aggregate sheet

Abstract

This provides a composite sheet that allows for easy detection of multiple marks using image recognition. [Solution] The assembled sheet 1 comprises a wiring circuit board 2 and alignment marks 4. The alignment marks 4 have a metal layer 40, a first mark 41 placed on one side surface S11 of the metal layer 40 and made of the same material as the base insulating layer 23 of the wiring circuit board 2, and a second mark 42 placed on one side surface S11 of the metal layer 40 and made of the same material as the first conductor pattern 24 of the wiring circuit board 2.

Description

Technical Field

[0006] ,

[0007] , ,

[0001] The present invention relates to an aggregate sheet.

Background Art

[0002] Conventionally, in the production of a wiring circuit board, it is known to provide alignment marks on an aggregate sheet having a plurality of wiring circuit boards (see, for example, Patent Document 1 below). The alignment marks are formed from an opening in the base insulating layer or the base insulating layer itself and are used for aligning a photomask with respect to the aggregate sheet.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the method for manufacturing a wiring circuit board as described in Patent Document 1, there may be a case where it is desired to use a plurality of types of alignment marks. For example, there may be a case where it is desired to use an alignment mark used for aligning a photomask with respect to the base insulating layer and an alignment mark used for aligning a photomask with respect to the conductor layer.

[0005] In this case, it may be difficult to detect a plurality of types of alignment marks by image recognition.

[0006] The present invention provides an aggregate sheet in which a plurality of marks can be easily detected by image recognition.

Means for Solving the Problems

[0007] The present invention [1] includes a wiring circuit board having a metal support layer, a base insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer, and a first conductor pattern disposed on one side of the base insulating layer in the thickness direction, and an alignment mark, wherein the alignment mark has a metal layer, a first mark disposed on one side surface of the metal layer in the thickness direction and made of the same material as the base insulating layer of the wiring circuit board, and a second mark disposed on the one side surface of the metal layer in the thickness direction and made of the same material as the first conductor pattern of the wiring circuit board.

[0008] In this configuration, a first mark made of the same material as the base insulating layer and a second mark made of the same material as the first conductor pattern are both placed on one side surface of the metal layer, forming a single alignment mark.

[0009] Therefore, by performing image recognition on one alignment mark from one side of the metal layer, it is possible to detect both the first mark, which is made of the same material as the base insulating layer, and the second mark, which is made of the same material as the first conductor pattern.

[0010] As a result, multiple marks (the first mark and the second mark) can be easily detected using image recognition.

[0011] The present invention [2] includes the aggregate sheet of [1] described above, wherein the first mark has a disc shape or a polygonal plate shape, and the second mark has an annular shape or a polygonal annular shape, surrounding the first mark.

[0012] With this configuration, a single alignment mark consisting of the first and second marks can be formed with a simple arrangement where the second mark surrounds the first mark.

[0013] Furthermore, the center of the first mark can be calculated from the peripheral edge of the first mark, and the center of the second mark can be calculated from the peripheral edge of the second mark.

[0014] Therefore, by measuring the distance between the center of the first mark and the center of the second mark, the misalignment of the first conductor pattern relative to the base insulating layer can be inspected.

[0015] The present invention [3] includes the aggregate sheet of [1] described above, wherein each of the first mark and the second mark has an annular shape or a polygonal annular shape, and the first mark surrounds the second mark.

[0016] With this configuration, a single alignment mark consisting of the first mark and the second mark can be formed with a simple arrangement where the first mark surrounds the second mark.

[0017] Furthermore, the center of the first mark can be calculated from the peripheral edge of the first mark, and the center of the second mark can be calculated from the peripheral edge of the second mark.

[0018] Therefore, by measuring the distance between the center of the first mark and the center of the second mark, the misalignment of the first conductor pattern relative to the base insulating layer can be inspected.

[0019] The present invention [4] further comprises any one of the above [1] to [3] assembly sheets, wherein the wiring circuit board further comprises a protective metal layer disposed between the metal support layer and the base insulating layer in the thickness direction, and the metal layer of the alignment mark comprises a first metal layer made of the same material as the metal support layer of the wiring circuit board and a second metal layer disposed on one side surface of the first metal layer in the thickness direction and made of the same material as the protective metal layer.

[0020] With this configuration, the reflectivity of one side surface of the background metal layer in image recognition can be adjusted by the second metal layer.

[0021] Therefore, it is possible to improve the accuracy of alignment mark detection.

[0022] The present invention [5] further includes a second conductor pattern that is disposed on one side of the base insulating layer in the thickness direction and is thicker than the first conductor pattern. The alignment mark is disposed on the one-side surface of the metal layer in the thickness direction, is made of the same material as the second conductor pattern, and has an annular shape or a polygonal annular shape. The alignment mark further includes a third mark that surrounds the second mark.

[0023] According to such a configuration, with a simple configuration in which the third mark surrounds the second mark, one alignment mark having the first mark, the second mark, and the third mark can be formed.

[0024] Also, by measuring the distance between the center of the third mark and the center of the second mark, the misalignment of the second conductor pattern with respect to the first conductor pattern can be inspected.

[0025] Also, by measuring the distance between the center of the third mark and the center of the first mark, the misalignment of the second conductor pattern with respect to the base insulating layer can be inspected.

[0026] The present invention [6] further includes a first cover insulating layer that is disposed on one side of the base insulating layer in the thickness direction and covers the first conductor pattern. The alignment mark is disposed on the one-side surface of the metal layer in the thickness direction, is made of the same material as the first cover insulating layer of the wiring circuit board, and further includes a cover layer that covers the first mark and the second mark.

[0027] According to such a configuration, the alignment mark can be protected by the cover layer.

[0028] Also, by checking the covering state of the first mark and the second mark by the cover layer, the covering state of the first conductor pattern by the first cover insulating layer can be inspected.

[0029] The present invention [7] includes the aggregate sheet of [6], wherein the cover layer of the alignment mark has an annular or polygonal annular shape and has a fourth mark surrounding the second mark.

[0030] With this configuration, a single alignment mark consisting of the first, second, and fourth marks can be formed with a simple arrangement where the fourth mark surrounds the second mark.

[0031] Furthermore, by measuring the distance between the center of the fourth mark and the center of the second mark, the misalignment of the first cover insulating layer relative to the first conductor pattern can be inspected.

[0032] The present invention [8] further includes any one of the assembled sheets of [1] to [4] described above, wherein the wiring circuit board further comprises a first cover insulating layer disposed on one side of the base insulating layer in the thickness direction and covering the first conductor pattern; a second conductor pattern disposed on one side of the first cover insulating layer in the thickness direction and thicker than the first conductor pattern; and a second cover insulating layer disposed on one side of the first cover insulating layer in the thickness direction and covering the second conductor pattern, and further comprises an alignment mark disposed on the one side surface of the metal layer in the thickness direction, made of the same material as the first cover insulating layer of the wiring circuit board and covering the first mark and the second mark; and a third mark disposed on the one side surface of the first cover layer in the thickness direction, made of the same material as the second conductor pattern, having an annular or polygonal annular shape and surrounding the second mark.

[0033] With this configuration, even if the second conductor pattern is positioned on one side of the first cover insulating layer, a single alignment mark having the first mark, second mark, and third mark can be formed with a simple configuration in which the third mark surrounds the second mark.

[0034] Furthermore, by measuring the distance between the center of the third mark and the center of the second mark, it is possible to inspect the misalignment of the second conductor pattern relative to the first conductor pattern.

[0035] Furthermore, by measuring the distance between the center of the third mark and the center of the first mark, the misalignment of the second conductor pattern relative to the base insulating layer can be inspected.

[0036] The present invention [9] includes the aggregate sheet of [8] described above, wherein the alignment marks are arranged on the one side surface of the first cover layer in the thickness direction and further comprises a second cover layer that covers the third mark and is made of the same material as the second cover insulating layer of the wiring circuit board, the first cover layer of the alignment marks has an annular or polygonal annular shape and has a fourth mark surrounding the second mark, and the second cover layer of the alignment marks has an annular or polygonal annular shape and has a fifth mark surrounding the third mark.

[0037] With this configuration, a single alignment mark having the first, second, third, fourth, and fifth marks can be formed in a simple configuration where the fourth mark of the first cover layer surrounds the second mark, and the fifth mark of the second cover layer surrounds the third mark.

[0038] Furthermore, by measuring the distance between the center of the fourth mark and the center of the second mark, the misalignment of the first cover insulating layer relative to the first conductor pattern can be inspected.

[0039] Furthermore, by measuring the distance between the center of the fifth mark and the center of the third mark, the misalignment of the second cover insulating layer relative to the second conductor pattern can be inspected.

[0040] The present invention

[10] includes any one of the above [1] to [9] assembly sheets, wherein the assembly sheet has a frame that supports the wiring circuit board, and the alignment marks are arranged on the frame.

[0041] The present invention

[11] includes any one of the above [1] to

[10] assembly sheets, wherein the assembly sheet has a plurality of the wiring circuit boards and the alignment marks are arranged between the plurality of the wiring circuit boards.

[0042] The present invention

[12] includes any one of the above [1] to

[11] aggregate sheets, wherein the aggregate sheet comprises a plurality of the alignment marks.

[0043] The present invention

[13] includes the aggregate sheet described in

[12] , wherein the aggregate sheet extends in a width direction perpendicular to the thickness direction and in a flow direction perpendicular to the thickness direction and the width direction, and the plurality of alignment marks include a first alignment mark, a second alignment mark positioned away from the first alignment mark in the width direction, and a third alignment mark positioned away from the second alignment mark in the flow direction.

[0044] With this configuration, the positional accuracy of the photomask relative to the aggregate sheet can be improved in both the width direction and the flow direction.

[0045] The present invention

[14] includes the aggregate sheet of

[13] wherein the second alignment mark is smaller than the first alignment mark and the third alignment mark.

[0046] With this configuration, the width and flow direction of the assembled sheet can be easily recognized by checking the position of the second alignment mark.

[0047] The present invention

[15] includes the aggregate sheet described in

[13] or

[14] above, wherein the distance between the first alignment mark and the second alignment mark in the width direction is different from the distance between the second alignment mark and the third alignment mark in the flow direction.

[0048] With this configuration, the width and flow direction of the assembled sheet can be easily determined by checking the distance between the first and second alignment marks in the width direction, and the distance between the second and third alignment marks in the flow direction.

[0049] The present invention

[16] is a method for manufacturing an aggregate sheet according to any one of the above [1] to

[15] , wherein the wiring circuit board further comprises a first cover insulating layer disposed on one side of the base insulating layer in the thickness direction and covering the first conductor pattern, and the method for manufacturing the aggregate sheet includes a base insulating layer forming step of forming the base insulating layer and forming the first mark, a first conductor pattern forming step of forming the first conductor pattern and forming the second mark, and a first cover insulating layer forming step of forming the first cover insulating layer, wherein in the first cover insulating layer forming step, the first mark is used to align a photomask for forming the first cover insulating layer with respect to the base insulating layer, or the second mark is used to align a photomask for forming the first cover insulating layer with respect to the first conductor pattern, the method for manufacturing an aggregate sheet.

[0050] According to this method, in the base insulating layer formation process, a first mark is formed together with the base insulating layer, and the positional relationship between the base insulating layer and the first mark is determined.

[0051] Furthermore, in the first conductor pattern formation process, the second mark is formed together with the first conductor pattern, and the positional relationship between the first conductor pattern and the second mark is determined.

[0052] Furthermore, in the first cover insulating layer formation process, by using the first mark to align the photomask for forming the first cover insulating layer with respect to the base insulating layer, the positional accuracy of the first cover insulating layer relative to the base insulating layer can be improved.

[0053] Furthermore, by using the second mark to align the photomask for forming the first cover insulating layer with respect to the first conductor pattern, the positional accuracy of the first cover insulating layer relative to the first conductor pattern can be improved.

[0054] The present invention

[17] further comprises the wiring circuit board having a second conductor pattern thicker than the first conductor pattern, and the method for manufacturing the assembly sheet further includes a second conductor pattern forming step for forming the second conductor pattern, wherein the second conductor pattern forming step includes aligning a photomask for forming the second conductor pattern with respect to the base insulating layer using the first marks, or aligning a photomask for forming the second conductor pattern with respect to the first conductor pattern using the second marks, as described in

[16] above.

[0055] According to this method, in the second conductor pattern formation process, by using the first mark to align the photomask for forming the second conductor pattern with respect to the base insulating layer, the positional accuracy of the second conductor pattern with respect to the base insulating layer can be improved.

[0056] Furthermore, by using the second mark to align the photomask for forming the second conductor pattern with respect to the first conductor pattern, the positional accuracy of the second conductor pattern relative to the first conductor pattern can be improved.

[0057] The present invention

[18] includes a method for manufacturing the aggregate sheet described in

[17] , wherein the second conductor pattern is arranged on one side of the base insulating layer in the thickness direction, and the first cover insulating layer forming step is performed after the second conductor pattern forming step.

[0058] The present invention

[19] includes a method for manufacturing the aggregate sheet described in

[17] above, wherein the second conductor pattern is arranged on one side of the first cover insulating layer in the thickness direction, and the second conductor pattern formation step is performed after the first cover insulating layer formation step. [Effects of the Invention]

[0059] According to the aggregate sheet of the present invention, multiple marks can be easily detected by image recognition. [Brief explanation of the drawing]

[0060] [Figure 1] Figure 1 is a plan view of an aggregate sheet as one embodiment of the present invention. Note that the cover insulating layer is omitted in Figure 1. [Figure 2] Figure 2A is a cross-sectional view of the wiring circuit board shown in Figure 1, section AA. Figure 2B is a cross-sectional view of the alignment marks shown in Figure 1, section BB. [Figure 3] Figure 3 is a magnified view of the alignment marks shown in Figure 1. [Figure 4] Figures 4A and 4B show the base insulating layer formation process. Figure 4A shows a cross-sectional view corresponding to line AA in Figure 1, and Figure 4B shows a cross-sectional view corresponding to line BB in Figure 1. [Figure 5] Figures 5A and 5B show the process of aligning the photomask for forming the first conductor pattern with respect to the base insulating layer during the first conductor pattern formation process. Figure 5A shows a cross-sectional view corresponding to line AA in Figure 1, and Figure 5B shows a cross-sectional view corresponding to line BB in Figure 1. [Figure 6] Figures 6A and 6B show the process of forming the first conductor pattern and the second mark in the first conductor pattern formation process. Figure 6A shows a cross-sectional view corresponding to line AA in Figure 1, and Figure 6B shows a cross-sectional view corresponding to line BB in Figure 1. [Figure 7] Figures 7A and 7B show the process of aligning the photomask for forming the second conductor pattern with respect to the base insulating layer during the second conductor pattern formation process. Figure 7A shows a cross-sectional view corresponding to line AA in Figure 1, and Figure 7B shows a cross-sectional view corresponding to line BB in Figure 1. [Figure 8]Figures 8A and 8B show the process of forming the second conductor pattern and the third mark in the second conductor pattern formation process. Figure 8A shows a cross-sectional view corresponding to line AA in Figure 1, and Figure 8B shows a cross-sectional view corresponding to line BB in Figure 1. [Figure 9] Figures 9A and 9B show the process of aligning the photomask for forming the cover insulating layer with respect to the base insulating layer during the cover insulating layer formation process. Figure 9A shows a cross-sectional view corresponding to line AA in Figure 1, and Figure 9B shows a cross-sectional view corresponding to line BB in Figure 1. [Figure 10] Figure 10A is a plan view showing the alignment marks of modified example (2). Figure 10B is a plan view showing the alignment marks of modified example (3). [Figure 11] Figure 11A is a cross-sectional view of the wiring circuit board of modified example (4), and corresponds to line AA in Figure 1. Figure 11B is a cross-sectional view of the alignment mark of modified example (4), and corresponds to line BB in Figure 1. [Figure 12] Figure 12 is a plan view of the alignment marks shown in Figure 11B. [Figure 13] Figure 13 is a plan view showing the aggregate sheet of modified example (5). [Figure 14] Figure 14 is a plan view showing the aggregate sheet of modified example (6). [Figure 15] Figure 15 is a plan view showing the aggregate sheet of modified example (7). [Figure 16] Figure 16 is a plan view showing the aggregate sheet of modified example (8). [Modes for carrying out the invention]

[0061] 1. Collective Sheet As shown in Figure 1, the aggregate sheet 1 extends in the width direction and the flow direction. The aggregate sheet 1 has a sheet shape. The flow direction is perpendicular to the width direction. The aggregate sheet 1 comprises a plurality of wiring circuit boards 2, a frame 3, and a plurality of alignment marks 4.

[0062] (1) Wiring circuit board Multiple wiring circuit boards 2 are arranged with spacing between them in the width direction and in the flow direction. Each of the multiple wiring circuit boards 2 has the same structure. Therefore, we will describe one of the multiple wiring circuit boards 2 and omit the descriptions of the other wiring circuit boards 2.

[0063] The wiring circuit board 2 extends in the width direction and the flow direction. In this embodiment, the wiring circuit board 2 has a substantially rectangular shape. However, the shape of the wiring circuit board 2 is not limited.

[0064] As shown in Figure 2A, the wiring circuit board 2 has a metal support layer 21, a protective metal layer 22, a base insulating layer 23, a seed layer 20, a first conductor pattern 24, a second conductor pattern 25, and a cover insulating layer 26 (first cover insulating layer).

[0065] (1-1) Metal support layer The metal support layer 21 supports the base insulating layer 23, the first conductor pattern 24, the second conductor pattern 25, and the cover insulating layer 26. Examples of materials for the metal support layer 21 include stainless steel and copper alloys.

[0066] (1-2) Protective metal layer The protective metal layer 22 is positioned on one side surface S1 of the metal support layer 21 in the thickness direction of the metal support layer 21. The thickness direction is perpendicular to the width direction and the flow direction. The protective metal layer 22 is positioned between the metal support layer 21 and the base insulating layer 23 in the thickness direction. The protective metal layer 22 protects the metal support layer 21 from the base insulating layer 23. Examples of materials for the protective metal layer 22 include chromium, nickel, titanium, and their alloys. The protective metal layer 22 is preferably made of chromium.

[0067] (1-3) Base insulating layer The base insulating layer 23 is positioned on one side of the metal support layer 21 in the thickness direction. The base insulating layer 23 is positioned on the protective metal layer 22. In other words, the base insulating layer 23 is positioned on one side surface S1 of the metal support layer 21 via the protective metal layer 22. The base insulating layer 23 is positioned in the thickness direction between the metal support layer 21 and the first conductor pattern 24, and between the metal support layer 21 and the second conductor pattern 25. The base insulating layer 23 insulates the metal support layer 21 from the first conductor pattern 24 and from the second conductor pattern 25. The base insulating layer 23 is made of a transparent resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the base insulating layer 23 is made of polyimide.

[0068] (1-4) Seed layer The seed layer 20 is positioned on one side surface S2 of the base insulating layer 23 in the thickness direction. The seed layer 20 is positioned between the base insulating layer 23 and the first conductor pattern 24, and between the base insulating layer 23 and the second conductor pattern 25, in the thickness direction. The seed layer 20 protects the first conductor pattern 24 and the second conductor pattern 25 from the base insulating layer 23. Examples of materials for the seed layer 20 include chromium, nickel, titanium, and their alloys. The seed layer 20 is preferably made of chromium.

[0069] (1-5) First conductor pattern The first conductor pattern 24 is positioned on one side of the base insulating layer 23 in the thickness direction. The first conductor pattern 24 is positioned on the seed layer 20. The first conductor pattern 24 is positioned on one side surface S2 of the base insulating layer 23 via the seed layer 20 in the thickness direction. The first conductor pattern 24 is positioned on the side opposite the metal support layer 21 to the base insulating layer 23 in the thickness direction. Examples of materials for the first conductor pattern 24 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. The first conductor pattern 24 is preferably made of copper.

[0070] The shape of the first conductor pattern 24 is not limited. In this embodiment, as shown in Figure 1, the first conductor pattern 24 has a plurality of terminals 241A, 241B, a plurality of terminals 242A, 242B, and a plurality of wires 243A, 243B. The number of terminals and the number of wires are not limited.

[0071] Terminals 241A and 241B are located at one end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 241A and 241B are spaced apart from each other and arranged in the flow direction. Each of terminals 241A and 241B has, for example, a corner land shape.

[0072] Terminals 242A and 242B are located at the other end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 242A and 242B are spaced apart from each other and arranged in the flow direction. Each of terminals 242A and 242B has, for example, a corner land shape.

[0073] Wires 243A and 243B are, for example, signal wires for transmitting electrical signals. Wires 243A and 243B may form a differential pair. One end of wire 243A is connected to terminal 241A. The other end of wire 243A is connected to terminal 242A. Wire 243A electrically connects terminals 241A and 242A. One end of wire 243B is connected to terminal 241B. The other end of wire 243B is connected to terminal 242B. Wire 243B electrically connects terminals 241B and 242B.

[0074] (1-6) Second conductor pattern As shown in Figure 2A, the second conductor pattern 25 is positioned on one side of the base insulating layer 23 in the thickness direction. The second conductor pattern 25 is positioned on the seed layer 20. In the thickness direction, the second conductor pattern 25 is positioned on one side surface S2 of the base insulating layer 23 via the seed layer 20. In the thickness direction, the second conductor pattern 25 is positioned on the opposite side of the metal support layer 21 from the base insulating layer 23. The thickness T2 of the second conductor pattern 25 is greater than the thickness T1 of the first conductor pattern 24. The material of the second conductor pattern 25 may be the same as the material of the first conductor pattern 24. Preferably, the material of the second conductor pattern 25 is the same as the material of the first conductor pattern 24.

[0075] The shape of the second conductor pattern 25 is not limited. In this embodiment, as shown in Figure 1, the second conductor pattern 25 has a plurality of terminals 251A, 251B, a plurality of terminals 252A, 252B, and a plurality of wires 253A, 253B. The number of terminals and the number of wires are not limited.

[0076] Terminals 251A and 251B are located at one end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 251A and 251B are spaced apart from each other and arranged in the flow direction. Each of terminals 251A and 251B has, for example, a corner land shape.

[0077] Terminals 252A and 252B are located at the other end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 252A and 252B are spaced apart from each other and arranged in the flow direction. Each of terminals 252A and 252B has, for example, a corner land shape.

[0078] Wires 253A and 253B are, for example, power supply wires through which current from the power source flows. One end of wire 253A is connected to terminal 251A. The other end of wire 253A is connected to terminal 252A. Wire 253A electrically connects terminals 251A and 252A. One end of wire 253B is connected to terminal 251B. The other end of wire 253B is connected to terminal 252B. Wire 253B electrically connects terminals 251B and 252B.

[0079] (1-7) Cover insulating layer As shown in Figure 2A, the cover insulating layer 26 is positioned on one side of the base insulating layer 23 in the thickness direction. The cover insulating layer 26 covers the first conductor pattern 24 and the second conductor pattern 25. More specifically, the cover insulating layer 26 covers the wiring 243A, 243B, 253A, and 253B. The cover insulating layer 26 does not cover the terminals 241A, 241B, 251A, 251B, 242A, 242B, 252A, and 252B. The cover insulating layer 26 is made of resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the cover insulating layer 26 is made of polyimide.

[0080] (2) Frame As shown in Figure 1, the frame 3 is positioned around the outer periphery of the assembled sheet 1. The frame 3 surrounds the multiple wiring circuit boards 2. In this embodiment, the frame 3 has a frame shape. As the material of the frame 3, for example, the same metal as the material of the metal support layer 21 can be used.

[0081] In this embodiment, the assembly sheet 1 has notches 5 between the frame 3 and the wiring circuit board 2, and between two wiring circuit boards 2. The assembly sheet 1 also has a connecting portion 6A that connects the frame 3 and the wiring circuit board 2, and a connecting portion 6B that connects two wiring circuit boards 2 to each other. Multiple wiring circuit boards 2 are connected to each other by the connecting portion 6B and then connected to the frame 3 by the connecting portion 6A. In this way, the frame 3 supports multiple wiring circuit boards 2.

[0082] (3) Alignment marks Multiple alignment marks 4 are placed, for example, on frame 3. The multiple alignment marks 4 include a first alignment mark 4A, a second alignment mark 4B, a third alignment mark 4C, and a fourth alignment mark 4D.

[0083] The first alignment mark 4A is located at one end of the frame 3 in the flow direction. The first alignment mark 4A is located at one end of the frame 3 in the width direction. The first alignment mark 4A is, for example, a polygon (e.g., an octagon).

[0084] The second alignment mark 4B is located at one end of the frame 3 in the flow direction. The second alignment mark 4B is located away from the first alignment mark 4A in the width direction. The second alignment mark 4B is located at the other end of the frame 3 in the width direction. Multiple wiring circuit boards 2 are located between the first alignment mark 4A and the second alignment mark 4B in the width direction. The second alignment mark 4B is, for example, a polygon (e.g., an octagon).

[0085] The second alignment mark 4B is smaller than the first alignment mark 4A and the third alignment mark 4C. Specifically, in the width direction, the outer dimensions of the second alignment mark 4B are smaller than the outer dimensions of the first alignment mark 4A and also smaller than the outer dimensions of the third alignment mark 4C. In the flow direction, the outer dimensions of the second alignment mark 4B are smaller than the outer dimensions of the first alignment mark 4A and also smaller than the outer dimensions of the third alignment mark 4C. Since the second alignment mark 4B is smaller than the first alignment mark 4A and the third alignment mark 4C, the width direction and flow direction of the assembly sheet 1 can be easily recognized by confirming the position of the second alignment mark 4B.

[0086] Furthermore, the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction is different from the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction. Therefore, by checking the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction, and the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction, the width direction and flow direction of the assembly sheet 1 can be easily recognized.

[0087] The third alignment mark 4C is positioned away from the second alignment mark 4B in the flow direction. The third alignment mark 4C is positioned at the other end of the frame 3 in the flow direction. The third alignment mark 4C is positioned at the other end of the frame 3 in the width direction. Multiple wiring circuit boards 2 are positioned between the second alignment mark 4B and the third alignment mark 4C in the flow direction. The outer dimensions of the third alignment mark 4C are the same as the outer dimensions of the first alignment mark 4A. The third alignment mark 4C is, for example, a polygon (for example, an octagon).

[0088] The fourth alignment mark 4D is positioned away from the third alignment mark 4C in the width direction. The fourth alignment mark 4D is positioned at one end of the frame 3 in the width direction. The fourth alignment mark 4D is positioned away from the first alignment mark 4A in the flow direction. The fourth alignment mark 4D is positioned at the other end of the frame 3 in the flow direction. The external dimensions of the fourth alignment mark 4D are the same as those of the first alignment mark 4A. The fourth alignment mark 4D is, for example, a polygon (e.g., an octagon).

[0089] The structure of alignment mark 4 is described below. As shown in Figure 3, alignment mark 4 has a metal layer 40 (see Figure 2B), a first mark 41, a second mark 42, a third mark 43, and a cover layer 44 (see Figure 2B). Note that alignment mark 4 does not necessarily have to have a cover layer 44.

[0090] (3-1) Metal layer If the alignment mark 4 is located on the frame 3, the metal layer 40 may be part of the frame 3. As shown in Figure 2B, the metal layer 40 may have a first metal layer 401, a second metal layer 402, and a third metal layer 403.

[0091] The first metal layer 401 is made of the same material as, for example, the metal support layer 21 of the wiring circuit board 2 (see Figure 2A).

[0092] The second metal layer 402 is positioned in the thickness direction between the first metal layer 401 and the first mark 41, and between the first metal layer 401 and the third metal layer 403. In the thickness direction, the second metal layer 402 is positioned on one side surface 401A of the first metal layer 401. This allows the reflectivity of one side surface S11 (one side surface in the thickness direction) of the metal layer 40 which serves as the background in image recognition to be adjusted by the second metal layer 402. Therefore, the detection accuracy of the alignment mark 4 can be improved. The material of the second metal layer 402 is different from the material of the first metal layer 401. For example, the second metal layer 402 is made of the same material as the protective metal layer 22 of the wiring circuit board 2 (see Figure 2A).

[0093] The third metal layer 403 is positioned in the thickness direction between the second metal layer 402 and the second mark 42, between the second metal layer 402 and the third mark 43, and between the second metal layer 402 and the cover layer 44. The third metal layer 403 is not positioned between the second metal layer 402 and the first mark 41. In the thickness direction, the third metal layer 403 is positioned on one side surface of the second metal layer 402. This allows the reflectivity of one side surface S11 (one side surface in the thickness direction) of the metal layer 40 which serves as the background in image recognition to be adjusted by the third metal layer 403. The material of the third metal layer 403 is different from the material of the first metal layer 401. For example, the third metal layer 403 is made of the same material as the seed layer 20 of the wiring circuit board 2.

[0094] (3-2) First Mark As shown in Figure 3, the first mark 41 is positioned in the center of the alignment mark 4 in the radial direction. The first mark 41 is positioned inside the second mark 42 in the radial direction of the alignment mark 4. The first mark 41 has a polygonal (e.g., octagonal) plate shape.

[0095] As shown in Figure 2B, the first mark 41 is positioned on one side surface S11 of the metal layer 40 in the thickness direction. If the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the first mark 41 is positioned on one side surface of the second metal layer 402 in the thickness direction. The first mark 41 is made of the same material as the base insulating layer 23 of the wiring circuit board 2 (see Figure 2A).

[0096] (3-3) Mark 2 As shown in Figure 3, the second mark 42 is positioned outside the first mark 41 in the radial direction of the alignment mark 4. The second mark 42 surrounds the first mark 41. The second mark 42 is positioned at a distance from the first mark 41 in the radial direction of the alignment mark 4. The second mark 42 is positioned between the first mark 41 and the third mark 43 in the radial direction of the alignment mark 4. The second mark 42 has a polygonal (e.g., octagonal) ring shape.

[0097] As shown in Figure 2B, the second mark 42 is positioned on one side surface S11 of the metal layer 40 in the thickness direction. If the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the second mark 42 is positioned on one side surface of the third metal layer 403 in the thickness direction. The second mark 42 is made of the same material as the first conductor pattern 24 of the wiring circuit board 2 (see Figure 2A).

[0098] (3-4) Third Mark As shown in Figure 3, the third mark 43 is positioned outside the second mark 42 in the radial direction of the alignment mark 4. The third mark 43 surrounds the second mark 42. The third mark 43 is positioned at a distance from the second mark 42 in the radial direction of the alignment mark 4. The third mark 43 has a polygonal (e.g., octagonal) ring shape.

[0099] As shown in Figure 2B, the third mark 43 is positioned on one side surface S11 of the metal layer 40 in the thickness direction. If the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the third mark 43 is positioned on one side surface of the third metal layer 403 in the thickness direction. The third mark 43 is made of the same material as the second conductor pattern 25 of the wiring circuit board 2 (see Figure 2A). The thickness T12 of the third mark 43 is greater than the thickness T11 of the second mark 42.

[0100] (3-5) Cover layer The cover layer 44 is positioned on one side surface S11 of the metal layer 40 in the thickness direction. If the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the cover layer 44 is positioned on one side surface of the third metal layer 403 in the thickness direction. The cover layer 44 is made of a transparent resin. The cover layer 44 may be made of the same material as the cover insulating layer 26 of the wiring circuit board 2 (see Figure 2A). Preferably, the cover layer 44 is made of polyimide. The cover layer 44 covers the first mark 41, the second mark 42, and the third mark 43. The cover layer 44 has a fourth mark 44A.

[0101] As shown in Figure 3, the fourth mark 44A is positioned outside the third mark 43 in the radial direction of the alignment mark 4. The fourth mark 44A surrounds the third mark 43. The fourth mark 44A is positioned at a distance from the third mark 43 in the radial direction of the alignment mark 4. The fourth mark 44A has a polygonal ring shape. The fourth mark 44A is a slit. One side surface S11 of the metal layer 40 may be exposed on one side in the thickness direction through the fourth mark 44A.

[0102] When the alignment mark 4 is image-recognized from one side in the thickness direction, the centers of the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A preferably coincide. The centers of the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A do not necessarily coincide.

[0103] 2. Method for manufacturing aggregate sheets Next, we will explain how to manufacture the aggregate sheet 1.

[0104] The manufacturing method for the aggregate sheet 1 includes a base insulating layer formation step (see Figures 4A and 4B), a first conductor pattern formation step (see Figures 5A to 6B), a second conductor pattern formation step (see Figures 7A to 8B), and a cover insulating layer formation step (first cover insulating layer formation step, see Figures 9A and 9B).

[0105] (1) Base insulating layer formation process As shown in Figures 4A and 4B, in the base insulating layer formation process, the base insulating layer 23 is formed, and the first mark 41 is also formed.

[0106] In detail, during the base insulating layer formation process, a thin metal film M2 is first formed on one side surface of the metal substrate M1 in the thickness direction. A portion of the substrate M1 becomes the metal support layer 21 of the wiring circuit board 2 (see Figure 2A) and the first metal layer 401 of the alignment mark 4 (see Figure 2B). A portion of the thin metal film M2 becomes the protective metal layer 22 of the wiring circuit board 2 (see Figure 2A) and the second metal layer 402 of the alignment mark 4 (see Figure 2B). The thin metal film M2 is formed, for example, by sputtering.

[0107] Next, in the base insulating layer formation process, a photosensitive resin solution (varnish) is applied to the metal thin film M2 and dried to form a photosensitive resin coating.

[0108] Next, the photosensitive resin coating is exposed to light and developed. This forms a base insulating layer 23 and a first mark 41 on the metal thin film M2.

[0109] (2) First conductor pattern formation process Next, in the first conductor pattern formation step, the first conductor pattern 24 (see Figure 6A) is formed, as well as the second mark 42 (see Figure 6B).

[0110] In more detail, in the first conductor pattern formation step, a seed layer 20 is first formed on the surface of the base insulating layer 23 in the thickness direction. The seed layer 20 is also formed on the surface of the metal thin film M2 and the surface of the first mark 41 in the thickness direction. The seed layer 20 is formed, for example, by sputtering.

[0111] Next, as shown in Figures 5A and 5B, a plating resist R1 is applied to one side surface of the substrate M1 in the thickness direction. The plating resist R1 covers the metal thin film M2, the base insulating layer 23, and the first mark 41.

[0112] Next, the first mark 41 is used to align the photomask PM1 for forming the first conductor pattern 24 with respect to the base insulating layer 23.

[0113] The photomask PM1 has a mask pattern 101 (see Figure 5A) and a plurality of alignment patterns 102 (see Figure 5B).

[0114] The mask pattern 101 has the same shape as the first conductor pattern 24 (see Figure 1). The mask pattern 101 blocks light.

[0115] Alignment pattern 102 has the same shape as the second mark 42 (see Figure 3). Alignment pattern 102 blocks light.

[0116] In the photomask PM1, the parts excluding the mask pattern 101 and alignment pattern 102 transmit light.

[0117] As shown in Figure 5B, the photomask PM1 is aligned with the substrate M1 such that, when viewed from one side in the thickness direction, the center 102A of the alignment pattern 102 coincides with the center 41A of the first mark 41. With the center 102A of the alignment pattern 102 coinciding with the center 41A of the first mark 41, the mask pattern 101 overlaps with the base insulating layer 23, as shown in Figure 5A.

[0118] The center 41A of the first mark 41 is calculated, for example, from the peripheral edge E11 of the first mark 41. The peripheral edge E11 is read, for example, by image recognition. Similarly, the center 102A of the alignment pattern 102 is calculated, for example, from the peripheral edge E12 of the alignment pattern 102. The peripheral edge E12 is read, for example, by image recognition. The same applies to the photomasks PM2 and PM3 used in subsequent processes.

[0119] Next, in the first conductor pattern formation step, the plating resist R1 is exposed and developed through the photomask PM1.

[0120] As a result, the portion of the plating resist R1 that was shielded by the mask pattern 101 and the alignment pattern 102 is removed, and the seed layer 20 is exposed in the area where the first conductor pattern 24 and the second mark 42 are formed. On the other hand, the exposed portion of the plating resist R1, i.e., the portion where the first conductor pattern 24 is not formed, remains.

[0121] Next, as shown in Figures 6A and 6B, a first conductor pattern 24 (see Figure 6A) and a second mark 42 (see Figure 6B) are formed on the exposed seed layer 20 by electroplating. This forms the first conductor pattern 24 on the base insulating layer 23 and the second mark 42 on the metal thin film M2.

[0122] After the electrolytic plating is complete, the plating resist R1 is removed.

[0123] (3) Second conductor pattern formation process Next, in the second conductor pattern formation process, the second conductor pattern 25 (see Figure 8A) is formed, as well as the third mark 43 (see Figure 8B).

[0124] More specifically, as shown in Figures 7A and 7B, a plating resist R2 is applied to one side surface of the substrate M1 in the thickness direction. The plating resist R2 covers the metal thin film M2, the base insulating layer 23, the first conductor pattern 24, the first mark 41, and the second mark 42.

[0125] Next, the photomask PM2 for forming the second conductor pattern 25 is aligned with the base insulating layer 23 using the first mark 41. If precise positional accuracy of the second conductor pattern 25 relative to the first conductor pattern 24 is required, the photomask PM2 may be aligned with the first conductor pattern 24 using the second mark 42.

[0126] The photomask PM2 has a mask pattern 201 (see Figure 7A) and a plurality of alignment patterns 202 (see Figure 7B).

[0127] The mask pattern 201 has the same shape as the second conductor pattern 25 (see Figure 1). The mask pattern 201 blocks light.

[0128] Alignment pattern 202 has the same shape as the third mark 43 (see Figure 3). Alignment pattern 202 blocks light.

[0129] In the photomask PM2, the parts excluding the mask pattern 201 and alignment pattern 202 transmit light.

[0130] As shown in Figure 7B, the photomask PM2 is aligned with the substrate M1 such that, when viewed from one side in the thickness direction, the center 202A of the alignment pattern 202 coincides with the center 41A of the first mark 41. With the center 102A of the alignment pattern 202 coinciding with the center 41A of the first mark 41, the mask pattern 201 overlaps with the base insulating layer 23, as shown in Figure 7A.

[0131] Next, in the second conductor pattern formation process, the plating resist R2 is exposed and developed through the photomask PM2.

[0132] As a result, the portions of the plating resist R2 that were shielded by the mask pattern 201 and the alignment pattern 202 are removed, and the seed layer 20 is exposed in the areas where the second conductor pattern 25 and the third mark 43 are formed. On the other hand, the exposed portions of the plating resist R2, i.e., the portions where the second conductor pattern 25 and the third mark 43 are not formed, remain.

[0133] Next, as shown in Figures 8A and 8B, a second conductor pattern 25 (see Figure 8A) and a third mark 43 (see Figure 8B) are formed on the exposed seed layer 20 by electroplating. This forms the second conductor pattern 25 on the base insulating layer 23 and the third mark 43 on the metal thin film M2.

[0134] Subsequently, the plating resist R2 is peeled off, and the seed layer 20 exposed by the peeling off of the plating resist R2 is removed by etching.

[0135] (4) Cover insulation layer formation process Next, in the cover insulating layer formation process, a cover insulating layer 26 (see Figure 2A) and a cover layer 44 (see Figure 2B) are formed. The cover insulating layer formation process is performed after the second conductor pattern formation process.

[0136] More specifically, as shown in Figures 9A and 9B, in the cover insulating layer formation process, a photosensitive resin solution (varnish) is applied to the metal thin film M2, base insulating layer 23, first conductor pattern 24, second conductor pattern 25, first mark 41, second mark 42, and third mark 43 and dried to form a photosensitive resin coating film F.

[0137] Next, the photomask PM3 for forming the cover insulating layer 26 is aligned with the base insulating layer 23 using the first mark 41. Alternatively, in the cover insulating layer formation step, the photomask PM3 for forming the cover insulating layer 26 may be aligned with the first conductor pattern 24 using the second mark 42.

[0138] The photomask PM3 has a mask pattern 301 (see Figure 9A) and a plurality of alignment patterns 302 (see Figure 9B).

[0139] The mask pattern 301 has a light-shielding portion 301A and a light-transmitting portion 301B. The light-shielding portion 301A blocks light. The light-transmitting portion 301B transmits light.

[0140] Alignment pattern 302 has the same shape as the fourth mark 44A (see Figure 3). Alignment pattern 302 blocks light.

[0141] As shown in Figure 9B, the photomask PM3 is aligned with the substrate M1 such that, when viewed from one side in the thickness direction, the center 302A of the alignment pattern 302 coincides with the center 41A of the first mark 41. With the center 302A of the alignment pattern 302 coinciding with the center 41A of the first mark 41, as shown in Figure 9A, the light-shielding portion 301A overlaps with the portion of the coating film F that does not form the cover insulating layer 26, and the transparent portion 301B overlaps with the portion of the coating film F that forms the cover insulating layer 26.

[0142] Next, the photosensitive resin coating film F is exposed to light and developed. This forms the cover insulating layer 26 and the cover layer 44, as shown in Figures 2A and 2B.

[0143] Subsequently, the notches 5 described above are formed by etching the substrate M1 and the metal thin film M2.

[0144] With the above steps, aggregate sheet 1 is complete.

[0145] Furthermore, the manufacturing method for the aggregate sheet 1 may also include an inspection step.

[0146] In the inspection process, the misalignment of each layer of the wiring circuit board 2 (base insulating layer 23, first conductor pattern 24, second conductor pattern 25, and cover insulating layer 26) may be inspected using alignment marks 4.

[0147] For example, by measuring the distance between the center of the first mark 41 and the center of the second mark 42, the misalignment of the first conductor pattern 24 relative to the base insulating layer 23 can be inspected. Also, by measuring the distance between the center of the third mark 43 and the center of the second mark 42, the misalignment of the second conductor pattern 25 relative to the first conductor pattern 24 can be inspected. Also, by measuring the distance between the center of the third mark 43 and the center of the first mark 41, the misalignment of the second conductor pattern 25 relative to the base insulating layer 23 can be inspected. Also, by measuring the distance between the center of the fourth mark 44A and the center of the first mark 41, the misalignment of the cover insulating layer 26 relative to the base insulating layer 23 can be inspected. Also, by measuring the distance between the center of the fourth mark 44A and the center of the second mark 42, the misalignment of the cover insulating layer 26 relative to the first conductor pattern 24 can be inspected. Also, by measuring the distance between the center of the fourth mark 44A and the center of the third mark 43, the misalignment of the second cover insulating layer 27 relative to the second conductor pattern 25 can be inspected.

[0148] 3. Effects (1) According to the assembled sheet 1, as shown in Figures 2B and 3, a first mark 41 made of the same material as the base insulating layer 23 (see Figure 2A) and a second mark 42 made of the same material as the first conductor pattern 24 (see Figure 2A) are both placed on one side surface S11 of the metal layer 40, forming one alignment mark 4.

[0149] Therefore, by image recognition of one alignment mark 4 from one side of the metal layer 40, both the first mark 41, which is made of the same material as the base insulating layer 23, and the second mark 42, which is made of the same material as the first conductor pattern 24, can be detected.

[0150] As a result, multiple marks (first mark 41 and second mark 42) can be easily detected by image recognition.

[0151] (2) According to the aggregate sheet 1, as shown in Figure 3, the first mark 41 has a polygonal plate shape, and the second mark 42 has a polygonal ring shape. The second mark 42 surrounds the first mark 41.

[0152] Therefore, a single alignment mark 4 having the first mark 41 and the second mark 42 can be formed with a simple configuration in which the second mark 42 surrounds the first mark 41.

[0153] Furthermore, the center of the first mark 41 can be calculated from its peripheral edge, and the center of the second mark 42 can be calculated from its peripheral edge.

[0154] Therefore, by measuring the distance between the center of the first mark 41 and the center of the second mark 42, the misalignment of the first conductor pattern 24 relative to the base insulating layer 23 can be inspected.

[0155] (3) According to the assembled sheet 1, as shown in Figure 2B, the metal layer 40 of the alignment mark 4 has a first metal layer 401 made of the same material as the metal support layer 21 (see Figure 2A) and a second metal layer 402 made of the same material as the protective metal layer 22 (see Figure 2A). The second metal layer 402 is positioned on one side surface 401A of the first metal layer 401 in the thickness direction.

[0156] Therefore, in image recognition, the reflectivity of one side surface S11 of the background metal layer 40 can be adjusted by the second metal layer 402.

[0157] As a result, the detection accuracy of alignment marks 4 can be improved.

[0158] (4) According to the assembled sheet 1, as shown in Figures 2B and 3, the alignment mark 4 further has a third mark 43 made of the same material as the second conductor pattern 25. The third mark 43 is positioned on one side surface S11 of the metal layer 40 together with the first mark 41 and the second mark 42. The third mark 43 has a polygonal ring shape and surrounds the second mark 42.

[0159] This allows for the formation of a single alignment mark 4 having the first mark 41, the second mark 42, and the third mark 43, with the third mark 43 surrounding the second mark 42.

[0160] Furthermore, by measuring the distance between the center of the third mark 43 and the center of the second mark 42, the misalignment of the second conductor pattern 25 relative to the first conductor pattern 24 can be inspected.

[0161] Furthermore, by measuring the distance between the center of the third mark 43 and the center of the first mark 41, the misalignment of the second conductor pattern 25 relative to the base insulating layer 23 can be inspected.

[0162] (5) According to the assembled sheet 1, as shown in Figure 2B, the alignment marks 4 further have a cover layer 44 made of the same material as the cover insulating layer 26. The cover layer 44 is placed on one side surface S11 of the metal layer 40 and covers the first mark 41, the second mark 42 and the third mark 43.

[0163] Therefore, the alignment mark 4 can be protected by the cover layer 44.

[0164] Furthermore, by checking the covering state of the first mark 41, second mark 42, and third mark 43 by the cover layer 44, the covering state of the first conductor pattern 24 and the second conductor pattern 25 by the cover insulating layer 26 can be inspected.

[0165] (6) According to the assembled sheet 1, as shown in Figures 2B and 3, the cover layer 44 has a fourth mark 44A. The fourth mark 44A has a polygonal ring shape and surrounds the first mark 41, the second mark 42 and the third mark 43.

[0166] This allows for a simple configuration in which the fourth mark 44A surrounds the first mark 41, the second mark 42, and the third mark 43, thereby forming a single alignment mark 4 having the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A.

[0167] Furthermore, by measuring the distance between the center of the fourth mark 44A and the center of the second mark 42, the misalignment of the cover insulating layer 26 relative to the first conductor pattern 24 can be inspected.

[0168] Furthermore, by measuring the distance between the center of the fourth mark 44A and the center of the third mark 43, the misalignment of the cover insulating layer 26 relative to the second conductor pattern 25 can be inspected.

[0169] Furthermore, by measuring the distance between the center of the fourth mark 44A and the center of the first mark 41, the misalignment of the cover insulating layer 26 relative to the base insulating layer 23 can be inspected.

[0170] (7) As shown in Figure 1, the aggregate sheet 1 has a first alignment mark 4A, a second alignment mark 4B positioned away from the first alignment mark 4A in the width direction, and a third alignment mark 4C positioned away from the second alignment mark 4B in the flow direction.

[0171] Therefore, the positional accuracy of the photomasks PM1, PM2, and PM3 relative to the aggregate sheet 1 can be improved in both the width direction and the flow direction.

[0172] (8) According to the assembly sheet 1, as shown in Figure 1, the second alignment mark 4B is smaller than the first alignment mark 4A and the third alignment mark 4C.

[0173] Therefore, by checking the position of the second alignment mark 4B, the width direction and flow direction of the aggregate sheet 1 can be easily recognized.

[0174] (9) According to the aggregate sheet 1, as shown in Figure 1, the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction is different from the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction.

[0175] Therefore, by checking the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction, and the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction, the width direction and flow direction of the assembly sheet 1 can be easily determined.

[0176] (10) According to the manufacturing method of the aggregate sheet 1, as shown in Figures 4A and 4B, in the base insulating layer formation step, the first mark 41 is formed together with the base insulating layer 23, and the positional relationship between the base insulating layer 23 and the first mark 41 is determined.

[0177] Then, as shown in Figures 5A and 5B, in the first conductor pattern formation step, the first mark 41 is used to align the photomask PM1 for forming the first conductor pattern 24 with respect to the base insulating layer 23.

[0178] This improves the positional accuracy of the first conductor pattern 24 relative to the base insulating layer 23.

[0179] Furthermore, as shown in Figures 6A and 6B, in the first conductor pattern formation process, the second mark 42 is formed together with the first conductor pattern 24, and the positional relationship between the first conductor pattern 24 and the second mark 42 is determined.

[0180] Then, as shown in Figures 9A and 9B, in the cover insulating layer formation process, the first mark 41 is used to align the photomask PM3 for forming the cover insulating layer 26 with respect to the base insulating layer 23.

[0181] This improves the positional accuracy of the cover insulating layer 26 relative to the base insulating layer 23.

[0182] (11) According to the manufacturing method of the aggregate sheet 1, as shown in Figures 7A and 7B, in the second conductor pattern formation step, the first mark 41 is used to align the photomask PM2 for forming the second conductor pattern 25 with respect to the base insulating layer 23.

[0183] This improves the positional accuracy of the second conductor pattern 25 relative to the base insulating layer 23.

[0184] 4. Variations Next, a modified example will be described. In the modified example, the same reference numerals are used for components similar to those in the above-described embodiment, and their descriptions are omitted.

[0185] (1) In the second conductor pattern formation process described above (see Figures 7A and 7B), the photomask PM2 can also be aligned with respect to the first conductor pattern 24 using the second mark 42. In this case, the positional accuracy of the second conductor pattern 25 with respect to the first conductor pattern 24 can be improved.

[0186] Furthermore, in the cover insulating layer formation process described above (see Figures 9A and 9B), the photomask PM3 can also be aligned with respect to the first conductor pattern 24 using the second mark 42. In this case, the positional accuracy of the cover insulating layer 26 with respect to the first conductor pattern 24 can be improved.

[0187] Furthermore, the third mark 43 can be used to align the photomask PM3 with respect to the second conductor pattern 25. In this case, the positional accuracy of the cover insulating layer 26 with respect to the second conductor pattern 25 can be improved.

[0188] (2) As shown in Figure 10A, the alignment marks 4 may be circular in shape. Specifically, the first mark 41 may be disc-shaped, and the second mark 42, third mark 43, and fourth mark 44A may have annular shapes. The second mark 42 surrounds the first mark 41, the third mark 43 surrounds the second mark 42, and the fourth mark 44A surrounds the third mark 43.

[0189] (3) In the radial direction of the alignment mark 4, the order of the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A is not limited.

[0190] For example, as shown in Figure 10B, the first mark 41 may be positioned outside of the second mark 42, the third mark 43, and the fourth mark 44A. In other words, the first mark 41 may surround the second mark 42, the third mark 43, and the fourth mark 44A. In this case, the first mark 41 may have a ring shape or a polygonal ring shape.

[0191] In this modified example, a single alignment mark 4 can be formed having the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A, with the first mark 41 surrounding the second mark 42, the third mark 43, and the fourth mark 44A.

[0192] (4) As shown in Figure 11A, the second conductor pattern 25 may be arranged on one side of the cover insulating layer 26 (first cover insulating layer) in the thickness direction. In this modified example, the cover insulating layer 26 does not cover the second conductor pattern 25. In this case, the wiring circuit board 2 may have a second cover insulating layer 27.

[0193] The second cover insulating layer 27 is positioned on one side of the cover insulating layer 26 in the thickness direction. The second cover insulating layer 27 covers the second conductor pattern 25. More specifically, the second cover insulating layer 27 covers the wiring 253A and 253B. The second cover insulating layer 27 does not cover the terminals 241A, 241B, 251A, 251B, 242A, 242B, 252A, and 252B. The second cover insulating layer 27 is made of the same resin as the cover insulating layer 26, for example. Preferably, the second cover insulating layer 27 is made of polyimide.

[0194] Furthermore, in this modified example, as shown in Figure 11B, the alignment mark 4 may have a cover layer 44 (first cover layer) and a second cover layer 45.

[0195] In this modified example, as in the embodiment described above, the cover layer 44 covers the first mark 41 and the second mark 42. However, in this modified example, unlike the embodiment described above, the cover layer 44 does not cover the third mark 43.

[0196] In this modified example, the third mark 43 is positioned on one side surface S21 of the cover layer 44 in the thickness direction. As shown in Figure 12, the fourth mark 44A of the cover layer 44 is positioned between the second mark 42 and the third mark 43 in the radial direction of the alignment mark 4. The fourth mark 44A surrounds the second mark 42.

[0197] As shown in Figure 11B, the second cover layer 45 is positioned on one side surface S21 of the cover layer 44 in the thickness direction. The second cover layer 45 is made of a transparent resin. The second cover layer 45 may be made of the same material as the second cover insulating layer 27 of the wiring circuit board 2 (see Figure 11A). Preferably, the second cover layer 45 is made of polyimide. The second cover layer 45 covers the third mark 43. The second cover layer 45 has a fifth mark 45A.

[0198] As shown in Figure 12, the fifth mark 45A is positioned outside the third mark 43 in the radial direction of the alignment mark 4. The fifth mark 45A surrounds the third mark 43. The fifth mark 45A is positioned at a distance from the third mark 43 in the radial direction of the alignment mark 4. The fifth mark 45A is a slit. The fifth mark 45A has an annular shape or a polygonal annular shape.

[0199] In this modified example, the second conductor pattern formation step is performed after the first cover insulating layer formation step. More specifically, in this modified example, unlike the embodiment described above, the steps are performed in the following order: base insulating layer formation step, first conductor pattern formation step, cover insulating layer formation step (first cover insulating layer formation step), and second conductor pattern formation step.

[0200] According to this modified example, even if the second conductor pattern 25 is positioned on one side of the cover insulating layer 26, a single alignment mark 4 having the first mark 41, the second mark 42, and the third mark 43 can be formed with a simple configuration in which the third mark 43 surrounds the second mark 42.

[0201] Furthermore, according to this modified example, a single alignment mark 4 having a first mark 41, a second mark 42, a third mark 43, a fourth mark 44A, and a fifth mark 45A can be formed with a simple configuration in which the fourth mark 44A of the cover layer 44 surrounds the second mark 42, and the fifth mark 45A of the second cover layer 45 surrounds the third mark 43.

[0202] Furthermore, by measuring the distance between the center of the fourth mark 44A and the center of the second mark 42, the misalignment of the cover insulating layer 26 relative to the first conductor pattern 24 can be inspected.

[0203] Furthermore, by measuring the distance between the center of the fifth mark 45A and the center of the third mark 43, the misalignment of the second cover insulating layer 27 relative to the second conductor pattern 25 can be inspected.

[0204] (5) The placement of the alignment marks 4 is not limited. For example, as shown in Figure 13, the alignment marks 4 do not have to be placed on the frame 3. The alignment marks 4 may be placed between multiple wiring circuit boards 2.

[0205] (6) As shown in Figure 14, the assembly sheet 1 may have two alignment marks 4. In this case, one alignment mark 4 may be located at one end of the frame 3 in the width direction and in the center of the frame 3 in the flow direction. The other alignment mark 4 may be located at the other end of the frame 3 in the width direction and in the center of the frame 3 in the flow direction.

[0206] (7) Also, as shown in Figure 15, one alignment mark 4 may be located at one end of the frame 3 in the flow direction and in the center of the frame 3 in the width direction. Another alignment mark 4 may be located at the other end of the frame 3 in the flow direction and in the center of the frame 3 in the width direction.

[0207] (8) Alternatively, as shown in Figure 16, the system may include two alignment marks 4 as shown in Figure 14 and two alignment marks 4 as shown in Figure 15.

[0208] (9) The same effects and advantages as those of the above-described embodiment can be obtained with the above-described modified examples (1) to (8). Furthermore, the above-described embodiment and the above-described modified examples (1) to (8) can be combined with each other. [Explanation of symbols]

[0209] 1. Collective Sheet 2 Wiring circuit board 3 frames 4 Alignment Marks 4A First Alignment Mark 4B Second Alignment Mark 4C Third Alignment Mark 21 Metal support layer 22 Protective metal layer 23 Base insulating layer 24 First Conductor Pattern 25 Second Conductor Pattern 26 Cover insulating layer (first cover insulating layer) 27. Second cover insulating layer 40 metal layer 401 1st metal layer 401A One side surface of the first metal layer 402 2nd metal layer 41 First Mark 42 Second Mark 43 Third Mark 44 Cover layer (First cover layer) 44A Mark 4 45. Second Cover Layer 45A Mark 5 D1 Distance between the first alignment mark and the second alignment mark D2 Distance between the second alignment mark and the third alignment mark PM2 Photomask for forming the second conductor pattern Photomask for forming PM3 cover insulating layer S11 One side surface of the metal layer S21 Cover insulating layer, one side surface

Claims

1. A wiring circuit board having a metal support layer, a base insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer, and a first conductor pattern disposed on one side of the base insulating layer in the thickness direction, Alignment marks and Equipped with, The aforementioned alignment marks are Metal layer, A first mark is disposed on one side surface of the metal layer in the thickness direction and is made of the same material as the base insulating layer of the wiring circuit board, A second mark is disposed on one side surface of the metal layer in the thickness direction and is made of the same material as the first conductor pattern of the wiring circuit board. A composite sheet having the following characteristics.

2. The first mark has a disc shape or a polygonal plate shape, The aggregate sheet according to claim 1, wherein the second mark has a ring shape or a polygonal ring shape and surrounds the first mark.

3. Each of the first and second marks has a ring shape or a polygonal ring shape. The first mark surrounds the second mark, as described in claim 1.

4. The aforementioned wiring circuit board is The present invention further comprises a protective metal layer disposed between the metal support layer and the base insulating layer in the thickness direction, The metal layer of the alignment mark is A first metal layer made of the same material as the metal support layer of the wiring circuit board, The aggregate sheet according to claim 1, further comprising a second metal layer disposed on one side surface of the first metal layer in the thickness direction and made of the same material as the protective metal layer.

5. The aforementioned wiring circuit board is The present invention further comprises a second conductor pattern, which is disposed on one side of the base insulating layer in the thickness direction and is thicker than the first conductor pattern. The aforementioned alignment marks are The aggregate sheet according to claim 1, wherein a third mark is arranged on one side surface of the metal layer in the thickness direction, is made of the same material as the second conductor pattern, has an annular shape or a polygonal annular shape, and further has a third mark surrounding the second mark.

6. The aforementioned wiring circuit board is The present invention further comprises a first cover insulating layer, which is disposed on one side of the base insulating layer in the thickness direction and covers the first conductor pattern. The aforementioned alignment marks are The aggregate sheet according to claim 1, further comprising a cover layer disposed on one side surface of the metal layer in the thickness direction, made of the same material as the first cover insulating layer of the wiring circuit board, and covering the first mark and the second mark.

7. The aggregate sheet according to claim 6, wherein the cover layer of the alignment mark has an annular shape or a polygonal annular shape and has a fourth mark surrounding the second mark.

8. The aforementioned wiring circuit board is A first cover insulating layer is disposed on one side of the base insulating layer in the thickness direction and covers the first conductor pattern, A second conductor pattern is disposed on one side of the first cover insulating layer in the thickness direction and is thicker than the first conductor pattern, The second cover insulating layer is arranged on one side of the first cover insulating layer in the thickness direction and covers the second conductor pattern. It further possesses, The aforementioned alignment marks are Disposed on one side surface of the metal layer in the thickness direction, the first cover layer is made of the same material as the first cover insulating layer of the wiring circuit board, and covers the first mark and the second mark, Displaced on one side surface of the first cover layer in the thickness direction, made of the same material as the second conductor pattern, having an annular or polygonal annular shape, and a third mark surrounding the second mark. The aggregate sheet according to claim 1, further comprising the above.

9. The aforementioned alignment marks are The second cover layer is further disposed on the one side surface of the first cover layer in the thickness direction, is made of the same material as the second cover insulating layer of the wiring circuit board, and covers the third mark. The first cover layer of the alignment mark has an annular or polygonal annular shape and has a fourth mark surrounding the second mark. The aggregate sheet according to claim 8, wherein the second cover layer of the alignment mark has an annular or polygonal annular shape and has a fifth mark surrounding the third mark.

10. The aforementioned aggregate sheet is Having a frame that supports the aforementioned wiring circuit board, The assembly sheet according to claim 1, wherein the alignment marks are arranged on the frame.

11. The assembly sheet has a plurality of the wiring circuit boards, The assembly sheet according to claim 1, wherein the alignment marks are arranged between a plurality of wiring circuit boards.

12. The aggregate sheet according to claim 1, wherein the aggregate sheet comprises a plurality of alignment marks.

13. The aggregate sheet extends in a width direction perpendicular to the thickness direction, and in a flow direction perpendicular to both the thickness direction and the width direction. Multiple alignment marks are, The first alignment mark and A second alignment mark positioned away from the first alignment mark in the width direction, A third alignment mark positioned away from the second alignment mark in the flow direction, The aggregate sheet according to claim 12, including the aggregate sheet according to claim 12.

14. The aggregate sheet according to claim 13, wherein the second alignment mark is smaller than the first alignment mark and the third alignment mark.

15. The aggregate sheet according to claim 13, wherein the distance between the first alignment mark and the second alignment mark in the width direction is different from the distance between the second alignment mark and the third alignment mark in the flow direction.

16. A method for manufacturing an aggregate sheet according to any one of claims 1 to 15, The aforementioned wiring circuit board is The present invention further comprises a first cover insulating layer, which is disposed on one side of the base insulating layer in the thickness direction and covers the first conductor pattern. The method for manufacturing the aggregate sheet is as follows: A base insulating layer forming step, in which the base insulating layer is formed and the first mark is formed, A first conductor pattern forming step in which the first conductor pattern is formed and the second mark is formed, A first cover insulating layer forming step for forming the aforementioned first cover insulating layer and Includes, A method for manufacturing an aggregate sheet, comprising the steps of forming the first cover insulating layer, wherein in the first cover insulating layer formation step, the first mark is used to align the photomask for forming the first cover insulating layer with respect to the base insulating layer, or the second mark is used to align the photomask for forming the first cover insulating layer with respect to the first conductor pattern.

17. The aforementioned wiring circuit board is It further has a second conductor pattern that is thicker than the first conductor pattern, The method for manufacturing the aggregate sheet is as follows: The process further includes a second conductor pattern forming step for forming the second conductor pattern, The method for manufacturing an aggregate sheet according to claim 16, wherein in the second conductor pattern formation step, the first mark is used to align the photomask for forming the second conductor pattern with respect to the base insulating layer, or the second mark is used to align the photomask for forming the second conductor pattern with respect to the first conductor pattern.

18. The second conductor pattern is arranged on one side of the base insulating layer in the thickness direction, The method for manufacturing an aggregate sheet according to claim 17, wherein the first cover insulating layer formation step is performed after the second conductor pattern formation step.

19. The second conductor pattern is arranged on one side of the first cover insulating layer in the thickness direction, The method for manufacturing an aggregate sheet according to claim 17, wherein the second conductor pattern formation step is performed after the first cover insulating layer formation step.

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