Pickup method and pickup device

Abstract

A novel pick-up method and a novel pick-up device are provided that can improve the throughput of the entire process required for picking up chips. [Solution] A pickup method for picking up chips from a frame unit having multiple chips attached to a tape whose outer periphery is fixed to a frame, the pickup method comprising: a detection step for detecting the chip to be picked up in the frame unit; a pickup step for pushing up the chip detected in the detection step through the tape with a main pushing-up unit, holding the chip with a chip holding unit, and picking it up from the tape; and a pre-pushing step for pushing up at least a portion of the chip before performing the pickup step.

Description

[Technical Field]

[0001] The present invention relates to a chip pick-up method and a configuration of a pick-up device. [Background technology]

[0002] 2. Description of the Related Art Conventionally, as disclosed in Patent Document 1, for example, a method for picking up chips from a divided wafer using a die bonder, a pick-up device, or the like has been known.

[0003] In this type of pickup method, a push-up member that moves up and down along the Z-axis direction pushes up the underside of the tape to peel the chip off the tape, and then the top surface of the peeled chip is suction-held and picked up by a collet. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-48279 Summary of the Invention [Problem to be solved by the invention]

[0005] The conventional pick-up method described above is known to include a first alignment step in which the wafer is positioned below a first camera and an image is taken to identify the position of the chip that needs to be picked up, a second alignment step in which the wafer is positioned below a second camera and an image is taken to position a push-up member relative to the chip that needs to be picked up, and a pick-up step in which the wafer is pushed up and picked up by a chip holding member.

[0006] In the series of processes comprising these steps, further improvement of throughput is considered to be an issue, and the inventors have investigated the situation and found that in the second alignment step to the pick-up step, it takes time to position and push up each chip to be picked up in sequence and peel the chip from the tape, whereas the first alignment step is completed in a shorter time than the second alignment step and the pick-up step.

[0007] After the first alignment step, the wafer waits before moving on to the second alignment step, and it has been discovered that by making effective use of this waiting time, it is possible to improve the throughput of the entire process required for pickup.

[0008] SUMMARY OF THE INVENTION An object of the present invention is to provide a pickup method and a pickup device that can solve the above problems. [Means for solving the problem]

[0009] The problem to be solved by the present invention is as described above, and the means for solving this problem will now be described.

[0010] According to one aspect of the present invention, there is provided a pickup method for picking up a chip from a frame unit having a plurality of chips attached to a tape whose outer periphery is fixed to a frame, the pickup method comprising: a detection step for detecting the chip to be picked up in the frame unit; a pickup step for pushing up the chip detected in the detection step through the tape with a main pushing-up unit, holding the chip with a chip holding unit, and picking up the chip from the tape; and a pre-pushing step for pushing up at least a portion of the chip before carrying out the pickup step.

[0011] According to another aspect of the present invention, in the preliminary pushing-up step, the chip is pushed up so that at least the outer periphery of the chip is separated from the tape.

[0012] According to another aspect of the present invention, the location where the chip is pushed up in the pre-push-up step is different from the location where the chip is pushed up in the pick-up step.

[0013] Furthermore, according to one aspect of the present invention, in the detection step, the chip to be picked up is detected based on an image formed by imaging the frame unit while the frame of the frame unit is held by a frame holding unit, and the pre-push-up step is performed while the frame is held by the frame holding unit.

[0014] According to one aspect of the present invention, there is provided a pickup device for picking up chips from a frame unit having a plurality of chips attached to a tape whose outer periphery is fixed to a frame, the pickup device comprising a detection unit for detecting the chip to be picked up in the frame unit, a main push-up unit for pushing up the chip detected by the detection unit through the tape, and a chip holding unit for holding the chip pushed up by the main push-up unit, a pickup mechanism for picking up the chip from the tape, and a pre-push-up unit for pushing up at least a portion of the chip through the tape and peeling off at least a portion of the chip from the tape before the pickup mechanism picks up the chip from the tape.

[0015] According to another aspect of the present invention, the pre-push-up unit peels off at least the outer periphery of the chip from the tape.

[0016] According to another aspect of the present invention, the location where the chip is pushed up in the pre-push-up unit and the location where the chip is pushed up in the pick-up mechanism are controlled to be different from each other.

[0017] According to one aspect of the present invention, the detection unit includes a frame holding unit that holds the frame of the frame unit, and an imaging unit that images the frame unit with the frame held by the frame holding unit to form an image, and the pre-push-up unit includes a push-up member that pushes up the chip through the tape of the frame unit with the frame held by the frame holding unit. [Effects of the Invention]

[0018] The present invention provides the following effects. In other words, according to one aspect of the present invention, while the subsequent pickup step is being performed on another frame unit, the preliminary push-up step can be performed on another frame unit in advance, and by effectively utilizing the waiting time until the pickup step, the throughput of the entire process can be improved.

[0019] Furthermore, according to one aspect of the present invention, the same portion of the chip is not pushed up multiple times, thereby shortening the time required for the pickup step and improving the throughput of the entire process. Furthermore, since the same portion of the chip is not pushed up multiple times, the load acting on the back surface of the chip can be reduced, and damage to the chip due to the push-up can be prevented. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 2 is a perspective view showing an embodiment of a frame unit. [Figure 2] FIG. 1 is a plan view showing an embodiment of a pickup device. [Figure 3] FIG. 3 is a side view showing an embodiment of a first alignment unit. [Figure 4] 1A is a side view showing an embodiment of a pre-thrust-up unit, and FIG. 1B is a plan view of the same. [Figure 5] FIG. 4 is a side view showing an embodiment of a second alignment unit. [Figure 6] 1A is a side view showing an embodiment of a main thrust-up unit, and FIG. [Figure 7] 1 is a flow chart illustrating the steps comprising the pick-up method. [Figure 8] (A) is a plan view explaining the pre-thrust step. (B) is a side view of the same. [Figure 9] (A) is a plan view explaining the main thrust step. (B) is a side view of the same. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is a diagram showing a wafer 13 (semiconductor wafer) as an example of a workpiece. The wafer 13 is attached to tape 19 and integrally formed with an annular frame 21 to form a frame unit 11. The wafer 13 is cut along planned division lines 17 by a cutting device (not shown) and divided into rectangular chips 23. Note that the wafer 13 may also be divided into chips 23 by a laser processing device.

[0022] The wafer 13 is formed in a disk shape using a material such as silicon, and has a surface 13a on which a plurality of devices 15 such as ICs (Integrated Circuits), LSIs (Large Scale Integrations), and LEDs (Light Emitting Diodes) are formed.

[0023] There are no limitations on the material, shape, structure, size, etc. of the wafer 13. For example, the wafer 13 may be a substrate formed from a material such as a semiconductor other than silicon (SiC, GaAs, InP, GaN, etc.), sapphire, glass, ceramics, resin, metal, etc. There are also no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices 15.

[0024] The back surface 13b of the wafer 13 is attached to a circular tape 19. The tape 19 is made of a flexible film having a rubber or acrylic adhesive layer (glue layer) formed on a base material made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate. Also, assuming chip pickup, the tape 19 may be, for example, an ultraviolet-curable tape that hardens when exposed to ultraviolet light. The diameter of the tape 19 is larger than the diameter of the wafer 13, and the wafer 13 is attached to the center of the tape 19.

[0025] A frame 21 made of metal or the like and having a circular opening 21a in the center is attached to the outer periphery of the tape 19. As a result, the wafer 13 is placed inside the opening 21a and supported by the frame 21 via the tape 19. Note that instead of using an annular frame 21 made of a ring-shaped flat plate as shown in Fig. 1, an embroidery frame-shaped so-called grip ring may also be used.

[0026] As described above, in the configuration of FIG. 1, frame unit 11 is configured in which a plurality of chips 23 are attached to tape 19 whose outer periphery is fixed to frame 21.

[0027] FIG. 2 is a plan view showing an example of the configuration of the pickup device 30. As shown in FIG. For ease of explanation, the up-down direction in the drawing is defined as the +Y direction and the −Y direction, and the left-right direction is defined as the −X direction and the +X direction.

[0028] The pickup device 30 is configured by arranging various units on a base 31, and Figure 2 shows the arrangement of a load / unload unit 32, a first alignment unit 34, a pre-push-up unit 35, a second alignment unit 36, a pickup mechanism 40, and a chip tray 38.

[0029] As shown in FIG. 2, the operation of each unit of the pickup device 30 is automatically controlled by a control device 100, which also performs image analysis.

[0030] The load / unload unit 32 temporarily places the frame unit 11 transferred from a transfer device (not shown) and allows the frame unit 11 to wait before being transferred to the first alignment unit 34 .

[0031] The frame unit 11 temporarily placed on the load / unload unit 32 is transported in the +Y direction by the frame holding unit 34 a of the first alignment unit 34 , and is transported to the first alignment unit 34 .

[0032] 3, the frame holding unit 34a has a support portion 34s that supports the frame 21 portion of the frame unit 11. The frame holding unit 34a is configured to move horizontally in the X and Y directions by an actuator (not shown), and performs so-called alignment for positioning the entire frame unit 11 and transports the frame unit 11.

[0033] The first alignment unit 34 has a detection unit 34b for capturing images of each chip 23 attached to the frame unit 11 and detecting the position of each chip 23 and the chip 23 to be picked up. The detection unit 34b is configured with, for example, an optical camera and outputs the captured image to the control device 100 of the pickup device. The control device 100 determines the presence or absence of damage such as cracks or chips from the captured image of each chip 23, and detects undamaged, good-quality chips as chips to be picked up, and detects damaged, defective chips as chips that do not need to be picked up.

[0034] A pre-push-up unit 35 is disposed below the first alignment unit 34 . The pre-push-up unit 35 functions to push up at least a part of the chip through the tape and peel off at least a part of the chip from the tape before the chip is picked up by the pickup mechanism 40 described later.

[0035] Figures 4(A) and (B) show one embodiment of the pre-push-up unit 35, which is composed of a pin-shaped push-up member 35a, a cylindrical outer layer member 35b that surrounds the push-up member 35a, and an actuator (not shown) that raises and lowers the push-up member 35a and the outer layer member 35b.

[0036] The push-up member 35a is configured, for example, to have a rectangular pressing surface 35c at its upper end, and the area of ​​the pressing surface 35c is smaller than the area of ​​the underside of the chip 23, so that it can accommodate chips 23 of various sizes and can push up specific positions of each chip 23 with pinpoint accuracy.

[0037] The outer layer member 35b has, for example, an annular suction surface 35d at its upper end, and a plurality of annular suction grooves 35e are formed in the suction surface 35d. The suction grooves 35e are connected to a suction source via a valve and a suction path (not shown), and are configured to attract the underside of the tape 19 by generating a negative pressure on the suction surface 35d.

[0038] As shown in FIG. 2, after the pre-thrust by the pre-thrust unit 35 is completed, the frame unit 11 is transported in the −Y direction by the frame holding unit 36a of the second alignment unit 36, and is transported to the second alignment unit 36.

[0039] 5, the frame holding unit 36a has a support portion 36s that supports the frame portion of the frame unit 11. The frame holding unit 36a is configured to move horizontally in the X and Y directions by an actuator (not shown), and performs so-called alignment for positioning the entire frame unit 11 and transports the frame unit 11.

[0040] The second alignment unit 36 ​​has a detection unit 36b for capturing an image of each chip attached to the frame unit 11 and detecting the position of each chip. The detection unit 36b is configured to have, for example, an optical camera, and outputs the captured image to the control device 100 of the pickup device.

[0041] The pickup mechanism 40 is configured to have a main push-up unit 42 that pushes up through the tape 19, and a chip holding unit 44 that holds the chip 23 pushed up by the main push-up unit 42.

[0042] As shown in Figures 6(A) and (B), the main push-up unit 42 is composed of a pin-shaped push-up member 42a, a cylindrical outer layer member 42b that surrounds the push-up member 42a, and an actuator (not shown) that raises and lowers the push-up member 42a and the outer layer member 42b.

[0043] Push-up member 42a is configured, for example, to have a rectangular pressing surface 42c at its upper end, and the area of ​​pressing surface 42c is made smaller than the area of ​​the underside of chip 23, so that it can accommodate chips 23 of various sizes and can pinpoint and push up specific positions of each chip 23. Alternatively, it may have a pressing surface that is substantially the same size as chip 23.

[0044] The outer layer member 42b has, for example, an annular suction surface 42d at its upper end, and a plurality of annular suction grooves 42e are formed in the suction surface 42d. The suction grooves 42e are connected to a suction source via a valve and a suction path (not shown), and are configured to suck the underside of the tape 19 by generating a negative pressure on the suction surface 42d.

[0045] 6(A), the chip holding unit 44 includes a collet 44b attached to the lower end of a movable shaft 44a. The lower surface of the collet 44b is configured as an adsorption holding surface 44c that has a larger area than the upper surface of the chip 23. The adsorption holding surface 44c is connected to a suction source via a valve and a suction path (not shown), and is configured to adsorb the lower surface of the tape 19 by generating a negative pressure on the adsorption holding surface 44c.

[0046] The movable shaft 44a is connected to a drive mechanism (not shown) and is configured to move in three axial directions of X, Y, and Z, so that the picked-up chip 23 can be transported to the chip tray .

[0047] Next, an example of a pickup method using the device configured as above will be described. 7 is a flowchart showing the steps of the pickup method, each of which will be described below.

[0048] <Detection step> As shown in FIG. 3, this is a step for detecting the chip 23 to be picked up in the frame unit 11.

[0049] Specifically, detection unit 34b captures an image from above showing the surfaces of all chips 23, and control device 100 determines the presence or absence of damage such as cracks or chips from the captured image of each chip, detecting chips that are undamaged and of good quality as chips that should be picked up, and detecting damaged, defective chips as chips that do not need to be picked up. Control device 100, for example, defines the coordinate position of each chip on a horizontal XY plane coordinate system, and defines the relative position of each chip and protruding member 35a (FIG. 4(A)).

[0050] <Pre-thrust step> This is a step of pushing up at least a part of the chip 23 before the pick-up step is performed.

[0051] 3, after the detection step, the control device 100 operates the frame holding unit 34a to sequentially position the chips to be picked up above the pre-push-up unit 35. Here, as shown in FIG. 8(A), precise positioning is performed so that a specific point P1 to be pushed up on each chip is directly above the push-up member 35a.

[0052] 8(A) and 8(B), the control device 100 causes the push-up member 35a to push up a specific portion P1 of the chip 23 that is to be pushed up. Here, the specific portion P1 is set to be the outer periphery of the chip 23, so that the chip 23 is pushed up so that the outer periphery of the chip 23 is peeled off from the tape 19. This allows the outer periphery of the chip 23 to be peeled off in a balanced manner, making it easier to peel off the entire chip 23 in the subsequent main push-up step.

[0053] As shown in Figure 8(A), the outer peripheral portion of the chip 23 can be defined as the side that is inside the outer peripheral edge 23g of the chip 23 and closer to the outer peripheral edge than the intermediate portion between the center 23c of the chip 23 and the outer peripheral edge 23g.

[0054] For example, in the example of Figure 8(A), corners P1 to P4 on the outer periphery of chip 23 are sequentially positioned directly above push-up member 35a by frame holding unit 34a and pushed up, thereby peeling all corners P1 to P4 of chip 23 from tape 19.

[0055] During this pushing-up, the upper part of the chip 23 is open, so the chip 23 is not pushed up while being pressed down from above, and no damage such as dents is caused to the bottom surface of the chip 23. Furthermore, other outer peripheral portions may be pushed up in addition to the corners P1 to P4, or other outer peripheral portions may be pushed up instead of the corners P1 to P4.

[0056] As shown in Figure 8(B), when the tape 19 is pushed up, the suction surface 35d of the outer layer member 35b adsorbs the underside of the tape 19, and the pressing surface 35c of the pushing member 35a is pushed up above the suction surface 35d of the outer layer member 35b, so that the chip 23 peels off from the tape 19 at the pushed-up location.

[0057] It should be noted that the pre-push-up step is not performed for chips that are detected as not requiring pick-up, which eliminates the need for time wasted for chips that do not require pick-up, thereby improving throughput.

[0058] In addition, in the above example, in the detection step, as shown in Figure 3, the chip to be picked up is detected based on an image formed by imaging the frame unit 11 while the frame 21 of the frame unit 11 is held by the frame holding unit 34a, and the pre-push-up step is performed while the frame 21 is held by the frame holding unit 34a.

[0059] This allows the two processes of the detection step and the pre-thrust step to be carried out while the frame unit 11 is held by the same frame holding unit 34a, eliminating the need to change the frame unit 11 and ensuring high throughput.

[0060] <Pickup step> In this step, the chip 23 detected in the detection step is pushed up by the main push-up unit 42 through the tape 19, and the chip 23 is held by the chip holding unit 44 and picked up from the tape 19.

[0061] 9(A) and 9(B), for example, the center P5 of the chip 23 in a plan view is positioned directly above the push-up member 42a, and then the lower surface of the collet 44b of the chip holding unit 44 is brought into contact with the upper surface of the chip 23. Then, the push-up member 42a is pushed up. In this example, the center P5 is a location that is not pushed up in the preliminary push-up step. In other words, the location where the chip is pushed up in the preliminary push-up step is different from the location where the chip is pushed up in the pick-up step.

[0062] This eliminates the need to push up the same part of the chip multiple times, shortening the time required for the pick-up step and improving the throughput of the entire process. Also, because the same part of the chip is not pushed up multiple times, the load acting on the back surface of the chip 23 can be reduced, preventing damage to the chip due to pushing up.

[0063] When pushing up, the lower surface of the tape 19 is sucked by the suction surface 42d of the outer layer member 42b, and the pressing surface 42c of the pushing member 42a is pushed up above the suction surface 42d of the outer layer member 42b, so that the chip 23 is peeled off from the tape 19 at the pushed-up location.

[0064] Simultaneously with this pushing-up, chip 23 is sucked and held by collet 44b, and by pulling down push-up member 42a, chip 23 is completely peeled off from tape 19. At this time, in the preliminary pushing-up step, corners P1 to P4 of the outer periphery have been pushed up in advance and peeled off once, and therefore the adhesive strength of the outer periphery to tape 19 has weakened or is in a peeled state, so chip 23 easily peels off from tape 19. This reduces the load on chip 23, making it possible to prevent damage to chip 23.

[0065] The chips 23 that have been peeled off and picked up are transferred to, for example, the chip tray 38 by moving the collet 44b as is, as shown in FIG.

[0066] In this way, while the subsequent pickup step is being performed on another frame unit, the preliminary push-up step can be performed on another frame unit in advance, and by making effective use of the waiting time until the pickup step, the throughput of the entire process can be improved.

[0067] Furthermore, in each of the above steps, as shown in FIG. 2, in the detection step, the chip to be picked up is detected based on an image formed by imaging the frame unit 11 while the frame 21 of the frame unit 11 is held by the frame holding unit 34a, and the pre-push-up step is performed while the frame 21 is held by the frame holding unit 34a.

[0068] This allows the series of steps of the detection step and the pre-push-up step to be performed without having to reposition the frame unit 11, while it is still held by the frame holding unit 34a, thereby eliminating the time required for repositioning and improving throughput. [Explanation of symbols]

[0069] 11 Frame Unit 13 wafers 13a surface 13b Back side 15 devices 17 Planned division line 19 Tape 21 frames 23 chips 30 Pickup device 32 Load-unload unit 34 First Alignment Unit 34a Frame holding unit 34b Detection unit 34s support part 35 Pre-thrust unit 35a Protruding member 35b Outer layer member 35c Pressing surface 35d suction surface 35e suction groove 36 Second alignment unit 36a Frame holding unit 36b Detection unit 36s support part 38 Chip Tray 40 Pickup mechanism 42 Main thrust unit 42a Protruding member 42b Outer layer member 42c Pressing surface 42d Adsorption surface 42e suction groove 44 Chip holding unit 44a Movable axis 44b Colette 44c Suction holding surface 100 control device

Claims

1. A pickup method for picking up chips from a frame unit having a plurality of chips attached to a tape whose outer periphery is fixed to a frame, comprising: a detecting step for detecting the chip to be picked up in the frame unit; a pick-up step of pushing up the chip detected in the detection step through the tape with a main push-up unit, holding the chip with a chip holding unit, and picking up the chip from the tape; a pre-push-up step of pushing up at least a part of the chip before carrying out the pick-up step.

2. In the preliminary pushing-up step, the chip is pushed up so that at least an outer peripheral portion of the chip is separated from the tape.

2. The pickup method according to claim 1.

3. a location where the tip is pushed up in the pre-push-up step; The location where the chip is pushed up in the pickup step is different.

3. The pickup method according to claim 1 or 2.

4. In the detection step, the chip to be picked up is detected based on a captured image formed by capturing an image of the frame unit while the frame of the frame unit is held by a frame holding unit; The pre-thrust step is performed in a state where the frame is held by the frame holding unit.

3. The pickup method according to claim 1 or 2.

5. A pickup device that picks up chips from a frame unit having a plurality of chips attached to a tape whose outer periphery is fixed to a frame, a detection unit for detecting the chip to be picked up in the frame unit; a pickup mechanism that includes a main push-up unit that pushes up the chip detected by the detection unit through the tape, and a chip holding unit that holds the chip pushed up by the main push-up unit, and that picks up the chip from the tape; and a pre-push-up unit that pushes up at least a portion of the chip through the tape and peels off at least a portion of the chip from the tape before the chip is picked up from the tape by the pickup mechanism.

6. The pre-push-up unit peels off at least the outer periphery of the chip from the tape.

6. The pickup device according to claim 5.

7. a location at which the tip is thrust up in the pre-thrust unit; The pickup mechanism is controlled so that the position where the tip is pushed up is different from the position where the tip is pushed up.

7. The pickup device according to claim 5 or 6.

8. the detection unit has a frame holding unit that holds the frame of the frame unit, and an imaging unit that images the frame unit with the frame held by the frame holding unit to form a captured image, the pre-push-up unit has a push-up member that pushes up the chip through the tape of the frame unit in which the frame is held by the frame holding unit; 7. The pickup device according to claim 5 or 6.

Images