A copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, and a method for manufacturing the same.

Abstract

To provide a method for manufacturing a copper foil laminated structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity. [Solution] A method for manufacturing a copper foil laminated structure includes: (a) coating a ceramic ink composition containing ceramic particles using an inkjet printing method to form a ceramic insulating film in which ceramic particles are uniformly distributed; (b) spraying a resin ink composition containing resin onto the top of the ceramic insulating film using an inkjet printing method to impregnate the pores between the ceramic particles with the resin ink composition; (c) heat-treating the ceramic insulating film impregnated with the resin ink composition at 140 to 200°C for 1 to 6 hours to form an insulating substrate; and (d) bonding a copper foil layer onto the insulating substrate to form a copper foil laminated structure, wherein the insulating substrate has a thermal conductivity of 1.92 to 18 W / mK.

Description

Technical Field

[0001] The present invention relates to a copper foil laminate having characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity, and a method for manufacturing the same. More specifically, an insulator substrate having values of low dielectric constant, low dielectric loss, and high thermal conductivity is bonded to a copper foil layer, and a part of the copper foil layer is patterned by selective etching to design a circuit pattern having a line width of 40 μm or less, which can be utilized for a digital substrate. The present invention relates to a copper foil laminate having characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity, and a method for manufacturing the same.

Background Art

[0002] The demand for high performance, high speed transmission, miniaturization, weight reduction, and thinning of electronic products is increasing.

[0003] In addition to these demands and trends for electronic products, in the communication market of 5G or higher where large-scale data must be transmitted at high speed in a high frequency band, a low dielectric constant material with a low signal loss rate is very important.

[0004] As a result, the development of substrates having a low dielectric constant that can be applied to communication equipment such as antennas for ultra-high speed communication and server boards has been continuously carried out.

[0005] However, since the FR-4 polymer material used as a normal substrate material has a relatively large dielectric loss, there is a limit to reducing the dielectric tangent. Therefore, in order to replace this, attempts have been made to use a ceramic material having a dielectric tangent of 1 / 10 or less of the polymer material.

[0006] In related prior art documents, there is Japanese Patent Publication No. 2001-348488 (published on December 18, 2001), which describes a thermally conductive resin composition, a prepreg, a heat dissipating circuit board, and a heat dissipating heat generating component.

Prior Art Documents

Patent Documents

[0007] [Patent Document 1] Japanese Patent Publication No. 2001-348488 [Overview of the project] [Problems that the invention aims to solve]

[0008] The object of the present invention is to provide a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, and a method for manufacturing the same, which can be used as a digital substrate by designing a circuit pattern with a line width of 40 μm or less by bonding an insulating substrate having low dielectric constant, low dielectric loss, and high thermal conductivity with a copper foil layer and patterning a part of the copper foil layer by selective etching. [Means for solving the problem]

[0009] To achieve the above objective, the method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention comprises: (a) coating a ceramic ink composition containing ceramic particles by an inkjet printing method to form a ceramic insulating film in which the ceramic particles are uniformly distributed; (b) spraying a resin ink composition containing resin onto the upper part of the ceramic insulating film by an inkjet printing method to impregnate the resin ink composition into the pores between the ceramic particles; (c) heat-treating the ceramic insulating film impregnated with the resin ink composition at 140 to 200°C for 1 to 6 hours to form an insulating substrate; and (d) bonding a copper foil layer onto the insulating substrate to form a copper foil laminated structure, wherein the insulating substrate has a thermal conductivity of 1.92 to 18 W / mK.

[0010] In step (a) above, the coating using the inkjet printing method is carried out under conditions of 80 to 140°C.

[0011] In step (a) above, the ceramic particles include one or more selected from Al2O3, AlN, SiO2, BaTiO3-based ceramics, SrTiO3-based ceramics, PbTiO3-based ceramics, ferrite, and Pb(Zr,Ti)O3-based ceramics.

[0012] The ceramic particles have an average diameter of 10 to 1,000 nm.

[0013] In step (a) above, the ceramic ink composition is ejected at a first speed and a first interval, and in step (b) above, the resin ink composition is ejected at a second speed and a second interval, wherein the first speed and the second speed are the same as each other, and the second interval is preferably greater than the first interval.

[0014] In step (b) above, the resin includes one or more selected from polyacrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimides resin, unsaturated polyester resin, polyphenylene ether resin (PPE), polyphenylene sulfides resin, cyanate ester resin, and benzocyclobutene (BCB).

[0015] The insulating substrate after step (c) above contains 5 to 50 vol% of resin, 0 to 40 vol% of pores, and the remaining amount of ceramic particles, relative to the total volume of the insulating substrate.

[0016] The insulating substrate after step (d) above has a dielectric constant (Dk) of 4.9 or less and a dielectric loss (Df) of 0.008 or less, measured at 10 to 100 GHz.

[0017] The copper foil laminated structure after step (d) above is used as a digital substrate by designing a circuit pattern having a line width of 40 μm or less by selectively etching the copper foil layer.

[0018] To achieve the above objective, the copper foil laminated structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to the embodiment of the present invention comprises an insulating substrate and a copper foil layer attached to the insulating substrate, wherein the insulating substrate contains 5 to 50 vol% of resin, 0 to 40 vol% of pores, and the remaining amount of ceramic particles relative to the total volume of the insulating substrate, the ceramic particles have an average diameter of 10 to 1,000 nm, and the insulating substrate has a thermal conductivity of 1.92 to 18 W / mK.

[0019] The aforementioned insulating substrate has a dielectric constant (Dk) of 4.9 or less and a dielectric loss (Df) of 0.008 or less, as measured at 10 to 100 GHz. [Effects of the Invention]

[0020] The copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to the present invention, and the method for manufacturing the same, can be used to design a circuit pattern with a line width of 40 μm or less by bonding an insulating substrate having low dielectric constant and high thermal conductivity values ​​to a copper foil layer and patterning a part of the copper foil layer by selective etching, thereby enabling its use in digital substrates.

[0021] Furthermore, the copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to the present invention, as well as the method for manufacturing the same, can be manufactured by using an inkjet printing method to impregnate and fill the pores of ceramic particles with a resin ink composition, and then heat-treating them to uniformly fill the pores of the ceramic particles with resin, thereby producing an insulating substrate having a low dielectric constant and high thermal conductivity.

[0022] As a result, the copper foil laminate structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to the present invention, and its manufacturing method have a dielectric constant (Dk) measured at 10 to 100 GHz of 4.9 or less, a dielectric loss (Df) of 0.008 or less, and a thermal conductivity of 1.92 to 18 W / mK, more preferably 3 to 8 W / mK.

Brief Description of the Drawings

[0023] [Figure 1] It is a schematic diagram showing a copper foil laminate structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention. [Figure 2] It is a schematic diagram showing the insulator substrate of FIG. 1. [Figure 3] It is a process flowchart showing a method for manufacturing a copper foil laminate structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention. [Figure 4] It is a photograph showing a dielectric constant measuring device. [Figure 5] It is a photograph showing a thermal conductivity measuring device. [Figure 6] It is a graph showing the measurement results of the thermal conductivity of the copper foil laminate structure manufactured according to Example 1. [Figure 7] It is a graph showing the measurement results of the thermal conductivity of the copper foil laminate structure manufactured according to Example 2. [Figure 8] It is a graph showing the measurement results of the thermal conductivity of the copper foil laminate structure manufactured according to Example 3. [Figure 9] It is a graph showing the measurement results of the thermal conductivity of the copper foil laminate structure manufactured according to Example 4. [Figure 10] It is a graph showing a comparison of the measurement results of the thermal conductivity of the copper foil laminate structures manufactured according to Examples 1 to 4.

Modes for Carrying Out the Invention

[0024] The aforementioned objectives, features, and advantages will be described in detail below with reference to the attached drawings, so that a person with ordinary skill in the art to which the present invention pertains can easily implement the technical concept of the present invention. In describing the present invention, if a specific description of known technology according to the present invention is deemed to obscure the gist of the present invention, the detailed description will be omitted. Hereafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The same reference numerals in the drawings are used to indicate the same or similar components.

[0025] Any matters not described herein that can be reasonably inferred by a person of ordinary skill in this art will be omitted from this specification.

[0026] In this specification, the arrangement of any configuration on the "upper (or lower)" or "above (or below)" of a component means not only that the configuration is arranged in contact with the upper (or lower) surface of the component, but also that other configurations may be interposed between the component and any configuration arranged on (or below) it.

[0027] In this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. Terms such as “contain,” “have,” and “include” in this application should not be interpreted as necessarily including all of the various components described in the specification, and some of these components may not be included, or may include further components.

[0028] The following describes in detail, with reference to the attached drawings, a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to a preferred embodiment of the present invention, as well as a method for manufacturing the same.

[0029] Figure 1 is a schematic diagram showing a copper foil laminated structure 300 having low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention, and Figure 2 is a schematic diagram showing the insulating substrate 100 of Figure 1.

[0030] Referring to Figures 1 and 2, the copper foil laminated structure 300 having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention includes an insulating substrate 100 and a copper foil layer 200.

[0031] While it is usually possible to form circuit patterns on an insulating substrate using Ag ink, in this case, it is impossible to form circuit patterns with a line width of 40 μm or less.

[0032] Therefore, in the present invention, a circuit pattern with a fine line width is realized by attaching a copper foil layer 200 to an insulating substrate 100 and selectively etching the copper foil layer 200. Here, the copper foil layer 200 is shown as being attached only to the upper surface of the insulating substrate 100, but this is illustrative and the invention is not limited to this structure. That is, the copper foil layer 200 may be attached to both the upper and lower surfaces of the insulating substrate 100.

[0033] In the present invention, the copper foil layer 200 may be copper foil, but is not limited thereto. Any metallic material with excellent electrical conductivity can be used without particular limitation. Therefore, in the present invention, the copper foil layer 200 can be interpreted as a material layer made of a metallic material.

[0034] Thus, the copper foil laminated structure 300 having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to the embodiment of the present invention has a laminated structure including an insulating substrate 100 having the characteristics of low dielectric constant and high thermal conductivity, and a copper foil layer 200 bonded to the insulating substrate 100.

[0035] In this case, the copper foil laminated structure 300 having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to the embodiment of the present invention can be used as a digital substrate by etching the copper foil layer 200 attached to the insulating substrate 100 to selectively remove unnecessary parts of the copper foil layer 200 and designing a circuit pattern having a line width of 40 μm or less.

[0036] The insulating substrate 100 can be manufactured using an inkjet printing method, more specifically, a Drop-on-Demand (DOD) inkjet printing method, with a ceramic ink composition containing ceramic particles 120 and a resin ink composition containing resin 140. Manufacturing the insulating substrate 100 using the Drop-on-Demand (DOD) method allows for easy control of the ejection speed and ejection interval, resulting in excellent accuracy and uniformity, and potentially enabling the production of films with complex shapes.

[0037] In other words, the insulating substrate 100 of the present invention can be manufactured by ejecting a ceramic ink composition containing ceramic particles 120 using a drop-on-demand (DOD) method onto a ceramic insulating film formed by ejecting a ceramic ink composition containing ceramic particles 120 using a DOD method, then ejecting a resin ink composition containing resin 140 using a DOD method onto the top of the ceramic insulating film, impregnating the resin ink composition into the pores 160 of the ceramic particles 120 by capillary action, and finally heat-treating the ceramic insulating film impregnated with the resin ink composition at 140 to 200°C for 1 to 6 hours.

[0038] Here, the substrate (not shown) to which the ceramic ink composition containing ceramic particles 120 is applied may include, but is not limited to, any of the commonly used ceramic substrates, semiconductor substrates, metal substrates, polymer films, etc., and any ordinary substrate can also be used.

[0039] Since the ceramic particles 120 have weak bonding strength, resin 140 is used as a binder to confine the ceramic particles 120 in a network of resin 140, thereby manufacturing an insulating substrate 100 made of a ceramic-resin-porous composite or a ceramic-resin composite.

[0040] The ceramic particles 120 may contain one or more selected from Al2O3, AlN, SiO2, BaTiO3-based ceramics, SrTiO3-based ceramics, PbTiO3-based ceramics, ferrite, and Pb(Zr,Ti)O3-based ceramics, but are not limited to these; any other ceramic particles can be used. Of these, Al2O3 is more preferably used for the ceramic particles 120.

[0041] The resin 140 contained in the resin ink composition may be a thermosetting polymer resin. More specifically, the resin 140 may contain one or more selected from polyacrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimides resin, unsaturated polyester resin, polyphenylene ether resin (PPE), polyphenylene sulfides resin, cyanate ester resin, and benzocyclobutene (BCB), but is not limited thereto, and any other ordinary thermosetting polymer resin can be used.

[0042] The insulating substrate 100 of the present invention described above contains 5 to 50 vol% of resin 140, 0 to 40 vol% of pores 160, and the remaining amount of ceramic particles 120, based on the total volume of the insulating substrate.

[0043] Accordingly, the insulating substrate 100 of the present invention may be made of a ceramic-resin-porous composite, or a ceramic-resin composite.

[0044] Thus, in the present invention, the insulating substrate 100 is formed by filling the pores 160 within the ceramic particles 120 with resin 140, creating a ceramic-resin-pore composite. By adjusting the amount of resin ink composition, the volume ratio of pores 160 that are not filled with resin 140 can be controlled. In this case, maintaining the volume ratio of pores 160 to the maximum improves dielectric properties, but relatively reduces thermal conductivity. Therefore, it is preferable to control the volume ratio of pores 160 to 40 vol% or less of the total volume of the insulating substrate.

[0045] Furthermore, the insulating substrate 100 of the present invention may be made of a ceramic-resin composite, and the structure of the ceramic-resin composite can realize the characteristic of high thermal conductivity. In this case, the insulating substrate 100 of the present invention may contain 5 to 60 vol% of resin 140 and 40 to 95 vol% of ceramic particles 120 based on the total volume of the insulating substrate.

[0046] Generally, polymer insulating substrates are considered to have excellent thermal conductivity if they have a thermal conductivity (TC) of approximately 1 W / mK or higher. Most polymer insulating substrates currently on the market have a thermal conductivity of 0.3 to 0.6 W / mK.

[0047] While metal insulating substrates, manufactured by coating a highly thermally conductive metal substrate with an insulating material to replace polymer insulating substrates, have a thermal conductivity of 2-7.5 W / mK, they have a large coefficient of thermal expansion, which can place excessive mechanical stress on components mounted on the substrate. Thus, metal insulating substrates have distinctly different properties from insulating substrates made by impregnating ceramic particles with resin without a metal substrate.

[0048] In other words, the insulating substrate 100 of the present invention is made possible by impregnating and filling the pores 160 of the ceramic particles 120 with a resin ink composition using an inkjet printing method, and then heat-treating it to uniformly fill the pores 160 of the ceramic particles 120 with resin 140, thereby enabling it to have a low dielectric constant and exhibit high thermal conductivity.

[0049] As a result, the insulating substrate 100 of the present invention has a dielectric constant (Dk) of 4.9 or less measured at 10 to 100 GHz, a dielectric loss (Df) of 0.008 or less, and a thermal conductivity of 1.92 to 18 W / mK, more preferably 3 to 8 W / mK.

[0050] The following describes a method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention, with reference to the attached drawings.

[0051] Figure 3 is a step-by-step diagram showing a method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention.

[0052] As shown in Figure 3, the method for manufacturing a copper foil laminated structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity according to an embodiment of the present invention includes a step of forming a ceramic insulating film (S110), a step of ejecting and impregnating a resin ink composition (S120), a step of forming an insulating substrate (S130), and a step of forming a copper foil laminated structure (S140).

[0053] Formation of ceramic insulating film In the ceramic insulating film formation step (S110), a ceramic ink composition containing ceramic particles is coated using an inkjet printing method to form a ceramic insulating film in which the ceramic particles are uniformly distributed.

[0054] Here, the ceramic ink composition containing ceramic particles may be coated onto a substrate. In this case, the substrate may include, but is not limited to, any ordinary substrate, selected from commonly used ceramic substrates, semiconductor substrates, metal substrates, polymer films, etc.

[0055] In this stage, the ceramic ink composition containing ceramic particles can be one prepared by mixing 5 to 20 vol% of ceramic particles with 80 to 95 vol% of solvent based on the total volume of the ceramic ink composition.

[0056] If the content of added ceramic particles deviates from 5-20 vol%, the dispersion stability of the ceramic ink composition may decrease when a ceramic insulating film is formed, potentially degrading the physical properties of the insulating substrate.

[0057] Furthermore, it is preferable to use ceramic particles having an average diameter of 1,000 nm or less, more preferably having an average diameter of 10 to 1,000 nm, and most preferably having an average diameter of 100 to 500 nm. If the average diameter of the ceramic particles exceeds 1,000 nm, although the dispersibility of the ceramic particles can be improved, there is a risk that the nozzles of the inkjet printing device may become clogged, which may reduce the packing rate of the ceramic particles. Therefore, it is preferable to use ceramic particles with an average diameter of 1,000 nm or less.

[0058] Furthermore, the ceramic particles may have various shapes, such as pellets, plates, or circles, and the inherent properties of ceramics can be maintained by using crystalline ceramic particles.

[0059] The ceramic particles 120 may contain one or more selected from Al2O3, AlN, SiO2, BaTiO3-based ceramics, SrTiO3-based ceramics, PbTiO3-based ceramics, ferrite, and Pb(Zr,Ti)O3-based ceramics, but are not limited to these; any other ceramic particles can be used. Of these, Al2O3 is more preferable for the ceramic particles 120.

[0060] Furthermore, one or more solvents can be selected from hydrocarbon solvents, chlorinated hydrocarbon solvents, cyclic ether solvents, ketone solvents, alcohols, polyhydric alcohol solvents, acetate solvents, polyhydric alcohol ether solvents, terpene solvents, and the like.

[0061] For example, the solvent may include dimethylformamide (DMF), ethyl alcohol, ethylene glycol (EG), diethylene glycol (DEG), dibasic ester (DBE), carbitol acetate (CA), dipropylene glycol methyl ether (DPM or DPGME), butyl carbitol acetate (BCA), butyl carbitol (BC), texanol, terpineol, butyl acrylate (BA), etc. Distilled water can also be used as a solvent.

[0062] Furthermore, to control the surface tension, a dispersant may be added to the ceramic ink composition in an amount of 5 vol% or less relative to the total volume of the ceramic ink composition. For example, the dispersant may include, but is not limited to, one or more selected from nonionic surfactants, cationic surfactants, anionic surfactants, octyl alcohol, acrylic polymers, etc.

[0063] In this stage, by using the Drop-on-Demand (DOD) method of inkjet printing, a ceramic ink composition containing ceramic particles is ejected onto the substrate at a constant speed, with spacings equal to the y-axis pitch and the x-axis pitch, thereby forming a ceramic insulating film in which the ceramic particles are uniformly distributed.

[0064] Therefore, when performing inkjet printing, it is preferable to eject the ceramic ink composition at a first speed and a first interval. In this case, it is preferable to set the first speed of the inkjet printing to 1 to 30 cm / s, and the first interval to 10 to 60 μm for both the y-axis pitch and the x-axis pitch.

[0065] Discharge and impregnation of resin ink composition In the resin ink composition ejection and impregnation step (S120), the resin ink composition containing resin is ejected onto the upper part of the ceramic insulating film using an inkjet printing method, and the resin ink composition is impregnated into the pores between the ceramic particles.

[0066] The resin ink composition may contain 5 to 20 vol% of resin and 80 to 95 vol% of solvent based on the total volume of the resin ink composition. If the resin content deviates from 5 to 20 vol%, uniform impregnation into the pores of the ceramic insulating film may not be possible.

[0067] These resins are thermosetting polymer resins that bind aluminum and nanopowder, and after curing, they can maintain excellent adhesion to metals and printability.

[0068] Resin 140 is a material for binding ceramic particles, and after heat treatment, it can be made to have excellent adhesive strength and maintain printability. For this reason, the resin may be a thermosetting polymer resin. More specifically, resin 140 may contain one or more selected from polyacrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin (PPE), polyphenylene sulfides resin, cyanate ester resin, and benzocyclobutene (BCB), but is not limited thereto, and any other ordinary thermosetting polymer resin can be used.

[0069] In this stage, when a resin ink composition containing resin is ejected using an inkjet printing method, the resin ink composition can impregnate the ceramic insulating film from the surface to the interior by capillary action and fill the pores between the ceramic particles.

[0070] This allows the porosity between ceramic particles to be adjusted by controlling the amount of resin ink composition containing resin that is ejected, thereby impregnating the ceramic insulating film with the resin ink composition.

[0071] Here, the temperature of the substrate from which the resin ink composition is ejected may be room temperature to 140°C. While room temperature may be 1 to 40°C, it is not limited to this range. This allows the resin ink composition impregnated into the ceramic insulating film to fill the pores.

[0072] In this stage, using the Drop-on-Demand (DOD) method of inkjet printing, a resin ink composition containing ceramic resin is coated onto the ceramic insulating film by ejecting it at a constant speed, with intervals of the y-axis pitch and x-axis pitch, thereby impregnating the pores between the ceramic particles with the resin ink composition.

[0073] When inkjet printing with these resin ink compositions, it is preferable to eject the resin ink composition at a second speed and a second interval. In this case, it is preferable that the second speed is the same as the first speed, and the second interval is greater than the first interval. It is preferable that the second speed of inkjet printing be set to 1 to 30 cm / s, and that the second interval be set to 30 to 120 μm for both the y-axis pitch and the x-axis pitch.

[0074] Formation of an insulating substrate In the insulating substrate formation stage (S130), the ceramic insulating film impregnated with the resin ink composition is heat-treated at 140-200°C for 1-6 hours to form the insulating substrate.

[0075] In this stage, the resin filling the pores of the ceramic insulating film with a resin ink composition impregnated by capillary action is heat-treated to harden it. That is, during the heat treatment process, the solvent of the resin ink composition impregnated inside the ceramic insulating film volatilizes and is removed, the resin fills the pores and the porosity of the ceramic particles is reduced.

[0076] If the heat treatment temperature is below 140°C or the heat treatment time is less than 1 hour, curing may not occur sufficiently, potentially weakening the bonding force between the resin impregnated into the pores between the ceramic particles and the ceramic particles themselves. Conversely, if the heat treatment temperature exceeds 200°C or the heat treatment time exceeds 6 hours, no further improvement in effectiveness may occur, and it may only increase manufacturing costs and time, making it uneconomical.

[0077] The insulating substrate produced by the above process contains 5 to 50 vol% resin, 0 to 40 vol% pores, and the remainder of ceramic particles, relative to the total volume of the insulating substrate.

[0078] As a result, the insulating substrate may be made of a ceramic-resin-porous composite, or a ceramic-resin composite.

[0079] Thus, the insulating substrate is formed by filling the pores within the ceramic particles with resin, creating a ceramic-resin-pore composite. By adjusting the amount of the resin ink composition, the volume ratio of pores not filled with resin can be controlled. While maintaining the pore volume ratio to the maximum can improve dielectric properties, it relatively reduces thermal conductivity. Therefore, it is preferable to control the pore volume ratio to 40 vol% or less of the total volume of the insulating substrate.

[0080] Furthermore, the insulating substrate may be made of a ceramic-resin composite, and the structure of the ceramic-resin composite can realize the characteristic of high thermal conductivity. In this case, the insulating substrate of the present invention may contain 5 to 60 vol% of resin and 40 to 95 vol% of ceramic particles based on the total volume of the insulating substrate.

[0081] Formation of a copper foil laminate structure In the formation stage of the copper foil laminated structure (S140), copper foil layers are bonded to an insulating substrate to form the copper foil laminated structure.

[0082] While it is usually possible to form circuit patterns on an insulating substrate using Ag ink, in this case, it is impossible to form circuit patterns with a line width of 40 μm or less.

[0083] Therefore, in this invention, a circuit pattern with a fine line width is realized by attaching a copper foil layer to an insulating substrate and selectively etching the copper foil layer. In this invention, the copper foil layer may be copper foil, but is not limited thereto; any metal material with excellent electrical conductivity can be used without particular limitation. Thus, in this invention, the copper foil layer can be interpreted as a material layer made of a metal material.

[0084] Thus, the copper foil laminated structure of the present invention has a laminated structure comprising an insulating substrate having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity, and a copper foil layer bonded to the insulating substrate.

[0085] In this case, the copper foil laminated structure of the present invention can be used as a digital substrate by etching the copper foil layer attached to the insulating substrate to selectively remove unnecessary parts of the copper foil layer and designing a circuit pattern having a line width of 40 μm or less.

[0086] As discussed above, the copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to the embodiment of the present invention, as well as the method for manufacturing the same, can be used to design circuit patterns with a line width of 40 μm or less by bonding an insulating substrate having low dielectric constant, low dielectric loss, and high thermal conductivity with a copper foil layer and patterning a part of the copper foil layer by selective etching, thereby enabling its use in digital substrates.

[0087] Furthermore, the copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to the embodiment of the present invention, as well as the method for manufacturing the same, can be manufactured by using an inkjet printing method to impregnate and fill the pores of ceramic particles with a resin ink composition, and then heat-treating it to uniformly fill the pores of the ceramic particles with resin, thereby producing an insulating substrate having a low dielectric constant and high thermal conductivity.

[0088] As a result, the copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity according to the embodiment of the present invention, and the method for manufacturing the same, show that the dielectric constant (Dk) measured at 10 to 100 GHz is 4.9 or less, the dielectric loss (Df) is 0.008 or less, and the thermal conductivity is 1.92 to 18 W / mK, more preferably 3 to 8 W / mK. [Examples]

[0089] The following describes the structure and operation of the present invention in more detail with reference to preferred embodiments. However, these are presented as preferred examples of the present invention and should not be construed as limiting the present invention in any sense.

[0090] Any matters not mentioned here can be technically inferred by experts in this field, so their explanations will be omitted.

[0091] 1. Manufacturing of copper foil laminated structures Example 1 A ceramic ink composition was prepared by mixing 10 vol% Al2O3 powder (Sumitomo, AKP-30, D50=250 nm) and 90 vol% ethylene glycol on a substrate and stirring at a speed of 500 rpm for 30 minutes. This ceramic ink composition was then coated onto the substrate using an inkjet printing method to produce a ceramic insulating film in which the Al2O3 powder was uniformly distributed.

[0092] In this experiment, the ink printing speed of the ceramic ink composition was maintained at 30 cm / s, and ceramic ink droplets were jetted onto the substrate to perform uniform inkjet printing without satellite jetting. The x and y pitch values ​​of the ceramic ink composition were set to 50 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 120°C.

[0093] Next, a resin ink composition was prepared by mixing 10 vol% epoxy resin and 90 vol% diethylene glycol dimethyl ether on top of a ceramic insulating film and stirring at a speed of 500 rpm for 30 minutes. This composition was then ejected using an inkjet printing method to impregnate the pores of the ceramic particles with the resin ink composition.

[0094] In this process, the ink printing speed of the resin ink composition was maintained at 30 cm / s, and resin ink droplets were jetted onto the substrate to perform uniform inkjet printing without satellite jetting. The x and y pitch values ​​of the resin ink composition were set to 75 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 30°C.

[0095] Next, a ceramic insulating film impregnated with a resin ink composition was heat-treated at 180°C for 6 hours to produce an insulating substrate consisting of a ceramic-resin-porous composite composed in the volume ratios shown in Table 1.

[0096] Next, a copper foil laminate structure was fabricated by laminating a 10 μm thick copper foil onto an insulating substrate.

[0097] Example 2 A ceramic ink composition was prepared by mixing 10 vol% Al2O3 powder (Sumitomo, AKP-30, D50=250 nm) and 90 vol% ethylene glycol on a substrate and stirring at a speed of 500 rpm for 30 minutes. This ceramic ink composition was then coated onto the substrate using an inkjet printing method to produce a ceramic insulating film in which the Al2O3 powder was uniformly distributed.

[0098] In this experiment, the ink printing speed of the ceramic ink composition was maintained at 30 cm / s, and ceramic ink droplets were jetted onto the substrate to perform uniform inkjet printing without the occurrence of satellite jetting. The x and y pitch values ​​of the ceramic ink composition were set to 25 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 120°C.

[0099] Next, a resin ink composition was prepared by mixing 10 vol% epoxy resin and 90 vol% diethylene glycol dimethyl ether on top of a ceramic insulating film and stirring at a speed of 500 rpm for 30 minutes. This composition was then ejected using an inkjet printing method to impregnate the pores of the ceramic particles with the resin ink composition.

[0100] In this experiment, the ink printing speed of the resin ink composition was maintained at 30 cm / s, and resin ink droplets were jetted onto the substrate to perform uniform inkjet printing without satellite jetting. The x and y pitch values ​​of the resin ink composition were set to 50 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 60°C.

[0101] Next, a ceramic insulating film impregnated with a resin ink composition was heat-treated at 180°C for 6 hours to produce an insulating substrate consisting of a ceramic-resin-porous composite composed in the volume ratios shown in Table 1.

[0102] Next, a copper foil laminate structure was fabricated by laminating a 10 μm thick copper foil onto the upper surface of an insulating substrate.

[0103] Example 3 A ceramic ink composition was prepared by mixing 10 vol% Al2O3 powder (Sumitomo, AKP-30, D50=250 nm) and 90 vol% ethylene glycol on a substrate and stirring at a speed of 500 rpm for 30 minutes. This ceramic ink composition was then coated onto the substrate using an inkjet printing method to produce a ceramic insulating film in which the Al2O3 powder was uniformly distributed.

[0104] In this experiment, the ink printing speed of the ceramic ink composition was maintained at 30 cm / s, and ceramic ink droplets were jetted onto the substrate to perform uniform inkjet printing without satellite jetting. The x and y pitch values ​​of the ceramic ink composition were set to 40 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 120°C.

[0105] Next, a resin ink composition was prepared by mixing 10 vol% epoxy resin and 90 vol% diethylene glycol dimethyl ether on top of a ceramic insulating film and stirring at a speed of 500 rpm for 30 minutes. This composition was then ejected using an inkjet printing method to impregnate the pores of the ceramic particles with the resin ink composition.

[0106] In this experiment, the ink printing speed of the resin ink composition was maintained at 30 cm / s, and ceramic ink droplets were jetted onto the substrate to perform uniform inkjet printing without satellite jetting. The x and y pitch values ​​of the resin ink composition were set to 40 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 30°C.

[0107] Next, a ceramic insulating film impregnated with a resin ink composition was heat-treated at 190°C for 3 hours to produce an insulating substrate consisting of a ceramic-resin-porous composite composed in the volume ratios shown in Table 1.

[0108] Next, a copper foil laminate structure was fabricated by laminating a 10 μm thick copper foil onto the upper surface of an insulating substrate.

[0109] Example 4 A ceramic ink composition was prepared by mixing 10 vol% Al2O3 powder (Sumitomo, AKP-30, D50=250 nm) and 90 vol% ethylene glycol on a substrate and stirring at a speed of 500 rpm for 30 minutes. This ceramic ink composition was then coated onto the substrate using an inkjet printing method to produce a ceramic insulating film in which the Al2O3 powder was uniformly distributed.

[0110] In this experiment, the ink printing speed of the ceramic ink composition was maintained at 30 cm / s, and ceramic ink droplets were jetted onto the substrate to perform uniform inkjet printing without satellite jetting. The x-pitch of the ceramic ink composition was set to 20 μm, the y-pitch to 40 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 120°C.

[0111] Next, a resin ink composition was prepared by mixing 10 vol% epoxy resin and 90 vol% diethylene glycol dimethyl ether on top of a ceramic insulating film and stirring at a speed of 500 rpm for 30 minutes. This composition was then ejected using an inkjet printing method.

[0112] In this process, the ink printing speed of the resin ink composition was maintained at 30 cm / s, and resin ink droplets were jetted onto the substrate to perform uniform inkjet printing without satellite jetting. The x and y pitch values ​​of the resin ink composition were set to 50 μm, the printing frequency to 1,000 Hz, and the substrate temperature to 30°C.

[0113] Next, a ceramic insulating film impregnated with a resin ink composition was heat-treated at 190°C for 3 hours to produce an insulating substrate made of a ceramic-resin composite composed in the volume ratios shown in Table 1.

[0114] Next, a copper foil laminate structure was fabricated by laminating a 10 μm thick copper foil onto the upper surface of an insulating substrate.

[0115] [Table 1]

[0116] 2. Evaluation of dielectric properties and thermal conductivity Table 2 shows the measurement results of dielectric properties and thermal conductivity of copper foil laminated structures manufactured according to Examples 1 to 4. Figure 4 is a photograph showing a dielectric constant meter, and Figure 5 is a photograph showing a thermal conductivity meter. Figures 6 and 7 are graphs showing the measurement results of thermal conductivity of copper foil laminated structures manufactured according to Examples 1 and 2. Figures 8 and 9 are graphs showing the measurement results of thermal conductivity of copper foil laminated structures manufactured according to Examples 3 and 4. Figure 10 is a graph comparing the measurement results of thermal conductivity of copper foil laminated structures manufactured according to Examples 1 to 4.

[0117] (1) Dielectric properties (Dk, Df) Dk and Df were measured using the Keysight SPDR (Split Post Dielectric Resonators) device (measurement frequency: 10 GHz) shown in Figure 4.

[0118] (2) Thermal conductivity (K) K was measured using the T3Ster DynTIM Tester device from cadgraphics (measurement temperature: 25°C) shown in Figure 5.

[0119] [Table 2]

[0120] As shown in Tables 1 and 2, the copper foil laminated structures manufactured according to Examples 1 to 4 were found to exhibit high thermal conductivity values ​​of 1.92 W / mK or higher while maintaining low dielectric constant (Dk) and dielectric loss (Df) values.

[0121] However, while the copper foil laminated structures manufactured according to Examples 3-4 showed high thermal conductivity due to the addition of a large amount of resin, it was confirmed that the dielectric constant (Dk) and dielectric loss (Df) values ​​were slightly higher.

[0122] As shown in Figures 6 to 10, in the case of copper foil laminated structures manufactured according to Examples 1 to 4, the thermal conductivity value tended to increase linearly as the epoxy resin content increased. However, since the dielectric constant (Dk) and dielectric loss (Df) also increased as the epoxy resin content increased, it was confirmed that it is preferable to optimize the epoxy resin content.

[0123] While the above has focused on embodiments of the present invention, various modifications and variations can be made by a person with ordinary skill in the art to which the present invention pertains. Such modifications and variations can be said to fall under the scope of the technical concept provided by the present invention, as long as they do not deviate from the scope of the technical concept provided by the present invention. Therefore, the scope of the rights of the present invention should be determined by the claims described below. [Explanation of symbols]

[0124] 300 Copper foil laminate structure 100 Insulator substrate 120 ceramic particles 140 resin 160 Stomata 200 copper foil layer S110 Ceramic insulating film formation stage S120 Dispensing and impregnation steps of resin ink composition S130 Insulating substrate formation stage S140 Formation stage of copper foil laminated structure

Claims

1. (a) A step of coating a ceramic ink composition containing ceramic particles using an inkjet printing method to form a ceramic insulating film in which the ceramic particles are uniformly distributed; (b) A step of spraying a resin ink composition containing resin onto the upper part of the ceramic insulating film using an inkjet printing method, thereby impregnating the resin ink composition into the pores between the ceramic particles; (c) A step of forming an insulating substrate by heat-treating the ceramic insulating film impregnated with the resin ink composition at 140 to 200°C for 1 to 6 hours; and, (d) The step of bonding a copper foil layer onto the insulating substrate to form a copper foil laminated structure; Includes, A method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the insulating substrate has a thermal conductivity of 1.92 to 18 W / mK.

2. In the above stage (a), A method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the coating by the inkjet printing method is carried out under conditions of 80 to 140°C, as described in claim 1.

3. In the above stage (a), The aforementioned ceramic particles are Al ２ O ３ AlN, SiO ２ , BaTiO ３ Ceramic system, SrTiO ３ PbTiO2-based ceramics ３ Ceramics, ferrite, and Pb(Zr,Ti)O ３ A method for manufacturing a copper foil laminated structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity, as described in claim 1, characterized by including one or more selected from among ceramic systems.

4. The method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the ceramic particles have an average diameter of 10 to 1,000 nm, as described in claim 3.

5. In step (a) above, the ceramic ink composition is ejected at a first speed and a first interval, and in step (b) above, the resin ink composition is ejected at a second speed and a second interval. A method for manufacturing a copper foil laminate structure having low dielectric constant, low dielectric loss, and high thermal conductivity, as described in claim 3, characterized in that the first speed and the second speed are the same, and the second interval is greater than the first interval.

6. In step (b) above, The aforementioned resins include polyacrylic resins, epoxy resins, phenolic resins, polyamide resins, polyimide resins, unsaturated polyester resins, polyphenylene ester resins (PPE), polyphenylene sulfide resins, and cyanate ester resins. A method for manufacturing a copper foil laminate structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity, characterized by comprising one or more selected from among resin and benzocyclobutene (BCB), as described in claim 1.

7. The method for manufacturing a copper foil laminate structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the insulating substrate after step (c) above contains 5 to 50 vol% of resin, 0 to 40 vol% of pores, and the remaining amount of ceramic particles, relative to the total volume of the insulating substrate.

8. The method for manufacturing a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the insulating substrate after step (d) above has a dielectric constant (Dk) of 4.9 or less measured at 10 to 100 GHz and a dielectric loss (Df) of 0.008 or less.

9. The method for manufacturing a copper foil laminate structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized in that the copper foil laminate structure after step (d) above is used as a digital substrate by designing a circuit pattern having a line width of 40 μm or less by selective etching of the copper foil layer.

10. Insulating substrate and The copper foil layer attached to the insulating substrate, Includes, The insulating substrate contains 5 to 50 vol% of resin, 0 to 40 vol% of pores, and the remaining amount of ceramic particles, based on the total volume of the insulating substrate. The ceramic particles have an average diameter of 10 to 1,000 nm. The insulating substrate is a copper foil laminated structure having low dielectric constant, low dielectric loss, and high thermal conductivity, characterized by having a thermal conductivity of 1.92 to 18 W / mK.

11. The insulator substrate is characterized in that it has a dielectric constant (Dk) of 4.9 or less and a dielectric loss (Df) of 0.008 or less, as measured at 10 to 100 GHz, and is a copper foil laminated structure having the characteristics of low dielectric constant, low dielectric loss, and high thermal conductivity as described in claim 10.

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