Wiring boards, modules, and image display devices

Abstract

The present invention provides a wiring board, module, and image display device that can improve the connectivity between power supply lines and power supply units. [Solution] The wiring board 10 comprises a substrate 11 including a first surface 11a and a second surface 11b located opposite the first surface 11a, a plurality of mesh wiring sections 20 arranged spaced apart from each other on the first surface 11a of the substrate 11, and a power supply section 40 electrically connected to the mesh wiring sections 20. The wiring board 10 has an electromagnetic wave transmission and reception function. The substrate 11 is transparent. The mesh wiring sections 20 are configured as antennas. A plurality of linearly extending first notches 45 are formed in the power supply section 40.

Description

[Technical Field]

[0001] Embodiments of this disclosure relate to a wiring board, a module, and an image display device. [Background technology]

[0002] Currently, mobile devices such as smartphones and tablets are becoming more sophisticated, smaller, thinner, and lighter. Because these devices utilize multiple communication bands, they require multiple antennas corresponding to each band. For example, mobile devices are equipped with multiple antennas, including antennas for telephone communication, Wi-Fi (Wireless Fidelity), 3G (Generation), 4G (Generation), LTE (Long Term Evolution), Bluetooth (registered trademark), and NFC (Near Field Communication). However, with the miniaturization of mobile devices, the space available for antenna installation is limited, restricting the design flexibility of antennas. Furthermore, because antennas are integrated into a limited space, radio wave sensitivity is not always satisfactory.

[0003] For this reason, film antennas that can be mounted on the display area of ​​mobile devices have been developed. In this film antenna, an antenna pattern is formed on a transparent substrate, and the antenna pattern is formed by a mesh-like conductive mesh layer consisting of a conductive part that forms an opaque conductive layer and a number of openings that do not form the layer. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2011-66610 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] Incidentally, in film antennas, a feed line is connected to the feed section, which electrically connects the conductive mesh layer to external equipment. In this case, it is necessary to improve the connectivity between the feed section and the feed line.

[0006] The objective of this embodiment is to provide a wiring board, a module, and an image display device that can improve the connectivity between the power supply line and the power supply unit. [Means for solving the problem]

[0007] A first aspect of this embodiment is a wiring board comprising a substrate including a first surface and a second surface located opposite to the first surface, a plurality of mesh wiring sections arranged spaced apart from each other on the first surface of the substrate, and a plurality of power supply sections electrically connected to the mesh wiring sections, wherein the wiring board has an electromagnetic wave transmission and reception function, the substrate is transparent, the mesh wiring sections are configured as antennas, each of the mesh wiring sections and each of the power supply sections are individually connected, and a plurality of linearly extending first notches are formed in the power supply sections.

[0008] A second aspect of this embodiment is the wiring board according to the first aspect described above, wherein the wiring board may have a millimeter-wave transmitting and receiving function, and the mesh wiring section may be configured as an array antenna.

[0009] A third aspect of this embodiment is a wiring board according to the first or second aspect described above, wherein the power supply portion may have a first end connected to the mesh wiring portion and a second end opposite to the first end, and the plurality of first notches may extend from the second end along the direction toward the first end.

[0010] A fourth aspect of this embodiment is a wiring board according to each of the first to third aspects described above, wherein the wiring board may further include a ground portion disposed on the first surface of the board, and a plurality of linearly extending second notches may be formed in the ground portion.

[0011] A fifth aspect of this embodiment is that, in the wiring board according to each of the first to fourth aspects described above, a dividing portion is formed in the first notch that divides the first notch.

[0012] A sixth aspect of this embodiment is that, in the wiring board according to each of the first to fifth aspects described above, the distance between the mesh wiring portions may be 1 mm or more and 5 mm or less.

[0013] A seventh aspect of this embodiment is that, in the wiring board according to each of the first to sixth aspects described above, a dummy wiring section electrically independent from the mesh wiring section may be provided around the mesh wiring section.

[0014] An eighth aspect of this embodiment is that, in the wiring board according to the seventh aspect described above, a plurality of dummy wiring sections may be provided, and the opening ratio of the mesh wiring section and the dummy wiring section may increase in stages from the mesh wiring section toward the dummy wiring section which is further away from the mesh wiring section.

[0015] A ninth aspect of this embodiment is a module comprising a wiring board according to each of the first to eighth aspects described above, and a power supply line electrically connected to the power supply section of the wiring board.

[0016] The tenth aspect of the present embodiment is that in the module according to the ninth aspect described above, the power supply line may have a base material and a metal wiring portion laminated on the base material, and a plurality of linearly extending third notch portions may be formed in the metal wiring portion. The width of the third notch portion may be equal to or less than the width of the first notch portion. In a plan view, the third notch portion may extend along the first notch portion and may overlap the first notch portion.

[0017] The eleventh aspect of the present embodiment is that in the module according to the ninth aspect or the tenth aspect described above, the power supply line may be electrically connected to the power supply portion via an anisotropic conductive film containing conductive particles. The width of the first notch portion may be 0.5 times or more and 1 time or less the average particle diameter of the conductive particles.

[0018] The twelfth aspect of the present embodiment is an image display device including the module according to each of the ninth aspect to the eleventh aspect described above and a display device laminated on the wiring board of the module.

Advantages of the Invention

[0019] According to the embodiment of the present disclosure, the connectivity between the power supply line and the power supply portion can be improved.

Brief Description of the Drawings

[0020] [Figure 1] FIG. 1 is a plan view showing an image display device according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view (cross-section taken along line II-II in FIG. 1) showing an image display device according to an embodiment. [Figure 3] FIG. 3 is a plan view showing a wiring board according to an embodiment. [Figure 4] FIG. 4 is an enlarged plan view showing a wiring board according to an embodiment. [Figure 5] FIG. 5 is a cross-sectional view (cross-section taken along line V-V in FIG. 4) showing a wiring board according to an embodiment. [Figure 6]Figure 6 is a cross-sectional view (cross-sectional view along line VI-VI in Figure 4) showing a wiring board according to one embodiment. [Figure 7] Figure 7 is a plan view showing a module according to one embodiment. [Figure 8] Figure 8 is a cross-sectional view (cross-sectional view along line VIII-VIII in Figure 7) showing a module according to one embodiment. [Figure 9] Figure 9 is an exploded perspective view showing a module according to one embodiment. [Figure 10] Figures 10(a)-(f) are cross-sectional views showing a method for manufacturing a wiring board according to one embodiment. [Figure 11] Figures 11(a)-(c) are cross-sectional views showing a method for manufacturing a module according to one embodiment. [Figure 12] Figures 12(a)-(c) are cross-sectional views showing a method for manufacturing an image display device according to one embodiment. [Figure 13] Figure 13 is a plan view showing a wiring board according to the first modified example. [Figure 14] Figure 14 is an enlarged plan view showing a wiring board according to the second modified example. [Figure 15] Figure 15 is a plan view showing a wiring board according to the third modified example. [Figure 16] Figure 16 is an enlarged plan view showing a wiring board according to the third modified example. [Figure 17] Figure 17 is a plan view showing a wiring board according to the fourth modified example. [Figure 18] Figure 18 is an enlarged plan view showing a wiring board according to the fourth modified example. [Figure 19] Figure 19 is a plan view showing a wiring board according to the fifth modified example. [Modes for carrying out the invention]

[0021] First, one embodiment will be described with reference to Figures 1 to 12. Figures 1 to 12 are diagrams illustrating this embodiment.

[0022] The following figures are schematic representations. Therefore, the size and shape of each part are exaggerated as appropriate for ease of understanding. Furthermore, they can be modified as appropriate without departing from the technical concept. In the following figures, the same parts are denoted by the same reference numerals, and some detailed explanations may be omitted. Also, the numerical values ​​such as dimensions and material names of each component described in this specification are examples of embodiments and are not limiting; they can be selected and used as appropriate. In this specification, terms that specify shapes and geometric conditions, such as parallel, orthogonal, and perpendicular, are interpreted to include not only their strict meaning but also substantially equivalent states.

[0023] In the following embodiments, "X direction" refers to the direction parallel to one side of the image display device. "Y direction" refers to the direction perpendicular to the X direction and parallel to the other side of the image display device. "Z direction" refers to the direction perpendicular to both the X and Y directions and parallel to the thickness direction of the image display device. "Front surface" refers to the surface on the positive Z direction side, which is the light-emitting surface side of the image display device and faces the observer. "Back surface" refers to the surface on the negative Z direction side, which is the surface opposite to the light-emitting surface and the surface facing the observer of the image display device. In this embodiment, the explanation will be given as an example where the mesh wiring section 20 is a mesh wiring section having a radio wave transmission and reception function (function as an antenna), but the mesh wiring section 20 does not necessarily have to have a radio wave transmission and reception function.

[0024] The configuration of the image display device according to this embodiment will be described with reference to Figures 1 and 2.

[0025] As shown in Figures 1 and 2, the image display device 60 according to this embodiment comprises a module 80A and a display device (display) 61 laminated on the module 80A. The module 80A comprises a wiring board 10 and a power supply line 85 electrically connected to a power supply section 40 of the wiring board 10, which will be described later. Furthermore, the laminate 70 for the image display device is composed of the module 80A, a first transparent adhesive layer (first adhesive layer) 95, which will be described later, and a second transparent adhesive layer (second adhesive layer) 96, which will be described later.

[0026] The wiring board 10 of module 80A comprises a substrate 11, a mesh wiring section 20, and a power supply section 40. As shown in Figure 2, the substrate 11 includes a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. Multiple mesh wiring sections 20 are arranged on the first surface 11a of the substrate 11. A power supply section 40 is electrically connected to each mesh wiring section 20. Furthermore, a communication module 63 is arranged on the negative Z-direction side relative to the display device 61. The image display device laminate 70, the display device 61, and the communication module 63 are housed in a housing 62.

[0027] In the image display device 60 shown in Figures 1 and 2, radio waves of a predetermined frequency can be transmitted and received via a communication module 63, enabling communication. The communication module 63 may include any of the following: a millimeter-wave antenna, a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth® antenna, an NFC antenna, etc. Examples of such an image display device 60 include mobile terminal devices such as smartphones and tablets.

[0028] As shown in Figure 2, the image display device 60 has a light-emitting surface 64. The image display device 60 includes a wiring board 10 located on the side of the light-emitting surface 64 (positive Z-direction) relative to the display device 61, and a communication module 63 located on the opposite side of the light-emitting surface 64 (negative Z-direction) relative to the display device 61.

[0029] The display device 61 is, for example, an organic EL (Electro Luminescence) display device.

[0030] The display device 61 may include, for example, a metal layer (not shown), a support substrate, a resin substrate, thin-film transistors (TFTs), and an organic EL layer. A touch sensor (not shown) may be placed on the display device 61. A wiring board 10 is also placed on the display device 61 via a second transparent adhesive layer 96. Note that the display device 61 is not limited to an organic EL display device. For example, the display device 61 may be any other display device that has the function of emitting light itself, or it may be a micro-LED display device that includes micro-LED elements. The display device 61 may also be a liquid crystal display device that includes liquid crystal.

[0031] A cover glass 75 is placed on the wiring board 10 via a first transparent adhesive layer 95. A decorative film and a polarizing plate (not shown) may be placed between the first transparent adhesive layer 95 and the cover glass 75.

[0032] The first transparent adhesive layer 95 is an adhesive layer that directly or indirectly adheres the wiring board 10 to the cover glass 75. This first transparent adhesive layer 95 is located on the first surface 11a side of the substrate 11. The first transparent adhesive layer 95 has optical transparency and may be an OCA (Optical Clear Adhesive) layer. An OCA layer is a layer made, for example, as follows: First, a liquid curable adhesive layer composition containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET). Next, an OCA sheet is obtained by curing this using, for example, ultraviolet light (UV). After laminating this OCA sheet to the object, the OCA layer is obtained by peeling off the release film. The material of the first transparent adhesive layer 95 may be an acrylic resin, a silicone resin, or a urethane resin. In particular, the first transparent adhesive layer 95 may contain an acrylic resin. In this case, it is preferable that the second transparent adhesive layer 96 contains an acrylic resin. This effectively eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, thereby more reliably suppressing the reflection of visible light at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0033] The first transparent adhesive layer 95 may have a visible light transmittance of 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the first transparent adhesive layer 95, but it may be, for example, 100% or less. By setting the visible light transmittance of the first transparent adhesive layer 95 within the above range, the transparency of the laminate 70 for the image display device can be increased, making the display device 61 of the image display device 60 easier to see. Visible light refers to light rays with a wavelength of 400 nm or more and 700 nm or less. Furthermore, a visible light transmittance of 85% or more means that when the absorbance is measured on the component to be measured (for example, the first transparent adhesive layer 95), the transmittance is 85% or more in the entire wavelength range from 400 nm to 700 nm. Absorbance can be measured using a known spectrophotometer (for example, a spectrometer manufactured by JASCO Corporation: V-670).

[0034] As described above, the wiring board 10 is positioned on the light-emitting surface 64 side relative to the display device 61. In this case, the wiring board 10 is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. More specifically, a portion of the substrate 11 of the wiring board 10 is positioned in a portion of the area between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. In this case, the first transparent adhesive layer 95, the second transparent adhesive layer 96, the display device 61, and the cover glass 75 each have a larger area than the substrate 11 of the wiring board 10. By positioning the substrate 11 of the wiring board 10 in a portion of the image display device 60 rather than across its entire surface in a plan view, the overall thickness of the image display device 60 can be reduced.

[0035] As described above, the wiring board 10 has a transparent substrate 11, a plurality of mesh wiring sections 20 arranged spaced apart from each other on the first surface 11a of the substrate 11, and a plurality of power supply sections 40. The power supply sections 40 are electrically connected to the mesh wiring sections 20. In this case, each mesh wiring section 20 and each power supply section 40 are individually connected. The power supply sections 40 are electrically connected to the communication module 63 via power supply lines 85. Furthermore, a portion of the wiring board 10 is not positioned between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, but protrudes outward (towards the negative side in the Y direction) from between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Specifically, the region of the wiring board 10 where the power supply sections 40 are provided protrudes outward. This facilitates the electrical connection between the power supply sections 40 and the communication module 63. On the other hand, the area of ​​the wiring board 10 in which the mesh wiring section 20 is provided is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Details of the wiring board 10 and the power supply line 85 will be described later.

[0036] The second transparent adhesive layer 96 is an adhesive layer that directly or indirectly adheres the display device 61 to the wiring substrate 10. This second transparent adhesive layer 96 is located on the second surface 11b side of the substrate 11. The second transparent adhesive layer 96, like the first transparent adhesive layer 95, has optical transparency and may be an OCA (Optical Clear Adhesive) layer. The material of the second transparent adhesive layer 96 may be an acrylic resin, a silicone resin, or a urethane resin, etc. In particular, the second transparent adhesive layer 96 may contain an acrylic resin. This substantially eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and more reliably suppresses the reflection of visible light at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0037] The second transparent adhesive layer 96 may have a transmittance of 85% or more for visible light (light with a wavelength of 400 nm to 700 nm), and preferably 90% or more. There is no particular upper limit to the transmittance of visible light of the second transparent adhesive layer 96, but it may be, for example, 100% or less. By setting the transmittance of visible light of the second transparent adhesive layer 96 within the above range, the transparency of the laminate 70 for the image display device is increased, making the display device 61 of the image display device 60 easier to see.

[0038] In such an image display device 60, the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 is 0.1 or less, and preferably 0.05 or less. Furthermore, the difference between the refractive index of the substrate 11 and the refractive index of the second transparent adhesive layer 96 is 0.1 or less, and preferably 0.05 or less. Moreover, the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 is preferably 0.1 or less, and more preferably 0.05 or less. For example, if the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are acrylic resins with a refractive index of 1.49, the refractive index of the substrate 11 is set to 1.39 or more and 1.59 or less. Examples of such materials include fluororesins, silicone resins, polyolefin resins, polyester resins, acrylic resins, polycarbonate resins, polyimide resins, cellulose resins, and the like.

[0039] In this way, by keeping the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 to 0.1 or less, the reflection of visible light at the interface B1 between the substrate 11 and the first transparent adhesive layer 95 is suppressed, making the substrate 11 difficult to see with the naked eye. Furthermore, by keeping the difference between the refractive index of the substrate 11 and the refractive index of the second transparent adhesive layer 96 to 0.1 or less, the reflection of visible light at the interface B2 between the substrate 11 and the second transparent adhesive layer 96 is suppressed, making the substrate 11 difficult to see with the naked eye. Moreover, by keeping the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 to 0.1 or less, the reflection of visible light at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 can be suppressed. Therefore, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 can be made difficult to see with the naked eye.

[0040] In particular, it is preferable that the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are the same material. This makes it possible to further reduce the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and to suppress the reflection of visible light at the interface B3 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0041] In Figure 2, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may be 1.5 times or more the thickness T1 of the substrate 11, preferably 2 times or more, and more preferably 2.5 times or more. By making the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 sufficiently thicker than the thickness T1 of the substrate 11, the first transparent adhesive layer 95 or the second transparent adhesive layer 96 deforms in the thickness direction in the region overlapping with the substrate 11, absorbing the thickness of the substrate 11. This prevents the formation of steps in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for observers to recognize the presence of the substrate 11.

[0042] The thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 are preferably 10 times or less the thickness T1 of the substrate 11, and more preferably 5 times or less. This prevents the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 from becoming too thick, thereby reducing the overall thickness of the image display device 60.

[0043] In Figure 2, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may be the same. In this case, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may each be 1.5 times or more the thickness T1 of the substrate 11, and preferably 2.0 times or more. That is, the sum of the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 (T3 + T4) is 3 times or more the thickness T1 of the substrate 11. In this way, by making the sum of the thicknesses T3 and T4 of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 sufficiently thick relative to the thickness T1 of the substrate 11, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 deform (shrink) in the thickness direction in the region overlapping with the substrate 11. As a result, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 absorb the thickness of the substrate 11. Therefore, it is possible to suppress the occurrence of steps in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for observers to recognize the presence of the substrate 11.

[0044] When the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 are the same, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may be 5 times or less the thickness T1 of the substrate 11, and preferably 3 times or less. This prevents the thicknesses T3 and T4 of both the first transparent adhesive layer 95 and the second transparent adhesive layer 96 from becoming too thick, and allows the overall thickness of the image display device 60 to be reduced.

[0045] Specifically, the thickness T1 of the substrate 11 may be, for example, 2 μm or more, 10 μm or more, and preferably 15 μm or more. By setting the thickness T1 of the substrate 11 to 2 μm or more, the strength of the wiring substrate 10 can be maintained, and the first directional wiring 21 and second directional wiring 22 of the mesh wiring portion 20, described later, can be made less prone to deformation. Alternatively, the thickness T1 of the substrate 11 may be, for example, 200 μm or less, 50 μm or less, and preferably 25 μm or less. By setting the thickness T1 of the substrate 11 to 200 μm or less, the occurrence of steps between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be suppressed, making it difficult for observers to recognize the presence of the substrate 11. Furthermore, by setting the thickness T1 of the substrate 11 to 50 μm or less, the occurrence of steps between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be further suppressed, making it even more difficult for observers to recognize the presence of the substrate 11.

[0046] The thickness T3 of the first transparent adhesive layer 95 may be, for example, 15 μm or more, and preferably 20 μm or more. The thickness T3 of the first transparent adhesive layer 95 may be, for example, 500 μm or less, preferably 300 μm or less, and more preferably 250 μm or less. The thickness T4 of the second transparent adhesive layer 96 may be, for example, 15 μm or more, and preferably 20 μm or more. The thickness T4 of the second transparent adhesive layer 96 may be, for example, 500 μm or less, preferably 300 μm or less, and more preferably 250 μm or less.

[0047] Referring again to Figure 2, the cover glass 75 is placed directly or indirectly on the first transparent adhesive layer 95. This cover glass 75 is a light-transmitting glass component. The cover glass 75 is plate-shaped, and its shape may be rectangular in plan view. The thickness of the cover glass 75 may be, for example, 200 μm or more and 1000 μm or less, and preferably 300 μm or more and 700 μm or less. The length of the cover glass 75 in the longitudinal direction (Y direction) may be, for example, 20 mm or more and 500 mm or less, preferably 100 mm or more and 200 mm or less. The length of the cover glass 75 in the short direction (X direction) may be 20 mm or more and 500 mm or less, preferably 50 mm or more and 100 mm or less.

[0048] As shown in Figure 1, the image display device 60 has a roughly rectangular shape in plan view, with its longitudinal direction parallel to the Y direction and its transverse direction parallel to the X direction. The length L4 of the longitudinal direction (Y direction) of the image display device 60 can be selected within the range of, for example, 20 mm to 500 mm, preferably 100 mm to 200 mm. The length L5 of the transverse direction (X direction) of the image display device 60 can be selected within the range of, for example, 20 mm to 500 mm, preferably 50 mm to 100 mm. The planar shape of the image display device 60 may also be a rectangle with rounded corners.

[0049] Next, the configuration of the wiring board will be described with reference to Figures 3 to 6. Figures 3 to 6 are diagrams showing the wiring board according to this embodiment.

[0050] The wiring board 10 according to this embodiment is a substrate used in the image display device 60 (see Figures 1 and 2) described above. The wiring board 10 is located on the light-emitting surface 64 side of the display device 61 and can be placed between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. As shown in Figure 3, such a wiring board 10 has, as described above, a transparent substrate 11, a plurality of mesh wiring sections 20 spaced apart from each other on the substrate 11, and a plurality of power supply sections 40. The power supply sections 40 are electrically connected to the mesh wiring sections 20. Each mesh wiring section 20 and each power supply section 40 are connected individually.

[0051] The substrate 11 has a roughly rectangular shape in plan view. In the illustrated example, its longitudinal direction is parallel to the X direction, and its transverse direction is parallel to the Y direction. The substrate 11 is transparent and roughly flat, and its thickness is roughly uniform overall. The length L1 of the substrate 11 in the longitudinal direction (Y direction) of the image display device 60 (see Figures 1 and 3) can be selected within a range of, for example, 10 mm to 200 mm. The length L2 of the substrate 11 in the transverse direction (X direction) of the image display device 60 (see Figure 1) can be selected within a range of, for example, 3 mm to 100 mm. The planar shape of the substrate 11 may be a rectangle with rounded corners.

[0052] The substrate 11 material may be any material having transparency in the visible light region and electrical insulation properties. Preferably, the substrate 11 material is an organic insulating material such as polyester resin, acrylic resin, polycarbonate resin, polyimide resin, polyolefin resin, cellulose resin, or fluororesin material. Polyester resin may be polyethylene terephthalate, etc. Acrylic resin may be polymethyl methacrylate, etc. Polyolefin resin may be cycloolefin polymer, etc. Cellulose resin may be triacetylcellulose, etc. Fluororesin material may be PTFE or PFA, etc. For example, the substrate 11 material may be an organic insulating material such as cycloolefin polymer (e.g., ZF-16 manufactured by Nippon Zeon Co., Ltd.) or polynorbornene polymer (manufactured by Sumitomo Bakelite Co., Ltd.). Furthermore, glass or ceramics may be appropriately selected as the substrate 11 material depending on the application. Although the illustration shows a substrate 11 composed of a single layer, it is not limited to this, and may have a structure in which multiple substrates or layers are laminated. Furthermore, the substrate 11 may be a film-like material or a plate-like material.

[0053] The dielectric loss tangent of the substrate 11 is preferably 0.002 or less. By having the dielectric loss tangent of the substrate 11 within the above range, the loss of gain (decrease in sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced, especially when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring section 20 are of high frequency.

[0054] The relative permittivity of the substrate 11 is preferably between 2 and 10. Having a relative permittivity of 2 or higher allows for a wider range of material choices for the substrate 11. Furthermore, having a relative permittivity of 10 or lower reduces the gain loss associated with electromagnetic wave transmission and reception. That is, when the relative permittivity of the substrate 11 is high, the influence of the substrate 11's thickness on electromagnetic wave propagation increases. Also, if electromagnetic wave propagation is negatively affected, the dielectric loss tangent of the substrate 11 increases, potentially leading to a greater gain loss associated with electromagnetic wave transmission and reception. In contrast, having a relative permittivity of 10 or lower reduces the influence of the substrate 11's thickness on electromagnetic wave propagation. Therefore, the gain loss associated with electromagnetic wave transmission and reception can be reduced. In particular, when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring section 20 are high-frequency, the gain loss associated with electromagnetic wave transmission and reception can be reduced.

[0055] The dielectric loss tangent and relative permittivity of the substrate 11 can be measured in accordance with IEC 62562. Specifically, first, a test specimen is prepared by cutting out a portion of the substrate 11 where the mesh wiring portion 20 is not formed. Alternatively, the substrate 11 with the mesh wiring portion 20 formed on it may be cut out, and the mesh wiring portion 20 may be removed by etching or the like. The dimensions of the test specimen shall be a width of 10 mm to 20 mm and a length of 50 mm to 100 mm. Next, the dielectric loss tangent or relative permittivity is measured in accordance with IEC 62562. The dielectric loss tangent and relative permittivity of the substrate 11 may also be measured in accordance with ASTM D150.

[0056] In this embodiment, the substrate 11 is transparent. In this specification, "transparent" means that the transmittance of visible light (light with a wavelength of 400 nm to 700 nm) is 85% or more. The substrate 11 may have a visible light transmittance of 85% or more, but it is preferably 90% or more. There is no particular upper limit to the visible light transmittance of the substrate 11, but it may be, for example, 100% or less. By setting the visible light transmittance of the substrate 11 within the above range, the transparency of the wiring board 10 is increased, making the display device 61 of the image display device 60 easier to see.

[0057] In this embodiment, the mesh wiring section 20 consists of an antenna pattern that functions as an antenna. This mesh wiring section 20 may also be configured as an array antenna. When the mesh wiring section 20 is configured as an array antenna in this way, the performance of the millimeter-wave antenna for transmitting and receiving highly directional millimeter waves can be improved. An array antenna is an antenna in which a plurality of antenna elements (radiating elements) are arranged regularly, and in which the amplitude and phase of the excitation of the elements can be controlled independently.

[0058] As shown in Figure 3, multiple mesh wiring sections 20 are formed on the substrate 11. It is preferable that four or more mesh wiring sections 20 are provided. In the illustrated example, four mesh wiring sections 20 are formed on the substrate 11 (see Figure 1). Also, as shown in Figure 3, the mesh wiring sections 20 may not be present across the entire surface of the substrate 11, but only in a portion of the substrate 11. Each mesh wiring section 20 may have the same shape as the others. In this case, each mesh wiring section 20 has a length (Y-direction distance) L of the tip portion 20b, which will be described later. a Error and width (distance in the X direction) W a It is preferable that the errors are within 10% each. This effectively improves the performance of the millimeter-wave antenna.

[0059] The mesh wiring section 20 has a base end portion (transmitting section) 20a on the power supply section 40 side and a tip end portion (transmitting / receiving section) 20b connected to the base end portion 20a. The base end portion 20a is connected to the power supply section 40. The shape of the base end portion 20a and the shape of the tip end portion 20b are both approximately rectangular in plan view. In this case, the length (Y-direction distance) of the tip end portion 20b is approximately the same as the length (Y-direction distance) of the base end portion 20a, and the width (X-direction distance) of the tip end portion 20b is wider than the width (X-direction distance) of the base end portion 20a.

[0060] The tip portion 20b of this mesh wiring section 20 corresponds to a predetermined frequency band. That is, the tip portion 20b has a length (Y-direction distance) L ahas a length corresponding to a specific frequency band. Note that the lower the corresponding frequency band, the longer the length L of the tip side portion 20b a becomes. The mesh wiring portion 20 may correspond to any of an antenna for millimeter waves, an antenna for telephones, an antenna for WiFi, an antenna for 3G, an antenna for 4G, an antenna for 5G, an antenna for LTE, an antenna for Bluetooth (registered trademark), an antenna for NFC, etc. Note that the lengths of the plurality of tip side portions 20b may be different from each other and may correspond to different frequency bands. Alternatively, when the wiring board 10 does not have a radio wave transmission / reception function, each mesh wiring portion 20 may perform functions such as a hovering function, fingerprint authentication, a heater, noise cut (shield), etc. Note that the hovering function refers to a function that enables the user to operate without directly touching the display

[0061] The longitudinal direction of the tip side portion 20b is parallel to the X direction, and the short side direction thereof is parallel to the Y direction. The length L of the tip side portion 20b in the Y direction a can be selected, for example, in the range of 1 mm or more and 100 mm or less. The width W of the tip side portion 20b in the X direction a can be selected, for example, in the range of 1 mm or more and 100 mm or less. In particular, when the mesh wiring portion 20 is an antenna for millimeter waves, the length L of the tip side portion 20b a can be selected in the range of 1 mm or more, more preferably 1.5 mm or more. When the mesh wiring portion 20 is an antenna for millimeter waves, the length L of the tip side portion 20b a can be selected in the range of 10 mm or less, more preferably 5 mm or less

[0062] The distance between the mesh wiring portions 20 is preferably 1 mm or more and 5 mm or less. That is, the distance D between the tip side portions 20b 20b (see FIG. 3) is preferably 1 mm or more and 5 mm or less. The distance D between the tip side portions 20b 20b being 1 mm or more can suppress unintentional interference of electromagnetic waves between the antenna elements. The distance D between the tip side portions 20b 20bBy keeping the distance between the mesh wiring sections 20 to 5 mm or less, the overall size of the array antenna formed by the mesh wiring section 20 can be reduced. For example, if the mesh wiring section 20 is a 28 GHz millimeter-wave antenna, the distance between the tip portions 20b is D 20b It may be 3.5 mm. Also, if the mesh wiring section 20 is a 60 GHz millimeter wave antenna, the distance D between the tip portions 20b is... 20b It may be 1.6 mm.

[0063] As shown in Figure 4, each mesh wiring section 20 has a pattern shape in which metal wires are arranged in a grid or mesh pattern. This pattern shape is repeated in the X and Y directions. That is, the mesh wiring section 20 has a pattern shape composed of a portion extending in a first direction (for example, the Y direction) (first direction wiring 21, described later) and a portion extending in a second direction (for example, the X direction) (second direction wiring 22, described later).

[0064] The mesh wiring section 20 has multiple wirings. Specifically, the mesh wiring section 20 has multiple first-directional wirings 21 and multiple second-directional wirings 22 that connect the multiple first-directional wirings 21. The multiple first-directional wirings 21 and the multiple second-directional wirings 22 together form a grid-like or mesh-like shape. Each first-directional wiring 21 extends in the longitudinal direction (Y direction) of the mesh wiring section 20. Each second-directional wiring extends linearly in the width direction (X direction) of the mesh wiring section 20. Note that the first-directional wirings 21 and the second-directional wirings 22 may extend in directions that are not parallel to either the X direction or the Y direction.

[0065] In the mesh wiring section 20, multiple openings 23 are formed by being surrounded by adjacent first-directional wiring 21 and adjacent second-directional wiring 22. The planar shape of each opening 23 is approximately rhombic in plan view. A transparent substrate 11 is exposed through each opening 23. This enhances the overall transparency of the wiring board 10.

[0066] In the mesh wiring section 20, multiple openings 23 are formed by being surrounded by adjacent first-directional wiring 21 and adjacent second-directional wiring 22. Furthermore, the first-directional wiring 21 and second-directional wiring 22 are arranged at equal intervals from each other. That is, the multiple first-directional wiring 21 are arranged at equal intervals from each other, and their pitch P1 can be, for example, in the range of 0.01 mm to 1 mm. Similarly, the multiple second-directional wiring 22 are arranged at equal intervals from each other, and their pitch P2 can be, for example, in the range of 0.01 mm to 1 mm. In this way, because the multiple first-directional wiring 21 and the multiple second-directional wiring 22 are arranged at equal intervals, there is no variation in the size of the openings 23 within the mesh wiring section 20, making the mesh wiring section 20 difficult to see with the naked eye. In addition, the pitch P1 of the first-directional wiring 21 is equal to the pitch P2 of the second-directional wiring 22. Therefore, each opening 23 is approximately square in plan view, and the transparent substrate 11 is exposed through each opening 23. By increasing the area of ​​each opening 23, the overall transparency of the wiring board 10 can be increased. The length L3 of one side of each opening 23 can be, for example, in the range of 0.01 mm to 1 mm. Although each first directional wiring 21 and each second directional wiring 22 are orthogonal to each other, they are not limited to this and may intersect at acute or obtuse angles. Furthermore, while it is preferable for the shape and size of the openings 23 to be the same across the entire surface, they do not have to be uniform across the entire surface, for example, by varying them in different locations.

[0067] As shown in Figure 5, each first-direction wiring 21 has a shape in which the cross section perpendicular to its longitudinal direction (cross section in the X direction) is approximately rectangular or approximately square. In this case, the cross-sectional shape of the first-direction wiring 21 is approximately uniform along the longitudinal direction (Y direction) of the first-direction wiring 21. As shown in Figure 6, each second-direction wiring 22 has a cross section perpendicular to its longitudinal direction (cross section in the Y direction) that is approximately rectangular or approximately square, and has approximately the same shape as the cross-sectional shape (cross section in the X direction) of the first-direction wiring 21 described above. In this case, the cross-sectional shape of the second-direction wiring 22 is approximately uniform along the longitudinal direction (X direction) of the second-direction wiring 22. The cross-sectional shapes of the first-direction wiring 21 and the second-direction wiring 22 do not necessarily have to be approximately rectangular or approximately square. For example, the cross-sectional shape of the first direction wiring 21 and the cross-sectional shape of the second direction wiring 22 may be a roughly trapezoidal shape where the front side (positive Z-direction side) is narrower than the back side (negative Z-direction side), or a shape in which the sides located on both sides in the longitudinal direction are curved.

[0068] In this embodiment, the line width W1 of the first directional wiring 21 (see Figure 5) and the line width W2 of the second directional wiring 22 (see Figure 6) are not particularly limited and can be appropriately selected according to the application. Here, the line width W1 of the first directional wiring 21 is the width (distance in the X direction) in a cross section perpendicular to its longitudinal direction, and the line width W2 of the second directional wiring 22 is the width (distance in the Y direction) in a cross section perpendicular to its longitudinal direction. For example, the line width W1 of the first directional wiring 21 can be selected in the range of 0.1 μm to 5.0 μm, and is preferably 0.2 μm to 2.0 μm. Also, the line width W2 of the second directional wiring 22 can be selected in the range of 0.1 μm to 5.0 μm, and is preferably 0.2 μm to 2.0 μm.

[0069] The height H1 of the first direction wiring 21 (see Figure 5) and the height H2 of the second direction wiring 22 (see Figure 6) are not particularly limited and can be appropriately selected depending on the application. Here, the height H1 of the first direction wiring 21 and the height H2 of the second direction wiring 22 are the lengths in the Z direction. The height H1 of the first direction wiring 21 and the height H2 of the second direction wiring 22 can each be selected in a range of, for example, 0.1 μm or more, and preferably 0.2 μm or more. The height H1 of the first direction wiring 21 and the height H2 of the second direction wiring 22 can each be selected in a range of, for example, 5.0 μm or less, and preferably 2.0 μm or less.

[0070] The material of the first directional wiring 21 and the second directional wiring 22 may be any conductive metallic material. In this embodiment, the material of the first directional wiring 21 and the second directional wiring 22 is copper, but is not limited to this. The material of the first directional wiring 21 and the second directional wiring 22 may be, for example, a metallic material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals. Furthermore, the first directional wiring 21 and the second directional wiring 22 may be a plated layer formed by an electroplating method.

[0071] The overall aperture ratio At of the mesh wiring section 20 may be, for example, in the range of 87% or more and less than 100%. By setting the overall aperture ratio At of the mesh wiring section 20 within this range, the conductivity and transparency of the wiring board 10 can be ensured. Preferably, the overall aperture ratio At of the mesh wiring section 20 is 95% or more and less than 100%. This ensures the conductivity of the wiring board 10 while also increasing its transparency. The aperture ratio refers to the ratio (%) of the area of ​​the aperture region to the unit area of ​​a predetermined region (for example, the entire area of ​​the mesh wiring section 20). The aperture region refers to the area where there are no metal parts such as the first direction wiring 21 and the second direction wiring 22, and the substrate 11 is exposed.

[0072] Although not shown in the figures, a protective layer may be formed on the first surface 11a of the substrate 11 so as to cover the mesh wiring portion 20. The protective layer protects the mesh wiring portion 20 and is formed so as to cover at least the mesh wiring portion 20 of the substrate 11. As the material for the protective layer, a colorless, transparent insulating resin such as polymethyl (meth)acrylate, polyethyl (meth)acrylate, acrylic resins and their modified resins and copolymers, polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral, polyvinyl resins and their copolymers, polyurethane, epoxy resin, polyamide, or chlorinated polyolefin can be used.

[0073] Referring again to Figures 3 and 4, the power supply unit 40 is electrically connected to the mesh wiring unit 20. This power supply unit 40 consists of a roughly rectangular conductive thin plate-like member. The longitudinal direction of the power supply unit 40 is parallel to the X direction, and the short direction of the power supply unit 40 is parallel to the Y direction. The power supply unit 40 has a first end 41 that connects to the mesh wiring unit 20, and a second end 42 on the opposite side of the first end 41.

[0074] Length L of the power supply unit 40 in the short direction (Y direction) b (See Figure 3) can be selected within a range of, for example, 1 mm to 100 mm. The width W in the longitudinal direction (X direction) of the power supply unit 40. b (See Figure 3) may be, for example, 0.2 mm or more. Here, the width W of the power supply section 40 b The width W of the power supply section 40 is such that it is 0.2 mm or more. b If the current is greater than or equal to a predetermined value, due to the skin effect described later, the current flowing through the power supply unit 40 will flow only in a portion of the outer surface area of ​​the power supply unit 40. On the other hand, in this embodiment, as described later, a first notch 45 is formed in the power supply unit 40. Therefore, the width W of the power supply unit 40 b Even if the width is 0.2 mm or more, the area through which current flows in the power supply section 40 can be widened. Therefore, the current flowing through the power supply section 40 can be distributed. As a result, deterioration of the power supply section 40 can be suppressed. The width W of such a power supply section 40 bFor example, it can be selected within a range of 0.2 mm to 100 mm.

[0075] Furthermore, the power supply unit 40 is located at the longitudinal end (the negative Y-direction end) of the substrate 11. The material of the power supply unit 40 can be, for example, a metallic material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals.

[0076] The power supply unit 40 is electrically connected to the communication module 63 of the image display device 60 (see Figures 1 and 2) via a power supply line 85 when the wiring board 10 is incorporated into the image display device 60. The power supply unit 40 is provided on the first surface 11a of the board 11, but is not limited to this, and part or all of the power supply unit 40 may be located outside the periphery of the board 11. Furthermore, by forming the power supply unit 40 flexibly, it may be configured to wrap around to the side or back of the image display device 60. In this case, the power supply unit 40 may be electrically connected to the communication module 63 on the side or back of the image display device 60.

[0077] As shown in Figure 4, multiple first-direction wirings 21 are electrically connected to the power supply unit 40 on the positive side in the Y direction. In this case, the power supply unit 40 is formed integrally with the mesh wiring unit 20. The thickness T5 of the power supply unit 40 (distance in the Z direction, see Figure 6) can be the same as the height H1 of the first-direction wiring 21 (see Figure 5) and the height H2 of the second-direction wiring 22 (see Figure 6), and can be selected in a range of, for example, 0.1 μm to 5.0 μm.

[0078] Here, the power supply section 40 has a plurality of linearly extending first notches 45 formed therein. These first notches 45 serve to allow the resin material of the anisotropic conductive film 85c, described later, to escape from between the power supply line 85 and the power supply section 40 when the power supply line 85 is attached to the power supply section 40. The first notches 45 also serve to allow air that has entered between the power supply line 85 and the power supply section 40 to escape when the power supply line 85 is attached to the power supply section 40. In other words, by forming the first notches 45 in the power supply section 40, when the power supply line 85 is pressed to the power supply section 40, the resin material of the anisotropic conductive film 85c and the air that has entered between the power supply line 85 and the power supply section 40 will flow along the first notches 45. This makes it possible to suppress so-called air bubbles that get trapped between the resin material of the anisotropic conductive film 85c and the power supply unit 40 when attaching the power supply line 85 to the power supply unit 40, and also improves the adhesion between the power supply line 85 and the power supply unit 40.

[0079] Furthermore, when the power supply line 85 is attached to the power supply unit 40, a portion of the resin material of the power supply line 85 enters the first notch 45. In addition, a portion of the resin material that enters the first notch 45 hardens within the first notch 45. The resin material that hardens within the first notch 45 then acts as an anchor. As a result, the power supply line 85 adheres strongly to the power supply unit 40, preventing the power supply line 85 from peeling off the power supply unit 40.

[0080] Furthermore, by forming the first notch 45 in the power supply section 40, deterioration of the power supply section 40 can be suppressed. Specifically, by forming the first notch 45 in the power supply section 40, the area through which current flows in the power supply section 40 becomes wider due to the skin effect described later. As a result, the current flowing through the power supply section 40 can be dispersed. This also suppresses deterioration of the power supply section 40.

[0081] Generally, when alternating current flows through a conductor, the higher the frequency, the less easily current flows through the center of the conductor, and the more the current flows along the outer surface. This phenomenon, where current flows only on the outer surface of a conductor when alternating current flows through it, is called the skin effect. Skin depth refers to the depth from the outer surface of the conductor at which the current attenuates to 1 / e (approximately 0.37) times the current at the outer surface where current flows most easily. This skin depth δ can generally be calculated using the following formula.

[0082]

number

[0083] In the above formula, ω is the angular frequency (=2πf), and μ is the permeability (4π × 10 in a vacuum). -7 [H / m]), σ is the conductivity of the conductor (5.8 × 10 in the case of copper). 7 This means [S / m]). The skin depth δ of a copper conductor is approximately 2.3 μm at a frequency of 0.8 GHz, approximately 1.3 μm at a frequency of 2.4 GHz, approximately 1.0 μm at a frequency of 4.4 GHz, and approximately 0.85 μm at a frequency of 6 GHz. Also, the radio waves (millimeter waves) transmitted and received by 5G antennas are at a higher frequency (28 GHz to 39 GHz) than, for example, the radio waves transmitted and received by 4G antennas. And, for example, when the frequency of the current is between 28 GHz and 39 GHz, δ is between approximately 0.3 μm and approximately 0.4 μm.

[0084] Thus, the current flows from the outer surface of the conductor to a depth corresponding to the skin depth δ. For this reason, especially when the radio waves transmitted and received by the mesh wiring section 20 are of high frequency (for example, 28 GHz to 39 GHz), the skin depth δ becomes small, so it is preferable to smooth the outer surface of the power supply section 40. On the other hand, a power supply line 85 is connected to the power supply section 40. For this reason, it is preferable to improve the adhesion between the power supply section 40 and the power supply line 85. As described above, in this embodiment, a plurality of first notches 45 are formed in the power supply section 40. Therefore, even if the outer surface of the power supply section 40 is smoothed, the adhesion between the power supply section 40 and the power supply line 85 can be improved.

[0085] Next, the first notches 45 will be described in detail. As shown in Figures 3 and 4, in the illustrated example, seven first notches 45 are formed in the power supply section 40. The first notches 45 penetrate the power supply section 40 in the thickness direction (Z direction), and a transparent substrate 11 is exposed from each first notch 45. Note that the number of first notches 45 formed in the power supply section 40 is not limited to this. For example, two to six first notches 45 may be formed in the power supply section 40, or eight or more may be formed.

[0086] Multiple first notches 45 may extend along the longitudinal direction (Y direction) of the mesh wiring section 20. In this case, the first notches 45 will extend along the direction in which the current flows. This allows for effective distribution of the current flowing through the power supply section 40. In this case, each first notch 45 may extend in a straight line. The length L6 (see Figure 4) of the first notches 45 in the longitudinal direction (Y direction) of the mesh wiring section 20 can be, for example, in the range of 0.5 mm to 99.9 mm.

[0087] Furthermore, the width W6 of the first notch 45 in the short direction (X direction) of the mesh wiring section 20 (see Figure 4) is preferably 0.5 times or more and 1 time or less the average particle diameter of the conductive particles 85d of the power supply line 85, which will be described later. This ensures that when the resin material of the anisotropic conductive film 85c, which will be described later, flows when the power supply line 85 is connected to the power supply section 40, the conductive particles 85d of the anisotropic conductive film 85c interfere with the first notch 45. Therefore, the first notch 45 can suppress the movement of the conductive particles 85d of the anisotropic conductive film 85c. The width W6 of the first notch 45 can be, for example, in the range of 0.01 mm or more and 0.5 mm or less.

[0088] Multiple first notches 45 extend from the second end 42 along the direction from the second end 42 to the first end 41 (the longitudinal direction (Y direction) of the mesh wiring section 20). This makes it easier for the resin material of the anisotropic conductive film 85c and the air that has entered between the power supply line 85 and the power supply section 40 to escape from between the power supply line 85 and the power supply section 40 via the second end 42 when the power supply line 85 is crimped to the power supply section 40. In addition, by forming the first notches 45, high-frequency currents, especially millimeter waves, will flow on both sides of the first notches 45 (both sides in the X direction) due to the skin effect. As a result, the current flowing through the power supply section 40 can be dispersed compared to when the first notches 45 are not formed. Therefore, deterioration of the edges of the power supply section 40 can be suppressed. In the illustrated example, each first notch 45 is not formed over the entire area of ​​the power supply section 40 in the Y direction, but only over a portion of the power supply section 40 in the Y direction. Therefore, each first notch 45 terminates midway through the power supply section 40. However, each first notch 45 may be formed over the entire area of ​​the power supply section 40 in the Y direction.

[0089] The first notches 45 may be formed at equal intervals from one another. The pitch P3 of the first notches 45 can be, for example, in the range of 0.01 mm to 0.5 mm. By forming multiple first notches 45 at equal intervals from one another in this way, unevenness in the current distribution in the power supply section 40 can be suppressed.

[0090] The first notch 45 may extend along the width direction (X direction) of the mesh wiring section 20. The first notch 45 may also extend along a direction not parallel to either the X or Y direction. Furthermore, each of the first notches 45 may extend in a bent shape, a curved shape, or a wavy shape. Also, each of the first notches 45 may extend in different directions. In particular, the first notches 45 may extend radially from the center of the power supply section 40. This improves the fluidity of the resin material of the anisotropic conductive film 85c, described later, when connecting the power supply line 85 to the power supply section 40.

[0091] Furthermore, the width W6 of the first notch 45 may vary. In particular, the width W6 of the first notch 45 may widen from the center outward of the power supply section 40. By widening the width W6 from the center outward of the power supply section 40, the fluidity of the resin material of the anisotropic conductive film 85c, which will be described later, can be further improved when connecting the power supply line 85 to the power supply section 40.

[0092] Each of the first notches 45 may have the same shape as the others, or they may have different shapes. For example, the widths W6 of each of the first notches 45 may be different.

[0093] Next, the module configuration will be described with reference to Figures 7 to 9. Figures 7 to 9 show the module according to this embodiment.

[0094] As shown in Figure 7, module 80A comprises the wiring board 10 described above and a power supply line 85 electrically connected to the power supply unit 40 via an anisotropic conductive film 85c. As described above, when module 80A is incorporated into the image display device 60 having a display device 61, the power supply unit 40 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply line 85.

[0095] The power supply line 85 has a roughly rectangular shape in plan view. In this case, the width (distance in the X direction) of the power supply line 85 may be approximately the same as the width (distance in the X direction) of the power supply unit 40. Also, the area of ​​the power supply line 85 may be approximately the same as the area of ​​the power supply unit 40. This makes it possible to bring the electrical resistance of the power supply line 85 and the electrical resistance of the power supply unit 40 closer to each other. As a result, impedance matching can be easily achieved between the power supply line 85 and the power supply unit 40, and a decrease in electrical connectivity between the power supply line 85 and the power supply unit 40 can be suppressed.

[0096] The power supply line 85 is crimped to the wiring board 10 via an anisotropic conductive film (ACF) 85c. As shown in Figure 8, the anisotropic conductive film 85c contains a resin material such as acrylic resin or epoxy resin and conductive particles 85d. In the illustrated example, the anisotropic conductive film 85c covers a portion of the power supply section 40. This helps to suppress corrosion of the power supply section 40.

[0097] The anisotropic conductive film 85c is positioned opposite the power supply unit 40. A portion of the conductive particles 85d are in contact with the power supply unit 40. This electrically connects the power supply line 85 to the power supply unit 40. Note that a portion of the anisotropic conductive film 85c may dissolve around the power supply line 85 when the power supply line 85 is crimped to the wiring board 10. The particle size of the conductive particles 85d may be between 3 μm and 10 μm, for example, about 7 μm. To measure the average particle size of the conductive particles 85d, first, the power supply line 85 is peeled off from the power supply unit 40 to expose multiple conductive particles 85d from the resin material of the anisotropic conductive film 85c. Next, the exposed multiple conductive particles 85d are photographed using a scanning electron microscope (SEM). Then, the particle size of the multiple conductive particles 85d is measured from the obtained image. The average of the measured values ​​is then taken as the average particle size of the conductive particles 85d. The number of conductive particles 85d to be measured shall be between 10 and 100. If the number of conductive particles 85d that can be measured in one power supply line 85 is 9 or less, the average particle diameter of the conductive particles 85d shall be calculated using the particle diameters of the conductive particles 85d in other power supply lines 85. Furthermore, if the conductive particles 85d are not exposed from the resin material of the anisotropic conductive film 85c, the shape of the conductive particles 85d within the resin material of the anisotropic conductive film 85c shall be imaged using a scanning electron microscope.

[0098] The power supply line 85 may be, for example, a flexible printed circuit board. As shown in Figure 8, the power supply line 85 has a base material 85a and a metal wiring section 85b laminated on the base material 85a. Of these, the base material 85a may contain, for example, a resin material such as polyimide or a liquid crystal polymer.

[0099] The metal wiring section 85b may contain, for example, copper. This metal wiring section 85b is electrically connected to the power supply section 40 via conductive particles 85d.

[0100] As shown in Figure 9, the metal wiring portion 85b may have a plurality of linearly extending third notches 86 formed therein. This widens the area through which current flows in the metal wiring portion 85b due to the skin effect. As a result, the current flowing through the metal wiring portion 85b can be dispersed. Consequently, deterioration of the metal wiring portion 85b can be suppressed. Note that in Figure 9, the anisotropic conductive film 85c is omitted from the illustration for clarity.

[0101] Furthermore, the width W7 of the third notch 86 (see Figure 7) may be less than or equal to the width W6 of the first notch 45, and in a plan view, the third notch 86 may extend along the first notch 45 or overlap the first notch 45. As a result, even if the resin material of the anisotropic conductive film 85c flows when the power supply line 85 is connected to the power supply unit 40, the conductive particles 85d of the anisotropic conductive film 85c will interfere with the first notch 45 and the third notch 86. Therefore, the first notch 45 and the third notch 86 can suppress the movement of the conductive particles 85d of the anisotropic conductive film 85c. The width W7 of the third notch 86 can be, for example, in the range of 0.002 mm or more and 2 mm or less.

[0102] In this case, as shown in Figure 9, seven third notches 86 are formed in the metal wiring portion 85b. The third notches 86 penetrate the metal wiring portion 85b in the thickness direction (Z direction), and the base material 85a is exposed from each of the third notches 86. Note that the number of third notches 86 formed in the metal wiring portion 85b is not limited to this. For example, there may be two to six third notches 86 formed in the metal wiring portion 85b, or there may be eight or more.

[0103] Multiple third notches 86 may extend along the longitudinal direction (Y direction) of the mesh wiring section 20. In this case, the third notches 86 will extend along the direction in which the current flows. This allows for effective distribution of the current flowing through the metal wiring section 85b.

[0104] The third notch 86 may extend from the end of the metal wiring section 85b on the positive side in the Y direction. As shown in Figure 7, in the illustrated example, each third notch 86 is not formed over the entire area of ​​the metal wiring section 85b in the Y direction, but only over a portion of the area of ​​the metal wiring section 85b in the Y direction. Therefore, each third notch 86 terminates in the middle of the metal wiring section 85b. However, each third notch 86 may be formed over the entire area of ​​the metal wiring section 85b in the Y direction. Furthermore, the length L7, pitch P4, and shape of the third notch 86 may be the same as those of the first notch 45. That is, the third notch 86 may extend along the width direction (X direction) of the mesh wiring section 20. Furthermore, the third notch 86 may extend along a direction that is not parallel to either the X direction or the Y direction. Furthermore, each of the third notches 86 may extend in a bent shape, a curved shape, or a wavy shape. Also, each of the third notches 86 may extend in different directions. In particular, the third notches 86 may be formed in the metal wiring portion 85b so as to extend radially from the center of the power supply portion 40 when the power supply line 85 is crimped to the power supply portion 40. This improves the fluidity of the resin material of the anisotropic conductive film 85c when connecting the power supply line 85 to the power supply portion 40.

[0105] Furthermore, the width W7 of the third notch 86 may vary. In particular, the third notch 86 may be formed in the metal wiring portion 85b such that when the power supply line 85 is crimped to the power supply portion 40, the width W7 of the third notch 86 widens outward from the center of the power supply portion 40. By widening the width W7 outward from the center of the power supply portion 40, the fluidity of the resin material of the anisotropic conductive film 85c can be further improved when connecting the power supply line 85 to the power supply portion 40.

[0106] Each of the third notches 86 may have the same shape as the others, or they may have different shapes. For example, the widths W7 of each of the third notches 86 may be different.

[0107] Next, with reference to Figures 10(a)-(f), 11(a)-(c), and 12(a)-(c), the manufacturing method of the wiring board 10, the manufacturing method of the module 80A, and the manufacturing method of the image display device 60 according to this embodiment will be described. Figures 10(a)-(f) are cross-sectional views showing the manufacturing method of the wiring board 10 according to this embodiment. Figures 11(a)-(c) are cross-sectional views showing the manufacturing method of the module 80A according to this embodiment. Figures 12(a)-(c) are cross-sectional views showing the manufacturing method of the image display device 60 according to this embodiment.

[0108] First, as shown in Figure 10(a), a substrate 11 is prepared, which includes a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. The substrate 11 is transparent.

[0109] Next, a mesh wiring section 20 and a power supply section 40 electrically connected to the mesh wiring section 20 are formed on the first surface 11a of the substrate 11.

[0110] In this case, first, as shown in Figure 10(b), a metal foil 51 is laminated over substantially the entire surface 11a of the substrate 11. In this embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In this embodiment, the metal foil 51 may contain copper.

[0111] Next, as shown in Figure 10(c), a photocurable insulating resist 52 is supplied to substantially the entire surface of the metal foil 51. Examples of this photocurable insulating resist 52 include organic resins such as acrylic resin and epoxy resin.

[0112] Next, as shown in Figure 10(d), the insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form the insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the first directional wiring 21 and the second directional wiring 22 is exposed.

[0113] Next, as shown in Figure 10(e), the metal foil 51 located on the first surface 11a of the substrate 11, in the portion not covered by the insulating layer 54, is removed. In this process, the metal foil 51 is etched so that the first surface 11a of the substrate 11 is exposed by performing a wet treatment using ferric chloride, cupric chloride, strong acids such as sulfuric acid and hydrochloric acid, persulfates, hydrogen peroxide, aqueous solutions thereof, or combinations thereof.

[0114] Next, as shown in Figure 10(f), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or by dry treatment using oxygen plasma.

[0115] In this way, a wiring board 10 is obtained having a substrate 11 and a mesh wiring section 20 provided on the first surface 11a of the substrate 11. In this case, the mesh wiring section 20 includes first directional wiring 21 and second directional wiring 22. At this time, a power supply section 40 may be formed by a part of the metal foil. In this case, when forming the insulating layer 54 by photolithography, the first notch 45 can be formed at a desired position by appropriately setting the shape of the insulating layer 54. Alternatively, a flat plate-shaped power supply section 40 may be prepared separately and electrically connected to the mesh wiring section 20. In this case, the first notch 45 may be formed by machining, such as cutting.

[0116] Next, the method for manufacturing a module according to this embodiment will be described with reference to Figures 11(a)-(c).

[0117] First, prepare the wiring board 10 as shown in Figure 11(a). In this case, the wiring board 10 is manufactured, for example, by the method shown in Figures 10(a)-(f).

[0118] Next, the power supply line 85 is electrically connected to the power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d. First, as shown in Figure 11(b), the anisotropic conductive film 85c is placed on the wiring board 10. At this time, the anisotropic conductive film 85c is positioned to face the power supply unit 40.

[0119] Next, as shown in Figure 11(c), the power supply line 85 is crimped to the wiring board 10. At this time, pressure and heat are applied to the power supply line 85 to crimp it to the wiring board 10. Then, a portion of the conductive particles 85d come into contact with the power supply unit 40. In this way, the power supply line 85 is electrically connected to the power supply unit 40. When crimping the power supply line 85 to the wiring board 10, the power supply line 85 is crimped to the wiring board 10 such that the anisotropic conductive film 85c covers at least a portion of the power supply unit 40. At this time, a portion of the anisotropic conductive film 85c may dissolve around the power supply line 85.

[0120] Furthermore, in this embodiment, the power supply unit 40 has a plurality of linearly extending first notches 45 formed therein. As a result, when the power supply wire 85 is pressed against the power supply unit 40, the resin material of the anisotropic conductive film 85c and the air that has entered between the power supply wire 85 and the power supply unit 40 are released along the first notches 45 from between the power supply wire 85 and the power supply unit 40.

[0121] Furthermore, when the power supply line 85 is attached to the power supply unit 40, a portion of the resin material of the power supply line 85 enters the first notch 45. In addition, a portion of the resin material that enters the first notch 45 hardens within the first notch 45. As a result, the power supply line 85 adheres tightly to the power supply unit 40.

[0122] In this way, a module 80A is obtained that includes a wiring board 10 and a power supply line 85 electrically connected to a power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d.

[0123] Next, with reference to Figures 12(a)-(c), a method for manufacturing the image display device 60 according to this embodiment will be described.

[0124] Next, the first transparent adhesive layer 95, the wiring board 10 of module 80A, and the second transparent adhesive layer 96 are laminated together. First, as shown in Figure 12(a), an OCA sheet 90 is prepared, which includes, for example, a release film 91 made of polyethylene terephthalate (PET) and an OCA layer 92 (first transparent adhesive layer 95 or second transparent adhesive layer 96) laminated on the release film 91. At this time, the OCA layer 92 may be a layer obtained by coating the release film 91 with a liquid curable adhesive layer composition containing a polymerizable compound and curing it using, for example, ultraviolet light (UV). This curable adhesive layer composition contains a polar group-containing monomer.

[0125] Next, as shown in Figure 12(b), the OCA layer 92 of the OCA sheet 90 is bonded to the wiring board 10. This sandwiches the wiring board 10 between the OCA layer 92.

[0126] Subsequently, as shown in Figure 12(c), the release film 91 is peeled off from the OCA layer 92 of the OCA sheet 90 bonded to the wiring board 10, thereby obtaining the first transparent adhesive layer 95 (OCA layer 92), the wiring board 10, and the second transparent adhesive layer 96 (OCA layer 92) which are laminated together.

[0127] In this way, a laminate 70 for an image display device is obtained, comprising a first transparent adhesive layer 95, a second transparent adhesive layer 96, and a module 80A having a wiring board 10.

[0128] Subsequently, by stacking the display device 61 on the image display device laminate 70, an image display device 60 is obtained, comprising a module 80A and a display device 61 stacked on the wiring board 10 of the module 80A.

[0129] Next, we will describe the operation of this embodiment, which has the above configuration.

[0130] As shown in Figures 1 and 2, the wiring board 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring board 10 is placed on the display device 61. The mesh wiring section 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply section 40 and the power supply line 85. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring section 20, and communication can be performed using the image display device 60.

[0131] In this embodiment, the power supply section 40 has a plurality of linearly extending first notches 45 formed therein. This improves the contact between the power supply line 85 and the power supply section 40.

[0132] Here, since the metal power supply unit 40 and the resin material of the power supply line 85 are made of different materials, their adhesion is not necessarily strong. For this reason, for example, if the power supply unit 40 does not have a notch like the first notch 45 and the surface of the power supply unit 40 is flat, the adhesion between the power supply line 85 and the power supply unit 40 may decrease.

[0133] In contrast, to improve the adhesion between the power supply line 85 and the power supply unit 40, multiple through-holes may be formed in the power supply unit 40 that penetrate the power supply unit 40 in the thickness direction (Z direction). In this case, a portion of the resin material of the anisotropic conductive film can enter into the through-holes. As a result, the portion of the resin material that enters into the through-holes acts as an anchor, firmly bonding the power supply line 85 to the power supply unit 40. On the other hand, if multiple through-holes are formed in the power supply unit 40, it may become difficult to release air and the resin material of the anisotropic conductive film that have entered between the power supply unit 40 and the power supply line 85.

[0134] In contrast, according to this embodiment, the power supply unit 40 has a plurality of linearly extending first notches 45 formed therein. As a result, when the power supply wire 85 is pressed to the power supply unit 40, the resin material of the anisotropic conductive film 85c and the air that has entered between the power supply wire 85 and the power supply unit 40 will flow along the first notches 45. Therefore, the resin material of the anisotropic conductive film 85c and the air that has entered between the power supply wire 85 and the power supply unit 40 can be released from between the power supply wire 85 and the power supply unit 40. As a result, when attaching the power supply wire 85 to the power supply unit 40, so-called air bubbles that enter between the resin material of the anisotropic conductive film 85c and the power supply unit 40 can be suppressed, and the adhesion between the power supply wire 85 and the power supply unit 40 can be improved.

[0135] Furthermore, when the power supply line 85 is attached to the power supply unit 40, a portion of the resin material of the power supply line 85 enters the first notch 45. In addition, a portion of the resin material that enters the first notch 45 hardens within the first notch 45. The resin material that hardens within the first notch 45 then acts as an anchor. As a result, the power supply line 85 adheres strongly to the power supply unit 40, preventing the power supply line 85 from peeling off the power supply unit 40.

[0136] Furthermore, by forming the first notch 45 in the power supply section 40, deterioration of the power supply section 40 can be suppressed. Specifically, by forming the first notch 45 in the power supply section 40, the skin effect widens the area through which current flows in the power supply section 40. As a result, the current flowing through the power supply section 40 can be dispersed, and deterioration of the power supply section 40 can be suppressed.

[0137] Furthermore, the wiring board 10 comprises a substrate 11 and a mesh wiring section 20 arranged on the substrate 11. The substrate 11 is transparent. In addition, the mesh wiring section 20 has a conductive section that forms an opaque conductive layer and a mesh-like pattern with numerous openings 23. Thus, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is placed on the display device 61, the display device 61 can be seen through the openings 23 of the mesh wiring section 20, and the visibility of the display device 61 is not obstructed.

[0138] Furthermore, according to this embodiment, the multiple first notches 45 extend along the longitudinal direction of the mesh wiring section 20. In this case, the first notches 45 extend along the direction in which the current flows. Therefore, the current flowing through the power supply section 40 can be effectively distributed.

[0139] Furthermore, according to this embodiment, the power supply unit 40 has a first end 41 connected to the mesh wiring unit 20 and a second end 42 on the opposite side of the first end 41. In addition, a plurality of first notches 45 extend from the second end 42 along the direction toward the first end 41 (the longitudinal direction of the mesh wiring unit 20). This makes it easier for the resin material of the anisotropic conductive film 85c and the air that has entered between the power supply unit 40 and the power supply unit 40 to escape from between the power supply unit 85 and the power supply unit 40 via the second end 42 when the power supply line 85 is crimped to the power supply unit 40. In addition, it is possible to suppress the first notches 45 from adversely affecting the flow of current.

[0140] Furthermore, according to this embodiment, a plurality of linearly extending third notches 86 are formed in the metal wiring portion 85b of the power supply line 85. This widens the area through which current flows in the metal wiring portion 85b. As a result, the current flowing through the metal wiring portion 85b can be dispersed. This suppresses deterioration of the metal wiring portion 85b. Also, in a plan view, the third notches 86 extend along the first notches 45 and overlap the first notches 45. As a result, even if the resin material of the anisotropic conductive film 85c flows when the power supply line 85 is connected to the power supply unit 40, the conductive particles 85d of the anisotropic conductive film 85c interfere with the first notches 45 and the third notches 86. Therefore, the first notches 45 can suppress the movement of the conductive particles 85d of the anisotropic conductive film 85c.

[0141] Next, we will describe a modified example of a wiring board.

[0142] Figure 13 shows a first modified example of the wiring board. The modified example shown in Figure 13 differs in that the wiring board 10 further includes a ground section 50, while the other configurations are substantially the same as those shown in Figures 1 to 12 described above. In Figure 13, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 12, and detailed explanations are omitted.

[0143] In the wiring board 10 shown in Figure 13, the wiring board 10 further includes a ground portion (GND) 50 arranged on the first surface 11a of the substrate 11. In this case, multiple ground portions 50 may be arranged on the first surface 11a of the substrate 11 so as to sandwich the mesh wiring portion 20 from both sides in the X direction.

[0144] The ground portion 50 is, for example, made of a substantially rectangular conductive thin plate-like member. The longitudinal direction of the ground portion 50 may be parallel to the X direction or parallel to the Y direction. In the illustrated example, the longitudinal direction of the ground portion 50 is parallel to the Y direction.

[0145] Furthermore, the ground portion 50 is located at the longitudinal end (the negative Y-direction end) of the substrate 11. The material of the ground portion 50 can be, for example, a metallic material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals. The ground portion 50 may be formed in the same manner as the power supply portion 40.

[0146] Here, multiple linearly extending second notches 55 are formed in the ground portion 50. As a result, the area in the ground portion 50 through which current flows is widened due to the skin effect. Therefore, the current flowing through the ground portion 50 can be dispersed. As a result, deterioration of the ground portion 50 can be suppressed.

[0147] As shown in Figure 13, in the illustrated example, three second notches 55 are formed in each ground portion 50. The first notches 45 penetrate the ground portion 50 in the thickness direction (Z direction), and the transparent substrate 11 is exposed from each second notch 55. The number of second notches 55 formed in the ground portion 50 is not limited to this. For example, two second notches 55 may be formed in each ground portion 50, or four or more may be formed in each.

[0148] The multiple second notches 55 may extend along the longitudinal direction (Y direction) of the mesh wiring section 20.

[0149] The second notch 55 may extend from the end of the ground section 50 on the negative side in the Y direction. In the illustrated example, each second notch 55 is not formed over the entire area of ​​the ground section 50 in the Y direction, but only over a portion of the ground section 50 in the Y direction. Therefore, each second notch 55 terminates in the middle of the ground section 50. However, each second notch 55 may be formed over the entire area of ​​the ground section 50 in the Y direction. Furthermore, the length L8, width W8, pitch P5, and shape of the second notch 55 may be the same as those of the first notch 45. That is, the second notch 55 may extend along the width direction (X direction) of the mesh wiring section 20. Furthermore, the second notch 55 may extend along a direction that is not parallel to either the X direction or the Y direction. Furthermore, each of the second notches 55 may extend in a bent shape, a curved shape, or a wavy shape. Also, each of the second notches 55 may extend in different directions.

[0150] Furthermore, the width W8 of the second notch 55 may vary. In addition, each of the second notches 55 may have the same shape as the others, or they may have different shapes as the others. For example, the width W8 of each of the second notches 55 may be different from the others.

[0151] Figure 14 shows a second modified example of the wiring board. The modified example shown in Figure 14 differs in that a dividing portion 46 is formed in the first notch 45, dividing the first notch 45. The other configurations are substantially the same as those shown in Figures 1 to 13 described above. In Figure 14, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 13, and detailed explanations are omitted.

[0152] In the wiring board 10 shown in Figure 14, a dividing portion 46 is formed in the first notch 45, dividing the first notch 45. In this case, the current flowing through the power supply section 40 also flows through the dividing portion 46. This suppresses unevenness in the current distribution in the power supply section 40. This dividing portion 46 can be formed, for example, by appropriately setting the shape of the insulating layer 54 (see Figure 10(d)) when forming the first notch 45. The thickness of the dividing portion 46 may be equal to the thickness T5 of the power supply section 40 (see Figure 6).

[0153] Furthermore, the length L9 of the divided portion 46 in the longitudinal direction (Y direction) of the mesh wiring section 20 may be 0.5 μm or more and 100 μm or less, and for example, it may be 1 μm. By making the length L9 of the divided portion 46 100 μm or less, air that has entered between the power supply section 40 and the power supply line 85, as well as the resin material of the anisotropic conductive film, can be easily released from between the power supply section 40 and the power supply line 85.

[0154] Figures 15 and 16 show a third modified example of the wiring board. The modified examples shown in Figures 15 and 16 differ in that a dummy wiring section 30 is provided around the mesh wiring section 20; the other configurations are substantially the same as those shown in Figures 1 to 14 described above. In Figures 15 and 16, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 14, and detailed explanations are omitted.

[0155] In the wiring board 10 shown in Figure 15, a dummy wiring section 30 is provided around the mesh wiring section 20. Unlike the mesh wiring section 20, this dummy wiring section 30 does not function as an antenna in any substantial way.

[0156] As shown in Figure 16, the dummy wiring section 30 is composed of repeating dummy wiring 30a having a predetermined pattern shape. That is, the dummy wiring section 30 includes multiple dummy wiring 30a, and each dummy wiring 30a is electrically independent from the mesh wiring section 20 (first direction wiring 21 and second direction wiring 22). Furthermore, the multiple dummy wiring 30a are regularly arranged throughout the entire area of ​​the dummy wiring section 30. The multiple dummy wiring 30a are spaced apart from each other in the planar direction and are arranged to protrude from the substrate 11. That is, each dummy wiring 30a is electrically independent from the mesh wiring section 20, the power supply section 40, and other dummy wiring 30a. The shape of each dummy wiring 30a is approximately L-shaped in plan view.

[0157] In this case, the dummy wiring 30a has a shape in which a part of the pattern shape of the mesh wiring section 20 described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring section 20 and the dummy wiring section 30, and makes the mesh wiring section 20 placed on the substrate 11 less visible. As shown in Figure 16, the dummy wiring 30a extends parallel to the first direction wiring 21 or the second direction wiring 22. Specifically, the dummy wiring 30a includes a first portion 31a that extends parallel to the first direction wiring 21 and a second portion 32a that extends parallel to the second direction wiring 22. In this way, because the dummy wiring 30a extends parallel to the first direction wiring 21 or the second direction wiring 22, the mesh wiring section 20 placed on the substrate 11 can be made even less visible. The aperture ratio of the dummy wiring section 30 may be the same as or different from the aperture ratio of the mesh wiring section 20, but it is preferable that it is close to the aperture ratio of the mesh wiring section 20.

[0158] As shown in this modified example, by providing a dummy wiring section 30 electrically independent from the mesh wiring section 20 around the mesh wiring section 20, the outer edge of the mesh wiring section 20 can be obscured. This makes the mesh wiring section 20 less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring section 20 with the naked eye.

[0159] Figures 17 and 18 show a fourth modified example of the wiring board. The modified examples shown in Figures 17 and 18 differ in that multiple dummy wiring sections 30A and 30B with different opening ratios are provided around the mesh wiring section 20, while the other configurations are substantially the same as those shown in Figures 1 to 16 described above. In Figures 17 and 18, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 16, and detailed explanations are omitted.

[0160] In the wiring board 10 shown in Figure 17, multiple (in this case, two) dummy wiring sections 30A and 30B (first dummy wiring section 30A and second dummy wiring section 30B) with different aperture ratios are provided around the mesh wiring section 20. Specifically, the first dummy wiring section 30A is arranged around the mesh wiring section 20, and the second dummy wiring section 30B is arranged around the first dummy wiring section 30A. Unlike the mesh wiring section 20, these dummy wiring sections 30A and 30B do not substantially function as antennas.

[0161] As shown in Figure 18, the first dummy wiring section 30A is composed of repeating dummy wiring 30a1 having a predetermined pattern shape. The second dummy wiring section 30B is composed of repeating dummy wiring 30a2 having a predetermined pattern shape. That is, the dummy wiring sections 30A and 30B each contain multiple dummy wirings 30a1 and 30a2, and each dummy wiring 30a1 and 30a2 is electrically independent from the mesh wiring section 20. Furthermore, the dummy wirings 30a1 and 30a2 are regularly arranged throughout the entire area of ​​the dummy wiring sections 30A and 30B, respectively. Each dummy wiring 30a1 and 30a2 is spaced apart from each other in the planar direction and is positioned protruding from the substrate 11. Each dummy wiring 30a1 and 30a2 is electrically independent from the mesh wiring section 20, the power supply section 40, and other dummy wirings 30a1 and 30a2. The shapes of each dummy wire 30a1 and 30a2 are roughly L-shaped when viewed from above.

[0162] In this case, the dummy wiring 30a1 and 30a2 have a shape in which a part of the pattern shape of the mesh wiring section 20 described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring section 20 and the first dummy wiring section 30A, and the difference between the first dummy wiring section 30A and the second dummy wiring section 30B, and makes the mesh wiring section 20 placed on the substrate 11 less visible. As shown in Figure 18, the dummy wiring 30a1 and 30a2 extend parallel to the first direction wiring 21 or the second direction wiring 22. Specifically, the dummy wiring 30a1 includes a first portion 31a1 that extends parallel to the first direction wiring 21 and a second portion 32a1 that extends parallel to the second direction wiring 22. The dummy wiring 30a2 includes a first portion 31a2 extending parallel to the first direction wiring 21 and a second portion 32a2 extending parallel to the second direction wiring 22.

[0163] Furthermore, the area of ​​each dummy wire 30a1 in the first dummy wiring section 30A is larger than the area of ​​each dummy wire 30a2 in the second dummy wiring section 30B. In this case, the line width of each dummy wire 30a1 is the same as the line width of each dummy wire 30a2, but this is not limited to this, and the line width of each dummy wire 30a1 may be thicker than the line width of each dummy wire 30a2. Furthermore, the other configurations of the dummy wires 30a1 and 30a2 are the same as the configuration of the dummy wire 30a in the third modified example, so a detailed explanation is omitted here.

[0164] In this modified example, it is preferable that the aperture ratio of the mesh wiring section 20 and the multiple dummy wiring sections 30A and 30B gradually increases from the mesh wiring section 20 toward the dummy wiring sections 30A and 30B that are further away from the mesh wiring section 20. In other words, it is preferable that the aperture ratio of each dummy wiring section gradually increases from those closer to the mesh wiring section 20 toward those further away. In this case, it is preferable that the aperture ratio of the first dummy wiring section 30A is greater than the aperture ratio of the mesh wiring section 20. It is also preferable that the aperture ratio of the second dummy wiring section 30B is greater than the aperture ratio of the first dummy wiring section 30A. This makes the outer edges of the mesh wiring section 20 and the dummy wiring sections 30A and 30B even more indistinct. As a result, the mesh wiring section 20 can be made even less visible on the surface of the image display device 60.

[0165] In this way, by arranging dummy wiring sections 30A and 30B that are electrically independent from the mesh wiring section 20, the outer edge of the mesh wiring section 20 can be made more indistinct. As a result, the mesh wiring section 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring section 20 with the naked eye. In addition, three or more dummy wiring sections with different aperture ratios may be provided around the mesh wiring section 20.

[0166] Figure 19 shows a fifth modified example of the wiring board. The modified example shown in Figure 19 differs in the planar shape of the mesh wiring section 20, but the other components are substantially the same as those shown in Figures 1 to 18 described above. In Figure 19, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 18, and detailed explanations are omitted.

[0167] In Figure 19, the first directional wiring 21 and the second directional wiring 22 intersect at an angle (not perpendicular), and each opening 23 is formed in a rhombus shape in plan view. Neither the first directional wiring 21 nor the second directional wiring 22 are parallel to either the X or Y direction, but either one of the first directional wiring 21 or the second directional wiring 22 may be parallel to either the X or Y direction.

[0168] The multiple components disclosed in the above embodiments and each of the variations can be combined as needed. Alternatively, some components may be removed from all the components shown in the above embodiments and each of the variations.

Claims

1. A wiring board, A substrate including a first surface and a second surface located opposite the first surface, A plurality of mesh wiring sections are arranged spaced apart from each other on the first surface of the substrate, Multiple power supply units electrically connected to the mesh wiring section, The substrate comprises a ground portion disposed on the first surface of the substrate, The aforementioned wiring board has an electromagnetic wave transmission and reception function, The substrate is transparent, The aforementioned mesh wiring section is configured as an antenna. Each of the aforementioned mesh wiring sections and each of the power supply sections are connected individually. A wiring board having a plurality of linearly extending second notches formed in the ground portion.

2. The wiring board according to claim 1, wherein the wiring board has millimeter-wave transmitting and receiving functions, and the mesh wiring section is configured as an array antenna.

3. The power supply section has a plurality of linearly extending first notches formed therein. The wiring board according to claim 1, wherein the power supply section has a first end connected to the mesh wiring section and a second end opposite to the first end, and the plurality of first notches extend from the second end along a direction toward the first end.

4. The power supply section has a plurality of linearly extending first notches formed therein. The wiring board according to claim 1, wherein a dividing portion is formed in the first notch portion, dividing the first notch portion.

5. The wiring board according to claim 1, wherein the distance between the mesh wiring portions is 1 mm or more and 5 mm or less.

6. The wiring board according to claim 1, wherein a dummy wiring section is provided around the mesh wiring section, electrically independent from the mesh wiring section.

7. The wiring board according to claim 6, wherein a plurality of dummy wiring sections are provided, and the opening ratio of the mesh wiring section and the dummy wiring section increases in stages from the mesh wiring section toward the dummy wiring section further away from the mesh wiring section.

8. A wiring board according to any one of claims 1 to 7, A module comprising a power supply line electrically connected to the power supply section of the wiring board.

9. A wiring board according to claim 3 or 4, A module comprising a power supply line electrically connected to the power supply section of the wiring board.

10. The module according to claim 9, wherein the power supply line comprises a base material and a metal wiring portion laminated on the base material, the metal wiring portion has a plurality of linearly extending third notches, the width of the third notches is less than or equal to the width of the first notches, and in a plan view, the third notches extend along the first notches and overlap the first notches.

11. The module according to claim 9, wherein the power supply line is electrically connected to the power supply section via an anisotropic conductive film containing conductive particles, and the width of the first notch is 0.5 times or more and 1 time or less the average particle diameter of the conductive particles.

12. The module according to claim 9, An image display device comprising a display device laminated on the wiring board of the module.

Images