Ultrasonic-based material processing apparatus and its control method

Abstract

An ultrasonic material processing apparatus and a method for controlling it are disclosed. [Solution] The material processing apparatus of the present invention includes an ultrasonic transmission unit configured to contain a material to be processed, an ultrasonic generating unit including a piezoelectric element arranged on the outer surface of the ultrasonic transmission unit and configured to generate ultrasonic waves, a power supply unit configured to output a drive power supply to the ultrasonic generating unit, and a control unit. The control unit controls the power supply unit so that a test power supply is supplied to the ultrasonic generating unit, determines the resonant frequency of the piezoelectric element based on the output of the piezoelectric element as a response to the test power supply, determines a first drive frequency and a second drive frequency based on the resonant frequency, and controls the power supply unit so that a first drive power supply having the first drive frequency and a second drive power supply having the second drive frequency are applied to the ultrasonic generating unit.

Description

Technical Field

[0001] The present invention relates to an ultrasonic-based substance processing apparatus and a control method thereof, and more particularly, to an ultrasonic-based substance processing apparatus and a control method thereof that enable efficient processing by controlling the frequency of a piezoelectric element that generates ultrasonic waves.

Background Art

[0002] A focused substance processing apparatus is an apparatus that focuses ultrasonic waves generated from a piezoelectric element and transmits energy to an object. Since it transmits energy in a non-invasive and non-destructive manner, it is used as a substance processing apparatus for processing substances. As an example, a focused substance processing apparatus is used as a dispersing apparatus. With the development of nanotechnology, nano-sized powders are produced in solution form and utilized in various fields. However, such nano-sized powders (nanoparticles) tend to agglomerate with each other, and it is necessary to appropriately disperse the nanoparticles. At this time, a focused substance processing apparatus is utilized. In addition, a focused substance processing apparatus is used for the decomposition of compounds. When a specific energy is applied to a compound, the molecular structure is deformed and the compound is decomposed. In particular, harmful substances can be efficiently decomposed by a focused substance processing apparatus and can also be used in the field of water treatment. Such a focused substance processing apparatus can efficiently exhibit a large output compared to the input by inducing the resonance of the piezoelectric element, but it is important to maintain the resonance condition of the piezoelectric element. The matters described in the above background art are for understanding the background of the invention and may include matters that are not published prior art.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

[0004] The present invention has been made in consideration of the above-mentioned conventional circumstances, and aims to provide an ultrasonic-based material processing apparatus and a control method therefor that makes it possible to monitor the resonant frequency of a piezoelectric element that generates ultrasonic waves and enables stable operation of the piezoelectric element. [Means for solving the problem]

[0005] To achieve the above objectives, an ultrasonic-based material processing apparatus according to a preferred embodiment of the present invention includes: an ultrasonic transmission unit configured to contain a material to be processed; an ultrasonic generating unit including a piezoelectric element disposed on the outer surface of the ultrasonic transmission unit and configured to generate ultrasonic waves; a power supply unit configured to output a drive power supply to the ultrasonic generating unit; and a control unit. The control unit controls the power supply unit so that a test power supply is supplied from the power supply unit to the ultrasonic generating unit; determines the resonant frequency of the piezoelectric element based on the output of the piezoelectric element as a response to the test power supply; determines a first drive frequency and a second drive frequency based on the resonant frequency; and controls the power supply unit so that a first drive power supply having the first drive frequency and a second drive power supply having the second drive frequency are applied from the power supply unit to the ultrasonic generating unit.

[0006] The control unit can determine the first drive frequency and the second drive frequency based on the resonant frequency and offset information determined according to the material to be processed. In this case, the control unit can determine the first drive frequency by adding a first value determined according to the offset information to the resonant frequency, and determine the second drive frequency by subtracting a second value determined according to the offset information to the resonant frequency. The power supply unit can combine the first drive power supply and the second drive power supply to generate a combined drive power supply, and output the generated combined drive power supply to the ultrasonic generating unit.

[0007] The control unit can determine a predetermined range of drive frequency bands including the resonant frequency based on the offset information, and determine the first drive frequency and the second drive frequency from among the frequencies belonging to the drive frequency band. The first drive frequency may be a frequency higher than the resonance frequency, and the second drive frequency may be a frequency lower than the resonance frequency.

[0008] The ultrasonic-based material processing apparatus further includes an input unit configured to receive information about the material to be processed, and the control unit can set the offset information based on the information about the material to be processed received via the input unit.

[0009] The control unit can determine the resonance phase, which is the phase at the resonance frequency of the piezoelectric element, determine the drive phase based on the resonance phase, and control the power supply unit so that the drive power supply corresponding to the resonance frequency and the drive phase is supplied from the power supply unit to the ultrasonic generating unit. In this case, the drive phase may be a phase delayed compared to the resonance phase. On the other hand, the control unit can determine the drive phase based on the resonance frequency and offset information determined according to the material to be processed.

[0010] On the other hand, a control method for an ultrasonic-based material processing apparatus according to a preferred embodiment of the present invention is a control method performed on an ultrasonic-based material processing apparatus from a power supply unit, and includes the steps of: controlling the power supply unit so that a test power supply is supplied to an ultrasonic generating unit located on the outer surface of an ultrasonic transmission unit; determining the resonant frequency of the ultrasonic generating unit based on the output of the piezoelectric element as a response to the test power supply; determining a first drive frequency and a second drive frequency based on the resonant frequency; and controlling the power supply unit so that a first drive power supply having the first drive frequency and a second drive power supply having the second drive frequency are applied from the power supply unit to the ultrasonic generating unit. [Effects of the Invention]

[0011] According to the present invention with this configuration, since the piezoelectric element operates based on two or more driving frequencies rather than one, even if a slight error occurs in determining the resonant frequency of the piezoelectric element, the use of two driving frequencies allows the piezoelectric element to operate at a frequency similar to the actual resonant frequency.

[0012] On the other hand, since a frequency band with a predetermined bandwidth can be set around the determined resonant frequency, and a drive power supply based on multiple frequencies within that frequency band can be transmitted to the piezoelectric element, the material processing in the embodiment of the present invention can be carried out smoothly.

[0013] Furthermore, since the bandwidth of the frequency band can be varied according to the attributes of the sample (i.e., the substance being processed), the vibrations entering the ultrasonic transmission unit can be adjusted to match changes in the sample inside the ultrasonic transmission unit (particle size, viscosity, concentration, slight temperature, etc.). This has the effect of transmitting the most efficient energy (i.e., ultrasonic energy) into the ultrasonic transmission unit.

[0014] On the other hand, since a drive signal (drive power source) having a phase slightly lagging from the phase of the determined resonance frequency can be transmitted to the piezoelectric element, in this case as well, there is an effect that the most efficient energy (i.e., ultrasonic energy) can be transmitted into the ultrasonic transmission unit.

Brief Description of the Drawings

[0015] [Figure 1] The substance processing apparatus according to an embodiment of the present invention is shown. [Figure 2] The structure of the ultrasonic transmission unit and the ultrasonic generation unit shown in FIG. 1 is shown. [Figure 3] It is a diagram for explaining a control method of the substance processing apparatus according to an embodiment of the present invention. [Figure 4] It is a diagram for explaining an example of the operation of the substance processing apparatus according to an embodiment of the present invention. [Figure 5] It is a diagram for explaining another example of the operation of the substance processing apparatus according to an embodiment of the present invention. [Figure 6] It is a diagram for explaining still another example of the operation of the substance processing apparatus according to an embodiment of the present invention.

Modes for Carrying Out the Invention

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0017] The embodiments are provided to more fully explain the present invention to those having ordinary knowledge in the relevant technical field. The following embodiments can be modified in various different forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to make this disclosure more faithful and complete and to fully convey the idea of the present invention.

[0018] The terms used in this specification are used to describe specific embodiments and are not intended to limit the present invention. Also, in this specification, the singular form can include the plural form unless the context clearly indicates otherwise. In this application, terms such as "comprising," "including," and "having" are intended to specify that there are features, numbers, steps, operations, components, parts, or combinations thereof of the invention, and it should be understood that the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof is not precluded in advance.

[0019] The drawings are only for the purpose of enabling understanding of the idea of the present invention and should not be construed as limiting the scope of the present invention. Also, in the drawings, relative thickness, length, and relative size may be exaggerated for convenience of explanation and clarity.

[0020] FIG. 1 shows a substance processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, the substance processing apparatus 10 can include an ultrasonic transmission unit 100, an ultrasonic generation unit 200, a power supply unit 300, and a control unit 400. The ultrasonic transmission unit 100 allows the substance to be processed to flow in and be accommodated, and ultrasonic processing (for example, dispersion by ultrasonic cavitation or water treatment, etc.) on the substance to be processed can be performed, and the substance to be processed after the ultrasonic processing is completed can be discharged. According to an embodiment, the ultrasonic transmission unit 100 can have a structure for facilitating the ultrasonic processing of the substance to be processed. For example, the ultrasonic transmission unit 100 may be a manifold where the processing of the substance to be processed is performed.

[0021] The ultrasonic generation unit 200 can generate ultrasonic waves. According to an embodiment, the ultrasonic generation unit 200 can include a piezoelectric element. For example, the piezoelectric element may be a PZT (element of the PbZrxTi(1 - x)O3 system), but is not limited thereto. The ultrasonic generating unit 200 can generate ultrasound by generating vibrations using an externally supplied power source. For example, the ultrasonic generating unit 200 can receive a drive power source having a predetermined operating frequency and can generate ultrasound having a predetermined frequency in response to the drive power source.

[0022] The power supply unit 300 can generate power for use in the material processing apparatus 10. In this embodiment, the power supply unit 300 may include a drive power supply unit (not shown) that generates a drive power supply (e.g., an AC power supply) for driving the ultrasonic generating unit 200. In this case, the drive power supply unit can generate a drive power supply having frequencies in a wide range of fields. The control unit 400 can control the overall operation of the material processing apparatus 10. In this embodiment, the control unit 400 includes a processor having computing power, and various operations of the material processing apparatus 10 can be controlled by controlling the processor.

[0023] The processor described above may include all types of devices capable of processing data. Here, a processor can mean a data processing device built into hardware, for example, having physically structured circuitry to perform a function expressed by code or instructions contained within a program. Such a processor can be implemented using one or more general-purpose or special-purpose computers, as well as, for example, a controller, an ALU (arithmetic logic unit), a digital signal processor, a microcomputer, an FPGA (field programmable gate array), a PLU (programmable logic unit), a microprocessor, or any other device capable of responding to and executing instructions in a defined manner, but the scope of the present invention is not limited thereto.

[0024] In this embodiment, the control unit 400 can control the power supply unit 300 to generate a drive power supply for driving the ultrasonic generating unit 200. For example, the control unit 400 can control the frequency of the drive power supply generated by the power supply unit 300 and the phase of the ultrasonic generating unit 200 (more specifically, the piezoelectric element). For example, the power supply unit 300 can generate a drive power supply corresponding to a frequency instructed by the control unit 400. According to an embodiment of the present invention, the control unit 400 can monitor the state of the ultrasonic generating unit 200 and determine the drive power supply for the ultrasonic generating unit 200, that is, the frequency of the drive power supply, according to the monitoring results.

[0025] In particular, the control unit 400 can determine the power supply for efficiently driving the ultrasonic generator 200 by taking into consideration information (e.g., attributes) of the material to be processed by the material processing apparatus 10. This has the effect of enabling stable operation of the ultrasonic generator 200 even when the operating environment of the material processing apparatus 10 changes in real time. For the piezoelectric element of the ultrasonic generating unit 200 to efficiently generate ultrasonic waves, a drive power supply corresponding to the resonant frequency of the piezoelectric element must be applied. Otherwise, the input-to-output efficiency of the piezoelectric element will decrease, resulting in poor driving conditions for the piezoelectric element, which may lead to damage or overheating.

[0026] On the other hand, while the resonant frequency of a piezoelectric element can be known in advance, this is the frequency under specific conditions (e.g., laboratory conditions). When the piezoelectric element actually starts operating, the actual resonant frequency will differ depending on the ambient temperature, pressure, and the way the piezoelectric element is arranged. Therefore, the embodiment of the present invention has the effect of enabling the stable generation of ultrasonic waves by determining the resonant frequency of the piezoelectric element in a real-time operating environment and applying a drive power supply corresponding to the determined resonant frequency.

[0027] In this embodiment, the material processing apparatus 10 further includes a measuring unit 500 which monitors the current state of the ultrasonic generating unit 200, i.e., the piezoelectric element, via the measuring unit 500, and the control unit 400 can determine the resonant frequency of the piezoelectric element based on the measurement results of the measuring unit 500. The measuring unit 500 can measure the state or output of the ultrasonic generating unit 200. In this embodiment, the measuring unit 500 can measure at least one of the output (amplitude), impedance, and phase of the ultrasonic generating unit 200. The measuring unit 500 can provide the measurement results to the control unit 400.

[0028] On the other hand, as ultrasonic treatment is performed on the substance to be treated, changes occur in the sample (i.e., the substance to be treated) inside the ultrasonic transmission unit 100 (for example, particle size, viscosity, concentration, slight temperature, etc.). When the piezoelectric element vibrates at a specific frequency, not only the piezoelectric element vibrates, but the sample is also vibrated, so the changes in the sample (i.e., the substance to be treated) inside cannot be ignored. Adjusting the vibrations entering from the outside (i.e., vibrations entering the inside of the ultrasonic transmission unit 100) to match the internal changes is the most efficient energy transfer and effective transfer to the sample.

[0029] Therefore, while it is important to explore the resonant frequency of the piezoelectric element, it is necessary to consider not only the characteristics of the piezoelectric element but also the entire environment surrounding the piezoelectric element (sample, cylinder shape) to determine the optimal resonant frequency for sample processing. In other words, in the embodiments of the present invention, the purpose is to efficiently transmit energy (e.g., ultrasonic energy) into the ultrasonic transmission unit 100 rather than simply matching the driving conditions of the piezoelectric element. Here, "efficient" is understood to mean taking into account changes in the sample inside the ultrasonic transmission unit 100. For this reason, in the embodiments, the material processing apparatus 10 may further include an input unit 600 and a storage unit 700. In the embodiments, the storage unit 700 may be included in the control unit 400, but is not limited thereto.

[0030] According to one embodiment of the present invention, the input unit 600 can receive information about the substance to be processed. The input unit 600 can also receive offset information corresponding to the information about the substance to be processed. Here, the substance to be processed refers to a target substance that is to be processed (for example, a substance to be ultrasonically processed) and which flows into the ultrasonic transmission unit 100. Information about the substance to be treated may include the name of the substance, the amount of the substance flowing in, and the attributes of the substance (sample) that change as a result of ultrasonic treatment (e.g., particle size, viscosity, concentration, temperature, etc.). The offset information may be information used to determine the frequency and phase of the drive power supply, which will be described later. The offset information may include frequency offset information and phase offset information. In this embodiment, the offset information can be used when determining the drive frequency.

[0031] For example, the driving frequency can be determined by adding or subtracting a frequency offset (e.g., K1) to the resonant frequency of the piezoelectric element. The frequency offset (e.g., K1) in this case may be a frequency value determined according to information about the material to be processed (e.g., 3kHz, 5kHz, etc.).

[0032] Alternatively, the drive frequency can be determined within a predetermined range of drive frequency bands obtained by adding a predetermined frequency offset to the resonant frequency of the piezoelectric element. The drive frequency band can be varied according to information about the material to be processed. For example, corresponding to information about material A, a drive frequency band in a range of ±5% around the resonant frequency can be determined, and corresponding to information about material B, a drive frequency band in a range of ±10% around the resonant frequency can be determined. The ±5% and ±10% range values ​​of the resonant frequency mentioned above can be frequency offsets.

[0033] On the other hand, in the embodiment, the phase obtained by adding a phase offset (e.g., K2) to the resonant phase, which is the phase at the resonant frequency of the piezoelectric element, can be determined as the driving phase of the piezoelectric element. That is, the resonant phase can be said to be the phase of the driving power supply transmitted to the piezoelectric element. The driving phase can be said to be a phase that has been slightly modified (e.g., delayed) from the resonant phase of the piezoelectric element. The phase offset (e.g., K2) may be a phase value determined according to information about the material to be processed.

[0034] The information on the substances to be processed and the corresponding offset information can be directly input by the user via a terminal (not shown). Of course, if necessary, the input unit 600 may receive only the information on the substances to be processed, and the offset information corresponding to the information of each of the multiple substances may be pre-stored in the storage unit 700. In this case, the offset information corresponding to the information of each substance may be pre-stored in the storage unit 700 based on the results obtained through numerous experiments. Here, each substance refers to a substance that can flow into the ultrasonic transmission unit 100 and become the target of ultrasonic treatment. If any one of the multiple substances that flow into the ultrasonic transmission unit 100 before flowing in can be said to be a substance to be processed.

[0035] The storage unit 700 can store data necessary for the operation of the control unit 400. The storage unit 700 stores offset information (e.g., frequency offset information, phase offset information) corresponding to the information of each of the multiple substances. As a result, the control unit 400 can read the offset information (frequency offset information / phase offset information) corresponding to the information of the substance to be processed from the storage unit 700, and determine the drive frequency / drive phase by applying the offset information to the resonant frequency / resonant phase based on the read offset information. For example, the control unit 400 can determine the drive frequency as the frequency obtained by adding the frequency offset value corresponding to the frequency offset information with the resonant frequency. The storage unit 700 can store a program consisting of instruction words for performing a series of operations carried out by the control unit 400. The storage unit 700 may include a non-volatile memory device or a volatile memory device.

[0036] Figure 2 shows the structure of the ultrasonic transmission unit 100 and the ultrasonic generation unit 200 shown in Figure 1. The ultrasonic transmission unit 100 may be configured as a cylindrical tube. Substances can flow through the tubular ultrasonic transmission unit 100. For example, the ultrasonic transmission unit 100 may be provided with an inlet (not shown) into which the substance to be treated (e.g., a dispersion medium) flows in, and an outlet (not shown) into which the substance to be treated is discharged. The inlet and outlet are in communication with each other through the internal space of the ultrasonic transmission unit 100. Although not shown, for example, a pump (not shown) may be provided on a path connected to the outlet, and a flow from the inlet to the outlet can be formed by the force provided by the pump.

[0037] Furthermore, the ultrasonic generating unit 200 may have a cylindrical shape and be configured to surround the ultrasonic transmitting unit 100 with a hollow interior. That is, although the ultrasonic generating unit 200 is provided on the outer surface of the ultrasonic transmitting unit 100, it may also be provided to surround a part of the ultrasonic transmitting unit 100 (for example, the central portion) from the outer surface of the ultrasonic transmitting unit 100. The ultrasonic generating unit 200 is of the focusing type and can convert electrical energy into ultrasonic energy and provide ultrasonic energy to the material to be processed flowing inside the ultrasonic transmitting unit 100.

[0038] The ultrasonic generating unit 200, which has a circular cross-section, is provided in the central part of the outer surface of the ultrasonic transmitting unit 100 so as to surround the central part of the outer surface of the ultrasonic transmitting unit 100, so that the ultrasonic waves generated by the ultrasonic generating unit 200 can be accurately focused into the ultrasonic transmitting unit 100. On the other hand, a hollow can be formed inside the ultrasonic transmission section 100, but the outer diameter of the hollow in the region where the ultrasonic generating section 200 is located may be larger than the outer diameter of the hollow in the region where the ultrasonic generating section 200 is not located.

[0039] Figure 3 is a diagram illustrating a control method for a substance processing apparatus according to an embodiment of the present invention. As shown in Figure 3, the material processing apparatus 10 determines the scan frequency (S110). The scan frequency refers to the frequency of the drive power supply (i.e., test power supply) applied to the piezoelectric element to check the state of the piezoelectric element. For example, the scan frequency may be in the hundreds of kHz range, preferably 360 kHz or more and 400 kHz or less, but is not limited to this. Here, the scan frequency can be seen as a set of multiple mutually different frequencies. For example, the scan frequency can be said to be a set of frequencies that change in units of 10 kHz from 360 kHz, but according to the above example, the frequencies 360 kHz, 370 kHz, 380 kHz, 390 kHz, and 400 kHz can be said to be the scan frequencies.

[0040] The material processing apparatus 10 supplies a drive power supply, i.e., a test power supply, corresponding to each scan frequency to the piezoelectric element of the ultrasonic generating unit 100 (S120). In this embodiment, the control unit 400 can sequentially determine the scan frequencies and control the power supply unit 300 to output a drive power supply corresponding to the determined scan frequencies. Supplying a drive power supply (i.e., a test power supply) corresponding to the scan frequency to the piezoelectric element means, for example, assuming there are three scan frequencies, supplying a drive power supply corresponding to the first scan frequency to the piezoelectric element, supplying a drive power supply corresponding to the second scan frequency to the piezoelectric element after a predetermined time, supplying a drive power supply corresponding to the third scan frequency to the piezoelectric element after a predetermined time.

[0041] The material processing apparatus 10 can measure the state of a piezoelectric element by applying a drive power supply (i.e., a test power supply) corresponding to the scan frequency to the piezoelectric element (S130). In this embodiment, the measurement unit 500 of the material processing apparatus 10 can measure at least one of the output (power), impedance, and phase of the piezoelectric element.

[0042] The material processing apparatus 10 can determine the resonance characteristics of the piezoelectric element based on the measurement results (S140). Here, the resonance characteristics of the piezoelectric element can mean the resonance frequency and / or the phase at the resonance frequency (resonance phase). In some embodiments, the control unit 400 of the material processing apparatus 10 can determine the frequency at which the output of the piezoelectric element is maximized (e.g., the peak frequency) as the resonance characteristic of the piezoelectric element, according to the measurement results. For example, the material processing apparatus 10 may determine the frequency at which the output of the piezoelectric element is maximized within a phase range of 35 degrees or less as the resonance characteristic.

[0043] Furthermore, according to the embodiment, the control unit 400 of the material processing apparatus 10 can determine the frequency at which the impedance of the piezoelectric element is minimized as the resonance characteristic of the piezoelectric element, according to the measurement results. Furthermore, according to the embodiment, the control unit 400 of the material processing apparatus 10 can determine the frequency at which the phase of the piezoelectric element (phase of current and / or phase of voltage) becomes a predetermined phase (for example, the lowest phase), according to the measurement results, as the resonance characteristic of the piezoelectric element. The material processing apparatus 10 can determine a drive power supply (e.g., an AC power supply) based on the determined resonance characteristics and supply the determined drive power supply to the piezoelectric element (S150). Here, determining the drive power supply can mean determining the drive frequency and / or drive phase of the drive power supply.

[0044] According to embodiments of the present invention, a drive frequency having a difference of a predetermined value from the resonant frequency can be determined, but there may be at least one drive frequency. According to embodiments of the present invention, a drive phase having a difference of a predetermined value from the resonant phase can be determined, but the drive phase may be slower than the resonant phase. When determining the drive power supply, the drive power supply can be determined by considering the characteristics (attributes) of the material to be processed along with the resonant characteristics. For example, information regarding the characteristics of the material to be processed can be input from an external source, and may be stored in advance or transmitted from the output results of a separately connected characteristic analyzer.

[0045] This allows the drive power supply to be determined by reflecting the attributes of the resonance characteristics, making it possible to consider the characteristics of the material being processed rather than determining the drive power supply all at once, resulting in more effective processing. For example, a drive frequency that is a predetermined value difference from the resonance frequency can be determined, and the predetermined value can be determined in various ways depending on the characteristics of the material being processed.

[0046] On the other hand, the operation to determine the resonance characteristics, as described with reference to Figure 3, may be started manually by the user or automatically by the material processing apparatus 10. For example, after the resonance characteristics have been determined, the material processing apparatus 10 may periodically or in real time monitor the driving frequency of the piezoelectric element, and if the output of the piezoelectric element changes beyond a predetermined value, it may perform the operation to determine the resonance characteristics of the piezoelectric element again.

[0047] Figure 4 is a diagram illustrating an example of the operation of a substance processing apparatus according to an embodiment of the present invention.

[0048] As shown in Figure 4, the material processing apparatus 10 can determine the resonance characteristics (e.g., resonance frequency) of the piezoelectric element (S210). At this time, the determination of the resonance characteristics (e.g., resonance frequency) may be performed by the operation described with reference to Figure 3. Of course, the material processing apparatus 10 receives information about the material to be processed from the user.

[0049] Next, the material processing apparatus 10 determines a first drive frequency higher than the resonant frequency and a second drive frequency lower than the resonant frequency based on the determined resonant characteristics (e.g., resonant frequency) (S220). Here, in order to determine the first drive frequency and the second drive frequency, not only the resonant frequency but also offset information determined according to the information of the current material to be processed is required. With this, the control unit 400 in the material processing apparatus 10 can read out first frequency offset information (i.e., including a first value) corresponding to the information of the current material to be processed from the offset information stored in the storage unit 700, and determine the frequency obtained by adding the read-out first value (e.g., a positive integer value) with the resonant frequency as the first drive frequency. Then, the control unit 400 in the material processing apparatus 10 can read out second frequency offset information (i.e., including a second value) corresponding to the information of the current material to be processed from the offset information stored in the storage unit 700, and determine the frequency obtained by subtracting the read-out second value (e.g., a positive integer value) from the resonant frequency as the second drive frequency. Here, the first value and the second value may be different or the same.

[0050] The material processing apparatus 10 supplies drive power to the piezoelectric element corresponding to the first drive frequency and the second drive frequency (S230). For example, the material processing apparatus 10 can generate a first drive power having the first drive frequency and a second drive power having the second drive frequency, and supply drive power based on the first and second drive power to the piezoelectric element. In this case, the power supply unit 300 of the material processing apparatus 10 can combine the first drive power and the second drive power to generate a combined drive power, and supply the generated combined drive power to the piezoelectric element of the ultrasonic generating unit 200.

[0051] In other words, as shown in Figure 4, the piezoelectric element can operate based on two or more driving frequencies, rather than just one. This has the effect of allowing the piezoelectric element to operate at a frequency similar to the actual resonant frequency, even if there is a slight error in determining the resonant frequency of the piezoelectric element, because two driving frequencies can be utilized.

[0052] In Figure 4 above, information about the substance to be processed is received from the user terminal. However, if necessary, a separate measuring device capable of measuring the attributes of the substance to be processed can be included. In that case, the first and second values ​​centered on the resonance frequency can be determined based on the attributes of the substance to be processed measured using the separate measuring device.

[0053] On the other hand, while Figure 4 above illustrates the case where the first and second value frequency offsets are directly applied to the resonant frequency of the piezoelectric element, the driving frequency band may be applied instead of the first and second values. This will be explained with reference to Figure 5.

[0054] Figure 5 is a diagram illustrating another example of the operation of a substance processing apparatus according to an embodiment of the present invention. As shown in Figure 5, the material processing apparatus 10 can determine the resonance characteristics (e.g., resonance frequency) of the piezoelectric element (S310). At this time, the determination of the resonance characteristics (e.g., resonance frequency) may be performed by the operation described with reference to Figure 3. Of course, the material processing device 10 receives information about the material to be processed from a user terminal (not shown).

[0055] Next, the control unit 400 of the material processing apparatus 10 reads out frequency offset information corresponding to the information of the material to be processed from the offset information corresponding to the information of each of the multiple materials stored in the storage unit 700 (S320). The frequency offset information at this time may include a predetermined range of drive frequency bands. For example, the predetermined range of drive frequency bands may be a frequency band in the range of ±3% or ±3kHz centered on the resonant frequency.

[0056] Subsequently, the control unit 400 of the material processing apparatus 10 determines a predetermined range of drive frequency bands centered on the resonant frequency based on the read-out offset information (S330). In other words, the control unit 400 can determine a drive frequency band including the resonant frequency based on the predetermined range of drive frequency bands read-out. In short, the determined drive frequency band can be understood as being variable according to the information of the material to be processed.

[0057] Thereafter, the control unit 400 of the material processing apparatus 10 determines a first drive frequency and a second drive frequency from among the frequencies belonging to the determined drive frequency band (S340). Here, the first drive frequency is a frequency higher than the resonant frequency, and may be, for example, a frequency generated by adding a predetermined first value to the resonant frequency. The second drive frequency is a frequency lower than the resonant frequency, and may be, for example, a frequency generated by subtracting a predetermined second value from the resonant frequency. Next, the material processing apparatus 10 can supply a drive power supply to the piezoelectric element of the ultrasonic generating unit 200 based on the determined first drive frequency and second drive frequency.

[0058] As shown in Figure 5 above, since the drive frequency band centered on the resonant frequency can be varied based on information about the material being processed, the vibrations entering the ultrasonic transmission unit 100 can be adjusted in accordance with changes in the sample (i.e., the material being processed) inside the ultrasonic transmission unit 100. This has the effect of transmitting the most efficient energy (i.e., ultrasonic energy) into the ultrasonic transmission unit 100.

[0059] In Figure 5 above, information about the substance to be processed is received from the user terminal. However, if necessary, a separate measuring device capable of measuring the attributes of the substance to be processed can be included. In that case, the drive frequency band could be determined based on the attributes of the substance to be processed measured using the separate measuring device.

[0060] On the other hand, in Figures 4 and 5 described above, once the resonant frequency of the piezoelectric element is determined, frequency offset information corresponding to the information (including attributes) of the material to be processed is applied to the resonant frequency. However, instead of frequency offset information, phase offset information may be applied. This will be explained with reference to Figure 6.

[0061] Figure 6 illustrates yet another example of the operation of a material processing apparatus according to an embodiment of the present invention. As shown in Figure 6, the material processing apparatus 10 can determine the resonance characteristics of a piezoelectric element (e.g., the phase at the resonance frequency (resonant phase)) (S410). At this time, the determination of the resonance characteristics (e.g., the phase at the resonance frequency (resonant phase)) may be performed by the operation described with reference to Figure 3. Of course, the material processing apparatus 10 receives information about the material to be processed from a user terminal (not shown).

[0062] Next, the control unit 400 of the material processing apparatus 10 reads out phase offset information corresponding to the information of the material to be processed from the offset information corresponding to the information of each of the multiple materials stored in the storage unit 700 (S420). The phase offset information at this time may include a predetermined phase delay value. For example, the phase delay value is a delay value with respect to the phase at the determined resonant frequency, and can mean information such as having a phase that is lagging slightly from the phase at the determined resonant frequency. The phase delay values ​​may differ from each other depending on the information of the material to be processed. For example, when material A to be processed with an inflow amount of K weight and attribute d is inflow, the phase delay value with respect to the phase of the resonant frequency may be "a", when material A to be processed with an inflow amount of L (L>K) weight and attribute e is inflow, the phase delay value with respect to the phase of the resonant frequency may be "b (b>a)", and when material B to be processed with an inflow amount of K weight and attribute f is inflow, the phase delay value with respect to the phase of the resonant frequency may be "c (c>b)".

[0063] Subsequently, the control unit 400 of the material processing apparatus 10 delays the phase at the resonant frequency based on the read-out phase offset (S430). Here, the phase at the resonant frequency can mean the phase of the piezoelectric element when the drive power supply corresponding to the resonant frequency is applied to the piezoelectric element. For example, the control unit 400 of the material processing apparatus 10 can determine the resonant phase, which is the phase of the piezoelectric element of the ultrasonic generating unit 200 at the resonant frequency, and determine the drive phase based on the resonant phase. That is, the drive phase can be the resonant phase plus a phase offset, so by determining the drive phase, the phase of the drive power supply transmitted to the piezoelectric element can be delayed by a small amount.

[0064] Thereafter, the control unit 400 of the material processing apparatus 10 controls the power supply unit 300 so that a delayed-phase drive power supply (i.e., a drive power supply corresponding to the resonant frequency and drive phase) is supplied from the power supply unit 300 to the ultrasonic generating unit 200. For this reason, the power supply unit 300 supplies a delayed-phase drive power supply (i.e., a drive power supply corresponding to the resonant frequency and drive phase) to the piezoelectric element of the ultrasonic generating unit 200 (S440).

[0065] As shown in Figure 6 above, the material processing apparatus 10 can change the phase of the drive power transmitted to the piezoelectric element based on information about the material to be processed. In the case of such a phase change, the same effect as in Figure 5 can be obtained.

[0066] In Figure 6 above, information about the substance to be processed is received from the user terminal. However, if necessary, a separate measuring device capable of measuring the attributes of the substance to be processed can be included. In that case, the phase offset information could be determined based on the attributes of the substance to be processed measured using the separate measuring device.

[0067] On the other hand, while Figures 5 and 6 explain that the control unit 400 determines the frequency or phase of the drive power supply by reflecting the offset information of the material to be processed in the frequency or phase, in the embodiment, the control unit 400 may determine the frequency or phase of the drive power supply in various ways based on information of the material to be processed instead of offset information. In other words, the control unit 400 according to the embodiment of the present invention can utilize information of the material to be processed when determining the frequency or phase of the drive power supply.

[0068] The above description illustrates the technical concept of the present invention using examples, and a person with ordinary skill in the art to which the present invention pertains will be able to make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted in accordance with the following claims, and all technical concepts within an equivalent scope shall be interpreted as being included in the scope of rights of the present invention. [Explanation of symbols]

[0069] 10. Material Processing Equipment 100 Ultrasonic transmission section 200 Ultrasonic Generator 300 Power supply section 400 Control Unit 500 Measuring part 600 Input Section 700 Storage Unit

Claims

1. An ultrasonic transmission unit configured to contain the substance to be processed, The ultrasonic generating unit includes a piezoelectric element arranged on the outer surface of the ultrasonic transmission unit and configured to generate ultrasonic waves, A power supply unit configured to output a drive power supply to the ultrasonic generating unit, Includes a control unit, The control unit, The power supply unit is controlled so that a test power supply is supplied from the power supply unit to the ultrasonic generating unit. Based on the output of the piezoelectric element as a response to the test power supply, the resonant frequency of the piezoelectric element is determined. Based on the aforementioned resonant frequency, the first drive frequency and the second drive frequency are determined. An ultrasonic material processing apparatus characterized by controlling the power supply unit so that a first drive power supply having the first drive frequency and a second drive power supply having the second drive frequency are supplied from the power supply unit to the ultrasonic generating unit.

2. The control unit, The ultrasonic-based material processing apparatus according to claim 1, characterized in that the first drive frequency and the second drive frequency are determined based on the resonant frequency and offset information determined according to the material to be processed.

3. The control unit, The first drive frequency is determined by adding a first value, which is determined according to the offset information, to the aforementioned resonant frequency. The ultrasonic-based material processing apparatus according to claim 2, characterized in that the second drive frequency is determined by subtracting a second value determined according to the offset information from the resonant frequency.

4. The aforementioned power supply unit is The ultrasonic-based material processing apparatus according to claim 1, characterized in that the first drive power supply and the second drive power supply are combined to generate a combined drive power supply, and the generated combined drive power supply is output to the ultrasonic generating unit.

5. The control unit, Based on the offset information, a predetermined range of drive frequency bands including the resonant frequency is determined. The ultrasonic-based material processing apparatus according to claim 2, characterized in that the first drive frequency and the second drive frequency are determined from among the frequencies belonging to the aforementioned drive frequency band.

6. The first driving frequency is a frequency higher than the resonant frequency, The ultrasonic-based material processing apparatus according to claim 1, characterized in that the second driving frequency is a frequency lower than the resonant frequency.

7. The aforementioned ultrasonic material processing apparatus is The system further includes an input unit configured to receive information about the substance to be processed, The control unit, The ultrasonic-based material processing apparatus according to claim 2, characterized in that the offset information is set based on the information of the material to be processed that is input via the input unit.

8. The control unit, The resonance phase, which is the phase at the resonance frequency of the piezoelectric element, is determined. The drive phase is determined based on the aforementioned resonance phase. The ultrasonic-based material processing apparatus according to claim 1, characterized in that the power supply unit is controlled so that the drive power supply corresponding to the resonant frequency and the drive phase is supplied from the power supply unit to the ultrasonic generating unit.

9. The aforementioned drive phase is The ultrasonic-based material processing apparatus according to claim 8, characterized in that the phase is delayed compared to the aforementioned resonance phase.

10. The control unit, The ultrasonic-based material processing apparatus according to claim 8, characterized in that the drive phase is determined based on the resonant frequency and offset information determined according to the material to be processed.

11. A control method performed in an ultrasonic material processing device, The steps include controlling the power supply unit so that a test power supply is supplied from the power supply unit to the ultrasonic generating unit located on the outer surface of the ultrasonic transmission unit, The steps include determining the resonant frequency of the ultrasonic generating unit based on the output of the piezoelectric element as a response to the test power supply, The steps include determining a first drive frequency and a second drive frequency based on the aforementioned resonant frequency, A control method for an ultrasonic-based material processing apparatus, comprising the step of controlling the power supply unit so that a first drive power supply having the first drive frequency and a second drive power supply having the second drive frequency are supplied from the power supply unit to the ultrasonic generating unit.

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