Electronic components
The electronic component with arc-shaped electrodes in through-holes addresses manufacturing challenges by reducing stress concentration and fractures, enhancing reliability in electron beam lithography systems.
JP2026055211APending Publication Date: 2026-03-31KK TOSHIBA +2
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2026-03-31
AI Technical Summary
Technical Problem
Existing electronic components used in electron beam lithography are prone to manufacturing difficulties due to stress concentration and potential fracture at electrode corners, which can lead to defects and reduced reliability.
Method used
The electronic component features a substrate with through-holes and electrode pairs where each electrode has an arc-shaped portion surrounding the center of the through-hole, with ends facing each other, reducing stress concentration and minimizing electrode fractures.
Benefits of technology
This design enhances manufacturing ease and reliability by minimizing stress-induced fractures, ensuring stable operation of electron beam lithography components.
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Abstract
The present invention provides an electronic component that increases the strength of the deflection field and reduces variations in the strength of the deflection field. [Solution] An electrode array unit comprising a substrate having multiple through holes for each of multiple charged particle beams to pass through, and multiple electrode pairs provided in each of the multiple through holes, wherein each of the multiple electrode pairs has a first electrode and a second electrode, and both the first electrode and the second electrode include an arc portion arranged to surround the center of the corresponding through hole, and the ends of the first electrode and the ends of the second electrode are arranged to face each other.
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Citation Information
Patent Citations
charged particle beam deflector
JP3145149B2