Methods for separating compositions, adhesives, cured products, and components, methods for manufacturing components, and methods for manufacturing components for processing.

Abstract

To provide a composition that exhibits excellent peelability and decomposition properties. [Solution] A composition comprising (A) a polyfunctional ester-type thiol compound having two or more ester-type thiol groups in its molecule, (B) a reactive compound having a group that reacts with the ester-type thiol group in its molecule, and (C) one or more film-forming aids selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol, wherein the ratio of the number of ester-type thiol groups in the (A) polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol group in the (B) reactive compound is 1.5:1 to 3.0:1, the content of (C) film-forming aids is 10 to 80 parts by mass when the content of the (B) reactive compound in the composition is 100 parts by mass, and the (B) reactive compound contains an epoxy resin.

Description

Technical Field

[0001] The present invention relates to a composition having excellent peelability and disassembly properties, an adhesive containing the composition, a cured product of the composition, a method for separating members, a method for manufacturing members, and a method for manufacturing processing members.

Background Art

[0002] Epoxy resins exhibit various properties such as excellent thermal, mechanical, and electrical properties, and thus their applications to various uses such as electric and electronic device materials, mechanical materials, civil engineering and construction materials, and daily necessities are being promoted. Further, when developing epoxy resins for various uses, in order to exhibit desired properties according to the purpose, it has been proposed to use a thiol-based compound as a curing agent. For example, Patent Document 1 describes a corrosion inhibitor used for the corrosion protection of coated electric wires, which is characterized by containing an epoxy resin as a main component and a thiol-based curing agent. Patent Document 2 describes a process for forming an elastic polymer by curing a reaction mixture containing a specific polyepoxide-terminated polyether, a curing agent containing a specific polythiol compound, and a base catalyst.

[0003] On the other hand, in the field of manufacturing electronic components such as semiconductor-related components and various substrate materials, a manufacturing method has been proposed in which an adhesive that can be easily removed by solution treatment or the like after curing is used for temporary adhesion between components required for manufacturing or temporary protection of specific components. For example, Patent Document 3 describes a process for producing an ingot by adhering a plurality of silicon wafers with an adhesive, a process for adhering the ingot to a base member using the adhesive, a process for cutting the central portion of each of the double-sided diffused silicon wafers constituting the ingot, and a process for removing the adhesive applied between the silicon wafers and the adhesive applied between the ingot and the base member to obtain a diffused wafer with single-sided diffusion. Further, Patent Document 4 describes a method for manufacturing a semiconductor device, which is characterized by having a process for forming an element on the main surface of a semiconductor wafer, a process for forming a protective member on the main surface of the semiconductor wafer, a process for performing a processing treatment on the back surface of the semiconductor wafer, and a process for removing the protective member. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2013-67847 [Patent Document 2] Special Publication No. 2016-501970 [Patent Document 3] Japanese Patent Application Publication No. 7-29837 [Patent Document 4] Japanese Patent Publication No. 2000-232085 [Overview of the project] [Problems that the invention aims to solve]

[0005] Epoxy resins exhibit excellent properties, making them desirable for use in the manufacturing processes of electronic components and other materials, as described above. However, removing highly durable, cured epoxy resins after use as adhesives or protective materials is not easy. Therefore, there has been a need for the development of epoxy resins with excellent peelability and disassembly properties that can be applied to fields such as the manufacturing of electronic components.

[0006] Therefore, the present invention aims to provide a composition that exhibits excellent peelability and demolition properties. [Means for solving the problem]

[0007] As a result of diligent research to solve the above problems, the present inventors have found that a composition containing a polyfunctional ester-type thiol compound, a reactive compound having a group that reacts with an ester-type thiol group in its molecule, and a specific film-forming aid in a specific ratio exhibits excellent peelability and decomposition properties, leading to the present invention. In other words, the present invention relates to a composition comprising (A) a polyfunctional ester-type thiol compound having two or more ester-type thiol groups in its molecule, (B) a reactive compound having a group that reacts with the ester-type thiol group in its molecule, and (C) one or more film-forming aids selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol, wherein the ratio of the number of ester-type thiol groups in the (A) polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol group in the (B) reactive compound is 1.5:1 to 3.0:1, the content of the (C) film-forming aid is 10 to 80 parts by mass when the content of the (B) reactive compound in the composition is 100 parts by mass, and the (B) reactive compound contains an epoxy resin. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a composition that is suitable for use in the manufacture of various electronic components and the like, and that exhibits excellent peelability and decomposition properties. [Modes for carrying out the invention]

[0009] (A) Polyfunctional ester-type thiol compounds The polyfunctional ester-type thiol compound used in the present invention is a polyfunctional thiol compound having two or more ester-type thiol groups in its molecule, and more specifically, a compound having two or more ester-type thiol groups represented by the following general formula (1) in its molecule.

[0010] [ka]

[0011] In the formula, R represents a linear alkylene group having 1 to 4 carbon atoms or a branched alkylene group having 2 to 4 carbon atoms. Examples of such groups include a methylene group, an ethylene group, a propylene group, a butylene group, a branched ethylene group, a branched propylene group, and a branched butylene group. In the present invention, by using a polyfunctional ester-type thiol compound having such a structure in combination with a reactive compound and a film-forming aid described later, a composition that can be peeled off with an alkaline solution even after curing can be obtained. In the present invention, from the viewpoint of obtaining a composition with superior peelability, the polyfunctional ester-type thiol compound preferably has an ester-type thiol group in the molecule in which R in general formula (1) is a methylene group, an ethylene group, a propylene group, or a butylene group, more preferably an ester-type thiol group in which R is a methylene group or an ethylene group, and even more preferably an ester-type thiol group in which R is an ethylene group. Furthermore, two or more polyfunctional ester-type thiol compounds with different R values ​​in general formula (1) may be used, for example, a polyfunctional ester-type thiol compound having an ester-type thiol group where R in general formula (1) is a methylene group and a polyfunctional ester-type thiol compound having an ester-type thiol group where R in general formula (1) is an ethylene group.

[0012] The number of ester-type thiol groups represented by general formula (1) in the polyfunctional ester-type thiol compound used in the present invention is not particularly limited as long as there are two or more, and can be appropriately adjusted according to the purpose. From the viewpoint of obtaining a composition with superior peelability, it is preferable to use a polyfunctional ester-type thiol compound having 2 to 8 ester-type thiol groups represented by general formula (1) in the molecule, more preferably a polyfunctional ester-type thiol compound having 3 to 6 ester-type thiol groups, and even more preferably a polyfunctional ester-type thiol compound having 2 to 4 ester-type thiol groups. Furthermore, two or more polyfunctional ester-type thiol compounds with different numbers of ester-type thiol groups represented by general formula (1) may be used, for example, a polyfunctional ester-type thiol compound having 3 ester-type thiol groups represented by general formula (1) and a polyfunctional ester-type thiol compound having 4 ester-type thiol groups represented by general formula (1).

[0013] The molecular weight of the polyfunctional ester-type thiol compound used in the present invention is not particularly limited and can be adjusted as appropriate depending on the purpose. From the viewpoint of obtaining a composition with superior peeling and decomposition properties, the molecular weight of the polyfunctional ester-type thiol compound is preferably 220 to 2000, more preferably 240 to 1000, even more preferably 280 to 800, and still more preferably 300 to 600.

[0014] The polyfunctional ester-type thiol compounds used in the present invention include, specifically, ethylene glycol bis(3-mercaptopropionate) (CAS No. 22504-50-3), 1,4-butanediol bis(thioglycolate) (CAS No. 10193-95-0), tetraethylene glycol bis(3-mercaptopropionate) (CAS No. 68891-92-9), 1,4-bis(3-mercaptobutyryloxy)butane (CAS No. 594836-83-6), trimethylolpropane tris(3-mercaptopropionate) (CAS No. 33007-83-9), and trimethylolpropane tris(3-mercaptobutyrate) (CAS No. 594836-83-6). Examples include (CAS No. 590678-06-1), 1,3,5-tris(2-(3-sulfanylbutanoyloxy)ethyl)-1,3,5-triazinan-2,4,6-trione (CAS No. 928339-75-7), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (CAS No. 36196-44-8), pentaerythritol tetrakis(3-mercaptopropionate) (CAS No. 7575-23-7), pentaerythritol tetrakis(3-mercaptobutyrate) (CAS No. 31775-89-0), and dipentaerythritol hexakis(3-mercaptopropionate) (CAS No. 25359-71-1).In the present invention, among these, from the viewpoint of obtaining a composition with superior peelability and decomposition properties, the polyfunctional ester-type thiol compounds are selected as follows: ethylene glycol bis(3-mercaptopropionate), 1,4-butanediol bis(thioglycolate), tetraethylene glycol bis(3-mercaptopropionate), 1,4-bis(3-mercaptobutyryloxy)butane, trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane It is preferable to use one or more selected from the group consisting of tris(3-mercaptobutyrate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), and dipentaerythritol hexakis(3-mercaptopropionate), and ethylene glycol bis(3-mercaptopropionate), te Traethylene glycol bis(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), and dipentaerythritol hexakis(3-mercaptopropionate) It is more preferable to use one or more selected from the group consisting of lucaptopropionates, and it is even more preferable to use one or more selected from the group consisting of tetraethylene glycol bis(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate and pentaerythritol tetrakis(3-mercaptopropionate).

[0015] The content of the (A) polyfunctional ester-type thiol compound in the composition of the present invention is not particularly limited and can be adjusted as appropriate depending on the purpose. Specifically, the content of the (A) polyfunctional ester-type thiol compound relative to the total amount of the composition of the present invention can be 40 to 75% by mass. In the present invention, from the viewpoint of obtaining a composition with superior peelability, the content of the (A) polyfunctional ester-type thiol compound relative to the total amount of the composition of the present invention is preferably 44 to 70% by mass, more preferably 48 to 65% by mass, and even more preferably 50 to 60% by mass.

[0016] (B) Reactive compounds The reactive compound used in the present invention is a reactive compound having a group that reacts with an ester-type thiol group in its molecule, and in this invention, the reactive compound is specifically characterized by containing an epoxy resin. The epoxy resin that can be used in this invention is not particularly limited as long as it is a compound having at least one epoxy group in its molecule, and for example, aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and polymers thereof can be used as epoxy resins. The epoxy equivalent of the epoxy resin is not particularly limited and can be adjusted as appropriate depending on the purpose. From the viewpoint of obtaining a composition with superior peelability, the epoxy equivalent of the epoxy resin is preferably 80 to 400 g / eq, more preferably 85 to 300 g / eq, and even more preferably 90 to 200 g / eq.

[0017] The aromatic epoxy compounds that can be used in the present invention are not particularly limited as long as they are compounds having an epoxy group and an aromatic ring in their molecule. In this case, the aromatic ring is not particularly limited as long as it is an aromatic ring, and examples include benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, pyrene rings, etc., and the hydrogen atoms constituting the aromatic ring in these may be substituted with alkyl groups having 1 to 4 carbon atoms (e.g., methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, etc.), halogen atoms (e.g., fluorine atom, chlorine atom, bromine atom, elemental atom, etc.). Furthermore, the aromatic ring may be an aromatic ring containing heteroatoms such as nitrogen atoms, oxygen atoms, and sulfur atoms in its ring structure. Examples include pyrrole, furan, thiophene, imidazole, pyrazole, oxazole, isoxazole, thiazole, isothiazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, quinoline, coumarin, chromone, indole, benzodiazepine, benzimidazole, purine, acridine, phenoxazine, phenothiazine, etc.

[0018] Examples of aromatic epoxy compounds that can be used in the present invention include glycidyl ethers of monovalent phenols such as phenol, cresol, butylphenol, and aminophenol, or their alkylene oxide adducts; polyglycidyl ethers of polyvalent phenols having at least one aromatic ring, such as bisphenol A, or their alkylene oxide adducts; phenol novolac type epoxy compounds; dicyclopentadiene novolac type epoxy compounds; glycidyl ethers of phenols having two or more phenolic hydroxyl groups, such as resorcinol, hydroquinone, and catechol; polyglycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups, such as benzenedimethanol, benzenediethanol, and benzenedibutanol; polyglycidyl esters of polybasic acid aromatic compounds having two or more carboxylic acids, such as phthalic acid, terephthalic acid, and trimellitic acid; glycidyl esters of benzoic acids, such as benzoic acid, toluic acid, and naphthoic acid; and epoxides of styrene oxide or divinylbenzene.

[0019] In the present invention, as the aromatic epoxy compound, an aromatic epoxy compound obtained by manufacturing by a known method may be used, or a commercially available product may be used. Examples of commercially available products include Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX-1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat 1012 (manufactured by Nagase ChemteX Corporation); Ogsool PG-100, Ogsool EG-200, Ogsool EG-210, Ogsool EG-250 (manufactured by Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D, HP4700, Epiklon N-665, Epiklon HP-7200 (manufactured by DIC Corporation); YX8800 (manufactured by Mitsubishi Chemical Corporation); Marproof G-0105SA, Marproof G-0130SP (manufactured by NOF Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, EPPN-201, EPPN-202, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (manufactured by Nippon Kayaku Co., Ltd.); Adeka Resin EP-3950S, Adeka Resin EP-4000, Adeka Resin EP-4003S, Adeka Resin EP-4005, Adeka Resin EP-4088L, Adeka Resin EP-4100, Adeka Resin EP-4100E, Adeka Resin EP-4901 (manufactured by Adeka Corporation); EPOX-MX R710, EPOX-MK-R1710, TECHMORE VG-3101L (manufactured by Printteck Co., Ltd.), etc. can be used.

[0020] As the alicyclic epoxy compound that can be used in the present invention, any compound having an epoxy group and an alicyclic ring without aromaticity in the molecule can be used without particular limitation. At this time, the alicyclic ring without aromaticity may be a saturated alicyclic ring or an unsaturated alicyclic ring, and may also be an alicyclic ring containing heteroatoms such as nitrogen atoms, oxygen atoms, sulfur atoms, etc. in the ring structure. Examples of the saturated alicyclic ring include cycloalkanes such as cyclobutane, cyclopentane, cyclopentene, cyclohexane, cyclohexene, cyclooctane, cyclooctene; bicycloheptane, trimethylbicyclo[2.2.1]heptane, isobornane, adamantane, tricyclodecane, tetracyclododecane, decalin, tetrahydrodicyclopentadiene, etc. Examples of the unsaturated alicyclic ring include cycloalkenyls such as cyclopentenyl, cyclopentadienyl, cyclohexenyl, etc., and cyclopentadiene, dicyclopentadiene, etc. Examples of the alicyclic ring containing heteroatoms in the ring structure include piperidine, piperazine, morpholine, quinuclidine, pyrrolidine, dioxane, dithiane, hexahydro-1,3,5-triazine, trioxane, trithiane, etc.

[0021] Examples of alicyclic epoxy compounds that can be used in the present invention include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, and 2-(3,4-epoxycyclo Examples include hexyl-5,5-spiro-3,4-epoxy)cyclohexane-methadioxane, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, methylenebis(3,4-epoxycyclohexane), dicyclopentadienediepoxide, ethylenebis(3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, 3,4-epoxycyclohexylmethyl acrylate, and 3,4-epoxycyclohexylmethyl methacrylate.

[0022] In the present invention, the alicyclic epoxy compound may be an alicyclic epoxy compound obtained by a known method, or a commercially available product may be used. Examples of commercially available products include UVR-6100, UVR-6105, UVR-6110, UVR-6128, UVR-6200 (all manufactured by Union Carbide), Celoxide 2021, Celoxide 2021P, Celoxide 2081, and Celoxide 208 3. Celoxide 2085, Celoxide 2000, Celoxide 3000, Cyclomer A200, Cyclomer M100, Cyclomer M101, Epolid GT-301, Epolid GT-302, Epolid 401, Epolid 403, ETHB, Epolid HD300 (all manufactured by Daicel Corporation), KRM-2110, KRM-2199 (all manufactured by ADEKA Corporation), etc. can be used.

[0023] The aliphatic epoxy compounds that can be used in the present invention are not particularly limited as long as they have an epoxy group in their molecule and do not have a carbon ring containing an aromatic ring. Examples of such aliphatic epoxy compounds include glycidyl ethers of aliphatic alcohols and polyglycidyl ethers of aliphatic polyhydric alcohols or their alkylene oxide adducts. More specifically, examples include glycidyl ethers of polyhydric alcohols such as allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12-13 mixed alkyl glycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, and diglycidyl ether of neopentyl glycol; polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane, and glycerin; monoglycidyl ethers of aliphatic higher alcohols; and epoxidized polybutadiene. Other examples include compounds having a tricyclodecane structure and a glycidyl ether group, such as dimethylol tricyclodecane diglycidyl ether and tricyclodecane diglycidyl ether. In addition, hydrogenated aromatic epoxy compounds such as hydrogenated bisphenol A diglycidyl ether can also be used as the above aliphatic epoxy compounds.

[0024] In the present invention, the aliphatic epoxy compound may be an aliphatic epoxy compound obtained by a known method, or a commercially available product may be used. Examples of commercially available products include Denacol EX-121, Denacol EX-171, Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, and Denacol E X-830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (all manufactured by Nagase ChemteX Corporation); Epolite M-1230, Epolite 40E, Epolite 100E, Epolite 200E, Epolite 400E, Epolite 70P, Epolite 200P, Epolite 400P, Epolite 1500NP, Epolite 1600, Epolite 80MF, Epolite 100MF (all manufactured by Kyoeisha Chemical Co., Ltd.), Adekaglycirol ED-503, Adekaglycirol ED-503G, Adekaglycirol ED-506, Adekaglycirol ED-523T (all manufactured by ADEKA Corporation), etc. can be used.

[0025] In the present invention, as the epoxy resin used as the reactive compound, it is preferable to use one or more selected from the group consisting of aromatic epoxy compounds and alicyclic epoxy compounds, from the viewpoint of obtaining a composition with superior peelability among the epoxy compounds described above, more preferably one or more aromatic epoxy compounds, and even more preferably one or more selected from the group consisting of glycidyl ethers of aminophenols, polyglycidyl ethers of alkylene oxide adducts of bisphenol A, and dicyclopentadiene novolac type epoxy compounds.

[0026] The reactive compound used in the present invention may contain, in addition to epoxy resins, other resins having a group that reacts with ester-type thiol groups in its molecule. Examples of such other resins include compounds having vinyl groups, acrylate groups, methacrylate groups, etc., in their molecule as the group that reacts with ester-type thiol groups. Among these, compounds having vinyl groups in their molecule (excluding compounds having acrylate groups or methacrylate groups) may be compounds having one vinyl group in their molecule, or compounds having two or more vinyl groups in their molecule. Examples include vinyl acetate, fumaric acid, maleic acid, itaconic acid, vinyl ketone, vinylpyridine, styrene, α-methylstyrene, vinyltoluene, monoalkyl esters of fumaric acid, dialkyl esters of fumaric acid, monoalkyl esters of maleic acid, dialkyl esters of maleic acid, monoalkyl esters of itaconic acid, dialkyl esters of itaconic acid, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, and polymers thereof.

[0027] Furthermore, compounds having an acrylate group or methacrylate group in the molecule may be compounds having one acrylate group or methacrylate group in the molecule (hereinafter sometimes collectively referred to as "(meth)acrylate group"), or compounds having two or more (meth)acrylate groups in the molecule. Examples include alkyl acrylates or alkyl methacrylates having a linear or branched alkyl group with 1 to 30 carbon atoms (hereinafter sometimes acrylates and methacrylates are collectively referred to as "(meth)acrylate"), hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, methoxyethyl (meth)acrylate, ethoxyethyl Examples include di(meth)acrylate, ethoxyethoxyethyl(meth)acrylate, ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylol tri(meth)acrylate, pentaerythritol tetrakis(meth)acrylate, dipentaerythritol hexakis(meth)acrylate, and polymers thereof.

[0028] The (B) reactive compound used in the present invention may consist of one or more epoxy resins, and may also contain other resins having a group that reacts with an ester-type thiol group in its molecule. In the present invention, from the viewpoint of obtaining a composition with superior peelability, the mass ratio of epoxy resin to other resins in the reactive compound is preferably 100:0 to 50:50, more preferably 100:0 to 80:20, even more preferably 100:0 to 90:10, and particularly preferably 100:0 (the reactive compound consists only of epoxy resin).

[0029] The content of the reactive compound (B) in the composition of the present invention is not particularly limited and can be adjusted as appropriate depending on the purpose. Specifically, the content of the reactive compound (B) relative to the total amount of the composition of the present invention can be 18 to 44% by mass. In the present invention, from the viewpoint of obtaining a composition with superior peelability and decomposition properties, the content of the reactive compound (B) relative to the total amount of the composition of the present invention is preferably 20 to 42% by mass, more preferably 22 to 40% by mass, and even more preferably 25 to 38% by mass.

[0030] (C) Film-forming agent The film-forming aid used in the present invention is one or more selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol. In the present invention, by using such a film-forming aid, when a composition containing (A) a polyfunctional ester-type thiol compound and (B) a reactive compound is cured, it is possible to obtain a composition that can maintain a film shape to a degree that can be used as an adhesive, and that has excellent peelability and delamination properties.

[0031] Examples of imidazole-based curing agents include 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 1-cyanoethyl-2 -methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'- Methylimidazolyl-(1')-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate adduct, 2-phenylimidazole Examples include isocyanuric acid adducts, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-dihydroxymethylimidazole, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl-s-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, and others, and one or more of these can be used. In the present invention, epoxy adduct-type imidazole compounds, which are reaction products of these imidazole compounds and epoxy compounds, may be used as imidazole-based curing agents, or commercially available products such as ADEKA Hardener EH-5011S and ADEKA Hardener EH-5046S (both manufactured by ADEKA Corporation) may be used.

[0032] Examples of amine-based curing agents include phenylenediamine, paraphenylenediamine, metaxylenediamine, paraxylenediamine, diethyltoluenediamine, diethylenetriamine, triethylenetetramine, isophoronediamine, BF3-amine complex, guanidine derivatives, guanamine derivatives, etc., and one or more of these can be used.

[0033] Examples of amide-based curing agents include dicyandiamide and polyamide resins synthesized from a linolenic acid dimer and ethylenediamine, and one or more of these can be used.

[0034] Examples of phenolic curing agents include bisphenol A, bisphenol F, bisphenol S, resorcinol, catechol, hydroquinone, fluorenebisphenol, 4,4'-biphenol, 4,4',4”-trihydroxytriphenylmethane, naphthalenediol, 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, calixarene, phenol novolac resin, cresol novolac resin, aromatic hydrocarbon formaldehyde resin-modified phenol resin, and dicyclopentadienephenol addition. Examples of polyhydric phenol compounds include molded resins, phenol aralkyl resins, resorcinol novolac resins, naphthol aralkyl resins, trimethylol methane resins, tetraphenyloleethane resins, naphthol novolac resins, naphthol-phenol co-condensed novolac resins, naphthol-cresol co-condensed novolac resins, biphenyl-modified phenol resins, biphenyl-modified naphthol resins, aminotriazine-modified phenol resins, and alkoxy-group-containing aromatic ring-modified novolac resins, and one or more of these can be used.

[0035] Examples of acid anhydride-based curing agents include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride, and one or more of these can be used.

[0036] Polyethylene glycols of various molecular weights can be used. From the viewpoint of obtaining a composition with superior peelability, it is preferable to use polyethylene glycol with a number average molecular weight of 120 to 30,000, more preferable to use polyethylene glycol with a number average molecular weight of 120 to 5,000, even more preferable to use polyethylene glycol with a number average molecular weight of 160 to 1,000, and particularly preferable to use polyethylene glycol with a number average molecular weight of 200 to 600.

[0037] Polypropylene glycols of various molecular weights can be used. From the viewpoint of obtaining a composition with superior peelability, it is preferable to use polypropylene glycol with a number average molecular weight of 180 to 100,000, more preferably polypropylene glycol with a number average molecular weight of 240 to 30,000, even more preferably polypropylene glycol with a number average molecular weight of 300 to 10,000, and particularly preferably polypropylene glycol with a number average molecular weight of 400 to 3,000.

[0038] Polyglycerin of various molecular weights can be used. From the viewpoint of obtaining a composition with superior peelability, it is preferable to use polyglycerin with a number average molecular weight of 240 to 50,000, more preferably polyglycerin with a number average molecular weight of 320 to 10,000, even more preferably polyglycerin with a number average molecular weight of 400 to 5,000, and particularly preferably polyglycerin with a number average molecular weight of 400 to 1,500.

[0039] The polyvinyl alcohol is not particularly limited, and polyvinyl alcohols of various molecular weights can be used. From the viewpoint of obtaining a composition with superior peelability, it is preferable to use polyvinyl alcohol with a number average molecular weight of 300 to 50,000, more preferably polyvinyl alcohol with a number average molecular weight of 500 to 10,000, even more preferably polyvinyl alcohol with a number average molecular weight of 1,000 to 5,000, and particularly preferably polyvinyl alcohol with a number average molecular weight of 1,500 to 2,000.

[0040] The (C) film-forming aid used in the present invention may be one or more selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol. However, from the viewpoint of obtaining a composition with superior peelability, it is preferable to use a film-forming aid containing one or more selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, and acid anhydride-based curing agents (hereinafter sometimes collectively referred to as the "curing agent group"). In the present invention, when using one or more of the curing agents as (C) film-forming aids, a film-forming aid consisting of one or more of the curing agents may be used, and a film-forming aid containing one or more selected from the group consisting of polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol (hereinafter collectively referred to as "other film-forming aid group") may also be used. In the present invention, when using a film-forming aid containing one or more of the curing agents and one or more of the other film-forming aid group as (C) film-forming aids, the ratio of their content in the film-forming aid is not particularly limited and can be adjusted as appropriate depending on the purpose. For example, the amount used can be such that the mass ratio of the total amount of one or more of the curing agents and the total amount of one or more of the other film-forming aid group in the film-forming aid is 100:0 to 5:95.

[0041] The content of (C) film-forming aid in the composition of the present invention is not particularly limited and can be adjusted as appropriate depending on the purpose. Specifically, the content of (C) film-forming aid relative to the total amount of the composition of the present invention can be 2 to 30% by mass. In the present invention, from the viewpoint of obtaining a composition with superior peelability, the content of (C) film-forming aid relative to the total amount of the composition of the present invention is preferably 3 to 25% by mass, more preferably 4 to 20% by mass, and even more preferably 6 to 15% by mass.

[0042] In the composition of the present invention, the ratio of the number of ester-type thiol groups of (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups of (B) the reactive compound is 1.5:1 to 3.0:1. With this configuration, the composition of the present invention can be made to have excellent peelability and delamination properties when cured. In the present invention, from the viewpoint of obtaining a composition with even better peelability and delamination properties, the ratio of the number of ester-type thiol groups of (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups of (B) the reactive compound is preferably 1.6:1 to 2.8:1, more preferably 1.6:1 to 2.4:1, and even more preferably 1.8:1 to 2.4:1.

[0043] In the composition of the present invention, the content of (C) film-forming aid is 10 to 80 parts by mass when the content of (B) reactive compound in the composition is 100 parts by mass. With this configuration, the composition of the present invention can be made into a composition that exhibits excellent peelability and delamination of the cured product after curing. In the present invention, from the viewpoint of obtaining a composition with even better peelability and delamination, the content of (C) curing agent in the composition is preferably 15 to 60 parts by mass, more preferably 20 to 50 parts by mass, and even more preferably 24 to 40 parts by mass when the content of (B) reactive compound in the composition is 100 parts by mass.

[0044] In the composition of the present invention, the ratio of the content of (A) a polyfunctional ester-type thiol compound, (B) a reactive compound, and (C) a film-forming aid in the composition can be adjusted as appropriate. From the viewpoint of obtaining a composition with superior peelability, the mass ratio of (A) a polyfunctional ester-type thiol compound, (B) a reactive compound, and (C) a film-forming aid in the composition is preferably 40-75:18-44:2-30, more preferably 44-70:20-42:3-25, even more preferably 48-65:22-40:4-20, and particularly preferably 50-60:25-38:6-15, when the total mass of (A) a polyfunctional ester-type thiol compound, (B) a reactive compound, and (C) a film-forming aid is 100.

[0045] In addition to the above-mentioned (A) polyfunctional ester-type thiol compound, (B) reactive compound, and (C) film-forming aid, the composition of the present invention may also contain other components such as (D) modifiers and solvents, depending on the purpose. Examples of (D) modifiers that can be used in the present invention include silica, alumina, nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, calcium carbonate, magnesium carbonate, aluminum carbonate, calcium sulfate, magnesium sulfate, calcium hydroxide, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium silicate, magnesium silicate, mica, talc, kaolin, clay, carbon black, etc. Surface-treated versions of these (e.g., hydrophobic silica, hydrophilic silica, etc.) can also be used. In the present invention, from the viewpoint of obtaining a composition with superior peelability, it is preferable to use one or more selected from the group consisting of hydrophobic silica, hydrophilic silica, mica, talc, alumina, titanium oxide, and zinc oxide as the (D) modifier, more preferably to use one or more selected from the group consisting of hydrophobic silica, mica, alumina, talc, and titanium oxide, and even more preferably to use one or more selected from the group consisting of hydrophobic silica, mica, alumina, and talc.

[0046] When the composition of the present invention contains a modifier (D), the content of the modifier (D) in the composition of the present invention is not particularly limited and can be adjusted as appropriate depending on the purpose. Specifically, the content of the modifier (D) relative to the total amount of the composition of the present invention can be 0.1 to 20% by mass. In the present invention, from the viewpoint of obtaining a composition with superior peelability and demolition properties, the content of the modifier (D) relative to the total amount of the composition of the present invention is preferably 0.5 to 15% by mass, more preferably 1 to 10% by mass, and even more preferably 2 to 8% by mass.

[0047] If the composition of the present invention contains (D) a modifier, the ratio of the content of (A) a polyfunctional ester-type thiol compound, (B) a reactive compound, (C) a film-forming aid, and (D) a modifier in the composition of the present invention can be adjusted as appropriate. From the viewpoint of obtaining a composition with superior peelability and decomposition properties, the mass ratio of (A) polyfunctional ester-type thiol compound, (B) reactive compound, (C) film-forming aid, and (D) modifier in the composition is preferably 40-75:18-44:2-30:0.1-20, more preferably 44-70:20-42:3-25:0.5-15, even more preferably 48-65:22-40:4-20:1-10, and particularly preferably 50-60:25-38:6-15:2-8, when the total mass of (A) polyfunctional ester-type thiol compound, (B) reactive compound, (C) film-forming aid, and (D) modifier is 100.

[0048] The solvents that can be used in the present invention are not particularly limited as long as they are known solvents, but for example, ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone; ether solvents such as ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether and dipropylene glycol dimethyl ether; ester solvents such as methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate and texanol; cellosolve solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, iso- or n-propanol, Examples of solvents include alcohol-based solvents such as iso- or n-butanol and amyl alcohol; ether ester-based solvents such as ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate and ethoxyethyl propionate; aromatic solvents such as benzene, toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane and cyclohexane; propylene carbonate, carbitol-based solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, and water, and one or more of these can be used.

[0049] When the composition of the present invention contains a solvent, the solvent content in the composition of the present invention is not particularly limited and can be adjusted as appropriate depending on the purpose. For example, the solvent content relative to the total amount of the composition of the present invention can be 1 to 80% by mass. In the present invention, when the composition of the present invention contains a solvent, from the viewpoint of obtaining a composition with superior peeling and demolition properties, the solvent content relative to the total amount of the composition of the present invention is preferably 2 to 70% by mass, more preferably 5 to 60% by mass, and even more preferably 10 to 50% by mass.

[0050] The composition of the present invention, having the configuration described above, exhibits excellent peelability and delamination. Here, excellent peelability and delamination means that when a cured product formed by curing the composition comes into contact with an acidic solution or an alkaline solution, part or all of the cured product dissolves in the acidic solution or alkaline solution, making it possible to peel or delaminate. Specifically in the present invention, it means that when the composition is applied to a material such as a substrate and cured, the resulting cured product (cured product adhered to the substrate) can be peeled off (delaminated) from the substrate by coming into contact with an acidic solution or an alkaline solution, causing part or all of it to dissolve. In particular, since the cured product formed by curing the composition of the present invention can be peeled off and delaminated by coming into contact with an alkaline solution, it can be used in various applications where such peelability and delamination are required.

[0051] The method for producing the composition of the present invention is not particularly limited, and it can be produced by stirring, melting, mixing, and dispersing (A) a polyfunctional ester-type thiol compound, (B) a reactive compound, (C) a film-forming aid, and (D) other components such as modifiers and solvents, which may be added as needed, while heating as necessary. The apparatus used for stirring, melting, mixing, and dispersion in this case is not particularly limited, and for example, a stirrer, a raikaisher equipped with a heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill, a planetary agitator, etc., can be used, and these apparatuses may be used in appropriate combinations.

[0052] The uses of the composition of the present invention are not particularly limited and can be used in various applications where epoxy resin is used, such as paints, adhesives, sealants, coatings, fiber scrubbers, building materials, electronic components, resist materials, optical materials, etc. Among these, the composition of the present invention is preferably used as an adhesive for various purposes, specifically as an adhesive for optical-related components, liquid crystal-related components, electronic-related components, circuit-related components, semiconductor-related components, automotive-related components, etc. Furthermore, from the viewpoint of excellent peelability, the composition of the present invention is more preferably used as an easily peelable adhesive used in the manufacture of optical-related components, liquid crystal-related components, electronic-related components, circuit-related components, semiconductor-related components, automotive-related components, etc. In the present invention, an easily peelable adhesive refers to an adhesive that is applied to and cured on components for purposes such as temporarily bonding multiple components or temporarily protecting some components during the manufacturing process of various components such as optical-related components, liquid crystal-related components, electronic-related components, circuit-related components, semiconductor-related components, and automotive-related components, and then removed by peeling or other means. More specifically, an easily peelable and disassembled adhesive refers to an adhesive that can be suitably used in, for example, the bonding and separation methods of components, the manufacturing methods of components for processing, etc., as described later.

[0053] The adhesive of the present invention is an adhesive containing the above-described composition. Because the adhesive of the present invention contains the above-described composition, it exhibits excellent peelability and delamination properties after curing. In addition to the above-mentioned (A) polyfunctional ester-type thiol compounds, (B) reactive compounds, (C) film-forming aids, (D) modifiers and solvents, the adhesive of the present invention may also contain other additives depending on the purpose, such as pigments, colorants, pigment dispersants, plasticizers, leveling agents, processing stabilizers, thickeners, flow regulators, UV absorbers, UV stabilizers, antioxidants, anti-aging agents, antioxidants, rust inhibitors, antimicrobial preservatives, metal deactivators, anti-algal agents, wetting agents, defoaming agents, surfactants, foaming agents, reinforcing agents, lubricants, anti-fogging agents, corrosion inhibitors, peroxide decomposing agents, mold decolorizing agents, fluorescent whitening agents, polymerization inhibitors, fillers, metal chelating agents, organic flame retardants, inorganic flame retardants, antistatic agents, flame retardants, slip agents, antiblocking agents, heat-resistant stabilizers, antistatic agents, etc.

[0054] The adhesive of the present invention is not particularly limited in its applications and can be used in various applications in which known adhesives are used. For example, it can be used as an adhesive for optical components, liquid crystal components, electronic components, circuit components, semiconductor components, automotive components, and the like. The material of the substrate when using the adhesive of the present invention is not particularly limited, but for example, metal substrates such as aluminum, titanium, stainless steel, mild steel, and plated steel; inorganic materials such as carbon, glass, and silicon; polyesters such as diacetylcellulose, triacetylcellulose (TAC), propionylcellulose, butyrylcellulose, acetylpropionylcellulose, nitrocellulose, polyamide, polyimide, polyurethane, epoxy resin, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate, and polybutylene terephthalate; polystyrene; polymer materials such as polyethylene, polypropylene, polymethylpentene, polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, polymethyl methacrylate, polyacrylate, polycarbonate, polysulfone, polyethersulfone, polyetherketone, polyetherimide, polyoxyethylene, norbornene resin, and cycloolefin polymer (COP) can be used.

[0055] Furthermore, when the adhesive of the present invention is used as an adhesive for optical components, liquid crystal components, electronic components, circuit components, semiconductor components, automotive components, etc., it has the advantage that only the adhesive can be easily peeled off and disassembled when the component is disassembled and discarded after use, thus allowing for easy reuse of components other than the adhesive.

[0056] The cured product of the present invention is a cured product of the above-described composition, and more specifically, a cured product obtained by curing the above-described composition. Since the cured product of the present invention is a cured product obtained by curing the above-described composition, it has excellent peelability and delamination properties. In the present invention, the method for curing the above-described composition is not particularly limited, and known methods can be used, for example, a method of curing the composition by heating, a method of curing the composition by irradiating the composition with light, and a method combining these can be used.

[0057] The heating conditions in the method for curing the composition of the present invention by heating are not particularly limited and can be adjusted as appropriate. For example, a method can be used in which the composition is cured by heating it in an environment of 40°C to 250°C for 1 minute to 10 hours.

[0058] In the method for curing the composition of the present invention by light irradiation, the type of light used for irradiation is not particularly limited and can be selected according to the purpose. For example, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, metal halogen lamps, electron beam irradiation devices, X-ray irradiation devices, argon lasers, dye lasers, nitrogen lasers, LEDs, helium-cadmium lasers, etc., can be used. Furthermore, the irradiation conditions when irradiating with these lights are not particularly limited and can be adjusted as appropriate. For example, the integrated light intensity is 500 to 10,000 mJ / cm². 2 Methods of irradiation that result in this can be used.

[0059] When obtaining the cured product of the present invention by curing the above-described composition, a coating step of applying the above-described composition to a substrate may be included before curing. The specific method of the coating step of applying the composition to the substrate is not particularly limited and can be selected according to the purpose, but for example, a coating method using a spin coater, roll coater, bar coater, die coater, curtain coater, gravure coater, comma coater, knife coater, air knife coater, kiss coater, shower coater, flow coater, dipping, screen printing, applicator, etc. can be used. In this case, the amount of the above-described composition applied to the substrate is not particularly limited and can be adjusted as appropriate according to the purpose. For example, the amount applied can result in a cured product thickness of 0.001 μm to 20 mm.

[0060] Furthermore, in the coating process for applying the composition to a substrate, the substrate that can be used is not particularly limited and can be appropriately selected according to the purpose, but examples include: metal substrates such as aluminum, titanium, stainless steel, mild steel, and plated steel; inorganic materials such as carbon, glass, and silicon; diacetylcellulose, triacetylcellulose (TAC), propionylcellulose, butyrylcellulose, acetylpropionylcellulose, nitrocellulose, polyamide, polyimide, polyurethane, epoxy resin, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate. Substrates such as polyesters including poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate, and polybutylene terephthalate; polystyrene; polyethylene, polypropylene, polymethylpentene, polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, polymethyl methacrylate, polyacrylate, polycarbonate, polysulfone, polyethersulfone, polyetherketone, polyetherimide, polyoxyethylene, norbornene resin, and cycloolefin polymers (COP) can be used. Furthermore, these substrates may be subjected to surface activation treatments such as corona discharge treatment, flame treatment, ultraviolet treatment, high-frequency treatment, glow discharge treatment, activated plasma treatment, and laser treatment before the coating process.

[0061] The present invention provides a method for separating components, comprising the step of separating the first component and the second component by exfoliating and dismantling the adhesive layer contained in a laminate in which a first component, an adhesive layer containing a cured product of the above-described composition, and a second component are laminated in this order, by contacting the adhesive layer with an alkaline solution. The first component and the second component in the laminate used in the present invention are not limited, and various components can be used depending on the purpose, and their material and shape are not particularly limited. Examples of such components include optical components, liquid crystal components, electronic components, circuit components, semiconductor components, and automotive components. Furthermore, as materials, for example, metal substrates such as aluminum, titanium, stainless steel, mild steel, and plated steel; inorganic materials such as carbon, glass, and silicon; polyesters such as diacetylcellulose, triacetylcellulose (TAC), propionylcellulose, butyrylcellulose, acetylpropionylcellulose, nitrocellulose, polyamide, polyimide, polyurethane, epoxy resin, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate, and polybutylene terephthalate; polystyrene; polymer materials such as polyethylene, polypropylene, polymethylpentene, polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, polymethyl methacrylate, polyacrylate, polycarbonate, polysulfone, polyethersulfone, polyetherketone, polyetherimide, polyoxyethylene, norbornene resin, and cycloolefin polymer (COP) can be used. In this case, the laminate used in the present invention may have the same material and shape as the first member and the second member, or they may be different members. Furthermore, the laminate used in the present invention may have members or layers other than the first member, the second member, and the adhesive layer, depending on the purpose.

[0062] The adhesive layer in the laminate used in the present invention is an adhesive layer containing a cured product of the above-described composition, and may consist only of the cured product of the above-described composition, or may further contain other additives. Examples of other additives include pigments, colorants, pigment dispersants, plasticizers, leveling agents, processing stabilizers, thickeners, flow regulators, ultraviolet absorbers, ultraviolet stabilizers, antioxidants, anti-aging agents, antioxidants, rust inhibitors, antimicrobial preservatives, metal deactivators, anti-algal agents, wetting agents, defoaming agents, surfactants, foaming agents, reinforcing agents, lubricants, anti-fogging agents, corrosion inhibitors, peroxide decomposing agents, mold decolorizing agents, fluorescent whitening agents, polymerization inhibitors, fillers, metal chelating agents, organic flame retardants, inorganic flame retardants, antistatic agents, flame retardants, slip agents, antiblocking agents, heat-resistant stabilizers, antistatic agents, etc., and one or more of these may be included.

[0063] In the present invention, in the step of separating a first member and a second member by peeling off the adhesive layer contained in the laminate by contacting it with an alkaline solution, the alkaline solution that can be used is not particularly limited, and for example, an aqueous solution in which a compound exhibiting basicity in an aqueous solution is dissolved in water and has a pH of 7.1 to 14 can be used. In this case, the compound that exhibits basicity in aqueous solution is not particularly limited, and known basic compounds can be used. For example, inorganic alkalis such as sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide, sodium carbonate, potassium carbonate, calcium carbonate, magnesium carbonate, sodium bicarbonate, potassium bicarbonate, calcium bicarbonate, magnesium bicarbonate, sodium bicarbonate, potassium bicarbonate, calcium bicarbonate, magnesium bicarbonate, sodium sulfate, potassium sulfate, calcium sulfate, magnesium sulfate, sodium silicate, sodium metasilicate, and ammonia; primary amines such as ethylamine and n-propylamine; secondary amines such as diethylamine and di-n-butylamine; tertiary amines such as triethylamine and methyldiethylamine; alcohol amines such as dimethylethanolamine and triethanolamine; quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; and cyclic amines such as pyrrole and pyridine can be used.

[0064] In this process, from the viewpoint of efficiently peeling and dismantling the adhesive layer contained in the laminate, it is preferable to use an aqueous solution in which one or more basic compounds selected from the group consisting of sodium hydroxide, potassium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, calcium carbonate, sodium bicarbonate, potassium bicarbonate, calcium bicarbonate, ammonia, ethylamine, and n-propylamine are dissolved in water as the alkaline solution; it is more preferable to use an aqueous solution in which one or more basic compounds selected from the group consisting of sodium hydroxide, calcium hydroxide, sodium carbonate, calcium carbonate, sodium bicarbonate, calcium bicarbonate, and ammonia are dissolved in water; and it is even more preferable to use an aqueous solution in which one or more basic compounds selected from the group consisting of sodium hydroxide, calcium hydroxide, and ammonia are dissolved in water. Furthermore, in this process, from the viewpoint of more efficiently peeling and dismantling the adhesive layer contained in the laminate, it is preferable to use an alkaline solution with a pH of 8 to 14; it is more preferable to use an alkaline solution with a pH of 10 to 14; and it is even more preferable to use an alkaline solution with a pH of 12 to 14.

[0065] In this process, the conditions for contacting the adhesive layer contained in the laminate with an alkaline solution are not particularly limited and can be adjusted as appropriate. For example, a method can be used in which the adhesive layer contained in the laminate is contacted with an alkaline solution at 20 to 90°C for 10 seconds to 720 minutes. In this case, from the viewpoint of more efficiently peeling and dismantling the adhesive layer contained in the laminate, it is preferable to use a method in which the adhesive layer contained in the laminate is contacted with an alkaline solution at 30 to 85°C, preferably at 40 to 80°C, and even more preferable at 50 to 75°C. Furthermore, in this process, from the viewpoint of more efficiently peeling and dismantling the adhesive layer contained in the laminate, it is preferable to use a method in which the adhesive layer contained in the laminate is contacted with an alkaline solution for 30 seconds to 360 minutes, preferably at 1 minute to 120 minutes, and even more preferable at 2 minutes to 60 minutes.

[0066] The laminate used in the present invention is not particularly limited as long as it has a structure in which a first member, an adhesive layer containing a cured product of the above-described composition, and a second member are laminated in this order. For example, a laminate obtained by a known method using a first member, the above-described composition, and a second member can be used. A specific method for obtaining the laminate includes, for example, a step of applying the above-described composition to the first member, a step of placing the second member on the first member via the applied portion, and a step of bonding the first member and the second member by curing the applied coating film. These steps can include, for example, the methods described below.

[0067] The process of applying the above-mentioned composition to the first member can be any known method for adhesives, paints, etc., without particular limitation. For example, methods such as using a spin coater, roll coater, bar coater, die coater, curtain coater, gravure coater, comma coater, knife coater, air knife coater, kiss coater, shower coater, flow coater, dipping, screen printing, or an applicator can be used. In this case, the amount of the above-mentioned composition applied to the first member is not particularly limited and can be adjusted as appropriate depending on the purpose. For example, the amount applied can be such that the thickness of the cured product formed by curing the applied coating film is 0.001 μm to 20 mm.

[0068] The step of placing the second member on the first member via the coating portion is not particularly limited as long as it allows the second member to be placed so as to be in contact with the composition coated on the first member. For example, it may be done by hand, or by mechanically placing it using various devices.

[0069] The step of bonding the first member and the second member by curing the applied coating film can be any known method for adhesives, paints, etc., without particular limitation. For example, a method of curing the applied coating film by heating it, a method of curing the applied coating film by irradiating it with light, and a method combining these can be used. In the method of curing the applied coating film by heating it, the heating conditions are not particularly limited and can be adjusted as appropriate. For example, a method of curing the coating film by heating it in an environment of 40°C to 250°C for 1 minute to 10 hours can be used. In the present invention, from the viewpoint of sufficiently curing the applied coating film and preventing heat damage to the first member and the second member, it is preferable to heat the applied coating film in an environment of 80°C to 200°C, more preferably in an environment of 100°C to 180°C, and even more preferably in an environment of 120°C to 170°C. Furthermore, in the present invention, from the viewpoint of sufficiently curing the applied coating and preventing heat damage to the first and second members, the heating time is preferably 3 minutes to 5 hours, more preferably 5 minutes to 2 hours, and even more preferably 10 minutes to 1 hour.

[0070] Furthermore, in the method of curing the applied coating by light irradiation, the type of light used is not particularly limited and can be selected according to the purpose. For example, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, metal halogen lamps, electron beam irradiation devices, X-ray irradiation devices, argon lasers, dye lasers, nitrogen lasers, LEDs, helium-cadmium lasers, etc., can be used. Also, the irradiation conditions when irradiating with these lights are not particularly limited and can be adjusted as appropriate. For example, the integrated light intensity is 500 to 10,000 mJ / cm². 2 Methods of irradiation that result in this can be used.

[0071] In the laminate used in the present invention, as a step of bonding the first member and the second member by curing the applied coating film, from the viewpoint of being able to cure the above-mentioned composition more easily, it is preferable to use a method of curing by heating the applied coating film.

[0072] The present invention provides a method for separating components, which includes a step of separating the first component from the second component by peeling off the adhesive layer contained in a laminate formed by laminating a first component, an adhesive layer containing a cured product of the above-described composition, and a second component in that order, by bringing the adhesive layer into contact with an alkaline solution. This method allows for the separation of the first component from the second component without complicating the manufacturing process or the necessary equipment, and also suppresses damage to the components. The present invention also provides a method for separating components, which may further include a step of applying the above-described composition to the first component, a step of placing the second component on the first component via the applied portion, and a step of bonding the first component and the second component by curing the applied coating film.

[0073] The present invention provides a method for manufacturing a component, which includes a step of separating the first component and the second component by exfoliating the adhesive layer contained in a laminate, in which a first component, an adhesive layer containing a cured product of the above-described composition, and a second component are laminated in this order, by contacting the adhesive layer with an alkaline solution. The configurations of the first component, the second component, and the adhesive layer in the laminate used in the present invention are not particularly limited, and each can be, for example, one of the configurations listed in the above-described method for separating components. Furthermore, each step in the method for manufacturing a component of the present invention can also be, for example, one of the steps and methods listed in the above-described method for separating components.

[0074] The present invention provides a method for manufacturing a component, which includes a step of separating the first component from the second component by peeling off the adhesive layer contained in a laminate formed by laminating a first component, an adhesive layer containing a cured product of the above-described composition, and a second component in that order, by contacting it with an alkaline solution. This method allows for the manufacture of components (such as the first component) that need to be temporarily fixed to another component (such as the second component) during the manufacturing process, without complicating the manufacturing process or the necessary equipment, and enables the production of high-quality components by suppressing damage to the components during the manufacturing process. The present invention also provides a method for manufacturing a component that includes a step of applying the above-described composition to the first component, a step of placing the second component on the first component via the applied portion, and a step of bonding the first component and the second component by curing the applied coating.

[0075] The present invention provides a method for manufacturing a processing member, which includes a step of separating the processing member and the protective film by exfoliating and dismantling the protective film contained in a laminate formed by laminating the processing member and a protective film containing a cured product of the above-described composition, by contacting the protective film with an alkaline solution. The processing member in the laminate used in the present invention is not particularly limited, and various processing members can be used depending on the purpose, and their material and shape are not particularly limited. Examples of such processing members include optical processing members, liquid crystal processing members, electronic processing members, circuit processing members, semiconductor processing members, and automotive processing members. Furthermore, as materials, for example, metal substrates such as aluminum, titanium, stainless steel, mild steel, and plated steel; inorganic materials such as carbon, glass, and silicon; polyesters such as diacetylcellulose, triacetylcellulose (TAC), propionylcellulose, butyrylcellulose, acetylpropionylcellulose, nitrocellulose, polyamide, polyimide, polyurethane, epoxy resin, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate, and polybutylene terephthalate; polystyrene; polymer materials such as polyethylene, polypropylene, polymethylpentene, polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, polymethyl methacrylate, polyacrylate, polycarbonate, polysulfone, polyethersulfone, polyetherketone, polyetherimide, polyoxyethylene, norbornene resin, and cycloolefin polymer (COP) can be used. Furthermore, the laminate used in the present invention may have components or layers other than processing components and protective films, depending on the purpose.

[0076] The protective film in the laminate used in the present invention is a protective film containing a cured product of the above-described composition, and may consist only of the cured product of the above-described composition, or may further contain other additives. Examples of other additives include pigments, colorants, pigment dispersants, plasticizers, leveling agents, processing stabilizers, thickeners, flow regulators, ultraviolet absorbers, ultraviolet stabilizers, antioxidants, anti-aging agents, antioxidants, rust inhibitors, antimicrobial preservatives, metal deactivators, anti-algal agents, wetting agents, defoaming agents, surfactants, foaming agents, reinforcing agents, lubricants, anti-fogging agents, corrosion inhibitors, peroxide decomposing agents, mold decolorizing agents, fluorescent whitening agents, polymerization inhibitors, fillers, metal chelating agents, organic flame retardants, inorganic flame retardants, antistatic agents, flame retardants, slip agents, antiblocking agents, heat-resistant stabilizers, antistatic agents, etc., and one or more of these may be included.

[0077] In the present invention, in the step of separating a processing member from a protective film by peeling off the protective film contained in a laminate by contacting it with an alkaline solution, the alkaline solution that can be used is not particularly limited. For example, an aqueous solution in which a compound exhibiting basicity in an aqueous solution is dissolved in water and has a pH of 7.1 to 14 can be used. In this case, the compound exhibiting basicity is not particularly limited, and known basic compounds can be used. For example, inorganic alkalis such as sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide, sodium carbonate, potassium carbonate, calcium carbonate, magnesium carbonate, sodium bicarbonate, potassium bicarbonate, calcium bicarbonate, magnesium bicarbonate, sodium bicarbonate, potassium bicarbonate, calcium bicarbonate, magnesium bicarbonate, sodium sulfate, potassium sulfate, calcium sulfate, magnesium sulfate, sodium silicate, sodium metasilicate, and ammonia; primary amines such as ethylamine and n-propylamine; secondary amines such as diethylamine and di-n-butylamine; tertiary amines such as triethylamine and methyldiethylamine; alcohol amines such as dimethylethanolamine and triethanolamine; quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; and cyclic amines such as pyrrole and pyridine can be used.

[0078] In this process, from the viewpoint of efficiently peeling and dismantling the protective film contained in the laminate, it is preferable to use an aqueous solution in which one or more basic compounds selected from the group consisting of sodium hydroxide, potassium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, calcium carbonate, sodium bicarbonate, potassium bicarbonate, calcium bicarbonate, ammonia, ethylamine, and n-propylamine are dissolved in water as the alkaline solution; it is more preferable to use an aqueous solution in which one or more basic compounds selected from the group consisting of sodium hydroxide, calcium hydroxide, sodium carbonate, calcium carbonate, sodium bicarbonate, calcium bicarbonate, and ammonia are dissolved in water; and it is even more preferable to use an aqueous solution in which one or more basic compounds selected from the group consisting of sodium hydroxide, calcium hydroxide, and ammonia are dissolved in water. Furthermore, in this process, from the viewpoint of more efficiently peeling and dismantling the protective film contained in the laminate, it is preferable to use an alkaline solution with a pH of 8 to 14; it is more preferable to use an alkaline solution with a pH of 10 to 14; and it is even more preferable to use an alkaline solution with a pH of 12 to 14.

[0079] In this process, the conditions for contacting the protective film contained in the laminate with an alkaline solution are not particularly limited and can be adjusted as appropriate. For example, a method can be used in which the protective film contained in the laminate is contacted with an alkaline solution at 20 to 90°C for 10 seconds to 720 minutes. In this case, from the viewpoint of more efficiently peeling and dismantling the protective film contained in the laminate, it is preferable to use a method in which the protective film contained in the laminate is contacted with an alkaline solution at 30 to 85°C, preferably at 40 to 80°C, and even more preferable at 50 to 75°C. Furthermore, in this process, from the viewpoint of more efficiently peeling and dismantling the protective film contained in the laminate, it is preferable to use a method in which the protective film contained in the laminate is contacted with an alkaline solution for 30 seconds to 360 minutes, preferably at 1 minute to 120 minutes, and even more preferable at 2 minutes to 60 minutes.

[0080] The laminate used in the present invention is not particularly limited as long as it is a laminate in which a processing member and a protective film containing a cured product of the above-described composition are laminated together. For example, a laminate obtained by a known method using a processing member and the above-described composition can be used. A specific method for obtaining the laminate includes, for example, a step of applying the above-described composition to a processing member and a step of forming a protective film on the processing member by curing the applied coating film. These steps can include, for example, the methods described below.

[0081] The process of applying the above-mentioned composition to the workpiece can be any known method for adhesives, paints, etc., without particular limitation. For example, methods such as using a spin coater, roll coater, bar coater, die coater, curtain coater, gravure coater, comma coater, knife coater, air knife coater, kiss coater, shower coater, flow coater, dipping, screen printing, or an applicator can be used. In this case, the amount of the above-mentioned composition applied to the workpiece is not particularly limited and can be adjusted as appropriate depending on the purpose. For example, the amount applied can be such that the thickness of the protective film formed by curing the applied coating is 0.001 μm to 20 mm.

[0082] The process of forming a protective film on a workpiece by curing the applied coating can be carried out without particular limitation by using known methods for adhesives, paints, etc. For example, a method of curing the applied coating by heating it, a method of curing the applied coating by irradiating it with light, and a method combining these can be used. In the method of curing the applied coating by heating it, the heating conditions are not particularly limited and can be adjusted as appropriate. For example, a method of curing the coating by heating it in an environment of 40°C to 250°C for 1 minute to 10 hours can be used. In the present invention, from the viewpoint of sufficiently curing the applied coating and preventing heat damage to the workpiece, it is preferable to heat the applied coating in an environment of 80°C to 200°C, more preferably in an environment of 100°C to 180°C, and even more preferably in an environment of 120°C to 170°C. Furthermore, in the present invention, from the viewpoint of sufficiently curing the applied coating film and preventing heat damage to the workpiece, the heating time is preferably 3 minutes to 5 hours, more preferably 5 minutes to 2 hours, and even more preferably 10 minutes to 1 hour.

[0083] Furthermore, in the method of curing the applied coating by light irradiation, the type of light used is not particularly limited and can be selected according to the purpose. For example, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, metal halogen lamps, electron beam irradiation devices, X-ray irradiation devices, argon lasers, dye lasers, nitrogen lasers, LEDs, helium-cadmium lasers, etc., can be used. Also, the irradiation conditions when irradiating with these lights are not particularly limited and can be adjusted as appropriate. For example, the integrated light intensity is 500 to 10,000 mJ / cm². 2 Methods of irradiation that result in this can be used.

[0084] In the present invention, as a step in forming a protective film on a processing member by curing the applied coating film, among the methods described above, it is preferable to use a method in which the applied coating film is cured by heating, from the viewpoint of being able to cure the above-mentioned composition more easily.

[0085] In the method for manufacturing a processing member of the present invention, a step of processing the processing member may be included before the step of separating the processing member from the protective film contained in the laminate by peeling and dismantling the protective film by contacting it with an alkaline solution. The step of processing the processing member is not particularly limited as long as it is a known processing method used in optical-related members, liquid crystal-related members, electronic-related members, circuit-related members, semiconductor-related members, automotive-related members, etc., but examples include back grinding (backside grinding) during silicon wafer manufacturing.

[0086] The present invention provides a method for manufacturing a processing member, which includes a step of separating the protective film from the processing member by peeling off the protective film contained in a laminate formed by laminating a processing member and a protective film containing a cured product of the above-described composition, by contacting it with an alkaline solution. This method allows for the manufacture of a processing member without complicating the manufacturing process or the necessary equipment, and enables the manufacture of a high-quality processing member by suppressing damage to the processing member during the manufacturing process. The present invention also provides a method for manufacturing a processing member, which may include a step of processing the processing member, and a step of applying the above-described composition to the processing member and a step of forming a protective film on the processing member by curing the applied coating.

[0087] The following aspects are included in this disclosure:

[0088] [1] A composition comprising (A) a polyfunctional ester-type thiol compound having two or more ester-type thiol groups in its molecule, (B) a reactive compound having a group that reacts with the ester-type thiol group in its molecule, and (C) one or more film-forming aids selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol, In the composition, the ratio of the number of ester-type thiol groups in (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups in (B) the reactive compound is 1.5:1 to 3.0:1. When the content of (B) reactive compound in the composition is 100 parts by mass, the content of (C) film-forming aid is 10 to 80 parts by mass. (B) A composition containing an epoxy resin as a reactive compound.

[0089] [2] The composition according to [1], wherein (A) the polyfunctional ester-type thiol compound is a polyfunctional ester-type thiol compound having 3 to 6 ester-type thiol groups in the molecule.

[0090] [3] The ratio of the number of ester-type thiol groups in (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups in (B) the reactive compound is 1.6:1 to 2.4:1. The composition according to [1] or [2], wherein the content of (C) film-forming aid is 20 to 50 parts by mass when the content of (B) reactive compound in the composition is 100 parts by mass.

[0091] [4] A composition according to any one of [1] to [3], for use as an easily peelable and dismantled adhesive.

[0092] [5] An adhesive containing the composition described in any of [1] to [4].

[0093] [6] A cured product of any of the compositions described in [1] to [4].

[0094] [7] A method for separating a member, comprising the step of separating the first member and the second member by bringing the adhesive layer contained in a laminate, which is formed by laminating a first member, an adhesive layer containing a cured product of any of the compositions described in [1] to [4], and a second member in this order, into contact with an alkaline solution to peel off the adhesive layer.

[0095] [8] The method for bonding and separating members according to [7], wherein the step of separating the first member and the second member is to separate the first member and the second member by exfoliating and disassembling the adhesive layer by contacting it with an alkaline solution at 20 to 90°C for 10 seconds to 720 minutes.

[0096] [9] A method for manufacturing a member, comprising the step of separating the first member and the second member by bringing the adhesive layer contained in a laminate, which is formed by laminating a first member, an adhesive layer containing a cured product of any of the compositions described in [1] to [4], and a second member in this order, into contact with an alkaline solution to peel off the adhesive layer.

[0097]

[10] A method for manufacturing a workpiece, comprising the step of separating the workpiece and the protective film by bringing the protective film contained in a laminate, which is a laminate of a workpiece and a protective film containing a cured product of any of the compositions described in [1] to [4], into contact with an alkaline solution to peel off and dismantle the workpiece and the protective film. [Examples]

[0098] The present invention will be further described in detail below with reference to examples. In the following examples, percentages are by mass unless otherwise specified. The components used in the examples and comparative examples are shown below. Of these, A'-5 is an ether-type thiol compound and corresponds to the comparative example compound. In Comparative Example 8, which uses A'-5, the column for ester-type thiol groups:epoxy groups in Table 2 shows the ratio of the number of ether-type thiol groups in A'-5 to the number of epoxy groups in the reactive compound as a reference value.

[0099] (A) Polyfunctional ester-type thiol compounds A-1: Pentaerythritol tetrakis(3-mercaptopropionate) (CAS No. 7575-23-7, Molecular weight: 488.64) A-2: Tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (CAS No. 36196-44-8, Molecular weight: 525.61) A-3: Trimethylolpropanetris (3-mercaptopropionate) (CAS No. 33007-83-9, Molecular weight: 398.55) A-4: Tetraethylene glycol bis(3-mercaptopropionate) (CAS No. 68891-92-9, Molecular weight: 370.48) (A') Ether-type thiol compound A'-5: Pentaerythritol tetrapropanthol (CAS No. 42903-62-8)

[0100] (B) Reactive compounds B-1: Dicyclopentadiene novolac type epoxy resin (ADEKA Resin EP-4088L, manufactured by ADEKA Corporation; epoxy equivalent: 165 g / eq)

[0101] (C) Film-forming agent C-1: Imidazole-based curing agent (ADEKA Hardener EH-2021, manufactured by ADEKA Corporation. Amine equivalent: 215 g / eq) C-2: Polyethylene glycol (number average molecular weight: 400)

[0102] (D) Modifier D-1: Hydrophobic silica (AEROSIL® RY-200S, manufactured by Nippon Aerosil Co., Ltd.)

[0103] <Preparation of composition> The compositions of Examples 1-3 and Comparative Examples 1-8 were prepared by thoroughly mixing each component according to the formulations shown in Tables 1 and 2 below.

[0104] <Evaluation of ease of peeling and dismantling> The peelability of each prepared composition was evaluated. Specifically, a frame with an inner space of 1 cm (length) x 1 cm (width) x 200 μm (height) was fixed to a glass slide, which served as the substrate, and the mass (substrate mass) was measured. The prepared composition was applied to the inner space of the frame, and then heated at 150°C for 30 minutes to form a cured material. The frame was then removed to produce a cured material of approximately 1 cm (length) x 1 cm (width) x 200 μm (height) on the glass slide. The mass of each sample with the cured material formed on the glass slide was measured, and the amount of cured material was calculated from the difference with the substrate mass. Next, each produced sample was immersed in a 5% by mass sodium hydroxide aqueous solution (pH=14), an alkaline solution, at 60°C for 5 minutes. After removing each sample, its mass was measured, and the mass of the remaining cured material was calculated from the difference with the substrate mass, and the retention rate % (mass of remaining cured material / amount of cured material × 100) was determined. After mass measurement, the ease of peeling was evaluated by peeling off the remaining cured material with tweezers. Based on the rate of mass change and ease of peeling in each sample, the peelability was evaluated according to the following peelability evaluation criteria. In this evaluation, if the peelability evaluation result is ○ or ◎, it can be said that it is suitable for easily peelable adhesives, and if the evaluation result is ◎, it can be said that it is particularly suitable. The evaluation results for each sample are shown in Tables 1 and 2.

[0105] <Evaluation Criteria for Peelability and Demolition Ease> ◎: The hardened material was completely dissolved in the alkaline solution (0% remaining). ○: The remaining percentage of the hardened material on the slide glass was between 0% and 100%, and the hardened material could be easily peeled off with tweezers without applying force. △: The remaining percentage of the hardened material on the slide glass was between 0% and 100%, and the hardened material could be peeled off by applying strong force with tweezers. ×: The remaining hardened material could not be removed even with strong force applied using tweezers, and / or its mass had increased (residual rate exceeding 100%).

[0106] [Table 1]

[0107] [Table 2]

[0108] As shown in Tables 1 and 2, the cured products produced using the compositions of the present invention were confirmed to have excellent peelability. Therefore, because the compositions of the present invention have excellent peelability, they can be used in paints, adhesives, sealants, coatings, fiber scrubbers, building materials, electronic components, resist materials, optical materials, etc. In particular, they can be suitably used as easily peelable adhesives when manufacturing various components such as optical components, liquid crystal components, electronic components, circuit components, semiconductor components, and automotive components.

Claims

1. A composition comprising (A) a polyfunctional ester-type thiol compound having two or more ester-type thiol groups in its molecule, (B) a reactive compound having a group that reacts with the ester-type thiol group in its molecule, and (C) one or more film-forming aids selected from the group consisting of imidazole-based curing agents, amine-based curing agents, amide-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, polyethylene glycol, polypropylene glycol, polyglycerin, and polyvinyl alcohol, In the composition, the ratio of the number of ester-type thiol groups in (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups in (B) the reactive compound is 1.5:1 to 3.0:

1. When the content of (B) reactive compound in the composition is 100 parts by mass, the content of (C) film-forming aid is 10 to 80 parts by mass. (B) A composition in which the reactive compound contains an epoxy resin.

2. (A) The composition according to claim 1, wherein the polyfunctional ester-type thiol compound is a polyfunctional ester-type thiol compound having 3 to 6 ester-type thiol groups in the molecule.

3. In the composition, the ratio of the number of ester-type thiol groups in (A) the polyfunctional ester-type thiol compound to the number of groups that react with the ester-type thiol groups in (B) the reactive compound is 1.6:1 to 2.4:

1. The composition according to claim 1, wherein the content of (C) film-forming aid is 20 to 50 parts by mass when the content of (B) reactive compound in the composition is 100 parts by mass.

4. The composition according to claim 1, for use as an easily peelable and dismantled adhesive.

5. An adhesive containing the composition described in claim 1.

6. A cured product of the composition according to claim 1.

7. A method for separating members, comprising the step of separating a first member and a second member by bringing the adhesive layer contained in a laminate, which is formed by laminating a first member, an adhesive layer containing a cured product of the composition described in claim 1, and a second member in this order, into contact with an alkaline solution to peel off and dismantle the adhesive layer.

8. The method for separating a member according to claim 7, wherein the step of separating the first member and the second member is to separate the first member and the second member by exfoliating and dismantling the adhesive layer by contacting it with an alkaline solution at 20 to 90°C for 10 seconds to 720 minutes.

9. A method for manufacturing a member, comprising the step of separating the first member and the second member by exfoliating and dismantling the adhesive layer contained in a laminate in which a first member, an adhesive layer containing a cured product of the composition described in claim 1, and a second member are laminated in this order, by contacting the adhesive layer with an alkaline solution.

10. A method for manufacturing a processing member, comprising the step of separating the processing member and the protective film by exfoliating and dismantling the protective film contained in a laminate formed by laminating a processing member and a protective film containing a cured product of the composition described in claim 1, by contacting the protective film with an alkaline solution.

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