Resin encapsulation device

Abstract

To provide a resin encapsulation device that can suppress the generation of resin burrs. [Solution] A resin sealing device according to one embodiment is a resin sealing device that performs resin sealing of a workpiece in a cavity, which is a space formed by the clamping of a first mold and a second mold, wherein at least one of the first mold and the second mold is arranged in a direction intersecting the clamping direction and comprises a plurality of inserts that press the same workpiece against each other in the clamping direction during clamping, and a plurality of adjusting members that adjust the force with which the corresponding insert presses the workpiece. Each of the plurality of inserts has a pressing portion that protrudes toward the workpiece and presses the workpiece, and the pressing portions of the plurality of inserts protrude toward each other.

Description

Technical Field

[0001] The disclosed embodiments relate to a resin sealing device.

Background Art

[0002] Conventionally, there has been known a resin sealing device that performs resin sealing of a molded product to be resin-sealed in a cavity, which is a space formed by clamping a first mold and a second mold.

[0003] For example, in Patent Document 1, in one of the first mold and the second mold, there is disclosed a device including a swivel member having a contact surface that contacts the molded product, a back member that presses the swivel member, and an adjustment member that is provided between the swivel member and the back member and adjusts the pressing force of the swivel member on the molded product.

[0004] In the device described in Patent Document 1, the swivel member pressed against the heat dissipation plate provided on the molded product tilts following the heat dissipation plate, thereby suppressing the occurrence of resin burrs.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the device described in Patent Document 1 above, when the variation in the inclination of the heat dissipation plate in the molded product is larger than the inclination amount of the swivel member, a gap occurs between the molded product and the swivel member, and resin dissolved in such a gap flows in, resulting in a problem that resin burrs are generated.

[0007] One embodiment of the invention has been made in view of the above, and aims to provide a resin sealing device that can suppress the generation of resin burrs. [Means for solving the problem]

[0008] A resin sealing apparatus according to one embodiment is a resin sealing apparatus that performs resin sealing of a workpiece in a cavity, which is a space formed by the clamping of a first mold and a second mold, wherein at least one of the first mold and the second mold is arranged in a direction intersecting the clamping direction and comprises a plurality of inserts that press the same workpiece against each other in the clamping direction during clamping, and a plurality of adjustment members that adjust the force with which the corresponding insert presses the workpiece. Each of the plurality of inserts has a pressing portion that protrudes toward the workpiece and presses the workpiece, and the pressing portions of the plurality of inserts protrude toward each other. [Effects of the Invention]

[0009] According to one embodiment, the generation of resin burrs can be suppressed. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a perspective view showing an example of the configuration of a resin encapsulation apparatus according to an embodiment. [Figure 2] Figure 2 is a side view showing an example of the configuration of a molded product according to the embodiment. [Figure 3] Figure 3 is a plan view showing an example of the configuration of a molded product according to the embodiment. [Figure 4] Figure 4 is a bottom view showing an example of the structure of a molded product according to the embodiment. [Figure 5] Figure 5 is a cross-sectional view showing an example of a resin encapsulation apparatus according to the embodiment. [Figure 6] Figure 6 is a diagram (part 1) illustrating an example of a resin sealing process using a resin sealing apparatus according to the embodiment. [Figure 7]FIG. 7 is a diagram (part 2) for explaining an example of a resin sealing process by the resin sealing apparatus according to the embodiment. [Figure 8] FIG. 8 is a diagram (part 3) for explaining an example of a resin sealing process by the resin sealing apparatus according to the embodiment. [Figure 9] FIG. 9 is a diagram (part 4) for explaining an example of a resin sealing process by the resin sealing apparatus according to the embodiment. [Figure 10] FIG. 10 is a diagram (part 5) for explaining an example of a resin sealing process by the resin sealing apparatus according to the embodiment. [Figure 11] FIG. 11 is a diagram (part 6) for explaining an example of a resin sealing process by the resin sealing apparatus according to the embodiment. [Figure 12] FIG. 12 is a plan view showing an example of the configuration of a resin-sealed molded product according to the embodiment. [Figure 13] FIG. 13 is a bottom view showing an example of the configuration of a resin-sealed molded product according to the embodiment. [Figure 14] FIG. 14 is a diagram (part 1) for explaining an example of resin sealing for a molded product with an inclined heat dissipation plate in the resin sealing apparatus according to the embodiment. [Figure 15] FIG. 15 is a diagram (part 2) for explaining an example of resin sealing for a molded product with an inclined heat dissipation plate in the resin sealing apparatus according to the embodiment. [Figure 16] FIG. 16 is a diagram (part 1) for explaining another example of resin sealing for a molded product with an inclined heat dissipation plate in the resin sealing apparatus according to the embodiment. [Figure 17] FIG. 17 is a diagram (part 2) for explaining another example of resin sealing for a molded product with an inclined heat dissipation plate in the resin sealing apparatus according to the embodiment. [Figure 18] FIG. 18 is a cross-sectional view showing another example of the resin sealing apparatus according to the embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0011] Hereinafter, embodiments of the resin sealing device disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited by the embodiments shown below.

[0012] <1. Configuration of Resin Sealing Device> As shown in FIG. 1, a resin sealing device 100 according to the first embodiment includes a resin sealing mold 1, a plurality of tie bars 4, a fixed platen 5, a movable platen 6, and a transfer unit 7. For ease of understanding the positional relationship, in a plurality of drawings including FIG. 1, each axis of an XYZ coordinate system including an X-axis, a Y-axis, and a Z-axis orthogonal to each other is shown, and the Z-axis is the vertical direction.

[0013] The plurality of tie bars 4 extend parallel to each other in the vertical direction and are supported by a base (not shown). The fixed platen 5 is fixed to the upper ends of the respective tie bars 4, and the movable platen 6 is attached to the respective tie bars 4 so as to be movable in the vertical direction (Z-axis direction).

[0014] The resin sealing mold 1 includes an upper mold 2 and a lower mold 3. In the resin sealing mold 1, resin sealing of the molded product is performed in a cavity 50 (see FIG. 8), which is a space formed by clamping the upper mold 2 and the lower mold 3.

[0015] The upper mold 2 is attached to the fixed platen 5, and the lower mold 3 is attached to the movable platen 6. The movable platen 6 is driven by a drive mechanism (not shown) to move in the vertical direction. The upper mold 2 includes an upper mold chess 10 and an upper mold die set 20 that supports the upper mold chess 10. The lower mold 3 includes a lower mold chess 30 and a lower mold die set 40 that supports the lower mold chess 30.

[0016] In the resin sealing device 100, the movable platen 6 moves upward, causing the lower mold 3 to press against the upper mold 2, thereby clamping the upper mold 2 and the lower mold 3 together. In the example shown in Figure 1, the resin sealing device 100 is configured such that the lower mold 3 moves upward (positive Z-axis direction), but it may also be configured such that the upper mold 2 moves downward (negative Z-axis direction), or the lower mold 3 moves upward and the upper mold 2 moves downward.

[0017] In the resin encapsulation apparatus 100, the upper mold 2 and the lower mold 3 are clamped together in contact with each other, thereby forming a resin supply path (for example, a crust section and a runner section) and a cavity 50 (see Figure 8) in the space between the upper mold 2 and the lower mold 3, and the molded product 60 is resin-encapsulated within the cavity 50.

[0018] The resin encapsulation apparatus 100 shown in Figure 1 is configured to simultaneously resin encapsulate six molded products 60, but is not limited to this example. The number of molded products 60 that can be resin encapsulated simultaneously may be five or fewer, or seven or more. In addition, the resin encapsulation apparatus 100 shown in Figure 1 uses six pots 8, each containing a resin tablet, to resin encapsulate the six molded products 60, but is not limited to this example. The number of pots 8 may be five or fewer, or seven or more.

[0019] As shown in Figures 2 to 4, the molded product 60 includes a lead frame 61, a plurality of electronic components 62 to 65, a pair of heat sinks 66 and 67, and so on. The plurality of electronic components 62 to 65 are arranged between the pair of heat sinks 66 and 67, and the heat generated by the plurality of electronic components 62 to 65 is dissipated by the pair of heat sinks 66 and 67. The lead frame 61 and terminals (not shown) of the plurality of electronic components 62 to 65 are connected by wires.

[0020] Electronic components 62-65 are, for example, semiconductor elements such as switching elements and diodes. Switching elements include, for example, MOSFETs (Metal-Oxide Semiconductor Field-Effect Transistors) or IGBTs (Insulated Gate Bipolar Transistors), but are not limited to these examples. The number of electronic components in the molded product 60 is not limited to four; it may be five or more, or three or less. The configuration of the molded product 60 is not limited to the configurations shown in Figures 2-4.

[0021] <2. Configuration of resin encapsulation mold 1> As shown in Figure 5, in the resin encapsulation mold 1, the upper mold 2, which includes the upper mold chess 10, and the lower mold 3, which includes the lower mold chess 30, are located at positions separated from each other in the clamping direction (Z-axis direction). During the resin encapsulation process of the molded product 60, the lower mold 3 is moved toward the upper mold 2 (positive Z-axis direction), and the lower mold 3 presses against the upper mold 2 in a clamped state.

[0022] The upper die chess 10 of the upper die 2 comprises a first upper die chess section 11 and a second upper die chess section 12. The first upper die chess section 11 includes a cavity forming section 1111 that forms part of the cavity 50 (see Figure 8), a runner forming section (not shown) that forms a runner (not shown), and a calf forming section (not shown) that forms a calf (not shown). The cavity 50 (see Figure 8), the calf (not shown), and the runner (not shown) are spaces formed when the upper die 2 and the lower die 3 are clamped together.

[0023] Furthermore, the first upper chess section 11 has a plurality of through holes 113a, 113b that penetrate in the vertical direction (Z-axis direction), and a suction hole 114 for drawing air from inside the first upper chess section 11 to the outside of the first upper chess section 11.

[0024] One end of an air pipe (not shown) is connected to the suction port 114, and an intake device is connected to the other end of the air pipe. Air is drawn in from the suction port 114 by the intake device. In addition, a recess 115 is formed in the first upper mold chest section 11, which is continuous with the cavity forming section 1111 and is recessed upward.

[0025] The second upper mold chess section 12 comprises a base section 13, a plurality of inserts 14a, 14b arranged in the left-right direction (X-axis direction) which intersects with the mold clamping direction, and which press the same molded product 60 against each other in the mold clamping direction during mold clamping, and a plurality of adjustment members 15a, 15b which adjust the force with which the corresponding inserts 14a, 14b press against the molded product 60.

[0026] Each of the multiple inserts 14a, 14b includes a base end 141 biased downward (negative Z-axis direction) by the corresponding adjustment member among the multiple adjustment members 15a, 15b, a pressing part 143 that presses the molded product 60 in the mold clamping direction during mold clamping, and an extension part 142 that connects the base end 141 and the pressing part 143. In the following, when each of the multiple inserts 14a, 14b is not individually distinguished, they may be referred to as insert 14.

[0027] The base end portion 141 is positioned in the storage space 121 formed in the second upper chess piece portion 12, and is biased downward (negative Z-axis direction) by the adjustment member 15, while its downward movement is restricted by the first upper chess piece portion 11. As a result, each nesting element 14 is biased downward by the corresponding adjustment member 15, while its downward movement is restricted.

[0028] The base end portion 141 has a shape that protrudes in the left-right direction (X-axis direction) compared to the shape of the extension portion 142, and the downward movement (negative Z-axis direction) by the first upper checkerboard portion 11 is restricted by the lower surface 141a of the base end portion 141 contacting the upper surface 11a of the first upper checkerboard portion 11.

[0029] Each extended portion 142 of the multiple nests 14a and 14b is slidably inserted into the corresponding through-hole among the multiple through-holes 113a and 113b formed in the first upper checkerboard portion 11. That is, the extended portion 142 of nest 14a extends downward (negative Z-axis direction) in a continuous manner from the base end portion 141 and is slidably inserted into the through-hole 113a. The extended portion 142 of nest 14b extends downward (negative Z-axis direction) in a continuous manner from the base end portion 141 and is slidably inserted into the through-hole 113b.

[0030] The pressing portion 143 of the insert 14a is continuous with the stretched portion 142 of the insert 14a, and extends downward (negative Z-axis direction), protruding toward the molded product 60. In addition, the pressing portion 143 of the insert 14a protrudes in the left-right direction (X-axis direction) compared to the stretched portion 142 of the insert 14a.

[0031] The pressing portion 143 of the insert 14b is continuous with the stretched portion 142 of the insert 14b, and extends downward (negative Z-axis direction), protruding toward the molded product 60. In addition, the pressing portion 143 of the insert 14b protrudes in the left-right direction (X-axis direction) compared to the stretched portion 142 of the insert 14b.

[0032] The pressing portions 143 of the nests 14a and 14b are positioned within the recess 115, which is a recess formed in the first upper die checkerboard portion 11. The lower surfaces 1431 of the pressing portions 143 of the nests 14a and 14b and the cavity forming portion 1111 form the upper die cavity forming portion 111, which is part of the cavity 50 (see Figure 8).

[0033] The pressing portion 143 of the nesting element 14a and the pressing portion 143 of the nesting element 14b protrude in the left-right direction (X-axis direction), which is the direction in which they move closer to each other, and a gap G1 is formed between the pressing portion 143 of the nesting element 14a and the pressing portion 143 of the nesting element 14b in the left-right direction (X-axis direction). In other words, a gap G1 is formed between adjacent pressing portions 143.

[0034] Furthermore, a gap G2 is formed in the left-right direction (X-axis direction) between the pressing portion 143 of the nesting element 14a and the side surface 115a that constitutes the recess 115. Similarly, a gap G2 is formed in the left-right direction between the pressing portion 143 of the nesting element 14b and the side surface 115a that constitutes the recess 115.

[0035] Furthermore, as described above, the insert 14a is biased downward (negative Z-axis direction) by the adjustment member 15a. If an upward force (positive Z-axis direction) greater than the biasing force of the adjustment member 15a acts on the pressing portion 143 of the insert 14a, the insert 14a will move upward against the biasing force of the adjustment member 15a.

[0036] Furthermore, as described above, the insert 14b is biased downward (negative Z-axis direction) by the adjustment member 15b. If an upward force (positive Z-axis direction) greater than the biasing force of the adjustment member 15b acts on the pressing portion 143 of the insert 14b, the insert 14b will move upward against the biasing force of the adjustment member 15b.

[0037] Each of the multiple adjustment members 15a, 15b contacts the base end 141 of the corresponding nest 14 among the multiple nests 14a, 14b, and biases the base end 141 downward (negative Z-axis direction). The adjustment member 15 is, for example, a spring, but may also be an elastic material such as rubber or silicone, or it may be a damper, cylinder, magnetic spring, or other material. In the following, when the multiple adjustment members 15a, 15b are not individually distinguished, they may be referred to as adjustment member 15.

[0038] In the example described above, the number of nesting elements 14 is two or more, but it may also be three or more. In this case as well, the three or more nesting elements 14 are arranged in the left-right direction (X-axis direction), which is the direction that intersects with the mold clamping direction.

[0039] Furthermore, the direction intersecting the clamping direction is not limited to the left-right direction (X-axis direction), but may also be the front-back direction (Y-axis direction), or it may be both the left-right direction (X-axis direction) and the front-back direction (Y-axis direction). Also, the direction intersecting the clamping direction is not limited to the direction perpendicular to the up-down direction (Z-axis direction), which is the clamping direction.

[0040] The lower die chess piece 30 of the lower die 3 has a lower die cavity forming section 301 that forms part of the cavity 50 (see Figure 8). The cavity 50 (see Figure 8) is formed by the upper die cavity forming section 111 of the upper die 2 and the lower die cavity forming section 301 of the lower die 3.

[0041] <3. Resin sealing process using resin sealing device 100> Next, the resin sealing process using the resin sealing apparatus 100 shown in Figure 5 will be explained in detail using Figures 6 to 13.

[0042] The resin sealing device 100 has a film placement section 9, and as shown in Figure 6, the film placement section 9 places the film 70 between the multiple pressing sections 143 and the molded product 60 before mold clamping.

[0043] The film placement section 9 comprises a film roll 92 on which the film 70 is wound in a roll shape, and a roller 93 facing the film roll 92 with the upper mold 2 in between. In the film placement section 9 shown in Figure 5, the roller 93 winds up the portion of the film 70 placed between the upper mold 2 and the lower mold 3 for each resin sealing process by the resin sealing device 100, thereby changing the portion of the film 70 placed between the upper mold 2 and the lower mold 3. However, the example is not limited to this.

[0044] Furthermore, as shown in Figure 6, before the upper mold 2 and lower mold 3 are clamped together, the molded product 60 is transported between the upper mold 2 and the lower mold 3 by a transport device (not shown).

[0045] Next, in the resin encapsulation apparatus 100, as shown in Figure 7, the molded product 60 is placed on the lower mold chess 30 of the lower mold 3 by a transport device (not shown). In the example shown in Figure 7, the heat sink 66 of the molded product 60 is placed on the lower mold cavity forming section 301 formed in the lower mold chess 30.

[0046] Furthermore, in the resin encapsulation device 100, air is drawn in from the space within the recess 115 through the suction hole 114 by an intake device via an air pipe. As a result, in the resin encapsulation device 100, as shown in Figure 7, the film 70 is sucked in by the suction force through the gap G1 between the pressing parts 143 (see Figure 5) and the gap G2 between each pressing part 143 and the side surface 115a that constitutes the recess 115 (see Figure 5).

[0047] Gaps G1 and G2 are gaps into which the film 70 cannot enter due to suction. For example, these gaps are less than or equal to the thickness of the film 70, but may also be less than or equal to half the thickness of the film 70.

[0048] As a result, the film 70 is drawn into the upper die chess 10 of the upper die 2, and as shown in Figure 7, the portion of the film 70 facing the upper die cavity forming portion 111 comes into contact with the upper die cavity forming portion 111. The portion of the film 70 facing the upper die cavity forming portion 111 takes on a shape that conforms to the shape of the upper die cavity forming portion 111.

[0049] Next, in the resin encapsulation device 100, the movable platen 6 (see Figure 1) moves upward (positive Z-axis direction) by a drive mechanism (not shown), causing the lower mold chess 30 of the lower mold 3 to move toward the upper mold chess 10 of the upper mold 2.

[0050] Then, as shown in Figure 8, the lower die chess 30 of the lower die 3 is pressed against the upper die chess 10 of the upper die 2 via the film 70. This clamps the upper die 2 and the lower die 3 together, and as shown in Figure 8, a cavity 50 is formed in the upper die cavity forming section 111 and the lower die cavity forming section 301.

[0051] After the lower die chest 30 of the lower die 3 moves upward (positive Z-axis direction), and before it presses against the upper die chest 10 of the upper die 2 via the film 70, each of the pressing parts 143 of the multiple inserts 14a, 14b presses against the heat sink 67 of the molded product 60 via the film 70.

[0052] Subsequently, as the lower die chest 30 of the lower die 3 moves upward (positive Z-axis direction), the heat sink 67 of the molded product 60 moves further upward (positive Z-axis direction). As a result, the pressing portions 143 of each of the multiple inserts 14a, 14b are pressed against the heat sink 67 of the molded product 60 against the biasing force of the multiple adjustment members 15a, 15b, causing the multiple inserts 14a, 14b to move upward.

[0053] In this state, the film 70 is in contact with the heat sink 67 of the molded product 60, and the pressing portion 143 of each of the multiple inserts 14a, 14b maintains a state in which they press against the heat sink 67 of the molded product 60 via the film 70.

[0054] Next, in the resin encapsulation apparatus 100, resin tablets (not shown) placed in each pot 8 (see Figure 1) are melted by a heater (not shown), and a plunger provided in the transfer unit 7 (see Figure 1) moves upward. As a result, the molten resin tablets are extruded as resin into the cavity 50 via a galvanizing section and a runner section (not shown).

[0055] As a result, as shown in Figure 9, the resin 80 is filled into the cavity 50, and a resin-sealed molded product 90 is formed in which a part of the molded product 60 is sealed within the cavity 50 by the resin 80. As described above, before the resin 80 is filled into the cavity 50, the portion of the film 70 facing the upper mold cavity forming portion 111 is shaped to conform to the shape of the upper mold cavity forming portion 111, so that the resin-sealed molded product 90 can be manufactured with high precision.

[0056] Next, in the resin encapsulation apparatus 100, the movable platen 6 (see Figure 1) moves downward, causing the lower mold 3 to separate from the upper mold 2, as shown in Figure 10. In this state, the resin-encapsulated molded product 90 is placed on the lower mold chess 30 of the lower mold 3.

[0057] Next, in the resin encapsulation apparatus 100, as shown in Figure 11, the resin-encapsulated molded product 90, which is placed on the lower mold chest 30 of the lower mold 3, is removed from the resin encapsulation mold 1 by a transport device (not shown).

[0058] As shown in Figures 11 to 13, the resin-encapsulated molded product 90 has the upper surface of the heat sink 66 and the lower surface of the heat sink 67 exposed, and the electronic components 62 to 65 sandwiched between the pair of heat sinks 66 and 67 are resin-encapsulated by the resin 91.

[0059] Thus, in the heat sink 67 of the resin-encapsulated molded product 90, the upper surface, which is the surface pressed by each of the pressing portions 143 of the multiple inserts 14a and 14b, becomes the exposed surface after resin encapsulation. Also, in the heat sink 66 of the resin-encapsulated molded product 90, the lower surface, which is the surface that abuts against the lower mold cavity forming portion 301 in the lower mold chest 30 of the lower mold 3, becomes the exposed surface after resin encapsulation. Note that the molded product 60 is not limited to the configuration shown in Figures 2 to 4, and the surfaces pressed by each of the pressing portions 143 of the multiple inserts 14a and 14b are not limited to the heat sink 67.

[0060] Here, we will describe the resin encapsulation process for a molded product 60 that has a tilted heat sink 67. In the heat sink 67 of the molded product 60 shown in Figure 14, the height decreases from the right to the left, resulting in a downward tilt to the left in the left-right direction (X direction) in Figure 14. The tilt of the heat sink 67 is the tilt with respect to the heat sink 66.

[0061] In the resin sealing process using the resin sealing device 100 for the molded product 60 shown in Figure 14, in the clamped state, as shown in Figure 15, the pressing portion 143 of each of the multiple inserts 14a and 14b is maintained to press against the heat sink 67 of the molded product 60 via the film 70.

[0062] Furthermore, in the state shown in Figure 15, the molded product 60 is tilted downward to the left, so the pressing portion 143 of the insert 14a located on the left side in Figure 15 is located lower (negative Z-axis direction) than the pressing portion 143 of the insert 14b located on the right side in Figure 15. Therefore, the resin encapsulation device 100 can properly press the heat sink 67 even when the amount of tilt of the heat sink 67 in the molded product 60 is greater than, for example, the amount of tilt of the swivel member in the device described in Patent Document 1.

[0063] Furthermore, a film 70 is placed between each of the pressing portions 143 of the multiple inserts 14a and 14b and the heat sink 67 of the molded product 60. As a result, as shown in Figure 15, the elastic deformation of the film 70 in the thickness direction prevents gaps from forming between the molded product 60 and the film 70, thereby suppressing the occurrence of resin burrs.

[0064] The resin encapsulation apparatus 100 is not limited to the example described above. In the resin encapsulation apparatus 100 shown in Figure 16, there is no film placement section 9, and no film 70 is placed between the upper mold 2 and the lower mold 3 during the resin encapsulation process. The heat sink 67 of the molded product 60 shown in Figure 16 exhibits a downward tilt to the left, similar to the heat sink 67 of the molded product 60 shown in Figure 14.

[0065] Then, in the resin encapsulation apparatus 100 shown in Figure 16, the movable platen 6 (see Figure 1) moves upward (positive Z-axis direction) by a drive mechanism (not shown), causing the lower mold chess 30 of the lower mold 3 to move toward the upper mold chess 10 of the upper mold 2.

[0066] As a result, as shown in Figure 17, the lower die chest 30 of the lower die 3 comes into contact with the upper die chest 10 of the upper die 2. This causes the upper die 2 and the lower die 3 to be clamped together, and the cavity 50 is formed. After the lower die chest 30 of the lower die 3 moves upward (positive Z-axis direction), before it comes into contact with the upper die chest 10 of the upper die 2, the pressing parts 143 of each of the multiple inserts 14a, 14b come into direct contact with the heat sink 67 of the molded product 60.

[0067] In the resin sealing process using the resin sealing device 100 for the molded product 60 shown in Figure 16, in the mold clamping state, as shown in Figure 17, the pressing portion 143 of each of the multiple inserts 14a and 14b is maintained to press against the heat sink 67 of the molded product 60.

[0068] Furthermore, in the state shown in Figure 17, the heat sink 67 in the molded product 60 is tilted downward to the left. Therefore, the pressing portion 143 of the insert 14a located on the left side in Figure 17 is located lower (negative Z-axis direction) than the pressing portion 143 of the insert 14b located on the right side in Figure 17. For this reason, the resin encapsulation apparatus 100 shown in Figures 16 and 17 can properly press the heat sink 67 even when the amount of tilt of the heat sink 67 in the molded product 60 is greater than, for example, the amount of tilt of the swivel member in the apparatus described in Patent Document 1.

[0069] Furthermore, in the resin encapsulation apparatus 100 shown in Figures 16 and 17, multiple inserts 14 are arranged in the left-right direction (X-axis direction), which is the direction in which the heat sink 67 is tilted. As a result, the gap between each of the pressing portions 143 of the multiple inserts 14 and the heat sink 67 of the molded product 60 can be suppressed compared to the case where there is only one insert 14, thereby suppressing the generation of resin burrs.

[0070] Furthermore, in the resin encapsulation apparatus 100, by increasing the number of inserts 14 arranged in the left-right direction (X direction) according to the allowable tilt of the heat sink 67 of the molded product 60, the occurrence of gaps between the pressing part 143 and the heat sink 67 of the molded product 60 can be suppressed with greater precision, thereby more effectively suppressing the occurrence of resin burrs.

[0071] In the resin sealing device 100 shown in Figures 16 and 17, there is no suction hole 114. Also, in the resin sealing device 100 shown in Figures 16 and 17, since there is no need for suction in gaps G1 (see Figure 5) and G2 (see Figure 5), the distance is shorter than that of gaps G1 (see Figure 5) and G2 (see Figure 5) shown in Figures 5 to 11, and the entry of resin 80 is suppressed.

[0072] Furthermore, in the example described above, multiple inserts 14 were placed in the upper mold 2, but the multiple inserts 14 may be placed in the lower mold 3 instead of the upper mold 2, or they may be placed in both the upper mold 2 and the lower mold 3.

[0073] In the resin encapsulation apparatus 100 shown in Figure 18, multiple inserts 14 are arranged in the upper mold 2 and the lower mold 3. The upper mold 2 of the resin encapsulation apparatus 100 shown in Figure 18 has the same configuration as the upper mold 2 of the resin encapsulation apparatus 100 shown in Figure 5.

[0074] Furthermore, the lower mold chess 30 of the lower mold 3 of the resin sealing device 100 shown in Figure 18 comprises a first lower mold chess section 31 and a second lower mold chess section 32. The first lower mold chess section 31 has the same configuration as the first upper mold chess section 11, and the second lower mold chess section 32 has the same configuration as the second upper mold chess section 12.

[0075] For example, the first lower chess piece 31 has through holes 313a, 313b, suction holes 314, and recesses 315, similar to the through holes 113a, 113b, suction holes 114, and recesses 115 of the first upper chess piece 11.

[0076] Furthermore, the second lower chess piece section 32, like the second upper chess piece section 12, includes a base section 33, multiple nesting elements 34a, 34b, and multiple adjustment members 35a, 35b. In the following, when the multiple nesting elements 34a, 34b are not individually distinguished, they may be referred to as nesting element 34.

[0077] In the resin encapsulation apparatus 100 shown in Figure 18, even if the heat sink 67 of the molded product 60 is tilted, multiple inserts are provided in both the upper mold 2 and the lower mold 3, allowing for more appropriate pressing of the heat sinks 66 and 67. Note that the number of inserts 34 is not limited to two, similar to the number of inserts 14, and may be three or more.

[0078] Furthermore, a film 70 is placed between each of the multiple inserts 14 and the heat sink 67 of the molded product 60, and between each of the multiple inserts 34 and the heat sink 66 of the molded product 60. Therefore, in the resin encapsulation apparatus 100 shown in Figure 18, the formation of gaps between the molded product 60 and the film 70 due to elastic deformation of the film 70 in the thickness direction is suppressed, thereby suppressing the occurrence of resin burrs.

[0079] Furthermore, the resin encapsulation apparatus 100 shown in Figure 18 may be configured in which no film 70 is placed between the molded product 60 and the upper mold 2, and between the molded product 60 and the lower mold 3. In this case, the resin encapsulation apparatus 100 shown in Figure 18 can suppress the gaps between each of the multiple inserts 14 and the heat sink 67 of the molded product 60, and the gaps between each of the multiple inserts 34 and the heat sink 66 of the molded product 60, compared to the case where there is only one insert 14 or 34, thereby suppressing the occurrence of resin burrs.

[0080] For example, by increasing the number of inserts 14, 34 arranged in the left-right direction (X direction) according to the allowable tilt of the heat sinks 66, 67 of the molded product 60, the gap formed between the inserts 14, 34 and the heat sinks 67 of the molded product 60 can be reduced, thereby more effectively suppressing the occurrence of resin burrs.

[0081] In the resin encapsulation apparatus 100 described above, the inserts 14 and 34 are arranged in the left-right direction (X-axis direction). However, if the heat sink 67 tilts in the front-back direction (Y-axis direction), the inserts 14 and 34 can be arranged in the front-back direction (Y-axis direction). Furthermore, in the resin encapsulation apparatus 100, if the heat sink 67 tilts in both the front-back direction (Y-axis direction) and the left-right direction (X-axis direction), they may be arranged in a matrix, that is, in the left-right direction (X-axis direction) and the front-back direction (Y-axis direction).

[0082] As described above, the resin encapsulation apparatus 100 according to the embodiment is a resin encapsulation apparatus that encapsulates a workpiece 60 in a cavity 50, which is a space formed by the clamping of an upper mold 2 and a lower mold 3. At least one of the upper mold 2 and the lower mold 3 is arranged in a direction intersecting the clamping direction and comprises a plurality of inserts 14 that press the same workpiece 60 against each other in the clamping direction during clamping, and a plurality of adjustment members 15 that adjust the force with which corresponding inserts 14 press against the workpiece 60. The upper mold 2 is an example of a first mold, and the lower mold 3 is an example of a second mold. Each of the plurality of inserts 14 has a pressing portion 143 that protrudes toward the workpiece 60 and presses against the workpiece 60, and the pressing portions 143 of the plurality of inserts 14 protrude toward each other. As a result, the resin encapsulation apparatus 100 can suppress the generation of resin burrs. Furthermore, in the resin encapsulation device 100, since the pressing portions 143 of the multiple inserts 14 protrude in a direction toward each other, the area of ​​the portion where the multiple pressing portions 143 press against the heat sink 67 can be made wider compared to a configuration in which the pressing portions 143 of the multiple inserts 14 do not protrude in a direction toward each other. Therefore, the area of ​​the portion where the multiple pressing portions 143 press against the heat sink 67 can be made closer to the area of ​​the upper surface of the heat sink 67, which is the exposed surface, and the generation of resin burrs can be suppressed. In addition, in the resin encapsulation device 100, since the pressing portions 143 of the multiple inserts 14 protrude in a direction toward each other, the outer shape (area) of the extended portion 142 between the base end 141 and the pressing portion 143 of each of the multiple inserts 14, when viewed in the positive Z-axis direction, becomes smaller (narrower) than the portion (area) where the pressing portion 143 presses against the heat sink 67. Therefore, in the resin encapsulation device 100, multiple through holes 113a and 113b can be formed with spacing between them in the first upper mold chess section 11. This allows the resin encapsulation device 100 to allow each of the extended portions 142 of the multiple inserts 14 to slide through the corresponding through holes 113a and 113b. Thus, with the resin encapsulation device 100, movement of each insert 14 in directions other than the sliding direction is restricted, and the spacing between the pressing portions 143 of the multiple inserts 14 can be maintained with high precision.

[0083] Furthermore, in the resin encapsulation device 100, a film 70 is placed between a plurality of inserts 14 and the molded product 60. Each of the pressing portions 143 of the plurality of inserts 14 presses the molded product 60 through the film 70, and the film 70 comes into contact with the plurality of inserts 14 by the suction force that passes through the gaps formed between the plurality of pressing portions 143. As a result, the resin encapsulation device 100 can suppress the generation of resin burrs with greater precision.

[0084] Furthermore, the surface of the molded product 60 that is pressed by the multiple inserts 14 becomes the exposed surface after resin sealing. This allows the resin sealing device 100 to suppress the generation of resin burrs on the surface that will become the exposed surface.

[0085] Furthermore, the molded product 60 has a heat sink 67, and the exposed surface described above is formed on the heat sink 66. As a result, the resin encapsulation device 100 can suppress the generation of resin burrs on the heat sink 66.

[0086] Furthermore, the molded product 60 has a pair of heat sinks 66, 67, with heat sink 67 being one of the heat sinks. The other heat sink 66 of the pair of heat sinks 66, 67 contacts the other mold of the upper mold 2 and the lower mold 3 during mold clamping. This allows the resin sealing device 100 to suppress the generation of resin burrs on the heat sink 67.

[0087] Furthermore, the resin encapsulation device 100 includes a film placement section 9 for positioning a film 70 between a plurality of pressing sections 143 and the molded product 60 before mold clamping. This allows the resin encapsulation device 100 to suppress the occurrence of resin burrs with greater precision.

[0088] Furthermore, at least one of the upper mold 2 and the lower mold 3 has a suction hole 114 formed in it for sucking the film 70 through the gap G1 formed between the multiple pressing portions 143. This allows the resin sealing device 100 to suppress the generation of resin burrs with greater precision.

[0089] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents. [Explanation of Symbols]

[0090] 1 Resin sealing mold 2 Upper mold 3 Lower mold 9. Film placement section 10 Upper Chess 15, 15a, 15b, 35a, 35b Adjustment members 50 Cavity 60 Molded product 66,67 Heat sink 70 film 80,91 resin 90 Resin-sealed molded products 100 Resin encapsulation device 111 Upper mold cavity forming section 113a,113b,313a,313b through hole 114,314 Suction hole 115,315 recesses 115a side 143 Pressing part 1431 Bottom surface G1, G2 gap

Claims

1. A resin sealing device that performs resin sealing of a molded product in a cavity, which is a space formed by clamping a first mold and a second mold, At least one of the first mold and the second mold is Multiple inserts arranged in a direction intersecting the mold clamping direction, which press the same molded product against each other in the mold clamping direction during mold clamping, The system comprises a plurality of adjusting members for adjusting the force with which each corresponding insert presses the molded product against the workpiece, among the plurality of inserts. Each of the aforementioned nested structures is It has a pressing portion that protrudes toward the molded product and presses against the molded product, The aforementioned pressing portions of the multiple nested components are They protrude in directions that bring them closer together. A resin encapsulation device characterized by the following features.

2. A film is placed between the plurality of nests and the molded product. Each of the aforementioned nesting parts has the pressing portion, The molded product is pressed through the film, The aforementioned film is The multiple nesting parts are brought into contact by the suction force that passes through the gaps formed between the multiple pressing parts. The resin encapsulation apparatus according to feature 1.

3. The molded product is The surface pressed by the plurality of nesting elements becomes the exposed surface after the resin sealing. The resin encapsulation apparatus according to claim 1 or 2.

4. The molded product is It has a heat sink, The exposed surface is, Formed on the heat sink The resin encapsulation apparatus according to feature 3.

5. The molded product is The heat sink has a pair of heat sinks, with the aforementioned heat sink being one of the heat sinks. The other heat sink of the pair of heat sinks is During the clamping process, the first mold and the other mold of the second mold come into contact with each other. The resin encapsulation apparatus according to feature 4.

6. The mold clamping mechanism includes a film placement section for positioning the film between multiple pressing sections and the molded product. The resin encapsulation apparatus according to feature 2.

7. At least one of the first mold and the second mold includes: Suction holes are formed to suck the film through the gaps formed between the multiple pressing portions. The resin encapsulation apparatus according to feature 2.

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