Ultrasound examination apparatus and power module ultrasound examination method

Abstract

Efficiently inspects various characteristics of the object under inspection (e.g., power modules), such as void defects at the bonding surface, void defects in the substrate, crack defects in the substrate, delamination defects, defects around wires, etc. [Solution] An ultrasonic inspection apparatus according to one embodiment of the present invention includes a first ultrasonic scanner positioned on one side of an object to be inspected and moving to scan the object to be inspected, and a second ultrasonic scanner positioned on the other side of the object to be inspected and moving to scan the object to be inspected, wherein the first ultrasonic scanner transmits ultrasonic waves to the object to be inspected and receives first reflected ultrasonic waves reflected from the object to be inspected, and the second ultrasonic scanner can receive transmitted ultrasonic waves that pass through the object to be inspected.

Description

Technical Field

[0001] The present invention relates to an ultrasonic inspection apparatus and a power module ultrasonic inspection method.

Background Art

[0002] Non-destructive testing (NDT) that utilizes a signal having a frequency in the ultrasonic wave region to obtain an ultrasonic image of an inspection target is used in various fields. The ultrasonic image can include at least one of an A-scan image, a B-scan image, and a C-scan image.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An ultrasonic inspection apparatus and a power module ultrasonic inspection method according to an embodiment of the present invention can be efficient in obtaining both reflected ultrasonic data used to inspect some characteristics of an inspection target (e.g., bonding surface void defect, substrate void defect, substrate crack defect, etc.) and transmitted ultrasonic data used to inspect other some characteristics of the inspection target (e.g., delamination defect, wire peripheral defect, etc.), and can efficiently inspect various characteristics of the inspection target (e.g., bonding surface void defect, substrate void defect, substrate crack defect, delamination defect, wire peripheral defect, etc.).

Means for Solving the Problems

[0005] An ultrasonic inspection apparatus according to one embodiment of the present invention includes a first ultrasonic scanner positioned on one side of an object to be inspected and moving to scan the object to be inspected, and a second ultrasonic scanner positioned on the other side of the object to be inspected and moving to scan the object to be inspected, wherein the first ultrasonic scanner transmits ultrasonic waves to the object to be inspected and receives first reflected ultrasonic waves reflected from the object to be inspected, and the second ultrasonic scanner can receive transmitted ultrasonic waves that pass through the object to be inspected.

[0006] For example, the second ultrasonic scanner can transmit ultrasound to the object to be inspected and receive the second reflected ultrasound reflected from the object to be inspected.

[0007] For example, the ultrasound inspection apparatus further includes a processing unit configured to generate a first C-scan image based on the first reflected ultrasound, a second C-scan image based on the second reflected ultrasound, and a T-scan image based on the transmitted ultrasound.

[0008] For example, the first ultrasonic scanner transmits first C-scan ultrasound and T-scan ultrasound to the object under inspection, the second ultrasonic scanner transmits second C-scan ultrasound to the object under inspection, and the second ultrasonic scanner or the processing machine can distinguish between the second reflected ultrasound and the transmitted ultrasound based on the difference in frequency or the difference in reception time.

[0009] For example, the object under inspection includes a power module, the power module includes a first substrate positioned facing the first ultrasonic scanner, a second substrate positioned facing the second ultrasonic scanner, and a semiconductor element positioned between the first substrate and the second substrate, and the processing machine can generate a first C-scan image including an image of the first substrate, a second C-scan image including an image of the second substrate, and a T-scan image including an image of the semiconductor element.

[0010] For example, the ultrasound inspection apparatus further includes a processing unit configured to generate a first C-scan image based on the first reflected ultrasound and a T-scan image based on the transmitted ultrasound, and the first ultrasound scanner can transmit the first C-scan ultrasound and the T-scan ultrasound to the object to be inspected.

[0011] For example, the object under inspection may include a power module, and the power module may include a first substrate and semiconductor elements arranged on the first substrate.

[0012] For example, the ultrasound inspection apparatus further includes a mobile device that moves the first ultrasound scanner and the second ultrasound scanner horizontally to scan the object to be inspected, and the first ultrasound scanner and the second ultrasound scanner can be arranged to overlap vertically with the object to be inspected in between.

[0013] For example, the first ultrasonic scanner can move for a period of one week using the mobile device and transmit both a first C-scan ultrasound and a T-scan ultrasound to the object being examined each time it scans the object.

[0014] For example, the ultrasonic inspection apparatus further includes a jig positioned between the first ultrasonic scanner and the second ultrasonic scanner to fix the object to be inspected, and at least a portion of the mobile unit may have a U-shape surrounding the jig.

[0015] A power module ultrasonic inspection method according to one embodiment of the present invention may include a placement step of placing a power module, which includes a first substrate and semiconductor elements arranged on the first substrate, between a first ultrasonic scanner and a second ultrasonic scanner; and a scan image generation step of generating a first C-scan image based on first reflected ultrasonic waves transmitted and received via the first ultrasonic scanner, and generating a T-scan image based on transmitted ultrasonic waves transmitted via the first ultrasonic scanner and received via the second ultrasonic scanner.

[0016] For example, the scan image generation step may include generating a second C-scan image based on a second reflected ultrasound transmitted and received via the second ultrasonic scanner.

[0017] For example, the scan image generation step may further include transmitting first C-scan ultrasound and T-scan ultrasound via the first ultrasound scanner, transmitting second C-scan ultrasound via the second ultrasound scanner, and distinguishing between the second reflected ultrasound and the transmitted ultrasound based on a difference in frequency or a difference in reception time.

[0018] For example, the power module further includes a second substrate positioned facing the second ultrasonic scanner, the first substrate positioned facing the first ultrasonic scanner, the semiconductor element positioned between the first substrate and the second substrate, and the scan image generation step can generate a first C-scan image including an image of the first substrate, a second C-scan image including an image of the second substrate, and a T-scan image including an image of the semiconductor element.

[0019] For example, the scan image generation step further includes moving the first ultrasonic scanner and the second ultrasonic scanner horizontally to scan the power module, wherein the first ultrasonic scanner and the second ultrasonic scanner can be positioned vertically overlapping with the power module in between. [Effects of the Invention]

[0020] The ultrasonic inspection apparatus and the power module ultrasonic inspection method according to an embodiment of the present invention can be efficient in obtaining both reflected ultrasonic data used for inspecting some characteristics of the inspected object (e.g., power module) (e.g., joint surface void defect, substrate void defect, substrate crack defect, etc.) and transmitted ultrasonic data used for inspecting other some characteristics of the inspected object (e.g., power module) (e.g., delamination defect, wire peripheral defect, etc.), and can efficiently inspect various characteristics of the inspected object (e.g., joint surface void defect, substrate void defect, substrate crack defect, delamination defect, wire peripheral defect, etc.).

Brief Description of the Drawings

[0021] [Figure 1] It is a perspective view showing an ultrasonic inspection apparatus according to an embodiment of the present invention. [Figure 2] It is a side view showing a state in which an ultrasonic inspection apparatus and a power module ultrasonic inspection method according to an embodiment of the present invention inspect a power module. [Figure 3] It is a drawing showing a state in which an ultrasonic inspection apparatus and a power module ultrasonic inspection method according to an embodiment of the present invention generate a C-scan image. [Figure 4] It is a block diagram showing an ultrasonic scanner of an ultrasonic inspection apparatus and a power module ultrasonic inspection method according to an embodiment of the present invention. [Figure 5] It is a flowchart showing a power module ultrasonic inspection method according to an embodiment of the present invention.

Modes for Carrying Out the Invention

[0022] Since the present invention can be modified in various ways and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to the specific embodiments shown, and it should be understood that the present invention includes all modifications, equivalents, and alternatives included within the spirit and technical scope of the present invention.

[0023] Terms such as "first," "second," etc., may be used to describe various components, but the components shall not be limited by such terms. The terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The terms "and / or" include combinations of multiple related items or any of multiple related items.

[0024] The terms used in this application are used solely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless they are clearly different in context. In this application, terms such as “includes” or “having” specify the existence of features, figures, stages, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the existence or possibility of adding one or more other features, figures, stages, operations, components, parts, or combinations thereof.

[0025] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by a person of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an ideal or overly formal sense unless explicitly defined herein.

[0026] In this specification, "vehicle" (including electric vehicles) means any vehicle used to transport a person, animal, or other object from one place of origin to another. Such vehicles are not limited to those that travel on roads or railways.

[0027] Preferred embodiments of the present invention will be described in more detail below with reference to the attached drawings.

[0028] Figure 1 is a perspective view showing an ultrasonic inspection apparatus according to one embodiment of the present invention, and Figure 2 is a side view showing how the ultrasonic inspection apparatus and power module ultrasonic inspection method according to one embodiment of the present invention inspect a power module.

[0029] Referring to Figures 1 and 2, an ultrasonic inspection apparatus 100 according to one embodiment of the present invention may include a first ultrasonic scanner 110 positioned on one side of the object to be inspected 10 (e.g., in the +Z direction) and moving to scan the object to be inspected 10, and a second ultrasonic scanner 120 positioned on the other side of the object to be inspected 10 (e.g., in the -Z direction) and moving to scan the object to be inspected 10. The first ultrasonic scanner 110 transmits ultrasonic waves (e.g., first C-scan ultrasonic CT1 and / or T-scan ultrasonic TT) to the object to be inspected 10 and receives first reflected ultrasonic waves (corresponding to first reflected ultrasonic data CS1) reflected from the object to be inspected 10, and the second ultrasonic scanner 120 can receive transmitted ultrasonic waves (corresponding to transmitted ultrasonic data TS) that pass through the object to be inspected 10.

[0030] The first reflected ultrasonic data CS1 can be used to inspect some characteristics of the object under inspection 10 (e.g., void defects on the bonding surface, void defects on the substrate, crack defects on the substrate, etc.), and the transmitted ultrasonic data TS can be used to inspect other characteristics of the object under inspection 10 (e.g., delamination defects, defects around the wire, etc.). The ultrasonic inspection apparatus 100 according to one embodiment of the present invention can obtain both the first reflected ultrasonic data CS1 and the transmitted ultrasonic data TS even when using only one first ultrasonic scanner 110, so it can efficiently inspect various characteristics of the object under inspection 10 (e.g., void defects on the bonding surface, void defects on the substrate, crack defects on the substrate, delamination defects, defects around the wire, etc.).

[0031] The second ultrasonic scanner 120 can transmit ultrasonic waves (e.g., ultrasonic wave CT2 for the second C-scan) to the object under inspection 10 and receive second reflected ultrasonic waves (corresponding to second reflected ultrasonic wave data CS2) reflected from the object under inspection 10. The first reflected ultrasonic wave data CS1 can be used to inspect the characteristics of the upper part of the object under inspection 10 (e.g., void defects at the bonding surface, substrate void defects, substrate crack defects, etc.), the second reflected ultrasonic wave data CS2 can be used to inspect the characteristics of the lower part of the object under inspection 10 (e.g., void defects at the bonding surface, substrate void defects, substrate crack defects, etc.), and the transmitted ultrasonic wave data TS can be used to inspect the characteristics of the middle part of the object under inspection 10 (e.g., delamination defects, defects around the wire, etc.).

[0032] An ultrasonic inspection apparatus 100 according to one embodiment of the present invention can obtain first reflected ultrasonic data CS1, second reflected ultrasonic data CS2, and transmitted ultrasonic data TS together, even when using two first and second ultrasonic scanners 110 and 120. Therefore, it can efficiently inspect various characteristics (e.g., bonding surface void defects, substrate void defects, substrate crack defects, delamination defects, wire peripheral defects, etc.) of various parts (e.g., upper, middle, lower) of the object to be inspected 10.

[0033] The first ultrasonic scanner 110 can transmit a first C-scan ultrasonic CT1 and a T-scan ultrasonic TT to the object under inspection 10, and the second ultrasonic scanner 120 can transmit a second C-scan ultrasonic CT2 to the object under inspection 10. For example, the first ultrasonic scanner 110 can adjust the frequency and / or amplitude of the transmitted ultrasonic waves to achieve different characteristics for the first C-scan ultrasonic CT1 (e.g., characteristics favorable for reflection) and the T-scan ultrasonic TT (e.g., characteristics favorable for transmission).

[0034] The processing unit 130 that the ultrasound inspection apparatus 100 may include can be configured to generate a first C-scan image C-SCAN-1 based on a first reflected ultrasound (corresponding to first reflected ultrasound data CS1), a second C-scan image C-SCAN-2 based on a second reflected ultrasound (corresponding to second reflected ultrasound data CS2), and a T-scan image T-SCAN based on transmitted ultrasound (corresponding to transmitted ultrasound data TS). For example, the processing unit 130 can be implemented as a computing system (including a processor, memory, input / output devices, and communication devices), or as a controller.

[0035] The first C-scan image C-SCAN-1 and the second C-scan image C-SCAN-2 can be two-dimensional images of multiple target layers located at different depths (or levels) of the object under inspection 10. The T-scan image T-SCAN may be a two-dimensional (or three-dimensional) transmission image for internal volume analysis of the object under inspection 10.

[0036] A mobile unit 140 that may be included in the ultrasonic inspection apparatus 100 can move the first ultrasonic scanner 110 and the second ultrasonic scanner 120 horizontally (e.g., in the X and / or Y directions) to scan the object under inspection 10. Thus, the first reflected ultrasonic data CS1, the second reflected ultrasonic data CS2, and the transmitted ultrasonic data TS obtained by the first and second ultrasonic scanners 110 and 120 can each be realized as two-dimensional data (ultrasonic data to which two-dimensional coordinate values ​​correspond). Depending on the design, the transmitted ultrasonic data TS can also be realized as three-dimensional data. The first ultrasonic scanner 110 and the second ultrasonic scanner 120 can be positioned overlapping vertically (e.g., in the Z direction) with the object under inspection 10 in between.

[0037] For example, the first and second ultrasonic scanners 110 and 120 can transmit and receive ultrasound to all of the multiple X-coordinates and multiple Y-coordinates of the object under inspection 10 by scanning while moving in the X-direction for each of the multiple Y-coordinates of the object under inspection 10, or by scanning while moving along a staggered path. The one-cycle movement path of the mobile device 140 can be defined as a path that overlaps once in the Z-direction for each of the multiple X-coordinates and multiple Y-coordinates of the object under inspection 10, and scanning each of the multiple X-coordinates and multiple Y-coordinates of the object under inspection 10 once can be defined as scanning the object under inspection 10 once.

[0038] For example, the first ultrasonic scanner 110 can move for one cycle period using the mobile unit 140, and transmit both the first C-scan ultrasonic CT1 and the T-scan ultrasonic TT to the object under inspection 10 each time it scans the object under inspection 10. As a result, the ultrasonic inspection apparatus 100 according to one embodiment of the present invention can reduce the time required to obtain both the first reflected ultrasonic data CS1 and the transmitted ultrasonic data TS, thereby reducing the total inspection time for various characteristics of the object under inspection 10 (e.g., bonding surface void defects, substrate void defects, substrate crack defects, delamination defects, wire peripheral defects, etc.). At this time, the second ultrasonic scanner 120 can also move for one cycle period using the mobile unit 140, and transmit the second C-scan ultrasonic CT2 to the object under inspection 10 each time it scans the object under inspection 10.

[0039] For example, the processing unit 130 can control the movement of the mobile unit 140. For example, the mobile unit 140 may include an actuator (not shown) that forms a force to move the first and second ultrasonic scanners 110 and 120 in the horizontal direction, and the processing unit 130 can transmit a signal to the mobile unit 140 to control the force formed by the actuator. In this case, the processing unit 130 can associate the target coordinates of the mobile unit 140 with the ultrasonic data.

[0040] For example, the mobile device 140 may include a first support portion 141 that supports the first ultrasonic scanner 110, a second support portion 142 that supports the second ultrasonic scanner 120, and a connecting portion 143 that connects one end each of the first and second support portions 141 and 142 to each other. For example, the first support portion 141 may include a through hole through which the first ultrasonic scanner 110 passes, and the second support portion 142 may include a through hole through which the second ultrasonic scanner 120 passes. The connecting portion 143 can move the first and second ultrasonic scanners 110 and 120 by moving the first and second support portions 141 and 142 by receiving a force formed by the actuator.

[0041] The fixture 150, which may be included in the ultrasonic inspection apparatus 100, can be positioned between the first ultrasonic scanner 110 and the second ultrasonic scanner 120 to fix the object to be inspected 10. At least a portion of the mobile unit 140 may have a U-shape surrounding the fixture 150. For example, the first support portion 141, the connecting portion 143, and the second support portion 142 may form a U-shape. For example, the fixture 150 may include a fixing portion 151 for fixing the object to be inspected 10 and a plate 152 that provides a surface on which the fixing portion 151 is positioned. The plate 152 may have a shape that is efficient for coupling with the U-shape of the mobile unit 140.

[0042] This allows the space occupied by the mobile unit 140 and the jig 150 to be efficiently compressed, enabling them to be stably housed in a specific structure (e.g., a water tank). For example, the combination of the mobile unit 140 and the jig 150 can be immersed in water by being placed in a water tank filled with water. The water can be used as an ultrasonic transmission medium, and the water tank may be equipped with a device to which the water is supplied or circulated.

[0043] Referring to Figure 2, the object under inspection 10 includes a power module, which may include at least one of the following: a first substrate 11, a second substrate 12, a semiconductor element 13, a spacer 14, and a lead terminal 15. For example, the power module of the object under inspection 10 can be electrically connected between a motor and a battery for driving an environmentally friendly vehicle such as an electric vehicle, and can be implemented as an inverter that converts the DC voltage of the battery into AC voltage.

[0044] The first substrate 11 can be positioned facing the first ultrasonic scanner 110, and the second substrate 12 can be positioned facing the second ultrasonic scanner 120. Positioning them facing each other means that one surface (e.g., top, bottom) of the first and second substrates 11 and 12 overlaps with the first and second ultrasonic scanners 110 and 120 in the normal direction (e.g., Z direction). For example, each of the first and second substrates 11 and 12 can be implemented as an AMB (Active Metal Brazed) substrate or a DBC (Direct Bonded Copper) substrate, and may have a structure in which at least one metal layer (e.g., a copper layer) and at least one insulating layer (e.g., a ceramic layer) are alternately laminated.

[0045] The semiconductor element 13 can be placed between the first substrate 11 and the second substrate 12. For example, the semiconductor element 13 can be implemented as an integrated circuit or as a chip, and can be mounted on the first substrate 11 or the second substrate 12 via soldering or sintering. For example, the semiconductor element 13 may include one or more power semiconductor elements with high power capacity, such as IGBTs (Insulated Cate Bipolar Transistors) or thyristors, or it may include silicon carbide (SiC) semiconductor elements or gallium nitride (GaN) semiconductor elements.

[0046] The spacer 14 can be positioned so as to overlap the semiconductor element 13 in a direction (e.g., Z direction) where the first substrate 11 and the second substrate 12 face each other. When the semiconductor element 13 is mounted on the first substrate 11, the spacer 14 can be positioned between the semiconductor element 13 and the second substrate 12. For example, the spacer 14 can contain a metallic material (e.g., copper (Cu) or molybdenum (Mo)) and can provide a heat dissipation path for the semiconductor element 13. For example, the spacer 14 can be bonded to the semiconductor element 13 and the second substrate 12, respectively, via multiple adhesive layers.

[0047] The lead terminal 15 can be electrically connected to the semiconductor element 13 and can extend horizontally (e.g., in the X and / or Y directions). For example, the lead terminal 15 can electrically connect the power module of the object under test 10 to an external motor or battery, and can provide a path for transmitting control signals from the motor controller of the motor system to the semiconductor element 13.

[0048] The processing unit 130 can generate a first C-scan image C-SCAN-1 including an image of the first substrate 11, a second C-scan image C-SCAN-2 including an image of the second substrate 12, and a T-scan image T-SCAN including an image of the semiconductor element 13. For example, the first C-scan image C-SCAN-1 can be used to inspect defects in the first substrate 11 (e.g., internal void defects, junction surface void defects), and the second C-scan image C-SCAN-2 can be used to inspect defects in the second substrate 12 (e.g., internal voids, junction surface voids). The T-scan image T-SCAN can be used to inspect defects in the semiconductor element 13 (e.g., junction surface delamination defects, wire peripheral defects), and can be used to inspect defects that are difficult to detect with C-scan.

[0049] The space between the first and second substrates 11 and 12 of the power module can be hidden from the viewpoint of the first and second ultrasonic scanners 110 and 120, making it a space that is difficult to inspect (or difficult to ensure inspection accuracy) using only the first C-scan image C-SCAN-1 and the second C-scan image C-SCAN-2. A T-scan image T-SCAN can be used to improve the difficulty / accuracy of inspection for the above-mentioned difficult-to-inspect space. An ultrasonic inspection apparatus 100 and power module ultrasonic inspection method according to one embodiment of the present invention can obtain a T-scan image T-SCAN without adding any further ultrasonic scanners, thus enabling efficient inspection of various parts of the power module (including spaces that are difficult to inspect) for various defects (including defects that are difficult to detect with C-scan).

[0050] Figure 3 is a diagram showing how an ultrasonic inspection apparatus and a power module ultrasonic inspection method according to one embodiment of the present invention generate a C-scan image.

[0051] Referring to Figure 3, the first ultrasonic scanner 110 can transmit a first C-scan ultrasonic CT1 to the object under inspection 10, receive first reflected ultrasonics R1, R2, R3, and R4, and generate first reflected ultrasonic data CS1 based on the first reflected ultrasonics R1, R2, R3, and R4. The second C-scan ultrasonic and second reflected ultrasonic data of the second ultrasonic scanner 120 can be realized using a similar principle to the first C-scan ultrasonic CT1 and first reflected ultrasonic data CS1.

[0052] For example, a portion of the first C-scan ultrasonic CT1 can be reflected from the front surface of the object under inspection 10 (e.g., the top surface of the first substrate (11 in Figure 2)). Subsequently, a portion of the first C-scan ultrasonic CT1 can be reflected from the boundary of the object under inspection 10 (e.g., the boundary between the metal layer and the insulating layer of the first substrate (11 in Figure 2)). Subsequently, a portion of the first C-scan ultrasonic CT1 can be reflected from defects FP of the object under inspection 10 (e.g., internal voids of the first substrate (11 in Figure 2)). Subsequently, a portion of the first C-scan ultrasonic CT1 can be reflected from the rear surface of the object under inspection 10 (e.g., the bottom surface of the first substrate (11 in Figure 2)).

[0053] For example, the first ultrasonic scanner 110 can identify the reflection positions (e.g., Front surface, Boundary, Area of ​​interest, Back surface) of the first reflected ultrasonic waves R1, R2, R3, R4 based on their amplitude (echo amplitude) and / or time of flight. This is because the amplitude (echo amplitude) and / or time of flight of the first reflected ultrasonic waves R1, R2, R3, R4 can be determined based on the medium characteristics (e.g., sound impedance, density) of the reflection positions of the first reflected ultrasonic waves R1, R2, R3, R4. For example, the second ultrasonic scanner 120 or processor (130 in Figure 1) can distinguish between the second reflected ultrasonic waves and the transmitted ultrasonic waves based on the difference in reception time.

[0054] The first reflected ultrasonic data CS1 may include the received coordinate data of the first reflected ultrasonic R3 and may include the reception time data of the first reflected ultrasonic R3. The reception time data may be the Z-direction position information of the defect FP. The processor (130 in Figure 1) can generate a first C-scan image that includes an image of the object under inspection 10 based on the first reflected ultrasonic R1, R2, and R4 of the first reflected ultrasonic data CS1 and an image of the defect FP based on the first reflected ultrasonic R3.

[0055] Figure 4 is a block diagram showing an ultrasonic scanner for an ultrasonic inspection apparatus and power module ultrasonic inspection method according to one embodiment of the present invention.

[0056] Referring to Figure 4, each of the first and second ultrasonic scanners 110 and 120 represents a signal processing system module including transducers 111 and 121. For example, each of the first and second ultrasonic scanners 110 and 120 may include transducers 111 and 121, preamplifiers 112 and 122, pulser receivers 113 and 123, A / D converters 114 and 124, and trigger boards 115 and 125.

[0057] Transducers 111 and 121 can be configured to convert between electrical signals and ultrasonic signals. Preamplifiers 112 and 122 can be configured to amplify electrical signals (or ultrasonic signals). Pulsar receivers 113 and 123 can generate or process the electrical signals. For example, pulser receivers 113 and 123 can generate electrical signals and transmit them to preamplifiers 112 and 122, which can amplify the electrical signals, and transducers 111 and 121 can convert the electrical signals into ultrasonic signals and output them. For example, transducers 111 and 121 can convert received ultrasonic signals (e.g., reflected ultrasonic, transmitted ultrasonic) into electrical signals and transmit them to preamplifiers 112 and 122, which can amplify the electrical signals, and pulser receivers 113 and 123 can receive and process the electrical signals.

[0058] For example, transducers 111, 121 and / or pulser receivers 113, 123 can determine the frequency for each type of ultrasonic signal (e.g., ultrasonic CT1 for the first C-scan, ultrasonic CT2 for the second C-scan, ultrasonic TT for the T-scan). Thus, the second ultrasonic scanner 120 or processor (130 in Figure 1) can distinguish between the second reflected ultrasonic and transmitted ultrasonic based on the frequency difference.

[0059] The A / D converters 114 and 124 can convert the electrical signals received and processed by the pulser receivers 113 and 123 from analog signals to digital signals (e.g., first and second reflected ultrasonic data, transmitted ultrasonic data), and can transmit the digital signals to a processor (130 in Figure 1).

[0060] The trigger boards 115 and 125 can store timing information for the first and second ultrasonic scanners 110 and 120 to transmit ultrasonic waves, and can control the timing of electrical signal generation by triggering the pulser receivers 113 and 123 according to the timing information. At this time, the trigger boards 115 and 125 can convert the triggering signal into a digital timing signal via the A / D converters 114 and 124 and transmit the digital timing signal to a processor (130 in Figure 1). The processor (130 in Figure 1) can synchronize with the first and second ultrasonic scanners 110 and 120 via the digital timing signal.

[0061] Alternatively, the A / D converters 114 and 124 can receive control signals from the processor (130 in Figure 1) and transmit the control signals to the trigger boards 115 and 125, which can then control the timing of the generation of electrical signals from the pulser receivers 113 and 123 according to the control signals.

[0062] Figure 5 is a flowchart showing a power module ultrasonic inspection method according to one embodiment of the present invention.

[0063] Referring to Figure 5, a power module ultrasonic inspection method according to one embodiment of the present invention may include a placement step S110 in which a power module (example of an object to be inspected 10) including a first substrate 11 and semiconductor elements 13 arranged on the first substrate 11 is placed between a first ultrasonic scanner 110 and a second ultrasonic scanner 120, and a scan image generation step S120 in which a first C-scan image C-SCAN-1 is generated (S122) based on first reflected ultrasonic waves (corresponding to first reflected ultrasonic wave data CS1) transmitted and received via the first ultrasonic scanner 110, and a T-scan image T-SCAN is generated (S124) based on transmitted ultrasonic waves (corresponding to transmitted ultrasonic wave data TS) transmitted via the first ultrasonic scanner 110 and received via the second ultrasonic scanner 120.

[0064] The scan image generation step S120 may further include moving the first ultrasonic scanner 110 and the second ultrasonic scanner 120 horizontally to scan the power module (example of the object under inspection 10), and transmitting the first C-scan ultrasonic CT1 and the T-scan ultrasonic TT via the first ultrasonic scanner 110 (S121). Transmitting (S121) may further include transmitting the second C-scan ultrasonic CT2 via the second ultrasonic scanner 120.

[0065] The scan image generation step S120 may include generating a second C-scan image C-SCAN-2 (S123) based on the second reflected ultrasound (corresponding to the second reflected ultrasound data CS2) transmitted and received via the second ultrasound scanner 120.

[0066] This may further include distinguishing between second reflected ultrasound (corresponding to second reflected ultrasound data CS2) and transmitted ultrasound (corresponding to transmitted ultrasound data TS) based on differences in frequency or reception time.

[0067] The scan image generation step (S120) may include generating a first C-scan image C-SCAN-1 including an image of the first substrate 11, a second C-scan image C-SCAN-2 including an image of the second substrate 12, and a T-scan image T-SCAN including an image of the semiconductor element 13.

[0068] As described above with reference to the embodiments, a person skilled in the art will understand that the present invention can be modified and altered in various ways without departing from the spirit and scope of the invention as set forth in the following claims. [Explanation of Symbols]

[0069] 10 Objects to be inspected 100 Ultrasound inspection device 11 First board 12 Second board 13 Semiconductor elements 14 Spacers 15. Outlet terminals 110 First ultrasound scanner 120 Second ultrasound scanner 130 processing machines, 140 mobile machines 150 jigs C-SCAN-1 First C-Scan Image C-SCAN-2 2nd C-Scan Image CS1: First reflected ultrasound data CS2: Second reflected ultrasound data CT1 Ultrasound for First C-Scan CT2 Ultrasound for 2C-Scan TS Transmission Ultrasound Data TT Ultrasound for T-Scan T-SCAN T-Scan Image

Claims

1. A first ultrasonic scanner positioned on one side of the object to be inspected and moving to scan the object to be inspected, The system includes a second ultrasonic scanner positioned on the other side of the object to be inspected and moving to scan the object to be inspected, The first ultrasonic scanner transmits ultrasonic waves to the object to be inspected and receives the first reflected ultrasonic waves reflected from the object to be inspected. The second ultrasonic scanner is an ultrasonic inspection device that receives transmitted ultrasonic waves that pass through the object to be inspected.

2. The ultrasonic inspection apparatus according to claim 1, wherein the second ultrasonic scanner transmits ultrasonic waves to the object to be inspected and receives second reflected ultrasonic waves reflected from the object to be inspected.

3. The ultrasonic inspection apparatus according to claim 2, further comprising a processing unit configured to generate a first C-scan image based on the first reflected ultrasonic wave, generate a second C-scan image based on the second reflected ultrasonic wave, and generate a T-scan image based on the transmitted ultrasonic wave.

4. The first ultrasonic scanner transmits a first C-scan ultrasound and a T-scan ultrasound to the object to be inspected. The second ultrasonic scanner transmits a second C-scan ultrasonic wave to the object under inspection. The ultrasonic inspection apparatus according to claim 3, wherein the second ultrasonic scanner or the processing machine distinguishes between the second reflected ultrasonic waves and the transmitted ultrasonic waves based on a difference in frequency or a difference in reception time.

5. The object under inspection includes a power module, The aforementioned power module is A first substrate positioned facing the first ultrasonic scanner, A second substrate is positioned facing the second ultrasonic scanner, A semiconductor element disposed between the first substrate and the second substrate, The ultrasonic inspection apparatus according to claim 3, wherein the processing machine generates a first C-scan image including an image of the first substrate, a second C-scan image including an image of the second substrate, and a T-scan image including an image of the semiconductor element.

6. The system further includes a processing unit configured to generate a first C-scan image based on the first reflected ultrasonic waves and a T-scan image based on the transmitted ultrasonic waves, The ultrasonic inspection apparatus according to claim 1, wherein the first ultrasonic scanner transmits first C-scan ultrasonic waves and T-scan ultrasonic waves to the object to be inspected.

7. The object under inspection includes a power module, The ultrasonic inspection apparatus according to claim 6, wherein the power module includes a first substrate and semiconductor elements disposed on the first substrate.

8. The system further includes a mobile device that moves the first ultrasonic scanner and the second ultrasonic scanner horizontally to scan the object to be inspected, The ultrasonic inspection apparatus according to claim 1, wherein the first ultrasonic scanner and the second ultrasonic scanner are arranged to overlap vertically with the object to be inspected in between.

9. The ultrasonic inspection apparatus according to claim 8, wherein the first ultrasonic scanner moves for a period of one cycle by the mobile device and transmits both a first C-scan ultrasonic wave and a T-scan ultrasonic wave to the object to be inspected each time it scans the object to be inspected once.

10. The present invention further includes a jig positioned between the first ultrasonic scanner and the second ultrasonic scanner for fixing the object to be inspected, The ultrasonic inspection apparatus according to claim 8, wherein at least a portion of the mobile device has a U-shape surrounding the jig.

11. A placement step involves placing a power module, which includes a first substrate and semiconductor elements arranged on the first substrate, between a first ultrasonic scanner and a second ultrasonic scanner. A power module ultrasound inspection method comprising: a scan image generation step of generating a first C-scan image based on first reflected ultrasound transmitted and received via the first ultrasound scanner; and generating a T-scan image based on transmitted ultrasound transmitted via the first ultrasound scanner and received via the second ultrasound scanner.

12. The aforementioned scan image generation step is: The power module ultrasound inspection method according to claim 11, comprising generating a second C-scan image based on a second reflected ultrasound transmitted and received via the second ultrasound scanner.

13. The aforementioned scan image generation step is: Transmitting first C-scan ultrasound and T-scan ultrasound via the first ultrasound scanner, Transmitting second C-scan ultrasound via the second ultrasonic scanner, The power module ultrasonic inspection method according to claim 12, further comprising distinguishing the second reflected ultrasonic wave from the transmitted ultrasonic wave based on a difference in frequency or a difference in reception time.

14. The power module further includes a second substrate positioned facing the second ultrasonic scanner, The first substrate is positioned so as to face the first ultrasonic scanner. The semiconductor element is placed between the first substrate and the second substrate. The power module ultrasonic inspection method according to claim 12, wherein the scan image generation step generates a first C-scan image including an image of the first substrate, a second C-scan image including an image of the second substrate, and a T-scan image including an image of the semiconductor element.

15. The aforementioned scan image generation step is: The method further includes moving the first ultrasonic scanner and the second ultrasonic scanner horizontally to scan the power module, The power module ultrasonic inspection method according to claim 12, wherein the first ultrasonic scanner and the second ultrasonic scanner are arranged to overlap vertically with the power module in between.

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