Manufacturing method of connector

Abstract

The present invention provides a method for manufacturing a connector that can increase the bonding strength between the connected portion and the central conductor. [Solution] A method for manufacturing a connector according to one aspect of the present disclosure is a method for manufacturing a connector in which central conductors exposed at the tip of an insulated wire are soldered in a one-to-one ratio to a plurality of connection parts arranged in parallel on a substrate, the method comprising the steps of: arranging the central conductors in a one-to-one ratio to the connection parts where solder is arranged; and pressing the plurality of central conductors arranged in the arranging step against the plurality of connection parts, wherein in the pressing step the plurality of central conductors are heated and pressed by a pressing jig, and the pressing jig has a cushion part and a heat conducting part in this order in the direction in which the plurality of central conductors are pressed.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a connector.

Background Art

[0002] There is known a connector formed by performing one-to-one soldering between a plurality of connection parts arranged in parallel on a substrate and a central conductor exposed at the tip of an insulated wire (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] A method for manufacturing a connector according to an aspect of the present disclosure is a method for manufacturing a connector in which a central conductor exposed at the tip of an insulated wire is soldered one-to-one to a plurality of connection parts arranged in parallel on a substrate, the method including: a step of arranging the central conductors one-to-one with respect to the connection parts on which solder is arranged; and a step of pressing the plurality of central conductors arranged in the arranging step against the plurality of connection parts, in the pressing step, the plurality of central conductors are heated and pressed by a pressing jig, and the pressing jig has a cushion part and a heat conduction part in this order in a direction in which the plurality of central conductors are pressed.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 1 is a flowchart showing a method for manufacturing a connector according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a plan view for explaining the arranging step in the manufacturing method of FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4]Figure 4 is a plan view showing the state in which pressure jigs are arranged on multiple central conductors during the pressing process of the manufacturing method shown in Figure 1. [Figure 5] Figure 5 is a cross-sectional view taken along the VV line, showing the state before pressing by the pressure jig during the pressing process of the manufacturing method shown in Figure 1. [Figure 6] Figure 6 is a cross-sectional view showing the state in which multiple central conductors are pressed by a pressure jig during the pressing step of the manufacturing method shown in Figure 1. [Figure 7] Figure 7 is a cross-sectional view showing the state in which multiple central conductors are heated by a pressure jig during the pressing step of the manufacturing method shown in Figure 1. [Figure 8] Figure 8 is a cross-sectional view showing a connector manufactured by the manufacturing method shown in Figure 1. [Figure 9] Figure 9 is a cross-sectional view showing a modified example of a connector manufactured by the manufacturing method of the present disclosure. [Figure 10] Figure 10 is a cross-sectional view corresponding to Figure 5, showing a first modified example of a pressurizing jig used in the manufacturing method of the present disclosure. [Figure 11] Figure 11 is a cross-sectional view corresponding to Figure 5, showing a second modified example of the pressurizing jig used in the manufacturing method of the present disclosure. [Figure 12] Figure 12 is a cross-sectional view corresponding to Figure 5, showing a third modified example of the pressurizing jig used in the manufacturing method of the present disclosure. [Figure 13] Figure 13 is a cross-sectional view corresponding to Figure 5, showing a fourth modified example of the pressurizing jig used in the manufacturing method of the present disclosure. [Figure 14] Figure 14 is a plan view corresponding to Figure 4, showing a fifth modified example of the pressurizing jig used in the manufacturing method of the present disclosure. [Figure 15] Figure 15 is a cross-sectional view taken from line XV-XV showing a sixth modified example of the pressurizing jig used in the manufacturing method of the present disclosure. [Figure 16] Figure 16 is a plan view showing a modified example of a heat conduction section used in the manufacturing method of the present disclosure. [Figure 17] Figure 17 is a plan view showing a modified example of the heat conduction section used in the manufacturing method of this disclosure, different from that shown in Figure 16. [Figure 18] Figure 18 is a plan view showing a modified example of the heat conduction section used in the manufacturing method of this disclosure, different from Figures 16 and 17. [Modes for carrying out the invention]

[0006] [Issues this disclosure aims to address] Today, with the miniaturization of insulated wires and the reduction in the surface area of ​​connection points, the amount of solder that can be placed on the connection points is also becoming limited. As a result, there is a need for technology that can reliably solder the central conductor to the connection point.

[0007] Patent Document 1 describes a method in which solder is applied to the upper surface of a conductive joint, the core wire of a coaxial cable is placed on this upper surface, and then the conductive joint, solder, and core wire are covered with a light-transmitting sheet. Patent Document 1 describes that the light-transmitting sheet has an adhesive layer that adheres to the core wire and solder. Patent Document 1 describes that the light-transmitting sheet is positioned so that the core wire does not deform or move in the vertical and horizontal directions, and then light is shone toward the light-transmitting sheet to melt the solder with light energy, thereby soldering the conductive joint and the core wire together.

[0008] However, according to the technique described in Reference 1, solder can only be applied to the lower half of the side surface of the core wire, making it difficult to sufficiently increase the bonding strength between the core wire and the conductive joint.

[0009] This disclosure is made in accordance with the above circumstances and aims to provide a method for manufacturing a connector that can increase the bonding strength between the connected portion and the central conductor.

[0010] [Effects of this disclosure] A method for manufacturing a connector according to one aspect of this disclosure can increase the bonding strength between the connected portion and the central conductor.

[0011] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and described.

[0012] (1) The manufacturing method of a connector according to one aspect of the present disclosure is a manufacturing method of a connector in which central conductors exposed at the tip portions of insulated wires are soldered one-to-one to a plurality of connection parts arranged in parallel on a substrate. The manufacturing method includes a step of arranging the central conductors one-to-one with respect to the connection parts on which solder is arranged, and a step of pressing the plurality of central conductors arranged in the arranging step against the plurality of connection parts. In the pressing step, the plurality of central conductors are heated and pressed by a pressing jig, and the pressing jig has a cushion part and a heat conduction part in this order in the direction of pressing the plurality of central conductors.

[0013] In the manufacturing method of the connector, since the pressing jig has a cushion part and a heat conduction part in this order in the direction of pressing the plurality of central conductors, when the pressing jig is pressed against the plurality of central conductors, the plurality of central conductors can be pressed with uniform pressure. As a result, in the manufacturing method of the connector, the plurality of central conductors can be soldered in a state of being evenly adhered to the plurality of connection parts. Further, in the manufacturing method of the connector, since the pressing jig has the heat conduction part, the plurality of central conductors and the plurality of connection parts can be soldered while heating the regions of the plurality of central conductors on the side opposite to the plurality of connection parts. As a result, the height of the solder fillet can be increased, and the contact area between the plurality of central conductors, the plurality of connection parts, and the solder fillet can be increased. Therefore, the manufacturing method of the connector can enhance the bonding strength between the connection part and the central conductor.

[0014] (2) In the above (1), in the pressing step, the cushion portion and the heat conduction portion may be deformed following the shape of the plurality of central conductors. According to this aspect, while positioning the plurality of central conductors with respect to the plurality of connection portions, the plurality of central conductors and the plurality of connection portions can be soldered more reliably. Further, according to this aspect, even when there is a height variation, for example, in the soldering surface (the surface opposite to the surface disposed on the substrate) in the plurality of connection portions, the plurality of central conductors and the plurality of connection portions can be soldered reliably.

[0015] (3) In the above (1) or (2), the pressing jig may further have a pressing portion disposed on the surface opposite to the side where the heat conduction portion in the cushion portion is disposed. According to this aspect, the cushion portion and the heat conduction portion can be easily and reliably pressed against the plurality of central conductors.

[0016] (4) In any one of the above (1) to (3), in the pressing step, the plurality of central conductors may be non-adhesively pressed by the heat conduction portion. According to this aspect, the height of the solder fillet can be made larger more easily.

[0017] (5) In any one of the above (1) to (4), in the pressing step, the heat conduction portion may not be brought into contact with the substrate. According to this aspect, the height of the solder fillet can be made larger more easily.

[0018] (6) In any one of the above (1) to (5), the heat conduction portion may have a heated region protruding from the cushion portion in a plan view. According to this aspect, the heat conduction portion can be easily heated.

[0019] (7) In (6) above, the heated region may protrude in the axial direction of the plurality of central conductors. According to this embodiment, the plurality of central conductors and the solder arranged on the plurality of connected parts can be heated uniformly via the heat conducting portion. As a result, the plurality of central conductors and the plurality of connected parts can be easily soldered together with uniform bonding strength.

[0020] (8) In (3) above, the heat conduction portion is bent so as to be in contact with the pressurizing portion, and the heat conduction portion may be heated by the heat from the pressurizing portion. According to this embodiment, for example, by integrating the pressurizing portion and the heat source, the installation area of ​​the device can be reduced and costs can be reduced. In addition, the heating rate and the maximum temperature that can be reached of the multiple central conductors can be improved, and the manufacturing efficiency of the connector can be increased.

[0021] (9) In any of (1) to (8) above, the heat conduction portion may have a solder desoldering surface that is in contact with the plurality of central conductors. According to this embodiment, solder can be prevented from joining to the heat conduction portion. As a result, the plurality of central conductors and the plurality of connected portions can be easily and reliably soldered together.

[0022] (10) In any of (1) to (9) above, the cushion portion may be mainly composed of rubber, soft resin, or elastomer, and the average thickness of the cushion portion may be 30 μm or more and 1000 μm or less. According to this embodiment, the plurality of central conductors can be pressed more easily with uniform pressure.

[0023] (11) In any of (1) to (10) above, the heat conductive part may be a film mainly composed of metal. According to this embodiment, excessive deformation of the cushion part can be suppressed by the heat conductive part. As a result, it is possible to prevent the solder from having insufficient space due to excessive deformation of the cushion part.

[0024] (12) In any of (1) to (11) above, the heat conduction portion may have holes, slits, or notches in the area where it is placed on the cushion portion. According to this embodiment, the heat conduction portion can be easily deformed.

[0025] (13) In any of (1) to (12) above, the plurality of central conductors may include one or more first central conductors having a first average diameter and one or more second central conductors having a second average diameter smaller than the first average diameter. According to the manufacturing method of the connector, even if the plurality of central conductors include central conductors of different diameters, the plurality of connected parts and the plurality of central conductors can be easily soldered together.

[0026] In this disclosure, "soft resin" means a resin that deforms by compression in response to external forces. "Average thickness" means the average value of the thicknesses at any 10 points. "Main component" means the component with the largest mass content, for example, a component with a content of 50% by mass or more. In this disclosure, when simply referred to as "metal," the concept includes alloys. "Diameter" means the diameter converted to a perfect circle of the same area. "Average diameter" means the average value of the diameters at any 10 points. In this disclosure, when simply referred to as "on," it means both direct contact and indirect contact. For example, "on the cushion" or "on the surface opposite to the side of the cushion where the heat conduction component is located" includes both cases where it is directly placed on the cushion and cases where it is indirectly placed on the cushion with other components in between.

[0027] In this disclosure, "pressing" means pressing against something. For example, when a pressure jig presses against a central conductor, this includes not only pressing the pressure jig against the central conductor from the opposite side of the central conductor, but also pressing the pressure jig against the central conductor by reducing pressure, pulling the pressure jig toward the central conductor, and pressing the central conductor against the pressure jig.

[0028] [Details of the embodiments of this disclosure] Preferred embodiments of this disclosure will be described below with reference to the drawings. Note that, regarding the numerical values ​​described herein, it is possible to adopt only one of the upper and lower limits, or to combine the upper and lower limits as desired. This specification includes all possible numerical ranges that can be combined. Furthermore, the figures are schematic and may not correspond to actual shapes, dimensions, proportions, etc. In this disclosure, the designations "First" and "Second" are for distinguishing the components to which they are attached and do not limit the number, order, priority, etc.

[0029] [First Embodiment] <Manufacturing method for connecting components> A method for manufacturing a connector according to one aspect of the present disclosure (hereinafter also simply referred to as "the manufacturing method") is a method for manufacturing a connector in which the central conductors exposed at the tip of an insulated wire are soldered in a one-to-one ratio to a plurality of connection parts arranged on a substrate. As shown in Figure 1, the manufacturing method comprises a step S1 of arranging the central conductors in a one-to-one ratio to the connection parts on which solder is arranged, and a step S2 of pressing the plurality of central conductors arranged in step S1 against the plurality of connection parts. In the pressing step S2, the manufacturing method heats and presses the plurality of central conductors with a pressing jig. The pressing jig has a cushion part and a heat conducting part in that order in the direction in which the plurality of central conductors are pressed.

[0030] In this manufacturing method, the pressurizing jig has a cushion portion and a heat conduction portion in that order in the direction of pressing the plurality of central conductors. Therefore, when the pressurizing jig is pressed against the plurality of central conductors, the plurality of central conductors can be pressed with uniform pressure. As a result, this manufacturing method allows the plurality of central conductors to be soldered together in a state of even contact with the plurality of parts to be connected. Furthermore, because the pressurizing jig has the heat conduction portion, this manufacturing method allows the plurality of central conductors and the plurality of parts to be connected to be soldered together while heating the region of the plurality of central conductors opposite to the plurality of parts to be connected. In other words, according to this manufacturing method, when the solder melts, a temperature gradient is formed on the plurality of central conductors from the side close to the heat conduction portion toward the plurality of parts to be connected. As a result, the movement of the molten solder can be promoted, increasing the height of the solder fillet and increasing the contact area between the plurality of central conductors and the plurality of parts to be connected and the solder fillet. Therefore, this manufacturing method can increase the joint strength between the parts to be connected and the central conductors.

[0031] This manufacturing method can flexibly accommodate a variety of substrate thicknesses and shapes, allowing for, for example, the omission of substrate thickness measurement, reduction of the time required to determine manufacturing conditions, and omission of condition changes. As a result, manufacturing costs can be reduced.

[0032] In this manufacturing method, the central conductor of an insulated wire that is exposed to the outside is soldered one-to-one to multiple connection points arranged on the substrate. First, before describing each step of this manufacturing method, an example of an object to be connected by this manufacturing method will be described with reference to Figures 2 and 3. In this embodiment, a printed circuit board 10 having pad portions 13 as connection points on a substrate 11 is connected to an insulated wire 20 having a central conductor 21 exposed from the insulating layer 22.

[0033] [Printed wiring board] The printed circuit board 10 comprises a substrate 11 and a conductive pattern 12 arranged on the substrate 11. The conductive pattern 12 has a plurality of pad portions 13 and wiring portions 14 that extend continuously from each pad portion 13. In the conductive pattern 12, the plurality of pad portions 13 are arranged in parallel. The pad portions 13 may have a structure in which the wiring portions 14 are widened in the width direction. In Figures 2 and 3, the pad portions 13 have a rectangular shape in plan view, with a long side parallel to the extending direction of the wiring portions 14 and a short side perpendicular to this long side. As long as the printed circuit board 10 comprises a substrate 11 and a plurality of pad portions 13, the other structures are not particularly limited. For example, the pad portions 13 may be directly laminated on the substrate 11, or they may be laminated with other layers in between. The number of pad portions 13 is not particularly limited, but the lower limit may be, for example, 2 or 5. The upper limit of the number of pad portions 13 may be 150 or 50. This manufacturing method ensures that even if the number of pad portions 13 is within the above range, the central conductor 21 can be reliably soldered to multiple pad portions 13 in a one-to-one ratio. In this disclosure, "plan view" means a view in the direction normal to the substrate.

[0034] The substrate 11 is insulating. The substrate 11 may or may not be flexible. If the substrate 11 is flexible, examples of its main components include polyimide, polyethylene terephthalate, liquid crystal polymer, and fluororesin. If the substrate 11 is not flexible, examples of its main components include glass epoxy, paper phenol, paper epoxy, glass composite, and glass. The printed circuit board 10 may be a flexible printed circuit board, a rigid printed circuit board, or a flex-rigid printed circuit board.

[0035] The pad portion 13 is provided, for example, continuously with the wiring portion 14. The pad portion 13 is also exposed on the substrate 11. The pad portion 13 is conductive. The main component of the pad portion 13 may be, for example, copper or gold. The surface of the pad portion 13 may also be plated, such as tin plating or gold plating. The pad portion 13 may be a laminate including an electroplated layer. The pad portion 13 may have a two-layer structure consisting of a conductive underlayer formed by, for example, sputtering, and an electroplated layer, or it may have a three-layer structure consisting of a conductive underlayer, an electroless plating layer, and an electroplated layer. The components of the conductive underlayer, the electroless plating layer, and the electroplated layer may be the same or different.

[0036] The pad portion 13 has a top surface 13a that is soldered to the central conductor 21. The top surface 13a has a flat portion parallel to the substrate 11. A solder portion 15 is formed on the top surface 13a. The solder portion 15 may be formed by, for example, solder paste. The solder portion 15 is printed on, for example, the top surface 13a. A known method can be used to print the solder portion 15, for example, screen printing. The solder portion 15 contains solder particles and flux. The type of solder included in the solder portion 15 is not particularly limited, and may be lead-free solders such as SnAgCu alloy, SnZnBi alloy, SnAgInBi alloy, SnBi alloy, SnBiAg alloy, SnBiCuNi alloy, SnZn alloy, InSnAg alloy, etc.

[0037] The lower limit of the average width W of the pad portion 13 may be 15 μm or 30 μm, from the viewpoint of ensuring reliable soldering between the pad portion 13 and the central conductor 21. On the other hand, the upper limit of the average width W may be 250 μm or 200 μm, from the perspective of the need for miniaturization of the printed circuit board 10. When the average width W is less than or equal to the upper limit, it may be important to increase the contact area between the central conductor 21 and the solder fillet in order to ensure reliable soldering between the pad portion 13 and the central conductor 21. In this respect, the manufacturing method allows for an increase in the height of the solder fillet, so that reliable soldering between the pad portion 13 and the central conductor 21 can be achieved. Note that "average width" means the average value of the widths of any five points.

[0038] The lower limit of the average pitch P of the pad portion 13 may be 35 μm or 50 μm, from the viewpoint of reliably soldering the pad portion 13 and the central conductor 21 while preventing the formation of solder bridges. On the other hand, the upper limit of the average pitch P may be 550 μm, 300 μm, 200 μm, or 100 μm, from the viewpoint of increasing the wiring density and miniaturizing the printed circuit board 10. When the average pitch P is less than or equal to the upper limit, it may be important to increase the contact area between the central conductor 21 and the solder fillet in order to reliably solder the pad portion 13 and the central conductor 21 without forming solder bridges. In this respect, according to this manufacturing method, the height of the solder fillet can be increased, so that the pad portion 13 and the central conductor 21 can be reliably soldered. Note that the "pitch" of the pad portion means the distance between the central axes of adjacent pad portions in a plan view. Also, "average pitch" means the average value of the pitch at any five points.

[0039] The heights of the top surfaces 13a of the multiple pad portions 13 may be uniform. Furthermore, in this manufacturing method, even if there is variation in the heights of the multiple top surfaces 13a, the multiple pad portions 13 and the multiple central conductors 21 can be properly soldered together. As shown in Figure 3, when there is variation in the multiple top surfaces 13a, the lower limit of the height difference Hd on the top surfaces 13a of the multiple pad portions 13 may be 2 μm or 4 μm. On the other hand, the upper limit of the height difference Hd may be 30 μm or 20 μm. Note that the "height" of the top surface refers to the height of the central part in the width direction of the top surface, and the "height difference" refers to the value obtained by subtracting the height of the top surface with the minimum height from the height of the top surface with the maximum height among the multiple pad portions. Furthermore, the "height difference" of the top surfaces may be due to variation in the height of individual pad portions, or it may be due to variation in the height of the overall structure of the printed circuit board including the substrate.

[0040] [Insulated wire] The insulated wire 20 has a two-layer structure consisting of a central conductor 21 and an insulating layer 22 laminated on the circumferential surface of the central conductor 21, with a portion of the central conductor 21 exposed to the outside. The central conductor 21 is soldered to the pad portion 13 at the portion exposed to the outside. The central conductor 21 may also be exposed to the outside at a portion that protrudes from the tip of the insulating layer 22. Alternatively, the central conductor 21 may be exposed to the outside by removing a portion of the insulating layer 22 other than the tip. In this case, the portion of the insulated wire 20 located towards the tip of the central conductor 21 than the portion that is exposed may be removed after the central conductor 21 is soldered to the pad portion 13. As a result of this removal, the central conductor 21 will have a shape that protrudes from the tip of the insulating layer 22 after being soldered to the pad portion 13. The length of the central conductor 21 protruding from the tip of the insulating layer 22 may be, for example, 0.2 mm or more and 3.0 mm or less. As long as the insulated wire 20 has a central conductor 21, the other structure is not particularly limited. The insulated wire 20 may have, for example, an outer conductor arranged on an insulating layer 22, and may also have an outer sheath arranged on the outer conductor. If the insulated wire 20 has the outer conductor and the outer sheath, the insulated wire 20 may be a coaxial cable.

[0041] The central conductor 21 may be a metal wire containing, for example, copper, copper alloy, aluminum, aluminum alloy, etc. Furthermore, the metal wire may be a single wire or a stranded wire. If the metal wire is a stranded wire, the number of strands is not particularly limited and may be, for example, 2 to 30 strands.

[0042] The cross-sectional shape perpendicular to the central axis of the central conductor 21 is not particularly limited and may be circular or rectangular, for example. If the cross-sectional shape of the central conductor 21 is circular, the central conductor 21 is, for example, a round wire. If the cross-sectional shape of the central conductor 21 is rectangular, the central conductor 21 is, for example, a square wire or a flat square wire. In this manufacturing method, if the cross-sectional shape of the central conductor 21 is circular, it is easier to increase the contact area between the central conductor 21 and the pad portion 13 and the solder fillet.

[0043] The lower limit of the average diameter of the central conductor 21 may be 10 μm, 15 μm, or 20 μm, from the viewpoint of ensuring a sufficiently large contact area with the solder fillet. On the other hand, the upper limit of the average diameter may be 200 μm, 150 μm, 100 μm, or 50 μm, from the viewpoint of preventing the central conductor 21 from becoming too large relative to the pad portion 13. In general, if the average diameter of the central conductor 21 is less than or equal to the above upper limit, and the heights of the top surfaces 13a of the multiple pad portions 13 are not uniform, some of the central conductors 21 tend to separate from the pad portions 13 when the multiple central conductors 21 are placed relative to the multiple pad portions 13. In contrast, according to this manufacturing method, even if some of the central conductors 21 are separated from the pad portion 13 in the placement process S1 described later, each central conductor 21 can be reliably soldered to the pad portion 13.

[0044] A pre-soldered section (not shown) may be provided on the circumferential surface of the portion of the central conductor 21 that is exposed to the outside. The pre-soldered section can be formed, for example, by wetting the circumferential surface of the central conductor 21 with molten solder and allowing the central conductor 21 to hold the solder. The type of solder included in the pre-soldered section is not particularly limited and may be lead-free solder such as SnAgCu alloy, SnZnBi alloy, SnAgInBi alloy, SnBi alloy, SnBiAg alloy, SnBiCuNi alloy, SnZn alloy, or InSnAg alloy. In this manufacturing method, if the amount of solder in the pre-soldered section is sufficient, the soldered section 15 described above can be omitted.

[0045] Next, we will explain each step in the manufacturing method.

[0046] (Placement process) In the placement step S1, as shown in Figures 2 and 3, the central conductor 21 is placed in a one-to-one ratio with respect to the multiple pad portions 13 on which solder is placed. The solder may be a solder portion 15 formed on the pad portion 13, or it may be the pre-solder portion placed on the central conductor 21.

[0047] In the placement step S1, the central conductor 21 is positioned relative to the pad portion 13 such that the central axis of the pad portion 13 and the central axis of the central conductor 21 coincide in a plan view. Note that "the central axis of the pad portion and the central axis of the central conductor coincide in a plan view" is not limited to a state in which the central axes coincide perfectly, but also includes a state in which the central axes coincide approximately.

[0048] In the placement step S1, the entire central conductor 21 exposed to the outside may be placed on the pad portion 13, or only a portion of the central conductor 21 may be placed on the pad portion 13. When only a portion of the central conductor 21 is placed on the pad portion 13, the length of the central conductor 21 exposed to the outside may be approximately 1.1 to 1.5 times the length of the long side of the pad portion 13.

[0049] In the placement step S1, multiple central conductors 21 may be fixed together with a fixing member (not shown) in accordance with the pitch of multiple pad portions 13, and then the multiple central conductors 21 may be placed together on the multiple pad portions 13. Examples of the fixing member include tapes and sheets used to fix multiple insulated wires 20 in an aligned state. The fixing position of the tape and sheet on the insulated wire 20 may be, for example, the insulating layer 22, an area on the central conductor 21 that does not overlap with the pad portions 13, or an area that includes a part of the portion of the central conductor 21 that overlaps with the pad portions 13.

[0050] In the placement step S1, for example, all central conductors 21 may be brought into contact with the top surface 13a of the pad portion 13 (or the solder portion 15 formed on the top surface 13a of the pad portion 13). On the other hand, in this manufacturing method, the height of the top surface 13a of the pad portion 13 may vary. In such a case, in the placement step S1, some of the central conductors 21 may be placed at a distance from the top surface 13a of the pad portion 13 (or the solder portion 15 formed on the top surface 13a of the pad portion 13). For example, when using the fixing member described above, some of the central conductors 21 may easily become separated from the pad portion 13. Even in such an embodiment, this manufacturing method can appropriately solder together multiple central conductors 21 and multiple pad portions 13.

[0051] (Pressing process) In the pressing step S2, as shown in Figures 4 to 7, a pressing jig 30 is used to heat and press multiple central conductors 21 against multiple pad portions 13. In the pressing step S2, the multiple central conductors 21 may be pressed from the opposite side of the multiple pad portions 13. In the pressing step S2, all central conductors 21 may be pressed together by a single pressing jig 30. Also, in the pressing step S2, the solder (solder portion 15 or the pre-solder portion) placed on the pad portion 13 is heated via the pressing jig 30 and melted. The molten solder forms a solder fillet 51 after hardening.

[0052] To explain the pressing process S2, we will first describe the pressurizing jig 30.

[0053] [Pressure jig] As shown in Figures 4 to 7, the pressurizing jig 30 has a cushion portion 32 and a heat conduction portion 33 in this order, in the direction of pressing the central conductor 21 (i.e., the direction approaching the central conductor 21). The pressurizing jig 30 is provided so that the heat conduction portion 33 is in direct contact with multiple central conductors 21. The pressurizing jig 30 may press the central conductor 21 by pressing the side of the cushion portion 32 opposite to the side where the heat conduction portion 33 is located with a plate material (not shown), or by pressing the central conductor 21 against the central conductor 21 by depressurizing, or by pulling the pressurizing jig 30 toward the central conductor 21, or by pressing the printed circuit board 10 against the central conductor 21 while the central conductor 21 is positioned.

[0054] (Cushion part) The cushion portion 32 is designed to compress and deform (elastically deform) by pressing against the multiple central conductors 21. In a plan view, the cushion portion 32 is sized to encompass the multiple central conductors 21 and the multiple pad portions 13.

[0055] The cushion portion 32 is layered. The main components of the cushion portion 32 include, for example, rubber, soft resin, and elastomer. Examples of rubber include silicone rubber and fluororubber. Examples of soft resin include polyvinyl chloride, polyethylene, and ethylene-vinyl acetate copolymer. Examples of elastomer include styrene-based thermoplastic elastomer and urethane-based thermoplastic elastomer. The cushion portion 32 may be heated by heat from the heat conduction portion 33. In this case, it is preferable that the cushion portion 32 has heat resistance to heat from the heat conduction portion 33.

[0056] The cushion portion 32 may have multiple voids to facilitate compression deformation that conforms to the outer shape of the multiple central conductors 21.

[0057] The lower limit of the average thickness T1 of the cushion portion 32 (see Figure 5) may be 30 μm, 100 μm, or 200 μm, from the viewpoint of enabling even pressure on the multiple central conductors 21. On the other hand, the upper limit of the average thickness T1 may be 1000 μm or 800 μm, from the viewpoint of preventing excessive deformation of the cushion portion 32 from restricting the solder's movement space.

[0058] The cushion portion 32, for example, contains the above-mentioned rubber, the above-mentioned soft resin, or the above-mentioned elastomer as its main component, and its average thickness T1 is within the above-mentioned range, thereby enabling the multiple central conductors 21 to be pressed more easily and with uniform pressure.

[0059] The lower limit of the Young's modulus of the cushion portion 32 may be 1 MPa or 2.5 MPa, from the viewpoint of sufficiently pressing the multiple central conductors 21. On the other hand, the upper limit of the Young's modulus may be 30 MPa or 5 MPa, from the viewpoint of facilitating compressive deformation that follows the outer shape of the multiple central conductors 21. In this disclosure, "Young's modulus" refers to the value measured in accordance with the "tensile modulus of elasticity" described in JIS K7161-1:2014.

[0060] (Heat conduction part) The heat conduction section 33 has thermal conductivity. Furthermore, the heat conduction section 33 is flexible enough to deform to conform to the outer shape of the multiple central conductors 21. The heat conduction section 33 is layered. Within the entire pressure jig 30, the heat conduction section 33 is positioned as the outermost layer in direct contact with the multiple central conductors 21. The heat conduction section 33 may be directly laminated onto the cushion section 32, or it may be laminated onto the cushion section 32 with other layers in between. In Figures 4 to 7, the heat conduction section 33 is directly laminated onto the surface of the cushion section 32. The heat conduction section 33 may be fixed to the cushion section 32 with an adhesive or the like.

[0061] The heat conduction section 33 deforms to conform to the outer shape of the multiple central conductors 21, pressing against the multiple central conductors 21, and heating and melting the solder placed on each of the multiple pad sections 13.

[0062] The heat conduction section 33 is formed to a size that, in a plan view, encompasses the multiple central conductors 21 and the multiple pad sections 13. In a plan view, the heat conduction section 33 may be laminated over the entire area of ​​the cushion section 32, or it may be laminated over only a portion of the cushion section 32. By reducing the laminated area of ​​the heat conduction section 33 relative to the cushion section 32, it is possible to prevent a decrease in the heating efficiency of the solder placed on the multiple central conductors 21 and the multiple pad sections 13 by preventing heat from the heat conduction section 33 from being absorbed by the cushion section 32.

[0063] The heat conduction portion 33 may have higher rigidity than the cushion portion 32. For example, the Young's modulus of the heat conduction portion 33 may be greater than that of the cushion portion 32. In this manufacturing method, if the cushion portion 32 were to directly contact the multiple central conductors 21, the cushion portion 32 might deform too much to conform to the outer shape of the multiple central conductors 21 (deforming to closely conform to the multiple central conductors 21), which could result in insufficient space for solder movement. In contrast, by laminating the heat conduction portion 33, which has higher rigidity than the cushion portion 32, onto the cushion portion 32, it is possible to easily prevent insufficient space for solder movement while allowing the cushion portion 32 to deform to follow the outer shape of the multiple central conductors 21.

[0064] The heat conduction portion 33 may be, for example, a film mainly composed of metal. In this embodiment, excessive deformation of the cushion portion 32 can be easily suppressed by the heat conduction portion 33. As a result, it is easy to prevent the solder from becoming insufficient due to excessive deformation of the cushion portion 32. Examples of the metals mentioned above include copper, aluminum, tungsten, gold, silver, molybdenum, beryllium, titanium, duralumin, and stainless steel.

[0065] Furthermore, the heat conduction section 33 may contain, for example, carbon materials such as carbon fibers, carbon nanotubes, and graphene as its main component as a heat conduction element, or it may contain crystals whose main structure is zirconia, diamond, silicon carbide, alumina, or boron nitride. Moreover, the heat conduction section 33 may be a resin sheet containing the above-mentioned heat conduction element.

[0066] The upper limit of the average thickness T2 of the heat conduction portion 33 (see Figure 5) may be 500 μm or 100 μm, from the viewpoint of ensuring sufficient flexibility. On the other hand, the lower limit of the average thickness T2 may be 5 μm or 10 μm, from the viewpoint of easily heating the solder arranged on the multiple central conductors 21 and the multiple pad portions 13.

[0067] As shown in Figure 4, the heat conduction section 33 has a heated area 33a that is heated by a heat source (not shown). More specifically, the heat conduction section 33 has a heated area 33a and a heating area 33b that heats the solder arranged on the multiple central conductors 21 and the multiple pad sections 13 by the heat transmitted from the heated area 33a. In a plan view, the heating area 33b overlaps with the cushion section 32. On the other hand, in a plan view, the heated area 33a protrudes beyond the cushion section 32. In this way, by providing the heated area 33a at a different position from the heating area 33b, thermal damage to the substrate 11, etc., when heating the heated area 33a can be reduced. The pressurizing jig 30 can easily heat the heat conduction section 33 because it has a heated area 33a that protrudes beyond the cushion section 32 in a plan view.

[0068] The direction in which the heated region 33a protrudes in a plan view is not particularly limited. However, the heated region 33a may protrude in the axial direction of the multiple central conductors 21. According to this embodiment, the heat transfer paths to the multiple central conductors 21 can be made equidistant. Therefore, the multiple central conductors 21 and the solder placed on the multiple pad portions 13 can be heated uniformly via the heated region 33b. As a result, the multiple central conductors 21 and the multiple pad portions 13 can be easily soldered together with uniform bonding strength.

[0069] The width of the heated area 33a (the length in the direction perpendicular to the central axis of the multiple central conductors 21) may be greater than or equal to the width of the heated area 33b. According to this embodiment, the multiple central conductors 21 and the solder arranged on the multiple pad portions 13 can be heated more evenly.

[0070] (heat source) The heat source for heating the heated region 33a is not particularly limited and may be, for example, hot air, a heater, or a lamp. Furthermore, if the heat conduction part 33 is a conductor, the heat source may be one that generates Joule heat by passing an electric current through it.

[0071] 〔procedure〕 The procedure in step S2, which involves pressing, will be explained below.

[0072] First, in the pressing step S2, the pressing jig 30 is placed on the multiple central conductors 21, as shown in Figures 4 and 5. The positional relationship between the pressing jig 30, the multiple central conductors 21, and the multiple pad portions 13 is as described above.

[0073] Next, in the pressing step S2, as shown in Figure 6, the multiple central conductors 21 are pressed by the pressure jig 30. More specifically, in the pressing step S2, with the bottom surface of the substrate 11 (the surface opposite to the side where the multiple pad portions 13 are located) supported by a support (not shown), the multiple central conductors 21 are pressed by the pressure jig 30 so that they are in close contact with the multiple pad portions 13.

[0074] The load in the pressing process S2 can be, for example, 1N or more and 40N or less.

[0075] In the pressing step S2, the cushion portion 32 and the heat conduction portion 33 are deformed to follow the shape of the multiple central conductors 21. According to this embodiment, the multiple central conductors 21 can be positioned relative to the multiple pad portions 13, and the multiple central conductors 21 and the multiple pad portions 13 can be soldered together more reliably. Furthermore, according to this embodiment, even if there is variation in height on the solder joint surfaces (top surface 13a) of the multiple pad portions 13, for example, the multiple central conductors 21 and the multiple pad portions 13 can be easily soldered together.

[0076] In the pressing step S2, the multiple central conductors 21 are pressed against the multiple pad portions 13 by pressing with the pressing jig 30. At this time, since the pressing jig 30 has a heat conductive portion 33 on the outermost layer that contacts the multiple central conductors 21, it deforms to follow the outer shape of the multiple central conductors 21, while still forming sufficient solder movement space S around the multiple central conductors 21. In the pressing step S2, the multiple central conductors 21 may be pressed with the pressing jig 30 while forming solder movement space S such that the height Tf of the solder fillet 51 (see Figure 8) is 0.6 times or more, or 0.7 times or more, or 0.9 times or more the diameter of the central conductor 21.

[0077] In the pressing step S2, the multiple central conductors 21 may be pressed non-adherently by the heat conduction section 33. That is, in this manufacturing method, the outermost layer of the heat conduction section 33 does not need to have, for example, an adhesive layer or a tackling layer. According to this embodiment, the height Tf of the solder fillet 51 can be increased more easily. The surface of the heat conduction section 33 may be a solder release surface, as will be described later. A "solder release surface" means a surface that prevents solder from adhering.

[0078] In the pressing step S2, the heat conduction part 33 may be brought into contact with the substrate 11, but it is not necessary to bring it into contact with the substrate 11. In this manufacturing method, contact between the heat conduction part 33 and the substrate 11 can be easily avoided if the heat conduction part 33 has appropriate rigidity (for example, higher rigidity than the cushion part 32). In this manufacturing method, the height Tf of the solder fillet 51 can be more easily increased by not bringing the heat conduction part 33 into contact with the substrate 11 in the pressing step S2. In addition, in the pressing step S2, the heat conduction part 33 may also be kept from contacting the multiple pad parts 13 in addition to the substrate 11.

[0079] Furthermore, in the pressing step S2, as shown in Figure 7, the heat conduction section 33 is heated, thereby heating the multiple central conductors 21 and the solder placed on the multiple pad sections 13 via the heat conduction section 33. In the pressing step S2, the multiple central conductors 21 and the solder may be heated after pressing the multiple central conductors 21, or the multiple central conductors 21 and the solder may be heated in parallel with pressing the multiple central conductors 21, or the multiple central conductors 21 may be pressed while the multiple central conductors 21 and the solder are heated.

[0080] In the pressing step S2, the heat conduction portion 33 is in contact with all the central conductors 21, and more specifically, the heat conduction portion 33 deforms to follow the outer shape of all the central conductors 21. Therefore, in the pressing step S2, all the central conductors 21 can be heated uniformly. As a result, variations in the shape of the solder fillets 51 for multiple central conductors 21 can be easily reduced.

[0081] In the pressing step S2, the heat conduction section 33 heats the multiple central conductors 21, allowing the solder to melt while heating the multiple central conductors 21 from their tops (the parts in contact with the heat conduction section 33). As a result, coupled with the fact that a sufficient solder movement space S is formed, the solder fillet 51 can be formed while moving the solder towards the heat conduction section 33. Therefore, according to this manufacturing method, the height Tf of the solder fillet 51 can be increased, and the contact area between the multiple central conductors 21 and the multiple pad sections 13 and the solder fillet 51 can be easily increased.

[0082] [Connector] In the pressing step S2, the multiple central conductors 21 and the multiple pad portions 13 are soldered together by the solder fillet 51, thereby obtaining the connected body 50 shown in Figure 8.

[0083] The connector 50 consists of multiple pad portions 13 arranged on the substrate 11 and a central conductor 21 arranged in a one-to-one ratio with respect to the pad portions 13, each soldered together by a solder fillet 51. In the connector 50, the central conductor 21 and the pad portions 13 are in close contact. More specifically, the multiple central conductors 21 are in close contact with the soldered pad portions 13. The specific structure of the substrate 11 and the multiple pad portions 13 in the connector 50 is as described above for the printed circuit board 10. The specific structure of the central conductor 21 in the connector 50 is as described above for the insulated wire 20.

[0084] (Solder fillet) The solder fillet 51 is formed on the pad portion 13 and solders the pad portion 13 to the central conductor 21.

[0085] The lower limit of the ratio of the height Tf of the solder fillet 51 to the diameter of the central conductor 21 may be 0.6, 0.7, or 0.9, from the viewpoint of sufficiently increasing the contact area between the central conductor 21 and the solder fillet 51. The connector 50 can be easily made larger by being manufactured by this manufacturing method. On the other hand, the upper limit of the above ratio is not particularly limited, but it can be set to 1, given that the central conductor 21 is pressed by the heat conduction part 33 in the pressing step S2.

[0086] The connector 50 may satisfy the above ratio for all central conductors 21. The connector 50 can be manufactured by the said manufacturing method to satisfy the above ratio for all central conductors 21.

[0087] [Differentiation] Modifying the connector 50 and the pressurizing jig 30 will be described with reference to Figures 9 to 18.

[0088] <Variations of the connector> In Figure 9, the connector 55 consists of multiple pad portions 13 arranged on the substrate 11 and a central conductor 56 arranged in a one-to-one ratio with respect to the pad portions 13, each of which is soldered together by solder fillets 51.

[0089] The connector 55 includes, as a plurality of central conductors 56, one or more (two are illustrated in Figure 9) first central conductors 56a having a first average diameter D1, and one or more (two are illustrated in Figure 9) second central conductors 56b having a second average diameter D2 smaller than the first average diameter D1. The connector 55 may have the same structure as the connector 50 in Figure 8, except that it includes one or more first central conductors 56a and one or more second central conductors 56b as a plurality of central conductors 56.

[0090] According to this manufacturing method, even if the multiple central conductors 56 include central conductors of different diameters (first central conductor 56a and second central conductor 56b), the multiple pad portions and the multiple central conductors 56 can be easily soldered together. In Figure 9, the first central conductor 56a and the second central conductor 56b are shown as central conductors of different diameters, but the connector 55 may further include another central conductor of a different diameter from both the first central conductor 56a and the second central conductor 56b.

[0091] The first average diameter D1 and the second average diameter D2 are not particularly limited and may be within the same range as the average diameter described for the central conductor 21 of the first embodiment.

[0092] The lower limit of the difference (D1-D2) between the first average diameter D1 and the second average diameter D2 can be set according to the application of the first central conductor 56a and the second central conductor 56b, and may be, for example, 5 μm or 10 μm. On the other hand, the upper limit of the above difference (D1-D2) may be 150 μm or 100 μm, from the viewpoint of reliably soldering multiple pad portions and multiple central conductors 56.

[0093] <Variations of the pressurizing jig> <First variation> The pressurizing jig 60 in Figure 10 has a cushion portion 32 and a heat conduction portion 63 in this order, in the direction of pressing the multiple central conductors. The cushion portion 32 in the pressurizing jig 60 can be the same as the cushion portion 32 in the first embodiment. Therefore, only the heat conduction portion 63 will be described below.

[0094] (Heat conduction part) The heat conduction section 63 has a solder release layer 63b that is in contact with a plurality of central conductors. More specifically, the heat conduction section 63 is a two-layer structure consisting of a main layer 63a and a solder release layer 63b laminated on the main layer 63a. In Figure 10, the solder release layer 63b is arranged on only one side of the main layer 63a, but in this disclosure, the solder release layer 63b may be arranged on both sides of the main layer 63a. The solder release layer 63b has a solder release surface 63c that is in contact with a plurality of central conductors. That is, the heat conduction section 63 has a solder release surface 63c that is in contact with a plurality of central conductors.

[0095] The specific structure of the main body layer 63a in the heat conduction section 63 can be the same as that of the heat conduction section 33 in the first embodiment. Depending on the material, the main body layer 63a (i.e., the heat conduction section 33 in the first embodiment) may have insufficient solder release properties. In this case, during the pressing step S2 described above, solder may adhere to the heat conduction section, making it difficult to form the desired solder fillet. In contrast, by having a solder release surface 63c in the heat conduction section 63, solder can be prevented from adhering to the heat conduction section 63. As a result, multiple central conductors and multiple pad sections can be easily and reliably soldered together.

[0096] The solder release layer 63b is positioned in a region that is in direct contact with multiple central conductors. The solder release layer 63b may have high thermal conductivity. The solder release layer 63b may be formed using a different material from the main layer 63a, such as a heat-resistant resin or a metal film. Alternatively, the solder release layer 63b may be formed by the film of the heat conduction part 63 itself.

[0097] Examples of the heat-resistant resins mentioned above include polyimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene ether, polytetrafluoroethylene, polyamide-imide, liquid crystal polyester, polyurethane, polyvinyl chloride, polyvinyl acetal, perfluoroalkoxyalkane, polyetheretherketone, polybenzimidazole, and fully aromatic polyester. The heat-resistant resin may be formed, for example, as a film, or laminated onto the main body layer 63a by baking. When the heat-resistant resin is used as the material for the solder release layer 63b, an example of a specific combination of the solder release layer 63b, the main body layer 63a, and the cushion portion 32 is a laminated structure of a polyimide layer, a copper foil layer, and a silicone rubber layer.

[0098] Examples of the above-mentioned metal films include films, oxide films, nitride films, and fluoride films containing aluminum, titanium, tungsten, stainless steel, silicon, tantalum, molybdenum, or alloys thereof. These metal films can be formed using methods such as sputtering, chemical vapor deposition (CVD), and plating.

[0099] When the solder release layer 63b is formed using a different material from the main layer 63a, the upper limit of the average thickness of the solder release layer 63b may be, for example, 50 μm or 25 μm, from the viewpoint of preventing a decrease in the heating efficiency of the solder placed on the multiple central conductors and multiple pad portions. On the other hand, the lower limit of the average thickness is not particularly limited as long as a solder release effect is obtained, and may be, for example, 50 nm, 1 μm or 5 μm.

[0100] Examples of coatings on the heat conduction portion 63 itself include metal oxide films, nitride films, and fluoride films that form the main body layer 63a. An example of a specific combination of the solder release layer 63b, the main body layer 63a, and the cushion portion 32 is a laminated structure of aluminum oxide layer (Al2O3 layer), aluminum foil layer, and silicone rubber layer.

[0101] If the solder release layer 63b is formed by the film of the heat conduction part 63 itself, the average thickness of the solder release layer 63b may be, for example, 1 nm to 10 nm, 1 nm to 5 nm, or 1 nm to 3 nm.

[0102] <Second variation> The pressurizing jig 65 in Figure 11 has a pressurizing section 66, a cushioning section 32, and a heat conducting section 33 in that order, in the direction of pressing the multiple central conductors. That is, the pressurizing jig 65 has a pressurizing section 66 positioned on the opposite side of the cushioning section 32 from the side where the heat conducting section 33 is located. The pressurizing jig 65 in Figure 11 can be the same as the pressurizing jig 30 in the first embodiment, except that it has a pressurizing section 66. Therefore, only the pressurizing section 66 will be described below.

[0103] (Pressurized section) The pressurizing portion 66 is formed to a size that, in a plan view, encompasses multiple central conductors and multiple pad portions. The pressurizing portion 66 is, for example, plate-shaped. The pressurizing portion 66 is also a rigid member. The pressurizing portion 66 supports the cushion portion 32 and the heat conduction portion 33, while also having the function of pressing the cushion portion 32 and the heat conduction portion 33 against the multiple central conductors. Examples of materials for the pressurizing portion 66 include metal and engineering plastic.

[0104] The pressurized portion 66 may be directly laminated to the cushion portion 32, or it may be laminated to the cushion portion 32 with another layer in between. In Figure 11, the pressurized portion 66 is directly laminated to the cushion portion 32. The pressurized portion 66 may also be fixed to the cushion portion 32 with an adhesive or the like.

[0105] The pressurizing jig 65 has a pressurizing section 66, which allows the cushion section 32 and the heat conduction section 33 to be easily and reliably pressed against multiple central conductors.

[0106] <Third variation> The pressurizing jig 70 in Figure 12 has a cushion portion 72 and a heat conduction portion 73 in this order, in the direction of pressing multiple central conductors. The pressurizing jig 70 has the cushion portion 72 and the heat conduction portion 73 integrally formed. More specifically, the cushion portion 72 and the heat conduction portion 73 are formed from a single resin molded body. The heat conduction portion 73 is formed by including a heat conduction element in a part of the above resin molded body.

[0107] Since the heat conduction section 73 is formed by incorporating a heat conduction element into a part of the resin molded body, it can have higher rigidity compared to the cushion section 72. Therefore, the pressurizing jig 70 can deform to follow the outer shape of the multiple central conductors while easily preventing insufficient space for solder movement.

[0108] <Fourth variation> The pressurizing jig 75 in Figure 13 has a pressurizing section 76, a cushioning section 77, and a heat conduction section 33 in that order, in the direction of pressing the multiple central conductors. The heat conduction section 33 is not particularly limited and can be the same as the heat conduction section 33 in the first embodiment, so its description is omitted.

[0109] The pressurizing jig 75 has a pressurizing section 76 and a cushioning section 77 integrally formed. More specifically, the pressurizing section 76 and the cushioning section 77 are formed from a single resin molded body. The pressurizing section 76 and the cushioning section 77 are formed by changing the hardness (e.g., Young's modulus) of the resin molded body in the direction of pressing the multiple central conductors. That is, in this disclosure, the pressurizing section 76 and the cushioning section 77 can also be distinguished by the difference in Young's modulus. The Young's modulus in the resin molded body may gradually decrease in the direction of pressing the multiple central conductors. The hardness of the resin molded body can be changed, for example, by creating a gradient in the content of components contained in the resin molded body.

[0110] The Young's modulus of the cushion portion 77 can be within the same range as that of the cushion portion 32 in the first embodiment.

[0111] As the lower limit of the Young's modulus of the pressurized section 76, it is possible to adopt any value that is greater than the Young's modulus of the cushion section 77, but from the viewpoint of sufficiently pressing the multiple central conductors 21, it may be 10 MPa or 30 MPa.

[0112] In Figure 13, the pressurizing portion 76 and the cushioning portion 77 are integrally formed from a single resin molded body. However, in this disclosure, it is also possible to integrally form the pressurizing portion, the cushioning portion, and the heat conducting portion from a single resin molded body.

[0113] <Fifth variation> The pressurizing jig 80 in Figure 14 has a pressurizing section 81, a cushion section 32, and a heat conduction section 83 in that order, in the direction of pressing the multiple central conductors 21. The heat conduction section 83 has a heated area 83a that protrudes more than the cushion section 32 in a plan view. The heated area 83a protrudes in the axial direction of the multiple central conductors 21, and more specifically, it protrudes on both sides in the axial direction of the multiple central conductors 21 relative to the heated area 83b. The pressurizing jig 80 can have the same structure as the pressurizing jig 30 in the first embodiment, except that the heated area 83a protrudes on both sides in the axial direction of the multiple central conductors 21 relative to the heated area 83b and that it has a pressurizing section 81. Note that the pressurizing jig 80 in Figure 14 can also have a structure without the pressurizing section 81.

[0114] The pressurizing jig 80 has a heated area 83a that protrudes on both sides from the heating area 83b, which improves the heating rate and the maximum temperature that can be reached for the multiple central conductors 21. As a result, even if the diameter of the central conductors 21 is large, for example, the multiple central conductors 21 and the multiple pad portions 13 can be easily soldered together. In addition, because the heated area 83a protrudes on both sides from the heating area 83b, uneven heating of the multiple central conductors 21 and the like can be more easily reduced.

[0115] <Sixth variation> The pressurizing jig 90 in Figure 15 has a pressurizing section 91, a cushioning section 32, and a heat conducting section 93 in this order in the direction of pressing the multiple central conductors. More specifically, the pressurizing jig 90 has a pressurizing section 91, a cushioning section 32, and a heating region 93b (described later) in this order in the direction of pressing the multiple central conductors. The cushioning section 32 in the pressurizing jig 90 can be the same as the cushioning section 32 in the first embodiment. Therefore, only the pressurizing section 91 and the heat conducting section 93 will be described below.

[0116] (Pressurized section) The pressurizing section 91 functions as a heat source for the heat conducting section 93. That is, the pressurizing jig 90 heats the heat conducting section 93 via the pressurizing section 91. Except for heating the heat conducting section 93, the structure of the pressurizing section 91 is the same as that of the pressurizing section 66 in the second modified example. The means for heating the pressurizing section 91 can be the same as that of the heated region 33a in the first embodiment.

[0117] (Heat conduction part) The heat conduction section 93 is bent so as to be in contact with the pressurizing section 91. The heat conduction section 93 is also provided to be heated by the heat from the pressurizing section 91. More specifically, the heat conduction section 93 has a heating region 93b positioned on the outermost layer so as to be in direct contact with the plurality of central conductors, and a heated region 93a that is bent from the heating region 93b and positioned between the pressurizing section 91 and the cushion section 32. The heat conduction section 93 heats the heated region 93a by the pressurizing section 91, and the heat transferred from the heated region 93a to the heating region 93b heats the plurality of central conductors, etc. The material of the heat conduction section 93 can be the same as that of the heat conduction section 33 in the first embodiment. The heat conduction section 93 may also have a solder desoldering surface that is in contact with the plurality of central conductors.

[0118] In this manufacturing method, the heat conduction section 93 is bent so that it is in contact with the pressurizing section 91, and the heat conduction section 93 is heated by the heat from the pressurizing section 91, thereby reducing the installation area of ​​the device and lowering costs. Furthermore, in this manufacturing method, the heat conduction section 93 is bent so that it sandwiches the cushion section 32, allowing the cushion section 32 to be heated simultaneously with the heat conduction section 93. As a result, the amount of heat escaping from the heat conduction section 93 to the cushion section 32 can be reduced, making it easier to improve the heating rate and the maximum temperature reached by the multiple central conductors. Therefore, this manufacturing method can increase the manufacturing efficiency of the connector.

[0119] The bent portion 93c (the curvature axis in the bent portion 93c) in the heat conduction portion 93 may extend in a direction intersecting the central axes of the multiple central conductors, or it may extend in a direction perpendicular to the central axes of the multiple central conductors. According to this embodiment, it is easier to ensure that the heat transfer paths to the multiple central conductors are equidistant.

[0120] <7th variation> As shown in Figures 16 to 18, the heat conduction sections 103, 113, and 123 may have holes 103a, slits 113a, or notches 123a in the region (i.e., the heating region) located on the cushion section.

[0121] In the heat conduction sections 103, 113, and 123, multiple holes 103a, multiple slits 113a, or multiple notches 123a are arranged to correspond to the gaps between the multiple central conductors 21. In the gaps between the multiple central conductors 21, multiple holes 103a, multiple slits 113a, or multiple notches 123a may be arranged along the axial direction of the central conductors 21.

[0122] The heat conduction sections 103, 113, and 123 are easily deformable due to having holes 103a, slits 113a, or notches 123a. As a result, for example, if multiple holes 103a, multiple slits 113a, or multiple notches 123a are arranged to correspond to the gaps between multiple central conductors 21, it becomes easier to deform the heat conduction sections 103, 113, and 123 to follow the outer shape of the multiple central conductors 21 while appropriately heating and pressing the multiple central conductors 21. Therefore, for example, by increasing the thickness of the heat conduction sections 103, 113, and 123, the heating rate of the multiple central conductors 21 and the maximum temperature reached can be improved.

[0123] [Other embodiments] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is not limited to the configurations of the embodiments described above, but is indicated by the claims, and all modifications within the meaning and scope equivalent to the claims are intended to be included.

[0124] For example, the specific structure of the pressurizing jig is not limited to the structure described in the above embodiment. The pressurizing jig only needs to have a cushion portion and a heat conduction portion in that order in the direction of pressing the multiple central conductors, and it is also possible to have a structure that further has other parts or layers. Furthermore, in the pressurizing jig, if the heat conduction portion is heated by the heat from the pressurizing portion, the heat conduction portion only needs to be bent so as to be in contact with the pressurizing portion, and does not need to be sandwiched between the pressurizing portion and the cushion portion. [Explanation of symbols]

[0125] 10 Printed circuit boards 11 circuit boards 12 Conductive Patterns 13 Pad section 13a Top surface 14 Wiring section 15 Soldering section 20 Insulated wires 21, 56 Central conductor 22 Insulating layer 30, 60, 65, 70, 75, 80, 90 pressure jigs 32, 72, 77 Cushion section 33, 63, 73, 83, 93, 103, 113, 123 Heat conduction section 33a, 83a, 93a Heated area 33b, 83b, 93b heating area 50, 55 connectors 51 Solder Fillet 56a First central conductor 56b Second central conductor 63a Main layer 63b Solder delamination layer 63c Solder delamination surface 66, 76, 81, 91 Pressurized section 93c Folded section 103a hole 113a Slit 123a Notch D1 First average diameter D2 Second mean diameter Height difference at the top surface of multiple pad sections (Hd) Average pitch of the P pad section S solder movement space T1 Average thickness of the cushion section T2 Average thickness of the heat conduction layer Tf solder fillet height W Pad section average width

Claims

1. A method for manufacturing a connector in which the central conductors exposed at the tip of an insulated wire are soldered one-to-one to multiple connection points arranged in parallel on a substrate, A step of arranging the central conductor in a one-to-one ratio with respect to the connection portion where solder is placed, The process of pressing the multiple central conductors positioned in the above-mentioned positioning process against the multiple connected parts, It is equipped with, In the pressing process described above, The above-mentioned multiple central conductors are heated and pressed by a pressure jig, The above pressurizing jig is, A method for manufacturing a connector having a cushion portion and a heat conduction portion in this order in the direction of pressing the above-mentioned plurality of central conductors.

2. A method for manufacturing a connector according to claim 1, wherein in the pressing step described above, the cushion portion and the heat conduction portion are deformed to conform to the shape of the plurality of central conductors.

3. The method for manufacturing a connector according to claim 1 or claim 2, wherein the pressurizing jig further comprises a pressurizing portion disposed on the surface of the cushion portion opposite to the side on which the heat conducting portion is disposed.

4. A method for manufacturing a connector according to claim 1 or claim 2, wherein in the pressing step described above, the plurality of central conductors are pressed by the heat conductive part without adhesive bonding.

5. A method for manufacturing a connector according to claim 1 or claim 2, wherein the heat conductive part is not brought into contact with the substrate during the pressing step described above.

6. The method for manufacturing a connector according to claim 1 or claim 2, wherein the heat conduction portion has a heated area that protrudes more than the cushion portion in a plan view.

7. The method for manufacturing a connector according to claim 6, wherein the heated region protrudes in the axial direction of the plurality of central conductors.

8. The heat conduction portion is bent so as to be in contact with the pressurizing portion. The method for manufacturing a connector according to claim 3, wherein the heat conducting portion is heated by the heat from the pressurizing portion.

9. The method for manufacturing a connector according to claim 1 or claim 2, wherein the heat conducting portion has a solder desoldering surface that is in contact with the plurality of central conductors.

10. The cushion part described above is mainly composed of rubber, soft resin, or elastomer. The method for manufacturing a connector according to claim 1 or claim 2, wherein the average thickness of the cushion portion is 30 μm or more and 1000 μm or less.

11. The method for manufacturing a connector according to claim 1 or claim 2, wherein the heat conductive part is a film mainly composed of metal.

12. The method for manufacturing a connector according to claim 1 or claim 2, wherein the heat conducting portion has holes, slits, or notches in the region where it is located on the cushion portion.

13. As the above multiple central conductors, One or more first central conductors having a first average diameter, One or more second central conductors having a second average diameter smaller than the first average diameter described above, A method for manufacturing a connector according to claim 1 or claim 2, including the following:

Images