Forming device
The molding device addresses wear issues by using an R-structured spring plate to displace contact points and distribute load, enhancing product quality and component longevity.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2026-03-11
AI Technical Summary
Wear caused by contact between a spring plate and a base plate affects the quality of molded products due to changes in the curved shapes of the spring plate and upper die during the molding process.
A molding device with a spring plate featuring an R structure at both ends, which displaces the contact points between the spring plate and base plate as the press load increases, allowing the curved surfaces to deform and approach a flat surface, thereby distributing the load and reducing wear.
The device suppresses wear between the spring plate and base plate, stabilizes the quality of molded products, and extends the lifespan of the components by distributing the contact pressure and preventing localized wear.
Smart Images

Figure 2026042562000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a molding apparatus. [Background technology]
[0002] BACKGROUND ART A manufacturing method is known in which an electronic component is manufactured by pressing a curved elastic resin plate (corresponding to an upper mold) to push out air from within a resin sheet that is a molded product (see Patent Document 1). [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Patent Publication No. 2021-174932 Summary of the Invention [Problem to be solved by the invention]
[0004] When molding an object, the spring plate is pressed against the upper and lower dies via the base plate to mold the object. The upper die is attached to a curved spring plate and curves to match the shape of the spring plate. In this case, both ends of the spring plate come into contact with the base plate, and these contact points wear out. As wear progresses, the curved shapes of the spring plate and the upper die change, affecting the quality of the molded product.
[0005] The present invention provides a molding device that can suppress wear caused by contact between a spring plate and a base plate. [Means for solving the problem]
[0006] A molding device according to one embodiment of the present invention is a molding device for press-molding a resin sheet that is a resin separator for a fuel cell, and comprises: a lower mold on which the resin sheet is placed; an upper mold arranged opposite the lower mold; a spring plate having a first surface and a second surface opposite to the thickness direction of the plate, the central portion of which in the first direction intersecting the thickness direction of the plate being curved so as to protrude opposite to the second surface, and to which the upper mold is attached so as to contact the first surface; and a base plate that presses the spring plate to bring the upper mold closer to the lower mold, wherein an R structure that has been subjected to R processing is formed at both ends of the second surface of the spring plate in the first direction, and as the press load pressing the spring plate increases, the curved first surface and second surface deform to approach a flat surface, and the contact point between the second surface and the base plate is displaced in the first direction from a first position far from the center to a second position closer to the center. [Effects of the Invention]
[0007] According to one aspect of the present invention, it is possible to provide a molding device that can suppress wear caused by contact between a spring plate and a base plate. [Brief explanation of the drawings]
[0008] [Figure 1] FIG. 1 is a cross-sectional view showing a molding device according to a first embodiment. [Figure 2] FIG. 4 is an enlarged cross-sectional view showing a contact portion between a spring plate and a base plate. [Figure 3] 10 is a graph showing the contact surface pressure between the spring plate and the base plate in the forming device according to the comparative example. [Figure 4] 4 is a graph showing the contact surface pressure between the spring plate and the base plate in the forming device according to the first embodiment. [Figure 5] FIG. 10 is an enlarged cross-sectional view showing a contact portion between a spring plate and a base plate in a forming device according to a second embodiment. [Figure 6] FIG. 10 is an enlarged cross-sectional view showing a contact portion between a spring plate and a base plate in a forming device according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0010] [Forming apparatus 100 according to the first embodiment] FIG. 1 is a cross-sectional view showing a molding apparatus 100 according to the first embodiment. FIG. 2 is an enlarged cross-sectional view showing the contact portion between the spring plate 40 and the base plate 50. Note that in FIGS. 1 and 2, arrows are shown indicating the X-axis direction, the Y-axis direction, and the Z-axis direction, which intersect with one another. The X-axis direction may be, for example, a direction along the longitudinal direction of the resin sheet 10. The Z-axis direction may be, for example, a direction along the thickness direction of the resin sheet 10. The Z-axis direction may be an up-down direction. The X-axis direction includes the direction indicated by the arrow and the opposite direction. The Y-axis direction includes the direction indicated by the arrow and the opposite direction. The Z-axis direction includes the direction indicated by the arrow and the opposite direction.
[0011] The molding apparatus 100 shown in Fig. 1 is an apparatus for press-molding a resin sheet 10, which is a resin separator for a fuel cell. The molding apparatus 100 includes a lower mold 20, an upper mold 30, a spring plate 40, and a base plate 50. Fig. 1 shows the molding apparatus 100 before the resin sheet 10 is press-molded.
[0012] The resin sheet 10 has an upper surface 11 and a lower surface 12 that face each other in the Z-axis direction. For example, an uneven shape is formed on the upper surface 11 and the lower surface 12. A plurality of voids 14 are formed in the resin sheet 10 before press molding. The resin sheet 10 is, for example, a resin sheet in which reinforcing fibers or the like are impregnated with a matrix resin.
[0013] A plurality of resin sheets 10 are stacked in the thickness direction when used. Flow paths through which a fluid flows are formed between the plurality of resin sheets 10.
[0014] For example, a stack of polymer electrolyte fuel cells (PEFC) has conductive resin separators between each cell. The resin separators have manifolds that supply fuel gas (hydrogen) and oxidant gas (air) and gas channels that circulate these gases to the power generation section. The separators have an uneven shape to form the channels.
[0015] In the molding device 100, the resin sheet 10 is placed on the upper surface 21 of the lower mold 20. The upper mold 30 is disposed opposite the lower mold 20 in the Z-axis direction. The resin sheet 10 is disposed between the lower mold 20 and the upper mold 30. A pattern to be transferred to the lower surface 12 of the resin sheet 10 is formed on the upper surface 21 of the lower mold 20.
[0016] The upper mold 30 is plate-shaped and elastic. The upper mold 30 has an upper surface 31 and a lower surface 32 that face each other in the plate thickness direction. The upper mold 30 is attached to the spring plate 40 and deforms to fit the shape of the spring plate 40. The lower surface 32 is disposed opposite the upper surface 11 of the resin sheet 10 in the Z-axis direction. A pattern to be transferred to the upper surface 11 of the resin sheet 10 is formed on the lower surface 32.
[0017] The spring plate 40 has an upper surface 41 and a lower surface 42 that face each other in the thickness direction. The thickness of the spring plate 40 may be thicker than the thickness of the upper mold 30, for example. The lower surface 42 is disposed opposite the upper surface 31 of the upper mold 30 in the Z-axis direction. In the X-axis direction, the central portion of the spring plate 40 is curved so as to protrude downward more than both end portions. The spring plate 40 is curved when no load is applied.
[0018] The upper die 30 is attached to the spring plate 40 by a plurality of fastening bolts 60. The upper surface 31 of the upper die 30 abuts against the lower surface 42 of the spring plate 40. The fastening bolts 60 penetrate the spring plate 40 in the plate thickness direction and hold the upper die 30. The upper die 30 can be deformed integrally with the spring plate 40.
[0019] The base plate 50 is disposed above the spring plate 40 and presses against the spring plate 40. A lower surface 51 of the base plate 50 is disposed opposite the spring plate 40 in the Z-axis direction. The lower surface 51 of the base plate 50 includes a plane parallel to the XY plane. The lower surface 51 includes a surface that contacts the spring plate 40. The base plate 50 is driven using hydraulics, for example. When no load is applied, the center of the spring plate 40 in the X-axis direction is disposed away from the lower surface 51 of the base plate 50. Both ends of the spring plate 40 in the X-axis direction are in contact with the lower surface 51 of the base plate 50. The base plate 50 is longer than the spring plate 40 in the X-axis direction. The base plate 50 is formed to extend outward beyond the side surface 43 of the spring plate 40 in the X-axis direction.
[0020] The spring plate 40 is temporarily fixed to the base plate 50 via the suspension bolts 70. When a load is applied to the base plate 50, the spring plate 40 is pressed in a direction approaching the resin sheet 10. When a load is applied to the base plate 50, the base plate 50 presses the spring plate 40, causing the spring plate 40 to deform. The upper surface 41 and the lower surface 42 of the spring plate 40 deform to approach a flat surface. The upper surface 41 and the lower surface 42 deform to become flat surfaces along the XY plane. The upper mold 30 deforms in accordance with the deformation of the spring plate 40. When the load acting on the spring plate 40 is removed, the spring plate 40 returns to its curved shape. The suspension bolts 70 are displaced relative to the base plate 50 in accordance with the deformation of the spring plate 40. The suspension bolts 70 are displaceable in the Z-axis direction.
[0021] The base plate 50 may be formed with openings in which a plurality of fastening bolts 60 are disposed, and the spring plate 40 may be formed with steps in which the heads of the fastening bolts 60 are disposed. The base plate 50 is formed with openings in which the suspension bolts 70 are disposed. The base plate 50 is formed with steps in which the heads of the suspension bolts 70 are disposed.
[0022] Next, we will explain the R structures 81 formed on both ends of the spring plate 40. As shown in Fig. 2, the R structures 81 are formed on the top surface 41 of the spring plate 40. The R structures 81 are provided on both ends of the top surface 41 in the X-axis direction.
[0023] The upper surface 41 of the spring plate 40 includes a curved surface 91 and an R structure 81. The curved surface 91 is formed in the center of the upper surface 41 in the X-axis direction. The curved surface 91 is formed to be concave downward. The center of the radius of curvature of the curved surface 91 is located above the spring plate 40. The curved surface 91 is formed when no load is applied to the spring plate 40. When a load is applied to the spring plate 40, the curved surface 91 deforms so that the curvature becomes gentler. The curved surface 91 deforms to approach a flat surface, and eventually becomes flat and comes into contact with the lower surface 51 of the base plate 50.
[0024] The R structure 81 is disposed outside the curved surface 91 in the X-axis direction. The curved surface 91 is formed between the curved surface 91 and the side surface 43. The center of the curvature radius of the R structure 81 is disposed below the upper surface 41.
[0025] The positions of contact points P101, P102, and P103 between the spring plate 40 and the base plate 50 are displaced depending on the magnitude of the load. When the load transmitted from the base plate 50 to the spring plate 40 increases, the spring plate 40 is deformed. When the curved surface 91 deforms to approach a flat surface, contact points P101 to P101 are generated in this order.
[0026] For example, when the load is small, the curvature of the curved surface 91 is large, and the spring plate 40 and the base plate 50 come into contact at a contact portion P101 close to the side surface 43. When the load increases, the curvature of the curved surface 91 deforms to decrease, and the spring plate 40 and the base plate 50 come into contact at a contact portion P102 more inward than the contact portion P101. When the load further increases, the curved surface 91 deforms to become closer to a flat surface, and the spring plate 40 and the base plate 50 come into contact at a contact portion P103 more inward than the contact portion P102. As the load increases, the positions of the contact portions P101 to P103 between the spring plate 40 and the base plate 50 are displaced away from the side surface 43. The contact portions P101 to P103 may have a predetermined length in the X-axis direction. The lengths of the contact portions P101 to P103 in the X-axis direction may be longer in the order of contact portion P101, contact portion P102, and contact portion P103.
[0027] When the load is reduced from a state in which curved surface 91 is nearly flat, curved surface 91 deforms so that its curvature increases. As the curvature increases, the gap between upper surface 41 and lower surface 51 increases in the Z-axis direction. At this time, contact portions P103, P102, and P101 between spring plate 40 and base plate 50 are displaced outward in the X-axis direction.
[0028] Next, the contact pressure between the spring plate and the base plate in a molding apparatus according to a comparative example will be described. Fig. 3 is a graph showing the contact pressure between the spring plate and the base plate in a molding apparatus according to a comparative example. The molding apparatus according to the comparative example differs from the molding apparatus 100 according to the first embodiment in that the R structure 81 is not formed on both ends of the spring plate 40. In the molding apparatus according to the comparative example, a curved surface 91 is formed over the entire upper surface 41 of the spring plate 40.
[0029] In FIG. 3, the horizontal axis indicates the position (mm) in the longitudinal direction (X-axis direction) of the spring plate 40. The positions X11, X12, X13, X15, and X16 are positions farthest from the center in the longitudinal direction of the spring plate 40, in that order. Position X11 is closest to the center, and position X16 is farthest from the center. The side surface 43 is located between positions X15 and X16. Positions X11, X12, X13, X15, and X16 are equally spaced apart.
[0030] In FIG. 3, the vertical axis represents the contact pressure (MPa) between the spring plate 40 and the base plate 50. The contact pressures increase in order from P10, P20, P30, P40, P50, and P60. The contact pressure P10 is the smallest value among the contact pressures P10 to P60. The contact pressure P60 is the largest value among the contact pressures P10 to P60.
[0031] In the molding apparatus according to the comparative example, the load acting on the spring plate 40 from the base plate 50 was gradually increased, and the contact position and contact pressure between the spring plate 40 and the base plate 50 were measured. The results are shown in FIG.
[0032] The loads K10, K20, K30, K40, K50, K100, K150, and K200 have increasing values in this order. The load K10 has the smallest value, and the load K200 has the largest value.
[0033] In the comparative example, as the load increased, the position where the contact pressure peaked did not shift in the X-axis direction but remained at approximately the same position. In the comparative example, as the load increased, the position where the contact pressure peaked shifted slightly outward in the X-axis direction.
[0034] Next, the contact pressure between the spring plate 40 and the base plate 50 in the molding apparatus 100 according to the first embodiment will be described. Fig. 4 is a graph showing the contact pressure between the spring plate 40 and the base plate 50 in the molding apparatus 100 according to the first embodiment.
[0035] In FIG. 4, the horizontal axis indicates the position (mm) in the longitudinal direction (X-axis direction) of the spring plate 40. The positions X21, X22, X23, X25, and X26 are positions farthest from the center in the longitudinal direction of the spring plate 40, in that order. Position X21 is closest to the center, and position X26 is farthest from the center. The side surface 43 is located between positions X25 and X26. Positions X21, X22, X23, X25, and X26 are spaced equally apart. The distances between positions X21, X22, X23, X25, and X26 are the same as the distances between positions X11, X12, X13, X15, and X16. For example, the distance between positions X21 and X22 is the same as the distance between positions X11 and X12.
[0036] 4, the vertical axis represents the contact surface pressure (MPa) between the spring plate 40 and the base plate 50. The contact surface pressures P10, P20, P30, P40, P50, and P60 have the same values as the contact surface pressures P10, P20, P30, P40, P50, and P60 shown in FIG.
[0037] In the molding apparatus 100 according to the first embodiment, the load acting on the spring plate 40 from the base plate 50 was gradually increased, and the contact position and contact pressure between the spring plate 40 and the base plate 50 were measured. The results are shown in FIG.
[0038] In the first embodiment and the comparative example, the same loads K10, K20, K30, K40, K50, K100, K150, and K200 were applied.
[0039] In the molding apparatus 100 according to the first embodiment, as the load increased, the position where the contact pressure peaked shifted inward so as to approach the center in the X-axis direction. In the molding apparatus 100 according to the first embodiment, the contact pressure increased as the load increased.
[0040] The maximum value of the contact surface pressure in the molding apparatus 100 according to the first embodiment was, for example, 1 / 3 or less of the maximum value of the contact surface pressure in the molding apparatus according to the comparative example.
[0041] [Actions and Effects of the Molding Apparatus 100 According to the First Embodiment] The molding apparatus 100 according to the first embodiment is a molding apparatus for press-molding a resin sheet 10, which is a resin separator for a fuel cell, by placing it between an upper mold 30 and a lower mold 20. The molding apparatus 100 has a lower surface (first surface) 42 and an upper surface (second surface) 41 that face each other in the thickness direction of the sheet, and the central portion in the X-axis direction (first direction, longitudinal direction) that intersects the thickness direction of the sheet is curved so as to protrude to the opposite side from the upper surface 41, and the upper mold 30 is attached so as to come into contact with the lower surface 42. The molding apparatus 100 also includes a spring plate 40 that is attached to the upper mold 30 so as to come into contact with the lower mold 20. and a base plate 50 that presses the plate 40, and an R structure is formed by R processing at both ends of the upper surface 41 of the spring plate 40 in the X-axis direction, and as the press load pressing the spring plate 40 increases, the curved lower surface 42 and upper surface 41 deform to approach a plane (XY plane), and the contact point between the upper surface 41 and the base plate displaces in the X-axis direction from a contact point (first position) P101 far from the center to a contact point (second position) P103 close to the center.
[0042] According to such a molding apparatus 100, the contact portions P101 to P103 between the spring plate 40 and the base plate 50 are displaced, thereby changing the position at which the load acts. This prevents the contact position between the spring plate 40 and the base plate 50 from becoming localized. As a result, wear due to contact between the spring plate 40 and the base plate 50 can be suppressed. By suppressing wear, the molding apparatus 100 can suppress deformation of the spring plate 40 over time. According to the molding apparatus 100, the lifespan of the spring plate 40 and the base plate 50 can be extended. According to the molding apparatus 100, the quality of the resin sheet 10 to be molded can be stabilized.
[0043] In the molding apparatus 100 , the voids 14 in the resin sheet 10 placed between the lower mold 20 and the upper mold 30 can be disposed outside the resin sheet 10 .
[0044] In the molding device 100, the R structure 81 is formed, so that the contact point between the spring plate 40 and the base plate 50 can be displaced in the X-axis direction. This makes it possible to shift the position where the load is concentrated. Furthermore, in the molding device 100, the R structure 81 is formed with R processing performed in the opposite direction to the curved surface 91. This increases the contact area between the spring plate 40 and the base plate 50, and makes it possible to reduce the contact surface pressure between the spring plate 40 and the base plate 50 compared to the prior art.
[0045] [Forming apparatus 100 according to the second embodiment] Fig. 5 is an enlarged cross-sectional view showing the contact portion between the spring plate 40 and the base plate 50 in the molding apparatus 100 according to the second embodiment. The molding apparatus 100 according to the second embodiment shown in Fig. 5 differs from the molding apparatus 100 according to the first embodiment shown in Fig. 2 in the shape of the R structure 82. Note that in the description of the second embodiment, explanations that are the same as those in the description of the first embodiment above may be omitted.
[0046] R-shaped structures 82 are formed on both ends in the X-axis direction of the upper surface 41 of the spring plate 40. The center position C1 of the curvature radius of the R-shaped structures 82 is located more inward than the side surface 43 in the X-axis direction. In addition, the center position C1 of the curvature radius of the R-shaped structures 82 is located between the upper surface 41 and the lower surface 42 in the Z-axis direction.
[0047] The center position C1 of the curvature radius of the R-structure 82 may be located on the side surface 43 in the X-axis direction, or may be located further outward than the side surface 43 in the X-axis direction.
[0048] Furthermore, the center position C1 of the curvature radius of the R structure 82 may be located below the lower surface 42 in the Z-axis direction.
[0049] [Molding device 100 according to the third embodiment] Fig. 6 is an enlarged cross-sectional view showing the contact portion between the spring plate 40 and the base plate 50 in the molding apparatus 100 according to the third embodiment. The molding apparatus 100 according to the third embodiment shown in Fig. 6 differs from the molding apparatus 100 according to the second embodiment shown in Fig. 5 in that it has an R structure 82 and an R structure 83. Note that in the description of the third embodiment, descriptions similar to those of the above embodiments may be omitted.
[0050] An R structure 82 and an R structure 83 are formed on both ends of the upper surface 41 of the spring plate 40 in the X-axis direction. The R structure 82 is an example of a first curved surface, and the R structure 83 is an example of a second curved surface. The R structure 83 is formed on the outside of the R structure 82 in the X-axis direction. The R structure 83 is formed at a position corresponding to a corner where the upper surface 41 and the side surface 43 intersect. The R structure 83 is formed so as to be continuous with the side surface 43. The R structure 83 is formed so as to connect the R structure 82 and the side surface 43. The R structure 82 is formed on the inside of the R structure 83 in the X-axis direction. The radius of curvature of the R structure 82 is larger than the radius of curvature of the R structure 83.
[0051] The molding apparatus 100 according to the third embodiment also provides the same effects as the molding apparatus 100 according to the first embodiment.
[0052] Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention described in the claims. [Explanation of symbols]
[0053] 100...molding device, 10...resin sheet, 20...lower mold, 30...upper mold, 40...spring plate, 50...base plate, 81...R structure, 82...R structure (first curved surface), 83...R structure (second curved surface), C1...center position of curvature radius, X...X-axis direction (first direction, longitudinal direction), Y...Y-axis direction, Z...Z-axis direction (thickness direction).
Claims
1. A molding device that press-forms a resin sheet, which is a resin separator for a fuel cell, by placing the resin sheet between an upper mold and a lower mold, a spring plate having a first surface and a second surface facing each other in a plate thickness direction, the spring plate having a central portion in a first direction intersecting the plate thickness direction curved so as to protrude to the side opposite to the second surface, and the upper mold attached to the spring plate so as to contact the first surface; a base plate that presses the spring plate so as to bring the upper die closer to the lower die, an R structure formed by R processing at both end portions of the second surface of the spring plate in the first direction; As the press load pressing the spring plate increases, the curved first surface and the second surface deform to approach a flat surface, and the contact point between the second surface and the base plate displaces in the first direction from a first position far from the center to a second position closer to the center.
2. The forming device described in claim 1, wherein the center position of the radius of curvature in the R structure is inside the side surface facing the first direction and is located between the first surface and the second surface in the plate thickness direction.
3. The R structure is a first curved surface corresponding to a corner where the first surface intersects with a side surface facing the first direction; a second curved surface disposed on the inner side of the first curved surface in the first direction, 3. The molding apparatus according to claim 1, wherein the radius of curvature of the second curved surface is larger than the radius of curvature of the first curved surface.
Citation Information
Patent Citations
Method for manufacturing electronic component
JP2021174932A