Stack structure, display module, electronic device, impact-resistant layer and preparation method therefor

Abstract

A stack structure (90), a display module (2), an electronic device (1), an impact-resistant layer and a preparation method, relating to the technical field of display. The stack structure (90) comprises a protective layer (91) and impact-resistant layers. The elastic modulus of each impact-resistant layers is less than the elastic modulus of the protective layer (91), the hardness of each impact-resistant layer is greater than the hardness of the protective layer (91), and / or the rigidity of each impact-resistant layer is greater than the rigidity of the protective layer (91). The protective layer (91) and the impact-resistant layers are connected by bonding or in other manners. Therefore, the compression resistance characteristic of a high-hardness and / or high-rigidity material is combined with the impact resistance characteristic of a high-elastic-modulus material, to improve the reliability of the stack structure (90). The stack structure (90) is directly connected to a display screen (20) by means of an adhesive layer, such that a display surface layer + cover plate structure is not required any more, and the architecture of the electronic device (1) can be simplified.

Description

Laminated structures, display modules, electronic devices, impact-resistant layers and their preparation methods

[0001] This application claims priority to Chinese Patent Application No. 202311792584.6, filed with the State Intellectual Property Office of China on December 22, 2023, entitled "Laminated Structure, Display Module, Electronic Device, Impact-Resistant Layer and Preparation Method Thereof", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a multilayer structure, a display module, an electronic device, an impact-resistant layer, and a method for preparing the same. Background Technology

[0003] With the continuous development of display technology, foldable electronic devices are gradually becoming a trend in future mobile electronic products. When unfolded, foldable electronic devices offer a larger display area, enhancing the viewing experience. When folded, they have a smaller size, making them easy for users to carry.

[0004] Flexible displays are a crucial component of foldable electronic devices. Due to the unique properties of their materials, these displays are easily damaged by external forces. Therefore, a protective screen layer is typically placed on the light-emitting side of the display. Since the electronic device as a whole needs to be bendable, the protective screen layer also needs to be bendable. Therefore, the cover glass used in traditional flat electronic devices is no longer suitable for foldable electronic devices, and polymer materials are chosen to protect the display.

[0005] To ensure the reliability of the display screen, multiple polymer film layers are usually required on the light-emitting side and the backlight side of the display screen. This results in a series of problems such as complex structure, many process steps, large thickness, and unreliable reliability of the display screen film layers.

[0006] Summary of the Invention

[0007] This application provides a stacked structure, a display module, an electronic device, an impact-resistant layer, and a method for preparing the same, which simplifies the architecture of electronic devices while improving reliability.

[0008] To achieve the above objectives, this application adopts the following technical solution:

[0009] A first aspect of this application provides a laminated structure disposed on a display screen and located on the light-emitting side of the display screen. The laminated structure includes a protective layer and a first impact-resistant layer. The first impact-resistant layer is located on one side of the protective layer and is connected to the protective layer. The elastic modulus of the first impact-resistant layer is less than that of the protective layer, the hardness of the first impact-resistant layer is greater than that of the protective layer, and / or, the stiffness of the first impact-resistant layer is greater than that of the protective layer.

[0010] The laminated structure provided in this application embodiment stacks a first impact-resistant layer with high hardness and / or high stiffness with a protective layer with high elastic modulus. This combines the compression resistance of the high hardness and / or high stiffness material with the impact resistance of the high elastic modulus material, and the laminated structure includes multiple impact-resistant layers. This improves the impact resistance, scratch resistance, compression resistance, and bending resistance of the laminated structure, and also enhances the refinement of creases and large-area light and shadow, thereby improving the reliability and refinement of the laminated structure. Furthermore, the connection between the first impact-resistant layer and the protective layer facilitates a thinner design of the laminated structure, reducing opening and closing resistance during bending, further improving the reliability and refinement of the laminated structure. Moreover, the laminated structure can be directly and separately installed on the light-emitting side of the display screen, combining the display surface layer and the cover layer into one, simplifying the architecture of the electronic device.

[0011] In one possible implementation, the protective layer is bonded to the first impact-resistant layer. The bonding of the first impact-resistant layer and the protective layer, designed as a composite laminate structure, eliminates the need for an additional connecting layer between the first impact-resistant layer and the protective layer. This facilitates a thinner design of the laminate structure, reduces opening and closing resistance during bending, and further improves the reliability and sophistication of the laminate structure.

[0012] In one possible implementation, the laminated structure further includes a first connecting layer bonded between the protective layer and the first impact-resistant layer. The protective layer and the first impact-resistant layer are connected by the connecting layer, and the laminated structure can include at least three film layers, which is beneficial for achieving a thinner design of the laminated structure.

[0013] In one possible implementation, the laminated structure further includes a second impact-resistant layer; the second impact-resistant layer is located on the side of the first impact-resistant layer away from the protective layer; a first connecting layer covers the surface of the first impact-resistant layer away from the protective layer, and the second impact-resistant layer is bonded to the first connecting layer. The laminated structure can include multiple impact-resistant layers. By thinning the thickness of each impact-resistant layer, multiple impact-resistant layers are provided, ensuring that the overall stiffness and hardness of the multiple impact-resistant layers remain unchanged, but the elastic modulus of the multiple impact-resistant layers can be increased to further improve the impact resistance, scratch resistance, compression resistance, and bending resistance of the laminated structure. Moreover, the multiple impact-resistant layers can be directly bonded together through the first connecting layer, simplifying the laminated structure.

[0014] In one possible implementation, the laminated structure further includes a second impact-resistant layer and a second connecting layer; the second impact-resistant layer is located on the side of the first impact-resistant layer away from the protective layer, and the second connecting layer connects the first impact-resistant layer and the second impact-resistant layer. Multiple impact-resistant layers can also be connected by various methods such as chemical bonding or adhesive bonding, making it widely applicable.

[0015] In one possible implementation, the first impact-resistant layer is made of ultrathin flexible glass or high-entropy glass. Ultrathin flexible glass and high-entropy glass have good elasticity and recoverability. Using this minimalist architecture with multiple ultrathin flexible glass or high-entropy glass, the recoverability of creases is also greatly improved.

[0016] In one possible implementation, the protective layer is made of materials including polyethylene terephthalate, transparent polyimide, or glass fiber. These are high-elasticity, technologically mature polymer materials.

[0017] In one possible implementation, the material of the first connecting layer includes an energy-absorbing and impact-resistant material. The energy-absorbing and impact-resistant material chemically bonds the first impact-resistant layer and the protective layer, resulting in a good connection effect, and the thickness of the first connecting layer can be made relatively thin.

[0018] In one possible implementation, the second connecting layer is made of a polymer or an energy-absorbing impact-resistant material, and is bonded to both the first and second impact-resistant layers. Chemical bonding of the first and second impact-resistant layers using a polymer or energy-absorbing impact-resistant material provides a good bond, and the second connecting layer can be made relatively thin.

[0019] In one possible implementation, the second connecting layer is made of an adhesive material, and the second connecting layer is bonded to both the first and second impact-resistant layers. Connecting the first and second impact-resistant layers using an adhesive material is a mature and easily implemented technique.

[0020] In one possible implementation, the surface of the first impact-resistant layer facing the protective layer and / or the surface away from the protective layer are provided with grooves. By providing grooves on the first impact-resistant layer, the thickness of the middle region of the first impact-resistant layer is reduced, enabling the first impact-resistant layer to have bending properties while ensuring reliability, thereby reducing the risk of the first impact-resistant layer breaking.

[0021] In one possible implementation, the dimension at the thinnest point of the first impact-resistant layer is less than or equal to 50 μm. This allows the first impact-resistant layer to balance reliability and resilience, thus optimizing its performance.

[0022] In one possible implementation, the thickness of the laminated structure is less than or equal to 600 μm. The laminated structure provided in this application embodiment can be made relatively thin while meeting reliability requirements, thus satisfying the demand for thinner and lighter electronic devices.

[0023] In one possible implementation, the sides of the laminated structure are perpendicular to the protective layer. This ensures that the laminated structure provides almost uniform protection at all locations on the display, improving the problem of poor protection at the edges of the display.

[0024] In one possible implementation, the laminated structure further includes a third connecting layer and a third impact-resistant layer disposed sequentially on the side of the second impact-resistant layer away from the second connecting layer. By thinning the thickness of each impact-resistant layer and setting multiple impact-resistant layers, the overall stiffness and hardness of the multiple impact-resistant layers remain unchanged, but the elastic modulus of the multiple impact-resistant layers can be increased to further improve the impact resistance, scratch resistance, extrusion resistance, and bending resistance of the laminated structure.

[0025] A second aspect of this application provides a laminated structure, comprising: a protective layer; a first connecting layer bonded between the protective layer and a first impact-resistant layer; the first impact-resistant layer located on one side of the protective layer; a second impact-resistant layer located on the side of the first impact-resistant layer away from the protective layer; and a second connecting layer bonded between the first impact-resistant layer and the second impact-resistant layer. The elastic modulus of the first impact-resistant layer is less than that of the protective layer, the hardness of the first impact-resistant layer is greater than that of the protective layer, and / or, the stiffness of the first impact-resistant layer is greater than that of the protective layer. The laminated structure provided in this application includes multiple impact-resistant layers. By thinning the thickness of each impact-resistant layer, multiple impact-resistant layers are provided, so that the overall stiffness and hardness of the multiple impact-resistant layers remain unchanged, but the elastic modulus of the multiple impact-resistant layers can be increased to further improve the impact resistance, scratch resistance, extrusion resistance, and bending resistance of the laminated structure. Moreover, the multiple impact-resistant layers can be directly bonded together through the first connecting layer, which simplifies the laminated structure.

[0026] A third aspect of the embodiments of this application provides a display module, the display module including a display screen and a stacked structure, the stacked structure including the stacked structure of either the first aspect or the second aspect, wherein the light-emitting surface of the display screen faces the second impact-resistant layer.

[0027] In one possible implementation, the display module further includes a first adhesive layer, a planarization layer, a second adhesive layer, and a bamboo book, sequentially disposed on the backlight surface of the display screen; the planarization layer is connected to the display screen through the first adhesive layer, and the bamboo book is connected to the planarization layer through the second adhesive layer. The absence of a support layer on the backlight surface of the display screen further simplifies the architecture of the display module, reduces its thickness, and achieves a minimalist and thinner design.

[0028] In one possible implementation, the elastic modulus of the bamboo book is greater than or equal to 10 GPa. By selecting a material with a high elastic modulus for the bamboo book, its impact resistance can be improved, and the refinement of creases and large-area light and shadow can be enhanced. This simplifies the display module architecture while improving the reliability and refinement of the display module.

[0029] In one possible implementation, the bamboo book comprises a first part and a second part, with the second part positioned on opposite sides of the first part. The elastic modulus of the first part is smaller than that of the second part. By reducing the elastic modulus in the middle region of the bamboo book, the bendability of the middle bending area can be ensured, further improving the performance of the display module.

[0030] In one possible implementation, bamboo books are made of materials including carbon fiber, graphite fiber, pitch-based materials, high-entropy alloys, stainless steel, titanium alloys, composites of pitch-based materials and metals, and composites of carbon fiber and metals. Bamboo books can utilize a variety of existing materials, eliminating the need to develop new materials and making them easy to implement.

[0031] In one possible implementation, the projection of the laminated structure onto the planarization layer overlaps the projection of the display screen onto the planarization layer. The laminated structure can protect the display screen, mitigate the vulnerability of weak areas due to edge compression, and further enhance the reliability of the display module.

[0032] In one possible implementation, the display module further includes a third adhesive layer, with the laminated structure and the display screen respectively connected to its two sides. The laminated structure and the display screen are directly bonded together by the third adhesive layer, eliminating the need for additional film layers between them. This simplifies the structure of the display module, reduces the gap between the display screen and the laminated structure, and thus reduces the overall size of the display module.

[0033] In one possible implementation, the display screen includes a first planar portion, a bent portion, and a second planar portion. The bent portion connects the first and second planar portions. The first planar portion is connected to the laminated structure, and the second planar portion is located on the backlight side of the first planar portion. The display module also includes a module adhesive layer that covers the bent portion, and the thickness of the module adhesive layer is 50µm-90µm. Only a third adhesive layer may be provided between the display screen and the laminated structure; therefore, the gap between the first planar portion and the laminated structure can be relatively small, reducing the thickness of the display module. Furthermore, a support layer may not be required between the first and second planar portions, further reducing the thickness of the module adhesive layer.

[0034] A fourth aspect of the embodiments of this application provides an electronic device, the electronic device including a display module and a middle frame, the display module being disposed on the middle frame; the display module includes the display module of any of the third aspects.

[0035] In one possible implementation, the electronic device also includes a bezel located around the display module and extending above the stacked structure to overlap with it. This eliminates gaps between the bezel and the stacked structure, improving aesthetics and reducing dust accumulation. Furthermore, the stacked structure provides protection against pressure on the edges of the electronic device, reducing the need for bezel protection and allowing for a narrower bezel, achieving a "narrow bezel" effect.

[0036] In one possible implementation, the width of the bezel projected onto the plane of the display module is less than or equal to 0.5 mm. Since the laminated structure protects against edge pressure on the electronic device, a bezel is unnecessary; it only needs to fill the gap between the display module and the mid-frame. Therefore, the bezel width can be reduced.

[0037] In one possible implementation, the sides of the display module are adjacent to the mid-frame. Since the stacked structure protects the edges of the electronic device from pressure, a bezel is not required for protection, and no bezel can be placed between the display module and the mid-frame to further achieve a "narrow bezel" effect.

[0038] In one possible implementation, the electronic device further includes a back cover, which comprises a first housing, a second housing, and a hinge mechanism. The first housing and the second housing are disposed on opposite sides of the hinge mechanism. The first housing and the second housing move towards or away from each other via the hinge mechanism, allowing the display module to switch between a flattened state and a closed state. The electronic device of this application is applicable to foldable electronic devices.

[0039] A fifth aspect of this application provides a method for preparing an impact-resistant layer, comprising: providing a glass sheet; placing the glass sheet in a hot casting jig with protrusions on the inner surface for hot casting to form a glass sheet with grooves on the surface; trimming the glass sheet to a target size to form an impact-resistant layer; the upper surface and / or lower surface of the impact-resistant layer having grooves.

[0040] The impact-resistant layer formed by the embodiment of this application can be formed by hot casting process, which can improve the processing efficiency and machinability of impact-resistant layers with unequal thickness, and can be mass-produced.

[0041] In one possible implementation, the fabrication method further includes polishing the glass sheet before or after trimming it to the target size. This can improve the optical properties of the impact-resistant layer.

[0042] In one possible implementation, the glass sheet is trimmed to the target size, including trimming the length and width of the glass sheet using laser or CNC machine tools. This processing method is technically simple and has a high yield.

[0043] In one possible implementation, an etching process is used to adjust the thickness of the glass sheet. This method is technically simple and yields a high yield.

[0044] In one possible implementation, the hot casting temperature is 600℃-1000℃. This process is technically simple and has a high yield.

[0045] A sixth aspect of the present application provides an impact-resistant layer applied to an electronic device including a display screen; the impact-resistant layer has opposing first and second surfaces, the first and / or second surfaces having grooves.

[0046] By setting grooves on the impact-resistant layer, the thickness of the middle area of ​​the impact-resistant layer is reduced, so that the impact-resistant layer can be bent while ensuring reliability, thus reducing the risk of the impact-resistant layer breaking.

[0047] In one possible implementation, the impact-resistant layer is made of ultra-thin flexible glass or high-entropy glass. Ultra-thin flexible glass and high-entropy glass have good elasticity and recoverability, which significantly improves the recoverability of creases in the impact-resistant layer.

[0048] In one possible implementation, the thinnest part of the impact-resistant layer has a dimension of less than or equal to 50 μm. This allows the impact-resistant layer to balance reliability and resilience, thus optimizing its performance.

[0049] A seventh aspect of this application provides a hot casting fixture, comprising: a first component and a second component, wherein the surface of the first component facing the second component has a protrusion, and / or the surface of the second component facing the first component has a protrusion. Attached Figure Description

[0050] Figure 1A is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0051] Figure 1B is a schematic diagram of the folded state of an electronic device provided in an embodiment of this application;

[0052] Figure 1C is a cross-sectional view of a candybar electronic device provided in an embodiment of this application;

[0053] Figure 1D is a simplified diagram of a display module provided in an embodiment of this application;

[0054] Figure 1E is a cross-sectional view along the A1-A2 direction in Figure 1A provided by an embodiment of this application;

[0055] Figure 1F is a cross-sectional view of a display screen provided in an embodiment of this application;

[0056] Figure 1G is an enlarged view of Figure 1F at point A;

[0057] Figure 2 is a cross-sectional view of a laminated structure provided in an embodiment of this application;

[0058] Figures 3A-3C are cross-sectional views of a laminated structure provided in an embodiment of this application;

[0059] Figures 4A-4C are cross-sectional views of a laminated structure provided in an embodiment of this application;

[0060] Figure 5 is a cross-sectional view of a laminated structure provided in an embodiment of this application;

[0061] Figure 6A is a cross-sectional view of a display module provided in an embodiment of this application;

[0062] Figure 6B is a simplified diagram of a display module provided in an embodiment of this application;

[0063] Figures 7A-7C are assembly diagrams of an electronic device provided in an embodiment of this application;

[0064] Figures 8A and 8B are cross-sectional views of an electronic device provided in an embodiment of this application;

[0065] Figure 9 is a schematic diagram of the preparation process of an impact-resistant layer provided in an embodiment of this application. Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0067] Hereinafter, the terms "second," "first," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "second," "first," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0068] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" may be defined relative to the orientation in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly based on the orientation of the components in the accompanying drawings.

[0069] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "coupled connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium. The term "contact" can be direct contact or indirect contact through an intermediate medium.

[0070] In this embodiment of the application, "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following associated objects have an "or" relationship.

[0071] This application provides an electronic device, which can be, for example, a foldable electronic device, or a candybar electronic device. In this application, the electronic device can be a commercially available electronic device. Examples of electronic devices include consumer electronics, home electronics, automotive electronics, or financial electronics. Consumer electronics include mobile phones, tablets, laptops, e-readers, personal computers (PCs), personal digital assistants (PDAs), desktop monitors, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) electronic devices, augmented reality (AR) electronic devices, drones, servers, etc. Home electronics include smart locks, televisions, remote controls, refrigerators, rechargeable small household appliances (e.g., soymilk makers, robot vacuum cleaners), switches, etc. Automotive electronics include car navigation systems, car DVDs, etc. Financial electronics include ATMs, self-service electronic devices, etc.

[0072] Figure 1A is a structural schematic diagram of an electronic device provided in an embodiment of this application, and Figure 1B is a schematic diagram of the folded state of an electronic device provided in an embodiment of this application.

[0073] To facilitate understanding of the electronic device provided in the embodiments of this application, an existing electronic device is described below with reference to Figure 1A:

[0074] As shown in Figure 1A, the electronic device 1 includes a screen protective layer 10, a display screen 20, a mid-frame 30, and a back cover (or rear shell, battery cover, etc.) 40. The screen protective layer 10 is disposed on the display screen 20 and located on the light-emitting side of the display screen 20. The display screen 20 is disposed on the mid-frame 30, which supports the display screen 20. The back cover 40 is disposed on the mid-frame 30, forming a receiving space with the side of the mid-frame 30 away from the display screen 20.

[0075] For example, electronic device 1 is a foldable electronic device, and display screen 20 is a flexible display screen. Display screen 20 is a self-emissive display screen, eliminating the need for a backlight module (BLM). Display screen 20 can be a self-emissive display screen such as an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (Mini-OLED) display screen, a micro light-emitting diode (Micro-LED) display screen, a micro organic light-emitting diode (Micro-OLED) display screen, or a quantum dot light-emitting diode (QLED) display screen.

[0076] The middle frame 30 includes a first frame 301 and a second frame 302. The first frame 301 and the second frame 302 can support the flexible display screen 20, ensuring the flexible display screen 20 remains as flat as possible during use and protecting the non-display surfaces of the flexible display screen 20. For example, a portion of the flexible display screen 20 is fixed to the first frame 301 by an adhesive layer, and a portion is fixed to the second frame 302 by an adhesive layer. This adhesive layer can be a thin film layer formed after applying adhesive; the specific form of this adhesive layer is not limited in this embodiment. Furthermore, other electronic components can be disposed on the side of the first frame 301 and the second frame 302 away from the display screen 20, such as a printed circuit board (PCB), a battery, a receiver, a speaker, and a camera. The PCB can integrate electronic components such as the main controller, storage unit, antenna module, and power management module of the electronic device, while the battery can power the display screen 20, the circuit board, the receiver, the speaker, and the camera. Of course, the electronic components disposed on the first frame 301 and the second frame 302 are not limited in the embodiments of this application.

[0077] The back cover 40 includes a first housing 401, a second housing 402, and a pivot mechanism 403, with the first housing 401 and the second housing 402 disposed on both sides of the pivot mechanism 403. In some embodiments, the display screen 20 may include a first display portion 201 corresponding to the first housing 401, a second display portion 202 corresponding to the second housing 402, and a foldable display portion 203 corresponding to the pivot mechanism 403. The foldable display portion 203 may be connected between the first display portion 201 and the second display portion 202. The first display portion 201 may be connected to the first frame 301, and the second display portion 202 may be connected to the second frame 302.

[0078] Under the action of the pivot mechanism 403, the first housing 401 and the second housing 402 can move closer to each other or further away from each other. Correspondingly, the first display part 201 and the second display part 202 of the display screen 20 can move closer to each other or further away from each other, so that the display screen 20 can be folded or unfolded.

[0079] As shown in Figure 1B, in the folded state, the angle α between the first housing 401 and the second housing 402 can be rotated from 180° to the point where the first housing 401 and the second housing 402 are parallel to each other and arranged opposite each other, with the minimum distance between the first housing 401 and the second housing 402. At this time, the first display unit 201 and the second display unit 202 can be considered to be arranged on different planes. Figure 1B illustrates an example where the electronic device 1 is folded with the display screen 20 facing outwards and the first housing 401 and the second housing 402 facing each other (folding outwards). Similarly, the electronic device 1 can also be folded with the display screen 20 facing inwards and the first display unit 201 and the second display unit 202 facing each other (folding inwards). In the folded state, the first display unit 201 and the second display unit 202 can be parallel to each other and arranged opposite each other, with the minimum height distance between the first display unit 201 and the second display unit 202. Of course, the electronic device 1 is not limited to a two-fold electronic device 1; the electronic device 1 can also be a multi-fold electronic device 1, and this embodiment does not limit this.

[0080] As shown in Figure 1A, in the unfolded state, the angle α between the first housing 401 and the second housing 402 can be approximately 180°, and the display screen 20 is in the unfolded state.

[0081] Figure 1C is a cross-sectional view of a candybar electronic device provided in an embodiment of this application.

[0082] As shown in Figure 1C, the structure of a straight-board electronic device is simpler than that of a multilayer electronic device, and can be simplified to a four-layer structure. First is the cover layer, which serves as the screen protection layer 10. The cover layer is typically made of glass and has a thickness of 500µm or more. Below the screen protection layer 10 is the display screen (or display panel) 20, which includes an OLED light-emitting layer, thin-film transistor (TFT) circuitry, and upper and lower encapsulation layers, serving a light-emitting function. Below the display screen 20 is the middle frame 30. A support layer such as copper foil can be placed between the middle frame 30 and the display screen 20. The middle frame 30 and the back cover 40 together form an accommodating space.

[0083] Figure 1D is a simplified diagram of a display module provided in an embodiment of this application, and Figure 1E is a cross-sectional view along the A1-A2 direction in Figure 1A provided in an embodiment of this application.

[0084] The structure of foldable electronic devices is relatively complex. The structure above the mid-frame 30 can be understood as the display module provided in this application embodiment, as shown in Figure 1D. The display module 2 can be simplified to include a five-layer structure. The outermost layer is the display surface layer, located on the outermost side of the display screen 20, which can protect the reliability of the screen. Below the display surface layer is the cover plate layer, which plays a protective role. The screen protection layer 10 includes two layers: the display surface layer and the cover plate layer. Next to it is the display screen 20. The backlight surface of the display screen 20 is provided with a support layer 50 and a bamboo book 60, as shown in Figure 1E. The main layers are adhered by optically clear adhesive (OCA).

[0085] As shown in Figure 1E, the light-emitting side of the display screen 20 may also be provided with a polarizer (POL) or a polyethylene terephthalate (PET) layer. The backlight side of the display screen 20 may also be provided with one or more planarization layers (buffer, BF), and the material of the support layer 50 may include, for example, polyimide (PI).

[0086] The bamboo book 60 has a second frame 302 in the middle frame 30 located below it. The bamboo book 60 and the middle frame 30 can be bonded together, for example, by OCA. The second housing 402 and the second frame 302 cover each other to form a receiving space, in which the battery is located.

[0087] Because the foldable display screen 20 needs to be bendable, the material of the cover plate on the light-emitting side of the display screen 20 must be changed from glass to a foldable and flexible material. In existing electronic devices, the reliability of the foldable display screen 20 cannot compare to that of a candybar phone. When the display screen 20 is subjected to impacts such as drops or bumps from protrusions, because the screen surface is mostly composed of polymers, the display screen 20 is prone to failure such as black spots and bright spots. Therefore, the reliability of the display screen 20 in foldable electronic devices is not as good as that in candybar electronic devices. At the same time, because the foldable display screen 20 needs to be bendable, after changing the cover plate from glass to a polymer material, the thickness of the entire display module 2 cannot be too thin. If the display module 2 is too thin, not only will the reliability of the entire display module (e.g., the risk of screen warping due to impacts, compression, and drops) be compromised, but the precision of the display module 2 (e.g., large-area light and shadow and creases) will also be a challenge. In addition, in order to achieve the reliability and bendability of the foldable display screen 20, a multi-layer design is often used in the display surface layer and the cover layer to achieve multi-layer neutral bendability under small-angle bending.

[0088] However, the cover layer in the folding electronic device 1 is different from the glass cover in the straight electronic device 1. The glass cover is stronger, harder and more wear-resistant. The cover layer in the folding electronic device 1 is mainly made of PET film and transparent polyimide (CPI) film for protection. After the display screen 20 is impacted, it cannot absorb or dissipate enough energy like the cover glass in the straight electronic device 1, and its protective performance is poor.

[0089] Figure 1F is a cross-sectional view of a display screen provided in an embodiment of this application, and Figure 1G is an enlarged view of Figure 1F at point A.

[0090] As shown in Figure 1F, the display screen 20 typically includes an array substrate 204, a light-emitting device layer 205, and an encapsulation layer 206.

[0091] For example, the array substrate 204 may specifically include a substrate (or backplane, BP) 111 formed of PI material, and a plurality of inorganic insulating layers 123 and a plurality of metal layers 124 located on one side of the substrate 111. The plurality of inorganic insulating layers 123 and the plurality of metal layers 124 are used to form electronic devices such as TFTs and capacitors.

[0092] The light-emitting device layer 205 may specifically include an anode 113, a light-emitting layer 114, and a cathode 115 stacked together. When driving the electronic device to emit light, the electronic devices in the array layer 112 transmit driving current to the anode 113, and electrons and holes are injected into the light-emitting layer 114 respectively to perform recombination and light emission. Of course, the light-emitting device layer 205 may also include a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, etc., as shown in Figure 1F.

[0093] The encapsulation layer 206 may specifically include a first inorganic encapsulation layer 120, an organic encapsulation layer 121, and a second inorganic encapsulation layer 122 stacked together. The encapsulation layer 206 is used to prevent external water and oxygen from penetrating and to protect the light-emitting devices and electronic devices inside the electronic device.

[0094] The array substrate 204 and the encapsulation layer 206 include multiple inorganic layers. Inorganic materials have poorer bending resistance compared to organic materials. Even with the subsequent use of organic encapsulation technology, bending resistance is only slightly improved, and there is still a gap compared to thick glass encapsulation.

[0095] When electronic device 1 is bent or subjected to external force, the substrate 111 is relatively thick and lacks effective patterning, so the stress on the array substrate 204 cannot be released. When the stress accumulates and exceeds the cracking threshold of the substrate 111, inorganic insulating layer 123, and encapsulation layer 206, film cracking will occur, making it difficult to ensure the impact resistance and bending reliability of electronic device 1. Moreover, as shown in Figure 1G, cracking of inorganic insulating layer 123 will further cause breakage of the metal layer 124 adjacent to inorganic insulating layer 123, resulting in poor display phenomena such as bright spots, bright lines, cracking, and detachment of electronic device 1.

[0096] In summary, employing this multi-layered design to protect the display screen 20 not only introduces design complexity but also presents challenges to manufacturability and the supply chain. Therefore, the structure, thickness, reliability, and precision of the films on both sides of the display screen 20 remain areas that require further improvement for the flexible electronic device 1.

[0097] Based on this, this application provides a stacked structure as a screen protection layer 10 on the light-emitting side of the display screen 20, which is applied to the above-mentioned electronic device 1. The stacked structure has certain improvements in reliability and thickness.

[0098] Figure 2 is a cross-sectional view of a stacked structure provided in an embodiment of this application.

[0099] As shown in Figure 2, the laminated structure 90 includes a protective layer 91 and a first impact-resistant layer 92, and the protective layer 91 and the first impact-resistant layer 92 are connected.

[0100] The protective layer 91 has a high elastic modulus and serves as an explosion-proof protective layer. After the laminated structure 90 is applied to the electronic device 1, the protective layer 91 is located on the surface of the display side of the electronic device 1 and can be directly touched.

[0101] The material of the protective layer 91 may include, for example, explosion-proof materials, energy-absorbing and impact-resistant materials, polymer materials, etc. For example, the modulus of the protective layer 91 is 10 mPa-20 GPa. For instance, the material of the protective layer 91 includes PET, CPI, glass fiber, CPI composite materials, etc.

[0102] The first impact-resistant layer 92 is located on one side of the protective layer 91. When the laminated structure 90 is applied to the electronic device 1, the first impact-resistant layer 92 is located on the side of the protective layer 91 facing the display screen 20.

[0103] The elastic modulus of the first impact-resistant layer 92 is less than that of the protective layer 91, the hardness of the first impact-resistant layer 92 is greater than that of the protective layer 91, and / or the stiffness of the first impact-resistant layer 92 is greater than that of the protective layer 91. The protective layer 91 serves as an explosion-proof protection layer, while the first impact-resistant layer 92 enhances the reliability of the laminated structure 90.

[0104] For example, the material of the first impact-resistant layer 92 includes ultra-thin glass (UTG) or high-entropy glass. UTG and high-entropy glass have good elasticity and recoverability, and the recoverability of creases is also greatly improved by using this minimalist architecture of multiple UTG or high-entropy glass.

[0105] The laminated structure 90 provided in this embodiment combines a high-hardness and / or high-rigidity first impact-resistant layer 92 with a high-elasticity protective layer 91. This combination of the extrusion resistance of the high-hardness and / or high-rigidity material with the impact resistance of the high-elasticity material enhances the impact resistance, scratch resistance, extrusion resistance, and bending resistance of the laminated structure 90. It also improves the refinement of creases and large-area light and shadow effects, thereby increasing the reliability and refinement of the laminated structure 90. Furthermore, the connection between the first impact-resistant layer 92 and the protective layer 91 facilitates a thinner design of the laminated structure 90, reducing opening and closing resistance during bending and further improving its reliability and refinement. Moreover, the laminated structure 90 can be directly and independently disposed on the light-emitting side of the display screen 20, merging the display surface layer and the cover layer into one, simplifying the architecture of the electronic device 1.

[0106] In some embodiments, the protective layer 91 and the first impact-resistant layer 92 are bonded together to achieve a chemical bond.

[0107] For example, the material of the protective layer 91 includes CPI, and the material of the first impact-resistant layer 92 includes UTG, wherein the siloxane in the CPI and the silanol in the UTG undergo a cross-linking chemical reaction.

[0108] For example, the surface of the first impact-resistant layer 92 facing the protective layer 91 is planar, and the first impact-resistant layer 92 is chemically bonded to the protective layer 91. Of course, the surface of the first impact-resistant layer 92 facing away from the protective layer 91 can be planar or other shaped surfaces, and this application embodiment does not limit this.

[0109] The first impact-resistant layer 92 and the protective layer 91 are designed as a composite laminated structure. No additional connecting layer is needed between the first impact-resistant layer 92 and the protective layer 91, which is conducive to the thin design of the laminated structure 90, reduces the opening and closing resistance during bending, and further improves the reliability and sophistication of the laminated structure 90.

[0110] Figures 3A-3C are cross-sectional views of a laminated structure provided in an embodiment of this application.

[0111] In some embodiments, as shown in FIG3A, the stacked structure 90 further includes a first connecting layer 93, which is bonded between the protective layer 91 and the first impact-resistant layer 92.

[0112] For example, the material of the first connecting layer 93 includes an energy-absorbing and impact-resistant material, such as a non-Newtonian fluid material. The material of the protective layer 91 includes CPI, and the material of the first impact-resistant layer 92 includes UTG. The first connecting layer 93 is chemically bonded to the protective layer 91 and the first impact-resistant layer 92, respectively.

[0113] For example, the empty orbitals of boron (B) atoms in the non-Newtonian fluid material form coordinate bonds with the excess electron pairs on the hydroxyl oxygen atoms on the UTG layer surface to achieve chemical bonding between the first connecting layer 93 and the first impact-resistant layer 92. Epoxy groups or polyesters in the non-Newtonian fluid material form coordinate bonds with epoxy groups in the CPI layer to achieve chemical bonding between the first connecting layer 93 and the protective layer 91.

[0114] In one implementation, the first connecting layer 93 may cover the top surface of the first impact-resistant layer 92 facing the protective layer 91 and be bonded to the top surface of the first impact-resistant layer 92.

[0115] In another implementation, as shown in Figure 3A, the first connecting layer 93 can cover the top and side surfaces of the first impact-resistant layer 92 and is bonded to both the top and side surfaces of the first impact-resistant layer 92.

[0116] In another implementation, as shown in Figure 3B, the first connecting layer 93 can cover the top surface, side surface and bottom surface away from the protective layer 91 of the first impact-resistant layer 92, and is bonded to the surface of the first impact-resistant layer 92.

[0117] For example, as shown in Figure 3A, the top surface of the first impact-resistant layer 92 facing the protective layer 91 and the bottom surface away from the protective layer 91 are both planar.

[0118] Alternatively, as shown in Figure 3C, the top surface of the first impact-resistant layer 92 facing the protective layer 91 has a groove, while the bottom surface facing away from the protective layer 91 is flat.

[0119] Alternatively, as shown in Figure 3B, the first impact-resistant layer 92 has grooves on both its top surface facing the protective layer 91 and its bottom surface away from the protective layer 91.

[0120] For example, the grooves on the first impact-resistant layer 92 can be filled with a non-Newtonian fluid layer 92. Alternatively, the grooves on the first impact-resistant layer 92 can be filled with a separate filler adhesive or similar material. In this case, the film thickness of the first impact-resistant layer 92 at the groove location is less than the film thickness of the first impact-resistant layer 92 at other locations. The shape of the grooves is not limited in this application embodiment; rectangular grooves, arc-shaped grooves, trapezoidal grooves, etc., are all applicable.

[0121] By providing grooves on the first impact-resistant layer 92, the thickness of the middle region of the first impact-resistant layer 92 is reduced, so that the first impact-resistant layer 92 has bending performance while ensuring reliability, thereby reducing the risk of the first impact-resistant layer 92 breaking.

[0122] In some embodiments, the thickness of the first impact-resistant layer 92 is equal at non-groove locations. For example, the first impact-resistant layer 92 is a film structure with equal thickness on both sides and thinning in the middle. This reduces the difficulty of fabricating the first impact-resistant layer 92.

[0123] In some embodiments, the dimension at the thinnest point of the first impact-resistant layer 92 is less than or equal to 50 μm. Alternatively, it can be understood that the dimension at the point closest to the bottom surface on the top surface of the first impact-resistant layer 92 is less than or equal to 50 μm.

[0124] The thickness of the first impact-resistant layer 92 can be selected by combining reliability and rebound force. For example, the size of the thinnest part of the first impact-resistant layer 92 can be 50um, 45um, 40um, 35um, 30um, 25um, 20um, 15um, 10um, 8um, 7um, 5um, 4um or 3um, etc.

[0125] For example, the top and bottom surfaces of the first impact-resistant layer 92 are both planar, the first impact-resistant layer 92 is a flat plate structure, and the thickness of the first impact-resistant layer 92 at each location is approximately less than or equal to 50 μm.

[0126] Alternatively, for example, the top and / or bottom surfaces of the first impact-resistant layer 92 have grooves. Depending on the groove structure, the thickness at the groove locations can be equal or unequal, but the thickness at the groove locations is less than the thickness at the non-grooved locations. For example, the thinnest dimension at the groove locations is less than or equal to 50 μm, and the thickness at the non-grooved locations can be, for example, less than or equal to 500 μm. The thickness at the non-grooved locations can be, for example, 500 μm, 450 μm, 400 μm, 350 μm, 300 μm, 250 μm, 200 μm, 150 μm, 100 μm, or 50 μm, etc.

[0127] For example, the thickness of the first impact-resistant layer 92 on both sides is 100 μm, and the thickness of the central groove region is 50 μm. Or, for example, the thickness of the first impact-resistant layer 92 on both sides is 40 μm, and the thickness of the central groove region is 25 μm.

[0128] The protective layer 91 and the first impact-resistant layer 92 are chemically bonded by the first connecting layer 93, which provides a high degree of reliability. Furthermore, the first connecting layer 93 can be made relatively thin, minimizing its impact on the performance of the first impact-resistant layer 92.

[0129] Figures 4A-4C are cross-sectional views of a laminated structure provided in an embodiment of this application.

[0130] In some embodiments, as shown in FIG4A, the laminated structure 90 further includes a second impact-resistant layer 94, which is located on the side of the first impact-resistant layer 92 away from the protective layer 91. A first connecting layer 93 covers the surface of the first impact-resistant layer 92 away from the protective layer 91, and the second impact-resistant layer 94 is bonded to the first connecting layer 93.

[0131] That is, the first connecting layer 93 connects the protective layer 91 and the first impact-resistant layer 92, and also connects the first impact-resistant layer 92 and the second impact-resistant layer 94.

[0132] The laminated structure 90 may include multiple impact-resistant layers. By reducing the thickness of each impact-resistant layer, multiple impact-resistant layers are provided, ensuring that the overall stiffness and hardness of the multiple impact-resistant layers remain unchanged, while the elastic modulus of the multiple impact-resistant layers can be increased, thereby further improving the impact resistance, scratch resistance, extrusion resistance, and bending resistance of the laminated structure 90. Moreover, the multiple impact-resistant layers can be directly bonded together through the first connecting layer 93, which simplifies the laminated structure 90.

[0133] In some other embodiments, as shown in FIG4B, the laminated structure 90 further includes a second impact-resistant layer 94 and a second connecting layer 95. The second impact-resistant layer 94 is located on the side of the first impact-resistant layer 92 away from the protective layer 91, and the second connecting layer 95 is located between the first impact-resistant layer 92 and the second impact-resistant layer 94. The first impact-resistant layer 92 and the second impact-resistant layer 94 are connected by the second connecting layer 95.

[0134] The materials and structure of the second impact-resistant layer 94 can be referred to the above description of the materials and structure of the first impact-resistant layer 92, and will not be repeated here.

[0135] Regarding the material of the second connecting layer 95, in some embodiments, the material of the second connecting layer 95 includes an adhesive material, and the second connecting layer 95 is bonded to the first impact-resistant layer 92 and the second impact-resistant layer 94 respectively.

[0136] The adhesive material includes optically transparent adhesives such as OCA. The first impact-resistant layer 92 and the second impact-resistant layer 94 are connected by the adhesive material. The technology is mature and easy to implement.

[0137] In other embodiments, the material of the second connecting layer 95 includes a polymer material, and the second connecting layer 95 is bonded to the first impact-resistant layer 92 and the second impact-resistant layer 94.

[0138] Polymer materials, such as PET, CPI, glass fiber, and CPI composite materials, are used to chemically bond the first impact-resistant layer 92 and the second impact-resistant layer 94, resulting in a good bonding effect, and the thickness of the second connecting layer 95 can be made relatively thin.

[0139] In some other embodiments, the material of the second connecting layer 95 includes an energy-absorbing and impact-resistant material, and the second connecting layer 95 is bonded to the first impact-resistant layer 92 and the second impact-resistant layer 94.

[0140] Energy-absorbing and impact-resistant materials include, for example, non-Newtonian fluid materials. In this case, the structural relationship between the second connecting layer 95, the first impact-resistant layer 92, and the second impact-resistant layer 94 can be referred to the above description of the structural relationship between the first connecting layer 93 and the first impact-resistant layer 92, and will not be repeated here.

[0141] In this embodiment, the multi-layer impact-resistant layers can also be connected by various methods such as chemical bonding or adhesive bonding, which has a wide range of applications.

[0142] In some embodiments, the thickness of the stacked structure 90 is less than or equal to 600 μm. For example, the thickness of the stacked structure 90 is 600 μm, 550 μm, 500 μm, 450 μm, 400 μm, 350 μm, 300 μm, 250 μm, 200 μm, or 150 μm.

[0143] The stacked structure 90 provided in this application embodiment can be made relatively thin while meeting reliability requirements, thus meeting the need for a thinner and lighter electronic device 1.

[0144] In some embodiments, as shown in FIG4C, the laminated structure 90 further includes a third connecting layer 97 and a third impact-resistant layer 98 disposed sequentially on the side of the second impact-resistant layer 94 away from the second connecting layer 95.

[0145] The third connecting layer 97 can refer to the above description of the second connecting layer 95, and the third impact-resistant layer 98 can refer to the above description of the first impact-resistant layer 92, which will not be repeated here. Of course, the laminated structure 90 may also include multiple alternating connecting layers and impact-resistant layers.

[0146] When the laminated structure 90 includes multiple impact-resistant layers, the thickness of the multiple impact-resistant layers is not limited to be the same, and the structure of the multiple impact-resistant layers is not limited to be the same. It can be set according to the adaptability of the product structure.

[0147] By reducing the thickness of each impact-resistant layer and setting multiple impact-resistant layers, the overall stiffness and hardness of the multiple impact-resistant layers remain unchanged, but the elastic modulus of the multiple impact-resistant layers can be increased, thereby further improving the impact resistance, scratch resistance, extrusion resistance and bending resistance of the laminated structure 90.

[0148] In some embodiments, the side of the laminated structure 90 is perpendicular to the protective layer 91. Approximate perpendicularity within the range of process tolerances is considered perpendicularity in the embodiments of this application. For example, angles within the range of 90° ± 10° are considered perpendicularity between the side and the protective layer 91 in the embodiments of this application.

[0149] The side of the laminated structure 90 is perpendicular to the protective layer 91, which makes the strength of the laminated structure 90 more uniform at all positions. The protective strength of the laminated structure 90 at all positions of the display screen 20 is almost the same, which improves the problem of poor protection effect at the edge of the display screen 20.

[0150] Figure 5 is a cross-sectional view of a stacked structure provided in an embodiment of this application.

[0151] In some embodiments, as shown in FIG5, the laminated structure 90 further includes a protective layer 91, a first impact-resistant layer 92, a first connecting layer 93, a second connecting layer 95, and a second impact-resistant layer 94. The first connecting layer 93 is an adhesive layer bonded between the protective layer 91 and the first impact-resistant layer 92, and the second connecting layer 95 is bonded between the first impact-resistant layer 92 and the second impact-resistant layer 94.

[0152] The structures of the protective layer 91, the first impact-resistant layer 92, the second connecting layer 95, and the second impact-resistant layer 94 can be referred to the above descriptions, and will not be repeated here.

[0153] The material of the first connecting layer 93 includes, for example, transparent adhesives such as OCA. In this embodiment, the protective layer 91 and the first impact-resistant layer 92 can also be connected using adhesives to meet various application requirements.

[0154] Figure 6A is a cross-sectional view of a display module provided in an embodiment of this application, and Figure 6B is a simplified view of a display module provided in an embodiment of this application.

[0155] This application provides a display module, as shown in FIG6A. The display module includes any of the above-mentioned stacked structures 90 and a display screen 20. The stacked structure 90 is disposed on the display screen 20, and the light-emitting surface of the display screen 20 faces the second impact-resistant layer 94.

[0156] For example, the display module also includes a third adhesive layer 993, which is located between the laminated structure 90 and the display screen 20, with the laminated structure 90 and the display screen 20 connected to its two sides respectively.

[0157] The laminated structure 90 and the display screen 20 are directly bonded together by the third adhesive layer 993. No other film layer is required between them, which simplifies the structure of the display module, reduces the gap between the display screen 20 and the laminated structure 90, and thus reduces the overall size of the display module.

[0158] In some embodiments, as shown in FIG6A, the display module further includes a first adhesive layer 991, a planarization layer BF, a second adhesive layer 992, and a bamboo book 60 sequentially disposed on the backlight surface of the display screen 20. The planarization layer BF is connected to the display screen 20 through the first adhesive layer 991, and the bamboo book 60 is connected to the planarization layer BF through the second adhesive layer 992.

[0159] The backlight surface of the display 20 no longer has a support layer 50, which can further simplify the architecture of the display module, reduce the thickness of the display module, and achieve a minimalist and thin display module.

[0160] In some embodiments, the elastic modulus of the bamboo book 60 is greater than or equal to 10 GPa. For example, the elastic modulus of the bamboo book 60 can be 10 GPa, 50 GPa, 100 GPa, 150 GPa, 200 GPa, 250 GPa, 300 GPa, 350 GPa, 400 GPa, 450 GPa, 500 GPa, 550 GPa, 600 GPa, 650 GPa, 700 GPa, 750 GPa, 800 GPa, 850 GPa, 900 GPa, 950 GPa, 1000 GPa, 1500 GPa, etc.

[0161] For example, Bamboo Book 60 is made of materials including carbon fiber, graphite fiber, pitch-based materials, high-entropy alloys, stainless steel, titanium alloys, composites of pitch-based materials and metals (such as aluminum, titanium, steel, etc.), and composites of carbon fiber and metals.

[0162] By selecting a material with a high modulus of elasticity for the Bamboo Book 60, its impact resistance can be improved, and the refinement of creases and large-area light and shadow can be enhanced, thereby improving the reliability and refinement of the display module while simplifying the display module architecture.

[0163] In some embodiments, the bamboo book 60 includes a first part and a second part, with the second part respectively disposed on opposite sides of the first part. The elastic modulus of the first part is smaller than that of the second part. That is, the elastic modulus of the middle part of the bamboo book 60 is smaller than that of the two side parts. For example, the first part corresponds to the position of the foldable display section 203 of the display screen 20.

[0164] By reducing the elasticity of the middle section of the Bamboo Book 60, the bendability of the middle bending area can be ensured, further improving the performance of the display module.

[0165] For example, the first and second parts of the bamboo book 60 are made of the same material, but their structures are different to achieve a lower elastic modulus in the first part than in the second part. Using the same material for all parts of the bamboo book 60 reduces the variety of materials used in its construction.

[0166] Alternatively, for example, the first and second parts of the bamboo book 60 are made of different materials to achieve a lower elastic modulus in the first part compared to the second part. Using different materials at different modulus locations in the bamboo book 60 can improve its machinability.

[0167] In some embodiments, as shown in FIG6A, the projection of the stacked structure 90 on the planarization layer BF covers the projection of the display screen 20 on the planarization layer BF.

[0168] The stacked structure 90 can protect the display screen 20, improve the problem of easy damage in the weak area of ​​edge compression, and further improve the reliability of the display module.

[0169] As shown in Figure 6B, the display module can be simplified to include a stacked structure 90, a display screen 20, and a bamboo book 60. A support layer may not be provided between the bamboo book 60 and the display screen 20.

[0170] Figures 7A-7C are assembly diagrams of an electronic device provided in an embodiment of this application.

[0171] In some embodiments, as shown in FIG7A, the electronic device 1 provided in this application embodiment further includes a frame, which is located around the display screen 20 and extends above the stacked structure 90 to overlap with the stacked structure 90.

[0172] The bezel, also known as the "small A-shell," is one of the important components of the foldable electronic device 1. Because the display screen 20 will shift when bent, a horizontal gap must be maintained between the side wall of the middle frame 30 and the display screen 20. As shown in Figure 7B, during the assembly of the electronic device, the stack formed by the cover plate, display screen 20, support layer 50, and bamboo book 60 is first placed on the middle frame 30. Then, the bezel is placed between the middle frame 30 and the display screen 20, overlapping the surface of the cover plate. The bezel serves two purposes: firstly, to conceal the gap between the display screen 20 and the middle frame 30, and secondly, to provide some protection against pressure on the edges of the electronic device 1. Subsequently, the display surface layer is placed on the surface of the cover plate. To absorb assembly tolerances, a gap exists between the display surface layer and the bezel, affecting the visual aesthetics.

[0173] As shown in Figure 7A, the assembly process of the electronic device 1 provided in this embodiment involves first placing the display module 2, including the stacked structure 90, the display screen 20, and the bamboo book 60, on the middle frame 30. The "minimalist" architecture allows for further thinning of the stacked structure, enabling the stacked structure 90 to cover the display screen 20. The stacked structure 90 provides some protection against pressure on the edges of the electronic device 1, mitigating the problem of bright lines caused by fingernail pressure on the edge areas. Then, the frame is placed between the middle frame 30 and the display screen 20, overlapping the surface of the stacked structure 90. This eliminates gaps between the frame and the stacked structure 90, improving aesthetics and reducing dust accumulation. Furthermore, the protection provided by the stacked structure 90 against the edges of the electronic device 1 reduces the need for frame protection, allowing for a narrower frame and a "narrow bezel" effect. Moreover, in the assembly process, since the stacked structure 90 integrates the display surface layer and the cover plate, there is no need to attach the display surface layer after assembling the frame, simplifying the assembly process of the electronic device 1.

[0174] In some embodiments, the width of the projection of the border onto the plane where the display module is located is less than or equal to 0.5 mm.

[0175] The width of the bezel can be understood as the dimension between the edge of the heavy bezel near the display module and the edge of the bezel near the middle frame. For example, the bezel width can be 0.5mm, 0.45mm, 0.4mm, 0.35mm, 0.3mm, 0.25mm, 0.2mm, 0.15mm, or 0.1mm.

[0176] Since the stacked structure 90 protects the edge of the electronic device 1 from pressure, a bezel is not required for protection; the bezel only needs to fill the gap between the display module and the middle frame 30. Therefore, the width of the bezel can be reduced.

[0177] In some embodiments, as shown in FIG7C, the electronic device 1 includes a mid-frame 30, and a display module is disposed on the mid-frame 30. For example, the side of the display module is disposed adjacent to the mid-frame 30. No border is provided between the display module and the mid-frame 30; the gap between the display module and the mid-frame 30 is sufficient to allow for misalignment when the display screen 20 is bent.

[0178] By not setting a border between the display module and the middle frame 30, the effect of a "narrow bezel" can be further achieved.

[0179] Figures 8A and 8B are cross-sectional views of an electronic device provided in an embodiment of this application.

[0180] As shown in Figure 8A, in some embodiments, the display screen 20 includes a first flat portion 21, a bent portion 22, and a second flat portion 23. The bent portion 22 is connected between the first flat portion 21 and the second flat portion 23. The first flat portion 21 is connected to the laminated structure 90, and the second flat portion 23 is located on the backlight side of the first flat portion 21. A bamboo book 60 is disposed between the first flat portion 21 and the second flat portion 23, and flat layers BF are disposed on the upper and lower sides of the bamboo book 60. The second flat portion 23 is connected to the middle frame 30 by adhesive backing.

[0181] The electronic device 1 also includes a module adhesive layer MCL, which covers the bent portion 22.

[0182] As shown in Figure 8B, when a display surface layer and a cover plate are provided above the display screen 20, a first cover plate and a second cover plate are usually provided above the display screen 20. The first cover plate and the second cover plate are bonded together by an adhesive layer, and the first cover plate is bonded to the display surface layer by an adhesive layer.

[0183] Because the pad bonding (PB) area of ​​electronic device 1 has a module coating layer (MCL), in order to prevent the second cover plate from contacting the module coating layer MCL when it bends or shifts, a certain gap is reserved between the second cover plate above the display screen 20 and the module coating layer MCL. Above this gap is only a thin first cover plate (CPI / PET), which is a weak area for edge extrusion. This will cause the nail-like extrusion failure problem in the pad bonding area PB.

[0184] As shown in Figure 8A, in the electronic device 1 of this application, the display screen 20 is directly connected to the stacked structure 90. Under the premise of ensuring the reliability of extrusion / impact, the "minimalist" architecture can eliminate the second cover plate, reduce the thickness of the module adhesive layer MCL, and further reduce the thickness of the stack.

[0185] In some embodiments, the thickness of the module adhesive layer (MCL) is 90µm-50µm.

[0186] The thickness of the module adhesive layer (MCL) can be understood as the dimension between the surface of the module adhesive layer MCL facing the bending portion 22 and the surface of the module adhesive layer MCL away from the bending portion 22. The thickness of the module adhesive layer MCL at different locations can be equal or unequal. For example, the thickness of the module adhesive layer MCL can be 90um, 85um, 80um, 75um, 70um, 65um, 60um, 55um, or 50um.

[0187] In this embodiment, only a third adhesive layer 993 can be provided between the display screen 20 and the stacked structure 90. Therefore, the gap between the first planar portion 21 and the stacked structure 90 can be made relatively small, which can reduce the thickness of the electronic device 1. Furthermore, no support layer needs to be provided between the first planar portion 21 and the second planar portion 23, which can reduce the thickness of the module adhesive layer MCL and further achieve the effect of "narrow bezel".

[0188] In some embodiments, the laminated structure 90 covers the display screen 20. When the display screen 20 includes a bend 22, since the bend 22 and the second planar portion 23 do not perform display functions, the laminated structure 90 covering the display screen 20 can be understood as the laminated structure 90 covering the first planar portion 21.

[0189] In this embodiment, the stacked structure 90 can protect the edge compression weak area and the pad bonding area PB located below it, thereby improving the edge reliability of the electronic device 1.

[0190] Figure 9 is a schematic diagram of the preparation process of an impact-resistant layer provided in an embodiment of this application.

[0191] This application embodiment also provides a method for preparing an impact-resistant layer, as shown in Figure 9. The preparation method includes:

[0192] S1. Provide raw glass sheets.

[0193] For example, you can choose glass raw materials of 150um-400um and cut them into glass sheets of 4 inches-20 inches according to product requirements.

[0194] S2. The glass sheet is placed in a hot casting jig with protrusions on the inner surface for hot casting to form a glass sheet with grooves on the surface.

[0195] Figure 9 illustrates a glass sheet with a groove on one surface as an example. After hot casting, two glass sheets with grooves on their surfaces can also be formed. Depending on the requirements of the target product, the hot casting step can be performed once or multiple times. Figure 9 illustrates an example of performing two hot casting steps.

[0196] For example, the hot casting temperature is greater than or equal to the softening temperature of the glass, such as 600℃-1000℃. The inner surface of the hot casting fixture can be understood as the surface of the hot casting fixture facing the original glass sheet.

[0197] S3. Trim the glass sheet to the target size to form an impact-resistant layer; the upper and / or lower surfaces of the impact-resistant layer have grooves.

[0198] For example, step S3 includes: trimming the length and width of the glass sheet using laser processing or a computer numerical control (CNC) machine tool, and trimming the thickness of the glass sheet using an etching process. The thickness direction of the glass sheet is, for example, the direction from the surface with the groove to the opposite surface.

[0199] Etching processes can employ double-sided etching to accelerate the etching speed. Alternatively, single-sided etching can also be used. The etching solution used can include, for example, a mixture of acids such as hydrofluoric acid, sulfuric acid, and nitric acid. After the target thickness is reduced, further steps such as cleaning, edge treatment, and strengthening can be performed to ultimately form an impact-resistant layer of varying thickness.

[0200] In some embodiments, before or after trimming the glass sheet to the target size, the preparation method further includes polishing the glass sheet to improve the optical performance of the impact-resistant layer.

[0201] The impact-resistant layer formed by the hot casting process in this embodiment can improve the processing efficiency and machinability of impact-resistant layers with varying thicknesses, and can be mass-produced.

[0202] This application provides an impact-resistant layer applied to the aforementioned electronic device 1. The impact-resistant layer has opposing first and second surfaces, one of which faces the protective layer 91, and the other is a surface facing away from the protective layer 91. The first and / or second surfaces have grooves.

[0203] The impact-resistant layer may be, for example, the first impact-resistant layer 92 or the second impact-resistant layer 94 mentioned above.

[0204] This application also provides a hot casting fixture for preparing the aforementioned impact-resistant layer. The hot casting fixture includes a first component and a second component, wherein, in an application state, the surface of the first component facing the second component has a protrusion, and / or, the surface of the second component facing the first component has a protrusion.

[0205] The materials of the first and second components include, for example, graphite and stainless steel. The first and second components are paired to form a master-slave mold. If the impact-resistant layer to be formed has a groove on only one surface, then the surface of either the first or second component has a protrusion facing the glass sheet. If the two opposite surfaces of the impact-resistant layer to be formed have grooves, then both the first and second components have protrusions facing the glass sheet. The width and height of the protrusions are related to the size of the groove to be formed, and the width and height of the protrusions are selected according to the design of enlarging unequal thickness areas based on the glass sheet's coefficient of thermal expansion.

[0206] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A layered structure, characterized in that, The stacked structure is disposed on the display screen, and the stacked structure includes: Protective layer; A first impact-resistant layer is located on one side of the protective layer and connected to the protective layer; the elastic modulus of the first impact-resistant layer is less than that of the protective layer, the hardness of the first impact-resistant layer is greater than that of the protective layer, and / or the stiffness of the first impact-resistant layer is greater than that of the protective layer.

2. The stacked structure according to claim 1, characterized in that, The protective layer is bonded to the first impact-resistant layer.

3. The stacked structure according to claim 1, characterized in that, The stacked structure further includes a first connecting layer, which is bonded between the protective layer and the first impact-resistant layer.

4. The stacked structure according to claim 3, characterized in that, The laminated structure further includes a second impact-resistant layer; the second impact-resistant layer is located on the side of the first impact-resistant layer away from the protective layer; The first connecting layer covers the surface of the first impact-resistant layer away from the protective layer, and the second impact-resistant layer is bonded to the first connecting layer.

5. The laminated structure according to any one of claims 1-3, characterized in that, The laminated structure further includes a second impact-resistant layer and a second connecting layer; the second impact-resistant layer is located on the side of the first impact-resistant layer away from the protective layer, and the second connecting layer connects the first impact-resistant layer and the second impact-resistant layer.

6. The laminated structure according to any one of claims 1-5, characterized in that, The material of the first impact-resistant layer includes ultra-thin flexible glass or high-entropy glass.

7. The laminated structure according to any one of claims 1-6, characterized in that, The material of the first connecting layer includes an energy-absorbing and impact-resistant material.

8. The laminated structure according to any one of claims 1-7, characterized in that, The protective layer is made of materials including polyethylene terephthalate, transparent polyimide, or glass fiber.

9. The laminated structure according to any one of claims 5-8, characterized in that, The material of the second connecting layer includes a polymer material or an energy-absorbing and impact-resistant material, and the second connecting layer is bonded to the first impact-resistant layer and the second impact-resistant layer, respectively.

10. The laminated structure according to any one of claims 5-9, characterized in that, The material of the second connecting layer includes an adhesive material, and the second connecting layer is bonded to the first impact-resistant layer and the second impact-resistant layer, respectively.

11. The laminated structure according to any one of claims 1-10, characterized in that, The first impact-resistant layer has grooves on its surface facing the protective layer and / or on its surface away from the protective layer.

12. The laminated structure according to any one of claims 1-11, characterized in that, The dimension at the thinnest point of the first impact-resistant layer is less than or equal to 50 μm.

13. The laminated structure according to any one of claims 1-12, characterized in that, The thickness of the stacked structure is less than or equal to 600 μm.

14. The laminated structure according to any one of claims 1-13, characterized in that, The side of the laminated structure is perpendicular to the protective layer.

15. A layered structure, characterized in that, The stacked structure is disposed on the display screen, and the stacked structure includes: Protective layer; A first connecting layer is bonded between the protective layer and the first impact-resistant layer; A first impact-resistant layer is located on one side of the protective layer; the elastic modulus of the first impact-resistant layer is less than that of the protective layer, the hardness of the first impact-resistant layer is greater than that of the protective layer, and / or the stiffness of the first impact-resistant layer is greater than that of the protective layer. The second impact-resistant layer is located on the side of the first impact-resistant layer away from the protective layer; The second connecting layer is bonded between the first impact-resistant layer and the second impact-resistant layer.

16. A display module, characterized in that, The display module includes a display screen and a stacked structure, wherein the stacked structure includes the stacked structure according to any one of claims 1-15, and the stacked structure is disposed on the display screen.

17. The display module according to claim 16, characterized in that, The display module further includes a first adhesive layer, a planarization layer, a second adhesive layer, and a bamboo book sequentially disposed on the backlight surface of the display screen; the planarization layer is connected to the display screen through the first adhesive layer, and the bamboo book is connected to the planarization layer through the second adhesive layer.

18. The display module according to claim 17, characterized in that, The elastic modulus of the bamboo book is greater than or equal to 10 GPa.

19. The display module according to claim 17 or 18, characterized in that, The bamboo book includes a first part and a second part, with the second part respectively disposed on opposite sides of the first part, and the elastic modulus of the first part being less than that of the second part.

20. The display module according to any one of claims 17-19, characterized in that, The materials used in the bamboo book include carbon fiber, graphite fiber, pitch-based materials, high-entropy alloys, stainless steel, titanium alloys, composite materials of pitch-based materials and metals, and composite materials of carbon fiber and metals.

21. The display module according to any one of claims 17-20, characterized in that, The projection of the stacked structure onto the flat layer covers the projection of the display screen onto the flat layer.

22. The display module according to any one of claims 16-21, characterized in that, The display module further includes a third adhesive layer, on both sides of which the stacked structure and the display screen are respectively connected.

23. The display module according to any one of claims 16-22, characterized in that, The display screen includes a first planar portion, a bent portion, and a second planar portion. The bent portion is connected between the first planar portion and the second planar portion. The first planar portion is connected to the stacked structure, and the second planar portion is located on the backlight side of the first planar portion. The display module also includes a module adhesive layer, which covers the bent portion, and the thickness of the module adhesive layer is 50um-90um.

24. An electronic device, characterized in that, The electronic device includes a display module and a mid-frame, wherein the display module is disposed on the mid-frame; the display module includes the display module according to any one of claims 16-23.

25. The electronic device according to claim 24, characterized in that, The electronic device also includes a frame, which is located around the display module and extends above the stacked structure to overlap with it.

26. The electronic device according to claim 25, characterized in that, The width of the projection of the border onto the plane where the display module is located is less than or equal to 0.5 mm.

27. The electronic device according to any one of claims 24-26, characterized in that, The side of the display module is disposed adjacent to the middle frame.

28. The electronic device according to any one of claims 24-27, characterized in that, The electronic device also includes a rear cover, which includes a first housing, a second housing, and a pivot mechanism, with the first housing and the second housing disposed on both sides of the pivot mechanism; The first housing and the second housing move toward each other or away from each other via the rotating shaft mechanism, so that the display module can switch between a flattened state and a closed state.

29. A method for preparing an impact-resistant layer, characterized in that, include: Provide raw glass sheets; The original glass sheet is placed in a hot casting jig with protrusions on the inner surface for hot casting to form a glass sheet with grooves on the surface; The glass sheet is trimmed to the target size to form an impact-resistant layer; the upper and / or lower surfaces of the impact-resistant layer have grooves.

30. The preparation method according to claim 29, characterized in that, Before or after trimming the glass sheet to the target size, the preparation method further includes polishing the glass sheet.

31. The preparation method according to claim 29 or 30, characterized in that, Trimming the glass sheet to the target size includes: The length and width of the glass sheet are adjusted using laser or CNC machine tool processing; And / or, The thickness of the glass sheet is adjusted using an etching process.

32. The preparation method according to any one of claims 29-31, characterized in that, The hot casting temperature is 600℃-1000℃.

33. An impact-resistant layer, characterized in that, The impact-resistant layer is applied to an electronic device including a display screen; the impact-resistant layer has opposing first and second surfaces, the first surface and / or the second surface having grooves.

34. The impact-resistant layer according to claim 33, characterized in that, The impact-resistant layer is made of ultra-thin flexible glass or high-entropy glass.

35. The impact-resistant layer according to claim 33 or 34, characterized in that, The dimension at the thinnest point of the impact-resistant layer is less than or equal to 50 μm.

36. A hot casting fixture, characterized in that, include: A first component and a second component, wherein the surface of the first component facing the second component has a protrusion, and / or the surface of the second component facing the first component has a protrusion.

Images