Pumping device

Abstract

This reduces the risk of electronic components mounted on the circuit board of a pump device falling off due to vibrations in the pump device. [Solution] The pump case 10 is provided with a plurality of mounting parts 11 extending outward when viewed from the axial direction, and each of the plurality of mounting parts 11 is provided with a fixing hole 12 that serves as a support fixing part for fixing to a support. An electronic element E3 having a pair of terminals T1 and T2 is mounted on the circuit board 19. The pair of terminals T1 and T2 are soldered to the circuit board 19. When the longest straight line connecting two different fixing holes 12 is taken as the virtual line P1 of the mounting part, and the straight line connecting the pair of terminals T1 and T2 is taken as the virtual line Q of the element, the electronic element E3 is arranged such that the angle θ between the virtual line Q of the element and the virtual line P1 of the mounting part is greater than 45°.

Description

Technical Field

[0001] The present invention relates to a pump device.

Background Art

[0002] Patent Documents 1 and 2 describe a pump device that rotates an impeller disposed in a pump chamber by a motor. The pump devices of Patent Documents 1 and 2 include a housing formed integrally with a stator of the motor and a case that forms a pump chamber between the housing. The case is provided with a fluid discharge port and a suction port. The motor includes a rotor disposed at the center in the radial direction of the stator and rotating integrally with the impeller, and a circuit board on which a drive circuit for supplying power to the coil of the stator is mounted.

[0003] The pump device of Patent Document 1 is provided with three mounting portions protruding radially outward from the case. The pump device is provided with fixing holes penetrating through the three mounting portions, and is fixed to a support through screws passed through the fixing holes.

[0004] In Patent Document 1, the circuit board of the pump device is molded together with the stator in the housing. On the other hand, the pump device of Patent Document 2 includes a cover attached to the housing from the side opposite to the case in the axial direction, and a circuit board is disposed between the cover and the bottom wall of the housing. The outer peripheral edge of the circuit board is fixed to the housing.

[0005] Various electronic elements are mounted on the circuit board on which the drive circuit of the motor is mounted. For example, switching elements constituting an inverter circuit are mounted on the circuit board of Patent Document 2. Further, an electrolytic capacitor connected to a drive voltage line to which a drive voltage is supplied from the outside is mounted. Furthermore, control elements such as an IC chip for controlling the inverter circuit based on a PWM signal supplied from the outside are mounted.

Prior Art Documents

Patent Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2019-157685 [Patent Document 2] Japanese Patent Publication No. 2023-056661 [Overview of the project] [Problems that the invention aims to solve]

[0007] As shown in Patent Document 1, the pump device is fixed to a support via multiple mounting parts formed in the case or housing that forms the pump chamber. In such a support structure, the arrangement of the mounting parts determines in which direction the pump device is prone to vibration. For example, among the multiple mounting parts, vibration is least likely to occur in the direction along the straight line connecting the two furthest mounting parts that are fixed to the support, in other words, the straight line connecting the two furthest fixing holes.

[0008] Here, as described in Patent Document 2, if the circuit board is not molded in resin, the electronic components mounted on the circuit board may experience stress on the solder joints due to the vibration of the pump device, potentially causing the solder to break. If the solder breaks, the electronic components will detach from the circuit board. The load applied to the solder fixing the electronic components to the circuit board depends on the arrangement of the solder and the direction of vibration. If the direction in which the pump device is prone to vibration coincides with the direction in which the solder is prone to breaking, there is a high risk of the electronic components detaching.

[0009] In view of the above problems, the object of the present invention is that an electronic element mounted on the circuit board of a pump device The purpose is to reduce the risk of the part falling off due to vibrations in the pump system. [Means for solving the problem]

[0010] To solve the above problems, one embodiment of the pump device according to the present invention includes a rotor and a stator surrounding the outer circumference of the rotor, a housing that seals the stator, and a pump case that covers the housing from one side in the axial direction along the rotation axis of the rotor and forms a pump chamber between the housing and the pump case, an impeller arranged in the pump chamber and rotating integrally with the rotor, a cover fixed to the housing from the other side in the axial direction, and a circuit board housed between the housing and the cover, wherein the pump case is provided with a plurality of mounting parts extending outward when viewed from the axial direction, each of the plurality of mounting parts has a support fixing part that is fixed to the support, an electronic element having a pair of terminals is mounted on the circuit board, the pair of terminals are soldered to the circuit board, and when the longest straight line among the straight lines connecting two different support fixing parts is taken as the virtual line of the mounting part, and the straight line connecting the pair of terminals is taken as the virtual line of the element, the angle between the virtual line of the element and the virtual line of the mounting part is greater than 45°. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a cross-sectional view of the pump device of Embodiment 1. [Figure 2] Figure 2 is a plan view of the pump device of Embodiment 1 with the cover removed, as seen from the other side in the axial direction. [Figure 3] Figure 3 is a perspective view of the circuit board from the other side in the axial direction and from the other side. [Figure 4] Figure 4 shows the plan view, bottom view, and side view of the electronic component. [Figure 5] Figure 5 is a plan view of the substrate surface on which electronic components are fixed. [Figure 6] Figure 6 is a schematic diagram illustrating arrangement A, where the virtual line for the mounting portion and the virtual line for the element are orthogonal, and arrangement C, where the virtual line for the shortest mounting portion and the virtual line for the element are parallel. [Figure 7] Figure 7 is a graph showing the seismic acceleration of the pump system. [Figure 8]Figure 8 is a plan view of the pump device of Embodiment 2 with the cover removed, as seen from the other side in the axial direction. [Modes for carrying out the invention]

[0012] Hereinafter, an embodiment of the pump device 1 will be described with reference to the drawings. In the following description, the direction along the rotation axis L of the rotor 5 will be referred to as the axial direction, with one side of the axial direction being L1 and the other side being L2.

[0013] (Embodiment 1) Figure 1 is a cross-sectional view of the pump device 1 of Embodiment 1. As shown in Figure 1, the pump device 1 comprises a motor 2, an impeller 3 rotated by the motor 2, and a case 4 that covers the motor 2 from one side L1 in the axial direction. The motor 2 comprises a rotor 5, a stator 7 surrounding the outer circumference of the rotor 5, a housing 8 that seals the stator 7, a cover 9 fixed to the housing 8 from the other side L2 in the axial direction, and a circuit board 19 housed between the housing 8 and the cover 9. The circuit board 19 is a motor drive circuit board that supplies drive current to a coil 6 located on the stator 7. The impeller 3 and rotor 5 rotate together around the rotation axis L.

[0014] The housing 8 is a resin sealing member that covers the stator 7 from both radial and axial sides. The stator 7 is integrated with the housing 8 by insert molding. The stator 7 comprises a stator core 70 and coils 6 wound around the stator core 70 via an insulator 71. The motor 2 is a three-phase motor and comprises three phases of coils 6.

[0015] Case 4 is fixed to the housing 8 from one side L1 in the axial direction. A pump chamber 20 is formed between the housing 8 and the case 4, and the impeller 3 is placed in the pump chamber 20. Thus, the housing 8 and the case 4 form a pump case 10. The case 4 includes an intake pipe 21 extending along the rotation axis L of the motor 2 and a discharge pipe (not shown) extending in a direction perpendicular to the rotation axis L of the motor 2.

[0016] On the other end of the housing 8 in the axial direction, there is a bottom wall 81 that covers the stator 7 from the other side L2 in the axial direction, and a cylindrical tubular portion 82 that extends from the outer edge of the bottom wall 81 to the other side L2 in the axial direction. At the radial center of the bottom wall 81, the end of the support shaft 50 that rotatably supports the rotor 5 is held. The circuit board 19 is disposed between the bottom wall 81 of the housing 8 and the cover 9. The outer peripheral edge of the cover 9 is fixed to an annular flange portion 83 provided at the tip of the tubular portion 82.

[0017] (Mounting portion) FIG. 2 is a plan view of the pump device 1 according to Embodiment 1 with the cover 9 removed, as viewed from the other side L2 in the axial direction. As described above, the pump device 1 includes a pump case 10 constituted by the case 4 and the housing 8, and the pump case 10 has three mounting portions 11 that project to the outer peripheral side. As shown in FIG. 2, the three mounting portions 11 extend in different directions. When fixing the pump device 1 to a support (not shown), it is fixed through the three mounting portions 11. Note that the three mounting portions 11 may be provided on the housing 8 or on the case 4.

[0018] At the tip of each mounting portion 11, a fixing hole 12, which is a support fixing portion, is provided. In the example shown in FIG. 2, the fixing hole 12 penetrates the mounting portion 11 in the axial direction. Each mounting portion 11 is fixed, for example, by screwing the tip of a fixing member such as a bolt passed through the fixing hole 12 to the support while being in contact with the fixing surface on the support side in the axial direction.

[0019] (Circuit board) As shown in FIG. 2, the circuit board 19 has a shape in which one location on the outer peripheral edge of the circular board is linearly cut out. Therefore, the outer peripheral edge of the circuit board 19 has a linear portion 190 that is linearly cut out. On both sides in the circumferential direction of the linear portion 190, board fixing portions 191 for fixing the circuit board 19 to the housing 8 are provided. The board fixing portion 191 is a notch for passing a screw 84.

[0020] The housing 8 has two boss portions (not shown) located inside the cylindrical portion 82. The boss portions extend from the bottom wall 81 of the housing 8 to the other side L2 in the axial direction. The circuit board 19 is fixed to the housing 8 by bringing the portion where the board fixing portion 191 is formed into contact with the boss portion of the housing 8 from the other side L2 in the axial direction, and by screwing screws 84 that pass through the board fixing portion 191 into the boss portion. In Figure 2, R is a straight line connecting the two board fixing portions 191. Hereafter, this straight line R will be referred to as the virtual board fixing line R.

[0021] On the outer edge of the circuit board 19, a mounting portion 192 is provided at a position radially opposite to the straight portion 190, projecting radially outward. The mounting portion 192 is placed on a substrate support portion 85 provided on the flange portion 83 of the housing 8. The substrate support portion 85 is a recess provided on the flange portion 83. The circuit board 19 is supported by the housing 8 at three points: two substrate fixing portions 191 and the mounting portion 192. The mounting portion 192 is provided radially opposite to the imaginary line R of the substrate fixing portion with respect to the center O of the circuit board 19. In this embodiment, the mounting portion 192 is provided at equiangled positions from the two substrate fixing portions 191.

[0022] Multiple terminal holes 195 are provided along the outer edge of the circuit board 19, arranged along a straight section 190. Connector terminals (not shown) held by the housing 8 are fitted into each terminal hole 195 and soldered. The connector terminals fitted into the terminal holes 195 are mounted on the circuit board 19. These are terminals for connecting the motor drive circuit to the power supply and higher-level equipment. For example, the connector terminals that fit into the terminal hole 195 include a constant voltage terminal to which a rated drive voltage of 12V is applied, a first signal terminal to which a PWM signal is input, a second signal terminal to which a rotation speed signal corresponding to the rotation speed of motor 2 is output, and a ground terminal to which ground potential is applied.

[0023] Multiple terminal holes 196 are provided on the outer edge of the circuit board 19 in the region radially opposite to the straight section 190. As shown in Figure 1, the multiple winding terminals 72 held at the bottom of the housing 8 have their other ends L2 in the axial direction fitted into the terminal holes 196 of the circuit board 19 and soldered. The three-phase coil 6 is electrically connected to the circuit board 19 via the winding terminals 72.

[0024] Figure 3 is a perspective view of the circuit board 19 as seen from the other side L2 and the other side L1 in the axial direction. The circuit board 19 has a substrate surface S1 facing the one side L1 in the axial direction and a substrate surface S2 facing the other side L2 in the axial direction. The circuit board 19 is a double-sided substrate, and electronic elements are mounted on substrate surface S1 and substrate surface S2.

[0025] As shown in the lower part of Figure 3, electronic elements E1, E2, and E3 are mounted on the board surface S1 of the circuit board 19. In addition to electronic elements E1, E2, and E3, other elements may also be mounted on the board surface S1. Electronic element E1 is a control element such as an IC chip. Electronic elements E2 and E3 are noise suppression electronic elements. For example, electronic element E2 is a choke coil. Electronic element E3 is an electrolytic capacitor. In Figure 2, the arrangement of electronic elements E1, E2, and E3 as viewed from the axial direction is shown by dashed lines.

[0026] In this embodiment, two electronic elements E3 are mounted on the substrate surface S1. The two electronic elements E3 are identical. The number of electronic elements E3 may be one or three or more. Electronic element E3 is the element with the largest mass among the elements mounted on the substrate surfaces S1 and S2. Also, electronic element E3 is the element with the largest height among the elements mounted on the substrate surfaces S1 and S2.

[0027] As shown in the upper diagrams of Figures 2 and 3, a switching element E4 of an inverter circuit that generates a drive current to supply to the coil 6 is mounted on the substrate surface S2 of the circuit board 19. The inverter circuit generates the drive current based on a control signal from an electronic element E1 mounted on the substrate surface S1. The switching element E4 is positioned in a region radially opposite to the linear section 190 with respect to the center O of the circuit board 19. Therefore, the switching element E4 is positioned in a region close to the terminal hole 196 to which the winding terminals 72 are soldered.

[0028] As shown in Figure 2, the electronic elements E1, E2, and E3 are arranged in the same region as the straight section 190 and terminal holes 195 with respect to the center O of the circuit board 19. Therefore, the electronic elements E1, E2, and E3 are arranged in the region opposite to the region where the switching element E4 is located.

[0029] (Fixed structure of electronic components) Figure 4 shows a plan view, bottom view, and side view of the electronic element E3. Figure 5 shows a plan view of the substrate surface S1 on which the electronic element E3 is fixed. As shown in Figure 4, the electronic element E3 has a pair of terminals T1 and T2. The pair of terminals T1 and T2 are located at both ends of the bottom surface 31 of the electronic element E3, extending to the corner where the bottom surface 31 and the side surface of the electronic element E3 connect, and are exposed at the lower end of the side surface. The terminals T1 and T2 are located in the center in the width direction on the side surface of the electronic element E3.

[0030] The electronic element E3 is electrically connected to the circuit pattern provided on the substrate surface S1 by soldering two locations on the substrate surface S1 where a pair of terminals T1 and T2 are provided. As shown in Figure 5, soldered portions 30 are formed at the locations where the pair of terminals T1 and T2 are provided. The electronic component E3 is fixed to the substrate surface S1 via the solder joint 30.

[0031] The electronic component E3 is fixed to the substrate surface S1 using adhesive 40 as an auxiliary agent. As shown in Figure 5, the adhesive 40 is applied to the two sides where no solder joints 30 are provided. Alternatively, the adhesive 40 may be omitted, and the electronic component E3 may be fixed using only the solder joints 30. If adhesive 40 is used in combination, it may also be applied over the solder joints 30 to fix all four sides, not just two, with adhesive 40.

[0032] (Arrangement of electronic components considering the direction of terminal alignment) As shown in Figure 5, when the line connecting the pair of terminals T1 and T2 is defined as the element virtual line Q, the two electronic elements E3 have the same orientation along the element virtual line Q and are aligned. It is preferable to arrange the electronic elements E3 so that the element virtual line Q and the arrangement direction of the terminal holes 195 are perpendicular. Since the electronic elements E3 are located in a region close to the terminal holes 195, arranging terminals T1 and T2 in a direction perpendicular to the arrangement direction of the terminal holes 195 makes it easier to simplify the circuit pattern connecting the terminal holes 195 and the electronic elements E3. Simplifying the circuit pattern makes it possible to miniaturize the circuit board 19 and improves EMC performance. Here, EMC refers to the compatibility of EMI (Electromagnetic Interference; the phenomenon of electromagnetic energy being emitted) and EMS (Electromagnetic Susceptibility; immunity; the ability to operate without performance degradation or malfunction due to external electromagnetic energy).

[0033] As shown in Figures 2 and 5, in this embodiment, one of the two electronic elements E3 is positioned on the virtual line R of the substrate fixing portion. The other electronic element E3 is not positioned on the virtual line R of the substrate fixing portion, but is positioned closer to the virtual line R of the substrate fixing portion than to the mounting portion 192. The area on or near the virtual line R of the substrate fixing portion connecting the screw-fixed points, and away from the mounting portion 192, is an area on the circuit board 19 where vibrations are less likely to be large. Therefore, this arrangement can reduce the vibrations applied to the electronic elements E3. By reducing vibrations, fracture of the solder portion 30 caused by vibrations can be suppressed. Therefore, the risk of the electronic elements E3 falling off the circuit board 19 can be reduced.

[0034] The arrangement of the electronic component E3 can be determined as follows, taking into account the arrangement of the mounting portion 11 of the pump device 1. As described above, the pump device 1 is fixed to the support at three points via the three mounting portion 11. In such a fixing structure, the direction in which the pump device 1 is least likely to vibrate is the direction connecting the two furthest points out of the three. As shown in Figure 2, comparing the lengths of three straight lines P1, P2, and P3 that connect the centers of two different mounting holes 12 out of the three mounting holes 12, the length of straight line P1 is the longest. Hereinafter, this straight line P1 will be referred to as the mounting portion imaginary line. The direction in which the pump device 1 is least likely to vibrate is the direction along the mounting portion imaginary line P1.

[0035] When the pump device 1 vibrates, the circuit board 19 vibrates together with the housing 8, and an inertial force in the direction of vibration is applied to the electronic element E3. When two solder joints 30 are aligned on the element's virtual line Q, the vibration direction in which the solder joints 30 are least likely to break is along the element's virtual line Q. The vibration direction in which the solder joints 30 are most likely to break is perpendicular to the element's virtual line Q. Therefore, considering the arrangement direction of terminals T1 and T2, any of the following arrangements A, B, C, a modified version of arrangement C, and D, or a combination thereof, can be adopted as the arrangement of the electronic element E3. Figure 6 is an explanatory diagram schematically showing arrangements A and C.

[0036] • Arrangement A: The virtual line P1 of the mounting part and the virtual line Q of the element are perpendicular to each other. The arrangement of the electronic elements E3 on the circuit board 19 is preferably such that the direction in which the pump device 1 vibrates least (i.e., the direction along the virtual line P1 of the mounting portion) coincides with the direction in which the solder portion 30 is most likely to break (i.e., the direction perpendicular to the virtual line Q of the elements). In other words, as shown in the upper diagram of Figure 6, the virtual line P1 of the mounting portion and the virtual line Q of the elements are perpendicular to each other. It is preferable to arrange the electronic element E3. This can suppress the fracture of the solder joint 30 and reduce the risk of the electronic element E3 falling off the circuit board 19.

[0037] • Arrangement B: The angle between the virtual line P1 of the mounting part and the virtual line Q of the element is θ > 45°. As shown in Figure 2, in this embodiment, the virtual line P1 of the mounting portion and the virtual line Q of the element are not orthogonal, but the angle θ between the virtual line P1 of the mounting portion and the virtual line Q of the element is greater than 45°. θ > 45° means that the direction in which the pump device 1 vibrates least is closer to the direction of vibration in which the solder portion 30 is most likely to break than to the direction of vibration in which the solder portion 30 is least likely to break. Therefore, if θ > 45°, the breakage of the solder portion 30 can be suppressed, and the risk of the electronic element E3 falling off the circuit board 19 can be reduced.

[0038] • Arrangement C: Make the virtual line P3 of the shortest mounting point and the virtual line Q of the element parallel. In a structure where the pump device 1 is fixed to a support via three mounting points 11, the mounting orientation of the electronic element E3 can also be determined by aligning it with the direction of the shortest virtual line P3, which is the shortest mounting point among the three straight lines P1, P2, and P3 connecting the centers of two different fixing holes 12. The direction along the virtual line P3 is the direction in which the pump device 1 is prone to vibration because the distance between the mounting points 11 is short. Therefore, it is preferable to align the direction in which the pump device 1 is prone to vibration with the vibration direction in which the solder portion 30 is least likely to break (i.e., the direction along the virtual line Q of the element). In other words, as shown in the lower diagram of Figure 6, it is preferable to position the electronic element E3 so that the virtual line P3 of the shortest mounting point and the virtual line Q of the element are parallel. This can suppress the breakage of the solder portion 30 and reduce the risk of the electronic element E3 falling off the circuit board 19.

[0039] • Example of changing layout C: As described above, it is preferable that the orientation of the shortest mounting point virtual line P3 and the orientation of the element virtual line Q coincide. However, even if they do not coincide, if the angle between the shortest mounting point virtual line P3 and the element virtual line Q is small, the angle between the direction in which the pump device 1 is most likely to vibrate and the vibration direction in which the solder joint 30 is least likely to break is small, thus reducing the risk of the solder joint 30 breaking. For example, when comparing the angles between each of the three straight lines P1, P2, and P3 connecting the fixing holes 12 and the element virtual line Q, if the angle between the shortest mounting point virtual line P3 and the element virtual line Q is the smallest, the risk of the solder joint 30 breaking is low. In other words, if the angle between the shortest mounting point virtual line P3 and the element virtual line Q is smaller than the angle between the straight line P1 and the element virtual line Q, and also smaller than the angle between the straight line P2 and the element virtual line Q, the risk of the solder joint 30 breaking is low. Therefore, the risk of the electronic element E3 falling off is low.

[0040] • Arrangement D: The virtual line Q of the element and the virtual line R of the substrate fixing part are orthogonal to each other. The virtual line R of the substrate fixing portion is a straight line connecting the two points where the circuit board 19 is fixed to the housing 8, and therefore coincides with the direction in which the circuit board 19 is less likely to vibrate relative to the housing 8. Accordingly, if the virtual line Q of the element and the virtual line R of the substrate fixing portion are orthogonal, the direction in which the circuit board 19 is less likely to vibrate coincides with the direction of vibration in which the solder portion 30 is more likely to break. Thus, this arrangement can suppress the breakage of the solder portion 30 and reduce the risk of the electronic element E3 falling off the circuit board 19.

[0041] (Seismic resistance test) To verify the effectiveness of the above arrangement C, a seismic test was conducted. In the seismic test, vibrations were applied in the direction along the shortest mounting point virtual line P3 to pump device 1 in which the electronic element E3 was positioned so that the angle between the shortest mounting point virtual line P3 and the element virtual line Q was 0°, and to pump device 1 in which the electronic element E3 was positioned so that the angle was 90°. Figure 7 is a graph showing the seismic acceleration of pump device 1. Seismic acceleration is the acceleration of vibration when the electronic element E3 falls off. As can be seen from Figure 7, when arrangement C is adopted, the seismic acceleration is higher than when it is not adopted. The vibration is large. Therefore, it can be seen that if arrangement C is adopted, there is less risk of the electronic element E3 falling off even if the vibration is large.

[0042] (Effects and Benefits) As described above, the pump device 1 of this embodiment includes a rotor 5 and a stator 7 surrounding the outer circumference of the rotor 5, a housing 8 that seals the stator 7, a pump case 10 including a case 4 that is placed over the housing 8 from one side L1 in the axial direction along the rotation axis L of the rotor 5 and forms a pump chamber 20 between the housing 8 and the case 4, an impeller 3 arranged in the pump chamber 20 and rotating integrally with the rotor 5, a cover 9 fixed to the housing 8 from the other side L2 in the axial direction, and a circuit board 19 housed between the housing 8 and the cover 9. The pump case 10 is provided with a plurality of mounting parts 11 extending outward when viewed from the axial direction, and each of the plurality of mounting parts 11 is provided with a fixing hole 12 as a support fixing part that is fixed to a support. An electronic element E3 having a pair of terminals T1 and T2 is mounted on the circuit board 19. The pair of terminals T1 and T2 are soldered to the circuit board 19. When the longest straight line connecting two different fixing holes 12 is defined as the virtual line P1 of the mounting portion, and the straight line connecting the pair of terminals T1 and T2 is defined as the virtual line Q of the element, the electronic element E3 is arranged such that the angle θ between the virtual line Q of the element and the virtual line P1 of the mounting portion is greater than 45°.

[0043] Thus, by adopting the above arrangement B, there is less risk of the solder joint 30 that fixes the electronic component E3 to the circuit board 19 breaking. Therefore, there is less risk of the electronic component E3 falling off the circuit board 19.

[0044] In this embodiment, the element virtual line Q is not perpendicular to the mounting part virtual line P1, but it is preferable to adopt the above arrangement A and make the element virtual line Q and the mounting part virtual line P1 perpendicular. In this case, the risk of the solder portion 30 breaking can be further reduced, and the risk of the electronic element E3 falling off the circuit board 19 can be further reduced.

[0045] In this embodiment, the mounting portion 11 is provided in three locations. Therefore, it is preferable to adopt the above arrangement C. That is, when the shortest straight line among the straight lines connecting two different fixing holes 12 is defined as the shortest mounting portion virtual line P3, it is preferable to make the element virtual line Q and the shortest mounting portion virtual line P3 parallel. In this case, the risk of the solder portion 30 breaking can be further reduced, and the risk of the electronic element E3 falling off the circuit board 19 can be further reduced. Alternatively, when comparing the angles made between each of the three straight lines P1, P2, and P3 connecting the fixing holes 12 and the element virtual line Q, by making the angle made between the shortest mounting portion virtual line P3 and the element virtual line Q the smallest, the risk of the solder portion 30 breaking can be reduced, and the risk of the electronic element E3 falling off can be reduced.

[0046] In this embodiment, the electronic element E3 is an electrolytic capacitor. Electrolytic capacitors are large elements with high mass and height, resulting in a large load on the solder joint 30 due to inertial force during vibration. Therefore, by adopting an arrangement that minimizes the risk of the solder joint 30 breaking, the risk of the electronic element E3 detaching from the circuit board 19 can be reduced.

[0047] The arrangement of the electronic element E3 in this embodiment can also be applied to elements other than electrolytic capacitors. For example, it is preferable to adopt the above arrangements when the electronic element E3 has the largest mass among the elements fixed to the circuit board 19, or when the electronic element E3 has the largest height among the elements fixed to the circuit board 19 and is fixed to the circuit board 19 by soldering a pair of terminals.

[0048] In this embodiment, the fixing hole 12 penetrates the mounting portion 11 in the axial direction. The circuit board 19 is in contact with the housing 8 from the other side in the axial direction at least three locations on its outer edge. It is fixed to part 8. With this support structure, we were able to confirm that the risk of electronic element E3 falling off can be reduced, as demonstrated in the seismic resistance test described above.

[0049] In this embodiment, the outer edge of the circuit board 19 is provided with two board fixing portions 191 that are fixed to the housing 8. The virtual line R connecting the two board fixing portions 191 is perpendicular to the virtual line Q of the element. By making the straight line connecting the screw-fixed locations perpendicular to the virtual line Q of the element, the direction in which the circuit board 19 is less likely to vibrate coincides with the direction in which the solder joints 30 are most likely to break. Therefore, the risk of the electronic element E3 falling off can be reduced.

[0050] In this embodiment, a mounting portion 192 is provided on the outer edge of the circuit board 19, which is placed on a board support portion 85 provided on the housing 8. The mounting portion 192 is provided on the opposite side of the imaginary line R of the board fixing portion from the center of the circuit board 19. The electronic element E3 is positioned on the imaginary line R of the board fixing portion, or closer to the imaginary line R of the board fixing portion than the mounting portion 192. As a result, the electronic element E3 is positioned in a region of the circuit board 19 where vibrations are less likely to become large. Therefore, fracture of the solder portion 30 due to vibration can be suppressed, and the risk of the electronic element E3 falling off the circuit board 19 can be reduced.

[0051] In this embodiment, the circuit board 19 is provided with a plurality of terminal holes 195 to which connector terminals held by the housing 8 are soldered, and the arrangement direction of the plurality of terminal holes 195 is orthogonal to the element virtual line Q. This makes it easier to simplify the circuit pattern connecting the terminal holes 195 and the electronic element E3, so that the circuit board 19 can be miniaturized and EMC performance is improved.

[0052] Furthermore, the orientation of the element virtual lines Q of the multiple electronic elements E3 arranged on the circuit board 19 does not need to be aligned. Even in this case, the orientation of the element virtual line Q of each electronic element E3 can be configured to be one of the arrangements A and D described above, or a combination thereof.

[0053] (Embodiment 2) Figure 8 is a plan view of the pump device 1A of Embodiment 2 with the cover removed, viewed from the other side in the axial direction. The pump device 1A shown in Figure 8 comprises a pump case 10A with a housing 8A and a circuit board 19A fixed to the housing 8A. The pump case 10A has two mounting portions 11A that protrude outward. When fixing the pump device 1A to a support (not shown), it is fixed via the two mounting portions 11A.

[0054] Each mounting portion 11A is provided with a fixing hole 12A, which is a support fixing portion. In the example shown in Figure 8, the fixing hole 12A penetrates the mounting portion 11A in a direction perpendicular to the axial direction. Each mounting portion 11A is fixed, for example, by screwing the tip of a fixing member such as a bolt passed through the fixing hole 12A to the support while the mounting portion 11A is in contact with the fixing surface on the support side in a direction perpendicular to the axial direction.

[0055] Similar to Embodiment 1, the circuit board 19A has a straight section 190 and two board fixing sections 191 on its outer edge. The board fixing sections 191 are fixed to the housing 8A by screws. Similar to Embodiment 1, the straight line connecting the two board fixing sections 191 is defined as the imaginary board fixing line R. In addition, the outer edge of the circuit board 19A has three locking recesses 197 in the region radially opposite to the straight section 190. Locking protrusions provided on the housing 8A fit into the locking recesses 197.

[0056] Multiple terminal holes 195 are provided along the outer edge of the circuit board 19A, aligned along the straight section 190, and multiple terminal holes 196 are provided in the region radially opposite to the straight section 190. Similar to Embodiment 1, the circuit board 19A is a double-sided board. Switching elements E4 are mounted on one side of the circuit board 19A. Electronic elements E3 are mounted on the other side of the circuit board 19A. Although not shown in the figures, similar to Embodiment 1, elements such as control elements and choke coils are also arranged on the other side of the circuit board 19A.

[0057] In the pump device 1A of Embodiment 2, since there are two mounting parts 11A, the direction in which the pump device 1 vibrates least is the direction connecting the two fixing holes 12A. Therefore, the straight line P11 shown in Figure 8 is called the imaginary mounting line. The imaginary mounting line P11 is the longest straight line connecting two different locations among the multiple fixing holes 12A.

[0058] In the pump device 1A of Embodiment 2, it is preferable to apply the arrangement of the electronic element E3 on the circuit board 19A as proposed in Embodiment 1. In Figure 8, the angle θ between the mounting portion virtual line P11 and the element virtual line Q is greater than 45°, as in Embodiment 1. Furthermore, it is preferable to apply arrangement A above to make θ = 90°. This suppresses the fracture of the solder portion 30 that fixes the electronic element E3 to the circuit board 19, as in Embodiment 1, and reduces the risk of the electronic element E3 falling off the circuit board 19A.

[0059] Furthermore, by applying arrangement D of Embodiment 1, the element virtual line Q and the substrate fixing part virtual line R can be made orthogonal. This suppresses vibrations applied to the electronic element E3, reducing the risk of the electronic element E3 falling off the circuit board 19.

[0060] Furthermore, it is preferable that the electronic element E3 be placed on or near the virtual line R of the substrate fixing portion. Also, when the electronic element E3 is placed in a region close to the terminal hole 195, it is preferable that the virtual line Q of the element and the alignment direction of the terminal hole 195 be orthogonal.

[0061] (summary) A summary of this disclosure is provided below. (1) A rotor and a stator surrounding the outer circumference of the rotor, A pump case including a housing that seals the stator, and a case that is placed over the housing from one side in the axial direction along the rotation axis of the rotor to form a pump chamber between the housing and the housing, An impeller is arranged in the pump chamber and rotates integrally with the rotor, A cover fixed to the housing from the other side in the axial direction, The housing and the cover house a circuit board, The pump case is provided with a plurality of mounting portions extending outward when viewed from the axial direction, and each of the plurality of mounting portions is equipped with a support fixing portion that is fixed to a support. An electronic element having a pair of terminals is mounted on the circuit board, and the pair of terminals is soldered to the circuit board. When the longest straight line connecting two different support fixing points is defined as the virtual line for the mounting point, and the straight line connecting the pair of terminals is defined as the virtual line for the element, A pump device characterized in that the angle between the virtual line of the element and the virtual line of the mounting portion is greater than 45°.

[0062] (2) The pump device according to (1) above, characterized in that the element virtual line is perpendicular to the mounting part virtual line.

[0063] (3) The mounting portion is provided in three locations, and when the shortest straight line among the straight lines connecting two different support fixing portions is defined as the shortest mounting portion virtual line, the element virtual line is parallel to the shortest mounting portion virtual line, as described in (1) or (2) above. A device.

[0064] (4) The pump device according to (1) or (2) above, wherein the mounting portion is provided in three locations, and when comparing the angles made between each of the three straight lines connecting two different support fixing portions and the virtual element line, the angle made between the shortest mounting portion virtual line, which is the shortest straight line among the three, and the virtual element line is the smallest.

[0065] (5) The pump device according to (1) or (2) above, wherein the mounting portion is provided in two locations, and the imaginary line of the mounting portion is a straight line connecting the support fixing portion provided on one of the two mounting portions and the support fixing portion provided on the other of the two mounting portions.

[0066] (6) The pump device according to any one of (1) to (5) above, characterized in that the electronic element is an electrolytic capacitor.

[0067] (7) The pump device according to any one of (1) to (6) above, characterized in that the electronic element has the largest mass among the elements fixed to the circuit board.

[0068] (8) The pump device according to any one of (1) to (6) above, characterized in that the electronic element is the tallest of the elements fixed to the circuit board.

[0069] (9) The pump device according to any one of (1) to (8) above, characterized in that the support fixing portion is a fixing hole that penetrates the mounting portion in the axial direction, and the circuit board is fixed to the housing such that at least three of its outer peripheral edges abut against the housing from the other side in the axial direction.

[0070] (10) The pump device according to any one of (1) to (9) above, wherein two substrate fixing portions are provided on the outer edge of the circuit board, which are fixed to the housing, and when the straight line connecting the two substrate fixing portions is defined as the virtual line of the substrate fixing portion, the virtual line of the element is perpendicular to the virtual line of the substrate fixing portion.

[0071] (11) The pump device according to (10) above, characterized in that the outer edge of the circuit board is provided with a mounting portion which is placed on a board support portion provided in the housing, the mounting portion is provided on the opposite side of the imaginary line of the board fixing portion with respect to the center of the circuit board, and the electronic elements are arranged on the imaginary line of the board fixing portion, or in a position closer to the imaginary line of the board fixing portion than the mounting portion.

[0072] (12) The pump device according to any one of (1) to (11) above, characterized in that the circuit board is provided with a plurality of terminal holes to which connector terminals held in the housing are soldered, and the arrangement direction of the plurality of terminal holes is perpendicular to the virtual line of the element. [Explanation of Symbols]

[0073] 1, 1A...Pump device, 2...Motor, 3...Impeller, 4...Case, 5...Rotor, 6...Coil, 7...Stator, 8, 8A...Housing, 9...Cover, 10, 10A...Pump case, 11, 11A...Mounting part, 12, 12A...Fixing hole, 19, 19A...Circuit board, 20...Pump chamber, 21...Suction pipe, 30...Solder part, 31...Bottom surface, 40...Adhesive, 50...Support shaft, 70...Stator E1, E2, E3... Electronic element, E4... Switching element, L... Rotation axis, L1... One side in the axial direction, L2... Axis On the other side in the direction of the line, O...center of the circuit board, P1, P11...virtual lines for mounting parts, P3...virtual line for the shortest mounting part, Q...virtual line for the element, R...virtual line for the board fixing part, S1, S2...board surface, T1, T2...terminals

Claims

1. A rotor and a stator surrounding the outer circumference of the rotor, A pump case including a housing that seals the stator, and a case that is placed over the housing from one side in the axial direction along the rotation axis of the rotor to form a pump chamber between the housing and the housing, An impeller is arranged in the pump chamber and rotates integrally with the rotor, A cover fixed to the housing from the other side in the axial direction, The housing and the cover house a circuit board, The pump case is provided with a plurality of mounting portions extending outward when viewed from the axial direction, and each of the plurality of mounting portions is equipped with a support fixing portion that is fixed to a support. An electronic element having a pair of terminals is mounted on the circuit board, and the pair of terminals is soldered to the circuit board. When the longest straight line connecting two different support fixing points is defined as the virtual line for the mounting point, and the straight line connecting the pair of terminals is defined as the virtual line for the element, A pump device characterized in that the angle between the virtual line of the element and the virtual line of the mounting portion is greater than 45°.

2. The pump device according to claim 1, characterized in that the virtual line of the element is perpendicular to the virtual line of the mounting portion.

3. The aforementioned mounting portion is provided in three locations. When the shortest straight line connecting two different support fixing points is defined as the shortest virtual line of the mounting point, The pump device according to claim 1, characterized in that the virtual line of the element is parallel to the virtual line of the shortest mounting portion.

4. The aforementioned mounting portion is provided in three locations. When comparing the angles between each of the three straight lines connecting two different support fixing points and the virtual line of the element, The pump device according to claim 1, characterized in that the angle between the shortest straight line among the three straight lines, which is the shortest mounting section virtual line, and the element virtual line is the smallest.

5. The aforementioned mounting portion is provided in two locations. The pump device according to claim 1, characterized in that the imaginary line of the mounting portion is a straight line connecting the support fixing portion provided on one of the two mounting portions and the support fixing portion provided on the other of the two mounting portions.

6. The pump device according to claim 1, characterized in that the electronic element is an electrolytic capacitor.

7. The pump device according to claim 1, characterized in that the electronic element has the largest mass among the elements fixed to the circuit board.

8. The pump device according to claim 1, characterized in that the electronic element has the largest height among the elements fixed to the circuit board.

9. The support fixing portion is a fixing hole that penetrates the mounting portion in the axial direction, The circuit board is fixed to the housing such that at least three of its outer edges abut against the housing from the other side in the axial direction, as described in claim 1. Pump device.

10. Two substrate fixing portions are provided on the outer edge of the circuit board, which are fixed to the housing. When the straight line connecting the two aforementioned substrate fixing points is defined as the virtual line of the substrate fixing point, The pump device according to claim 1, characterized in that the virtual line of the element is perpendicular to the virtual line of the substrate fixing portion.

11. The outer edge of the circuit board is provided with a mounting portion which is placed on a board support portion provided in the housing, and the mounting portion is provided on the opposite side of the imaginary line of the board fixing portion with respect to the center of the circuit board. The pump device according to claim 10, characterized in that the electronic element is arranged on the imaginary line of the substrate fixing portion, or at a position closer to the imaginary line of the substrate fixing portion than the previously described fixing portion.

12. The circuit board is provided with a plurality of terminal holes to which connector terminals held in the housing are soldered. The pump device according to claim 1, characterized in that the arrangement direction of the plurality of terminal holes and the virtual line of the element are orthogonal to each other.

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