.

19. 20. The headphone of claim 18, wherein the first pivot assembly further includes a yaw sensor configured to measure an amount of rotation of the stem of the first earbud relative to a housing of the first earbud.

20. The headphones of claim 12 , wherein the first pivot assembly includes a first helical orbital spring and a second helical orbital spring adjacent to the first helical orbital spring.

Images