Conductive plates, electrochemical elements, electrochemical modules, electrochemical devices, and energy systems

Abstract

The present invention provides a conductive plate that reduces electrical resistance at the point of contact with the electrochemical reaction section, does not obstruct the supply of gas to the electrochemical reaction section, and minimizes the space required for its placement. [Solution] The conductive plate 22 provided on the electrochemical element, which comprises an electrochemical reaction section 15 having a solid electrolyte layer, an electrode layer and a counter electrode layer, a plate-shaped support supporting the electrochemical reaction section 15, and a separator, is provided between the counter electrode layer and the separator and is configured to electrically conduct electricity between the counter electrode layer and the separator. When provided on the electrochemical element, it includes a flat plate portion 22b positioned in contact with the counter electrode layer, and the flat plate portion 22b has a plurality of through holes 22d that penetrate between the side of the counter electrode layer and the side of the separator.

Description

[Technical Field]

[0001] The present invention relates to conductive plates, electrochemical elements, electrochemical modules, electrochemical devices, and energy systems. [Background technology]

[0002] Patent Document 1 (Japanese Patent Application Publication No. 2019-186147) describes an electrochemical element (power generation unit 102) comprising an electrochemical reaction section (single cell 110) having an electrolyte layer (112), an electrode layer (fuel electrode 116) disposed on one side of the electrolyte layer (112), and a counter electrode layer (air electrode 114) disposed on the other side of the electrolyte layer (112). This electrochemical element (power generation unit 102) includes an air electrode side current collector member (134) disposed between an interconnector (150) and the counter electrode layer (air electrode 114) of the electrochemical reaction section (single cell 110), and composed of a conductive material for electrically connecting them. Specifically, the air electrode side current collector member (134) has a base portion (136), a plurality of cell contact portions (135), and a plurality of connecting portions (137). Then, the base portion (136) is joined to the interconnector (150), and the cell contact portion (135) is joined to the counter electrode layer (air electrode 114).

[0003] Furthermore, in Patent Document 1, an air electrode side spacer (139) made of an elastic material (elastic body) such as mica is placed between each cell contact portion (135) of the air electrode side current collector member (134) and the interconnector (150). This configuration aims to ensure that the height of the air chamber (166) is above a certain level while suppressing an increase in the weight of the air electrode side current collector member (134).

[0004] Patent Document 2 (Japanese Patent No. 6586478) describes an electrochemical element (fuel cell cell 300) comprising an electrochemical reaction section (power generation element section 10) having an electrolyte layer (electrolyte 5), an electrode layer (fuel electrode 4) disposed on one side of the electrolyte layer (electrolyte 5), and a counter electrode layer (air electrode 6) disposed on the other side of the electrolyte layer (electrolyte 5). Two adjacent electrochemical elements (fuel cell cells 300) are electrically connected by a current collector (301) formed from a bent metal plate. This current collector (301) is placed in a space through which air flows. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2019-186147 [Patent Document 2] Patent No. 6586478 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] In the electrochemical elements described above, the current collector that ensures electrical connection with the electrochemical reaction section is required to have low electrical resistance at the part that contacts the electrochemical reaction section, to be less likely to obstruct the supply of gas to the electrochemical reaction section, and to suppress the enlargement of the electrochemical element by minimizing the space required for arranging the current collector.

[0007] The air electrode side current collector (134) described in Patent Document 1 aims to ensure that the height of the air chamber (166) is above a certain level, which has the problem of leading to an increase in the size of the electrochemical element.

[0008] The current collector (301) described in Patent Document 2 uses a large, bent metal plate, which creates a large space for air to flow. This leads to the problem of the electrochemical element becoming larger.

[0009] The present invention has been made in view of the above problems, and its objective is to provide a conductive plate, electrochemical element, electrochemical module, electrochemical apparatus, and energy system that can reduce electrical resistance at the part in contact with the electrochemical reaction section, not obstruct the supply of gas to the electrochemical reaction section, and minimize the space required for placement. [Means for solving the problem]

[0010] A characteristic configuration of a conductive plate according to the present invention for achieving the above objective is a conductive plate provided in an electrochemical element comprising a solid electrolyte layer, an electrode layer disposed on one side of the solid electrolyte layer, a counter electrode layer disposed on the other side of the solid electrolyte layer, a plate-shaped support for the electrode layer of the electrochemical reaction unit, and a separator. It is provided between the counter electrode layer and the separator, and is configured to electrically conduct electricity between the counter electrode layer and the separator. When provided in the electrochemical element, it includes a flat plate portion positioned in contact with the counter electrode layer, The flat plate portion has a plurality of through holes that penetrate between the counter electrode layer and the separator.

[0011] According to the above characteristic configuration, by arranging the flat plate portion between the counter electrode layer and the separator, electrical conductivity between the counter electrode layer and the separator can be improved compared to the case where the flat plate portion is not arranged. Furthermore, because the flat plate portion is arranged between the counter electrode layer and the separator, a large space is not required between the counter electrode layer and the separator. In addition, since the flat plate portion facing the counter electrode layer is provided with multiple through holes that penetrate from the side of the counter electrode layer to the side of the separator, gas can be supplied to the counter electrode layer well without hindering gas diffusion. Therefore, it is possible to provide a conductive plate that reduces electrical resistance at the part in contact with the electrochemical reaction section, does not obstruct the supply of gas to the electrochemical reaction section, and minimizes the space required for placement.

[0012] Another characteristic configuration of the conductive plate according to the present invention is that it includes an annular portion and a flat plate portion located within a space surrounded by the annular portion and connected to the annular portion.

[0013] According to the above characteristic configuration, since the flat plate portion is connected to and supported by the annular portion, the position of the flat plate portion is not significantly displaced with respect to the counter electrode layer and the separator. That is, the flat plate portion can be reliably arranged between the counter electrode layer and the separator, and the electrical conduction between the counter electrode layer and the separator can be ensured to be in a good state.

[0014] Another characteristic configuration of the conductive plate according to the present invention is that the diameter of the through hole is 100 μm or more.

[0015] According to the above characteristic configuration, gas can flow sufficiently through the through hole. Also, since the diameter of the through hole is 100 μm or more, it is possible to coat the inner surface of the through hole by electrodeposition or the like.

[0016] Another characteristic configuration of the conductive plate according to the present invention is that the thickness is 250 μm or more and it is formed using ferritic stainless steel.

[0017] According to the above characteristic configuration, the conductive plate can have sufficient oxidation resistance.

[0018] Another characteristic configuration of the conductive plate according to the present invention is that it has a Cr diffusion prevention layer on its surface.

[0019] According to the above characteristic configuration, it is possible to prevent chromium atoms contained in the conductive plate from diffusing into an adjacent counter electrode layer or separator, or diffusing into other members communicating with the gas flow path.

[0020] Another characteristic configuration of the conductive plate according to the present invention is that the annular portion is rectangular when viewed from a direction along the stacking direction in which the plate-like support, the electrochemical reaction portion, and the separator are stacked in the electrochemical element. It is located at the point where one side constituting the annular portion is connected to the flat plate portion.

[0021] According to the above characteristic configuration, the flat plate portion is connected to one side of the annular portion, that is, the flat plate portion is connected to the annular portion in a cantilevered state. Therefore, even if the annular portion of the conductive plate deforms due to heat, deformation of the flat plate portion in accordance with the deformation of the annular portion can be avoided.

[0022] Another characteristic configuration of the conductive plate according to the present invention is that the annular portion is rectangular when viewed from a direction along the stacking direction in which the plate-shaped support, the electrochemical reaction portion, and the separator are stacked in the electrochemical element. The flat plate portion is located at a point where each of the two or more sides constituting the annular portion is connected to the flat plate portion.

[0023] According to the above characteristic configuration, the flat plate portion is connected to multiple points on the annular portion, so the flat plate portion can be stably held by the annular portion.

[0024] A characteristic feature of the electrochemical element according to the present invention is that it comprises the plate-shaped support, the electrochemical reaction section, the conductive plate, and the separator, all of which are laminated together.

[0025] According to the above characteristic configuration, it is possible to provide an electrochemical element equipped with a conductive plate that reduces electrical resistance at the part in contact with the electrochemical reaction part, does not obstruct the supply of gas to the electrochemical reaction part, and minimizes the space required for placement.

[0026] Another characteristic feature of the electrochemical element according to the present invention is that the conductive plate and the separator are joined together.

[0027] According to the above characteristic configuration, since the conductive plate and the separator are joined together, it is possible to prevent the two from shifting positions.

[0028] Another characteristic feature of the electrochemical element according to the present invention is that it includes a conductive bonding layer that joins the flat plate portion and the counter electrode layer.

[0029] According to the above characteristic configuration, the bonding layer can improve electrical conductivity between the flat portion of the conductive plate and the counter electrode layer.

[0030] Another characteristic feature of the electrochemical element according to the present invention is that the material constituting the junction layer is located between the flat plate portion and the counter electrode layer, and inside the through-hole of the flat plate portion.

[0031] According to the above characteristic configuration, the material constituting the bonding layer is present not only between the flat plate portion and the counter electrode layer, but also inside the through-hole of the flat plate portion, so that the inner surface of the through-hole is covered with the material constituting the bonding layer. As a result, the contact area between the flat plate portion and the counter electrode layer increases by the amount by which the inner diameter of the through-hole is reduced. Consequently, the electrical resistance between the flat plate portion and the counter electrode layer can be reduced, and a strong bond can be formed between the flat plate portion and the counter electrode layer.

[0032] Another characteristic configuration of the electrochemical element according to the present invention is that the material constituting the junction layer is located between the flat plate portion and the counter electrode layer, inside the through-hole of the flat plate portion, and on the surface of the flat plate portion that is not opposite the counter electrode layer.

[0033] According to the above characteristic configuration, the material constituting the bonding layer is present between the flat plate portion and the counter electrode layer, inside the through hole of the flat plate portion, and on the surface of the flat plate portion on the side not facing the counter electrode layer. As a result, the inner surface of the through hole is covered with the material constituting the bonding layer, and the material constituting the bonding layer is also provided between the flat plate portion and the separator. Therefore, the contact area between the flat plate portion and the counter electrode layer increases by the amount by which the inner diameter of the through hole is reduced. As a result, the electrical resistance between the flat plate portion and the counter electrode layer can be reduced, and the flat plate portion and the counter electrode layer can be firmly bonded. In addition, the electrical resistance between the surface of the flat plate portion on the side not facing the counter electrode layer (i.e., the separator side) and the separator can be reduced, and the flat plate portion and the separator can be firmly bonded.

[0034] Another characteristic feature of the electrochemical element according to the present invention is the provision of a conductive elastic member provided between the conductive plate and the separator, which presses the flat portion of the conductive plate toward the counter electrode layer.

[0035] According to the above characteristic configuration, the elastic member presses the flat portion of the conductive plate toward the counter electrode layer, thereby enabling stable contact between the conductive plate and the counter electrode layer.

[0036] The characteristic configuration of the electrochemical module according to the present invention is that it comprises an electrochemical element laminate comprising a plurality of the above-mentioned electrochemical elements stacked on top of each other, a first gas supply unit that supplies a first gas, which is one of the reducing component gas and the oxidizing component gas supplied to the electrode layer of the electrochemical element, to the electrochemical element laminate, and a second gas supply unit that supplies a second gas, which is the other of the reducing component gas and the oxidizing component gas supplied to the counter electrode layer of the electrochemical element, to the electrochemical element laminate.

[0037] According to the above characteristic configuration, it is possible to provide an electrochemical module equipped with a conductive plate that reduces electrical resistance at the part in contact with the electrochemical reaction section, does not obstruct the supply of gas to the electrochemical reaction section, and minimizes the space required for placement.

[0038] The characteristic configuration of the electrochemical apparatus according to the present invention is that it has an electrochemical module and a fuel converter, and has a fuel supply unit that supplies the reducing component gas from the fuel converter to the electrochemical element or the electrochemical module, or supplies the reducing component gas from the electrochemical element or the electrochemical module to the fuel converter.

[0039] According to the above-described configuration, when operating an electrochemical element or electrochemical module as a fuel cell, if hydrogen is generated from natural gas supplied using existing raw material supply infrastructure such as city gas, via a fuel converter such as a reformer, it is possible to realize an electrochemical device equipped with an electrochemical element or electrochemical module that is highly durable, reliable, and high-performing. Furthermore, since it becomes easier to construct a system for recycling unused fuel gas emitted from the electrochemical element or electrochemical module, a highly efficient electrochemical device can be realized.

[0040] When an electrochemical element or electrochemical module is operated as an electrolytic cell, a gas containing water vapor or carbon dioxide is passed through the electrode layer, and a voltage is applied between the electrode layer and the counter electrode layer. This generates electrons in the electrode layer. - Water molecules (H2O) and carbon dioxide molecules (CO2) react with hydrogen molecules (H2), carbon monoxide (CO), and oxygen ions (O). 2- This is the result. Oxygen ion O 2- It moves through the electrolyte layer to the counter electrode layer. In the counter electrode layer, oxygen ions O 2- The electrons are released to form oxygen molecules (O2). Through the above reaction, water molecules (H2O) are electrolyzed into hydrogen (H2) and oxygen (O2), and if a gas containing carbon dioxide molecules (CO2) is passed through, it is electrolyzed into carbon monoxide (CO) and oxygen (O2). When a gas containing water vapor and carbon dioxide molecules (CO2) is being circulated, a fuel converter can be provided that synthesizes various compounds such as hydrocarbons from hydrogen and carbon monoxide produced by the electrochemical element or electrochemical module through the electrolysis described above. The fuel supply unit can then circulate the hydrocarbons produced by this fuel converter to the electrochemical element or electrochemical module, or it can be extracted outside the system / device and used separately as fuel or chemical raw material.

[0041] Another characteristic configuration of the electrochemical apparatus according to the present invention is that it comprises at least the above-mentioned electrochemical module and a power converter that extracts power from the electrochemical element or the electrochemical module, or that supplies power to the electrochemical element or the electrochemical module.

[0042] According to the above characteristic configuration, the power converter extracts the electricity generated by the electrochemical element or electrochemical module, or supplies electricity to the electrochemical element or electrochemical module. As a result, the electrochemical element or electrochemical module acts as a fuel cell or an electrolytic cell. Therefore, it is possible to provide an electrochemical element or the like that can improve the efficiency of converting chemical energy such as fuel into electrical energy, or converting electrical energy into chemical energy such as fuel.

[0043] Furthermore, for example, when using an inverter as a power converter, it is preferable because the inverter can boost the electrical output obtained from an electrochemical element or electrochemical module, which has excellent durability, reliability, and performance, or convert DC to AC, making it easier to utilize the electrical output obtained from the electrochemical element or electrochemical module.

[0044] A key feature of the energy system according to the present invention is that it comprises the electrochemical apparatus described above and a waste heat utilization unit that reuses the heat discharged from the electrochemical apparatus or the fuel converter.

[0045] According to the above characteristic configuration, since it has an electrochemical device and a waste heat utilization unit that reuses the heat discharged from the electrochemical device or fuel converter, it is possible to realize an energy system that is excellent in durability, reliability and performance, as well as energy efficiency. Furthermore, it is also possible to realize an energy-efficient hybrid system by combining it with a power generation system that generates electricity using the combustion heat of unused fuel gas discharged from the electrochemical device or fuel converter.

[0046] Another characteristic configuration of the energy system according to the present invention is that it comprises the electrochemical apparatus and a waste heat utilization unit that reuses the heat discharged from the electrochemical apparatus.

[0047] According to the above-described configuration, since it has an electrochemical device and a waste heat utilization unit that reuses the heat discharged from the electrochemical device, it is possible to realize an energy system that is excellent in durability, reliability, and performance, as well as energy efficiency. Furthermore, it is also possible to realize an energy-efficient hybrid system by combining it with a power generation system that generates electricity using the combustion heat of unused fuel gas discharged from the electrochemical device. [Brief explanation of the drawing]

[0048] [Figure 1] This is a diagram showing the external appearance of an electrochemical module. [Figure 2] This diagram shows the configuration of the electrochemical element stack in the electrochemical module. [Figure 3] This is an exploded view showing the components of the electrochemical elements in an electrochemical element laminate. [Figure 4] This is a diagram showing the configuration of the conductive plate. [Figure 5] This is a diagram showing the structure of the elastic member. [Figure 6] This is a diagram showing the structure of the elastic member. [Figure 7] This is a diagram showing the configuration of the channel formation structure. [Figure 8] This diagram shows the configuration of the channel forming plate that constitutes the channel forming structure. [Figure 9] This diagram shows the configuration of the channel forming plate that constitutes the channel forming structure. [Figure 10] This is a diagram showing the configuration of an electrochemical apparatus and an energy system. [Figure 11] This is a diagram showing the configuration of an electrochemical apparatus and an energy system. [Modes for carrying out the invention]

[0049] The conductive plate 22, electrochemical element 10, electrochemical module 9, electrochemical apparatus 100, and energy system Z according to embodiments of the present invention will be described below with reference to the drawings. In the drawings, the X, Y, and Z directions are indicated. When describing the positional relationships of the layers, for example, the side of the solid electrolyte layer 15b as viewed from the electrode layer 15a may be referred to as "up" or "upper side" in the Z direction, and the side of the plate-shaped support 16 may be referred to as "down" or "lower side" in the Z direction.

[0050] Figure 1 shows the external appearance of the electrochemical module 9. Figure 2 shows the configuration of the electrochemical element laminate 8 provided in the electrochemical module 9. Figure 3 is an exploded view showing the components of the electrochemical element 10 provided in the electrochemical element laminate 8. In this embodiment, the electrochemical element 10 is an element that generates electricity. Note that Figure 2 schematically depicts the cross-sectional structure of the electrochemical element laminate 8 and differs from the actual cross-sectional structure.

[0051] As shown in Figure 1, the electrochemical module 9 comprises an electrochemical element stack 8, a container 1 housing the electrochemical element stack 8, a first gas supply unit 2 for supplying a first gas to the electrochemical element stack 8, a second gas supply unit 3 for supplying a second gas to the electrochemical element stack 8, a first gas discharge unit 4 for discharging the first gas after the reaction discharged from the electrochemical element stack 8, and a second gas discharge unit 5 for discharging the second gas after the reaction discharged from the electrochemical element stack 8.

[0052] The container 1 that houses the electrochemical element laminate 8 is generally rectangular in shape. Although not shown in the diagram, the container 1 includes a box-shaped top lid that opens at the bottom and a bottom lid that opens at the top. The top lid and the bottom lid are connected, for example, by welding, and a rectangular space is formed inside.

[0053] The first gas is one of the reducing component gas and the oxidizing component gas supplied to the electrode layer 15a, and the second gas is the other of the reducing component gas and the oxidizing component gas supplied to the counter electrode layer 15c. In this embodiment, the first gas is a reducing component gas such as fuel gas, and the second gas is an oxidizing component gas such as air (oxygen).

[0054] Therefore, the electrochemical element laminate 8 receives fuel gas from the first gas supply unit 2 and air from the second gas supply unit 3, and generates electricity by causing an electrochemical reaction between the fuel gas and oxygen in the air. The fuel gas after the electrochemical reaction is discharged to the outside from the first gas discharge unit 4. The air after the electrochemical reaction is guided to the second gas discharge unit 5 and discharged to the outside from the second gas discharge unit 5.

[0055] In addition, the electrochemical element laminate 8 comprises a pair of busbars 6 and 7. Each busbar 6 and 7 is exposed from the inside to the outside of the container 1 through an opening formed in the container 1.

[0056] As shown in Figure 2, the electrochemical element laminate 8 comprises multiple electrochemical elements 10 stacked on top of each other. In addition, the electrochemical element laminate 8 is equipped with an upper current collection unit 11 at the top and a lower current collection plate 13 at the bottom. In other words, the electrochemical element laminate 8 is equipped with multiple electrochemical elements 10 stacked on top of each other between the upper current collection unit 11 and the lower current collection plate 13.

[0057] The upper current collection unit 11 is comprised of a conductive plate 22, an elastic member 21, and an upper current collection plate 12, stacked from bottom to top. The busbar 6 is mounted on the conductive upper current collection plate 12. The conductive plate 22 and the elastic member 21 will be described later.

[0058] The busbar 7 is attached to the conductive lower current collector plate 13.

[0059] The electrochemical element 10 comprises an electrochemical reaction section 15 having a solid electrolyte layer 15b, an electrode layer 15a disposed on one side of the solid electrolyte layer 15b, and a counter electrode layer 15c disposed on the other side of the solid electrolyte layer 15b, a plate-shaped support 16 supporting the electrode layer 15a of the electrochemical reaction section 15, and a separator 20. In this embodiment, the electrochemical element 10 comprises a conductive conductive plate 22, a conductive elastic member 21, a conductive separator 20, a conductive channel forming structure 17, a conductive plate-shaped support 16, an electrically insulating sealing member 14, and an electrochemical reaction section 15, all stacked from bottom to top. The separator 20 is formed using, for example, ferritic stainless steel. The sealing member 14 is formed using an insulating material such as mica. In other words, the electrochemical element 10 comprises a plate-shaped support 16, an electrochemical reaction section 15, a conductive plate 22, and a separator 20.

[0060] In the example shown in Figure 2, two electrochemical reaction units 15 are provided on a plate-shaped support 16. In other words, the two electrochemical reaction units 15 formed on the same plate-shaped support 16 are electrically connected in parallel to each other.

[0061] [Plate-shaped support 16] The plate-shaped support 16 supports the electrochemical reaction section 15, which has an electrode layer 15a, a solid electrolyte layer 15b, and a counter electrode layer 15c, and plays a role in maintaining the strength of the electrochemical element 10. The material used for the plate-shaped support 16 is a material with excellent electronic conductivity, heat resistance, oxidation resistance, and corrosion resistance. For example, ferritic stainless steel is used. The plate-shaped support 16 is formed using a plate material of uniform thickness as a whole.

[0062] The plate-shaped support 16 is provided with a gas flow-permitting portion 16a having a plurality of through holes 16b that penetrate the front surface and the back surface. The through holes 16b have the function of allowing gas to pass through from the back surface to the front surface of the plate-shaped support 16. Preferably, the gas flow-permitting portion 16a is provided in an area smaller than the area on the plate-shaped support 16 in which the electrode layer 15a is provided.

[0063] When the through-holes 16b are formed in the plate-shaped support 16 by etching, laser processing, or the like, no mechanical stress is applied to the plate-shaped support 16, which is preferable because it allows the through-holes 16b to be formed while maintaining its flatness. Furthermore, by using etching, laser processing, or the like, the spacing between multiple through-holes 16b can be reduced. As a result, gas can be supplied evenly to the counter electrode layer 15c.

[0064] The plate-shaped support 16 may have a metal oxide layer on its surface as a Cr diffusion prevention layer. This Cr diffusion prevention layer is the same as the Cr diffusion prevention layer 21f described later.

[0065] The plate-shaped support 16 described above can be formed, for example, by etching, laser processing, or physical processing (such as punching) on ​​a single conductive rectangular plate. Alternatively, the plate-shaped support 16 can also be formed by physical processing such as press working. Using etching or laser processing, which do not apply physical force to the plate, prevents warping or deformation of the plate.

[0066] [Electrochemical reaction section 15] <Electrode layer 15a> The electrode layer 15a can be provided in a thin layer on the front surface of the plate-shaped support 16 in an area larger than the gas flow-permitted portion 16a where the multiple through holes 16b are provided. When it is a thin layer, its thickness can be, for example, about 1 μm to 100 μm, preferably 5 μm to 50 μm. With such a thickness, it is possible to reduce the amount of expensive electrode layer 15a material used, thereby reducing costs, while ensuring sufficient electrode performance. The entire area where the through holes 16b are provided is covered by the electrode layer 15a. In other words, the through holes 16b are formed inside the area on the plate-shaped support 16 where the electrode layer 15a is formed. In other words, all the through holes 16b are provided facing the electrode layer 15a.

[0067] The electrode layer 15a has multiple pores on its interior and surface to allow gas permeability. In other words, the electrode layer 15a is formed as a porous layer. For example, the electrode layer 15a is formed so that its density is between 30% and less than 80%. The size of the pores can be appropriately selected to ensure that the electrochemical reaction proceeds smoothly. Density is the ratio of the material constituting the layer to the surrounding space, and can be expressed as (1 - porosity), and is equivalent to relative density.

[0068] As the material for the electrode layer 15a, composite materials such as NiO-GDC, Ni-GDC, NiO-YSZ, Ni-YSZ, CuO-CeO2, and Cu-CeO2 can be used. In these examples, GDC, YSZ, and CeO2 can be called aggregates of the composite material. The electrode layer 15a is preferably formed by low-temperature firing (for example, a wet method using firing in a low temperature range without firing in a high temperature range higher than 1100°C), spray coating (such as thermal spraying, aerosol deposition, aerosol gas deposition, powder jet deposition, particle jet deposition, and cold spray), PVD (such as sputtering and pulsed laser deposition), or CVD. These processes, which can be used in a low temperature range, allow for the acquisition of a good electrode layer 15a without using firing in a high temperature range higher than 1100°C. Therefore, this method is preferable because it does not damage the plate-shaped support 16 and suppresses elemental interdiffusion between the plate-shaped support 16 and the electrode layer 15a, thereby realizing an electrochemical element 10 with excellent durability. Furthermore, using a low-temperature firing method is even preferable because it simplifies the handling of raw materials.

[0069] <Solid electrolyte layer 15b> The solid electrolyte layer 15b is formed as a thin layer on the electrode layer 15a. It can also be formed as a thin film with a thickness of 10 μm or less. For example, the solid electrolyte layer 15b may be provided across (straddle) the electrode layer 15a and the plate-shaped support 16. In other words, the solid electrolyte layer 15b may be provided on the front surface of the plate-shaped support 16 in an area larger than the area where the through-holes 16b are provided. In this case, the solid electrolyte layer 15b can suppress gas leakage from the electrode layer 15a.

[0070] As the material for the solid electrolyte layer 15b, electrolyte materials that conduct oxygen ions such as YSZ (yttria-stabilized zirconia), SSZ (scandium-stabilized zirconia), GDC (gadolinium-doped ceria), YDC (yttrium-doped ceria), SDC (samarium-doped ceria), and LSGM (strontium-magnesium-doped lanthanum gallate), or electrolyte materials that conduct hydrogen ions such as perovskite-type oxides can be used. Zirconia-based ceramics are particularly preferred. If the solid electrolyte layer 15b is made of zirconia-based ceramics, the operating temperature of the SOFC (solid oxide fuel cell) using the electrochemical element 10 can be made higher compared to ceria-based ceramics and various hydrogen ion conductive materials. For example, when using the electrochemical element 10 in an SOFC, if a material capable of exhibiting high electrolyte performance even in high-temperature ranges of around 650°C or higher, such as YSZ, is used as the material for the solid electrolyte layer 15b, and hydrocarbon-based raw fuels such as city gas or LPG are used as the raw fuel for the system, and the raw fuel is converted into the anode gas of the SOFC by steam reforming or the like, a highly efficient SOFC system can be constructed that uses the heat generated in the SOFC cell stack to reform the raw fuel gas.

[0071] The solid electrolyte layer 15b is preferably formed by low-temperature firing (for example, a wet method using firing in a low temperature range without firing in a high temperature range exceeding 1100°C), spray coating (such as thermal spraying, aerosol deposition, aerosol gas deposition, powder jet deposition, particle jet deposition, or cold spray), PVD (such as sputtering or pulsed laser deposition), or CVD (chemical vapor deposition). These low-temperature film formation processes allow for the production of a dense, airtight, and highly gas-barrier solid electrolyte layer 15b without using firing in a high temperature range exceeding 1100°C, for example. This suppresses damage to the plate-shaped support 16 and inhibits elemental interdiffusion between the plate-shaped support 16 and the electrode layer 15a, thereby realizing an electrochemical element 10 with excellent performance and durability. In particular, using low-temperature firing or spray coating is preferable because it allows for the realization of a low-cost element. Furthermore, using a spray coating method is even more preferable because a dense, airtight, and highly gas-barrier solid electrolyte layer 15b can be easily obtained at low temperatures.

[0072] The solid electrolyte layer 15b is densely constructed to shield against gas leaks of the first and second gases and to exhibit high ionic conductivity. The density of the solid electrolyte layer 15b is preferably 90% or more, more preferably 95% or more, and even more preferably 98% or more. If the solid electrolyte layer 15b is a uniform layer, its density is preferably 95% or more, and more preferably 98% or more. Furthermore, if the solid electrolyte layer 15b is composed of multiple layers, it is preferable that at least a portion of it includes a layer with a density of 98% or more (a dense solid electrolyte layer), and more preferably a layer with a density of 99% or more (a dense solid electrolyte layer). This is because including such a dense solid electrolyte layer in a portion of the solid electrolyte layer 15b makes it easier to form a dense solid electrolyte layer 15b with high airtightness and gas barrier properties, even if the solid electrolyte layer 15b is composed of multiple layers.

[0073] <Counter electrode layer 15c> The counter electrode layer 15c is formed as a thin layer on the solid electrolyte layer 15b. When it is a thin layer, its thickness can be, for example, about 1 μm to 100 μm, preferably 5 μm to 50 μm. With such a thickness, it is possible to reduce the amount of expensive counter electrode layer 15c material used, thereby reducing costs, while ensuring sufficient electrode performance. As the material for the counter electrode layer 15c, for example, composite oxides such as LSCF and LSM, ceria oxides, and mixtures thereof can be used. In particular, it is preferable that the counter electrode layer 15c contains a perovskite-type oxide containing two or more elements selected from the group consisting of La, Sr, Sm, Mn, Co, and Fe. The counter electrode layer 15c constructed using the above materials functions as a cathode.

[0074] The formation of the counter electrode layer 15c is preferably carried out using a method that can be performed at a processing temperature of 1100°C or lower, as this suppresses damage to the plate-shaped support 16 and inhibits elemental interdiffusion between the plate-shaped support 16 and the electrode layer 15a, thereby realizing an electrochemical element 10 with excellent performance and durability. For example, this can be done using a low-temperature firing method (e.g., a wet method using firing in a low-temperature range without firing in a high-temperature range exceeding 1100°C), a spray coating method (such as thermal spraying, aerosol deposition, aerosol gas deposition, powder jet deposition, particle jet deposition, or cold spray), a PDV method (such as sputtering or pulsed laser deposition), or a CVD method. In particular, using a low-temperature firing method or a spray coating method is preferable because it enables the realization of a low-cost element. Furthermore, using a low-temperature firing method is even preferable because it simplifies the handling of raw materials.

[0075] Furthermore, an intermediate layer having oxygen ion (oxide ion) conductivity may be provided between the electrode layer 15a and the solid electrolyte layer 15b. The intermediate layer may also have mixed conductivity of oxygen ions (oxide ions) and electrons. For example, the intermediate layer can be formed as a thin layer on top of the electrode layer 15a, covering the electrode layer 15a. When forming a thin layer, its thickness can be, for example, about 1 μm to 100 μm, preferably about 2 μm to 50 μm, and more preferably about 4 μm to 25 μm. Such a thickness makes it possible to reduce the amount of expensive intermediate layer material used, thereby lowering costs while ensuring sufficient performance. As the material for the intermediate layer, for example, YSZ (yttria-stabilized zirconia), SSZ (scandium-stabilized zirconia), GDC (gadolinium-doped ceria), YDC (yttrium-doped ceria), SDC (samarium-doped ceria), etc. Ceria-based ceramics are particularly preferred.

[0076] The intermediate layer is preferably formed by low-temperature firing (for example, a wet method using firing in a low temperature range without firing in a high temperature range higher than 1100°C), spray coating (such as thermal spraying, aerosol deposition, aerosol gas deposition, powder jet deposition, particle jet deposition, and cold spray), PVD (such as sputtering and pulsed laser deposition), or CVD. These film formation processes, which can be used in a low temperature range, allow for the acquisition of the intermediate layer without using firing in a high temperature range higher than 1100°C. Therefore, elemental interdiffusion between the plate-shaped support 16 and the electrode layer 15a can be suppressed without damaging the plate-shaped support 16, resulting in a highly durable electrochemical element 10. Furthermore, using a low-temperature firing method is even more preferable because it simplifies the handling of raw materials.

[0077] In addition, a reaction prevention layer may be provided between the solid electrolyte layer 15b and the counter electrode layer 15c to prevent a reaction between the components of the solid electrolyte layer 15b and the components of the counter electrode layer 15c. The thickness of the reaction prevention layer can be, for example, about 1 μm to 100 μm, preferably about 2 μm to 50 μm, and more preferably about 3 μm to 15 μm. Such a thickness makes it possible to reduce the amount of expensive reaction prevention layer material used, thereby lowering costs while ensuring sufficient performance. The material of the reaction prevention layer can be any material that can prevent a reaction between the components of the solid electrolyte layer 15b and the components of the counter electrode layer 15c, for example, ceria-based materials are used. Furthermore, a material containing at least one element selected from the group consisting of Sm, Gd, and Y is preferably used as the material of the reaction prevention layer. It is preferable that the material contains at least one element selected from the group consisting of Sm, Gd, and Y, and that the total content of these elements is 1.0 mass% or more and 10 mass% or less.

[0078] By introducing a reaction prevention layer between the solid electrolyte layer 15b and the counter electrode layer 15c, the reaction between the constituent materials of the counter electrode layer 15c and the constituent materials of the solid electrolyte layer 15b is effectively suppressed, thereby improving the long-term stability of the performance of the electrochemical element 10. Forming the reaction prevention layer using a method that can be performed at a processing temperature of 1100°C or lower is preferable because it suppresses damage to the plate-shaped support 16 and also suppresses elemental interdiffusion between the plate-shaped support 16 and the electrode layer 15a, thereby realizing an electrochemical element 10 with excellent performance and durability. For example, this can be done using a low-temperature firing method (e.g., a wet method using firing in a low-temperature range without firing in a high-temperature range exceeding 1100°C), a spray coating method (such as thermal spraying, aerosol deposition, aerosol gas deposition, powder jet deposition, particle jet deposition, or cold spray), a PVD method (such as sputtering or pulsed laser deposition), or a CVD method as appropriate. In particular, using low-temperature firing methods or spray coating methods is preferable because it enables the realization of low-cost devices. Furthermore, using low-temperature firing methods is even preferable because it simplifies the handling of raw materials.

[0079] When the electrochemical reaction part 15 configured as described above functions as a fuel cell (electrochemical power generation cell), the electrochemical element 10 can be used as a power generation cell of a solid oxide fuel cell. For example, a fuel gas containing hydrogen as the first gas is supplied to the electrode layer 15a through the through-hole 16b from the back surface of the plate-like support 16, and air as the second gas is supplied to the counter electrode layer 15c serving as the counter electrode of the electrode layer 15a, and maintained at an operating temperature of about 700°C, for example. Then, oxygen O2 contained in the air reacts with electrons e - to produce oxygen ions O 2- . The oxygen ions O 2- move through the solid electrolyte layer 15b to the electrode layer 15a. In the electrode layer 15a, hydrogen H2 contained in the supplied fuel gas reacts with oxygen ions O 2- to produce water H2O and electrons e - .

[0080] When an electrolyte material that conducts hydrogen ions is used for the solid electrolyte layer 15b, hydrogen H2 contained in the fuel gas flowing through the electrode layer 15a releases electrons e - to produce hydrogen ions H + . The hydrogen ions H + move through the solid electrolyte layer 15b to the counter electrode layer 15c. In the counter electrode layer 15c, oxygen O2 contained in the air reacts with hydrogen ions H + and electrons e - to produce water H2O. Due to the above reactions, an electromotive force is generated as an electrochemical output between the electrode layer 15a and the counter electrode layer 15c. In this case, the electrode layer 15a functions as the fuel electrode (anode) of the fuel cell, and the counter electrode layer 15c functions as the air electrode (cathode).

[0081] As shown in FIG. 2, the electrochemical element laminate 8 includes a first gas supply manifold 24 connected to the first gas supply part 2, a second gas supply manifold 25 connected to the second gas supply part 3, a first gas discharge manifold 26 connected to the first gas discharge part 4, and a second gas discharge manifold 27 connected to the second gas discharge part 5.

[0082] As shown in Figure 3, the plate-shaped conductive plate 22 is provided with ventilation holes 22h, 22i, 22j, and 22k. Ventilation hole 22h constitutes part of the first gas supply manifold 24. Ventilation hole 22i constitutes part of the second gas supply manifold 25. Ventilation hole 22j constitutes part of the first gas discharge manifold 26. Ventilation hole 22k constitutes part of the second gas discharge manifold 27.

[0083] The plate-shaped elastic member 21 is provided with ventilation holes 21h, 21i, 21j, and 21k. Ventilation hole 21h constitutes part of the first gas supply manifold 24. Ventilation hole 21i constitutes part of the second gas supply manifold 25. Ventilation hole 21j constitutes part of the first gas discharge manifold 26. Ventilation hole 21k constitutes part of the second gas discharge manifold 27.

[0084] The plate-shaped separator 20 is provided with ventilation holes 20h, 20i, 20j, and 20k. Ventilation hole 20h constitutes part of the first gas supply manifold 24. Ventilation hole 20i constitutes part of the second gas supply manifold 25. Ventilation hole 20j constitutes part of the first gas discharge manifold 26. Ventilation hole 20k constitutes part of the second gas discharge manifold 27.

[0085] The plate-shaped flow path forming structure 17 is provided with vent holes 17h, 17i, 17j, and 17k. Vent hole 17h constitutes part of the first gas supply manifold 24. Vent hole 17i constitutes part of the second gas supply manifold 25. Vent hole 17j constitutes part of the first gas discharge manifold 26. Vent hole 17k constitutes part of the second gas discharge manifold 27.

[0086] The plate-shaped support 16 is provided with ventilation holes 16h, 16i, 16j, and 16k. Ventilation hole 16h constitutes part of the first gas supply manifold 24. Ventilation hole 16i constitutes part of the second gas supply manifold 25. Ventilation hole 16j constitutes part of the first gas discharge manifold 26. Ventilation hole 16k constitutes part of the second gas discharge manifold 27.

[0087] The sealing member 14 is provided with vent holes 14h, 14i, 14j, and 14k. Vent hole 14h constitutes part of the first gas supply manifold 24. Vent hole 14i constitutes part of the second gas supply manifold 25. Vent hole 14j constitutes part of the first gas discharge manifold 26. Vent hole 14k constitutes part of the second gas discharge manifold 27. As shown in Figure 2, the thickness of the sealing member 14 along the Z direction is greater than the thickness of the electrochemical reaction section 15 along the Z direction. Furthermore, both the sealing member 14 and the electrochemical reaction section 15 are provided on the surface of the plate-shaped support 16. Therefore, the surface of the electrochemical reaction section 15 is not at the same level as the surface of the sealing member 14, but is at a lower position. Because the sealing member 14 and the electrochemical reaction section 15 have this thickness, a portion of the conductive plate 22 (the flat portion 22b) is pushed toward the electrochemical reaction section 15 by the protruding portion 21c of the elastic member 21, resulting in a bent (protruding) shape toward the electrochemical reaction section 15. Furthermore, because the protruding portion 21c of the elastic member 21 protrudes along the Z direction, and the conductive plate 22 also takes on a bent shape, a gap is formed through which the second gas supplied to the space 21g of the elastic member 21 and the space 22f of the conductive plate 22 flows along a plane perpendicular to the stacking direction (XY plane).

[0088] As described above, the system includes a first gas manifold (first gas supply manifold 24, first gas discharge manifold 26) through which the first gas flows along the stacking direction through the plate-shaped support 16, conductive plate 22, elastic member 21, and separator 20, and a second gas manifold (second gas supply manifold 25, second gas discharge manifold 27) through which the second gas flows along the stacking direction through the plate-shaped support 16, conductive plate 22, elastic member 21, and separator 20, with holes provided in the plate-shaped support 16, conductive plate 22, elastic member 21, and separator 20 that function as either the first or second gas manifold. In other words, the first gas supply manifold 24, second gas supply manifold 25, first gas discharge manifold 26, and second gas discharge manifold 27 are realized by the ventilation holes formed in the conductive plate 22, elastic member 21, separator 20, flow path forming structure 17, plate-shaped support 16, and sealing member 14. As a result, since components for separately forming those manifolds are not required, the manufacturing process of the electrochemical element 10 can be simplified and manufacturing costs can be reduced.

[0089] In this embodiment, as shown in the figure, the conductive plate 22, the elastic member 21, the separator 20, the flow channel forming structure 17, the plate-shaped support 16, the electrochemical reaction section 15, and the sealing member 14 are all considered as a single unit constituting the electrochemical element 10. For example, the conductive plate 22, the elastic member 21, the separator 20, the flow channel forming structure 17, the plate-shaped support 16, and the sealing member 14 all have the same external shape when viewed from the stacking direction (Z direction). By welding the members constituting the external shapes of the conductive plate 22, the elastic member 21, the separator 20, the flow channel forming structure 17, and the plate-shaped support 16 together, they are mechanically integrated and electrically conductive to each other. As a result, misalignment of the above-mentioned members constituting the electrochemical element 10 can be prevented.

[0090] In this embodiment, since the conductive plate 22, the elastic member 21, the separator 20, the flow channel forming structure 17, and the plate-shaped support 16 are all made of the same material (for example, ferritic stainless steel), their thermal expansion coefficients become similar to those of the electrochemical reaction section 15, thereby reducing thermal stress and thermal deformation caused by heat cycling.

[0091] [Conductive plate 22] Figure 4 shows the configuration of the conductive plate 22. The conductive plate 22 is provided between the counter electrode layer 15c and the separator 20, more specifically between the counter electrode layer 15c and the elastic member 21, and is configured to electrically conduct electricity between the counter electrode layer 15c and the separator 20. In this embodiment, the conductive plate 22 is provided between the counter electrode layer 15c and the elastic member 21. When the conductive plate 22 is provided on the electrochemical element 10, it includes a flat plate portion 22b that is positioned to be in contact with the counter electrode layer 15c. In this embodiment, the conductive plate 22 includes an annular portion 22a and a flat plate portion 22b (second flat plate portion) located within the space 22f surrounded by the annular portion 22a and connected to the annular portion 22a. The annular portion 22a is rectangular when viewed from a direction along the stacking direction in which the plate-shaped support 16, the electrochemical reaction section 15, and the separator 20 are stacked in the electrochemical element 10.

[0092] Ventilation holes 22h, 22i, 22j, and 22k are formed at the four corners of the annular section 22a. Ventilation holes 22i and 22j communicate with space 22f. As a result, the second gas flowing through the second gas supply manifold 25 flows into space 22f from ventilation hole 22i. The second gas that has flowed through space 22f then flows out to the second gas discharge manifold 27 from ventilation hole 22j.

[0093] The conductive plate 22 is formed using, for example, ferritic stainless steel. Furthermore, the conductive plate 22 is formed using a plate material with a uniform thickness overall. In addition, a Cr diffusion prevention layer 22e is provided on its surface. As a result, it is possible to prevent chromium atoms contained in the conductive plate 22 from diffusing to the adjacent counter electrode layer 15c or separator 20. This Cr diffusion prevention layer 22e is similar to the Cr diffusion prevention layer 21f described later.

[0094] The thickness of the conductive plate 22 is 250 μm or more. For example, the thickness of the conductive plate 22 is preferably 280 μm or more, and more preferably 300 μm or more. By making the thickness of the conductive plate 22 250 μm or more, the conductive plate 22 can be given sufficient oxidation resistance. In addition, the thickness of the conductive plate 22 is preferably 700 μm or less.

[0095] When the conductive plate 22 is provided on the electrochemical element 10, the flat plate portion 22b is positioned to be in contact with the counter electrode layer 15c. As a result, good electrical conductivity is expected between the conductive plate 22 and the counter electrode layer 15c. In this embodiment, an example is described in which two electrochemical reaction sections 15 are provided on a plate-shaped support 16, so there are also two flat plate portions 22b corresponding to each electrochemical reaction section 15.

[0096] The number of flat plate portions 22b on the conductive plate 22 can be changed as appropriate. For example, the conductive plate 22 may have one flat plate portion 22b that is opposite to two electrochemical reaction sections 15. Conversely, the conductive plate 22 may have multiple flat plate portions 22b that are opposite to one electrochemical reaction section 15.

[0097] Furthermore, the flat plate portion 22b has a plurality of through holes 22d that penetrate between the side of the counter electrode layer 15c and the side of the separator 20. The diameter of the through holes 22d is 100 μm or more. For example, the diameter of the through holes 22d is preferably 120 μm or more, and more preferably 150 μm or more. As a result, as described above, the second gas supplied to the space 21g of the elastic member 21 and the space 22f of the conductive plate 22 flows along a plane perpendicular to the lamination direction (XY plane) and is reliably supplied to the counter electrode layer 15c through the through holes 22d. In other words, since the flat plate portion 22b facing the counter electrode layer 15c is provided with a plurality of through holes 22d that penetrate between the side of the counter electrode layer 15c and the side of the separator 20, gas can be supplied to the counter electrode layer 15c well without hindering gas diffusion. Furthermore, by making the diameter of the through-hole 22d 100 μm or more, the Cr diffusion prevention layer 22e can be coated onto the inner surface of the through-hole 22d by electrodeposition or the like. Alternatively, the diameter of the through-hole 22d is preferably 300 μm or less.

[0098] One side constituting the annular portion 22a is connected to the flat plate portion 22b. Specifically, the flat plate portion 22b and the annular portion 22a are connected via a connecting portion 22c. In the example shown in Figures 3 and 4, one side constituting the annular portion 22a is connected to the flat plate portion 21b using the connecting portion 22c. In this way, since the entire perimeter of the flat plate portion 22b is not connected to the annular portion 22a, the conductive plate 22 is lighter compared to the case where the entire perimeter of the flat plate portion 22b is connected to the annular portion 22a. Furthermore, when the flat plate portion 22b of the conductive plate 22 is pushed toward the electrochemical reaction portion 15 by the protrusion 21c of the elastic member 21, the flat plate portion 22b is pushed toward the electrochemical reaction portion 15 along the Z direction while being supported by the connecting portion 22c.

[0099] In addition, since the flat plate portion 22b is connected to the annular portion 22a, in addition to electrical conductivity between the flat plate portion 22b and the separator 20, electrical conductivity can also be ensured between the conductive plate 22 and the separator 20 at the annular portion 22a. Furthermore, since the flat plate portion 22b is connected to one side of the annular portion 22a, that is, the flat plate portion 22b is connected to the annular portion 22a in a cantilevered state, even if the annular portion 22a of the conductive plate 22 deforms due to heat, deformation of the flat plate portion 22b in accordance with the deformation of the annular portion 22a can be avoided.

[0100] Furthermore, the flat plate portion 22b may be connected to each of the two or more sides constituting the annular portion 22a. In that case, the flat plate portion 22b can be stably held by the annular portion 22a.

[0101] Furthermore, in this embodiment, a conductive bonding layer 23 is provided to bond the flat plate portion 22b and the counter electrode layer 15c, which further improves the electrical conductivity between the conductive plate 22 and the counter electrode layer 15c.

[0102] Preferably, the material constituting the bonding layer 23 exists between the flat plate portion 22b and the counter electrode layer 15c, and inside the through hole 22d of the flat plate portion 22b. When such a configuration is adopted, the material constituting the bonding layer 23 exists not only between the flat plate portion 22b and the counter electrode layer 15c, but also inside the through hole 22d of the flat plate portion 22b, so that the inner surface of the through hole 22d is covered with the material constituting the bonding layer 23. As a result, the contact area between the flat plate portion 22b and the counter electrode layer 15c increases by the amount by which the inner diameter of the through hole 22d is reduced. As a result, the electrical resistance between the flat plate portion 22b and the counter electrode layer 15c can be reduced, and the flat plate portion 22b and the counter electrode layer 15c can be firmly bonded, providing the advantage of being less prone to breakage even when subjected to thermal cycling.

[0103] Furthermore, the material constituting the bonding layer 23 may be configured to exist between the flat plate portion 22b and the counter electrode layer 15c, inside the through hole 22d of the flat plate portion 22b, and on the surface of the flat plate portion 22b that does not face the counter electrode layer 15c. When such a configuration is adopted, the material constituting the bonding layer 23 is present between the flat plate portion 22b and the counter electrode layer 15c, inside the through hole 22d of the flat plate portion 22b, and on the surface of the flat plate portion 22b that does not face the counter electrode layer 15c, so that the inner surface of the through hole 22d is covered with the material constituting the bonding layer 23, and the material constituting the bonding layer 23 is also provided between the flat plate portion 22b and the separator 20. As a result, the contact area between the flat plate portion 22b and the counter electrode layer 15c increases by the amount by which the inner diameter of the through hole 22d is reduced. As a result, the electrical resistance between the flat plate portion 22b and the counter electrode layer 15c can be reduced, and a strong bond can be formed between the flat plate portion 22b and the counter electrode layer 15c. In addition, the electrical resistance between the flat plate portion 22b and the separator 20 can be reduced, and a strong bond can be formed between the flat plate portion 22b and the separator 20.

[0104] The conductive plate 22 described above can be formed, for example, by etching, laser processing, or physical processing (such as punching) on ​​a single conductive rectangular plate. Alternatively, the conductive plate 22 can also be formed by physical processing such as press working. Using etching or laser processing, which do not apply physical force to the plate, prevents warping or deformation of the plate.

[0105] By using the conductive plate 22 described above and arranging the flat plate portion 22b between the counter electrode layer 15c and the separator 20, electrical conductivity between the counter electrode layer 15c and the separator 20 can be improved compared to the case where the flat plate portion 22b is not arranged. Furthermore, since the flat plate portion 22b facing the counter electrode layer 15c is provided with multiple through holes 22d that penetrate between the side of the counter electrode layer 15c and the side of the separator 20, gas can be supplied to the counter electrode layer 15c through these through holes 22d. Moreover, because the flat plate portion 22b is arranged between the counter electrode layer 15c and the separator 20, a large space is not required between the counter electrode layer 15c and the separator 20.

[0106] [Elastic member 21] Figures 5 and 6 show the configuration of the elastic member 21. The elastic member 21 is provided between the counter electrode layer 15c and the separator 20, more specifically between the conductive plate 22 and the separator 20, and is formed from a single elastically deformable plate-like member that electrically conducts electricity between the counter electrode layer 15c and the separator 20. The elastic member 21 has a flat plate portion 21b (first flat plate portion) and a protruding portion 21c that protrudes from the flat plate portion 21b toward the counter electrode layer 15c or the separator 20 along the stacking direction in which the plate-like support 16, the electrochemical reaction portion 15, and the separator 20 are stacked in the electrochemical element 10. In this embodiment, the protruding portion 21c protrudes toward the counter electrode layer 15c (i.e. toward the conductive plate 22) and is in contact with the conductive plate 22. With this configuration, the elastic member 21 can press the flat portion 22b of the conductive plate 22 toward the counter electrode layer 15c.

[0107] The elastic member 21 has an annular portion 21a and a flat plate portion 21b surrounded by the annular portion 21a. A second gas is supplied to the space 21g adjacent to the flat plate portion 21b. The annular portion 21a is rectangular when viewed from the direction along the stacking direction in which the plate-shaped support 16, the electrochemical reaction portion 15, and the separator 20 are stacked in the electrochemical element 10. When such an elastic member 21 is provided, the elastic member 21 pushes the flat plate portion 22b of the conductive plate 22 toward the counter electrode layer 15c, thereby enabling stable contact between the conductive plate 22 and the counter electrode layer 15c. Furthermore, by providing a bonding material between the elastic member 21 and the conductive plate 22, electrical conductivity between the elastic member 21 and the conductive plate 22 can be ensured.

[0108] As shown in Figure 5, around the protruding portion 21c, there are areas connected to the flat plate portion 21b and areas separated from the flat plate portion 21b. The orientation of the multiple protruding portions 21c is not limited to one direction, but can be oriented in various directions.

[0109] As shown in Figure 6, the protruding portion 21c has a flat portion 21d. A space is formed between the flat plate portion 21b and the flat portion 21d, and no other members are present. In addition, the protruding portion 21c has a plurality of through holes 21e that penetrate between the side of the counter electrode layer 15c and the side of the separator 20. Specifically, the flat portion 21d has the through holes 21e. The diameter of the through holes 21e is 100 μm or more. For example, the diameter of the through holes 21e is preferably 150 μm or more, and more preferably 200 μm or more. As a result, as described above, the second gas supplied to the space 21g of the elastic member 21 and the space 22f of the conductive plate 22 flows along a plane perpendicular to the stacking direction (XY plane) and is reliably supplied to the conductive plate 22 and the counter electrode layer 15c through the through holes 21e. Furthermore, the diameter of the through holes 21e is preferably, for example, 1000 μm or less.

[0110] The elastic member 21 is formed using, for example, ferritic stainless steel. Furthermore, the elastic member 21 is formed using a plate material of uniform thickness. In addition, a Cr diffusion prevention layer 21f is provided on its surface. As a result, the diffusion of Cr contained in the ferritic stainless steel can be prevented.

[0111] The Cr diffusion prevention layer 21f can be realized, for example, by a metal oxide layer. The Cr diffusion prevention layer 21f may also be provided on the inner surface of the through hole 21e. For example, if ferritic stainless steel containing chromium is used as the elastic member 21, the Cr diffusion prevention layer 21f will mainly be a spinel oxide, such as the Co-Mn type. The Cr diffusion prevention layer 21f suppresses the diffusion of chromium atoms, etc., from the elastic member 21 to the counter electrode layer 15c and separator 20 of the electrochemical reaction section 15, and to other members that are in communication with the gas flow path. The thickness of the Cr diffusion prevention layer 21f should be such that it is possible to achieve both high diffusion prevention performance and low electrical resistance.

[0112] The Cr diffusion prevention layer 21f can be formed by various methods, but a method of oxidizing the surface of the elastic member 21 to form a metal oxide is preferably used. Alternatively, the metal oxide layer may be formed on the surface of the elastic member 21 by spray coating methods (such as thermal spraying, aerosol deposition, aerosol gas deposition, powder jet deposition, particle jet deposition, and cold spray), PVD methods such as sputtering and PLD, or CVD, or by plating and oxidation treatment.

[0113] Ventilation holes 21h, 21i, 21j, and 21k are formed at the four corners of the annular section 21a. Ventilation holes 21i and 21j communicate with the space 21g. As a result, the second gas flowing through the second gas supply manifold 25 flows into the space 21g from the ventilation holes 21i. The second gas then flows into the flat plate section 21b which communicates with the space 21g, and reaches the protruding portion 21c that protrudes from the flat plate section 21b. The orientation of the multiple protruding portions 21c is not limited to one direction, but is oriented in various directions, so the second gas flows while colliding with the multiple protruding portions 21c and changing its direction of travel. The second gas then flows out from the ventilation hole 21j to the second gas discharge manifold 27.

[0114] In other words, the protruding portion 21c of the elastic member 21 can cause the flowing first gas to be in a turbulent state. Here, the turbulent state referred to in this embodiment means a state in which the direction of fluid flow in the flow path is not constant but disordered.

[0115] The elastic member 21 described above can be formed, for example, by etching, laser processing, or physical processing (such as punching) on ​​a single conductive rectangular plate. Alternatively, the elastic member 21 can also be formed by physical processing such as press working. Using etching or laser processing, which do not apply physical force to the plate, prevents warping or deformation of the plate.

[0116] [Flow channel forming structure 17] Figure 7 shows the configuration of the channel forming structure 17. Figures 8 and 9 show the configuration of the channel forming plates 18 and 19 that make up the channel forming structure 17. In other words, Figure 7 shows the channel forming plates 18 and 19 shown in Figures 8 and 9 stacked in the stacking direction.

[0117] The channel-forming structure 17 is a plate-shaped member provided on one side of the plate-shaped support 16 in the electrochemical element 10, and is located between the plate-shaped support 16 and the separator 20, thereby electrically conducting electricity between the plate-shaped support 16 and the separator 20. An electrode layer 15a is provided on the other side of the plate-shaped support 16. The plate-shaped support 16 allows gas to flow between one side and the other side through through holes 16b formed in the plate-shaped support 16.

[0118] The annular portion 17a is rectangular when viewed from the direction along the stacking direction, and the collision portion 17c connects one side of the annular portion 17a to another side. The collision portion 17c is strip-shaped when viewed from the direction along the stacking direction. Multiple strip-shaped collision portions 17c are provided to bridge one side of the annular portion 17a to another side. Furthermore, the shape of the impacted portion 17c can be changed as appropriate.

[0119] Ventilation holes 17h, 17i, 17j, and 17k are formed at the four corners of the annular section 17a. Ventilation holes 17h and 17k communicate with the flow path space 17b. As a result, the first gas flowing through the first gas supply manifold 24 flows into the flow path space 17b from ventilation hole 22h. The first gas that has flowed through the flow path space 17b then flows out to the first gas discharge manifold 26 from ventilation hole 17k.

[0120] The channel-forming structure 17 has an annular portion 17a and a channel space 17b surrounded by the annular portion 17a, in which gas flows in a direction perpendicular to the stacking direction in which the plate-shaped support 16, the electrochemical reaction section 15, and the separator 20 are stacked in the electrochemical element 10, and a collision-receiving portion 17c into which the gas flowing through the channel space 17b collides. The collision-receiving portion 17c is connected to the annular portion 17a.

[0121] The channel forming structure 17 of this embodiment comprises a plurality of channel forming plates 18 and 19. The channel forming plates 18 and 19 are formed using, for example, ferritic stainless steel. Furthermore, the channel forming plates 18 and 19 are formed using plate material with a uniform thickness overall. Specifically, the channel forming structure 17 comprises a plurality of channel forming plates 18 and 19, each having annular portions 18a and 19a as annular portions 17a and collision portions 18c and 19c as collision portions 17c, stacked in a stacking direction in a state where they are in contact with each other and electrically conductive. In this embodiment, an example in which the channel forming structure 17 comprises two channel forming plates 18 and 19 is described, but the number of channel forming plates comprising the channel forming structure 17 can be changed as appropriate.

[0122] The annular portion 17a (18a, 19a) is rectangular when viewed from the direction along the stacking direction. Ventilation holes 18h, 18i, 18j, and 18k are formed at the four corners of the annular portion 18a of the flow channel forming plate 18. Ventilation holes 19h, 19i, 19j, and 19k are formed at the four corners of the annular portion 19a of the flow channel forming plate 19. The ventilation holes 18h, 18i, 18j, and 18k formed in the flow channel forming plate 18 have the same shape as the ventilation holes 19h, 19i, 19j, and 19k formed in the flow channel forming plate 19, and communicate with each other when stacked. The collision portion 18c connects one side of the annular portion 18a to another side. The collision portion 19c connects one side of the annular portion 19a to another side. The vents 18h, 18k, 19h, and 19k communicate with the flow paths 18b and 19b that make up the flow path space 17b. As a result, the first gas flowing through the first gas supply manifold 24 flows into the flow path space 17b from the vents 18h and 19h. The first gas that has flowed through the flow path space 17b then flows out to the first gas discharge manifold 26 from the vents 18k and 19k. The impacted portion 17c of the flow path forming structure 17 can form a turbulent state when struck by the flowing first gas.

[0123] As shown in Figures 8 and 9, the shapes of the impacted portions 17c of the multiple channel-forming plates 18, when viewed in the direction along the stacking direction (Y direction), are different from each other. Also, as shown in Figure 7, the impacted portions 17c of the multiple channel-forming plates 18 have multiple overlapping portions s (i.e., intersection portions) that overlap each other when viewed in the direction along the stacking direction. The multiple overlapping portions s are regularly located in a plane perpendicular to the stacking direction (Z direction) (i.e., in the XY plane). The regular existence of such overlapping portions s in a plane perpendicular to the stacking direction (Z direction) (in the XY plane) allows the load received by the channel-forming structure 17 from the stacking direction to be evenly distributed across the overlapping portions s. Furthermore, since the channel-forming plates 18 and 19 are electrically conductive in the overlapping portions s, a larger number of overlapping portions s is preferable if prioritizing their electrical conductivity.

[0124] The collision portion 17c of the channel-forming structure 17 is in contact with at least one of the adjacent plate-shaped support 16 and separator 20 along the stacking direction, and is electrically conductive. In other words, the collision portion 17c of the channel-forming structure 17 can be used to make the channel-forming structure 17 electrically conductive with at least one of the plate-shaped support 16 and separator 20.

[0125] The channel-forming plates 18 and 19 described above can be formed, for example, by etching, laser processing, or physical processing (such as punching) on ​​a single conductive rectangular plate. Alternatively, the channel-forming plates 18 and 19 can also be formed by physical processing such as press working. When etching or laser processing, which do not apply physical force to the plate, are used, warping or deformation of the plate can be prevented.

[0126] [Electrochemical apparatus 100, Energy system Z] Next, the energy system Z and the electrochemical apparatus 100 will be explained using Figure 10.

[0127] The electrochemical apparatus 100 includes an electrochemical module 9 having an electrochemical element 10 (not shown in Figure 10), and a fuel converter having a reformer 102. It also has a fuel supply unit 103 that supplies reducing component gas from the fuel converter (reformer 102) to the electrochemical element 10 or the electrochemical module 9.

[0128] Furthermore, the electrochemical apparatus 100 includes an electrochemical module 9 having an electrochemical element 10, and an inverter (an example of a power converter) 104 as an output unit that extracts power from the electrochemical element 10 or the electrochemical module 9.

[0129] Energy system Z includes an electrochemical apparatus 100 and a heat exchanger 190 which serves as a waste heat utilization unit for reusing the heat discharged from the electrochemical apparatus 100.

[0130] In more detail, the electrochemical apparatus 100 includes a desulfurizer 101, a reformed water tank 105, a vaporizer 106, a reformer 102, a blower 107, a combustion unit 108, an inverter 104, a control unit 110, and an electrochemical module 9.

[0131] The desulfurizer 101 removes (desulfurizes) sulfur compounds contained in hydrocarbon raw fuels such as city gas. When sulfur compounds are present in the raw fuel, the desulfurizer 101 can suppress adverse effects of sulfur compounds on the reformer 102 or electrochemical element 10. The vaporizer 106 generates steam from reformed water supplied from the reformed water tank 105. The reformer 102 uses the steam generated in the vaporizer 106 to steam reform the raw fuel that has been desulfurized in the desulfurizer 101, generating a reformed gas containing hydrogen.

[0132] The electrochemical module 9 generates electricity by using reformed gas supplied from the reformer 102 and air supplied from the blower 107 to perform an electrochemical reaction. The combustion unit 108 mixes the reaction exhaust gas discharged from the electrochemical module 9 with air and burns the combustible components in the reaction exhaust gas.

[0133] The inverter 104 adjusts the output power of the electrochemical module 9 to the same voltage and frequency as the electricity received from the commercial power grid (not shown). The control unit 110 controls the operation of the electrochemical apparatus 100 and the energy system Z.

[0134] The reformer 102 uses the heat of combustion generated by the combustion of reaction exhaust gas in the combustion section 108 to perform a reforming treatment on the raw fuel.

[0135] The raw fuel is supplied to the desulfurizer 101 through the raw fuel supply line 112 by the operation of the booster pump 111. The reformed water from the reformed water tank 105 is supplied to the vaporizer 106 through the reformed water supply line 114 by the operation of the reformed water pump 113. The raw fuel supply line 112 then merges with the reformed water supply line 114 downstream of the desulfurizer 101, and the merged reformed water and raw fuel are supplied to the vaporizer 106.

[0136] The reformed water is vaporized into steam in the vaporizer 106. The raw fuel containing the steam generated in the vaporizer 106 is supplied to the reformer 102 through the steam-containing raw fuel supply line 115. In the reformer 102, the raw fuel is steam reformed, and a reformed gas (first gas with reducing properties) mainly composed of hydrogen gas is produced. The reformed gas produced in the reformer 102 is supplied to the electrochemical module 9 through the fuel supply unit 103.

[0137] The reaction exhaust gas is combusted in the combustion section 108 and becomes combustion exhaust gas, which is then sent to the heat exchanger 190 through the combustion exhaust gas discharge passage 116. A combustion catalyst section 117 (for example, a platinum-based catalyst) is located in the combustion exhaust gas discharge passage 116 to burn and remove reducing components such as carbon monoxide and hydrogen contained in the combustion exhaust gas.

[0138] The heat exchanger 190 exchanges heat between the combustion exhaust gas generated by combustion in the combustion section 108 and the supplied chilled water to produce hot water. In other words, the heat exchanger 190 operates as a waste heat utilization unit that reuses the heat discharged from the electrochemical apparatus 100.

[0139] Alternatively, instead of a waste heat utilization section, a reaction exhaust gas utilization section may be provided that utilizes the reaction exhaust gas discharged (without combustion) from the electrochemical module 9. Furthermore, at least a portion of the reaction exhaust gas flowing out of container 1 from the first gas discharge section 4 may be combined and recycled at any of the locations 100, 101, 103, 106, 112, 113, or 115 in Figure 10. The reaction exhaust gas contains residual hydrogen gas that was not used in the reaction at the electrochemical element 10. In the reaction exhaust gas utilization section, the residual hydrogen gas is used for heat utilization through combustion or power generation using fuel cells, etc., thereby achieving efficient energy utilization.

[0140] <Another Embodiment> The configurations disclosed in the above-described embodiments (including other embodiments, the same applies hereinafter) can be applied in combination with configurations disclosed in other embodiments, provided that no inconsistencies arise. Furthermore, the embodiments disclosed herein are illustrative, and the embodiments of the present invention are not limited thereto and can be modified as appropriate without departing from the object of the present invention.

[0141] (1) In the above embodiment, an example was described in which the conductive plate 22, the elastic member 21, the separator 20, the flow channel forming structure 17, and the plate-shaped support 16 are welded to each other, but a configuration in which they are not welded is also possible.

[0142] (2) In the above embodiment, the electrochemical element 10 was used in a solid oxide fuel cell as an electrochemical device 100, but the electrochemical element 10 can also be used in a solid oxide electrolytic cell or an oxygen sensor using solid oxides. Furthermore, the electrochemical element 10 is not limited to being used in combination as an electrochemical element laminate 8 or an electrochemical module 9, but can also be used individually.

[0143] In other words, the above embodiment describes a configuration that can improve the efficiency of converting chemical energy such as fuel into electrical energy. Specifically, in the above embodiment, the electrochemical element 10 and the electrochemical module 9 are operated as a fuel cell, hydrogen gas is circulated through the electrode layer 15a, and oxygen gas is circulated through the counter electrode layer 15c. As a result, oxygen molecules O2 in the counter electrode layer 15c are converted into electrons e - It reacts with oxygen ions O 2- This is produced. The oxygen ion O 2- The hydrogen molecules H2 move through the solid electrolyte layer 15b to the electrode layer 15a. In the electrode layer 15a, the hydrogen molecules H2 become oxygen ions O 2- It reacts with water (H2O) and electrons (e). - This is generated. Through the above reaction, an electromotive force is generated between the electrode layer 15a and the counter electrode layer 15c, and electricity is generated.

[0144] On the other hand, when the electrochemical element 10 and the electrochemical module 9 are operated as an electrolytic cell, a gas containing water vapor or carbon dioxide is passed through the electrode layer 15a, and a voltage is applied between the electrode layer 15a and the counter electrode layer 15c. As a result, electrons e are formed in the electrode layer 15a. - Water molecules (H2O) and carbon dioxide molecules (CO2) react with hydrogen molecules (H2), carbon monoxide (CO), and oxygen ions (O). 2- This is the result. Oxygen ion O 2- The oxygen ions O move through the solid electrolyte layer 15b to the counter electrode layer 15c. 2- The electrons are released to form oxygen molecules (O2). Through the above reaction, water molecules (H2O) are electrolyzed into hydrogen (H2) and oxygen (O2), and if a gas containing carbon dioxide molecules (CO2) is passed through, it is electrolyzed into carbon monoxide (CO) and oxygen (O2).

[0145] When a gas containing water vapor and carbon dioxide molecules (CO2) is being circulated, a fuel converter 30 (Figure 11) can be provided to synthesize various compounds such as hydrocarbons from hydrogen and carbon monoxide generated by the electrochemical element 10 and electrochemical module 9 through the electrolysis described above. The hydrocarbons generated by this fuel converter 30 can be circulated to the electrochemical element 10 and electrochemical module 9, or extracted outside of this system / device and used separately as fuel or chemical raw material.

[0146] Figure 11 shows an example of the energy system Z and electrochemical apparatus 100 when the electrochemical reaction unit 15 is operated as an electrolytic cell. In this example, water vapor and carbon dioxide supplied by the booster pump 111 are mixed and supplied to the electrochemical module 9.

[0147] The electrochemical apparatus 100 includes an electrochemical module 9 having an electrochemical element 10 (not shown in Figure 11) and a fuel converter 30, and a fuel supply unit 32 that supplies reducing component gas from the electrochemical element 10 or the electrochemical module 9 to the fuel converter 30.

[0148] Furthermore, the electrochemical apparatus 100 includes an electrochemical module 9 having an electrochemical element 10, and a power converter 31 that supplies power to the electrochemical element 10 or the electrochemical module 9.

[0149] Energy system Z includes an electrochemical device 100 and a waste heat utilization unit that reuses heat discharged from the electrochemical device 100 or the fuel converter 30.

[0150] Specifically, in this system, supplied water (water vapor) and carbon dioxide are electrolyzed in the electrochemical reaction section 15 of the electrochemical element 10 in the electrochemical module 9 to produce hydrogen and carbon monoxide, etc. Then, these reducing component gases such as hydrogen and carbon monoxide are supplied from the fuel supply section 32 to the fuel converter 30, where hydrocarbons and other substances are synthesized. In this case, by configuring the heat exchanger 29 in Figure 11 to operate as a waste heat utilization section that exchanges the reaction heat generated by the reaction occurring in the fuel converter 30 with water and vaporizes it, and by configuring the heat exchanger 28 in Figure 11 to operate as a waste heat utilization section that exchanges the waste heat generated by the electrochemical element 10 with water vapor and carbon dioxide to preheat, energy efficiency can be increased.

[0151] Furthermore, the power converter 31 supplies power to the electrochemical element 10. As a result, the electrochemical element 10 acts as an electrolytic cell, as described above. Therefore, according to the above configuration, it is possible to provide an electrochemical device 100 and an energy system Z, etc., that can improve the efficiency of converting electrical energy into chemical energy such as fuel.

[0152] (3) In the above embodiment, composite materials such as NiO-GDC, Ni-GDC, NiO-YSZ, Ni-YSZ, CuO-CeO2, and Cu-CeO2 were used as the material for the electrode layer 15a, and composite oxides such as LSCF and LSM were used as the material for the counter electrode layer 15c. The electrochemical element 10 configured in this way can be used as a solid oxide fuel cell by supplying hydrogen gas to the electrode layer 15a to serve as the fuel electrode (anode) and supplying air to the counter electrode layer 15c to serve as the air electrode (cathode). It is also possible to modify this configuration so that the electrochemical element 10 can be configured so that the electrode layer 15a is the air electrode and the counter electrode layer 15c is the fuel electrode. Specifically, composite oxides such as LSCF and LSM are used as the material for the electrode layer 15a, and composite materials such as NiO-GDC, Ni-GDC, NiO-YSZ, Ni-YSZ, CuO-CeO2, and Cu-CeO2 are used as the material for the counter electrode layer 15c. With an electrochemical element 10 configured in this way, air can be supplied to the electrode layer 15a to create an air electrode, and hydrogen gas can be supplied to the counter electrode layer 15c to create a fuel electrode, allowing the electrochemical element 10 to be used as a solid oxide fuel cell.

[0153] (4) In the above embodiment, the electrode layer 15a is placed between the plate-shaped support 16 and the solid electrolyte layer 15b, and the counter electrode layer 15c is placed on the side opposite to the plate-shaped support 16 when viewed from the solid electrolyte layer 15b. It is also possible to reverse the arrangement of the electrode layer 15a and the counter electrode layer 15c. That is, it is also possible to place the counter electrode layer 15c between the plate-shaped support 16 and the solid electrolyte layer 15b, and place the electrode layer 15a on the side opposite to the plate-shaped support 16 when viewed from the solid electrolyte layer 15b. In this case, it is also necessary to change the gas supply to the electrochemical element 10.

[0154] In other words, regarding the order of the electrode layer 15a and the counter electrode layer 15c, and whether the first gas or the second gas is a reducing component gas or an oxidizing component gas, various configurations can be adopted as long as they are arranged so that the first gas and the second gas are supplied to the electrode layer 15a and the counter electrode layer 15c in a manner that allows them to react appropriately.

[0155] Furthermore, the plate-shaped support 16 is not limited to a rectangular shape; it can take on various forms such as a square or circular shape.

[0156] (5) In the above embodiment, the electrochemical apparatus 100 includes an electrochemical module 9 comprising a plurality of electrochemical elements 10. However, the electrochemical apparatus 100 of the above embodiment can also be applied to a configuration comprising a single electrochemical element 10.

[0157] (6) In the above embodiment, an example was described in which the electrochemical element 10 comprises a conductive plate 22, an elastic member 21, a separator 20, a flow channel forming structure 17, a plate-shaped support 16, a sealing member 14, and an electrochemical reaction section 15. However, the configuration may be changed to one that does not include any of these, or to one that includes other members.

[0158] For example, the electrochemical element 10 may be changed to a configuration that does not include a conductive plate 22 (i.e., a configuration that includes an elastic member 21 and a channel forming structure 17), or a configuration that does not include a conductive plate 22 and an elastic member 21 (i.e., a configuration that includes a channel forming structure 17), or a configuration that does not include a conductive plate 22 and a channel forming structure 17 (i.e., a configuration that includes an elastic member 21). Alternatively, the electrochemical element 10 may be changed to a configuration that does not include an elastic member 21 (i.e., a configuration that includes a conductive plate 22 and a channel forming structure 17), or a configuration that does not include an elastic member 21 and a channel forming structure 17 (a configuration that includes a conductive plate 22). Alternatively, the electrochemical element 10 may be changed to a configuration that does not include a channel forming structure 17 (a configuration that includes a conductive plate 22 and an elastic member 21), etc.

[0159] (7) In the above embodiment, an example was described in which the electrochemical module 9 includes both a first gas manifold (first gas supply manifold 24, first gas discharge manifold 26) through which the first gas flows along the stacking direction through the plate-shaped support 16, conductive plate 22, elastic member 21 and separator 20, and a second gas manifold (second gas supply manifold 25, second gas discharge manifold 27) through which the second gas flows along the stacking direction through the plate-shaped support 16, conductive plate 22, elastic member 21 and separator 20. However, the electrochemical module 9 may also be configured to include at least one of the first gas manifold (first gas supply manifold 24, first gas discharge manifold 26) and the second gas manifold (second gas supply manifold 25, second gas discharge manifold 27). Furthermore, the shape and installation position of the first gas manifold (first gas supply manifold 24, first gas discharge manifold 26) and the second gas manifold (second gas supply manifold 25, second gas discharge manifold 27) can also be changed as appropriate. In other words, the method of supplying the first and second gases to the electrochemical element laminate 8 can be changed as appropriate. [Industrial applicability]

[0160] The present invention can be used in conductive plates, electrochemical elements, electrochemical modules, electrochemical devices, and energy systems that reduce electrical resistance at the part in contact with the electrochemical reaction section, do not obstruct the supply of gas to the electrochemical reaction section, and minimize the space required for installation. [Explanation of symbols]

[0161] 2: First Gas Supply Department 3: Second Gas Supply Department 5: Electrolyte 8: Electrochemical element laminate 9: Electrochemical Module 10: Electrochemical elements 15: Electrochemical reaction section 15a: Electrode layer 15b: Solid electrolyte layer 15c: Counter electrode layer 16: Plate-shaped support 20: Separator 21: Elastic member 22: Conductive plate 22a: Ring section 22b: Flat plate part 22d: Through hole 22e: Cr diffusion prevention layer 22f: Space 23: Bonding layer 30: Fuel Converter 31: Power Converter 32:Fuel supply section 100: Electrochemical apparatus 102: Reformer (fuel converter) 103:Fuel supply section 104: Inverter (power converter) Z: Energy System

Claims

1. A conductive plate provided in an electrochemical element comprising an electrochemical reaction section having a solid electrolyte layer, an electrode layer disposed on one side of the solid electrolyte layer, and a counter electrode layer disposed on the other side of the solid electrolyte layer, a plate-shaped support for supporting the electrode layer of the electrochemical reaction section, and a separator, It is provided between the counter electrode layer and the separator, and is configured to electrically conduct electricity between the counter electrode layer and the separator. When provided in the electrochemical element, it includes a flat plate portion positioned in contact with the counter electrode layer, The flat plate portion is a conductive plate having a plurality of through holes that penetrate between the counter electrode layer side and the separator side.

2. The conductive plate according to claim 1, comprising an annular portion and a flat plate portion located within the space surrounded by the annular portion and connected to the annular portion.

3. The conductive plate according to claim 1, wherein the diameter of the through hole is 100 μm or more.

4. The conductive plate according to claim 1, having a thickness of 250 μm or more and formed using ferritic stainless steel.

5. The conductive plate according to claim 4, further comprising a Cr diffusion prevention layer on its surface.

6. The annular portion is rectangular when viewed from a direction along the stacking direction in which the plate-shaped support, the electrochemical reaction portion, and the separator are stacked in the electrochemical element. The conductive plate according to claim 2, wherein one side constituting the annular portion is connected to the flat plate portion.

7. The annular portion is rectangular when viewed from a direction along the stacking direction in which the plate-shaped support, the electrochemical reaction portion, and the separator are stacked in the electrochemical element. The conductive plate according to claim 2, wherein each of the two or more sides constituting the annular portion is connected to the flat plate portion.

8. An electrochemical element comprising the plate-shaped support, the electrochemical reaction section, the conductive plate according to any one of claims 1 to 7, and the separator, laminated together.

9. The electrochemical element according to claim 8, wherein the conductive plate and the separator are joined together.

10. The electrochemical element according to claim 8, further comprising a conductive bonding layer that bonds the flat plate portion and the counter electrode layer.

11. The electrochemical element according to claim 10, wherein the material constituting the bonding layer is located between the flat plate portion and the counter electrode layer, and inside the through-hole of the flat plate portion.

12. The electrochemical element according to claim 10, wherein the material constituting the bonding layer is present between the flat plate portion and the counter electrode layer, inside the through hole of the flat plate portion, and on the surface of the flat plate portion that does not face the counter electrode layer.

13. The electrochemical element according to claim 8, further comprising a conductive elastic member provided between the conductive plate and the separator, which presses the flat plate portion of the conductive plate toward the counter electrode layer.

14. An electrochemical element laminate comprising a plurality of electrochemical elements as described in claim 8, A first gas supply unit supplies a first gas, which is one of a reducing component gas and an oxidizing component gas supplied to the electrode layer of the electrochemical element, to the electrochemical element laminate. An electrochemical module comprising a second gas supply unit that supplies a second gas, which is the other of the reducing component gas and the oxidizing component gas supplied to the counter electrode layer of the electrochemical element, to the electrochemical element laminate.

15. An electrochemical apparatus comprising an electrochemical module and a fuel converter as described in claim 14, and a fuel supply unit that supplies the reducing component gas from the fuel converter to the electrochemical element or the electrochemical module, or supplies the reducing component gas from the electrochemical element or the electrochemical module to the fuel converter.

16. An electrochemical apparatus comprising at least an electrochemical module as described in claim 14, and a power converter that extracts power from the electrochemical element or the electrochemical module, or that supplies power to the electrochemical element or the electrochemical module.

17. An energy system comprising an electrochemical apparatus as described in claim 15, and a waste heat utilization unit for reusing heat discharged from the electrochemical apparatus or the fuel converter.

18. An energy system comprising an electrochemical apparatus as described in claim 15, and a waste heat utilization unit for reusing heat discharged from the electrochemical apparatus.

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