Electrical connection unit

Abstract

One embodiment provides an electrical connection unit that can improve heat dissipation. [Solution] An electrical connection unit of one embodiment comprises a heat dissipation member (metal plate) 110, a first electronic component 10S, a first base member 41S, a first busbar, a second electronic component 10T, a second base member 41T, a second busbar, a heat transfer member 120, and an insulating cover 119. The heat dissipation member includes a first region A1 and a second region A2. The first electronic component faces the first region in the Z direction. The first base member faces the first region in the Z direction. The first busbar is supported by the first base member. The second electronic component faces the second region in the Z direction and generates less heat than the first electronic component. The second base member faces the second region in the Z direction and is insulating. The second busbar is supported by the second base member. The heat transfer member extends across the first and second regions when viewed from the Z direction.

Description

Technical Field

[0001] Embodiments of the present invention relate to an electrical connection unit.

Background Art

[0002] An electrical connection unit having an electronic component and a bus bar electrically connected to the electronic component is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, improvement in heat dissipation is expected for the electrical connection unit.

[0005] One embodiment provides an electrical connection unit capable of improving heat dissipation.

Means for Solving the Problems

[0006] An electrical connection unit according to one embodiment comprises a heat dissipation member, a first electronic component, a first base member, a first busbar, a second electronic component, a second base member, a second busbar, and a heat transfer section. The heat dissipation member includes a first region and a second region. The first electronic component faces the first region in a first direction. The first base member faces the first region in a first direction and is insulating. The first busbar is supported by the first base member and is electrically connected to the first electronic component. The second electronic component faces the second region in a first direction and generates less heat than the first electronic component. The second base member faces the second region in a first direction and is insulating. The second busbar is supported by the second base member and is electrically connected to the second electronic component. The heat transfer section extends across the first region and the second region when viewed from a first direction. [Effects of the Invention]

[0007] According to one embodiment, heat dissipation can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] A cross-sectional view showing an electrical connection unit of an embodiment. [Figure 2] A perspective view illustrating the main body of the embodiment. [Figure 3] A perspective view illustrating one subunit of an embodiment. [Figure 4] A perspective view showing the electronic components and connecting components of the embodiment. [Figure 5] A perspective view illustrating the wiring substrate of the embodiment. [Figure 6] A perspective view showing a partially disassembled wiring substrate of the embodiment. [Figure 7] A plan view showing a subunit of the embodiment. [Figure 8] A cross-sectional view of the structure shown in Figure 7, along the line F8-F8. [Figure 9] A cross-sectional view of the structure shown in Figure 7, along the line F9-F9. [Figure 10]Perspective view showing another sub-unit of the embodiment. [Figure 11] Front view showing the electronic component of the embodiment. [Figure 12] Perspective view showing the base member of the embodiment. [Figure 13] Plan view showing the sub-unit of the embodiment. [Figure 14] Cross-sectional view taken along line F14-F14 of the structure shown in FIG. 13. [Figure 15] Cross-sectional view taken along line F15-F15 of the structure shown in FIG. 13. [Figure 16] Cross-sectional view taken along line F16-F16 of the structure shown in FIG. 13. [Figure 17] Perspective view showing the connection structure between a plurality of sub-units of the embodiment. [Figure 18] Cross-sectional view taken along line F18-F18 of the structure shown in FIG. 13. [Figure 19] Perspective view for explaining the electrical connection unit of the first modification of the embodiment. [Figure 20] Perspective view for explaining the electrical connection unit of the second modification of the embodiment. [Figure 21] Cross-sectional view for explaining the electrical connection unit of the second modification of the embodiment.

Mode for Carrying Out the Invention

[0011] In the present disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end portion 110e1 to the second end portion 110e2 of the metal plate 110 described later (see FIG. 2). The -X direction is the direction opposite to the +X direction. Hereinafter, when the +X direction and the -X direction are not distinguished, they are simply referred to as the "X direction". The +Y direction and the -Y direction are directions that intersect (for example, are orthogonal) to the X direction. The +Y direction is the direction from the third end portion 110e3 to the fourth end portion 110e4 of the metal plate 110 described later (see FIG. 2). The -Y direction is the direction opposite to the +Y direction. Hereinafter, when the +Y direction and the -Y direction are not distinguished, they are simply referred to as the "Y direction". The +Z direction and the -Z direction are directions that intersect (for example, are orthogonal) to the X direction and the Y direction. The +Z direction is the direction from the metal plate 110 described later toward the main body portion MU (see FIG. 2). The -Z direction is the direction opposite to the +Z direction. Hereinafter, when the +Z direction and the -Z direction are not distinguished, they are simply referred to as the "Z direction". The Z direction is an example of the "first direction".

[0012] In the following, the X and Y directions may be referred to as the "horizontal direction" if they are not distinguished. In the following, the Z direction may be referred to as the "vertical direction." Also, in the following, the +Z direction may be referred to as "up" and the -Z direction as "down." However, these expressions are for the sake of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the installation orientation of the electrical connection unit 1).

[0013] (Embodiment) <1. Configuration of the electrical connection unit> Figure 1 is a cross-sectional view showing an electrical connection unit 1 according to an embodiment. The electrical connection unit 1 is an in-vehicle device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0014] The electrical connection unit 1 includes, for example, a housing 5, a main body MU, a metal plate 110, a plurality of insulating covers 119 (see Figure 2), and a plurality of heat transfer members 120 (see Figure 2).

[0015] <2. Enclosure> First, let's describe the housing 5. The housing 5 forms the outer casing of the electrical connection unit 1. The housing 5 includes, for example, a base 6 (first member) and a cover 7 (second member). The base 6 is a member that covers the main body MU and the metal plate 110 from below. The base 6 is, for example, a plate-like shape along the horizontal direction or a bowl-like shape with the +Z direction open. The base 6 is, for example, made of synthetic resin. The cover 7 is a member that covers the main body MU and the metal plate 110 from above. The base 6 is, for example, a bowl-like shape with the -Z direction open. The cover 7 is, for example, made of synthetic resin. In this embodiment, the base 6 and the cover 7 are combined to form a box-shaped housing 5. The shape of the housing 5 is not limited to the above example. For example, the metal plate 110, which will be described later, may function as part or all of the base 6. Also, the housing 5 may be omitted.

[0016] In this embodiment, the electrical connection unit 1 includes a first region (first space) R1 and a second region (second space) R2. The first region R1 is a region where heat dissipation is important. For example, an electronic component 10S that generates a large amount of heat is placed in the first region R1. The electronic component 10S is an example of a "first electronic component". On the other hand, the second region R2 is a region where ease of mounting is important. For example, an electronic component 10T that generates less heat than the electronic component 10S and / or requires a more complex mounting structure than the electronic component 10S is placed in the second region R2. The electronic component 10T is an example of a "second electronic component". However, these details do not limit the contents of the electrical connection unit 1 of this disclosure.

[0017] <3. Main body> Next, we will explain the main unit MU. Figure 2 is a perspective view illustrating the main body MU. The main body MU is the part of the electrical connection unit 1 that performs the main function (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into a plurality of subunits SU. The main body MU is formed, for example, by connecting a plurality of subunits SU. In this embodiment, the main body MU has two subunits SU (subunits SUS and SUT). Each subunit SU may be referred to as a "circuit configuration".

[0018] The subunit SUS has a primary electrical function. The subunit SUS includes, for example, a plurality of electronic components 10S and a wiring substrate 40S. The plurality of electronic components 10S are electrically connected to the wiring substrate 40S. The base plate 41S (described later) included in the subunit SUS is an example of a "first base member".

[0019] The subunit SUT has a second electrical function. This second function is, for example, a function different from the first function. The subunit SUT includes, for example, a plurality of electronic components 10T and a wiring structure 40T. The plurality of electronic components 10T are electrically connected to the wiring structure 40T. The base member 41T (described later) included in the subunit SUT is an example of a "second base member".

[0020] In this embodiment, the subunit SUS is a subunit SU that prioritizes heat dissipation. The subunit SUS is positioned in the first region R1 of the electrical connection unit 1 described above. The subunit SUS faces the first region A1 of the metal plate 110, which will be described later, in the Z direction.

[0021] On the other hand, subunit SUT is a subunit SU that prioritizes ease of mounting. Subunit SUT is positioned, for example, on the +Y direction side with respect to subunit SUS. Subunit SUT is positioned in the second region R2 of the electrical connection unit 1 described above. Subunit SUT faces the second region A2 of the metal plate 110, which will be described later, in the Z direction. Hereafter, when electronic component 10S and electronic component 10T are not distinguished, they will simply be referred to as "electronic component 10".

[0022] Furthermore, the main body MU does not have to be divided into multiple subunits SU, as in the example described above. For example, multiple subunits SU may be formed as a single unit. For instance, the base plate 41S of the cable routing substrate 40S and the base member 41T of the cable routing structure 40T, respectively, may be formed as a single unit from one piece of material.

[0023] <4. Configuration of Subunit SUS> Next, we will explain the configuration of the subunit SUS. Figure 3 is a perspective view illustrating a subunit SUS. The subunit SUS includes, for example, a plurality of electronic components 10, a plurality of connecting components 20, and a wiring substrate 40S. The connecting components 20 are members that form vertical electrical circuits. The connecting components 20 may also be referred to as "vertical wiring members."

[0024] <4.1 Electronic Components> First, let's describe the electronic components 10. The electronic components 10 are electronic components that are mounted in each subunit SU according to the required functions. The electronic components 10 may be, for example, connectors, fuses, relays (e.g., mechanical relays or semiconductor relays), capacitors, branching components, various sensors (e.g., current sensors or voltage sensors), electronic control units, or electronic component units that combine two or more of these. However, the types of electronic components 10 are not limited to the examples above. The electronic components 10 may be, for example, heat-generating components that generate heat when energized.

[0025] In this embodiment, the multiple electronic components 10 include electronic components 10S that generate a relatively large amount of heat when energized. The electronic components 10S are relays (e.g., mechanical relays or semiconductor relays), pyrofuses, or current sensors (e.g., current sensors with shunt resistors). However, the type of electronic component 10S is not limited to the above examples.

[0026] Figure 4 is a perspective view showing an electronic component 10S and a connecting component 20. The electronic component 10S is, for example, an electronic component in which a plurality of terminals 13 are arranged in a row at one end of the electronic component 10S. The electronic component 10S has, for example, a case 11, a component body 12, a plurality of terminals 13, and a plurality of mounting parts 14.

[0027] (case) The case 11 is an outer casing that forms most of the external shape of the electronic component 10S. The case 11 is made of, for example, synthetic resin and has insulating properties. The case 11 houses the component body 12. The case 11 and the component body 12 may be formed as a single unit.

[0028] In this embodiment, the case 11 has insulating ribs 11a that protrude horizontally (e.g., in the Y direction) and extend in the Z direction. The insulating ribs 11a are, for example, plate-shaped and aligned horizontally (e.g., in the Y direction) and in the Z direction. The insulating ribs 11a extend, for example, along the entire length of the case 11 in the Z direction. The insulating ribs 11a are positioned between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating ribs 11a electrically insulate terminals 13A and 13B. In this embodiment, a portion of the insulating ribs 11a is positioned between the first portions 21 (described later) of two connecting components 20 connected to the electronic component 10S. The insulating ribs 11a electrically insulate the first portions 21 of the two connecting components 20 connected to the electronic component 10S.

[0029] (Main part of the component) The main body of the component 12 is the part that performs the main function of the electronic component 10S. For example, if the electronic component 10S is a relay, the main body of the component 12 includes a switching part (e.g., a contact part) that switches between a conductive state and a non-conductive state. For example, if the electronic component 10S is a fuse, the main body of the component 12 includes a fuse that melts when an overcurrent flows. For example, if the electronic component 10S is a capacitor, the main body of the component 12 includes a part that stores electric charge.

[0030] (Terminals) Terminal 13 is an electrical connection part exposed to the outside of case 11. Terminal 13 is electrically connected to the component body 12 inside case 11. In this embodiment, the electronic component 10S includes terminals 13A and terminal 13B as a plurality of terminals 13. One of terminals 13A and terminal 13B is the positive terminal. The other of terminals 13A and terminal 13B is the negative terminal. One of terminals 13A and terminal 13B is an example of a "first terminal". The other of terminals 13A and terminal 13B is an example of a "second terminal".

[0031] In this embodiment, terminals 13A and 13B are provided at one end of the electronic component 10S in the horizontal direction (e.g., the Y direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the X direction). Each of terminals 13A and 13B faces in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h into which a fastening member 71 (e.g., a screw or bolt), described later, is attached. The mounting hole 13h opens in the horizontal direction (e.g., the Y direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10S has a screw groove.

[0032] (Mounting part) The mounting portion 14 is a part for fixing the electronic component 10S. The mounting portion 14 has a mounting hole 14h into which a fastening member 116 (for example, a screw or bolt, see Figure 9) described later is attached. The mounting hole 14h opens in the Z direction. The mounting hole 14h is a through hole through which the fastening member 116 passes. The destination for fixing the mounting portion 14 will be described later.

[0033] <4.2 Connecting Components> Next, the connecting component 20 will be described. The connecting component 20 is a component that electrically connects the electronic component 10S and the wiring substrate 40S. The connecting component 20 forms part of the current-carrying circuit in the subunit SUS. The connecting component 20 is made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy). The connecting component 20 may also be referred to as a "metal component".

[0034] In this embodiment, the connecting component 20 electrically connects the electronic component 10S to the busbar 42 (see Figure 3) included in the routing substrate 40S. In this embodiment, the length L12 of the connecting component 20 in the longitudinal direction (e.g., Y direction) of the electronic component 10S is smaller than the longitudinal length L11 of the electronic component 10S. The connecting component 20 has, for example, a first portion 21 and a second portion 22.

[0035] (Part 1) The first part 21 of the connecting component 20 is the part that connects to the terminal 13 of the electronic component 10S. The first part 21 is a plate-like or rectangular parallelepiped-shaped part that extends in the Z direction. The first part 21 extends in the Z direction along one end of the electronic component 10S (for example, the end in the Y direction). The first part 21 is an upright part that stands upright in the Z direction relative to the routing substrate 40S (for example, relative to the bus bar 42 described later). The first part 21 is adjacent to the electronic component 10S in the horizontal direction (for example, the Y direction). For example, the first part 21 is adjacent to the terminal 13 of the electronic component 10S in the horizontal direction (for example, the Y direction) and is connected to the terminal 13 of the electronic component 10S from the horizontal direction (for example, the Y direction).

[0036] The first portion 21 of the connecting part 20 has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) is passed. The first mounting hole 21h opens horizontally (e.g., in the Y direction). The first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10S by the fastening member 71 passed through the first mounting hole 21h engaging with the mounting hole 13h of the terminal 13 of the electronic component 10S.

[0037] (Second part) The second portion 22 of the connecting component 20 is the portion that connects to the bus bar 42 (see Figure 3). The second portion 22 protrudes horizontally (e.g., in the Y direction) from the -Z direction end of the first portion 21. The second portion 22 is a plate portion that runs horizontally. The second portion 22 is adjacent to the bus bar 42 in the Z direction and connects to the bus bar 42 from the Z direction. The second portion 22 of the connecting component 20 is attached from the Z direction to a fastening member 43 (e.g., a screw or bolt, see Figure 8) that protrudes from the bus bar 42 in the +Z direction, and is physically and electrically connected to the bus bar 42. In this embodiment, the second portion 22 of the connecting component 20 has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The fastening member 43 passes through the second mounting hole 22h of the second portion 22. Then, the second portion 22 is fixed to the busbar 42 by engaging the tip of the fastening member 43, which is passed through the second mounting hole 22h, with the engaging member 44 (for example, a nut, see Figure 3). In this embodiment, the first portion 21 and the second portion 22 form an L-shaped single connecting component 20.

[0038] In this embodiment, the busbar 42 is positioned at a distance from the terminal 13 of the electronic component 10S (for example, at a distance in the Z direction). The connecting component 20 is positioned between the electronic component 10S and the busbar 42. In this disclosure, "the connecting component is positioned between the electronic component and the busbar" is not limited to cases where a portion of the connecting component is located between the electronic component and the busbar when viewed from the X or Y direction. "The connecting component is positioned between the electronic component and the busbar" may also refer to cases where a portion of the connecting component is located between the electronic component and the busbar when viewed from a direction inclined with respect to the X or Y direction. The connecting component 20 electrically connects the terminal 13 of the electronic component 10S and the busbar 42.

[0039] <4.3 Circuit board for cable routing> Next, we will explain the wiring substrate 40S. Figure 5 is a perspective view illustrating the cable routing substrate 40S. The cable routing substrate 40S is a member that forms at least a portion of the electrical conduction path between a plurality of electronic components 10 (e.g., a plurality of electronic components 10S), and / or at least a portion of the electrical conduction path between an electronic component 10 (e.g., electronic component 10S) included in a subunit SUS and an electronic component 10 included in another subunit SU (e.g., subunit SUT). In this disclosure, "cable routing substrate" means a substrate-type cable routing structure. "Substrate-type" means that, when viewed as a whole, regardless of the fine shape, it is in the shape of a plate along a single plane. In this disclosure, "plate-like," "sheet-like," or "plane" is not limited to cases where it is perfectly flat, but may include cases where there are fixing structures or ribs protruding in the Z direction, or where there are uneven shapes on the surface that follow the thickness of the busbar. In this embodiment, the cable routing substrate 40S is in the shape of a plate along the X and Y directions.

[0040] The cable routing substrate 40S includes, for example, a base plate 41S, one or more (e.g., multiple) bus bars 42, and multiple fastening members 43. In this embodiment, the base plate 41S and the multiple bus bars 42 are integrated by insert molding. For example, the cable routing substrate 40S is formed as a single piece by insert molding of the bus bars 42 with the base plate 41S after the fastening members 43 have been fixed to the bus bars 42. That is, the bus bars 42 are integrated with the base plate 41S without using fastening members such as screws or bolts. The cable routing substrate 40S may be formed by a different structure instead of insert molding. Modified examples in which the cable routing substrate 40S is formed by a different structure will be described later.

[0041] Figure 6 is a perspective view showing a partially disassembled wiring substrate 40S. For convenience of explanation, the base plate 41S, bus bar 42, and fastening member 43 will be described below with reference to a partially disassembled drawing of the wiring substrate 40S.

[0042] <4.3.1 Base Plate> The base plate 41S is a support member that integrally supports a plurality of busbars 42 arranged horizontally with spacing between them. The base plate 41S is made of, for example, synthetic resin and has insulating properties. The base plate 41S electrically insulates the plurality of busbars 42. The base plate 41S is an example of a "base member". The base plate 41S may also be called an "insulating substrate". The base plate 41S has, for example, a flat portion 51, a frame portion 52, and a plurality of fixing portions 53 (see Figure 9).

[0043] (Plane part) The flat portion 51 is a plate-shaped part formed within the base plate 41S. The flat portion 51 is plate-shaped and oriented horizontally. The flat portion 51 forms the main part of the base plate 41S. The flat portion 51 forms the base (insulating base) of the base plate 41S. In this embodiment, the flat portion 51 extends across the entire width of the base plate 41S in the X direction and across the entire width of the base plate 41S in the Y direction, excluding the frame portion 52 of the base plate 41S.

[0044] The planar portion 51 has a first surface 51a and a second surface 51b (see Figure 9). The first surface 51a is a surface oriented in the +Z direction. The first surface 51a is a plane that aligns with the horizontal direction. The first surface 51a faces a plurality of electronic components 10 (for example, a plurality of electronic components 10S). The second surface 51b is located on the opposite side from the first surface 51a. The second surface 51b is a surface oriented in the -Z direction. The second surface 51b is a plane that aligns with the horizontal direction. The second surface 51b faces the metal plate 110 (see Figure 2). The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction. In this embodiment, the thickness T11 of the planar portion 51 in the Z direction is smaller than the thickness T1 of the busbar 42 in the Z direction (for example, the thickness of the horizontal plate portion 42p described later in the Z direction) (see Figure 8). The thickness T11 of the flat portion 51 in the Z direction may be the same as the thickness T1 of the busbar 42 in the Z direction, or it may be greater than the thickness T1 of the busbar 42 in the Z direction.

[0045] The planar portion 51 has, for example, one or more (e.g., multiple) housing portions 55, each of which accommodates a busbar 42. The multiple housing portions 55 are formed apart from each other in the X or Y direction. Each housing portion 55 is, for example, a through hole that penetrates the planar portion 51 in the Z direction. Alternatively, the housing portion 55 may be a recess provided on the first surface 51a or the second surface 51b of the planar portion 51 and recessed in the Z direction. In this disclosure, "the housing portion penetrates the planar portion in the first direction (Z direction)" may also include cases where a portion of the total length of the housing portion 55 penetrates the planar portion 51 in the Z direction (for example, the remaining portion of the housing portion 55 may be a recess recessed in the Z direction, or it may be provided inside the base plate 41S and not exposed to the outside of the base plate 41S). Similarly, in this disclosure, "the housing portion is recessed in the first direction (Z direction)" may also include cases where a portion of the total length of the housing portion 55 is recessed in the Z direction (for example, the remaining portion of the housing portion 55 may be a through hole penetrating the planar portion 51 in the Z direction, or it may be provided inside the base plate 41S and not exposed to the outside of the base plate 41S).

[0046] Each housing section 55 has an external shape that corresponds to the shape of the bus bar 42 it houses when viewed from the Z direction. A plurality of housing sections 55 may include, for example, four housing sections 55A, 55B, 55C, and 55D. Housing section 55A is provided in correspondence with bus bar 42A, which will be described later, and houses at least a portion of bus bar 42A. Housing section 55B is provided in correspondence with bus bar 42B, which will be described later, and houses at least a portion of bus bar 42B. Housing section 55C is provided in correspondence with bus bar 42C, which will be described later, and houses at least a portion of bus bar 42C. Housing section 55D is provided in correspondence with bus bar 42D, which will be described later, and houses at least a portion of bus bar 42D.

[0047] (Frame) The frame portion 52 is provided at the peripheral end of the base plate 41S. The frame portion 52 is a reinforcing rib that protrudes vertically from the end of the flat portion 51 (see Figure 8). The width (thickness) H11 of the frame portion 52 in the Z direction is, for example, less than half of the width (thickness) H12 of the electronic component 10 in the Z direction (see Figure 8). Note that the frame portion 52 may be omitted.

[0048] (Fixed part) The fixing portion 53 is the part that is fixed to the metal plate 110 (see Figure 9). The fixing portion 53 has a mounting hole 53h that penetrates the base plate 41S in the Z direction. A fastening member 115 (for example, a screw or bolt), which will be described later, is passed through the mounting hole 53h.

[0049] <4.3.2 Busbar> The busbar 42 is a routing member (electrical connection member) included in the routing substrate 40S. The busbar 42 is, for example, a routing member for electrically connecting multiple electronic components (e.g., multiple electronic components 10S). Alternatively, the busbar 42 may be a routing member for electrically connecting an electronic component 10 (e.g., electronic component 10S) to an electronic component 10 included in another subunit SU (e.g., subunit SUT). The busbar 42 is made of metal (e.g., copper, copper alloy, aluminum, or aluminum alloy) and is conductive. In this embodiment, there are multiple busbars 42, for example, four busbars 42A, 42B, 42C, and 42D. The four busbars 42A, 42B, 42C, and 42D are arranged horizontally with space between them. The four busbars 42A, 42B, 42C, and 42D include portions that are arranged on the same plane. The four busbars 42A, 42B, 42C, and 42D are supported by the flat portion 51 of the base plate 41S. In this disclosure, "the busbars are supported by the flat portion" is not limited to the case where the busbars 42 are housed in the housing portion 55, but may also include cases where the busbars 42 are attached to the first surface 51a or the second surface 51b of the flat portion 51.

[0050] At least a portion of each busbar 42 is plate-shaped and oriented horizontally. At least a portion of each busbar 42 is housed in the housing 55 and extends along the planar portion 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing 55. Hereinafter, the portion of each busbar 42 that extends horizontally in a plate-like shape may be referred to as the "horizontal plate portion 42p". The horizontal plate portion 42p is an example of a "plate portion". The busbar 42 is a member that forms a horizontal electrical circuit. The busbar 42 may also be referred to as a "horizontal wiring member".

[0051] Figure 7 is a plan view showing the subunit SUS. Each busbar 42 has, for example, a connecting portion 61, a connecting portion 62, and an extension portion 63.

[0052] The connection portion 61 is located in the middle of the bus bar 42 or at the first end of the bus bar 42. The connection portion 61 is the portion that connects directly to the electronic component 10 (e.g., electronic component 10S) or via the connecting component 20. The connection portion 61 includes, for example, a portion that overlaps with the connecting component 20 when viewed from the Z direction. The connection portion 61 is adjacent to the connecting component 20 in the Z direction and connects to the connecting component 20 from the Z direction. Alternatively, the connection portion 61 may be adjacent to a terminal 13 of the electronic component 10 in the Z direction and connect directly to the terminal 13 of the electronic component 10 from the Z direction.

[0053] The connector 62 is located in the middle of the busbar 42 or at the second end of the busbar 42. The connector 62 is the portion that connects to another electronic component 10 directly or via another connector 20. Alternatively, the connector 62 may be connected to another busbar 42 (for example, a busbar 42 included in another subunit SU) or to an external busbar 76 (see Figure 2).

[0054] The extension portion 63 extends from the connecting portion 61 in the X or Y direction. The extension portion 63 is provided between the connecting portion 61 and the connecting portion 62. The extension portion 63 extends across the connecting portion 61 and the connecting portion 62. The extension portion 63 connects the connecting portion 61 and the connecting portion 62.

[0055] In this embodiment, the horizontal plate portion 42p described above includes at least the entirety of the connecting portion 61 and a part of the extension portion 63. That is, at least the entirety of the connecting portion 61 and a part of the extension portion 63 are housed in the housing portion 55 and are located on the same plane.

[0056] In this embodiment, the extensions 63 of some busbars 42 are housed in the housing 55, so that they extend across both sides of region R, which overlaps with the electronic component 10 when viewed from the Z direction. For example, the extensions 63 extend across the region R that overlaps with the electronic component 10 when viewed from the Z direction, so that they extend across the -Y and +Y sides of region R. In other words, by being housed in the housing 55, the busbars 42 can be routed along a better path (for example, a shorter path) without being obstructed by the presence of the electronic component 10.

[0057] Furthermore, one or more busbars 42 may have an extension 64 in addition to the connection portion 61, connection portion 62, and extension portion 63. The extension 64 is a portion of the busbar 42 that is extended for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension 64 is a portion that is not used for electrical connection. For example, the extension 64 is located on the opposite side of the extension portion 63 from the connection portion 61 (or connection portion 62). The extension 64 is plate-shaped and runs horizontally. The extension 64 is included in the horizontal plate portion 42p. The extension 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension 64 extends to a region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at a position that overlaps with the electronic component 10 when viewed from the Z direction.

[0058] The following describes some routing examples for the busbar 42. Note that multiple electronic components 10S include three electronic components 10A, 10B, and 10C. Multiple connecting components 20 include five connecting components 20A, 20B, 20C, 20D, and 20E.

[0059] The busbar 42A has a connector 61, a connector 62, and an extension 63. The connector 61 is connected to terminal 13A of the electronic component 10A via a connector 20A. The connector 62 is located at the +Y direction end of subunit SUS and is connected to busbar 42 included in another subunit SU. The extension 63 is housed in a housing 55 and extends across both sides of region R, which overlaps with the electronic component 10A when viewed from the Z direction.

[0060] The busbar 42B has a connecting portion 61, a connecting portion 62, an extension portion 63, and an extension portion 64. The connecting portion 61 is connected to terminal 13B of the electronic component 10A via a connecting component 20B. The connecting portion 62 is connected to terminal 13A of the electronic component 10B via a connecting component 20C. The extension portion 64 extends to a region R that overlaps with the electronic component 10B when viewed from the Z direction, and has an end 42e1 of the busbar 42 at a position that overlaps with the electronic component 10B.

[0061] The busbar 42C has a connector 61, a second connector 62, and an extension 63. The connector 61 is connected to terminal 13B of electronic component 10B via a connector 20D. The connector 62 is located at the +Y direction end of subunit SUS and is connected to busbar 42 included in another subunit SU.

[0062] The busbar 42D has a connector 61, a connector 62, and an extension 63. The connector 61 is connected to terminal 13A of the electronic component 10C via a connector 20E. The connector 62 is located at the +Y direction end of subunit SUS and is connected to busbar 42 included in another subunit SU.

[0063] (Exposed structure on the upper side of each busbar) In this embodiment, at least a portion of the busbar 42 is exposed on the upper side of the base plate 41S. For example, the connecting portion 61, connecting portion 62, and extension portion 63 of the busbar 42 are exposed to the outside of the base plate 41S on the upper side of the base plate 41S (the side of the first surface 51a of the flat portion 51). For example, the extension portion 63 of the busbar 42 is exposed to the outside of the base plate 41S on the upper side of the base plate 41S over its entire length, at least between the connecting portion 61 and the connecting portion 62.

[0064] (Exposed structure on the underside of each busbar) In this embodiment, at least a portion of the busbar 42 is exposed on the lower side of the base plate 41S. For example, the entirety of the connecting portion 61 and at least a portion of the extending portion 63 are exposed to the outside of the base plate 41S on the lower side of the base plate 41S (the second surface 51b side of the flat portion 51). In this embodiment, a gap S1 is formed between the flat portion 51 of the base plate 41S and the metal plate 110 (see Figure 9). The busbar 42 includes an exposed portion 42u exposed in the gap S1 (see Figure 9). The exposed portion 42u includes, for example, the entirety of the connecting portion 61 and at least a portion of the extending portion 63.

[0065] <4.3.3 Fastening Members> Next, the fastening member 43 will be described. Figure 8 is a cross-sectional view of the structure shown in Figure 7 along the line F8-F8. The fastening member 43 is a component for fixing the bus bar 42 to the connecting component 20 corresponding to the bus bar 42. The fastening member 43 is, for example, a crimping bolt fixed to the bus bar 42. The fastening member 43 is an example of a "fastening part".

[0066] In this embodiment, at least one of the connecting portion 61 and connecting portion 62 of the bus bar 42 has a through hole 42h. The through hole 42h penetrates the bus bar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head portion 43b. The circumferential surface of the shaft portion 43a has screw grooves. The head portion 43b has a larger diameter than the shaft portion 43a. The fastening member 43 is crimped and fixed to the bus bar 42 with the shaft portion 43a passing through the through hole 42h of the bus bar 42, and the head portion 43b being crimped and fixed to the bus bar 42. With this fixing, the fastening member 43 is electrically and physically connected to the bus bar 42 with the shaft portion 43a protruding from the through hole 42h of the bus bar 42 in the +Z direction. Note that the fastening member 43 is not limited to crimping and may be fixed to the bus bar 42 by welding or other methods.

[0067] In this embodiment, the connecting component 20 is attached to the fastening member 43 from the Z direction, with the connecting component 20 already fixed to the electronic component 10 by the fastening member 71. For example, the connecting component 20 is inserted into the second mounting hole 22h of the second portion 22 of the fastening member 43 by inserting the shaft portion 43a of the fastening member 43. Then, the engaging member 44 (e.g., a nut) is engaged with the shaft portion 43a of the fastening member 43 that protrudes from the second mounting hole 22h of the second portion 22 of the connecting component 20. The engaging member 44 is attached to the shaft portion 43a along the Z direction. This engagement fixes the second portion 22 of the connecting component 20 to the fastening member 43.

[0068] (Heat transfer component) First, the heat transfer member 120 will be described. The heat transfer member 120 is a member for transferring heat generated by the electronic component 10 (e.g., electronic component 10S) when energized, and / or heat generated by the busbar 42 itself (Joule heat) when energized, to the metal plate 110. The heat transfer member 120 is, for example, an elastic heat transfer sheet (e.g., a thermally conductive silicone sheet). The heat transfer member 120 is formed of a material with a higher thermal conductivity than, for example, the base plate 41S (or the base member 41T described later). However, the heat transfer member 120 is not limited to the above example, and may be a heat transfer member formed of a thermally conductive gel or other material. In this embodiment, the heat transfer member 120 is insulating. The heat transfer member 120 is partially provided on the wiring substrate 40S (see Figure 2).

[0069] In this embodiment, the multiple heat transfer members 120 include one or more (for example, multiple) heat transfer members 120A (see Figure 2). The heat transfer member 120A is a heat transfer member 120 that also has the function of transferring heat from the first region R1 to the second region R2 of the electrical connection unit 1.

[0070] In this embodiment, the heat transfer member 120 (for example, heat transfer member 120A) is positioned so as to overlap with a portion of the bus bar 42 when viewed from the Z direction. A portion of the heat transfer member 120 (for example, heat transfer member 120A) is positioned between the bus bar 42 and the first region A1 of the flat portion 111 of the metal plate 110, which will be described later. In this embodiment, a portion of the heat transfer member 120 (for example, heat transfer member 120A) is positioned between the exposed portion 42u of the bus bar 42 and the flat portion 111 of the metal plate 110, and is in contact with the exposed portion 42u of the bus bar 42 and the first region A1 of the flat portion 111 of the metal plate 110, respectively. A portion of the heat transfer member 120 (for example, heat transfer member 120A) transfers heat from the electronic component 10 (for example, electronic component 10S) to the bus bar 42, and / or heat generated by the bus bar 42, from the bus bar 42 to the first region A1 of the flat portion 111 of the metal plate 110.

[0071] In this embodiment, the heat transfer member 120A has, for example, a first portion 131, a second portion 132, and a third portion 133 (see Figure 2). Here, the first portion 131 will be described, and the second portion 132 and the third portion 133 will be described later.

[0072] The first portion 131 of the heat transfer member 120A forms, for example, the first end portion 130e1, which is the -Y end portion of the heat transfer member 120A. When viewed from the Z direction, the first portion 131 is positioned near the electronic component 10 (e.g., electronic component 10S) and overlaps with a portion of the bus bar 42. In this embodiment, when viewed from the Z direction, the first portion 131 is positioned to overlap with the connecting component 20. In other words, when viewed from the Z direction, the first portion 131 is positioned to overlap with the connecting portion 61 or 62 of the bus bar 42. The first portion 131 transfers the heat that moves from the electronic component 10S to the bus bar 42 via the connecting component 20 from the bus bar 42 to the first region A1 of the planar portion 111 of the metal plate 110.

[0073] <4.4 Fixing Structure for Cable Management Boards and Electronic Components> Next, the fixing structure of the wiring substrate 40S and the electronic components 10 will be described. Figure 9 is a cross-sectional view of the structure shown in Figure 7 along the line F9-F9. The metal plate 110 has, for example, a flat portion 111 (described later), as well as a fixing portion 112 and a fixing portion 113.

[0074] The fixing portion 112 is a fixing portion for fixing the base plate 41S to the metal plate 110. When viewed from the Z direction, the fixing portion 112 is provided at a position corresponding to the fixing portion 53 of the base plate 41S. The fixing portion 112 is a cylindrical or prismatic boss that protrudes in the +Z direction from the flat portion 111 of the metal plate 110. The fixing portion 112 has an engagement hole 112h that opens in the +Z direction. The inner circumferential surface of the engagement hole 112h has a screw groove.

[0075] As described above, the fixing portion 53 of the base plate 41S has a mounting hole 53h. A fastening member 115 (for example, a screw or bolt) is passed through the mounting hole 53h. When the fastening member 115 passed through the mounting hole 53h of the fixing portion 53 of the base plate 41S engages with the engagement hole 112h of the fixing portion 112 of the metal plate 110, the base plate 41S is fixed to the metal plate 110.

[0076] The fixing portion 113 is a fixing portion for directly fixing the electronic component 10 (for example, electronic component 10S) to the metal plate 110 without using the base plate 41S. The fixing portion 113 is provided at a position corresponding to the mounting portion 14 of the electronic component 10 when viewed from the Z direction. The fixing portion 113 is a cylindrical or prismatic boss that protrudes from the flat portion 111 in the +Z direction. The fixing portion 113 has an engagement hole 113h that opens in the +Z direction. The inner circumferential surface of the engagement hole 113h has a screw groove.

[0077] In this embodiment, the flat portion 51 of the base plate 41S has a through hole 51h. The through hole 51h penetrates the flat portion 51 in the Z direction. When viewed from the Z direction, the through hole 51h is located at a position corresponding to the fixing portion 113 of the metal plate 110. The fixing portion 113 of the metal plate 110 protrudes through the through hole 51h of the base plate 41S to the same position as the first surface 51a of the flat portion 51, or to the +Z direction side of the first surface 51a of the flat portion 51. The mounting portion 14 of the electronic component 10 is in contact with the fixing portion 113 at the same position as the first surface 51a of the flat portion 51, or to the +Z direction side of the first surface 51a of the flat portion 51.

[0078] A fastening member 116 (for example, a screw or bolt) is passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 from the +Z direction side. When the fastening member 116 passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engagement hole 113h of the fixing portion 113 of the metal plate 110, the electronic component 10 is fixed to the metal plate 110 without going through the base plate 41S. Alternatively, the electronic component 10 may be fixed to a fixing portion provided on the base plate 41S.

[0079] <5. Configuration of the Subunit SUT> Next, we will explain the configuration of the subunit SUT. Figure 10 is a perspective view showing a subunit SUT. The subunit SUT includes, for example, a plurality of electronic components 10, a wiring structure 40T, an auxiliary base member 101 (see Figure 14), and a metal part 90 (see Figure 12).

[0080] <5.1 Electronic Components> First, let's describe the electronic component 10. The multiple electronic component 10 includes multiple electronic component 10TA (only one is shown in Figure 12) and multiple electronic component 10TB (only one is shown in Figure 12). Note that the multiple electronic component 10 may have only one of either electronic component 10TA or electronic component 10TB.

[0081] Electronic component 10TA is an example of the electronic component 10T described above. Electronic component 10TA is an electronic component that generates less heat when energized compared to electronic component 10S. On the other hand, electronic component 10TB is another example of the electronic component 10T described above. Electronic component 10TB is an electronic component that is less mountable than electronic component 10S (for example, it requires a complex implementation structure). Electronic component 10TB has, for example, a terminal 13 that protrudes in the -Z direction toward the planar portion 111 of the metal plate 110 (see Figure 14). Electronic component 10TB generates less heat when energized compared to electronic component 10S.

[0082] In the following, when electronic component 10TA and electronic component 10TB are not distinguished, they will simply be referred to as "electronic component 10T". Electronic component 10T may be, for example, a connector, fuse, capacitor, branching component, various sensors (e.g., current sensor or voltage sensor), an electronic control unit, or an electronic component unit that combines two or more of these. However, the types of electronic component 10T are not limited to the examples above.

[0083] Figure 11 is a front view showing an electronic component 10TA. The electronic component 10TA is an electronic component in which, for example, a plurality of terminals 13 are arranged separately at both horizontal ends of the electronic component 10TA. In this embodiment, terminals 13A and 13B are arranged separately at both ends in the Y direction of the electronic component 10TA. Terminals 13A and 13B protrude horizontally (for example, in the +Y direction or -Y direction) from the center of the case 11 in the Z direction. Each terminal 13 has a mounting hole 13h through which a fastening member 43 (for example, a screw or bolt) is passed. The mounting hole 13h opens in the Z direction.

[0084] <5.2 Routing Structure> Next, we will return to Figure 10 and describe the wiring structure 40T. The wiring structure 40T is a member that forms at least a portion of the current supply path between a plurality of electronic components 10 (e.g., a plurality of electronic components 10T), and / or at least a portion of the current supply path between an electronic component 10 (e.g., an electronic component 10T) included in a subunit SUT and an electronic component 10 included in another subunit SU (e.g., subunit SUS). The wiring structure 40T includes, for example, a base member 41T, one or more (e.g., a plurality) busbars 42, and a plurality of fastening members 43. Note that the fastening members 43 are the same as those described for subunit SUS, so a redundant explanation will be omitted.

[0085] <5.2.1 Base Components> Figure 12 is a perspective view showing the base member 41T. The base member 41T is a support member that integrally supports a plurality of busbars 42 arranged horizontally with spacing between them. The base member 41T is made of, for example, synthetic resin and has insulating properties. The base member 41T electrically insulates the plurality of busbars 42 from each other by, for example, ribs (not shown). The base member 41T may also be called an "insulating substrate". The base member 41T has a three-dimensional structure that is thicker in the Z direction compared to the base plate 41S included in the subunit SUS. The base member 41T has, for example, a support wall 81, a frame portion 85 (peripheral wall portion), and a fixing portion 87.

[0086] (Supporting wall) The support wall 81 is, for example, a plate-shaped wall portion that runs horizontally. Multiple bus bars 42 are placed on the support wall 81 and supported from below by the support wall 81 (see Figure 10). Note that the support wall 81 that supports the bus bars 42 is not limited to a wall portion that runs horizontally, but may also be a lattice-shaped wall portion formed by multiple ribs extending in the Z direction. In this embodiment, a fastening member 43 is attached to the support wall 81. The fastening member 43 protrudes from the support wall 81 in the +Z direction.

[0087] (A housing for electronic components) In this embodiment, the base member 41T has a housing portion 84A that opens on the +Z direction side. The housing portion 84A is, for example, a recess in the Z direction in which a part of the support wall 81 is recessed, or a through hole that penetrates the support wall 81 in the Z direction. When viewed from the Z direction, the housing portion 84A has an outer shape that corresponds to the shape of the case 11 (i.e., the main body portion 12) of the electronic component 10 (e.g., electronic component 10T). At least a part of the electronic component 10 (e.g., at least a part of the main body portion 12) is housed in the housing portion 84A. At least a part of the electronic component 10 housed in the housing portion 84A is located on the -Z direction side relative to the support wall 81.

[0088] (A housing for the metal part) In this embodiment, the base member 41T has a housing portion 84B that opens on the +Z direction side. The housing portion 84B is, for example, a recess in which a part of the support wall 81 is recessed in the Z direction, or a through hole that penetrates the support wall 81 in the Z direction. When viewed from the Z direction, the housing portion 84B has an outer shape corresponding to the shape of the metal portion 90, which will be described later. At least a part of the metal portion 90 is housed in the housing portion 84B. At least a part of the metal portion 90 housed in the housing portion 84B is located on the -Z direction side relative to the support wall 81.

[0089] (Frame) The frame portion 85 is provided at the peripheral end of the base member 41T. The frame portion 85 is a rib (peripheral wall portion) extending in the Z direction at the peripheral end of the base member 41T. The width (thickness) H21 of the frame portion 85 (peripheral wall portion) in the Z direction is, for example, more than half of the width (thickness) H22 of the electronic component 10 (for example, electronic component 10TA) in the Z direction (see Figure 14). Note that the frame portion 85 may be omitted.

[0090] (Fixed part) The fixing portion 87 is the part that is fixed to the metal plate 110 (see Figure 14). The fixing portion 87 faces the fixing portion 112 of the metal plate 110 in the Z direction. The fixing portion 87 has a mounting hole 87h that penetrates the base member 41T in the Z direction. A fastening member 115 (e.g., a screw or bolt) is passed through the mounting hole 87h. When the fastening member 115 passed through the mounting hole 87h engages with the engagement hole 112h of the fixing portion 112 of the metal plate 110, the base member 41T is fixed to the metal plate 110.

[0091] <5.2.2 Busbar> Next, we will describe the bus bar 42 included in the cable routing structure 40T. Figure 13 is a plan view showing the subunit SUT. The busbar 42 is a wiring member (electrical connection member) included in the wiring structure 40T. The busbar 42 is, for example, a wiring member for electrically connecting multiple electronic components 10 (e.g., multiple electronic components 10T). Alternatively, the busbar 42 may be a wiring member for connecting an electronic component 10 (e.g., electronic component 10T) to an electronic component 10 included in another subunit SU (e.g., subunit SUS). In this embodiment, the multiple busbars 42 are supported from below by the base member 41T and are positioned away from the metal plate 110. The busbars 42 are positioned, for example, directly below the terminals 13 of the electronic component 10. When viewed from the X or Y direction, the busbars 42 overlap with the component body 12 of the electronic component 10 (see Figure 15).

[0092] The multiple busbars 42 include, for example, four busbars 42E, 42F, 42G, and 42I. The four busbars 42E, 42F, 42G, and 42I are arranged horizontally with space between them. The four busbars 42E, 42F, 42G, and 42I include portions that are arranged on the same plane as each other. At least a portion of each busbar 42 is a horizontal plate portion 42p. In this embodiment, each busbar 42 is plate-shaped along its entire length in the horizontal direction. The horizontal plate portion 42p of each busbar 42 includes a connecting portion 61, a connecting portion 62, and an extension portion 63. In this embodiment, the subunit SUT has an electronic component 10D as one of a plurality of electronic components 10TA.

[0093] The connector 61 of busbar 42E is connected to busbar 42 included in subunit SUS. Similarly, the connector 61 of busbar 42F is connected to busbar 42 included in subunit SUS. The connector 62 of busbar 42F is physically and electrically connected to terminal 13A of electronic component 10D. For example, terminal 13A of electronic component 10D is connected to the connector 62 of busbar 42F by being placed on the horizontal plate portion 42p of busbar 42F.

[0094] The connector 61 of the busbar 42G is physically and electrically connected to the terminal 13B of the electronic component 10D. For example, the terminal 13B of the electronic component 10D is connected to the connector 61 of the busbar 42G by being placed on the horizontal plate portion 42p of the busbar 42G. The connector 62 of the busbar 42G is physically and electrically connected to an external busbar 76. The connector 62 of the busbar 42G is connected to an external device via the busbar 76. The busbar 76 is an example of an "external connection component". Note that the connector 62 of the busbar 42G may be physically and electrically connected to the terminal 13 of another electronic component 10 instead of the busbar 76.

[0095] The connector 61 of busbar 42I is connected to busbar 42 included in subunit SUS. The connector 62 of busbar 42I is physically and electrically connected to terminal 13A of electronic component 10T (not shown).

[0096] <5.3 Auxiliary base member> Next, the auxiliary base member 101 will be described. Figure 14 is a cross-sectional view along the line F14-F14 of the structure shown in Figure 13. The auxiliary base member 101 is made of, for example, synthetic resin and is insulating. Multiple wirings 102 are provided on the surface of the auxiliary base member 101. The wirings 102 are, for example, conductive layers (metal layers) provided on the surface of the auxiliary base member 101. The auxiliary base member 101 is positioned in the Z direction between the base member 41T and the planar portion 111 of the metal plate 110. The auxiliary base member 101 faces the electronic component 10TB from the -Z direction side. The terminals 13 of the electronic component 10TB are electrically connected to the wirings 102 provided on the auxiliary base member 101 at a position between the base member 41T and the planar portion 111 of the metal plate 110. The auxiliary base member 101 is an example of a "third base member".

[0097] <5.4 Metal parts> Next, with reference to Figure 12, the metal part 90 will be described. The metal part 90 is, for example, a structure that reduces thermal interference from external equipment to the electronic components 10 included in the subunit SUT.

[0098] The metal part 90 is a heat transfer part that, for example, transmits a portion of the heat directed from an external device to the electronic component 10 (e.g., electronic component 10T) via the busbar 76 to the flat portion 111 of the metal plate 110, which will be described later. Alternatively, the metal part 90 may be a heat transfer part that transmits at least a portion of the heat emitted by the electronic component 10 and at least a portion of the heat emitted by the busbar 42 itself to the flat portion 111 of the metal plate 110. The flat portion 111 of the metal plate 110 is positioned away from the busbar 42 in the Z direction. The flat portion 111 of the metal plate 110 faces the busbar 42 in the Z direction. The flat portion 111 of the metal plate 110 is an example of an "opposing portion".

[0099] The metal part 90 is, for example, a heat storage member (heat absorption member) that increases the heat capacity of the electrical circuit included in the subunit SUT. The metal part 90 stores (absorbs) some of the heat that is directed from external equipment to the electronic component 10 (e.g., electronic component 10TA) via the bus bar 76. Alternatively, the metal part 90 may store (absorb) at least some of the heat emitted by the electronic component 10 and at least some of the heat emitted by the bus bar 42 itself. When the metal part 90 is used as a heat storage member, the metal part 90 does not need to be thermally connected to the metal plate 110.

[0100] Figure 15 is a cross-sectional view along the line F15-F15 of the structure shown in Figure 13. Figure 16 is a cross-sectional view along the line F16-F16 of the structure shown in Figure 13. In this embodiment, the metal part 90 is provided separately from the metal plate 110. The metal part 90 is, for example, a solid metal block. The shape of the metal part 90 is not limited to the above example. The metal part 90 may be a member having an I-shaped, L-shaped, or C-shaped cross-sectional shape. The metal part 90 may be integrally formed with the base member 41T by insert molding.

[0101] The thickness H31 of the metal part 90 in the Z direction is greater than the thickness T1 of the horizontal plate portion 42p of the busbar 42 in the Z direction. For example, the thickness H31 of the metal part 90 in the Z direction is more than twice the thickness T1 of the horizontal plate portion 42p of the busbar 42 in the Z direction.

[0102] In this embodiment, the width W31 of the metal part 90 in the X direction is greater than the width W32 of the electronic component 10 in the X direction (see Figure 13). From another perspective, the width W31 of the metal part 90 in the X direction (see Figure 13) is greater than the thickness H31 of the metal part 90 in the Z direction (see Figure 16) as described above.

[0103] In this embodiment, the base member 41T is positioned between the busbar 42 and the flat portion 111 of the metal plate 110. The base member 41T has a housing portion 84B that opens in the Z direction. At least a portion of the metal portion 90 is housed in the housing portion 84B.

[0104] The metal part 90 is positioned between the bus bar 42 and the flat portion 111 of the metal plate 110 in the Z direction. The metal part 90 faces the bus bar 42 from the Z direction and is thermally connected to the bus bar 42.

[0105] In this embodiment, the metal part 90 is positioned, for example, between the extended portion 63 of the busbar 42 and the flat portion 111 of the metal plate 110. The metal part 90 faces the extended portion 63 of the busbar 42 from the Z direction and is thermally connected to the extended portion 63 of the busbar 42.

[0106] In this embodiment, the metal part 90 has an engagement hole 90h that opens in the +Z direction. The inner circumferential surface of the engagement hole 90h has a screw groove. The extension portion 63 of the busbar 42 has a through hole 42h that faces the engagement hole 90h. A fastening member 117 (for example, a screw or bolt) is passed through the through hole 42h of the busbar 42 from the +Z direction side. When the fastening member 117 passed through the through hole 42h of the busbar 42 engages with the engagement hole 90h of the metal part 90, the extension portion 63 of the busbar 42 is fixed to the metal part 90.

[0107] In this embodiment, a heat transfer member 120B is placed between the metal part 90 and the flat portion 111 of the metal plate 110. The heat transfer member 120B is an example of the heat transfer member 120 described above. In addition to the above example, a heat transfer member 120B may be placed between the metal part 90 and the busbar 42.

[0108] As shown in Figure 13, when viewed from the Z direction, the metal part 90 is positioned between the terminal 13B of the electronic component 10 and the bus bar 76 for external connection. Therefore, heat directed from the bus bar 76 to the electronic component 10 through the bus bar 42 is more likely to transfer to the metal part 90 before reaching the electronic component 10.

[0109] The metal part 90 includes, for example, a first part 91 and a second part 92. The first part 91 is located on the +Y side with respect to the terminal 13B of the electronic component 10 when viewed from the Z direction. The second part 92 is located on the -X side or the +X side with respect to the terminal 13B of the electronic component 10 when viewed from the Z direction. The first part 91 and the second part 92 are formed integrally. With this configuration, it is easier to secure a larger volume for the metal part 90 compared to a rectangular parallelepiped metal part 90.

[0110] <6. Subunit Connection Structure> Next, we will describe the connecting structure between multiple subunits SU. Figure 17 is a perspective view showing the connection structure between subunit SUS and subunit SUT. In this embodiment, a step ST is formed between subunit SUS and subunit SUT based on the difference in height in the Z direction between the base plate 41S of subunit SUS and the base member 41T of subunit SUT. Using this step ST, a cross structure is realized in which the busbar 42 included in subunit SUS and the busbar 42 included in subunit SUT intersect in three dimensions.

[0111] For example, the busbars 42E, 42F, and 42I included in the subunit SUT maintain their height in the Z direction supported by the base member 41T and extend in the -Y direction to a position where they overlap with the base plate 41S of the subunit SUS in the Z direction. Each connection portion 61 of the busbars 42E, 42F, and 42I moves away from the base plate 41S of the subunit SUS in the Z direction, while facing the base plate 41S of the subunit SUS in the Z direction.

[0112] On the other hand, the connection portion 62 of the bus bar 42A included in the subunit SUS is raised in the +Z direction relative to the extended portion 63 of the bus bar 42A and is in contact with the connection portion 61 of the bus bar 42E from the -Z direction side. The connection portion 62 of the bus bar 42A and the connection portion 61 of the bus bar 42E are fixed together by a fastening member 43 and an engaging member 44.

[0113] Similarly, the connection portion 62 of the bus bar 42C included in the subunit SUS is raised in the +Z direction relative to the extended portion 63 of the bus bar 42C and is in contact with the connection portion 61 of the bus bar 42I from the -Z direction side. The connection portion 62 of the bus bar 42C and the connection portion 61 of the bus bar 42I are fixed together by a fastening member 43 and an engaging member 44.

[0114] The extended portion 63 of the busbar 42D included in the subunit SUS extends in the X direction through the space between the flat portion 111 of the metal plate 110 and the busbar 42I. For example, the extended portion 63 of the busbar 42D extends across the +X and -X directions of the busbar 42I, passing through a region that overlaps with the busbar 42I when viewed from the Z direction. The connecting portion 62 of the busbar 42D is raised in the +Z direction relative to the extended portion 63 of the busbar 42D and is in contact with the connecting portion 61 of the busbar 42F from the -Z direction. The connecting portion 62 of the busbar 42D and the connecting portion 61 of the busbar 42F are fixed together by a fastening member 43 and an engaging member 44.

[0115] <7. Busbar extension structure> Figure 18 is a cross-sectional view along the line F18-F18 of the structure shown in Figure 13. In this embodiment, one busbar 42 (busbar 42K) is positioned between the base member 41T and the planar portion 111 of the metal plate 110, and extends in the Y direction through the gap S2 between the base member 41T and the planar portion 111 of the metal plate 110. The busbar 42K is positioned, for example, between the auxiliary base member 101 and the planar portion 111 of the metal plate 110. The busbar 42K extends, for example, across the -Y direction and the +Y direction of the base member 41T. The connector 61 of the busbar 42K is physically and electrically connected to the busbar 42 included in the subunit SUS. The connector 62 of the busbar 42K is physically and electrically connected to the busbar 76 for external connection.

[0116] <8. Metal plate and insulating cover> Next, we will return to Figure 2 and describe the metal plate 110 and the insulating cover 119.

[0117] <8.1 Metal Plate> The metal plate 110 is a component that ensures the rigidity of the electrical connection unit 1 and enhances the heat dissipation of the electrical connection unit 1. The metal plate 110 is made of metal (for example, aluminum or an aluminum alloy). The metal plate 110 is an example of a "heat dissipation component". The metal plate 110 may also be referred to as a "metal component" or a "rigid component".

[0118] The metal plate 110 is rectangular in shape along the X and Y directions. The metal plate 110 has a first end 110e1, a second end 110e2, a third end 110e3, and a fourth end 110e4. The first end 110e1 and the second end 110e2 are a pair of longitudinal ends of the metal plate 110, separated in the X direction. The third end 110e3 and the fourth end 110e4 are a pair of transverse ends of the metal plate 110, separated in the Y direction. The metal plate 110 includes, for example, a flat portion 111, the aforementioned plurality of fixing portions 112 (see Figure 9), and the aforementioned plurality of fixing portions 113 (see Figure 9).

[0119] The flat portion 111 is a plate-shaped part within the metal plate 110. The flat portion 111 is plate-shaped and oriented horizontally. The flat portion 111 forms the main part of the metal plate 110. The flat portion 111 forms the base (metal base) of the metal plate 110. The flat portion 111 is large enough to cover the two subunits SU from below.

[0120] In this embodiment, the planar portion 111 has a first region A1 and a second region A2. The first region A1 is, for example, the region on the -Y direction side of the planar portion 111. The subunit SUS described above faces the first region A1 of the planar portion 111 when viewed from the Z direction. That is, the multiple electronic components 10S and the base plate 41S included in the subunit SUS face the first region A1 of the planar portion 111 in the Z direction.

[0121] The second region A2 is, for example, the region on the +Y direction side of the planar portion 111. The subunit SUT described above faces the second region A2 of the planar portion 111 when viewed from the Z direction. That is, the multiple electronic components 10T and the base member 41T included in the subunit SUT face the second region A2 of the planar portion 111 in the Z direction.

[0122] <8.2 Insulation Cover> The insulating cover 119 is a component for preventing fingers from touching the energized circuit of the subunit SU. The insulating cover 119 is made of, for example, synthetic resin and has insulating properties. The insulating cover 119 is, for example, box-shaped with the -Z direction side open. The insulating cover 119 has a plurality of ventilation holes 119h. The insulating cover 119 covers part or all of the corresponding subunit SU. Note that the insulating cover 119 is not limited to a box-shaped component, but may be a sheet-like component that covers the energized circuit of the main body MU. Also, the insulating cover 119 may be omitted.

[0123] <9. Heat Transfer Section> Next, the heat transfer member 120A will be described. The heat transfer member 120A is a member that transfers heat from the first region R1 to the second region R2 of the electrical connection unit 1 described above. The heat transfer member 120A is an example of a "heat transfer section". In this embodiment, the heat transfer member 120A is formed separately from the metal plate 110.

[0124] As shown in Figure 2, the multiple heat transfer members 120A are arranged side by side with spacing in the X direction. Each of the multiple heat transfer members 120A extends in the Y direction. When viewed from the Z direction, the heat transfer members 120A extend across the first region A1 and the second region A2 of the metal plate 110. The heat transfer member 120A has, for example, a first portion 131, a second portion 132, and a third portion 133.

[0125] The first portion 131 forms, for example, the first end portion 130e1 (see Figure 2) of the heat transfer member 120A. The first end portion 130e1 is, for example, the end portion of the heat transfer member 120A on the -Y direction side. When viewed from the Z direction, the first portion 131 (for example, the first end portion 130e1) faces the first region A1 of the metal plate 110.

[0126] In this embodiment, the first portion 131 (e.g., the first end portion 130e1) is located in the Z direction between the first region A1 of the metal plate 110 and the base plate 41S of the subunit SUS (see Figure 8). In this embodiment, the first portion 131 (e.g., the first end portion 130e1) is positioned between the bus bar 42 of the subunit SUS and the flat portion 111 of the metal plate 110, and is in contact with the connection portion 61 or 62 of the bus bar 42 of the subunit SUS. The first portion 131 (e.g., the first end portion 130e1) is thermally connected to the connection portion 61 or 62 of the bus bar 42 of the subunit SUS. For example, the first portion 131 is thermally connected to the terminal 13 of the electronic component 10S via the connection portion 61 or 62 of the bus bar 42 of the subunit SUS. In this disclosure, "in contact" is not limited to direct contact, but may also include cases where the connection is made via an insulating sheet or other material to ensure insulation. For example, the statement that the first part 131 is in contact with the busbar 42 may include the presence of an insulating sheet (e.g., insulating sheet 162, see Figure 21) between the first part 131 and the busbar 42.

[0127] In this embodiment, the first portion 131 (for example, the first end portion 130e1) is in contact with the first region A1 of the flat portion 111 of the metal plate 110. The first portion 131 (for example, the first end portion 130e1) is thermally connected to the first region A1 of the flat portion 111 of the metal plate 110.

[0128] The second portion 132 forms, for example, the second end 130e2 (see Figure 2) of the heat transfer member 120A. The second end 130e2 is the end located on the opposite side from the first end 130e1. The second end 130e2 is, for example, the end of the heat transfer member 120A on the +Y direction side. When viewed from the Z direction, the second portion 132 (for example, the second end 130e2) faces the second region A2 of the metal plate 110.

[0129] In this embodiment, the second portion 132 (e.g., the second end portion 130e2) is located in the Z direction between the second region A2 of the metal plate 110 and the base member 41T of the subunit SUT (see Figures 14 and 15). The second portion 132 (e.g., the second end portion 130e2) is in contact with the second region A2 of the planar portion 111 of the metal plate 110 and is thermally connected to the second region A2 of the planar portion 111 of the metal plate 110. Note that the statement that the second portion 132 is in contact with the planar portion 111 of the metal plate 110 may include the presence of an insulating sheet (e.g., insulating sheet 162, see Figure 21) between the second portion 132 and the planar portion 111 of the metal plate 110.

[0130] The third portion 133 is located between the first portion 131 and the second portion 132 and extends in the Y direction. The third portion 133 connects the first portion 131 and the second portion 132. A portion of the third portion 133 faces the first region A1 of the metal plate 110 when viewed from the Z direction. Another portion of the third portion 133 faces the second region A2 of the metal plate 110 when viewed from the Z direction.

[0131] In this embodiment, a portion of the third portion 133 is located in the Z direction between the first region A1 of the metal plate 110 and the base plate 41S of the subunit SUS (see Figure 8). In this embodiment, the third portion 133 is positioned between the extended portion 63 or connecting portion 62 of the busbar 42 of the subunit SUS and the flat portion 111 of the metal plate 110, and is in contact with the extended portion 63 or connecting portion 62 of the busbar 42 of the subunit SUS. The third portion 133 is thermally connected to the extended portion 63 or connecting portion 62 of the busbar 42. For example, contact between the third portion 133 and the busbar 42 may include the presence of an insulating sheet (e.g., insulating sheet 162, see Figure 21) between the third portion 133 and the busbar 42.

[0132] In this embodiment, another part of the third portion 133 is located in the Z direction between the second region A2 of the metal plate 110 and the base member 41T of the subunit SUT (see Figure 15). The third portion 133 is in contact with the second region A2 of the planar portion 111 of the metal plate 110 and is thermally connected to the second region A2 of the planar portion 111 of the metal plate 110. Note that the third portion 133 being in contact with the planar portion 111 of the metal plate 110 may include the presence of an insulating sheet (e.g., insulating sheet 162, see Figure 21) between the third portion 133 and the planar portion 111 of the metal plate 110.

[0133] Furthermore, if another heat transfer member 120 (for example, heat transfer member 120C shown in Figure 19) is provided to thermally connect the connection portion 61 of the bus bar 42 of the subunit SUS and the first region A1 of the metal plate 110, the heat transfer member 120A may be provided separately from the said heat transfer member 120 (heat transfer member 120C). In this case, the first portion 131 of the heat transfer member 120A (for example, the first end portion 130e1) may be positioned between the extended portion 63 or connection portion 62 of the bus bar 42 of the subunit SUS and the flat portion 111 of the metal plate 110, and may be in contact with the extended portion 63 or connection portion 62 of the bus bar 42.

[0134] When the electronic component 10S generates heat in the subunit SUS, a portion of the heat generated by the electronic component 10S is transferred, for example, through the first end 130e1 of the heat transfer member 120A to the first region A1 of the flat portion 111 of the metal plate 110. The heat transferred to the first region A1 is then dissipated to the outside. In this embodiment, another portion of the heat generated by the electronic component 10S is transferred, for example, through the heat transfer member 120A from the first region R1 to the second region R2 of the electrical connection unit 1, and then to the second region A2 of the flat portion 111 of the metal plate 110. The heat transferred to the second region A2 is then dissipated to the outside. In other words, in addition to the first region A1 of the metal plate 110, the second region A2 also contributes to the heat dissipation of the electronic component 10S.

[0135] <10. Advantages> As a comparative example, consider a configuration in which the heat transfer member 120A is absent, and a heat transfer member 120 (for example, the heat transfer member 120C shown in Figure 19) is provided to thermally connect the connection portion 61 of the busbar 42 of the subunit SUS and the first region A1 of the metal plate 110. In this comparative example configuration, the first region A1 of the metal plate 110 is effectively utilized as a region for releasing heat from the subunit SUS, where heat dissipation is important. On the other hand, the second region A2 of the metal plate 110 tends to be colder than the first region A1, and may not be effectively utilized as a region for releasing heat. In this case, there is room for improvement in the heat dissipation of the electrical connection unit.

[0136] On the other hand, in this embodiment, the electrical connection unit 1 includes a heat dissipation member (e.g., a metal plate 110), a first electronic component (e.g., an electronic component 10S), a first base member (e.g., a base plate 41S), a first busbar (e.g., a busbar 42 of the subunit SUS), a second electronic component (e.g., an electronic component 10T), a second base member (e.g., a base member 41T), and a heat transfer section (e.g., a heat transfer member 120A). The heat dissipation member includes a first region (e.g., a first region A1) and a second region (e.g., a second region A2). The first electronic component faces the first region in a first direction. The first base member faces the first region in a first direction and is insulating. The first busbar is supported by the first base member and electrically connected to the first electronic component. The second electronic component faces the second region in a first direction. The second electronic component generates less heat than the first electronic component. The second base member faces the second region in the first direction and is insulating. The second busbar is supported by the second base member and electrically connected to the second electronic component. The heat transfer section extends across the first and second regions when viewed from the first direction.

[0137] With this configuration, the heat transfer section can transfer at least a portion of the heat generated by the first electronic component to the second region of the heat dissipation member. This allows the second region of the heat dissipation member to be effectively utilized as a region for releasing at least a portion of the heat generated by the first electronic component. This action improves the heat dissipation performance of the electrical connection unit 1.

[0138] In this embodiment, the first base member includes a flat portion (for example, a flat portion 51). The first busbar is supported by the flat portion. The second base member has a three-dimensional structure that is thicker in the first direction compared to the first base member. With this configuration, the area where the second base member, which has a relatively thick three-dimensional structure, is located (for example, the area where an electronic component 10T requiring a complex execution structure is located) can be used to promote heat dissipation of the electronic component 10S which generates a large amount of heat. This action can further improve the heat dissipation performance of the electrical connection unit 1.

[0139] In this embodiment, the heat transfer section includes a first portion (for example, a first portion 131) and a second portion (for example, a second portion 132). The first portion is located between the first region and the first base member in the first direction. The second portion is located between the second region and the second base member in the first direction. With this configuration, the heat transfer section can be provided by utilizing the gap between the first base member and the heat dissipation member and the gap between the second base member and the heat dissipation member. With this configuration, even when the heat transfer section is provided, it becomes easier to miniaturize the electrical connection unit 1.

[0140] In this embodiment, the heat transfer section is a heat transfer member formed separately from the heat dissipation member. This configuration allows for greater flexibility in the shape and arrangement of the heat transfer section. This configuration makes it possible to further improve the heat dissipation performance of the electrical connection unit 1 and / or to further miniaturize the electrical connection unit 1.

[0141] <11. Variant> Next, some modifications of the embodiment will be described. In each modification, the configuration other than that described below is the same as that of the embodiment described above.

[0142] <11.1 Modifications related to the heat transfer section> (First variation) Figure 19 is a perspective view illustrating the first modified electrical connection unit 1. In this modified version, the electrical connection unit 1 has a heat transfer member 120C and a heat transfer section 140 instead of the heat transfer member 120A.

[0143] The heat transfer member 120C is a heat transfer member that transfers heat from the subunit SUS to the first region A1 of the flat portion 111 of the metal plate 110. The heat transfer member 120C is an example of the heat transfer member 120 described above. When viewed from the Z direction, the heat transfer member 120C is positioned so as to overlap with a part of the bus bar 42 of the subunit SUS. The heat transfer member 120C is positioned between the bus bar 42 of the subunit SUS and the flat portion 111 of the metal plate 110. In this embodiment, the heat transfer member 120C is positioned between the exposed portion 42u of the bus bar 42 and the first region A1 of the flat portion 111 of the metal plate 110, and is in contact with the exposed portion 42u of the bus bar 42 and the first region A1 of the flat portion 111 of the metal plate 110, respectively. The heat transfer member 120C transfers the heat transferred from the electronic component 10 (e.g., electronic component 10S) to the bus bar 42, and / or the heat generated by the bus bar 42, from the bus bar 42 to the first region A1 of the flat portion 111 of the metal plate 110.

[0144] In this modified example, the heat transfer member 120C is positioned near the electronic component 10 (e.g., electronic component 10S) and overlaps with a portion of the bus bar 42 of the subunit SUS when viewed from the Z direction. In this embodiment, the heat transfer member 120C is positioned overlapping with the connecting component 20 when viewed from the Z direction. In other words, the heat transfer member 120C is positioned overlapping with the connecting portion 61 or 62 of the bus bar 42 when viewed from the Z direction. The heat transfer member 120C transfers the heat that moves from the electronic component 10S to the bus bar 42 of the subunit SUS via the connecting component 20, and then transfers that heat from the bus bar 42 of the subunit SUS to the first region A1 of the planar portion 111 of the metal plate 110.

[0145] The heat transfer section 140 is provided separately from the heat transfer member 120C and is a heat transfer section that transfers heat from the first region R1 to the second region R2 of the electrical connection unit 1. The heat transfer section 140 is made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy). The heat transfer section 140 has a higher thermal conductivity than, for example, the base plate 41S (or base member 41T). In this embodiment, the heat transfer section 140 is a thick portion of the metal plate 110 provided as part of the metal plate 110. That is, the heat transfer section 140 is a protrusion that protrudes in the +Z direction from the flat portion 111 of the metal plate 110. Alternatively, the heat transfer section 140 may be formed from a metal member separate from the metal plate 110.

[0146] As shown in Figure 19, the multiple heat transfer sections 140 are arranged side by side with spacing in the X direction. Each of the multiple heat transfer sections 140 extends in the Y direction. When viewed from the Z direction, the heat transfer section 140 extends across the first region A1 and the second region A2 of the metal plate 110. The heat transfer section 140 has, for example, a first part 131, a second part 132, and a third part 133, similar to the heat transfer member 120A described above. Details regarding the heat transfer section 140 are the same as those for the heat transfer member 120A described above. Therefore, for descriptions of the heat transfer section 140 other than those described below, you can simply replace "heat transfer member 120A" with "heat transfer section 140" in the description of the heat transfer member 120A.

[0147] The first portion 131 forms, for example, the first end 130e1 of the heat transfer section 140. The first end 130e1 is, for example, the end of the heat transfer section 140 on the -Y direction side. The first portion 131 (for example, the first end 130e1) faces the first region A1 of the metal plate 110 when viewed from the Z direction. The first portion 131 is formed integrally with the first region A1 of the metal plate 110, for example.

[0148] In this embodiment, the first portion 131 (e.g., the first end portion 130e1) is located in the Z direction between the first region A1 of the metal plate 110 and the base plate 41S of the subunit SUS. In this embodiment, the first portion 131 (e.g., the first end portion 130e1) is positioned between the bus bar 42 of the subunit SUS and the flat portion 111 of the metal plate 110, and is in contact with the connection portion 61, connection portion 62, or extension portion 63 of the bus bar 42 of the subunit SUS. The first portion 131 (e.g., the first end portion 130e1) is thermally connected to the connection portion 61, connection portion 62, or extension portion 63 of the bus bar 42 of the subunit SUS.

[0149] The second portion 132 forms, for example, the second end 130e2 of the heat transfer section 140. The second end 130e2 is, for example, the end of the heat transfer section 140 on the +Y direction side. The second portion 132 (for example, the second end 130e2) faces the second region A2 of the metal plate 110 when viewed from the Z direction. The second portion 132 is formed integrally with the second region A2 of the metal plate 110, for example.

[0150] In this embodiment, the second portion 132 (e.g., the second end portion 130e2) is located in the Z direction between the second region A2 of the metal plate 110 and the base member 41T of the subunit SUT. The second portion 132 (e.g., the second end portion 130e2) is in contact with the second region A2 of the planar portion 111 of the metal plate 110 and is thermally connected to the second region A2 of the planar portion 111 of the metal plate 110.

[0151] The third portion 133 is located between the first portion 131 and the second portion 132 and extends in the Y direction. The third portion 133 connects the first portion 131 and the second portion 132. A portion of the third portion 133 faces the first region A1 of the metal plate 110 when viewed from the Z direction. Another portion of the third portion 133 faces the second region A2 of the metal plate 110 when viewed from the Z direction.

[0152] In this embodiment, a portion of the third portion 133 is positioned between the extended portion 63 or connecting portion 62 of the busbar 42 of the subunit SUS and the flat portion 111 of the metal plate 110, and is in contact with the extended portion 63 or connecting portion 62 of the busbar 42. A portion of the third portion 133 is formed integrally with, for example, the first region A1 of the metal plate 110.

[0153] Furthermore, another part of the third portion 133 is in contact with the second region A2 of the flat portion 111 of the metal plate 110 and is thermally connected to the second region A2 of the flat portion 111 of the metal plate 110. This other part of the third portion 133 is, for example, formed integrally with the second region A2 of the metal plate 110.

[0154] With this configuration, the heat transfer section 140, being made of metal, can facilitate the transfer of heat from the first region R1 to the second region R2 of the electrical connection unit 1. This configuration further improves the heat dissipation performance of the electrical connection unit 1. In this embodiment, the heat transfer section 140 is made of metal. In this case, the heat transfer can be further facilitated by the heat transfer section 140 having high thermal conductivity.

[0155] (Second variation) Figure 20 is a perspective view illustrating the electrical connection unit 1 of the second modified example. In this modified example, the electrical connection unit 1 includes a heat transfer member 120C, a heat transfer substrate 150, a heat transfer member 120D, a heat transfer material 161 (see Figure 23), and an insulating sheet 162 (see Figure 23). The contents of the heat transfer member 120C are the same as those described in the first modified example, so a redundant explanation will be omitted.

[0156] The heat transfer substrate 150 is a substrate-type heat transfer unit that transfers heat from the first region R1 to the second region R2 of the electrical connection unit 1. The heat transfer substrate 150 is positioned in the Z direction between the two subunits SU (subunits SUS, SUT) described above and the flat portion 111 of the metal plate 110. The heat transfer substrate 150 has a base plate 151 and one or more (e.g., multiple) heat transfer busbars 152.

[0157] In this embodiment, the base plate 151 and the multiple busbars 152 are integrated by insert molding. For example, the heat transfer substrate 150 is formed as a single piece by insert molding the busbars 152 with the base plate 151. That is, the busbars 152 are integrated with the base plate 151 without using fastening members such as screws or bolts. Note that the heat transfer substrate 150 may be formed by a different structure instead of insert molding, similar to the wiring substrate 40.

[0158] The base plate 151 is a support member that integrally supports a plurality of busbars 152 arranged horizontally with spacing between them. The base plate 151 is made of, for example, synthetic resin and has insulating properties. The base plate 151 is, for example, a plate-shaped structure that aligns horizontally. The base plate 151 is an example of a "base member". The base plate 151 may also be referred to as an "insulating substrate".

[0159] The base plate 151 has, for example, one or more (e.g., multiple) housing sections 155, each of which accommodates a busbar 152. The multiple housing sections 155 are formed apart from each other in the X or Y direction. Each housing section 155 is, for example, a through hole penetrating the base plate 151 in the Z direction. Alternatively, the housing section 155 may be a recess provided on the surface of the base plate 151 that is recessed in the Z direction. When viewed from the Z direction, each housing section 155 has an outer shape corresponding to the shape of the busbar 152 it accommodates. The base plate 151 also has an opening 151h to avoid interference with the heat transfer member 120C.

[0160] The heat transfer busbar 152 is a busbar that transfers heat from the first region R1 to the second region R2 of the electrical connection unit 1. The busbar 152 is made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy). The busbar 152 has a higher thermal conductivity than, for example, the base plate 41S. The busbar 152 is an example of a "heat transfer part". The busbar 152 may also be referred to as a "metal member".

[0161] As shown in Figure 20, the multiple busbars 152 are arranged side by side with spacing in the X direction. Each of the multiple busbars 152 extends in the Y direction. When viewed from the Z direction, the busbars 152 extend across the first region A1 and the second region A2 of the metal plate 110. The busbars 152 have, for example, a first portion 131, a second portion 132, and a third portion 133. Details regarding the busbars 152 are the same as those for the heat transfer member 120A or heat transfer section 140 described above. Therefore, when describing the busbars 152, you can simply replace "heat transfer member 120A" or "heat transfer section 140" with "busbars 152" in the description of the heat transfer member 120A or heat transfer section 140.

[0162] Figure 21 is a cross-sectional view illustrating a second modified electrical connection unit 1. In this modified example, the busbar 152 is made of metal and is rigid. A first portion 131 (e.g., a first end 130e1) of the busbar 152 faces the busbar 42 of the subunit SUS in the Z direction. The first portion 131 (e.g., a first end 130e1) of the busbar 152 is thermally connected to the busbar 42 of the subunit SUS.

[0163] In this modified example, a heat transfer material 161 is provided between the first portion 131 (e.g., the first end 130e1) of the busbar 152 and the busbar 42. The heat transfer material 161 is a heat transfer material for more firmly connecting the busbar 152 and the busbar 42 thermally. The heat transfer material 161 is, for example, thermal grease, but may also be an elastic heat transfer sheet or the like. The heat transfer material 161 has a higher thermal conductivity than, for example, the base plate 41S (or base member 41T).

[0164] In this modified example, an insulating sheet 162 is provided between the first portion 131 (e.g., the first end 130e1) of the busbar 152 and the busbar 42. The insulating sheet 162 electrically insulates the busbar 152 and the busbar 42.

[0165] In this modified example, a heat transfer member 120D (see Figure 22) is provided between the second portion 132 (e.g., the second end portion 130e2) of the busbar 152 and the second region A2 of the flat portion 111 of the metal plate 110. The heat transfer member 120D is an example of the heat transfer member 120 described above. The second portion 132 of the busbar 152 is thermally connected to the second region A2 of the flat portion 111 of the metal plate 110 via the heat transfer member 120D.

[0166] With this configuration, the heat transfer busbar 152 can facilitate the transfer of heat from the first region R1 to the second region R2 of the electrical connection unit 1. This configuration further improves the heat dissipation performance of the electrical connection unit 1.

[0167] <11.2 Modified examples related to wiring substrates> (First variation) The routing substrate 40S is not limited to a structure in which the base plate 41S and the bus bar 42 are integrated by insert molding. For example, the base plate 41S, which is provided with a housing portion 55 for housing the bus bar 42, may be molded, and then the bus bar 42 may be placed in the housing portion 55. In this case, the bus bar 42 may be fixed to the housing portion 55 by fitting, or by adhesive or other fixing means. In these cases, potting may be applied to fill the gap between the bus bar 42 and the housing portion 55.

[0168] (Second variation) The base member of the cable routing substrate 40S is not limited to a base plate 41S having a plate-shaped flat portion 51. The cable routing substrate 40S may also be a base member having a sheet-shaped flat portion 51 (for example, an insulating sheet). In this case, a portion of the flat portion 51 may conform to the outer shape of the bus bar 42 to form the housing portion 55. In this disclosure, "sheet-shaped" or "sheet" is not limited to a member with a thickness of 1 mm or more, and may also include a member with a thickness of less than 1 mm (so-called film).

[0169] (Third variation) The base plate 41S of the cable routing substrate 40S may include a plurality of members (plate members or sheet members). The plurality of members are provided so as to sandwich a plurality of bus bars 42 arranged in the horizontal direction. For example, the plurality of members may be integrated by sandwiching a plurality of bus bars 42, for example, by lamination molding. The plurality of members form a planar portion 51. In this case, the housing portion 55 may be formed hollow inside the base plate 41S (between the plurality of members). The plurality of members may be a plurality of plate members, a plurality of sheet members, or a combination of plate members and sheet members. The sheet members may be, for example, flexible sheet members. The planar portion 51 formed by the plurality of members has openings that expose at least the first connection portion 61 and the second connection portion 62 of the bus bars 42.

[0170] (Fourth variation) The connection between the electronic component 10 and the busbar 42 is not limited to a connection via the connecting component 20. The electronic component 10 may be directly connected to the busbar 42 using fastening members (e.g., bolts or screws) or welding.

[0171] Several embodiments and modifications have been described above. However, the embodiments and modifications are not limited to the examples described above. For example, the modifications described above may be implemented in combination with each other. [Explanation of Symbols]

[0172] 1…Electrical connection unit SU, SUS, SUT… Subunits 10, 10S, 10T, 10TA, 10TB… Electronic components Terminals 13, 13A, 13B… 20…Connecting parts 40S… Circuit board for cable routing 40T... Cable routing structure 41S…Base plate 41T...Base component 42... Bus bar 51...Plane part 52...frame section 55...Detention Unit 61...Connection part 62...Connection part 63…Extension part 84A, 84B… Storage section 85...frame section 110…Metal plate (heat dissipation member, rigid member, metal member) 111...Plane part (opposing part) 120… Heat transfer components 120A... Heat transfer component (heat transfer part) 120B, C... Heat transfer components 131…Part 1 132…Second part 133...Third part 140... Heat transfer section 150… Heat transfer substrate 151…Base plate 152... Busbars for heat transfer 161… Heat transfer material

Claims

1. A heat dissipation member including a first region and a second region, A first electronic component facing the first region in the first direction, An insulating first base member facing the first region in the first direction, A first busbar supported by the first base member and electrically connected to the first electronic component, A second electronic component that faces the second region in the first direction and generates less heat than the first electronic component, An insulating second base member facing the second region in the first direction, A second busbar supported by the second base member and electrically connected to the second electronic component, A heat transfer section extending across the first region and the second region when viewed from the first direction, An electrical connection unit equipped with [a specific feature].

2. The first base member includes a flat portion, The first busbar is supported on the flat portion, The second base member has a three-dimensional structure that is thicker in the first direction compared to the first base member. The electrical connection unit according to claim 1.

3. The heat transfer section includes a first part and a second part. The first portion is located between the first region and the first base member in the first direction. The second portion is located between the second region and the second base member in the first direction. The electrical connection unit according to claim 1 or claim 2.

4. The system further comprises a heat transfer material disposed between the first busbar and the heat transfer section. The electrical connection unit according to claim 1 or claim 2.

5. The heat transfer section is a heat transfer member formed separately from the heat dissipation member. The electrical connection unit according to claim 1 or claim 2.

6. The heat dissipation member is made of metal. The heat transfer portion is a thick portion of the heat dissipation member provided as part of the heat dissipation member. The electrical connection unit according to claim 1 or claim 2.

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