Light-emitting device

Abstract

The objective is to improve the reliability of light-emitting devices. [Solution] A light-emitting device according to one embodiment of the present disclosure is a light-emitting device having a lead, a light-emitting element disposed on the lead, and a resin member holding the lead, wherein the lead has a first lead and a second lead spaced apart from the first lead, the first lead has a first upper surface, a first side surface located opposite to the side surface facing the second lead, and a first through-hole that penetrates from a first upper surface opening located spaced apart from the first side surface on the first upper surface to a first side surface opening located spaced apart from the first upper surface on the first side surface, and the resin member has a first filling portion disposed within the first through-hole and a covering portion continuous with the first filling portion and including a region covering the first side surface of the first lead.

Description

[Technical Field]

[0001] This disclosure relates to a light-emitting device. [Background technology]

[0002] Patent Document 1 discloses a light-emitting device comprising a lead frame for an optoelectronic semiconductor device having a recess on its surface side, and a light-reflective resin covering the recess. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2013-58739 [Overview of the project] [Problems that the invention aims to solve]

[0004] This disclosure aims to improve the reliability of light-emitting devices. [Means for solving the problem]

[0005] A light-emitting device according to one embodiment of the present disclosure is a light-emitting device comprising a lead, a light-emitting element disposed on the lead, and a resin member holding the lead, wherein the lead comprises a first lead and a second lead spaced apart from the first lead, the first lead having a first upper surface, a first side surface located opposite to the side surface facing the second lead, and a first through-hole penetrating from a first upper surface opening located spaced apart from the first side surface on the first upper surface to a first side surface opening located spaced apart from the first upper surface on the first side surface, and the resin member comprising a first filling portion disposed within the first through-hole and a covering portion continuous with the first filling portion and including a region covering the first side surface of the first lead. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, the reliability of the light-emitting device can be improved. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic top view showing a light-emitting device according to an embodiment. [Figure 2] This is a schematic cross-sectional view showing the light-emitting device along line II-II in Figure 1. [Figure 3] This is a schematic top view showing the leads of the light-emitting device. [Figure 4] Figure 1 is a schematic cross-sectional view showing the light-emitting device in the IV-IV line. [Figure 5] This is a schematic perspective view showing the leads of a light-emitting device. [Figure 6] This is a schematic cross-sectional view showing the light-emitting device along the VI-VI line in Figure 1. [Figure 7] This is a schematic top view showing another example of the leads of a light-emitting device. [Figure 8] This is a schematic top view showing the light-emitting device according to Modification Example 1. [Figure 9] Figure 8 is a schematic cross-sectional view showing the light-emitting device on the IX-IX line. [Figure 10] This is a schematic top view showing the light-emitting device according to the modified example 2. [Figure 11] Figure 10 is a schematic cross-sectional view showing the light-emitting device in the XI-XI line. [Modes for carrying out the invention]

[0008] The light-emitting device according to the embodiments of this disclosure will be described in detail below with reference to the drawings. However, the embodiments shown below are illustrative of light-emitting devices that embody the technical concept of the embodiments and are not limited thereto. Furthermore, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of this disclosure to those described therein, unless otherwise specified, but are merely illustrative examples. Note that the size, positional relationships, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. Also, in the following description, the same name and reference numerals indicate the same or similar members, and detailed explanations will be omitted as appropriate. In some cases, end view diagrams showing only the cross-section may be used as cross-sectional views.

[0009] In the diagrams shown below, directions may be indicated by the X, Y, and Z axes. The X, Y, and Z axes are mutually orthogonal. In the X-axis direction, the direction the arrow is pointing is denoted as the +X direction or +X side, and the opposite direction of the +X direction is denoted as the -X direction or -X side. In the Y-axis direction, the direction the arrow is pointing is denoted as the +Y direction or +Y side, and the opposite direction of the +Y direction is denoted as the -Y direction or -Y side. In the Z-axis direction, the direction the arrow is pointing is denoted as upward, the +Z direction, or the +Z side, and the opposite direction of the +Z direction is denoted as downward, the -Z direction, or -Z side.

[0010] In the terminology of the embodiments, "side view" means viewing the object from the +X direction, the +X side, the -X direction, the -X side, the +Y direction, the +Y side, the -Y direction, or the -Y side. In the terminology of the embodiments, "top view" means viewing the object from above, the +Z direction, or the +Z side. However, these do not restrict the orientation of the light-emitting device when it is in use, and the orientation of the light-emitting device is arbitrary. In the embodiments, the surface in the +Z direction (i.e., the surface of the object when viewed from above, the +Z direction, or the +Z side) is referred to as the "top surface," and the surface in the -Z direction (i.e., the surface of the object when viewed from below, the -Z direction, or the -Z side) is referred to as the "bottom surface." In the embodiments shown below, "parallel" includes the case where two lines, surfaces, etc., have an inclination within a range of ±5°. In the embodiments, "orthogonal" includes a difference of ±5° from 90°.

[0011] In the present disclosure, unless otherwise specified, with respect to polygons such as rectangles, shapes that have been processed with rounding, chamfering, corner cutting, etc. at the corners of the polygon are also included in the term "polygon". Also, not limited to the corners (i.e., the ends of the sides), shapes that have been processed in the middle part of the sides are also similarly referred to as polygons. That is, shapes that have been partially processed while leaving the polygon as a base are included in the interpretation of "polygon" described in the present disclosure.

[0012] The same applies not only to polygons but also to terms representing specific shapes such as trapezoids, circles, and concavities and convexities. The same also applies to terms related to each side forming the shape. That is, even if a side has been processed at a corner or in the middle part, the processed part is included in the interpretation of "side".

[0013] Also, "covering" includes not only the case of direct contact but also the case of indirectly covering, for example, through other members. Also, "arranging" includes not only the case of direct contact but also the case of indirectly arranging, for example, through other members.

[0014] [Embodiment] Referring to FIGS. 1 to 7, an example of the configuration of a light-emitting device 1 according to an embodiment will be described. FIG. 1 is a top view schematically showing the light-emitting device 1 according to the embodiment. FIG. 2 is a cross-sectional view schematically showing the light-emitting device 1 taken along the line II-II of FIG. 1. FIG. 3 is a top view schematically showing the lead 10 of the light-emitting device 1. FIG. 4 is a cross-sectional view schematically showing the light-emitting device 1 taken along the line IV-IV of FIG. 1. FIG. 5 is a perspective view schematically showing the lead 10 of the light-emitting device 1. FIG. 6 is a cross-sectional view schematically showing the light-emitting device 1 taken along the line VI-VI of FIG. 1. FIG. 7 is a top view schematically showing another example (lead 10A) of the lead 10 of the light-emitting device 1.

[0015] The light-emitting device 1 shown in Figures 1 to 6 includes a lead 10, a light-emitting element 20 arranged on the lead 10, and a resin member 30 that holds the lead 10. The lead 10 includes a first lead 110 and a second lead 120 spaced apart from the first lead 110. The first lead 110 has a first upper surface 110a, a first side surface 110c located opposite the side surface 110g facing the second lead 120, and a first through-hole 112 that penetrates from a first upper surface opening 112a located spaced apart from the first side surface 110c on the first upper surface 110a to a first side surface opening 112b located spaced apart from the first upper surface 110a on the first side surface 110c. The resin member 30 has a first filling portion 31a positioned within the first through hole 112, and a covering portion 32 (32a) that is continuous with the first filling portion 31a and includes a region that covers the first side surface 110c of the first lead 110.

[0016] In the case of the light-emitting device 1, by arranging the first filling portion 31a of the resin member 30 within the first through-hole 112, the contact area between the first lead 110 and the resin member 30 can be increased, thereby improving the adhesion between the first lead 110 and the resin member 30. As a result, the reliability of the light-emitting device 1 can be improved.

[0017] The following describes each component that makes up the light-emitting device 1.

[0018] <Lead 10> Lead 10 is a conductive component for supplying power to the light-emitting element 20. Lead 10 includes a first lead 110 and a second lead 120 spaced apart from the first lead 110.

[0019] In the example shown in Figure 3, the first lead 110 has a first portion extending in the Y-axis direction and a second portion connected to the +Y end of the first portion and extending in the +X direction. The second lead 120 has a third portion extending in the Y-axis direction and a fourth portion connected to the -Y end of the third portion and extending in the -X direction. The first and third portions are parallel to each other, and the second and fourth portions extend in directions parallel to each other.

[0020] Furthermore, the first lead 110 may consist only of the first part, without having a second part. Similarly, the second lead 120 may consist only of the third part, without having a fourth part. Also, if the first lead 110 has a second part, the second part may be connected to the +Y end of the first part and not extend to the +X side. That is, the width of the second part in the X-axis direction may be the same as the width of the first part in the X-axis direction. Similarly, if the second lead 120 has a fourth part, the fourth part may be connected to the -Y end of the third part and not extend to the -X side. That is, the width of the fourth part in the X-axis direction may be the same as the width of the first part in the X-axis direction.

[0021] The first lead 110 has a first upper surface 110a, a first lower surface 110b, a first side surface 110c, a second side surface 110d, and other sides 110e, 110f, 110g, and 110h. The first side surface 110c, the second side surface 110d, and the other sides 110e, 110f, 110g, and 110h are located between the first upper surface 110a and the first lower surface 110b.

[0022] The first side surface 110c is located in the X-axis direction opposite to the side surface 110g facing the second lead 120. The second side surface 110d is located in the Y-axis direction opposite to the side surface 110f facing the second lead 120. The second side surface 110d is continuous with the first side surface 110c. The -X end of the second side surface 110d connects to the +Y end of the first side surface 110c. Side surface 110f is continuous with side surface 110g. The -X end of side surface 110f connects to the +Y end of side surface 110g. Side surface 110e is located between the second side surface 110d and side surface 110f. The +Y end of side surface 110e connects to the +X end of the second side surface 110d, and the -Y end of side surface 110e connects to the +X end of side surface 110f. Side 110h is located between the first side 110c and side 110g. The +X end of side 110h connects to the -Y end of side 110g, and the -X end of side 110h connects to the -Y end of the first side 110c.

[0023] In the example shown in Figure 3, the first lead 110 has a first through hole 112 and a second through hole 113. The first through hole 112 penetrates from the first upper opening 112a to the first side opening 112b. The first upper opening 112a is located on the first upper surface 110a, spaced apart from the first side surface 110c. The first upper opening 112a is located on the first side surface 110c side rather than the side surface 110g side. The first side opening 112b is located on the first side surface 110c, spaced apart from the first upper surface 110a. The first portion of the first lead 110 includes a part of the first main body 110M and a first connecting portion 112c whose Y-axis ends are connected to the first main body 110M. The first connecting portion 112c includes a first surface 112ca located on the -X side of the first upper surface opening 112a of the first through hole 112 on the first upper surface 110a, a second surface 112cb located on the +Z side of the first side surface opening 112b of the first through hole 112 on the first side surface 110c, and a third surface 112cc connecting the +X side end of the first surface 112ca and the -Z side end of the second surface 112cb.

[0024] In the example shown in Figure 4, the third surface 112cc of the first connecting portion 112c is a curved surface. However, it is not limited to this, and the third surface 112cc may be a flat surface. If the third surface 112cc is a curved surface, the contact area between the first lead 110 and the resin member 30 can be increased compared to the case where it is a flat surface, and the adhesion between the first lead 110 and the resin member 30 can be improved.

[0025] The first upper opening 112a is spaced apart from the second side surface 110d and side surface 110h in the Y-axis direction. In the example shown in Figure 3, the first upper opening 112a extends parallel to the first side surface 110c in a top view. This further improves the adhesion between the first lead 110 and the resin member 30.

[0026] In the example shown in Figure 3, the first upper opening 112a is composed of a single opening extending in a straight line. However, it is not limited to this, and the first upper opening 112a may be composed of multiple openings spaced apart from each other. When the first upper opening 112a is composed of a single opening, the shape of the first upper opening 112a in a top view may be, for example, a rectangle or a shape that narrows in the direction of extension (triangle or rhombus). When the first upper opening 112a is composed of multiple openings, the shape of the first upper opening 112a in a top view may be, for example, a rectangle or a circle (including an ellipse). The same applies to the first side opening 112b, the second upper opening 113a, and the second side opening 113b, which will be described later.

[0027] The first side opening 112b is spaced apart from the second side 110d and side 110h in the Y-axis direction. In the example shown in Figure 5, the first side opening 112b extends parallel to the first upper surface 110a in a side view (i.e., when the first side opening 112b is viewed from the -X side). This improves the adhesion between the first lead 110 and the resin member 30.

[0028] In the example shown in Figure 4, in the cross-section of the first through-hole 112, the maximum width W1 of the first through-hole 112 in the direction parallel to the first upper surface 110a of the first lead 110 (the X-axis direction in Figure 4) is longer than the width W2 of the first upper opening 112a. That is, the inner end 112i of the first through-hole 112 is located further away from the inner end 112ai of the first upper opening 112a relative to the first side surface 110c. This increases the contact area between the inner surface of the first lead 110 defining the first through-hole 112 and the first filling portion 31a, thereby improving the adhesion between the first lead 110 and the resin member 30. Note that "cross-section of the first through-hole 112" refers to the cross-section obtained when the first through-hole 112 is cut parallel to the XZ plane.

[0029] In the example shown in Figure 4, in the cross-section of the first through-hole 112, the maximum width W3 of the first through-hole 112 in the direction perpendicular to the first upper surface 110a of the first lead 110 (the Z-axis direction in Figure 4) is longer than the width W4 of the first side opening 112b. That is, the lower end portion 112u of the first through-hole 112 is located further away from the lower end portion 112bu of the first side opening 112b relative to the first upper surface 110a. This increases the contact area between the inner surface of the first lead 110 defining the first through-hole 112 and the first filling portion 31a, thereby improving the adhesion between the first lead 110 and the resin member 30.

[0030] The second through-hole 113 penetrates from the second upper opening 113a to the second side opening 113b. The second upper opening 113a is located on the first upper surface 110a, separated from the second side surface 110d. The second upper opening 113a is located on the second side surface 110d side from the side surface 110f side. The second side opening 113b is located on the second side surface 110d, separated from the first upper surface 110a. The second portion of the first lead 110 includes a second connecting portion 113c at both ends in the X-axis direction, which connects to other parts of the first main body portion 110M. The second connecting portion 113c includes a fourth surface located on the +Y side of the second upper opening 113a of the second through hole 113 on the first upper surface 110a, a fifth surface located on the +Z side of the second side opening 113b of the second through hole 113 on the second side surface 110d, and a sixth surface connecting the -Y end of the fourth surface and the -Z end of the fifth surface.

[0031] The second upper opening 113a is spaced apart from the first side surface 110c and side surface 110e in the X-axis direction. In the example shown in Figure 3, the second upper opening 113a extends parallel to the second side surface 110d in a top view. This improves the adhesion between the first lead 110 and the resin member 30.

[0032] In the example shown in Figure 3, the second upper opening 113a is separated from the first upper opening 112a. However, the second upper opening 113a may be continuous with the first upper opening 112a.

[0033] The second side opening 113b is separated from the first side 110c and side 110e in the X-axis direction. In the example shown in Figure 5, the second side opening 113b extends parallel to the first upper surface 110a in a side view (i.e., when the second side opening 113b is viewed from the +Y side). The second side opening 113b is separated from the first side opening 112b. However, the second side opening 113b may be continuous with the first side opening 112b.

[0034] As shown in Figure 6, in the cross-section of the second through-hole 113, the maximum width W5 of the second through-hole 113 in the direction parallel to the first upper surface 110a of the first lead 110 (the Y-axis direction in Figure 6) is longer than the width W6 of the second upper opening 113a. Also, as shown in Figure 6, in the cross-section of the second through-hole 113, the maximum width W7 of the second through-hole 113 in the direction perpendicular to the first upper surface 110a of the first lead 110 (the Z-axis direction in Figure 6) is longer than the width W8 of the second side opening 113b. Note that "cross-section of the second through-hole 113" refers to the cross-section obtained when the second through-hole 113 is cut parallel to the YZ plane.

[0035] The first lead 110 has protrusions 111a and 111b. The protrusions 111a and 111b are parts that correspond to connecting portions provided to connect the first lead 110 to other leads before it is separated into individual pieces.

[0036] As shown in Figure 2, the protrusion 111a extends from the first side surface 110c to the opposite side (i.e., the -X side) from the side toward the second lead 120. The protrusion 111a is located to the side of the first through hole 112. In the example shown in Figure 2, the protrusion 111a is located on the -X side of the first through hole 112. As a result, the first connecting portion 112c is continuous with the protrusion 111a, which reduces the reduction in the strength of the first connecting portion 112c. The protrusion 111b extends from the second side surface 110d to the opposite side (i.e., the +Y side) from the side toward the second lead 120.

[0037] The protrusion 111b is located to the side of the second through hole 113. The protrusion 111b is located on the +Y side of the second through hole 113. The protrusion 111b can have the same configuration as the protrusion 111a, except that it extends from the second side surface 110d toward the side toward the second lead 120. Therefore, the description of the protrusion 111b will be omitted below.

[0038] The protrusion 111a has a surface on the -X side that is exposed from the resin member 30. Therefore, sulfurous gas present in the atmosphere may enter through the small gap between the protrusion 111a and the resin member 30 and corrode the light-emitting element 20. If the first lead 110 has a first through hole 112, the distance over which sulfurous gas can pass through the gap and reach the light-emitting element 20 from the outside can be increased compared to the case where the first through hole 112 is not present. As a result, the possibility of the light-emitting element 20 being corroded by sulfurous gas can be reduced in the light-emitting device 1. This can improve the reliability of the light-emitting device 1.

[0039] The second lead 120 has a second upper surface 120a, a second lower surface 120b, a third side surface 120c, a fourth side surface 120d, and other sides 120e, 120f, 120g, and 120h. The third side surface 120c, the fourth side surface 120d, and the other sides 120e, 120f, 120g, and 120h are located between the second upper surface 120a and the second lower surface 120b.

[0040] The third side 120c is located in the X-axis direction opposite to the side 120g facing the first lead 110. The fourth side 120d is located in the Y-axis direction opposite to the side 120f facing the first lead 110. The fourth side 120d is continuous with the third side 120c. The +X end of the fourth side 120d connects to the -Y end of the third side 120c. Side 120f is continuous with side 120g. The +X end of side 120f connects to the -Y end of side 120g. Side 120e is located between the fourth side 120d and side 120f. The -Y end of side 120e connects to the -X end of the fourth side 120d, and the +Y end of side 120e connects to the -X end of side 120f. Side 120h is located between the third side 120c and side 120g. The -X end of side 120h connects to the +Y end of side 120g, and the +X end of side 120h connects to the +Y end of the third side 120c.

[0041] In the example shown in Figure 3, the second lead 120 has a third through hole 122 and a fourth through hole 123. The third through hole 122 penetrates from the third upper opening 122a to the third side opening 122b. The third upper opening 122a is located on the second upper surface 120a, away from the third side surface 120c. The third upper opening 122a is located on the third side surface 120c side from the side surface 120g side. The third side opening 122b is located on the third side surface 120c, away from the second upper surface 120a.

[0042] The third portion of the second lead 120 comprises a part of the second main body 120M and a third connecting portion 122c whose Y-axis ends are connected to the second main body 120M. The third connecting portion 122c includes a seventh surface located on the +X side of the third upper opening 122a of the third through hole 122 on the second upper surface 120a, an eighth surface located on the +Z side of the third side opening 122b of the third through hole 122 on the third side surface 120c, and a ninth surface connecting the -X end of the seventh surface and the -Z end of the eighth surface.

[0043] The fourth through-hole 123 penetrates from the fourth upper opening 123a to the fourth side opening 123b. The fourth upper opening 123a is located on the second upper surface 120a, away from the fourth side surface 120d. The fourth upper opening 123a is located on the fourth side surface 120d side rather than the side surface 120f side. The fourth side opening 123b is located on the fourth side surface 120d, away from the second upper surface 120a. The fourth portion of the second lead 120 includes a fourth connecting portion 123c, the ends of which in the X-axis direction are connected to other parts of the second main body portion 120M. The fourth connecting portion 123c includes a tenth surface located on the -Y side of the fourth upper opening 123a of the fourth through hole 123 on the second upper surface 120a, an eleventh surface located on the +Z side of the fourth side opening 123b of the fourth through hole 123 on the fourth side surface 120d, and a twelfth surface connecting the +Y end of the tenth surface and the -Z end of the eleventh surface. The third upper opening 122a, the third side opening 122b, the fourth upper opening 123a, the fourth side opening 123b, the third connecting portion 122c, and the fourth connecting portion 123c have the same configuration as the first upper opening 112a, the first side opening 112b, the second upper opening 113a, the second side opening 113b, the first connecting portion 112c, and the second connecting portion 113c, respectively, so their description is omitted.

[0044] The second lead 120 has protrusions 121a and 121b. The protrusions 121a and 121b, like the protrusions 111a and 111b, are parts that correspond to connecting portions provided to connect the second lead 120 to other leads before it is separated into individual pieces. The protrusions 121a and 121b have the same structure as the protrusions 111a and 111b, so their description is omitted.

[0045] In the example shown in Figure 3, the first lead 110 and the second lead 120 each have two through holes. However, as shown in lead 10A in Figure 7, the first lead 110 may have only the first through hole 112, and the second lead 120 may have only the third through hole 122. Alternatively, the first lead 110 may have only the second through hole 113, and the second lead 120 may have only the fourth through hole 123. The first lead 110 may have only the first through hole 112, and the second lead 120 may have no through holes.

[0046] Examples of materials constituting the first lead 110 and the second lead 120 include metallic materials such as copper, aluminum, gold, silver, tungsten, iron, and nickel; alloying materials such as iron-nickel alloys and phosphor bronze; and cladding materials. Furthermore, the first lead 110 and the second lead 120 may have a conductive thin film on their surface composed of at least one of silver, aluminum, nickel, palladium, gold, and alloys thereof. The conductive thin film may have a single-layer structure or a multilayer structure. The lead 10 may further include one or more leads different from the first lead 110 and the second lead 120.

[0047] <Light-emitting element 20> The light-emitting element 20 is a semiconductor element that emits light on its own when a voltage is applied to it. An example of the light-emitting element 20 is an LED chip. It has a semiconductor structure 21 and a first electrode 22 and a second electrode 23 with opposite polarities.

[0048] The semiconductor structure 21 comprises a first semiconductor layer, an emissive layer, and a second semiconductor layer. The first semiconductor layer, the emissive layer, and the second semiconductor layer are configured as a laminate.

[0049] The first semiconductor layer and the second semiconductor layer have different conductivity types. For example, if the first semiconductor layer is an n-type semiconductor layer, the second semiconductor layer is a p-type semiconductor layer. If the first semiconductor layer is a p-type semiconductor layer, the second semiconductor layer is an n-type semiconductor layer. One of the first and second semiconductor layers is electrically connected to the first electrode 22. The other of the first and second semiconductor layers is electrically connected to the second electrode 23. The light-emitting layer may have a single quantum well (SQW) structure or a multi-quantum well (MQW) structure including multiple well layers.

[0050] The first semiconductor layer, the light-emitting layer, and the second semiconductor layer may each be semiconductor layers made of a nitride semiconductor. Nitride semiconductors include In x Al yGa 1-x-y The semiconductor comprises all compositions in which the composition ratios x and y are varied within their respective ranges in the chemical formula N (0 ≤ x, 0 ≤ y, x + y ≤ 1). The emission peak wavelength of the light-emitting layer can be appropriately selected depending on the purpose. The light-emitting layer is configured to emit, for example, visible light or ultraviolet light.

[0051] When a structure comprising a first semiconductor layer, an emissive layer, and a second semiconductor layer is considered as a single laminate, the light-emitting element 20 may comprise multiple laminates. In this case, for example, the multiple laminates may be stacked sequentially in the Z-axis direction. The multiple emissive layers comprising each of the multiple laminates may include well layers with different emission peak wavelengths, or they may include well layers with the same emission peak wavelength.

[0052] The combination of emission peak wavelengths of multiple laminates can be selected as appropriate. For example, if the light-emitting element 20 comprises two laminates, possible combinations of light emitted from the light-emitting layers of each laminate include blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, ultraviolet light and blue light, blue light and green light, blue light and red light, or green light and red light. For example, if the light-emitting element 20 comprises three laminates, possible combinations of light emitted from the light-emitting layers of each laminate include blue light, green light, and red light.

[0053] The semiconductor structure 21 may or may not include an element substrate that supports the laminate. If the semiconductor structure 21 includes an element substrate, the element substrate is located on the opposite side of the laminate, which includes a first semiconductor layer, an emissive layer, and a second semiconductor layer, from the side where the first electrode 22 and the second electrode 23 are arranged. The element substrate is made of an insulating material such as sapphire, spinel, or glass.

[0054] In the example shown in Figure 2, the first electrode 22 and the second electrode 23 are located on the lower surface of the semiconductor structure 21. The first electrode 22 is located on the first upper surface 110a of the first lead 110 via a bonding member 50. The first electrode 22 is electrically connected to the first lead 110. The second electrode 23 is located on the second upper surface 120a of the second lead 120 via a bonding member 50. The second electrode 23 is electrically connected to the second lead 120.

[0055] In the example shown in Figure 2, the light-emitting element 20 is positioned such that the side of the semiconductor structure 21 on which the first electrode 22 and the second electrode 23 are located faces the lead 10. However, the light-emitting element 20 can be positioned such that the side of the semiconductor structure 21 opposite to the side on which the first electrode 22 and the second electrode 23 are located faces the lead 10. If the semiconductor structure 21 includes an element substrate, the element substrate faces the lead 10.

[0056] In the examples shown in Figures 1 and 2, the number of light-emitting elements 20 in the light-emitting device 1 is one. However, the number of light-emitting elements 20 in the light-emitting device 1 may be two or more.

[0057] <Resin component 30> The resin member 30 is a member for holding the lead 10. In the example shown in Figures 1 to 6, the resin member 30 has a first filling portion 31a, a second filling portion 31b, a third filling portion 31c, a fourth filling portion 31d, and a covering portion 32 (32a, 32b).

[0058] The first filling portion 31a is positioned within the first through-hole 112 of the first lead 110. The first filling portion 31a is in contact with the inner surface of the first lead 110 that defines the first through-hole 112. The first filling portion 31a is also in contact with the third surface 112cc of the first connecting portion 112c. As a result, the light-emitting device 1 has an increased contact area between the first lead 110 and the first filling portion 31a of the resin member 30 compared to a light-emitting device without the first connecting portion 112c, thereby improving the adhesion between the first lead 110 and the first filling portion 31a. This improves the reliability of the light-emitting device 1. The second filling portion 31b is positioned within the second through-hole 113 of the first lead 110. The second filling portion 31b is in contact with the inner surface of the first lead 110 that defines the second through-hole 113. Furthermore, the second filling portion 31b is in contact with the sixth surface of the second connecting portion 113c. This improves the adhesion between the first lead 110 and the second filling portion 31b, similar to the first filling portion 31a. When the first through hole 112 and the second through hole 113 are separated, the first filling portion 31a and the second filling portion 31b are separated. When the first through hole 112 and the second through hole 113 are continuous, the first filling portion 31a and the second filling portion 31b are continuous.

[0059] The third filling portion 31c is located within the third through-hole 122 of the second lead 120. The third filling portion 31c is in contact with the inner surface of the second lead 120 that defines the third through-hole 122. The fourth filling portion 31d is located within the fourth through-hole 123 of the second lead 120. The third filling portion 31c is in contact with the ninth surface of the third connecting portion 122c. The fourth filling portion 31d is in contact with the inner surface of the second lead 120 that defines the fourth through-hole 123. The fourth filling portion 31d is in contact with the twelfth surface of the fourth connecting portion 123c. When the third through-hole 122 and the fourth through-hole 123 are separated, the third filling portion 31c and the fourth filling portion 31d are separated. When the third through-hole 122 and the fourth through-hole 123 are continuous, the third filling portion 31c and the fourth filling portion 31d are continuous.

[0060] The covering portion 32a is continuous with the first filling portion 31a, the second filling portion 31b, the third filling portion 31c, and the fourth filling portion 31d, and includes a region that covers the first side surface 110c and the second side surface 110d of the first lead 110, and the third side surface 120c and the fourth side surface 120d of the second lead 120.

[0061] The covering portion 32b is located between the first lead 110 and the second lead 120 and includes a region that covers the side surfaces 110g, 120g, 110h, 120f, 110f, and 120h. The covering portion 32 (32a and 32b) does not cover the first lower surface 110b. The first lower surface 110b is exposed from the covering portion 32 (32a and 32b) of the resin member 30.

[0062] In the example shown in Figure 1, the resin member 30 has a wall portion 33. The wall portion 33 is continuous with the covering portion 32a, the first filling portion 31a, the second filling portion 31b, the third filling portion 31c, and the fourth filling portion 31d, and extends upward from the first upper surface 110a of the first lead 110. The wall portion 33 extends upward from the second upper surface 120a of the second lead 120. The wall portion 33 covers a portion of the first upper surface 110a, and the other portion of the first upper surface 110a is exposed from the wall portion 33. The wall portion 33 is arranged in an annular shape when viewed from above. In this case, the light-emitting device 1 has a recess 1s surrounded by the wall portion 33 when viewed from above. The side surface of the recess 1s is defined by the inner surface of the wall portion 33. The bottom surface of the recess 1s is defined by the first upper surface 110a of the first lead 110 and the second upper surface 120a of the second lead 120 of the lead 10, and the covering portion 32b of the resin member 30 located between the first lead 110 and the second lead 120. The light-emitting element 20 is arranged in the region surrounded by the wall portion 33. Specifically, the light-emitting element 20 is arranged on the bottom surface of the recess 1s.

[0063] In the examples shown in Figures 2 and 4, the wall portion 33 covers the entirety of the first filling portion 31a, the entirety of the second filling portion 31b, the entirety of the third filling portion 31c, and the entirety of the fourth filling portion 31d in a cross-sectional view. However, the wall portion 33 may cover a part of the first filling portion 31a, a part of the second filling portion 31b, a part of the third filling portion 31c, and a part of the fourth filling portion 31d in a cross-sectional view.

[0064] The wall portion 33 may be a structurally integrated member with the first filling portion 31a, the second filling portion 31b, the third filling portion 31c, the fourth filling portion 31d, and the covering portion 32a, or it may be a structurally separate member.

[0065] Furthermore, the resin member 30 is not limited to having a wall portion 33; it does not need to have a wall portion 33.

[0066] Examples of materials constituting the resin component 30 include thermosetting resins. Examples of thermosetting resins include epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. In addition to insulating materials such as thermosetting resins, the resin component 30 may further contain light-reflecting particles. Examples of light-reflecting particles include inorganic particles such as titanium dioxide, silicon dioxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, barium titanate, zinc oxide, silicon nitride, aluminum nitride, boron nitride, calcium carbonate, calcium hydroxide, and calcium silicate.

[0067] <Other components> The light-emitting device 1 may further include a sealing member 40. <Sealing member 40> The sealing member 40 is placed in the recess 1s. The sealing member 40 seals the light-emitting element 20. The sealing member 40 mainly contains a thermosetting resin such as epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, or urethane resin. The sealing member 40 is preferably rigid in order to protect the light-emitting element 20. Furthermore, it is preferable to use a resin with excellent heat resistance, weather resistance, and light resistance for the sealing member 40. The sealing member 40 may contain a wavelength conversion material.

[0068] For example, phosphors can be used as wavelength conversion materials. Examples of phosphors include yttrium-aluminum-garnet phosphors (e.g., Y3(Al,Ga)5O 12:Ce), lutetium-aluminum-garnet-based phosphor (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium-aluminum-garnet-based phosphor (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphor (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphor (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphor (e.g., Ca8MgSi4O 16 Cl2:Eu), β-sialon-based phosphor (e.g., (Si,Al)3(O,N)4:Eu), α-sialon phosphor (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), SLA-based phosphor (e.g., SrLiAl3N4:Eu), CASN-based phosphor (e.g., CaAlSiN3:Eu) or SCASN-based phosphor (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphor (e.g., K2SiF6:Mn), KSAF-based phosphor (e.g., K2(Si,Al)F6:Mn) or MGF-based phosphor (e.g., 3.5MgO·0.5MgF2·GeO2:Mn) and other fluoride-based phosphors, phosphor having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphor (e.g., CdSe, InP, AgInS2 or AgInSe2) etc. can be used.

[0069] The light-emitting device 1 shown in FIGS. 1 and 2 has a rectangular shape in a top view. However, the shape of the light-em-em-em device 1 in a top view is not limited to a rectangle and may be a square.

[0070] [Modification Example 1] Next, referring to FIGS. 8 and 9, the light-emitting device 2 according to Modification Example 1 of the embodiment will be described. FIG. 8 is a top view schematically showing the light-emitting device 2 according to Modification Example 1. FIG. 9 is a cross-sectional view schematically showing the light-emitting device 2 taken along line IX-IX of FIG. 8. In Modification Example 1, for the constituent members similar to those of the light-emitting device 1 according to the embodiment, the same reference numerals may be given and the description may be omitted as appropriate.

[0071] The light-emitting device 2 according to Modification 1 has a resin member 30F that is in contact with the side surface 24 of the light-emitting element 20F. The light-emitting device 2 does not have a recess 1s. As shown in Figures 8 and 9, the light-emitting device 2 may have a translucent member 25 disposed on the light-emitting element 20F. The translucent member 25 may include a wavelength conversion material. Examples of wavelength conversion materials include the wavelength conversion materials listed for the sealing member 40. The resin member 30F is in contact with the side surface of the translucent member 25.

[0072] The first lead 110F has a first through hole 112. The first filling portion 31a is located within the first through hole 112. The second lead 120F has a third through hole 122. The third filling portion 31c is located within the third through hole 122. If the light-emitting device 2 is used, the same effects as the light-emitting device 1 can be obtained.

[0073] [Differentiation 2] Next, a light-emitting device 3 according to modified embodiment 2 will be described with reference to Figures 10 and 11. Figure 10 is a schematic top view showing the light-emitting device 3 according to modified embodiment 2. Figure 11 is a schematic cross-sectional view showing the light-emitting device 3 along the line XI-XI in Figure 10. In modified embodiment 2, components similar to those in the light-emitting device according to embodiment and modified embodiment 1 are denoted by the same reference numerals, and their descriptions may be omitted as appropriate.

[0074] The lead 10G of the light-emitting device 3 according to the modified example 2 has a first lead 110G, a second lead 120G, a third lead 130G, and a fourth lead 140G. The wall portion 33G of the resin member 30G has a region 331 that spans the second upper surface 120a of the second lead 120G and the third upper surface 130a of the third lead 130G. The light-emitting device 3 has two recesses 1s.

[0075] The first lead 110G has a first through hole 112. The first filling portion 31a is located within the first through hole 112. The second lead 120G has a third through hole 122. The third filling portion 31c is located within the third through hole 122. The third lead 130G has a fifth through hole 132. The fifth filling portion 31e is located within the fifth through hole 132. The fourth lead 140G has a sixth through hole 142. The sixth filling portion 31f is located within the sixth through hole 142. In the case of the light-emitting device 3, similar to light-emitting devices 1 and 2, the adhesion between the first lead 110G and the second lead 120G and the resin member 30G can be improved.

[0076] The first lead 110G has a first side surface 110c located on the opposite side of the side facing the second lead 120G, and a protrusion 131a extending from the first side surface 110c toward the opposite side toward the second lead 120G (i.e., the -X side). The fourth lead 140G has a fifth side surface 140c located on the opposite side of the side facing the third lead 130G, and a protrusion 141a extending from the fifth side surface 140c toward the opposite side toward the third lead 130G (i.e., the +X side). The light-emitting device 3 has a first through hole 112, which increases the distance over which the sulfur gas passes through the small gap between the protrusion 131a and the resin member 30G to reach the light-emitting element 20. Similarly, the light-emitting device 3 has a sixth through-hole 142, which increases the distance over which the sulfur gas passes through the small gap between the protrusion 141a and the resin member 30G to reach the light-emitting element 20. As a result, the possibility of the light-emitting element 20 being corroded by the sulfur gas can be reduced, and the reliability of the light-emitting device 3 can be improved.

[0077] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0078] The aspects of this disclosure are, for example, as follows: <Item 1> A light-emitting device comprising a lead, a light-emitting element disposed on the lead, and a resin member holding the lead, The lead comprises a first lead and a second lead separated from the first lead. The first lead has a first upper surface, a first side surface located opposite to the side surface facing the second lead, and a first through hole that penetrates from a first upper surface opening located at a distance from the first side surface on the first upper surface to a first side surface opening located at a distance from the first upper surface on the first side surface. The resin member has a first filling portion disposed within the first through hole, and a covering portion that is continuous with the first filling portion and includes a region that covers the first side surface of the first lead. Light-emitting device. <Item 2> The first upper opening extends parallel to the first side surface in a top view. The light-emitting device described in item 1 above. <Item 3> The first side opening extends parallel to the first upper surface in a side view. The light-emitting device described in item 1 or item 2 above. <Item 4> In the cross-section of the first through-hole, the maximum width of the first through-hole in the direction parallel to the first upper surface of the first lead is longer than the width of the first upper surface opening. A light-emitting device according to any one of the above items <1> to <3>. <Item 5> In the cross-section of the first through-hole, the maximum width of the first through-hole in the direction perpendicular to the first upper surface of the first lead is longer than the width of the first side opening. A light-emitting device according to any one of the above items <1> to <4>. <Clause 6> The first lead has a second side surface continuous with the first side surface, and a second through hole that penetrates from a second upper opening located on the first upper surface at a position away from the second side surface to a second side opening located on the second side surface at a position away from the first upper surface, The resin member has a second filling portion disposed within the second through hole, The covering portion includes a region that covers the second side surface of the first lead and is continuous with the second filling portion. A light-emitting device according to any one of the above items <1> to <5>. <Clause 7> The second upper opening extends parallel to the second side surface in a top view. The light-emitting device described in item 6 above. <Item 8> The first upper opening and the second upper opening are continuous, The light-emitting device described in item 6 or item 7 above. <Item 9> The first lead extends from the first side surface toward the side toward the second lead and further has a protrusion exposed from the covering portion of the resin member, The aforementioned protrusion is located to the side of the first through hole, A light-emitting device according to any one of the above items <1> to <8>. <Item 10> The second lead has a second upper surface, a third side surface located opposite to the side surface facing the first lead, and a third through-hole extending from a third upper surface opening located on the second upper surface at a distance from the third side surface to a third side surface opening located on the third side surface at a distance from the second upper surface, The resin member has a third filling portion disposed within the third through hole, The covering portion is continuous with the third filling portion and includes a region that covers the third side surface of the second lead. A light-emitting device according to any one of the above items <1> to <9>. <Item 11> The resin member has a wall portion that is continuous with the covering portion and the first filling portion and extends upward from the first upper surface. A light-emitting device according to any one of items 1 to 10 above. <Item 12> The wall portion is arranged in a ring shape when viewed from above. The light-emitting element is arranged in the region surrounded by the wall portion. The light-emitting device described in item 11 above. <Item 13> The resin member is in contact with the side surface of the light-emitting element, A light-emitting device according to any one of the above items <1> to <12>. [Explanation of Symbols]

[0079] 1,2,3 Light-emitting device 1s recess 10, 10A, 10G Leads 110, 110F, 110G First lead 110M 1st main body 110a 1st top surface 110c 1st side 110d 2nd side 111a,111b,121a,121b,131a,141a Convex part 112 First through hole 112a 1st top opening 112b 1st side opening 112c First connecting section 112ca 1st page 112cb 2nd side 112cc 3rd side 113 Second through hole 113a 2nd top opening 113b 2nd side opening 113c Second connecting section 120, 120F, 120G Second lead 120M 2nd main body 120a 2nd top surface 120c 3rd side 120d 4th side 122 Third through hole 122a 3rd top opening 122b 3rd side opening 123 Fourth through hole 123a 4th top opening 123b 4th side opening 20,20F light-emitting element 21 Semiconductor Structures 22 1st electrode 23 2nd electrode 30, 30F, 30G Resin components 31a 1st filling section 31b 2nd filling section 31c 3rd filling section 31d 4th filling section 31e 5th filling section 31f 6th filling section 132 Fifth through hole 142 Sixth through hole 32(32a,32b) Covering part 33,33G wall 40 Sealing member 50 Joining members

Claims

1. A light-emitting device comprising a lead, a light-emitting element disposed on the lead, and a resin member holding the lead, The lead comprises a first lead and a second lead separated from the first lead. The first lead has a first upper surface, a first side surface located opposite to the side surface facing the second lead, and a first through hole that penetrates from a first upper surface opening located at a distance from the first side surface on the first upper surface to a first side surface opening located at a distance from the first upper surface on the first side surface. The resin member has a first filling portion disposed within the first through hole, and a covering portion that is continuous with the first filling portion and includes a region that covers the first side surface of the first lead. Light-emitting device.

2. The first upper opening extends parallel to the first side surface in a top view. The light-emitting device according to claim 1.

3. The first side opening extends parallel to the first upper surface in a side view. The light-emitting device according to claim 1 or claim 2.

4. In the cross-section of the first through-hole, the maximum width of the first through-hole in the direction parallel to the first upper surface of the first lead is longer than the width of the first upper surface opening. The light-emitting device according to claim 1 or claim 2.

5. In the cross-section of the first through-hole, the maximum width of the first through-hole in the direction perpendicular to the first upper surface of the first lead is longer than the width of the first side opening. The light-emitting device according to claim 1 or claim 2.

6. The first lead has a second side surface that is continuous with the first side surface, and a second through-hole that penetrates from a second upper surface opening located at a position away from the second side surface on the first upper surface to a second side surface opening located at a position away from the first upper surface on the second side surface. The resin member has a second filling portion disposed within the second through hole, The covering portion includes a region that covers the second side surface of the first lead and is continuous with the second filling portion. The light-emitting device according to claim 1 or claim 2.

7. The light-emitting device according to claim 6, wherein the second upper opening extends parallel to the second side surface when viewed from above.

8. The first upper opening and the second upper opening are continuous. The light-emitting device according to claim 6.

9. The first lead extends from the first side surface toward the side opposite to the side toward the second lead, and further has a protrusion that is exposed from the covering portion of the resin member. The aforementioned protrusion is located to the side of the first through hole, The light-emitting device according to claim 1 or claim 2.

10. The second lead has a second upper surface, a third side surface located opposite to the side surface facing the first lead, and a third through-hole extending from a third upper surface opening located on the second upper surface at a distance from the third side surface to a third side surface opening located on the third side surface at a distance from the second upper surface. The resin member has a third filling portion disposed within the third through hole, The light-emitting device according to claim 1 or claim 2, wherein the covering portion is continuous with the third filling portion and includes a region that covers the third side surface of the second lead.

11. The resin member has a wall portion that is continuous with the covering portion and the first filling portion and extends upward from the first upper surface. The light-emitting device according to claim 1 or claim 2.

12. The aforementioned wall portion is arranged in a ring shape when viewed from above. The light-emitting element is arranged in the region surrounded by the wall portion. The light-emitting device according to claim 11.

13. The resin member is in contact with the side surface of the light-emitting element, The light-emitting device according to claim 1 or claim 2.

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