Multilayer ceramic capacitor

Abstract

One embodiment aims to provide a multilayer ceramic capacitor that can prevent a decrease in moisture resistance reliability. [Solution] A multilayer ceramic capacitor according to one embodiment includes a body comprising a plurality of dielectric layers and a plurality of internal electrodes stacked in the third direction, including a first and second surface facing a first direction, a third and fourth surface facing a second direction intersecting the first direction, and a fifth and sixth surface facing a third direction intersecting the first and second directions simultaneously; and an external electrode disposed outside the body, wherein the body includes a margin region where no internal electrodes are present, disposed on the outer periphery of the plurality of internal electrodes on the third surface side and the outer periphery on the fourth surface side, and the ratio of the width of the margin region to the width of the body, measured in the second direction, is greater than 8.5% and less than or equal to 9.5%, and the average porosity of the margin region may be greater than 0% and less than 1.1%.

Description

[Technical Field]

[0001] This disclosure relates to multilayer ceramic capacitors. [Background technology]

[0002] Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, and thermistors. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) can be used in a wide variety of electronic devices due to their advantages of being small, having guaranteed high capacitance, and being easy to mount.

[0003] A multilayer ceramic capacitor may include a body comprising multiple dielectric layers and multiple internal electrodes, and external electrodes positioned outside the body and connected to the internal electrodes. If moisture or hydrogen penetrates into the margin region of the body, the moisture resistance reliability of the multilayer ceramic capacitor may be reduced. [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] One embodiment aims to provide a multilayer ceramic capacitor that can prevent a decrease in moisture resistance reliability. [Means for solving the problem]

[0005] A multilayer ceramic capacitor according to one embodiment includes a body comprising a plurality of dielectric layers and a plurality of internal electrodes stacked in the third direction, including a first and second surface facing a first direction, a third and fourth surface facing a second direction intersecting the first direction, and a fifth and sixth surface facing a third direction intersecting the first and second directions simultaneously; and an external electrode disposed outside the body, wherein the body includes a margin region where no internal electrodes are present, disposed on the outer periphery of the plurality of internal electrodes on the third surface side and the outer periphery on the fourth surface side, and the ratio of the width of the margin region to the width of the body, measured in the second direction, is greater than 8.5% and less than or equal to 9.5%, and the average porosity of the margin region may be greater than 0% and less than 1.1%.

[0006] The margin region may include the same dielectric layer as the dielectric layer in the remaining region of the body.

[0007] The plurality of internal electrodes may include a plurality of first internal electrodes and a plurality of second internal electrodes that are alternately arranged in the first direction.

[0008] The external electrodes may include a first external electrode disposed on the first surface and connected to the plurality of first internal electrodes, and a second external electrode disposed on the second surface and connected to the plurality of second internal electrodes.

[0009] The multilayer ceramic capacitor may further include a plating layer covering the external electrodes.

[0010] The plating layer may include a first layer covering the external electrode, a second layer covering the first layer, and a third layer covering the second layer.

[0011] The first layer may contain nickel (Ni), the second layer may contain copper (Cu), and the third layer may contain tin (Sn). [Effects of the Invention]

[0012] According to the multilayer ceramic capacitor of this embodiment, a decrease in moisture resistance reliability can be prevented by adjusting the width and porosity of the margin region of the body to prevent moisture and hydrogen penetration. [Brief explanation of the drawing]

[0013] [Figure 1] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to one embodiment. [Figure 2] Figure 2 is a separated perspective view schematicly showing the layered structure of the internal electrodes of the multilayer ceramic capacitor shown in Figure 1. [Figure 3] Figure 3 is a schematic plan view showing the first internal electrode of the multilayer ceramic capacitor shown in Figure 1. [Figure 4] Figure 4 is a schematic plan view showing the second internal electrode of the multilayer ceramic capacitor shown in Figure 1. [Figure 5] Figure 5 is a cross-sectional view taken along the line I-I' in Figure 1. [Figure 6] Figure 6 is a cross-sectional view taken along the line II-II' in Figure 1. [Modes for carrying out the invention]

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that they can be easily implemented by a person with ordinary skill in the art to which the present invention pertains. In the drawings, parts that are not necessary for the clear explanation of the present invention have been omitted, and the same or similar components are denoted by the same reference numerals throughout the specification. In addition, some components in the attached drawings are exaggerated, omitted, or shown schematically, and the size of each component does not fully reflect its actual size.

[0015] The attached drawings are only for facilitating the understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings. It must be understood that the present invention includes any modifications, equivalents or alternatives included in the spirit and technical scope of the present invention.

[0016] Terms including ordinal numbers such as first, second, etc. can be used to describe various components, but the components are not limited by such terms. The terms are only used for the purpose of distinguishing one component from another.

[0017] Also, when a part such as a layer, film, region, plate, etc. is "on" another part, this includes not only the case where it is "directly on" another part, but also the case where there are other parts in between. Conversely, when a part is "directly on" another part, it means that there are no other parts in between. Also, being "on" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" in the direction opposite to gravity.

[0018] Throughout the specification, terms such as "comprising" or "having" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and it should not be understood as precluding the presence or addition possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Therefore, when a part "comprises" a certain component, this means that other components are not excluded unless otherwise stated, and it can further include other components.

[0019] Also, throughout the specification, when it is said "on a plane", this means when the target part is viewed from above, and when it is said "in a cross-section", this means when the cross-section obtained by vertically cutting the target part is viewed from the side.

[0020] Furthermore, throughout the specification, the term "connected" does not only mean that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are not only physically connected but also electrically connected, or that they are a single unit, even though they are referred to by different names depending on their location or function.

[0021] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to one embodiment.

[0022] Referring to Figure 1, the multilayer ceramic capacitor 1000 according to this embodiment includes a body 110, a first external electrode 200, and a second external electrode 300.

[0023] First, in order to clearly explain this embodiment, the directions are defined as follows: the L-axis, W-axis, and T-axis shown in the drawing represent the length, width, and thickness directions of the multilayer ceramic capacitor 1000, respectively.

[0024] The thickness direction (T-axis direction) may be perpendicular to the wide surface (circumferential surface) of the sheet-shaped component. For example, the thickness direction (T-axis direction) can be used with the same concept as the direction in which the dielectric layer 140 is stacked.

[0025] The length direction (L-axis direction) is parallel to the wide surface (circumferential surface) of the sheet-shaped component and may intersect (or be perpendicular to) the thickness direction (T-axis direction). For example, the length direction (L-axis direction) may be the direction in which the first external electrode 200 and the second external electrode 300 face each other.

[0026] The width direction (W-axis direction) is a direction parallel to the wide surface (circumferential surface) of the sheet-shaped component, and may simultaneously intersect (or be perpendicular to) the thickness direction (T-axis direction) and the length direction (L-axis direction).

[0027] The body 110 may be approximately hexahedral in shape, but this embodiment is not limited to this. Due to shrinkage during sintering, the body 110 may not be a perfect hexahedron, but may have a substantially hexahedral shape. For example, the body 110 may be approximately a right hexahedron, but the corners and vertices may have a rounded shape.

[0028] In this embodiment, for the sake of explanation, the surfaces of the body 110 that face each other in the longitudinal direction (L-axis direction) are defined as the first surface S1 and the second surface S2, the surfaces of the body 110 that face each other in the width direction (W-axis direction) and connect the first surface S1 and the second surface S2 are defined as the third surface S3 and the fourth surface S4, and the surfaces of the body 110 that face each other in the thickness direction (T-axis direction) and connect the first surface S1 and the second surface S2 are defined as the fifth surface S5 and the sixth surface S6.

[0029] Therefore, the first direction, which is the direction in which the first surface S1 and the second surface S2 face each other, may be the length direction (L-axis direction), and the second and third directions, which are perpendicular to the first direction and perpendicular to each other, may be the thickness direction (T-axis direction) and the width direction (W-axis direction) or the width direction (W-axis direction) and the thickness direction (T-axis direction), respectively.

[0030] The length of body 110 may represent the maximum length among multiple selections parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the length direction (L-axis direction) as shown in the aforementioned cross-sectional photograph of body 110 in the length direction (L-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-section (cross section) in the length direction (L-axis direction) at the center of body 110 in the width direction (W-axis direction). On the other hand, the length of body 110 may represent the minimum length among multiple selections parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the length direction (L-axis direction), as shown in the aforementioned cross-sectional photograph. On the other hand, the length of body 110 may represent the arithmetic mean of the lengths of at least two selections parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the length direction (L-axis direction), as shown in the aforementioned cross-sectional photograph.

[0031] The thickness of body 110 may represent the maximum length among multiple segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines of body 110 that are opposite each other in the thickness direction (T-axis direction) as shown in the aforementioned cross-sectional photograph of body 110 in the length direction (L-axis direction) - thickness direction (T-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-sectional photograph of body 110 in the width direction (W-axis direction). On the other hand, the thickness of body 110 may represent the minimum length among multiple segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines of body 110 that are opposite each other in the thickness direction (T-axis direction), as shown in the aforementioned cross-sectional photograph. On the other hand, the thickness of body 110 may represent the arithmetic mean of the lengths of at least two segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines of body 110 that are opposite each other in the thickness direction (T-axis direction), as shown in the aforementioned cross-sectional photograph.

[0032] The width of body 110 may represent the maximum length among multiple selections parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the width direction (W-axis direction) as shown in the aforementioned cross-sectional photograph of body 110 in the length direction (L-axis direction) - width direction (W-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-section of body 110 in the length direction (L-axis direction) - width direction (W-axis direction), as shown in the aforementioned cross-sectional photograph. On the other hand, the width of body 110 may represent the minimum length among multiple selections parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the width direction (W-axis direction), as shown in the aforementioned cross-sectional photograph. On the other hand, the width of body 110 may represent the arithmetic mean of the lengths of at least two selections parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the width direction (W-axis direction), as shown in the aforementioned cross-sectional photograph.

[0033] Figure 2 is a schematic separated perspective view showing the laminated structure of the internal electrodes of the multilayer ceramic capacitor in Figure 1, Figure 3 is a schematic plan view showing the first internal electrode of the multilayer ceramic capacitor in Figure 1, and Figure 4 is a schematic plan view showing the second internal electrode of the multilayer ceramic capacitor in Figure 1. Figure 5 is a cross-sectional view cut along the line I-I' in Figure 1, and Figure 6 is a cross-sectional view cut along the line II-II' in Figure 1.

[0034] Referring to Figures 2, 3, 4, 5, and 6, the body 110 may include a plurality of dielectric layers 140, a first internal electrode 150, and a second internal electrode 160.

[0035] Multiple dielectric layers 140 are stacked in the thickness direction (T-axis direction) of the body 110. The boundaries between the dielectric layers 140 are sometimes unclear. For example, the boundaries between the dielectric layers 140 are difficult to confirm without using a scanning electron microscope (SEM), and the multiple dielectric layers 140 may appear as a single integrated structure.

[0036] The dielectric layer 140 can include a ceramic material. For example, the ceramic material can include a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Further, these components can further include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, nickel (Ni) compounds, etc. For example, the dielectric layer is partially solid-solved with calcium (Ca), zirconium (Zr), etc. in BaTiO3 (Ba Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x [[ID=#12]]Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc., but the present invention is not limited thereto.

[0037] The dielectric layer 140 can further include one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. The ceramic additive may be, for example, a transition metal oxide or carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like. <000015#0>

[0038] The first internal electrode 150 and the second internal electrode 160 may be alternately laminated with the dielectric layer 140 interposed therebetween. Such a laminated structure may be repeated within the body 110, and the internal electrode closest to the fifth surface S5 of the body 110 may be the first internal electrode 150 or the second internal electrode 160. Similarly, the internal electrode closest to the sixth surface S6 of the body 110 may be the first internal electrode 150 or the second internal electrode 160. <#

[0039] The first internal electrode 150 and the second internal electrode 160 have different polarities from each other, but can be electrically insulated from each other by the dielectric layer 140 disposed therebetween.

[0040] The first internal electrode 150 and the second internal electrode 160 may be formed by printing a conductive paste containing metal onto the surface of the dielectric layer 140. For example, the internal electrodes can be formed by printing a conductive paste containing nickel (Ni) or a nickel (Ni) alloy onto the surface of the dielectric layer using screen printing or gravure printing. However, this embodiment is not limited to this.

[0041] When a voltage is applied to the first external electrode 200 and the second external electrode 300, charge accumulates between the first internal electrode 150 and the second internal electrode 160. In other words, capacitance can be obtained between the first internal electrode 150, which is electrically connected to the first external electrode 200, and the second internal electrode 160, which is electrically connected to the second external electrode 300. The capacitance of the multilayer ceramic capacitor 1000 is proportional to the overlapping area of ​​the first internal electrode 150 and the second internal electrode 160, which overlap each other along the thickness direction (T-axis direction).

[0042] In other words, the multilayer ceramic capacitor 1000 may include an active region AR and a margin region 170.

[0043] The active region AR can be defined as the region where the first internal electrode 150 and the second internal electrode 160 overlap along the thickness direction (T-axis direction).

[0044] The margin region 170 includes the same dielectric layer 140 as the rest of the body 110, but is a region where the internal electrodes 150 and 160 are not located. The margin region 170 may include a margin region 170W in the width direction and a margin region 170L in the length direction.

[0045] The longitudinal margin region 170L may include a first margin region 171 and a second margin region 172. The first margin region 171 is the region between the active region AR and the first surface S1 of the body 110, and the second margin region 172 may refer to the region between the active region and the second surface S2 of the body 110.

[0046] The widthwise margin region 170W may include a third margin region 173 and a fourth margin region 174. The third margin region 173 is the region between the active region AR and the third surface S3 of the body 110, and the fourth margin region 174 may refer to the region between the active region AR and the fourth surface S4 of the body 110.

[0047] Referring to Figure 6, the body 110 has a width W1, the third margin region 173 has a first margin width M1, and the fourth margin region 174 has a second margin width M2. In other words, the width of the margin region 170W in the width direction is the sum of the first margin width M1 and the second margin width M2, M1 + M2.

[0048] The ratio of the width M1 + M2 of the width margin area 170W to the width W1 of the body 110 (hereinafter referred to as the "margin ratio") may be greater than 8.5% and less than or equal to 9.5%.

[0049] If the margin ratio is 8.5% or less, the margin region in the width direction is relatively thin, making it easier for external moisture and hydrogen to penetrate, which may reduce the moisture resistance reliability of the multilayer ceramic capacitor.

[0050] If the margin ratio exceeds 9.5%, the active region (AR) becomes relatively smaller, which may lead to a decrease in the capacitance of the multilayer ceramic capacitor.

[0051] Here, the widths M1 and M2 of the widthwise margin region 170W are measured based on an optical microscope or scanning electron microscope image of the widthwise (W-axis direction) - thicknesswise (T-axis direction) cross-section of the multilayer ceramic capacitor 1000 at the center in the lengthwise (L-axis direction). The first margin width M1 may be the arithmetic mean of the width of the third margin region 173 measured at the uppermost point in the thicknesswise (T-axis direction) of the body 110 shown in the aforementioned cross-sectional image, the width of the third margin region 173 measured at the lowest point, and the width of the third margin region 173 measured at the center. The second margin width M2 may be the arithmetic mean of the width of the fourth margin region 174 measured at the uppermost point in the thicknesswise (T-axis direction) of the body 110 shown in the aforementioned cross-sectional image, the width of the fourth margin region 174 measured at the lowest point, and the width of the fourth margin region 174 measured at the center.

[0052] On the other hand, the margin region 170W in the width direction can have an average porosity of more than 0% and less than 1.1%.

[0053] If the average porosity of the 170W margin region in the width direction is 1.1% or higher, external moisture and hydrogen can easily penetrate, which may reduce the moisture resistance reliability of the multilayer ceramic capacitor.

[0054] Here, the average porosity is measured based on optical microscope or scanning electron microscope images of the cross-section of the multilayer ceramic capacitor 1000 in the width direction (W-axis direction) - thickness direction (T-axis direction) at the center in the length direction (L-axis direction). For example, using known image analysis software, a 10 μm × 10 μm region can be selected from the width direction margin region shown in the aforementioned cross-sectional image, at the uppermost point, lowermost point, and center in the thickness direction (T-axis direction). The area of ​​the selected region and the area of ​​the pores within that region are measured to determine the porosity, and then these values ​​are arithmetically averaged to obtain the average porosity.

[0055] For example, in the manufacturing process of multilayer ceramic capacitors, the average porosity of the margin region in the width direction can be adjusted to a specific range by controlling the amount of residual carbon in the calcination step of the dielectric green sheet laminate.

[0056] Referring to Figures 5 and 6, a first cover layer 143 and a second cover layer 145 may be arranged on the outer side of the active region AR in the thickness direction (T-axis direction).

[0057] The first cover layer 143 is positioned between the fifth surface S5 of the body 110 and the internal electrode closest to it. The second cover layer 145 is positioned between the sixth surface S6 of the body 110 and the internal electrode closest to it.

[0058] In other words, the first cover layer 143 may be placed above the uppermost internal electrode in the body 110, and the second cover layer 145 may be placed below the lowermost internal electrode. The first cover layer 143 and the second cover layer 145 may have the same composition as the dielectric layer 140. The first cover layer 143 and the second cover layer 145 can be formed by laminating one or more dielectric layers onto the outer surface of the uppermost internal electrode and the outer surface of the lowermost internal electrode, respectively. On the other hand, the first cover layer 143 and the second cover layer 145 may have a different composition from the dielectric layer 140.

[0059] The first cover layer 143 and the second cover layer 145 can serve to prevent damage to the first internal electrode 150 and the second internal electrode 160 due to physical or chemical stress.

[0060] The first external electrode 200 and the second external electrode 300 are positioned outside the body 110.

[0061] The first external electrode 200 is positioned on the first surface S1 of the body 110 and may extend to the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6. The second external electrode 300 is positioned on the second surface S2 of the body 110 and may extend to the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6. In other embodiments, the first external electrode 200 and the second external electrode 300 may extend to a portion of at least one of the fifth surface S5 and sixth surface S6.

[0062] The first external electrode 200 may include a first electrode layer 120 and a first plating layer 180.

[0063] The first electrode layer 120 includes a first connecting portion 121, a first band portion 123, and a first corner portion 125.

[0064] The first connection portion 121 covers the first surface S1 of the body 110 and is connected to a plurality of first internal electrodes 150, thereby being electrically coupled.

[0065] In other embodiments, the first connecting portion 121 can cover a portion of the first surface S1 of the body 110.

[0066] The first band portion 123 extends from the first connecting portion 121 and covers at least a portion of the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the body 110. The first band portion 123 can cause the first electrode layer 120 to adhere more strongly to the body 110.

[0067] The first corner portion 125 may be the portion that connects the first connecting portion 121 and the first band portion 123.

[0068] The second external electrode 300 may include a second electrode layer 130 and a second plating layer 190.

[0069] The second electrode layer 130 includes a second connecting portion 131, a second band portion 133, and a second corner portion 135, respectively.

[0070] The second connection portion 131 covers the second surface S2 of the body 110 and is connected to a plurality of second internal electrodes 160, thereby being electrically coupled.

[0071] In other embodiments, the second connecting portion 131 can cover a portion of the second surface S2 of the body 110.

[0072] The second band portion 133 extends from the second connecting portion 131 and covers at least a portion of the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the body 110. The second band portion 133 can allow the second electrode layer 130 to adhere more strongly to the body 110.

[0073] The second corner portion 135 may be the portion that connects the second connecting portion 131 and the second band portion 133.

[0074] Based on an optical microscope or scanning electron microscope (SEM) photograph of the cross section in the length direction (L-axis direction) - thickness direction (T-axis direction) at the center of the multilayer ceramic capacitor 1000 in the width direction (W-axis direction), the first connection portion 121 and the second connection portion 131 of the multilayer ceramic capacitor 1000 shown in the aforementioned cross section photograph may have a shape approximately parallel to the thickness direction (T-axis direction), the first band portion 123 and the second band portion 133 may have a shape approximately parallel to the length direction (L-axis direction), and the first corner portion 125 and the second corner portion 135 may have a curved shape. The aforementioned curved shape may also be a curved shape having a tangent whose slope changes in the direction parallel to the thickness direction (T-axis direction) in the direction parallel to the length direction (L-axis direction) (or in the opposite direction).

[0075] The first electrode layer 120 and the second electrode layer 130 may be formed from conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but are not limited thereto.

[0076] As another example, the first electrode layer 120 and the second electrode layer 130 may include metal and glass. The metal may be a conductive metal including, for example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), or alloys thereof. The glass component included in the electrode layer may be a composition of mixed oxides. The glass component may include, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, alkaline earth metal oxide, or combinations thereof. Here, the transition metal may be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), or nickel (Ni); the alkali metal may be selected from lithium (Li), sodium (Na), or potassium (K); and the alkaline earth metal may be selected from magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba). The method for forming such an electrode layer is not particularly limited. For example, it can be formed by dipping the body into a conductive paste containing metal and glass, or by printing the conductive paste onto the surface of the body using screen printing or gravure printing. In addition, various methods can be used, such as coating the surface of the body with the conductive paste, or transferring a dried film of the conductive paste to a laminate.

[0077] The first plating layer 180 can cover the first electrode layer 120, and the second plating layer 190 can cover the second electrode layer 130.

[0078] The first plating layer 180 and the second plating layer 190 may both consist of multiple layers. For example, the first plating layer 180 may include a first layer 181 covering the first electrode layer 120, a second layer 183 covering the first layer 181, and a third layer 185 covering the second layer 183. The first layer may contain nickel (Ni), the second layer may contain copper (Cu), and the third layer may contain tin (Sn), but this embodiment is not limited thereto.

[0079] Furthermore, the second plating layer 190 may include a first layer 191 covering the second electrode layer 130, a second layer 193 covering the first layer 191, and a third layer 195 covering the second layer 193. The first layer 191 may contain nickel (Ni), the second layer 193 may contain copper (Cu), and the third layer 195 may contain tin (Sn), but this embodiment is not limited thereto.

[0080] [Manufacturing example: Manufacturing of multilayer ceramic capacitors] (Example 1) A paste containing barium titanate (BaTiO3) powder was applied to a carrier film and then dried to produce multiple dielectric green sheets.

[0081] A conductive paste containing nickel (Ni) was applied onto a dielectric green sheet using screen printing to form a conductive paste layer.

[0082] A dielectric green sheet laminate was manufactured by stacking multiple dielectric green sheets so that at least a portion of the conductive paste layer overlapped.

[0083] After cutting the dielectric green sheet laminate into individual chips, a primary calcination (or binder removal) treatment was performed in a nitrogen atmosphere at 400°C for 70 hours, followed by a secondary calcination treatment in a hydrogen atmosphere at 900°C for 6 hours.

[0084] The body was manufactured by firing a dielectric green sheet laminate in a reducing atmosphere at a maintained temperature of 1165°C.

[0085] A paste containing glass frit and copper (Cu) was applied to the outer surface of the body using a dipping method, dried, and then sintered to form the external electrodes.

[0086] A multilayer ceramic capacitor was manufactured by plating the external electrodes with nickel (Ni) and tin (Sn), and then heat-treating them at 160°C for 1 hour.

[0087] The margin ratio of the manufactured multilayer ceramic capacitor was 8.8%, and the average porosity of the margin region in the width direction was 0.84%.

[0088] (Example 2) Except for the margin ratio being 9.5% and the average porosity of the margin region in the width direction being 0.84%, it was identical to Example 1.

[0089] (Comparative Example 1) Except for the margin ratio being 8.3% and the average porosity of the margin region in the width direction being 1.35%, it was identical to Example 1.

[0090] (Comparative Example 2) Except for the margin ratio being 8.5% and the average porosity of the margin region in the width direction being 1.1%, it was identical to Example 1.

[0091] (Comparative Example 3) Except for the margin ratio being 9.6% and the average porosity of the margin region in the width direction being 1.1%, it was identical to Example 1.

[0092] [Experimental Example: Moisture Resistance Reliability of Multilayer Ceramic Capacitors] 100 multilayer ceramic capacitors were manufactured according to Examples 1 and 2 and Comparative Examples 1 to 3, and their moisture resistance reliability was measured.

[0093] Solder cream was patterned onto a 40-channel moisture-resistant PCB board using a stencil mask. Subsequently, the prepared specimens were mounted onto the PCB board after a reflow process at a maximum temperature of 260°C. The prepared PCB board was placed in a slot capable of measuring potential difference and current, and then placed in a chamber at 85°C and 85% RH. Subsequently, the moisture resistance reliability was measured by checking the level at which the insulation resistance (IR) decreased in the first and second steps, each lasting 1 hour, with a potential difference of 7.56V applied to both ends of the specimen, and in the third step, each lasting 2 hours, with a potential difference of 4.5V applied to both ends of the specimen. If the insulation resistance could not be measured, it was judged as "defective". 6 A value below Ω was considered "degradation." For each of the 100 samples, the number of samples exhibiting poor moisture resistance and those exhibiting degradation in insulation resistance were investigated.

[0094] The results are summarized in Table 1.

[0095] [Table 1]

[0096] Referring to Table 1, in Examples 1 and 2, no moisture resistance failure or insulation resistance degradation occurred in the multilayer ceramic capacitors, while in Comparative Examples 1 to 3, moisture resistance failure and / or insulation resistance degradation occurred in the multilayer ceramic capacitors. This is thought to be because, in the case of Comparative Examples 1 to 3, the margin ratio was relatively small or the average porosity was relatively high, allowing external moisture and hydrogen to penetrate.

[0097] Although preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and can be implemented in various ways within the scope of the claims, description of the invention, and attached drawings, and these also naturally fall within the scope of the present invention. [Explanation of Symbols]

[0098] 1000: Multilayer ceramic capacitor 110: Body 120: 1st electrode layer 130: Second electrode layer 200: 1st external electrode 300: 2nd external electrode 140: Dielectric layer 143: First Cover Layer 145: Second Cover Layer 150: 1st internal electrode 160:Second internal electrode 170: Margin area 180: First plating layer 190: Second plating layer

Claims

1. A body comprising a plurality of dielectric layers and a plurality of internal electrodes stacked in the third direction, including a first and second surface facing the first direction, a third and fourth surface facing the second direction intersecting the first direction, and a fifth and sixth surface facing the third direction intersecting the first and second directions simultaneously, External electrodes positioned outside the body, Includes, The body is arranged on the outer circumference of the third and fourth surfaces of the plurality of internal electrodes, and the body includes a margin region where no internal electrodes are present. The ratio of the width of the margin region to the width of the body, measured in the second direction, is greater than 8.5% and less than or equal to 9.5%. A multilayer ceramic capacitor in which the average porosity of the margin region is greater than 0% but less than 1.1%.

2. The multilayer ceramic capacitor according to claim 1, wherein the margin region includes the same dielectric layer as the dielectric layer of the remaining region of the body.

3. The aforementioned plurality of internal electrodes are The multilayer ceramic capacitor according to claim 1, comprising a plurality of first internal electrodes and a plurality of second internal electrodes arranged alternately in the first direction.

4. The aforementioned external electrode is A first external electrode arranged on the first surface and connected to the plurality of first internal electrodes, and A second external electrode, positioned on the second surface and connected to the plurality of second internal electrodes. A multilayer ceramic capacitor according to claim 3, comprising:

5. The multilayer ceramic capacitor according to claim 1, further comprising a plating layer covering the external electrode.

6. The aforementioned plating layer is The first layer covering the external electrode, A second layer covering the first layer, and A third layer covering the aforementioned second layer The multilayer ceramic capacitor according to claim 5, including the above.

7. The first layer contains nickel (Ni), The second layer contains copper (Cu), The multilayer ceramic capacitor according to claim 6, wherein the third layer contains tin (Sn).

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