Light-emitting devices, display devices, photoelectric converters, electronic devices, lighting devices, mobile devices, and wearable devices

Abstract

This technology offers advantages in suppressing the reduction of the color gamut. [Solution] A display area is provided on the main surface of a substrate, each pixel comprising a light-emitting region on the substrate, a microlens on the light-emitting region, and a light-shielding layer that covers a part of the microlens and has an opening at a position that coincides with the vertex of the microlens in the orthogonal projection onto the main surface, wherein the plurality of pixels include a first pixel, and in the orthogonal projection onto the main surface, the vertex of the microlens and the geometric centroid of the light-emitting region are positioned at different locations, and the distance between the geometric centroid of the opening and the geometric centroid of the light-emitting region is shorter than the distance between the vertex of the microlens and the geometric centroid of the light-emitting region.

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a display device, a photoelectric conversion device, an electronic device, a lighting device, a moving body, and a wearable device.

Background Art

[0002] A light-emitting device including a light-emitting element using an organic electroluminescence (EL) element is known. In Patent Document 1, in order to improve the viewing angle characteristics and expand the emission angle of a display device, the center position of the lens of a pixel and the center position of the pixel electrode are displaced according to the position arranged in the display area.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Pixels arranged in a light-emitting device are often designed so that light of a desired wavelength can be extracted mainly in the normal direction with respect to the substrate. Therefore, light emitted obliquely with respect to the normal direction may deviate from the desired wavelength and be emitted from the pixel in a state where the color purity is reduced. As shown in Patent Document 1, when the center position of the lens of a pixel and the center position of the pixel electrode are displaced, the component of light emitted obliquely with respect to the normal direction may increase. When light with reduced color purity is emitted from the pixel, the color gamut of the light-emitting device may be reduced.

[0005] The present disclosure provides a technique advantageous for suppressing reduction of the color gamut.

Means for Solving the Problems

[0006] One aspect of the present disclosure relates to a light-emitting device comprising a display area on the main surface of a substrate in which a plurality of pixels are arranged, each pixel comprising a light-emitting area arranged on the substrate, a microlens arranged on the light-emitting area, and a light-shielding layer having an opening at a position that coincides with the vertex of the microlens in an orthogonal projection onto the main surface and covering a part of the microlens, wherein the plurality of pixels include a first pixel, and the first pixel is positioned such that, in an orthogonal projection onto the main surface, the vertex of the microlens and the geometric centroid of the light-emitting area are at different positions, and the distance between the geometric centroid of the opening and the geometric centroid of the light-emitting area is shorter than the distance between the vertex of the microlens and the geometric centroid of the light-emitting area. [Effects of the Invention]

[0007] This disclosure provides a technology that is advantageous in suppressing the reduction of the color gamut. [Brief explanation of the drawing]

[0008] [Figure 1] A plan view showing an example configuration of the light-emitting device of this embodiment. [Figure 2] A cross-sectional view showing an example configuration of a comparative light-emitting device. [Figure 3] A cross-sectional view showing an example of the configuration of the light-emitting element of the light-emitting device in Figure 1. [Figure 4] A cross-sectional view showing an example of the configuration of the light-emitting element of the light-emitting device in Figure 1. [Figure 5] A plan view showing an example of the configuration of the light-emitting device in Figure 1. [Figure 6] A plan view showing an example of the configuration of the light-emitting device in Figure 1. [Figure 7] A cross-sectional view showing an example of the configuration of the light-emitting device in Figure 1. [Figure 8] A cross-sectional view showing an example of a manufacturing method for the light-emitting device shown in Figure 1. [Figure 9] A cross-sectional view showing an example of the pixel configuration of the light-emitting device of this embodiment. [Figure 10] A diagram showing an example of a display device using the light-emitting device of this embodiment. [Figure 11] A diagram showing an example of a photoelectric conversion device using the light-emitting device of this embodiment. [Figure 12] A diagram showing an example of an electronic device using the light-emitting device of this embodiment. [Figure 13] A diagram showing an example of a display device using the light-emitting device of this embodiment. [Figure 14] A diagram showing an example of a mobile body using the light-emitting device of this embodiment. [Figure 15] A diagram showing an example of a wearable device using the light-emitting device of this embodiment. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] A light-emitting device according to an embodiment of the present disclosure will be described with reference to Figures 1 to 8. Figure 1(a) is a cross-sectional view and a plan view showing an example of the configuration of the light-emitting device 100 of this embodiment. The cross-sectional view shown at the top of Figure 1(a) shows the cross section between A and A' in the plan view shown at the bottom of Figure 1(a).

[0011] The light-emitting device 100 includes a display area in which a plurality of pixels 106 are arranged on the main surface 151 of the substrate 119. Each pixel 106 includes a light-emitting element 105 including a light-emitting region 104 arranged on the substrate 119, a microlens 102 arranged on the light-emitting region 104, and a light-shielding layer 103 having an opening at a position overlapping the apex of the microlens 102 in the orthographic projection onto the main surface 151 of the substrate 119 and covering a part of the microlens 102. As shown in FIG. 1(b), in the orthographic projection onto the main surface 151 of the substrate 119, the geometric center of gravity of the light-emitting region 104 in each pixel 106 can be arranged at a position overlapping the microlens 102 of each pixel 106. Hereinafter, as shown in FIG. 1(b), the apex of the microlens 102 may be denoted as apex C1, and the geometric center of gravity of the light-emitting region 104 may be denoted as geometric center of gravity C3. Further, the opening arranged at the position overlapping the apex of the microlens 102 of the above-described light-shielding layer 103 may be denoted as opening 107, and the geometric center of gravity of the opening 107 in the orthographic projection onto the main surface 151 of the substrate 119 may be denoted as geometric center of gravity C2.

[0012] In the configurations shown in FIGS. 1(a) and 1(b), each of the microlens 102 and the light-emitting region 104 is circular in the orthographic projection onto the main surface 151 of the substrate 119. However, it is not limited thereto. The shape of each of the microlens 102 and the light-emitting region 104 in the orthographic projection onto the main surface 151 of the substrate 119 may be, for example, triangular, rectangular, or a polygon with five or more sides such as hexagonal. Further, for example, the microlens 102 may be an aspherical lens or the like.

[0013] As shown in Fig. 1(a), the light-emitting device 100 may include a low refractive index layer 101 so as to cover a microlens 102, a light-shielding layer 103, a light-emitting element 105, and the like. The low refractive index layer 101 may be a gas such as air, or may be a solid such as a resin or polysiloxane. When the low refractive index layer 101 is a solid, the refractive index of the solid such as a resin may be decreased by adding hollow silica or the like to the solid such as a resin. When the low refractive index layer 101 is a gas, a package having a hollow structure may be adopted, and the low refractive index layer 101 can be formed by introducing a gas into the hollow portion. When the low refractive index layer 101 is a solid, a resist in which a low refractive index material is dissolved in a solvent is prepared, and the resist is applied by using a spin coating method or an inkjet method and then cured, whereby the low refractive index layer 101 can be formed.

[0014] For the light-shielding layer 103, for example, a resin containing a black pigment such as carbon black or titanium black may be used. For example, a black resist composed of a pigment, a dispersant, a resin, an additive, a polymerization initiator, a solvent, etc. is prepared and applied by using a spin coating method or an inkjet method. Then, patterning is performed by using, for example, a photolithography method, whereby the light-shielding layer 103 is formed in a desired region.

[0015] For the microlens 102, for example, an acrylic resin, an epoxy resin, a polyhydroxystyrene (PHS) resin, a novolak resin, or the like is used. Also, fillers such as titanium oxide and zirconium oxide may be added to these resins, and the refractive index of the resin may be increased. The refractive index of the microlens 102 in the visible light region (wavelength 400 nm to 800 nm) is, for example, about 1.5 to 1.7. The microlens 102 can be formed from the above-described resin coated on the light-emitting element 105 by using a thermal flow method, an etch-back method, a grayscale mask method, or the like.

[0016] In the thermal flow method, first, a photosensitive microlens resist is created, and a resist film is deposited using a spin coating method or an inkjet method. Next, the resist film is patterned using, for example, a photolithography method. Then, the patterned resist film is heated to a temperature above the glass transition temperature of the resin constituting it, causing the resin pattern to liquefy (thermal flow), and the resin (resist film) is deformed into a lens shape by surface tension. By cooling and solidifying the deformed resin, a microlens 102 is formed.

[0017] In the etch-back method, first, a resin that will become the microlens 102 and a photosensitive microlens resist are layered on top of it. Next, an etching mask is formed from the microlens resist using the same thermal flow method as described above. The microlenses 102 are formed by etch-back transfer of the patterned and lens-shaped microlens resists onto the underlying resin layer using the etching mask. For etch-back transfer, for example, reactive ion etching (RIE) is used.

[0018] In the gray tone mask method, first, a resin layer that will become the microlens 102 is formed. Then, the microlens 102 is formed by patterning using a photolithography method with a gray tone mask whose transmittance has been locally adjusted.

[0019] Figure 3(a) shows a more detailed cross-sectional view of the light-emitting element 105 of this embodiment. Each light-emitting element 105 arranged in each pixel 106 may include an upper electrode 110 arranged on a substrate 119, a lower electrode 113 arranged between the upper electrode 110 and the substrate 119, and an organic compound layer 111 arranged between the upper electrode 110 and the lower electrode 113. In the configuration of the light-emitting device 100 shown in Figure 3(a), a reflective layer 117 is arranged between the lower electrode 113 and the substrate 119, and optical adjustment layers 114 to 116 are arranged between the lower electrode 113 and the reflective layer 117. Furthermore, in the light-emitting device 100, a sealing layer 109 is arranged on the upper electrode 110, and a planarization layer 108 is arranged on the sealing layer 109. In addition, a wiring structure 118 may be arranged between the substrate 119 and the reflective layer 117.

[0020] The planarization layer 108 may be formed to flatten the surface (top surface) of the light-emitting element 105. Furthermore, by adjusting the film thickness of the planarization layer 108, the focal position of the microlens 102 placed on the planarization layer 108 can be aligned with the position of the light-emitting region 104. The microlens 102 may, for example, be placed in contact with the planarization layer 108. The light-emitting region 104 can be considered as the portion of the organic compound layer 111 where the lower electrode 113 and the organic compound layer 111 are in contact, in an orthogonal projection onto the main surface 151 of the substrate 119. A liquid white resist composed of a resin, additives, and a solvent may be used to form the planarization layer 108. Suitable resins include acrylic resin, epoxy resin, PHS resin, and novolac resin. The white resist can then be applied and cured using a spin coating method or an inkjet method to form the planarization layer 108.

[0021] The sealing layer 109 is light-transmitting and suppresses the transmission of oxygen and moisture from the outside of the light-emitting element 105 into the light-emitting element 105. Silicon nitride (SiN), silicon oxynitride (SiON), silicon oxide (SiON) xMaterials such as silicon oxide-based materials, aluminum oxide (Al2O3), titanium oxide (TiO2), and multilayer films thereof can be used for the sealing layer 109. Chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc., can be used to form the sealing layer 109.

[0022] The upper electrode 110 is positioned on top of the organic compound layer 111. Therefore, the upper electrode 110 is translucent. The upper electrode 110 may also reflect some of the light incident from the substrate 119 side rather than the upper electrode 110. For this reason, the upper electrode 110 is sometimes called a semi-transparent electrode. The material constituting the upper electrode 110 may be a transparent material such as a transparent conductive oxide (indium tin oxide (ITO), indium zinc oxide (IZO), etc.). Alternatively, the material constituting the upper electrode 110 may be a semi-transparent material such as metals such as aluminum, silver, or gold, alkali metals such as lithium or cesium, alkaline earth metals such as magnesium, calcium, or barium, or alloy materials containing these metal materials.

[0023] The organic compound layer 111 includes a light-emitting layer. In addition to the light-emitting layer, the organic compound layer 111 may also include a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, an electron injection layer, and so on. A light-emitting element 105 having such a configuration may also be called an organic light-emitting element, an organic EL element, or an organic light-emitting diode (OLED). The organic compound layer 111 (light-emitting layer) emits light by injecting electrons and holes into the organic compound layer 111 from a pair of electrodes (upper electrode 110 and lower electrode 113). The organic compound layer 111 can be formed using methods such as vapor deposition or spin coating.

[0024] The lower electrode 113 is a transparent electrode that transmits light emitted from the organic compound layer 111 in the configuration shown in Figure 3(a). Examples of materials that can be used for the lower electrode 113 include ITO, IZO, aluminum zinc oxide (AZO), and indium gallium zinc oxide (IGZO). The lower electrode 113 is separated for each pixel 106 by the pixel separation layer 112. The pixel separation layer 112 may also be called a bank. Silicon oxide or silicon nitride film can be used for the pixel separation layer.

[0025] A reflective layer 117 is provided between the lower electrode 113 (light-emitting region 104) and the substrate 119. The reflective layer 117 may be made of a material with a reflectivity of 70% or more to the light emitted by the light-emitting layer of the organic compound layer 111. Metals such as aluminum and silver, alloys of these metals with silicon, copper, nickel, neodymium, etc., transparent oxide films such as ITO and IZO, or laminated films of these materials can be used as the reflective layer 117.

[0026] Optical adjustment layers 114 to 116 are arranged between the lower electrode 113 and the reflective layer 117. For example, pixel 106 may include a red-emitting pixel 106R, a green-emitting pixel 106G, and a blue-emitting pixel 106B. In the configuration shown in Figure 3(a), the optical adjustment layer 114 is arranged for pixel 106R, the optical adjustment layer 115 is arranged for pixel 106G, and the optical adjustment layer 116 is arranged for pixel 106B. The optical adjustment layers 114 to 116 have different thicknesses (optical distances) for each of the pixels 106R, 106G, and 106B. As a result, the color purity of the light emitted from each of the pixels 106R, 106G, and 106B can be increased by the optical resonance effect.

[0027] More specifically, by causing the light emitted from the light-emitting layer of the organic compound layer 111 to resonate between the reflective layer 117 and the upper electrode 110, light of a desired resonant wavelength can be extracted. The resonant wavelength satisfies the following relationship as a function of the optical distance L0 of the optical adjustment layers 114 to 116, the resonant wavelength λ0, and the sum Φ of the phase shift due to multiple reflections. [(2×L0) / λ0+Φ] / (2π)=m0 (where m0 is an integer) Optical adjustment layers 114-116 may be made of so-called silicon oxide-based materials such as silicon nitride, silicon oxynitride, or silicon oxide.

[0028] In the configuration shown in Figure 3(a), the light-emitting layer of the organic compound layer 111 emits light of the same color in pixels 106R, 106G, and 106B. In contrast, by varying the thickness of the optical adjustment layers 114 to 116 for each pixel 106, it is possible to extract light of a desired resonant wavelength. As shown in Figure 3(a), by making the organic compound layer 111 common to each pixel 106, the complexity of manufacturing is reduced and reliability can be improved compared to forming separate organic compound layers 111 for each color. Furthermore, it may be more advantageous for miniaturizing the pixels 106 than when forming separate organic compound layers 111 for each color.

[0029] A wiring structure 118 may be placed between the substrate 119 and the reflective layer 117. The wiring structure 118 may contain wiring patterns for connecting transistors and other components on the substrate 119, or for connecting circuits such as transistors on the substrate 119 to the light-emitting element 105. The wiring structure 118 may be a multilayer wiring structure in which conductive patterns made of aluminum, copper, or the like are arranged in an insulating layer such as silicon nitride, silicon oxynitride, or silicon oxide.

[0030] The substrate 119 may be made of a semiconductor material such as silicon. However, it is not limited to this, and the substrate 119 may be an insulating substrate such as glass on which a semiconductor layer is arranged. As described above, the substrate 119 is provided with circuits including transistors.

[0031] Next, the effects of this embodiment will be explained. The solid lines in the cross-sectional view of Figure 1(a) represent light rays emitted in a desired direction due to desired optical interference. On the other hand, the dashed lines represent light rays emitted in an oblique direction due to optical interference different from the desired direction. In the light-emitting device 100, the optical distance L0 can be designed so that light of wavelength λ0 is strongly extracted in a direction perpendicular to the main surface 151 of the substrate 119 (normal direction). In this case, light radiated obliquely to the substrate 119 deviates from the desired resonance (interference) conditions, and the color purity decreases. When light with reduced color purity is emitted from the light-emitting device 100, the color gamut of the light-emitting device 100 is reduced.

[0032] For example, the requirements of an optical system installed outside the light-emitting device 100 (for example, placed on a low refractive index layer 101) may necessitate extracting strong light in a direction inclined with respect to the normal direction of the main surface 151 of the substrate 119. In such cases, as shown in Figures 1(a) and 1(b), the vertex C1 of the microlens 102 and the geometric centroid C3 of the light-emitting region 104 may be offset to design the system so that strong light is extracted in an oblique direction. In such cases, optical interference is more likely to occur because light rays with misaligned light rays are more likely to be mixed in compared to when light is extracted in the direction normal to the main surface 151 of the substrate 119, and color shifts are more likely to occur.

[0033] As shown in Figure 1(a), the dashed rays have degraded color purity compared to the solid rays due to an optical path length different from the desired optical interference distance. A portion of the light emitted from the light-emitting region 104 of the light-emitting element 105 (solid rays) is incident on the microlens 102, refracted at the interface between the microlens 102 and the low refractive index layer 101, and emitted from the microlens 102. On the other hand, the dashed rays with low color purity that are emitted obliquely from the light-emitting region 104 are blocked by the light-shielding layer 103. This suppresses the emission of light with reduced color purity from the light-emitting device 100, thereby suppressing the reduction of the color gamut.

[0034] Figure 2 shows a comparative example of the light-emitting device 199 without the light-shielding layer 103. As shown in Figure 2, when the light-shielding layer 103 is not present, light rays with low color purity, indicated by dashed lines, are emitted from the light-emitting device 199 in an oblique direction from the light-emitting area 104. This can potentially reduce the color gamut. In this embodiment, the light-emitting device 100, by having the light-shielding layer 103, suppresses the emission of such low-color-purity light, thereby improving the display quality of the light-emitting device 100.

[0035] Here, as shown in Figure 1(c), in the light-emitting device 100 of this embodiment, the pixels 106 are positioned such that, in the orthogonal projection onto the main surface 151 of the substrate 119, the vertex C1 of the microlens 102 and the geometric centroid C3 of the light-emitting region 104 are at different positions. Furthermore, the distance between the geometric centroid C2 of the aperture 107 provided in the light-shielding layer 103 and the geometric centroid C3 of the light-emitting region 104 is shorter than the distance between the vertex C1 of the microlens 102 and the geometric centroid C3 of the light-emitting region 104. In the orthogonal projection onto the main surface 151 of the substrate 119, the geometric centroid C2 of the aperture 107 may be positioned between the vertex C1 of the microlens 102 and the geometric centroid C3 of the light-emitting region 104. In that case, as shown in Figure 1(b), the vertex C1 of the microlens 102, the geometric centroid C2 of the aperture 107, and the geometric centroid C3 of the light-emitting region 104 may be arranged to lie on a virtual straight line in the orthogonal projection onto the main surface 151 of the substrate 119. This allows light of the desired resonant wavelength to be extracted from the light-emitting device 100, and light with low color purity that results in interference conditions different from the desired ones can be effectively blocked by the light-shielding layer 103.

[0036] In the configuration shown in Figure 3(a), the desired wavelength of light is extracted by arranging optical adjustment layers 114 to 116. However, as shown in Figure 3(b), even when optical adjustment layers 114 to 116 are arranged, color filters 123 to 125 may also be arranged. The light-emitting element 105 shown in Figure 3(b) has color filters 123 to 125 and an upper planarization layer 126 in addition to the configuration shown in Figure 3(a). A microlens 102 is arranged on the upper planarization layer 126, for example, in contact with the upper planarization layer 126.

[0037] In the configuration shown in Figure 3(b), similar to the configuration shown in Figure 3(a), light of the desired resonant wavelength can be extracted from pixels 106R, 106G, and 106B, respectively. Therefore, color filters 123-125 can be thin films or high-transmittance color filters with lower colorant density compared to the case where optical adjustment layers 114-116 are not provided. As a result, the decrease in brightness caused by the provision of color filters 123-125 can be suppressed.

[0038] Color filters 123 to 125 are color filters that each have different transmission spectral characteristics. For example, color filter 123 placed in pixel 106R transmits red light. Similarly, color filter 124 placed in pixel 106G transmits green light, and color filter 125 placed in pixel 106B transmits blue light. However, this is not limited to this, and for example, color filters that transmit cyan, yellow, and magenta may be combined.

[0039] A liquid color resist composed of a colorant, dispersant, resin, additives, solvent, etc., can be used to form the color filters 123 to 125. The colorant, which mainly determines the spectral characteristics of the color filter, may contain multiple pigments or dyes. First, the color resist is applied and formed using a spin coating method or an inkjet method. Next, patterning is performed using a photolithography method to form the color filter. The deposition and patterning of the color resist are carried out for each color to form a color filter layer composed of multiple color filters 123 to 125. Some or all of the color filters can be omitted. Also, as shown in Figure 3(b), the film thickness of the color filters 123 to 125 does not necessarily have to be the same for each color. Therefore, irregularities may occur on the surface of the color filter layer composed of the color filters 123 to 125.

[0040] The upper planarization layer 126 may be formed to flatten the surface irregularities of the color filter layer. Furthermore, the focal position of the microlens 102 and the position of the light-emitting region 104 can be adjusted by adjusting the film thickness of the upper planarization layer 126, the film thickness of the planarization layer 108, or both. A liquid white resist composed of resin, additives, and solvents may be used to form the upper planarization layer 126. Acrylic resin, epoxy resin, PHS resin, and novolac resin can be used as the resin. The upper planarization layer 126 may also be formed by applying and curing the white resist using a spin-coating method or an inkjet method. The upper planarization layer 126 is not required. For example, if the surface irregularities of the color filter layer composed of color filters 123-125 are small, the upper planarization layer 126 may not be present.

[0041] Next, a modified example of the light-emitting element 105 will be described using Figure 4(a). As described above, the organic compound layer 111 (light-emitting layer) is common to pixels 106R, 106G, and 106B, and the optical adjustment layers 114-116 and the reflective layer 117 are used to extract light of a desired resonant wavelength. However, the light-emitting element 105 used in the light-emitting device 100 of this embodiment is not limited to a structure comprising optical adjustment layers 114-116 and a reflective layer 117.

[0042] In the configuration shown in Figure 4(a), the optical adjustment layers 114-116 and the reflective layer 117 are not present. On the other hand, an organic compound layer 111 is separately provided for each of the pixels 106R, 106G, and 106B. As a result, in the configuration shown in Figure 4(a), the organic compound layer 111 (emissive layer) emits light of a different color for each of the pixels 106R, 106G, and 106B. In other words, it is possible to extract light of a desired wavelength from each of the pixels 106R, 106G, and 106B. In the configuration shown in Figure 4(a), since the emissive layer provided for the organic compound layer 111 emits each color, a color filter is not required. Therefore, light absorption by a color filter does not occur, and it is possible to improve brightness.

[0043] Furthermore, in the configuration shown in Figure 4(a), unlike the lower electrode 113 shown in Figure 3(a), the lower electrode 127 does not need to transmit light to the substrate 119. Therefore, for example, the lower electrode 127 may be made of a material with a reflectivity of 70% or more to the light emitted by the light-emitting layer of the organic compound layer 111. Metals such as aluminum and silver, alloys of these metals with silicon, copper, nickel, neodymium, etc., transparent oxide films such as ITO and IZO, or laminated films of these materials can be used as the lower electrode 127.

[0044] In the configuration shown in Figure 4(a), optical resonance (interference) occurs depending on the optical distance between the upper electrode 110 and the lower electrode 127, but there is no difference in the occurrence of resonance among pixels 106R, 106G, and 106B. On the other hand, as described above, light emitted in the direction normal to the main surface 151 of the substrate 119 has the desired color purity, but light emitted in an oblique direction may have reduced color purity. As described above, in the light-emitting device 100, the pixel 106 can be optimally designed for light extracted in the direction normal to the main surface 151 of the substrate 119. Therefore, even for the light-emitting element 105 shown in Figure 4(a), the light-shielding layer 103 shown in Figure 1(a) shields the light emitted in an oblique direction with low color purity. As a result, the reduction in the color gamut of the light-emitting device 100 can be suppressed, and the display quality can be improved.

[0045] Figure 4(b) shows a modified example of the light-emitting element 105 shown in Figure 4(a). Similar to the light-emitting element 105 shown in Figure 3(b) and the light-emitting element 105 shown in Figure 3(a), the light-emitting element shown in Figure 4(b) has, in addition to the configuration shown in Figure 4(a), color filters 123-125 and an upper planarization layer 126.

[0046] In the configuration shown in Figure 4(b), similar to the configuration shown in Figure 4(a), it is possible to extract light of a desired wavelength from pixels 106R, 106G, and 106B, respectively. Therefore, the color filters 123-125 can be thin films or high-transmittance color filters with lower colorant density compared to, for example, the case where the organic compound layer 111 emits light of the same color (e.g., white light). As a result, the decrease in brightness caused by the arrangement of color filters 123-125 can be suppressed. Furthermore, due to the spectral effect of color filters 123-125, a light-emitting device 100 with higher color purity and a wider color gamut can be realized than the configuration shown in Figure 4(a).

[0047] Next, with reference to Figures 5 to 7, the light-emitting device 100 of this embodiment will be described further. As described above, the light-emitting device 100 may include a display area 160 in which a plurality of pixels 106 are arranged. The configuration of the microlens 102, light-shielding layer 103, and light-emitting area 104 in each pixel 106 arranged in the display area 160 may be the same for all pixels 106. However, it is not limited to this, and as shown below, the configuration of the microlens 102, light-shielding layer 103, and light-emitting area 104 in each pixel 106 may change depending on the position in the display area 160.

[0048] Figure 5(a) shows a light-emitting device 100 having a display area 160 in which multiple pixels 106 are arranged. Figure 5(b) shows a schematic diagram of the pixels 106 in areas A to I of the display area 160. In Figure 5(b), as in Figure 1(b), the microlens 102, light-shielding layer 103, and light-emitting area 104 of the pixels 106 are shown (reference numbers are omitted for simplification of the figure). As shown in Figure 5(b), the multiple pixels 106 are arranged in a delta array in the display area 160, but are not limited to this, and may be arranged in a stripe array, square array, pentile array, Bayer array, etc.

[0049] Figures 6(a) to 6(c) are plan views of pixels 106 located in regions A to C shown in Figures 5(a) and 5(b). Figures 7(a) to 7(c) are cross-sectional views of the areas A-A', B-B', and C-C' shown in Figures 6(a) to 6(c).

[0050] Figures 6(b) and 7(b) are schematic diagrams of a pixel 106 near the center of the display area 160. As shown in Figures 6(b) and 7(b), in the orthogonal projection onto the main surface 151 of the substrate 119, the pixel 106 located in area B, which is the center of the display area 160, may be positioned so that the vertex C1 of the microlens 102, the geometric centroid C2 of the opening 107 provided in the light-shielding layer 103, and the geometric centroid C3 of the light-emitting area 104 overlap each other. As shown in Figure 7(b), the light-shielding layer 103 can cover the outer edge of the microlens 102 with a certain width. This suppresses the emission of light rays, indicated by dashed lines with low color purity, from the light-emitting device 100, which are emitted diagonally from the light-emitting area 104.

[0051] Furthermore, as is the case with each of the above-described configurations and the following configurations, in the orthogonal projection onto the main surface 151 of the substrate 119, the light-shielding layer 103 is arranged to cover not only a portion of the microlenses 102, but also the space between each of the microlenses 102 of the multiple pixels 106. This makes it possible to shield the light emitted from between the microlenses 102, as shown in Figure 7(b). This can suppress a decrease in image quality caused by unexpected color mixing of light between adjacent pixels 106.

[0052] As will be described later, the arrangement of the microlens 102, aperture 107, and light-emitting region 104 in the pixels 106 arranged in the display area 160 can change continuously. Therefore, in the orthogonal projection onto the main surface 151 of the substrate 119, the pixel 106 located at the center of the display area 160 may be positioned so that the vertex C1 of the microlens 102, the geometric centroid C2 of the aperture 107 provided in the light-shielding layer 103, and the geometric centroid C3 of the light-emitting region 104 overlap with each other. In at least one pixel 106 located at the center of the display area 160, the vertex C1 of the microlens 102, the geometric centroid C2 of the aperture 107 provided in the light-shielding layer 103, and the geometric centroid C3 of the light-emitting region 104 may be positioned so that they overlap with each other. Furthermore, multiple pixels 106 located in region B of the display area 160 may have a similar configuration.

[0053] Figures 6(a) and 7(a) are schematic diagrams of pixels 106 located in region A near the left edge (-x direction) of the display area 160. As shown in Figures 6(a) and 7(b), in the orthogonal projection onto the main surface 151 of the substrate 119, the vertex C1 of the microlens 102 is shifted to the left (-x direction) with respect to the geometric centroid C3 of the light-emitting region 104. As shown in Figure 7(a), the emission angle of the light ray, which is the principal ray and is shown by a solid line with high color purity, is wider (-Φ) compared to Figure 7(b). Also, as shown in Figures 6(a) and 7(a), the light-shielding layer 103 covers the surface of the microlens 102 in the -Φ direction more broadly and, conversely, the surface of the microlens 102 in the +Φ direction narrowly compared to the configuration shown in Figures 6(b) and 7(b). Therefore, light rays indicated by dashed lines with low color purity are blocked by the light-shielding layer 103, and their emission from the light-emitting device 100 is suppressed.

[0054] Figures 6(c) and 7(c) are schematic diagrams of pixels 106 located in region C near the right edge (+x direction) of the display area 160. As shown in Figures 6(c) and 7(c), in the orthogonal projection onto the main surface 151 of the substrate 119, the vertex C1 of the microlens 102 is shifted to the right (+x direction) with respect to the geometric centroid C3 of the light-emitting region 104. As shown in Figure 7(c), the emission angle of the principal ray, indicated by a solid line with high color purity, is wider (+Φ) compared to Figure 7(b). Also, as shown in Figures 6(c) and 7(c), the light-shielding layer 103 covers the surface of the microlens 102 in the +Φ direction more broadly and, conversely, the surface of the microlens 102 in the -Φ direction less narrowly compared to the configuration shown in Figures 6(b) and 7(b). Therefore, light rays indicated by dashed lines with low color purity are blocked by the light-shielding layer 103, and their emission from the light-emitting device 100 is suppressed.

[0055] As shown in Figures 5 to 7, in the orthogonal projection onto the main surface 151 of the substrate 119, the geometric centroid C3 of the light-emitting region 104 of the pixel 106 may be positioned between the center of the display region 160 and the vertex C1 of the microlens 102 of the pixel 106. This allows for the extraction of strong light in a direction expanding from the display region 160, for example, in response to the requirements of the optical system outside the light-emitting device 100. In this case, the distance between the vertex C1 of the microlens 102 of multiple pixels 106 and the geometric centroid C3 of the light-emitting region 104 may increase continuously or stepwise as it moves away from the center of the display region 160. In that case, in the orthogonal projection onto the main surface 151 of the substrate 119, the distance between the vertex C1 of the microlens 102 in the plurality of pixels 106 and the geometric centroid of the aperture 107 provided in the light-shielding layer 103 may increase continuously or stepwise as it moves away from the center of the display area 160.

[0056] In such a case, we consider the relationship between the first pixel 106A located in region A and the second pixel 106B located between the first pixel 106A and the center of the display region 160, among the multiple pixels 106. In this case, in the orthogonal projection onto the main surface 151 of the substrate 119, the distance between the vertex C1 of the microlens 102 in the first pixel 106A and the geometric centroid C3 of the light-emitting region 104 may be longer than the distance between the vertex C1 of the microlens 102 in the second pixel 106B and the geometric centroid C3 of the light-emitting region 104. Also, in the orthogonal projection onto the main surface 151 of the substrate 119, the distance between the vertex C1 of the microlens 102 in the first pixel 106A and the geometric centroid C2 of the aperture 107 may be longer than the distance between the vertex C1 of the microlens 102 in the second pixel 106B and the geometric centroid C2 of the aperture 107. Furthermore, as you move away from the center of the display area 160, the area covered by the light-shielding layer 103 on the side of the microlens 102 opposite to the side facing the center of the display area 160 may increase continuously or intermittently. Therefore, the shortest distance between the microlens 102 and the outer edge of the aperture 107 in the first pixel 106A may be shorter than the shortest distance between the microlens 102 and the outer edge of the aperture 107 in the second pixel 106B.

[0057] Furthermore, as described above, the pixel 106 located at the center of the display area 160 can be positioned where the vertex C1 of the microlens 102, the geometric centroid C2 of the aperture 107 provided in the light-shielding layer 103, and the geometric centroid C3 of the light-emitting area 104 overlap with each other. On the other hand, as shown in Figures 7(a) and 7(b), the vertex C1 of the microlens 102 gradually shifts outward, either continuously or intermittently, relative to the geometric centroid C3 of the light-emitting area 104, towards the outer edge of the display area 160. Therefore, in the pixel 106 located in area B close to the center of the display area 160, the difference between the distance between the vertex C1 of the microlens 102 and the geometric centroid C2 of the aperture 107 provided in the light-shielding layer 103, and the distance between the geometric centroid C2 of the aperture 107 and the geometric centroid C3 of the light-emitting area 104 is small. On the other hand, in pixels 106 located in a region away from the center of the display area 160, the difference between the distance between the vertex C1 of the microlens 102 and the geometric centroid C2 of the aperture 107 provided in the light-shielding layer 103, and the distance between the geometric centroid C2 of the aperture 107 and the geometric centroid C3 of the light-emitting region 104 may be large. In that case, as shown in Figure 1(b), in the orthogonal projection onto the main surface 151 of the substrate 119, the distance between the vertex C1 of the microlens 102 and the geometric centroid C2 of the aperture 107 may be shorter than the distance between the geometric centroid C2 of the aperture 107 and the geometric centroid C3 of the light-emitting region 104.

[0058] Thus, in this embodiment, the light-shielding layer 103 covers a portion of the microlens 102. Furthermore, as shown in Figures 5 to 7, the light-shielding layer 103 broadly covers the surface of each region A to I of the microlens 102 on the side facing the direction of emission of the principal rays, and narrowly covers the surface on the opposite side of the direction of emission of the principal rays. As a result, light rays with low color purity are blocked by the light-shielding layer 103, making it possible to realize a light-emitting device 100 with high color purity and a wide color gamut.

[0059] Next, the manufacturing method of the above-described light-emitting device 100 will be explained using Figures 8(a) to 8(e). First, a circuit for operating (emitting light) pixels 106, including transistors, is formed on a substrate 119 made of silicon or the like. Then, as shown in Figure 8(a), the above-described light-emitting element 105 is formed on the main surface 151 of the substrate 119. The light-emitting element 105 may have any of the configurations shown in Figures 3(a), 3(b), 4(a), 4(b), etc. However, it is not limited to these, and the light-emitting element 105 may have a configuration different from the configurations shown in Figures 3(a), 3(b), 4(a), 4(b), etc.

[0060] Next, microlenses 102 are formed as shown in Figure 8(b). As described above, microlenses 102 can be formed using methods such as thermal flow, etch-back, and gray tone mask. In the configuration shown in Figure 8(b), an array of spherical microlenses 102 with gaps between each microlens 102 is illustrated. However, a microlens array in which multiple microlenses 102 are arranged may also be a gapless microlens array in which there are no gaps between each microlens 102. Furthermore, the surface of the microlens 102 may be aspherical.

[0061] After the formation of the microlens 102, a black resist film 201, which will become the light-shielding layer 103, is formed to cover the entire surface of the substrate 119, as shown in Figure 8(c). The black resist film 201 is a photosensitive resin film containing a black pigment, and can be formed using a spin coating method or an inkjet method. In this embodiment, a negative-type black resist sensitive to the i-line (wavelength 365 nm) was used, but a positive-type black resist or one sensitive to other wavelengths may also be used.

[0062] Figure 8(d) shows the process of selectively exposing the black resist film 201. An i-line stepper is used as the exposure apparatus, and a gray tone mask 202 is used as the photomask. By appropriately designing the mask pattern of the gray tone mask 202, the transmittance of the exposure light 203 (i-line in this embodiment) can be controlled locally, and a light-shielding layer 103 of a desired shape can be formed after development. The left side of Figure 8(d) is a schematic diagram of the position corresponding to Figure 7(b), and the right side is a schematic diagram of the position corresponding to Figure 7(a).

[0063] The gray tone mask 202 has different patterns arranged according to regions A to I, etc. For example, the light-shielding layer 103 for the entire display region 160 may be patterned with a single photomask (gray tone mask 202). The gray tone mask 202 is composed of fine patterns (e.g., fine dot patterns) below the resolution limit of the exposure machine, but by changing the arrangement of these fine patterns for each pixel 106, the light-shielding pattern of the light-shielding layer 103 formed in each region of the display region 160 is controlled. This eliminates the need to create a separate mask for each region, for example, suppressing an increase in manufacturing costs.

[0064] Following the exposure process, a development process is performed to form a light-shielding layer 103 as shown in Figure 8(e). For example, after the exposure process, the substrate (a structure including the substrate 119 and the light-emitting element 105 formed on the substrate 119, the microlens 102, and the black resist film 201) is immersed in an alkaline developer solution, and the black resist film 201 is developed to form a light-shielding layer 103 of the desired shape. Including the above steps, the light-emitting device 100 of this embodiment is formed.

[0065] Here, examples of applications of the light-emitting device 100 of this embodiment applied to image forming apparatuses, display devices, photoelectric converters, electronic devices, lighting devices, mobile devices, and wearable devices will be described using Figures 9(a), 9(b) to 15(a), 15(b). The pixels 106 (hereinafter sometimes referred to as pixels or sub-pixels) arranged in the light-emitting device 100 will be described as being equipped with organic light-emitting elements (OLEDs) such as organic EL elements using organic light-emitting materials (corresponding to the light-emitting elements 105 described above). First, the details of each component arranged in the pixels 106 (light-emitting elements 105) of the light-emitting device 100 described above will be shown, and then the application examples will be described.

[0066] An organic light-emitting element according to one embodiment of the present invention comprises a first electrode, a second electrode, and an organic compound layer disposed between these electrodes. One of the first electrode and the second electrode is an anode and the other is a cathode. In the organic light-emitting element of this embodiment, the organic compound layer may be a single layer or a laminate consisting of multiple layers, provided that it has a light-emitting layer. If the organic compound layer is a laminate consisting of multiple layers, the organic compound layer may have, in addition to the light-emitting layer, a hole injection layer, a hole transport layer, an electron blocking layer, a hole-exciton blocking layer, an electron transport layer, an electron injection layer, and the like. The light-emitting layer may also be a single layer or a laminate consisting of multiple layers. If the light-emitting layer is a multi-layer structure, a charge generation layer may be provided between the light-emitting layers. The charge generation layer may be composed of a compound whose LUMO is lower than that of the hole transport layer, and the LUMO of the charge generation layer may be lower than that of the HOMO of the hole transport layer. Here, the molecular orbital energy of the organic compound layer may be the molecular orbital energy of the organic compound with the largest weight ratio of the organic compound layer.

[0067] Here, HOMO and LUMO are described as "higher" the closer they are to the vacuum level. When the LUMO of the charge generation layer is lower than the HOMO of the hole transport layer, it means that the LUMO of the charge generation layer is closer to the vacuum level than the HOMO of the hole transport layer.

[0068] In this specification, HOMO and LUMO can be calculated using molecular orbital calculations. These calculations are performed using density functional theory (DFT), with the functional being B3LYP and the basis set being 6-31G. *It is also the case that the range of graphical designs is Gaussian09(Gaussian09). ,RevisionC.01,MJFrisch,GWTrucks,HBSchlegel,GEScus area, MARobb, JRCheeseman, G. Scalmani, V. Barone, B. Mennucci, G. Petersson, H. Nakatsuji, M. Caricato, X. Li, HPHr atchian, AFIzmaylov, J. Bloino, G. Zheng, JLSonnenberg, M. Hada, M. Ehara, K. Toyota, R. Fukuda, J. Hasegawa, M. Ish ida,T.Nakajima,Y.Honda,O.Kitao,H.Nakai,T.Vreven,JAMontgomery,Jr.,JEPeralta,F.Ogliaro,M.Bearpark,JJH eyd, E. Brothers, KNKudin, VNStaroverov, T. Keith, R. Kobayashi, J. Normand, K. Raghavachari, A. Rendell, JCBuran t,SSIyengar,J.Tomasi,M.Cossi,N.Rega,JMMillam,M.Klene,JEKnox,JBCross,V.Bakken,C.Adamo,J.Jaramillo,R. Gomperts,REStratmann,O.Yazyev,AJAustin,R.Cammi,C.Pomelli,JWOchterski,RLMartin,K.Morokuma,VGZakrzews ki,GAVoth,P.Salvador,JJDannenberg,S.Dapprich,ADDaniels,O.Farkas,JBForesman,JVOrtiz,JCioslowski,and DJFox,Gaussian,Inc.,Wallingford CT,2010.)

[0069] In this specification, HOMO and LUMO can be calculated using the ionization potential and band gap. The HOMO can be estimated by measuring the ionization potential. The ionization potential can be measured by dissolving the compound to be measured in a solvent such as toluene and measuring it with a measuring device such as AC-3. The band gap can be measured by dissolving the compound to be measured in a solvent such as toluene and irradiating it with excitation light. The band gap can be measured by measuring the absorption edge of the excitation light. Alternatively, the compound to be measured can be deposited on a substrate such as glass and the deposited film can be irradiated with excitation light. The measurement can be performed by measuring the absorption edge of the absorption spectrum at which the deposited film absorbs the excitation light, thereby determining the band gap.

[0070] The LUMO can be calculated using the band gap and ionization potential. By subtracting the ionization potential from the band gap, the LUMO can be estimated.

[0071] LUMO can also be estimated from the reduction potential. For example, the one-electron reduction potential can be estimated using cyclic volmetry (CV) measurement. CV measurement is performed, for example, in a 0.1 M tetrabutylammonium perchlorate DMF solution with an Ag / Ag reference electrode. + The measurement can be performed using Pt as the counter electrode and glassy carbon as the working electrode. The LUMO can be estimated by adding the difference of -4.8 eV between the reduction potential of the obtained compound and the reduction potential of ferrocene.

[0072] When the organic compound according to this embodiment is included in the light-emitting layer, the light-emitting layer may be composed solely of the organic compound according to this embodiment, or it may be composed of the organometallic complex according to this embodiment and other compounds. Here, when the light-emitting layer is composed of the organometallic complex according to this embodiment and other compounds, the organic compound according to this embodiment may be used as a host or a guest in the light-emitting layer. It may also be used as an assist material that can be included in the light-emitting layer. Here, the host is the compound with the largest mass ratio among the compounds constituting the light-emitting layer. The guest is a compound with a smaller mass ratio than the host among the compounds constituting the light-emitting layer, and is responsible for the main light emission. The assist material is a compound with a smaller mass ratio than the host among the compounds constituting the light-emitting layer, and assists the light emission of the guest. The assist material is also called the second host. The host material can also be called the first compound, and the assist material can be called the second compound.

[0073] When an organic compound according to one embodiment is used as a guest in the light-emitting layer, the concentration of the guest may be 0.01% by mass or more and 20% by mass or less relative to the entire light-emitting layer, or it may be 0.1% by mass or more and 10% by mass or less. The guest is also called a dopant.

[0074] The organometallic complex according to this embodiment can be used as a constituent material for organic compound layers other than the light-emitting layer constituting the organic light-emitting device of this embodiment. Specifically, it may be used as a constituent material for electron transport layers, electron injection layers, hole transport layers, hole injection layers, hole blocking layers, etc. In this case, the light-emitting color of the organic light-emitting device is not limited to red. More specifically, it may be white light or an intermediate color.

[0075] If necessary, conventionally known low-molecular-weight and high-molecular-weight hole-injecting or hole-transporting compounds, host compounds, luminescent compounds, electron-injecting or electron-transporting compounds, etc., can be used together. Examples of these compounds are listed below.

[0076] Suitable hole-injection transport materials are those with high hole mobility, which facilitates hole injection from the anode and allows for the transport of injected holes to the light-emitting layer. Furthermore, materials with high glass transition temperatures are suitable to reduce film quality degradation such as crystallization within the organic light-emitting element. Examples of low-molecular-weight and high-molecular-weight materials with hole-injection transport properties include triarylamine derivatives, arylcarbazole derivatives, phenylenediamine derivatives, stilbene derivatives, phthalocyanine derivatives, porphyrin derivatives, poly(vinylcarbazole), poly(thiophene), and other conductive polymers. Moreover, the above-mentioned hole-injection transport materials are also suitably used in electron-blocking layers. Specific examples of compounds used as hole-injection transport materials are shown below, but the material is not limited to these.

[0077] [ka]

[0078] Among the hole transport materials listed, HT16 to HT18 can reduce the driving voltage when used in the layer in contact with the anode. HT16 is widely used in organic light-emitting devices. HT2, HT3, HT4, HT5, HT6, HT10, and HT12 may be used in the organic compound layer adjacent to HT16. Furthermore, multiple materials may be used in a single organic compound layer.

[0079] Luminescent materials primarily involved in light emission include fused ring compounds (e.g., fluorene derivatives, naphthalene derivatives, pyrene derivatives, perylene derivatives, tetracene derivatives, anthracene derivatives, rubrene, etc.), quinacridone derivatives, coumarin derivatives, stilbene derivatives, organoaluminum complexes such as tris(8-quinolinolate)aluminum, iridium complexes, platinum complexes, rhenium complexes, copper complexes, europium complexes, ruthenium complexes, and polymer derivatives such as poly(phenylenevinylene) derivatives, poly(fluorene) derivatives, and poly(phenylene) derivatives.

[0080] The following are some specific examples of compounds used as luminescent materials, but they are not limited to these.

[0081] [ka]

[0082] [ka]

[0083] When the luminescent material is a hydrocarbon compound, this method is suitable because it can reduce the decrease in luminescence efficiency due to excyplex formation and the decrease in color purity due to changes in the emission spectrum of the luminescent material caused by excyplex formation.

[0084] Hydrocarbon compounds are compounds composed only of carbon and hydrogen, and among the example compounds listed above, these include BD7, BD8, GD5 through GD9, and RD1.

[0085] When the luminescent material is a condensed polycyclic material containing a five-membered ring, it has a high ionization potential, making it resistant to oxidation and suitable for devices with a long lifespan. Among the example compounds listed above, BD7, BD8, GD5 to GD9, and RD1 are suitable.

[0086] Examples of light-emitting layer hosts or light-emitting assist materials included in the light-emitting layer include aromatic hydrocarbon compounds or their derivatives, as well as carbazole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, organoaluminum complexes such as tris(8-quinolinolate)aluminum, and organoberylium complexes.

[0087] The following are specific examples of compounds used as luminescent layer hosts or luminescence assist materials contained in the luminescent layer, but are not limited to these.

[0088] [ka]

[0089] The host material may be a hydrocarbon compound. A hydrocarbon compound is a compound composed only of carbon and hydrogen, and among the example compounds listed above, these are EM1 to EM12 and EM16 to EM27. From the viewpoint of stability, a host material is more suitable if it does not have a carbon-heteroatom bond in the single bond connecting the aryl group unit in its structure, such as F3 listed in compound 1.

[0090] As electron-transporting materials, any material capable of transporting electrons injected from the cathode to the light-emitting layer can be arbitrarily selected, taking into consideration the balance with the hole mobility of the hole-transporting material. Examples of materials with electron-transporting properties include oxadiazole derivatives, pyrazine derivatives, triazole derivatives, triazine derivatives, quinoline derivatives, quinoxaline derivatives, phenanthroline derivatives, organoaluminum complexes, and fused ring compounds (e.g., fluorene derivatives, naphthalene derivatives, chrysene derivatives, anthracene derivatives, etc.). Furthermore, the above electron-transporting materials are also suitably used in the hole-blocking layer.

[0091] The following are specific examples of compounds used as electron transport materials, but are not limited to these.

[0092] [ka]

[0093] Electron-injectable materials can be arbitrarily selected from those that allow for easy electron injection from the cathode, taking into consideration the balance with hole injection properties. Organic compounds include n-type dopants and reducing dopants. Examples include alkali metal compounds such as lithium fluoride, lithium complexes such as lithium quinolinol, benzimidazolidene derivatives, imidazolidene derivatives, fluvalene derivatives, and acridine derivatives.

[0094] It can also be used in combination with the electron transport materials mentioned above.

[0095] Structure of an organic light-emitting device An organic light-emitting element is provided on a substrate by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode. A protective layer, a color filter, a microlens, etc., may be provided on the cathode. If a color filter is provided, a planarization layer may be provided between the protective layer and the color filter. The planarization layer can be made of acrylic resin or the like. The same applies when a planarization layer is provided between the color filter and the microlens.

[0096] substrate Examples of substrates include quartz, glass, silicon wafers, resins, and metals. The substrate may also be equipped with switching elements such as transistors and wiring patterns, and an insulating layer may be provided on top of these. The insulating layer can be made of any material as long as it allows for the formation of contact holes between the first electrode and the substrate, enabling the formation of wiring patterns between them, and ensuring insulation from unconnected wiring patterns. For example, the insulating layer may be made of resins such as polyimide, silicon oxide, or silicon nitride.

[0097] electrode A pair of electrodes can be used as electrodes. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with the higher potential is the anode, and the other is the cathode. Alternatively, the electrode that supplies holes to the light-emitting layer can be the anode, and the electrode that supplies electrons can be the cathode.

[0098] Materials with a high work function may be selected as the anode components. For example, elemental metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, and tungsten, or mixtures containing these, or alloys combining them, as well as metal oxides such as tin oxide, zinc oxide, indium oxide, tin-indium oxide (ITO), and zinc-indium oxide can be used. Conductive polymers such as polyaniline, polypyrrole, and polythiophene can also be used as anode components.

[0099] These electrode materials may be used individually or in combination of two or more types. Furthermore, the anode may consist of a single layer or multiple layers.

[0100] When electrodes are used as reflective electrodes, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys thereof, or laminates thereof, can be used. It is also possible to use the above materials to function as a reflective film without serving as an electrode. Furthermore, when transparent electrodes are used, oxide transparent conductive layers such as indium tin oxide (ITO) or indium zinc oxide can be used, but are not limited to these. Photolithography technology can be used to form the electrodes.

[0101] On the other hand, materials with a low work function may be selected as the constituent material of the cathode. Examples include alkali metals such as lithium, alkaline earth metals such as calcium, and elemental metals or mixtures containing these, such as aluminum, titanium, manganese, silver, lead, and chromium. Alternatively, alloys combining these elemental metals can also be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver can be used. Metal oxides such as indium tin oxide (ITO) can also be used. These electrode materials may be used individually or in combination of two or more. The cathode may also have a single-layer or multi-layer structure. Silver may be used as the cathode, and a silver alloy may be used to reduce silver aggregation. The ratio of the alloy does not matter as long as silver aggregation is reduced. For example, the ratio of silver to other metals may be 1:1, 3:1, etc.

[0102] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but using a DC or AC sputtering method can result in good coverage of the formed film and a lower cathode resistance.

[0103] Pixel separation layer The pixel separation layer may be formed from so-called silicon oxides such as silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO), which are formed using chemical vapor deposition (CVD). To increase the in-plane resistance of the organic compound layer, the thickness of the organic compound layer, particularly the hole transport layer, may be thinly deposited on the sidewalls of the pixel separation layer. Specifically, by increasing the taper angle of the sidewalls of the pixel separation layer and the thickness of the pixel separation layer, the thickness of the organic processed material layer on the sidewalls can be thinned to increase vignetting during deposition.

[0104] On the other hand, the pixel isolation layer's sidewall taper angle and thickness can be adjusted to the extent that no voids are formed in the protective layer formed on top of it. By preventing voids from forming in the protective layer, the occurrence of defects in the protective layer can be reduced. As the occurrence of defects in the protective layer is reduced, reliability degradation such as the occurrence of dark spots and poor conductivity of the second electrode can be reduced.

[0105] According to this embodiment, charge leakage to adjacent pixels can be effectively suppressed even if the taper angle of the sidewall of the pixel isolation layer is not steep. As a result of this study, it was found that sufficient reduction is possible if the taper angle is in the range of 60 degrees or more and 90 degrees or less. The film thickness of the pixel isolation layer may be 10 nm or more and 150 nm or less. Furthermore, the same effect can be obtained even if the device is composed only of pixel electrodes without a pixel isolation layer. However, in this case, the film thickness of the pixel electrode can be reduced by making it less than half the thickness of the organic layer, or by making the ends of the pixel electrodes a forward taper of less than 60°.

[0106] Furthermore, even when the first electrode is the cathode and the second electrode is the anode, a wide color gamut and low-voltage driving are possible by forming an electron-transporting material, a charge transport layer, and a light-emitting layer on the charge transport layer.

[0107] organic compound layer The organic compound layer may be formed as a single layer or as multiple layers. If there are multiple layers, they may be called a hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc., depending on their function. The organic compound layer is mainly composed of organic compounds, but may also contain inorganic atoms or inorganic compounds. The organic compound layer may contain, for example, copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be placed between the first electrode and the second electrode, or it may be placed in contact with the first electrode and the second electrode. If there are multiple light-emitting layers, a charge generation section may be placed between the first light-emitting layer and the second light-emitting layer. The charge generation section may contain an organic compound with a minimum unoccupied molecular orbital energy (LUMO) of -5.0 eV or less. The same applies when the charge generation section is placed between the second light-emitting layer and the third light-emitting layer.

[0108] protective layer A protective layer may be provided on the cathode. For example, by bonding glass with a desiccant to the cathode, the intrusion of moisture into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation layer such as silicon nitride may be provided on the cathode to reduce the intrusion of moisture into the organic compound layer. For example, after forming the cathode, it may be transported to another chamber without breaking the vacuum and a 2 μm thick silicon nitride may be formed by the CVD method to serve as the protective layer. After forming the protective layer using the CVD method, a protective layer using atomic layer deposition (ALD) may be provided. The material of the protective layer formed by the ALD method is not limited, but may be silicon nitride, silicon oxide, aluminum oxide, etc. Silicon nitride may be further formed on the protective layer formed by the ALD method using the CVD method. The protective layer formed by the ALD method may have a smaller film thickness than the protective layer formed by the CVD method. Specifically, the film thickness of the protective layer formed by the ALD method may be 50% or less, or even 10% or less, of the film thickness of the protective layer formed by the CVD method.

[0109] Color filter A color filter may be provided on the protective layer. For example, a color filter that takes into account the size of the organic light-emitting element may be provided on a separate substrate, and the substrate on which the color filter is formed and the substrate on which the organic light-emitting element is provided may be bonded together. Alternatively, for example, the color filter may be patterned on the protective layer described above using photolithography technology. The color filter may be made of polymer.

[0110] planarization layer A planarization layer may be placed between the color filter and the protective layer. The planarization layer is provided to reduce the unevenness of the layer below it. It may also be called a material resin layer without limiting its purpose. The planarization layer may be composed of an organic compound, which may be low molecular weight or high molecular weight. High molecular weight organic compounds may be used in the planarization layer to reduce unevenness.

[0111] Planarization layers may be provided above and below the color filter. In this case, the constituent materials of each planarization layer may be the same or different. Specifically, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenolic resin, epoxy resin, silicone resin, urea resin, etc., can be used as materials for the planarization layer.

[0112] Microlens An organic light-emitting device may have optical components such as microlenses on its light-emitting side. Microlenses may be made of acrylic resin, epoxy resin, or the like. Microlenses may be used to increase the amount of light extracted from the organic light-emitting device or to control the direction of the extracted light. Microlenses may have a hemispherical shape. If they have a hemispherical shape, among the tangents tangent to the hemisphere, there is a tangent parallel to the insulating layer, and the point of contact between that tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be similarly determined in any cross-sectional view. That is, among the tangents tangent to the semicircle of the microlens in the cross-sectional view, there is a tangent parallel to the insulating layer, and the point of contact between that tangent and the semicircle is the vertex of the microlens.

[0113] Furthermore, the midpoint of a microlens can also be defined. In the cross-section of a microlens, a line segment can be imagined from the point where one arc ends to the point where another arc ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross-section used to determine the vertices and midpoints may be a cross-section perpendicular to the insulating layer.

[0114] A microlens has a first surface with a convex portion and a second surface opposite to the first surface. The second surface may be positioned closer to the functional layer (light-emitting layer) than the first surface. To adopt such a configuration, it is necessary to form the microlens on a light-emitting device. If the functional layer is an organic layer, high-temperature processes may be avoided in the manufacturing process of the microlens. Also, when adopting a configuration in which the second surface is positioned closer to the functional layer than the first surface, the glass transition temperatures of all organic compounds constituting the organic layer may be 100°C or higher, and for example, 130°C or higher is suitable.

[0115] Opposing board A counter substrate may be placed on the planarization layer. The counter substrate is called a counter substrate because it is provided in a position corresponding to the aforementioned substrate. The constituent material of the counter substrate may be the same as that of the aforementioned substrate. The counter substrate may be a second substrate if the aforementioned substrate is referred to as the first substrate.

[0116] organic layer The organic compound layers constituting the organic light-emitting element according to the embodiment of this disclosure (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) may be formed by the following methods.

[0117] The organic compound layer constituting the organic light-emitting element according to the embodiment of this disclosure can be formed using a dry process such as vacuum deposition, ionization deposition, sputtering, or plasma deposition. Alternatively, instead of a dry process, a wet process can be used in which the layer is formed by dissolving the compound in a suitable solvent and applying a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.).

[0118] When layers are formed using methods such as vacuum deposition or solution coating, crystallization is less likely to occur, resulting in excellent stability over time. Furthermore, when forming films using coating methods, it is possible to combine the film with an appropriate binder resin.

[0119] Examples of the binder resins mentioned above include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenolic resin, epoxy resin, silicone resin, and urea resin.

[0120] Furthermore, these binder resins may be used individually as homopolymers or copolymers, or as a mixture of two or more types. Additionally, known additives such as plasticizers, antioxidants, and UV absorbers may be used in combination as needed.

[0121] Pixel circuit The light-emitting device may have a pixel circuit connected to a light-emitting element. The pixel circuit may be an active-matrix type that independently controls the light emission of the first light-emitting element and the second light-emitting element. The active-matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the light emission brightness of the light-emitting element, a transistor that controls the light emission timing, a capacitor that holds the gate voltage of the transistor that controls the light emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0122] The light-emitting device has a display area and a peripheral area arranged around the display area. The display area has a pixel circuit, and the peripheral area has a display control circuit. The mobility of the transistors constituting the pixel circuit may be smaller than the mobility of the transistors constituting the display control circuit.

[0123] The slope of the current-voltage characteristics of the transistors constituting the pixel circuit can be smaller than the slope of the current-voltage characteristics of the transistors constituting the display control circuit. The slope of the current-voltage characteristics can be measured using the so-called Vg-Ig characteristic.

[0124] The transistors that make up the pixel circuit are those connected to the light-emitting elements, such as the first light-emitting element.

[0125] pixels The organic light-emitting device has multiple pixels. Each pixel has subpixels that emit light of a different color from the others. The subpixels may each have, for example, RGB light-emitting colors.

[0126] A pixel emits light from a region also called the pixel aperture. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0127] The spacing between subpixels may be 10 μm or less, specifically 8 μm, 7.4 μm, or 6.4 μm.

[0128] Pixels can take on known arrangements in a plan view. For example, they may be in a stripe arrangement, delta arrangement, pentile arrangement, or Bayer arrangement. The shape of subpixels in a plan view may be any known shape. For example, rectangles, rhombuses or other quadrilaterals, hexagons, etc. Of course, even if it is not a precise shape, if it is close to a rectangle, it is included in the category of rectangles. The shape of subpixels and the pixel arrangement can be used in combination.

[0129] Applications of the organic light-emitting element according to the embodiment of this disclosure The organic light-emitting element according to the embodiments of this disclosure can be used as a component of a display device or lighting device. Other applications include exposure light sources for electrophotographic image forming apparatuses, backlights for liquid crystal display devices, and light-emitting devices having a color filter in a white light source.

[0130] The display device may also be an image information processing device that has an image input unit for receiving image information from an area CCD, linear CCD, memory card, etc., an information processing unit for processing the input information, and displays the input image on the display unit.

[0131] Furthermore, the display unit of the imaging device or inkjet printer may have a touch panel function. The driving method for this touch panel function may be infrared, capacitive, resistive, or electromagnetic induction, and is not particularly limited. The display device may also be used as the display unit of a multifunction printer.

[0132] Next, we will provide further explanation with reference to the drawings. Figure 9(a) shows an example of pixels arranged in the light-emitting device 100. The pixels have sub-pixels 810. The sub-pixels are divided into 810R, 810G, and 810B according to their emitted color. The emitted color may be distinguished by the wavelength emitted from the light-emitting layer, or the light emitted from the sub-pixel may be selectively transmitted or color-converted by a color filter or the like. Each sub-pixel has a reflective electrode 802 which is the first electrode, an insulating layer 803 covering the edge of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 which is the second electrode, a protective layer 806, and a color filter 807 on an interlayer insulating layer 801.

[0133] The interlayer insulating layer 801 may have transistors or capacitive elements placed in the layer below or inside it. The transistor and the first electrode may be electrically connected via a contact hole or the like (not shown).

[0134] The insulating layer 803 may also be called a bank or pixel isolation layer. The insulating layer 803 covers the edge of the first electrode and is arranged to surround the first electrode. The portion of the first electrode not covered by the insulating layer 803 is in contact with the organic compound layer 804 and becomes a light-emitting region.

[0135] The organic compound layer 804 includes a hole injection layer 841, a hole transport layer 842, a first light-emitting layer 843, a second light-emitting layer 844, and an electron transport layer 845.

[0136] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transparent electrode.

[0137] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is shown as a single layer, it may consist of multiple layers. Each layer may contain an inorganic compound layer and an organic compound layer.

[0138] The color filter 807 is classified into 807R, 807G, and 807B depending on its color. The color filter may be formed on a planarization film (not shown). A resin protective layer (not shown) may also be placed on the color filter. The color filter may also be formed on a protective layer 806. Furthermore, the color filter may be bonded to an opposing substrate, such as a glass substrate, after it has been placed on it.

[0139] Figure 9(b) shows a light-emitting device 800, which includes an organic light-emitting element 826 as an example of a light-emitting element and a TFT 818 as an example of a transistor. A substrate 811 made of glass, silicon, or the like is provided, with an insulating layer 812 on top of it. An active element such as the TFT 818 is placed on the insulating layer, and the gate electrode 813, gate insulating film 814, and semiconductor layer 815 of the active element are arranged therein. The TFT 818 is also composed of a semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on top of the TFT 818. The anode 821 and the source electrode 817 of the organic light-emitting element 826 are connected via a contact hole 820 provided in the insulating film.

[0140] The method of electrical connection between the electrodes (anode, cathode) in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) in the TFT is not limited to the configuration shown in Figure 9(b). In other words, it is sufficient for either the anode or cathode to be electrically connected to either the source electrode or the drain electrode of the TFT. TFT refers to a thin-film transistor.

[0141] In the light-emitting device 800 shown in Figure 9(b), the organic compound layer is depicted as a single layer, but the organic compound layer 822 may consist of multiple layers. A first protective layer 824 and a second protective layer 825 are provided on the cathode 823 to reduce the degradation of the organic light-emitting element.

[0142] In the light-emitting device 800 shown in Figure 9(b), a transistor is used as the switching element, but other switching elements may be used instead.

[0143] Furthermore, the transistor used in the light-emitting device 800 in Figure 9(b) is not limited to a transistor using a single-crystal silicon wafer, but may also be a thin-film transistor having an active layer on the insulating surface of the substrate. Examples of active layers include non-single-crystal silicon such as single-crystal silicon, amorphous silicon, and microcrystalline silicon, and non-single-crystal oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Thin-film transistors are also called TFT elements.

[0144] The transistor included in the light-emitting device 800 in Figure 9(b) may be formed within a substrate such as a silicon substrate. Here, "formed within a substrate" means that the transistor is manufactured by processing the substrate itself, such as a silicon substrate. In other words, having a transistor within a substrate can be seen as the substrate and the transistor being formed as a single unit.

[0145] The organic light-emitting element according to this embodiment has its luminescence controlled by a TFT, which is an example of a switching element, and by providing multiple organic light-emitting elements on the surface, an image can be displayed according to the luminescence of each element. Here, the switching element according to this embodiment is not limited to a TFT, but may also be a transistor made of low-temperature polysilicon, or an active matrix driver formed on a substrate such as a silicon substrate. "On the substrate" can also be said to be "within the substrate". Whether to provide a transistor within the substrate or to use a TFT is selected depending on the size of the display area; for example, if the size is about 0.5 inches, the organic light-emitting element may be provided on a silicon substrate.

[0146] Figure 10 is a schematic diagram showing an example of a display device using the light-emitting device 100 of this embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPCs 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. Active elements such as transistors are arranged on the circuit board 1007. The battery 1008 does not need to be provided if the display device 1000 is not a portable device, and even if it is a portable device, it does not need to be provided in this position. The light-emitting device 100 can be applied to the display panel 1005. The pixels 106 arranged on the light-emitting device 100 that functions as the display panel 1005 are connected to and operate with a control circuit including active elements such as transistors arranged on the circuit board 1007.

[0147] The display device 1000 shown in Figure 10 may be used in the display unit of a photoelectric conversion device (also called an imaging device) which has an optical unit with multiple lenses and an image sensor that receives light passing through the optical unit and converts it into an electrical signal. The photoelectric conversion device may have a display unit that displays information acquired by the image sensor. The display unit may be an external display unit exposed to the outside of the photoelectric conversion device, or a display unit located inside the viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0148] Figure 11 is a schematic diagram showing an example of a photoelectric converter using the light-emitting device 100 of this embodiment. The photoelectric converter 1100 may have a viewfinder 1101, a rear display 1102, an operating unit 1103, and a housing 1104. The photoelectric converter 1100 may also be called an imaging device. The light-emitting device 100 of this embodiment can be applied to the display unit, which is the viewfinder 1101 or the rear display 1102. In this case, the light-emitting device 100 may display not only the image to be captured, but also environmental information, imaging instructions, etc. Environmental information may include the intensity of ambient light, the direction of ambient light, the speed at which the subject is moving, and the possibility that the subject may be obscured by an obstacle.

[0149] Since the optimal timing for imaging is often very short, it is desirable to display information as quickly as possible. Therefore, a light-emitting device 100, which includes pixels 106 containing light-emitting elements 105 made of organic light-emitting materials such as organic EL elements, may be used in the viewfinder 1101 or the rear display 1102. This is because organic light-emitting materials have a fast response speed. A light-emitting device 100 using organic light-emitting materials is more suitable than a liquid crystal display device for these devices where display speed is required.

[0150] The photoelectric converter 1100 has an optical section (not shown). The optical section has multiple lenses, and the light that passes through the optical section is imaged onto a photoelectric converter element (not shown) housed in a light-receiving housing 1104. The focus can be adjusted by adjusting the relative positions of the multiple lenses. This operation can also be performed automatically.

[0151] The light-emitting device 100 may be applied to the display section of an electronic device. In that case, it may have both a display function and an operating function. Examples of portable terminals include mobile phones such as smartphones, tablets, and head-mounted displays.

[0152] Figure 12 is a schematic diagram showing an example of an electronic device using the light-emitting device 100 of this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type response unit. The operation unit 1202 may also be a biometric recognition unit that recognizes fingerprints to unlock, etc. A portable device having a communication unit can also be called a communication device. The light-emitting device 100 of this embodiment can be applied to the display unit 1201.

[0153] Figures 13(a) and 13(b) are schematic diagrams showing an example of a display device using the light-emitting device 100 of this embodiment. Figure 13(a) is a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device 100 of this embodiment can be applied to the display unit 1302. The display device 1300 may also have a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form shown in Figure 13(a). For example, the lower edge of the frame 1301 may also serve as the base 1303. Also, the frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0154] Figure 13(b) is a schematic diagram showing another example of a display device using the light-emitting device 100 of this embodiment. The display device 1310 in Figure 13(b) is configured to be foldable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The light-emitting device 100 of this embodiment can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single display device without seams. The first display unit 1311 and the second display unit 1312 can be separated by a bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or they may display a single image together.

[0155] Figure 14(a) is a schematic diagram of an automobile having a taillight, which is an example of a vehicle light fixture using the light-emitting device 100 of this embodiment. The automobile 1500 may have a taillight 1501, and the taillight 1501 may be illuminated when the brakes are applied or otherwise. The light-emitting device 100 of this embodiment may also be used as a headlight for a vehicle.

[0156] The light-emitting device 100 of this embodiment can be applied to the tail lamp 1501. The tail lamp 1501 may have a protective member to protect the light-emitting device 100 that functions as a tail lamp 1501. The protective member can be made of any material as long as it has a reasonably high strength and is transparent, but it may be made of polycarbonate or the like. The protective member may also be made of polycarbonate mixed with a frangic acid derivative, an acrylonitrile derivative, or the like.

[0157] The automobile 1500 may have a body 1503 and windows 1502 attached thereto. The windows may be for checking the front and rear of the automobile, or they may be transparent displays such as head-up displays. The light-emitting device 100 of this embodiment may be used for such transparent displays. In this case, the constituent materials such as electrodes of the light-emitting device 100 are made of transparent materials.

[0158] Furthermore, as shown in Figure 14(b), the automobile 1500 may also be equipped with a steering wheel 1504 for controlling the direction of movement of the moving body (automobile), a display unit 1505 mounted on the vehicle body 1503 that displays a map, the position of the moving body, the direction of turns, the view behind the moving body, etc. The light-emitting device 100 of this embodiment can be applied to the display unit 1505.

[0159] The automobile 1500 is an example of a mobile body, and the mobile body according to this embodiment includes a drive force generating unit that generates a driving force mainly used for the movement of the mobile body, and one or both of a rotating body mainly used for the movement of the mobile body. The drive force generating unit may be an engine, a motor, etc. The rotating body may be a tire, a wheel, a ship's propeller, an aircraft's propeller or fan, etc. Specifically, the mobile body may be a bicycle, an automobile, a train, a ship, an aircraft, a drone, etc. The mobile body may have a body and a light fixture installed thereon. The light fixture may indicate the current position of the body. The light fixture may have the light-emitting device 100 of this embodiment. The mobile body may also have a display unit mounted on a base. The display unit may have the light-emitting device 100 of this embodiment.

[0160] Further application examples of the light-emitting device 100 of this embodiment will be described with reference to Figures 15(a) and 15(b). The light-emitting device 100 can be applied to systems that can be worn as wearable devices such as smart glasses, head-mounted displays (HMDs), and smart contact lenses. The imaging display device used in such application examples has an imaging device capable of photoelectric conversion of visible light and a light-emitting device capable of emitting visible light.

[0161] Figure 15(a) illustrates a pair of glasses 1600 (smart glasses) according to one application example. An imaging device 1602, such as a CMOS sensor or SPAD, is provided on the front surface of the lens 1601 of the glasses 1600. In addition, the light-emitting device 100 of this embodiment is provided on the back surface of the lens 1601.

[0162] The eyeglasses 1600 further include a control device 1603. The control device 1603 functions as a power supply that provides power to the imaging device 1602 and the light-emitting device 100 according to each embodiment. The control device 1603 also controls the operation of the imaging device 1602 and the light-emitting device 100. The lens 1601 has an optical system formed therein for focusing light onto the imaging device 1602.

[0163] Figure 15(b) illustrates a pair of glasses 1610 (smart glasses) according to one application example. The glasses 1610 have a control device 1612, which is equipped with an imaging device equivalent to an imaging device 1602 and a light-emitting device 100. The lens 1611 has an optical system formed to project the light emitted from the imaging device and the light-emitting device 100 within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power supply to provide power to the imaging device and the light-emitting device 100, and also controls the operation of the imaging device and the light-emitting device 100. The control device 1612 may have a gaze detection unit that detects the wearer's gaze. Gaze detection may use infrared light. The infrared light-emitting unit emits infrared light towards the eyeball of the user who is gazing at the displayed image. The imaging unit, which has a photodetector, detects the reflected light from the eyeball of the emitted infrared light, thereby obtaining an image of the eyeball. By having a reduction mechanism that reduces the amount of light transmitted from the infrared light-emitting part to the display part in a planar view, the degradation of image quality is reduced.

[0164] The user's gaze towards a displayed image is detected from an image of the eyeball obtained by imaging with infrared light. Any known method can be applied to gaze detection using an image of the eyeball. As an example, a gaze detection method based on the Purkinje image obtained by the reflection of the irradiated light from the cornea can be used.

[0165] More specifically, gaze detection processing is performed based on the pupil-corneal reflection method. Using the pupil-corneal reflection method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the pupil image and Purkinje image contained in the captured image of the eyeball, thereby detecting the user's gaze.

[0166] The light-emitting device 100 according to the embodiment of this disclosure includes an imaging device having a light-receiving element, and may control the displayed image based on the user's line of sight information from the imaging device.

[0167] Specifically, the light-emitting device 100 determines a first field of view area that the user is fixated on, and a second field of view area other than the first field of view area, based on gaze information. The first and second field of view areas may be determined by the control device of the light-emitting device 100, or they may be determined by an external control device and received by the device. In the display area of ​​the light-emitting device 100, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0168] Furthermore, the display area has a first display area and a second display area different from the first display area, and based on gaze information, the area with higher priority is determined from the first display area and the second display area. The first display area and the second display area may be determined by the control device of the light-emitting device 100, or they may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of the areas other than the high-priority area. In other words, the resolution of the area with relatively lower priority may be lowered.

[0169] AI may be used to determine the first field of view area and high-priority areas. The AI ​​may be a model configured to estimate the angle of line of sight and the distance to the target object at the end of the line of sight from the image of the eye, using the image of the eye and the direction the eye was actually looking in the image as training data. The AI ​​program may be owned by the light-emitting device 100, the imaging device, or an external device. If it is owned by an external device, it is transmitted to the light-emitting device 100 via communication.

[0170] When display control is based on visual detection, this can be applied to smart glasses that also have an imaging device for capturing images of the surrounding environment. The smart glasses can display the captured external information in real time.

[0171] The disclosures herein include the following light-emitting devices, display devices, photoelectric converters, electronic devices, lighting devices, mobile devices, and wearable devices.

[0172] (Item 1) The circuit board has a display area on its main surface in which multiple pixels are arranged. Each pixel includes a light-emitting region disposed on a substrate, a microlens disposed on the light-emitting region, and a light-shielding layer that has an opening at a position that coincides with the vertex of the microlens in the orthogonal projection onto the main surface and covers a portion of the microlens. The plurality of pixels include the first pixel, The light-emitting device is characterized in that, in the orthogonal projection onto the principal surface, the vertex of the microlens and the geometric centroid of the light-emitting region are positioned at different locations, and the distance between the geometric centroid of the aperture and the geometric centroid of the light-emitting region is shorter than the distance between the vertex of the microlens and the geometric centroid of the light-emitting region.

[0173] (Item 2) The light-emitting device according to item 1, characterized in that, in the orthogonal projection onto the main surface, the geometric centroid of the light-emitting region of the first pixel is located between the center of the display region and the vertex of the microlens of the first pixel.

[0174] (Item 3) The light-emitting device according to item 1 or 2, characterized in that, in the orthogonal projection onto the principal surface, the first pixel is positioned between the vertex of the microlens and the geometric centroid of the light-emitting region.

[0175] (Item 4) The light-emitting device according to any one of items 1 to 3, characterized in that, in the orthogonal projection onto the principal surface, the vertices of the microlenses of the first pixel, the geometric centroid of the aperture, and the geometric centroid of the light-emitting region are arranged to lie on a virtual straight line.

[0176] (Item 5) The light-emitting device according to any one of items 1 to 4, characterized in that, in the orthogonal projection onto the principal surface, the geometric centroid of the light-emitting region at each pixel is positioned to coincide with the microlens of each pixel.

[0177] (Item 6) The light-emitting device according to any one of items 1 to 5, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertex of the microlens in the first pixel and the geometric centroid of the aperture is shorter than the distance between the geometric centroid of the aperture in the first pixel and the geometric centroid of the light-emitting region.

[0178] (Item 7) The aforementioned plurality of pixels include the second pixel, The second pixel is positioned between the first pixel and the center of the display area, and in the orthogonal projection onto the principal surface, the vertex of the microlens and the geometric centroid of the light-emitting area are positioned at different locations, and the distance between the geometric centroid of the aperture and the geometric centroid of the light-emitting area is shorter than the distance between the vertex of the microlens and the geometric centroid of the light-emitting area. A light-emitting device according to any one of items 1 to 6, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertex of the microlens in the first pixel and the geometric centroid of the light-emitting region is longer than the distance between the vertex of the microlens in the second pixel and the geometric centroid of the light-emitting region.

[0179] (Item 8) The light-emitting device according to item 7, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertex of the microlens in the first pixel and the geometric centroid of the aperture is longer than the distance between the vertex of the microlens in the second pixel and the geometric centroid of the aperture.

[0180] (Item 9) The light-emitting device according to item 7 or 8, characterized in that the shortest distance between the microlens and the outer edge of the aperture in the first pixel is shorter than the shortest distance between the microlens and the outer edge of the aperture in the second pixel.

[0181] (Item 10) The light-emitting device according to any one of items 1 to 9, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertices of the microlenses in the plurality of pixels and the geometric centroid of the light-emitting region increases continuously or stepwise as it moves away from the center of the display region.

[0182] (Item 11) The light-emitting device according to any one of items 1 to 10, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertices of the microlenses in the plurality of pixels and the geometric centroid of the aperture increases continuously or stepwise as it moves away from the center of the display area.

[0183] (Item 12) The light-emitting device according to any one of items 1 to 11, characterized in that, in the orthogonal projection onto the main surface, the pixel among the plurality of pixels located at the center of the display area is positioned at a location where the vertex of the microlens, the geometric centroid of the aperture, and the geometric centroid of the light-emitting area coincide with each other.

[0184] (Item 13) Each pixel further includes a reflective layer disposed between the light-emitting region and the substrate, and an optical adjustment layer disposed between the light-emitting region and the reflective layer, The light-emitting device according to any one of items 1 to 12, characterized in that the plurality of pixels include a third pixel whose optical adjustment layer thickness is different from that of the first pixel.

[0185] (Item 14) Each pixel further includes a color filter positioned between the microlens and the light-emitting region. The light-emitting device according to item 13, characterized in that the color filter arranged in the first pixel and the color filter arranged in the third pixel transmit light of different wavelengths from each other.

[0186] (Item 15) The light-emitting device according to any one of items 1 to 13, characterized in that each pixel further includes a color filter disposed between the microlens and the light-emitting region.

[0187] (Item 16) The light-emitting device according to any one of items 1 to 15, characterized in that, in the orthogonal projection onto the main surface, the light-shielding layer is arranged to further cover the space between each of the microlenses of the plurality of pixels.

[0188] (Item 17) The light-emitting device according to any one of items 1 to 16, characterized in that the light-shielding layer contains a resin containing a black pigment.

[0189] (Item 18) A display device comprising a light-emitting device described in any one of items 1 to 17, and a control circuit connected to the light-emitting device.

[0190] (Item 19) It comprises an optical unit having multiple lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image. The photoelectric conversion device is characterized in that the display unit has a light-emitting device described in any one of items 1 to 17.

[0191] (Item 20) It comprises a housing on which a display unit is provided, and a communication unit provided in the housing for communicating with the outside, The display unit is an electronic device characterized by having a light-emitting device described in any one of items 1 to 17.

[0192] (Item 21) A mobile body having an aircraft body and a lighting fixture provided on the aircraft body, The aforementioned luminaire is a mobile body characterized by having a light-emitting device described in any one of items 1 to 17.

[0193] (Item 22) A wearable device having a display device for displaying images, The aforementioned display device is a wearable device characterized by having a light-emitting device as described in any one of items 1 to 17.

[0194] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0195] 100: Light-emitting device, 102: Microlens, 103: Light-shielding layer, 104: Light-emitting area, 106: Pixel, 107: Aperture, 119: Substrate, 151: Main surface, 160: Display area, C1: Vertex, C2, C3: Geometric centroids

Claims

1. The circuit board has a display area on its main surface in which multiple pixels are arranged. Each pixel includes a light-emitting region disposed on a substrate, a microlens disposed on the light-emitting region, and a light-shielding layer that has an opening at a position that coincides with the vertex of the microlens in the orthogonal projection onto the main surface and covers a portion of the microlens. The plurality of pixels include the first pixel, The light-emitting device is characterized in that, in the orthogonal projection onto the main surface, the first pixel is positioned at different locations from the vertex of the microlens and the geometric centroid of the light-emitting region, and the distance between the geometric centroid of the aperture and the geometric centroid of the light-emitting region is shorter than the distance between the vertex of the microlens and the geometric centroid of the light-emitting region.

2. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the main surface, the geometric centroid of the light-emitting region of the first pixel is located between the center of the display region and the vertex of the microlens of the first pixel.

3. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the main surface, the first pixel is positioned between the vertex of the microlens and the geometric centroid of the light-emitting region.

4. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the main surface, the vertices of the microlenses of the first pixel, the geometric centroid of the aperture, and the geometric centroid of the light-emitting region are arranged to lie on a virtual straight line.

5. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the principal surface, the geometric centroid of the light-emitting region at each pixel is positioned to coincide with the microlens of each pixel.

6. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertex of the microlens in the first pixel and the geometric centroid of the aperture is shorter than the distance between the geometric centroid of the aperture in the first pixel and the geometric centroid of the light-emitting region.

7. The aforementioned plurality of pixels include a second pixel, The second pixel is positioned between the first pixel and the center of the display area, and in the orthogonal projection onto the principal surface, the vertex of the microlens and the geometric centroid of the light-emitting area are positioned at different locations, and the distance between the geometric centroid of the aperture and the geometric centroid of the light-emitting area is shorter than the distance between the vertex of the microlens and the geometric centroid of the light-emitting area. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertex of the microlens in the first pixel and the geometric centroid of the light-emitting region is longer than the distance between the vertex of the microlens in the second pixel and the geometric centroid of the light-emitting region.

8. The light-emitting device according to claim 7, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertex of the microlens in the first pixel and the geometric centroid of the aperture is longer than the distance between the vertex of the microlens in the second pixel and the geometric centroid of the aperture.

9. The light-emitting device according to claim 7, characterized in that the shortest distance between the microlens and the outer edge of the aperture in the first pixel is shorter than the shortest distance between the microlens and the outer edge of the aperture in the second pixel.

10. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertices of the microlenses in the plurality of pixels and the geometric centroid of the light-emitting region increases continuously or stepwise as it moves away from the center of the display region.

11. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the principal surface, the distance between the vertices of the microlenses in the plurality of pixels and the geometric centroid of the aperture increases continuously or stepwise as it moves away from the center of the display area.

12. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the main surface, the pixel among the plurality of pixels located at the center of the display area is positioned at a location where the vertex of the microlens, the geometric centroid of the aperture, and the geometric centroid of the light-emitting area coincide with each other.

13. Each pixel further includes a reflective layer disposed between the light-emitting region and the substrate, and an optical adjustment layer disposed between the light-emitting region and the reflective layer, The light-emitting device according to claim 1, characterized in that the plurality of pixels include a third pixel whose optical adjustment layer thickness is different from that of the first pixel.

14. Each pixel further includes a color filter positioned between the microlens and the light-emitting region, The light-emitting device according to claim 13, characterized in that the color filter arranged in the first pixel and the color filter arranged in the third pixel transmit light of different wavelengths from each other.

15. The light-emitting device according to claim 1, characterized in that each pixel further includes a color filter disposed between the microlens and the light-emitting region.

16. The light-emitting device according to claim 1, characterized in that, in the orthogonal projection onto the main surface, the light-shielding layer is arranged to further cover the space between each of the microlenses of the plurality of pixels.

17. The light-emitting device according to claim 1, characterized in that the light-shielding layer contains a resin containing a black pigment.

18. A display device comprising a light-emitting device according to any one of claims 1 to 17, and a control circuit connected to the light-emitting device.

19. It comprises an optical unit having multiple lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image. The photoelectric conversion device is characterized in that the display unit has a light-emitting device according to any one of claims 1 to 17.

20. It comprises a housing on which a display unit is provided, and a communication unit provided in the housing for communicating with the outside, The display unit is an electronic device characterized by having a light-emitting device according to any one of claims 1 to 17.

21. A mobile body having an aircraft body and a lighting fixture provided on the aircraft body, The aforementioned light fixture is a mobile body characterized by having a light-emitting device according to any one of claims 1 to 17.

22. A wearable device having a display device for displaying images, The wearable device is characterized in that the display device has a light-emitting device according to any one of claims 1 to 17.

Images