Radiation imaging device and radiation imaging system

Abstract

This technology offers advantages in improving the accuracy of AEC (Autonomous Ecosystem Control). [Solution] The system comprises an imaging area in which a plurality of pixels are arranged, a plurality of signal lines to which signals are supplied from pixels arranged in the same pixel row, a signal processing circuit, and a drive circuit, wherein the plurality of pixels include a plurality of imaging pixels and a plurality of detection pixels, the imaging area comprises a plurality of light-gathering fields composed of a predetermined number of pixels that are continuous in the row and column directions from the plurality of pixels, each light-gathering field comprises a plurality of detection areas each containing one or more detection pixels, the plurality of detection pixels are connected to different signal lines from the plurality of signal lines for each detection area in each light-gathering field, during radiation irradiation, the drive circuit drives the detection pixels arranged in the light-gathering field set to acquire the irradiation information from the plurality of detection pixels, and the signal processing circuit acquires the irradiation information based on signals supplied from the detection pixels arranged in each of the plurality of detection areas.

Description

Technical Field

[0001] The present invention relates to a radiation imaging apparatus and a radiation imaging system.

Background Art

[0002] As a multifunctionalization of a radiation imaging apparatus, by detecting irradiation information of radiation incident on the radiation imaging apparatus, detecting the amount of incident radiation and performing automatic exposure control (AEC) can be mentioned. In Patent Document 1, it is shown that signal lines for outputting signals from detection pixels for acquiring cumulative dose are separated for each large block corresponding to a light collection field when performing AEC.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the configuration shown in Patent Document 1, when there are regions where a subject is arranged and regions where it is not arranged within one large block, signals cannot be separately acquired from detection pixels arranged in each region. Therefore, due to the signal output from the detection pixels located in the region where the subject is not arranged, the accuracy of AEC may decrease, such as the irradiation of radiation being stopped by AEC even though the subject is not irradiated with a sufficient amount of radiation.

[0005] An object of the present invention is to provide a technique advantageous for improving the accuracy of AEC.

Means for Solving the Problems

[0006] In view of the above problems, an embodiment of the present invention provides a radiation imaging apparatus comprising: an imaging area in which a plurality of pixels are arranged in a matrix; a plurality of signal lines from which signals are supplied from pixels arranged in the same pixel row among the plurality of pixels; a signal processing circuit; and a drive circuit, wherein the plurality of pixels include a plurality of imaging pixels for acquiring a radiation image and a plurality of detection pixels for acquiring radiation irradiation information separately from the radiation image; the imaging area comprises a plurality of light-gathering fields each composed of a predetermined number of pixels that are continuous in the row and column directions among the plurality of pixels; each light-gathering field comprises a plurality of detection areas each containing one or more detection pixels among the plurality of detection pixels; the plurality of detection pixels are connected to different signal lines among the plurality of signal lines for each detection area of ​​the plurality of detection areas in each light-gathering field; and during radiation irradiation, the drive circuit drives the detection pixels arranged in the light-gathering fields set to acquire the irradiation information among the plurality of detection pixels, thereby the signal processing circuit acquires the irradiation information based on signals supplied from the detection pixels arranged in each of the plurality of detection areas. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technology that is advantageous for improving the accuracy of AEC. [Brief explanation of the drawing]

[0008] [Figure 1] A diagram showing an example configuration of a radiation imaging system including the radiation imaging device of this embodiment. [Figure 2] A diagram showing an example configuration of the radiation imaging device of this embodiment. [Figure 3] Figure 2 is a plan view showing an example of the pixel configuration of a radiation imaging device. [Figure 4] Figure 2 is a cross-sectional view showing an example of the pixel configuration of a radiation imaging device. [Figure 5] Figure 2 shows an example of the arrangement of the light-gathering field of a radiation imaging device. [Figure 6] Figure 5 shows a timing diagram illustrating an example of the operation of a radiation imaging device. [Figure 7] Figure 2 shows an example of the arrangement of the light-gathering field of a radiation imaging device. [Figure 8] Figure 7 shows a timing diagram illustrating an example of the operation of a radiation imaging device. [Figure 9] Figure 7 shows a timing diagram illustrating an example of the operation of a radiation imaging device. [Figure 10] Figure 7 shows a modified example of the radiation imaging device. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] Furthermore, the radiation in this disclosure may include not only alpha rays, beta rays, and gamma rays, which are beams created by particles (including photons) emitted by radioactive decay, but also beams with energy of equal or greater magnitude, such as X-rays, particle beams, and cosmic rays.

[0011] A radiation imaging device according to an embodiment of the present disclosure will be described with reference to Figures 1 to 10. Figure 1 is a diagram showing an example configuration of a radiation imaging system 500 including the radiation imaging device 100 of this embodiment. The radiation imaging system 500 includes the radiation imaging device 100, a radiation source 501, a radiation source interface 502, a communication interface 503, a controller 504, and a grid 600, and captures a radiation image of a subject 700. Figure 1 shows an example in which the radiation imaging device 100 and the radiation source 501 communicate via a wired connection. However, the system is not limited to this, and may also have a configuration in which the radiation imaging device 100 and the radiation source 501 communicate wirelessly. The grid 600 is provided for scattering removal and may not be used depending on the subject 700.

[0012] The controller 504 receives input such as dose, irradiation time (ms), tube current (mA), tube voltage (kV), and the light-gathering field, which is the area where radiation is detected. When the exposure switch attached to the radiation source 501 is operated, the controller 504 transmits a start request signal to the radiation imaging device 100. The start request signal is a signal requesting the start of radiation irradiation. Upon receiving the start request signal, the radiation imaging device 100 begins preparing to accept radiation irradiation. When the radiation imaging device 100 has finished preparing to acquire a radiation image, it transmits a start-ready signal to the radiation source interface 502 via the communication interface 503. The start-ready signal is a signal indicating that it is possible to start radiation irradiation. Upon receiving the start-ready signal, the radiation source interface 502 instructs the radiation source 501 to start irradiating with radiation.

[0013] The radiation imaging device 100 transmits a termination request signal to the radiation source interface 502 via the communication interface 503 when the cumulative dose of the irradiated radiation reaches or is expected to reach a target threshold. The termination request signal is a signal requesting the termination of radiation irradiation. Upon receiving the termination request signal, the radiation source interface 502 terminates radiation irradiation by the radiation source 501 at an appropriate time. The target threshold for dose is determined based on the input dose value, radiation irradiation intensity, communication delay between each unit, processing delay, etc.

[0014] Processing in the radiation source interface 502 in response to start-ready signals and termination request signals output from the radiation imaging device 100 may be performed by the controller 504. Furthermore, for example, the controller 504 may process the data for the radiation image output from the radiation imaging device after acquiring the radiation image, and display the radiation image on a display (not shown). The radiation source interface 502 and the controller 504 can also be said to function as signal processing units that process signals output from the radiation imaging device 100.

[0015] FIG. 2 shows a configuration example of the radiation imaging apparatus 100 of the present invention. The radiation imaging apparatus 100 includes an imaging region IR in which a plurality of pixels are arranged in a matrix, a plurality of drive lines 10 and 11, a plurality of signal lines 302 to which signals are respectively supplied from pixels arranged in the same pixel column among the plurality of pixels, a signal processing circuit 170, and a drive circuit 150. Each of the plurality of drive lines 10 and 11 is arranged corresponding to a pixel row constituted by pixels 101 arranged in the imaging region IR. Each of the plurality of signal lines 302 is arranged corresponding to a pixel column constituted by pixels 101 arranged in the imaging region IR.

[0016] The plurality of pixels 101 include a plurality of pixels 101a for acquiring a radiation image and a plurality of pixels 101c for acquiring radiation irradiation information separately from the radiation image. Further, the plurality of pixels 101 may include a plurality of pixels 101b used for correcting the radiation dose. Hereinafter, for the sake of understanding of the present disclosure, pixel 101a among the plurality of pixels 101 may be referred to as "imaging pixel" 101a. Similarly, pixel 101c may be referred to as "detection pixel" 101c and pixel 101b may be referred to as "correction pixel" 101b, respectively. When not indicating pixels for a specific application, they are simply referred to as pixels 101. As shown in FIG. 2, the plurality of detection pixels 101c and the plurality of correction pixels 101b may include detection pixels 101c and correction pixels 101b connected to the same drive line among the plurality of drive lines 10 and 11.

[0017] The imaging pixel 101a may include a conversion element 102a that converts radiation into an electrical signal, and a switch element 103a that outputs the electrical signal generated by the conversion element 102a to the corresponding signal line 302. The correction pixel 101b may include a conversion element 102b that converts radiation into an electrical signal, and a switch element 103b that outputs the electrical signal generated by the conversion element 102b to the corresponding signal line 302. The detection pixel 101c may include a conversion element 102c that converts radiation into an electrical signal, and a switch element 103c that outputs the electrical signal generated by the conversion element 102c to the corresponding signal line 302. The correction pixel 101b and the detection pixel 101c are arranged to be included in rows and columns formed by a plurality of imaging pixels 101a. Hereinafter, when the conversion element and the switch element of the pixel for a specific application are not shown, they may be simply shown as the conversion element 102 and the switch element 103.

[0018] The conversion element 102 may be composed of a scintillator that converts radiation into light and a photoelectric conversion element that converts light into an electrical signal. The scintillator is generally formed in a sheet shape so as to cover the imaging region IR and may be shared by a plurality of pixels 101. Instead of this, the conversion element 102 may be composed of a conversion element that directly converts radiation into an electrical signal.

[0019] The switch element 103 may include, for example, a thin-film transistor (TFT) whose active region is composed of a semiconductor such as amorphous silicon or polycrystalline silicon. One electrode of the conversion element 102 is connected to one main electrode of the switch element 103, and the other electrode of the conversion element 102 is connected to a bias line 17. The bias line 17 extends in the column direction between pixels 101 and is commonly connected to the other electrode of a plurality of conversion elements 102 arranged in the column direction. The bias line 17 supplies a bias potential Vs to the conversion elements 102 from the power supply circuit 140. The other main electrode of the switch element 103 of a pixel 101 included in one pixel column is connected to a corresponding signal line 302. The control electrode of the switch element 103a located in an imaging pixel 101a included in one pixel row of a plurality of pixels 101 is connected to a corresponding drive line 10. The control electrodes of the switch elements 103b and 103c, which are located on the correction pixel 101b and detection pixel 101c included in one pixel row of the multiple pixels 101, are connected to a corresponding drive line 11. In this way, the multiple imaging pixels 101a and the multiple detection pixels 101c may be connected to different drive lines from among the multiple drive lines 10 and 11. Also, the multiple imaging pixels 101a and the multiple correction pixels 101b may be connected to different drive lines from among the multiple drive lines 10 and 11.

[0020] The drive circuit 150 is configured to drive the pixels 101 to be driven by supplying drive signals to them via a plurality of drive lines 10 and 11, according to control signals supplied from the control circuit 180. The drive line 10 to which the imaging pixel 101a is connected and the drive line 11 to which the detection pixel 101c and correction pixel 101b are connected may each be connected to different drive circuits. Specifically, the drive line 10 may be connected to a drive circuit for imaging, and the drive line 11 may be connected to a drive circuit for detecting radiation irradiation information. In this embodiment, the drive signal is a signal to turn on the switch element 103 included in the pixel 101 to be driven. For example, the switch element 103 of each pixel 101 may turn on with a high-level signal and turn off with a low-level signal. Therefore, in this embodiment, this high-level signal is called the drive signal. However, it is not limited to this, and the switch element 103 may turn on with a low-level signal and turn off with a high-level signal. When a drive signal is supplied to the pixel 101, the signal (electricity) converted from radiation and stored by the conversion element 102 of the pixel 101 becomes readable by the readout circuit 160.

[0021] The readout circuit 160 is configured to read signals output from each of the multiple pixels 101 to the corresponding signal lines 302. The readout circuit 160 may include multiple amplifier circuits 161, a multiplexer 162, and an analog-to-digital (AD) converter 163, each corresponding to one of the multiple signal lines 302. Each of the multiple signal lines 302 is connected to the corresponding amplifier circuit 161 among the multiple amplifier circuits 161 arranged in the readout circuit 160. One signal line 302 corresponds to one amplifier circuit 161. The multiplexer 162 selects the multiple amplifier circuits 161 in a predetermined order and supplies the signals from the selected amplifier circuits 161 to the AD converter 163. The AD converter 163 converts the supplied signals into digital signals and outputs them.

[0022] The signal read from the imaging pixel 101a is supplied to the signal processing circuit 170, which performs calculations, storage, and other processing. Specifically, the signal processing circuit 170 may include an arithmetic circuit 171 and a storage circuit 172. The arithmetic circuit 171 generates image data for a radiation image based on the signal read from the imaging pixel 101a and supplies it to the control circuit 180. Since there is no imaging pixel 101a at the coordinates where the detection pixel 101c and correction pixel 101b are located, these may be missing in the radiation image. Therefore, when generating image data for a radiation image, the signal processing circuit 170 may use the signal read from an imaging pixel 101a in the vicinity of the missing area to fill in the missing area. The signals read from the correction pixel 101b and detection pixel 101c are supplied to the signal processing circuit 170, and calculations, storage, and other processing are performed by the arithmetic circuit 171. Specifically, the signal processing circuit 170 outputs irradiation information indicating radiation irradiation to the radiation imaging device 100 based on the signal read from the detection pixel 101c. For example, the signal processing circuit 170 may detect the start or end of radiation irradiation to the imaging area IR, or it may determine the radiation dose or the cumulative radiation dose.

[0023] The control circuit 180 controls the entire radiation imaging device 100. The control circuit 180 may also control the drive circuit 150 and the readout circuit 160 based on the irradiation information supplied from the signal processing circuit 170. Furthermore, the control circuit 180 may also control, for example, the start and end of exposure (accumulation of charge corresponding to the irradiated radiation by the imaging pixel 101a) based on the irradiation information supplied from the signal processing circuit 170.

[0024] To determine the radiation dose, the control circuit 180 controls the drive circuit 150 to scan only the drive line 11 during radiation irradiation, making it possible to read signals from the correction pixel 101b and the detection pixel 101c. Next, the control circuit 180 controls the readout circuit 160 to read the signals supplied to the signal line 302 arranged in the pixel rows corresponding to the correction pixel 101b and the detection pixel 101c, and obtains irradiation information indicating the radiation dose. Through this operation, the radiation imaging device 100 can obtain irradiation information in the detection pixel 101c during radiation irradiation. One or more correction pixels 101b, detection pixels 101c, and drive lines 11 are arranged in the light-gathering field, which is the area for detecting radiation. In addition, one or more such light-gathering fields are arranged in the imaging area IR. By driving the correction pixels 101b and detection pixels 101c via drive lines 11 arranged in the light-gathering field set for acquiring irradiation information, signals are read from the correction pixels 101b and detection pixels 101c, and irradiation information corresponding to the radiation dose incident in the selected light-gathering field is acquired. The setting of the light-gathering field for acquiring irradiation information can be performed by the user operating the controller 504. For example, the user may select the light-gathering field to be used, or the control circuit 180 may select an appropriate light-gathering field according to information such as the area to be imaged and the setting of the mAs value.

[0025] Figure 3 shows a plan view of pixels 101 arranged in the imaging region IR. Figure 3 shows 12 pixels 101, all of which are imaging pixels 101a except for one correction pixel 101b and one detection pixel 101c. As described above, a conversion element 102 is arranged in each pixel 101. A bias line 17 is placed above the conversion element 102, and the upper electrode of the conversion element 102 is connected to the bias line 17. The aperture region, which is the area in which light converted from radiation by radiation or a scintillator can be detected, can be the area of ​​the conversion element 102 that is not shielded by the bias line 17. As shown in Figure 3, in order to increase the sensitivity of the imaging pixels 101a and detection pixels 101c to radiation, the area of ​​the aperture region of the imaging pixels 101a and detection pixels 101c can be designed to be as large as possible. A charge corresponding to the radiation incident in this aperture region is accumulated in the conversion element 102, and the accumulated charge is supplied to the signal line 302 via the switch element 103.

[0026] Figure 4(a) is a cross-sectional view of the detection pixel 101c along A-A' in Figure 3. The conversion element 102c is depicted on the left side of Figure 4(a), and the switch element 103c is depicted on the right side. The switch element 103c may include a gate electrode 301, electrodes 300 and 303 that function as source or drain electrodes, an insulating layer 304, a semiconductor layer 305, and an impurity semiconductor layer 306. The conversion element 102c may include a lower electrode 307, an impurity semiconductor layer 308, a semiconductor layer 309, an impurity semiconductor layer 310, an upper electrode 311, and a protective layer 312. Electrode 303 is connected to the lower electrode 307. The upper electrode 311 is connected to the bias line 17 via a contact via. The gate electrode 301 of the switch element 103c constitutes part of the drive line 11, and electrode 300 constitutes part of the signal line 302. A drive signal is supplied to the drive line 11, and the switch element 103c turns on, transferring the charge accumulated in the conversion element 102c as an electrical signal to the signal line 302. A light-shielding layer made of metal or the like may be placed on top of the switch element 103c. The light-shielding layer may be made of the same metal layer as the bias line 17, for example, and the light-shielding layer and the bias line may be connected. By shielding the switch element 103c from light, light is irradiated onto the semiconductor layer of the switch element 103c, which can suppress the generation of charge that causes noise and the leakage of charge accumulated in the conversion element 102c. The imaging pixel 101a may also have a configuration similar to the detection pixel 101c, except that the drive line to which it is connected is the drive line 10. Therefore, the cross-sectional structure of the imaging pixel 101a will not be explained here.

[0027] Figure 4(b) is a cross-sectional view of the correction pixel 101b along B-B' in Figure 3. The correction pixel 101b differs from the detection pixel 101c in that the conversion element 102b is covered by a light-shielding layer. Other components of the correction pixel 101b may be the same as those of the detection pixel 101c. The light-shielding layer is made of, for example, the same metal layer as the bias wire 17. Although not shown in Figures 4(a) and 4(b), a scintillator is placed above the layer where the bias wire 17 is located (on the side opposite to the conversion element 102). Also, when a conversion element 102 that directly converts radiation into an electrical signal is used, for example, tungsten may be used as the bias wire 17. As a result, the correction pixel 101b has a different sensitivity to radiation than the imaging pixel 101a and the detection pixel 101b. More specifically, the sensitivity of the correction pixel 101b to radiation is significantly lower than that of the imaging pixel 101a and the detection pixel 101c. For example, the output of the correction pixel 101b can be said to be independent of the radiation incident on the correction pixel 101b.

[0028] Figure 5 is a diagram illustrating the light-gathering fields arranged within the imaging area IR. The light-gathering field is an area set up to acquire radiation irradiation information separately from the radiation image. The configuration shown in Figure 5 shows an example in which five light-gathering fields 401 to 405 are arranged within the imaging area IR. The light-gathering fields 401 to 405 are areas that detect the dose of incident radiation as irradiation information during radiation irradiation. The radiation dose is detected using multiple detection pixels 101c arranged within the light-gathering fields 401 to 405. Multiple light-gathering fields 401 to 405 are arranged within the imaging area IR, but there are various ways in which the light-gathering fields 401 to 405 are arranged. For example, by arranging the light-gathering fields symmetrically with respect to the center of the imaging area IR, each light-gathering field 401 to 405 can be used in the same way regardless of the orientation in which the radiation imaging device 100 is used. The shape of the light-gathering fields may be a square, rectangle, circle, or ellipse. Furthermore, the shapes of the light-gathering fields 401 to 405 may be shaped to conform to the shape of the subject. As shown in Figure 5, each of the light-gathering fields 401 to 405 can be composed of a predetermined number of pixels 101 that are continuous in the row and column directions, for example. Automatic exposure control (AEC) detects the dose of radiation irradiated into the light-gathering fields 401 to 405 by reading out the outputs of multiple detection pixels 101c arranged in the light-gathering fields 401 to 405 during radiation irradiation. Depending on conditions such as the area being photographed, it is possible to arbitrarily set which of the light-gathering fields 401 to 405 is used to detect the dose of incident radiation.

[0029] As shown in Figure 5, each of the light-gathering fields 401 to 405 comprises multiple detection regions, each containing one or more detection pixels 101c from a plurality of detection pixels 101c. In the configuration shown in Figure 5, each of the light-gathering fields 401 to 405 is composed of four detection regions. Specifically, light-gathering field 401 is composed of detection regions 4011 to 4014, light-gathering field 402 is composed of detection regions 4021 to 4024, light-gathering field 403 is composed of detection regions 4031 to 4034, light-gathering field 404 is composed of detection regions 4041 to 4044, and light-gathering field 405 is composed of detection regions 4051 to 4054. It can also be said that each of the light-gathering fields 401 to 405 comprises a detection region composed of a predetermined number of pixels 101 that are consecutive in the row and column directions from a plurality of pixels 101. Furthermore, as shown in Figure 5, each of the multiple detection regions 4011 to 4054 that constitute each of the light-gathering fields 401 to 405 may contain one or more correction pixels 101b from among the multiple correction pixels 101b. Here, the number of detection regions arranged in one light-gathering field is not limited to four, but may be two, three, or five or more.

[0030] Furthermore, in each of the light-gathering fields 401 to 405, multiple detection pixels 101c are connected to different signal lines from among the multiple signal lines 302 for each of the multiple detection regions 4011 to 4054. Similarly, in each of the light-gathering fields 401 to 405, multiple correction pixels 101b are connected to different signal lines from among the multiple signal lines 302 for each of the multiple detection regions 4011 to 4054. As a result, during radiation irradiation, the drive circuit 150 drives the detection pixels from among the multiple detection pixels 101c that are arranged in the light-gathering fields set to acquire irradiation information, so that the signal processing circuit 170 can acquire irradiation information based on the signals supplied from the detection pixels 101c arranged in each of the multiple detection regions. Furthermore, the drive circuit 150 can simultaneously drive detection pixels 101c, each located in multiple detection regions (e.g., detection regions 4011 to 4014) within each of the light-gathering fields (e.g., light-gathering field 401) set up to acquire irradiation information such as radiation dose. Similarly, the drive circuit 150 can simultaneously drive correction pixels 101b, each located in multiple detection regions (e.g., detection regions 4011 to 4014) within each of the light-gathering fields (e.g., light-gathering field 401) within the set light-gathering fields, at the same time as the detection pixels 101b.

[0031] In each light-gathering field, the detection pixels 101c are connected to different signal lines from among the multiple signal lines 302 for each detection area. Therefore, signals can be individually acquired from the detection pixels 101c located in each detection area. For example, consider a case where, among the detection areas 4011 to 4014 that make up the light-gathering field 401, the target area is not located in detection area 4011, resulting in a gap, while the target area overlaps in the other detection areas 4012 to 4014. In this case, the signal value output from the detection pixel 101c located in detection area 4011 may be larger than the signal values ​​output from the detection pixels 101c located in the other detection areas 4012 to 4014. In this case, the signal processing circuit 170 selects a detection area from among the multiple detection areas 4011 to 4014 for acquiring irradiation information such as radiation dose, based on the signals output from the detection pixels 101c located in each of the multiple detection areas 4011 to 4014. In the above case, the signal processing circuit 170 selects detection regions 4012 to 4014 as detection regions to acquire irradiation information. As a result, the signal processing circuit 170 acquires irradiation information based on the output of detection pixels 101c located in the selected detection regions 4012 to 4014 from among the multiple detection regions 4011 to 4014. This improves the detection accuracy of AEC in the radiation imaging device 100. Furthermore, in each light-gathering field, signals are simultaneously read from detection pixels 101c (and correction pixels 101b) located in all detection regions. This enables faster detection of radiation dose and further improves the detection accuracy of AEC.

[0032] Furthermore, in the configuration shown in Figure 5, the detection pixels 101c and correction pixels 101b for each of the five light-gathering fields 401 to 405, which each have four detection areas 4011 to 4054, are all connected to different signal lines 302. This configuration makes it possible to simultaneously read signals from the detection pixels 101c and correction pixels 101b located in all of the detection areas 4011 to 4054 of the light-gathering fields 401 to 405. As a result, dose detection operations in AEC can be performed at high speed, and consequently, the exposure dose can be reduced.

[0033] Figure 6 shows an example of operation of a radiation imaging device 100 having the configuration shown in Figure 5. Vg1 to Vgn shown in Figure 6 represent signals supplied to each of the drive lines 10 corresponding to the pixel rows from the 1st to the nth row in order to drive the imaging pixels 101a. Vd1 to Vd18 represent signals supplied to the drive lines 11 corresponding to the pixel rows where the detection pixels 101c and correction pixels 101b are located, in order to drive the detection pixels 101c and correction pixels 101b, as also shown in Figure 5. For example, Vd1 is a signal for driving the detection pixels 101c and correction pixels 101b located in a certain pixel row located in the detection areas 4011 and 4012 of the light field 401, and the detection areas 4041 and 4042 of the light field 404.

[0034] The radiation imaging device 100 starts a reset operation at time t0 and repeats the reset operation. The reset operation can be an operation to sweep out the charge accumulated in the conversion elements 102 arranged in each pixel 101. Next, from time t1, the same operation as the readout operation performed during radiation irradiation is started. This is an offset signal readout operation to obtain the correction value Od of the offset signal of the detection pixel 101c and the correction value Oc of the offset signal of the correction pixel 101b. Here, the readout operation is an operation to supply a drive signal to the drive line 11 and read out the signals caused by the charge accumulated in the detection pixel 101c and the correction pixel 101b. By obtaining the offset correction value before receiving the radiation irradiation start request signal, the correction value can be obtained without affecting the radiation exposure delay. Therefore, it is possible to perform many readout operations in the offset signal readout operation (for example, several thousand times), and by averaging the readout signals, the effect of noise in the offset correction value can be suppressed, and the correction accuracy can be improved. After performing a predetermined number of offset signal readout operations, the radiation imaging device 100 repeats the reset operation again from time t2. When the radiation imaging device 100 receives a signal requesting the start of radiation irradiation at time t3, it performs a reset operation that scans all drive lines 10 and 11, including the drive lines 11 connected to the detection pixel 101c and the correction pixel 101b, and then starts the readout operation from time t4. Then, the radiation imaging device 100 transmits a signal ready to start at time t5, and radiation irradiation starts from time t6. Since the offset correction value has been acquired as described above, it is possible to start radiation irradiation immediately after receiving the start request signal, and the exposure delay corresponding to the acquisition of the offset correction value can be shortened. Alternatively, after transitioning from the reset operation to the readout operation, the signal ready to start may be transmitted after a predetermined time (for example, several ms to tens of ms) has elapsed, and radiation irradiation may be started. This makes it possible to suppress the reading of signals from the detection pixel 101c and the correction pixel 101b during the period of large output fluctuations immediately after switching from the reset operation to the readout operation.After radiation irradiation begins, the signal values ​​output from the detection pixel 101c and the correction pixel 101b are corrected using offset correction values ​​Od and Oc to obtain the dose of incident radiation. Specifically, the signal processing circuit 170 corrects the signal value Sd of the signal output from the detection pixel 101c and the signal Sc of the signal output from the correction pixel 101b during radiation irradiation by calculating the difference as shown in the following formula. DOSE = (Sd - Od) - (Sc - Oc) This allows offset correction to be performed on the signals output from the detection pixel 101c and the correction pixel 101b.

[0035] Here, as an example, a method for acquiring the offset correction value during the reset operation period before receiving the start request signal is shown. However, it is not limited to this. The timing for acquiring the offset correction value may be after receiving the start request signal and before transmitting the irradiation start ready signal. By acquiring the offset correction value immediately before radiation irradiation in this way, the effects of offset fluctuations caused by temperature changes of the radiation imaging device 100 can be suppressed. Furthermore, as in this embodiment, by correcting the signal read from the detection pixel 101c using the signal of the correction pixel 101b read out simultaneously, the dark component included in the signal output from the detection pixel 101c can be corrected.

[0036] Furthermore, since the detection pixels 101c and correction pixels 101b arranged in the light-gathering fields 401 to 405 are connected to different signal lines 302 for each detection area, the drive lines 11 (Vd1 to Vd18) can acquire signals output individually from the detection pixels 101c and correction pixels 101b for each detection area 4011 to 4054, even when drive signals are supplied at the same timing. This enables faster dose detection operation in AEC, and as a result, makes it possible to suppress the exposure dose.

[0037] Furthermore, in the configuration shown in Figure 5, three detection pixels 101c and three correction pixels 101b are connected to a single signal line 302, but this can be two or fewer pixels, or four or more pixels. Increasing the number of detection pixels 101c and correction pixels 101b can be expected to improve the SNR and the accuracy of offset correction. On the other hand, if the number of detection pixels 101c and correction pixels 101b becomes too large, the number of missing pixels where imaging pixels 101a are not placed will increase, making correction by image processing difficult. Therefore, the placement position and number of detection pixels 101c and correction pixels 101b should be determined appropriately, taking into account these trade-offs.

[0038] Next, we will describe a different arrangement of light fields from the embodiment described above using Figures 7(a) and 7(b). Figure 7(a) is a diagram showing the arrangement of light fields 821 to 825 in this embodiment. Figure 7(b) is a diagram focusing on light fields 801 to 805, which are arranged in a row on the left side of the 25 light fields 801 to 825 shown in Figure 7(a).

[0039] As shown in Figure 7(a), compared to the embodiment described above, the number of light-gathering fields in the imaging area IR has increased to 25 fields in a 5x5 arrangement. Also, as shown in Figure 7(b), this includes both cases where the detection pixels 101c and correction pixels 101b located in different light-gathering fields are connected to the same signal line 302, and cases where they are connected to different signal lines 302. On the other hand, similar to the embodiment described above, each light-gathering field 801 to 825 is divided into four detection areas as shown by the dashed lines, and within each light-gathering field 801 to 825, the detection pixels 101c and correction pixels 101b located in the four detection areas are connected to different signal lines 302 for each detection area.

[0040] As shown in Figure 7(b), the detection pixels 101c located in the light field 801, the detection pixels 101c located in the light field 803, and the detection pixels 101c located in the light field 804 are all connected to the same signal line 302. Similarly, the detection pixels 101c located in the light field 802 and the detection pixels 101c located in the light field 805 are all connected to the same signal line 302. Likewise, the correction pixels 101b located in the light field 801, the correction pixels 101b located in the light field 803, and the correction pixels 101b located in the light field 804 are all connected to the same signal line 302. Furthermore, the correction pixels 101b located in the light field 802 and the correction pixels 101b located in the light field 805 are all connected to the same signal line 302. On the other hand, the detection pixels 101c located in light fields 801, 803, and 804 are connected to different signal lines 302 than the detection pixels 101c located in light fields 802 and 805. Similarly, the correction pixels 101b located in light fields 801, 803, and 804 are connected to different signal lines 302 than the correction pixels 101b located in light fields 802 and 805.

[0041] In such a case, we consider individually acquiring the signals output from the detection pixels 101c and correction pixels 101b for each detection area. In this case, the detection pixels 101c and correction pixels 101b located in the light field 801, the detection pixels 101c and correction pixels 101b located in the light field 803, and the detection pixels 101c and correction pixels 101b located in the light field 804 need to be driven at different timings. Similarly, the detection pixels 101c and correction pixels 101b located in the light field 802 and the detection pixels 101c and correction pixels 101b located in the light field 805 need to be driven at different timings. On the other hand, the detection pixels 101c and correction pixels 101b located in the light fields 801, 803, and 804 can be driven at the same timing as the detection pixels 101c and correction pixels 101b located in the light fields 802 and 805.

[0042] Here, Figure 7(b) shows a diagram focusing on the light-gathering fields 801-805 arranged in the column direction of the leftmost column shown in Figure 7(a). However, in the other four columns as well, detection pixels 101c and correction pixels 101b may be arranged at the same positions (pixel rows) as in the light-gathering fields 801-805. This allows all detection pixels 101c and correction pixels 101b arranged in the imaging area IR to be driven using the 30 drive lines 11 to which signals Vd1-Vd30 are supplied.

[0043] Next, using Figure 8, we will explain an example of operation when all of the 25 light-gathering fields 801 to 825 shown in Figure 7(a) are selected to acquire irradiation information such as the incident radiation dose. The difference from the operation example shown in Figure 6 is that, although they are located in different detection areas, the timing of supplying the drive signal to the drive line 11 is divided in order to individually acquire signals from the detection pixels 101c and correction pixels 101b that are connected to the same signal line 302. As shown in Figure 8, the drive signals are supplied to the drive line 11 in three groups: a group of drive lines 11 supplied with Vd1 to 12, a group of drive lines 11 supplied with Vd13 to 18, and a group of drive lines 11 supplied with Vd19 to 30. As a result, the detection pixels 101c and correction pixels 101b connected to the same signal line 302 are driven at different timings and can acquire signals individually. In other words, in each light-gathering field 801 to 825, signals can be acquired from the detection pixels 101c and correction pixels 101b for each detection area. Furthermore, detection pixels 101c and correction pixels 101b connected to different signal lines 302 can read signals at the same timing. As in this embodiment, as the number of settings in the imaging area IR of the light field used for AEC increases, it becomes difficult to separate the signal lines 302 connected to the detection pixels 101c and correction pixels 101b that are placed in all detection areas. Therefore, to the extent possible, detection pixels 101c and correction pixels 101b are connected to different signal lines 302 for each detection area. Also, even when detection pixels 101c and correction pixels 101b of different detection areas are connected to the same signal line 302, the drive timing is separated. This makes it possible to read signals individually from detection pixels 101c and correction pixels 101b for each detection area in each light field 801 to 825.

[0044] Furthermore, in the configuration examples shown in Figures 5 and 7(b), the drive circuit 150 is equipped with multiple output terminals corresponding to each of the multiple drive lines 10 and 11. It can also be said that the drive lines 10 and 11 are all wired so that they can each receive a drive signal from the drive circuit 150 individually. For example, it is conceivable to bundle the drive lines 11 that are driven simultaneously into a single wiring pattern before the drive circuit 150, but in that case, the wiring capacitance of the drive lines 11 would become excessive, and there is a possibility that the pulse of the drive signal will be delayed when the drive signal is supplied. For this reason, the radiation imaging device 100 of this embodiment is wired so that each of the drive lines 10 and 11 can be supplied with a drive signal individually from the drive circuit 150.

[0045] The operation example shown in Figure 8 shows the drive timing when all 25 light-gathering fields 801 to 825 shown in Figure 7(a) are selected to acquire illumination information. Figure 9 shows an operation example when three of the light-gathering fields 807, 813, and 817 shown in Figure 7(a) are selected to acquire illumination information. In Figure 8, the detection pixels 101c and correction pixels 101b were driven by three groups of drive lines 11 supplied with Vd1 to 12, drive lines 11 supplied with Vd13 to 18, and drive lines 11 supplied with Vd19 to 30. On the other hand, in the operation example shown in Figure 9, the drive line group 11 supplied with Vd7 to 18 is driven all at once. The drive line group 11 supplied with Vd7 to 18 has four detection regions arranged in the column direction, but the signal lines 302 to which the detection pixels 101c and correction pixels 101b are connected are different for each detection region. Therefore, even when the group of drive lines 11 supplied with Vd7 to Vd18 are driven collectively, it is possible to acquire signals individually from the detection pixels 101c and correction pixels 101b for each detection area in each of the light-gathering fields 807, 813, and 817. Furthermore, in the operation example shown in Figure 8, the timing of the supply of drive signals is different for the group of drive lines 11 supplied with Vd7 to Vd12 and the group of drive lines 11 supplied with Vd13 to Vd18. On the other hand, in the operation example shown in Figure 9, the drive signals are supplied at the same timing to the group of drive lines 11 supplied with Vd7 to Vd12 and the group of drive lines 11 supplied with Vd13 to Vd18. This is because the primary objective is to acquire signals from the detection pixels 101c and correction pixels 101b separately for each detection area in each light-gathering field. Moreover, ideally, the temporal resolution of the AEC can be increased by simultaneously acquiring illumination information for the detection area of ​​the selected light-gathering field and increasing the readout interval frequency. Therefore, if the signal lines 302 to which the detection pixels 101c and correction pixels 101b, which are placed in the light-gathering field selected for acquiring illumination information, are connected differ for each light-gathering field, the drive signal is supplied to all of the drive lines 11 that are to be read out at the same timing.On the other hand, if the detection pixels 101c and correction pixels 101b located in the selected light-gathering field are connected to the same signal line 302, drive signals are supplied to the drive line 11 at different timings so that signals can be acquired individually from the detection pixels 101c and correction pixels 101b. In this way, the radiation imaging device 100 may switch the drive control during the readout operation depending on the light-gathering field selected to acquire irradiation information such as the incident radiation dose.

[0046] Furthermore, for example, AEC is often performed using a light-gathering field located in the center of the imaging area IR. Therefore, for example, in the configuration shown in Figure 7(b), the detection pixels 101c and correction pixels 101b located in light-gathering field 803 and the detection pixels 101c and correction pixels 101b located in light-gathering field 804 may be connected to different signal lines 302. As described above, signals can be acquired at the same timing from the detection pixels 101c and correction pixels 101b located in the light-gathering fields (light-gathering fields 807, 817) arranged in the row direction with light-gathering field 802 and the light-gathering field (light-gathering field 813) arranged in the row direction with light-gathering field 803, respectively. In addition, signals can be acquired at the same timing from the detection pixels 101c and correction pixels 101b located in the light-gathering fields arranged in the row direction with light-gathering field 803 and the light-gathering field arranged in the row direction with light-gathering field 804, respectively.

[0047] Furthermore, as shown in Figure 10, the drive circuit 150 may be configured to include a plurality of drive chips 151a to 151i. Each of the drive chips 151a to 151i may individually include, for example, a shift register for sequentially outputting drive signals to drive lines 10 and 11. Alternatively, it can be said that there are no shift registers for sequentially outputting drive signals to drive lines 10 and 11 across each of the drive chips 151a to 151i. Here, each of the drive chips 151a to 151i is connected to drive a detection pixel 101c and a correction pixel 101b located in one of the multiple light-gathering fields 801 to 805 arranged in a row. It can also be said that the detection pixels 101c (correction pixels 101b) located in the light-gathering fields 801 to 805, which are arranged in a row, are driven by different drive chips from among the multiple drive chips 151a to 151i for each light-gathering field. In this way, the drive chips 151a to 151b are connected to the drive line 11 so as not to span two or more light-gathering fields among the light-gathering fields 801 to 805 which are arranged in a row. Attempting to individually control the detection pixels 101c and correction pixels 101b located in two or more light-gathering fields arranged in a row with a single drive chip 151 (drive circuit 150) may make the driving complex. Furthermore, depending on the specifications of the drive chip 151 (drive circuit 150), it may not be possible to support the above-described example of operation (for example, the example of operation shown in Figure 8). Therefore, the drive chips 151a to 151i constituting the drive circuit 150 may be connected to the drive lines 10 and 11 respectively, so as not to straddle the light-gathering fields 801 to 805 which are arranged in a row direction. Although the connection of multiple drive chips 151a to 151i to the drive lines 10 is not described here, they may be connected as appropriate. In addition, multiple drive chips 151 other than the drive chips 151a to 151i may be provided in the drive circuit 150 and connected to the corresponding drive lines 10.

[0048] Furthermore, as mentioned above, the central part of the imaging area IR is frequently used for AEC and other purposes. For this reason, illumination information may be acquired using only the light-gathering fields 808, 813, 818, and 823, which are arranged in the row direction with light-gathering field 803. Even in such cases, the operation of the drive chip 151 can be simplified by connecting a single drive chip 151 to the drive line 11 in such a way that it does not span two or more light-gathering fields. Alternatively, one drive chip 151 may be assigned to one light-gathering field, as with drive chip 151e, or two or more drive chips 151 may be assigned to one light-gathering field, as with the other drive chips 151 shown in Figure 10.

[0049] The disclosures herein include the following radiographic imaging devices and radiographic imaging systems.

[0050] (Item 1) A radiation imaging apparatus comprising: an imaging area in which multiple pixels are arranged in a matrix; multiple signal lines from which signals are supplied from pixels arranged in the same pixel row among the multiple pixels; a signal processing circuit; and a drive circuit, The plurality of pixels include a plurality of imaging pixels for acquiring a radiation image and a plurality of detection pixels for acquiring radiation irradiation information separately from the radiation image. The imaging area comprises a plurality of light-gathering fields, each composed of a predetermined number of pixels that are continuous in the row and column directions from among the plurality of pixels. Each light-gathering field comprises a plurality of detection regions, each containing one or more detection pixels from the plurality of detection pixels, and in each light-gathering field, the plurality of detection pixels are connected to different signal lines from the plurality of signal lines for each detection region of the plurality of detection regions. A radiation imaging apparatus characterized in that, during radiation irradiation, the drive circuit drives a detection pixel among the plurality of detection pixels that is arranged in a light-gathering field set to acquire the irradiation information, and the signal processing circuit acquires the irradiation information based on signals supplied from the detection pixels arranged in each of the plurality of detection regions.

[0051] (Item 2) The signal processing circuit, during radiation irradiation, for each of the set light-gathering fields, Based on the signals output from the detection pixels arranged in each of the plurality of detection regions, a detection region for acquiring the irradiation information is selected from among the plurality of detection regions. The radiation imaging device according to item 1, characterized in that it acquires irradiation information based on the output of a detection pixel located in a detection region selected from among the plurality of detection regions.

[0052] (Item 3) The radiation imaging apparatus according to item 1 or 2, characterized in that the drive circuit simultaneously drives the detection pixels arranged in each of the plurality of detection regions within each of the set light-gathering fields.

[0053] (Item 4) The plurality of pixels further include a plurality of correction pixels that have different sensitivities to radiation from the plurality of detection pixels. Each of the plurality of detection regions includes one or more correction pixels from the plurality of correction pixels, The radiation imaging apparatus according to any one of items 1 to 3, characterized in that the plurality of correction pixels are connected to different signal lines from among the plurality of signal lines for each detection area of ​​the plurality of detection areas.

[0054] (Item 5) The drive circuit drives the plurality of pixels via a plurality of drive lines, The radiation imaging apparatus according to item 4, characterized in that the plurality of detection pixels and the plurality of correction pixels include detection pixels and correction pixels connected to the same drive line among the plurality of drive lines in each detection region.

[0055] (Item 6) The drive circuit drives the plurality of pixels via a plurality of drive lines, The radiation imaging apparatus according to any one of items 1 to 5, characterized in that the plurality of imaging pixels and the plurality of detection pixels are connected to different drive lines among the plurality of drive lines.

[0056] (Item 7) The radiation imaging apparatus according to item 6, characterized in that the drive circuit is provided with a plurality of output terminals corresponding to each of the plurality of drive lines.

[0057] (Item 8) The plurality of light-gathering fields include a first light-gathering field and a second light-gathering field arranged in a row direction, Of the plurality of detection pixels, the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field are connected to the same signal line among the plurality of signal lines. A radiation imaging apparatus according to any one of items 1 to 7, characterized in that, during radiation irradiation, the drive circuit drives the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field at different timings from each other.

[0058] (Item 9) The plurality of light-gathering fields further include a third light-gathering field arranged in a row with the first light-gathering field, Of the plurality of detection pixels, the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the third light-gathering field are connected to different signal lines among the plurality of signal lines. The radiation imaging apparatus according to item 8, characterized in that, during radiation irradiation, the drive circuit drives the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the third light-gathering field at the same timing.

[0059] (Item 10) The plurality of light-gathering fields include a first light-gathering field and a second light-gathering field arranged in a row direction, Of the plurality of detection pixels, the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field are connected to different signal lines from among the plurality of signal lines. A radiation imaging apparatus according to any one of items 1 to 7, characterized in that, during radiation irradiation, the drive circuit drives the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field at the same timing.

[0060] (Item 11) The aforementioned drive circuit is composed of multiple drive chips, The aforementioned plurality of light-gathering fields include two or more light-gathering fields arranged in a row direction, The radiation imaging apparatus according to any one of items 1 to 10, characterized in that the detection pixels, among the plurality of detection pixels, arranged in two or more light-gathering fields, are driven by different drive chips among the plurality of drive chips for each of the two or more light-gathering fields.

[0061] (Item 12) A radiographic imaging device described in any one of items 1 through 11, A signal processing unit that processes signals output from the aforementioned radiation imaging device, A radiation imaging system characterized by having the following features.

[0062] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0063] 100: Radiation imaging device, 101: Pixel, 101a: Imaging pixel, 101c: Detection pixel, 150: Drive circuit, 170: Signal processing circuit, 302: Signal line, 401~405, 801~825: Light-gathering field, 4011~4054: Detection area

Claims

1. A radiation imaging apparatus comprising: an imaging area in which multiple pixels are arranged in a matrix; multiple signal lines from which signals are supplied from pixels arranged in the same pixel row among the multiple pixels; a signal processing circuit; and a drive circuit, The plurality of pixels include a plurality of imaging pixels for acquiring a radiation image and a plurality of detection pixels for acquiring radiation irradiation information separately from the radiation image. The imaging area comprises a plurality of light-gathering fields, each composed of a predetermined number of pixels that are continuous in the row and column directions from among the plurality of pixels. Each light-gathering field comprises a plurality of detection regions, each containing one or more detection pixels from the plurality of detection pixels, and in each light-gathering field, the plurality of detection pixels are connected to different signal lines from the plurality of signal lines for each detection region of the plurality of detection regions. A radiation imaging apparatus characterized in that, during radiation irradiation, the drive circuit drives a detection pixel among the plurality of detection pixels that is arranged in a light-gathering field set to acquire the irradiation information, and the signal processing circuit acquires the irradiation information based on signals supplied from the detection pixels arranged in each of the plurality of detection regions.

2. The signal processing circuit, during radiation irradiation, for each of the set light-gathering fields, Based on the signals output from the detection pixels arranged in each of the plurality of detection regions, a detection region for acquiring the irradiation information is selected from among the plurality of detection regions. The radiation imaging apparatus according to claim 1, characterized in that it acquires irradiation information based on the output of a detection pixel located in a detection region selected from among the plurality of detection regions.

3. The radiation imaging apparatus according to claim 1, characterized in that the drive circuit simultaneously drives the detection pixels arranged in each of the plurality of detection regions within each of the set light-gathering fields.

4. The plurality of pixels further include a plurality of correction pixels that have different sensitivities to radiation from the plurality of detection pixels. Each of the plurality of detection regions includes one or more correction pixels from the plurality of correction pixels, The radiation imaging apparatus according to claim 1, characterized in that the plurality of correction pixels are connected to different signal lines from the plurality of signal lines for each detection area of ​​the plurality of detection areas.

5. The drive circuit drives the plurality of pixels via a plurality of drive lines, The radiation imaging apparatus according to claim 4, characterized in that the plurality of detection pixels and the plurality of correction pixels include detection pixels and correction pixels connected to the same drive line among the plurality of drive lines in each detection region.

6. The drive circuit drives the plurality of pixels via a plurality of drive lines, The radiation imaging apparatus according to claim 1, characterized in that the plurality of imaging pixels and the plurality of detection pixels are connected to different drive lines among the plurality of drive lines.

7. The radiation imaging apparatus according to claim 6, characterized in that the drive circuit is provided with a plurality of output terminals corresponding to each of the plurality of drive lines.

8. The plurality of light-gathering fields include a first light-gathering field and a second light-gathering field arranged in a row direction, Of the plurality of detection pixels, the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field are connected to the same signal line among the plurality of signal lines. The radiation imaging apparatus according to claim 1, characterized in that, during radiation irradiation, the drive circuit drives the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field at different timings from each other.

9. The plurality of light-gathering fields further include a third light-gathering field arranged in a row with the first light-gathering field, Of the plurality of detection pixels, the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the third light-gathering field are connected to different signal lines among the plurality of signal lines. The radiation imaging apparatus according to claim 8, characterized in that, during radiation irradiation, the drive circuit drives the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the third light-gathering field at the same timing.

10. The plurality of light-gathering fields include a first light-gathering field and a second light-gathering field arranged in a row direction, Of the plurality of detection pixels, the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field are connected to different signal lines from among the plurality of signal lines. The radiation imaging apparatus according to claim 1, characterized in that, during radiation irradiation, the drive circuit drives the detection pixels arranged in the first light-gathering field and the detection pixels arranged in the second light-gathering field at the same timing.

11. The aforementioned drive circuit is composed of multiple drive chips, The aforementioned plurality of light-gathering fields include two or more light-gathering fields arranged in a row direction, The radiation imaging apparatus according to claim 1, characterized in that the detection pixels, among the plurality of detection pixels, arranged in two or more light-gathering fields, are driven by different drive chips among the plurality of drive chips for each of the two or more light-gathering fields.

12. A radiation imaging apparatus according to any one of claims 1 to 11, A signal processing unit that processes signals output from the aforementioned radiation imaging device, A radiation imaging system characterized by having the following features.

Images