Imaging device

Abstract

The present invention provides an imaging device that is equipped with a heat dissipation section having a fan and can be held by hand for shooting. [Solution] The imaging device includes a heat dissipation unit that draws in air from below and exhausts it from above when the imaging device is held horizontally, a first heat transfer member that transfers heat generated by the processing unit to the upper part of the front cover, and a lens mount to which the lens unit can be attached and detached. The heat dissipation unit is attached to a part that the user does not touch when taking pictures, and a part of the heat transfer member is arranged along a plane perpendicular to one of the main surfaces of the processing unit.

Description

Technical Field

[0001] Embodiments of the present invention relate to an imaging device. This application claims priority based on Japanese Patent Application No. 2021-182404 filed in Japan on November 9, 2021, and incorporates its content herein.

Background Art

[0002] Conventionally, an imaging device including a heat generating part, a housing that houses the heat generating part, and a heat radiating means that radiates the heat generated by the heat generating part to the outside has been known (for example, see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] One aspect of the present invention is an imaging device in which a heat radiating part having a fan is disposed at the left end as viewed from the photographer when the imaging device is held in a horizontal position.

Brief Description of the Drawings

[0005] [Figure 1] It is a schematic diagram showing an example of a camera body of the imaging device according to the present embodiment. [Figure 2] It is a schematic diagram showing Example 1 of the imaging device according to the present embodiment. [Figure 3] It is a block diagram showing an example of a camera body of the imaging device according to the present embodiment. [Figure 4A] It is a perspective view showing Example 1 of the heat radiating part of the imaging device according to the present embodiment. [Figure 4B] It is a perspective view showing Example - 1 of the heat radiating part of the imaging device according to the present embodiment. [Figure 5] It is a diagram showing an example of a fan of the heat radiating part of the imaging device according to the present embodiment. [Figure 6A] This figure shows example 1 of the fan placement. [Figure 6B] This figure shows example 2 of the fan placement. [Figure 7] This figure shows an example of the assembly of the imaging device according to this embodiment. [Figure 8A] This is a schematic diagram showing an example 2 of the imaging device according to this embodiment. [Figure 8B] This is a schematic diagram showing Example 3 of the imaging device according to this embodiment. [Figure 9] This is a schematic diagram showing Example 1 of an imaging device according to a modified embodiment. [Figure 10] This figure shows an example 2 of an imaging device according to a modified embodiment. [Figure 11A] This figure shows Example 3 of an imaging device according to a modified embodiment. [Figure 11B] This figure shows Example 3 of an imaging device according to a modified embodiment. [Modes for carrying out the invention]

[0006] (First Embodiment) The imaging device according to this embodiment will be described below with reference to the drawings. Figure 1 is a schematic diagram showing an example of the camera body of the imaging device according to this embodiment. The imaging device 100 comprises a camera body 1, a lens mount 2-1, a microphone 3-1, and a microphone 3-2. The two microphones, microphone 3-1 and microphone 3-2, form a stereo microphone. Microphones 3-1 and 3-2 are positioned away from the fan 14-1, which is the sound source. A lens unit is attached to the camera body 1. An example of microphones 3-1 and 3-2 is that they are installed around the lens mount 2-1. Figure 2 is a schematic diagram showing Example 1 of the imaging device according to this embodiment. Figure 2 is a cross-sectional view of the imaging device 100 shown in Figure 1 when it is cut along A1-A2, as seen from the direction of the arrow. Figure 2 is a cross-sectional view of the camera body 1 of Figure 1 with the lens unit 2 attached. The lens unit 2 has an optical system arranged along the optical axis OA within its lens barrel. The optical system guides the incident subject light beam to the imaging unit 16 of the camera body 1. The camera body 1 comprises a heat dissipation unit 14, a battery compartment 15, and an imaging unit 16. The imaging unit 16 includes a first processing unit 11, a second processing unit 12, and an image sensor 13. The first processing unit 11, the second processing unit 12, and the image sensor 13 are arranged within the housing of the camera body 1 in a position that overlaps in a direction along the optical axis OA of the imaging device 100.

[0007] In this embodiment, the direction along the optical axis OA is defined as the Z-axis. That is, the direction in which the subject light beam is incident on the image sensor 13 of the imaging unit 16 is defined as the Z-axis. Specifically, the direction in which the subject light beam is incident is defined as the negative Z-axis, and the opposite direction is defined as the positive Z-axis. The longitudinal direction of camera body 1 is defined as the X-axis. The short direction of camera body 1 is defined as the Y-axis. Specifically, the X-axis and Y-axis are defined as shown in Figure 2. For the sake of explanation, the positive side of the Z-axis may be referred to as the front or front side. The negative side of the Z-axis may be referred to as the rear or back side. The negative side of the Z-axis may be referred to as the back side. The negative side of the X-axis may be referred to as the left side. The positive side of the X-axis may be referred to as the right side. The battery compartment 15 is the part that houses the battery. For example, the battery compartment 15 is located on the right side (positive side of the X-axis) of the camera body 1. The heat dissipation unit 14 is located on the left side of the negative X-axis. The heat dissipation unit 14 will be described later.

[0008] Figure 3 is a block diagram showing an example of a camera body of an imaging device according to this embodiment. As described above, the camera body 1 includes, for example, an imaging unit 16, a heat dissipation unit 14, and a battery compartment 15. The imaging unit 16 includes an image sensor 13, a first processing unit 11, and a second processing unit 12. The image sensor 13 is constructed using, for example, a CMOS (Complementary Metal Oxide Semiconductor). The image sensor 13 generates image data by converting incident light into photoelectric data. The image sensor 13 also generates an imaging signal by performing predetermined signal processing, such as noise reduction and white balance adjustment, on the generated image data. The first processing unit 11 is configured using, for example, a CPU (Central Processing Unit). The first processing unit 11 generates development data based on the imaging signal generated by the image sensor. The first processing unit 11 performs various processing operations on the generated development data as needed.

[0009] The second processing unit 12 includes, for example, an application processor that runs an operating system and various application software, and an interface connector. The second processing unit 12 displays the image data generated by the image sensor 13. The second processing unit 12 stores the developed data generated by the first processing unit 11 and transmits it externally via a predetermined network through the interface connector. The heat dissipation unit 14 primarily dissipates heat generated by the second processing unit 12. Alternatively, the heat dissipation unit 14 may be configured to dissipate heat from one or any combination of the following: heat generated by the first processing unit 11, heat generated by the second processing unit 12, and heat generated by the image sensor 13.

[0010] Figure 4A is a perspective view showing Example 1 of the heat dissipation section of the imaging device according to this embodiment. Figure 4A is a view of the heat dissipation section 14 from the negative side of the X-axis to the positive side. As shown in Figure 4A, the heat dissipation section 14 is located on the left side of the camera body 1 as seen from the photographer's perspective when the imaging device 100 is held in a horizontal position. The heat dissipation section 14 includes a fan 14-1, an intake port 14-2, and an exhaust port 14-3. By configuring it in this way, the heat radiating unit 14 can be arranged on the left side surface of the camera body 1, so that the microphones (microphone 3-1 and microphone 3-2) can be arranged away from the fan 14-1 (which is the sound source). Therefore, it is possible to reduce the collection of noises such as the rotation noise of the fan 14-1 by the microphones 3-1 and 3-2 installed around the lens mount 2-1.

[0011] Also, the air intake 14-2 and the air outlet 14-3 are provided on one main surface 14-4 of the heat radiating unit 14. An example of the one main surface is the side of the imaging device 100. Specifically, the air intake 14-2 and the air outlet 14-3 are provided on the left side surface of the camera body 1. The air intake 14-2 is provided at the lower part of one main surface 14-4 of the heat radiating unit 14 (minus the Y axis with respect to the air outlet 14-3 in FIG. 4A), and the air outlet 14-3 is provided at the upper part of one main surface 14-4 of the heat radiating unit 14 (plus the Y axis with respect to the air intake 14-2 in FIG. 4A). By configuring it in this way, when the imaging device 100 is held in a horizontal position, the heat radiating unit 14 can intake air from the lower side and exhaust air from the upper side. Therefore, it is possible to prevent the air intake from the air intake 14-2 from being warmed by the air exhausted from the air outlet 14-3, and thus heat can be efficiently discharged. Also, compared with the case where the air intake 14-2 and the air outlet 14-3 are not provided on one main surface of the heat radiating unit 14, since the members related to the fan 14-1 can be housed in one unit, the structure of the members becomes simple and the replacement of the members becomes easy.

[0012] FIG. 4B is a perspective view showing Example 1 of the heat radiating unit of the imaging device according to the present embodiment. FIG. 4B is a view of the heat radiating unit 14 seen from the negative side to the positive direction of the Z axis. As shown in FIG. 4B, the heat radiating unit 14 includes, in addition to the fan 14-1, a heat radiating member 14-6 and an outer casing 14-5. Inside the heat radiating unit 14, since the heat radiating member 14-6 that becomes high temperature is arranged at the upper part, a chimney effect (when the air inside is hotter than the outside air, the hot air has a lower density than the cold air, so buoyancy is generated in the air and warm air moves from the bottom to the top) creates a flow of air from the intake port to the exhaust port. Since this air flow is combined with the exhaust heat by the fan 14-1, exhaust heat can be effectively removed.

[0013] FIG. 5 is a view showing an example of the fan of the heat radiating unit of the imaging device according to the present embodiment. An example of the fan 14-1 is a small blower type fan. By using the small fan 14-1, power consumption can be reduced compared to the case of using medium-sized or large-sized ones. The fan 14-1 includes a motor 14-11, a runner 14-12, and a scroll 14-13. The runner 14-12 is arranged in a cylindrical shape. The fan 14-1 creates a swirling flow in a direction substantially perpendicular to the rotation axis by the rotation of the runner 14-12. The swirling flow is rectified in one direction by the scroll 14-13. By narrowing the exhaust port, the wind can be concentrated in a certain direction. The rotation axis of the fan 14-1 and the optical axis OA are arranged to be orthogonal. By configuring in this way, compared to the case where the rotation axis of the fan 14-1 and the optical axis OA are not arranged to be orthogonal, without increasing the length of the imaging device 100 in the X-axis direction, the optical axis OA and the fan 14-1 can be arranged so as not to overlap, and the thickness in the Z-axis direction can also be made thinner.

[0014] Figures 6A and 6B show examples of fan arrangements. If, as shown in Figure 6A, fan 14-1 is placed next to the imaging unit 16 in the X-axis direction with the rotation axis of fan 14-1 parallel to the optical axis OA, the thickness in the X-axis direction will be increased. However, by arranging fan 14-1 so that its rotation axis is perpendicular to the optical axis OA, the thickness in the X-axis direction can be reduced. Furthermore, if the fan 14-1 is positioned in the Z-axis direction, overlapping with the imaging unit 16, as shown in Figure 6B, the thickness in the Z-axis direction will increase. However, by positioning the fan 14-1 so that its rotation axis and the optical axis OA are perpendicular, the thickness in the Z-axis direction can be reduced. Let's return to Figure 4B and continue the explanation.

[0015] As fan 14-1 rotates, the airflow flows in the positive direction of the Y-axis. The air exhausted from fan 14-1 is introduced into the heat dissipation component 14-6. The heat dissipation member 14-6 serves as both a flow path for guiding the exhaust from the fan 14-1 to the exhaust port 14-3 and a heat storage section. This configuration allows for better guidance of the exhaust from the fan 14-1 to the exhaust port 14-3 compared to a configuration without the heat dissipation member 14-6. An example of the heat dissipation member 14-6 is a material with high heat capacity, such as aluminum alloy die-casting. Another example of the heat dissipation member 14-6 is a heat dissipation fin, which has a protruding fin structure. This configuration increases the surface area of ​​the heat dissipation member 14-6, allowing for efficient storage of heat generated inside the camera, which can then be efficiently dissipated by the exhaust from the fan 14-1. The height of the fins decreases as they approach the exhaust port 14-3 from the fan 14-1. The enclosure 14-5, together with the fan 14-1 and the heat dissipation member 14-6, forms a space. This space includes a flow path from the intake port 14-2 to the exhaust port 14-3. This configuration allows the heat dissipation unit 14 to be unitized, making it easy to install and remove. Therefore, replacing the heat dissipation unit 14 is easy. In addition, compared to a configuration without the enclosure 14-5, the space can be divided into sub-assemblies, preventing dust, dirt, and water from entering the main body. Furthermore, the exhaust from the fan 14-1 can pass through the heat dissipation member 14-6 and be discharged from the exhaust port 14-3 without going into the inside of the camera body 1. This also prevents dust and dirt from entering the inside of the heat dissipation unit 14. Even if water droplets enter the camera body 1 through either the intake port 14-2 or the exhaust port 14-3 of the heat dissipation unit 14, or both, the water droplets will remain in the heat dissipation unit 14, thus preventing the water droplets from entering the camera body 1 beyond the heat dissipation unit 14.

[0016] Figure 7 shows an example of the assembly of the imaging device according to this embodiment. As shown in Figure 7, the heat dissipation unit 14 is attached to a part that the user does not touch when imaging with the imaging device 100, such as the side of the camera body 1. Specifically, the heat dissipation unit 14 is located on the left side (negative side of the X-axis) of the camera body 1. The heat dissipation unit 14 is attached to the housing of the imaging device 100 by moving it from the negative to the positive direction of the X-axis. Furthermore, by attaching the heat dissipation unit 14 to a part that the user does not touch when the imaging device 100 is taking an image, it is possible to prevent parts that the user touches, such as the grip, from becoming hot. Also, by attaching the heat dissipation unit 14 to a part that the user does not touch when the imaging device 100 is taking an image, heat can be efficiently dissipated while maintaining the same operability as the imaging device 100 without the heat dissipation unit 14.

[0017] Figure 8A is a schematic diagram showing Example 2 of the imaging device according to this embodiment. The imaging device 100a-1 comprises a camera body 1 and a lens unit 2. The lens unit 2 is mounted on the camera body 1. The lens unit 2 has an optical system arranged along the optical axis OA within its lens barrel. The optical system guides the incident subject light beam to the imaging unit 16 of the camera body 1. The imaging unit 16 includes a first processing unit 11, a second processing unit 12, and an image sensor 13. The first processing unit 11 and the image sensor 13, and the second processing unit 12 and the image sensor 13 are arranged within the housing at positions where they overlap in the optical axis OA direction of the imaging device 100.

[0018] Figure 8B is a schematic diagram showing Example 3 of the imaging device according to this embodiment. The imaging device 100a-2 comprises a camera body 1 and a lens unit 2. The lens unit 2 is mounted on the camera body 1. The lens unit 2 has an optical system arranged along the optical axis OA within its lens barrel. The optical system guides the incident subject light beam to the imaging unit 16 of the camera body 1. The imaging unit 16 includes a first processing unit 11, a second processing unit 12, and an image sensor 13. The first processing unit 11 and the second processing unit 12 overlap in the Z-axis direction.

[0019] According to the imaging device 100 of this embodiment, when the imaging device 100 is held in a horizontal position, a heat dissipation unit 14 having a fan 14-1 is located at the left end as seen from the photographer's perspective. By configuring the system in this way, the heat dissipation unit 14, which has the fan 14-1, can be positioned at the left end when the imaging device 100 is held horizontally, as viewed from the photographer. This reduces the amount of noise, such as the rotation sound of the fan 14-1, that is picked up by the microphones 3-1 and 3-2, which are installed around the lens mount 2-1. Furthermore, in the imaging device 100, the heat dissipation unit 14 draws in air from below and exhausts it from above when the imaging device 100 is positioned horizontally. By configuring the system in this way, when the imaging device 100 is positioned horizontally, air can be drawn in from below and exhausted from above. Compared to a configuration where air is drawn in from above and exhausted from below, this prevents the drawn-in air from being heated by the exhausted air, thus allowing for efficient heat dissipation.

[0020] Furthermore, in the imaging device 100, the rotation axis of the fan 14-1 is perpendicular to the optical axis of the imaging device 100. By configuring it in this way, the thickness of the imaging device 100 (thickness in the Z-axis direction) can be reduced compared to the case where the rotation axis of the fan 14-1 and the optical axis direction OA are not perpendicular. Therefore, the imaging device 100 can be miniaturized. In other words, if the fan 14-1 is placed next to the imaging unit 16 in the X-axis direction with the rotation axis of the fan 14-1 parallel to the optical axis OA, the thickness in the X-axis direction will be increased. However, by arranging the fan 14-1 so that its rotation axis and the optical axis OA are perpendicular to each other, the thickness in the X-axis direction can be reduced. Also, if the fan 14-1 is placed on top of the imaging unit 16 in the Z-axis direction, the thickness in the Z-axis direction will be increased. However, by arranging the fan 14-1 so that its rotation axis and the optical axis OA are perpendicular to each other, the thickness in the Z-axis direction can be reduced.

[0021] Furthermore, the imaging device 100 includes an image sensor 13 and either or both of a first processing unit 11 and a second processing unit 12 as processing units, and the fan 14-1 is positioned so as not to overlap with the image sensor 13 and either or both of the first processing unit 11 and the second processing unit 12 in the optical axis direction of the imaging device 100. By configuring it in this way, the thickness of the imaging device 100 (thickness in the Z-axis direction) can be reduced compared to the case where the fan 14-1 is positioned so that it overlaps with the image sensor 13 and either or both of the first processing unit 11 and the second processing unit 12 in the optical axis direction of the imaging device 100. As a result, the imaging device 100 can be made smaller.

[0022] Furthermore, in the imaging device 100, the processing unit comprises a first processing unit 11 and a second processing unit 12, and the fan 14-1 is positioned in the optical axis direction of the imaging device 100 in a location that does not overlap with the image sensor 13, the first processing unit 11, or the second processing unit 12. By configuring it in this way, the thickness of the imaging device 100 (thickness in the Z-axis direction) can be reduced compared to the case where the fan 14-1 is positioned so that it overlaps with the image sensor 13, the first processing unit 11 and the second processing unit 12 in the optical axis direction of the imaging device 100. As a result, the imaging device 100 can be made smaller.

[0023] Furthermore, in the imaging device 100, the processing unit comprises a first processing unit 11 and a second processing unit 12, and the first processing unit 11, the second processing unit 12, and the image sensor 13 are positioned to overlap in the optical axis direction of the imaging device. By configuring it in this way, the width (thickness in the X-axis direction) of the imaging device 100 can be reduced compared to when the first processing unit 11 and the second processing unit 12 are arranged side by side along the X-axis. As a result, the imaging device 100 can be made more compact.

[0024] Furthermore, in the imaging device 100, the processing unit comprises a first processing unit 11 and a second processing unit 12, and any two of the first processing unit 11, the second processing unit 12, and the image sensor 13 are positioned to overlap in the optical axis direction of the imaging device. By configuring it in this way, the thickness of the imaging device 100 (thickness in the Z-axis direction) can be reduced compared to when the fan 14-1 is positioned to overlap with the image sensor 13, the first processing unit 11 and the second processing unit 12 in the optical axis direction of the imaging device 100. Furthermore, the width of the imaging device 100 (thickness in the X-axis direction) can be reduced compared to when the first processing unit 11 and the second processing unit 12 are positioned side by side along the X-axis. As a result, the imaging device 100 can be made more compact.

[0025] Furthermore, in the imaging device 100, the heat dissipation unit 14 may be positioned in a location that the user does not touch when the imaging device 100 is taking an image. With this configuration, in the basic way of holding the imaging device 100 in a horizontal position, the right hand generally holds the right side of the camera body 1 and the left hand holds the lens unit, so the left side of the camera body 1 is free of obstructions (not covered by the hand), which is convenient for the intake and exhaust of the fan. Compared to the case where the heat dissipation unit 14 is positioned in a location that the user touches when the imaging device 100 is taking an image, the operability can be made the same as when the fan 14-1 is not installed.

[0026] (Modified version of the embodiment) An example of an imaging device according to a modified embodiment can be found in Figure 1. The imaging device 100b comprises a camera body 1 and a lens unit 2. The lens unit 2 is mounted on the camera body 1. The imaging device 100b further includes heat transfer members 17, 18-1, 18-2, 18-3, etc., which transfer heat from the first processing unit 11, the second processing unit 12, or the image sensor 13 to the heat dissipation section 14, the battery compartment 15, etc., as described above in the imaging device 100.

[0027] Figure 9 shows an example 1 of an imaging device according to a modified embodiment. Figure 9 is a cross-sectional view of the imaging device 100 shown in Figure 1 when it is cut along A1-A2, as seen from the direction of the arrow. The heat transfer member 17 guides the heat from inside the enclosure to the heat dissipation member 14-6 of the heat dissipation section 14. The heat stored in the heat dissipation member 14-6 is discharged from the exhaust port 14-3 along with the outside air supplied by the fan 14-1. The heat dissipation member 14-6 acts as both a heat sink and a flow path. An example of the heat transfer member 17 is a material with excellent thermal conductivity, such as graphite-based aluminum composite material (ACM-a). As shown by the arrows in Figure 9, the heat generated in the second processing unit 12 is transferred to the heat transfer member 17 and forcibly dissipated by the fan 14-1. With this configuration, the heat generated in the second processing unit 12 can be guided to the heat dissipation section 14, thus enabling efficient heat dissipation. In Figure 9, heat is transferred from the front of the second processing unit 12 (between the first processing unit 11 and the second processing unit 12), but this is not the only option. For example, heat may also be transferred from the rear of the second processing unit 12 (between the second processing unit 12 and the back of the camera body 1). The heat transfer member 17 may also be applied to the imaging device 100a-1 and imaging device 100a-2 described above.

[0028] Figure 10 shows an example 2 of an imaging device according to a modified embodiment. Figure 10 is a view of the inside of the imaging device 100b from the negative side of the Z axis. Figure 10 shows a state in which only the image sensor 13 is assembled to the main body, and the first processing unit 11 and the second processing unit 12 are detached. An example of the heat transfer member 18-1 is a material with excellent thermal conductivity, such as graphite. The heat transfer member 18-1 functions as a heat channel. The heat transfer member 18-1 is positioned to connect the image sensor 13 and the battery compartment 15. As shown by the arrow in Figure 10, the heat generated by the image sensor 13 is transferred to the battery compartment 15 via the heat transfer member 18-1. The heat transfer member 18-1 may also be applied to the imaging devices 100a-1 and 100a-2 described above.

[0029] An example of the heat transfer member 18-2 is a material with excellent thermal conductivity, such as graphite. The heat transfer member 18-2 functions as a heat channel. The heat transfer member 18-2 is positioned to connect the image sensor 13 and the bottom side BU of the imaging device 100b. As shown by the arrow in Figure 10, the heat generated by the image sensor 13 is transferred to the bottom BU of the imaging device 100b via the heat transfer member 18-2. With this configuration, the heat generated by the image sensor 13 can be guided in a different direction from the heat generated by the second processing unit 12, so that the entire camera body 1 can be used for heat dissipation. The heat transfer member 18-2 may also be applied to the aforementioned imaging devices 100a-1 and 100a-2.

[0030] Figure 11A shows Example 3 of an imaging device according to a modified embodiment. Figure 11A is a view of the inside of the imaging device 100b from the negative side of the Z-axis to the positive side. Figure 11A shows the state in which the second processing unit 12 has been removed from the imaging device 100. The imaging device 100b further includes a heat transfer member 18-3 that transfers heat from the first processing unit 11 to the upper part of the front cover. An example of the heat transfer member 18-3 is a material with excellent thermal conductivity, such as graphite. The heat transfer member 18-3 functions as a heat channel. When the first processing unit 11 is attached to the imaging device 100, the heat transfer member 18-3 is positioned to connect the first processing unit 11 and the upper side FUP of the front cover. Heat generated in the first processing unit 11 is transferred to the upper side FUP of the front cover via the heat transfer member 18-3. In addition, the heat generated in the first processing unit 11 is configured to be transferred to the heat sink on the back of the imaging device 100. Figure 11B shows an example 3 of an imaging device according to a modified embodiment. As shown in Figure 11B, a heat storage unit 18-4 may be provided to store the heat generated by the first processing unit 11. With this configuration, the heat generated by the first processing unit 11 can be guided in a direction different from the heat generated by the second processing unit 12, so that the entire camera body 1 can be used for heat dissipation.

[0031] In the imaging device 100b described above, the heat generated by the first processing unit 11 may be configured to transfer to the upper part of the front cover. Alternatively, the heat generated by the first processing unit 11 may be configured to transfer to the heat sink on the back. Furthermore, a heat storage unit for accumulating the heat generated by the first processing unit 11 may be provided. Additionally, the heat generated by the first processing unit 11 may be configured to transfer to the battery compartment side and the bottom side. There are three destinations for heat transfer: the battery compartment side, the bottom side, and the upper part of the front cover, and these three locations may be configured to be used in any combination.

[0032] Although embodiments of the present invention have been described in detail above with reference to the drawings, the specific configuration is not limited to these embodiments and includes designs and the like that do not depart from the spirit of the invention. [Explanation of symbols]

[0033] 1...Camera body, 2...Lens unit, 2-1...Lens mount, 3-1, 3-2...Microphone, 11...First processing unit, 12...Second processing unit, 13...Image sensor, 14...Heat dissipation section, 14-1...Fan, 14-2...Intake port, 14-3...Exhaust port, 14-4...Main surface, 14-5...Enclosure, 14-6...Heat dissipation member, 14-11...Motor, 14-12...Runner, 14-13...Scroll, 15...Battery compartment, 16...Imaging unit, 17, 18-1, 18-2, 18-3...Heat transfer member, 100, 100a-1, 100a-2, 100b...Imaging device

Claims

[Claim 1] When the imaging device is positioned horizontally, the heat dissipation unit draws in air from the bottom and exhausts it from the top, A first heat transfer member transfers heat generated by the processing unit of the imaging device to the upper part of the front cover of the imaging device, A lens mount that allows for the attachment and detachment of the lens unit, Equipped with, The heat dissipation section is attached to a part that the user does not touch when the imaging device is taking an image. A portion of the first heat transfer member is arranged along a plane perpendicular to one of the main surfaces of the processing unit. The aforementioned imaging device is a handheld imaging device capable of taking pictures.

Images